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Solder Paste SC Blf03: Lead-Free

The SC BLF03 is a no-clean lead-free solder paste suitable for all SMT applications. It is a homogenous mixture of lead-free solder powder and a synthetic resin flux classified as RMA and RE L0. The paste has excellent printing and soldering properties like long stencil and tack life, minimal and transparent residue, and adhesion. It is compatible with common soldering profiles and reflow ovens.

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86 views

Solder Paste SC Blf03: Lead-Free

The SC BLF03 is a no-clean lead-free solder paste suitable for all SMT applications. It is a homogenous mixture of lead-free solder powder and a synthetic resin flux classified as RMA and RE L0. The paste has excellent printing and soldering properties like long stencil and tack life, minimal and transparent residue, and adhesion. It is compatible with common soldering profiles and reflow ovens.

Uploaded by

luismcmc
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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S OL D ER PAS T E S C BL F 03

Type ISO 1.2.3.C

The SC BLF03 is a cosequently evolved High-Tech-Product, which is best suitable for all
lead-free SMT applications. Its development is not only based on many years of
experience on the field of SMT but also the careful and severe consideration of the norms
ISO, EN, IPC, und MIL.
The SC BLF03 is a homogenous mixture of a lead-free solder powder available in all
required alloys and grain sizes, with an organic flux based on synthetic resin
corresponding to RE L0 according to J-STD 004 (F-SW32) (exceeds the expectations of
RMA!). Thus it belongs to the latest "no-clean" solder paste types. Besides excellent slump
resistance, no solder balling, a long stencil and tack life and high temperature stability, this
paste has following advantages:

*SC BLF03* minimal (4.3%), highly transparent residue, simplifying the in circuit test
*SC BLF03* a true ”no clean” paste
*SC BLF03* contains corrosion inhibitors
*SC BLF03* an outstanding printing quality - for hours
*SC BLF03* an huge adhesive power
*SC BLF03* excellent for fine pitch and super fine pitch applications
*SC BLF03* superior soldering results with all soldering profiles and ovens

PHYSICAL DATA

Metal alloys
Preferred alloys Melting point According to international standards we deliver
these alloys in the classes of:
Sn96,5/Ag3,5 221°C
class 3 25 – 45 µm
Sn95,5/Ag3,8/Cu0,7 217 – 219°C
Sn96,5/Ag3/Cu0,5 217°C
class 4 20 – 36 µm
Sn99,3/Cu0,7 227°C class 5 10 – 25 µm

VISCOSITY (Pa.S)
Viscosity:* Slump according to DIN32513 Solder balling Wetting acc.
At the moment 20min 80°C acc. To IPC To IPC
750 Pa.s. powder class III Kl.1 = 0.2 0.2
900 Pa.s. powder class IV Kl.2 = 0.2 0.3 1 1
*The information is founded on the measurement with the Brookfield RVT-DV-II viscometer TF 5R/pm at 25°C with the Helipath-system
(+/- 10%). Paste with 90% metal content.

SURFACE RESISTANCE (SIR) and electrolytic corrosion impact according to IPC 650

Measured on day 4 day 21


4,4x10'³ 6,8x10'²
QUALIFICATIONS

SC BLF03 is an RMA paste, which fulfils the demands of MIL-QQ-S571e. The corrosion-,
solderballing-, wetting- and slump (SN 59650) tests have been passed. Laboratory tests
certify non-corrosive residues, which can be left on the board, even under the protective
coating, as the flux corresponds to RE L0 (no clean).
If wetting of the PCB can occur during the use of it, even for a short term, apropriate
measures against moisture have to be applied.

STORAGE

Unopened at room temperature (20°C/68°F): 6 months


Open or on the printer squeegee the maximal processing time depends, of course, on the
environmental influences on the paste. A storage in the refrigerator is not necessary,
but a storage temperature of <22°C is recommended.

APPLICATION INFORMATION

After using the paste close the container tightly.


Do not mix used and fresh paste, only to freshen up paste and only at work in progress.
Do not mix pastes of different kind.
Recommended squeegee speed: 15-100 mm/s.
For stencil printing, paste with 90% metal content is recommended.
Note: the printer is always faster than the fastest assembler in the production line.
The printer squeegee must be set to ensure that the paste performs a rolling action in front
of the squeegee and does not slide!
The stencil can be washed with an alcohol mixture but the alcohol must not contaminate
fresh paste. We recommend the SC Stencil Cleaner.
The paste is suitable for all common reflow systems.

Solder Chemistry order example

Legend Paste type Grain size Alloy Flux content Jar capacity

e.g. SC BLF03 F 95,5/3,8/0,7Cu 10% 500g


SC BLF03 F 96,5/3,5Ag 10% 200g

Order example according to DIN:


Solder Paste(SC...) L-Sn96,5Ag3,5 / F-SW 32 / 90-3 200g(packing)

Solder Chemistry ; Fragnerstraße 4 ; D-84034 Landshut


Tel. ++49/871/4309500 ; Fax. ++49/871/43095020
e-Mail: [email protected] ; www.SolderChemistry.com

The engineering data shown here has been compiled by Solder Chemistry using commonly accepted procedures. Although the data is
considered accurate, we cannot guarantee its accuracy, the results obtained from its use, or any patent infringement resulting from its
use. The data is supplied on the condition that the user shall conduct tests to determine material suitability for a particular application.

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