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Chapter1 Microchip Fabrication

The document discusses the history and development of the semiconductor industry. It begins with the transition from vacuum tubes to transistors in the 1940s-1950s. The first integrated circuit was developed in 1959 by Jack Kilby at Texas Instruments. Feature sizes on chips have decreased significantly over time according to Moore's Law. The semiconductor industry now produces a wide variety of chips used in computers, vehicles, and other applications and has become a major global industry. Fabricating semiconductor chips is a complex process involving crystal growth, wafer preparation, thin film deposition, lithography, etching, and packaging.

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278 views

Chapter1 Microchip Fabrication

The document discusses the history and development of the semiconductor industry. It begins with the transition from vacuum tubes to transistors in the 1940s-1950s. The first integrated circuit was developed in 1959 by Jack Kilby at Texas Instruments. Feature sizes on chips have decreased significantly over time according to Moore's Law. The semiconductor industry now produces a wide variety of chips used in computers, vehicles, and other applications and has become a major global industry. Fabricating semiconductor chips is a complex process involving crystal growth, wafer preparation, thin film deposition, lithography, etching, and packaging.

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吳文嘉
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Microchip Fabrication

A Practical Guide to Semiconductor Processing

半導體製程
材料科學與工程研究所
張翼 教授
Chapter 1
The Semiconductor Industry
Figure 1.1 Eniac statistics. (Foundations of Computector
Technology, J. G. Giarratano, Howard W. Sams & Co.,
Indianapolis, Ind., 1983) (First electronic computer,1947)
Figure 1.2 Vacuum tube

 Vacuum tube (better


radiation hardening) →
Transistor
 NCTU is the first
University to use
transistor in student Lab.
→
Figure 1.3 The first transistor.

 Bell Labs
 John Bardeen, Walter
Brattin, William Shockley
 1956 Nobel Prize
(Physicist)
 Si-Ge, bandgap increase,
low terminal noise
Figure 1.4 Solid-state discrete devices.

 active device: transistors


& diodes
 passive element:
capacitors & resistors
 Discrete device account
for 12% sale in 1998
Figure 1.5 Kilby integrated circuit from his notebook
(Courtesy of Texas Instruments.)

 In 1959, TI developed first


IC. (Jack Kilby)
Figure 1.6 Horni “teardrop” transistor.

 Planar Technology
Figure 1.7 Growth of Dram Density (After Campbell, The
Science of Engineering and Microelectronics fabrication,
Oxford Press.)

 First demo, Bell Labs


 First production, NEC
Figure 1.8 IC integration table.
Figure 1.9 Decreasing image feature size. (After Wolf and
Tauber, “Silicon Processing for the VSLI Era.”)

 2000, 0.18µ m, TSMC


2012, 0.005µ m
Figure 1.10 Effect of processing larger die on larger wafers.

 wafer size → 12 inch (1B


USD to build)
 ULSI chip size> 0.5 inch
each side
 # whole die in a wafer :
40 → Need to decrease
contamination
 use class 1 clean room
Figure 1.11 Relative size of airborne particles and wafer
dimensions.

 class 1
 1 Particle/ft3
 Particle size < 0.1µm
Figure 1.12 Cross section of typical planarized two-level metal
VLI structure showing range of via depths after planarization.
(Courtesy of Solid State Technology)

 Use multilayer
interconnect level to
increase traffic
Figure 1.13 Wafer fabrication (and electrical test).
Figure 1.14 Price of chips per bit of memory.

Moore’s law (1965):


Doubling of transistors
in the ICs every couple
of years
1971 2250
1982 120,000
1993 3,100,000
2000 42,000,000
Figure 1.15 Semiconductor chip uses. (Courtesy In-Stat-1995
SEMI ISS seminary)

 original driving force:


military demand
Figure 1.16 Semiconductor and vehicle parts growth
(Courtesy Semiconductor Industry Association)

→ semiconductor
→ motor vehicle parts
Figure 1.17 Future DRAM capacity. (Source: Business Week,
July, 1994)
Figure 1.18 Growth of semiconductor industry-capital
spending (Courtesy of Semiconductor Industry Association)

→ semiconductors
Figure 1.18

 Wafer Fabrication
 Vertical Integration
 IDM:Integrated Device Manufacturer-include IC design and
manufacture
 Fab
 Fabless company
 Foundry

 Captive: produce in house for their own use


 Merchant supplier: sell to the open market
Figure 1.19 Stages of semiconductor manufacturing.
Figure 1.20 Conversion of silicon dioxide to semiconductor
grade silicon.
Figure 1.21 Crystal growth and wafer preparation.
Figure 1.22 Wafer fabrication (and electrical test)
Figure 1.23 Packaging stage.

 Packaging technology
becomes important as CPU
speed approaching 1 Gb/Sec
Figure 1.24 P-N and N-P junctions.
Figure 1.25 Basics of silicon planar processing.
Figure 1.26 Double diffused bipolar transistor formed in
epitaxial layer.
Figure 1.27 DRAM growth design rule and number of process
steps. (SEMI 1995 ISS Conference)

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