Service Manual

TFT LCD MONITOR

Model : L500B

DAEWOO ELECTRONICS CO., LTD

OVERSEAS SERVICE DEPT.
TABLE OF CONTENTS
SAFETY PRECAUTIONS ................................................................................................. 2
GENERAL SAFETY INFORMATION.................................................................................. 3
SERVICING PRECAUTIONS ........................................................................................... 4
GENERAL INFORMATION ............................................................................................. 8
PIN CONNECTOR ....................................................................................................... 9
OPERATION & ADJUSTMENT ........................................................................................ 10
ALIGNMENT PROCEDURE ............................................................................................ 14
TROUBLE SHOOTING HINTS .......................................................................................... 15
BLOCK DIAGRAM ....................................................................................................... 22
PCB LAYOUT ............................................................................................................... 23
SCHEMATIC DIAGRAM ................................................................................................ 25
EXPLODED VIEW & MECHANICAL PARTS LIST ................................................................ 33
INFORMATION OF PART DESCRIPTION ......................................................................... 34
ELECTRICAL PARTS LIST ................................................................................................ 35

1
 SAFETY PRECAUTIONS
CAUTION
No modifications of any circuit should be attempted. Service work should only be performed after you
are thoroughly familiar with all of the following safety check and servicing guidelines.

u Fire & Shock Hazard

w In servicing, pay attention to original lead dress especially in the high voltage circuit. if a short circuit
is found, replace all parts which have been overheated as a result of the short circuit.
w All the protective devices must be reinstalled per original design.
w Soldering must be inspected for possible cold solder points, frayed leads, damaged insulation, solder
splashes or sharp solder points. Be certain to remove all foreign materials.

u Implosion Protection
TFT LCD in this monitor employs integral implosion protection system, but care should be taken to avoid
damage and scratching during installation.
Use only same type replacement TFT panel.

IMPORTANT SAFETY NOTICE

There are special components used in analog TFT LCD color display, which are important for safety.
These parts are shaded on the schematic diagram and on the replacement parts list. It is essential
that these critical parts should be replaced with manufacturer’s specified parts to prevent X-radiation,
shock, fire or other hazards. Do not modify the original design without getting a written permission
from DAEWOO ELECTRONICS CO. or this will void the original parts and labor warranty.

2
 GENERAL SAFETY INFORMATION
u Terms in the manual

CAUTION Statements identify conditions or practices that could result in damage to the equipment or
other property.
WARNING Statements identify conditions or practices that could result in personal injury or loss of life.

u Terms as marked on equipment

CAUTION Statements indicate a personal injury hazard not immediately accessible as one reads the
marking, or a hazard to properly including the equipment itself.
WARNING Statements indicate a personal injury hazard immediately accessible as one reads the marking

u Symbols in the manual

This symbol indicates where applicable cautionary or other information is to be found.

u Symbols as marked on equipment

Protective GROUND terminal

u High Voltage Warning And Critical Component Warning Label

Following warning label is on the backlight outside.

WARNING
This product includes critical mechanical and electrical parts. For continued safety, replace critical
components indicated in the service manual only with exact replacement parts given in the parts list.
Refer to service manual for measurement procedures and proper service adjustments.

3
 SERVICING PRECAUTIONS
CAUTION
Before servicing instruments covered by this service manual, its supplements and addendum, read
and follow the SAFETY PRECAUTIONS of this manual.

NOTE
If unforeseen circumstances create conflict between the following servicing precautions and any of
the safety precautions on page 1 of this manual, always follow the safety precautions.
Remember: Safety First.

u General Servicing Precautions

1. Always unplug the AC power cord from the AC power source before:
a. Removing or reinstalling any component, circuit board, module, or any other instrument assembly.
b. Disconnecting or reconnecting any electrical plug or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic capacitor in the instrument.

CAUTION
A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in a
explosion hazard.

2. Do not any spray chemicals on or near this instrument or any or its assemblies.
3. Unless specified otherwise in this service manual, clean electrical contacts by applying the following
mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable nonabrasive applicator:
10% (by volume) Aceton and 90% (by volume) isopropyl alchohol (90%-99% strength).

CAUTION
This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts
is not required.

4. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state
device heat sinks are correctly installed.
5. Always connect the test instrument ground lead to the appropriate instrument chassis ground before
connecting the test instrument positive lead. Always remove the test instrument ground lead last.
6. Use only the test fixtures specified in this service manual with this instrument.

CAUTION
Do not connect the test fixture ground strap to any heatsink in this instrument.

4
 SERVICING PRECAUTIONS

u Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity.
Such components commonly are called Electrostatically Sensitive (ES) Devices.
The examples of typical ES devices are integrated circuits, some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the
incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly,
drain off any electrostatic charge on your body by touching a known earth ground. Alternatively,
obtain and wear a commercially available discharging wrist strap device which should be removed for
potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive
surface such as aluminum foil to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as
“anti-static” can generate enough electrical charges to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate enough electrical charges to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are
ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together
by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device,
touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION
Be sure that no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmful
motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted
floor can generate enough static electricity to damage an ES devices).

u General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron with appropriate tip size and shape that will maintain
tip temperature within a 550°F-660°F (288°C-316°C) range.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean.
4. Throughly clean the surface to be soldered. Use a small wire-bristle (0.5 inch or 1.25cm) brush with a
metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following soldering technique:
a. Allow the soldering iron tip to reach normal temperature (550°F to 660°F or 288°C to 316°C)
b. Hold the soldering iron tip and solder strand against the component lead until the solder melts.
c. quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil,
and hold it there only until the solder flows onto and around both the component lead and the foil.
d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

CAUTION
Work quickly to avoid overheating the circuit board printed foil.

5
 SERVICING PRECAUTIONS

FIGURE1. USE SOLDERING IRON TO PRY LEADS

u IC Removal / Replacement
Some utilized chassis circuit boards have slotted (oblong) holes through which the IC leads are inserted
and then bent flat against the circuit foil. When holes are slotted, the following technique should be used
to remove and replace the IC. When working with boards using the familiar round hole, use the standard
technique as outlined in paragraphs 5 on the page under the title of general soldering guidelines.

u Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the solder-
ing iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with desolder-
ing braid before removing the IC.

u Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (lt is not necessary to reapply acrylic coating
to the area).

u “Small-Signal” Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend the end of each of three leads remaining on the circuit board into a “U” shape.
3. Bend the replacement transistor leads into a “U” shape.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board
and crimp the “U” with long nose pliers to insoure metal-to-metal contact, then solder each
connection.

6
 SERVICING PRECAUTIONS

u Power IC, Transistor or Devices Removal / Replacement

1. Heat and remove all solders from the device leads.
2. Remove the heatsink mounting screw (if applicable).
3. Carefully remove the device from the circuit board.
4. Insert new device in circuit board.
5. Solder each device lead, and clip off excess lead.
6. Replace heatsink.

u Diode Removal / Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicularly to the circuit board.
3. Observing diode polarity, wrap each lead out of the new diode around the corresponding lead on the
circuit board.
4. Securely crimp each connection and solder it.
5. Inspect the solder joints of the two “original” leads on the circuit board copper side. If they are not
shiny, reheat them and apply additional solder if necessary.

uTECHNICAL INFORMATION
Electrical
Pixel pitch 0.3mm X 0.3mm
Horizontal frequency 30KHz to 62KHz (Automatically)
Vertical frequency 50Hz to 85Hz (Automatically)
Operating temperature 10-40°C / 50-104°F
Operating humidity 8-80%
Mechanical
Cabinet Molded Plastic Cabinet with attachable tilt & swivel base
Dimension (set with packing) 502(H) X 502(W) X 242(D) mm
Weight(net) 4.5 Kg
Power Switch
Controls
OSD control

7
 GENERAL INFORMATION
This TFT LCD monitor automatically scans all horizontal frequencies from 30KHz to 62KHz, and all verti-
cal frequencies from 50Hz to 85Hz. This TFT LCD monitor supports IBM PC, PC/XT, PC/AT, personal
System/2 (PS/2), Apple Macintosh, and compatible users crisp text and vivid color graphics display
when using the following graphics adapters : (VGA, Super VGA, VESA and XGA and Apple Macintosh
Video Card). And so, this TFT LCD monitor has a maximum horizontal resolution of 1024 dots and a
maximum vertical resolution of 768 lines for superior clarity of display.
By accepting analog signal inputs which level is zero to 0.7 Volts. This TFT LCD monitor can display and
262, 144 colors depending on the graphics adapter and software being used.(available used to 8 bit
panel is 16.7M colors)

u Abbreviations

ADJ Adjustment
AFC Automatic Frequency Control
H.sync Horizontal Synchronization
OSC Oscillator
P.S.U Power Supply Unit
PWA Printed Circuit Board Wiring Assembly
R.G.B Red, Green, Blue
V.sync Vertical Synchronization

8
PIN CONNECTOR

Pin Signal
1 Red
2 Green 1

3 Blue
4 GND
6 10
5 GND
6 GND - Red
15
7 GND - Green
8 GND - Blue
9 +5Vdc Arrangement of 15-pin D-sub connector
10 GND - H.Sync
11 GND - V.Sync
12 Bi-directional Data (SDA)
13 Horizontal Sync
14 Vertical Sync (VCLK)
15 Data clock (SCL)

uCAUTION FOR ADJUSTMENT AND REPAIR

w The white balance adjustment has been done by a color analyzer in factroy. The adjustment proce-
dure, described in the service manual is made by a visual check.
w Allow 20 minutes warm-up time for the display before checking or adjusting only electrical specifica-
tion or function.
w Reform the leadwire after any repair work.

9
OPERATION & ADJUSTMENT
u Control Panel

w Move cursor to the right window on the OSD window.

w Increase the value of any selected function.

w Move cursor to the left window on the OSD window.

w Decrease the value of any selected function.

w Launch OSD(On-Screen Display) MENU window.

w Move cursor to the high window on the OSD window.

w Increase the value of V.center.

w Move cursor to the low window on the OSD window.

w Decrease the value of V.center.

10
 OPERATION & ADJUSTMENT

u Key Process

Start

w When you choose the icon on the OSD window, you can exit the OSD screen.

u Hot Key

11
OPERATION & ADJUSTMENT

u Adjustment procedure

Is the mode Yes

1024x768?

Adjust the FIT SCREEN.

Is the H.Size No
proper? Adjust the CLOCK control.

Perform the
Is the AUTO POSITION.
noise displayed on No
the screen?

Perform the
AUTO TRACKING.

Is the
noise displayed on No
the screen?

Adjust the CLOCK FINE

until the screen is cleared.

Is the
Yes noise displayed on No
End
the screen yet?

12
 OPERATION & ADJUSTMENT

u OSD Functions

ICON CONTROL FUNCTIONS

LANGUAGE Select language for OSD (5 languages).

CLOCK Adjust the width (horizontal size) of the screen image.

Sharpen the focus by aligning the illuminated pixels and adjust until the
CLOCK FINE screen image looks focused, crisp and sharp. Adjusting the CLOCK FINE
after the CLOCK adjustment will produce a clear screen.

Choose different preset color temperatures or set your own customized

COLOR TEMP
color parameters.

RED CONTROL Adjust the red color.

GREEN
Adjust the green color.
CONTROL

BLUE CONTROL Adjust the blue color.

H.CENTER & Adjust the position of the display horizontally (left or right) and vertically
V.CENTER (up or down).

Make characters of displayed text easier to read (only for resolutions

FIT SCREEN
lower than 1024x768).

SMART
Adjust the display image quality (if the screen proceed to scaling up).
SCALING

AUTO
Adjust the horizontal & vertical picture image quality and size.
TRACKING

OSD
Adjust the display OSD Menu.
TIME OUT

STATUS Display horizontal & vertical frequency and polarity.

Reset the screen to the Factory Preset

RECALL
Display Settings.

AUTO Choose automatically the proper horizontal position and vertical position
POSITION & size of the screen image.

13
 ALIGNMENT PROCEDURE
u Standard Check point

1. Power source : 100-240Vac 50/60Hz

2. Aging: Take at least 20 minutes warm up time.
3. Signal
Video input :Analog 0.7Vpp 75Ω terminal positive polarity
Synchronizing : acceptable negative or positive at TTL level
Resolution
Horizontal : 1024 max.
Vertical : 768 max.
Frequency
Horizontal :30KHz - 62KHz
Vertical : 50Hz - 85Hz (available only non interlace mode)

u Adjustment

1. Smart scaling set to 50%.

2. Contrast set to 100%.
3. Brightness set to 50%.
4. Switching to factory alignment mode
Press power key with down menu key( t ) at the power off status.
5. Video level adjustment
Receive stair pattern of 16 step (doesn’t care any mode).
Readjust coarse R, G, B in TDA8752 menu before saturation point.
6. Set up the tracking
See the user’s manual at page 8 th.
7. Switching to user’s mode
If turn-off and turn-on then switched to user’s mode.
* All of adjusted data stores by fade out of OSD.

14
TROUBLE SHOOTING HINTS
1. Abnormal mode detect

Abnormal
mode detect

YES

Check input H. Sync NO Trouble video input

of TDA8752. circuit.

YES

Check
waveforms of #84 pin NO
Trouble in the TDA8752.
of TDA8752
correct?

YES

Trouble in the
MX88281.

15
 TROUBLESHOOTING HINTS

2. Trouble in Power on

Trouble in power on.

ON Refer to No video
Power LED.
or No raster.

OFF

Check output NO
voltage of adapter. Trouble in adapter.

YES

Is the 5VS line NO Trouble in SQ8 and its

normal? ambient circuit.

YES

Is the pulse of pin9 NO Trouble in Q7 or its

of the IC1? ambient circuit.

YES

Trouble in IC2 or its

ambient circuit.

16
 TROUBLESHOOTING HINTS

3. No raster

No raster.

Trouble in the Q10 or

Check the output < 2.5V MX88281 (If it's trouble
of the Q10 or #3 pin in the MX88282, change
of CN1. the main B'D)

> 2.5V

CN1 #1 pin NO Check the 12V of the

12V check. main power.

YES

Check the DC/AC NO Trouble in DC/AC

output. inverter.

YES

Replace LCD panel.

17
 TROUBLESHOOTING HINTS

4. One color is missing

One color is missing.

YES

Is OSD color NO Check the output signal

normal? of the MX88281
and 74act573.

YES

Is input signal NO Check video signal cable

normal? or video card.

YES

Are the R, G,
B digital (8 bit) output NO
Replace the main B'D.
of the U17
(TDA8752)?

YES

Trouble in the
soldering.

18
 TROUBLESHOOTING HINTS

5. Pre check

Pre check

Check output Check reset signal

NO Check on/off NO
voltage (#9 pin of micom) and
signal of micom.
(5V/3.3V/12V). its ambient circuit.

YES YES

Check output NO Trouble in the Q9 and

of Q9. its ambient circuit.

YES

Trouble each trouble item. Trouble in the SU1.

19
TROUBLESHOOTING HINTS

6. Abnormal video

Abnormal video

NO Is LCLK output the NO Check the output of

Is the OSD normal?
L1 waveform MX88281.
normal?

YES
YES

Check the control and Check connection

data signal of SDRAM. of 41 pin cable.

20
 TROUBLESHOOTING HINTS

7. No video

No video

NO
White Black

YES YES

OUT1 41 pin cable NO NO

Trouble connection. Is OSD normal? No raster
connection check.

YES YES

U8 #2 pin NO Are the contrast NO

output 12V check? Trouble connection. Change the contrast
controls maximum? control value to maximum

YES YES

LVCC 3.3V check

Are the video
NO Change the main B'D
signal and output signal
of the TDA8752? (Trouble in the TDA8752)
YES

OK YES

Are the output NO Change the main B'D

signal of the MX88281?
(Trouble in the TDA8752)

YES

Check the LCD panel or

41 pin cable

21
 From PC

H/V sync 15PIN DSUB KM416S1020CT X 3

CONNECTOR

RGB signal
16M SDRAM X 3
3
TDA8752
2
10 16 10
PRE-AMP Offset & amplifier Address line Data line H,V sync &
Control line MX88281 dot clock
BLOCK DIAGRAM

74ACT14
Controller
Buffer 8 Red 6 Red
FRC OSD Buffer
3 8 Green 6 Green
Scaling control & mixer
Current & 74ACT573
dithering 6
resistance 8 Blue Blue X4

22
ADC
Dot clock Controller
Clock timing
& phase Sampling
Address & Panel
clock
data line OSD signal driver
H. sync
PLL 8
I2C bus DWOSD05 OSD Back
H,V sync &
circuit light
pixel clock
Micom
V. sync
( 78 E58 ) Dimming control
Panel
On-off control 630VAC
62KHz
DC-DC converter & +5V, +3.3V
on-off control & +12V out DC-AC
AC in 12V adapter inverter
+12V
 SCHEMATIC DIAGRAM

u MAIN88281A

25
 SCHEMATIC DIAGRAM

u TOP CIRCUIT

26
 SCHEMATIC DIAGRAM

u BUFFER

27
 SCHEMATIC DIAGRAM

u POWER DC/DC

28
 SCHEMATIC DIAGRAM

u MEMORY

29
 SCHEMATIC DIAGRAM

u MICOM

30
 SCHEMATIC DIAGRAM

u RGB/SYNC

31
 SCHEMATIC DIAGRAM

u TDA8752A

32
EXPLODED VIEW & MECHANICAL PARTS LIST

33
 INFORMATION OF PART DESCRIPTION
Important Safety Notice
Components identified with the International Symbol have special characteristics important for safety.
When replacing any components, use only manufacturer’s specified parts.

Abbreviation of Description

RESISTOR Description

Allowance
F ±1%
J ±5%
K ±10%
M ±20%
G ±2%

Example

Fig & Index Part No Description

Resistors
R18
HRFT472JCA Chip=1/10W 472J

CAPACITOR Description

Allowance
C ±0.25pF
D ±0.5%
F ±1pF
J ±5%
K ±10%
P ±100% ~ 0%
Z ±80% ~ -

Example

Fig & Index Part No Description

Capacitors
C044
HRFT104ZCA Chip CERA 50V Y5V 0.1µ F Z 2012

34
ELECTRICAL PARTS LIST
The components identified by mark I have special characteristics important for safety and X-ray.
These should be replaced only with the types specified in the parts list.

LOC PART-CODE PART-NAME PART-DESC LOC PART-CODE PART-NAME PART-DESC

I AD1 9979720013 ADAPTER POWER ISA50-1 C082 HCFK103ZCA C CHIP CERA 50V Y5V 0.01MF Z 2012

AD1A W3414M731- CORD POWER KKP-419C/KKS-15A 1.8M(BK) C083 HCFK103ZCA C CHIP CERA 50V Y5V 0.01MF Z 2012
C044 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C084 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012
C045 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C085 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012

C046 HCFK103ZCA C CHIP CERA 50V Y5V 0.01MF Z 2012 C086 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012
C047 HCFK103ZCA C CHIP CERA 50V Y5V 0.01MF Z 2012 C087 HCFK223ZCA C CHIP CERA 50V Y5V 0.022MF Z 2012

C048 HCFK103ZCA C CHIP CERA 50V Y5V 0.01MF Z 2012 C088 HCFK223ZCA C CHIP CERA 50V Y5V 0.022MF Z 2012
C049 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C090 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS

C050 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C091 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012

C051 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C092 HCQK220JCA C CHIP CERA 50V CH 22PF J 2012

C052 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C093 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012

C053 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C094 HCFK103ZCA C CHIP CERA 50V Y5V 0.01MF Z 2012
C054 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C095 HCFK103ZCA C CHIP CERA 50V Y5V 0.01MF Z 2012

C055 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C096 HCQK220JCA C CHIP CERA 50V CH 22PF J 2012
C056 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C097 HCFK103ZCA C CHIP CERA 50V Y5V 0.01MF Z 2012

C057 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C098 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS

C058 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C099 HCFK223ZCA C CHIP CERA 50V Y5V 0.022MF Z 2012

C059 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C1 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012

C060 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C10 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS
C061 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C100 HCFK223ZCA C CHIP CERA 50V Y5V 0.022MF Z 2012

C062 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C101 HCFK223ZCA C CHIP CERA 50V Y5V 0.022MF Z 2012
C063 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C102 HCFK223ZCA C CHIP CERA 50V Y5V 0.022MF Z 2012
C064 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C103 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012

C065 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C104 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012
C066 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C105 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012

C067 HCQK220JCA C CHIP CERA 50V CH 22PF J 2012 C107 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012
C068 HCTAF109MB C CHIP TANTAL 16V 1MF M 3216 C108 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012

C069 HCTEF101MC C CHIP TANTAL 16V 100MF M 7343 TS C109 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012

C070 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C11 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS
C071 HCTEF101MC C CHIP TANTAL 16V 100MF M 7343 TS C110 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012

C072 HCTAF109MB C CHIP TANTAL 16V 1MF M 3216 C111 HCTEF101MC C CHIP TANTAL 16V 100MF M 7343 TS
C073 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C112 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012

C074 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C113 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012
C075 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012 C114 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012
C076 HCTEJ220MC C CHIP TANTAL 35V 22MF M 7343 C115 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS

C077 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C116 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012
C078 HCFK154ZCA C CHIP CERA Y5V 50V 0.15MF Z 2012 C117 HCFK474ZCA C CHIP CERA Y5V 50V 0.47MF Z 2012

C079 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C118 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012
C080 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C119 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012

C081 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C12 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012

35
 ELECTRICAL PARTS LIST

LOC PART-CODE PART-NAME PART-DESC LOC PART-CODE PART-NAME PART-DESC

C120 HCFK474ZCA C CHIP CERA Y5V 50V 0.47MF Z 2012 C273 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012
C121 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C28 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS
C122 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C29 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS
C123 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS C3 HCQK220JCA C CHIP CERA 50V CH 22PF J 2012
C124 HCFF105ZEA C CHIP CERA 16V Y5V 1MF Z 3216 C31 HCQK470JCA C CHIP CERA 50V CH 47PF J 2012
C125 HCQK121JCA C CHIP CERA 50V CH 120PF J 2012 C32 HCQK470JCA C CHIP CERA 50V CH 47PF J 2012
C126 HCQK121JCA C CHIP CERA 50V CH 120PF J 2012 C33 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS
C127 HCTAF109MB C CHIP TANTAL 16V 1MF M 3216 C34 HCQK150JCA C CHIP CERA 50V CH 15PF J 2012
C128 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS C35 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS
C129 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS C36 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS
C13 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C37 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012
C130 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C38 HCFK474ZCA C CHIP CERA Y5V 50V 0.47MF Z 2012
C131 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C39 HCFK474ZCA C CHIP CERA Y5V 50V 0.47MF Z 2012
C132 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C4 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012
C133 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C40 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS
C136 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS C41 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS
C139 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS C42 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS
C14 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS C43 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS
C141 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C5 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012
C142 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C6 HCQK100JCA C CHIP CERA 50V CH 10PF Z 2012
C143 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C7 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012
C144 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C8 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012
C145 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C813 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012
C146 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 C9 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012
C147 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 CA01 9970800035 CABLE SIGNAL AS 15P+15P/DDC=1.5M(GY275A)
C148 HCQK220JCA C CHIP CERA 50V CH 22PF J 2012 CN1 9979220020 CONN WAFER SMAW250-05 (ANGLE)
C149 HCQK220JCA C CHIP CERA 50V CH 22PF J 2012 CN1A 9970750034 CONN AS SMH250+5264-5+1007#24=110
C15 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS CN2 9979220024 CONN WAFER SMAW250-09 (ANGLE)
C150 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 CN2A 9970790107 CONN AS SMH250-9*2+1007#24=270
C151 HCQK470JCA C CHIP CERA 50V CH 47PF J 2012 CN3 9979220018 CONN WAFER SMAW250-03 (ANGLE)
C152 HCQK330JCA C CHIP CERA 50V CH 33PF J 2012 CN3A 9970730071 CONN AS SMH250-3*2+1354#28=250
C16 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS CN4 9979220021 CONN WAFER SMAW250-06 (ANGLE)
C17 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS CN4A 9970760042 CONN AS SMH250-6*2+2464#24=120
C179 HCTEF101MC C CHIP TANTAL 16V 100MF M 7343 TS CN5 9979220022 CONN WAFER SMAW250-07 (ANGLE)
C18 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 CN5A 9970760043 CONN AS SMH250+1354#28+OP14A=100
C19 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 CW1 9979220022 CONN WAFER SMAW250-07 (ANGLE)
C2 HCQK220JCA C CHIP CERA 50V CH 22PF J 2012 CW2 9979220021 CONN WAFER SMAW250-06 (ANGLE)
C20 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS CW3 9979220018 CONN WAFER SMAW250-03 (ANGLE)
C21 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 CW4 9979220024 CONN WAFER SMAW250-09 (ANGLE)
C22 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 D1 DRLS4148-- DIODE CHIP RLS4148
C23 HCTAF109MB C CHIP TANTAL 16V 1MF M 3216 D2 DRLS4148-- DIODE CHIP RLS4148
C24 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 D3 DRLS4148-- DIODE CHIP RLS4148
C25 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 D4 DRLS4148-- DIODE CHIP RLS4148
C27 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 D5 DRLZ5R6B-B DIODE ZENER CHIP RLZTE-11 5.6B

36
ELECTRICAL PARTS LIST

LOC PART-CODE PART-NAME PART-DESC LOC PART-CODE PART-NAME PART-DESC

DSUB1 9979200209 D-SUB 15P ANGLE 15P DDC BLUE W/IN SCREW Q2 TKTC3875SY TR CHIP KTC3875SY(RTK)
EF1 5PF1BH471M FILTER LC CFI-06-B-1H-471M Q3 TKTC3875SY TR CHIP KTC3875SY(RTK)
IC1 1DWM300--- IC MICOM W78E58-24 Q4 1K1A7805P1 IC REGULATOR KIA7805API
IC1A 9979300500 SOCKET IC WSDIF-40T Q5 TKTC3875SY TR CHIP KTC3875SY(RTK)
IC2 174HCT4538 IC 74HCT4538D Q6 TKTC3875SY TR CHIP KTC3875SY(RTK)
I INV1 DBA11501-- LCD INVERTER BAI1501 Q7 1KA7542--- IC VOTAGE DETECTOR KA7542
J001 85801052GY WIRE COPPER 1/0.52 TIN COATING Q8 DKDS226RTK DIODE CHIP KDS226(RTK)

J002 85801052GY WIRE COPPER 1/0.52 TIN COATING Q9 TKTC3875SY TR CHIP KTC3875SY(RTK)

J003 85801052GY WIRE COPPER 1/0.52 TIN COATING R001 RD-AZ472J- R CARBON FILM 1/6 4.7K OHM J
J004 85801052GY WIRE COPPER 1/0.52 TIN COATING R002 RD-AZ472J- R CARBON FILM 1/6 4.7K OHM J

J005 85801052GY WIRE COPPER 1/0.52 TIN COATING R003 RD-AZ472J- R CARBON FILM 1/6 4.7K OHM J
J006 85801052GY WIRE COPPER 1/0.52 TIN COATING R1 HRFT472JCA R CHIP 1/10 4.7K OHM J 2012

J007 85801052GY WIRE COPPER 1/0.52 TIN COATING R10 HRFT102JCA R CHIP 1/10 1K OHM J 2012
J008 85801052GY WIRE COPPER 1/0.52 TIN COATING R11 HRFT101JCA R CHIP 1/10 100 OHM J 2012
J009 85801052GY WIRE COPPER 1/0.52 TIN COATING R12 HRFT104JCA R CHIP 1/10 100K OHM J 2012

J010 85801052GY WIRE COPPER 1/0.52 TIN COATING R13 HRFT474JCA R CHIP 1/10 470K OHM J 2012
J011 85801052GY WIRE COPPER 1/0.52 TIN COATING R14 HRFT103JCA R CHIP 1/10 10K OHM J 2012

JACK1 9979100010 JACK DC POWER JACK 6.5PIE 14.5*9 R15 RD-2Z101J- R CARBON FILM 1/2 100 OHM J
L1 HFFTB2601B COIL CHIP BEAD TB321611Z260 R16 HRFT105JCA R CHIP 1/10 1M OHM J 2012

L10 HFFTB2601B COIL CHIP BEAD TB321611Z260 R17 HRFT105JCA R CHIP 1/10 1M OHM J 2012

L11 HFFTB2601B COIL CHIP BEAD TB321611Z260 R18 HRFT472JCA R CHIP 1/10 4.7K OHM J 2012
L12 HFFTB2601B COIL CHIP BEAD TB321611Z260 R19 HRFT472JCA R CHIP 1/10 4.7K OHM J 2012

L13 HFFTB2601B COIL CHIP BEAD TB321611Z260 R2 HRFT220JCA R CHIP 1/10 22 OHM J 2012
L15 HFFTB2601B COIL CHIP BEAD TB321611Z260 R20 HRFT472JCA R CHIP 1/10 4.7K OHM J 2012

L16 HFFTB2601B COIL CHIP BEAD TB321611Z260 R22 HRFT472JCA R CHIP 1/10 4.7K OHM J 2012
L2 HFFTB2601B COIL CHIP BEAD TB321611Z260 R23 HRFT473JCA R CHIP 1/10 47K OHM J 2012

L28 HFFTB2601B COIL CHIP BEAD TB321611Z260 R3 HRFT472JCA R CHIP 1/10 4.7K OHM J 2012

L4 HFFTB2601B COIL CHIP BEAD TB321611Z260 R32 HRFT000JCA R CHIP 1/10 0 OHM J 2012

L5 HFFTB2601B COIL CHIP BEAD TB321611Z260 R34 HRFT220JCA R CHIP 1/10 22 OHM J 2012

L6 HFFTB2601B COIL CHIP BEAD TB321611Z260 R35 HRFT220JCA R CHIP 1/10 22 OHM J 2012

L7 HFFTB2601B COIL CHIP BEAD TB321611Z260 R36 HRFT102JCA R CHIP 1/10 1K OHM J 2012

L8 HFFTB2601B COIL CHIP BEAD TB321611Z260 R4 HRFT472JCA R CHIP 1/10 4.7K OHM J 2012

L9 HFFTB2601B COIL CHIP BEAD TB321611Z260 R40 HRFT472JCA R CHIP 1/10 4.7K OHM J 2012
LCD DLM151X2C2 LCD LM151X2-C2TH R400 HRFT362JCA R CHIP 1/10 3.6K OHM J 2012

LED1 DSD50GYW-- LED SD50GYW(GREEN/AMBER) R401 HRFT362JCA R CHIP 1/10 3.6K OHM J 2012
OUT1 9979220080 CONN WAFER DBBV-41PJ-1.0SM R41 HRFT472JCA R CHIP 1/10 4.7K OHM J 2012

OUTA 9970741001 CONN AS DF-9-41S*2+1571#32=220 R5 HRFT220JCA R CHIP 1/10 22 OHM J 2012

Q10 TKTC3875SY TR CHIP KTC3875SY(RTK) R51 HRFT513JCA R CHIP 1/10 51K OHM J 2012

Q12 DKDS226RTK DIODE CHIP KDS226(RTK) R52 HRFT512JCA R CHIP 1/10 5.1K OHM J 2012

Q13 DKDS226RTK DIODE CHIP KDS226(RTK) R53 HRFT512JCA R CHIP 1/10 5.1K OHM J 2012
Q14 DKDS226RTK DIODE CHIP KDS226(RTK) R55 HRFT103JCA R CHIP 1/10 10K OHM J 2012

Q15 DKDS226RTK DIODE CHIP KDS226(RTK) R6 HRFT472JCA R CHIP 1/10 4.7K OHM J 2012
Q16 DKDS226RTK DIODE CHIP KDS226(RTK) R7 HRFT101JCA R CHIP 1/10 100 OHM J 2012

Q17 DKDS226RTK DIODE CHIP KDS226(RTK) R8 HRFT472JCA R CHIP 1/10 4.7K OHM J 2012

37
 ELECTRICAL PARTS LIST

LOC PART-CODE PART-NAME PART-DESC LOC PART-CODE PART-NAME PART-DESC

R801 HRFT750JCA R CHIP 1/10 75 OHM J 2012 SD2 DSK14----- DIODE SCHOTTKY SK14
R811 HRFT750JCA R CHIP 1/10 75 OHM J 2012 SD3 DSK14----- DIODE SCHOTTKY SK14
R821 HRFT750JCA R CHIP 1/10 75 OHM J 2012 SL1 HLC220M00E L CHIP COIL 22UH M (BA220)
R9 HRFT102JCA R CHIP 1/10 1K OHM J 2012 SL2 HLC220M00E L CHIP COIL 22UH M (BA220)
R92 HRFT302JCA R CHIP 1/10 3K OHM J 2012 SQ1 TFDS6930A- FET CHIP FDS6930A
RP1 HFFH4H300E COIL CHIP BEAD HB-4H3216-300JT SQ2 TFDS6930A- FET CHIP FDS6930A
RP10 HFFH4M121E COIL CHIP BEAD HB-4M3216-121JT SQ3 1K1A78L05F IC REGULATOR CHIP KIA78L05F(RTF)
RP12 HFFH4M121E COIL CHIP BEAD HB-4M3216-121JT SQ6 TNDS9435A- FET CHIP NDS9435A
RP13 HFFH4M121E COIL CHIP BEAD HB-4M3216-121JT SQ7 T2N3904SRT TR CHIP 2N3904S(RTK)
RP2 HFFH4H300E COIL CHIP BEAD HB-4H3216-300JT SQ8 1K1A78L05F IC REGULATOR CHIP KIA78L05F(RTF)
RP3 HFFH4H300E COIL CHIP BEAD HB-4H3216-300JT SR1 HRFT104JCA R CHIP 1/10 100K OHM J 2012
RP4 HFFH4H300E COIL CHIP BEAD HB-4H3216-300JT SR10 HRFT220JCA R CHIP 1/10 22 OHM J 2012
RP5 HFFH4H300E COIL CHIP BEAD HB-4H3216-300JT SR14 HRFT104JCA R CHIP 1/10 100K OHM J 2012
RP7 HFFH4M121E COIL CHIP BEAD HB-4M3216-121JT SR15 HRFT104JCA R CHIP 1/10 100K OHM J 2012
RP8 HFFH4M121E COIL CHIP BEAD HB-4M3216-121JT SR16 HRFT113JCA R CHIP 1/10 11K OHM J 2012
RP9 HFFH4M121E COIL CHIP BEAD HB-4M3216-121JT SR2 HRFT103JCA R CHIP 1/10 10K OHM J 2012
RW2 RS01Z330J- R M-OXIDE FILM 1W 33 OHM J (TAPPING) SR3 HRFT103JCA R CHIP 1/10 10K OHM J 2012
S001 5S50101Z01 SW TACT KPT-1115VM 1C-1P SR4 HRFT104JCA R CHIP 1/10 100K OHM J 2012
S002 5S50101Z01 SW TACT KPT-1115VM 1C-1P SR5 HRM1407JPD R CHIP METAL PLATE 1W 0.04 OHM J 8340
S003 5S50101Z01 SW TACT KPT-1115VM 1C-1P SR6 HRM1207JPD R CHIP METAL PLATE 1W 0.02 OHM J 8340
S004 5S50101Z01 SW TACT KPT-1115VM 1C-1P SU1 1SB3052P-- IC SB3052P(SSOP-28)
S005 5S50101Z01 SW TACT KPT-1115VM 1C-1P U015 1M62393P-- IC DAC M62393P
S006 5S50101Z01 SW TACT KPT-1115VM 1C-1P U017 1TDA8752AH IC ADC TDA8752AH/8
SC1 HCTEJ220MC C CHIP TANTAL 35V 22MF M 7343 U019 1TC74ACT14 IC TC74ACT14FN
SC10 HCTED221MC C CHIP TANTAL 10V 220MF M 7343 U1 1MX88281FC IC LCD CONTROLLER MX88281FC
SC11 HCTED221MC C CHIP TANTAL 10V 220MF M 7343 U10 1TC74ACT57 IC TC74ACT573FT(EL)
SC12 HCTED221MC C CHIP TANTAL 10V 220MF M 7343 U11 1TC74ACT57 IC TC74ACT573FT(EL)
SC13 HCTED221MC C CHIP TANTAL 10V 220MF M 7343 U12 1TC74ACT57 IC TC74ACT573FT(EL)
SC18 HCTEJ220MC C CHIP TANTAL 35V 22MF M 7343 U16 1AT24C21-- IC EEPROM AT24C21
SC2 HCTEJ220MC C CHIP TANTAL 35V 22MF M 7343 U2 1ZRC250N80 IC ZRC250N802
SC20 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS U3 1KM416S102 IC SDRAM KM416S1020CT-G8
SC21 HCFF105ZEA C CHIP CERA 16V Y5V 1MF Z 3216 U4 1KM416S102 IC SDRAM KM416S1020CT-G8
SC3 HCTBF479MB C CHIP TANTAL 16V 4.7MF M 3528 U5 1KM416S102 IC SDRAM KM416S1020CT-G8
SC4 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 U6 1AT24C1610 IC AT24C16-10PC
SC5 HCFK104ZCA C CHIP CERA 50V Y5V 0.1MF Z 2012 U7 1DW0SD05-- IC OSD DWOSD05
SC6 HCFK103ZCA C CHIP CERA 50V Y5V 0.01MF Z 2012 U8 TNDS9958-- FET CHIP NDS9958
SC7 HCFK103ZCA C CHIP CERA 50V Y5V 0.01MF Z 2012 U9 1TC74ACT57 IC TC74ACT573FT(EL)
SC8 HCFF105ZEA C CHIP CERA 16V Y5V 1MF Z 3216 Y1 5XJ14R318F CRYSTAL QUARTZ HC-49/S 14.31818MHZ 50PPM
SD1 DKDS181RTK DIODE CHIP KDS181(RTK) Y2 5XJ11R059E CRYSTAL HC-49/S 11.0592MHZ 30PPM

38