Memorandum

To: Our Valued Customers

Background
On January 27, 2003, the European Union passed the "Restriction on Use of Hazardous Substances in
Electrical and Electronic Equipment," or "RoHS" directive 2002/95/EC, which has an implementation date of July 1,
2006. On 4 June 2015, the EU commission published a new Directive (EU) 2015/863 to amend Annex II to EU
RoHS 2 (Directive 2011/65/EU) to add 4 phthalates onto the list of restricted substances. Member states were
required ensure that new electrical and electronic equipment placed on the market, contain less than the maximum
allowed levels of the following restricted hazardous substances:
Hazardous Substance Maximum limit % by weight
Hg – Mercury 0.1%
Cd – Cadmium 0.01%
Cr6 – Hexavalent Chromium 0.1%
PBB – Polybrominated Biphenyls 0.1%
PBDE – Polybrominated Diphenylethers 0.1%
Pb - Lead 0.1%
Bis(2-Ethylhexyl) phthalate (DEHP) 0.1%
Benzyl butyl phthalate (BBP) 0.1%
Dibutyl phthalate (DBP) 0.1%
Diisobutyl phthalate (DIBP) 0.1%

It shall be noted that above maximum concentration values apply to each homogeneous material rather than
a product or a part itself. A homogeneous material means material of uniform composition throughout that cannot be
mechanically separated into different materials.
Materials Selection
In compliance with the RoHS European directives to eliminate lead (Pb) in the electronics industry, Holt
Integrated Circuits has adopted the use of Pb-free terminations for its RoHS compliant plastic packages. Package
molding compounds have been upgraded so that the product is fully RoHS compliant and able to withstand the
higher soldering temperatures of lead-free solder alloys. Product qualification has validated that the products can
withstand peak solder temperature rating per JEDEC J-STD-020E Table 5-2 and Figure 5-1.
Holt selected matte tin and NiPdAu lead finishes to provide forward and backward compatibility with both the
current industry-standard SnPb-based soldering processes and higher-temperature Pb-free processes. Industry
testing has shown that matte tin is backward compatible to standard 215ºC to 225ºC tin/lead (SnPb) reflow processes
and compatible with up to 260ºC Pb-free reflow processes.

23351 Madero, Mission Viejo, CA 92691-2730  (949) 859-8800  (949) 859-9643 (Fax)
Web Site: www.holtic.com  E-mail: [email protected]
 JEDEC J-STD-020E Table 5-2 Classification Reflow Profiles
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat/Soak
Temperature Min (Tsmin)
100 °C 150 °C
Temperature Max (Tsmax) 150 °C 200 °C
Time (ts) from (Tsmin to Tsmax) 60-120 seconds 60-120 seconds
Ramp-up rate (TL to Tp) 3 °C/second max. 3 °C/second max.
Liquidous temperature (TL) 183 °C 217 °C
Time (tL) maintained above TL 60-150 seconds 60-150 seconds

For users Tp must not exceed the For users Tp must not exceed the
Classification temp in Table 4-1. Classification temp in Table 4-2.
Peak package body temperature (Tp)
For suppliers Tpmust equal or exceed For suppliers Tp must equal or exceed
the Classification temp in Table 4-1. the Classification temp in Table 4-2.
Time (tp)* within 5 °C of the specified classi- 20* seconds 30* seconds
fication temperature (Tc), see Figure 5-1.
Ramp-down rate (Tp to TL) 6 °C/second max. 6 °C/second max.
Time 25 °C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If parts are
reflowed in other than the normal live bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ± 2 °C of the live bug Tp and still meet the Tc
requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body temperatures, refer to JEP140 for
recommended thermocouple use.
Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly profiles should
be developed based on specific process needs and board designs and should not exceed the parameters in this table.
For example, if Tc is 260 °C and time Tp is 30 seconds, this means the following for the supplier and the user:
 For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least 30 seconds.
 For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 seconds.
Note 3: All components in the test load shall meet the classification profile requirements.
Note 4: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020, JESD22-A112
(rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a higher pe ak classification
temperature is desired.

JEDEC J-STD-020E Figure 5-1 Classification Reflow Profile

23351 Madero, Mission Viejo, CA 92691-2730  (949) 859-8800  (949) 859-9643 (Fax)
Web Site: www.holtic.com  E-mail: [email protected]
Tin Whisker Mitigation
Because of the lead-free movement and the European RoHS directive, many component manufacturers are
moving from tin-lead (SnPb) to pure tin (Sn) lead finishes. Pure tin and high-tin content alloys are subject to tin
whisker formation and growth. Tin whiskers are spontaneous filamentous or needlelike growths from the tin surface
and are believed to be a result of stress relief in the tin layer. Holt’s assembly subcontractors employ the following
industry approved mitigation practices to mitigate the formation and growth of tin whiskers:
 Use of 100% matte tin.
o Matte tin has a larger grain size (1m-5m) than bright tin (0.5m-0.8m)
 Use of a thicker matte tin plating
o Plating thickness of 8m minimum is recommended
 Use of an annealing process immediately after matte tin plating

Holt is aware of and will continue to monitor ongoing studies in tin whisker development and mitigation strategies.
Additional information on tin whiskers can be found at the International Electronics Manufacturing Initiative website
(www.nemi.org).

Product Offerings
To meet our customer’s desire to meet these Directives, Holt is proud to offer RoHS compliant Lead-Free
products. Holt’s RoHS compliant ICs are in full compliance with the EU Directives for Restriction of Hazardous
Substances (RoHS). Our lead-free products are easily identifiable. Plastic products compliant to the RoHS
Directives are identified by an “F” contained in the part number marked on the device.
For example:
HI-8586PSI is non-RoHS SnPb plated
HI-8586PSIF is RoHS compliant lead-free plated with 100% matte tin

Ceramic parts with the following suffixes are also RoHS compliant:
C, CT, CM (without dash numbers)
S, ST, SM (without dash numbers)
CDI, CDT, CLI, CLT

Holt will continue to support the original line of tin/lead plated products, where possible. We recognize that
many customers still require Tin/Lead products that are not RoHS compliant and many of these products are still
available from Holt. In situations where this is not possible or practical (ex. QFN packages), we strive to employ lead
finishes that do not contain tin. The part numbers will remain as they are. They will continue to be the same high
quality products we have always delivered.

Steve Brower
Vice President of Operations
Holt Integrated Circuits, Inc.

Disclaimer
The information contained herein could include technical inaccuracies or typographical errors. Holt makes no representation or warranty as to the accuracy of such
information. Holt believes it has taken reasonable steps to provide representative and accurate information, but may not have conducted destructive testing or chemical
analysis on incoming materials. Certain Holt suppliers consider information on material content to be proprietary, and thus CAS numbers for such materials may not be
available for release. The information provided on this page is based on information provided by third parties as well as existing European legislation, and is not based
on, nor is it applicable to, market-specific or country-specific laws, regulations or policies. Rather, Holt intends to comply with industry standards that meet the RoHS
directives.

23351 Madero, Mission Viejo, CA 92691-2730  (949) 859-8800  (949) 859-9643 (Fax)
Web Site: www.holtic.com  E-mail: [email protected]