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Thermo Generator Package

The document discusses ThermoGenerator-Packages (TGP) that integrate Micropelt's thin-film thermogenerators. The TGP-751 and TGP-651 packages offer solid-state, maintenance-free operation with high power density. A larger heat sink results in more output power by increasing the temperature difference across the TGP. The TGP-751 is best for applications requiring maximum power output or operation from small temperature differences due to its larger active area.

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0% found this document useful (0 votes)
96 views

Thermo Generator Package

The document discusses ThermoGenerator-Packages (TGP) that integrate Micropelt's thin-film thermogenerators. The TGP-751 and TGP-651 packages offer solid-state, maintenance-free operation with high power density. A larger heat sink results in more output power by increasing the temperature difference across the TGP. The TGP-751 is best for applications requiring maximum power output or operation from small temperature differences due to its larger active area.

Uploaded by

dudulemarc
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 13

TGP-751

TGP-651
ThermoGenerator-Package (TGP)

Thin Film Thermogenerator


inside standard package

Preliminary Datasheet
TGP-751 / TGP-651 ThermoGenerator-Package

1. Introduction 1.2 Features:

 Integrates Micropelt MPG-D751 or MPG-D651


1.1 General description
solid-state thermogenerator
The TGP-751 / TGP-651 a packaged Micropelt thermo-
 Maintenance-free solid state operation
generator, which offers the superior performance of
Micropelt’s thin-film, solid-state generators in a stand-  Long life time
ard packaging concept.  Compatible with automated placing & reflow
production lines
Micropelt’s thermogenerator chips offer a very high  TGP thickness offers adequate spacing for
power density, with up to 100 leg pairs per mm², and a placing components on the PCB
very high output voltage of up to 1.75 V per Watt of  Optimized mechanical design offers maximum
thermal input. thermal performance

 Operating temperatures up to 140 °C

 High output voltage per degree temperature


gradient (110 mV/K for TGP-751)

TGP-751 TGP-651

Relec 300 Ω 185 Ω

Thermoelectric legs pairs on wafer substrate


R thermal (R-th) 18 K/W 28 K/W

The package concept is based on a rectangle metal- Seebeck voltage 110 mV/K 60 mV/K
base laminate with a ring isolator, in order to achieve a
good thermal performance by maximizing the thermal TEG inside MPG-D751 MPG-D651

flow through the Micropelt thermogenerator chip.


Footprint (l x w) 15 x 10 mm 15 x 10 mm
Together with a metal top, the components offer a
solid and stable mechanical construction.

1.3 Applications

Aluminium Generic power supply utilizing waste heat to drive


Milliwatt (wireless) applications, including:
Isolator
 Wireless sensor networks (WSN)
PCB
 Industrial process monitoring

 Condition monitoring

 Thermal event logging

 Thermal triggering

Solid and stable mechanical construction


 Intelligent buildings and HVAC

 Automatic meter reading (AMR)

 Energy monitoring & control

Micropelt - preliminary - Datasheet TGP v1.8 | Page 2


TGP-751 / TGP-651 ThermoGenerator-Package

1.4 Typical application diagram The Micropelt TE-CORE module operates from a heat
Electrical diagram of a DC Booster (refer Micropelt TE- source versus ambient air with heatsink.
CORE module datasheet), which up-converts the TGP
output voltage to 1.9 V - 4.5 V (configurable).

Micropelt TE-CORE module with heatsink

1.6 Absolute Maximum Ratings

min TYP max

TGP-751

R thermal 18 K/W

110 mV/K
Seebeck voltage
(Tamb = 25 ºC)

300 Ω
R electrical 240 Ω 350 Ω
(Tamb = 25 ºC)

TGP-651

R thermal 28 K/W

60 mV/K /
Seebeck voltage
(Tamb = 25 ºC)

185 Ω
R electrical 150 Ω 230 Ω
(Tamb = 25 ºC)
DC booster concept, as used for Micropelt TE-CORE
thermoharvesting power module General

ESD sensitivity 9000 V


1.5 Typical thermal application
Soldering
260 ºC
The TGP can be integrated into a standard (FR4) PCB temperature *

via a through hole for the thermal path. This allows a Allowable
3
reflow cycles *
mechanical construction for the hot and cold side of
the thermal harvester power source, with an optimum Operating temp - 40 ºC + 140 ºC

thermal performance.
Storage temp - 40 ºC + 160 ºC

* for prototype samples, special instructions are valid, see §3.2

Micropelt - preliminary - Datasheet TGP v1.8 | Page 3


TGP-751 / TGP-651 ThermoGenerator-Package

2. Electrical parameters

2.1 Thermal path and heat sink The net Delta-T over the TGP can be analyzed as:

A typical thermal energy harvesting application con- Delta‐TTGP *


tains a hot side surface and a heat sink (HS) in ambient
air as cold side. In between the TGP generator is The larger the heat sink, the smaller the R-thHS and
“sandwiched” and a heat energy (Q) is floating. therefore the more heat energy (Q) is floating through

TGP generator
the TGP, resulting in a larger, net delta-T over the TGP.
Heat sink
Heat source
Clear and brief:
 a larger heat sink result in more output power
for the TGP

Since the TGP-751 has a larger active area, compared


DT TGP to the TGP-651, the TGP-751 is most suitable for appli-
DT hot-cold
cations, targeting:
Heat flux Q  maximum output power

Typical energy harvesting application  Operation from very small temperature


differences
The output power of a thermogenerator depends on
the amount of heat energy floating through the device.
Operating optimum of a thermal system is when:
This is represented by the temperature difference di-
 R-thTGP = R-th-HS
rectly over the thermogenerator, which depends on its
Therefore the higher output power capabilities of the
thermal resistance,. This can be described by a thermal
TGP-751 can be measured when using a larger heat
resistor network (equivalent to Ohm’s law for voltage,
sink.
current and electrical resistance).

Rth thermal resistance in K/W


Performance results are given in 2.2 and 2.3:

 2.2: TGP component level, independent from a ther-


R-thTGP R-thHS
mal solution. This is important for thermal systems
THOT [K]
Heat flow Q [W]
TCOLD [K] which are not against ambient air, like an applica-
tion where the TGP is directly mounted between
two pipes with hot and cold liquid.
Network diagram for thermal system
 2.3: TGP in practical application with a hot source
The effective (net) temperature difference (Delta-T)
and different practical heat sinks in
over the TGP is determined by:
ambient air at a temperature of 25 ºC.
 Gross Delta-T = THOT — TCOLD
 Thermal resistance TGP: R-thTGP
 Thermal resistance heat sink: R-thHS

Micropelt - preliminary - Datasheet TGP v1.8 | Page 4


TGP-751 / TGP-651 ThermoGenerator-Package

2.2 Electrical parameters of TGP components

The matched output power and open circuit output


voltage of the TGP depend on the temperature gradi-
ent over the device.

Both the hot and cold side of the TGP component are
fixed to a defined temperature.

The TGP measurements are made with the TGP


component and two fixed temperatures over the
device.

Micropelt - preliminary - Datasheet TGP v1.8 | Page 5


TGP-751 / TGP-651 ThermoGenerator-Package

2.3 Output power performance application


The matched output power depends on the character-
istics of the thermal path from heat source to ambient
(cold side). The heatsink type, dimensions and position
are of influence.

Dimensions Sk422 heat sink


The TGP measurements are made with the TE-
CORE7 ThermoHarvesting Power module, using
different heat sinks from Fischer Elektronik,
type Sk422 with a length of 33 mm, 50 mm
and 90 mm.
http://www.fischerelektronik.de/index.php/
kuehlkoerperbereich-fcool/

Performance diagram of Sk422 heat sink

Different heat sink types od Sk422

TE-CORE with heat sink Sk422-33

Micropelt - preliminary - Datasheet TGP v1.8 | Page 6


TGP-751 / TGP-651 ThermoGenerator-Package

TGP-651 performance measured with


TE-CORE6 ThermoHarvesting Power
module, using different heat sinks from
Fischer Elektronik, type Sk422 with a
length of 33 mm, 50 mm and 90 mm.

Summary output power performance:


The output power performance depends on
the heat sink (HS) performance in combina-
tion with the selected TGP ThermoGenerator
Package. The table below describes the in-
crease of output power with the smallest heat
sink (33 mm) as reference.

Midsize
Small HS Larger HS
HS
(Sk-422 (Sk-422
(Sk-422
33) 90)
5o)

TGP-651 100% 125% 135%

TGP-751 100% 130% 185%

Thanks to the optimized thermal de-


sign of the TGP compared to the Mi-
cropelt TE-Power NODE evaluation
system, the output power of the TGP
outperforms the TE-Power NODE.

Micropelt - preliminary - Datasheet TGP v1.8 | Page 7


TGP-751 / TGP-651 ThermoGenerator-Package

3. Application information Top View


(hot side)
3.1 Product dimensions
All dimensions are given in millimeters
Drawings are not to scale

Top view

Contact pad TGP-- Mechanical pad (no function)

Bottom View
(cold side)
W (width)

Contact pad TGP+ Orientation marker

L (length) Side View

Side View
T (thickness)

Dimensions TGP Solder Pad Layout


L = 15.0 mm
W = 10.0 mm
T = 9.3 mm

Tolerances according
ISO 2768-mK (medium).
Except tolerances ± are
given in the drawing.
(see table §3.1.1)

Micropelt - preliminary - Datasheet TGP v1.8 | Page 8


TGP-751 / TGP-651 ThermoGenerator-Package

3.1.1 General tolerances for linear and angular dimensions according DIN ISO 2768-mk

For TGP tolerance class „medium“ is applicable, except tolerances ± are given in the drawing.

Permissible deviations Tolerance class


in mm for ranges in designation (description)
nominal lengths
f (fine) m (medium) c (coarse) v (very coarse)
0.5 up to 3 ±0.05 ±0.1 ±0.2 -

over 3 up to 6 ±0.05 ±0.1 ±0.3 ±0.5

over 6 up to 30 ±0.1 ±0.2 ±0.5 ±1.0

over 30 up to 120 ±0.15 ±0.3 ±0.8 ±1.5

over 120 up to 400 ±0.2 ±0.5 ±1.2 ±2.5

over 400 up to 1000 ±0.3 ±0.8 ±2.0 ±4.0

over 1000 up to 2000 ±0.5 ±1.2 ±3.0 ±6.0


over 2000 up to 4000 - ±2.0 ±4.0 ±8.0

Micropelt - preliminary - Datasheet TGP v1.8 | Page 9


TGP-751 / TGP-651 ThermoGenerator-Package

3.2 Handling & Solder recommendations A good mechanical connection can be achieved by us-
The TGP package can be wired and soldered by using ing a clamp or stainless steel bolts to mount the TGP
standard solder equipment. between the hot and cold sources.

The non-functional connection is being used for me- Important to observe is:
chanical stability. It can also be used to integrate a tem-  avoid parallel leakage of thermal energy (bypassing
perature sensor (e.g. PT100) close to the TGP to moni- the TGP) by using stainless steal bolts, which have a
reduced thermal conductivity.
tor the package temperature.
Alternative, an improved construction can be con-
sidered by an using thermal isolator material around
Reflow procedure for mass production will be accord-
the bolts
ing IPC/JEDEC.
 when using bolts to clamp TGP between two metal
IMPORTANT NOTE: surfaces, then target force is a about 35 cNm;
achieved by alternative fastening the bolts in small
 actual prototypes have to be manually soldered:
steps
270 ºC max. and 5 seconds max.,
 Thermal paste can be added between the outside of
to connect wires to the TGP contact pads.
the TGP and both the hot and cold sources. Also a
Graphite foil can be used to achieve a good thermal
performance (i.e. eGraph type Hitherm 2505, 127µm.
3.3 Mechanical design
The TGP will have to be mounted between a hot and Stainless steel bolts

cold source and has been designed in order that:

 there is space for placing electronic components Optional PCB

directly next to the TGP, in case of an embedded


application with a Printed Circuit Board (PCB)
TGP position
 Maximum thermal performance can be achieved, by
proper distance between a hot and cold source

A practical example is described for an application with Hot source or adaptor


a hot source adaptor (for instance connected to a pipe
with hot liquid) and a heat sink in ambient air.
Assembly of TGP

Heat sink in ambient air

TGP position

Optional PCB

Hot source or adaptor

Practical energy harvesting application

Micropelt - preliminary - Datasheet TGP v1.8 | Page 10


TGP-751 / TGP-651 ThermoGenerator-Package

3.4 Reliability Testing


The TGP components are planned to be tested
 Lifetime
 Humidity
 Vibration
 Mechanical shock
 Non-operating thermal shock

IMPORTANT NOTE:
 actual prototype withstand a mechanical shear
force of 15 kg in combination with the manual
solder procedure as mentioned in §3.2

3.5 Environmental compliance


Micropelt Generator-in-package components are com-
pliant to the Restriction of Hazardous Substances Di-
rective of RoHS.

3.6 Ordering information


 TGP-751
 TGP-651

Micropelt - preliminary - Datasheet TGP v1.8 | Page 11


TGP-751 / TGP-651 ThermoGenerator-Package

TE-CORE power kit TE-Power PROBE

TE-Power PROBE is an integrated thermoharvester which we


TE-CORE module offers an efficient DC-
specifically designed for operating conditions using natural
booster and power management concept.
convection to ambient air.
A powerful heat sink ensures a high level of heat dissipation
which leads to maximal thermoharvesting results when
mounted in horizontal orientation.
TE-Power PLUS

TE-qNODE

TE-Power PLUS evaluation unit with DC-DC


booster module. With potentiometer for out-
put setting from 1.6 V - 5 V and cap interface
for additional capacity.

TE-qNODE is a battery-free wireless sensor for thermal


TE-Power NODE monitoring of electrical distribution systems, i.e. busbars
and busways.
Resistive heat is used to power continuous monitoring for
increased safety and power availability in 24/7 production
environments.

TE-Power NODE thermo-powered wireless


sensor, harvesting budget explorer comes
with TE-Power SCOPE application software.

Micropelt - preliminary - Datasheet TGP v1.8 | Page 12


TGP-751 / TGP-651 ThermoGenerator-Package

4. Important Notices – Please read carefully prior to use

1. Micropelt Products are prototypes


Micropelt supplies thermoelectric coolers and thermogenerators in package, as well as energy harvesting modules (hereinafter referred to as
“Prototype Products”). The Prototype Products distributed by Micropelt to date are prototypes that have not yet been released to manufacturing
and marketing for regular use by end-users. The Prototype Products are still being optimized and continuously tested. As such, the Prototype
Products may not fully comply with design-, marketing-, and/or manufacturing-related protective considerations, including product safety and
environmental measures typically found in end products that incorporate such semiconductor components or circuit boards.
In addition, the Products have not yet been fully tested for compliance with the limits of computing devices, neither pursuant to part 15 of FCC
rules nor pursuant to any other national or international standards, which are designed to provide reasonable protection against radio frequency
interference.

2. Use of Products restricted to demonstration, testing and evaluation


Micropelt’s Prototype Products are intended exclusively for the use for demonstration, testing and evaluation purposes.
The Prototype Products must not be used productively. In particular, the Prototype Products must not be used in any safety-critical applications,
such as (but not limited to) life support systems, near explosion endangered sites, and/or any other performance critical systems.
The Prototype Products must only be handled by professionals in the field of electronics and engineering who are experienced in observing good
engineering standards and practices.

3. Warnings and use instructions

 Using Micropelt’s Prototype Products without care and in the wrong context is potentially dangerous and could result in injury or damage.
The Prototype Products are designed for use within closed rooms in conditions as apply for electronics such as computers; except when indicat-
ed expressively. Keep the Prototype Products away from open fire, water, chemicals, gases, explosives as well as from temperature conditions
above 100 degrees centigrade, or as indicated in the datasheet of the product. When testing temperature settings at the limits given in the
datasheet for longer term, do not leave the Prototype Products alone but monitor their performance. Take special care to monitor closely when-
ever the Prototype Products are connected to other electrical items and/or electronics.

 If the Prototype Products use wireless data transmission technology, therefore they receive and radiate radio frequency energy. They have not
yet been fully tested for compliance with the limits of computing devices, neither pursuant to part 15 of FCC rules nor pursuant to any other
national or international standards, which are designed to provide reasonable protection against radio frequency interference. Operation of the
Prototype Products may cause interference with radio communications, in which case the user at his own expense will be required to take what-
ever measures may be necessary to correct this interference and prevent potential damage. Do take special care not to operate the Prototype
Products near safety-critical applications or any other applications known to be affected by radio frequencies.

 If any of the Prototype Products elements are separated from the complete module and used independently, it is important to control each
individual system’s power supply to be within their acceptable voltage and/or amperage range. Exceeding the specified supply voltage and/or
amperage range may cause unintended behavior and/or irreversible damage to the Prototype Products and/or connected applications.Please
consult the Prototype Products’ User Guide prior to connecting any load to the Prototype Products’ output. Applying loads outside of the speci-
fied output range may result in unintended behavior and/or permanent damage to the Prototype Products. If there is uncertainty as to the sup-
ply or load specification, please contact a Micropelt engineer.

 During normal operation, some circuit components may have case temperatures greater than 70°C. The Prototype Products are designed to
operate properly with certain components above 70°C as long as the input and output ranges are maintained. These components include but
are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified
using the evaluation unit schematic located in the dataheet. When placing measurement probes near these devices during operation, please be
aware that these devices may be as hot as to inflict the risk of burning skin when touched.

 Due to the open construction of the Prototype Products, it is the user’s responsibility to take any and all appropriate precautions with regard to
electrostatic discharge and any other prevention measures for safety.

4. User’s Feedback
Micropelt welcomes the user’s feedback on the results of any tests and evaluations of the Prototype Products. In particular, we appreciate experi-
ence information on use cases with indications of strengths and weaknesses of the Prototype Products, its robustness in operation and its long-
term durability. Please, contact our Micropelt Application Engineering colleagues by email at [email protected].

Prototype Products, its robustness in operation and its long-term durability. Please, contact our Micropelt Application Engineering colleagues by
email at [email protected].

Micropelt GmbH | Emmy-Noether-Str. 2 | 79110 Freiburg (Germany)

Micropelt - preliminary - Datasheet TGP v1.8 | Page 13

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