Thermo Generator Package
Thermo Generator Package
TGP-651
ThermoGenerator-Package (TGP)
Preliminary Datasheet
TGP-751 / TGP-651 ThermoGenerator-Package
TGP-751 TGP-651
The package concept is based on a rectangle metal- Seebeck voltage 110 mV/K 60 mV/K
base laminate with a ring isolator, in order to achieve a
good thermal performance by maximizing the thermal TEG inside MPG-D751 MPG-D651
1.3 Applications
Condition monitoring
Thermal triggering
1.4 Typical application diagram The Micropelt TE-CORE module operates from a heat
Electrical diagram of a DC Booster (refer Micropelt TE- source versus ambient air with heatsink.
CORE module datasheet), which up-converts the TGP
output voltage to 1.9 V - 4.5 V (configurable).
TGP-751
R thermal 18 K/W
110 mV/K
Seebeck voltage
(Tamb = 25 ºC)
300 Ω
R electrical 240 Ω 350 Ω
(Tamb = 25 ºC)
TGP-651
R thermal 28 K/W
60 mV/K /
Seebeck voltage
(Tamb = 25 ºC)
185 Ω
R electrical 150 Ω 230 Ω
(Tamb = 25 ºC)
DC booster concept, as used for Micropelt TE-CORE
thermoharvesting power module General
via a through hole for the thermal path. This allows a Allowable
3
reflow cycles *
mechanical construction for the hot and cold side of
the thermal harvester power source, with an optimum Operating temp - 40 ºC + 140 ºC
thermal performance.
Storage temp - 40 ºC + 160 ºC
2. Electrical parameters
2.1 Thermal path and heat sink The net Delta-T over the TGP can be analyzed as:
TGP generator
the TGP, resulting in a larger, net delta-T over the TGP.
Heat sink
Heat source
Clear and brief:
a larger heat sink result in more output power
for the TGP
Both the hot and cold side of the TGP component are
fixed to a defined temperature.
Midsize
Small HS Larger HS
HS
(Sk-422 (Sk-422
(Sk-422
33) 90)
5o)
Top view
Bottom View
(cold side)
W (width)
Side View
T (thickness)
Tolerances according
ISO 2768-mK (medium).
Except tolerances ± are
given in the drawing.
(see table §3.1.1)
3.1.1 General tolerances for linear and angular dimensions according DIN ISO 2768-mk
For TGP tolerance class „medium“ is applicable, except tolerances ± are given in the drawing.
3.2 Handling & Solder recommendations A good mechanical connection can be achieved by us-
The TGP package can be wired and soldered by using ing a clamp or stainless steel bolts to mount the TGP
standard solder equipment. between the hot and cold sources.
The non-functional connection is being used for me- Important to observe is:
chanical stability. It can also be used to integrate a tem- avoid parallel leakage of thermal energy (bypassing
perature sensor (e.g. PT100) close to the TGP to moni- the TGP) by using stainless steal bolts, which have a
reduced thermal conductivity.
tor the package temperature.
Alternative, an improved construction can be con-
sidered by an using thermal isolator material around
Reflow procedure for mass production will be accord-
the bolts
ing IPC/JEDEC.
when using bolts to clamp TGP between two metal
IMPORTANT NOTE: surfaces, then target force is a about 35 cNm;
achieved by alternative fastening the bolts in small
actual prototypes have to be manually soldered:
steps
270 ºC max. and 5 seconds max.,
Thermal paste can be added between the outside of
to connect wires to the TGP contact pads.
the TGP and both the hot and cold sources. Also a
Graphite foil can be used to achieve a good thermal
performance (i.e. eGraph type Hitherm 2505, 127µm.
3.3 Mechanical design
The TGP will have to be mounted between a hot and Stainless steel bolts
TGP position
Optional PCB
IMPORTANT NOTE:
actual prototype withstand a mechanical shear
force of 15 kg in combination with the manual
solder procedure as mentioned in §3.2
TE-qNODE
Using Micropelt’s Prototype Products without care and in the wrong context is potentially dangerous and could result in injury or damage.
The Prototype Products are designed for use within closed rooms in conditions as apply for electronics such as computers; except when indicat-
ed expressively. Keep the Prototype Products away from open fire, water, chemicals, gases, explosives as well as from temperature conditions
above 100 degrees centigrade, or as indicated in the datasheet of the product. When testing temperature settings at the limits given in the
datasheet for longer term, do not leave the Prototype Products alone but monitor their performance. Take special care to monitor closely when-
ever the Prototype Products are connected to other electrical items and/or electronics.
If the Prototype Products use wireless data transmission technology, therefore they receive and radiate radio frequency energy. They have not
yet been fully tested for compliance with the limits of computing devices, neither pursuant to part 15 of FCC rules nor pursuant to any other
national or international standards, which are designed to provide reasonable protection against radio frequency interference. Operation of the
Prototype Products may cause interference with radio communications, in which case the user at his own expense will be required to take what-
ever measures may be necessary to correct this interference and prevent potential damage. Do take special care not to operate the Prototype
Products near safety-critical applications or any other applications known to be affected by radio frequencies.
If any of the Prototype Products elements are separated from the complete module and used independently, it is important to control each
individual system’s power supply to be within their acceptable voltage and/or amperage range. Exceeding the specified supply voltage and/or
amperage range may cause unintended behavior and/or irreversible damage to the Prototype Products and/or connected applications.Please
consult the Prototype Products’ User Guide prior to connecting any load to the Prototype Products’ output. Applying loads outside of the speci-
fied output range may result in unintended behavior and/or permanent damage to the Prototype Products. If there is uncertainty as to the sup-
ply or load specification, please contact a Micropelt engineer.
During normal operation, some circuit components may have case temperatures greater than 70°C. The Prototype Products are designed to
operate properly with certain components above 70°C as long as the input and output ranges are maintained. These components include but
are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified
using the evaluation unit schematic located in the dataheet. When placing measurement probes near these devices during operation, please be
aware that these devices may be as hot as to inflict the risk of burning skin when touched.
Due to the open construction of the Prototype Products, it is the user’s responsibility to take any and all appropriate precautions with regard to
electrostatic discharge and any other prevention measures for safety.
4. User’s Feedback
Micropelt welcomes the user’s feedback on the results of any tests and evaluations of the Prototype Products. In particular, we appreciate experi-
ence information on use cases with indications of strengths and weaknesses of the Prototype Products, its robustness in operation and its long-
term durability. Please, contact our Micropelt Application Engineering colleagues by email at [email protected].
Prototype Products, its robustness in operation and its long-term durability. Please, contact our Micropelt Application Engineering colleagues by
email at [email protected].