CLASSIFICATION PRODUCT SPECIFICATION No. REV.

Einstufung Produktspezifikation DS-1x55-2400-102 1.2

SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 1 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

Product Specification
Applicant / Manufacturer Panasonic Industrial Devices Europe GmbH
Hardware Zeppelinstrasse 19
21337 Lüneburg
Germany

Applicant / Manufacturer Stollmann Entwicklungs- und Vertriebs-GmbH

Software Mendelssohnstrasse 15 D
22761 Hamburg
Germany

Supported Bluetooth Profiles BlueRS , SPP, HDP, HID, OPP, HDP/SPP

By purchase of any of products described in this document the customer accepts the
document's validity and declares their agreement and understanding of its contents and
recommendations. Panasonic reserves the right to make changes as required without
notification

PANASONIC INDUSTRIAL DEVICES APPROVED CHECKED DESIGNED

EUROPE GmbH genehmigt geprüft erstellt
POWER ELECTRONICS R&D CENTER
WIRELESS CONNECTIVITY
CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 2 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

TABLE OF CONTENTS

1. Key Features ................................................................................................................. 4

2. Applications for the Module ........................................................................................... 4
3. Description for the Module............................................................................................. 5
4. Scope of this Document ................................................................................................ 6
5. History for this Document .............................................................................................. 6
6. Terminal Layout ............................................................................................................ 7
6.1. General Pin Assignment....................................................................................... 8
6.2. Application Specific Pin Description ..................................................................... 9
6.2.1. SPP configuration DCE Mode ................................................................. 9
7. Terminal Specifics ....................................................................................................... 10
7.1. RF-Interface - ANT ............................................................................................. 10
7.2. Power Supply ..................................................................................................... 10
7.3. Power-On-Reset ................................................................................................ 10
7.4. UART Interface – TXD, RXD, CTS, RTS ............................................................ 11
7.5. 3-wire Serial Interface ........................................................................................ 12
7.6. USB Interface, .................................................................................................... 12
7.6.1. USB_DP, USB_DN ............................................................................... 12
7.7. GPIO Interface ................................................................................................... 12
7.8. ADC ................................................................................................................... 12
7.9. DAC ................................................................................................................... 12
7.10. PCM Interface .................................................................................................... 12
8. Key Parts List .............................................................................................................. 13
9. Test Conditions ........................................................................................................... 14
10. Absolute Maximum Ratings (1) ..................................................................................... 14
11. Electrical Requirements .............................................................................................. 14
12. I/O Operating Characteristics ...................................................................................... 15
13. USB Interface .............................................................................................................. 15
14. Typical Current Consumption ...................................................................................... 16
14.1. SPP Configuration.............................................................................................. 16
14.1.1. Deep Sleep State .................................................................................. 16
14.1.2. Power Down State ................................................................................ 16
14.1.3. Idle State............................................................................................... 16
14.2. Power Consumption ........................................................................................... 16
14.3. Power-up time .................................................................................................... 17
15. Electrical RF-Characteristics ....................................................................................... 17
16. Mechanical Requirements ........................................................................................... 18
17. Soldering Temperature-Time Profile (for reflow soldering)........................................... 19
17.1. For lead solder ................................................................................................... 19
17.2. For leadfree solder ............................................................................................. 19

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 3 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

18. Module Dimension....................................................................................................... 20

19. Recommended Foot Pattern ....................................................................................... 21
20. Labelling Drawing ........................................................................................................ 23
21. Software ...................................................................................................................... 24
21.1. SPP Software ..................................................................................................... 24
21.2. HDP Software .................................................................................................... 24
21.3. HID Software ...................................................................................................... 24
21.4. HDP/SPP Software ............................................................................................ 24
21.5. Other Profiles are available on request. ............................................................. 24
22. Cautions ...................................................................................................................... 24
22.1. Design Notes ..................................................................................................... 24
22.2. Installation Notes................................................................................................ 25
22.3. Usage Conditions Notes..................................................................................... 25
22.4. Storage Notes .................................................................................................... 25
22.5. Safety Cautions .................................................................................................. 26
22.6. Other cautions .................................................................................................... 27
23. Packaging ................................................................................................................... 28
23.1. Embossed tape / Blistergurt ............................................................................... 28
23.2. Component direction .......................................................................................... 29
23.3. Reel dimension .................................................................................................. 30
23.4. Package ............................................................................................................. 30
24. Ordering Information ................................................................................................... 31
25. RoHS Declaration ....................................................................................................... 31
26. Data Sheet Status ....................................................................................................... 31
27. Regulatory Information ................................................................................................ 32
27.1. FCC for US ........................................................................................................ 32
27.1.1. FCC Notice ........................................................................................... 32
27.1.2. Caution ................................................................................................. 32
27.1.3. Labeling Requirements ......................................................................... 32
27.1.4. Antenna Warning .................................................................................. 33
27.1.5. Approved Antenna List .......................................................................... 33
27.1.6. RF Exposure PAN1455/PAN1555 ......................................................... 33
27.2. Industry Canada Certification ............................................................................. 33
27.3. European R&TTE Declaration of Conformity ...................................................... 34
28. Related Documents ..................................................................................................... 34
29. General Information..................................................................................................... 34
30. Life Support Policy ...................................................................................................... 35

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 4 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

1. KEY FEATURES
Schlüsseleigenschaften
 Bluetooth specification v2.0 + EDR (Enhanced Data Rate)
 CSR BlueCore6-ROM inside
 Complete Co-location and Co-existence with IEEE 802.11 (AWMA, AFH and SFH)
 Fast Connection Setup
 Extended SCO Link
 RF output power class 2 with power control
 Supply Voltage 3.0V to 3.6V
 Internal crystal oscillator (26MHz, 14.7456 MHz and 32 kHz for deep sleep)
 Surface mount type
 PAN1455: 13.5 x 18.75 x 2.85 mm
 PAN1555: 13.5 x 22.75 x 2.85 mm
 Built-in shielding to be compliant to FCC
 Full Bluetooth data rate up to 2178kbps asymmetric
 Support for all Bluetooth power saving modes (Park, Sniff, Hold)
 Support for very low-power modes (deep sleep and power down)
 Otional support for ultra-low-power mode. Standby with Battery-Backup
 PCM Interface Master / Slave supporting 13 or 16 bit linear, 8 bit µ-law or A-law Codecs
and CVSD transcoders on up to 3 SCO channels
 Full 8- to 128-bit encryption
 High sensitivity design (-86 dBm typ.)
 3 UART, USB, I2C and SPI Interface
 18 GPIO’s for individual usage for your embedded software
 3 Channel ADC and 1 Channel DAC
 Cortex-M3 ST32F103 core for embedded profiles or application software
 Manufactured in conformance with RoHS

2. APPLICATIONS FOR THE MODULE

Applikationen für das Modul
All Embedded Wireless Applications
 Access Points  Cable Replacement
 Printer Adapters  Personal Digital Assistants
(PDAs)
 Printers  Access Points
 Scanners  Computers and Peripherals
 Wireless Sensors  Industrial Control Applications

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 5 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

3. DESCRIPTION FOR THE MODULE

Modulbeschreibung
PAN1455/1555 is a short-range class 2 module for implementing Bluetooth functionality into
various electronic devices. The module consists of three major parts; a baseband controller, a
EEPROM memory and a radio that operates in the license-free 2.45 GHz ISM band.
The module is listed as a Bluetooth End Product (EPL). Customers have to list their product under
the BT QDID: B015522
Communication between the module and the host controller is carried out normally via UART.
Otional via below interfaces. Please contact your local sales office for further details on additional
options.

PAN1555
256K EEPROM Antenna
GPIO´s

Debug
UART

SPP-AT
STM32 BALUN Matching
UART 256kByte Flash BC06ROM Filter Circuit 50 Ohm
48kByte RAM
PLL
Optional:
2 x SPI,
USB, Optional U.FL
UART,
ADC, JTAG,
PCM,
WLAN-
Coexistence
Optional Optional Optional Low
One Crystal
Bottom Pad
16MHz 14,7456MHz 14,75MHz 26MHz Power 32KHz
USB Temp -25°C to +85°C Oscillator
PAN1455

Figure 3.1 PAN1455/1555 Block-Diagram

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 6 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

4. SCOPE OF THIS DOCUMENT

Umfang dieses Dokumentes
This product specification applies to the class 2 bluetooth module ENW89815CxKF/ENW89815AxKF.
The different characters indicates different versions (refer to chapter 24 Ordering Information)
The used bluetooth chip is the BlueCore6 from the company CSR. (www.csr.com).
Diese Produktionsunterlagen beziehen sich auf das Class 2 Bluetooth Modul
ENW89815CxKF/ENW89815AxKF.
Die unterschiedlichen Zeichen bezeichnen verschiedene Versionen (Erklärung im Kapitel 24
Ordering Information)
Der verwendete Bluetooth Chip ist der BlueCore6 der Firma CSR.

5. HISTORY FOR THIS DOCUMENT

Versionsverwaltung dieses Dokumentes
Revision Date Modification / Remarks
Version Datum Änderungen / Bemerkungen
0.90 06.03.2009 Preliminary release.

0.91 30.03.2009 Add FCC Notice

0.92 04.05.2009 Include RF-Performance and current consumption

0.93 06.05.2009 Do minor changes in formatting, content links now included.

0.94 29.05.2009 Include final tables and Interface description

0.95 28.08.2009 SW-Status updated

Power update for min values, add foot note from CSR, addd CSR datasheet in appendix, add
1.00 01.02.2011 HDP Partnumbers, add link to Stollmann SW support page. Include BT Listing QDID
information.
1.10 27.06.2011 Updated laser label information in chapter 20 Labelling Drawing.
Added chapter ‘European R&TTE Declaration of Conformity’.
1.2 19.01.2015
Updated chapter ‘General Information’

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 7 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

6. TERMINAL LAYOUT
Anschlußbelegung

10 9 8 7 6 5 4 3 2 1
11 1 34

12 33

13 32

14 31

15 30

16 B A 29
D C
17 28
18 19 20 21 22 23 24 25 26 27

Figure 6.1 PAN1455/1555 Pin Numbering Bottom View

10 9 8 7 6 5 4 3 2 1
11 1 34

12 33

13 32

14 31

15 30
ANT

16 B A 29
D C
17 28
18 19 20 21 22 23 24 25 26 27
Figure 6.2 PAN1455/1555 Pin Numbering Bottom View

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
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CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

6.1. GENERAL PIN ASSIGNMENT

No Pin Name Type PU/PD Active Description

1 GND1 P - - Connect to Ground
2 ANT I/O - - Antenna Connector
3 UART_RTS# I PD H UART Request To Send (active low)
4 UART_TXD I PD L UART Data Input, weak internal Pull-Down
5 UART_RXD O - L UART Data Output
6 UART_CTS# O - H UART Clear To Send, internal Pull-Up
7 GPIO[9]/PCM_CLK I/O PU L General Purpose Input/Output, weak internal Pull-
Up / PCM Data Clock Output
8 GPIO[10]/PCM_O/TXD3 I/O PU L General Purpose Input/Output, weak internal Pull-
Up / PCM Data Output/ UART3 DATA Output
9 GPIO[7]/PCM_SYNC I/O PD H General Purpose Input/Output, weak internal Pull-
Down / PCM Data Sync Output
10 GND2 P - - Connect to Ground
11 ATRST/SPI2_MISO I/O PU H JTAG reset, internal Pull-Up / SPI2 Master In -
Slave Out
12 GPIO[8]/PCM_I/RXD3 I/O PU L General Purpose Input/Output, weak internal Pull-
Up / PCM Data Input / UART3 DATA Input
13 ATDI/SPI2_CS I/O PU - JTAG test data input, weak internal Pull-Up / SPI2
Chip Select
14 ATMS I PU - JTAG mode select, weak internal Pull-Up
15 reserved I PD - for Debug-Use only, nc
16 VCC P - - VCC
17 RESET# I PU L Reset input
18 GND3 P - - Connect to Ground
19 GPIO[14] I/O PU L General Purpose Input/Output, weak internal Pull-
Up
20 GPIO[13] I/O PD H General Purpose Input/Output, weak internal Pull-
Down
21 GPIO[15] I/O PU L General Purpose Input/Output, weak internal Pull-
Up
22 GPIO[6]/ADC I/O PD H General Purpose Input/Output, weak internal Pull-
Up / ADC Input
23 ATDO/SPI2_SCK O PU - JTAG test data output
24 ATCK O PD - JTAG clock, weak internal Pull-Down
25 GPIO[3]/SPI_CLK I/O PD H General Purpose Input/Output, weak internal Pull-
Down / SPI Clock
26 GPIO[0]/SPI_MOSI I/O PD H General Purpose Input/Output, weak internal Pull-
Down / SPI Master Out – Slave In
27 GND4 P - - Connect to Ground
28 GPIO[2]/SPI_CS I/O PD H General Purpose Input/Output, weak internal Pull-
Down / SPI Chip Select
29 GPIO[1]/SPI_MISO I/O PD H General Purpose Input/Output, weak internal Pull-
Down / SPI Master In – Slave Out
30 GPIO[5]/TXD2 I/O PD H General Purpose Input/Output, weak internal Pull-
Down / UART2 DATA Output
31 GPIO[4]/RXD2 I/O PD H General Purpose Input/Output, weak internal Pull-
Down / UART2 DATA Input
32 USB_DM I/O PD - USB Data Minus Terminal
33 USB_DP I/O PD - USB Data Plus Terminal
34 GPIO[17]/TAMPER I/O PD - General Purpose Input/Output, weak internal Pull-
Down, do not use as current source! / TAMPER In
A GPIO[16]/SPI2_MOSI I/O PU L General Purpose Input/Output, weak internal Pull-
Up / SPI2 Master Out – Slave In
B GPIO[12]/I2C_SCL I/O PU L General Purpose Input/Output, weak internal Pull-
Up / I2C Serial Clock Line
C GPIO[11]/I2C_SDA I/O PU L General Purpose Input/Output, weak internal Pull-
Up / I2C Serial Data Line
D VBAT P - - Optional Batterie Backup
Type: PU - Pulled up; PD – pulled down; P – Power; I – Input; O – Output; I/O - bidirectional

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Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 9 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

6.2. APPLICATION SPECIFIC PIN DESCRIPTION

6.2.1. SPP configuration DCE Mode
No Pin Name SPP-Function Type PU/PD Active Description
1 GND1 Power P - - Connect to Ground
2 ANT Antenna I/O - - Antenna Connector
3 UART_RTS# /RTS I PU L UART Request To Send
4 UART_TXD TXD I PD H UART Data Input
5 UART_RXD RXD O H UART Data Output
6 UART_CTS# /CTS O L UART Clear To Send
7 GPIO[9]/PCM_CLK /LED2 O L Bluetooth connected. Active if a
Bluetooth connection exists.
Inactive in idle state. Flashes
during startup.
8 GPIO[10]/PCM_O/TXD3 UA2 O User Output 2
9 GPIO[7]/PCM_SYNC /LED1 O L Device Ready
10 GND2 Power - - - Connect to Ground
11 ATRST/SPI2_MISO reserved I/O PU H leave open
12 GPIO[8]/PCM_I/RXD3 /UE1 I PU L User Input 1
13 ATDI/SPI2_CS reserved I/O PU - leave open
14 ATMS reserved I PU - leave open
15 BOOT0 reserved I PD H for Debug-Use only, nc
16 VCC Power - - - VCC
17 RESET# /RESET I PU L Reset input (active low for 5 ms);
Schmitt triggered
18 GND3 Power - - Connect to Ground
19 GPIO[14] /RTC-OUT O L DSR in DCE mode, DTR in DTE
mode
20 GPIO[13] /RTC-IN I PU L DTR in DCE mode, DSR in DTE
mode
21 GPIO[15] /DCD or /DCD- I/O PU L Data Carrier Detect , Input in
DTE DTE mode Output in DCE mode
22 GPIO[6]/ADC /RI I/O PU L Ring Indicator, Input in DTE
mode Output in DCE mode
23 ATDO/SPI2_SCK reserved O PU - JTAG
24 ATCK reserved O PD - JTAG
25 GPIO[3]/SPI_CLK reserved I/O PD H leave open
26 GPIO[0]/SPI_MOSI reserved I/O PD H leave open
27 GND4 Power - - Connect to Ground
28 GPIO[2]/SPI_CS reserved O leave open
29 GPIO[1]/SPI_MISO /UE2 I PD H User Input 2, Break Detect (1)
30 GPIO[5]/TXD2 reserved O leave open
31 GPIO[4]/RXD2 DTE-/DCE I PD H DTE (high) DCE (low) mode
Select selector
32 USB_DM reserved I/O PD - leave open
33 USB_DP reserved I/O PD - leave open
34 GPIO[17]/TAMPER reserved I/O PD - leave open
A GPIO[16]/SPI2_MOSI reserved I/O PU L leave open
B GPIO[12]/I2C_SCL reserved I/O PU L leave open
C GPIO[11]/I2C_SDA reserved I/O PU L leave open
D VBAT Power - - Optional Batterie Backup

Type: PU - Pulled up; PD – pulled down; P – Power; I – Input; O – Output; I/O - bidirectional

All other pins do not have a dedicated functionality in SPP mode. See 6.1 General Pin
Assignment for all other terminals.

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 10 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

7. TERMINAL SPECIFICS
Interfacebeschreibungen
7.1. RF-INTERFACE - ANT
The PAN1455 presents a 50Ω impedance on the antenna pin. If you need antenna support
please e-mail to [email protected] or use the PAN1555 with integrated ceramic
antenna.

7.2. POWER SUPPLY

PAN1455/1555 require a power supply with the following characteristics:
Typical : 3.3VDC, min.: 3.0VDC – max.: 3.6VDC, low noise (10mV), >80mA peak
Due to the technological requirements and the pulsed radio transmission the supply needs to
be fed by an ultra fast (response time 20µs) linear regulator placed as close as possible to
the VSUP pin (16). Functionality has been verified with the following types: TOREX:
XC6204x332xx or XC6401xx42xx
It is also recommended to place a low ESR capacitor with at least 10µF as close as possible
to the VSUP pin (16).
NOTE: You must ensure that during operation the supply voltage never drops below 2.8 VDC.
Otherwise the flash contents (firmware and/or configuration data) can get lost.

7.3. POWER-ON-RESET
PAN1455/1555 are equipped with circuitry for generating Power ON/-OFF Reset from the
internal core voltage. A reset is generated when the core voltage falls below typically 1.88V
and is released when it rises above typically 1.92V.
In case of Power-On, Power-Off, Watchdog, Low-Power or Software, RESET# acts as an
Output by holding RESET# at ≤ 0.3V for min. 1,5ms and max. 3,5ms.
In an application with an external Reset as an Input, for example external Reset-Controller,
we recommend to use Open-Drain-Output for this circuit. An external reset shall be generated
at RESET# ≤ 0.3V for ≥ 5ms after VSUP has stabilized in the recommended voltage range.
The following table shows the pin states of PAN1455/1555 on reset.
Pin Name State: PAN1455/1555
UART_RTS# Input Floating
UART_TXD Input Floating
UART_RXD Input Floating
UART_CTS# Input Pull-Up
GPIO[0] – GPIO[13], GPIO[16], Input Floating
GPIO[17]
GPIO[14] Input Pull-Up
GPIO[15] Input Pull-Up
Boot0 Input Pull-Down
ATRST Input Pull-Up
ATDI Input Pull-Up
ATMS Input Pull-Up
ATDO Input Floating
ATCK Input Pull-Down
USB_DM Input Floating
USB_DP Input Floating

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7.4. UART INTERFACE – TXD, RXD, CTS, RTS

The functionality of the interface corresponds to the V.24 / RS-232 standard on TTL-level.
Transmission speeds:
 1200 bps
 2400 bps
 4800 bps
 9600 bps
 19200 bps
 38400 bps
 57600 bps
 115200 bps
 230400 bps
 460800 bps
 921200 bps
Character representation:
 8 or 9 Bit, even/odd/no Parity, 1or 2 stop bits
 7 Bit, even/odd Parity, 1 or 2 stop bits
 7 Bit no Parity, 2 or 3 stop bits
Hardware flow-control with UART_RTS and UART_CTS (active low)

TXD
PAN1x55 Host
RXD
DCE RTS DTE
CTS

Figure 7.1 UART Signal Connections

CTS

TXD

0 us 16 bytes max

RTS

RXD

0 uS 2 bytes max
Figure 7.2 UART Timing Diagram

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SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
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7.5. 3-WIRE SERIAL INTERFACE

When using only GND and UART_Rx, UART_Tx serial lines, you may leave UART_RTS#
and UART_CTS# open.
Note: Not using flow control can result in loss of data.

7.6. USB INTERFACE1,2

7.6.1. USB_DP, USB_DN
PAN1455/1555 contain a full speed USB version 2.0 compliant interface capable of directly
driving an USB cable. The PAN1455/1555 operates as a USB peripheral and responds to
requests from a USB master host controller.

7.7. GPIO INTERFACE

It is possible to use the programmable digital I/Os GPIO[0:17]. The Current from GPIO[17] is
limited to 3mA max.
For 5V tolerant GPIO´s refer to chapter 6.2.1SPP configuration DCE Mode

7.8. ADC3
It is possible to use the programmable I/Os PIO[0:3,6,7,13:15] as ADC.
The 12-bit ADC is a successive approximation analogue-to-digital converter. A/D conversion
can be performed in single, continuous, scan or discontinuous mode.

7.9. DAC4
It is possible to use the programmable I/Os PIO[2,3] as ADAC
The DAC module is a 12-bit, voltage output digital-to-analogue converter. The DAC can be
configured in 8- or 12-bit mode and may be used in conjunction with the DMA controller.

7.10. PCM INTERFACE5

PCM or Pulse Code Modulation is a sampling technique for digitising analogue signals.
The PCM interface for voice applications is provided via the PCM_OUT, PCM_IN, PCM_CLK
and PCM_SYNC pins.
The PCM interface can act as master or as slave device.
In master mode, clock frequencies of 128kHz, 256kHz or 512kHz can be generated, when
using the internal 4MHz clock. In slave mode, clock frequencies up to 2048kHz are accepted.
The Frame Clock is 8kHz. Long and Short Frame Sync are supported.
PAN1455/1555 interface directly to PCM audio devices including the following:

1
subject to firmware support, contact Stollmann for current status.
2
subject to hardware support, contact Stollmann for availability of variants
3
subject to firmware support, contact Stollmann for current status
4
subject to firmware support, contact Stollmann for current status
5
subject to firmware support, contact Stollmann for current status

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 13 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

 Qualcom MSM3000 series and MSM5000 series CDMA base band devices
 OKI MSM7705 four channel A-law and µ-law codec
 WINBOND W681310 8-bit A-law and µ-law codec
 WINBOND W681360 13-bit linear codec
 STW 5093 5094 14-bit linear codec

8. KEY PARTS LIST

Liste der Schlüsselkomponenten
Part Name Material
Teilenummer Material
P.W.Board Glass cloth epoxide resin with gold plating
BC63B239A04Q (Cambridge Silicon Radio Ltd www.csr.com)
BT-IC part name
You have to register, before you can download the data sheet.
µ-Controller ST32F103xxxx (Cortex baseed STMiroelectronics www.stm.com)

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 14 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

9. TEST CONDITIONS
Meßbedingungen
Measurements shall be made under room temperature and humidity unless otherwise specified.
Messungen unter normalen Bedingungen, Abweichungen sind gesondert notiert.
Temperature 25 ± 10°C Humidity 40 to 85%RH
Temperatur 25 ± 10°C Luftfeuchtigkeit 40 to 85%RH

10. ABSOLUTE MAXIMUM RATINGS (1)

Absolute Grenzwerte
The maximum ratings may not be exceeded under any circumstances, not even momentarily and
individually, as permanent damage to the module will result.
Item Symbol Absolute Maximum Ratings Unit
No.
Punkt Zeichen Absolute Grenzwerte Einheit
Supply voltage
1 Vcc -0.4 to +3.7 V
Versorgungsspannung
Voltage on any pin
2 VPin GND -0.3 to Vcc+0.40 V
Spannung an jedem Pin
Storage temperature range
3 Tstg -40 to +105 °C
Lagertemperatur
Operating temperature range
4 Top -40 to +85 °C
Betriebstemperatur
Lead temperature
6 TDeath See chapter 17.2 °C
Löttemperatur
ESD on any pin max 2000 V
7 VESD V
ESD Festigkeit (CLoad=150pF, RLoad=330)
Notes:
(1) ABSOLUTE MAXIMUM RATINGS indicate limits beyond which damage to the device may occur.

11. ELECTRICAL REQUIREMENTS

Vcc = 3.3V, Tamb = 25°C if nothing else stated

No Item Condition Limit / Grenzen Unit
Nr. Punkt Bedingung Min Typ Max Einheit
Frequency Range
1 2400 2483.5 MHz
Frequenzbereich
Load impedance Measured with network analyzer in the
2 50 
Ausgangsimpedanz frequency range at antenna pin
Output return loss Receive Mode to 50Ω load -10
3 dBm
Ausgangsanpassung Transmit Mode to 50Ω load -10
Supply voltage The typical voltage is recommended Vcc
4 3.0 3.3 3.6 Vdc
Versorgungsspg. at voltage pin
Ripple on Vcc Ripple frequency 200kHz
5 10 mVms
AC Anteil auf Vcc Ripple frequency <200kHz

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 15 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

12. I/O OPERATING CHARACTERISTICS

Vcc = 3.3V, Tamb = 25°C if nothing else stated

Symbol Item Condition Limit Unit
Min Typ Max
VIL Low-Level Input Voltage VSUP = 3.3V - 0.5 - 0.8 V
- VSUP
VIH High-Level Input Voltage 2.0 V
+0.5
VOL Low-Level Output Voltage IOL = mA - - 0.2 V

VOH High-Level Output Voltage IOH = -4mA VSUP-0.2 - - V

Low -Level Output Current -
IOL VOL = 0.4V - 8 mA
(except GPIO[17])
High-Level Output Current VOH = 2.4V -
IOH - 8 mA
(except GPIO[17])
Low -Level Output Current -
IOL (GPIO[17]) VOL = 0.4V - 3 mA
at GPIO[17]
High-Level Output Current VOH = 2.4V -
IOH (GPIO[17]) - 3 mA
at GPIO[17]
Weak pull-up typ.
Iwp-u Input-current –5.0 –1.0 –0.2 A
40k
Weak pull-down typ.
Iwp-d Input-current +0,2 +1.0 +5.0 A
40k
Ilc I/O pad leakage current Standard I/Os –1.0 0 +1.0 A

Ilc I/O pad leakage current Vin = 5V -3,0 0 +3,0 A

Cl Input Capacitance - 5 - pF

13. USB INTERFACE

Vcc = 3.3V, Tamb = 25°C if nothing else stated
Item Unit
Min Max
Input logic level low - 0.3xVSUP V

Input logic level high 0.7xVSUP 5.5 V

Output logic level low )* 0 0.2 V

Output logic level high )* 2.8 VSUP V

)* connected to correctly terminated USB cable

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 16 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

14. TYPICAL CURRENT CONSUMPTION

14.1. SPP CONFIGURATION

14.1.1. Deep Sleep State

The Bluetooth RF is completely deactivated, no paging requests from other Bluetooth devices
will be recognized. Only rising control line DTR will activate the PAN1455/1555 and may
initiate a Bluetooth link dependent on other parameters.
Note: In Deep Sleep state the AT command set is not active, CTS line is low.

14.1.2. Power Down State

The Bluetooth RF is activated every 1.25 seconds, paging requests from other Bluetooth
devices will be recognized after that intervals and accepted if allowed. Additionally rising
control line DTR will activate the PAN1455/1555 and may initiate a Bluetooth link dependent
on other parameters.
Note: In Power down state the AT command set is not active, CTS line is low.

14.1.3. Idle State

No power down mode activated.
All functionality is available immediately including connection control using AT command set.

14.2. POWER CONSUMPTION

The following values are approximate power consumption values in the different states:
VSUP = 3.3V, Tamb = 25°C

Condition Current Unit

Consumption
IMEAN IPEAK

Idle, no page scan, no inquiry scan, Uart baud rate: 1200 baud 7,5 15 mA

Idle, all functions available, no Bluetooth link, page scan & inquiry scan interval
8 56 mA
1,28s

Idle, all functions available, no Bluetooth link, continuous page scans 50 60 mA

Bluetooth connected, no data traffic – close range (Slave) 10 56 mA

Bluetooth connected, data traffic 115 kbit/s – close range (Slave) 33 61 mA

ACL connected DH5 max PWR, shortest Poll Period (Slave) 43 68 mA

ACL connected DH5 min PWR, shortest Poll Period (Slave) 42 67 mA

ACL connected DH1 max PWR, shortest Poll Period (Slave) 43 69 mA

ACL connected DH1 min PWR, shortest Poll Period (Slave) 41 67 mA

Power Down 7,5 -- mA

Device in reset 1,5 -- mA

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
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SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 17 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

14.3. POWER-UP TIME

The time until the PAN1455/1555 is able to accept link requests or serial data depends on the
firmware version and the software parameters RSTTIM and RSTMSG. In the SPP firmware
version 1.001 the module is command ready after at least 0,3s (RSTTIM=3 / RSTMSG=0)
and 2,16s (RSTTIM=40 / RSTMSG=1) maximum. Bluetooth links are accepted 2,3s after
reset.

15. ELECTRICAL RF-CHARACTERISTICS

Vcc = 3.0V to 3.6V, Tamb = - 40°C to +85°C

Receiver Frequency [GHz] Limit BT Unit
Min Typ Max Spec
2.402 -70,0 -85,3
Sensitivity at 0.1% BER
2.441 -70,0 -85,4 -70 dBm
DH1
2.480 -70,0 -86,0

2.402 -70,0 -84,4

Sensitivity at 0.1% BER
2.441 -70,0 -84,9 -70 dBm
DH5
2.480 -70,0 -85,6

2.402 -70,0 -88,1

Sensitivity at 0.1% BER
2.441 -70,0 -88,3 -70 dBm
EDR2, PI/4 DQPSK
2.480 -70,0 -88,1

2.402 -70,0 -82,0

Sensitivity at 0.1% BER
2.441 -70,0 -82,7 -70 dBm
EDR3, 8DPSK c)
2.480 -70,0 -82,4

Maximum received signal at 0.1% BER with DH1 -20,0 >10 -20 dBm

Maximum received signal at 0.1% BER with DH5 -20,0 >10 -20 dBm
Maximum received signal at 0.1% BER with EDR2, PI/4
-20,0 >0 -20 dBm
DQPSK
Maximum received signal at 0.1% BER with EDR3,
-20,0 >0 -20 dBm
8DPSK
 11
a)
C/I co-channel 6 11 dB

Adjacent channel selectivity C/I f = f0 + 1MHz a) -5 0 0 dB

0
a)
Adjacent channel selectivity C/I f = f0 - 1MHz -5 0 dB

Adjacent channel selectivity C/I f  f0 + 2MHz a) -38 -30  -30 dB

Adjacent channel selectivity C/I f  f0 - 2MHz a)

-22 -20  -20 dB

Adjacent channel selectivity C/I f  f0 + 3MHz a)

-42 -40  -40 dB

Adjacent channel selectivity C/I f  f0 - 5MHz a) -45 -40  -40 dB

 -9
a)
Adjacent channel selectivity C/I f = fimage -15 -9 dB

Notes: a) For BER less then 0,1%. Applies according to BT Test Specification Ver. 1.2/2.0/2.0
+ EDR only for Tamb = 20°C

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
Einstufung Produktspezifikation DS-1x55-2400-102 1.2
SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 18 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

Vcc = 3.3V, Tamb = +25°C

Transmitter Frequency [GHz] Limit BT Unit
Min Typ Max Spec

RF transmit power 2.402 2,0 3,9

50 Ω load with GFSK
2.441 2,0 3,2 dBm
Modulation and default
settings b) 2.480 2,0 3,0

2.402 GFSK 2,7

2.402 DPSK 1,6

RF transmit power
50 Ω load with EDR, PI/4 2.441 GFSK 2,7
DQPSK Modulation and dBm
default settings b 2.441 DPSK 1,6

2.480 GFSK 2,2

2.480 DPSK 1,0

2.402 GFSK 2,6

2.402 DPSK 1,6

RF transmit power
2.441 GFSK 2,7
50 Ω load with EDR, 8DPSK
dBm
Modulation and default 2.441 DPSK 1,6
settings b
2.480 GFSK 2,2

2.480 DPSK 1,0

RF power control range -21 - 4,0 dB

RF power range control resolution 3,2 3,9 4,6 2 to 8 dB

20 dB bandwidth for modulated carrier 920 924 1000 1000 kHz

Initial carrier frequency tolerance -75 -10 75  75 kHz

Carrier frequency drift (packet DH1) -25 11 25  25 kHz

Drift Rate -20 0 20 20 kHz/ 50µs

140 to
f1avg “Maximum Modulation” 140 166 175 kHz
175
f2avg “Minimum Modulation” 115 155 -  115 kHz

Notes: b) excluding antenna gain

16. MECHANICAL REQUIREMENTS

Mechanische Anforderungen
Item Limit Condition
No. Bedingung
Punkt Grenzwerte
More than 75% of the soldering area shall be
Solderability coated by solder Reflow soldering with
1
Lötfähigkeit Mehr als 75% der Lötfläche soll mit Lötpaste recommendable temperature profile
bedeckt sein.
Resistance to soldering It shall be satisfied electrical requirements and not
2 See chapter 17.2
heat be mechanical damage

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CLASSIFICATION PRODUCT SPECIFICATION No. REV.
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SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 19 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

17. SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)

Temperatur-Zeit Profil für die Reflowlötung
17.1. FOR LEAD SOLDER

Recommended temp. profile 10 1s

for reflow soldering
30 +20/-10s
Temp.[°C] 235°C max.

220 5°C

200°C

150 10°C

90 30s

Time [s]

17.2. FOR LEADFREE SOLDER

Our used temp. profile

for reflow soldering
30 +20/-10s
Temp.[°C] 230°C -250°C max.

220°C

150°C – 190°C

90 30s

Time [s]
Reflow permissible cycle: 2
Opposite side reflow is prohibited due to module weight.

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SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
Thema Bluetooth Modul der Klasse 2 Seite 20 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

18. MODULE DIMENSION

Modulabmessungen

+0,10 +0,10
0,80 -0,10 2,70 -0,10
+0,00
18,75 -0,10
+0,10
18,00 -0,10

+0,10 +0,00
12,60 -0,10
13,50 -0,10

Figure 18.1 PAN1455 dimensions

+0,20
5,90 -0,10
+0,20
0,90 -0,10

+0,10 +0,10 +0,10

2,80 -0,20 0,80 -0,10 2,70 -0,10
+0,00
22,75 -0,10
+0,10
18,00 -0,10

+0,10 +0,00
12,60 -0,10
13,50 -0,10
+0,20 +0,20
5,90 -0,20 0,90 -0,20

+0,20
0,60 -0,20
+0,20
2,60 -0,20

Figure 18.2 PAN1555 dimensions

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CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

19. RECOMMENDED FOOT PATTERN

Empfohlenes Land Pattern
0,65

18,75
1,75
1 2 3 4 5 6 7 8 9 10
34 1 Fi nger Rnd 1.0x0.8 11

1,75
33 12

32 13
B

13,5
1,25 31 14

30 15
4,75

29 A B 16
Round 0.8
C D
28 17
27 26 25 24 23 22 21 20 19 18
6,025 0,65
1,25

Figure 19.1 PAN1455 Recommended Land pattern

(Top-View not scaled)

Dimensions in mm.

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CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015
0,65

22,75
18,75
1,75
1 2 3 4 5 6 7 8 9 10
34 1 Fi nger Rnd 1.0x0.8 11

1,75
33 12

32 13
B

13,5
1,25 31 14

30 15
4,75
ANT

29 A B 16
Round 0.8
C D
28 17
27 26 25 24 23 22 21 20 19 18
6,025 0,65
1,25

Figure 19.2 PAN1555 Recommended Land pattern

(Top-View not scaled)
Dimensions in mm.
If you have no experience about the land pattern, this figure can guide you, but this information is
given without any legal responsibility.
We recommend the same dimension for the solder paste screen.
The solder screen thickness depends on your production standard, we recommend 120µm to
150µm.

IMPORTANT:

Please be careful with the area under the module to avoid short cuts.
The bottom side from the PAN1455/1555 is fully coated, also the vias!
If you have any questions on this point, we are open to discuss your individual situation.

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CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

20. LABELLING DRAWING

Kennzeichnung des Modules durch Label

The information on the Module are marked by laser.

Information in the 2D-Barcode are in the format
 BT-address [12 signs, here 123456789ABC].
 Ordering number [12 signs, please refer also to chapter 24];
 The identifier for the software release (2 signs, here yy);
 Datecode: Year-Week-Day-Lotnumber [7 signs, here YYWWDLL].
All items are separated by a semicolon.

As a summary:
Japan Radio Marking
Japan TTE Marking
FCC ID: T7V-BC06 FCC Certification Marking
zz Identifier for the hardware version
yy Identifier for the software version
123456789ABC BT-Address
YYWWDLL Datecode – Year-Week-Day-Lotnumber

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SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
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CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

21. SOFTWARE
Software
Standard platforms of PAN1455/1555 are avaialble with several popular Bluetooth profiles, many
other profiles are availalble on request. Before starting production, be certain to carefully review
that the software meets your requirements.
21.1. SPP SOFTWARE
Serial Port Profile
Customized variants are available on request.
Please refer to Reference [1] .
21.2. HDP SOFTWARE
The Health Device Profile
Please refer to Reference [1] .
21.3. HID SOFTWARE
The Human Inteface Device Software
Please refer to Reference [1] .
21.4. HDP/SPP SOFTWARE
The combined HDP and SPP Profile enables customers to use both versions (SPP/HDP) in
parallel.
Please refer to Reference [1] .

21.5. OTHER PROFILES ARE AVAILABLE ON REQUEST.

22. CAUTIONS
Warnungen
Failure to do so may result in degrading of the product’s functions and damage to the product.
22.1. DESIGN NOTES
Designhinweise
(1) Please follow the condition written in this specification, especially the control
signals of this module.
(2) The supply voltage has to be free of ac ripple voltage, as for example from a
battery or a low noise regulator output. For noisy supply voltages provide a
decoupling circuit as for example a ferrite in series connection and a blocking
capacitor to ground of at least 47uF directly at the module.
(3) This product should not be stressed when installed.
(4) Heat is the major cause of shortening the life of these products. Please keep this
product away from heat.
Avoid assembly and use of the target equipment in conditions where the products'
temperature may exceed the maximum allowable.
(5) The supply voltage should not be exceeding or reverse, and should not carry noise
and spike.
(6) Please keep this product away from other high frequency circuits.

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PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

22.2. INSTALLATION NOTES

Verarbeitungshinweise
(1) Reflow soldering is possible for twice on the condition in chapter 15.
Please set up the temperature at the soldering portion of this product according to
this reflow profile.
(2) Carefully position the products so that their heat will not burn into printed circuit
boards or affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due to
the effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will
melt and generate toxic gas, damaging the insulation. Never allow contact between
the cover and these products to occur.
(5) This product should not be stressed or vibrated when reflowed.
(6) Keep the following conditions when you install this product for reparation by hand
soldering.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal cover is not
allowed.

22.3. USAGE CONDITIONS NOTES

Benutzerhinweise
(1) Take measure against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied
to the products, then before use, check and evaluate their operation when
assembled on your products.
(2) Do not use the fallen product.
(3) Do not put on damage and dirt to the pin , and don't touch the electric components.
(4) Be certain to follow the condition written in the ratings , about the power supply
instruments applied to this product.
(5) Electrode peeling strength: Do not add pressure of more than 4.9N when soldered
on PCB
(6) Pressing on parts of the metal cover or fastening objects to the metal cover is not
allowed.
(7) These products are intended for general purpose and standard use in general
electronic equipment, such as home appliances, office equipment, information and
communication equipment.

22.4. STORAGE NOTES

Lagerhinweise
(1) The module may not be stressed mechanically during storage.
(2) Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely affected:
 Storage in salty air or in an environment with a high concentration of corrosive
gas, such as Cl2, H2S, NH3, SO2, or NOX
 Storage in direct sunlight
 Storage in an environment where the temperature may be outside the range of
5°C to 35°C range, or where the humidity may be outside the 45 to 85% range.

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SUBJECT CLASS 2 BLUETOOTH MODULE PAGE
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CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

 Storage of the products for more than one year after the date of delivery at your
company if the avoidance all the above conditions (1) to (3) have been met.
(3) Storage period: Please check the adhesive strength of the embossed tape and
soldering after 6 months of storage.
(4) Please keep this product away from water, poisonous gas and corrosive gas.
(5) This product should not be stressed or shocked when transported.
(6) Please follow the specification when piling up the packed crate ( max. 10).

22.5. SAFETY CAUTIONS

Sicherheitshinweise
These specifications are intended to preserve the quality assurance of products as individual
components.
Before use, check and evaluate their operation when mounted on your products. Abide by
these specifications, without deviation when using the products. These products may short-
circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated
when a short circuit occurs, then at least, provide the following failsafe functions, as a
minimum.
(1) Ensure the safety of the whole system by installing a protection circuit and a
protection device.
(2) Ensure the safety of the whole system by installing a redundant circuit or another
system to prevent a single fault causing an unsafe status.

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CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

22.6. OTHER CAUTIONS

Weitere Hinweise
(1) This specification sheet is copyrighted. Please do not open it to the third party.
(2) Do not use this product of our company for another purpose.
(3) Be sure to provide an appropriate fail-safe function on your product to prevent a
second damage that may be caused by the abnormal function or the failure of our
product.
(4) This product has not been manufactured with any ozone chemical controlled under
the Montreal Protocol.
(5) These products are not intended for other uses, other than under the special
conditions shown below. Before using these products under such special
conditions, check their performance and reliability under the said special conditions
carefully to determine whether or not they can be used in such a manner.
 In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places
where liquid may splash.
 In direct sunlight, outdoors, or in a dusty environment
 In an environment where condensation occurs.
 In an environment with a high concentration of harmful gas (e.g. salty air, HCl,
Cl2, SO2, H2S, NH3, and NOX)
(6) If an abnormal voltage is applied due to a problem occurring in other components
or circuits, replace these products with new products because they may not be
able to provide normal performance even if their electronic characteristics and
appearances appear satisfactory.
(7) When you have any question or uncertainty , both of you and Panasonic sincerely
cope with it.

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CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

23. PACKAGING
Verpackung
23.1. EMBOSSED TAPE / BLISTERGURT

(1) Dimension of the tape PAN1555 / Abmessungen des Gurtes (EIAJ-tbd)

(2) Dimension of the tape PAN1455 / Abmessungen des Gurtes (EIAJ-tbd)

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(3) Cover tape reel strength / Abzugskräfte Blistergurt Deckfolie

Force direction

θ= 10deg Speed = 300mm/min.

Cover tape reel strength
=0.098～0.68N (10～70g)

(4) Empty hollow / leere Taschen

Direction of feed
Vorschubrichtung

Empty hollow more Component Empty hollow more Top cover tape
than 10 pitch packed area than 10pitch more than 200mm
Mehr als 10 leere Modulbereich Mehr als 10 leere Deckfolie groesser als
Taschen Taschen 200mm

Empty hollow in component packed area shall be less than two per reel and those hollows shall not
be consecutive.
Es dürfen minimal 2 leere Taschen im Bereich der Komponenten vorhanden sein, diese dürfen
aber nicht aufeinander folgen.

23.2. COMPONENT DIRECTION

Komponentenanordnung
Top cover tape shall not be found on reel holes and shall not stick out from reel.
Deckfolien darf nicht durch die Löcher der Spule und nicht außerhalb der Spule geführt werden.

Tape running direction

Laufrichtung des Bandes (top view)

27 1 Component direction
Part No.

Komponentenrichtung
(See also chapter 21)
18 10

Figure 1

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CUSTOMER’S CODE PANASONIC’S CODE DATE
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23.3. REEL DIMENSION

Abmaße der Rolle
(1) Quantity per reel : 500 pieces
Anzahl pro Rolle : 500 Stück
(2) Marking : Customer’s part No. / Quantity / Lot No. and Our part# with bar-code
shall be on the reel.
Kennzeichnung : Kundennummer / Anzahl / Losnummer und unsere
Komponentennummer als Barcode wird auf die Rolle gedruckt
Refer to figure 2
Bezugnehmend zur Zeichnung 2

23.4. PACKAGE
Umverpackung
(1) Package box : 1 or 2 reel (depends on quantity)
Paketbox.: 1 oder 2 Rollen (abhängig von der Liefermenge)
(2) Marking : Customer’s part No. / Quantity / Lot No. and Our part# with
bar-code shall be on the package box.
Kennzeichnung : Kundennummer / Anzahl / Losnummer und unsere
Komponentennummer als Barcode wird auf die
Verpackung gedruckt
Refer to figure 2 and 3
Bezugnehmend zur Zeichnung 2 und 3
φ 13 +/-0.5

φ 13 +/-1 2 +/-0.5
φ 80 +/-2

Figure 3

Marking Marking

φ 330 33.5 +/-1.0

Figure 2 2.0 +/-0.2

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CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

24. ORDERING INFORMATION

Bestellinformationen
Ordering part number Description
PAN1455 BT 3.0
ENW89815C3KF 256kByte Flash Memory, without Antenna
Software: SPP(1)
PAN1555 BT 3.0
ENW89815A3KF 256kByte Flash Memory, with Antenna
Software: SPP(1)
PAN1555 BT 3.0
ENW89815A4KF 256kByte Flash Memory, with Antenna
Software: HDP(1)
PAN1555 BT 3.0
ENW89815A5KF 256kByte Flash Memory, with Antenna
Software: SPP/HDP(1)
PAN1455 BT 3.0
ENW89815C4KF 256kByte Flash Memory, without Antenna
Software: HDP(1)
PAN1455 BT3.0
ENW89815C5KF 256kByte Flash Memory, without Antenna
Software: SPP/HDP(1)
Notes:
(1) This software is licensed by the company Stollmann please refer to [1] .

25. ROHS DECLARATION

RoHS-Erklärung
Declaration of environmental compatibility for supplied products:
Hereby we declare to our best present knowledge based on declaration of our suppliers that this
product do not contain by now the following substances which are banned by Directive 2002/95/EC
(RoHS) or if contain a maximum concentration of 0,1% by weight in homogeneous materials for
 Lead and lead compounds
 Mercury and mercury compounds
 Chromium (VI)
 PBB (polybrominated biphenyl) category
 PBDE (polybrominated biphenyl ether) category

And a maximum concentration of 0,01% by weight in homogeneous materials for

 Cadmium and cadmium compounds

26. DATA SHEET STATUS

Datenblatt Status
This data sheet contains the final specification (RELEASE).
Panasonic reserves the right to make changes at any time without notice in order to improve
design and supply the best possible product.
Supplementary data will be published at a later date.
Please consult the most recently issued data sheet before initiating or completing a design.

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Thema Bluetooth Modul der Klasse 2 Seite 32 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

27. REGULATORY INFORMATION

27.1. FCC FOR US
27.1.1. FCC Notice
The device PAN1555, including the ceramic antenna and also the SMD type PAN1455,
including with the antennas, which are listed in 27.1.5, complies with Part 15 of the FCC
Rules. The device meets the requirements for modular transmitter approval as detailed in
FCC public Notice DA00-1407.transmitter
Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) This device must accept any interference received, including
interference that may cause undesired operation.

27.1.2. Caution
The FCC requires the user to be notified that any changes or modifications made to this
device that are not expressly approved by Panasonic Electronic Devices Europe GmbH may
void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
 Reorient or relocate the receiving antenna.
 Increase the separation between the equipment and receiver.
 Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
 Consult the dealer or an experienced radio/TV technician for help

27.1.3. Labeling Requirements

The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements
are met. This includes a clearly visible label on the outside of the OEM enclosure specifying
the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above.
The FCC identifier are FCC ID: T7V-BC06. This FCC identifier is valid for all versions, for
details, please see the chapter 24. Ordering Information.
In any case end product must be labelled exterior with "Contains FCC ID: T7V-BC06"

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CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

27.1.4. Antenna Warning

The related part number for this device is PAN1455 with SMD pad). For details, please see
the chapter 24. Ordering Information. This device are tested with a standard SMA connector
and with the antennas listed below. When integrated in the OEMs product, these fixed
antennas require installation preventing end-users from replacing them with non-approved
antennas. Any antenna exceeding 2dBi not in the following table must be tested to comply
with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions.
The FCC identifier for this device with the antenna listed in item 1 are the same (FCC ID:
T7V-BC06).

27.1.5. Approved Antenna List

Note: We are able to qualify your antenna and will add to this list as that process is completed.
Item Part Number Manufacturer Frequency Band Type Gain (dBi)

1 WIMO17010.10 Wimo 2.4GHz ROD +2

2 2450AT42B100 Johanson 2.4GHz SMD -1.5

27.1.6. RF Exposure PAN1455/PAN1555

To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM)
must ensure that the approved antenna in the previous table must be installed.
The preceding statement must be included as a CAUTION statement in manuals for products
operating with the approved antennas in the previous table to alert users on FCC RF
Exposure compliance.
Any notification to the end user of installation or removal instructions about the integrated
radio module is not allowed.
The radiated output power of PAN1455 with mounted ceramic antenna
(FCC ID: T7V-BC06) is far below the FCC radio frequency exposure limits. Nevertheless, the
PAN1455 shall be used in such a manner that the potential for human contact during normal
operation is minimized.
End users may not be provided with the module installation instructions. OEM integrators and
end users must be provided with transmitter operating conditions for satisfying RF exposure
compliance.

27.2. INDUSTRY CANADA CERTIFICATION

PAN1455/PAN1555 comply with the regulatory requirements of Industry canada (IC), license:
IC: 216Q-BC06
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to
clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits.
Users can obtain Canadian information on RF exposure and compliance from
www.ic.gc.ca
This device has been designed to operate with the antenna listed in section 27.1.5 above,
having a maximum gain of 2.0 dBi. Antennas not included in this list or having a gain greater
than 2.0 dBi are strictly prohibited for use with this device. The required antenna impedance
is 50 ohms. The antenna used for this transmitter must not be colocated or operating in
conjunction with any other antenna or transmitter.

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CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

27.3. EUROPEAN R&TTE DECLARATION OF CONFORMITY

All modules described in this data sheet comply to the following standards:

- EN 60950-1: 2006 For article 3.1 (a) : Health and Safety of the User
- EN 301 489-17 V2.2.1 For article 3.1 (b) : Electromagnetic Compatibility
- EN 300 328 V1.8.1 For article 3.2 : Effective use of spectrum allocated

As a result of the conformity assessment procedure described in Annex III of the Directive
1999/5/EC, the end-customer equipment should be labelled as follows:

The end-customer has to assure that the device has a distance of more the 20cm from the
human body under all circumstances.
The end-customer equipment must meet the actual Safety/Health requirements according
R&TTE.

PAN1555 and their versions in the specified reference design can be used in the following
countries: Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France,
Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Poland,
Portugal, Slovakia, Slovenia, Spain, Sweden, The Netherlands, the United Kingdom,
Switzerland and Norway.

28. RELATED DOCUMENTS

Mitgeltende Dokumente
[1] Stollmann Firmware updates/support:
http://www.stollmann.de/de/support/downloads/bluetooth-adapter/bluemod-p2xg2.html

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Thema Bluetooth Modul der Klasse 2 Seite 35 of 35
CUSTOMER’S CODE PANASONIC’S CODE DATE
PAN1455/1555 ENW89815CxKF/ENW89815AxKF Datum 19.01.2015

29. GENERAL INFORMATION

Allgemeine Informationen
© Panasonic Industrial Devices Europe GmbH.
All rights reserved.
This document may contain errors. Panasonic reserves the right to make corrections,
modifications, enhancements, improvements, and other changes to its literature at any time.
Customers should obtain the latest relevant information before placing orders and should verify
that such information is current and complete. All products are sold subject to Panasonic’s terms
and conditions of sale supplied at the time of order acknowledgment.

If we deliver ES samples to the customer, these samples have the status Engineering Samples.
This means, the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and there may be differences to be published Data Sheet.
Engineering Samples are not qualified and are not to be used for reliability testing or series
production.

Disclaimer:
Customer acknowledges that samples may deviate from the Data Sheet and may bear defects
due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular,
Panasonic disclaims liability for damages caused by
 the use of the Engineering Sample other than for Evaluation Purposes, particularly the
installation or integration in an other product to be sold by Customer,
 deviation or lapse in function of Engineering Sample,
 improper use of Engineering Samples.
Panasonic disclaimes any liability for consequential and incidental damages. Panasonic
assumes no liability for applications assistance or customer product design. Customers are
responsible for their products and applications using Panasonic components. To minimize the
risks associated with customer products and applications, customers should provide adequate
design and operating safeguards. In case of any questions, contact your local sales
representative.

30. LIFE SUPPORT POLICY

Politik für Lebenserhaltungssysteme
This Panasonic product is not designed for use in life support appliances, devices, or systems
where malfunction can reasonably be expected to result in a significant personal injury to the
user, or as a critical component in any life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system, or to affect
its safety or effectiveness. Panasonic customers using or selling these products for use in such
applications do so at their own risk and agree to fully indemnify Panasonic for any damages
resulting.

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