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Pert 7. PCB - 2

The document discusses the key components and design process of printed circuit boards (PCBs). It describes how PCBs connect electronic components using conducting traces etched onto layers of a non-conductive substrate. The design process involves laying out the placement of pads, traces, and vias that connect components, as well as designing multilayer boards. Manufacturing involves etching away unwanted copper to leave the circuit traces.

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Rahma Hanifa
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87 views23 pages

Pert 7. PCB - 2

The document discusses the key components and design process of printed circuit boards (PCBs). It describes how PCBs connect electronic components using conducting traces etched onto layers of a non-conductive substrate. The design process involves laying out the placement of pads, traces, and vias that connect components, as well as designing multilayer boards. Manufacturing involves etching away unwanted copper to leave the circuit traces.

Uploaded by

Rahma Hanifa
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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PCB Design Presentation

Jakia Afruz
 Printed Circuit Board
 Electronic Board that connects circuit
components
 PCB populated with electronic components
is a printed circuit assembly (PCA)
 Mass manufacturing
 Conducting layers are typically made of
thin copper foil.
 The board is typically coated with a solder
mask that is green in color. Other colors
that are normally available are blue and
red.
 Unwanted copper is removed from the
substrate after etching leaving only the
desired copper traces or pathways
 Components
 Pads
 Traces
 Top Metal Layer
 Bottom Metal Layer
 Components are the actual devices
used in the circuit.
 This includes input/output connections.
 I/O ports, including power supply
connections, are also important in the
PCB design.
 Location that components connect to.
 You will solder components to the pads
on the PCB.
 Pads will connect to traces.
 Pads have an inner diameter and outer
diameter.
 Traces connect pads together.
 Traces are essentially the wiring of the
PCB.
 Equivalent to wire for conducting signals
 Traces sometimes connect to vias.
 High current traces should be wide.
 Signal traces usually narrower than
power or ground traces
 Pad with a plated hole connecting
traces from one layer of board to other
layers.
 Attempt to minimize via use in your
PCBs.
 Some component leads can be used as
vias.
 Most of the components
reside on the top layer
 Fewer traces on the top
layer
 Components are soldered
to the pads on the top
layer of PCB
 Higher circuit densities
 Few components on this layer.
 Many traces on this layer.
 Most soldering done on this layer.
 Often, many signal wires need to exist in
too small of a space and must overlap.
 Running traces on different PCB layers is
an option.
 Multilayer PCBs are often expensive.
 Solution: use jumpers
 Printing on the solder mask to designate
component locations
 Readable information about component
part numbers and placement.
 Helpful in assembling, testing and
servicing the circuit board.
 Component Size
 Heat Dissipation
 Input and Output
 Mounting Points
 Make sure components will actually fit.
 This especially applies for circuits that
require high component densities.
 Some components come in multiple
sizes. SMT vs Through Hole
 Sometimes you can get tall and narrow
caps or short and wide capacitors.
 Heat sink dissipates heat off the
component
 Doesn’t remove the heat just moves it
 Some components may get hot. Make
sure you get a large enough heat sink.
 Data sheets specify the size of the heat
sink
 A short circuit may result when two
devices share the same heat sink
 The PCB needs to be mechanically
secured to something.
 Could be the chassis-consist of metal
frame on which the circuit boards and
other electronic components are
mounted.
 Could be another PCB/socket on PCB.
 Could be attachments to a heatsink.
1. Film Generation 2. Shear Raw Material

Industry standard
3. Drill Holes 0.059" thick, copper
clad, two sides
4. Electrolus copper 5. Apply Image

Apply copper in hole barrels Apply Photosensitive Material to


develop selected areas from
panel
6. Strip and Etch 7. Solder Mask

•Remove dryfilm, then Apply solder mask area to


etch exposed copper entire board with the exception
•Tin protects the copper of solder pads
circuitry from being
etched
8. Solder Coat 9. Silkscreen

Apply solder to pads Apply white letter marking


using screen printing
process
http://www.youtube.com/watch?v=Q6WJqjVleG
0&feature=related

http://www.advancedcircuits.com/
 PCB Design slides by Chris Stahl
 www.wikipedia.org
 www.pcbexpress.com
 A Practical Guide to high-speed printed
circuit board layout
 http://www.advancedcircuits.com
 How to download the software (EAGLE Layout
editor)
1. Go to http://www.cadsoftusa.com
2. Click ‘Freeware’
3. Click ‘Download’
4. Find the correct version (Windows/Linux,English)
5. Also download Manual and Tutorial
 http://www.pcbexpress.com
 http://www.freepcb.com
 http://www.4pcb.com
 http://www.pentalogix.com

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