We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 2
Format for Product information
Sr Item Value Remarks
1 Product name & Silicon number
IITM - Prof Kamakoti 2 End user unit/centres, contact (mail / phone): Phone - +91 44 2257 4368 3 Is product target for Flight Model (FM) 3a Project name / Flight: 4 Expected delivery FAB: SCL NODE: 180nm 5 Technology: Substrate: Maskset in SCL fab Number of die pads: 384 Die physical without 6 Die size, mm: 8.1 x 8.1 information sealring Die Grid Size (microns) : 0.005 Speed of operations / 70MHz frequency, MHz Device Voltage (Core) 1.8V Device Voltage (I/O) 3.3V Die Electrical Power dissipation Core 7 1844 mW information (Max) Power dissipation Core 1554 mW (Avg) Power dissipation I/O 662 mW (Max) Power dissipation I/O 491 mW (Avg) IBIS model Available (Yes/No) Critical signals required special attention 8 Package or COB Package Pin Replacement of existing device: 9 (If yes, attach datasheet / provide data sheet number) Need separate power plane for 10 Any other packaging requirement IO power and core power 11 Packaged device quantity delivery to user: 12 Package Marking Information from user: 13 Any other information 14 Focal point / designer in SCL 15 Budget provision if needed