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EE - 504L: Solid State Processing and Integrated Circuit Processing Ming Hsieh Electrical Engineering Dept. USC Viterbi School of Engineering

This course covers the theoretical and hands-on aspects of processing silicon wafers into integrated circuits. Over 11 weeks, students will attend weekly lectures on topics like oxidation, lithography, diffusion, and CMOS processing. They will also spend 3 hours per week in a clean room performing a full wafer processing project. Grading is based on homework assignments, a midterm, lab performance, a final written report on their project, and a final exam. The goal is for students to understand the steps required to transform a bare wafer into a multi-layer integrated circuit that can be electrically tested.

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73 views2 pages

EE - 504L: Solid State Processing and Integrated Circuit Processing Ming Hsieh Electrical Engineering Dept. USC Viterbi School of Engineering

This course covers the theoretical and hands-on aspects of processing silicon wafers into integrated circuits. Over 11 weeks, students will attend weekly lectures on topics like oxidation, lithography, diffusion, and CMOS processing. They will also spend 3 hours per week in a clean room performing a full wafer processing project. Grading is based on homework assignments, a midterm, lab performance, a final written report on their project, and a final exam. The goal is for students to understand the steps required to transform a bare wafer into a multi-layer integrated circuit that can be electrically tested.

Uploaded by

Harshini
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as DOC, PDF, TXT or read online on Scribd
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EE – 504L: Solid State Processing and Integrated Circuit Processing

Ming Hsieh Electrical Engineering Dept.


USC Viterbi School of Engineering
Instructor: Dr. Kian Kaviani, office: PHE528, email: [email protected] , office hours: 5:30 –
6:20 PM, Mon. & Wed.
Course Material: No Textbook
2) Weekly Lectures Power Point Slides which are accessible by all registered student of the
course on the USC blackboard system.

Course Objective

This course has two components that are designed to complement each other. Two weekly
lectures of one hour each that are intended to bring the theoretical aspect of the processing steps
that are needed to transform silicon wafers to working devices and circuits. Also the state-of-the-
art processes are presented and discussed. The goal of the lecture component of the course is to
empower the students to be able to perform a reverse engineering on finished integrated circuits,
with more than 20 mask counts and recognize the necessary fabrication steps that are needed to
start from the bare wafer all the way to multi step metallization leading to the final cap layer. The
second aspect of the course is the hands-on components that each student will spend about 3
hours per week for 11 weeks in a clean room setting to fabricate his/her wafer processing. The
end of the laboratory work is to electrically test the finished devices and extract device/material
parameters.

Grading

I) Homework (5 sets) 250 pts.


I – a) Oxidation: 30
I – b) Lithography: 30
I – c) Diffusion / Implantation: 90
I – d) CMOS: 150

II) Midterm 200 pts.


II – a) HW – Based: 100
II – b) Lecture Based: 100

IV) Lab Performance 200 pts.


based on the weekly lab
performance, evaluated
by the teaching assistants

V) Final Written Report 150 pts.


based on the calculation
and parameter extraction
of the data (10% off for every days of late submission)

VI) Final Exam 200 pts.


similar to part V

Statement on Academic Integrity


USC seeks to maintain an optimal learning environment. General principles of academic
honesty include the concept of respect for the intellectual property of others, the
expectation that individual work will be submitted unless otherwise allowed by an
instructor, and the obligations both to protect one’s own academic work from misuse by
others as well as to avoid using another’s work as one’s own. All students are expected to
understand and abide by these principles. Scampus, the Student Guidebook, contains the
Student Conduct Code in Section11.00, while the recommended sanctions are located in
Appendix A:
http://www.usc.edu/dept/publications/SCAMPUS/gov/. Students will be referred to the
Office of Student Judicial Affairs and Community Standards for further review, should
there be any suspicion of academic dishonesty. The Review process can be found at:
http://www.usc.edu/student-affairs/SJACS/.

Schedule of Weekly Lecture

Week – 1: a) Introduction to the semiconductor industry


b) Safety and basic semiconductor physics
Week – 2: a) Semiconductor Physics
Week – 3: a) Silicon wafers. Properties, defects
b) Thermal oxidation of silicon
Week – 4: a) Calculation on Thermal oxidation (HW # 1)
b) Thin Film deposition
Week – 5: a) Lithography – I
b) Lithography – II (HW # 2)
Week – 6: a) Diffusion – I
b) Diffusion – II
Week – 7 a) Ion Implantation (HW # 3)
b) Etching
Week – 8: a) Metallization
b) Midterm (Part – I)
Week – 9: a) Midterm (Part – II)
b) Review of the Midterm results
Week – 10: a) CMOS – I
b) CMOS – II (HW # 4)
Week – 11: a) CMOS – III
b) CMOS – IV
Week – 12: a) CMOS – V
b) Electrical Testing
Week – 13: a) Electrical Testing
b) Packaging & Assembly
Week – 14: a) Technical Report Writing
b) Review for Final Exam
Week – 15: a) Open Class to deal with the Final Report
Week – 16: Final Written Report Due in the last class meeting

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