feature

Optimization of Acid Copper Electrodeposition

Processes for High-Throwing Power DC Plating
by Michael Carano quantify the capability of a fabricator to prof-
RBP Chemical Technology itably produce traditional boards. The ability
to image conductor lines, and perhaps even
more important, the insulating airspace be-
Introduction tween them, is considered a key characteristic.
Perhaps one of the three most fundamen- With surface mount components, a dramatic
tal aspects of printed circuit fabrication is the decrease in plated via hole diameter require-
metallization and electroplating of through- ments occurred, and as a result, via holes have
hole vias and blind via interconnections. Ide- become simple vertical interconnections. Now,
ally, one should also include fine-line imaging under competition from laser drilling, both
of increasingly smaller feature sizes and via for- drill bit and machine technology have driven
mation, whether by mechanical or laser meth- mechanical holes capability much smaller.
ods. Indeed, the foundation of technology In the most recent release of the IPC Tech-
roadmaps should, at the very least, encompass nology Roadmap, PTH and blind via diameters
a discussion of line widths and spaces, PTH and aspect ratios have been defined as to the
and blind via aspect ratios, and a metric that technology sector where the boards are used. In
defines acceptability of plating uniformity and order to provide a list of key attributes (layer
throwing power. These same parameters have counts, board thickness, number and diam-
been used for nearly four decades to quickly eters of vias, etc.) for the PCB, emulators are

8 The PCB Magazine • May 2015

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Optimization of Acid Copper Electrodeposition Processes continues

employed. Emulators (synthetic) are representa- For purposes of this paper, throwing power
tions of a category of product, combining the at- is defined as the minimum electroplated thick-
tributes common to the type to avoid concerns ness in the center of the PTH, divided by the
about disclosure of specific company-proprietary thickness on the PTH surface (excluding copper
designs. Technologists from around the world
were asked to provide their respective view of
the PCB technology required for the emulator.
This exercise is critical in developing and un-
derstanding roadmaps. As an example, Table 1
below lists the minimum mechanical via hole
sizes for the various emulators.
Table 2 depicts the maximum aspect ratio of
mechanically drilled plated through-holes for
the respective emulators.

The Challenge
It is quite clear from the two tables that
there are rather high-aspect ratio vias that must
be plated. It is understood that it is desirable
to achieve as close to 100% throwing power as
possible. At a minimum, market surveys have
shown that for reliability, productivity, and
performance purposes, a minimum of 80-85%
throwing power is required. Further, process
engineers desire to minimize plating on the
conductor traces in order to minimize under- Figure 1: Throwing power: 1.0 mil minimum hole
cut and circuit width destruction due to final thickness and 1.3 mil surface thickness. Throwing
etching. power is 1.0/1.3 mil, or 77%.

Table 1: Minimum hole diameter for mechanically drilled vias (mm, rounded to whole number).
(Source: IPC Technology Roadmap, 2015)

10 The PCB Magazine • May 2015

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Optimization of Acid Copper Electrodeposition Processes continues

foil). Figure 1 illustrates the definition of throw- K = Solution resistance

ing power. d = Hole diameter
While in Figure 1 the throwing power L = Length of hole
is 77%, one would prefer throwing power
of 100%. Electroplating of high-aspect ratio It is important to keep this in mind when
through-holes becomes increasingly more dif- designing plating processes for high-aspect ratio
ficult as via diameters decrease and board thick- circuit boards. As circuit boards become more
nesses increase. Figure 1 depicts a condition complex in their designs, more attention must
aptly named “dog-boning” for its thinness in be paid to plating cell design, plating chemistry,
the center of the via. anodes and plating racks, electrical connections
The following equation illustrates a model and solution agitation. This paper will also pres-
that provides insight into the difficulty factor ent various techniques on improving and en-
encountered when aspect ratios increase. It is hancing throwing power for high-aspect ratio
not as simple as it looks. As the model illustrates, plated through-holes, with a focus on direct
board thickness has a much greater influence current (DC) plating.
on degree of difficulty than does via diameter.
Essentially, board thickness directly influences Acid Copper Electroplating:
ohmic resistance through the via. Resistance is Theoretical Aspects
inversely proportional to plating propagation. In order to enhance plating uniformity
(defined not only as plating thickness across
the PCB surface but in the via as well), en-
gineers should understand that there are
several factors that influence plating unifor-
mity. The Fishbone diagram below details in
concise fashion those parameters that influ-
Where: ence throwing power, plating distribution
E = Voltage drop down hole (energy lost) and overall quality of the finished printed cir-
J = Cathode current density cuit board.

Table 2: Aspect ratio, mechanically drilled hole via (max ratio).

May 2015 • The PCB Magazine 11

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Optimization of Acid Copper Electrodeposition Processes continues

Figure 2: These factors and their influence on plating distribution will be presented throughout this paper.

Acid Copper Electroplating for High-Aspect the board thickness increases, ohmic resistance
Ratio PCBs: Practical Aspects dominates and addition agents have less of an
For any process engineer, getting a handle influence[2]. In this case, mass transfer of the
on the key elements involved in the process will plating solution into the vias is critical. How-
provide the insight and understanding required ever, with the higher-aspect ratio holes, mass
to achieve optimum plating results. The first transfer gives way to ohmic resistance. In or-
part of this equation is to recognize the rela- der to compensate, one needs to reduce the ca-
tionship and interactions of the plating chem- thodic current density and also reduce plating
istry (inorganic and organic). solution resistances. The latter is accomplished
by increasing electrolyte conductivity, reducing
Influence of the Organic Additives and resistances in plating cables and other cell de-
Plating Electrolyte (inorganic) sign enhancements that will be mentioned in
The organic addition agents utilized in the the next section. Since it becomes increasingly
plating solution have an influence on plating difficult to achieve near 100% throwing power
distribution and throwing power under certain in aspect ratio holes of 10:1 and above, the plat-
conditions. The additives distinctively influence ing electrolyte must be set-up to maximize plat-
this behavior when charge transfer and ohmic ing solution conductivity. This is accomplished
resistance dominate the plating system behav- by increasing the sulfuric acid concentration
ior. However, as the PTH diameter increases and and reducing the amount of available copper

12 The PCB Magazine • May 2015

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Optimization of Acid Copper Electrodeposition Processes continues

ions in solution. Of course, one cannot reduce

the copper ions in such a way that the limiting
current density will be quite low. This is where
mass transfer becomes increasingly important.
And mass transfer is dependent on diffusion-
the movement of ions and additives through
the plating electrolyte.
Organic additives will also affect the grain
structure, leveling and physical properties of
the deposit. Strict control of the additive chem-
istry requires instrumentation such as cyclic
voltammetric stripping (CVS) and perhaps ion
chromatography. Additional agent imbalances
will reduce the ductility of the copper depos-
it, thin plating at the knee of the via and poor Figure 3: Air bubble entrapment in via leading to
leveling. plating void.

Influence of Mechanical Aspects

of the Process
In addition to the influence of the organic resistive when present as a cloud or foam of
additives and the inorganic chemistry, there bubbles; and, the general plating rate enhance-
are several other factors that influence plating ment is modest despite several possible param-
distribution and throwing power. One major eters for adjustment. The least appreciated char-
influence is solution movement or agitation. acteristic is the resistivity, which can lead to
Agitation influences mass transport. As one an increase of electroplating power of 25–30%
will recognize, the organic addition agents af- and is therefore a significant electrical cost fac-
fect plating distribution and throwing power, tor. It also generates environmental pollution
among other attributes. And mass transport of through dispersion of air bubbles. In addition,
the plating solution is key to “pushing” these these tiny bubbles can lodge into the through-
additives from the bulk plating solution to the holes and blind vias, leading to a reduction in
cathode (circuit board to be plated) surface. One plating thickness or voids[1]. This micro-bubble
can look at agitation as solution mixing and ag- void inducing condition is well-documented in
itation at the interface of the cathode and solu- the industry and can be seen in Figure 3.
tion boundary layer. Solution agitation of the Conversely, solution movement supplied by
copper plating electrolyte maybe accomplished eductor agitation is much more effective than
with air agitation, eductors, solution impinge- air. When agitation is supplied via eductors,
ment or cathode bar movement. The main pur- the solution movement is significantly more
poses of agitation have been stated many times uniform across the panel surface. One can de-
and include: scribe this as ‘laminar flow.’ With air agitation,
the solution is moving in a turbulent fashion
• Elimination of solution stagnation and and is often quite non-uniform. This turbulent
dispersal of reaction products flow creates areas within the plating cell con-
• Increase of deposition rates by mass sisting of dead spots, which appear as if there
transfer enhancement is no or very minimal agitation in that portion
• Dissipation of heat at electrode/solution of the cell. This is a recipe for disaster. When
interfaces[1] this condition occurs, plating uniformity is not
ideal and the cosmetics of the deposit as well as
Air agitation suffers from three main dis- the physical properties suffer.
advantages: It has a chemical oxidative action Eductors, on the other hand, can be imple-
towards solution constituents; it is electrically mented at a very low cost with respect to retro-

May 2015 • The PCB Magazine 13

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Optimization of Acid Copper Electrodeposition Processes continues

fitting any of the plating cells. This author has power ills on its own. As mentioned above, there
had documented success with respect to im- are other factors including the organic addition
proving throwing power and plating distribu- agents and the composition of the plating elec-
tion. More uniform plating distribution helps trolyte itself. And many of these factors interact
to reduce the plating cycle time (everyone likes with each other. As the graph in Figure 6 below
higher productivity and efficient use of capital). shows, when the organic addition agents (in
Secondly, minimizing plating thickness on the this case the carrier component of the plating
surface of the board while enhancing throwing additives) are in the optimum concentrations,
power in small diameter vias will provide less the throwing power is significantly better than
opportunity for circuit line width reduction due when eductors are used to supply the solution
to etching. Fabricators should always keep this movement. In this study, the circuit board test
fact in mind especially as one migrates to 3 mil vehicle was 0.093 inches thick and the smallest
lines and spaces. Figure 4 shows an actual plat- via diameter was 0.008 inches. Cathode current
ing cell (without chemistry) with eductors. density was set at 25 ASF (amps per square foot).
Figure 5 shows a single eductor pod as a One should not underestimate the im-
close-up. These eductors should be mounted portance of plating cell design and geometry
on manifolds as shown in Figure 4. This type of when it comes to optimizing throwing power
agitation set-up requires a 2.5–4 HP pump for and overall plating distribution. Factors such as
every 4000 liters of plating solution. anode-to-cathode distances, anode length and
Of course, solution movement (eductor ver- placement and plating rack construction/design
sus air agitation) cannot cure plating throwing greatly affect plating uniformity. With respect
to rack design, a picture frame rack (multiple
rack points around the periphery of the board)
will provide more uniform current distribution
as opposed to a rack with a few attachment
points at the top or side of the panel.
In addition, anode length should be 3–4
inches shorter than the length of cathode. This
will aid in mitigating excessive plating on edges
of the panel.
With primary distribution, the electron po-
tential field depends solely on cell geometry in-
cluding anode length and placement (Figure 7).
It is possible to use floating shields in the plat-
ing tank in order to divert current from those
areas of the circuit board most prone to over-
plating.

Figure 4: Photo of plating cell with bottom up Figure 5: Close-up view of a single educator, also
educators. known as a pod.

14 The PCB Magazine • May 2015

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Optimization of Acid Copper Electrodeposition Processes continues

Figure 6: Influence of air versus eductors on throwing power.

Figure 7: Current flux lines follow path of least resistance leading to over-plating and poor distribution.

Plating rack materials fabricated out of cop- ondary current distribution. Secondary current
per (Plastisol coated) provide more electrical comes into play through a factor known as po-
conductivity than stainless steel material. This larization. Polarization refers to the additional
is an important fact for thicker panels and high- potential required above the equilibrium po-
aspect ratio via holes. tential to drive the deposition of the metal to
Fortunately for plating difficult circuit be plated. (Keep in mind that factors involved
boards, there is another factor to consider: sec- in primary current distribution should be op-

16 The PCB Magazine • May 2015

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Optimization of Acid Copper Electrodeposition Processes continues

timized in addition to manipulating second- Large grained copper anodes dissolve uneven-
ary current distribution.) The potential is de- ly, leading to heavy sludging and potential for
termined by Ohm’s Law, which is the solution impurities and particulate matter to enter the
resistance between the anodes and cathodes. plating solution. An example of different anode
Additional resistances arrive through the volt- quality is shown in Figure 8.
age required to corrode the anode and the resis- There are three different anodes from three
tance required to reduce the metal ions to metal different suppliers, each claiming quality an-
at the cathode. odes for printed circuit fabrication. Note that
In order to improve throwing power and each anode looks much like the other.
plating uniformity, one can increase the con- Each anode ball was cut with a diamond saw
ductivity of the plating electrolyte and increase to reveal structure. Figure 9 shows an SEM of
the polarization. Polarization and conductiv- each of those. Clearly there is a distinctive dif-
ity are both dependent on solution operating ference among the grain structures and phos-
temperature, solution agitation and cathode phorous (shown as the dark areas). To read
current density. The main consideration is rec- more about anode manufacturing and quality,
ognizing that plating distribution across the see Reference 3.
surface of a printed wiring board panel and Each anode ball was cut with a diamond saw
from the surface of the panel through the holes and given a light etch to reveal. Figure 9 shows
will vary due to resistances. By mitigating the an SEM of each of those. Clearly there is a dis-
effects of these resistances, plating distribution tinctive difference among the grain structures
is improved.

The Importance of Quality Anodes-Care

and Maintenance
It is surprising how little attention is paid
to the quality and maintenance of the copper
anodes. The grain structure is the most critical
characteristic of copper anodes. This structure
is predicated on the manufacturing process of
the anodes, which in turn determines the grain
structure of the copper. Fine grained size of the
copper is the preferred orientation. The unifor-
mity of grain size and the dispersement of the
phosphorous along the grain boundaries will Figure 8: External view of three anodes from
aid in the orderly dissolution of the copper. three different manufacturers.

Figure 9: Manufacturer 1 (left), Manufacturer 2 (middle) and Manufacturer 3 (right).

18 The PCB Magazine • May 2015

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feature

Optimization of Acid Copper Electrodeposition Processes continues

and phosphorous dispersion (shown as the dark and placement and proper selection of organic
areas). As one views each of the structures, the plating additives and the electrolyte (inorganic
differences are remarkable. chemistry). PCB
The anodes from Manufacturer 1 show large
and uneven grain boundaries. In addition, the References
phosphorous is unevenly distributed. This leads 1. D.R.Gabe, Trans IMF 2003, 81, 7. Ward.
to high organic additive consumption, anode 2. Yung, E.K. and Romankiw, L., “Fundamen-
sludge and plating roughness. The anodes from tal Study of Acid Copper Through-hole Electro-
Manufacturer 2 and 3 are the ideal quality re- plating Process,” Symposium on Electrodeposi-
quired for PCB plating for high-aspect ratio tion Technology, The Electrochemical Society,
holes. Pennington, New Jersey, pages 612–635.
3. Chuck Walker and Steve Doyle, Electro-
Summary plating: The Importance of Copper Anodes,
While electroplating PCBs with aspect ra- Finishing World.
tios greater that 12:1 is probably best accom-
plished with periodic pulse reverse plating, di-
rect current plating will produce high-quality Michael Carano is with
circuit boards with aspect ratios up to 12:1. RBP Chemical Technology.
This requires that several parameters be opti- To contact the author,
mized for throwing power and plating distri- click here.
bution. These parameters include plating cell
design, high quality copper anodes, solution
agitation with use of eductors, anode length

Video Interview

ENIG & ENEPIG IPC Standards Update

by Real Time with...
IPC APEX EXPO 2015

IPC Plating Committee Chair

George Milad explains the
procedure for generating
standards, with particular
reference to recent revisions
of IPC-4552 for ENIG and
Click
IPC-4556 for ENEPIC and dis-
cusses current developments realtimewith.com
in EPIG and electroless silver.
To View

20 The PCB Magazine • May 2015