User’s Manual

µPD780058, 780058Y Subseries

8-Bit Single-Chip Microcontrollers

µPD780053 µPD780053Y
µPD780054 µPD780054Y
µPD780055 µPD780055Y
µPD780056 µPD780056Y
µPD780058 µPD780058BY
µPD780058B µPD78F0058Y
µPD78F0058 µPD780053Y(A)
µPD780053(A) µPD780054Y(A)
µPD780054(A) µPD780055Y(A)
µPD780055(A) µPD780056Y(A)
µPD780056(A) µPD780058BY(A)
µPD780058B(A)
Document No. U12013EJ3V2UD00 (3rd edition)
Date Published February 2003 N CP (K)

1997, 2003
Printed in Japan
[MEMO]

2 User's Manual U12013EJ3V2UD

 NOTES FOR CMOS DEVICES

1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS

Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.

2 HANDLING OF UNUSED INPUT PINS FOR CMOS

Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.

3 STATUS BEFORE INITIALIZATION OF MOS DEVICES

Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.

FIP, EEPROM, and IEBus are trademarks of NEC Electronics Corporation.

Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the
United States and/or other countries.
PC/AT is a trademark of International Business Machines Corporation.
HP9000 Series 700 and HP-UX are trademarks of Hewlett-Packard Company.
SPARCstation is a trademark of SPARC International, Inc.
SunOS is a trademark of Sun Microsystems, Inc.
TRON stands for The Realtime Operating system Nucleus.
ITRON is an abbreviation of Industrial TRON.

User's Manual U12013EJ3V2UD 3

 These commodities, technology or software, must be exported in accordance
with the export administration regulations of the exporting country.
Diversion contrary to the law of that country is prohibited.

Purchase of NEC Electronics I2C components conveys a license under the Philips I2C Patent Rights to use
these components in an I2C system, provided that the system conforms to the I2C Standard Specification as
defined by Philips.

• The information in this document is current as of January, 2003. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.

The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.

(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics
(as defined above).

M8E 02. 11-1

4 User's Manual U12013EJ3V2UD

 Regional Information

Some information contained in this document may vary from country to country. Before using any NEC
Electronics product in your application, pIease contact the NEC Electronics office in your country to
obtain a list of authorized representatives and distributors. They will verify:

• Device availability

• Ordering information

• Product release schedule

• Availability of related technical literature

• Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)

• Network requirements

In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.

NEC Electronics America, Inc. (U.S.) • Filiale Italiana NEC Electronics Hong Kong Ltd.
Santa Clara, California Milano, Italy Hong Kong
Tel: 408-588-6000 Tel: 02-66 75 41 Tel: 2886-9318
800-366-9782 Fax: 02-66 75 42 99 Fax: 2886-9022/9044
Fax: 408-588-6130
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NEC Electronics (Europe) GmbH Tel: 040-244 58 45 Seoul, Korea
Duesseldorf, Germany Fax: 040-244 45 80 Tel: 02-528-0303
Tel: 0211-65 03 01 Fax: 02-528-4411
Fax: 0211-65 03 327 • Tyskland Filial
Taeby, Sweden NEC Electronics Shanghai, Ltd.
• Sucursal en España Tel: 08-63 80 820 Shanghai, P.R. China
Madrid, Spain Fax: 08-63 80 388 Tel: 021-6841-1138
Tel: 091-504 27 87 Fax: 021-6841-1137
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• Succursale Française Tel: 01908-691-133 Taipei, Taiwan
Vélizy-Villacoublay, France Fax: 01908-670-290
Tel: 02-2719-2377
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Fax: 01-30-67 58 99
NEC Electronics Singapore Pte. Ltd.
Novena Square, Singapore
Tel: 6253-8311
Fax: 6250-3583

J02.11

User's Manual U12013EJ3V2UD 5

 Major Revisions in This Edition (1/2)

Page Description
Throughout Deletion of following product
• µPD780058Y

Addition of following products

• µPD780058B, 780058BY, 780053(A), 780053Y(A), 780054(A), 780054Y(A), 780055(A),
780055Y(A), 780056(A), 780056Y(A), 780058B(A), 780058BY(A)
Deletion of following packages
• 80-pin plastic QFP (GC-3B9 type)
• 80-pin plastic TQFP (GK-BE9 type)
Addition of following package
• 80-pin plastic TQFP (GK-9EU type)

pp. 31, 32, 38, 39 1.1 Features, 1.7 Outline of Functions

• Change of operating voltage range of A/D and D/A converters of µPD780058 and 78F0058
• Change of supply voltage of µPD78F0058
p. 40 Addition of 1.9 Differences Between Standard Model and (A) Model
pp. 41, 42, 48, 49 2.1 Features, 2.7 Outline of Functions
• Change of operating voltage range of A/D and D/A converters of µPD78F0058Y
• Change of supply voltage of µPD78F0058Y

p. 50 Addition of 2.9 Differences Between Standard Model and (A) Model

p. 60 Change of processing when A/D converter is not used in 3.2.11 AVREF0
pp. 62, 63 Change of recommended connection of unused pins and connection of P60 to P63, AVREF1, and
VPP pins in Table 3-1 Pin I/O Circuit Types

p. 75 Change of processing when A/D converter is not used in 4.2.11 AVREF0

pp. 77, 78 Change of recommended connection of unused pins and connection of P60 to P63, AVREF1, and
VPP pins in Table 4-1 Pin I/O Circuit Types
p. 132 Modification of Note 2 in 6.2.8 Port 6

p. 149 Addition of note on feedback resistor to Figure 7-3 Processor Clock Control Register Format
p. 167 Addition of Table 8-5 INTP1/TI01 Pin Valid Edge and CR00 Capture Trigger Valid Edge
p. 168 Addition of Table 8-6 INTP0/TI00 Pin Valid Edge and CR01 Capture Trigger Valid Edge

p. 177 Correction of note on valid edge of INTP0/TI00/P00 and INTP1/TI01/P01 pin in Figure 8-8
Format of External Interrupt Mode Register 0
p. 185 Addition of Figure 8-17 Configuration of PPG Output
Addition of Figure 8-18 PPG Output Operation Timing
pp. 201 to 204 8.5 16-Bit Timer/Event Counter Operating Cautions
Addition of description on TI01/P01/INTP1 to (5) Valid edge setting
Addition of (c) One-shot pulse output function to (6) Re-trigger of one-shot pulse
Addition of (8) Conflict operation
Addition of (9) Timer operation
Addition of (10) Capture operation
Addition of (11) Compare operation
Addition of (12) Edge detection

p. 235 Modification of note on changing count clock in Figure 10-2 Timer Clock Select Register 2
Format
p. 242 Modification of note on changing count clock in Figure 11-2 Timer Clock Select Register 2
Format
p. 252 Addition of note on rewriting TCL2 in Figure 13-2 Format of Timer Clock Select Register 2

6 User's Manual U12013EJ3V2UD

 Major Revisions in This Edition (2/2)

Page Description
p. 263 Modification of Figure 14-5 A/D Converter Basic Operation
Addition of Table 14-2 A/D Conversion Sampling Time and A/D Converter Start Delay Time

pp. 267, 268 Addition of 14.5 How to Read A/D Converter Characteristics Table
pp. 269, 270, 272, 273 14.6 A/D Converter Cautions
Change of description in (1) Power consumption in standby mode
Addition of (3) Conflict operations
Addition of (6) Input impedance of ANI0 to ANI7 pins
Addition of (10) Timing at which A/D conversion result is undefined
Addition of (11) Notes on board design
Addition of (12) AVREF0 pin
Addition of (13) Internal equivalent circuit of ANI0 to ANI7 pins and permissible signal
source impedance
p. 280 Addition of description of processing when D/A converter is not used in 15.5 D/A Converter
Cautions (3) AVREF1 pin

p. 379 Addition of 17.4.7 Restrictions in I2C bus mode 2

p. 468 Addition of 19.4.5 Restrictions in UART mode 2
p. 477 Addition of Caution when interrupt is acknowledged to Figure 21-2 Interrupt Request Flag
Register Format

p. 483 Addition of description on TI01/P01/INTP1 pin to Figure 21-5 Format of External Interrupt
Mode Register 0
p. 525 Addition of Caution to 25.1 ROM Correction Function
p. 535 Modification of Table 26-1 Differences Between µPD78F0058, 78F0058Y and Mask ROM
Versions

pp. 538 to 549 Total revision of description on flash memory programming as 26.3 Flash Memory
Characteristics
pp. 567 to 596 Addition of CHAPTER 28 ELECTRICAL SPECIFICATIONS (MASK ROM VERSION)
pp. 597 to 626 Addition of CHAPTER 29 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION)

pp. 627 to 657 Addition of CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION (VDD
= 2.2 V))
pp. 658, 659 Addition of CHAPTER 31 CHARACTERISTICS CURVES (REFERENCE VALUES)
pp. 660, 661 Addition of CHAPTER 32 PACKAGE DRAWINGS

pp. 662 to 665 Addition of CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS

pp. 666, 667 Correction of APPENDIX A DIFFERENCES BETWEEN µPD78054, 78058F, AND 780058
SUBSERIES
pp. 668 to 684 Total revision of APPENDIX B DEVELOPMENT TOOLS
Transfer of description of embedded software to APPENDIX B DEVELOPMENT TOOLS

The mark shows major revised points.

User's Manual U12013EJ3V2UD 7

 PREFACE

Readers This manual has been prepared for user engineers who wish to understand the
functions of the µPD780058 and 780058Y Subseries and design and develop its
application systems and programs.
This manual is intended for the products in the following subseries.

• µPD780058 Subseries
µPD780053, 780054, 780055, 780056, 780058, 780058B, 78F0058, 780053(A),
780054(A), 780055(A), 780056(A), 780058B(A)
• µPD780058Y Subseries
µPD780053Y, 780054Y, 780055Y, 780056Y, 780058BY, 78F0058Y, 780053Y(A),
780054Y(A), 780055Y(A), 780056Y(A), 780058BY(A)

These products are collectively referred to as the “µPD780058, 780058Y Subseries”

in this manual.

Purpose This manual is intended to give users an understanding of the functions described
in the organization below.

Organization The µPD780058, 780058Y Subseries manual is separated into two parts: this
manual and the instruction edition (common to the 78K/0 Series).

µPD780058, 780058Y 78K/0 Series

Subseries User’s Manual
User’s Manual
(This manual) Instructions

Pin functions CPU functions

Internal block functions Instruction set
Interrupts Explanation of each instruction
Other on-chip peripheral functions
Electrical specifications

8 User's Manual U12013EJ3V2UD

How to Read This Manual It is assumed that readers of this manual have general knowledge of electrical
engineering, logic circuits, and microcontrollers.

When using this manual as the manual for the µPD780053(A), 780054(A),
780055(A), 780056(A), 780058B(A), 780053Y(A), 780054Y(A), 780055Y(A),
780056Y(A), and 780058BY(A),
→ The only difference between these products and the µPD780053, 780054,
780055, 780056, 780058B, 780053Y, 780054Y, 780055Y, 780056Y, and
780058BY is the quality grade (see 1.9 Differences Between Standard
Model and (A) Model, and 2.9 Differences Between Standard Model and
(A) Model). The correspondence between the standard model and (A) model
is as follows in CHAPTER 6 PORT FUNCTIONS to CHAPTER 27 INSTRUC-
TION SET OUTLINE.
µPD780053 → µPD780053(A) µPD780053Y → µPD780053Y(A)
µPD780054 → µPD780054(A) µPD780054Y → µPD780054Y(A)
µPD780055 → µPD780055(A) µPD780055Y → µPD780055Y(A)
µPD780056 → µPD780056(A) µPD780056Y → µPD780056Y(A)
µPD780058B → µPD780058B(A) µPD780058BY → µPD780058BY(A)
To gain a general understanding the functions:
→ Read this manual in the order of the contents.
To know the µPD780058 and 780058Y Subseries instruction functions in detail:
→ Refer to the 78K/0 Series Instructions User’s Manual (U12326E)
How to interpret the register format:
→ For a bit number enclosed in angle brackets (<>), the bit name is defined as
a reserved word in the RA78K0, and defined in the header file named sfrbit.h
in the CC78K0.
To learn the function of a register whose register name is known:
→ Refer to APPENDIX C REGISTER INDEX.
To see application examples of each function of the µPD780058, 780058Y
Subseries:
→ Refer to 78K/0 Series Basics (III) Application Note (U10182E) separately
available.
To understand the electrical specifications of the µPD780058, 780058Y Subseries:
→ See CHAPTER 28 ELECTRICAL SPECIFICATIONS (MASK ROM VER-
SION), CHAPTER 29 ELECTRICAL SPECIFICATIONS (FLASH MEMORY
VERSION), CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY
VERSION (VDD = 2.2 V)).

Caution Examples in this manual employ the “standard” quality grade for
general electronics. When using examples in this manual for the
“special” quality grade, review the quality grade of each part and/or
circuit actually used.

User's Manual U12013EJ3V2UD 9

Chapter Organization: This manual divides the descriptions for the µPD780058 and 780058Y Subseries into
different chapters as shown below. Read only the chapters related to the device being used.

Chapter µ PD780058 µ PD780058Y

Subseries Subseries

CHAPTER 1 Outline ( µ PD780058 Subseries) √ —

CHAPTER 2 Outline ( µ PD780058Y Subseries) — √
CHAPTER 3 Pin Functions ( µ PD780058 Subseries) √ —
CHAPTER 4 Pin Functions ( µ PD780058Y Subseries) — √
CHAPTER 5 CPU Architecture √ √
CHAPTER 6 Port Functions √ √
CHAPTER 7 Clock Generator √ √
CHAPTER 8 16-Bit Timer/Event Counter √ √
CHAPTER 9 8-Bit Timer/Event Counter √ √
CHAPTER 10 Watch Timer √ √
CHAPTER 11 Watchdog Timer √ √
CHAPTER 12 Clock Output Controller √ √
CHAPTER 13 Buzzer Output Controller √ √
CHAPTER 14 A/D Converter √ √
CHAPTER 15 D/A Converter √ √
CHAPTER 16 Serial Interface Channel 0 ( µ PD780058 Subseries) √ —
CHAPTER 17 Serial Interface Channel 0 ( µ PD780058Y Subseries) — √
CHAPTER 18 Serial Interface Channel 1 √ √
CHAPTER 19 Serial Interface Channel 2 √ √
CHAPTER 20 Real-Time Output Port √ √
CHAPTER 21 Interrupt and Test Functions √ √
CHAPTER 22 External Device Expansion Function √ √
CHAPTER 23 Standby Function √ √
CHAPTER 24 Reset Function √ √
CHAPTER 25 ROM Correction √ √
CHAPTER 26 µ PD78F0058, µ PD78F0058Y √ √
CHAPTER 27 Outline of Instruction Set √ √
CHAPTER 28 ELECTRICAL SPECIFICATIONS (MASK ROM VERSION) √ √
CHAPTER 29 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION) √ √

CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION (VDD = 2.2 V)) √ √

CHAPTER 31 CHARACTERISTICS CURVES (REFERENCE VALUES) √ √
CHAPTER 32 PACKAGE DRAWINGS √ √

CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS √ √

10 User's Manual U12013EJ3V2UD

Differences Between µPD780058 and µPD780058Y Subseries:
The µPD780058 and µPD780058Y Subseries differ in the following functions of
serial interface channel 0.

Modes of serial interface channel 0 µPD780058 µPD780058Y

Subseries Subseries
3-wire serial I/O mode √ √
2-wire serial I/O mode √ √
SBI (serial bus interface) mode √ —
2
I C (inter IC) bus mode — √
√: Supported
—: Not supported

Legend Data significance: Higher digits on the left and lower digits on the right
Active low representations: ××× (overscore over pin or signal name)
Note: Footnote for item marked with Note in the text.
Caution: Information requiring particular attention
Remark: Supplementary information
Numeral representations: Binary ... ×××× or ××××B
Decimal ... ××××
Hexadecimal ... ××××H

Related Documents The related documents indicated in this publication may include preliminary
versions. However, preliminary versions are not marked as such.

Documents Related to Devices

Document Name Document No.

µPD780058, 780058Y Subseries User's Manual This manual

78K/0 Series Instruction User's Manual U12326E
78K/0 Series Basics (III) Application Note U10182E

Caution The related documents listed above are subject to change without notice. Be sure to use the
latest version of each document for designing.

User's Manual U12013EJ3V2UD 11

Documents Related to Software Development Tools (User’s Manuals)

Document Name Document No.

RA78K0 Assember Package Operation U14445E

Language U14446E
Structure Assembly Language U11789E
CC78K0 C Compiler Operation U14297E
Language U14298E
SM78K Series System Simulator Ver. 2.30 or Later Operation (WindowsTM Based) U15373E
External Part User Open Interface Specification U15802E
ID78K Series Integrated Debugger Ver. 2.30 or Later Operation (Windows Based) U15185E
RX78K0 Real-Time OS Fundamentals U11537E
Installation U11536E
Project Manager Ver. 3.12 or Later (Windows Based) U14610E

Documents Related to Hardware Development Tools (User’s Manuals)

Document Name Document No.

IE-78K0-NS In-Circuit Emulator U13731E
IE-78K0-NS-A In-Circuit Emulator U14889E
IE-780308-NS-EM1 Emulation Board U13304E
IE-78001-R-A In-Circuit Emulator U14142E
IE-780308-R-EM Emulation Board U11362E

Documents Related to Flash Memory Writing

Document Name Document No.

PG-FP3 Flash Memory Programmer User’s Manual U13502E
PG-FP4 Flash Memory Programmer User’s Manual U15260E

Other Related Documents

Document Name Document No.

SEMICONDUCTOR SELECTION GUIDE - Products and Packages - X13769X
Semiconductor Device Mounting Technology Manual C10535E
Quality Grades on NEC Semiconductor Devices C11531E
NEC Semiconductor Device Reliability/Quality Control System C10983E
Guide to Prevent Damage for Semiconductor Devices by Electrostatic Discharge (ESD) C11892E

Caution The related documents listed above are subject to change without notice. Be sure to use the
latest version of each document for designing.

12 User's Manual U12013EJ3V2UD

 CONTENTS

CHAPTER 1 OUTLINE (µPD780058 SUBSERIES) ......................................................................... 31

1.1 Features ................................................................................................................................ 31
1.2 Applications ......................................................................................................................... 32
1.3 Ordering Information .......................................................................................................... 32
1.4 Pin Configuration (Top View) ............................................................................................. 33
1.5 78K/0 Series Lineup ............................................................................................................ 35
1.6 Block Diagram ..................................................................................................................... 37
1.7 Outline of Function ............................................................................................................. 38
1.8 Mask Options ....................................................................................................................... 40
1.9 Differences Between Standard Model and (A) Model .................................................... 40

CHAPTER 2 OUTLINE (µPD780058Y SUBSERIES) ....................................................................... 41

2.1 Features ................................................................................................................................ 41
2.2 Applications ......................................................................................................................... 42
2.3 Ordering Information .......................................................................................................... 42
2.4 Pin Configuration (Top View) ............................................................................................. 43
2.5 78K/0 Series Lineup ............................................................................................................ 45
2.6 Block Diagram ..................................................................................................................... 47
2.7 Outline of Functions ........................................................................................................... 48
2.8 Mask Options ....................................................................................................................... 50
2.9 Differences Between Standard Model and (A) Model .................................................... 50

CHAPTER 3 PIN FUNCTIONS (µPD780058 SUBSERIES) ............................................................. 51

3.1 Pin Function List ................................................................................................................. 51
3.2 Description of Pin Functions ............................................................................................ 55
3.2.1 P00 to P05, P07 (Port 0) ........................................................................................................ 55
3.2.2 P10 to P17 (Port 1) ................................................................................................................. 55
3.2.3 P20 to P27 (Port 2) ................................................................................................................. 56
3.2.4 P30 to P37 (Port 3) ................................................................................................................. 57
3.2.5 P40 to P47 (Port 4) ................................................................................................................. 57
3.2.6 P50 to P57 (Port 5) ................................................................................................................. 58
3.2.7 P60 to P67 (Port 6) ................................................................................................................. 58
3.2.8 P70 to P72 (Port 7) ................................................................................................................. 59
3.2.9 P120 to P127 (Port 12) ........................................................................................................... 59
3.2.10 P130 and P131 (Port 13) ........................................................................................................ 60
3.2.11 AVREF0 ...................................................................................................................................... 60
3.2.12 AVREF1 ...................................................................................................................................... 60
3.2.13 AVSS ......................................................................................................................................... 60
3.2.14 RESET ..................................................................................................................................... 60
3.2.15 X1 and X2 ................................................................................................................................ 60
3.2.16 XT1 and XT2 ........................................................................................................................... 60
3.2.17 VDD0, VDD1 ................................................................................................................................ 60
3.2.18 VSS0, VSS1 ................................................................................................................................. 61
3.2.19 VPP (Flash memory version only) ........................................................................................... 61
3.2.20 IC (Mask ROM version only) .................................................................................................. 61
3.3 I/O Circuits and Recommended Connection of Unused Pins....................................... 62

User's Manual U12013EJ3V2UD 13

CHAPTER 4 PIN FUNCTIONS (µPD780058Y SUBSERIES) .......................................................... 66
4.1 Pin Function List ................................................................................................................. 66
4.2 Description of Pin Functions ............................................................................................ 70
4.2.1 P00 to P05, P07 (Port 0) ........................................................................................................ 70
4.2.2 P10 to P17 (Port 1) ................................................................................................................. 71
4.2.3 P20 to P27 (Port 2) ................................................................................................................. 71
4.2.4 P30 to P37 (Port 3) ................................................................................................................. 72
4.2.5 P40 to P47 (Port 4) ................................................................................................................. 73
4.2.6 P50 to P57 (Port 5) ................................................................................................................. 73
4.2.7 P60 to P67 (Port 6) ................................................................................................................. 73
4.2.8 P70 to P72 (Port 7) ................................................................................................................. 74
4.2.9 P120 to P127 (Port 12) ........................................................................................................... 74
4.2.10 P130 and P131 (Port 13) ....................................................................................................... 75
4.2.11 AVREF0 ...................................................................................................................................... 75
4.2.12 AVREF1 ...................................................................................................................................... 75
4.2.13 AVSS ......................................................................................................................................... 75
4.2.14 RESET ..................................................................................................................................... 75
4.2.15 X1 and X2 ................................................................................................................................ 75
4.2.16 XT1 and XT2 ........................................................................................................................... 75
4.2.17 VDD0, VDD1 ................................................................................................................................ 75
4.2.18 VSS0, VSS1 ................................................................................................................................. 76
4.2.19 VPP (Flash memory version only) ........................................................................................... 76
4.2.20 IC (Mask ROM version only) .................................................................................................. 76
4.3 I/O Circuits and Recommended Connection of Unused Pins....................................... 77

CHAPTER 5 CPU ARCHITECTURE ................................................................................................. 81

5.1 Memory Spaces ................................................................................................................... 81
5.1.1 Internal program memory space .............................................................................................. 87
5.1.2 Internal data memory space .................................................................................................... 89
5.1.3 Special Function Register (SFR) area .................................................................................... 89
5.1.4 External memory space ........................................................................................................... 89
5.1.5 Data memory addressing ......................................................................................................... 89
5.2 Processor Registers ........................................................................................................... 96
5.2.1 Control registers ....................................................................................................................... 96
5.2.2 General registers ...................................................................................................................... 99
5.2.3 Special-Function Registers (SFRs) ......................................................................................... 100
5.3 Instruction Address Addressing ....................................................................................... 104
5.3.1 Relative addressing .................................................................................................................. 104
5.3.2 Immediate addressing .............................................................................................................. 105
5.3.3 Table indirect addressing ......................................................................................................... 106
5.3.4 Register addressing ................................................................................................................. 107
5.4 Operand Address Addressing ........................................................................................... 108
5.4.1 Implied addressing ................................................................................................................... 108
5.4.2 Register addressing ................................................................................................................. 109
5.4.3 Direct addressing ..................................................................................................................... 110
5.4.4 Short direct addressing ............................................................................................................ 111
5.4.5 Special-Function Register (SFR) addressing .......................................................................... 113
5.4.6 Register indirect addressing .................................................................................................... 114
5.4.7 Based addressing ..................................................................................................................... 115

14 User's Manual U12013EJ3V2UD

 5.4.8 Based indexed addressing ....................................................................................................... 116
5.4.9 Stack addressing ...................................................................................................................... 116

CHAPTER 6 PORT FUNCTIONS ...................................................................................................... 117

6.1 Port Functions ..................................................................................................................... 117
6.2 Port Configuration .............................................................................................................. 122
6.2.1 Port 0 ....................................................................................................................................... 122
6.2.2 Port 1 ....................................................................................................................................... 124
6.2.3 Port 2 (µPD780058 Subseries) .............................................................................................. 125
6.2.4 Port 2 (µPD780058Y Subseries) ............................................................................................ 127
6.2.5 Port 3 ....................................................................................................................................... 129
6.2.6 Port 4 ....................................................................................................................................... 130
6.2.7 Port 5 ....................................................................................................................................... 131
6.2.8 Port 6 ....................................................................................................................................... 132
6.2.9 Port 7 ....................................................................................................................................... 134
6.2.10 Port 12 ..................................................................................................................................... 136
6.2.11 Port 13 ..................................................................................................................................... 137
6.3 Port Function Control Registers ....................................................................................... 138
6.4 Port Operations ................................................................................................................... 144
6.4.1 Writing to I/O port ..................................................................................................................... 144
6.4.2 Reading from I/O port .............................................................................................................. 144
6.4.3 Operations on I/O port ............................................................................................................. 144
6.5 Selection of Mask Option ................................................................................................... 145

CHAPTER 7 CLOCK GENERATOR .................................................................................................. 146

7.1 Clock Generator Functions ................................................................................................ 146
7.2 Clock Generator Configuration ......................................................................................... 146
7.3 Clock Generator Control Registers .................................................................................. 148
7.4 System Clock Oscillator ..................................................................................................... 152
7.4.1 Main system clock oscillator .................................................................................................... 152
7.4.2 Subsystem clock oscillator ....................................................................................................... 153
7.4.3 Example of resonator with bad connection ............................................................................. 154
7.4.4 Divider ....................................................................................................................................... 155
7.4.5 When not using subsystem clock ............................................................................................ 155
7.5 Clock Generator Operations .............................................................................................. 156
7.5.1 Main system clock operations .................................................................................................. 157
7.5.2 Subsystem clock operations .................................................................................................... 158
7.6 Changing System Clock and CPU Clock Settings ......................................................... 159
7.6.1 Time required for switchover between system clock and CPU clock ..................................... 159
7.6.2 System clock and CPU clock switching procedure ................................................................. 161

CHAPTER 8 16-BIT TIMER/EVENT COUNTER ............................................................................... 162

8.1 16-Bit Timer/Event Counter Functions ............................................................................. 162
8.2 16-Bit Timer/Event Counter Configuration ...................................................................... 164
8.3 16-Bit Timer/Event Counter Control Registers ............................................................... 169
8.4 16-Bit Timer/Event Counter Operations ........................................................................... 179
8.4.1 Interval timer operations .......................................................................................................... 179
8.4.2 PWM output operations ............................................................................................................ 181
8.4.3 PPG output operations ............................................................................................................. 184
8.4.4 Pulse width measurement operations ..................................................................................... 186

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 8.4.5 External event counter operation ............................................................................................. 193
8.4.6 Square-wave output operation ................................................................................................. 195
8.4.7 One-shot pulse output operation ............................................................................................. 197
8.5 16-Bit Timer/Event Counter Operating Cautions ............................................................ 201

CHAPTER 9 8-BIT TIMER/EVENT COUNTER ................................................................................. 205

9.1 8-Bit Timer/Event Counter Functions ............................................................................... 205
9.1.1 8-bit timer/event counter mode ................................................................................................ 205
9.1.2 16-bit timer/event counter mode .............................................................................................. 208
9.2 8-Bit Timer/Event Counter Configuration ........................................................................ 210
9.3 8-Bit Timer/Event Counter Control Registers .................................................................. 214
9.4 Operations of 8-Bit Timer/Event Counters 1 and 2 ........................................................ 219
9.4.1 8-bit timer/event counter mode ................................................................................................ 219
9.4.2 16-bit timer/event counter mode .............................................................................................. 225
9.5 Cautions on 8-Bit Timer/Event Counters 1 and 2 ........................................................... 230

CHAPTER 10 WATCH TIMER ............................................................................................................ 232

10.1 Watch Timer Functions ..................................................................................................... 232
10.2 Watch Timer Configuration .............................................................................................. 233
10.3 Watch Timer Control Registers ........................................................................................ 233
10.4 Watch Timer Operations ................................................................................................... 237
10.4.1 Watch timer operation ............................................................................................................ 237
10.4.2 Interval timer operation .......................................................................................................... 237

CHAPTER 11 WATCHDOG TIMER ................................................................................................... 238

11.1 Watchdog Timer Functions .............................................................................................. 238
11.2 Watchdog Timer Configuration ........................................................................................ 240
11.3 Watchdog Timer Control Registers ................................................................................. 241
11.4 Watchdog Timer Operations ............................................................................................ 244
11.4.1 Watchdog timer operation ...................................................................................................... 244
11.4.2 Interval timer operation .......................................................................................................... 245

CHAPTER 12 CLOCK OUTPUT CONTROLLER ............................................................................. 246

12.1 Clock Output Controller Functions ................................................................................ 246
12.2 Clock Output Controller Configuration .......................................................................... 247
12.3 Clock Output Function Control Registers ..................................................................... 247

CHAPTER 13 BUZZER OUTPUT CONTROLLER ........................................................................... 250

13.1 Buzzer Output Controller Functions .............................................................................. 250
13.2 Buzzer Output Controller Configuration ........................................................................ 250
13.3 Buzzer Output Function Control Registers ................................................................... 251

CHAPTER 14 A/D CONVERTER ...................................................................................................... 254

14.1 A/D Converter Functions ................................................................................................. 254
14.2 A/D Converter Configuration ........................................................................................... 254
14.3 A/D Converter Control Registers .................................................................................... 258
14.4 A/D Converter Operations ................................................................................................ 262
14.4.1 Basic operations of A/D converter ......................................................................................... 262
14.4.2 Input voltage and conversion results ..................................................................................... 264
14.4.3 A/D converter operating mode ............................................................................................... 265

16 User's Manual U12013EJ3V2UD

 14.5 How to Read the A/D Converter Characteristics Table ................................................ 267
14.6 A/D Converter Cautions ................................................................................................... 269

CHAPTER 15 D/A CONVERTER ...................................................................................................... 275

15.1 D/A Converter Functions ................................................................................................. 275
15.2 D/A Converter Configuration ........................................................................................... 276
15.3 D/A Converter Control Registers .................................................................................... 278
15.4 D/A Converter Operations ................................................................................................ 279
15.5 D/A Converter Cautions ................................................................................................... 280

CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES) .............................. 281

16.1 Functions of Serial Interface Channel 0 ........................................................................ 282
16.2 Configuration of Serial Interface Channel 0 ................................................................. 284
16.3 Control Registers of Serial Interface Channel 0 ........................................................... 288
16.4 Operations of Serial Interface Channel 0 ...................................................................... 295
16.4.1 Operation stop mode .............................................................................................................. 295
16.4.2 3-wire serial I/O mode operation ........................................................................................... 296
16.4.3 SBI mode operation ............................................................................................................... 301
16.4.4 2-wire serial I/O mode operation ........................................................................................... 327
16.4.5 SCK0/P27 pin output manipulation ....................................................................................... 332

CHAPTER 17 SERIAL INTERFACE CHANNEL 0 (µPD780058Y SUBSERIES) ........................... 333

17.1 Functions of Serial Interface Channel 0 ........................................................................ 334
17.2 Configuration of Serial Interface Channel 0 ................................................................. 336
17.3 Control Registers of Serial Interface Channel 0 ........................................................... 340
17.4 Operations of Serial Interface Channel 0 ...................................................................... 347
17.4.1 Operation stop mode .............................................................................................................. 347
17.4.2 3-wire serial I/O mode operation ........................................................................................... 348
17.4.3 2-wire serial I/O mode operation ........................................................................................... 352
17.4.4 I 2C bus mode operation ......................................................................................................... 357
17.4.5 Cautions on use of I2C bus mode ......................................................................................... 374
17.4.6 Restrictions in I2C bus mode 1 .............................................................................................. 377
17.4.7 Restrictions in I2C bus mode 2 .............................................................................................. 379
17.4.8 SCK0/SCL/P27 pin output manipulation ............................................................................... 380

CHAPTER 18 SERIAL INTERFACE CHANNEL 1 ........................................................................... 382

18.1 Functions of Serial Interface Channel 1 ........................................................................ 382
18.2 Configuration of Serial Interface Channel 1 ................................................................. 383
18.3 Control Registers of Serial Interface Channel 1 ........................................................... 386
18.4 Operations of Serial Interface Channel 1 ...................................................................... 394
18.4.1 Operation stop mode .............................................................................................................. 394
18.4.2 3-wire serial I/O mode operation ........................................................................................... 395
18.4.3 3-wire serial I/O mode operation with automatic transmit/receive function ......................... 398

CHAPTER 19 SERIAL INTERFACE CHANNEL 2 ........................................................................... 427

19.1 Functions of Serial Interface Channel 2 ........................................................................ 427
19.2 Configuration of Serial Interface Channel 2 ................................................................. 428
19.3 Control Registers of Serial Interface Channel 2 ........................................................... 432
19.4 Operation of Serial Interface Channel 2 ........................................................................ 442
19.4.1 Operation stop mode .............................................................................................................. 442

User's Manual U12013EJ3V2UD 17

 19.4.2 Asynchronous serial interface (UART) mode (with time-division transfer function) ............ 444
19.4.3 3-wire serial I/O mode ............................................................................................................ 458
19.4.4 Restrictions in UART mode 1 ................................................................................................ 465
19.4.5 Restrictions in UART mode 2 ................................................................................................ 468

CHAPTER 20 REAL-TIME OUTPUT PORT ..................................................................................... 469

20.1 Real-Time Output Port Functions ................................................................................... 469
20.2 Real-Time Output Port Configuration ............................................................................ 470
20.3 Real-Time Output Port Control Registers ...................................................................... 472

CHAPTER 21 INTERRUPT AND TEST FUNCTIONS ...................................................................... 474

21.1 Interrupt Function Types .................................................................................................. 474
21.2 Interrupt Sources and Configuration ............................................................................. 475
21.3 Interrupt Function Control Registers ............................................................................. 479
21.4 Interrupt Servicing Operations ....................................................................................... 488
21.4.1 Non-maskable interrupt request acknowledgment operation ............................................... 488
21.4.2 Maskable interrupt request acknowledgment operation ....................................................... 491
21.4.3 Software interrupt request acknowledgment operation ........................................................ 494
21.4.4 Multiple interrupt servicing ..................................................................................................... 494
21.4.5 Interrupt request pending ....................................................................................................... 497
21.5 Test Function ..................................................................................................................... 498
21.5.1 Registers controlling test function ......................................................................................... 498
21.5.2 Test input signal acknowledgment operation ........................................................................ 500

CHAPTER 22 EXTERNAL DEVICE EXPANSION FUNCTION ....................................................... 501

22.1 External Device Expansion Function ............................................................................. 501
22.2 External Device Expansion Function Control Register ............................................... 505
22.3 External Device Expansion Function Timing ................................................................ 507
22.4 Example of Connection with Memory ............................................................................ 512

CHAPTER 23 STANDBY FUNCTION .............................................................................................. 513

23.1 Standby Function and Configuration ............................................................................. 513
23.1.1 Standby function ..................................................................................................................... 513
23.1.2 Standby function control register ........................................................................................... 514
23.2 Standby Function Operations ......................................................................................... 515
23.2.1 HALT mode ............................................................................................................................. 515
23.2.2 STOP mode ............................................................................................................................ 518

CHAPTER 24 RESET FUNCTION .................................................................................................... 521

24.1 Reset Function .................................................................................................................. 521

CHAPTER 25 ROM CORRECTION ................................................................................................. 525

25.1 ROM Correction Function ................................................................................................ 525
25.2 ROM Correction Configuration ....................................................................................... 525
25.3 ROM Correction Control Registers ................................................................................. 527
25.4 ROM Correction Application............................................................................................ 528
25.5 ROM Correction Usage Example .................................................................................... 531
25.6 Program Execution Flow .................................................................................................. 532
25.7 ROM Correction Cautions ................................................................................................ 534

18 User's Manual U12013EJ3V2UD

CHAPTER 26 µPD78F0058, 78F0058Y ............................................................................................ 535
26.1 Internal memory Size Switching Register ..................................................................... 536
26.2 Internal Expansion RAM Size Switching Register ....................................................... 537
26.3 Flash Memory Characteristics ........................................................................................ 538
26.3.1 Programming environment ..................................................................................................... 538
26.3.2 Communication mode ............................................................................................................ 539
26.3.3 On-board pin processing ........................................................................................................ 543
26.3.4 Connection of adapter for flash writing ................................................................................. 546

CHAPTER 27 INSTRUCTION SET OVERVIEW ............................................................................... 552

27.1 Conventions Used in Operation List .............................................................................. 553
27.1.1 Operand identifiers and description methods ....................................................................... 553
27.1.2 Description of operation column ............................................................................................ 554
27.1.3 Description of flag operation column ..................................................................................... 554
27.2 Operation List .................................................................................................................... 555
27.3 Instructions Listed by Addressing Type ........................................................................ 563

CHAPTER 28 ELECTRICAL SPECIFICATIONS (MASK ROM VERSION) .................................... 567

CHAPTER 29 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION) ........................... 597

CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION (VDD = 2.5 V)) .... 627

CHAPTER 31 CHARACTERISTICS CURVES (REFERENCE VALUES) .................................... 658

CHAPTER 32 PACKAGE DRAWINGS ............................................................................................. 660

CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS ..................................................... 662

APPENDIX A DIFFERENCES BETWEEN µPD78054, 78058F, AND 780058 SUBSERIES ......... 666

APPENDIX B DEVELOPMENT TOOLS ........................................................................................... 668

B.1 Software Package ............................................................................................................. 670
B.2 Language Processing Software ...................................................................................... 670
B.3 Control Software ............................................................................................................... 671
B.4 Flash Memory Writing Tools ............................................................................................ 671
B.5 Debugging Tools (Hardware) ........................................................................................... 672
B.5.1 When using in-circuit emulator IE-78K0-NS, IE-78K0-NS-A .................................................. 672
B.5.2 When using in-circuit emulator IE-78001-R-A ....................................................................... 673
B.6 Debugging Tools (Software) ............................................................................................ 674
B.7 Embedded Software ......................................................................................................... 675
B.8 System-Upgrade Method from Former In-Circuit Emulator for 78K/0 Series
to IE-78001-R-A ................................................................................................................. 676
B.9 Drawing and Footprint for Conversion Socket (EV-9200GC-80) ................................ 677
B.10 Drawing of Conversion Adapter (TGK-080SDW, TGC-080SBP) .................................. 679
B.11 Cautions on Designing Target System .......................................................................... 681

APPENDIX C REGISTER INDEX ..................................................................................................... 685

C.1 Register Index (Register Name) ....................................................................................... 685
C.2 Register Index (Symbol) .................................................................................................... 688

APPENDIX D REVISION HISTORY ................................................................................................. 691

User's Manual U12013EJ3V2UD 19

 LIST OF FIGURES (1/8)

Figure No. Title Page

3-1 Pin I/O Circuit List .................................................................................................................................... 64

4-1 Pin I/O Circuit List .................................................................................................................................... 79

5-1 Memory Map (µPD780053, 780053(A), 780053Y, 780053Y(A)) ........................................................... 81

5-2 Memory Map (µPD780054, 780054(A), 780054Y, 780054Y(A)) ........................................................... 82
5-3 Memory Map (µPD780055, 780055(A), 780055Y, 780055Y(A)) ........................................................... 83
5-4 Memory Map (µPD780056, 780056(A), 780056Y, 780056Y(A)) ........................................................... 84
5-5 Memory Map (µPD780058, 780058B, 780058B(A), 780058BY, 780058BY(A)) ................................... 85
5-6 Memory Map (µPD78F0058, 78F0058Y) ................................................................................................ 86
5-7 Data Memory Addressing (µPD780053, 780053(A), 780053Y, 780053Y(A)) ....................................... 90
5-8 Data Memory Addressing (µPD780054, 780054(A), 780054Y, 780054Y(A)) ....................................... 91
5-9 Data Memory Addressing (µPD780055, 780055(A), 780055Y, 780055Y(A)) ....................................... 92
5-10 Data Memory Addressing (µPD780056, 780056(A), 780056Y, 780056Y(A)) ....................................... 93
5-11 Data Memory Addressing (µPD780058, 780058B, 780058B(A), 780058BY, 780058BY(A)) ............... 94
5-12 Data Memory Addressing (µPD78F0058, 78F0058Y) ........................................................................... 95
5-13 Program Counter Format ......................................................................................................................... 96
5-14 Program Status Word Format .................................................................................................................. 96
5-15 Stack Pointer Format ............................................................................................................................... 98
5-16 Data to Be Saved to Stack Memory ........................................................................................................ 98
5-17 Data to Be Reset from Stack Memory .................................................................................................... 98
5-18 General-purpose Register Configuration ................................................................................................ 99

6-1 Port Types ............................................................................................................................................... 117

6-2 Block Diagram of P00 and P07 ............................................................................................................. 123
6-3 Block Diagram of P01 to P05 ................................................................................................................ 123
6-4 Block Diagram of P10 to P17 ................................................................................................................ 124
6-5 Block Diagram of P20, P21, and P23 to P26 ....................................................................................... 125
6-6 Block Diagram of P22 and P27 ............................................................................................................. 126
6-7 Block Diagram of P20, P21, and P23 to P26 ....................................................................................... 127
6-8 Block Diagram of P22 and P27 ............................................................................................................. 128
6-9 Block Diagram of P30 to P37 ................................................................................................................ 129
6-10 Block Diagram of P40 to P47 ................................................................................................................ 130
6-11 Block Diagram of Falling Edge Detector ............................................................................................... 130
6-12 Block Diagram of P50 to P57 ................................................................................................................ 131
6-13 Block Diagram of P60 to P63 ................................................................................................................ 133
6-14 Block Diagram of P64 to P67 ................................................................................................................ 133
6-15 Block Diagram of P70 ............................................................................................................................ 134
6-16 Block Diagram of P71 and P72 ............................................................................................................. 135
6-17 Block Diagram of P120 to P127 ............................................................................................................ 136
6-18 Block Diagram of P130 and P131 ......................................................................................................... 137
6-19 Port Mode Register Format ................................................................................................................... 140
6-20 Format of Pull-up Resistor Option Register .......................................................................................... 141
6-21 Format of Memory Expansion Mode Register ...................................................................................... 142

20 User's Manual U12013EJ3V2UD

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6-22 Format of Key Return Mode Register ................................................................................................... 143

7-1 Clock Generator Block Diagram ............................................................................................................ 147

7-2 Subsystem Clock Feedback Resistor ................................................................................................... 148
7-3 Format of Processor Clock Control Register ........................................................................................ 149
7-4 Format of Oscillation Mode Selection Register .................................................................................... 151
7-5 Main System Clock Waveform due to Writing to OSMS ...................................................................... 151
7-6 External Circuit of Main System Clock Oscillator ................................................................................. 152
7-7 External Circuit of Subsystem Clock Oscillator .................................................................................... 153
7-8 Examples of Resonator with Bad Connection ...................................................................................... 154
7-9 Main System Clock Stop Function ........................................................................................................ 157
7-10 Switching Between System Clock and CPU Clock .............................................................................. 161

8-1 Block Diagram of 16-Bit Timer/Event Counter ...................................................................................... 165

8-2 Block Diagram of 16-Bit Timer/Event Counter Output Controller ........................................................ 166
8-3 Format of Timer Clock Select Register 0 .............................................................................................. 170
8-4 Format of 16-Bit Timer Mode Control Register .................................................................................... 172
8-5 Format of Capture/Compare Control Register 0 .................................................................................. 173
8-6 Format of 16-Bit Timer Output Control Register .................................................................................. 175
8-7 Format of Port Mode Register 3 ............................................................................................................ 176
8-8 Format of External Interrupt Mode Register 0 ...................................................................................... 177
8-9 Format of Sampling Clock Select Register ........................................................................................... 178
8-10 Control Register Settings for Interval Timer Operation ........................................................................ 179
8-11 Interval Timer Configuration Diagram ................................................................................................... 180
8-12 Interval Timer Operation Timings .......................................................................................................... 180
8-13 Control Register Settings for PWM Output Operation ......................................................................... 182
8-14 Example of D/A Converter Configuration with PWM Output ............................................................... 183
8-15 TV Tuner Application Circuit Example ................................................................................................... 183
8-16 Control Register Settings for PPG Output Operation ........................................................................... 184
8-17 Configuration of PPG Output ................................................................................................................. 185
8-18 PPG Output Operation Timing ............................................................................................................... 185
8-19 Control Register Settings for Pulse Width Measurement with Free-Running Counter
and One Capture Register .................................................................................................................... 186
8-20 Configuration Diagram for Pulse Width Measurement by Free-Running Counter .............................. 187
8-21 Timing of Pulse Width Measurement Operation by Free-Running Counter
and One Capture Register (with Both Edges Specified) ..................................................................... 187
8-22 Control Register Settings for Two Pulse Width Measurements with Free-Running Counter .............. 188
8-23 Timing of Pulse Width Measurement Operation with Free-Running Counter
(with Both Edges Specified) .................................................................................................................. 189
8-24 Control Register Settings for Pulse Width Measurement with Free-Running Counter
and Two Capture Registers ................................................................................................................... 190
8-25 Timing of Pulse Width Measurement Operation by Free-Running Counter
and Two Capture Registers (with Rising Edge Specified) ................................................................... 191
8-26 Control Register Settings for Pulse Width Measurement by Means of Restart .................................. 192

User's Manual U12013EJ3V2UD 21

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8-27 Timing of Pulse Width Measurement Operation by Means of Restart

(with Rising Edge Specified) ................................................................................................................. 192
8-28 Control Register Settings in External Event Counter Mode ................................................................ 193
8-29 External Event Counter Configuration Diagram ................................................................................... 194
8-30 External Event Counter Operation Timing (with Rising Edge Specified) ............................................ 194
8-31 Control Register Settings in Square-Wave Output Mode .................................................................... 195
8-32 Square-Wave Output Operation Timing ................................................................................................ 196
8-33 Control Register Settings for One-Shot Pulse Output Operation Using Software Trigger .................. 197
8-34 One-Shot Pulse Output Operation Timing Using Software Trigger ..................................................... 198
8-35 Control Register Settings for One-Shot Pulse Output Operation Using External Trigger .................. 199
8-36 One-Shot Pulse Output Operation Timing Using External Trigger (with Rising Edge Specified) ...... 200
8-37 16-Bit Timer Register Start Timing ........................................................................................................ 201
8-38 Timing After Change of Compare Register During Timer Count Operation ....................................... 201
8-39 Capture Register Data Retention Timing .............................................................................................. 202
8-40 Operation Timing of OVF0 Flag ............................................................................................................ 203

9-1 Block Diagram of 8-Bit Timer/Event Counter ........................................................................................ 211

9-2 Block Diagram of 8-Bit Timer/Event Counter Output Controller 1 ....................................................... 212
9-3 Block Diagram of 8-Bit Timer/Event Counter Output Controller 2 ....................................................... 212
9-4 Format of Timer Clock Select Register 1 .............................................................................................. 215
9-5 Format of 8-Bit Timer Mode Control Register 1 ................................................................................... 216
9-6 Format of 8-Bit Timer Output Control Register ..................................................................................... 217
9-7 Format of Port Mode Register 3 ............................................................................................................ 218
9-8 Interval Timer Operation Timing ............................................................................................................ 219
9-9 External Event Counter Operation Timing (with Rising Edge Specified) ............................................ 222
9-10 Square-Wave Output Operation Timing ................................................................................................ 224
9-11 Interval Timer Operation Timing ............................................................................................................ 225
9-12 External Event Counter Operation Timing (with Rising Edge Specified) ............................................ 227
9-13 Square-Wave Output Operation Timing ................................................................................................ 229
9-14 Start Timing of 8-Bit Timer Registers 1 and 2 ...................................................................................... 230
9-15 External Event Counter Operation Timing ............................................................................................ 230
9-16 Timing After Compare Register Change During Timer Count Operation ............................................ 231

10-1 Watch Timer Block Diagram .................................................................................................................. 234

10-2 Format of Timer Clock Select Register 2 .............................................................................................. 235
10-3 Format of Watch Timer Mode Control Register .................................................................................... 236

11-1 Watchdog Timer Block Diagram ............................................................................................................ 240

11-2 Format of Timer Clock Select Register 2 .............................................................................................. 242
11-3 Format of Watchdog Timer Mode Register ........................................................................................... 243

12-1 Remote Controlled Output Application Example .................................................................................. 246

12-2 Clock Output Controller Block Diagram ................................................................................................ 247
12-3 Format of Timer Clock Select Register 0 .............................................................................................. 248

22 User's Manual U12013EJ3V2UD

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12-4 Format of Port Mode Register 3 ............................................................................................................ 249

13-1 Buzzer Output Controller Block Diagram .............................................................................................. 250

13-2 Format of Timer Clock Select Register 2 .............................................................................................. 252
13-3 Format of Port Mode Register 3 ............................................................................................................ 253

14-1 A/D Converter Block Diagram ............................................................................................................... 255

14-2 Format of A/D Converter Mode Register .............................................................................................. 259
14-3 Format of A/D Converter Input Select Register .................................................................................... 260
14-4 Format of External Interrupt Mode Register 1 ...................................................................................... 261
14-5 A/D Converter Basic Operation ............................................................................................................. 263
14-6 Relationship Between Analog Input Voltage and A/D Conversion Result ........................................... 264
14-7 A/D Conversion by Hardware Start ....................................................................................................... 265
14-8 A/D Conversion by Software Start ........................................................................................................ 266
14-9 Overall Error ........................................................................................................................................... 267
14-10 Quantization Error .................................................................................................................................. 267
14-11 Example of Method of Reducing Current Consumption in Standby Mode ......................................... 269
14-12 Analog Input Pin Handling ..................................................................................................................... 270
14-13 A/D Conversion End Interrupt Request Generation Timing ................................................................. 271
14-14 Timing of Reading Conversion Result (When Conversion Result is Undefined) ................................ 272
14-15 Timing of Reading Conversion Result (When Conversion Result is Normal) ..................................... 272
14-16 Example of Connecting Capacitor to AVREF0 Pin .................................................................................. 273
14-17 Internal Equivalent Circuit of Pins ANI0 to ANI7 .................................................................................. 274
14-18 Example of Connection If Signal Source Impedance Is High .............................................................. 274

15-1 D/A Converter Block Diagram ............................................................................................................... 276

15-2 Format of D/A Converter Mode Register .............................................................................................. 278
15-3 Use Example of Buffer Amplifier ........................................................................................................... 280

16-1 Serial Bus Interface (SBI) System Configuration Example .................................................................. 283
16-2 Block Diagram of Serial Interface Channel 0 ....................................................................................... 285
16-3 Format of Timer Clock Select Register 3 .............................................................................................. 289
16-4 Format of Serial Operating Mode Register 0 ....................................................................................... 290
16-5 Format of Serial Bus Interface Control Register .................................................................................. 292
16-6 Format of Interrupt Timing Specification Register ................................................................................ 294
16-7 3-Wire Serial I/O Mode Timing .............................................................................................................. 299
16-8 RELT and CMDT Operations ................................................................................................................. 299
16-9 Circuit for Switching Transfer Bit Order ................................................................................................. 300
16-10 Example of Serial Bus Configuration with SBI ..................................................................................... 301
16-11 SBI Transfer Timing ................................................................................................................................ 303
16-12 Bus Release Signal ............................................................................................................................... 304
16-13 Command Signal .................................................................................................................................... 304
16-14 Addresses ............................................................................................................................................... 305
16-15 Slave Selection by Address ................................................................................................................... 305

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Figure No. Title Page

16-16 Commands ............................................................................................................................................. 306

16-17 Data ........................................................................................................................................................ 306
16-18 Acknowledge Signal ............................................................................................................................... 307
16-19 BUSY and READY Signals .................................................................................................................... 308
16-20 RELT, CMDT, RELD, and CMDD Operations (Master) ......................................................................... 313
16-21 RELD and CMDD Operations (Slave) ................................................................................................... 313
16-22 ACKT Operation ..................................................................................................................................... 314
16-23 ACKE Operations ................................................................................................................................... 315
16-24 ACKD Operations ................................................................................................................................... 316
16-25 BSYE Operation ..................................................................................................................................... 316
16-26 Pin Configuration ................................................................................................................................... 319
16-27 Address Transmission from Master Device to Slave Device (WUP = 1) ............................................. 321
16-28 Command Transmission from Master Device to Slave Device ............................................................ 322
16-29 Data Transmission from Master Device to Slave Device ..................................................................... 323
16-30 Data Transmission from Slave Device to Master Device ..................................................................... 324
16-31 Serial Bus Configuration Example Using 2-Wire Serial I/O Mode ...................................................... 327
16-32 2-Wire Serial I/O Mode Timing .............................................................................................................. 330
16-33 RELT and CMDT Operations ................................................................................................................. 331
16-34 SCK0/P27 Pin Configuration ................................................................................................................. 332

17-1 Serial Bus Configuration Example Using I2C Bus ................................................................................ 335
17-2 Block Diagram of Serial Interface Channel 0 ....................................................................................... 337
17-3 Format of Timer Clock Select Register 3 .............................................................................................. 341
17-4 Format of Serial Operating Mode Register 0 ....................................................................................... 342
17-5 Format of Serial Bus Interface Control Register .................................................................................. 343
17-6 Format of Interrupt Timing Specification Register ................................................................................ 345
17-7 3-Wire Serial I/O Mode Timing .............................................................................................................. 350
17-8 RELT and CMDT Operations ................................................................................................................. 350
17-9 Circuit for Switching Transfer Bit Order ................................................................................................. 351
17-10 Serial Bus Configuration Example Using 2-Wire Serial I/O Mode ...................................................... 352
17-11 2-Wire Serial I/O Mode Timing .............................................................................................................. 355
17-12 RELT and CMDT Operations ................................................................................................................. 356
17-13 Example of Serial Bus Configuration Using I2C Bus ......................................................................... 357
17-14 I2C Bus Serial Data Transfer Timing ................................................................................................... 358
17-15 Start Condition .................................................................................................................................... 359
17-16 Address ............................................................................................................................................... 359
17-17 Transfer Direction Specification .......................................................................................................... 359
17-18 Acknowledge Signal ............................................................................................................................ 360
17-19 Stop Condition ..................................................................................................................................... 360
17-20 Wait Signal .......................................................................................................................................... 361
17-21 Pin Configuration ................................................................................................................................ 366
17-22 Data Transmission from Master to Slave (Both Master and Slave Selected 9-Clock Wait) ............ 368
17-23 Data Transmission from Slave to Master (Both Master and Slave Selected 9-Clock Wait) ............ 371
17-24 Start Condition Output ........................................................................................................................ 374

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17-25 Slave Wait Release (Transmission) .................................................................................................... 375

17-26 Slave Wait Release (Reception) ......................................................................................................... 376
17-27 SCK0/SCL/P27 Pin Configuration ...................................................................................................... 380
17-28 SCK0/SCL/P27 Pin Configuration ...................................................................................................... 380
17-29 Logic Circuit of SCL Signal ................................................................................................................ 381

18-1 Block Diagram of Serial Interface Channel 1 ....................................................................................... 384

18-2 Format of Timer Clock Select Register 3 .............................................................................................. 387
18-3 Format of Serial Operation Mode Register 1 ....................................................................................... 388
18-4 Format of Automatic Data Transmit/Receive Control Register ............................................................ 389
18-5 Format of Automatic Data Transmit/Receive Interval Specification Register ...................................... 390
18-6 3-Wire Serial I/O Mode Timing .............................................................................................................. 396
18-7 Circuit for Switching Transfer Bit Order ................................................................................................. 397
18-8 Basic Transmission/Reception Mode Operation Timing ....................................................................... 406
18-9 Basic Transmission/Reception Mode Flowchart ................................................................................... 407
18-10 Internal Buffer RAM Operation in 6-Byte Transmission/Reception
(in Basic Transmit/Receive Mode) ......................................................................................................... 408
18-11 Basic Transmission Mode Operation Timing ......................................................................................... 410
18-12 Basic Transmission Mode Flowchart ..................................................................................................... 411
18-13 Internal Buffer RAM Operation in 6-Byte Transmission (in Basic Transmit Mode) ............................. 412
18-14 Repeat Transmission Mode Operation Timing ...................................................................................... 414
18-15 Repeat Transmission Mode Flowchart .................................................................................................. 415
18-16 Internal Buffer RAM Operation in 6-Byte Transmission (in Repeat Transmit Mode) ........................... 416
18-17 Automatic Transmission/Reception Suspension and Restart .............................................................. 418
18-18 System Configuration When Busy Control Option Is Used .................................................................. 419
18-19 Operation Timing When Busy Control Option Is Used (When BUSY0 = 0) ........................................ 420
18-20 Busy Signal and Wait Release (When BUSY0 = 0) ............................................................................. 421
18-21 Operation Timing When Busy & Strobe Control Options Are Used (When BUSY0 = 0) .................... 422
18-22 Operation Timing of Bit Shift Detection Function by Busy Signal (When BUSY0 = 1) ...................... 423
18-23 Automatic Data Transmit/Receive Interval Time ................................................................................... 424
18-24 Operation Timing with Automatic Data Transmit/Receive Function Performed Using
Internal Clock ......................................................................................................................................... 425

19-1 Block Diagram of Serial Interface Channel 2 ....................................................................................... 429

19-2 Baud Rate Generator Block Diagram ................................................................................................... 430
19-3 Format of Serial Operating Mode Register 2 ....................................................................................... 432
19-4 Format of Asynchronous Serial Interface Mode Register .................................................................... 433
19-5 Format of Asynchronous Serial Interface Status Register ................................................................... 436
19-6 Format of Baud Rate Generator Control Register ................................................................................ 437
19-7 Format of Serial Interface Pin Select Register ..................................................................................... 441
19-8 Format of Asynchronous Serial Interface Transmit/Receive Data ....................................................... 452
19-9 Asynchronous Serial Interface Transmission Completion Interrupt Request Generation Timing ....... 454
19-10 Asynchronous Serial Interface Reception Completion Interrupt Request Generation Timing ........... 455
19-11 Receive Error Timing ............................................................................................................................. 456

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19-12 Status of Receive Buffer Register (RXB) and Generation of Interrupt Request (INTSR)
When Reception Is Stopped .................................................................................................................. 457
19-13 3-Wire Serial I/O Mode Timing .............................................................................................................. 463
19-14 Circuit for Switching Transfer Bit Order ................................................................................................. 464
19-15 Reception Completion Interrupt Request Generation Timing (When ISRM = 1) ................................ 465
19-16 Receive Buffer Register Read Disable Period ...................................................................................... 466
19-17 P23 Output Selector .............................................................................................................................. 468

20-1 Real-Time Output Port Block Diagram .................................................................................................. 470

20-2 Real-Time Output Buffer Register Configuration .................................................................................. 471
20-3 Format of Port Mode Register 12 .......................................................................................................... 472
20-4 Format of Real-Time Output Port Mode Register ................................................................................ 472
20-5 Format of Real-Time Output Port Control Register .............................................................................. 473

21-1 Basic Configuration of Interrupt Function ............................................................................................. 477

21-2 Format of Interrupt Request Flag Register ........................................................................................... 480
21-3 Interrupt Mask Flag Register Format .................................................................................................... 481
21-4 Format of Priority Specification Flag Register ...................................................................................... 482
21-5 Format of External Interrupt Mode Register 0 ...................................................................................... 483
21-6 Format of External Interrupt Mode Register 1 ...................................................................................... 484
21-7 Format of Sampling Clock Select Register ........................................................................................... 485
21-8 Noise Eliminator I/O Timing (During Rising Edge Detection) .............................................................. 486
21-9 Format of Program Status Word ........................................................................................................... 487
21-10 Non-Maskable Interrupt Request Occurrence and Acknowledgment Flowchart ................................ 489
21-11 Non-Maskable Interrupt Request Acknowledgment Timing ................................................................. 489
21-12 Non-Maskable Interrupt Request Acknowledgment Operation ............................................................ 490
21-13 Interrupt Request Acknowledgment Processing Algorithm .................................................................. 492
21-14 Interrupt Request Acknowledgment Timing (Minimum Time) .............................................................. 493
21-15 Interrupt Request Acknowledgment Timing (Maximum Time) ............................................................. 493
21-16 Multiple Interrupt Servicing Example .................................................................................................... 495
21-17 Interrupt Request Pending Timing ......................................................................................................... 497
21-18 Basic Configuration of Test Function .................................................................................................... 498
21-19 Format of Interrupt Request Flag Register 1L ...................................................................................... 499
21-20 Format of Interrupt Mask Flag Register 1L .......................................................................................... 499
21-21 Format of Key Return Mode Register ................................................................................................... 500

22-1 Memory Map When Using External Device Expansion Function ........................................................ 502
22-2 Format of Memory Expansion Mode Register ...................................................................................... 505
22-3 Format of Internal Memory Size Switching Register ............................................................................ 506
22-4 Instruction Fetch from External Memory ............................................................................................... 508
22-5 External Memory Read Timing .............................................................................................................. 509
22-6 External Memory Write Timing .............................................................................................................. 510
22-7 External Memory Read Modify Write Timing ........................................................................................ 511
22-8 Example of Connection Between µPD780054 and Memory ................................................................ 512

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23-1 Format of Oscillation Stabilizat Time Selection Register ..................................................................... 514

23-2 HALT Mode Release by Interrupt Request Generation ........................................................................ 516
23-3 HALT Mode Release by RESET Input .................................................................................................. 517
23-4 STOP Mode Release by Interrupt Request Generation ....................................................................... 519
23-5 STOP Mode Release by RESET Input ................................................................................................. 520

24-1 Reset Function Block Diagram .............................................................................................................. 521

24-2 Reset Timing by RESET Input .............................................................................................................. 522
24-3 Reset Timing due to Watchdog Timer Overflow ................................................................................... 522
24-4 Reset Timing by RESET Input in STOP Mode ..................................................................................... 522

25-1 ROM Correction Block Diagram ............................................................................................................ 525

25-2 Format of Correction Address Registers 0 and 1 ................................................................................. 526
25-3 Format of Correction Control Register .................................................................................................. 527
25-4 Example of Storing to EEPROM (When One Place Is Corrected) ...................................................... 528
25-5 Initialization Routine ............................................................................................................................... 529
25-6 ROM Correction Operation .................................................................................................................... 530
25-7 ROM Correction Usage Example .......................................................................................................... 531
25-8 Program Transition Diagram (When One Place Is Corrected) ............................................................. 532
25-9 Program Transition Diagram (When Two Places Are Corrected) ......................................................... 533

26-1 Format of Memory Size Switching Register ......................................................................................... 536

26-2 Format of Internal Expansion RAM Size Switching Register .............................................................. 537
23-3 Environment for Writing Program to Flash Memory ............................................................................. 538
26-4 Communication Mode Selection Format ............................................................................................... 539
26-5 Example of Connection with Dedicated Flash Programmer ................................................................ 540
26-6 VPP Pin Connection Example ................................................................................................................ 543
26-7 Signal Conflict (Input Pin of Serial Interface) ....................................................................................... 544
26-8 Abnormal Operation of Other Device .................................................................................................... 544
26-9 Signal Conflict (RESET Pin) .................................................................................................................. 545
26-10 Wiring Example for Flash Writing Adapter in 3-Wire Serial I/O Mode (SIO ch-0) .............................. 546
26-11 Wiring Example for Flash Writing Adapter in 3-Wire Serial I/O Mode (SIO ch-1) .............................. 547
26-12 Wiring Example for Flash Writing Adapter in 3-Wire Serial I/O Mode (SIO ch-2) .............................. 548
26-13 Wiring Example for Flash Writing Adapter in UART Mode (UART ch-0) ............................................. 549
26-14 Wiring Example for Flash Writing Adapter in UART Mode (UART ch-1) ............................................. 550
26-15 Wiring Example for Flash Writing Adapter in Pseudo 3-Wire Mode.................................................... 551

B-1 Configuration of Development Tools ..................................................................................................... 669

B-2 EV-9200GC-80 Drawing (For Reference Only) ..................................................................................... 677
B-3 EV-9200GC-80 Footprint (For Reference Only) ................................................................................... 678
B-4 TGK-080SDW Drawing (For Reference Only) (Unit: mm) .................................................................... 679
B-5 TGC-080SBP Drawing (For Reference Only) (Unit: mm) ................................................................... 680
B-6 Distance Between In-Circuit Emulator and Conversion Socket (80GC) .............................................. 681
B-7 Connection Condition of Target System (NP-80GC-TQ) ...................................................................... 682
B-8 Distance Between In-Circuit Emulator and Conversion Socket (80GK) .............................................. 683
B-9 Connection Condition of Target System (NP-80GK) ............................................................................ 684

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1-1 Mask Options of Mask ROM Versions .................................................................................................... 40

1-2 Differences Between Standard Model and (A) Model ............................................................................ 40

2-1 Mask Options of Mask ROM Versions .................................................................................................... 50

2-2 Differences Between Standard Model and (A) Model ............................................................................ 50

3-1 Pin I/O Circuit Types ................................................................................................................................ 62

4-1 Pin I/O Circuit Types ................................................................................................................................ 77

5-1 Vector ........................................................................................................................................................ 88

5-2 Special-Function Register List .............................................................................................................. 101

6-1 Port Functions (µPD780058 Subseries) ............................................................................................... 118

6-2 Port Functions (µPD780058Y Subseries) ............................................................................................. 120
6-3 Port Configuration .................................................................................................................................. 122
6-4 Pull-up Resistor of Port 6 ...................................................................................................................... 132
6-5 Port Mode Register and Output Latch Settings When Using Alternate Functions ............................. 139
6-6 Comparison Between Mask ROM Version and Flash Memory Version .............................................. 145

7-1 Clock Generator Configuration .............................................................................................................. 146

7-2 Relationship Between CPU Clock and Minimum Instruction Execution Time ..................................... 150
7-3 Maximum Time Required for CPU Clock Switchover ........................................................................... 160

8-1 16-Bit Timer/Event Counter Interval Times ........................................................................................... 162

8-2 16-Bit Timer/Event Counter Square-Wave Output Ranges .................................................................. 163
8-3 16-Bit Timer/Event Counter Configuration ............................................................................................ 164
8-4 INTP0/TI00 Pin Valid Edge and CR00 Capture Trigger Valid Edge ..................................................... 167
8-5 INTP1/TI01 Pin Valid Edge and CR00 Capture Trigger Valid Edge ..................................................... 167
8-6 INTP0/TI00 Pin Valid Edge and CR01 Capture Trigger Valid Edge ..................................................... 168
8-7 16-Bit Timer/Event Counter Interval Times ........................................................................................... 181
8-8 16-Bit Timer/Event Counter Square-Wave Output Ranges .................................................................. 196

9-1 Interval Times of 8-Bit Timer/Event Counters 1 and 2 ......................................................................... 206

9-2 Square-Wave Output Ranges of 8-Bit Timer/Event Counters 1 and 2 ................................................ 207
9-3 Interval Times When 8-Bit Timer/Event Counters 1 and 2 Are Used as
16-Bit Timer/Event Counter ................................................................................................................... 208
9-4 Square-Wave Output Ranges When 8-Bit Timer/Event Counters 1 and 2
Are Used as 16-Bit Timer/Event Counter ............................................................................................. 209
9-5 8-Bit Timer/Event Counter Configuration .............................................................................................. 210
9-6 Interval Time of 8-Bit Timer/Event Counter 1 ....................................................................................... 220
9-7 Interval Time of 8-Bit Timer/Event Counter 2 ....................................................................................... 221
9-8 Square-Wave Output Ranges of 8-Bit Timer/Event Counters 1 and 2 ................................................ 223

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9-9 Interval Times When 2-Channel 8-Bit Timer/Event Counters (TM1 and TM2)
Are Used as 16-Bit Timer/Event Counter ............................................................................................. 226
9-10 Square-Wave Output Ranges When 2-Channel 8-Bit Timer/Event Counters (TM1 and TM2)
Are Used as 16-Bit Timer/Event Counter ............................................................................................. 228

10-1 Interval Timer Interval Time ................................................................................................................... 232

10-2 Watch Timer Configuration .................................................................................................................... 233
10-3 Interval Timer Interval Time ................................................................................................................... 237

11-1 Watchdog Timer Program Loop Detection Times ................................................................................. 238

11-2 Interval Times ......................................................................................................................................... 239
11-3 Watchdog Timer Configuration .............................................................................................................. 240
11-4 Watchdog Timer Program Loop Detection Time ................................................................................... 244
11-5 Interval Timer Interval Time ................................................................................................................... 245

12-1 Clock Output Controller Configuration .................................................................................................. 247

13-1 Buzzer Output Controller Configuration ................................................................................................ 250

14-1 A/D Converter Configuration ................................................................................................................. 254

14-2 A/D Converter Sampling Time and A/D Conversion Start Delay Time ................................................ 263
14-3 Resistances and Capacitances of Equivalent Circuit (Reference Values) .......................................... 274

15-1 D/A Converter Configuration ................................................................................................................. 276

16-1 Differences Between Channels 0, 1, and 2 .......................................................................................... 281

16-2 Configuration of Serial Interface Channel 0 ......................................................................................... 284
16-3 Various Signals in SBI Mode ................................................................................................................. 317

17-1 Differences Between Channels 0, 1, and 2 .......................................................................................... 333

17-2 Configuration of Serial Interface Channel 0 ......................................................................................... 336
17-3 Interrupt Request Signal Generation of Serial Interface Channel 0 .................................................... 339
17-4 Signals in I2C Bus Mode ..................................................................................................................... 365

18-1 Configuration of Serial Interface Channel 1 ......................................................................................... 383

18-2 Interval Timing According to CPU Processing (When Internal Clock Is Operating) ........................... 425
18-3 Interval Time According to CPU Processing (with External Clock) ..................................................... 426

19-1 Configuration of Serial Interface Channel 2 ......................................................................................... 428

19-2 Operating Mode Settings of Serial Interface Channel 2 ...................................................................... 434
19-3 Relationship Between Main System Clock and Baud Rate ................................................................. 439
19-4 Relationship Between ASCK Pin Input Frequency and Baud Rate (When BRGC Is Set to 00H) ..... 440
19-5 Relationship Between Main System Clock and Baud Rate ................................................................. 449
19-6 Relationship Between ASCK Pin Input Frequency and Baud Rate (When BRGC Is Set to 00H) ..... 450

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19-7 Receive Error Causes ............................................................................................................................ 456

20-1 Real-Time Output Port Configuration .................................................................................................... 470

20-2 Operation in Real-Time Output Buffer Register Manipulation ............................................................. 471
20-3 Real-Time Output Port Operating Mode and Output Trigger ............................................................... 473

21-1 Interrupt Source List .............................................................................................................................. 475

21-2 Various Flags Corresponding to Interrupt Request Sources ............................................................... 479
21-3 Times from Maskable Interrupt Request Generation to Interrupt Servicing ....................................... 491
21-4 Interrupt Request Enabled for Multiple Interrupt Servicing During Interrupt Servicing ...................... 494
21-5 Test Input Sources ................................................................................................................................. 498
21-6 Flags Corresponding to Test Input Signals ........................................................................................... 498

22-1 Pin Functions in External Memory Expansion Mode ........................................................................... 501

22-2 State of Port 4 to 6 Pins in External Memory Expansion Mode .......................................................... 501
22-3 Values After Internal Memory Size Switching Register Is Reset ......................................................... 506

23-1 HALT Mode Operating Status ................................................................................................................ 515

23-2 Operation After HALT Mode Release .................................................................................................... 517
23-3 STOP Mode Operating Status ............................................................................................................... 518
23-4 Operation After STOP Mode Release ................................................................................................... 520

24-1 Hardware Status After Reset ................................................................................................................. 523

25-1 ROM Correction Configuration .............................................................................................................. 525

26-1 Differences Between µPD78F0058, 78F0058Y and Mask ROM Versions .......................................... 535
26-2 Internal Memory Size Switching Register Setting Values .................................................................... 536
26-3 Internal Expansion RAM Size Switching Register Setting Values ....................................................... 537
26-4 Communication Mode List ..................................................................................................................... 539
26-5 Pin Connection List ................................................................................................................................ 542

27-1 Operand Identifiers and Description Methods ...................................................................................... 553

33-1 Surface Mounting Type Soldering Conditions ....................................................................................... 662

A-1 Major Differences Between µPD78054, 78058F, and 780058 Subseries ........................................... 666

B-1 System-Upgrade Method from Former In-Circuit Emulator for 78K/0 Series to IE-78001-R-A ......... 676

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1.1 Features

On-chip high-capacity ROM and RAM

Item Program Memory Data Memory

Mask ROM Flash Internal High- Internal Buffer Internal
Part Number Memory Speed RAM RAM Expansion RAM
µPD780053, 780053(A) 24 KB — 1,024 bytes 32 bytes None
µPD780054, 780054(A) 32 KB —
µPD780055, 780055(A) 40 KB —
µPD780056, 780056(A) 48 KB —
µPD780058, 780058B, 780058B(A) 60 KB — 1,024 bytes
µPD78F0058 — 60 KBNote 1 1,024 bytesNote 2

Notes 1. The flash memory capacity can be changed by means of the internal memory size switching register
(IMS).
2. The capacity of the internal high-speed RAM can be changed by means of the internal expansion RAM
size switching register (IXS).

External memory expansion space: 64 KB

Minimum instruction execution time changeable from high-speed (0.4 µs: Main system clock 5.0 MHz operation)
to ultra-low speed (122 µs: Subsystem clock 32.768 kHz operation)
Instruction set suited to system control
• Bit manipulation possible in all address spaces
• Multiple and divide instructions
I/O ports: 68 (N-ch open-drain: 4)
8-bit resolution A/D converter: 8 channels (VDD = 1.8 to 5.5 VNote)
8-bit resolution D/A converter: 2 channels (VDD = 1.8 to 5.5 VNote)
Serial interface: 3 channels
• 3-wire serial I/O/SBI/2-wire serial I/O mode: 1 channel
• 3-wire serial I/O mode (on-chip automatic transmit/receive function): 1 channel
• 3-wire serial I/O/UART mode (on-chip time-division transfer function): 1 channel
Timer: 5 channels
• 16-bit timer/event counter: 1 channel
• 8-bit timer/event counter: 2 channels
• Watch timer: 1 channel
• Watchdog timer: 1 channel

Note The operating voltage range of the A/D and D/A converters of the µPD780058 is VDD = 2.7 to 5.5 V.

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Vectored interrupt sources: 21

Test inputs: 2
Two types of on-chip clock oscillators (main system clock and subsystem clock)
Supply voltage: VDD = 1.8 to 5.5 V (mask ROM version)
VDD = 2.7Note to 5.5 V (µPD78F0058)

Note VDD = 2.2 V can also be supplied to the µPD78F0058. For details, contact an NEC Electronics sales
representative.

1.2 Applications

Car audio systems, cellular phones, pagers, printers, AV equipment, cameras, PPCs, vending machines, car
electrical components, etc.

1.3 Ordering Information

Part Number Package Internal ROM

µPD780053GC-×××-8BT 80-pin plastic QFP (14 × 14) Mask ROM

µPD780053GK-×××-9EU 80-pin plastic TQFP (fine pitch) (12 × 12) Mask ROM
µPD780054GC-×××-8BT 80-pin plastic QFP (14 × 14) Mask ROM
µPD780054GK-×××-9EU 80-pin plastic TQFP (fine pitch) (12 × 12) Mask ROM
µPD780055GC-×××-8BT 80-pin plastic QFP (14 × 14) Mask ROM
µPD780055GK-×××-9EU 80-pin plastic TQFP (fine pitch) (12 × 12) Mask ROM
µPD780056GC-×××-8BT 80-pin plastic QFP (14 × 14) Mask ROM
µPD780056GK-×××-9EU 80-pin plastic TQFP (fine pitch) (12 × 12) Mask ROM
µPD780058GC-×××-8BT 80-pin plastic QFP (14 × 14) Mask ROM
µPD780058GK-×××-9EU 80-pin plastic TQFP (fine pitch) (12 × 12) Mask ROM
µPD780058BGC-×××-8BT 80-pin plastic QFP (14 × 14) Mask ROM
µPD780058BGK-×××-9EU 80-pin plastic TQFP (fine pitch) (12 × 12) Mask ROM
µPD780053GC(A)-×××-8BT 80-pin plastic QFP (14 × 14) Special
µPD780054GC(A)-×××-8BT 80-pin plastic QFP (14 × 14) Special
µPD780055GC(A)-×××-8BT 80-pin plastic QFP (14 × 14) Special
µPD780056GC(A)-×××-8BT 80-pin plastic QFP (14 × 14) Special
µPD780058BGC(A)-×××-8BT 80-pin plastic QFP (14 × 14) Special
µPD78F0058GC-8BT 80-pin plastic QFP (14 × 14) Flash memory
µPD78F0058GK-9EU 80-pin plastic TQFP (fine pitch) (12 × 12) Flash memory

Remark ××× indicates ROM code suffix.

For details of the quality grades and their applications, see Quality Grades on NEC Electronics Semiconductor
Devices (Document No.: C11531E).

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1.4 Pin Configuration (Top View)

• 80-pin plastic QFP (14 × 14)

µPD780053GC-×××-8BT, 780054GC-×××-8BT, 780055GC-×××-8BT,
µPD780056GC-×××-8BT, 780058GC-×××-8BT, 780058BGC-×××-8BT,
µPD780053GC(A)-×××-8BT, 780054GC(A)-×××-8BT, 780055GC(A)-×××-8BT,
µPD780056GC(A)-×××-8BT, 780058BGC(A)-×××-8BT, 78F0058GC-8BT
• 80-pin plastic TQFP (fine pitch) (12 × 12)
µPD780053GK-×××-9EU, 780054GK-×××-9EU, 780055GK-×××-9EU,
µPD780056GK-×××-9EU, 780058GK-×××-9EU, 780058BGK-×××-9EU, 78F0058GK-9EU

P01/INTP1/TI01
P00/INTP0/TI00
P05/INTP5
P04/INTP4
P03/INTP3
P02/INTP2
P14/ANI4
P13/ANI3
P12/ANI2
P11/ANI1
P10/ANI0

XT1/P07

IC (VPP)
AVREF0
V DD0

VDD1
XT2

VSS0
X1
X2
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
P15/ANI5 1 60 RESET
P16/ANI6 2 59 P127/RTP7
P17/ANI7 3 58 P126/RTP6
AVSS 4 57 P125/RTP5
P130/ANO0 5 56 P124/RTP4
P131/ANO1 6 55 P123/RTP3
AVREF1 7 54 P122/RTP2
P70/SI2/RxD0 8 53 P121/RTP1
P71/SO2/TxD0 9 52 P120/RTP0
P72/SCK2/ASCK 10 51 P37
P20/SI1 11 50 P36/BUZ
P21/SO1 12 49 P35/PCL
P22/SCK1 13 48 P34/TI2
P23/STB/TxD1 14 47 P33/TI1
P24/BUSY/RxD1 15 46 P32/TO2
P25/SI0/SB0 16 45 P31/TO1
P26/SO0/SB1 17 44 P30/TO0
P27/SCK0 18 43 P67/ASTB
P40/AD0 19 42 P66/WAIT
P41/AD1 20 41 P65/WR
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
P42/AD2
P43/AD3
P44/AD4
P45/AD5
P46/AD6
P47/AD7
P50/A8
P51/A9
P52/A10
P53/A11
P54/A12
P55/A13
VSS1
P56/A14
P57/A15
P60
P61
P62
P63
P64/RD

Cautions 1. Be sure to connect the IC (Internally Connected) pin to VSS0 or VSS1 directly in the normal
operating mode.
2. Connect the AVSS pin to VSS0.

Remarks 1. The pin connection in parentheses is intended for the µPD78F0058.

2. When the µPD780053, 780054, 780055, 780056, 780058, or 780058B is used in application
fields that require reduction of the noise generated from inside the microcontroller, the
implementation of noise reduction measures, such as supplying to VDD0 and VDD1 individually
and connecting VSS0 and VSS1 to different ground lines, is recommended.

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A8 to A15: Address bus PCL: Programmable clock

AD0 to AD7: Address/data bus RD: Read strobe
ANI0 to ANI7: Analog input RESET: Reset
ANO0, ANO1: Analog output RTP0 to RTP7: Real-time output port
ASCK: Asynchronous serial clock RxD0, RxD1: Receive data
ASTB: Address strobe SB0, SB1: Serial bus
AVREF0, AVREF1: Analog reference voltage SCK0 to SCK2: Serial clock
AVSS: Analog ground SI0 to SI2: Serial input
BUSY: Busy SO0 to SO2: Serial output
BUZ: Buzzer clock STB: Strobe
IC: Internally connected TI00, TI01: Timer input
INTP0 to INTP6: Interrupt from peripherals TI1, TI2: Timer input
P00 to P05, P07: Port 0 TO0 to TO2: Timer output
P10 to P17: Port 1 TxD0, TxD1: Transmit data
P20 to P27: Port 2 VDD0, VDD1: Power supply
P30 to P37: Port 3 VPP: Programming power supply
P40 to P47: Port 4 VSS0, VSS1: Ground
P50 to P57: Port 5 WAIT: Wait
P60 to P67: Port 6 WR: Write strobe
P70 to P72: Port 7 X1, X2: Crystal (main system clock)
P120 to P127: Port 12 XT1, XT2: Crystal (subsystem clock)
P130, P131: Port 13

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1.5 78K/0 Series Lineup

78K/0 Series product lineup is illustrated below. Part numbers in the boxes indicate subseries names.

Products in mass production Products under development

Y subseries products are compatible with I2C bus.

Control
100-pin µ PD78075B EMI-noise reduced version of the µPD78078
100-pin µ PD78078 µPD78078Y µ PD78054 with timer and enhanced external interface
100-pin µ PD78070A µ PD78070AY ROMless version of the µ PD78078
100-pin µ PD780018AY µ PD78078Y with enhanced serial I/O and limited functions
80-pin µ PD780058 µ PD780058Y µ PD78054 with enhanced serial I/O
80-pin µ PD78058F µ PD78058FY EMI-noise reduced version of the µ PD78054
80-pin µPD78054 µ PD78054Y µ PD78018F with UART and D/A converter, and enhanced I/O
80-pin µPD780065 µ PD780024A with expanded RAM
64-pin µ PD780078 µ PD780078Y µ PD780034A with timer and enhanced serial I/O
64-pin µ PD780034A µ PD780034AY µ PD780024A with enhanced A/D converter
64-pin µ PD780024A µ PD780024AY µ PD78018F with enhanced serial I/O
52-pin µ PD780034AS 52-pin version of the µ PD780034A
52-pin µ PD780024AS 52-pin version of the µ PD780024A
64-pin µPD78014H EMI-noise reduced version of the µ PD78018F
64-pin µPD78018F µ PD78018FY Basic subseries for control
42/44-pin µ PD78083 On-chip UART, capable of operating at low voltage (1.8 V)

Inverter control
64-pin µPD780988 On-chip inverter control circuit and UART. EMI-noise reduced.

VFD drive
100-pin µ PD780208 µ PD78044F with enhanced I/O and VFD C/D. Display output total: 53
80-pin µ PD780232 For panel control. On-chip VFD C/D. Display output total: 53
80-pin µPD78044H µ PD78044F with N-ch open-drain I/O. Display output total: 34
80-pin µPD78044F Basic subseries for driving VFD. Display output total: 34

LCD drive
78K/0
Series 100-pin µ PD780354 µPD780354Y µ PD780344 with enhanced A/D converter
100-pin µ PD780344 µ PD780344Y µ PD780308 with enhanced display function and timer. Segment signal output: 40 pins max.
120-pin µ PD780338 µ PD780308 with enhanced display function and timer. Segment signal output: 40 pins max.
120-pin µ PD780328 µ PD780308 with enhanced display function and timer. Segment signal output: 32 pins max.
120-pin µPD780318 µ PD780308 with enhanced display function and timer. Segment signal output: 24 pins max.
100-pin µ PD780308 µPD780308Y µ PD78064 with enhanced SIO, and expanded ROM and RAM
100-pin µPD78064B EMI-noise reduced version of the µ PD78064
100-pin µPD78064 µ PD78064Y Basic subseries for driving LCDs, on-chip UART

Bus interface supported

100-pin µ PD780948 On-chip CAN controller
80-pin µ PD78098B µ PD78054 with IEBusTM controller
80-pin µ PD780702Y On-chip IEBus controller
80-pin µPD780703Y On-chip CAN controller
80-pin µ PD780833Y On-chip controller compliant with J1850 (Class 2)
64-pin µPD780816 Specialized for CAN controller function
Meter control
100-pin µPD780958 For industrial meter control
80-pin µPD780852 On-chip automobile meter controller/driver
80-pin µPD780828B For automobile meter driver. On-chip CAN controller

Remark VFD (Vacuum Fluorescent Display) is referred to as FIPTM (Fluorescent Indicator Panel) in some
documents, but the functions of the two are the same.

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The following lists the main functional differences between subseries products.

• Non-Y subseries

Function ROM Timer 8-Bit 10-Bit 8-Bit Serial Interface I/O VDD External
Capacity MIN.
Subseries Name (Bytes) 8-Bit 16-Bit Watch WDT A/D A/D D/A Value Expansion
Control µ PD78075B 32 K to 40 K 4 ch 1 ch 1 ch 1 ch 8 ch – 2 ch 3 ch (UART: 1 ch) 88 1.8 V √
µ PD78078 48 K to 60 K

µ PD78070A – 61 2.7 V

µ PD780058 24 K to 60 K 2 ch 3 ch (time-division UART: 1 ch) 68 1.8 V

µ PD78058F 48 K to 60 K 3 ch (UART: 1 ch) 69 2.7 V

µ PD78054 16 K to 60 K 2.0 V

µ PD780065 40 K to 48 K – 4 ch (UART: 1 ch) 60 2.7 V

µ PD780078 48 K to 60 K 2 ch – 8 ch 3 ch (UART: 2 ch) 52 1.8 V

µ PD780034A 8 K to 32 K 1 ch 3 ch (UART: 1 ch) 51

µPD780024A 8 ch –

µ PD780034AS – 4 ch 39 –

µPD780024AS 4 ch –

µ PD78014H 8 ch 2 ch 53 √

µ PD78018F 8 K to 60 K
µ PD78083 8 K to 16 K – – 1 ch (UART: 1 ch) 33 –

Inverter µ PD780988 16 K to 60 K 3 ch Note – 1 ch – 8 ch – 3 ch (UART: 2 ch) 47 4.0 V √

control

VFD µPD780208 32 K to 60 K 2 ch 1 ch 1 ch 1 ch 8 ch – – 2 ch 74 2.7 V –

drive
µPD780232 16 K to 24 K 3 ch – – 4 ch 40 4.5 V

µ PD78044H 32 K to 48 K 2 ch 1 ch 1 ch 8 ch 1 ch 68 2.7 V

µ PD78044F 16 K to 40 K 2 ch

LCD µPD780354 24 K to 32 K 4 ch 1 ch 1 ch 1 ch – 8 ch – 3 ch (UART: 1 ch) 66 1.8 V –

drive
µPD780344 8 ch –

µPD780338 48 K to 60 K 3 ch 2 ch – 10 ch 1 ch 2 ch (UART: 1 ch) 54

µ PD780328 62

µ PD780318 70

µ PD780308 48 K to 60 K 2 ch 1 ch 8 ch – – 3 ch (time-division UART: 1 ch) 57 2.0 V

µ PD78064B 32 K 2 ch (UART: 1 ch)

µPD78064 16 K to 32 K

Bus µPD780948 60 K 2 ch 2 ch 1 ch 1 ch 8 ch – – 3 ch (UART: 1 ch) 79 4.0 V √

interface µPD78098B 40 K to 60 K 1 ch 2 ch 69 2.7 V –

supported µ PD780816 32 K to 60 K 2 ch 12 ch – 2 ch (UART: 1 ch) 46 4.0 V
Meter µPD780958 48 K to 60 K 4 ch 2 ch – 1 ch – – – 2 ch (UART: 1 ch) 69 2.2 V –
control

Dash- µ PD780852 32 K to 40 K 3 ch 1 ch 1 ch 1 ch 5 ch – – 3 ch (UART: 1 ch) 56 4.0 V –

board
control µPD780828B 32 K to 60 K 59

Note 16-bit timer: 2 channels

10-bit timer: 1 channel

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1.6 Block Diagram

P00
TO0/P30
16-bit timer/ Port 0 P01 to P05
TI00/P00
event counter P07
TI01/P01

TO1/P31 Port 1 P10 to P17

8-bit timer/
TI1/P33 event counter 1

TO2/P32 8-bit timer/ Port 2 P20 to P27

TI2/P34 event counter 2

Port 3 P30 to P37

Watchdog timer

Watch timer Port 4 P40 to P47

SI0/SB0/P25
Port 5 P50 to P57
SO0/SB1/P26 Serial interface 0
SCK0/P27
ROM
78K/0
(flash Port 6 P60 to P67
CPU core
SI1/P20 memory)
SO1/P21
SCK1/P22 Serial interface 1
STB/TxD1/P23 Port 7 P70 to P72
BUSY/RxD1/P24

BUSY/RxD1/P24 Port 12 P120 to P127

STB/TxD1/P23
SI2/RxD0/P70 Serial interface 2
SO2/TxD0/P71 P130, P131
RAM Port 13
SCK2/ASCK/P72

ANI0/P10 to RTP0/P120 to
Real-time output port
ANI7/P17 RTP7/P127
A/D converter
AVSS
AVREF0
AD0/P40 to
AD7/P47
ANO0/P130, A8/P50 to
ANO1/P131 A15/P57
AVSS D/A converter External access RD/P64
AVREF1 WR/P65
WAIT/P66
INTP0/P00 to ASTB/P67
Interrupt control
INTP5/P05

RESET
BUZ/P36 Buzzer output
X1
System control X2
VDD0, VSS0, IC XT1/P07
PCL/P35 Clock output control VDD1 VSS1 (VPP) XT2

Remarks 1. The internal ROM and RAM capacities depend on the product.
2. The pin connection in parentheses is intended for the µPD78F0058.

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1.7 Outline of Function

Part Number µPD780053, µPD780054, µPD780055, µPD780056, µPD780058B, µPD780058 µPD78F0058

Item 780053(A) 780054(A) 780055(A) 780056(A) 780058B(A)
Internal ROM Mask ROM Flash memory
memory
24 KB 32 KB 40 KB 48 KB 60 KB 60 KBNote 1
High-speed RAM 1,024 bytes
Buffer RAM 32 bytes
Expansion RAM None 1,024 bytes 1,024 bytesNote 2
Memory space 64 KB
General-purpose registers 8 bits × 8 × 4 banks
Minimum instruction execution time Function to vary minimum instruction execution time incorporated
With main system clock selected 0.4 µs/0.8 µs/1.6 µs/3.2 µs/6.4 µs/12.8 µs (@ 5.0 MHz operation)
With subsystem clock selected 122 µs (@ 32.768 kHz operation)
Instruction set • 16-bit operation
• Multiply/divide (8 bits × 8 bits, 16 bits ÷ 8 bits)
• Bit manipulation (set, reset, test, and boolean operation)
• BCD adjust, etc.
I/O ports Total: 68
• CMOS input: 2
• CMOS I/O: 62
• N-ch open-drain I/O: 4
A/D converter 8-bit resolution × 8 channels
Operating voltage range VDD = 1.8 to 5.5 V VDD = 2.7 to 5.5 V
D/A converter 8-bit resolution × 2 channels
Operating voltage range VDD = 1.8 to 5.5 V VDD = 2.7 to 5.5 V
Serial interface • 3-wire serial I/O/SBI/2-wire serial I/O mode selection possible: 1 channel
• 3-wire serial I/O mode (on-chip max. 32 bytes auto-transmit/receive function): 1 channel
• 3-wire serial I/O/UART mode (on-chip time-division transfer function) selectable:
1 channel
Timer • 16-bit timer/event counter: 1 channel
• 8-bit timer/event counter: 2 channels
• Watch timer: 1 channel
• Watchdog timer: 1 channel
Timer outputs 3: (14-bit PWM output enable: 1)
Clock output 19.5 kHz, 39.1 kHz, 78.1 kHz, 156 kHz, 313 kHz, 625 kHz, 1.25 MHz,
2.5 MHz, 5.0 MHz (main system clock: @ 5.0 MHz operation)
32.768 kHz (subsystem clock: @ 32.768 kHz operation)
Buzzer output 1.2 kHz, 2.4 kHz, 4.9 kHz, 9.8 kHz (main system clock: @ 5.0 MHz operation)

Notes 1. The capacity of the flash memory can be changed by using the internal memory switching register
(IMS).
2. The capacity of the internal expansion RAM can be changed by using the internal expansion RAM
size switching register (IXS).

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Part Number µPD780053, µPD780054, µPD780055, µPD780056, µPD780058B, µPD780058 µPD78F0058

Item 780053(A) 780054(A) 780055(A) 780056(A) 780058B(A)
Vectored Maskable Internal: 13, External: 6
interrupt
Non-maskable Internal: 1
sources
Software 1

Test input Internal: 1, External: 1

Supply voltage VDD = 1.8 to 5.5 V VDD = 2.7Note
to 5.5 V
Operating ambient temperature TA = –40 to +85°C
Package • 80-pin plastic QFP (14 × 14)
• 80-pin plastic TQFP (fine pitch) (12 × 12)

Note VDD = 2.2 V can also be supplied. For details, contact an NEC Electronics sales representative.

The timers are outlined below.

16-Bit Timer/ 8-Bit Timer/Event Watch Timer Watchdog Timer

Event Counter Counters 1 and 2

Operating Interval timer 2 channelsNote 3 2 channels 1 channelNote 1 1 channelNote 2

Mode External event counter √ √ — —
Function Timer output √ √ — —
PWM output √ — — —
Pulse width measurement √ — — —
Square-wave output √ √ — —
One-shot pulse output √ — — —
Interrupt request √ √ √ √
Test input — — √ —

Notes 1. The watch timer can perform both watch timer and interval timer functions at the same time.
2. The watchdog timer can perform either the watchdog timer function or the interval timer function.
3. When capture/compare registers 00 and 01 (CR00 and CR01) are specified as compare registers.

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1.8 Mask Options

The mask ROM versions (µPD780053, 780053(A), 780054, 780054(A), 780055, 780055(A), 780056, 780056(A),
780058, 780058B, 780058B(A)) provide pull-up resistor mask options which allow users to specify whether to connect
a pull-up resistor to a specific port pin when the user places an order for the device production. Using this mask option
when pull-up resistors are required reduces the number of components to add to the device, resulting in board space
saving.
The mask options provided in the µPD780058 Subseries are shown in Table 1-1.

Table 1-1. Mask Options of Mask ROM Versions

Pin Names Mask Options

P60 to P63 Pull-up resistor connection can be specified in 1-bit units.

1.9 Differences Between Standard Model and (A) Model

The (A) models of the µPD780058 Subseries (µPD780053(A), 780054(A), 780055(A), 780056(A), and 780058B(A))
have improved reliability by increasing the check items from the standard model (µPD780053, 780054, 780055,
780056, and 780058B). The functions and electrical characteristics of the (A) model are the same as those of the
standard model.

Table 1-2. Differences Between Standard Model and (A) Model

Product Name Standard Model (A) Model

Item

Quality grade Standard Special

(for general-purpose electronic systems) (for high-reliability electronic systems)

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2.1 Features

On-chip high-capacity ROM and RAM

Item Program Memory Data Memory

Mask ROM Flash Internal High- Internal Buffer Internal
Part Number Memory Speed RAM RAM Expansion RAM
µPD780053Y, 780053Y(A) 24 KB — 1,024 bytes 32 bytes None
µPD780054Y, 780054Y(A) 32 KB —
µPD780055Y, 780055Y(A) 40 KB —
µPD780056Y, 780056Y(A) 48 KB —
µPD780058BY, 780058BY(A) 60 KB — 1,024 bytes
µPD78F0058Y — 60 KBNote 1 1,024 bytesNote 2

Notes 1. The capacity of flash memory can be changed by means of the internal memory size switching register
(IMS).
2. The capacity of internal high-speed RAM can be changed by means of the internal expansion RAM
size switching register (IXS).

External memory expansion space: 64 KB

Minimum instruction execution time changeable from high-speed (0.4 µs: Main system clock 5.0 MHz operation)
to ultra-low speed (122 µs: Subsystem clock 32.768 kHz operation)
Instruction set suited to system control
• Bit manipulation possible in all address spaces
• Multiple and divide instructions
I/O ports: 68 (N-ch open-drain: 4)
8-bit resolution A/D converter: 8 channels (VDD = 1.8 to 5.5 V)
8-bit resolution D/A converter: 2 channels (VDD = 1.8 to 5.5 V)
Serial interface: 3 channels
• 3-wire serial I/O/2-wire serial I/O/I2C bus mode: 1 channel
• 3-wire serial I/O mode (on-chip automatic transmit/receive function): 1 channel
• 3-wire serial I/O/UART mode (on-chip time-division transfer function): 1 channel
Timer: 5 channels
• 16-bit timer/event counter: 1 channel
• 8-bit timer/event counter: 2 channels
• Watch timer: 1 channel
• Watchdog timer: 1 channel
Vectored interrupt sources: 21
Test inputs: 2
Two types of on-chip clock oscillators (main system clock and subsystem clock)
Supply voltage: VDD = 1.8 to 5.5 V (mask ROM version)
VDD = 2.7Note to 5.5 V (µPD78F0058Y)

Note VDD = 2.2 V can also be supplied to the µPD78F0058Y. For details, contact an NEC Electronics sales
representative.

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2.2 Applications

Car audio systems, cellular phones, pagers, printers, AV equipment, cameras, PPCs, vending machines, car
electrical components, etc.

2.3 Ordering Information

Part Number Package Internal ROM

µPD780053YGC-×××-8BT 80-pin plastic QFP (14 × 14) Mask ROM

µPD780053YGK-×××-9EU 80-pin plastic TQFP (fine pitch) (12 × 12) Mask ROM
µPD780054YGC-×××-8BT 80-pin plastic QFP (14 × 14) Mask ROM
µPD780054YGK-×××-9EU 80-pin plastic TQFP (fine pitch) (12 × 12) Mask ROM
µPD780055YGC-×××-8BT 80-pin plastic QFP (14 × 14) Mask ROM
µPD780055YGK-×××-9EU 80-pin plastic TQFP (fine pitch) (12 × 12) Mask ROM
µPD780056YGC-×××-8BT 80-pin plastic QFP (14 × 14) Mask ROM
µPD780056YGK-×××-9EU 80-pin plastic TQFP (fine pitch) (12 × 12) Mask ROM
µPD780058BYGC-×××-8BT 80-pin plastic QFP (14 × 14) Mask ROM
µPD780058BYGK-×××-9EU 80-pin plastic TQFP (fine pitch) (12 × 12) Mask ROM
µPD780053YGC(A)-×××-8BT 80-pin plastic QFP (14 × 14) Special
µPD780054YGC(A)-×××-8BT 80-pin plastic QFP (14 × 14) Special
µPD780055YGC(A)-×××-8BT 80-pin plastic QFP (14 × 14) Special
µPD780056YGC(A)-×××-8BT 80-pin plastic QFP (14 × 14) Special
µPD780058BYGC(A)-×××-8BT 80-pin plastic QFP (14 × 14) Special
µPD78F0058YGC-8BT Note 80-pin plastic QFP (14 × 14) Flash-memory
µPD78F0058YGK-9EU Note 80-pin plastic TQFP (fine pitch) (12 × 12) Flash-memory

Remark ××× indicates ROM code suffix.

For details of the quality grades and their applications, see Quality Grades on NEC Electronics Semiconductor
Devices (Document No.: C11531E).

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2.4 Pin Configuration (Top View)

• 80-pin plastic QFP (14 × 14)

µPD780053YGC-×××-8BT, 780054YGC-×××-8BT, 780055YGC-×××-8BT,
µPD780056YGC-×××-8BT, 780058BYGC-×××-8BT, 780053YGC(A)-×××-8BT,
µPD780054YGC(A)-×××-8BT, 780055YGC(A)-×××-8BT, 780056YGC(A)-×××-8BT,
µPD780058BYGC(A)-×××-8BT, 78F0058YGC-8BT
• 80-pin plastic TQFP (fine pitch) (12 × 12)
µPD780053YGK-×××-9EU, 780054YGK-×××-9EU, 780055YGK-×××-9EU,
µPD780056YGK-×××-9EU, 780058BYGK-×××-9EU, 78F0058YGK-9EU

P01/INTP1/TI01
P00/INTP0/TI00
P05/INTP5
P04/INTP4
P03/INTP3
P02/INTP2
P14/ANI4
P13/ANI3
P12/ANI2
P11/ANI1
P10/ANI0

XT1/P07

IC (VPP)
AVREF0
V DD0

VDD1
XT2

VSS0
X1
X2
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
P15/ANI5 1 60 RESET
P16/ANI6 2 59 P127/RTP7
P17/ANI7 3 58 P126/RTP6
AVSS 4 57 P125/RTP5
P130/ANO0 5 56 P124/RTP4
P131/ANO1 6 55 P123/RTP3
AVREF1 7 54 P122/RTP2
P70/SI2/RxD0 8 53 P121/RTP1
P71/SO2/TxD0 9 52 P120/RTP0
P72/SCK2/ASCK 10 51 P37
P20/SI1 11 50 P36/BUZ
P21/SO1 12 49 P35/PCL
P22/SCK1 13 48 P34/TI2
P23/STB/TxD1 14 47 P33/TI1
P24/BUSY/RxD1 15 46 P32/TO2
P25/SI0/SB0/SDA0 16 45 P31/TO1
P26/SO0/SB1/SDA1 17 44 P30/TO0
P27/SCK0/SCL 18 43 P67/ASTB
P40/AD0 19 42 P66/WAIT
P41/AD1 20 41 P65/WR
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
P42/AD2
P43/AD3
P44/AD4
P45/AD5
P46/AD6
P47/AD7
P50/A8
P51/A9
P52/A10
P53/A11
P54/A12
P55/A13
VSS1
P56/A14
P57/A15
P60
P61
P62
P63
P64/RD

Cautions 1. Be sure to connect the IC (Internally Connected) pin to VSS0 directly in the normal
operating mode.
2. Connect the AVSS pin to VSS0.

Remarks 1. The pin connection in parentheses is intended for the µPD78F0058Y.

2. When the µPD780053Y, 780054Y, 780055Y, 780056Y, or 780058BY is used in application
fields that require reduction of the noise generated from inside the microcontroller, the
implementation of noise reduction measures, such as supplying to VDD0 and VDD1 individually
and connecting VSS0 and VSS1 to different ground lines, is recommended.

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A8 to A15: Address bus RD: Read strobe

AD0 to AD7: Address/data bus RESET: Reset
ANI0 to ANI7: Analog input RTP0 to RTP7: Real-time output port
ANO0, ANO1: Analog output RxD0, RxD1: Receive data
ASCK: Asynchronous serial clock SB0, SB1: Serial bus
ASTB: Address strobe SCK0 to SCK2: Serial clock
AVREF0, AVREF1: Analog reference voltage SCL: Serial clock
AVSS: Analog ground SDA0, SDA1: Serial data
BUSY: Busy SI0 to SI2: Serial input
BUZ: Buzzer clock SO0 to SO2: Serial output
IC: Internally connected STB: Strobe
INTP0 to INTP6: Interrupt from peripherals TI00, TI01: Timer input
P00 to P05, P07: Port 0 TI1, TI2: Timer input
P10 to P17: Port 1 TO0 to TO2: Timer output
P20 to P27: Port 2 TxD0, TxD1: Transmit data
P30 to P37: Port 3 VDD0, VDD1: Power supply
P40 to P47: Port 4 VPP: Programming power supply
P50 to P57: Port 5 VSS0, VSS1: Ground
P60 to P67: Port 6 WAIT: Wait
P70 to P72: Port 7 WR: Write strobe
P120 to P127: Port 12 X1, X2: Crystal (main system clock)
P130, P131: Port 13 XT1, XT2: Crystal (subsystem clock)
PCL: Programmable clock

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2.5 78K/0 Series Lineup

78K/0 Series product lineup is illustrated below. Part numbers in the boxes indicate subseries names.

Products in mass production Products under development

Y subseries products are compatible with I2C bus.

Control
100-pin µ PD78075B EMI-noise reduced version of the µPD78078
100-pin µ PD78078 µPD78078Y µ PD78054 with timer and enhanced external interface
100-pin µ PD78070A µ PD78070AY ROMless version of the µ PD78078
100-pin µ PD780018AY µ PD78078Y with enhanced serial I/O and limited functions
80-pin µ PD780058 µ PD780058Y µ PD78054 with enhanced serial I/O
80-pin µ PD78058F µ PD78058FY EMI-noise reduced version of the µ PD78054
80-pin µPD78054 µ PD78054Y µ PD78018F with UART and D/A converter, and enhanced I/O
80-pin µPD780065 µ PD780024A with expanded RAM
64-pin µ PD780078 µ PD780078Y µ PD780034A with timer and enhanced serial I/O
64-pin µ PD780034A µ PD780034AY µ PD780024A with enhanced A/D converter
64-pin µ PD780024A µ PD780024AY µ PD78018F with enhanced serial I/O
52-pin µ PD780034AS 52-pin version of the µ PD780034A
52-pin µ PD780024AS 52-pin version of the µ PD780024A
64-pin µPD78014H EMI-noise reduced version of the µ PD78018F
64-pin µPD78018F µ PD78018FY Basic subseries for control
42/44-pin µ PD78083 On-chip UART, capable of operating at low voltage (1.8 V)

Inverter control
64-pin µPD780988 On-chip inverter control circuit and UART. EMI-noise reduced.

VFD drive
100-pin µ PD780208 µ PD78044F with enhanced I/O and VFD C/D. Display output total: 53
80-pin µ PD780232 For panel control. On-chip VFD C/D. Display output total: 53
80-pin µPD78044H µ PD78044F with N-ch open-drain I/O. Display output total: 34
80-pin µPD78044F Basic subseries for driving VFD. Display output total: 34

LCD drive
78K/0
Series 100-pin µ PD780354 µPD780354Y µ PD780344 with enhanced A/D converter
100-pin µ PD780344 µ PD780344Y µ PD780308 with enhanced display function and timer. Segment signal output: 40 pins max.
120-pin µ PD780338 µ PD780308 with enhanced display function and timer. Segment signal output: 40 pins max.
120-pin µ PD780328 µ PD780308 with enhanced display function and timer. Segment signal output: 32 pins max.
120-pin µPD780318 µ PD780308 with enhanced display function and timer. Segment signal output: 24 pins max.
100-pin µ PD780308 µPD780308Y µ PD78064 with enhanced SIO, and expanded ROM and RAM
100-pin µPD78064B EMI-noise reduced version of the µ PD78064
100-pin µPD78064 µ PD78064Y Basic subseries for driving LCDs, on-chip UART

Bus interface supported

100-pin µ PD780948 On-chip CAN controller
80-pin µ PD78098B µ PD78054 with IEBus controller
80-pin µ PD780702Y On-chip IEBus controller
80-pin µPD780703Y On-chip CAN controller
80-pin µ PD780833Y On-chip controller compliant with J1850 (Class 2)
64-pin µPD780816 Specialized for CAN controller function
Meter control
100-pin µPD780958 For industrial meter control
80-pin µPD780852 On-chip automobile meter controller/driver
80-pin µPD780828B For automobile meter driver. On-chip CAN controller

Remark VFD (Vacuum Fluorescent Display) is referred to as FIP (Fluorescent Indicator Panel) in some
documents, but the functions of the two are the same.

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Major functional differences among the Y subseries are shown below.

• Y subseries

Function ROM Timer 8-Bit 10-Bit 8-Bit Serial Interface I/O VDD External
Capacity MIN.
Subseries Name (Bytes) 8-Bit 16-Bit Watch WDT A/D A/D D/A Value Expansion
Control µPD78078Y 48 K to 60 K 4 ch 1 ch 1 ch 1 ch 8 ch – 2 ch 3 ch (UART: 1 ch, I2C: 1 ch) 88 1.8 V √
µPD78070AY – 61 2.7 V

µPD780018AY 48 K to 60 K – 2
3 ch (I C: 1 ch) 88
µPD780058Y 24 K to 60 K 2 ch 2
2 ch 3 ch (time-division UART: 1 ch, I C: 1 ch) 68 1.8 V
µPD78058FY 48 K to 60 K 2
3 ch (UART: 1 ch, I C: 1 ch) 69 2.7 V

µPD78054Y 16 K to 60 K 2.0 V
µPD780078Y 48 K to 60 K 2 ch – 8 ch – 2
4 ch (UART: 2 ch, I C: 1 ch) 52 1.8 V
µPD780034AY 8 K to 32 K 1 ch 3 ch (UART: 1 ch, I C: 1 ch) 512

µPD780024AY 8 ch –
µPD78018FY 8 K to 60 K 2 ch (I2C: 1 ch) 53
LCD µPD780354Y 24 K to 32 K 4 ch 1 ch 1 ch 1 ch – 8 ch – 4 ch (UART: 1 ch, 66 1.8 V –
2
drive I C: 1 ch)
µPD780344Y 8 ch –
µPD780308Y 48 K to 60 K 2 ch 3 ch (time-division UART: 1 ch, I2C: 1 ch) 57 2.0 V
µPD78064Y 16 K to 32 K 2
2 ch (UART: 1 ch, I C: 1 ch)

Bus µPD780701Y 60 K 3 ch 2 ch 1 ch 1 ch 16 ch – – 4 ch (UART: 1 ch, I2C: 1 ch) 67 3.5 V –

interface µPD780703Y
supported
µPD780833Y 65 4.5 V

Remark Functions other than the serial interface are common to both the Y and non-Y subseries.

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2.6 Block Diagram

P00
TO0/P30
16-bit timer/ Port 0 P01 to P05
TI00/P00
event counter P07
TI01/P01

TO1/P31 Port 1 P10 to P17

8-bit timer/
TI1/P33 event counter 1

TO2/P32 8-bit timer/ Port 2 P20 to P27

TI2/P34 event counter 2

Port 3 P30 to P37

Watchdog timer

Watch timer Port 4 P40 to P47

SI0/SB0/P25
Port 5 P50 to P57
SO0/SB1/P26 Serial interface 0
SCK0/P27
ROM
78K/0
(flash Port 6 P60 to P67
CPU core
SI1/P20 memory)
SO1/P21
SCK1/P22 Serial interface 1
STB/TxD1/P23 Port 7 P70 to P72
BUSY/RxD1/P24

BUSY/RxD1/P24 Port 12 P120 to P127

STB/TxD1/P23
SI2/RxD0/P70 Serial interface 2
SO2/TxD0/P71 P130, P131
RAM Port 13
SCK2/ASCK/P72

ANI0/P10 to RTP0/P120 to
Real-time output port
ANI7/P17 RTP7/P127
A/D converter
AVSS
AVREF0
AD0/P40 to
AD7/P47
ANO0/P130, A8/P50 to
ANO1/P131 A15/P57
AVSS D/A converter External access RD/P64
AVREF1 WR/P65
WAIT/P66
INTP0/P00 to ASTB/P67
Interrupt control
INTP5/P05

RESET
BUZ/P36 Buzzer output
X1
System control X2
VDD0, VSS0, IC XT1/P07
PCL/P35 Clock output control VDD1 VSS1 (VPP) XT2

Remarks 1. The internal ROM and RAM capacities depend on the product.
2. The pin connection in parentheses is intended for the µPD78F0058Y.

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2.7 Outline of Functions

Part Number µPD780053Y, µPD780054Y, µPD780055Y, µPD780056Y, µPD780058BY µPD78F0058Y

Item 780053Y(A) 780054Y(A) 780055Y(A) 780056Y(A) 780058BY(A)
Internal ROM Mask ROM Flash memory
memory 24 KB 32 KB 40 KB 48 KB 60 KB 60 KBNote 1
High-speed RAM 1,024 bytes
Buffer RAM 32 bytes
Expansion RAM None 1,024 bytes 1,024 bytesNote 2
Memory space 64 KB
General-purpose registers 8 bits × 8 × 4 banks
Minimum instruction execution time Function to vary minimum instruction execution time incorporated
With main system clock selected 0.4 µs/0.8 µs/1.6 µs/3.2 µs/6.4 µs/12.8 µs (@ 5.0 MHz operation)
With subsystem clock selected 122 µs (@ 32.768 kHz operation)
Instruction set • 16-bit operation
• Multiply/divide (8 bits × 8 bits, 16 bits ÷ 8 bits)
• Bit manipulation (set, reset, test, and boolean operation)
• BCD adjust, etc.
I/O ports Total: 68
• CMOS input: 2
• CMOS I/O: 62
• N-ch open-drain I/O: 4
A/D converter 8-bit resolution × 8 channels
Operating voltage range VDD = 1.8 to 5.5 V VDD = 2.7 to 5.5 V
D/A converter 8-bit resolution × 2 channels
Operating voltage range VDD = 1.8 to 5.5 V VDD = 2.7 to 5.5 V
Serial interface • 3-wire serial I/O/SBI/2-wire serial I/O mode selection possible: 1 channel
• 3-wire serial I/O mode (on-chip max. 32 bytes auto-transmit/receive function):
1 channel
• 3-wire serial I/O/UART mode (on-chip time-division transfer function) selectable:
1 channel
Timer • 16-bit timer/event counter: 1 channel
• 8-bit timer/event counter: 2 channels
• Watch timer: 1 channel
• Watchdog timer: 1 channel
Timer outputs 3: (14-bit PWM output enable: 1)
Clock output 19.5 kHz, 39.1 kHz, 78.1 kHz, 156 kHz, 313 kHz, 625 kHz, 1.25 MHz,
2.5 MHz, 5.0 MHz (main system clock: @ 5.0 MHz operation)
32.768 kHz (subsystem clock: @ 32.768 kHz operation)
Buzzer output 1.2 kHz, 2.4 kHz, 4.9 kHz, 9.8 kHz (main system clock: @ 5.0 MHz operation)

Notes 1. The capacity of the flash memory can be changed by using the internal memory switching register
(IMS).
2. The capacity of the internal expansion RAM can be changed by using the internal expansion RAM
size switching register (IXS).

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Part Number µPD780053Y, µPD780054Y, µPD780055Y, µPD780056Y, µPD780058BY µPD78F0058Y

Item 780053Y(A) 780054Y(A) 780055Y(A) 780056Y(A) 780058BY(A)
Vectored Maskable Internal: 13, External: 6
interrupt
Non-maskable Internal: 1
sources
Software 1

Test input Internal: 1, External: 1

Supply voltage VDD = 1.8 to 5.5 V VDD = 2.7Note
to 5.5 V
Operating ambient temperature TA = –40 to +85°C
Package • 80-pin plastic QFP (14 × 14)
• 80-pin plastic TQFP (Fine pitch) (12 × 12)

Note VDD = 2.2 V can also be supplied. For details, contact an NEC Electronics sales representative.

The timers are outlined below.

16-Bit Timer/ 8-Bit Timer/Event Watch Timer Watchdog Timer

Event Counter Counters 1 and 2

Operating Interval timer 2 channelsNote 3 2 channels 1 channelNote 1 1 channelNote 2

Mode External event counter √ √ — —
Function Timer output √ √ — —
PWM output √ — — —
Pulse width measurement √ — — —
Square-wave output √ √ — —
One-shot pulse output √ — — —
Interrupt request √ √ √ √
Test input — — √ —

Notes 1. The watch timer can perform both watch timer and interval timer functions at the same time.
2. The watchdog timer can perform either the watchdog timer function or the interval timer function.
3. When capture/compare registers 00 and 01 (CR00 and CR01) are specified as compare registers.

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2.8 Mask Options

The mask ROM versions (µPD780053Y, 780053Y(A), 780054Y, 780054Y(A), 780055Y, 780055Y(A), 780056Y,
780056Y(A), 780058BY, 780058BY(A)) provide pull-up resistor mask options which allow users to specify whether
to connect a pull-up resistor to a specific port pin when the user places an order for the device production. Using
this mask option when pull-up resistors are required reduces the number of components to add to the device, resulting
in board space saving.
The mask options provided in the µPD780058Y Subseries are shown in Table 2-1.

Table 2-1. Mask Options of Mask ROM Versions

Pin Names Mask Options

P60 to P63 Pull-up resistor connection can be specified in 1-bit units.

2.9 Differences Between Standard Model and (A) Model

The (A) models of the µPD780058Y Subseries (µPD780053Y(A), 780054Y(A), 780055Y(A), 780056Y(A), and
780058BY(A)) have improved reliability by increasing the check items from the standard model (µPD780053Y,
780054Y, 780055Y, 780056Y, and 780058BY). The functions and electrical characteristics of the (A) model are the
same as those of the standard model.

Table 2-2. Differences Between Standard Model and (A) Model

Product Name Standard Model (A) Model

Item

Quality grade Standard Special

(for general-purpose electronic systems) (for high-reliability electronic systems)

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3.1 Pin Function List

(1) Port pins (1/2)

Pin Name I/O Function After Reset Alternate Function
P00 Input Port 0 Input only Input INTP0/TI00
I/O 7-bit I/O port Input/output can be specified in 1-bit
P01 Input INTP1/TI01
units.
P02 INTP2
If used as an input port, an on-chip
P03 pull-up resistor can be connected by INTP3
P04 setting software. INTP4

P05 INTP5
P07Note 1 Input Input only Input XT1
P10 to P17 I/O Port 1 Input ANI0 to ANI7
8-bit I/O port
Input/output can be specified in 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by
setting software.Note 2
P20 I/O Port 2 Input SI1
8-bit I/O port
P21 SO1
Input/output can be specified in 1-bit units.
P22 If used as an input port, an on-chip pull-up resistor can be connected by SCK1
P23 setting software. STB/TxD1
P24 BUSY/RxD1

P25 SI0/SB0
P26 SO0/SB1
P27 SCK0
P30 I/O Port 3 Input TO0
8-bit I/O port
P31 TO1
Input/output can be specified in 1-it units.
P32 If used as an input port, an on-chip pull-up resistor can be connected by TO2
P33 setting software. TI1

P34 TI2
P35 PCL
P36 BUZ

P37 —

Notes 1. When the P07/XT1 pin is used as an input port, set bit 6 (FRC) of the processor clock control register
(PCC) to 1 (do not use the feedback resistor incorporated in the subsystem clock oscillator).
2. When pins P10/ANI0 to P17/ANI7 are used as an analog input of the A/D converter, set port 1 to the
input mode. In this case, any connected on-chip pull-up resistors are automatically disabled.

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(1) Port pins (2/2)

Pin Name I/O Function After Reset Alternate Function

P40 to P47 I/O Port 4 Input AD0 to AD7

8-bit I/O port
Input/output can be specified in 8-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by
setting software.
The test input flag (KRIF) is set to 1 by falling edge detection.
P50 to P57 I/O Port 5 Input A8 to A15
8-bit I/O port
LEDs can be driven directly.
Input/output can be specified in 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by
setting software.
P60 I/O Port 6 N-ch open-drain I/O port Input —

P61 8-bit I/O port On-chip pull-up resistors can be

Input/output can be specified in specified by mask option.
P62
1-bit units. (Mask ROM version only).
P63 LEDs can be driven directly.
P64 If used as an input port, an on-chip RD
P65 pull-up resistor can be connected by WR
setting software.
P66 WAIT

P67 ASTB
P70 I/O Port 7 Input SI2/RxD0
3-bit I/O port
P71 Input/output can be specified in 1-bit units. SO2/TxD0
If used as an input port, an on-chip pull-up resistor can be connected by
P72 setting software. SCK2/ASCK

P120 to P127 I/O Port 12 Input RTP0 to RTP7

8-bit I/O port
Input/output can be specified in 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by
setting software.
P130 to P131 I/O Port 13 Input ANO0 to ANO1
2-bit I/O port
Input/output can be specified in 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by
setting software.

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(2) Non-port pins (1/2)

Pin Name I/O Function After Reset Alternate Function

INTP0 Input External interrupt request inputs with specifiable valid edges (rising Input P00/TI00
edge, falling edge, both rising and falling edges).
INTP1 P01/TI01
INTP2 P02

INTP3 P03
INTP4 P04
INTP5 P05
SI0 Input Serial interface serial data input Input P25/SB0

SI1 P20
SI2 P70/RxD
SO0 Output Serial interface serial data output Input P26/SB1

SO1 P21
SO2 P71/TxD
SB0 I/O Serial interface serial data input/output Input P25/SI0

SB1 P26/SO0
SCK0 I/O Serial interface serial clock input/output Input P27
SCK1 P22

SCK2 P72/ASCK
STB Output Serial interface automatic transmit/receive strobe output Input P23/TxD1
BUSY Input Serial interface automatic transmit/receive busy input Input P24/RxD1

RxD0 Input Asynchronous serial interface serial data input Input P70/SI2
RxD1 P24/BUSY

TxD0 Output Asynchronous serial interface serial data output Input P71/SO2
TxD1 P23/STB
ASCK Input Asynchronous serial interface serial clock input Input P72/SCK2
TI00 Input External count clock input to 16-bit timer (TM0) Input P00/INTP0

TI01 Capture trigger signal input to capture register (CR00) P01/INTP1

TI1 External count clock input to 8-bit timer (TM1) P33
TI2 External count clock input to 8-bit timer (TM2) P34
TO0 Output 16-bit timer (TM0) output (also used for 14-bit PWM output) Input P30

TO1 8-bit timer (TM1) output P31

TO2 8-bit timer (TM2) output P32
PCL Output Clock output (for main system clock and subsystem clock trimming) Input P35
BUZ Output Buzzer output Input P36
RTP0 to RTP7 Output Real-time output port outputting data in synchronization with trigger Input P120 to P127

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(2) Non-port pins (2/2)

Pin Name I/O Function After Reset Alternate Function

AD0 to AD7 I/O Lower address/data bus when expanding memory externally Input P40 to P47
A8 to A15 Output Higher address bus when expanding memory externally Input P50 to P57
RD Output Strobe signal output for read operation from external memory Input P64

WR Strobe signal output for write operation to external memory P65

WAIT Input Wait insertion when accessing external memory Input P66
ASTB Output Strobe output externally latching address information output to ports 4 Input P67
and 5 to access external memory

ANI0 to ANI7 Input A/D converter analog input Input P10 to P17
ANO0, ANO1 Output D/A converter analog output Input P130, P131
AVREF0 Input A/D converter reference voltage input (also functions as analog power — —
supply)

AVREF1 Input D/A converter reference voltage input — —

AVSS — A/D converter, D/A converter ground potential. Use the same potential — —
as VSS0.
RESET Input System reset input — —

X1 Input Crystal connection for main system clock oscillation — —

X2 — — —
XT1 Input Crystal connection for subsystem clock oscillation Input P07

XT2 — — —
VDD0 — Positive power supply for ports — —
VSS0 — Ground potential for ports — —

VDD1 — Positive power supply (except ports and analog block) — —

VSS1 — Ground potential (except ports and analog block) — —

VPP — High-voltage application for program write/verify. — —

IC — Internally connected. Connect directly to VSS0. — —

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3.2 Description of Pin Functions

3.2.1 P00 to P05, P07 (Port 0)

P00 to P05 and P07 function as a 7-bit I/O port. Besides serving as I/O port pins, they also function as an external
interrupt request input, an external count clock input to the timer, a capture trigger signal input, and crystal connection
for subsystem oscillation.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P00 and P07 function as input-only port pins and P01 to P05 function as I/O port pins.
P01 to P05 can be specified as input or output in 1-bit units using port mode register 0 (PM0). When they
are used as input port pins, on-chip pull-up resistors can be connected to them using pull-up resistor option
register L (PUOL).

(2) Control mode

In this mode, P00 to P05 and P07 function as an external interrupt request input, an external count clock input
to the timer, and crystal connection for subsystem clock oscillation.

(a) INTP0 to INTP5

INTP0 to INTP5 are external interrupt request input pins for which valid edges can be specified (rising
edge, falling edge, and both rising and falling edges). INTP0 or INTP1 become 16-bit timer/event counter
capture trigger signal input pins with a valid edge input.

(b) TI00
This is a pin for inputting the external count clock to the 16-bit timer/event counter.

(c) TI01
This is a pin for inputting the capture trigger signal to the capture register (CR00) of the 16-bit timer/event
counter.

(d) XT1
This is a crystal connection pin for subsystem clock oscillation.

3.2.2 P10 to P17 (Port 1)

P10 to P17 function as an 8-bit I/O port. Besides serving as I/O port pins, they also function as an A/D converter
analog inputs.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P10 to P17 function as an 8-bit I/O port.
They can be specified as input or output in 1-bit units using port mode register 1 (PM1). When they are used
as input port pins, on-chip pull-up resistor can be connected to them using pull-up resistor option register L
(PUOL).

(2) Control mode

P10 to P17 function as A/D converter analog input pins (ANI0 to ANI7). On-chip pull-up resistors are
automatically disabled when these pins are specified as analog inputs.

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3.2.3 P20 to P27 (Port 2)

P20 to P27 function as an 8-bit I/O port. Besides serving as I/O port pins, they also function as data input/output
to/from the serial interface, clock input/output, automatic transmit/receive busy input, and strobe output.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P20 to P27 function as an 8-bit I/O port. They can be specified as input or output in 1-bit units using port mode
register 2 (PM2). When they are used as input ports, on-chip pull-up resistors can be connected to them using
pull-up resistor option register L (PUOL).

(2) Control mode

P20 to P27 function as serial interface data input/output, clock input/output, automatic transmit/receive busy
input, and strobe output.

(a) SI0, SI1, SO0, SO1

These are serial data I/O pins of the serial interface.

(b) SCK0, SCK1

These are serial clock I/O pins of the serial interface.

(c) SB0, SB1

These are NEC Electronics standard serial bus interface I/O pins.

(d) BUSY
This is an automatic transmit/receive busy input pin of the serial interface.

(e) STB
This is an automatic transmit/receive strobe output pin of the serial interface.

(f) RxD1, TxD1

These are serial interface serial data I/O pins of the asynchronous serial interface.

Caution When P20 to P27 are used as serial interface pins, the I/O and output latches must be
set according to the function the user requires. For the setting, see Figure 16-4 Format
of Serial Operation Mode Register 0, Figure 18-3 Format of Serial Operation Mode
Register 1, and Table 19-2 Serial Interface Channel 2 Operating Mode Settings.

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3.2.4 P30 to P37 (Port 3)

P30 to P37 function as an 8-bit I/O port. Besides serving as I/O port pins, they also function as timer input/output,
clock output and buzzer output.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P30 to P37 function as an 8-bit I/O port. They can be specified as an input or output in 1-bit units using port
mode register 3 (PM3). When they are used as input port pins, on-chip pull-up resistors can be connected
to then using pull-up resistor option register L (PUOL).

(2) Control mode

P30 to P37 function as timer input/output, clock output, and buzzer output.

(a) TI1 and TI2

These are pins for inputting the external count clock to the 8-bit timer/event counter.

(b) TO0 to TO2

These are timer output pins.

(c) PCL
This is a clock output pin.

(d) BUZ
This is a buzzer output pin.

3.2.5 P40 to P47 (Port 4)

P40 to P47 function as an 8-bit I/O port. Besides serving as I/O port pins, they also function as an address/data
bus.
The test input flag (KRIF) can be set to 1 by detecting a falling edge.
The following operating modes can be specified in 8-bit units.

(1) Port mode

P40 to P47 using function as an 8-bit I/O port. They can be specified for as input or output in 8-bit units using
the internal memory expansion mode register (MM). When they are used as an input port pins, on-chip pull-
up resistors can be connected to them using pull-up resistor option register L (PUOL).

(2) Control mode

P40 to P47 function as the lower address/data bus pins (AD0 to AD7) in external memory expansion mode.
When these pins are used as an address/data bus, on-chip pull-up resistors are automatically disabled.

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3.2.6 P50 to P57 (Port 5)

P50 to P57 function as an 8-bit I/O port. Besides serving as I/O port pins, they also function as an address bus.
P50 to P57 can drive LEDs directly.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P50 to P57 function as an 8-bit I/O port. They can be specified as input or output in 1-bit units using port mode
register 5 (PM5). When they are used as input port pins, on-chip pull-up resistors can be connected to them
using pull-up resistor option register L (PUOL).

(2) Control mode

P50 to P57 function as the higher address bus pins (A8 to A15) in external memory expansion mode. When
these pins are used as an address bus, on-chip pull-up resistors are automatically disabled.

3.2.7 P60 to P67 (Port 6)

P60 to P67 function as an 8-bit I/O port. Besides serving as I/O port pins, they are also used for control in external
memory expansion mode. P60 to P63 can drive LEDs directly.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P60 to P67 function as an 8-bit I/O port. They can be specified as input or output in 1-bit units using port mode
register 6 (PM6).
P60 to P63 are N-ch open-drain outputs. In mask ROM products, on-chip pull-up resistors can be connected
to these pins using a mask option.
When P64 to P67 are used as input port pins, on-chip pull-up resistor can be connected using pull-up resistor
option register L (PUOL).

(2) Control mode

P60 to P67 function as control signal output pins (RD, WR, WAIT, ASTB) in external memory expansion mode.
When pins are used as control signal outputs, on-chip pull-up resistors are automatically disabled.

Caution When an external wait is not used in external memory expansion mode, P66 can be used as
an I/O port pins.

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3.2.8 P70 to P72 (Port 7)

P70 to P72 function as a 3-bit I/O port. Besides serving as I/O port pins, they also function as serial interface data
I/O and clock I/O.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P70 to P72 function as a 3-bit I/O port. They can be specified as input port or output in 1-bit units using port
mode register 7 (PM7). When they are used as input port pins, on-chip pull-up resistors can be connected
to them using pull-up resistor option register L (PUOL).

(2) Control mode

P70 to P72 function as serial interface data I/O and clock I/O.

(a) SI2, SO2

These are serial data I/O pins of the serial interface.

(b) SCK2
This is a serial clock I/O pin of the serial interface.

(c) RxD0, TxD0

These are serial data I/O pins of the asynchronous serial interface.

(d) ASCK
This is a serial clock I/O pin of the asynchronous serial interface.

Caution When P70 to P72 are used as serial interface pins, the I/O and output latches must be set
according to the function the user requires.
For the setting, see the operation mode setting list in Table 19-2 Serial Interface Channel
2.

3.2.9 P120 to P127 (Port 12)

P120 to P127 function as an 8-bit I/O port. Besides serving as I/O port pins, they also function as a real-time output
port.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P120 to P127 function as an 8-bit I/O port. They can be specified as input or output in 1-bit units using port
mode register 12 (PM12). When they are used as input port pins, on-chip pull-up resistors can be connected
to them using pull-up resistor option register H (PUOH).

(2) Control mode

P120 to P127 function as a real-time output port (RTP0 to RTP7) that outputs data in synchronization with
a trigger.

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3.2.10 P130 and P131 (Port 13)

P130 and P131 function as a 2-bit I/O port. Besides serving as I/O port pins, they also function as D/A converter
analog output.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P130 and P131 function as a 2-bit I/O port. They can be specified as input or output in 1-bit units using port
mode register 13 (PM13). When they are used as an input port pins, on-chip pull-up resistors can be connected
to them using pull-up resistor option register H (PUOH).

(2) Control mode

P130 and P131 function as D/A converter analog outputs (ANO0 and ANO1).

Caution When only one of the D/A converter channels is used with AVREF1 < VDD0, the other pins that
are not used as analog outputs must be set as follows:
• Set the PM13x bit of port mode register 13 (PM13) to 1 (input mode) and connect the pin
to VSS0.
• Clear the PM13x bit of port mode register 13 (PM13) to 0 (output mode) and the output latch
to 0, and output a low level from the pin.

3.2.11 AVREF0
This is the A/D converter reference voltage input pin. This pin also serves as an analog power supply pin. Supply
power to this pin when the A/D converter is used.
When the A/D converter is not used, use the same voltage that of the VDD0 or VSS0 pin.

3.2.12 AVREF1
This is the D/A converter reference voltage input pin.
When the D/A converter is not used, use the same voltage that of the VDD0 pin.

3.2.13 AVSS
This is the ground voltage pin of A/D converter and D/A converter. Always use the same voltage as that of the
VSS0 pin even when the A/D converter or D/A converter is not used.

3.2.14 RESET
This is the low-level active system reset input pin.

3.2.15 X1 and X2
These are crystal resonator connection pins for main system clock oscillation. For external clock supply, input
a signal to X1 and its inverted signal to X2.

3.2.16 XT1 and XT2

These are crystal resonator connection pins for subsystem clock oscillation.
For external clock supply, input a signal to XT1 and its inverted signal to XT2.

3.2.17 VDD0, VDD1

VDD0 is the positive power supply pin for ports.
VDD1 is the positive power supply pin for blocks other than port and analog blocks.

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3.2.18 VSS0, VSS1

VSS0 is the ground potential pin for ports.
VSS1 is the ground potential pin for blocks other than port and analog blocks.

3.2.19 VPP (Flash memory version only)

This is the high-voltage application pin for flash memory programming mode setting and program write/verify.
Connect this pin in either of the following ways.
• Connect independently to a 10 kΩ pull-down resistor.
• By using a jumper on the board, connect directly to the dedicated flash programmer in the programming mode
or to VSS0 in the normal operation mode.

3.2.20 IC (Mask ROM version only)

The IC (Internally Connected) pin is provided to set the test mode to check the µPD780058 Subseries at delivery.
Connect it directly to VSS0 with the shortest possible wire in the normal operating mode.
When a voltage difference is produced between the IC pin and VSS0 pin because the wiring between those two
pins is too long or an external noise is input to the IC pin, the user’s program may not run normally.

Connect the IC pin to VSS0 directly.

VSS0 IC

As short as possible

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3.3 I/O Circuits and Recommended Connection of Unused Pins

Table 3-1 shows the pin I/O circuit types and the recommended connection of unused pins.
Refer to Figure 3-1 for the configuration of the I/O circuit of each type.

Table 3-1. Pin I/O Circuit Types (1/2)

Pin Name I/O Circuit Type I/O Recommended Connection of Unused Pins
P00/INTP0/TI00 2 Input Connect to VSS0.
P01/INTP1/TI01 8-C I/O Input: Independently connect to VSS0 via a resistor.
P02/INTP2 Output: Leave open.

P03/INTP3
P04/INTP4
P05/INTP5
P07/XT1 16 Input Connect to VDD0.
P10/ANI0 to P17/ANI7 11-D I/O Input: Independently connect to VDD0 or VSS0 via a resistor.
P20/SI1 8-C Output: Leave open.

P21/SO1 5-H
P22/SCK1 8-C
P23/STB/TxD1 5-H
P24/BUSY/RxD1 8-C
P25/SI0/SB0 10-B
P26/SO0/SB1
P27/SCK0
P30/TO0 5-H
P31/TO1
P32/TO2
P33/TI1 8-C
P34/TI2
P35/PCL 5-H
P36/BUZ
P37
P40/AD0 to P47/AD7 5-N I/O Input: Independently connect to VDD0 via a resistor.
Output: Leave open.
P50/A8 to P57/A15 5-H I/O Input: Independently connect to VDD0 or VSS0 via a resistor.
Output: Leave open.

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Table 3-1. Pin I/O Circuit Types (2/2)

Pin Name I/O Circuit Type I/O Recommended Connection of Unused Pins
P60 to P63 (mask ROM version) 13-J I/O Input: Independently connect to VDD0 via a resistor.
P60 to P63 (flash memory version) 13-K Output: Set 0 to the port and leave open at low level output.

P64/RD 5-H I/O Input: Independently connect to VDD0 or VSS0 via a resistor.
P65/WR Output: Leave open.

P66/WAIT
P67/ASTB
P70/SI2/RxD0 8-C
P71/SO2/TxD0 5-H
P72/SCK2/ASCK 8-C
P120/RTP0 to P127/RTP7 5-H
P130/ANO0, P131/ANO1 12-C I/O Input: Independently connect to VSS0 via a resistor.
Output: Leave open.
RESET 2 Input —
XT2 16 — Leave open.
AVREF0 — Connect to VDD0 or VSS0.
AVREF1 Connect to VDD0.
AVSS Connect to VSS0.
IC (mask ROM version) Connect directly to VSS0.
VPP (flash memory version) Independently connect via a 10 kΩ pull-down resistor, or
connect to VSS0 or VSS1 directly.

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Figure 3-1. Pin I/O Circuit List (1/2)

Type 2 Type 8-C

VDD0

Pull-up
P-ch
enable
IN
VDD0

Data P-ch

Schmitt-triggered input with IN/OUT

hysteresis characteristics Output N-ch
disable
VSS0

Type 5-H VDD0 Type 10-B

VDD0

Pull-up Pull-up
P-ch P-ch
enable enable

VDD0
VDD0
Data
P-ch Data
P-ch
IN/OUT
IN/OUT
Output N-ch Open drain
disable Output disable N-ch
VSS0
VSS0

Input
enable

Type 5-N VDD0 Type 11-D VDD0

Pull-up
P-ch
Pull-up enable
P-ch VDD0
enable
VDD0 Data
P-ch

Data IN/OUT
P-ch
Output N-ch
disable
P-ch VSS0
IN/OUT Comparator
+
Output – N-ch
N-ch VSS0
disable
VSS0 VREF (threshold voltage)

Input
enable

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Figure 3-1. Pin I/O Circuit List (2/2)

Type 12-C VDD0 Type 13-K

IN/OUT
Pull-up
P-ch
enable Data
VDD0 Output disable N-ch
Data VSS0
P-ch

IN/OUT VDD0

Output N-ch
disable RD P-ch
VSS0

Input P-ch
enable Medium breakdown
Analog output input buffer
voltage N-ch

Type 13-J Type 16

VDD0
Mask Feedback
option cut-off
IN/OUT
P-ch
Data
Output disable N-ch
VSS0
VDD0

RD P-ch

XT1 XT2
Medium breakdown
input buffer

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4.1 Pin Function List

(1) Port pins (1/2)

Pin Name I/O Function After Reset Alternate Function
P00 Input Port 0 Input only Input INTP0/TI00
I/O 7-bit I/O port Input/output can be specified in 1-bit Input
P01 INTP1/TI01
units.
P02 INTP2
If used as an input port, an on-chip
P03 pull-up resistor can be connected by INTP3
P04 setting software. INTP4

P05 INTP5
P07Note 1 Input Input only Input XT1
P10 to P17 I/O Port 1 Input ANI0 to ANI7
8-bit I/O port
Input/output can be specified in 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by
setting softwareNote 2.
P20 I/O Port 2 Input SI1
8-bit I/O port
P21 SO1
Input/output can be specified in 1-bit units.
P22 If used as an input port, an on-chip pull-up resistor can be connected by SCK1
P23 setting software. STB/TxD1

P24 BUSY/RxD1
P25 SI0/SB0/SDA0
P26 SO0/SB1/SDA1

P27 SCK0/SCL
P30 I/O Port 3 Input TO0

P31 8-bit I/O port TO1

Input/output mode can be specified in 1-bit units.
P32 TO2
If used as an input port, an on-chip pull-up resistor can be connected by
P33 setting software. TI1

P34 TI2
P35 PCL
P36 BUZ

P37 —

Notes 1. When the P07/XT1 pin is used as an input port, set bit 6 (FRC) of the processor clock control register
(PCC) to 1 (do not use the feedback resistor incorporated in the subsystem clock oscillator).
2. When pins P10/ANI0 to P17/ANI7 are used as an analog input of the A/D converter, set port 1 to the
input mode. In this case, any connected on-chip pull-up resistors are automatically disabled.

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(1) Port pins (2/2)

Pin Name I/O Function After Reset Alternate Function

P40 to P47 I/O Port 4 Input AD0 to AD7

8-bit I/O port
Input/output can be specified in 8-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by
setting software.
The test input flag (KRIF) is set to 1 by falling edge detection.
P50 to P57 I/O Port 5 Input A8 to A15
8-bit I/O port
LEDs can be driven directly.
Input/output can be specified in 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by
setting software.
P60 I/O Port 6 N-ch open-drain I/O port Input —

P61 8-bit I/O port On-chip pull-up resistors can be

Input/output can be specified in specified by mask option.
P62
1-bit units. (Mask ROM version only).
P63 LEDs can be driven directly.
P64 If used as an input port, an on-chip RD
P65 pull-up resistor can be connected by WR
setting software.
P66 WAIT

P67 ASTB
P70 I/O Port 7 Input SI2/RxD0
3-bit I/O port
P71 Input/output can be specified in 1-bit units. SO2/TxD0
If used as an input port, an on-chip pull-up resistor can be connected by
P72 SCK2/ASCK
setting software.
P120 to P127 I/O Port 12 Input RTP0 to RTP7
8-bit I/O port
Input/output can be specified in 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by
setting software.
P130 to P131 I/O Port 13 Input ANO0 to ANO1
2-bit I/O port
Input/output can be specified in 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by
setting software.

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(2) Non-port pins (1/2)

Pin Name I/O Function After Reset Alternate Function

INTP0 Input External interrupt request inputs with specifiable valid edges (rising Input P00/TI00
edge, falling edge, both rising and falling edges).
INTP1 P01/TI01
INTP2 P02

INTP3 P03
INTP4 P04
INTP5 P05
SI0 Input Serial interface serial data input Input P25/SB0/SDA0

SI1 P20
SI2 P70/RxD
SO0 Output Serial interface serial data output Input P26/SB1/SDA1

SO1 P21
SO2 P71/TxD
SB0 I/O Serial interface serial data input/output Input P25/SI0/SDA0

SB1 P26/SO0/SDA1
SDA0 P25/SI0/SB0
SDA1 P26/SO0/SB1

SCK0 I/O Serial interface serial clock input/output Input P27/SCL

SCK1 P22
SCK2 P72/ASCK
SCL P27/SCK0

STB Output Serial interface automatic transmit/receive strobe output Input P23/TxD1
BUSY Input Serial interface automatic transmit/receive busy input Input P24/RxD1
RxD0 Input Asynchronous serial interface serial data input Input P70/SI2
RxD1 P24/BUSY

TxD Output Asynchronous serial interface serial data output Input P71/SO2
TxD1 P23/STB

ASCK Input Asynchronous serial interface serial clock input Input P72/SCK2
TI00 Input External count clock input to 16-bit timer (TM0) Input P00/INTP0
TI01 Capture trigger signal input to capture register (CR00) P01/INTP1

TI1 External count clock input to 8-bit timer (TM1) P33

TI2 External count clock input to 8-bit timer (TM2) P34
TO0 Output 16-bit timer (TM0) output (also used for 14-bit PWM output) Input P30
TO1 8-bit timer (TM1) output P31
TO2 8-bit timer (TM2) output P32
PCL Output Clock output (for main system clock and subsystem clock trimming) Input P35
BUZ Output Buzzer output Input P36
RTP0 to RTP7 Output Real-time output port outputting data in synchronization with trigger Input P120 to P127

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(2) Non-port pins (2/2)

Pin Name I/O Function After Reset Alternate Function

AD0 to AD7 I/O Lower address/data bus when expanding memory externally Input P40 to P47
A8 to A15 Output Higher address bus when expanding memory externally Input P50 to P57
RD Output Strobe signal output for read operation from external memory Input P64

WR Strobe signal output for write operation to external memory P65

WAIT Input Wait insertion when accessing external memory Input P66
ASTB Output Strobe output externally latching address information output to ports 4 Input P67
and 5 to access external memory

ANI0 to ANI7 Input A/D converter analog input Input P10 to P17
ANO0, ANO1 Output D/A converter analog output Input P130, P131
AVREF0 Input A/D converter reference voltage input (also functions as analog power supply) — —

AVREF1 Input D/A converter reference voltage input — —

AVSS — A/D converter, D/A converter ground potential. Use the same potential — —
as VSS0.
RESET Input System reset input — —

X1 Input Crystal connection for main system clock oscillation — —

X2 — — —
XT1 Input Crystal connection for subsystem clock oscillation Input P07

XT2 — — —
VDD0 — Positive power supply for ports — —
VSS0 — Ground potential for ports — —

VDD1 — Positive power supply (except ports and analog block) — —

VSS1 — Ground potential (except ports and analog block) — —

VPP — High-voltage application for program write/verify. — —

VSS — Ground potential — —

IC — Internally connected. Connect directly to VSS0. — —

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4.2 Description of Pin Functions

4.2.1 P00 to P05, P07 (Port 0)

P00 to P05 and P07 function as a 7-bit I/O port. Besides serving as I/O port pins, they function as an external
interrupt request input, an external count clock input to the timer, a capture trigger signal input, and crystal connection
for subsystem oscillation.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P00 and P07 function as input-only port pins and P01 to P05 function as I/O port pins.
P01 to P05 can be specified as input or output in 1-bit units using port mode register 0 (PM0). When they
are used as input port pins, on-chip pull-up resistors can be connected to them using pull-up resistor option
register L (PUOL).

(2) Control mode

In this mode, P00 to P05 and P07 function as an external interrupt request input, an external count clock input
to the timer, and crystal connection for subsystem clock oscillation.

(a) INTP0 to INTP5

INTP0 to INTP5 are external interrupt request input pins for which valid edges can be specified (rising
edge, falling edge, and both rising and falling edges). INTP0 and INTP1 become a 16-bit timer/event
counter capture trigger signal input pins with a valid edge input.

(b) TI00
This is a pin for inputting the external count clock to the 16-bit timer/event counter.

(c) TI01
This is a pin for inputting the capture trigger signal to the capture register (CR00) of the 16-bit timer/event
counter.

(d) XT1
This is a crystal connection pin for subsystem clock oscillation.

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4.2.2 P10 to P17 (Port 1)

P10 to P17 function as an 8-bit I/O port. Besides serving as I/O port pins, they also function as an A/D converter
analog inputs.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P10 to P17 function as an 8-bit I/O port.
They can be specified as input or output in 1-bit units using port mode register 1 (PM1). When they are used
as input port pins, on-chip pull-up resistor can be connected to them using pull-up resistor option register L
(PUOL).

(2) Control mode

P10 to P17 function as A/D converter analog input pins (ANI0 to ANI7). On-chip pull-up resistors are
automatically disabled when these pins are specified as analog inputs.

4.2.3 P20 to P27 (Port 2)

P20 to P27 an 8-bit I/O port. Besides serving as I/O port pins, they also function as data input/output to/from the
serial interface, clock input/output, automatic transmit/receive busy input, and strobe output.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P20 to P27 function as an 8-bit I/O port. They can be specified as input or output in 1-bit units using port mode
register 2 (PM2). When they are used as input port pins, on-chip pull-up resistors can be connected to them
using pull-up resistor option register L (PUOL).

(2) Control mode

P20 to P27 function as serial interface data input/output, clock input/output, automatic transmit/receive busy
input, and strobe output.

(a) SI0, SI1, SO0, SO1, SB0, SB1, SDA0, SDA1

These are serial data I/O pins of the serial interface.

(b) SCK0, SCK1, SCL

These are serial clock I/O pins of the serial interface.

(c) BUSY
This is an automatic transmit/receive busy input pin of the serial interface.

(d) STB
This is an automatic transmit/receive strobe output pin of the serial interface.

(e) RxD1, TxD1

These are serial interface serial data I/O pins of the asynchronous serial interface.

Caution When P20 to P27 are used as a serial interface pins, the I/O and output latches must
be set according to the function the user requires. For the setting, see Figure 17-4
Format of Serial Operation Mode Register 0, Figure 18-3 Format of Serial Operation
Mode Register 1, and Table 19-2 Serial Interface Channel 2 Operating Mode Settings.

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4.2.4 P30 to P37 (Port 3)

P30 to P37 function as an 8-bit I/O port. Besides serving as I/O port pins, they also function as timer input/output,
clock output, and buzzer output.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P30 to P37 function as an 8-bit I/O port. They can be specified as an input or output using in 1-bit units port
mode register 3 (PM3). When they are used as input port pins, on-chip pull-up resistors can be connected
to them using pull-up resistor option register L (PUOL).

(2) Control mode

P30 to P37 function as timer input/output, clock output, and buzzer output.

(a) TI1 and TI2

These are pins for inputting the external count clock to the 8-bit timer/event counter.

(b) TO0 to TO2

These are timer output pins.

(c) PCL
This is a clock output pin.

(d) BUZ
This is a buzzer output pin.

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4.2.5 P40 to P47 (Port 4)

P40 to P47 function as an 8-bit I/O port. Besides serving as I/O port pins, they also function as an address/data
bus.
The test input flag (KRIF) can be set to 1 by detecting a falling edge.
The following operating modes can be specified in 8-bit units.

(1) Port mode

P40 to P47 function as an 8-bit I/O port. They can be specified as input or output in 8-bit units using the internal
memory expansion mode register (MM). When they are used as input port pins, on-chip pull-up resistors can
be connected to them using pull-up resistor option register L (PUOL).

(2) Control mode

P40 to P47 function as the lower address/data bus pins (AD0 to AD7) in external memory expansion mode.
When these pins are used as an address/data bus, on-chip pull-up resistors are automatically disabled.

4.2.6 P50 to P57 (Port 5)

P50 to P57 function as an 8-bit I/O port. Besides serving as I/O port pins, they also function as an address bus.
P50 to P57 can drive LEDs directly.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P50 to P57 function as an 8-bit I/O port. They can be specified as input or output in 1-bit units using port mode
register 5 (PM5). When they are used as input port pins, on-chip pull-up resistors can be connected to them
using pull-up resistor option register L (PUOL).

(2) Control mode

P50 to P57 function as the higher address bus pins (A8 to A15) in external memory expansion mode. When
these pins are used as an address bus, on-chip pull-up resistors are automatically disabled.

4.2.7 P60 to P67 (Port 6)

P60 to P67 function as an 8-bit I/O port. Besides serving as I/O port pins, they are also used for control in external
memory expansion mode. P60 to P63 can drive LEDs directly.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P60 to P67 function as an 8-bit I/O port. They can be specified as input or output in 1-bit units using port mode
register 6 (PM6).
P60 to P63 are N-ch open-drain outputs. In mask ROM products, on-chip pull-up resistors can be connected
to these pins using a mask option.
When P64 to P67 are used as input port pins, on-chip pull-up resistor can be connected using pull-up resistor
option register L (PUOL).

(2) Control mode

P60 to P67 functions as control signal output pins (RD, WR, WAIT, ASTB) in external memory expansion mode.
When pins are used as control signal outputs, the on-chip pull-up resistors are automatically disabled.

Caution When an external wait is not used in external memory expansion mode, P66 can be used as
an I/O port pin.

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4.2.8 P70 to P72 (Port 7)

P70 to P72 function as a 3-bit I/O port. Besides serving as I/O port pins, they also function as serial interface data
I/O and clock I/O.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P70 to P72 function as a 3-bit I/O port. They can be specified as input port or output in 1-bit units using port
mode register 7 (PM7). When they are used as input port pins, on-chip pull-up resistors can be connected
to them using pull-up resistor option register L (PUOL).

(2) Control mode

P70 to P72 function as serial interface data I/O and clock I/O.

(a) SI2, SO2

These are serial data I/O pins of the serial interface.

(b) SCK2
This is a serial clock I/O pin of the serial interface.

(c) RxD0, TxD0

These are serial interface serial data I/O pins of the asynchronous serial interface.

(d) ASCK
This is a serial clock I/O pin of the asynchronous serial interface.

Caution When P70 to P72 are used as serial interface pins, the I/O and output latches must be set
according to the function the user requires.
For the setting, see to the operation mode setting list in Table 19-2 Serial Interface Channel
2.

4.2.9 P120 to P127 (Port 12)

P120 to P127 function as an 8-bit I/O port. Besides serving as an I/O port pins, they also function as a real-time
output port.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P120 to P127 function as an 8-bit I/O port. They can be specified as input or output port in 1-bit units using
port mode register 12 (PM12). When they are used as input port pins, on-chip pull-up resistors can be
connected to them using pull-up resistor option register H (PUOH).

(2) Control mode

P120 to P127 function as a real-time output port (RTP0 to RTP7) that outputs data in synchronization with
a trigger.

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4.2.10 P130 and P131 (Port 13)

P130 and P131 function as a 2-bit I/O port. Besides serving as I/O port pins, they also function as D/A converter
analog output.
The following operating modes can be specified in 1-bit units.

(1) Port mode

P130 and P131 function as a 2-bit I/O port. They can be specified as input or output in 1-bit units using port
mode register 13 (PM13). When they are used as input port pins, on-chip pull-up resistors can be connected
to them using pull-up resistor option register H (PUOH).

(2) Control mode

P130 and P131 function as D/A converter analog outputs (ANO0 and ANO1).

Caution When only one of the D/A converter channels is used with AVREF1 < VDD0, the other pins that
are not used as analog outputs must be set as follows:
• Set the PM13x bit of port mode register 13 (PM13) to 1 (input mode) and connect the pin
to VSS0.
• Clear the PM13x bit of port mode register 13 (PM13) to 0 (output mode) and the output latch
to 0, and output a low level from the pin.

4.2.11 AVREF0
This is the A/D converter reference voltage input pin. This pin also serves as an analog power supply pin. Supply
power to this pin when the A/D converter is used.
When the A/D converter is not used, use the same voltage that of the VDD0 or VSS0 pin.

4.2.12 AVREF1
This is the D/A converter reference voltage input pin.
When the D/A converter is not used, use the same voltage that of the VDD0 pin.

4.2.13 AVSS
This is the ground voltage pin of A/D converter and D/A converter. Always use the same voltage as that of the
VSS0 pin even when the A/D converter or D/A converter is not used.

4.2.14 RESET
This is the low-level active system reset input pin.

4.2.15 X1 and X2
These are crystal resonator connection pins for main system clock oscillation. For external clock supply, input
a signal to X1 and its inverted signal to X2.

4.2.16 XT1 and XT2

These are crystal resonator connection pins for subsystem clock oscillation.
For external clock supply, input a signal to XT1 and its inverted signal to XT2.

4.2.17 VDD0, VDD1

VDD0 is the positive power supply pin for ports.
VDD1 is the positive power supply pin for blocks other than port and analog blocks.

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4.2.18 VSS0, VSS1

VSS0 is the ground potential pin for ports.
VSS1 is the ground potential pin for blocks other than port and analog blocks.

4.2.19 VPP (Flash memory version only)

This is the high-voltage apply pin for flash memory programming mode setting and program write/verify.
Connect this pin in either of the following ways.
• Connect independently to a 10 kΩ pull-down resistor.
• By using a jumper on the board, connect directly to the dedicated flash programmer in the programming mode
or to VSS0 in the normal operation mode.

4.2.20 IC (Mask ROM version only)

The IC (Internally Connected) pin is provided to set the test mode to check the µPD780058Y Subseries at delivery.
Connect it directly to VSS0 with the shortest possible wire in the normal operating mode.
When a voltage difference is produced between the IC pin and VSS0 pin because the wiring between those two
pins is too long or an external noise is input to the IC pin, the user’s program may not run normally.

Connect the IC pin to VSS0 directly.

VSS0 IC

As short as possible

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4.3 I/O Circuits and Recommended Connection of Unused Pins

Table 4-1 shows the pin I/O circuit types and the recommended connection of unused pins.
Refer to Figure 4-1 for the configuration of the I/O circuit of each type.

Table 4-1. Pin I/O Circuit Types (1/2)

Pin Name I/O Circuit Type I/O Recommended Connection of Unused Pins
P00/INTP0/TI00 2 Input Connect to VSS0.
P01/INTP1/TI01 8-C I/O Input: Independently connect to VSS0 via a resistor.
P02/INTP2 Output: Leave open.

P03/INTP3
P04/INTP4
P05/INTP5
P07/XT1 16 Input Connect to VDD0
P10/ANI0 to P17/ANI7 11-D I/O Input: Independently connect to VDD0 or VSS0 via a resistor.
P20/SI1 8-C Output: Leave open.

P21/SO1 5-H
P22/SCK1 8-C
P23/STB/TxD1 5-H
P24/BUSY/RxD1 8-C
P25/SI0/SB0/SDA0 10-B
P26/SO0/SB1/SDA1
P27/SCK0/SCL
P30/TO0 5-H
P31/TO1
P32/TO2
P33/TI1 8-C
P34/TI2
P35/PCL 5-H
P36/BUZ
P37
P40/AD0 to P47/AD7 5-N I/O Input: Independently connect to VDD0 via a resistor.
Output: Leave open.
P50/A8 to P57/A15 5-H I/O Input: Independently connect to VDD0 or VSS0 via a resistor.
Output: Leave open.

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Table 4-1. Pin I/O Circuit Types (2/2)

Pin Name I/O Circuit Type I/O Recommended Connection of Unused Pins
P60 to P63 (mask ROM version) 13-J I/O Input: Independently connect to VDD0 via a resistor.
Output: Set 0 to the port and leave open at low level output.
P60 to P63 (flash memory version) 13-K I/O Input: Independently connect to VDD0 or VSS0 via a resistor.
P64/RD 5-H Output: Leave open.

P65/WR
P66/WAIT
P67/ASTB
P70/SI2/RxD0 8-C
P71/SO2/TxD0 5-H
P72/SCK2/ASCK 8-C
P120/RTP0 to P127/RTP7 5-H
P130/ANO0, P131/ANO1 12-C I/O Input: Independently connect to VSS0 via a resistor.
Output: Leave open.
RESET 2 Input —
XT2 16 — Leave open.
AVREF0 — Connect to VDD0 or VSS0.
AVREF1 Connect to VDD0.
AVSS Connect to VSS0.
IC (mask ROM version) Connect directly to VSS0.
VPP (flash memory version) Independently connect 10 kΩ pull-down resistor, or connect
to VSS0 or VSS1 directly.

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Figure 4-1. Pin I/O Circuit List (1/2)

Type 2 Type 8-C

VDD0

Pull-up
P-ch
enable
IN
VDD0

Data P-ch

Schmitt-triggered input with IN/OUT

hysteresis characteristics Output N-ch
disable
VSS0

Type 5-H VDD0 Type 10-B

VDD0

Pull-up Pull-up
P-ch P-ch
enable enable

VDD0
VDD0
Data
P-ch Data
P-ch
IN/OUT
IN/OUT
Output N-ch Open drain
disable Output disable N-ch
VSS0
VSS0

Input
enable

Type 5-N VDD0 Type 11-D VDD0

Pull-up
P-ch
Pull-up enable
P-ch VDD0
enable
VDD0 Data
P-ch

Data IN/OUT
P-ch
Output N-ch
disable
P-ch VSS0
IN/OUT Comparator
+
Output – N-ch
N-ch VSS0
disable
VSS0 VREF (threshold voltage)

Input
enable

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Figure 4-1. Pin I/O Circuit List (2/2)

Type 12-C VDD0 Type 13-K

IN/OUT
Pull-up
P-ch
enable Data
VDD0 Output disable N-ch
Data VSS0
P-ch

IN/OUT VDD0

Output N-ch
disable RD P-ch
VSS0

Input P-ch
enable Medium breakdown
Analog output input buffer
voltage N-ch

Type 13-J Type 16

VDD0
Mask Feedback
option cut-off
IN/OUT
P-ch
Data
Output disable N-ch
VSS0
VDD0

RD P-ch

XT1 XT2
Medium breakdown
input buffer

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5.1 Memory Spaces

Figures 5-1 to 5-6 show the memory maps.

Figure 5-1. Memory Map (µPD780053, 780053(A), 780053Y, 780053Y(A))

FFFFH Special function

registers (SFRs)
256 × 8 bits
FF00H
FEFFH General-purpose registers
FEE0H 32 × 8 bits
FEDFH

Internal high-speed RAM

1,024 × 8 bits

FB00H
FAFFH
Unusable
FAE0H
FADFH 5FFFH
Internal buffer RAM
32 × 8 bits Program area
FAC0H
Data memory FABFH 1000H
space Unusable 0FFFH
FA80H
FA7FH
CALLF entry area

0800H
External memory 07FFH
39,552 × 8 bits
Program area
Program
memory
0080H
space
6000H 007FH
5FFFH
CALLT table area

0040H
Internal ROM
003FH
24,576 × 8 bits
Vector table area

0000H 0000H

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Figure 5-2. Memory Map (µPD780054, 780054(A), 780054Y, 780054Y(A))

FFFFH Special function

registers (SFRs)
256 × 8 bits
FF00H
FEFFH General-purpose registers
FEE0H 32 × 8 bits
FEDFH

Internal high-speed RAM

1,024 × 8 bits

FB00H
FAFFH
Unusable
FAE0H
FADFH 7FFFH
Internal buffer RAM
32 × 8 bits Program area
FAC0H
Data memory FABFH 1000H
space Unusable 0FFFH
FA80H
FA7FH
CALLF entry area

0800H
External Memory 07FFH
31,360 × 8 bits
Program area
Program
memory
0080H
space
8000H 007FH
7FFFH
CALLT table area

0040H
Internal ROM
003FH
32,768 × 8 bits
Vector table area

0000H 0000H

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Figure 5-3. Memory Map (µPD780055, 780055(A), 780055Y, 780055Y(A))

FFFFH Special function

registers (SFRs)
256 × 8 bits
FF00H
FEFFH General-purpose registers
FEE0H 32 × 8 bits
FEDFH

Internal high-speed RAM

1,024 × 8 bits

FB00H
FAFFH
Unusable
FAE0H
FADFH 9FFFH
Internal buffer RAM
32 × 8 bits Program area
FAC0H
Data memory FABFH 1000H
space Unusable 0FFFH
FA80H
FA7FH
CALLF entry area

0800H
External memory 07FFH
23,168 × 8 bits
Program area
Program
memory
0080H
space
A000H 007FH
9FFFH
CALLT table area

0040H
Internal ROM
003FH
40,960 × 8 bits
Vector table area

0000H 0000H

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Figure 5-4. Memory Map (µPD780056, 780056(A), 780056Y, 780056Y(A))

FFFFH Special function

registers (SFRs)
256 × 8 bits
FF00H
FEFFH General-purpose registers
FEE0H 32 × 8 bits
FEDFH

Internal high-speed RAM

1,024 × 8 bits

FB00H
FAFFH
Unusable
FAE0H
FADFH BFFFH
Internal buffer RAM
32 × 8 bits Program area
FAC0H
Data memory FABFH 1000H
space Unusable 0FFFH
FA80H
FA7FH
CALLF entry area

0800H
External memory 07FFH
14,976 × 8 bits
Program area
Program
memory
0080H
space
C000H 007FH
BFFFH
CALLT table area

0040H
Internal ROM
003FH
49,152 × 8 bits
Vector table area

0000H 0000H

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Figure 5-5. Memory Map (µPD780058, 780058B, 780058B(A), 780058BY, 780058BY(A))

FFFFH Special function

registers (SFRs)
256 × 8 bits
FF00H
FEFFH General-purpose registers
FEE0H 32 × 8 bits
FEDFH

Internal high-speed RAM

1,024 × 8 bits

FB00H
FAFFH
Unusable
FAE0H
FADFH EFFFH
Internal buffer RAM
32 × 8 bits Program area
FAC0H
Data memory FABFH 1000H
space Unusable 0FFFH
F800H
F7FFH
CALLF entry area
Internal
expansion RAM 0800H
1,024 × 8 bits 07FFH

Program area
F400H
F3FFH
Unusable
Note 0080H
F000H 007FH
EFFFH
CALLT table area

Program 0040H
Internal ROM
memory 003FH
61,440 × 8 bits
space
Vector table area

0000H 0000H

Note When the internal ROM size is 60 KB, the area F000H to F3FFH cannot be used. F000H to F3FFH
can be used as external memory by setting the internal ROM size to 56 KB or less using the internal
memory size switching register (IMS).

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Figure 5-6. Memory Map (µPD78F0058, 78F0058Y)

FFFFH Special function

registers (SFRs)
256 × 8 bits
FF00H
FEFFH General-purpose registers
FEE0H 32 × 8 bits
FEDFH

Internal high-speed RAM

1,024 × 8 bits

FB00H
FAFFH
Unusable
FAE0H
FADFH EFFFH
Internal buffer RAM
32 × 8 bits Program area
FAC0H
Data memory FABFH 1000H
space Unusable 0FFFH
F800H
F7FFH
CALLF entry area
Internal
expansion RAM 0800H
1,024 × 8 bits 07FFH

Program area
F400H
F3FFH
Note 0080H
Unusable
F000H 007FH
EFFFH
CALLT table area

Program 0040H
Flash memory
memory 003FH
61,440 × 8 bits
space
Vector table area

0000H 0000H

Note When the flash memory size is 60 KB, the area F000H to F3FFH cannot be used. F000H to F3FFH
can be used as external memory by setting the flash memory size to 56 KB or less using the internal
memory size switching register (IMS).

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5.1.1 Internal program memory space

The µPD780058 and 780058Y Subseries have various sizes of internal ROM or flash memory as shown below.
The internal program memory space stores programs and table data. Normally, they are addressed with a program
counter (PC).

Internal ROM
Part Number
Type Capacity
µPD780053, 780053(A), 780053Y, 780053Y(A) Mask ROM 24,576 × 8 bits
µPD780054, 780054(A), 780054Y, 780054Y(A) 32,768 × 8 bits
µPD780055, 780055(A), 780055Y, 780055Y(A) 40,960 × 8 bits
µPD780056, 780056(A), 780056Y, 780056Y(A) 49,152 × 8 bits
µPD780058, 780058B, 780058B(A), 780058BY, 780058BY(A) 61,440 × 8 bits
µPD78F0058, 78F0058Y Flash memory 61,440 × 8 bits

The internal program memory is divided into the following three areas.

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(1) Vector table area

The 64-byte area 0000H to 003FH is reserved as a vector table area. The program start addresses for branch
upon RESET input interrupt request or generation are stored in the vector table area. Of the 16-bit address,
the lower 8 bits are stored at even addresses and the higher 8 bits are stored at odd addresses.

Table 5-1. Vector Table

Vector Table Address Interrupt Source

0000H RESET input

0004H INTWDT
0006H INTP0

0008H INTP1
000AH INTP2
000CH INTP3

000EH INTP4
0010H INTP5
0014H INTCSI0

0016H INTCSI1
0018H INTSER
001AH INTSR/INTCSI2

001CH INTST
001EH INTTM3
0020H INTTM00

0022H INTTM01
0024H INTTM1
0026H INTTM2

0028H INTAD
003EH BRK

(2) CALLT instruction table area

The 64-byte area 0040H to 007FH can store the subroutine entry address of a 1-byte call instruction (CALLT).

(3) CALLF instruction entry area

The area 0800H to 0FFFH can perform a direct subroutine call with a 2-byte call instruction (CALLF).

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5.1.2 Internal data memory space

The µPD780058 and 780058Y Subseries incorporate the following RAMs.

(1) Internal high-speed RAM

High-speed memory of the following configuration is incorporated:
1,024 × 8 bits (FB00H to FEFFH)
In this area, four banks of general-purpose registers, each bank consisting of eight 8-bit registers, are allocated
to the 32-byte area FEE0H to FEFFH.
The internal high-speed RAM can also be used as a stack memory area.

(2) Internal buffer RAM

Buffer RAM is allocated to the 32-byte area from FAC0H to FADFH. The internal buffer RAM is used to store
transmit/receive data of serial interface channel 1 (in 3-wire serial I/O mode with automatic transmit/receive
function). If the 3-wire serial I/O mode with automatic transmit/receive function is not used, the internal buffer
RAM can also be used as normal RAM.

(3) Internal expansion RAM (µPD780058, 780058B, 780058B(A), 780058BY, 780058BY(A), 78F0058, 78F0058Y
only)
Internal expansion RAM is allocated to the 1,024-byte area from F400H to F7FFH.

5.1.3 Special Function Register (SFR) area

On-chip peripheral hardware special-function registers (SFRs) are allocated to the area FF00H to FFFFH. (See
Table 5-2 Special-Function Register List in 5.2.3 Special Function Registers (SFRs)).

Caution Do not access addresses where SFRs are not assigned.

5.1.4 External memory space

The external memory space is accessible by setting the internal memory expansion mode register (MM). External
memory space can store program, table data, etc. and allocate peripheral devices.

5.1.5 Data memory addressing

The method to specify the address of the instruction to be executed next, or the address of a register or memory
to be manipulated when an instruction is executed is called addressing.
The address of the instruction to be executed next is addressed by the program counter PC (for details, see 5.3
Instruction Address Addressing).
To address the memory that is manipulated when an instruction is executed, the µPD780058, 780058Y Subseries
is provided with many addressing modes with a high operability. Especially at addresses corresponding to data
memory area, particular addressing modes can be used in accordance with the functions of the special function
registers (SFRs) and general-purpose registers. This area is between FB00H and FFFFH. The data memory space
is the entire 64 KB space (0000H to FFFFH). Figures 5-7 to 5-12 show the data memory addressing modes. For
details of each addressing, see 5.4 Operand Address Addressing.

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Figure 5-7. Data Memory Addressing (µPD780053, 780053(A), 780053Y, 780053Y(A))

FFFFH
Special function
registers (SFRs) SFR addressing
256 × 8 bits
FF20H
FF1FH
FF00H
FEFFH General-purpose registers
Register addressing
32 × 8 bits Short direct
FEE0H
FEDFH addressing
Internal high-speed RAM
1,024 × 8 bits
FE20H
FE1FH

FB00H
FAFFH
Unusable
FAE0H
FADFH
Direct addressing
Internal buffer RAM
32 × 8 bits Register indirect
FAC0H addressing
FABFH
Unusable Based addressing
FA80H
FA7FH Based indexed
addressing

External memory
39,552 × 8 bits

6000H
5FFFH

Internal ROM
24,576 × 8 bits

0000H

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Figure 5-8. Data Memory Addressing (µPD780054, 780054(A), 780054Y, 780054Y(A))

FFFFH
Special function
registers (SFRs) SFR addressing
256 × 8 bits
FF20H
FF1FH
FF00H
FEFFH General-purpose registers
Register addressing
32 × 8 bits Short direct
FEE0H
FEDFH addressing
Internal high-speed RAM
1,024 × 8 bits
FE20H
FE1FH

FB00H
FAFFH
Unusable
FAE0H
FADFH
Direct addressing
Internal buffer RAM
32 × 8 bits Register indirect
FAC0H addressing
FABFH
Unusable Based addressing
FA80H
FA7FH Based indexed
addressing

External memory
31,360 × 8 bits

8000H
7FFFH

Internal ROM
32,768 × 8 bits

0000H

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Figure 5-9. Data Memory Addressing (µPD780055, 780055(A), 780055Y, 780055Y(A))

FFFFH
Special function
registers (SFRs) SFR addressing
256 × 8 bits
FF20H
FF1FH
FF00H
FEFFH General-purpose registers
Register addressing
32 × 8 bits Short direct
FEE0H
FEDFH addressing
Internal high-speed RAM
1,024 × 8 bits
FE20H
FE1FH

FB00H
FAFFH
Unusable
FAE0H
FADFH
Direct addressing
Internal buffer RAM
32 × 8 bits Register indirect
FAC0H addressing
FABFH
Unusable Based addressing
FA80H
FA7FH Based indexed
addressing

External memory
23,168 × 8 bits

A000H
9FFFH

Internal ROM
40,960 × 8 bits

0000H

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Figure 5-10. Data Memory Addressing (µPD780056, 780056(A), 780056Y, 780056Y(A))

FFFFH
Special function
registers (SFRs) SFR addressing
256 × 8 bits
FF20H
FF1FH
FF00H
FEFFH General-purpose registers
Register addressing
32 × 8 bits Short direct
FEE0H
FEDFH addressing
Internal high-speed RAM
1,024 × 8 bits
FE20H
FE1FH

FB00H
FAFFH
Unusable
FAE0H
FADFH
Direct addressing
Internal buffer RAM
32 × 8 bits Register indirect
FAC0H addressing
FABFH
Unusable Based addressing
FA80H
FA7FH Based indexed
addressing

External memory
14,976 × 8 bits

C000H
BFFFH

Internal ROM
49,152 × 8 bits

0000H

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Figure 5-11. Data Memory Addressing (µPD780058, 780058B, 780058B(A), 780058BY, 780058BY(A))

FFFFH
Special function
registers (SFRs) SFR addressing
256 × 8 bits
FF20H
FF1FH
FF00H
FEFFH General-purpose registers
Register addressing
32 × 8 bits Short direct
FEE0H
FEDFH addressing
Internal high-speed RAM
1,024 × 8 bits
FE20H
FE1FH

FB00H
FAFFH
Unusable
FAE0H
FADFH
Direct addressing
Internal buffer RAM
32 × 8 bits Register indirect
FAC0H addressing
FABFH
Unusable Based addressing
F800H
F7FFH Based indexed
addressing
Internal expansion RAM
1,024 × 8 bits
F400H
F3FFH

UnusableNote

F000H
EFFFH

Internal ROM
61,440 × 8 bits

0000H

Note When the internal ROM size is 60 KB, the area F000H to F3FFH cannot be used. F000H to F3FFH
can be used as external memory by setting the internal ROM size to 56 KB or less using the internal
memory size switching register (IMS).

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Figure 5-12. Data Memory Addressing (µPD78F0058, 78F0058Y)

FFFFH
Special function
registers (SFRs) SFR addressing
256 × 8 bits
FF20H
FF1FH
FF00H
FEFFH General-purpose registers
Register addressing
32 × 8 bits Short direct
FEE0H
FEDFH addressing
Internal high-speed RAM
1,024 × 8 bits
FE20H
FE1FH

FB00H
FAFFH
Unusable
FAE0H
FADFH
Direct addressing
Internal buffer RAM
32 × 8 bits Register indirect
FAC0H addressing
FABFH
Unusable Based addressing
F800H
F7FFH Based indexed
addressing
Internal expansion RAM
1,024 × 8 bits

F400H
F3FFH

UnusableNote

F000H
EFFFH

Flash memory
61,440 × 8 bits

0000H

Note When the flash memory size is 60 KB, the area F000H to F3FFH cannot be used. F000H to F3FFH
can be used as external memory by setting the flash memory size to 56 KB or less using the internal
memory size switching register (IMS).

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5.2 Processor Registers

The µPD780058 and 780058Y Subseries incorporate the following processor registers.

5.2.1 Control registers

The control registers control the program sequence, statuses and stack memory. The control registers consist
of a program counter (PC), a program status word (PSW) and a stack pointer (SP).

(1) Program counter (PC)

The program counter is a 16-bit register which holds the address information of the next program to be
executed.
In normal operation, the PC is automatically incremented according to the number of bytes of the instruction
to be fetched. When a branch instruction is executed, immediate data and register contents are set.
RESET input sets the reset vector table values at addresses 0000H and 0001H to the program counter.

Figure 5-13. Program Counter Format

15 0

PC PC15 PC14 PC13 PC12 PC11 PC10 PC9 PC8 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0

(2) Program status word (PSW)

The program status word is an 8-bit register consisting of various flags to be set/reset by instruction execution.
Program status word contents are automatically stacked upon interrupt request generation or PUSH PSW
instruction execution and are automatically reset upon execution of the RETB, RETI, and POP PSW instructions.
RESET input sets the PSW to 02H.

Figure 5-14. Program Status Word Format

7 0

PSW IE Z RBS1 AC RBS0 0 ISP CY

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(a) Interrupt enable flag (IE)

This flag controls the interrupt request acknowledgment operations of the CPU.
When IE = 0, all interrupt requests except the non-maskable interrupt are disabled (DI status).
When IE = 1, interrupts are enabled (EI status). At this time, acknowledgment of interrupts is controlled
with an inservice priority flag (ISP), an interrupt mask flag for various interrupt sources, and a priority
specification flag.
The interrupt enable flag is reset to 0 when the DI instruction is executed or when an interrupt request
is acknowledged, and set to 1 when the EI instruction is executed.

(b) Zero flag (Z)

When the operation result is zero, this flag is set to 1. It is reset to 0 in all other cases.

(c) Register bank select flags (RBS0 and RBS1)

These are 2-bit flags to select one of the four register banks.
The 2-bit information which indicates the register bank selected by SEL RBn instruction execution is stored
in these flags.

(d) Auxiliary carry flag (AC)

If the operation result has a carry from bit 3 or a borrow at bit 3, this flag is set to 1. It is reset to 0 in
all other cases.

(e) In-service priority flag (ISP)

This flag manages the priority of acknowledgeable maskable vectored interrupts. When ISP = 0, the
vectored interrupt whose priority is specified by the priority specification flag registers (PR0L, PR0H, and
PR1L) (see 21.3 (3) Priority specification flag registers (PR0L, PR0H, and PR1L)) to be low is
disabled. Whether the interrupt is actually acknowledged is controlled by the status of the interrupt enable
flag (IE).

(f) Carry flag (CY)

This flag stores overflow and underflow upon add/subtract instruction execution. It stores the shift-out
value upon rotate instruction execution and functions as a bit accumulator during bit manipulation
instruction execution.

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(3) Stack pointer (SP)

This is a 16-bit register to hold the start address of the memory stack area. Only the internal high-speed RAM
area (FB00H to FEFFH) can be set as the stack area.

Figure 5-15. Stack Pointer Format

15 0

SP SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0

The SP is decremented ahead of write (save) to the stack memory and is incremented after read (reset) from
the stack memory.
Each stack operation saves/resets data as shown in Figures 5-16 and 5-17.

Caution Because RESET input makes SP contents indeterminate, be sure to initialize the SP before
instruction execution.

Figure 5-16. Data to Be Saved to Stack Memory

Interrupt and
PUSH rp instruction CALL, CALLF, and BRK instruction
CALLT instruction
SP SP _ 3

SP SP _ 2 SP SP _ 2 SP _ 3 PC7 to PC0

SP _ 2 Register pair lower SP _ 2 PC7 to PC0 SP _ 2 PC15 to PC8

SP _ 1 Register pair upper SP _ 1 PC15 to PC8 SP _ 1 PSW

SP SP SP

Figure 5-17. Data to Be Reset from Stack Memory

RETI and RETB

POP rp instruction RET instruction instruction

SP Register pair lower SP PC7 to PC0 SP PC7 to PC0

SP + 1 Register pair upper SP + 1 PC15 to PC8 SP + 1 PC15 to PC8

SP SP + 2 SP SP + 2 SP + 2 PSW

SP SP + 3

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5.2.2 General registers

General-purpose registers are mapped at particular addresses (FEE0H to FEFFH) of the data memory. They
consist of 4 banks, each bank containing eight 8-bit registers (X, A, C, B, E, D, L, and H).
Each register can be used as an 8-bit register and two 8-bit registers can be used in pairs as a 16-bit register (AX,
BC, DE, and HL).
They can be described in terms of function names (X, A, C, B, E, D, L, H, AX, BC, DE, and HL) and absolute names
(R0 to R7 and RP0 to RP3).
Register banks to be used for instruction execution are set with the CPU control instruction (SEL RBn). Because
of the 4-register bank configuration, an efficient program can be created by switching between a register for normal
processing and a register for interrupt requests for each bank.

Figure 5-18. General-Purpose Register Configuration

(a) Absolute name

16-bit processing 8-bit processing

FEFFH
R7
BANK0 RP3
R6
FEF8H

R5
BANK1 RP2
R4
FEE0H
R3
BANK2 RP1
R2
FEE8H

R1
BANK3 RP0
R0
FEE0H
15 0 7 0

(b) Function name

16-bit processing 8-bit processing

FEFFH
H
BANK0 HL
L
FEF8H

D
BANK1 DE
E
FEF0H
B
BANK2 BC
C
FEE8H

A
BANK3 AX
X
FEE0H
15 0 7 0

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5.2.3 Special-Function Registers (SFRs)

Unlike a general-purpose register, each special-function register has a special function.
These registers are allocated in the FF00H to FFFFH area.
Special-function registers can be manipulated like general-purpose registers, with operation, transfer and bit
manipulation instructions. The manipulatable bit units, 1, 8, and 16, depend on the special-function register type.
Each manipulation bit unit can be specified as follows.

• 1-bit manipulation
Describe the symbol reserved by assembler for the 1-bit manipulation instruction operand (sfr.bit).
This manipulation can also be specified using an address.
• 8-bit manipulation
Describe the symbol reserved by assembler for the 8-bit manipulation instruction operand (sfr).
This manipulation can also be specified using an address.
• 16-bit manipulation
Describe the symbol reserved by assembler for the 16-bit manipulation instruction operand (sfrp).
When addressing an address, describe an even address.

Table 5-2 gives a list of special-function registers. The meanings of items in the table are as follows.

• Symbol
Symbol indicating the addresses of the special function register. These symbols are reserved words in the
RA78K0 and defined by header file sfrbit.h in the CC78K0, and can be used as the operands of instructions
when the RA78K0, ID78K0, ID78K0-NS, and SM78K0 are used.
• R/W
Indicates whether the corresponding special-function register can be read or written.
R/W: Read/write enabled
R: Read only
W: Write only
• Manipulatable bit units
√ indicates the bit units (1, 8, or 16 bits) in which the register can be manipulated. — indicates that the register
cannot be manipulated in the indicated bit units.
• After reset
Indicates each register status upon RESET input.

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Table 5-2. Special-Function Register List (1/3)

Address Special-Function Register (SFR) Name Symbol R/W Manipulatable Bit Unit After Reset

1 Bit 8 Bits 16 Bits

FF00H Port 0 P0 R/W √ √ — 00H

FF01H Port 1 P1 √ √ —
FF02H Port 2 P2 √ √ —
FF03H Port 3 P3 √ √ —

FF04H Port 4 P4 √ √ — Undefined

FF05H Port 5 P5 √ √ —
FF06H Port 6 P6 √ √ —

FF07H Port 7 P7 √ √ — 00H

FF0CH Port 12 P12 √ √ —
FF0DH Port 13 P13 √ √ —

FF10H Capture/compare register 00 CR00 — — √ Undefined

FF11H

FF12H Capture/compare register 01 CR01 — — √

FF13H

FF14H 16-bit timer register TM0 R — — √ 0000H

FF15H

FF16H Compare register 10 CR10 R/W — √ — Undefined

FF17H Compare register 20 CR20 — √ —

FF18H 8-bit timer register 1 TMS TM1 R — √ √ 00H
FF19H 8-bit timer register 2 TM2 — √
FF1AH Serial I/O shift register 0 SIO0 R/W — √ — Undefined

FF1BH Serial I/O shift register 1 SIO1 — √ —

FF1FH A/D conversion result register ADCR R — √ —
FF20H Port mode register 0 PM0 R/W √ √ — FFH
FF21H Port mode register 1 PM1 √ √ —

FF22H Port mode register 2 PM2 √ √ —

FF23H Port mode register 3 PM3 √ √ —
FF25H Port mode register 5 PM5 √ √ —

FF26H Port mode register 6 PM6 √ √ —

FF27H Port mode register 7 PM7 √ √ —
FF2CH Port mode register 12 PM12 √ √ —

FF2DH Port mode register 13 PM13 √ √ —

FF30H Real-time output buffer register L RTBL — √ — 00H
FF31H Real-time output buffer register H RTBH — √ —

FF34H Real-time output port mode register RTPM √ √ —

FF36H Real-time output port control register RTPC √ √ —

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Table 5-2. Special-Function Register List (2/3)

Address Special-Function Register (SFR) Name Symbol R/W Manipulatable Bit Unit After Reset

1 Bit 8 Bits 16 Bits

FF38H Correction address register 0Note CORAD0 R/W — — √ 0000H

FF39H

FF3AH Correction address register 1Note CORAD1 — — √

FF3BH

FF40H Timer clock select register 0 TCL0 √ √ — 00H

FF41H Timer clock select register 1 TCL1 — √ —

FF42H Timer clock select register 2 TCL2 — √ —

FF43H Timer clock select register 3 TCL3 — √ — 88H
FF47H Sampling clock select register SCS — √ — 00H

FF48H 16-bit timer mode control register TMC0 √ √ —

FF49H 8-bit timer mode control register 1 TMC1 √ √ —
FF4AH Watch timer mode control register TMC2 √ √ —

FF4CH Capture/compare control register 0 CRC0 √ √ — 04H

FF4EH 16-bit timer output control register TOC0 √ √ — 00H
FF4FH 8-bit timer output control register TOC1 √ √ —

FF60H Serial operating mode register 0 CSIM0 √ √ —

FF61H Serial bus interface control register SBIC √ √ —
FF62H Slave address register SVA — √ — Undefined
FF63H Interrupt timing specify register SINT √ √ — 00H
FF68H Serial operating mode register 1 CSIM1 √ √ —
FF69H Automatic data transmit/receive control register ADTC √ √ —
FF6AH Automatic data transmit/receive address pointer ADTP — √ —
FF6BH Automatic data transmit/receive interval specify register ADTI √ √ —
FF70H Asynchronous serial interface mode register ASIM √ √ —
FF71H Asynchronous serial interface status register ASIS R √ √ —
FF72H Serial operating mode register 2 CSIM2 RW √ √ —
FF73H Baud rate generator control register BRGC — √ —
FF74H Transmit shift register TXS SIO2 W — √ — FFH

Receive buffer register RXB R

FF75H Serial interface pin select register SIPS R/W √ √ — 00H

FF80H A/D converter mode register ADM √ √ — 01H

FF84H A/D converter input select register ADIS — √ — 00H

FF8AH Correction control registerNote CORCN √ √ —

FF90H D/A conversion value setting register 0 DACS0 — √ —

FF91H D/A conversion value setting register 1 DACS1 — √ —
FF98H D/A converter mode register DAM √ √ —

Note This register is provided only in the µPD780058, 780058B, 780058B(A), 780058BY, 780058BY(A),
78F0058, and 78F0058Y.

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Table 5-2. Special-Function Register List (3/3)

Address Special-Function Register (SFR) Name Symbol R/W Manipulatable Bit Unit After Reset

1 Bit 8 Bits 16 Bits

FFD0H to External access areaNote 1 R/W √ √ — Undefined

FFDFH

FFE0H Interrupt request flag register 0L IF0 IF0L √ √ √ 00H

FFE1H Interrupt request flag register 0H IF0H √ √

FFE2H Interrupt request flag register 1L IF1L √ √ —

FFE4H Interrupt mask flag register 0L MK0 MK0L √ √ √ FFH

FFE5H Interrupt mask flag register 0H MK0H √ √

FFE6H Interrupt mask flag register 1L MK1L √ √ —

FFE8H Priority order specification flag register 0L PR0 PR0L √ √ √

FFE9H Priority order specification flag register 0H PR0H √ √

FFEAH Priority order specification flag register 1L PR1L √ √ —

FFECH External interrupt mode register 0 INTM0 — √ — 00H

FFEDH External interrupt mode register 1 INTM1 — √ —

FFF0H Internal memory size switching register IMS — √ — Note 2

FFF2H Oscillation mode select register OSMS W — √ — 00H

FFF3H Pull-up resistor option register H PUOH R/W √ √ —

FFF4H Internal expansion RAM size IXS W — √ — 0AH

switching registerNote 3

FFF6H Key return mode register KRM R/W √ √ — 02H

FFF7H Pull-up resistor option register L PUOL √ √ — 00H
FFF8H Memory expansion mode register MM √ √ — 10H

FFF9H Watchdog timer mode register WDTM √ √ — 00H

FFFAH Oscillation stabilization time select register OSTS — √ — 04H
FFFBH Processor clock control register PCC √ √ —

Notes 1. The external access area cannot be accessed using SFR addressing. Access the area using direct
addressing.
2. The value after reset depends on the product.
µPD780053, 780053(A), 780053Y, 780053Y(A): C6H
µPD780054, 780054(A), 780054Y, 780054Y(A): C8H
µPD780055, 780055(A), 780055Y, 780055Y(A): CAH
µPD780056, 780056(A), 780056Y, 780056Y(A): CCH
µPD780058, 780058B, 780058B(A), 780058BY, 780058BY(A): CFH
µPD78F0058, 78F0058Y: CFH
3. This register is provided only in the µPD780058, 780058B, 780058B(A), 780058BY, 780058BY(A),
78F0058, and 78F0058Y.

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5.3 Instruction Address Addressing

The instruction address is determined by the program counter (PC) contents. The contents of the PC are normally
incremented (+1 for each byte) automatically according to the number of bytes of an instruction to be fetched each
time another instruction is executed. When a branch instruction is executed, the branch destination information is
set to the PC and branched by the following addressing. (For details of instructions, refer to 78K/0 Instructions User’s
Manual (U12326E).

5.3.1 Relative addressing

[Function]
The value obtained by adding 8-bit immediate data (displacement value: jdisp8) of an instruction code to the
start address of the following instruction is transferred to the program counter (PC) and branched. The
displacement value is treated as signed two’s complement data (–128 to +127) and bit 7 becomes a sign bit.
In the relative addressing modes, execution branches in a relative range of –128 to +127 from the first address
of the next instruction.
This function is carried out when the BR $addr16 instruction or a conditional branch instruction is executed.

[Illustration]

15 0

PC ... PC indicates the start address

of the instruction
+ after the BR instruction.

15 8 7 6 0

α S

jdisp8

15 0

PC

When S = 0, all bits of α are 0.

When S = 1, all bits of α are 1.

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5.3.2 Immediate addressing

[Function]
Immediate data in the instruction word is transferred to the program counter (PC) and branched.
This function is carried out when the CALL !addr16 or BR !addr16 or CALLF !addr11 instruction is executed.
The CALL !addr16 and BR !addr16 instructions can branch in the entire memory space. The CALLF !addr11
instruction branches to an area of addresses 0800H to 0FFFH.

[Illustration]
In the case of CALL !addr16 and BR !addr16 instructions

7 0

CALL or BR

Low Addr.

High Addr.

15 8 7 0

PC

In the case of CALLF !addr11 instruction

7 6 4 3 0

fa10 to 8 CALLF

fa7 to 0

15 11 10 8 7 0

PC 0 0 0 0 1

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5.3.3 Table indirect addressing

[Function]
The table contents (branch destination address) of the particular location to be addressed by bits 1 to 5 of the
immediate data of an operation code are transferred to the program counter (PC) and branched.
Before the CALLT [addr5] instruction is executed, table indirect addressing is performed. This instruction
references an address stored in the memory table at addresses 40H to 7FH, and can branch in the entire memory
space.

[Illustration]

7 6 5 1 0

Operation code 1 1 ta4 to 0 1

15 8 7 6 5 1 0

Effective address 0 0 0 0 0 0 0 0 0 1 0

7 Memory (table) 0

Low Addr.

Effective address + 1 High Addr.

15 8 7 0

PC

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5.3.4 Register addressing

[Function]
The register pair (AX) contents to be specified by an instruction word are transferred to the program counter (PC)
and branched.
This function is carried out when the BR AX instruction is executed.

[Illustration]

7 0 7 0

rp A X

15 8 7 0

PC

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5.4 Operand Address Addressing

The following methods are available to specify the register and memory (addressing) which undergo manipulation
during instruction execution.

5.4.1 Implied addressing

[Function]
The register which functions as an accumulator (A and AX) in the general-purpose register area is automatically
(illicitly) addressed.
In the µPD780058 and 780058Y Subseries instruction words, the following instructions employ implied addressing.

Instruction Register to Be Specified by Implied Addressing

MULU Register A for multiplicand and AX register for product storage

DIVUW Register AX for dividend and quotient storage

ADJBA/ADJBS Register A for storage of numeric values which become decimal correction targets
ROR4/ROL4 Register A for storage of digit data which undergoes digit rotation

[Operand format]
Because implied addressing can be automatically employed with an instruction, no particular operand format is
necessary.

[Description example]
In the case of MULU X
With an 8-bit × 8-bit multiply instruction, the product of register A and register X is stored in AX. In this example,
the A and AX registers are specified by implied addressing.

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5.4.2 Register addressing

[Function]
This addressing accesses a general-purpose register as an operand. The general-purpose register accessed
is specified by the register bank select flags (RBS0 and RBS1) and register specification code (Rn or RPn) in
an instruction code.
Register addressing is carried out when an instruction with the following operand format is executed. When an
8-bit register is specified, one of the eight registers is specified by 3 bits in the operation code.

[Operand format]

Identifier Description

r X, A, C, B, E, D, L, H
rp AX, BC, DE, HL

‘r’ and ‘rp’ can be described with function names (X, A, C, B, E, D, L, H, AX, BC, DE, and HL) as well as absolute
names (R0 to R7 and RP0 to RP3).

[Description example]
MOV A, C; when selecting C register as r

Operation code 0 1 1 0 0 0 1 0

Register specification code

INCW DE; when selecting DE register pair as rp

Operation code 1 0 0 0 0 1 0 0

Register specification code

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5.4.3 Direct addressing

[Function]
This addressing directly addresses the memory indicated by the immediate data in an instruction word.

[Operand format]

Identifier Description
addr16 Label or 16-bit immediate data

[Description example]
MOV A, !0FE00H; when setting !addr16 to FE00H

Operation code 1 0 0 0 1 1 1 0 OP code

0 0 0 0 0 0 0 0 00H

1 1 1 1 1 1 1 0 FEH

[Illustration]

7 0

Opcode

addr16 (lower)

addr16 (higher)

Memory

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5.4.4 Short direct addressing

[Function]
The memory to be manipulated in the fixed space is directly addressed with 8-bit data in an instruction word.
The fixed space to which this address is applied is a 256-byte space of addresses FE20H to FF1FH. An internal
RAM and special-function registers (SFRs) are mapped at FE20H to FEFFH and FF00H to FF1FH, respectively.
The SFR area (FF00H to FF1FH) to which short direct addressing is applied is a part of the entire SFR area.
Ports frequently accessed by the program, and the compare registers and capture registers of timer/event
counters are mapped to this area. These SFRs can be manipulated with a short byte length and few clocks.
When 8-bit immediate data is at 20H to FFH, bit 8 of an effective address is set to 0. When it is at 00H to 1FH,
bit 8 is set to 1. See [Illustration] on next page.

[Operand format]

Identifier Description

saddr Label or immediate data of FE20H to FF1FH

saddrp Label or immediate data of FE20H to FF1FH (even address only)

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[Description example]

MOV 0FE30H, #50H; when setting saddr to FE30H and immediate data to 50H

Operation code 0 0 0 1 0 0 0 1 OP code

0 0 1 1 0 0 0 0 30H (saddr-offset)

0 1 0 1 0 0 0 0 50H (immediate data)

[Illustration]

7 0

Opcode

saddr-offset

Short direct memory

15 8 7 0
Effective Address 1 1 1 1 1 1 1 α

When 8-bit immediate data is 20H to FFH, α = 0

When 8-bit immediate data is 00H to 1FH, α = 1

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5.4.5 Special-Function Register (SFR) addressing

[Function]
The memory-mapped special-function registers (SFRs) are addressed with 8-bit immediate data in an instruction
word.
This addressing is applied to the 240-byte spaces FF00H to FFCFH and FFE0H to FFFFH. However, the SFRs
mapped at FF00H to FF1FH can be accessed with short direct addressing.

[Operand format]

Identifier Description
sfr Special-function register name
sfrp 16-bit manipulatable special-function register name (even address only)

[Description example]

MOV PM0, A; when selecting PM0 (FF20H) as sfr

Operation code 1 1 1 1 0 1 1 0 OP code

0 0 1 0 0 0 0 0 20H (sfr-offset)

[Illustration]

7 0

Opcode

sfr-offset

SFR
15 8 7 0
Effective address 1 1 1 1 1 1 1 1

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5.4.6 Register indirect addressing

[Function]
This addressing addresses the memory with the contents of a register pair specified as an operand. The register
pair to be accessed is specified by the register bank select flags (RBS0 and RBS1) and register pair specification
code in an instruction code. This addressing can be carried out for all the memory spaces.

[Operand format]

Identifier Description
— [DE], [HL]

[Description example]

MOV A, [DE]; when selecting [DE] as register pair

Operation code 1 0 0 0 0 1 0 1

[Illustration]

15 8 7 0

DE D E

Memory address specified

by register pair DE
7 Memory 0

Contents of addressed
memory are transferred.

7 0

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5.4.7 Based addressing

[Function]
This addressing addresses the memory by adding 8-bit immediate data to the contents of the HL register pair
which is used as a base register and by using the result of the addition. The HL register pair to be accessed
is in the register bank specified by the register bank select flags (RBS0 and RBS1). The addition is performed
by expanding the offset data as a positive number to 16 bits. A carry from the 16th bit is ignored. This addressing
can be carried out for all the memory spaces.

[Operand format]

Identifier Description

— [HL + byte]

[Description example]

MOV A, [HL + 10H]; when setting byte to 10H

Operation code 1 0 1 0 1 1 1 0

0 0 0 1 0 0 0 0

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5.4.8 Based indexed addressing

[Function]
This addressing addresses the memory by adding the contents of the HL register, which is used as a base register,
to the contents of the B or C register specified in the instruction word, and by using the result of the addition.
The HL, B, and C registers to be accessed are registers in the register bank specified by the register bank select
flags (RBS0 and RBS1). The addition is performed by extending the contents of the B or C register to 16 bits
as a positive number. A carry from the 16th bit is ignored. This addressing can be carried out for all the memory
spaces.

[Operand format]

Identifier Description
— [HL + B], [HL + C]

[Description example]

In the case of MOV A, [HL + B]

Operation code 1 0 1 0 1 0 1 1

5.4.9 Stack addressing

[Function]
The stack area is indirectly addressed with the stack pointer (SP) contents.
This addressing method is automatically employed when the PUSH, POP, subroutine call and return instructions
are executed or the register is saved/reset upon generation of an interrupt request.
Stack addressing can be used to address the internal high-speed RAM area only.

[Description example]

In the case of PUSH DE

Operation code 1 0 1 1 0 1 0 1

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6.1 Port Functions

The µPD780058 and 780058Y Subseries incorporate two input ports and sixty-six I/O ports. Figure 6-1 shows
the port types. Every port can be manipulated in 1-bit and 8-bit units and can carry out considerably varied control
operations. Besides port functions, the ports can also serve as on-chip hardware I/O pins.

Figure 6-1. Port Types

 P50 P00 
 
 
 
 Port 0
Port 5  
 
 P05 
 P07 
 P57

 P60 P10 
 
 
 
Port 6   Port 1
 
 
 
 P67 P17 

 P70 P20 
Port 7  
 P72 

P120  Port 2
 
 
 
 P27 
Port 12 

 P30 
 
 P127 

P130  Port 3
 
Port 13  
 P131 
P37 

P40 



 Port 4



P47 

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Table 6-1. Port Functions (µPD780058 Subseries) (1/2)

Pin Name Function Alternate Function

P00 Port 0 Input only INTP0/TI00

P01 7-bit I/O port INTP1/TI01
Input/output can be specified in 1-bit units.
P02 If used as an input port, an on-chip pull-up INTP2
resistor can be connected by setting
P03 INTP3
software.
P04 INTP4

P05 INTP5
P07 Input only XT1
P10 to P17 Port 1 ANI0 to ANI7
8-bit I/O port
Input/output can be specified in 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by setting software.

P20 Port 2 SI1

P21 8-bit I/O port SO1
Input/output can be specified in 1-bit units.
P22 SCK1
If used as an input port, an on-chip pull-up resistor can be connected by setting software.
P23 STB/TxD1
P24 BUSY/RxD1
P25 SI0/SB0

P26 SO0/SB1
P27 SCK0
P30 Port 3 TO0
P31 8-bit I/O port TO1
Input/output can be specified in 1-bit units.
P32 TO2
If used as an input port, an on-chip pull-up resistor can be connected by setting software.
P33 TI1
P34 TI2

P35 PCL
P36 BUZ
P37 —

P40 to P47 Port 4 AD0 to AD7

8-bit I/O port
Input/output can be specified i 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by setting software.
The test input flag (KRIF) is set to 1 by falling edge detection.
P50 to P57 Port 5 A8 to A15
8-bit I/O port
LED can be driven directly.
Input/output can be specified in 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by setting software.

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Table 6-1. Port Functions (µPD780058 Subseries) (2/2)

Pin Name Function Alternate Function

P60 Port 6 N-ch open-drain I/O port —

P61 8-bit I/O port On-chip pull-up resistors can be specified
Input/output can be specified in 1-bit units. by mask option. (Mask ROM version only).
P62
LEDs can be driven directly.
P63
P64 If used as an input port, an on-chip pull-up RD
P65 resistor can be connected by setting WR
software.
P66 WAIT
P67 ASTB
P70 Port 7 SI2/RxD0
3-bit I/O port
P71 SO2/TxD0
Input/output can be specified in 1-bit units.
P72 If used as an input port, an on-chip pull-up resistor can be connected by setting software. SCK2/ASCK
P120 to P127 Port 12 RTP0 to RTP7
8-bit I/O port
Input/output can be specified in 1-bit units.
If used as an input port, on-chip pull-up resistor can be connected by setting software.

P130 and P131 Port 13 ANO0, ANO1

2-bit I/O port
Input/output can be specified in 1-bit units.
If used as an input port, on-chip pull-up resistor can be connected by setting software.

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Table 6-2. Port Functions (µPD780058Y Subseries) (1/2)

Pin Name Function Alternate Function

P00 Port 0 Input only INTP0/TI00
P01 7-bit I/O port Input/output can be specified in 1-bit units. INTP1/TI01

P02 If used as an input port, an on-chip pull-up INTP2

resistor can be connected by setting
P03 INTP3
software.
P04 INTP4

P05 INTP5
P07 Input only XT1
P10 to P17 Port 1 ANI0 to ANI7
8-bit I/O port
Input/output can be specified in 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by setting software.

P20 Port 2 SI1

P21 8-bit I/O port SO1
Input/output can be specified in 1-bit units.
P22 SCK1
If used as an input port, an on-chip pull-up resistor can be connected by setting software.
P23 STB/TxD1
P24 BUSY/RxD1
P25 SI0/SB0/SDA0

P26 SO0/SB1/SDA1
P27 SCK0/SCL
P30 Port 3 TO0

P31 8-bit I/O port TO1

Input/output can be specified in 1-bit units.
P32 TO2
If used as an input port, an on-chip pull-up resistor can be connected by setting software.
P33 TI1

P34 TI2
P35 PCL
P36 BUZ

P37 —
P40 to P47 Port 4 AD0 to AD7
8-bit I/O port
Input/output can be specified in 8-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by setting software.
The test input flag (KRIF) is set to 1 by falling edge detection.
P50 to P57 Port 5 A8 to A15
8-bit I/O port
LEDs can be driven directly.
Input/output can be specified in 1-bit units.
If used as an input port, an on-chip pull-up resistor can be connected by setting software.

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Table 6-2. Port Functions (µPD780058Y Subseries) (2/2)

Pin Name Function Alternate Function

P60 Port 6 N-ch open-drain I/O port —

P61 8-bit I/O port On-chip pull-up resistors can be specified
Input/output can be specified in 1-bit units. by mask option. (Mask ROM version only).
P62
LEDs can be driven directly.
P63
P64 If used as an input port, an on-chip pull-up RD
P65 resistor can be connected by setting WR
software.
P66 WAIT
P67 ASTB
P70 Port 7 SI2/RxD0
3-bit I/O port
P71 SO2/TxD0
Input/output can be specified in 1-bit units.
P72 If used as an input port, an on-chip pull-up resistor can be connected by setting software. SCK2/ASCK
P120 to P127 Port 12 RTP0 to RTP7
8-bit I/O port
Input/output can be specified in 1-bit units.
If used as an input port, on-chip pull-up resistor can be connected by setting software.

P130 and P131 Port 13 ANO0, ANO1

2-bit I/O port
Input/output mode can be specified in 1-bit units.
If used as an input port, on-chip pull-up resistor can be connected by setting software.

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6.2 Port Configuration

A port consists of the following hardware.

Table 6-3. Port Configuration

Item Configuration

Control register Port mode register (PMm: m = 0 to 3, 5 to 10, 12, 13)

Pull-up resistor option register (PUOH, PUOL)
Memory expansion mode register (MM)Note
Key return mode register (KRM)
Port Total: 68 (Input: 2, I/O: 66)
Pull-up resistor • Mask ROM version
Total: 66 (software specifiable: 62, mask option: 4)
• Flash memory version
Total: 62

Note MM specifies the input/output mode of port 4.

6.2.1 Port 0
Port 0 is a 7-bit I/O port with an output latch. Pins P01 to P05 can be set to input or output mode in 1-bit units
using port mode register 0 (PM0). Pins P00 and P07 are input-only ports. When pins P01 to P05 are used as input
ports, an on-chip pull-up resistor can be connected to them in 6-bit units using pull-up resistor option register L (PUOL).
Alternate functions include external interrupt request input, external count clock input to the timer and crystal
connection for subsystem clock oscillation.
RESET input sets port 0 to input mode.
Figures 6-2 and 6-3 show block diagrams of port 0.

Caution Because port 0 also serves as external interrupt request input, when the port function output
mode is specified and the output level is changed, the interrupt request flag is set. Thus, when
the output mode is used, set the interrupt mask flag to 1.

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Figure 6-2. Block Diagram of P00 and P07

RD

Internal bus
P00/INTP0/TI00,
P07/XT1

RD: Port 0 read signal

Figure 6-3. Block Diagram of P01 to P05

VDD0

WRPUO

PUO0 P-ch
RD

Selector
Internal bus

WRPORT
P01/INTP1/TI01,
Output latch P02/INTP2
(P01 to P05) to
P05/INTP5

WRPM

PM01 to PM05

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 0 read signal
WR: Port 0 write signal

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6.2.2 Port 1
Port 1 is an 8-bit I/O port with an output latch. Port 1 can be set to input or output mode in 1-bit units using port
mode register 1 (PM1). When pins P10 to P17 are used as an input port, an on-chip pull-up resistor can be connected
to them in 8-bit units using pull-up resistor option register L (PUOL).
Alternate functions include A/D converter analog input.
RESET input sets port 1 to input mode.
Figure 6-4 shows a block diagram of port 1.

Caution A pull-up resistor cannot be used for pins used as A/D converter analog inputs.

Figure 6-4. Block Diagram of P10 to P17

VDD0

WRPUO

PUO1
P-ch
RD

Selector
Internal bus

WRPORT
P10/ANI0
Output latch
to
(P10 to P17)
P17/ANI7

WRPM

PM10 to PM17

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 1 read signal
WR: Port 1 write signal

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6.2.3 Port 2 (µPD780058 Subseries)

Port 2 is an 8-bit I/O port with an output latch. Pins P20 to P27 can be set to input or output mode in 1-bit units
using port mode register 2 (PM2). When pins P20 to P27 are used as an input port, an on-chip pull-up resistor can
be connected to them in 8-bit units using pull-up resistor option register L (PUOL).
Alternate functions include serial interface data I/O, clock I/O, automatic transmit/receive busy input, and strobe
output.
RESET input sets port 2 to input mode.
Figures 6-5 and 6-6 show a block diagram of port 2.

Cautions 1. When used as serial interface pins, set input/output and the output latch according to the
function. For the setting method, see Figure 16-4 Format of Serial Operating Mode Register
0, Figure 18-3 Format of Serial Operating Mode Register 1, and Table 19-2 Serial Interface
Channel 2 Operating Mode Settings.
2. When reading the pin state in SBI mode, set the PM2n bit of PM2 to 1 (n = 5, 6) (See the
description of (10) Judging busy state of slave in section 16.4.3 SBI mode operation).

Figure 6-5. Block Diagram of P20, P21, and P23 to P26

VDD0

WRPUO

PUO2
P-ch
RD

Selector
Internal bus

WRPORT
P20/SI1,
Output latch P21/SO1,
(P20, P21, P23 to P26) P23/STB/TxD1,
P24/BUSY/RxD1,
P25/SI0/SB0,
P26/SO0/SB1

WRPM

PM20, PM21
PM23 to PM26

Alternate function

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 2 read signal
WR: Port 2 write signal

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Figure 6-6. Block Diagram of P22 and P27

VDD0

WRPUO

PUO2 P-ch
RD

Selector
Internal bus

WRPORT

Output latch
(P22, P27) P22/SCK1,
P27/SCK0

WRPM

PM22, PM27

Alternate function

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 2 read signal
WR: Port 2 write signal

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6.2.4 Port 2 (µPD780058Y Subseries)

Port 2 is an 8-bit I/O port with an output latch. Pins P20 to P27 can be set to input or output mode in 1-bit units
using port mode register 2 (PM2). When pins P20 to P27 are used as an input port, an on-chip pull-up resistor can
be connected to them in 8-bit units using pull-up resistor option register L (PUOL).
Alternate functions include serial interface data I/O, clock I/O, automatic transmit/receive busy input, and strobe
output.
RESET input sets port 2 to input mode.
Figures 6-7 and 6-8 show a block diagram of port 2.

Caution When used as serial interface pins, set input/output and the output latch according to the
function. For the setting method, see Figure 17-4 Format of Serial Operating Mode Register 0,
Figure 18-3 Format of Serial Operating Mode Register 1, and Table 19-2 Serial Interface Channel
2 Operating Mode Settings.

Figure 6-7. Block Diagram of P20, P21, and P23 to P26

VDD0

WRPUO

PUO2
P-ch
RD

Selector
Internal bus

WRPORT

Output latch
(P20, P21, P23 to P26)
P20/SI1,
P21/SO1,
P23/STB/TxD1,
P24/BUSY/RxD1,
P25/SI0/SB0/SDA0,
WRPM P26/SO0/SB1/SDA1

PM20, PM21
PM23 to PM26

Alternate function

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 2 read signal
WR: Port 2 write signal

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Figure 6-8. Block Diagram of P22 and P27

VDD0

WRPUO

PUO2 P-ch
RD

Selector
Internal bus

WRPORT

Output latch
(P22 and P27) P22/SCK1,
P27/SCK0/SCL

WRPM

PM22, PM27

Alternate function

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 2 read signal
WR: Port 2 write signal

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6.2.5 Port 3
Port 3 is an 8-bit I/O port with an output latch. Pins P30 to P37 can be set to input or output mode in 1-bit units
using port mode register 3 (PM3). When pins P30 to P37 are used as an input port, an on-chip pull-up resistor can
be connected to them in 8-bit units using pull-up resistor option register L (PUOL).
Alternate functions include timer I/O, clock output and buzzer output.
RESET input sets port 3 to input mode.
Figure 6-9 shows a block diagram of port 3.

Figure 6-9. Block Diagram of P30 to P37

VDD0

WRPUO

PUO3 P-ch
RD

Selector
Internal bus

WRPORT
P30/TO0
to
Output latch
P32/TO2,
(P30 to P37)
P33/TI1,
P34/TI2,
P35/PCL,
P36/BUZ,
WRPM P37

PM30 to PM37

Alternate function

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 3 read signal
WR: Port 3 write signal

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6.2.6 Port 4
Port 4 is an 8-bit I/O port with an output latch. Pins P40 to P47 can be set to input or output mode in 8-bit units
using the memory expansion mode register (MM). When pins P40 to P47 are used as an input port, an on-chip pull-
up resistor can be connected to them in 8-bit units using pull-up resistor option register L (PUOL).
The test input flag (KRIF) can be set to 1 by detecting a falling edge.
Alternate functions include an address/data bus function in external memory expansion mode.
RESET input sets port 4 to input mode.
Figures 6-10 and 6-11 show a block diagram of port 4 and of the falling edge detector, respectively.

Figure 6-10. Block Diagram of P40 to P47

VDD0

WRPUO

PUO4 P-ch
RD

Selector
Internal bus

WRPORT
P40/AD0
Output latch
to
(P40 to P47)
P47/AD7

WRMM

MM

PUO: Pull-up resistor option register

MM: Memory expansion mode register
RD: Port 4 read signal
WR: Port 4 write signal

Figure 6-11. Block Diagram of Falling Edge Detector

P40
P41
P42
P43 Falling edge detector KRIF set signal
P44
P45
KRMK Standby release
P46
signal
P47

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6.2.7 Port 5
Port 5 is an 8-bit I/O port with an output latch. Pins P50 to P57 can be set to input or output mode in 1-bit units
using the port mode register 5 (PM5). When pins P50 to P57 are used as an input port, an on-chip pull-up resistor
can be connected to them in 8-bit units using pull-up resistor option register L (PUOL).
Port 5 can drive LEDs directly.
Alternate functions include an address bus function in external memory expansion mode.
RESET input sets port 5 to input mode.
Figure 6-12 shows a block diagram of port 5.

Figure 6-12. Block Diagram of P50 to P57

VDD0

WRPUO

PUO5
P-ch
RD

Selector
Internal bus

WRPORT
P50/A8
Output latch
to
(P50 to P57)
P57/A15

WRPM

PM50 to PM57

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 5 read signal
WR: Port 5 write signal

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6.2.8 Port 6
Port 6 is an 8-bit I/O port with an output latch. Pins P60 to P67 can be set to input or output mode in 1-bit units
using port mode register 6 (PM6).
This port has functions related to pull-up resistors as shown below. These functions differ depending on whether
the higher 4 bits or lower 4 bits of a port are used, and whether the mask ROM model or flash memory model is used.

Table 6-4. Pull-up Resistor of Port 6

Higher 4 Bits (P64 to P67 Pins) Lower 4 Bits (P60 to P63 Pins)

Mask ROM On-chip pull-up resistor can be connected in 4-bit Pull-up resistor can be connected in 1-bit
version units by PUO6 units by mask option
Flash memory version Pull-up resistor is not connected

PUO6: Bit 6 of pull-up resistor option register L (PUOL)

Pins P60 to P63 can drive LEDs directly.

Alternate functions include a control signal output function in external memory expansion mode.
RESET input sets port 6 to input mode.
Figures 6-13 and 6-14 show block diagrams of port 6.

Cautions 1. When an external wait is not used in external memory expansion mode, P66 can be used as
an I/O port.
2. The value of the low-level input leakage current flowing to the P60 to P63 pins differ
depending on the following conditions:

[Mask ROM version]

• When pull-up resistor is connected: Always –3 µA (MAX.)
• When pull-up resistor is not connected
· For duration of 1.5 clocks (no wait)Note when instruction such as MOV instruction to
read port 6 (P6) and port mode register 6 (PM6) is executed: –200 µA (MAX.)
· Other than above: –3 µA (MAX.)

[Flash memory version]

• For duration of 1.5 clocks (no wait)Note when instruction such as MOV instruction to read
port 6 (P6) and port mode register 6 (PM6) is executed: –200 µA (MAX.)
• Other than above: –3 µA (MAX.)

Note At this time, on-chip pull-up resistors are enabled.

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Figure 6-13. Block Diagram of P60 to P63

VDD0

RD Mask option resistor

Mask ROM versions
only. Flash memory
Selector versions have no
pull-up resistors.
Internal bus

WRPORT

Output latch
P60 to P63
(P60 to P63)

WRPM

PM60 to PM63

PM: Port mode register

RD: Port 6 read signal
WR: Port 6 write signal

Figure 6-14. Block Diagram of P64 to P67

VDD0

WRPUO

PUO6 P-ch
RD

Selector
Internal bus

WRPORT
P64/RD,
Output latch P65/WR,
(P64 to P67) P66/WAIT,
P67/ASTB

WRPM

PM64 to PM67

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 6 read signal
WR: Port 6 write signal

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6.2.9 Port 7
This is a 3-bit I/O port with an output latch. Pins P70 to P72 can be set to input or output mode in 1-bit units using
port mode register 7 (PM7). When pins P70 to P72 are used as an input port, an on-chip pull-up resistor can be
connected in 3-bit units using pull-up resistor option register L (PUOL).
Alternate functions include serial interface channel 2 data I/O and clock I/O.
RESET input sets port 7 to input mode.
Figures 6-15 and 6-16 show a block diagram of port 7.

Caution When used as serial interface pins, set input/output and the output latch according to the
function. For the setting method, see Table 19-2 Serial Interface Channel 2 Operating Mode
Setting.

Figure 6-15. Block Diagram of P70

VDD0

WRPUO

PUO7
P-ch
RD

Selector
Internal bus

WRPORT

Output latch P70/SI2/RxD0

(P70)

WRPM

PM70

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 7 read signal
WR: Port 7 write signal

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Figure 6-16. Block Diagram of P71 and P72

VDD0

WRPUO

PUO7
P-ch
RD

Selector
Internal bus

WRPORT

Output latch
P71/SO2/TxD0,
(P71 and P72)
P72/SCK2/ASCK

WRPM

PM71, PM72

Alternate function

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 7 read signal
WR: Port 7 write signal

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6.2.10 Port 12
This is an 8-bit I/O port with an output latch. Pins P120 to P127 can be set to input or output mode in 1-bit units
using port mode register 12 (PM12). When pins P120 to P127 are used as an input port, an on-chip pull-up resistor
can be connected in 8-bit units using pull-up resistor option register H (PUOH).
These pins have an alternate function, serving as real-time outputs.
RESET input sets port 12 to input mode.
Figure 6-17 shows a block diagram of port 12.

Figure 6-17. Block Diagram of P120 to P127

VDD0

WRPUO

PUO12
P-ch
RD

Selector
Internal bus

WRPORT
P120/RTP0
Output latch
to
(P120 to P127)
P127/RTP7

WRPM

PM120 to PM127

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 12 read signal
WR: Port 12 write signal

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6.2.11 Port 13
This is a 2-bit I/O port with an output latch. Pins P130 and P131 can be set to input mode/output mode in 1-bit
units using port mode register 13 (PM13). When pins P130 and P131 are used as an input port, an on-chip pull-up
resistor can be connected in 2-bits using pull-up resistor option register H (PUOH).
These pins have an alternate function, serving as D/A converter analog outputs.
RESET input sets port 13 to input mode.
Figure 6-18 shows a block diagram of port 13.

Caution When only one of the D/A converter channels is used with AVREF1 < VDD0, the other pins that
are not used as analog outputs must be set as follows:
• Set the PM13 bit of port mode register 13 (PM13) to 1 (input mode) and connect the pin
to VSS0.
• Clear the PM13x bit of port mode register 13 (PM13) to 0 (output mode) and the output latch
to 0, and output a low level from the pin.

Figure 6-18. Block Diagram of P130 and P131

VDD0

WRPUO

PUO13 P-ch
RD

Selector
Internal bus

WRPORT

Output latch P130/ANO0,

(P130 and P131) P131/ANO1

WRPM

PM130, PM131

PUO: Pull-up resistor option register

PM: Port mode register
RD: Port 13 read signal
WR: Port 13 write signal

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6.3 Port Function Control Registers

The following four types of registers control the ports.

• Port mode registers (PM0 to PM3, PM5 to PM7, PM12, PM13)
• Pull-up resistor option registers (PUOH, PUOL)
• Memory expansion mode register (MM)
• Key return mode register (KRM)

(1) Port mode registers (PM0 to PM3, PM5 to PM7, PM12, PM13)
These registers are used to set port input/output in 1-bit units.
PM0 to PM3, PM5 to PM7, PM12, and PM13 are independently set with a 1-bit or 8-bit memory manipulation
instruction
RESET input sets these registers to FFH.
When port pins are used as the alternate-function pins, set the port mode register and output latch according
to Table 6-5.

Cautions 1. Pins P00 and P07 are input-only pins.

2. As port 0 has an alternate function as external interrupt request input, when the port
function output mode is specified and the output level is changed, the interrupt request
flag is set. When the output mode is used, therefore, the interrupt mask flag should be
set to 1 beforehand.
3. The memory expansion mode register (MM) specifies the input/output mode of pins P40
to P47.

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Table 6-5. Port Mode Register and Output Latch Settings When Using Alternate Functions

Pin Name Alternate Function PM×× P××

Name I/O

P00 INTP0 Input 1 (fixed) None

TI00 Input 1 (fixed) None
P01 INTP1 Input 1 ×
TI01 Input 1 ×
P02 to P05 INTP2 to INTP5 Input 1 ×
P07Note 1 XT1 Input 1 (fixed) None
P10 to P17Note 1 ANI0 to ANI7 Input 1 ×
P30 to P32 TO0 to TO2 Output 0 0
P33, P34 TI1, TI2 Input 1 ×
P35 PCL Output 0 0
P36 BUZ Output 0 0
P40 to P47 AD0 to AD7 I/O ×Note 2
P50 to P57 A8 to A15 Output ×Note 2
P64 RD Output ×Note 2
P65 WR Output ×Note 2
P66 WAIT Input ×Note 2
P67 ASTB Output ×Note 2
P120 to P127 RTP0 to RTP7 Output 0 Desired value
P130, P131Note 1 ANO0, ANO1 Output 1 ×

Notes 1. If these ports are read out when these pins are used in the alternate-function mode, undefined values
are read.
2. When the P40 to P47 pins, P50 to P57 pins, and P64 to P67 pins are used for alternate functions,
set the function by the memory extension mode register (MM).

Cautions 1. When not using an external wait in the external memory extension mode, the P66 pin can be
used as an I/O port.
2. When port 2 and port 7 are used for the serial interface, input/output and the output latch
must be set according to the function. For the setting methods, see Figure 16-4 Format
of Serial Operation Mode Register 0, Figure 17-4 Format of Serial Operation Mode
Register 0, Figure 18-3 Format of Serial Operation Mode Register 1, and Table 19-2 Serial
Interface Channel 2 Operating Mode Settings.

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

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Figure 6-19. Port Mode Register Format

After
Symbol 7 6 5 4 3 2 1 0 Address reset R/W

PM0 1 1 PM05 PM04 PM03 PM02 PM01 1 FF20H FFH R/W

PM1 PM17 PM16 PM15 PM14 PM13 PM12 PM11 PM10 FF21H FFH R/W

PM2 PM27 PM26 PM25 PM24 PM23 PM22 PM21 PM20 FF22H FFH R/W

PM3 PM37 PM36 PM35 PM34 PM33 PM32 PM31 PM30 FF23H FFH R/W

PM5 PM57 PM56 PM55 PM54 PM53 PM52 PM51 PM50 FF25H FFH R/W

PM6 PM67 PM66 PM65 PM64 PM63 PM62 PM61 PM60 FF26H FFH R/W

PM7 1 1 1 1 1 PM72 PM71 PM70 FF27H FFH R/W

PM12 PM127 PM126 PM125 PM124 PM123 PM122 PM121 PM120 FF2CH FFH R/W

PM13 1 1 1 1 1 1 PM131 PM130 FF2DH FFH R/W

PMmn Pmn pin I/O mode selection

(m = 0 to 3, 5 to 7, 12, 13 : n = 0 to 7)
0 Output mode (output buffer on)
1 Input mode (output buffer off)

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(2) Pull-up resistor option registers (PUOH, PUOL)

These registers are used to set whether to use an on-chip pull-up resistor at each port or not. A pull-up resistor
is internally used at bits set to the input mode in a port where on-chip pull-up resistor use has been specified
with PUOH, PUOL. No on-chip pull-up resistors can be used for bits set to the output mode or bits used as
an analog input pin, irrespective of the PUOH or PUOL setting.
PUOH and PUOL are set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears these registers to 00H.

Cautions 1. Pins P00 and P07 do not incorporate a pull-up resistor.

2. When ports 1, 4, 5, and pins P64 to P67 are used as alternate-function pins, an on-chip
pull-up resistor cannot be used even if the PUOm bit of PUOH, PUOL (m = 1, 4 to 6) is
set to 1.
3. Pins P60 to P63 can be connected to pull-up resistors by a mask option only for mask
ROM versions.

Figure 6-20. Format of Pull-up Resistor Option Register

After
Symbol 7 6 <5> <4> 3 2 1 0 Address reset R/W

PUOH 0 0 PUO13 PUO12 0 0 0 0 FFF3H 00H R/W

<7> <6> <5> <4> <3> <2> <1> <0>

PUOL PUO7 PUO6 PUO5 PUO4 PUO3 PUO2 PUO1 PUO0 FFF7H 00H R/W

PUOm Pm internal pull-up resistor selection

(m = 0 to 7, 12, 13)
0 Internal pull-up resistor not used
1 Internal pull-up resistor used

Caution Be sure to clear bits 0 to 3, 6, and 7 of PUOH to 0.

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(3) Memory expansion mode register (MM)

This register is used to set the input/output mode of port 4.
MM is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input sets MM to 10H.

Figure 6-21. Format of Memory Expansion Mode Register

After
Symbol 7 6 5 4 3 2 1 0 Address reset R/W

MM 0 0 PW1 PW0 0 MM2 MM1 MM0 FFF8H 10H R/W

MM2 MM1 MM0 Single-chip/memory P40 to P47, P50 to P57, P64 to P67 pin state
expansion mode
selection P40 to P47 P50 to P53 P54, P55 P56, P57 P64 to P67

0 0 0 Single-chip mode Port Input Port mode

mode Out-
0 0 1 put
0 1 1 Memory 256-byte AD0 to AD7 Port mode P64 = RD
expansion mode
mode P65 = WR
1 0 0 4 KB A8 to A11 Port mode
mode P66 = WAIT

1 0 1 16 KB A12, A13 Port mode P67 = ASTB

mode
1 1 1 Full Note A14, A15
address
mode
Other than above Setting prohibited

PW1 PW0 Wait control

0 0 No wait
0 1 Wait (one wait state inserted)
1 0 Setting prohibited
1 1 Wait control by external wait pin

Note The full address mode allows external expansion for all areas of the 64 KB address space, except the
internal ROM, RAM, SFR, and use-prohibited areas.

Remarks 1. Pins P60 to P63 enter the port mode in both the single-chip and memory expansion mode.
2. Besides setting port 4 input/output mode, MM also sets the wait count and external expansion
area.

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(4) Key return mode register (KRM)

This register sets enabling/disabling of standby function release by a key return signal (falling edge detection
of port 4).
KRM is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input sets KRM to 02H.

Figure 6-22. Format of Key Return Mode Register

After
Symbol 7 6 5 4 3 2 <1> <0> Address reset R/W

KRM 0 0 0 0 0 0 KRMK KRIF FFF6H 02H R/W

KRIF Key return signal detection flag

0 Not detected
1 Detected (falling edge detection of port 4)

KRMK Standby mode control by key return signal

0 Standby mode release enabled
1 Standby mode release disabled

Caution When falling edge detection of port 4 is used, KRIF should be cleared to 0 (it is not cleared
to 0 automatically).

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6.4 Port Operations

Port operations differ depending on whether the input or output mode is set, as shown below.

6.4.1 Writing to I/O port

(1) Output mode

A value is written to the output latch by a transfer instruction, and the output latch contents are output from
the pin.
Once data is written to the output latch, it is retained until data is written to the output latch again.

(2) Input mode

A value is written to the output latch by a transfer instruction, but since the output buffer is off, the pin status
does not change.
Once data is written to the output latch, it is retained until data is written to the output latch again.

Caution In the case of a 1-bit memory manipulation instruction, although a single bit is manipulated,
the port is accessed as an 8-bit unit. Therefore, on a port with a mixture of input and output
pins, the output latch contents for pins specified as input are undefined, even for bits other
than the manipulated bit.

6.4.2 Reading from I/O port

(1) Output mode

The output latch contents are read by a transfer instruction. The output latch contents do not change.

(2) Input mode

The pin status is read by a transfer instruction. The output latch contents do not change.

6.4.3 Operations on I/O port

(1) Output mode

An operation is performed on the output latch contents, and the result is written to the output latch. The output
latch contents are output from the pins.
Once data is written to the output latch, it is retained until data is written to the output latch again.

(2) Input mode

The output latch contents are undefined, but since the output buffer is off, the pin status does not change.

Caution In the case of a 1-bit memory manipulation instruction, although a single bit is manipulated,
the port is accessed as an 8-bit unit. Therefore, on a port with a mixture of input and output
pins, the output latch contents for pins specified as input are undefined, even for bits other
than the manipulated bit.

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6.5 Selection of Mask Option

The following mask option is provided in mask ROM versions. The flash memory versions have no mask options.

Table 6-6. Comparison Between Mask ROM Version and Flash Memory Version

Pin Name Mask ROM Version Flash Memory Version

Mask option for pins P60 to P63 On-chip pull-up resistors can be selected in 1-bit units. No on-chip pull-up resistor

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 CHAPTER 7 CLOCK GENERATOR

7.1 Clock Generator Functions

The clock generator generates the clock to be supplied to the CPU and peripheral hardware. The following two
types of system clock oscillators are available.

(1) Main system clock oscillator

This circuit oscillates at frequencies of 1 to 5.0 MHz. Oscillation can be stopped by executing the STOP
instruction or setting the processor clock control register (PCC).

(2) Subsystem clock oscillator

The circuit oscillates at a frequency of 32.768 kHz. Oscillation cannot be stopped. If the subsystem clock
oscillator is not used, not using the internal feedback resistor can be set by the processor clock control register
(PCC). This enables a decrease in the power consumption in STOP mode.

7.2 Clock Generator Configuration

The clock generator consists of the following hardware.

Table 7-1. Clock Generator Configuration

Item Configuration

Control registers Processor clock control register (PCC)

Oscillation mode select register (OSMS)
Oscillator Main system clock oscillator
Subsystem clock oscillator

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Figure 7-1. Clock Generator Block Diagram

FRC

XT1/P07 Subsystem f XT Watch timer,

clock clock output
XT2 oscillator function
Prescaler

X1 1/2 Clock to
Main fX

Selector
peripheral
system
X2 Prescaler f XT hardware
clock
oscillator Scaler 2
fX f XX
f XX 4

Selector
2 f XX 23 2 Standby Wait CPU clock
f XX 22 controller controller (fCPU)
f XX 2

To INTP0
3
sampling clock

STOP
MCS MCC FRC CLS CSS PCC2 PCC1 PCC0

Oscillation mode Processor clock control register

select register

Internal bus

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7.3 Clock Generator Control Registers

The clock generator is controlled by the following two registers.

• Processor clock control register (PCC)

• Oscillation mode select register (OSMS)

(1) Processor clock control register (PCC)

PCC sets the CPU clock selection, division ratio, main system clock oscillator operation/stop and whether to
use the subsystem clock oscillator internal feedback resistorNote.
PCC is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input sets PCC to 04H.

Note The feedback resistor is necessary for adjusting the bias point of an oscillated waveform to the middle
level of the supply voltage. Only when the subsystem clock is not used, the current consumption in
the STOP mode can be further reduced by setting bit 6 (FRC) of PCC to 1.

Figure 7-2. Subsystem Clock Feedback Resistor

FRC

P-ch
Feedback resistor

XT1 XT2

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Figure 7-3. Format of Processor Clock Control Register

After
Symbol <7> <6> <5> <4> 3 2 1 0 Address reset R/W

PCC MCC FRC CLS CSS 0 PCC2 PCC1 PCC0 FFFBH 04H R/WNote 1

R/W CSS PCC2 PCC1 PCC0 CPU cIock selection (fCPU)

MCS = 1 MCS = 0
0 0 0 0 fXX fX fX/2
0 0 1 fXX/2 fX/2 fX/22
2 2
0 1 0 fXX/2 fX/2 fX/23
3 3
0 1 1 fXX/2 fX/2 fX/24
1 0 0 fXX/24 fX/24 fX/25
1 0 0 0 fXT/2
0 0 1
0 1 0
0 1 1
1 0 0
Other than above Setting prohibited

R CLS CPU clock status

0 Main system clock
1 Subsystem clock

R/W FRC Subsystem clock feedback resistor selection

0 Internal feedback resistor used
Note 2
1 Internal feedback resistor not used

Note 3
R/W MCC Main system clock oscillation control
0 Oscillation possible
1 Oscillation stopped

Notes 1. Bit 5 is a read-only bit.

2. This bit can be set to 1 only when the subsystem clock is not used.
3. When the CPU is operating on the subsystem clock, MCC should be used to stop the main
system clock oscillation. A STOP instruction should not be used.

Caution Be sure to clear bit 3 to 0.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fXT: Subsystem clock oscillation frequency
4. MCS: Bit 0 of oscillation mode select register (OSMS)

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The fastest instruction of the µPD780058, 780058Y Subseries is executed in 2 CPU clocks. Therefore, the
relationship between the CPU clock (fCPU) and minimum instruction execution time is as shown in Table 7-
2.

Table 7-2. Relationship Between CPU Clock and Minimum Instruction Execution Time

CPU Clock (fCPU) Minimum Instruction

Execution Time: 2/fCPU
fX 0.4 µs
fX/2 0.8 µs

fX/22 1.6 µs
fX/23 3.2 µs
fX/24 6.4 µs

fX/25 12.8 µs
fXT/2 122 µs

fX = 5.0 MHz, fXT = 32.768 kHz

f X: Main system clock oscillation frequency
fXT: Subsystem clock oscillation frequency

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(2) Oscillation mode select register (OSMS)

This register specifies whether the clock output from the main system clock oscillator without passing through
the divider is used as the main system clock, or the clock output via the divider is used as the main system
clock.
OSMS is set with an 8-bit memory manipulation instruction.
RESET input clears OSMS to 00H.

Figure 7-4. Format of Oscillation Mode Selection Register

After
Symbol 7 6 5 4 3 2 1 0 Address reset R/W

OSMS 0 0 0 0 0 0 0 MCS FFF2H 00H W

MCS Main system clock divider control

0 Divider used
1 Divider not used

Cautions 1. Writing to OSMS should be performed only immediately after reset signal release and before
peripheral hardware operation starts. As shown in Figure 7-5 below, writing data (including
the same data as previously) to OSMS causes a main system clock cycle delay of up to 2/
fX during the write operation. Therefore, if this register is written during the operation, in
peripheral hardware which operates on the main system clock, a temporary error occurs in
the count clock cycle of timer, etc. In addition, because the oscillation mode is changed by
this register, the clock for peripheral hardware as well as that for the CPU is switched.

Figure 7-5. Main System Clock Waveform due to Writing to OSMS

Write to OSMS
(MCS 0)
Max. 2/fX

fXX

Operating at fXX = fX/2 (MCS = 0) Operating at fXX = fX/2 (MCS = 0)

2. When writing 1 to MCS, VDD must be 2.7 V or higher before the write operation.

Remark fXX: Main system clock frequency (fX or fX/2)

fX: Main system clock oscillation frequency

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7.4 System Clock Oscillator

7.4.1 Main system clock oscillator

The main system clock oscillator oscillates with a crystal resonator or a ceramic resonator (standard: 5.0 MHz)
connected to the X1 and X2 pins.
External clocks can be input to the main system clock oscillator. In this case, input a clock signal to the X1 pin
and the inverse signal to the X2 pin.
Figure 7-6 shows an external circuit of the main system clock oscillator.

Figure 7-6. External Circuit of Main System Clock Oscillator

(a) Crystal and ceramic oscillation (b) External clock

X2 X2

VSS1 External X1
X1 clock
IC
Crystal
or
ceramic resonator

Cautions 1. Do not execute the STOP instruction or set MCC (bit 7 of the processor clock control register
(PCC)) to 1 if an external clock is used. Otherwise, the operation of the main system clock
will be stopped and the X2 pin will be pulled up to VDD1.
2. When using a main system clock oscillator and a subsystem clock oscillator, carry out wiring
in the broken line area in Figures 7-6 and 7-7 to prevent any effects from wiring capacities.
• Minimize the wiring length.
• Do not allow wiring to intersect with other signal conductors. Do not allow wiring to come
near changing high current.
• Set the potential of the grounding position of the oscillator capacitor to that of VSS1. Do
not ground to any ground pattern where high current is present.
• Do not fetch signals from the oscillator.

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7.4.2 Subsystem clock oscillator

The subsystem clock oscillator oscillates with a crystal resonator (standard: 32.768 kHz) connected to the XT1
and XT2 pins.
External clocks can be input to the main system clock oscillator. In this case, input a clock signal to the XT1 pin
and an antiphase clock signal to the XT2 pin.
Figure 7-7 shows an external circuit of the subsystem clock oscillator.

Figure 7-7. External Circuit of Subsystem Clock Oscillator

(a) Crystal oscillation (b) External clock

IC
XT2 XT2
32.768
kHz
External XT1
VSS1 XT1 Clock
µ PD74HCU04

Caution When using a main system clock oscillator and a subsystem clock oscillator, carry out wiring
in the broken line area in Figures 7-6 and 7-7 to prevent any effects from wiring capacities.
• Minimize the wiring length.
• Do not allow wiring to intersect with other signal conductors. Do not allow wiring to come near
changing high current.
• Set the potential of the grounding position of the oscillator capacitor to that of VSS1. Do not
ground to any ground pattern where high current is present.
• Do not fetch signals from the oscillator.
Take special note of the fact that the subsystem clock oscillator is designed as a low-amplitude
circuit for reducing current consumption.

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7.4.3 Example of resonator with bad connection

Figure 7-8 shows examples of resonators with bad connections.

Figure 7-8. Examples of Resonator with Bad Connection (1/2)

(a) Too long wiring (b) Crossed signal lines

PORTn
(n = 0 to 7, 12, 13)

X2 X1 IC X2 X1 IC

VSS1 VSS1

(c) Wiring near high fluctuating current (d) Current flowing through ground line
of oscillator (potential at points A, B,
and C fluctuates)

VDD

Pnm
X2 X1 IC
X2 X1 IC

High
Current

A B C

VSS1 High Current

VSS1

Remark When using the subsystem clock, replace X1 and X2 with XT1 and XT2, respectively. Also, insert
resistors in series on the XT2 side.

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Figure 7-8. Examples of Resonator with Bad Connection (2/2)

(e) Signals are fetched

X2 X1 IC

VSS1

Remark When using the subsystem clock, replace X1 and X2 with XT1 and XT2, respectively. Also, insert
resistors in series on the XT2 side.

Caution If XT2 and XT1 are wired in parallel, the cross-talk noise of X1 may increase with XT2, resulting
in malfunction. To prevent this, it is recommended to wire XT2 and X1 so that they are not in
parallel, and to connect the IC pin between XT2 and X1 directly to VSS1.

7.4.4 Divider
The divider divides the main system clock oscillator output (fXX) and generates various clocks.

7.4.5 When not using subsystem clock

If it is not necessary to use the subsystem clock for low power consumption operations and clock operations,
connect the XT1 and XT2 pins as follows.

XT1: Connect to VDD0

XT2: Leave open

In this state, however, some current may leak via the internal feedback resistor of the subsystem clock oscillator
when the main system clock stops. To suppress the leakage current, disconnect the above internal feedback resistor
by setting bit 6 (FRC) of the processor clock control register (PCC) to 1. In this case also, connect the XT1 and XT2
pins as described above.

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7.5 Clock Generator Operations

The clock generator generates the following clocks and controls the CPU operating mode including the standby
mode.

• Main system clock fXX

• Subsystem clock fXT
• CPU clock fCPU
• Clock to peripheral hardware

The following clock generator functions and operations are determined by the processor clock control register
(PCC) and the oscillation mode selection register (OSMS).

(a) Upon generation of the RESET signal, the lowest speed mode of the main system clock (12.8 µs when operated
at 5.0 MHz) is selected (PCC = 04H, OSMS = 00H). Main system clock oscillation stops while a low level
is applied to the RESET pin.

(b) With the main system clock selected, one of the six types of minimum instruction execution times (0.4 µs, 0.8
µs, 1.6 µs, 3.2 µs, 6.4 µs, 12.8 µs @ 5.0 MHz) can be selected by setting the PCC and OSMS registers.

(c) With the main system clock selected, two standby modes, the STOP and HALT modes, are available. In a
system where the subsystem clock is not used, the current consumption in the STOP mode can be further
reduced by specifying with not to use the feedback resistor using bit 6 (FRC) of the PCC register.

(d) The PCC register can be used to select the subsystem clock and to operate the system on a low current
consumption (122 µs when operated at 32.768 kHz).

(e) With the subsystem clock selected, main system clock oscillation can be stopped by the PCC register. The
HALT mode can be used, but not the STOP mode. (Subsystem clock oscillation cannot be stopped.)

(f) The main system clock is divided and supplied to the peripheral hardware. The subsystem clock is supplied
to the 16-bit timer/event counter, watch timer, and clock output functions only. Thus, the 16-bit timer/event
counter (when selecting watch timer output as the count clock when operating on the subsystem clock), the
watch function, and the clock output function can also be continued in the standby state. However, since all
other peripheral hardware operate on the main system clock, the peripheral hardware also stops if the main
system clock is stopped (except external input clock operation).

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7.5.1 Main system clock operations

When operating on the main system clock (with bit 5 (CLS) of the processor clock control register (PCC) cleared
to 0), the following operations are carried out by PCC settings.

(a) Because the operation guaranteed instruction execution speed depends on the power supply voltage, the
minimum instruction execution time can be changed by bits 0 to 2 (PCC0 to PCC2) of the PCC register.

(b) If bit 7 (MCC) of the PCC register is set to 1 when operating on the main system clock, the main system clock
oscillation does not stop. When bit 4 (CSS) of PCC is set to 1 and the operation is subsequently switched
to the subsystem clock (CLS = 1), the main system clock oscillation stops (see Figure 7-9).

Figure 7-9. Main System Clock Stop Function (1/2)

(a) Operation when MCC is set after setting CSS in case of main system clock operation

MCC

CSS

CLS

Main system clock oscillation

Subsystem clock oscillation

CPU clock

(b) Operation when MCC is set in case of main system clock operation

MCC
CSS L

CLS L
Oscillation does not stop.

Main system clock oscillation

Subsystem clock oscillation

CPU clock

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 CHAPTER 7 CLOCK GENERATOR

Figure 7-9. Main System Clock Stop Function (2/2)

(c) Operation when CSS is set after setting MCC in case of main system clock operation

MCC

CSS

CLS

Main system clock oscillation

Subsystem clock oscillation

CPU clock

7.5.2 Subsystem clock operations

When operating on the subsystem clock (with bit 5 (CLS) of the processor clock control register (PCC) set to 1),
the following operations are carried out.

(a) The minimum instruction execution time remains constant (122 µs when operating at 32.768 kHz) irrespective
of bits 0 to 2 (PCC0 to PCC2) of the PCC register.

(b) The watchdog timer stops counting.

Caution Do not execute the STOP instruction while the subsystem clock is in operation.

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7.6 Changing System Clock and CPU Clock Settings

7.6.1 Time required for switchover between system clock and CPU clock
The system clock and CPU clock can be switched over by bits 0 to 2 (PCC0 to PCC2) and bit 4 (CSS) of the
processor clock control register (PCC).
The actual switchover operation is not performed directly after writing to the PCC; operation continues on the pre-
switchover clock for several instructions (see Table 7-3).
Determination as to whether the system is operating on the main system clock or the subsystem clock is performed
using bit 5 (CLS) of the PCC register.

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160

Table 7-3. Maximum Time Required for CPU Clock Switchover

Set Values Before Set Values After Switchover

Switchover MCS = 1 MCS = 0

CSS PCC2 PCC1 PCC0 CSS PCC2 PCC1 PCC0 CSS PCC2 PCC1 PCC0 CSS PCC2 PCC1 PCC0 CSS PCC2 PCC1 PCC0 CSS PCC2 PCC1 PCC0 CSS PCC2 PCC1 PCC0
CSS PCC2 PCC1 PCC0
0 0 0 0 0 0 0 1 0 0 1 0 0 0 1 1 0 1 0 0 1 × × × 1 × × ×

fX/2fXT instruction fX/4fXT instruction

0 0 0 16 instructions 16 instructions 16 instructions 16 instructions
(77 instructions) (39 instructions)

fX/4fXT instruction fX/8fXT instruction

8 instructions 8 instructions 8 instructions 8 instructions

CHAPTER 7
0 0 1
(39 instructions) (20 instructions)
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fX/8fXT instruction fX/16fXT instruction

0 0 1 0 4 instructions 4 instructions 4 instructions 4 instructions

CLOCK GENERATOR
(20 instructions) (10 instructions)

fX/16fXT instruction fX/32fXT instruction

0 1 1 2 instructions 2 instructions 2 instructions 2 instructions
(10 instructions) (5 instructions)

fX/32fXT instruction fX/64fXT instruction

1 0 0 1 instruction 1 instruction 1 instruction 1 instruction
(5 instructions) (3 instructions)

1 × × × 1 instruction 1 instruction 1 instruction 1 instruction 1 instruction

Remarks 1. One instruction is executed in the minimum instruction execution time with the pre-switchover CPU clock.
2. MCS: Bit 0 of the oscillation mode selection register (OSMS)
3. Values in parentheses apply to operation with fX = 5.0 MHz or fXT = 32.768 kHz.

Caution Selection of the CPU clock cycle division ratio (PCC0 to PCC2) and switchover from the main system clock to the subsystem
clock (changing CSS from 0 to 1) should not be performed simultaneously. Simultaneous setting is possible, however, for
selection of the CPU clock cycle division ratio (PCC0 to PCC2) and switchover from the subsystem clock to the main system
clock (changing CSS from 1 to 0).
 CHAPTER 7 CLOCK GENERATOR

7.6.2 System clock and CPU clock switching procedure

This section describes the procedure for switching between the system clock and the CPU clock.

Figure 7-10. Switching Between System Clock and CPU Clock

VDD

RESET

Interrupt
request
signal

System clock fXX fXX fXT fXX

CPU clock
Minimum Maximum speed Subsystem clock High-speed
speed operation operation operation
operation
Wait (26.2 ms: 5.0 MHz)
Internal reset operation

(1) The CPU is reset by setting the RESET signal to low level after power-on. After that, when reset is released
by setting the RESET signal to high level, the main system clock starts oscillation. At this time, the oscillation
stabilization time (217/fX) is secured automatically.
After that, the CPU starts executing the instruction at the minimum speed of the main system clock (12.8 µs when
operated at 5.0 MHz).

(2) After the lapse of a sufficient time for the VDD voltage to increase to enable operation at maximum speeds,
the processor clock control register (PCC) and oscillation mode selection register (OSMS) are rewritten and
the maximum-speed operation is carried out.

(3) Upon detection of a decrease of the VDD voltage due to an interrupt request signal, the main system clock
is switched to the subsystem clock (which must be in an oscillation stable state).

(4) Upon detection of VDD voltage reset due to an interrupt request signal, bit 7 (MCC) of PCC is cleared to 0 and
oscillation of the main system clock is started. After the lapse of time required for stabilization of oscillation,
the PCC and OSMS registers are rewritten and the maximum-speed operation is resumed.

Caution When the main system clock is stopped and the device is operating on the subsystem clock, wait
until the oscillation stabilization time has been secured by the program before switching back
to the main system clock.

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 CHAPTER 8 16-BIT TIMER/EVENT COUNTER

8.1 16-Bit Timer/Event Counter Functions

The 16-bit timer/event counter (TM0) has the following functions.

• Interval timer
• PWM output
• Pulse width measurement
• External event counter
• Square-wave output
• One-shot pulse output

PWM output and pulse width measurement can be used at the same time.

(1) Interval timer

TM0 generates interrupt requests at the preset time interval.

Table 8-1. 16-Bit Timer/Event Counter Interval Times

Minimum Interval Time Maximum Interval Time Resolution

MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0

2 × TI00 input cycle 216 × TI00 input cycle TI00 input edge cycle

— 2 × 1/fX — 216 × 1/fX — 1/fX

(400 ns) (13.1 ms) (200 ns)
2 × 1/fX 22 × 1/fX 216 × 1/fX 217 × 1/fX 1/fX 2 × 1/fX
(400 ns) (800 ns) (13.1 ms) (26.2 ms) (200 ns) (400 ns)
22 × 1/fX 23 × 1/fX 217 × 1/fX 218 × 1/fX 2 × 1/fX 22 × 1/fX
(800 ns) (1.6 µs) (26.2 ms) (52.4 ms) (400 ns) (800 ns)

23 × 1/fX 24 × 1/fX 218 × 1/fX 219 × 1/fX 22 × 1/fX 23 × 1/fX

(1.6 µs) (3.2 µs) (52.4 ms) (104.9 ms) (800 ns) (1.6 µs)
2 × watch timer output cycle 216 × watch timer output cycle Watch timer output edge cycle

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. Values in parentheses apply to operation with fX = 5.0 MHz

(2) PWM output

TM0 can generate 14-bit resolution PWM output.

(3) Pulse width measurement

TM0 can measure the pulse width of an externally input signal.

(4) External event counter

TM0 can measure the number of pulses of an externally input signal.

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(5) Square-wave output

TM0 can output a square wave with any selected frequency.

Table 8-2. 16-Bit Timer/Event Counter Square-Wave Output Ranges

Minimum Pulse Time Maximum Pulse Time Resolution

MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0

2 × TI00 input cycle 216 × TI00 input cycle TI00 input edge cycle
— 2 × 1/fX — 216 × 1/fX — 1/fX
(400 ns) (13.1 ms) (200 ns)

2 × 1/fX 22 × 1/fX 216 × 1/fX 217 × 1/fX 1/fX 2 × 1/fX

(400 ns) (800 ns) (13.1 ms) (26.2 ms) (200 ns) (400 ns)
22 × 1/fX 23 × 1/fX 217 × 1/fX 218 × 1/fX 2 × 1/fX 22 × 1/fX
(800 ns) (1.6 µs) (26.2 ms) (52.4 ms) (400 ns) (800 ns)
23 × 1/fX 24 × 1/fX 218 × 1/fX 219 × 1/fX 22 × 1/fX 23 × 1/fX
(1.6 µs) (3.2 µs) (52.4 ms) (104.9 ms) (800 ns) (1.6 µs)

2 × watch timer output cycle 216 × watch timer output cycle Watch timer output edge cycle

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. Values in parentheses apply to operation with fX = 5.0 MHz

(6) One-shot pulse output

TM0 is able to output a one-shot pulse with any output pulse width.

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8.2 16-Bit Timer/Event Counter Configuration

The 16-bit timer/event counter consists of the following hardware.

Table 8-3. 16-Bit Timer/Event Counter Configuration

Item Configuration

Timer register 16 bits × 1 (TM0)

Register Capture/compare register: 16 bits × 2 (CR00, CR01)

Timer outputs 1 (TO0)
Control registers Timer clock select register 0 (TCL0)
16-bit timer mode control register (TMC0)
Capture/compare control register 0 (CRC0)
16-bit timer output control register (TOC0)
Port mode register 3 (PM3)
External interrupt mode register 0 (INTM0)
Sampling clock select register (SCS)Note

Note See Figure 21-1 Basic Configuration of Interrupt Function.

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Figure 8-1. Block Diagram of 16-Bit Timer/Event Counter

Internal bus

Capture/compare
control register 0

CRC02 CRC01 CRC00

INTP1

TI01/ Selector 16-bit capture/compare INTTM00

P01/INTP1 control register (CR00)

Match PWM pulse

output Note 2
INTTM3 controller
2f XX 16-bit timer/event
f XX TO0/P30
Selector

f XX/2 TMC01 to TMC03 counter output

16-bit timer register (TM0) controller
f XX/22
Clear 2
TI00/P00/ Note 1 Clear circuit
INTP0 TMC01 to TMC03
Match
INTTM01
3 3
INTP0

16-bit capture/compare
TCL06 TCL05 TCL04 control register (CR01) TMC03 TMC02 TMC01 OVF0 OSPT OSPETOC04 LVS0 LVR0 TOC01 TOE0
Timer clock 16-bit timer mode 16-bit timer output
select register 0 CRC02 control register control register

Internal Bus

Notes 1. Edge detector

2. The configuration of the 16-bit timer/event counter output controller is shown in Figure 8-2.

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Figure 8-2. Block Diagram of 16-Bit Timer/Event Counter Output Controller

PWM pulse Level

output controller inversion

CRC02
INTTM01

Selector
CRC00

Selector
INTTM00 INV

Q TO0/P30
S
TI00/P00/ Edge
INTP0 detector One-shot pulse R
output controller
3

ES11 ES10 P30 output PM30

OSPT OSPE TOC04 LVS0 LVR0 TOC01 TOE0 TMC03 TMC02 TMC01
latch

External interrupt 16-bit timer output 16-bit timer mode

mode register 0 control register control register Port mode
register 3

Internal bus

Remark The circuitry enclosed by the broken line is the output controller.

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(1) Capture/compare register 00 (CR00)

CR00 is a 16-bit register which has the functions of both a capture register and a compare register. Whether
it is used as a capture register or as a compare register is set by bit 0 (CRC00) of capture/compare control
register 0.

(a) When CR00 is used as a compare register

The value set in CR00 is constantly compared with the 16-bit timer register (TM0) count value, and an
interrupt request (INTTM00) is generated if they match. It can also be used as the register that holds
the interval time when TM0 is set to interval timer operation, and as the register that sets the pulse width
when TM0 is set to PWM output operation.

(b) When CR00 is used as a capture register

It is possible to select the valid edge of the INTP0/TI00 pin or the INTP1/TI01 pin as the capture trigger.
The INTP0/TI00 or INTP1/TI01 valid edge is set by external interrupt mode register 0 (INTM0).
If CR00 is specified as a capture register and the capture trigger is specified to be the valid edge of the
INTP0/TI00 pin, the situation is as shown in Table 8-4. On the other hand, when the capture trigger is
specified to be the valid edge of the INTP1/TI01 pin, the situation is as shown in Table 8-5.

Table 8-4. INTP0/TI00 Pin Valid Edge and CR00 Capture Trigger Valid Edge

ES11 ES10 INTP0/TI00 Pin Valid Edge CR00 Capture Trigger Valid Edge

0 0 Falling edge Rising edge

0 1 Rising edge Falling edge
1 0 Setting prohibited

1 1 Both rising and falling edges No capture operation

Table 8-5. INTP1/TI01 Pin Valid Edge and CR00 Capture Trigger Valid Edge

ES21 ES20 INTP1/TI01 Pin Valid Edge CR00 Capture Trigger Valid Edge
0 0 Falling edge Falling edge
0 1 Rising edge Rising edge

1 0 Setting prohibited
1 1 Both rising and falling edges Both rising and falling edges

CR00 is set with a 16-bit memory manipulation instruction.

RESET input makes CR00 undefined.

Cautions 1. Set the data of PWM (14 bits) to the higher 14 bits of CR00. At this time, clear the lower
2 bits to 00.
2. Set CR00 to a value other than 0000H in the clear & start mode entered on a match between
TM0 and CR00. However, in the free-running mode and in the clear mode using the valid
edge of TI00, if CR00 is set to 0000H, an interrupt request (INTTM00) is generated
following overflow (FFFFH).
3. If the new value of CR00 is less than the value of the 16-bit timer register (TM0), TM0
continues counting, overflows, and then starts counting again from 0. If the new value
of CR00 is less than the old value, the timer must be restarted after changing the value
of CR00.

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(2) Capture/compare register 01 (CR01)

CR01 is a 16-bit register which has the functions of both a capture register and a compare register. Whether
it is used as a capture register or a compare register is set by bit 2 (CRC02) of capture/compare control register
0.

(a) When CR01 is used as a compare register

The value set in CR01 is constantly compared with the 16-bit timer register (TM0) count value, and an
interrupt request (INTTM01) is generated if they match.

(b) When CR01 is used as a capture register

It is possible to select the valid edge of the INTP0/TI00 pin as the capture trigger. The INTP0/TI00 valid
edge is set by external interrupt mode register 0 (INTM0).

Table 8-6. INTP0/TI00 Pin Valid Edge and CR01 Capture Trigger Valid Edge

ES11 ES10 INTP0/TI00 Pin Valid Edge CR01 Capture Trigger Valid Edge
0 0 Falling edge Falling edge

0 1 Rising edge Rising edge

1 0 Setting prohibited
1 1 Both rising and falling edges Both rising and falling edges

CR01 is set with a 16-bit memory manipulation instruction.

RESET input makes CR01 undefined.

Caution Set CR01 to a value other than 0000H in the clear & start mode entered on a match between
TM0 and CR00. However, in the free-running mode and in the clear mode using the valid edge
of TI00, if CR01 is set to 0000H, an interrupt request (INTTM01) is generated following
overflow (FFFFH).

(3) 16-bit timer register (TM0)

TM0 is a 16-bit register which counts the count pulses.
TM0 is read with a 16-bit memory manipulation instruction. When TM0 is read, the capture/compare register
(CR01) should first be set as a capture register.
RESET input clears TM0 to 0000H.

Caution As reading of the value of TM0 is performed via CR01, the previously set value of CR01 is
lost.

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8.3 16-Bit Timer/Event Counter Control Registers

The following seven registers are used to control the 16-bit timer/event counter.

• Timer clock select register 0 (TCL0)

• 16-bit timer mode control register (TMC0)
• Capture/compare control register 0 (CRC0)
• 16-bit timer output control register (TOC0)
• Port mode register 3 (PM3)
• External interrupt mode register 0 (INTM0)
• Sampling clock select register (SCS)

(1) Timer clock select register 0 (TCL0)

This register is used to set the count clock of the 16-bit timer register.
TCL0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears TCL0 to 00H.

Remark TCL0 has the function of setting the PCL output clock in addition to that of setting the count clock
of the 16-bit timer register.

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Figure 8-3. Format of Timer Clock Select Register 0

Symbol <7> 6 5 4 3 2 1 0 Address After reset R/W

TCL0 CLOE TCL06 TCL05 TCL04 TCL03 TCL02 TCL01 TCL00 FF40H 00H R/W

TCL03 TCL02 TCL01 TCL00 PCL output clock selection

MCS = 1 MCS = 0

0 0 0 0 fXT (32.768 kHz)

0 1 0 1 fXX fX (5.0 MHz) fX/2 (2.5 MHz)

2
0 1 1 0 fXX/2 fX/2 (2.5 MHz) fX/2 (1.25 MHz)
2 2 3
0 1 1 1 fXX/2 fX/2 (1.25 MHz) fX/2 (625 kHz)
3 3 4
1 0 0 0 fXX/2 fX/2 (625 kHz) fX/2 (313 kHz)
4 4 5
1 0 0 1 fXX/2 fX/2 (313 kHz) fX/2 (156 kHz)
5 5 6
1 0 1 0 fXX/2 fX/2 (156 kHz) fX/2 (78.1 kHz)
6 6 7
1 0 1 1 fXX/2 fX/2 (78.1 kHz) fX/2 (39.1 kHz)
7 7 8
1 1 0 0 fXX/2 fX/2 (39.1 kHz) fX/2 (19.5 kHz)

Other than above Setting prohibited

TCL06 TCL05 TCL04 16-bit timer register count clock selection

MCS = 1 MCS = 0

0 0 0 TI00 (valid edge specifiable)

0 0 1 2fXX Setting prohibited fX (5.0 MHz)

0 1 0 fXX fX (5.0 MHz) fX/2 (2.5 MHz)

2
0 1 1 fXX/2 fX/2 (2.5 MHz) fX/2 (1.25 MHz)
2 2 3
1 0 0 fXX/2 fX/2 (1.25 MHz) fX/2 (625 kHz)

1 1 1 Watch timer output (INTTM 3)

Other than above Setting prohibited

CLOE PCL output control

0 Output disabled

1 Output enabled

Cautions 1. The TI00/INTP0 pin valid edge is set by external interrupt mode register 0 (INTM0), and
the sampling clock frequency is selected by the sampling clock selection register (SCS).
2. When enabling PCL output, set TCL00 to TCL03, then set CLOE to 1 with a 1-bit memory
manipulation instruction.
3. To read the count value when TI00 has been specified as the TM0 count clock, the value
should be read from TM0, not from 16-bit capture/compare register 01 (CR01).
4. When rewriting TCL0 to other data, stop the timer operation beforehand.

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Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fXT: Subsystem clock oscillation frequency
4. TI00: 16-bit timer/event counter input pin
5. TM0: 16-bit timer register
6. MCS: Bit 0 of oscillation mode select register (OSMS)
7. Values in parentheses apply to operation with fX = 5.0 MHz or fXT = 32.768 kHz.

(2) 16-bit timer mode control register (TMC0)

This register sets the 16-bit timer operating mode, the 16-bit timer register clear mode and output timing, and
detects an overflow.
TMC0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears TMC0 to 00H.

Caution The 16-bit timer register starts operation at the moment TMC01 to TMC03 are set to values
other than 0, 0, 0 (operation stop mode). Set TMC01 to TMC03 to 0, 0, 0 to stop the operation.

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Figure 8-4. Format of 16-Bit Timer Mode Control Register

Symbol 7 6 5 4 3 2 1 <0> Address After reset R/W

TMC0 0 0 0 0 TMC03 TMC02 TMC01 OVF0 FF48H 00H R/W

OVF0 16-bit timer register overflow detection

0 Overflow not detected

1 Overflow detected

TMC03 TMC02 TMC01 Operating mode or TO0 output timing selection Interrupt request generation
clear mode selection

0 0 0 Operation stopped No change Not generated

(TM0 cleared to 0)

0 0 1 PWM mode PWM pulse output Generated on match

(free running) between TM0 and CR00,
and match between TM0
0 1 0 Free-running mode Match between TM0 and and CR01
CR00 or match between
TM0 and CR01

0 1 1 Match between TM0 and

CR00, match between
TM0 and CR01 or TI00
valid edge

1 0 0 Clear & start on TI00 Match between TM0 and

valid edge CR00 or match between
TM0 and CR01

1 0 1 Match between TM0 and

CR00, match between
TM0 and CR01 or TI00
valid edge

1 1 0 Clear & start on match Match between TM0 and

between TM0 and CR00 CR00 or match between
TM0 and CR01

1 1 1 Match between TM0 and

CR00, match between
TM0 and CR01 or TI00
valid edge

Cautions 1. Switch the clear mode and the TO0 output timing after stopping the timer operation
(by clearing TMC01 to TMC03 to 0, 0, 0).
2. Set the valid edge of the TI00/INTP0 pin using external interrupt mode register 0
(INTM0) and select the sampling clock frequency using the sampling clock select
register (SCS).
3. When using the PWM mode, set the PWM mode and then set data to CR00.
4. If clear & start mode entered on a match between TM0 and CR00 is selected, when the
set value of CR00 is FFFFH and the TM0 value changes from FFFFH to 0000H, the OVF0
flag is set to 1.

Remark TO0: 16-bit timer/event counter output pin

TI00: 16-bit timer/event counter input pin
TM0: 16-bit timer register
CR00: Compare register 00
CR01: Compare register 01

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(3) Capture/compare control register 0 (CRC0)

This register controls the operation of capture/compare registers 00 and 01 (CR00 and CR01).
CRC0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input sets CRC0 to 04H.

Figure 8-5. Format of Capture/Compare Control Register 0

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

CRC0 0 0 0 0 0 CRC02 CRC01 CRC00 FF4CH 04H R/W

CRC00 CR00 operating mode selection

0 Operates as compare register

1 Operates as capture register

CRC01 CR00 capture trigger selection

0 Captures on valid edge of TI01

1 Captures on reverse phase of valid edge of TI00

CRC02 CR01 operating mode selection

0 Operates as compare register

1 Operates as capture register

Cautions 1. Timer operation must be stopped before setting CRC0.

2. When clear & start mode entered on a match between TM0 and CR00 is selected by
the 16-bit timer mode control register (TMC0), CR00 should not be specified as a
capture register.

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(4) 16-bit timer output control register (TOC0)

This register controls the operation of the 16-bit timer/event counter output controller. It sets R-S type flip-
flop (LV0) setting/resetting, the active level in PWM mode, inversion enabling/disabling in modes other than
PWM mode, 16-bit timer/event counter timer output enabling/disabling, one-shot pulse output operation
enabling/disabling, and the output trigger for a one-shot pulse by software.
TOC0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears TOC0 to 00H.

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Figure 8-6. Format of 16-Bit Timer Output Control Register

Symbol 7 <6> <5> 4 <3> <2> 1 <0> Address After reset R/W
TOC0 0 OSPT OSPE TOC04 LVS0 LVR0 TOC01 TOE0 FF4EH 00H R/W

TOE0 16-bit timer/event counter output control

0 Output disabled (port mode)

1 Output enabled

TOC01 In PWM mode In other modes

Active level selection Timer output F/F control

by match of CR00 and
TM0
0 Active high Inversion operation disabled

1 Active low Inversion operation enabled

LVS0 LVR0 16-bit timer/event counter timer

output F/F status setting

0 0 No change

0 1 Timer output F/F reset to 0

1 0 Timer output F/F set to 1

1 1 Setting prohibited

TOC04 Timer output F/F control by match of CR01 and TM0

0 Inversion operation disabled

1 Inversion operation enabled

OSPE One-shot pulse output control

0 Continuous pulse output

1 One-shot pulse output

OSPT Control of one-shot pulse output trigger by software

0 One-shot pulse trigger not used

1 One-shot pulse trigger used

Cautions 1. Timer operation must be stopped before setting TOC0 (except OSPT).
2. If LVS0 and LVR0 are read after data is set, they will be 0.
3. OSPT is cleared automatically after data setting, and will therefore be 0 if read.
4. OSPT can be set only when OSPE = 1.

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(5) Port mode register 3 (PM3)

This register sets port 3 input/output in 1-bit units.
When using the P30/TO0 pin for timer output, set PM30 and the output latch of P30 to 0.
PM3 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input sets PM3 to FFH.

Figure 8-7. Format of Port Mode Register 3

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

PM3 PM37 PM36 PM35 PM34 PM33 PM32 PM31 PM30 FF23H FFH R/W

PM3n P3n pin input/output mode selection (n = 0 to 7)

0 Output mode (output buffer on)

1 Input mode (output buffer off)

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(6) External interrupt mode register 0 (INTM0)

This register is used to set the valid edges of INTP0 to INTP2, TI00, and TI01.
INTM0 is set with an 8-bit memory manipulation instruction.
RESET input clears INTM0 to 00H.

Figure 8-8. Format of External Interrupt Mode Register 0

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

INTM0 ES31 ES30 ES21 ES20 ES11 ES10 0 0 FFECH 00H R/W

ES11 ES10 INTP0/TI00 valid edge selection

0 0 Falling edge

0 1 Rising edge

1 0 Setting prohibited

1 1 Both rising and falling edges

ES21 ES20 INTP1/TI01 valid edge selection

0 0 Falling edge

0 1 Rising edge

1 0 Setting prohibited

1 1 Both rising and falling edges

ES31 ES30 INTP2 valid edge selection

0 0 Falling edge

0 1 Rising edge

1 0 Setting prohibited

1 1 Both rising and falling edges

Caution When using the INTP0/TI00/P00 and INTP1/TI01/P01 pins as timer input pins (TI00 and TI01),
stop the operation of 16-bit timer 0 by clearing bits 1 to 3 (TMC01 to TMC03) of the 16-bit timer
mode control register (TMC0) to 0, 0, 0, before setting the valid edge of TI00 and TI01. When
using the INTP0/TI00/P00 and INTP1/TI01/P01 pins as external interrupt input pins (INTP0 and
INTP1), the valid edge of INTP0 and INTP1 may be set while 16-bit timer 0 is operating.

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(7) Sampling clock select registers (SCS)

This register sets the clock used as the clock for sampling the valid edges input to INTP0. When remote
controlled reception is carried out using INTP0, digital noise is eliminated by the sampling clock.
SCS is set with an 8-bit memory manipulation instruction.
RESET input clears SCS to 00H.

Figure 8-9. Format of Sampling Clock Select Register

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

SCS 0 0 0 0 0 0 SCS1 SCS0 FF47H 00H R/W

SCS1 SCS0 INTP0 sampling clock selection

MCS = 1 MCS = 0
N
0 0 fXX/2
7 7 8
0 1 fXX/2 fX/2 (39.1 kHz) fX/2 (19.5 kHz)
5 5 6
1 0 fXX/2 fX/2 (156.3 kHz) fX/2 (78.1 kHz)
6 6 7
1 1 fXX/2 fX/2 (78.1 kHz) fX/2 (39.1 kHz)

Caution fXX/2N is the clock supplied to the CPU, and fXX/25, fXX/26, and fXX/27 are clocks supplied to
peripheral hardware. The fXX/2N clock is stopped in HALT mode.

Remarks 1. N: Value set to bits 0 to 2 (PCC0 to PCC2) of the processor clock control register (PCC)
(N = 0 to 4)
2. fXX: Main system clock frequency (fX or fX/2)
3. fX: Main system clock oscillation frequency
4. MCS: Bit 0 of oscillation mode select register (OSMS)
5. Values in parentheses apply to operation with fX = 5.0 MHz.

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8.4 16-Bit Timer/Event Counter Operations

8.4.1 Interval timer operations

Setting the 16-bit timer mode control register (TMC0) and capture/compare control register 0 (CRC0) as shown
in Figure 8-10 allows operation as an interval timer. Interrupt requests are generated repeatedly using the count value
set to 16-bit capture/compare register 00 (CR00) beforehand as the interval.
When the count value of the 16-bit timer register (TM0) matches the value set to CR00, counting continues with
the TM0 value cleared to 0 and the interrupt request signal (INTTM00) is generated.
The count clock of the 16-bit timer/event counter can be selected using bits 4 to 6 (TCL04 to TCL06) of timer clock
select register 0 (TCL0).
For the operation when the value of the compare register is changed during the timer/counter operation, see 8.6
(3) Operation after compare register change during timer count operation.

Figure 8-10. Control Register Settings for Interval Timer Operation

(a) 16-bit timer mode control register (TMC0)

TMC03 TMC02 TMC01 OVF0

TMC0 0 0 0 0 1 1 0/1 0

Clear & start on match TM0 and CR00

(b) Capture/compare control register 0 (CRC0)

CRC02 CRC01 CRC00

CRC0 0 0 0 0 0 0/1 0/1 0

CR00 is set as compare register

Remark 0/1: Setting 0 or 1 allows another function to be used simultaneously with the interval timer. See
the description of the respective control registers for details.

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Figure 8-11. Interval Timer Configuration Diagram

16-bit capture/compare register 00 (CR00)

INTTM3 INTTM00
2fXX
fXX Selector
fXX/2
2
16-bit timer register (TM0) OVF0
fXX/2
TI00/P00/INTP0

Clear circuit

Figure 8-12. Interval Timer Operation Timings

Count clock

TM0 count value 0000 0001 N 0000 0001 N 0000 0001 N

Count start Clear Clear

CR00 N N N N

INTTM00

Interrupt request acknowledge Interrupt request acknowledge

TO0

Interval time Interval time Interval time

Remark Interval time = (N + 1) × t : N = 0001H to FFFFH.

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Table 8-7. 16-Bit Timer/Event Counter Interval Times

TCL06 TCL05 TCL04 Minimum Interval Time Maximum Interval Time Resolution

MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0

0 0 0 2 × TI00 input cycle 216 × TI00 input cycle TI00 input edge cycle
0 0 1 Setting 2 × 1/fX Setting 216 × 1/fX Setting 1/fX
prohibited (400 ns) prohibited (13.1 ms) prohibited (200 ns)
0 1 0 2 × 1/fX 22 × 1/fX 216 × 1/fX 217 × 1/fX 1/fX 2 × 1/fX
(400 ns) (800 ns) (13.1 ms) (26.2 ms) (200 ns) (400 ns)

0 1 1 22 × 1/fX 23 × 1/fX 217 × 1/fX 218 × 1/fX 2 × 1/fX 22 × 1/fX

(800 ns) (1.6 µs) (26.2 ms) (52.4 ms) (400 ns) (800 ns)
1 0 0 23 × 1/fX 24 × 1/fX 218 × 1/fX 219 × 1/fX 22 × 1/fX 23 × 1/fX
(1.6 µs) (3.2 µs) (52.4 ms) (104.9 ms) (800 ns) (1.6 µs)
1 1 1 2 × watch timer output cycle 216 × watch timer output cycle Watch timer output edge cycle

Other than above Setting prohibited

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. TCL04 to TCL06: Bits 4 to 6 of timer clock select register (TCL0)
4. Values in parentheses apply to operation with fX = 5.0 MHz

8.4.2 PWM output operations

Setting the 16-bit timer mode control register (TMC0), capture/compare control register 0 (CRC0), and the 16-bit
timer output control register (TOC0) as shown in Figure 8-13 allows operation as PWM output. Pulses with the duty
rate determined by the value set to 16-bit capture/compare register 00 (CR00) beforehand are output from the TO0/
P30 pin.
Set the active level width of the PWM pulse to the higher 14 bits of CR00. Select the active level using bit 1 (TOC01)
of the 16-bit timer output control register (TOC0).
This PWM pulse has a 14-bit resolution. The pulse can be converted to an analog voltage by integrating it with
an external low-pass filter (LPF). The PWM pulse is formed by a combination of the basic cycle determined by 28/
Φ and the sub-cycle determined by 214/Φ so that the time constant of the external LPF can be shortened. The count
clock Φ can be selected using bits 4 to 6 (TCL04 to TCL06) of timer clock select register 0 (TCL0).
PWM output enable/disable can be selected using bit 0 (TOE0) of TOC0.

Cautions 1. PWM operation mode should be selected before setting CR00.

2. Be sure to clear bits 0 and 1 of CR00 to 0.
3. Do not select PWM operation mode for external clock input from the TI00/P00/INTP0 pin.

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Figure 8-13. Control Register Settings for PWM Output Operation

(a) 16-bit timer mode control register (TMC0)

TMC03 TMC02 TMC01 OVF0

TMC0 0 0 0 0 0 0 1 0

PWM mode

(b) Capture/compare control register 0 (CRC0)

CRC02 CRC01 CRC00

CRC0 0 0 0 0 0 0/1 0/1 0

CR00 is set as compare register

(c) 16-bit timer output control register (TOC0)

OSPT OSPE TOC04 LVS0 LVR0 TOC01 TOE0

TOC0 0 × × × × × 0/1 1
TO0 output enabled
Specifies active level

Remark 0/1: Setting 0 or 1 allows another function to be used simultaneously with PWM output.
See the description of the respective control registers for details.
×: don’t care

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By integrating 14-bit resolution PWM pulses with an external low-pass filter, they can be converted to an analog
voltage and used for electronic tuning and D/A converter applications, etc.
The analog output voltage (VAN) used for D/A conversion with the configuration shown in Figure 8-14 is as follows.

Capture/compare register 00 (CR00) value

VAN = VREF ×
216

VREF: External switching circuit reference voltage

Figure 8-14. Example of D/A Converter Configuration with PWM Output

µ PD780058, 780058Y

VREF

PWM
signal Analog output (VAN)
TO0/P30 Switching circuit Low-pass filter

Figure 8-15 shows an example in which PWM output is converted to an analog voltage and used in a voltage
synthesizer type TV tuner.

Figure 8-15. TV Tuner Application Circuit Example

+110 V
µ PD780058, 780058Y
22 kΩ
47 kΩ 47 kΩ 47 kΩ

100 pF
2SC 0.22 µ F 0.22 µ F 0.22 µ F Electronic
TO0/P30 2352 tuner
8.2 kΩ µ PC574J

8.2 kΩ

VSS0 GND
VSS0

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8.4.3 PPG output operations

Setting the 16-bit timer mode control register (TMC0) and capture/compare control register 0 (CRC0) as shown
in Figure 8-16 allows operation as PPG (Programmable Pulse Generator) output.
In the PPG output operation, square waves are output from the TO0/P30 pin with the pulse width and the cycle
that correspond to the count values set beforehand to 16-bit capture/compare register 01 (CR01) and 16-bit capture/
compare register 00 (CR00), respectively.

Figure 8-16. Control Register Settings for PPG Output Operation

(a) 16-bit timer mode control register (TMC0)

TMC03 TMC02 TMC01 OVF0

TMC0 0 0 0 0 1 1 0 0

Clear & start on match of TM0 and CR00

(b) Capture/compare control register 0 (CRC0)

CRC02 CRC01 CRC00

CRC0 0 0 0 0 0 0 × 0

CR00 is set as compare register

CR01 is set as compare register

(c) 16-bit timer output control register (TOC0)

OSPT OSPE TOC04 LVS0 LVR0 TOC01 TOE0

TOC0 0 0 0 1 0/1 0/1 1 1
TO0 output enabled
Inversion of output on match of TM0 and CR00
Specified TO0 output F/F initial value
Inversion of output on match of TM0 and CR01
One-shot pulse output disabled

Remark × : don’t care

Cautions 1. CR00 and CR01 should be set to values in the following range:
0000H ≤ CR01 < CR00n ≤ FFFFH
2. The cycle of the pulse generated through PPG output (CR00 setting value + 1) has a duty of
(CR01 setting value + 1)/(CR00 setting value + 1).

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Figure 8-17. Configuration of PPG Output

16-bit timer capture/compare

register 00 (CR00)

INTTM3
2fXX

Selector
fXX
fXX/2
16-bit timer counter 0 Clear
fXX/22 (TM0) circuit
Noise

Output controller
TI00/P00/INTP0
eliminator

TO0/P30

16-bit timer capture/compare

register 01 (CR01)

Figure 8-18. PPG Output Operation Timing

Count clock

TM0 count value 0000H 0001H M–1 M N–1 N 0000H 0001H

Count start Clear

CR00 capture value N

CR01 capture value M

TO0

Pulse width: (M + 1) × t

1 cycle: (N + 1) × t

Remark 0000H < M < N ≤ FFFFH

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8.4.4 Pulse width measurement operations

It is possible to measure the pulse width of the signals input to the TI00/P00 pin and TI01/P01 pin using the
16-bit timer register (TM0).
There are two measurement methods: measuring with TM0 used in free-running mode, and measuring by restarting
the timer in synchronization with the edge of the signal input to the TI00/P00 pin.

(1) Pulse width measurement with free-running counter and one capture register
When the 16-bit timer register (TM0) is operated in free-running mode (see register settings in Figure 8-17),
and the edge specified by external interrupt mode register 0 (INTM0) is input to the TI00/P00 pin, the value
of TM0 is taken into 16-bit capture/compare register 01 (CR01) and an external interrupt request signal (INTP0)
is set.
Any of three edge specifications can be selected—rising, falling, or both edges—by bits 2 and 3 (ES10 and
ES11) of INTM0.
For valid edge detection, sampling is performed at the interval selected by the sampling clock select register
(SCS), and a capture operation is only performed when a valid level is detected twice, thus eliminating noise
with a short pulse width.

Figure 8-19. Control Register Settings for Pulse Width Measurement with
Free-Running Counter and One Capture Register

(a) 16-bit timer mode control register (TMC0)

TMC03 TMC02 TMC01 OVF0

TMC0 0 0 0 0 0 1 0/1 0

Free-running mode

(b) Capture/compare control register 0 (CRC0)

CRC02 CRC01 CRC00

CRC0 0 0 0 0 0 1 0/1 0
CR00 is set as compare register
CR01 is set as capture register

Remark 0/1: Setting 0 or 1 allows another function to be used simultaneously with pulse width measure-
ment. See the description of the respective control registers for details.

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Figure 8-20. Configuration Diagram for Pulse Width Measurement by Free-Running Counter

INTTM3
2fXX

Selector
fXX
16-bit timer register (TM0) OVF0
fXX/2
2
fXX/2

TI00/P00/INTP00 16-bit capture/compare

register 01 (CR01)

INTP0

Internal bus

Figure 8-21. Timing of Pulse Width Measurement Operation by Free-Running Counter

and One Capture Register (with Both Edges Specified)

Count clock

TM0 count value 0000 0001 D0 D1 FFFF 0000 D2 D3

TI00 pin input

CR01 captured value D0 D1 D2 D3

INTP0

OVF0

(D1 – D0) × t (10000H – D1 + D2) × t (D3 – D2) × t

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(2) Measurement of two pulse widths with free-running counter

When the 16-bit timer register (TM0) is operated in free-running mode (see register settings in Figure 8-20),
it is possible to simultaneously measure the pulse widths of the two signals input to the TI00/P00 pin and the
TI01/P01 pin.
When the edge specified by bits 2 and 3 (ES10 and ES11) of external interrupt mode register 0 (INTM0) is
input to the TI00/P00 pin, the value of TM0 is taken into 16-bit capture/compare register 01 (CR01) and an
external interrupt request signal (INTP0) is set.
Also, when the edge specified by bits 4 and 5 (ES20 and ES21) of INTM0 is input to the TI01/P01 pin, the
value of TM0 is taken into 16-bit capture/compare register 00 (CR00) and an external interrupt request signal
(INTP1) is set.
Any of three edge specifications can be selected—rising, falling, or both edges—as the valid edges for the
TI00/P00 pin and the TI01/P01 pin by bits 2 and 3 (ES10 and ES11) and bits 4 and 5 (ES20 and ES21) of
INTM0, respectively.
For TI00/P00 pin valid edge detection, sampling is performed at the interval selected by the sampling clock
select register (SCS), and a capture operation is only performed when a valid level is detected twice, thus
eliminating noise with a short pulse width.

Figure 8-22. Control Register Settings for Two Pulse Width Measurements with Free-Running Counter

(a) 16-bit timer mode control register (TMC0)

TMC03 TMC02 TMC01 OVF0

TMC0 0 0 0 0 0 1 0/1 0

Free-running mode

(b) Capture/compare control register 0 (CRC0)

CRC02 CRC01 CRC00

CRC0 0 0 0 0 0 1 0 1

CR00 is set as capture register

Captured in CR00 on valid edge of TI01/P01 Pin

CR01 is set as capture register

Remark 0/1: Setting 0 or 1 allows another function to be used simultaneously with pulse width measurement.
See the description of the respective control registers for details.

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Figure 8-23. Timing of Pulse Width Measurement Operation with

Free-Running Counter (with Both Edges Specified)

Count clock

TM0 count value 0000 0001 D0 D1 FFFF 0000 D2 D3

TI00 pin input

CR01 captured value D0 D1 D2 D3

INTP0

TI01 pin input

CR00 captured value D1

INTP1

OVF0

(D1 – D0) × t (10000H – D1 + D2) × t (D3 – D2) × t

(10000H – D1 + (D2 + 1)) × t

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(3) Pulse width measurement with free-running counter and two capture registers
When the 16-bit timer register (TM0) is operated in free-running mode (see register settings in Figure 8-22),
it is possible to measure the pulse width of the signal input to the TI00/P00 pin.
When the edge specified by bits 2 and 3 (ES10 and ES11) of external interrupt mode register 0 (INTM0) is
input to the TI00/P00 pin, the value of TM0 is taken into 16-bit capture/compare register 01 (CR01) and an
external interrupt request signal (INTP0) is set.
Also, on the reverse input edge to that of the capture operation into CR01, the value of TM0 is taken into 16-
bit capture/compare register 00 (CR00).
Either of two edge specifications can be selected—rising or falling—as the valid edges for the TI00/P00 pin
by bits 2 and 3 (ES10 and ES11) of INTM0.
For TI00/P00 pin valid edge detection, sampling is performed at the interval selected by the sampling clock
select register (SCS), and a capture operation is only performed when a valid level is detected twice, thus
eliminating noise with a short pulse width.

Caution If the valid edge of TI00/P00 is specified to be both the rising and falling edges, capture/
compare register 00 (CR00) cannot perform the capture operation.

Figure 8-24. Control Register Settings for Pulse Width Measurement with
Free-Running Counter and Two Capture Registers

(a) 16-bit timer mode control register (TMC0)

TMC03 TMC02 TMC01 OVF0

TMC0 0 0 0 0 0 1 0/1 0

Free-running mode

(b) Capture/compare control register 0 (CRC0)

CRC02 CRC01 CRC00

CRC0 0 0 0 0 0 1 1 1

CR00 is set as capture register

Captured in CR00 on reverse
edge of valid edge of TI00/P00 Pin
CR01 is set as capture register

Remark 0/1: Setting 0 or 1 allows another function to be used simultaneously with pulse width measurement.
See the description of the respective control registers for details.

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Figure 8-25. Timing of Pulse Width Measurement Operation by Free-Running

Counter and Two Capture Registers (with Rising Edge Specified)

Count clock

TM0 count value 0000 0001 D0 D1 FFFF 0000 D2 D3

TI00 pin input

CR01 captured value D0 D2

CR00 captured value D1 D3

INTP0

OVF0

(D1 – D0) × t (10000H – D1 + D2) × t (D3 – D2) × t

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(4) Pulse width measurement by means of restart

When input of a valid edge to the TI00/P00 pin is detected, the count value of the 16-bit timer register (TM0)
is taken into 16-bit capture/compare register 01 (CR01), and then the pulse width of the signal input to the
TI00/P00 pin is measured by clearing TM0 and restarting the count (see register settings in Figure 8-24).
The edge specification can be selected from two types, rising and falling edges by bits 2 and 3 (ES10 and
ES11) of external interrupt mode register 0 (INTM0).
In a valid edge detection, sampling is performed on the cycle selected by the sampling clock select register
(SCS), and a capture operation is only performed when a valid level is detected twice, thus eliminating noise
with a short pulse width.

Caution If the valid edge of TI00/P00 is specified to be both the rising and falling edges, 16-bit capture/
compare register 00 (CR00) cannot perform the capture operation.

Figure 8-26. Control Register Settings for Pulse Width Measurement by Means of Restart

(a) 16-bit timer mode control register (TMC0)

TMC03 TMC02 TMC01 OVF0

TMC0 0 0 0 0 1 0 0/1 0

Clear & start on valid edge of TI00/P00 pin

(b) Capture/compare control register 0 (CRC0)

CRC02 CRC01 CRC00

CRC0 0 0 0 0 0 1 1 1

CR00 is set as capture register

Captured in CR00 on reverse
edge to valid edge of TI00/P00 Pin
CR01 is set as capture register

Remark 0/1: Setting 0 or 1 allows another function to be used simultaneously with pulse width measurement.
See the description of the respective control registers for details.

Figure 8-27. Timing of Pulse Width Measurement Operation by

Means of Restart (with Rising Edge Specified)

Count clock

TM0 count value 0000 0001 D0 0000 0001 D1 D2 0000 0001

TI00 pin input

CR01 captured value D0 D2

CR00 captured value D1

INTP0

D1 × t

D2 × t

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8.4.5 External event counter operation

The external event counter counts the number of external clock pulses to be input to the TI00/P00 pin with the
16-bit timer register (TM0).
TM0 is incremented each time the valid edge specified by external interrupt mode register 0 (INTM0) is input.
When the TM0 counted value matches the 16-bit capture/compare register 00 (CR00) value, TM0 is cleared to
0 and the interrupt request signal (INTTM00) is generated.
Set CR00 to a value other than 0000H (1-pulse count operation cannot be performed).
The rising edge, falling edge or both edges can be selected using bits 2 and 3 (ES10 and ES11) of INTM0.
Because operations are carried out only after the valid edge is detected twice by sampling at the interval selected
by the sampling clock select register (SCS), noise with short pulse widths can be eliminated.

Figure 8-28. Control Register Settings in External Event Counter Mode

(a) 16-bit timer mode control register (TMC0)

TMC03 TMC02 TMC01 OVF0

TMC0 0 0 0 0 1 1 0/1 0

Clear & start on match of TM0 and CR00

(b) Capture/compare control register 0 (CRC0)

CRC02 CRC01 CRC00

CRC0 0 0 0 0 0 0/1 0/1 0

CR00 is set as compare register

Remark 0/1: Setting 0 or 1 allows another function to be used simultaneously with the external event
counter. See the description of the respective control registers for details.

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Figure 8-29. External Event Counter Configuration Diagram

16-bit capture/compare
register 00 (CR00)

INTTM00
Clear

TI00 valid edge 16-bit timer register (TM0) OVF0

INTP0

16-bit capture/compare
register 01 (CR01)

Internal bus

Figure 8-30. External Event Counter Operation Timing (with Rising Edge Specified)

TI00 pin input

TM0 count value 0000 0001 0002 0003 0004 0005 N–1 N 0000 0001 0002 0003

CR00 N

INTTM00

Caution When reading the external event counter count value, TM0 should be read.

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8.4.6 Square-wave output operation

The 16-bit timer/event counter outputs a square wave with any selected frequency at intervals specified by the
count value set in advance to 16-bit capture/compare register 00 (CR00).
The TO0/P30 pin output status is reversed at intervals of the count value preset to CR00 by setting bit 0 (TOE0)
and bit 1 (TOC01) of the 16-bit timer output control register (TOC0) to 1. This enables a square wave with any selected
frequency to be output.

Figure 8-31. Control Register Settings in Square-Wave Output Mode

(a) 16-bit timer mode control register (TMC0)

TMC03 TMC02 TMC01 OVF0

TMC0 0 0 0 0 1 1 0/1 0

Clear & start on match of TM0 and CR00

(b) Capture/compare control register 0 (CRC0)

CRC02 CRC01 CRC00

CRC0 0 0 0 0 0 0/1 0/1 0
CR00 is set as compare register

(c) 16-bit timer output control register (TOC0)

OSPT OSPE TOC04 LVS0 LVR0 TOC01 TOE0

TOC0 0 0 0 0 0/1 0/1 1 1
TO0 output enabled
Inversion of output on match of TM0 and CR00
Specified TO0 output F/F initial value
No inversion of output on match of TM0 and CR01
One-shot pulse output disabled

Remark 0/1: Setting 0 or 1 allows another function to be used simultaneously with square-wave output.
See the description of the respective control registers for details.

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Figure 8-32. Square-Wave Output Operation Timing

Count clock

TM0 count value 0000 0001 0002 N–1 N 0000 0001 0002 N–1 N 0000

CR00 N

INTTM0

TO0 pin output

Table 8-8. 16-Bit Timer/Event Counter Square-Wave Output Ranges

Minimum Pulse Time Maximum Pulse Time Resolution

MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0

2 × TI00 input cycle 216 × TI00 input cycle TI00 input edge cycle

— 2 × 1/fX — 216 × 1/fX — 1/fX

(400 ns) (13.1 ms) (200 ns)
2 × 1/fX 22 × 1/fX 216 × 1/fX 217 × 1/fX 1/fX 2 × 1/fX
(400 ns) (800 ns) (13.1 ms) (26.2 ms) (200 ns) (400 ns)
22 × 1/fX 23 × 1/fX 217 × 1/fX 218 × 1/fX 2 × 1/fX 22 × 1/fX
(800 ns) (1.6 µs) (26.2 ms) (52.4 ms) (400 ns) (800 ns)

23 × 1/fX 24 × 1/fX 218 × 1/fX 219 × 1/fX 22 × 1/fX 23 × 1/fX

(1.6 µs) (3.2 µs) (52.4 ms) (104.9 ms) (800 ns) (1.6 µs)
2 × watch timer output cycle 216 × watch timer output cycle Watch timer output edge cycle

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. Values in parentheses apply to operation with fX = 5.0 MHz

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8.4.7 One-shot pulse output operation

The 16-bit timer/event counter can be started in synchronization with a software trigger or external trigger (TI00/
P00 pin input) and output a one-shot pulse that ends on overflow of TM0.

(1) One-shot pulse output using software trigger

If the 16-bit timer mode control register (TMC0), capture/compare control register 0 (CRC0), and the 16-bit
timer output control register (TOC0) are set as shown in Figure 8-31, and bit 6 (OSPT) of TOC0 is set to 1
by software, a one-shot pulse is output from the TO0/P30 pin.
By setting OSPT to 1, the 16-bit timer/event counter is cleared and started, and output is activated by the count
value (N) set beforehand to 16-bit capture/compare register 01 (CR01). Thereafter, output is inactivatedNote
by the count value (M) set beforehand in 16-bit capture/compare register 00 (CR00).
TM0 continues to operate after a one-shot pulse is output. To stop TM0, TMC0 must be set to 00H.

Note The case where N < M is described here. When N > M, the output becomes active with the CR00
register and inactive with the CR01 register.

Cautions 1. When a one-shot pulse is output by a software trigger, fix the TI00/P00 pin to either the
high or low level.
2. When outputting a one-shot pulse, do not set OSPT to 1. To output a one-shot pulse
again, wait until the current one-shot pulse output is completed.

Figure 8-33. Control Register Settings for One-Shot Pulse Output Operation Using Software Trigger

(a) 16-bit timer mode control register (TMC0)

TMC03 TMC02 TMC01 OVF0

TMC0 0 0 0 0 0 1 0 0

Free-running mode

(b) Capture/compare control register 0 (CRC0)

CRC02 CRC01 CRC00

CRC0 0 0 0 0 0 0 0/1 0

CR00 is set as compare register

CR01 is set as compare register

(c) 16-bit timer output control register (TOC0)

OSPT OSPE TOC04 LVS0 LVR0 TOC01 TOE0

TOC0 0 0 1 1 0/1 0/1 1 1
TO0 output enabled
Inversion of output on match of TM0 and CR00
Specified TO0 output F/F initial value
Inversion of output on match of TM0 and CR01
One-shot pulse output mode
Set 1 in case of output

Remark 0/1: Setting 0 or 1 allows another function to be used simultaneously with one-shot pulse output.
See the description of the respective control registers for details.

Caution Do not clear CR00 and CR01 to 0000H.

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Figure 8-34. One-Shot Pulse Output Operation Timing Using Software Trigger

Set 0CH to TMC0

(TM0 count start)

Count clock

TM0 count value 0000 0001 N N+1 0000 N–1 N M–1 M M+1 0000

CR01 set value N N N N

CR00 set value M M M M

OSPT

INTTM01

INTTM00

TO0 pin output

One-shot pulse

Caution The 16-bit timer register starts operation at the moment TMC01 to TMC03 are set to values
other than 0, 0, 0 (operation stop mode).

Remark N<M

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(2) One-shot pulse output using external trigger

If the 16-bit timer mode control register (TMC0), capture/compare control register 0 (CRC0), and the 16-bit
timer output control register (TOC0) are set as shown in Figure 8-33, a one-shot pulse is output from the TO0/
P30 pin with a TI00/P00 valid edge as an external trigger.
Any of three edge specifications can be selected—rising, falling, or both edges—as the valid edges for the
TI00/P00 pin by bits 2 and 3 (ES10 and ES11) of external interrupt mode register 0 (INTM0).
When a valid edge is input to the TI00/P00 pin, the 16-bit timer/event counter is cleared and started, and output
is activated by the count values (N) set beforehand in 16-bit capture/compare register 01 (CR01). Thereafter,
output is inactivatedNote by the count value (M) set beforehand in 16-bit capture/compare register 00 (CR00).

Note The case where N < M is described here. When N > M, the output becomes active with the CR00
register and inactive with the CR01 register.

Caution When outputting one-shot pulses, the external trigger is ignored if generated again.

Figure 8-35. Control Register Settings for One-Shot Pulse Output Operation Using External Trigger

(a) 16-bit timer mode control register (TMC0)

TMC03 TMC02 TMC01 OVF0

TMC0 0 0 0 0 1 0 0 0

Clear & start on valid edge of TI00/P00 pin

(b) Capture/compare control register 0 (CRC0)

CRC02 CRC01 CRC00

CRC0 0 0 0 0 0 0 0/1 0
CR00 is set as compare register

CR01 is set as compare register

(c) 16-bit timer output control register (TOC0)

OSPT OSPE TOC04 LVS0 LVR0 TOC01 TOE0

TOC0 0 0 1 1 0/1 0/1 1 1
TO0 output enabled
Inversion of output on match of TM0 and CR00
Specified TO0 output F/F initial value
Inversion of output on match of TM0 and CR01
One-shot pulse output mode

Remark 0/1: Setting 0 or 1 allows another function to be used simultaneously with one-shot pulse output.
See the description of the respective control registers for details.

Caution Do not clear CR00 and CR01 to 0000H.

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Figure 8-36. One-Shot Pulse Output Operation Timing Using

External Trigger (with Rising Edge Specified)

Set 08H to TMC0

(TM0 count start)

Count clock

TM0 count value 0000 0001 0000 N N+1 N+2 M–2 M–1 M M+1 M+2 M+3

CR01 set value N N N N

CR00 set value M M M M

TI00 pin input

INTTM01

INTTM00

TO0 pin output

Caution The 16-bit timer register starts operation at the moment TMC01 to TMC03 are set to values
other than 0, 0, 0 (operation stop mode).

Remark N<M

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8.5 16-Bit Timer/Event Counter Operating Cautions

(1) Timer start errors

An error of up to one clock may occur in the time required for a match signal to be generated after timer start.
This is because the 16-bit timer register (TM0) is started asynchronously to the count pulse.

Figure 8-37. 16-Bit Timer Register Start Timing

Count pulse

TM0 count value 0000H 0001H 0002H 0003H 0004H

Timer start

(2) 16-bit compare register setting (when in the clear & start mode entered on a match between TM0 and
CR00)
Set 16-bit capture/compare register 00 (CR00) to the a value other than 0000H.
Thus, when using the 16-bit capture/compare register as event counter, one-pulse count operation cannot
be carried out.

(3) Operation after compare register change during timer count operation
If the value after the 16-bit capture/compare register (CR00) is changed is smaller than that of the 16-bit timer
register (TM0), TM0 continues counting, overflows and then restarts counting from 0. Thus, if the value after
CR00 change (M) is smaller than that before change (N), it is necessary to reset and restart the timer after
changing CR00.

Figure 8-38. Timing After Change of Compare Register During Timer Count Operation

Count pulse

CR00 N M

TM0 count value X–1 X FFFFH 0000H 0001H 0002H

Remark N>X>M

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(4) Capture register data retention timing

If the valid edge of the TI00/P00 pin is input during 16-bit capture/compare register 01 (CR01) read, CR01
holds the data without carrying out a capture operation. However, the interrupt request signal (PIF0) is set
upon detection of the valid edge.

Figure 8-39. Capture Register Data Retention Timing

Count pulse

TM0 count value N N+1 N+2 M M+1 M+2

Edge input

PIF0

Capture read signal

CR01 captured value X N+1

Capture operation
ignored

(5) Valid edge setting

When using the TI00/P00/INTP0 and TI01/P01/INTP1 pins as timer input pins (TI00 and TI01), stop the
operation of 16-bit timer 0 by clearing bits 1 to 3 (TMC01 to TMC03) of the 16-bit timer mode control register
(TMC0) to 0, 0, 0, before setting the valid edge of TI00 and TI01. The valid edge is set by bits 2 and 3 (ES10
and ES11) of external interrupt mode register 0 (INTM0). When using the TI00/P00/INTP0 and TI01/P01/
INTP1 pins as external interrupt input pins (INTP0 and INTP1), the valid edge of INTP0 and INTP1 may be
set while 16-bit timer 0 is operating.

(6) Re-trigger of one-shot pulse

(a) One-shot pulse output using software

When outputting a one-shot pulse, do not set OSPT to 1. To output a one-shot pulse again, wait until
the current one-shot pulse output is completed.

(b) One-shot pulse output using external trigger

When outputting one-shot pulses, the external trigger is ignored if generated again.

(c) One-shot pulse output function

When using the software trigger for one-shot pulse output, fix the level of the TI00/P00/INTP0 and TI01/
P01/INTP1 pins to either the high or low level. Otherwise, the external trigger will remain valid even when
the software trigger is used, and the timer will be cleared and started when the level of the TI00/P00/INTP0
or TI01/P01/INTP1 pin changes. In consequence, the pulse will be output unexpectedly.

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(7) Operation of OVF0 flag

(a) OVF0 flag setting

OFV0 flag is set to 1 in the following case.
When one of clear & start mode on match between TM0 and CR00, clear & start mode on TI00 valid edge,
or free-running mode is selected.
↓
CR00 is set to FFFFH.
↓
TM0 is counted up from FFFFH to 0000H.

Figure 8-40. Operation Timing of OVF0 Flag

Count pulse

CR00 FFFFH

TM0 FFFEH FFFFH 0000H 0001H

OVF0

INTTM00

(b) Clear OVF0 flag

Even if the OVF0 flag is cleared before the next count clock is counted (before TM0 becomes 0001H)
after TM0 has overflowed, the OVF0 flag is set again and the clear becomes invalid.

(8) Conflict operation

(a) If the read period and capture trigger input conflict

If the read period and inputting a capture trigger conflict while 16-bit capture/compare registers 00 and
01 (CR00 and CR01) are used as capture registers, the registers do not perform a capture operation but
hold data. However, the interrupt request flag (PIF0) is set when the valid edge is detected.

(b) If the match timing of the write period and TM0 conflict
When 16-bit capture/compare registers 00 and 01 (CR00, CR01) are used as capture registers, because
match detection cannot be performed correctly if the match timing of the write period and 16-bit timer
register 0 (TM0) conflict, do not write to CR00 and CR01 close to the match timing.

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(9) Timer operation

(a) CR01 capture

Even if 16-bit timer register 0 (TM0) is read, a capture to 16-bit capture/compare register 01 (CR01) is
not performed.

(b) Acknowledgement of TI00 and TI01 pins

When the timer is stopped, input signals to the TI00 and TI01 pins are not acknowledged, regardless of
the CPU operation.

(10) Capture operation

(a) If the valid edge of TI00 is specified for the count clock
When the valid edge of TI00 is specified for the count clock, the capture register with TI00 specified as
a trigger will not operate correctly.

(b) If both rising and falling edges are selected as the valid edge of TI00.
When both the rising and falling edges are selected as the valid edge of TI00, CR00 cannot perform a
capture operation with TI00 specified as the capture trigger.

(c) To use signal from TI00 as capture trigger

For an accurate capture operation, a pulse longer than twice the width of the count clock selected by the
sampling clock select register (SCS) is necessary.

(11) Compare operation

(a) When rewriting CR00 and CR01 during timer operation

When rewriting 16-bit timer capture/compare registers 00 and 01 (CR00, CR01), if the value is close to
or larger than the timer value, the match interrupt request generation or clear operation may not be
performed correctly.

(b) When CR00 and CR01 are set to compare mode

When CR00 and CR01 are set to compare mode, they do not perform a capture operation even if a capture
trigger is input.

(12) Edge detection

(a) When the TI00 or TI01 pin is high level immediately after a system reset
When the TI00 or TI01 pin is high level immediately after a system reset, if the valid edge of the TI00 or
TI01 pin is specified as the rising edge or both rising and falling edges, and the operation of 16-bit timer/
counter 0 (TM0) is then enabled, the rising edge will be detected immediately. Care is therefore needed
when the TI00 or TI01 pin is pulled up. However, when operation is enabled after being stopped, the rising
or falling edge is not detected.

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9.1 8-Bit Timer/Event Counter Functions

For the 8-bit timer/event counter, two modes are available. One is a mode for the two 8-bit timer/event counter
channels to be used separately (the 8-bit timer/event counter mode) and the other is a mode for the 8-bit timer/event
counter to be used as 16-bit timer/event counter (the 16-bit timer/event counter mode).

9.1.1 8-bit timer/event counter mode

The 8-bit timer/event counters 1 and 2 (TM1 and TM2) have the following functions.

• Interval timer
• External event counter
• Square-wave output

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(1) 8-bit interval timer

Interrupt requests are generated at the preset time intervals.

Table 9-1. Interval Times of 8-Bit Timer/Event Counters 1 and 2

Minimum Interval Time Maximum Interval Time Resolution

MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0
2 × 1/fX 22 × 1/fX 29 × 1/fX 210 × 1/fX 2 × 1/fX 22 × 1/fX
(400 ns) (800 ns) (102.4 µs) (204.8 µs) (400 ns) (800 ns)
22 × 1/fX 23 × 1/fX 210 × 1/fX 211 × 1/fX 22 × 1/fX 23 × 1/fX
(800 ns) (1.6 µs) (204.8 µs) (409.6 µs) (800 ns) (1.6 µs)
23 × 1/fX 24 × 1/fX 211 × 1/fX 212 × 1/fX 23 × 1/fX 24 × 1/fX
(1.6 µs) (3.2 µs) (409.6 µs) (819.2 µs) (1.6 µs) (3.2 µs)
24 × 1/fX 25 × 1/fX 212 × 1/fX 213 × 1/fX 24 × 1/fX 25 × 1/fX
(3.2 µs) (6.4 µs) (819.2 µs) (1.64 ms) (3.2 µs) (6.4 µs)
25 × 1/fX 26 × 1/fX 213 × 1/fX 214 × 1/fX 25 × 1/fX 26 × 1/fX
(6.4 µs) (12.8 µs) (1.64 ms) (3.28 ms) (6.4 µs) (12.8 µs)
26 × 1/fX 27 × 1/fX 214 × 1/fX 215 × 1/fX 26 × 1/fX 27 × 1/fX
(12.8 µs) (25.6 µs) (3.28 ms) (6.55 ms) (12.8 µs) (25.6 µs)

27 × 1/fX 28 × 1/fX 215 × 1/fX 216 × 1/fX 27 × 1/fX 28 × 1/fX

(25.6 µs) (51.2 µs) (6.55 ms) (13.1 ms) (25.6 µs) (51.2 µs)
28 × 1/fX 29 × 1/fX 216 × 1/fX 217 × 1/fX 28 × 1/fX 29 × 1/fX
(51.2 µs) (102.4 µs) (13.1 ms) (26.2 ms) (51.2 µs) (102.4 µs)
29 × 1/fX 210 × 1/fX 217 × 1/fX 218 × 1/fX 29 × 1/fX 210 × 1/fX
(102.4 µs) (204.8 µs) (26.2 ms) (52.4 ms) (102.4 µs) (204.8 µs)

211 × 1/fX 212 × 1/fX 219 × 1/fX 220 × 1/fX 211 × 1/fX 212 × 1/fX
(409.6 µs) (819.2 µs) (104.9 ms) (209.7 ms) (409.6 µs) (819.2 µs)

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. Values in parentheses apply to operation with fX = 5.0 MHz.

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(2) External event counter

The number of pulses of an externally input signal can be measured.

(3) Square-wave output

A square wave with any selected frequency can be output.

Table 9-2. Square-Wave Output Ranges of 8-Bit Timer/Event Counters 1 and 2

Minimum Pulse Time Maximum Pulse Time Resolution

MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0
2 × 1/fX 22 × 1/fX 29 × 1/fX 210 × 1/fX 2 × 1/fX 22 × 1/fX
(400 ns) (800 ns) (102.4 µs) (204.8 µs) (400 ns) (800 ns)
22 × 1/fX 23 × 1/fX 210 × 1/fX 211 × 1/fX 22 × 1/fX 23 × 1/fX
(800 ns) (1.6 µs) (204.8 µs) (409.6 µs) (800 ns) (1.6 µs)

23 × 1/fX 24 × 1/fX 211 × 1/fX 212 × 1/fX 23 × 1/fX 24 × 1/fX

(1.6 µs) (3.2 µs) (409.6 µs) (819.2 µs) (1.6 µs) (3.2 µs)
24 × 1/fX 25 × 1/fX 212 × 1/fX 213 × 1/fX 24 × 1/fX 25 × 1/fX
(3.2 µs) (6.4 µs) (819.2 µs) (1.64 ms) (3.2 µs) (6.4 µs)
25 × 1/fX 26 × 1/fX 213 × 1/fX 214 × 1/fX 25 × 1/fX 26 × 1/fX
(6.4 µs) (12.8 µs) (1.64 ms) (3.28 ms) (6.4 µs) (12.8 µs)

26 × 1/fX 27 × 1/fX 214 × 1/fX 215 × 1/fX 26 × 1/fX 27 × 1/fX

(12.8 µs) (25.6 µs) (3.28 ms) (6.55 ms) (12.8 µs) (25.6 µs)
27 × 1/fX 28 × 1/fX 215 × 1/fX 216 × 1/fX 27 × 1/fX 28 × 1/fX
(25.6 µs) (51.2 µs) (6.55 ms) (13.1 ms) (25.6 µs) (51.2 µs)
28 × 1/fX 29 × 1/fX 216 × 1/fX 217 × 1/fX 28 × 1/fX 29 × 1/fX
(51.2 µs) (102.4 µs) (13.1 ms) (26.2 ms) (51.2 µs) (102.4 µs)

29 × 1/fX 210 × 1/fX 217 × 1/fX 218 × 1/fX 29 × 1/fX 210 × 1/fX
(102.4 µs) (204.8 µs) (26.2 ms) (52.4 ms) (102.4 µs) (204.8 µs)
211 × 1/fX 212 × 1/fX 219 × 1/fX 220 × 1/fX 211 × 1/fX 212 × 1/fX
(409.6 µs) (819.2 µs) (104.9 ms) (209.7 ms) (409.6 µs) (819.2 µs)

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. Values in parentheses apply to operation with fX = 5.0 MHz.

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9.1.2 16-bit timer/event counter mode

(1) 16-bit interval timer

Interrupt requests can be generated at the preset time intervals.

Table 9-3. Interval Times When 8-Bit Timer/Event Counters 1 and 2

Are Used as 16-Bit Timer/Event Counter

Minimum Interval Time Maximum Interval Time Resolution

MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0
2 × 1/fX 22 × 1/fX 217 × 1/fX 218 × 1/fX 2 × 1/fX 22 × 1/fX
(400 ns) (800 ns) (26.2 ms) (52.4 ms) (400 ns) (800 ns)

22 × 1/fX 23 × 1/fX 218 × 1/fX 219 × 1/fX 22 × 1/fX 23 × 1/fX

(800 ns) (1.6 µs) (52.4 ms) (104.9 ms) (800 ns) (1.6 µs)
23 × 1/fX 24 × 1/fX 219 × 1/fX 220 × 1/fX 23 × 1/fX 24 × 1/fX
(1.6 µs) (3.2 µs) (104.9 ms) (209.7 ms) (1.6 µs) (3.2 µs)
24 × 1/fX 25 × 1/fX 220 × 1/fX 221 × 1/fX 24 × 1/fX 25 × 1/fX
(3.2 µs) (6.4 µs) (209.7 ms) (419.4 ms) (3.2 µs) (6.4 µs)

25 × 1/fX 26 × 1/fX 221 × 1/fX 222 × 1/fX 25 × 1/fX 26 × 1/fX

(6.4 µs) (12.8 µs) (419.4 ms) (838.9 ms) (6.4 µs) (12.8 µs)
26 × 1/fX 27 × 1/fX 222 × 1/fX 223 × 1/fX 26 × 1/fX 27 × 1/fX
(12.8 µs) (25.6 µs) (838.9 ms) (1.7 s) (12.8 µs) (25.6 µs)
27 × 1/fX 28 × 1/fX 223 × 1/fX 224 × 1/fX 27 × 1/fX 28 × 1/fX
(25.6 µs) (51.2 µs) (1.7 s) (3.4 s) (25.6 µs) (51.2 µs)

28 × 1/fX 29 × 1/fX 224 × 1/fX 225 × 1/fX 28 × 1/fX 29 × 1/fX

(51.2 µs) (102.4 µs) (3.4 s) (6.7 s) (51.2 µs) (102.4 µs)
29 × 1/fX 210 × 1/fX 225 × 1/fX 226 × 1/fX 29 × 1/fX 210 × 1/fX
(102.4 µs) (204.8 µs) (6.7 s) (13.4 s) (102.4 µs) (204.8 µs)
211 × 1/fX 212 × 1/fX 227 × 1/fX 228 × 1/fX 211 × 1/fX 212 × 1/fX
(409.6 µs) (819.2 µs) (26.8 s) (53.7 s) (409.6 µs) (819.2 µs)

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. Values in parentheses apply to operation with fX = 5.0 MHz.

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(2) External event counter

The number of pulses of an externally input signal can be measured.

(3) Square-wave output

A square wave with any selected frequency can be output.

Table 9-4. Square-Wave Output Ranges When 8-Bit Timer/Event

Counters 1 and 2 Are Used as 16-Bit Timer/Event Counter

Minimum Pulse Time Maximum Pulse Time Resolution

MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0

2 × 1/fX 22 × 1/fX 217 × 1/fX 218 × 1/fX 2 × 1/fX 22 × 1/fX
(400 ns) (800 ns) (26.2 ms) (52.4 ms) (400 ns) (800 ns)
22 × 1/fX 23 × 1/fX 218 × 1/fX 219 × 1/fX 22 × 1/fX 23 × 1/fX
(800 ns) (1.6 µs) (52.4 ms) (104.9 ms) (800 ns) (1.6 µs)

23 × 1/fX 24 × 1/fX 219 × 1/fX 220 × 1/fX 23 × 1/fX 24 × 1/fX

(1.6 µs) (3.2 µs) (104.9 ms) (209.7 ms) (1.6 µs) (3.2 µs)
24 × 1/fX 25 × 1/fX 220 × 1/fX 221 × 1/fX 24 × 1/fX 25 × 1/fX
(3.2 µs) (6.4 µs) (209.7 ms) (419.4 ms) (3.2 µs) (6.4 µs)
25 × 1/fX 26 × 1/fX 221 × 1/fX 222 × 1/fX 25 × 1/fX 26 × 1/fX
(6.4 µs) (12.8 µs) (419.4 ms) (838.9 ms) (6.4 µs) (12.8 µs)

26 × 1/fX 27 × 1/fX 222 × 1/fX 223 × 1/fX 26 × 1/fX 27 × 1/fX

(12.8 µs) (25.6 µs) (838.9 ms) (1.7 s) (12.8 µs) (25.6 µs)
27 × 1/fX 28 × 1/fX 223 × 1/fX 224 × 1/fX 27 × 1/fX 28 × 1/fX
(25.6 µs) (51.2 µs) (1.7 s) (3.4 s) (25.6 µs) (51.2 µs)
28 × 1/fX 29 × 1/fX 224 × 1/fX 225 × 1/fX 28 × 1/fX 29 × 1/fX
(51.2 µs) (102.4 µs) (3.4 s) (6.7 s) (51.2 µs) (102.4 µs)

29 × 1/fX 210 × 1/fX 225 × 1/fX 226 × 1/fX 29 × 1/fX 210 × 1/fX
(102.4 µs) (204.8 µs) (6.7 s) (13.4 s) (102.4 µs) (204.8 µs)
211 × 1/fX 212 × 1/fX 227 × 1/fX 228 × 1/fX 211 × 1/fX 212 × 1/fX
(409.6 µs) (819.2 µs) (26.8 s) (53.7 s) (409.6 µs) (819.2 µs)

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. Values in parentheses apply to operation with fX = 5.0 MHz.

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9.2 8-Bit Timer/Event Counter Configuration

The 8-bit timer/event counter consists of the following hardware.

Table 9-5. 8-Bit Timer/Event Counter Configuration

Item Configuration

Timer register 8 bits × 2 (TM1, TM2)

Register Compare register: 8 bits × 2 (CR10, CR20)
Timer outputs 2 (TO1, TO2)

Control registers Timer clock select register 1 (TCL1)

8-bit timer mode control register 1 (TMC1)
8-bit timer output control register (TOC1)
Port mode register 3 (PM3)Note

Note See Figure 6-9 Block Diagram of P30 to P37.

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Figure 9-1. Block Diagram of 8-Bit Timer/Event Counter

Internal bus

INTTM1

8-bit compare 8-bit compare

register 10 (CR10) register (CR20)

Note

Selector
Match 8-bit timer/event
counter output TO2/P32
Match controller 2
9
Selector

f XX/2 to fXX/2
8-bit timer 4
11

Selector
f XX/2 register 1 (TM1)
8-bit timer
TI1/P33 register 2 (TM2) INTTM2
Clear
4 Clear

Selector
9
Selector

f XX/2 to fXX/2
11
f XX/2
TI2/P34

Note
8-bit timer/
4 event counter TO1/P31
output controller
4

TCL TCL TCL TCL TCL TCL TCL TCL TMC12 TCE2 TCE1 LVS2 LVR2 TOC TOE2 LVS1 LVR1 TOC TOE1
17 16 15 14 13 12 11 10 15 11
Timer clock 8-bit timer mode 8-bit timer output
select register 1 control register control register

Internal bus

Note See Figures 9-2 and 9-3 for details of 8-bit timer/event counter output controllers 1 and 2, respectively.

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Figure 9-2. Block Diagram of 8-Bit Timer/Event Counter Output Controller 1

Level F/F
(LV1)

LVR1 R
Q
TO1/P31
LVS1 S

TOC11 P31 PM31Note

INV Output latch

INTTM1

TOE1

Note Bit 1 of port mode register 3 (PM3)

Remark The section in the broken lines is the output controller.

Figure 9-3. Block Diagram of 8-Bit Timer/Event Counter Output Controller 2

Level F/F
(LV2)
fSCK
LVR2 R
Q
TO2/P32
LVS2 S
TOC15 P32 PM32Note
INV Output latch

INTTM2

TOE2
Note Bit 2 of port mode register 3 (PM3)

Remarks 1. The section in the broken lines is the output controller.

2. fSCK: Serial clock frequency

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(1) Compare registers 10, 20 (CR10, CR20)

CR10 and CR20 are 8-bit registers used to compare the value set to CR10 to the 8-bit timer register 1 (TM1)
count value, and the value set to CR20 to the 8-bit timer register 2 (TM2) count value, and, if they match,
generate an interrupt request (INTTM1 and INTTM2, respectively).
CR10 and CR20 are set with an 8-bit memory manipulation instruction. They cannot be set with a 16-bit
memory manipulation instruction. When the compare register is used as 8-bit timer/event counter, between
values 00H and FFH can be set. When the compare register is used as 16-bit timer/event counter, between
values 0000H and FFFFH can be set.
RESET input makes CR10 and CR20 undefined.

Cautions 1. Before changing the set value of 8-bit compare registers 10 and 20 (CR10 and CR20) while
the 16-bit timer/counter is being used, stop the operation of each of the 8-bit timer/event
counters.
2. When the new values of CR10 and CR20 are less than the count values of the 8-bit timer
registers (TM1 and TM2), TM1 and TM2 continue counting, overflow, and start counting
again from 0. If the new values of CR10 and CR20 are less than the old values, therefore,
it is necessary to restart the timers after changing the values of CR10 and CR20.

(2) 8-bit timer registers 1, 2 (TM1, TM2)

TM1 and TM2 are 8-bit registers used to count count pulses.
When TM1 and TM2 are used in the 8-bit timer × 2-channel mode, they are read with an 8-bit memory
manipulation instruction. When TM1 and TM2 are used as 16-bit timer × 1-channel mode, 16-bit timer register
(TMS) is read with a 16-bit memory manipulation instruction.
RESET input clears TM1 and TM2 to 00H.

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9.3 8-Bit Timer/Event Counter Control Registers

The following four registers are used to control the 8-bit timer/event counter.

• Timer clock select register 1 (TCL1)

• 8-bit timer mode control register 1 (TMC1)
• 8-bit timer output control register (TOC1)
• Port mode register 3 (PM3)

(1) Timer clock select register 1 (TCL1)

This register sets the count clock of 8-bit timer registers 1 and 2.
TCL1 is set with an 8-bit memory manipulation instruction.
RESET input clears TCL1 to 00H.

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Figure 9-4. Format of Timer Clock Select Register 1

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W
TCL1 TCL17 TCL16 TCL15 TCL14 TCL13 TCL12 TCL11 TCL10 FF41H 00H R/W

TCL13 TCL12 TCL11 TCL10 8-bit timer register 1 count clock selection

MCS = 1 MCS = 0

0 0 0 0 TI1 falling edge

0 0 0 1 TI1 rising edge

2
0 1 1 0 fXX/2 fX/2 (2.5 MHz) fX/2 (1.25 MHz)
2 2 3
0 1 1 1 fXX/2 fX/2 (1.25 MHz) fX/2 (625 kHz)
3 3 4
1 0 0 0 fXX/2 fX/2 (625 kHz) fX/2 (313 kHz)
4 4 5
1 0 0 1 fXX/2 fX/2 (313 kHz) fX/2 (156 kHz)
5 5 6
1 0 1 0 fXX/2 fX/2 (156 kHz) fX/2 (78.1 kHz)
6 6 7
1 0 1 1 fXX/2 fX/2 (78.1 kHz) fX/2 (39.1 kHz)
7 7 8
1 1 0 0 fXX/2 fX/2 (39.1 kHz) fX/2 (19.5 kHz)
8 8 9
1 1 0 1 fXX/2 fX/2 (19.5 kHz) fX/2 (9.8 kHz)
9 9 10
1 1 1 0 fXX/2 fX/2 (9.8 kHz) fX/2 (4.9 kHz)
11 11 12
1 1 1 1 fXX/2 fX/2 (2.4 kHz) fX/2 (1.2 kHz)

Other than above Setting prohibited

TCL17 TCL16 TCL15 TCL14 8-bit timer register 2 count clock selection

MCS = 1 MCS = 0

0 0 0 0 TI2 falling edge

0 0 0 1 TI2 rising edge

2
0 1 1 0 fXX/2 fX/2 (2.5 MHz) fX/2 (1.25 MHz)
2 2 3
0 1 1 1 fXX/2 fX/2 (1.25 MHz) fX/2 (625 kHz)
3 3 4
1 0 0 0 fXX/2 fX/2 (625 kHz) fX/2 (313 kHz)
4 4 5
1 0 0 1 fXX/2 fX/2 (313 kHz) fX/2 (156 kHz)
5 5 6
1 0 1 0 fXX/2 fX/2 (156 kHz) fX/2 (78.1 kHz)
6 6 7
1 0 1 1 fXX/2 fX/2 (78.1 kHz) fX/2 (39.1 kHz)
7 7 8
1 1 0 0 fXX/2 fX/2 (39.1 kHz) fX/2 (19.5 kHz)
8 8 9
1 1 0 1 fXX/2 fX/2 (19.5 kHz) fX/2 (9.8 kHz)
9 9 10
1 1 1 0 fXX/2 fX/2 (9.8 kHz) fX/2 (4.9 kHz)
11 11 12
1 1 1 1 fXX/2 fX/2 (2.4 kHz) fX/2 (1.2 kHz)

Other than above Setting prohibited

Caution When rewriting TCL1 to other data, stop the timer operation beforehand.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. f X: Main system clock oscillation frequency
3. TI1: 8-bit timer register 1 input pin
4. TI2: 8-bit timer register 2 input pin
5. MCS: Bit 0 of oscillation mode select register (OSMS)
6. Values in parentheses apply to operation with fX = 5.0 MHz

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(2) 8-bit timer mode control register (TMC1)

This register enables/stops operation of 8-bit timer registers 1 and 2 and sets the operating mode of 8-bit timer
registers 1 and 2.
TMC1 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears TMC1 to 00H.

Figure 9-5. Format of 8-Bit Timer Mode Control Register 1

Symbol 7 6 5 4 3 2 <1> <0> Address After reset R/W

TMC1 0 0 0 0 0 TMC12 TCE2 TCE1 FF49H 00H R/W

TCE1 8-bit timer register 1 operation control

0 Operation stopped (TM1 is cleared to 0)

1 Operation enabled

TCE2 8-bit timer register 2 operation control

0 Operation stopped (TM2 is cleared to 0)

1 Operation enabled

TMC12 Operating mode selection

0 8-bit timer register × 2-channel mode (TM1, TM2)

1 16-bit timer register × 1-channel mode (TMS)

Cautions 1. Switch the operating mode after stopping timer operation.

2. When used as a 16-bit timer register (TMS), TCE1 should be used for operation enable/
stop.

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(3) 8-bit timer output control register (TOC1)

This register controls operation of 8-bit timer/event counter output controllers 1 and 2.
It sets/resets the R-S flip-flops (LV1 and LV2) and enables/disables inversion and 8-bit timer output of 8-bit
timer registers 1 and 2.
TOC1 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears TOC1 to 00H.

Figure 9-6. Format of 8-Bit Timer Output Control Register

Symbol <7> <6> 5 <4> <3> <2> 1 <0> Address After reset R/W
TOC1 LVS2 LVR2 TOC15 TOE2 LVS1 LVR1 TOC11 TOE1 FF4FH 00H R/W

TOE1 8-bit timer/event counter 1 outptut control

0 Output disabled (port mode)

1 Output enabled

TOC11 8-bit timer/event counter 1 timer output F/F control

0 Inverted operation disabled

1 Inverted operation enabled

LVS1 LVR1 8-bit timer/event counter 1 timer output F/F status set

0 0 Unchanged

0 1 Timer output F/F is reset to 0

1 0 Timer output F/F is set to 1

1 1 Setting prohibited

TOE2 8-bit timer/event counter 2 output control

0 Output disabled (port mode)

1 Output enabled

TOC15 8-bit timer/event counter 2 timer output F/F control

0 Inverted operation disabled

1 Inverted operation enabled

LVS2 LVR2 8-bit timer/event counter 2 timer output F/F status set

0 0 Unchanged

0 1 Timer output F/F is reset to 0

1 0 Timer output F/F is set to 1

1 1 Setting prohibited

Cautions 1. Be sure to set TOC1 after stopping timer operation.

2. After data setting, 0 is read from LVS1, LVS2, LVR1, and LVR2 when they are read.

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(4) Port mode register 3 (PM3)

This register sets port 3 input/output in 1-bit units.
When using the P31/TO1 and P32/TO2 pins for timer output, set PM31, PM32, and the output latches of P31
and P32 to 0.
PM3 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input sets PM3 to FFH.

Figure 9-7. Format of Port Mode Register 3

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

PM3 PM37 PM36 PM35 PM34 PM33 PM32 PM31 PM30 FF23H FFH R/W

PM3n P3n pin input/output mode selection (n = 0 to 7)

0 Output mode (output buffer on)

1 Input mode (output buffer off)

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9.4 Operations of 8-Bit Timer/Event Counters 1 and 2

9.4.1 8-bit timer/event counter mode

(1) Interval timer operations

8-bit timer/event counters 1 and 2 operate as interval timers that generate interrupt requests repeatedly at
intervals of the count value preset to 8-bit compare registers 10 and 20 (CR10 and CR20).
When the count values of 8-bit timer registers 1 and 2 (TM1 and TM2) match the values set to CR10 and CR20,
counting continues with the TM1 and TM2 values cleared to 0 and the interrupt request signals (INTTM1 and
INTTM2) are generated.
The count clock of TM1 can be selected using bits 0 to 3 (TCL10 to TCL13) of timer clock select register 1
(TCL1). The count clock of TM2 can be selected using bits 4 to 7 (TCL14 to TCL17) of timer clock select register
1 (TCL1).
For the operation when the value of the compare register is changed during a timer count operation, see 9.5
(3) Operation after compare register change during timer count operation.

Figure 9-8. Interval Timer Operation Timing

Count clock

TM1 count value 00 01 N 00 01 N 00 01 N

Count start Clear Clear

CR10 N N N N

INTTM1

Interrupt request acknowledge Interrupt request acknowledge

TO1

Interval time Interval time Interval time

Remark Interval time = (N + 1) × t : N = 00H to FFH

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Table 9-6. Interval Time of 8-Bit Timer/Event Counter 1

TCL13 TCL12 TCL11 TCL10 Minimum Interval Time Maximum Interval Time Resolution
MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0
0 0 0 0 TI1 input cycle 28 × TI1 input cycle TI1 input edge cycle

0 0 0 1 TI1 input cycle 28 × TI1 input cycle TI1 input edge cycle
0 1 1 0 2 × 1/fX 22 × 1/fX 29 × 1/fX 210 × 1/fX 2 × 1/fX 22 × 1/fX
(400 ns) (800 ns) (102.4 µs) (204.8 µs) (400 ns) (800 ns)
0 1 1 1 22 × 1/fX 23 × 1/fX 210 × 1/fX 211 × 1/fX 22 × 1/fX 23 × 1/fX
(800 ns) (1.6 µs) (204.8 µs) (409.6 µs) (800 ns) (1.6 µs)

1 0 0 0 23 × 1/fX 24 × 1/fX 211 × 1/fX 212 × 1/fX 23 × 1/fX 24 × 1/fX

(1.6 µs) (3.2 µs) (409.6 µs) (819.2 µs) (1.6 µs) (3.2 µs)
1 0 0 1 24 × 1/fX 25 × 1/fX 212 × 1/fX 213 × 1/fX 24 × 1/fX 25 × 1/fX
(3.2 µs) (6.4 µs) (819.2 µs) (1.64 ms) (3.2 µs) (6.4 µs)
1 0 1 0 25 × 1/fX 26 × 1/fX 213 × 1/fX 214 × 1/fX 25 × 1/fX 26 × 1/fX
(6.4 µs) (12.8 µs) (1.64 ms) (3.28 ms) (6.4 µs) (12.8 µs)

1 0 1 1 26 × 1/fX 27 × 1/fX 214 × 1/fX 215 × 1/fX 26 × 1/fX 27 × 1/fX

(12.8 µs) (25.6 µs) (3.28 ms) (6.55 ms) (12.8 µs) (25.6 µs)
1 1 0 0 27 × 1/fX 28 × 1/fX 215 × 1/fX 216 × 1/fX 27 × 1/fX 28 × 1/fX
(25.6 µs) (51.2 µs) (6.55 ms) (13.1 ms) (25.6 µs) (51.2 µs)
1 1 0 1 28 × 1/fX 29 × 1/fX 216 × 1/fX 217 × 1/fX 28 × 1/fX 29 × 1/fX
(51.2 µs) (102.4 µs) (13.1 ms) (26.2 ms) (51.2 µs) (102.4 µs)

1 1 1 0 29 × 1/fX 210 × 1/fX 217 × 1/fX 218 × 1/fX 29 × 1/fX 210 × 1/fX
(102.4 µs) (204.8 µs) (26.2 ms) (52.4 ms) (102.4 µs) (204.8 µs)
1 1 1 1 211 × 1/fX 212 × 1/fX 219 × 1/fX 220 × 1/fX 211 × 1/fX 212 × 1/fX
(409.6 µs) (819.2 µs) (104.9 ms) (209.7 ms) (409.6 µs) (819.2 µs)
Other than above Setting prohibited

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. TCL10 to TCL13: Bits 0 to 3 of timer clock select register 1 (TCL1)
4. Values in parentheses apply to operation with fX = 5.0 MHz.

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Table 9-7. Interval Time of 8-Bit Timer/Event Counter 2

TCL17 TCL16 TCL15 TCL14 Minimum Interval Time Maximum Interval Time Resolution

MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0

0 0 0 0 TI2 input cycle 28 × TI2 input cycle TI2 input edge cycle
0 0 0 1 TI2 input cycle 28 × TI2 input cycle TI2 input edge cycle

0 1 1 0 2 × 1/fX 22 × 1/fX 29 × 1/fX 210 × 1/fX 2 × 1/fX 22 × 1/fX

(400 ns) (800 ns) (102.4 µs) (204.8 µs) (400 ns) (800 ns)
0 1 1 1 22 × 1/fX 23 × 1/fX 210 × 1/fX 211 × 1/fX 22 × 1/fX 23 × 1/fX
(800 ns) (1.6 µs) (204.8 µs) (409.6 µs) (800 ns) (1.6 µs)
1 0 0 0 23 × 1/fX 24 × 1/fX 211 × 1/fX 212 × 1/fX 23 × 1/fX 24 × 1/fX
(1.6 µs) (3.2 µs) (409.6 µs) (819.2 µs) (1.6 µs) (3.2 µs)

1 0 0 1 24 × 1/fX 25 × 1/fX 212 × 1/fX 213 × 1/fX 24 × 1/fX 25 × 1/fX

(3.2 µs) (6.4 µs) (819.2 µs) (1.64 ms) (3.2 µs) (6.4 µs)
1 0 1 0 25 × 1/fX 26 × 1/fX 213 × 1/fX 214 × 1/fX 25 × 1/fX 26 × 1/fX
(6.4 µs) (12.8 µs) (1.64 ms) (3.28 ms) (6.4 µs) (12.8 µs)
1 0 1 1 26 × 1/fX 27 × 1/fX 214 × 1/fX 215 × 1/fX 26 × 1/fX 27 × 1/fX
(12.8 µs) (25.6 µs) (3.28 ms) (6.55 ms) (12.8 µs) (25.6 µs)

1 1 0 0 27 × 1/fX 28 × 1/fX 215 × 1/fX 216 × 1/fX 27 × 1/fX 28 × 1/fX

(25.6 µs) (51.2 µs) (6.55 ms) (13.1 ms) (25.6 µs) (51.2 µs)
1 1 0 1 28 × 1/fX 29 × 1/fX 216 × 1/fX 217 × 1/fX 28 × 1/fX 29 × 1/fX
(51.2 µs) (102.4 µs) (13.1 ms) (26.2 ms) (51.2 µs) (102.4 µs)
1 1 1 0 29 × 1/fX 210 × 1/fX 217 × 1/fX 218 × 1/fX 29 × 1/fX 210 × 1/fX
(102.4 µs) (204.8 µs) (26.2 ms) (52.4 ms) (102.4 µs) (204.8 µs)

1 1 1 1 211 × 1/fX 212 × 1/fX 219 × 1/fX 220 × 1/fX 211 × 1/fX 212 × 1/fX
(409.6 µs) (819.2 µs) (104.9 ms) (209.7 ms) (409.6 µs) (819.2 µs)
Other than above Setting prohibited

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. TCL14 to TCL17: Bits 4 to 7 of timer clock select register 1 (TCL1)
4. Values in parentheses apply to operation with fX = 5.0 MHz

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(2) External event counter operation

The external event counter counts the number of external clock pulses to be input to the TI1/P33 and TI2/
P34 pins using 8-bit timer registers 1 and 2 (TM1 and TM2).
TM1 and TM2 are incremented each time the valid edge specified by the timer clock select register (TCL1)
is input. Either the rising or falling edge can be selected.
When the TM1 and TM2 counted values match the values of 8-bit compare registers 10 and 20 (CR10 and
CR20), TM1 and TM2 are cleared to 0 and the interrupt request signals (INTTM1 and INTTM2) are generated.

Figure 9-9. External Event Counter Operation Timing (with Rising Edge Specified)

TI1 pin input

TM1 count value 00 01 02 03 04 05 N–1 N 00 01 02 03

CR10 N

INTTM1

Remark N = 00H to FFH

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(3) Square-wave output operation

8-bit timer/event counters 1 and 2 output a square wave with any selected frequency at intervals specified
by the value set in advance to 8-bit compare registers 10 and 20 (CR10 and CR20).
The TO1/P31 or TO2/P32 pin output status is reversed at intervals of the count value preset to CR10 or CR20
by setting bit 0 (TOE1) or bit 4 (TOE2) of the 8-bit timer output control register (TOC1) to 1. This enables
a square wave with any selected frequency to be output.

Table 9-8. Square-Wave Output Ranges of 8-Bit Timer/Event Counters 1 and 2

Minimum Pulse Time Maximum Pulse Time Resolution

MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0

2 × 1/fX 22 × 1/fX 29 × 1/fX 210 × 1/fX 2 × 1/fX 22 × 1/fX
(400 ns) (800 ns) (102.4 µs) (204.8 µs) (400 ns) (800 ns)
22 × 1/fX 23 × 1/fX 210 × 1/fX 211 × 1/fX 22 × 1/fX 23 × 1/fX
(800 ns) (1.6 µs) (204.8 µs) (409.6 µs) (800 ns) (1.6 µs)

23 × 1/fX 24 × 1/fX 211 × 1/fX 212 × 1/fX 23 × 1/fX 24 × 1/fX

(1.6 µs) (3.2 µs) (409.6 µs) (819.2 µs) (1.6 µs) (3.2 µs)
24 × 1/fX 25 × 1/fX 212 × 1/fX 213 × 1/fX 24 × 1/fX 25 × 1/fX
(3.2 µs) (6.4 µs) (819.2 µs) (1.64 ms) (3.2 µs) (6.4 µs)
25 × 1/fX 26 × 1/fX 213 × 1/fX 214 × 1/fX 25 × 1/fX 26 × 1/fX
(6.4 µs) (12.8 µs) (1.64 ms) (3.28 ms) (6.4 µs) (12.8 µs)

26 × 1/fX 27 × 1/fX 214 × 1/fX 215 × 1/fX 26 × 1/fX 27 × 1/fX

(12.8 µs) (25.6 µs) (3.28 ms) (6.55 ms) (12.8 µs) (25.6 µs)
27 × 1/fX 28 × 1/fX 215 × 1/fX 216 × 1/fX 27 × 1/fX 28 × 1/fX
(25.6 µs) (51.2 µs) (6.55 ms) (13.1 ms) (25.6 µs) (51.2 µs)
28 × 1/fX 29 × 1/fX 216 × 1/fX 217 × 1/fX 28 × 1/fX 29 × 1/fX
(51.2 µs) (102.4 µs) (13.1 ms) (26.2 ms) (51.2 µs) (102.4 µs)

29 × 1/fX 210 × 1/fX 217 × 1/fX 218 × 1/fX 29 × 1/fX 210 × 1/fX
(102.4 µs) (204.8 µs) (26.2 ms) (52.4 ms) (102.4 µs) (204.8 µs)
211 × 1/fX 212 × 1/fX 219 × 1/fX 220 × 1/fX 211 × 1/fX 212 × 1/fX
(409.6 µs) (819.2 µs) (104.9 ms) (209.7 ms) (409.6 µs) (819.2 µs)

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. Values in parentheses apply to operation with fX = 5.0 MHz.

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Figure 9-10. Square-Wave Output Operation Timing

Count clock

TM1 count value 00 01 02 N–1 N 00 01 02 N–1 N 00

Count start
CR10 N N

TO1Note

Note The initial value of the TO1 output can be set by bits 2 and 3 (LVS1 and LVR1) of the 8-bit timer output
control register (TOC1).

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9.4.2 16-bit timer/event counter mode

When bit 2 (TMC12) of the 8-bit timer mode control register (TMC1) is set to 1, the 16-bit timer/event counter mode
is set.
In this mode, the count clock is selected by using bits 0 to 3 (TCL10 to TCL13) of the timer clock select register
(TCL1), and the overflow signal of 8-bit timer/event counter 1 (TM1) is used as the count clock for 8-bit timer/event
counter 2 (TM2).
The counting operation is enabled or disabled in this mode by using bit 0 (TCE1) of TMC1.

(1) Operation as interval timer

The 16-bit timer/event counter operates as an interval timer that repeatedly generates an interrupt request
at intervals of the count values set in advance to the 2 channels of the 8-bit compare registers (CR10 and
CR20). When setting a count value, assign the value of the higher 8 bits to CR20 and the value of the lower
8 bits to CR10. For the count values that can be set (interval time), see Table 9-9.
When the value of 8-bit timer register 1 (TM1) matches the value of CR10 and the value of 8-bit timer register
2 (TM1) matches the value of CR20, the values of TM1 and TM2 are cleared to 0, and at the same time, an
interrupt request signal (INTTM2) is generated. For the operation timing of the interval timer, see Figure 9-
11.
Select the count clock by using bits 0 to 3 (TCL10 to TCL13) of timer clock select register 1 (TCL1). The overflow
signal of TM1 is used as the count clock for TM2.

Figure 9-11. Interval Timer Operation Timing

Count clock

TMS (TM1, TM2) count value 0000 0001 N 0000 0001 N 0000 0001 N

Count start Clear Clear

CR10, CR20 N N N N

INTTM2

Interrupt request acknowledge Interrupt request acknowledge

TO2

Interval time Interval time Interval time

Remark Interval time = (N + 1) × t : N = 0000H to FFFFH

Caution Even if the 16-bit timer/event counter mode is used, when the TM1 count value matches the
CR10 value, an interrupt request (INTTM1) is generated and the F/F of 8-bit timer/event
counter output controller 1 is inverted. Thus, when using the 8-bit timer/event counter as
a 16-bit interval timer, set the INTTM1 mask flag TMMK1 to 1 to disable INTTM1 acknowledgment.
When reading the 16-bit timer register (TMS) count value, use a 16-bit memory manipulation
instruction.
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Table 9-9. Interval Times When 2-Channel 8-Bit Timer/Event Counters (TM1 and TM2)
Are Used as 16-Bit Timer/Event Counter

TCL13 TCL12 TCL11 TCL10 Minimum Interval Time Maximum Interval Time Resolution

MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0

0 0 0 0 TI1 input cycle 28 × TI1 input cycle TI1 input edge cycle
0 0 0 1 TI1 input cycle 28 × TI1 input cycle TI1 input edge cycle

0 1 1 0 2 × 1/fX 22 × 1/fX 217 × 1/fX 218 × 1/fX 2 × 1/fX 22 × 1/fX

(400 ns) (800 ns) (26.2 ms) (52.4 ms) (400 ns) (800 ns)
0 1 1 1 22 × 1/fX 23 × 1/fX 218 × 1/fX 219 × 1/fX 22 × 1/fX 23 × 1/fX
(800 ns) (1.6 µs) (52.4 ms) (104.9 ms) (800 ns) (1.6 µs)
1 0 0 0 23 × 1/fX 24 × 1/fX 219 × 1/fX 220 × 1/fX 23 × 1/fX 24 × 1/fX
(1.6 µs) (3.2 µs) (104.9 ms) (209.7 ms) (1.6 µs) (3.2 µs)

1 0 0 1 24 × 1/fX 25 × 1/fX 220 × 1/fX 221 × 1/fX 24 × 1/fX 25 × 1/fX

(3.2 µs) (6.4 µs) (209.7 ms) (419.4 ms) (3.2 µs) (6.4 µs)
1 0 1 0 25 × 1/fX 26 × 1/fX 221 × 1/fX 222 × 1/fX 25 × 1/fX 26 × 1/fX
(6.4 µs) (12.8 µs) (419.4 ms) (838.9 ms) (6.4 µs) (12.8 µs)
1 0 1 1 26 × 1/fX 27 × 1/fX 222 × 1/fX 223 × 1/fX 26 × 1/fX 27 × 1/fX
(12.8 µs) (25.6 µs) (838.9 ms) (1.7 s) (12.8 µs) (25.6 µs)

1 1 0 0 27 × 1/fX 28 × 1/fX 223 × 1/fX 224 × 1/fX 27 × 1/fX 28 × 1/fX

(25.6 µs) (51.2 µs) (1.7 s) (3.4 s) (25.6 µs) (51.2 µs)
1 1 0 1 28 × 1/fX 29 × 1/fX 224 × 1/fX 225 × 1/fX 28 × 1/fX 29 × 1/fX
(51.2 µs) (102.4 µs) (3.4 s) (6.7 s) (51.2 µs) (102.4 µs)
1 1 1 0 29 × 1/fX 210 × 1/fX 225 × 1/fX 226 × 1/fX 29 × 1/fX 210 × 1/fX
(102.4 µs) (204.8 µs) (6.7 s) (13.4 s) (102.4 µs) (204.8 µs)

1 1 1 1 211 × 1/fX 212 × 1/fX 227 × 1/fX 228 × 1/fX 211 × 1/fX 212 × 1/fX
(409.6 µs) (819.2 µs) (26.8 s) (53.7 s) (409.6 µs) (819.2 µs)
Other than above Setting prohibited

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. TCL10 to TCL13: Bits 0 to 3 of timer clock select register 1 (TCL1)
4. Values in parentheses apply to operation with fX = 5.0 MHz.

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(2) External event counter operations

The external event counter counts the number of external clock pulses to be input to the TI1/P33 pin using
2-channel 8-bit timer registers 1 and 2 (TM1 and TM2).
TM1 is incremented each time the valid edge specified by timer clock select register 1 (TCL1) is input. When
TM1 overflows as a result, TM2 is incremented with the overflow signal used as its count clock. Either the
rising or falling edge can be selected.
When the TM1 and TM2 counted values match the values of 8-bit compare registers 10 and 20 (CR10 and
CR20), TM1 and TM2 are cleared to 0 and the interrupt request signal (INTTM2) is generated.

Figure 9-12. External Event Counter Operation Timing (with Rising Edge Specified)

TI1 pin input

TM1, TM2 count value 0000 0001 0002 0003 0004 0005 N–1 N 0000 0001 0002 0003

CR10, CR20 N

INTTM2

Caution Even if the 16-bit timer/event counter mode is used, when the TM1 count value matches the
CR10 value, an interrupt request (INTTM1) is generated and the F/F of 8-bit timer/event
counter output controller 1 is inverted. Thus, when using the 8-bit timer/event counter as
a 16-bit interval timer, set the INTTM1 mask flag TMMK1 to 1 to disable INTTM1 acknowledgment.
When reading the 16-bit timer register (TMS) count value, use a 16-bit memory manipulation
instruction.

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 CHAPTER 9 8-BIT TIMER/EVENT COUNTER

(3) Square-wave output operation

8-bit timer/event counters 1 and 2 output a square wave with any selected frequency at intervals specified
by the value set in advance to 8-bit compare registers 10 and 20 (CR10 and CR20). To set a count value,
set the value of the higher 8 bits to CR20, and the value of the lower 8 bits to CR10.
The TO2/P32 pin output status is reversed at intervals of the count value preset to CR10 and CR20 by setting
bit 4 (TOE2) of the 8-bit timer output control register (TOC1) to 1. This enables a square wave with any selected
frequency to be output.

Table 9-10. Square-Wave Output Ranges When 2-Channel 8-Bit Timer/Event Counters
(TM1 and TM2) Are Used as 16-Bit Timer/Event Counter

Minimum Pulse Time Maximum Pulse Time Resolution

MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0
2 × 1/fX 22 × 1/fX 217 × 1/fX 218 × 1/fX 2 × 1/fX 22 × 1/fX
(400 ns) (800 ns) (26.2 ms) (52.4 ms) (400 ns) (800 ns)

22 × 1/fX 23 × 1/fX 218 × 1/fX 219 × 1/fX 22 × 1/fX 23 × 1/fX

(800 ns) (1.6 µs) (52.4 ms) (104.9 ms) (800 ns) (1.6 µs)
23 × 1/fX 24 × 1/fX 219 × 1/fX 220 × 1/fX 23 × 1/fX 24 × 1/fX
(1.6 µs) (3.2 µs) (104.9 ms) (209.7 ms) (1.6 µs) (3.2 µs)
24 × 1/fX 25 × 1/fX 220 × 1/fX 221 × 1/fX 24 × 1/fX 25 × 1/fX
(3.2 µs) (6.4 µs) (209.7 ms) (419.4 ms) (3.2 µs) (6.4 µs)

25 × 1/fX 26 × 1/fX 221 × 1/fX 222 × 1/fX 25 × 1/fX 26 × 1/fX

(6.4 µs) (12.8 µs) (419.4 ms) (838.9 ms) (6.4 µs) (12.8 µs)
26 × 1/fX 27 × 1/fX 222 × 1/fX 223 × 1/fX 26 × 1/fX 27 × 1/fX
(12.8 µs) (25.6 µs) (838.9 ms) (1.7 s) (12.8 µs) (25.6 µs)
27 × 1/fX 28 × 1/fX 223 × 1/fX 224 × 1/fX 27 × 1/fX 28 × 1/fX
(25.6 µs) (51.2 µs) (1.7 s) (3.4 s) (25.6 µs) (51.2 µs)

28 × 1/fX 29 × 1/fX 224 × 1/fX 225 × 1/fX 28 × 1/fX 29 × 1/fX

(51.2 µs) (102.4 µs) (3.4 s) (6.7 s) (51.2 µs) (102.4 µs)
29 × 1/fX 210 × 1/fX 225 × 1/fX 226 × 1/fX 29 × 1/fX 210 × 1/fX
(102.4 µs) (204.8 µs) (6.7 s) (13.4 s) (102.4 µs) (204.8 µs)
211 × 1/fX 212 × 1/fX 227 × 1/fX 228 × 1/fX 211 × 1/fX 212 × 1/fX
(409.6 µs) (819.2 µs) (26.8 s) (53.7 s) (409.6 µs) (819.2 µs)

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)
3. Values in parentheses apply to operation with fX = 5.0 MHz.

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Figure 9-13. Square-Wave Output Operation Timing

Count
clock
TM1 00H 01H N N+1 FFH 00H FFH 00H FFH 00H 01H N 00H 01H

TM2 00H 01H 02H M–1 M 00H

CR10 N

CR20 M

TO2 Interval time

Count start Level inversion counter clear

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 CHAPTER 9 8-BIT TIMER/EVENT COUNTER

9.5 Cautions on 8-Bit Timer/Event Counters 1 and 2

(1) Timer start errors

An error of up to one clock may occur in the time required for a match signal to be generated after timer start.
This is because 8-bit timer registers 1 and 2 (TM1 and TM2) are started asynchronously to the count pulse.

Figure 9-14. Start Timing of 8-Bit Timer Registers 1 and 2

Count pulse

TM1, TM2 count value 00H 01H 02H 03H 04H

Timer start

(2) 8-bit compare register 10 and 20 setting

8-bit compare registers 10 and 20 (CR10 and CR20) can be set to 00H.
Thus, when these 8-bit compare registers are used as event counters, a one-pulse count operation can be
carried out.
When the 8-bit compare register is used as 16-bit timer/event counter, write data to CR10 and CR20 after
setting bit 0 (TCE1) of the 8-bit timer mode control register (TMC1) and stopping timer operation.

Figure 9-15. External Event Counter Operation Timing

TI1, TI2, input

CR10, CR20 00H

TM1, TM2 count value 00H 00H 00H 00H

TO1, TO2

Interrupt request flag

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(3) Operation after compare register change during timer count operation
If the values after 8-bit compare registers 10 and 20 (CR10 and CR20) are changed are smaller than those
of the 8-bit timer registers (TM1 and TM2), TM1 and TM2 continue counting, overflow and then restart counting
from 0. Thus, if the value after CR10 and CR20 change (M) is smaller than value before the change (N), it
is necessary to restart the timer after changing CR10 and CR20.

Figure 9-16. Timing After Compare Register Change During Timer Count Operation

Count pulse

CR10, CR20 N M

TM1, TM2 count value X–1 X FFH 00H 01H 02H

Remark N>X>M

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 CHAPTER 10 WATCH TIMER

10.1 Watch Timer Functions

The watch timer has the following functions.

• Watch timer
• Interval timer

The watch timer and the interval timer can be used simultaneously.

(1) Watch timer

When the 32.768 kHz subsystem clock is used, a flag (WTIF) is set at 0.5-second or 0.25-second intervals.
When the 4.19 MHz (standard: 4.194304 MHz) main system clock is used, a flag (WTIF) is set at 0.5-second
or 0.25-second intervals.

Caution 0.5-second intervals cannot be generated with the 5.0 MHz main system clock. Switch to
the 32.768 kHz subsystem clock to generate 0.5-second intervals.

Remark fXX: Watch timer clock frequency (fX/27 or fXT)

fX : Main system clock oscillation frequency
fXT: Subsystem clock oscillation frequency

(2) Interval timer

Interrupt requests (INTTM3) are generated at the preset time interval.

Table 10-1. Interval Timer Interval Time

Interval Time When Operated at When Operated at When Operated at

fXX = 5.0 MHz fXX = 4.19 MHz fXT = 32.768 kHz

24 × 1/fW 410 µs 488 µs 488 µs

25 × 1/fW 819 µs 977 µs 977 µs
26 × 1/fW 1.64 ms 1.95 ms 1.95 ms

27 × 1/fW 3.28 ms 3.91 ms 3.91 ms

28 × 1/fW 6.55 ms 7.81 ms 7.81 ms
29 × 1/fW 13.1 ms 15.6 ms 15.6 ms

Remark fXX: Main system clock frequency (fX or fX/2)

fX : Main system clock oscillation frequency
fXT: Subsystem clock oscillation frequency
f W: Watch timer clock frequency (fXX/27 or fXT)

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10.2 Watch Timer Configuration

The watch timer consists of the following hardware.

Table 10-2. Watch Timer Configuration

Item Configuration

Counter 5 bits × 1
Control registers Timer clock select register 2 (TCL2)
Watch timer mode control register (TMC2)

10.3 Watch Timer Control Registers

The following two registers are used to control the watch timer.

• Timer clock select register 2 (TCL2)

• Watch timer mode control register (TMC2)

(1) Timer clock select register 2 (TCL2) (see Figure 10-2.)

This register sets the watch timer count clock.
TCL2 is set with an 8-bit memory manipulation instruction.
RESET input clears TCL2 to 00H.

Remark Besides setting the watch timer count clock, TCL2 sets the watchdog timer count clock and buzzer
output frequency.

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Figure 10-1. Watch Timer Block Diagram

TMC21

fW

Selector
7
Clear 214
f XX /2 5-bit counter

Selector
Selector

fW
Prescaler INTWT
f XT Clear
fW fW fW fW fW fW fW
24 25 26 27 28 29 213

Selector
INTTM3

To 16-bit timer/
event counter
3

TCL24 TMC26 TMC25 TMC24 TMC23 TMC22 TMC21 TMC20

Timer clock Watch timer mode

select register 2 control register

Internal bus

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Figure 10-2. Format of Timer Clock Select Register 2

After
Symbol 7 6 5 4 3 2 1 0 Address R/W
reset
TCL2 TCL27 TCL26 TCL25 TCL24 0 TCL22 TCL21 TCL20 FF42H 00H R/W

TCL22 TCL21 TCL20 Watchdog timer count clock selection (see CHAPTER 11 WATCHDOG TIMER)

MCS = 1 MCS = 0
3 3 4
0 0 0 f XX /2 f X /2 (625 kHz) f X /2 (313 kHz)

0 0 1 f XX /24 f X /24 (313 kHz) f X /25 (156 kHz)

0 1 0 f XX /25 f X /25 (156 kHz) f X /26 (78.1 kHz)

0 1 1 f XX /26 f X /26 (78.1 kHz) f X /27 (39.1 kHz)

1 0 0 f XX /27 f X /27 (39.1 kHz) f X /28 (19.5 kHz)

1 0 1 f XX /28 f X /28 (19.5 kHz) f X /29 (9.8 kHz)

1 1 0 f XX /29 f X /29 (9.8 kHz) f X /210 (4.9 kHz)

1 1 1 f XX /211 f X /211 (2.4 kHz) f X /212 (1.2 kHz)

TCL24 Watch timer count clock selection

MCS = 1 MCS = 0

0 f XX /27 f X /27 (39.1 kHz) f X /28 (19.5 kHz)

1 f XT (32.768 kHz)

TCL27 TCL26 TCL25 Buzzer output frequency selection (see CHAPTER 13 BUZZER OUTPUT CONTROLLER)

MCS = 1 MCS = 0

0 × × Buzzer output disabled

1 0 0 f XX /29 f X /29 (9.8 kHz) f X /210 (4.9 kHz)

1 0 1 f XX /210 f X /210 (4.9 kHz) f X /211 (2.4 kHz)

1 1 0 f XX /211 f X /211 (2.4 kHz) f X /212 (1.2 kHz)

1 1 1 Setting prohibited

Caution When changing the count clock, be sure to stop operation of the watch timer before
rewriting TCL2 (stopping operation is not necessary when rewriting the same data).

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fXT: Subsystem clock oscillation frequency
4. ×: don’t care
5. MCS: Bit 0 of oscillation mode select register (OSMS)
6. Values in parentheses apply to operation with fX = 5.0 MHz or fXT = 32.768 kHz.

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(2) Watch timer mode control register (TMC2)

This register sets the watch timer operating mode, watch flag set time and prescaler interval time and enables/
disables prescaler and 5-bit counter operations.
TMC2 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears TMC2 to 00H.

Figure 10-3. Format of Watch Timer Mode Control Register

After
Symbol 7 6 5 4 3 2 1 0 Address R/W
reset
TMC2 0 TMC26 TMC25 TMC24 TMC23 TMC22 TMC21 TMC20 FF4AH 00H R/W

TMC20 Watch operating mode selection

0 Normal operating mode (flag set at f W /214 )

1 Fast feed operating mode (flag set at f W /25)

TMC21 Prescaler operation control

0 Clear after operation stop

1 Operation enable

TMC22 5-bit counter operation control

0 Clear after operation stop

1 Operation enable

TMC23 Watch flag set time selection

f XX = 5.0 MHz operation f XX = 4.19 MHz operation f XT = 32.768 kHz operation

14 14
0 2 /f W (0.4 sec) 2 /f W (0.5 sec) 214/f W (0.5 sec)

1 213/f W (0.2 sec) 213/f W (0.25 sec) 213/f W (0.25 sec)

TMC26 TMC25 TMC24 Prescaler interval time selection

f XX = 5.0 MHz operation f XX = 4.19 MHz operation f XT = 32.768 kHz operation

0 0 0 2 /f W (410 µ s)
4
2 /f W (488 µ s)
4
24/f W (488 µ s)

0 0 1 25/f W (819 µ s) 25/f W (977 µ s) 25/f W (977 µ s)

0 1 0 26/f W (1.64 ms) 26/f W (1.95 ms) 26/f W (1.95 ms)

0 1 1 27/f W (3.28 ms) 27/f W (3.91 ms) 27/f W (3.91 ms)

1 0 0 28/f W (6.55 ms) 28/f W (7.81 ms) 28/f W (7.81 ms)

1 0 1 29/f W (13.1 ms) 29/f W (15.6 ms) 29/f W (15.6 ms)

Other than above Setting prohibited

Caution When the watch timer is used, the prescaler should not be cleared frequently.

Remarks 1. fW: Watch timer clock frequency (fXX/27 or fXT)

2. fXX: Main system clock frequency (fX or fX/2)
3. fX: Main system clock oscillation frequency
4. fXT: Subsystem clock oscillation frequency

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10.4 Watch Timer Operations

10.4.1 Watch timer operation

When the 32.768 kHz subsystem clock or 4.19 MHz main system clock is used, the timer operates as a watch
timer with a 0.5-second or 0.25-second interval.
The watch timer sets the test input flag (WTIF) to 1 at a constant time interval. When WTMK = 0, the standby
state (STOP mode/HALT mode) can be cleared by setting WTIF to 1.
When bit 2 (TMC22) of the watch timer mode control register (TMC2) is cleared to 0, the 5-bit counter is cleared
and the count operation stops.
For simultaneous operation of the interval timer, zero-second start can be achieved by clearing TMC22 to 0
(maximum error: 26.2 ms when operated at fXX = 5.0 MHz).

10.4.2 Interval timer operation

The watch timer operates as interval timer which generates interrupt requests repeatedly at an interval of the preset
count value.
The interval time can be selected using bits 4 to 6 (TMC24 to TMC26) of the watch timer mode control register
(TMC2).

Table 10-3. Interval Timer Interval Time

TMC26 TMC25 TMC24 Interval Time When Operated at When Operated at When Operated at
fXX = 5.0 MHz fXX = 4.19 MHz fXT = 32.768 kHz
0 0 0 24 × 1/fW 410 µs 488 µs 488 µs
0 0 1 25 × 1/fW 819 µs 977 µs 977 µs
0 1 0 26 × 1/fW 1.64 ms 1.95 ms 1.95 ms

0 1 1 27 × 1/fW 3.28 ms 3.91 ms 3.91 ms

1 0 0 28 × 1/fW 6.55 ms 7.81 ms 7.81 ms
1 0 1 29 × 1/fW 13.1 ms 15.6 ms 15.6 ms

Other than above Setting prohibited

Remark fXX: Main system clock frequency (fX or fX/2)

f X: Main system clock oscillation frequency
fXT: Subsystem clock oscillation frequency
f W: Watch timer clock frequency (fXX/27 or fXT)
TMC24 to TMC26: Bits 4 to 6 of watch timer mode control register (TMC2)

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 CHAPTER 11 WATCHDOG TIMER

11.1 Watchdog Timer Functions

The watchdog timer has the following functions.

• Watchdog timer
• Interval timer

Caution Select the watchdog timer mode or the interval timer mode using the watchdog timer mode
register (WDTM) (the watchdog timer and interval timer cannot be used at the same time).

(1) Watchdog timer mode

An inadvertent program loop is detected. Upon detection of the program loop, a non-maskable interrupt
request or RESET can be generated.

Table 11-1. Watchdog Timer Program Loop Detection Times

Runaway Detection Time MCS = 1 MCS = 0

211 × 1/fXX 211 × 1/fX (410 µs) 212 × 1/fX (819 µs)
212 × 1/fXX 212 × 1/fX (819 µs) 213 × 1/fX (1.64 ms)

213 × 1/fXX 213 × 1/fX (1.64 ms) 214 × 1/fX (3.28 ms)
214 × 1/fXX 214 × 1/fX (3.28 ms) 215 × 1/fX (6.55 ms)
215 × 1/fXX 215 × 1/fX (6.55 ms) 216 × 1/fX (13.1 ms)

216 × 1/fXX 216 × 1/fX (13.1 ms) 217 × 1/fX (26.2 ms)
217 × 1/fXX 217 × 1/fX (26.2 ms) 218 × 1/fX (52.4 ms)
219 × 1/fXX 219 × 1/fX (104.9 ms) 220 × 1/fX (209.7 ms)

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. MCS: Bit 0 of oscillation mode select register (OSMS)
4. Values in parentheses apply to operation with fX = 5.0 MHz.

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(2) Interval timer mode

Interrupt requests are generated at the preset time intervals.

Table 11-2. Interval Times

Interval Time MCS = 1 MCS = 0

211 × 1/fXX 211 × 1/fX (410 µs) 212 × 1/fX (819 µs)
212 × 1/fXX 212 × 1/fX (819 µs) 213 × 1/fX (1.64 ms)

213 × 1/fXX 213 × 1/fX (1.64 ms) 214 × 1/fX (3.28 ms)
214 × 1/fXX 214 × 1/fX (3.28 ms) 215 × 1/fX (6.55 ms)
215 × 1/fXX 215 × 1/fX (6.55 ms) 216 × 1/fX (13.1 ms)

216 × 1/fXX 216 × 1/fX (13.1 ms) 217 × 1/fX (26.2 ms)
217 × 1/fXX 217 × 1/fX (26.2 ms) 218 × 1/fX (52.4 ms)
219 × 1/fXX 219 × 1/fX (104.9 ms) 220 × 1/fX (209.7 ms)

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. MCS: Bit 0 of oscillation mode select register (OSMS)
4. Values in parentheses apply to operation with fX = 5.0 MHz.

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11.2 Watchdog Timer Configuration

The watchdog timer consists of the following hardware.

Table 11-3. Watchdog Timer Configuration

Item Configuration

Control registers Timer clock select register 2 (TCL2)

Watchdog timer mode register (WDTM)

Figure 11-1. Watchdog Timer Block Diagram

Internal bus

f XX /23 Prescaler
TMMK4
f XX f XX f XX f XX f XX f XX f XX RUN
24 25 26 27 28 29 211 INTWDT
TMIF4 Maskable
Selector

interrupt
8-bit counter request
Controller
RESET
INTWDT
3 Non-maskable
interrupt
request

TCL22 TCL21 TCL20 RUN WDTM4 WDTM3

Timer clock select register 2 Watchdog timer mode register

Internal bus

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11.3 Watchdog Timer Control Registers

The following two registers are used to control the watchdog timer.

• Timer clock select register 2 (TCL2)

• Watchdog timer mode register (WDTM)

(1) Timer clock select register 2 (TCL2)

This register sets the watchdog timer count clock.
TCL2 is set with an 8-bit memory manipulation instruction.
RESET input clears TCL2 to 00H.

Remark Besides setting the watchdog timer count clock, TCL2 sets the watch timer count clock and buzzer
output frequency.

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Figure 11-2. Format of Timer Clock Select Register 2

After
Symbol 7 6 5 4 3 2 1 0 Address R/W
reset
TCL2 TCL27 TCL26 TCL25 TCL24 0 TCL22 TCL21 TCL20 FF42H 00H R/W

TCL22 TCL21 TCL20 Watchdog timer count clock selection

MCS = 1 MCS = 0
3 3 4
0 0 0 f XX /2 f X /2 (625 kHz) f X /2 (313 kHz)

0 0 1 f XX /24 f X /24 (313 kHz) f X /25 (156 kHz)

0 1 0 f XX /25 f X /25 (156 kHz) f X /26 (78.1 kHz)

0 1 1 f XX /26 f X /26 (78.1 kHz) f X /27 (39.1 kHz)

1 0 0 f XX /27 f X /27 (39.1 kHz) f X /28 (19.5 kHz)

1 0 1 f XX /28 f X /28 (19.5 kHz) f X /29 (9.8 kHz)

1 1 0 f XX /29 f X /29 (9.8 kHz) f X /210 (4.9 kHz)

1 1 1 f XX /211 f X /211 (2.4 kHz) f X /212 (1.2 kHz)

TCL24 Watch timer count clock selection (see CHAPTER 10 WATCH TIMER)

MCS = 1 MCS = 0
7 7 8
0 f XX /2 f X /2 (39.1 kHz) f X /2 (19.5 kHz)

1 f XT (32.768 kHz)

TCL27 TCL26 TCL25 Buzzer output frequency selection (see CHAPTER 13 BUZZER OUTPUT CONTROLLER)

MCS = 1 MCS = 0

0 × × Buzzer output disable

1 0 0 f XX /29 f X /29 (9.8 kHz) f X /210 (4.9 kHz)

1 0 1 f XX /210 f X /210 (4.9 kHz) f X /211 (2.4 kHz)

1 1 0 f XX /211 f X /211 (2.4 kHz) f X /212 (1.2 kHz)

1 1 1 Setting prohibited

Caution Changing the count clock (rewriting TCL20 to TCL22) after watchdog timer operation has
started is prohibited.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fXT: Subsystem clock oscillation frequency
4. ×: don’t care
5. MCS: Bit 0 of oscillation mode select register (OSMS)
6. Values in parentheses apply to operation with fX = 5.0 MHz or fXT = 32.768 kHz.

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(2) Watchdog timer mode register (WDTM)

This register sets the watchdog timer operating mode and enables/disables counting.
WDTM is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears WDTM to 00H.

Figure 11-3. Format of Watchdog Timer Mode Register

After
Symbol <7> 6 5 4 3 2 1 0 Address R/W
reset
WDTM RUM 0 0 WDTM4 WDTM3 0 0 0 FFF9H 00H R/W

WDTM4 WDTM3 Watchdog timer operation mode

selection selectionNote 1

0 × Interval timer modeNote 2

(Maskable interrupt request occurs upon
generation of an overflow.)
1 0 Watchdog timer mode 1
(Non-maskable interrupt request occurs
upon generation of an overflow.)
1 1 Watchdog timer mode 2
(Reset operation is activated upon
generation of an overflow.)

RUN Watchdog timer operation mode selectionNote 3

0 Count stop

1 Counter is cleared and counting starts.

Notes 1. Once set to 1, WDTM3 and WDTM4 cannot be cleared to 0 by software.

2. The watchdog timer starts operating as an interval timer as soon as RUN has been set to 1.
3. Once set to 1, RUN cannot be cleared to 0 by software.
Thus, once counting starts, it can only be stopped by RESET input.

Cautions 1. When RUN is set to 1 so that the watchdog timer is cleared, the actual overflow time is
up to 0.5% shorter than the time set by timer clock select register 2 (TCL2).
2. To use watchdog timer modes 1 and 2, make sure that the interrupt request flag (TMIF4)
is 0, and then set WDTM4 to 1.
If WDTM4 is set to 1 when TMIF4 is 1, the non-maskable interrupt request occurs,
regardless of the contents of WDTM3.

Remark ×: don’t care

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 CHAPTER 11 WATCHDOG TIMER

11.4 Watchdog Timer Operations

11.4.1 Watchdog timer operation

When bit 4 (WDTM4) of the watchdog timer mode register (WDTM) is set to 1, the watchdog timer operates to
detect an inadvertent program loop.
The watchdog timer count clock (program loop detection time interval) can be selected using bits 0 to 2 (TCL20
to TCL22) of timer clock select register 2 (TCL2).
The watchdog timer starts by setting bit 7 (RUN) of WDTM to 1. After the watchdog timer is started, set RUN to
1 within the set loop detection time interval. The watchdog timer can be cleared and counting is started by setting
RUN to 1. If RUN is not set to 1 and the program loop detection time has elapsed, system reset or a non-maskable
interrupt request is generated according to the value of WDTM bit 3 (WDTM3).
By setting RUN to 1, the watchdog timer can be cleared.
The watchdog timer continues operating in the HALT mode but it stops in the STOP mode. Thus, set RUN to 1
before the STOP mode is set, clear the watchdog timer and then execute the STOP instruction.

Cautions 1. The actual loop detection time may be shorter than the set time by a maximum of
0.5%.
2. When the subsystem clock is selected for the CPU clock, the watchdog timer count operation
is stopped.

Table 11-4. Watchdog Timer Program Loop Detection Time

TCL22 TCL21 TCL20 Runaway Detection Time MCS = 1 MCS = 0

0 0 0 211 × 1/fXX 211 × 1/fX (410 µs) 212 × 1/fX (819 µs)

0 0 1 212 × 1/fXX 212 × 1/fX (819 µs) 213 × 1/fX (1.64 ms)
0 1 0 213 × 1/fXX 213 × 1/fX (1.64 ms) 214 × 1/fX (3.28 ms)
0 1 1 214 × 1/fXX 214 × 1/fX (3.28 ms) 215 × 1/fX (6.55 ms)

1 0 0 215 × 1/fXX 215 × 1/fX (6.55 ms) 216 × 1/fX (13.1 ms)
1 0 1 216 × 1/fXX 216 × 1/fX (13.1 ms) 217 × 1/fX (26.2 ms)
1 1 0 217 × 1/fXX 217 × 1/fX (26.2 ms) 218 × 1/fX (52.4 ms)

1 1 1 219 × 1/fXX 219 × 1/fX (104.9 ms) 220 × 1/fX (209.7 ms)

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. MCS: Bit 0 of oscillation mode select register (OSMS)
4. TCL20 to TCL22: Bits 0 to 2 of timer clock select register 2 (TCL2)
5. Values in parentheses apply to operation with fX = 5.0 MHz.

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11.4.2 Interval timer operation

The watchdog timer operates as an interval timer which generates interrupt requests repeatedly at an interval of
the preset count value when bit 4 (WDTM4) of the watchdog timer mode register (WDTM) is cleared to 0.
The count clock (interval time) can be selected by bits 0 to 2 (TCL20 to TCL22) of timer clock select register 2
(TCL2). By setting bit 7 (RUN) of WDTM to 1, the watchdog timer starts operating as an interval timer.
When the watchdog timer operates as interval timer, the interrupt mask flag (TMMK4) and priority specification
flag (TMPR4) are validated and a maskable interrupt request (INTWDT) can be generated. Among the maskable
interrupt requests, the INTWDT default has the highest priority.
The interval timer continues operating in the HALT mode but it stops in STOP mode. Thus, set bit 7 (RUN) of
WDTM to 1 before the STOP mode is set, clear the interval timer and then execute the STOP instruction.

Cautions 1. Once bit 4 (WDTM4) of WDTM is set to 1 (with the watchdog timer mode selected), the interval
timer mode is not set unless RESET input is applied.
2. The interval time just after setting by WDTM may be shorter than the set time by a maximum
of 0.5%.
3. When the subsystem clock is selected for the CPU clock, the watchdog timer count operation
is stopped.

Table 11-5. Interval Timer Interval Time

TCL22 TCL21 TCL20 Interval Time MCS = 1 MCS = 0

0 0 0 211 × 1/fXX 211 × 1/fX (410 µs) 212 × 1/fX (819 µs)
0 0 1 212 × 1/fXX 212 × 1/fX (819 µs) 213 × 1/fX (1.64 ms)

0 1 0 213 × 1/fXX 213 × 1/fX (1.64 ms) 214 × 1/fX (3.28 ms)
0 1 1 214 × 1/fXX 214 × 1/fX (3.28 ms) 215 × 1/fX (6.55 ms)
1 0 0 215 × 1/fXX 215 × 1/fX (6.55 ms) 216 × 1/fX (13.1 ms)

1 0 1 216 × 1/fXX 216 × 1/fX (13.1 ms) 217 × 1/fX (26.2 ms)
1 1 0 217 × 1/fXX 217 × 1/fX (26.2 ms) 218 × 1/fX (52.4 ms)
1 1 1 219 × 1/fXX 219 × 1/fX (104.9 ms) 220 × 1/fX (209.7 ms)

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. MCS: Bit 0 of oscillation mode select register (OSMS)
4. TCL20 to TCL22: Bits 0 to 2 of timer clock select register 2 (TCL2)
5. Values in parentheses apply to operation with fX = 5.0 MHz.

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 CHAPTER 12 CLOCK OUTPUT CONTROLLER

12.1 Clock Output Controller Functions

The clock output controller is used for carrier output during remote controlled transmission and clock output for
supply to peripheral LSI devices. The clock selected by timer clock select register 0 (TCL0) is output from the PCL/
P35 pin.
Follow the procedure below to output clock pulses.

(1) Select the clock pulse output frequency (with clock pulse output disabled) using bits 0 to 3 (TCL00 to TCL03)
of TCL0.
(2) Set the P35 output latch to 0.
(3) Set bit 5 (PM35) of port mode register 3 (PM3) to 0 (set to output mode).
(4) Set bit 7 (CLOE) of timer clock select register 0 (TCL0) to 1.

Caution Clock output cannot be used when the P35 output latch is set to 1.

Remark When clock output enable/disable is switched, the clock output controller does not output pulses with
small widths (see the portions marked with * in Figure 12-1).

Figure 12-1. Remote Controlled Output Application Example

CLOE

* *
PCL/P35 pin output

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12.2 Clock Output Controller Configuration

The clock output controller consists of the following hardware.

Table 12-1. Clock Output Controller Configuration

Item Configuration

Control registers Timer clock select register 0 (TCL0)

Port mode register 3 (PM3)

Figure 12-2. Clock Output Controller Block Diagram

f XX
f XX /2
f XX /22
f XX /23
Selector

f XX /24
Synchronizing
f XX /25 circuit PCL /P35
f XX /26
f XX /27
f XT
4

CLOE TCL03 TCL02 TCL01 TCL00 P35 PM35

Output latch

Timer clock select register 0 Port mode register 3

Internal Bus

12.3 Clock Output Function Control Registers

The following two registers are used to control the clock output function.

• Timer clock select register 0 (TCL0)

• Port mode register 3 (PM3)

(1) Timer clock select register 0 (TCL0)

This register sets the PCL output clock.
TCL0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears TCL0 to 00H.

Remark Besides setting the PCL output clock, TCL0 sets the 16-bit timer register count clock.

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Figure 12-3. Format of Timer Clock Select Register 0

After
Symbol <7> 6 5 4 3 2 1 0 Address R/W
reset
TCL0 CLOE TCL06 TCL05 TCL04 TCL03 TCL02 TCL01 TCL00 FF40H 00H R/W

TCL03 TCL02 TCL01 TCL00 PCL output clock selection

MCS = 1 MCS = 0

0 0 0 0 f XT (32.768 kHz)

0 1 0 1 f XX fX (5.0 MHz) f X /2 (2.5 MHz)

0 1 1 0 f XX /2 f X /2 (2.5 MHz) f X /22 (1.25 MHz)

0 1 1 1 f XX /22 f X /22 (1.25 MHz) f X /23 (625 kHz)

1 0 0 0 f XX /23 f X /23 (625 kHz) f X /24 (313 kHz)

1 0 0 1 f XX /24 f X /24 (313 kHz) f X /25 (156 kHz)

1 0 1 0 f XX /25 f X /25 (156 kHz) f X /26 (78.1 kHz)

1 0 1 1 f XX /26 f X /26 (78.1 kHz) f X /27 (39.1 kHz)

1 1 0 0 f XX /27 f X /27 (39.1 kHz) f X /28 (19.5 kHz)

Other than above Setting prohibited

TCL06 TCL05 TCL04 16-bit timer register count clock selection

MCS = 1 MCS = 0

0 0 0 TI00 (valid edge specifiable)

0 0 1 2f XX Setting prohibited fX (5.0 MHz)

0 1 0 f XX fX (5.0 MHz) f X /2 (2.5 MHz)

0 1 1 f XX /2 f X /2 (2.5 MHz) f X /22 (1.25 MHz)

1 0 0 f XX /22 f X /22 (1.25 MHz) f X /23 (625 kHz)

1 1 1 Watch timer output (INTTM3)

Other than above Setting prohibited

CLOE PCL output control

0 Output disabled

1 Output enabled

Cautions 1. The TI00/P00/INTP0 pin valid edge is set by external interrupt mode register 0 (INTM0),
and the sampling clock frequency is selected by the sampling clock select register
(SCS).
2. When enabling PCL output, set TCL00 to TCL03, then set CLOE to 1 with a 1-bit memory
manipulation instruction.
3. When reading the count value when TI00 has been specified as the TM0 count clock,
the value should be read from TM0, not from the 16-bit capture/compare register (CR01).
4. When rewriting TCL0 to other data, stop the clock operation beforehand.

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Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fXT: Subsystem clock oscillation frequency
4. TI00: 16-bit timer/event counter input pin
5. TM0: 16-bit timer register
6. MCS: Bit 0 of oscillation mode select register (OSMS)
7. Values in parentheses apply to operation with fX = 5.0 MHz or fXT = 32.768 kHz.

(2) Port mode register 3 (PM3)

This register sets port 3 input/output in 1-bit units.
When using the P35/PCL pin for clock output, set PM35 and the output latch of P35 to 0.
PM3 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input sets PM3 to FFH.

Figure 12-4. Format of Port Mode Register 3

After
Symbol 7 6 5 4 3 2 1 0 Address R/W
reset
PM3 PM37 PM36 PM35 PM34 PM33 PM32 PM31 PM30 FF23H FFH R/W

PM3n P3n pin input/output mode selection (n = 0 to 7)

0 Output mode (output buffer on)

1 Input mode (output buffer off)

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13.1 Buzzer Output Controller Functions

The buzzer output controller outputs 1.2 kHz, 2.4 kHz, 4.9 kHz, or 9.8 kHz frequency square waves. The buzzer
frequency selected by timer clock select register 2 (TCL2) is output from the BUZ/P36 pin.
Follow the procedure below to output the buzzer frequency.

(1) Select the buzzer output frequency using bits 5 to 7 (TCL25 to TCL27) of TCL2.
(2) Set the P36 output latch to 0.
(3) Set bit 6 (PM36) of port mode register 3 (PM3) to 0 (set to output mode).

Caution Buzzer output cannot be used when the P36 output latch is set to 1.

13.2 Buzzer Output Controller Configuration

The buzzer output controller consists of the following hardware.

Table 13-1. Buzzer Output Controller Configuration

Item Configuration
Control registers Timer clock select register 2 (TCL2)
Port mode register 3 (PM3)

Figure 13-1. Buzzer Output Controller Block Diagram

f XX /29
Selector

f XX /210 BUZ/P36
f XX /211

P36
TCL27 TCL26 TCL25 Output latch PM36

Timer clock select register 2 Port mode register 3

Internal bus

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13.3 Buzzer Output Function Control Registers

The following two registers are used to control the buzzer output function.

• Timer clock select register 2 (TCL2)

• Port mode register 3 (PM3)

(1) Timer clock select register 2 (TCL2)

This register sets the buzzer output frequency.
TCL2 is set with an 8-bit memory manipulation instruction.
RESET input clears TCL2 to 00H.

Remark Besides setting the buzzer output frequency, TCL2 sets the watch timer count clock and the
watchdog timer count clock.

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Figure 13-2. Format of Timer Clock Select Register 2

After
Symbol 7 6 5 4 3 2 1 0 Address R/W
reset
TCL2 TCL27 TCL26 TCL25 TCL24 0 TCL22 TCL21 TCL20 FF42H 00H R/W

TCL22 TCL21 TCL20 Watchdog timer count clock selection (see CHAPTER 11 WATCHDOG TIMER)

MCS = 1 MCS = 0
3 3 4
0 0 0 f XX /2 f X /2 (625 kHz) f X /2 (313 kHz)

0 0 1 f XX /24 f X /24 (313 kHz) f X /25 (156 kHz)

0 1 0 f XX /25 f X /25 (156 kHz) f X /26 (78.1 kHz)

0 1 1 f XX /26 f X /26 (78.1 kHz) f X /27 (39.1 kHz)

1 0 0 f XX /27 f X /27 (39.1 kHz) f X /28 (19.5 kHz)

1 0 1 f XX /28 f X /28 (19.5 kHz) f X /29 (9.8 kHz)

1 1 0 f XX /29 f X /29 (9.8 kHz) f X /210 (4.9 kHz)

1 1 1 f XX /211 f X /211 (2.4 kHz) f X /212 (1.2 kHz)

TCL24 Watch timer count clock selection (see CHAPTER 10 WATCH TIMER)

MCS = 1 MCS = 0
7 7 8
0 f XX /2 f X /2 (39.1 kHz) f X /2 (19.5 kHz)

1 f XT (32.768 kHz)

TCL27 TCL26 TCL25 Buzzer output frequency selection

MCS = 1 MCS = 0

0 × × Buzzer output disabled

1 0 0 f XX /29 f X /29 (9.8 kHz) f X /210 (4.9 kHz)

1 0 1 f XX /210 f X /210 (4.9 kHz) f X /211 (2.4 kHz)

1 1 0 f XX /211 f X /211 (2.4 kHz) f X /212 (1.2 kHz)

1 1 1 Setting prohibited

Cautions 1. Be sure to stop operation of the watch timer or buzzer to be changed before rewriting
TCL2 (stop operation is not necessary when rewriting the same data).
The operation is stopped by the following methods.

• Buzzer output: Input 0 to bit 7 of TCL2 (TCL27)

• Watch timer: Input 0 to bit 2 (TMC22) of watch timer mode control register 2
(TMC2)

2. Changing the count clock (rewriting TCL20 to TCL22) after watchdog timer operation
has started is prohibited.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fXT: Subsystem clock oscillation frequency
4. ×: don’t care
5. MCS: Bit 0 of oscillation mode select register (OSMS)
6. Values in parentheses apply to operation with fX = 5.0 MHz or fXT = 32.768 kHz.
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(2) Port mode register 3 (PM3)

This register sets port 3 input/output in 1-bit units.
When using the P36/BUZ pin for buzzer output, clear PM36 and the output latch of P36 to 0.
PM3 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input sets PM3 to FFH.

Figure 13-3. Format of Port Mode Register 3

After
Symbol 7 6 5 4 3 2 1 0 Address R/W
reset
PM3 PM37 PM36 PM35 PM34 PM33 PM32 PM31 PM30 FF23H FFH R/W

PM3n P3n pin input/output mode selection (n = 0 to 7)

0 Output mode (output buffer on)

1 Input mode (output buffer off)

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14.1 A/D Converter Functions

The A/D converter converts an analog input into a digital value. It consists of 8 channels (ANI0 to ANI7) with an
8-bit resolution.
The conversion method is based on successive approximation and the conversion result is held in the 8-bit A/D
conversion result register (ADCR).
A/D conversion can be started in the following two ways.

(1) Hardware start

Conversion is started by trigger input (INTP3).

(2) Software start

Conversion is started by setting the A/D converter mode register (ADM).

One analog input channel is selected from ANI0 to ANI7 and A/D conversion is carried out. In the case of hardware
start, A/D conversion stops when an A/D conversion operation ends, and an interrupt request (INTAD) is generated.
In the case of software start, A/D conversion is repeated. Each time an A/D conversion operation ends, an interrupt
request (INTAD) is generated.

14.2 A/D Converter Configuration

The A/D converter consists of the following hardware.

Table 14-1. A/D Converter Configuration

Item Configuration
Analog inputs 8 channels (ANI0 to ANI7)
Control registers A/D converter mode register (ADM)
A/D converter input select register (ADIS)
External interrupt mode register 1 (INTM1)

Registers Successive approximation register (SAR)

A/D conversion result register (ADCR)

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Figure 14-1. A/D Converter Block Diagram

Internal bus

A/ D converter input select register

ADIS3 ADIS2 ADIS1 ADIS0

4
Series resistor string
ANI0/P10
ANI1/P11
Sample & hold circuit

Tap selector
ANI2/P12 Note 1 Note 2 Voltage AVREF0
Selector

ANI3/P13 Selector comparator (also functions

ANI4/P14 as analog
ANI5/P15 power supply)
AVSS Successive
ANI6/P16 AVSS
approximation
ANI7/P17 register (SAR)
3

ADM1 to ADM3

Edge
INTP3/P03 Controller INTAD
detector

ES40, ES41Note 3 INTP3

3
Trigger enable
A/D conversion
CS TRG FR1 FR0 ADM3 ADM2 ADM1 HSC result register
(ADCR)
A/D converter mode register

Internal bus

Notes 1. Selector to select the number of channels to be used for analog input.
2. Selector to select the channel for A/D conversion.
3. ES40, ES41: Bits 0 and 1 of external interrupt mode register 1 (INTM1)

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(1) Successive approximation register (SAR)

This register compares the analog input voltage value to the voltage tap (compare voltage) value applied from
the series resistor string and holds the result from the most significant bit (MSB).
When up to the least significant bit (LSB) is held (end of A/D conversion), the SAR contents are transferred
to the A/D conversion result register (ADCR).

(2) A/D conversion result register (ADCR)

This register holds the A/D conversion result. Each time A/D conversion ends, the conversion result is loaded
from the successive approximation register (SAR).
ADCR is read with an 8-bit memory manipulation instruction.
RESET input makes ADCR undefined.

(3) Sample & hold circuit

The sample & hold circuit samples each analog input signal sequentially applied from the input circuit and
sends it to the voltage comparator. This circuit holds the sampled analog input voltage value during A/D
conversion.

(4) Voltage comparator

The voltage comparator compares the analog input to the series resistor string output voltage.

(5) Series resistor string

The series resistor string is connected between AVREF0 and AVSS, and generates a voltage to be compared
with the analog input.

(6) ANI0 to ANI7 pins

These are 8-channel analog input pins to input analog signals to undergo A/D conversion to the A/D converter.
Pins other than those selected as analog input by the A/D converter input select register (ADIS) can be used
as I/O ports.

Cautions 1. Use the ANI0 to ANI7 input voltages within the specified range. If a voltage higher than
or equal to AVREF0 or lower than or equal to AVSS is applied (even if within the absolute
maximum ratings), the converted value of the corresponding channel becomes undefined
and may adversely affect the converted values of other channels.
2. The analog input pins (ANI0 to ANI7) also function as I/O port pins (port 1). When A/D
conversion is performed with any of pins ANI0 to ANI7 selected, be sure not to execute
an instruction that inputs data to port 1 while conversion is in progress, as this may
reduce the conversion resolution.
Also, if digital pulses are applied to a pin adjacent to the pin in the process of A/D
conversion, the expected A/D conversion value may not be obtained due to coupling
noise. Therefore, avoid applying pulses to pins adjacent to the pin undergoing A/D
conversion.

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(7) AVREF0 pin

This pin inputs the A/D converter reference voltage.
It converts signals input to ANI0 to ANI7 into digital signals according to the voltage applied between AVREF0
and AVSS.
The current flowing in the series resistor string can be reduced by setting the voltage to be input to the AVREF0
pin to AVSS level in standby mode.
This pin also serves as an analog power supply pin. Supply power to this pin when the A/D converter is used.

Caution A series resistor string of approximately 10 kΩ is connected between the AVREF0 pin and
AV SS pin. Therefore, if the output impedance of the reference voltage source is high, this
will result in series connection to the series resistor string between AVREF0 pin and the
AV SS pin, resulting in a large reference voltage error.

(8) AVSS pin

This is a GND potential pin of the A/D converter. Keep it at the same potential as the VSS0 pin when not using
the A/D converter.

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14.3 A/D Converter Control Registers

The following three registers are used to control the A/D converter.

• A/D converter mode register (ADM)

• A/D converter input select register (ADIS)
• External interrupt mode register 1 (INTM1)

(1) A/D converter mode register (ADM)

This register sets the analog input channel for A/D conversion, conversion time, conversion start/stop and
external trigger.
ADM is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input sets ADM to 01H.

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Figure 14-2. Format of A/D Converter Mode Register

After
Symbol <7> <6> 5 4 3 2 1 0 Address R/W
reset
ADM CS TRG FR1 FR0 ADM3 ADM2 ADM1 HSC FF80H 01H R/W

ADM3 ADM2 ADM1 Analog input channel selection

0 0 0 ANI0

0 0 1 ANI1

0 1 0 ANI2

0 1 1 ANI3

1 0 0 ANI4

1 0 1 ANI5

1 1 0 ANI6

1 1 1 ANI7

FR1 FR0 HSC A/D conversion time selectionNote 1

fX = 5.0 MHz operation fX = 4.19 MHz operation

MCS = 1 MCS = 0 MCS = 1 MCS = 0

0 0 1 80/f X (16.0 µ s) 160/f X (32.0 µ s) 80/f X (19.1 µs) 160/f X (38.1 µ s)

) 80/f X (16.0 µ s) ) 80/f X (19.1 µs)

Note 2 Note 2
0 1 1 40/f X (Setting prohibited 40/f X (Setting prohibited

) 100/f X (20.0 µ s) ) 100/f X (23.8 µs)

Note 2 Note 2
1 0 0 50/f X (Setting prohibited 50/f X (Setting prohibited

1 0 1 100/f X (20.0 µs) 200/f X (40.0 µ s) 100/f X (23.8 µs) 200/f X (47.7 µ s)

Other than above Setting prohibited

TRG External trigger selection

0 No external trigger (software starts)

1 Conversion started by external trigger (hardware starts)

CS A/D conversion operation control

0 Operation stop

1 Operation start

Notes 1. Set so that the A/D conversion time is 16 µs or more.

2. Setting is prohibited because the A/D conversion time is less than 16 µs with fX set to this
condition.

Cautions 1. The following sequence is recommended for reducing the power consumption of the
A/D converter when the standby function is used: Clear bit 7 (CS) to 0 first to stop
the A/D conversion operation, and then execute the HALT or STOP instruction.
2. When restarting a stopped A/D conversion operation, start the A/D conversion
operation after clearing the interrupt request flag (ADIF) to 0.

Remarks 1. fX: Main system clock oscillation frequency

2. MCS: Bit 0 of oscillation mode select register (OSMS)

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(2) A/D converter input select register (ADIS)

This register determines whether the ANI0/P10 to ANI7/P17 pins should be used for analog input channels
or ports. Pins other than those selected as analog input can be used as I/O ports.
ADIS is set with an 8-bit memory manipulation instruction.
RESET input clears ADIS to 00H.

Cautions 1. Set the analog input channel using the following procedure.
(1) Set the number of analog input channels using ADIS.
(2) Using the A/D converter mode register (ADM), select one channel to undergo A/D
conversion from among the channels set to analog input by ADIS.
2. No internal pull-up resistor can be used for the channels set to analog input by ADIS,
irrespective of the value of bit 1 (PUO1) of pull-up resistor option register L (PUOL).

Figure 14-3. Format of A/D Converter Input Select Register

After
Symbol 7 6 5 4 3 2 1 0 Address R/W
reset
ADIS 0 0 0 0 ADIS3 ADIS2 ADIS1 ADIS0 FF84H 00H R/W

ADIS3 ADIS2 ADIS1 ADIS0 Number of analog input channel selection

0 0 0 0 No analog input channel (P10 to P17)

0 0 0 1 1 channels (ANI0, P11 to P17)

0 0 1 0 2 channels (ANI0, ANI1, P12 to P17)

0 0 1 1 3 channels (ANI0 to ANI2, P13 to P17)

0 1 0 0 4 channels (ANI0 to ANI3, P14 to P17)

0 1 0 1 5 channels (ANI0 to ANI4, P15 to P17)

0 1 1 0 6 channels (ANI0 to ANI5, P16, P17)

0 1 1 1 7 channels (ANI0 to ANI6, P17)

1 0 0 0 8 channels (ANI0 to ANI7)

Other than above Setting prohibited

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(3) External interrupt mode register 1 (INTM1)

This register sets the valid edge for INTP3 to INTP5.
INTM1 is set with an 8-bit memory manipulation instruction.
RESET input clears INTM1 to 00H.

Figure 14-4. Format of External Interrupt Mode Register 1

After
Symbol 7 6 5 4 3 2 1 0 Address R/W
reset
INTM1 0 0 ES61 ES60 ES51 ES50 ES41 ES40 FFEDH 00H R/W

ES41 ES40 INTP3 valid edge selection

0 0 Falling edge

0 1 Rising edge

1 0 Setting prohibited

1 1 Both rising and falling edges

ES51 ES50 INTP4 valid edge selection

0 0 Falling edge

0 1 Rising edge

1 0 Setting prohibited

1 1 Both rising and falling edges

ES61 ES60 INTP5 valid edge selection

0 0 Falling edge

0 1 Rising edge

1 0 Setting prohibited

1 1 Both rising and falling edges

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14.4 A/D Converter Operations

14.4.1 Basic operations of A/D converter

(1) Set the number of analog input channels using the A/D converter input select register (ADIS).
(2) From among the analog input channels set by ADIS, select one channel for A/D conversion using the A/D
converter mode register (ADM).
(3) Sample the voltage input to the selected analog input channel using the sample & hold circuit.
(4) Sampling for the specified period of time sets the sample & hold circuit to the hold state so that the circuit
holds the input analog voltage until the end of A/D conversion.
(5) Bit 7 of the successive approximation register (SAR) is set. The series resistor string voltage tap is set to
(1/2) AVREF0 by the tap selector.
(6) The voltage difference between the series resistor string voltage tap and analog input is compared by the
voltage comparator. If the analog input is greater than (1/2) AVREF0, the MSB of SAR remains set. If the input
is smaller than (1/2) AVREF0, the MSB is reset.
(7) Next, bit 6 of SAR is automatically set and the operation proceeds to the next comparison. In this case, the
series resistor string voltage tap is selected according to the preset value of bit 7 as described below.
• Bit 7 = 1: (3/4) AVREF0
• Bit 7 = 0: (1/4) AVREF0
The voltage tap and analog input voltage are compared and bit 6 of SAR is manipulated with the result as
follows.
• Analog input voltage ≥ Voltage tap: Bit 6 = 1
• Analog input voltage < Voltage tap: Bit 6 = 0
(8) Comparison of this sort continues up to bit 0 of SAR.
(9) Upon completion of the comparison of 8 bits, a valid digital result remains in SAR and that value is transferred
to and latched in the A/D conversion result register (ADCR).
At the same time, the A/D conversion end interrupt request (INTAD) can also be generated.

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Figure 14-5. A/D Converter Basic Operation

CS = 0 → 1,
or external trigger, or ADM rewrite
A/D conversion start delay time Conversion time

Sampling time

A/D converter
Sampling A/D conversion
operation

Undefined 80H C0H or Conversion

SAR 40H result

ADCR Conversion
result

INTAD

CS

A/D conversion operations are performed continuously until bit 7 (CS) of the AD converter mode register (ADM)
is reset to 0 by software.
RESET input makes ADCR undefined.
Check the completion of A/D conversion by using the A/D conversion end interrupt request flag (ADIF).

Table 14-2. A/D Converter Sampling Time and A/D Conversion Start Delay Time

FR01 FR00 HS0C Conversion TimeNote 1 Sampling Time A/D Conversion

Start Delay Time
MCS = 1 MCS = 0 MCS = 1 MCS = 0 MCS = 1 MCS = 0

0 0 1 80/fX (16.0 µs) 160/fX (32.0 µs) 9/fX 18/fX 6/fX 12/fX
0 1 1 40/fX (setting prohibitedNote 2) 80/fX (16.0 µs) 4.5/fX 9/fX 3/fX 6/fX
1 0 0 50/fX (setting prohibitedNote 2) 100/fX (20.0 µs) 5.25/fX 10.5/fX 4.5/fX 9/fX

1 0 1 100/fX (20.0 µs) 200/fX (40.0 µs) 10.5/fX 21/fX 9/fX 18/fX
Other than above Setting prohibited – –

Notes 1. Set so that the A/D conversion time is 16 µs or more.

2. Setting is prohibited because the A/D conversion time is less than 16 µs with fX set to this condition.

Remarks 1. fX: Main system clock oscillation frequency

2. Values in parentheses apply to operation with fX = 5.0 MHz.

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14.4.2 Input voltage and conversion results

The relationship between the analog input voltage input to the analog input pins (ANI0 to ANI7) and the A/D
conversion result (the value stored in the A/D conversion result register (ADCR)) is shown by the following expression.

VIN
ADCR = INT ( × 256 + 0.5)
AVREF0

or

AVREF0
(ADCR – 0.5) × ≤ VIN < (ADCR + 0.5) × AVREF0
256 256

Where, INT( ): Function which returns integer part of value in parentheses.

VIN: Analog input voltage
AVREF0: AVREF0 pin voltage
ADCR Value of A/D conversion result register (ADCR)

Figure 14-6 shows the relationship between the analog input voltage and the A/D conversion result.

Figure 14-6. Relationship Between Analog Input Voltage and A/D Conversion Result

255

254

A/D conversion 253

results
(ADCR)

0
1 1 3 2 5 3 507 254 509 255 511
1
512 256 512 256 512 256 512 256 512 256 512
Input voltage/AVREF0

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14.4.3 A/D converter operating mode

One analog input channel is selected from among ANI0 to ANI7 by the A/D converter input select register (ADIS)
and A/D converter mode register (ADM) and A/D conversion is started.
A/D conversion can be stared in the following two ways.

• Hardware start: Conversion is started by trigger input (INTP3).

• Software start: Conversion is started by setting ADM.

The A/D conversion result is stored in the A/D conversion result register (ADCR) and the interrupt request signal
(INTAD) is simultaneously generated.

(1) A/D conversion by hardware start

When bit 6 (TRG) and bit 7 (CS) of the A/D converter mode register (ADM) are set to 1, the A/D conversion
standby state is set. When the external trigger signal (INTP3) is input, the A/D conversion starts on the voltage
applied to the analog input pins specified by bits 1 to 3 (ADM1 to ADM3) of ADM.
Upon termination of A/D conversion, the conversion result is stored in the A/D conversion result register
(ADCR) and the interrupt request signal (INTAD) is generated. After one A/D conversion operation is started
and terminated, another operation is not started until a new external trigger signal is input.
If data with CS set to 1 is written to ADM again during A/D conversion, the converter suspends the A/D
conversion operation and waits for a new external trigger signal to be input. When the external trigger input
signal is input again, A/D conversion is carried out from the beginning.
If data with CS cleared to 0 is written to ADM during A/D conversion, the A/D conversion operation stops
immediately.

Figure 14-7. A/D Conversion by Hardware Start

INTP3

ADM rewrite ADM rewrite

CS = 1, TRG = 1 CS = 1, TRG = 1

A /D conversion Standby ANIn ANIn Standby ANIn Standby ANIm ANIm ANIm
state state state

ADCR ANIn ANIn ANIn ANIm ANIm

INTAD

Remark n = 0, 1, ..., 7
m = 0, 1, ..., 7

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(2) A/D conversion operation in software start

When bit 6 (TRG) and bit 7 (CS) of the A/D converter mode register (ADM) are set to 0 and 1, respectively,
A/D conversion starts on the voltage applied to the analog input pins specified by bits 1 to 3 (ADM1 to
ADM3) of ADM.
Upon termination of A/D conversion, the conversion result is stored in the A/D conversion result register
(ADCR) and the interrupt request signal (INTAD) is generated. After one A/D conversion operation is started
and terminated, the next A/D conversion operation starts immediately. The A/D conversion operation
continues repeatedly until new data is written to ADM.
If data with CS set to 1 is written to ADM again during A/D conversion, the converter suspends the A/D
conversion operation and starts A/D conversion on the newly written data.
If data with CS cleared to 0 is written to ADM during A/D conversion, the A/D conversion operation stops
immediately.

Figure 14-8. A/D Conversion by Software Start

Conversion start ADM rewrite ADM rewrite

CS = 1, TRG = 0 CS = 1, TRG = 0 CS = 0, TRG = 0

A /D conversion ANIn ANIn ANIn ANIm ANIm

Conversion suspended
Conversion results are Stop
not stored.

ADCR ANIn ANIn ANIm

INTAD

Remark n = 0, 1, ..., 7
m = 0, 1, ..., 7

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14.5 How to Read the A/D Converter Characteristics Table

Here, special terms unique to the A/D converter are explained.

(1) Resolution
This is the minimum analog input voltage that can be identified. That is, the percentage of the analog input
voltage per 1 bit of digital output is called 1LSB (Least Significant Bit). The percentage of 1LSB with respect
to the full scale is expressed by %FSR (Full Scale Range).

When the resolution is 8 bits,

1LSB = 1/28 = 1/256

= 0.4%FSR

Accuracy has no relation to resolution, but is determined by overall error.

(2) Overall error

This shows the maximum error value between the actual measured value and the theoretical value.
Zero-scale offset, full-scale offset, integral linearity error, differential linearity error and errors which are
combinations of these express the overall error.
Note that the quantization error is not included in the overall error in the characteristics table.

(3) Quantization error

When analog values are converted to digital values, a ±1/2LSB error naturally occurs. In an A/D converter,
an analog input voltage in a range of ±1/2LSB is converted to the same digital code, so a quantization error
cannot be avoided.
Note that the quantization error is not included in the overall error, zero-scale offset, full-scale offset, integral
linearity error, and differential linearity error in the characteristics table.

Figure 14-9. Overall Error Figure 14-10. Quantization Error

1……1 1……1

Ideal line
Digital output

Digital output

Overall
error
1/2LSB Quantization error
1/2LSB

0……0 0……0
0 AVREF0 0 AVREF0
Analog input Analog input

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(4) Conversion time

This expresses the time from when the analog input voltage was applied to the time when the digital output
was obtained.
The sampling time is included in the conversion time in the characteristics table.

(5) Sampling time

This is the time the analog switch is turned on for the analog voltage to be sampled by the sample & hold circuit.

Sampling
time
Conversion time

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14.6 A/D Converter Cautions

(1) Power consumption in standby mode

A/D converter stops operating in the standby mode. At this time, current consumption can be reduced by
stopping the conversion operation (by setting bit 7 (CS) of the A/D converter mode register (ADM) to 0).
Figure 14-11 shows how to reduce the current consumption in the standby mode.

Figure 14-11. Example of Method of Reducing Current Consumption in Standby Mode

AVREF0

P-ch CS

Series resistor string

AVSS

(2) Input range of ANI0 to ANI7

The input voltages of ANI0 to ANI7 should be within the specification range. In particular, if a voltage of AVREF0
or above or AVSS or below is input (even if within the absolute maximum rating range), the conversion value
for that channel will be undefined. The conversion values of the other channels may also be affected.

(3) Conflicting operations

<1> Conflict between A/D conversion result register (ADCR) write and ADCR read by instruction upon end
of conversion
ADCR read is given priority. After the read operation, the new conversion result is written to ADCR.

<2> Conflict between ADCR write and external trigger signal input upon end of conversion
The external trigger signal is not acknowledged during A/D conversion. Therefore, the external trigger
signal is not acknowledged during ADCR write.

<3> Conflict between ADCR write and A/D converter mode register (ADM) write or A/D converter input select
register (ADIS) write
ADM or ADIS write is given priority. ADCR write is not performed, nor is the conversion end interrupt
request signal (INTAD) generated.

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(4) Noise countermeasures

In order to maintain 8-bit resolution, attention must be paid to noise on the AVREF0 and ANI0 to ANI7 pins.
Since the effect increases in proportion to the output impedance of the analog input source, it is recommended
that a capacitor be connected externally as shown in Figure 14-12 in order to reduce noise.

Figure 14-12. Analog Input Pin Handling

If there is possibility that noise whose

level is AVREF0 or higher or AVSS or lower may enter,
clamp with a diode with a small VF (0.3 V or less).
Reference
voltage input AVREF0

ANI0 to ANI7

C = 100 to 1,000 pF

VDD0

AVSS

VSS0

(5) ANI0/P10 to ANI7/P17 pins

The analog input pins ANI0 to ANI7 also function as I/O port pins (port 1). When A/D conversion is performed
with any of pins ANI0 to ANI7 selected, be sure not to execute an instruction that inputs data to port 1 while
conversion is in progress, as this may reduce the conversion resolution.
Also, if digital pulses are applied to a pin adjacent to the pin in the process of A/D conversion, the expected
A/D conversion value may not be obtainable due to coupling noise. Therefore, avoid applying pulses to pins
adjacent to the pin undergoing A/D conversion.

(6) Input impedance of ANI0 to ANI7 pins

In this A/D converter, the internal sampling capacitor is charged and sampling is performed for approx. one
tenth of the conversion time.
Since only the leakage current flows other than during sampling and the current for charging the capacitor
also flows during sampling, the input impedance fluctuates and has no meaning.
To perform sufficient sampling, however, it is recommended to make the output impedance of the analog input
source 10 kΩ or lower, or attach a capacitor of around 100 pF to the ANI0 to ANI7 pins (see Figure 14-12).

(7) AVREF0 pin input impedance

A series resistor string of approximately 10 kΩ is connected between the AVREF0 pin and the AVSS pin.
Therefore, if the output impedance of the reference voltage source is high, this will result in series connection
to the series resistor string between the AVREF0 pin and the AVSS pin, and there will be a large reference voltage
error.

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(8) Interrupt request flag (ADIF)

The interrupt request flag (ADIF) is not cleared even if the A/D converter mode register (ADM) is changed.
Caution is therefore required since, if a change of analog input pin is performed during A/D conversion, the
A/D conversion result and ADIF for the pre-change analog input may be set just before the ADM rewrite. At
this time, when ADIF is read immediately after the ADM rewrite, ADIF may be set despite the fact that the
A/D conversion for the post-change analog input has not ended.
When the A/D conversion is stopped and then resumed, clear ADIF before it is resumed.

Figure 14-13. A/D Conversion End Interrupt Request Generation Timing

ADM rewrite ADIF is set but ANIm

(start of ANIm conversion) conversion has not ended.
ADM rewrite
(start of ANIn conversion)

A /D conversion ANIn ANIn ANIm ANIm

ADCR ANIn ANIn ANIm ANIm

INTAD

Remark n = 0, 1, ..., 7
m = 0, 1, ..., 7

(9) Conversion result immediately after A/D converter start

The first A/D conversion value immediately after A/D conversion is started may not satisfy ratings. Therefore,
implement a countermeasure such as polling A/D conversion end interrupt requests (INTAD) to delete the first
conversion result.

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(10) Timing at which A/D conversion result is undefined

The A/D conversion value may be undefined if the timing of completion of A/D conversion and the timing of
stopping the A/D conversion conflict with each other. Therefore, read the A/D conversion result during the
A/D conversion operation. To read the conversion result after stopping the A/D conversion operation, be sure
to stop the A/D conversion before the next conversion ends.
Figures 14-14 and 14-15 show the timing of reading the conversion result.

Figure 14-14. Timing of Reading Conversion Result (When Conversion Result is Undefined)

A/D conversion ends A/D conversion ends

ADCR Normal conversion result Undefined value

INTAD

CS

Normal conversion result is read. A/D conversion Undefined value

is stopped. is read.

Figure 14-15. Timing of Reading Conversion Result (When Conversion Result is Normal)

A/D conversion ends

ADCR Normal conversion result

INTAD

CS

A/D conversion is stopped. Normal conversion

result is read.

(11) Notes on board design

Locate analog circuits as far away from digital circuits as possible on the board because the analog circuits
may be affected by the noise of the digital circuits. In particular, do not cross an analog signal line with a digital
signal line, or wire an analog signal line in the vicinity of a digital signal line. Otherwise, the A/D conversion
characteristics may be affected by the noise of the digital line.
Connect AVSS and VSS0 at one location on the board where the voltages are stable.

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(12) AVREF0 pin

Connect a capacitor to the AVREF0 pin to minimize conversion errors due to noise. If an A/D conversion
operation has been stopped and then is started, the voltage applied to the AVREF0 pin becomes unstable,
causing the accuracy of the A/D conversion to drop. To prevent this, also connect a capacitor to the AVREF0
pin.
Figure 14-16 shows an example of connecting a capacitor. Capacitor C1 is effective for noise of low frequency
and capacitor C2 is effective for noise of high frequency.

Figure 14-16. Example of Connecting Capacitor to AVREF0 Pin

AVREF0

C1 C2

AVSS

Remark C1: 4.7 µF to 10 µF (reference value)

C2: 0.01 µF to 0.1 µF (reference value)
Connect C2 as close to the pin as possible.

(13) Internal equivalent circuit of ANI0 to ANI7 pins and permissible signal source impedance
To complete sampling within the sampling time with sufficient A/D conversion accuracy, the impedance of the
signal source such as a sensor must be sufficiently low. Figure 14-17 shows the internal equivalent circuit
of the ANI0 to ANI7 pins.
If the impedance of the signal source is high, connect capacitors with a high capacitance to the ANI0 to ANI7
pins. An example of this is shown in Figure 14-18. In this case, however, the microcontroller cannot follow
an analog signal with a high differential coefficient because a low-pass filter is created.
To convert a high-speed analog signal or to convert an analog signal in the scan mode, insert a low-impedance
buffer.

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Figure 14-17. Internal Equivalent Circuit of Pins ANI0 to ANI7

R1 R2
ANIn

C1 C2 C3

Remark n = 0 to 7

Table 14-3. Resistances and Capacitances of Equivalent Circuit (Reference Values)

AVREF0 R1 R2 C1 C2 C3

1.8 V 75 kΩ 30 kΩ 8 pF 4 pF 2 pF

2.7 V 12 kΩ 8 kΩ 8 pF 3 pF 2 pF

4.5 V 4 kΩ 2.7 kΩ 8 pF 1.4 pF 2 pF

Caution The resistances and capacitances in Table 14-3 are not guaranteed values.

Figure 14-18. Example of Connection If Signal Source Impedance Is High

<Sensor internal circuit> <Microcontroller internal circuit>

Output impedance R1 R2
ANIn
of sensor

R0

C1 C2 C3
C0 ≤ 0.1 µF C0

Low-pass filter
is created.

Remark n = 0 to 7

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 CHAPTER 15 D/A CONVERTER

15.1 D/A Converter Functions

The D/A converter converts a digital input into an analog value. The D/A converter used is a 2-channel 8-bit
resolution voltage output type D/A converter.
The conversion method used is the R-2R resistor ladder method.
Start D/A conversion by setting bits 0 and 1 (DACE0 and DACE1) of the D/A converter mode register (DAM).
There are two modes for the D/A converter, as follows.

(1) Normal mode

Outputs an analog voltage signal immediately after D/A conversion.

(2) Real-time output mode

Outputs an analog voltage signal synchronously with the output trigger after D/A conversion.
Since a sine wave can be generated in this mode, it is useful for an MSK modem for cordless telephone sets.

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15.2 D/A Converter Configuration

The D/A converter consists of the following hardware.

Table 15-1. D/A Converter Configuration

Item Configuration

Registers D/A conversion value set register 0 (DACS0)

D/A conversion value set register 1 (DACS1)
Control register D/A converter mode register (DAM)

Figure 15-1. D/A Converter Block Diagram

Internal bus

DACS1 write D/A conversion value

set register 1
INTTM2 (DACS1)
DACS0 Write D/A conversion value
set register 0
INTTM1 (DACS0)
2R
ANO1/P131
AVREF1 2R R
Selector
AVSS
2R R
2R
2R ANO0/P130
2R R

Selector
2R R
2R

DAM5 DAM4 DACE1 DACE0

D/A converter mode register

Internal bus

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(1) D/A conversion value set registers 0, 1 (DACS0, DACS1)

DACS0 and DACS1 are registers that set the values used to determine the analog voltages to be output to
the ANO0 and ANO1 pins, respectively.
DACS0 and DACS1 are set with an 8-bit memory manipulation instruction.
RESET input clears DACS0 and DACS1 to 00H.
Analog voltage output to the ANO0 and ANO1 pins is determined by the following expression.

DACSn
ANOn output voltage = AVREF1 ×
256

where, n = 0, 1

Cautions 1. In the real-time output mode, when data that is set in DACS0 and DACS1 is read before
an output trigger is generated, the previous data is read rather than the set data.
2. In the real-time output mode, data should be set to DACS0 and DACS1 after an output
trigger and before the next output trigger.

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15.3 D/A Converter Control Registers

The D/A converter mode register (DAM) controls the D/A converter. This register sets D/A converter operation
enable/stop.
DAM is set with a 1-bit or an 8-bit memory manipulation instruction.
RESET input clears DAM to 00H.

Figure 15-2. Format of D/A Converter Mode Register

After
Symbol 7 6 5 4 3 2 <1> <0> Address R/W
reset
DAM 0 0 DAM5 DAM4 0 0 DACE1 DACE0 FF98H 00H R/W

DACE0 D/A converter channel 0 control

0 D/A conversion stop

1 D/A conversion enable

DACE1 D/A converter channel 1 control

0 D/A conversion stop

1 D/A conversion enable

DAM4 D/A converter channel 0 operating mode

0 Normal mode

1 Real-time output mode

DAM5 D/A converter channel 1 operating mode

0 Normal mode

1 Real-time output mode

Cautions 1. When using the D/A converter, alternate-function port pins should be set to the input mode,
and pull-up resistors should be disconnected.
2. Always set bits 2, 3, 6, and 7 to 0.
3. When D/A conversion is stopped, the output state is high-impedance.
4. The output triggers are INTTM1 and INTTM2 for channel 0 and channel 1, respectively, in the
real-time output mode.

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15.4 D/A Converter Operations

(1) The channel 0 operating mode and channel 1 operating mode are selected by bits 4 and 5 (DAM4 and DAM5),
respectively, of the D/A converter mode register (DAM).
(2) Set the data corresponding to the analog voltages output to the ANO0/P130 and ANO1/P131 pins to
D/A conversion value setting registers 0 and 1 (DACS0 and DACS1), respectively.
(3) D/A conversion of channel 0 or channel 1 can be started by setting bits 0 or 1 (DACE0 or DACE1) of DAM,
respectively.
(4) In the normal mode, the analog voltage signals are output to the ANO0/P130 and ANO1/P131 pins immediately
after D/A conversion. In the real-time output mode, the analog voltage signals are output synchronously with
the output triggers.
(5) In the normal mode, the analog voltage signals to be output are held until new data is set in DACS0 and DACS1.
In the realtime output mode, new data is set in DACS0 and DACS1 and then held until the next trigger is
generated.

Caution Set DACE0 and DACE1 after setting data in DACS0 and DACS1.

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15.5 D/A Converter Cautions

(1) Output impedance of D/A converter

Because the output impedance of the D/A converter is high, use of current flowing from the ANOn pins (n =
0,1) is prohibited. If the input impedance of the load for the converter is low, insert a buffer amplifier between
the load and the ANOn pins. In addition, wiring from the ANOn pins to the buffer amplifier or the load should
be as short as possible (because of high output impedance). If the wiring may be long, design the ground
pattern so as to be close to those lines or use some other expedient to achieve shorter wiring.

Figure 15-3. Use Example of Buffer Amplifier

(a) Inverting amplifier

µPD780058, 780058Y
Subseries C

R2

R1
ANOn

• The input impedance of the buffer amplifier is R1.

(b) Voltage-follower

µ PD780058, 780058Y
Subseries

R
ANOn

R1 C

• The input impedance of the buffer amplifier is R1 .

• If R1 is not connected, the output becomes
undefined when RESET is low.
(2) Output voltage of D/A converter
Because the output voltage of the converter changes in steps, use the D/A converter output signals in general
by connecting a low-pass filter.

(3) AVREF1 pin

When only one of the D/A converter channels is used with AVREF1 < VDD0, the other pins that are not used
as analog outputs must be set as follows:
• Set the PM13x bit of port mode register 13 (PM13) to 1 (input mode) and connect the pin to VSS0.
• Set the PM13x bit of port mode register 13 (PM13) to 0 (output mode) and the output latch to 0, and output
a low level from the pin.
When not using the D/A converter, use AVREF1 with its potential the same as that of the VDD0.

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The µPD780058 Subseries incorporates three serial interface channels. Differences between channels 0, 1,
and 2 are as follows (see CHAPTER 18 SERIAL INTERFACE CHANNEL 1 for details of serial interface channel
1 and CHAPTER 19 SERIAL INTERFACE CHANNEL 2 for details of serial interface channel 2).

Table 16-1. Differences Between Channels 0, 1, and 2

Serial Transfer Mode Channel 0 Channel 1 Channel 2

3-wire serial I/O Clock selection fXX/2, fXX/22, fXX/23, fXX/2, fXX/22, fXX/23, External clock, baud
fXX/24, fXX/25, fXX/26, fXX/24, fXX/25, fXX/26, rate generator output
fXX/27, fXX/28, external fXX/27, fXX/28, external
clock, TO2 output clock, TO2 output
Transfer method MSB/LSB switchable MSB/LSB switchable as MSB/LSB switchable as
as the start bit the start bit the start bit
Automatic transmit/
receive function
Transfer end flag Serial transfer end Serial transfer end Serial transfer end
interrupt request flag interrupt request flag interrupt request flag
(CSIIF0) (CSIIF1) (SRIF)

SBI (serial bus interface) Use possible None None

2-wire serial I/O

UART None Use possible
(Asynchronous serial interface) Time-division
transfer function

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16.1 Functions of Serial Interface Channel 0

Serial interface channel 0 employs the following four modes.

• Operation stop mode

• 3-wire serial I/O mode
• SBI (serial bus interface) mode
• 2-wire serial I/O mode

Caution Do not change the operating mode (3-wire serial I/O, 2-wire serial I/O, or SBI) while serial interface
channel 0 is enabled to operate. To change the operating mode, stop the serial operation first.

(1) Operation stop mode

This mode is used when serial transfer is not carried out. Power consumption can be reduced in this mode.

(2) 3-wire serial I/O mode (MSB-/LSB-first selectable)

This mode is used for 8-bit data transfer using three lines, one each for the serial clock (SCK0), serial output
(SO0) and serial input (SI0). This mode enables simultaneous transmission/reception and therefore reduces
the data transfer processing time.
The start bit of transferred 8-bit data is switchable between MSB and LSB, so that devices can be connected
regardless of their start bit recognition.
This mode should be used when connecting with peripheral I/O devices or display controllers which incorporate
a conventional clocked serial interface as is the case with the 75X/XL, 78K, and 17K Series.

(3) SBI (serial bus interface) mode (MSB-first)

This mode is used for 8-bit data transfer with two or more devices using the serial clock (SCK0) and serial
data bus (SB0 or SB1) lines (see Figure 16-1).
The SBI mode conforms to the NEC Electronics serial bus format, and transmits or receives three types of
transfer data: “addresses”, “commands”, and “data”.

• Address: Data to select the target device for serial communication

• Command: Data to give an instruction to the target device
• Data: Data actually transferred

Actually, the master device outputs an “address” to the serial bus to select one of the slave devices with which
the master device is to communicate. After that, “commands” and “data” are transmitted or received between
the master and slave devices (this is the serial transfer). The receiver can automatically identify the received
data as an “address”, “command”, or “data” by hardware.
This function enables the I/O ports to be used effectively and the serial interface control portions of the
application program to be simplified.
In this mode, the wakeup function for handshake and the output function of acknowledge and busy signals
can also be used.

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(4) 2-wire serial I/O mode (MSB-first)

This mode is used for 8-bit data transfer using the two lines of the serial clock (SCK0) and serial data bus
(SB0 or SB1).
This mode enables support of any one of the possible data transfer formats by controlling the SCK0 level and
the SB0 or SB1 output level. Thus, the handshake line previously necessary for connection of two or more
devices can be removed, resulting in an increased number of available I/O ports.

Figure 16-1. Serial Bus Interface (SBI) System Configuration Example

VDD0

Master CPU Slave CPU1

SCK0 SCK0

SB0 SB0

Slave CPU2

SCK0

SB0

Slave CPUn

SCK0

SB0

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16.2 Configuration of Serial Interface Channel 0

Serial interface channel 0 consists of the following hardware.

Table 16-2. Configuration of Serial Interface Channel 0

Item Configuration

Registers Serial I/O shift register 0 (SIO0)

Slave address register (SVA)
Control registers Timer clock select register 3 (TCL3)
Serial operating mode register 0 (CSIM0)
Serial bus interface control register (SBIC)
Interrupt timing specify register (SINT)
Port mode register 2 (PM2)Note

Note See Figure 6-5 Block Diagram of P20, P21, and P23 to P26 and Figure 6-6 Block Diagram of P22
and P27.

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Figure 16-2. Block Diagram of Serial Interface Channel 0

Internal bus

Serial bus interface

Serial operating mode register 0 control register
CSIM CSIM CSIM CSIM CSIM Slave address
CSIE0 COI WUP BSYE ACKD ACKE ACKT CMDD RELD CMDT RELT
04 03 02 01 00 register (SVA)
SVAM
Match

Controller

SI0/SB0/ Serial I/O shift CLR SET

P25 Selector D Q
P25 register 0 (SIO0)
PM25
Output latch
Output
control Busy/
SO0/SB1/ Selector acknowledge
P26 output circuit
PM26 Bus release/ ACKD
Output command/ CMDD WUP
control acknowledge
RELD Interrupt
detector
P26 Output latch request
CLD
signal INTCSI0
SCK0/ Serial clock
generator
P27 counter
PM27 TO2
Output Serial clock
control Selector Selector fXX/2 to fXX/28
controller

CSIM00 CSIM00 4
CSIM01 CSIM01

P27
Output latch

CLD SIC SVAM TCL33 TCL32 TCL31 TCL30

Interrupt timing Timer clock

specify register select
register 3

Internal bus

Remark The output control block performs selection between CMOS output and N-ch open-drain output.

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(1) Serial I/O shift register 0 (SIO0)

SIO0 is an 8-bit register used to carry out parallel/serial conversion and to carry out serial transmission/
reception (shift operation) in synchronization with the serial clock.
SIO0 is set with an 8-bit memory manipulation instruction.
When bit 7 (CSIE0) of serial operating mode register 0 (CSIM0) is 1, writing data to SIO0 starts a serial
operation.
In transmission, data written to SIO0 is output to the serial output (SO0) or serial data bus (SB0/SB1). In
reception, data is read from the serial input (SI0) or SB0/SB1 to SIO0.
Note that, if a bus is driven in the SBI mode or 2-wire serial I/O mode, the bus pins must serve for both input
and output. Thus, in the case of a device for reception, write FFH to SIO0 in advance (except when address
reception is carried out by setting bit 5 (WUP) of CSIM0 to 1).
In the SBI mode, the busy state can be cleared by writing data to SIO0. In this case, bit 7 (BSYE) of the serial
bus interface control register (SBIC) is not cleared to 0.
RESET input makes SIO0 undefined.

(2) Slave address register (SVA)

SVA is an 8-bit register used to set the slave address value for connection of a slave device to the serial bus.
The SVA is set with an 8-bit memory manipulation instruction. This register is not used in the 3-wire serial
I/O mode.
The master device outputs a slave address to the connected slave devices for selection of a particular slave
device. These two data (the slave address output from the master device and the SVA value) are compared
by an address comparator. If they match, the slave device has been selected. In that case, bit 6 (COI) of
serial operating mode register 0 (CSIM0) becomes 1.
Address comparison can also be executed on the data of LSB-masked higher 7 bits by setting bit 4 (SVAM)
of the interrupt timing specify register (SINT) to 1.
If no matching is detected in address reception, bit 2 (RELD) of the serial bus interface control register (SBIC)
is cleared to 0. In the SBI mode, the wakeup function can be used by setting bit 5 (WUP) of CSIM0 to 1. In
this case, the interrupt request signal (INTCSI0) is generated only when the slave address output by the master
matches with the SVA value, and it can be learned by this interrupt request that the master requests
communication. If bit 5 (SIC) of the interrupt timing specify register (SINT) is set to 1, the wakeup function
cannot be used even if WUP is set to 1 (an interrupt request signal is generated when bus release is detected).
To use the wakeup function, clear SIC to 0.
Further, an error can be detected by using SVA when the device transmits data as a master or slave device
in the SBI or 2-wire serial I/O mode.
RESET input makes SVA undefined.

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(3) SO0 latch

This latch holds the SI0/SB0/P25 and SO0/SB1/P26 pin levels. It can be directly controlled by software. In
the SBI mode, this latch is set upon termination of the 8th serial clock.

(4) Serial clock counter

This counter counts the serial clocks to be output and input during transmission/reception to check whether
8-bit data has been transmitted/received.

(5) Serial clock controller

This circuit controls serial clock supply to serial I/O shift register 0 (SIO0). When the internal system clock
is used, the circuit also controls clock output to the SCK0/P27 pin.

(6) Interrupt request signal generator

This circuit controls interrupt request signal generation. It generates an interrupt request signal in the following
cases.

• In the 3-wire serial I/O mode and 2-wire serial I/O mode
This circuit generates an interrupt request signal every eight serial clocks.

• In the SBI mode

When WUP is 0 ........... Generates an interrupt request signal every eight serial clocks.
When WUP is 1 ........... Generates an interrupt request signal when the serial I/O shift register 0 (SIO0)
value matches the slave address register (SVA) value after address reception.

Remark WUP is the wakeup function specification bit. It is bit 5 of serial operating mode register 0 (CSIM0).
When using the wakeup function (WUP = 1), clear bit 5 (SIC) of the interrupt timing specification
register (SINT) to 0.

(7) Busy/acknowledge output circuit and bus release/command/acknowledge detector

These two circuits output and detect various control signals in the SBI mode.
These do not operate in the 3-wire serial I/O mode and 2-wire serial I/O mode.

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16.3 Control Registers of Serial Interface Channel 0

The following four registers are used to control serial interface channel 0.

• Timer clock select register 3 (TCL3)

• Serial operating mode register 0 (CSIM0)
• Serial bus interface control register (SBIC)
• Interrupt timing specification register (SINT)

(1) Timer clock select register 3 (TCL3)

This register sets the serial clock of serial interface channel 0.
TCL3 is set with an 8-bit memory manipulation instruction.
RESET input sets TCL3 to 88H.

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Figure 16-3. Format of Timer Clock Select Register 3

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

TCL3 TCL37 TCL36 TCL35 TCL34 TCL33 TCL32 TCL31 TCL30 FF43H 88H R/W

TCL33 TCL32 TCL31 TCL30 Serial interface channel 0 serial clock selection

MCS = 1 MCS = 0

0 1 1 0 fXX/2 Setting prohibited fX/22 (1.25 MHz)

0 1 1 1 fXX/22 fX/22 (1.25 MHz) fX/23 (625 kHz)

1 0 0 0 fXX/23 fX/23 (625 kHz) fX/24 (313 kHz)

1 0 0 1 fXX/24 fX/24 (313 kHz) fX/25 (156 kHz)

1 0 1 0 fXX/25 fX/25 (156 kHz) fX/26 (78.1 kHz)

1 0 1 1 fXX/26 fX/26 (78.1 kHz) fX/27 (39.1 kHz)

1 1 0 0 fXX/27 fX/27 (39.1 kHz) fX/28 (19.5 kHz)

1 1 0 1 fXX/28 fX/28 (19.5 kHz) fX/29 (9.8 kHz)

Other than above Setting prohibited

TCL37 TCL36 TCL35 TCL34 Serial interface channel 1 serial clock selection

MCS = 1 MCS = 0

0 1 1 0 fXX/2 Setting prohibited fX/22 (1.25 MHz)

0 1 1 1 fXX/22 fX/22 (1.25 MHz) fX/23 (625 kHz)

1 0 0 0 fXX/23 fX/23 (625 kHz) fX/24 (313 kHz)

1 0 0 1 fXX/24 fX/24 (313 kHz) fX/25 (156 kHz)

1 0 1 0 fXX/25 fX/25 (156 kHz) fX/26 (78.1 kHz)

1 0 1 1 fXX/26 fX/26 (78.1 kHz) fX/27 (39.1 kHz)

1 1 0 0 fXX/27 fX/27 (39.1 kHz) fX/28 (19.5 kHz)

1 1 0 1 fXX/28 fX/28 (19.5 kHz) fX/29 (9.8 kHz)

Other than above Setting prohibited

Caution When rewriting TCL3 to other data, stop the serial transfer operation beforehand.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. MCS:Bit 0 of oscillation mode select register (OSMS)
4. Values in parentheses apply to operation with fX = 5.0 MHz.

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(2) Serial operating mode register 0 (CSIM0)

This register sets the serial interface channel 0 serial clock, operating mode, operation enable/stop wakeup
function and displays the address comparator match signal.
CSIM0 is set with a 1-bit or an 8-bit memory manipulation instruction.
RESET input clears CSIM0 to 00H.

Caution Do not change the operating mode (3-wire serial I/O, 2-wire serial I/O, or SBI) while serial
interface channel 0 is enabled to operate. To change the operating mode, stop the serial
operation first.

Figure 16-4. Format of Serial Operating Mode Register 0 (1/2)

Symbol <7> <6> <5> 4 3 2 1 0 Address After reset R/W

CSIM0 CSIE0 COI WUP CSIM04 CSIM03 CSIM02 CSIM01 CSIM00 FF60H 00H R/WNote 1

R/W CSIM01 CSIM00 Serial interface channel 0 clock selection

0 × Input clock to SCK0 pin from off-chip
1 0 8-bit timer register 2 (TM2) output
1 1 Clock specified by bits 0 to 3 of timer clock select register 3 (TCL3)

R/W CSIM CSIM CSIM PM25 P25 PM26 P26 PM27 P27 Operation Start bit SI0/SB0/P25 SO0/SB1/P26 SCK0/P27
04 03 02 mode pin function pin function pin function
Note 2 Note 2
0 × 0 1 × 0 0 0 1 3-wire serial MSB SI0Note 2 SO0 SCK0
1 l/O mode LSB (input) (CMOS output) (CMOS I/O)
Note 3 Note 3
1 0 0 × × 0 0 0 1 SBI mode MSB P25 SB1 SCK0
(CMOS I/O) (N-ch (CMOS I/O)
open-drain I/O)
Note 3 Note 3
1 0 0 × × 0 1 SB0 P26
(N-ch (CMOS I/O)
open-drain I/O)
Note 3 Note 3
1 1 0 × × 0 0 0 1 2-wire serial MSB P25 SB1 SCK0
l/O mode (CMOS I/O) (N-ch (N-ch
open-drain I/O) open-drain I/O)
Note 3 Note 3
1 0 0 × × 0 1 SB0 P26
(N-ch (CMOS I/O)
open-drain I/O)

(Cont’d)
Notes 1. Bit 6 (COI) is a read-only bit.
2. Can be used as P25 (CMOS I/O) when used only for transmission.
3. Can be used freely as a port function.

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

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Figure 16-4. Format of Serial Operating Mode Register 0 (2/2)

R/W WUP Wakeup function controlNote 1

0 Interrupt request signal generation with each serial transfer in any mode
1 Interrupt request signal generation when the address received after bus release (when CMDD = RELD = 1)
matches the slave address register (SVA) data in SBI mode

R COI Slave address comparison result flagNote 2

0 Slave address register (SVA) not equal to serial I/O shift register 0 (SIO0) data
1 Slave address register (SVA) equal to serial I/O shift register 0 (SIO0) data

R/W CSIE0 Serial interface channel 0 operation control

0 Operation stopped
1 Operation enabled

Notes 1. When using the wakeup function (WUP = 1), clear bit 5 (SIC) of the interrupt timing specification
register (SINT) to 0.
2. When CSIE0 = 0, COI becomes 0.

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(3) Serial bus interface control register (SBIC)

This register sets the serial bus interface operation and displays statuses.
SBIC is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SBIC to 00H.

Figure 16-5. Format of Serial Bus Interface Control Register (1/2)

Symbol <7> <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

SBIC BSYE ACKD ACKE ACKT CMDD RELD CMDT RELT FF61H 00H R/WNote

R/W RELT Used for bus release signal output.

When RELT = 1, the SO0 Iatch is set to 1. After the SO0 latch is set, is RELT automatically cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

R/W CMDT Used for command signal output.

When CMDT = 1, the SO0 Iatch is cleared to 0. After the SO0 latch is cleared, CMDT is automatically
cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

R RELD Bus release detection

Clear conditions (RELD = 0) Set conditions (RELD = 1)

• When transfer start instruction is executed • When bus release signal (REL) is detected
• If SIO0 and SVA values do not match in
address reception
• When CSIE0 = 0
• When RESET input is applied

R CMDD Command detection

Clear conditions (CMDD = 0) Set conditions (CMDD = 1)

• When transfer start instruction is executed • When command signal (CMD) is detected
• When bus release signal (REL) is detected
• When CSIE0 = 0
• When RESET input is applied

R/W ACKT The acknowledge signal is output in synchronization with the falling edge of the SCK0 clock just after
execution of the instruction that sets this bit to 1, and after acknowledge signal output, ACKT is automatically
cleared to 0.
ACKT is used with ACKE = 0. ACKT is also cleared to 0 upon start of serial interface transfer or when
CSIE0 = 0.

Note Bits 2, 3, and 6 (RELD, CMDD and ACKD) are read-only bits.

Remarks 1. Bits 0, 1, and 4 (RELT, CMDT, and ACKT) are 0 when read after data setting.
2. CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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Figure 16-5. Format of Serial Bus Interface Control Register (2/2)

R/W ACKE Acknowledge signal automatic output control

0 Acknowledge signal automatic output disable (output by ACKT enabled)

1 Before completion of The acknowledge signal is output in synchronization with the falling edge of the 9th
transfer SCK0 clock (automatically output when ACKE = 1).
After completion of The acknowledge signal is output in synchronization with the falling edge of
transfer SCK0 just after execution of the instruction that sets this bit to 1
(automatically output when ACKE = 1).
However, ACKE is not automatically cleared to 0 after acknowledge signal is output.

R ACKD Acknowledge detection

Clear conditions (ACKD = 0) Set conditions (ACKD = 1)

• Falling edge of SCK0 immediately after busy • When acknowledge signal (ACK) is detected at the
mode is released after executing the transfer rising edge of the SCK0 clock after completion of
start instruction
• When CSIE0 = 0 transfer
• When RESET input is applied

Note
R/W BSYE Synchronizing busy signal output control

0 Disable the busy signal which is output in synchronization with the falling edge the SCK0 clock just after
execution of the instruction that clears this bit to 0.

1 Output the busy signal at the falling edge of the SCK0 clock following the acknowledge signal.

Note The busy mode can be cleared by start of serial interface transfer. However, the BSYE flag is
not cleared to 0.

Remark CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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(4) Interrupt timing specification register (SINT)

This register sets the bus release interrupt and address mask functions and displays the SCK0/P27 pin level
status.
SINT is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SINT to 00H.

Figure 16-6. Format of Interrupt Timing Specification Register

Symbol 7 <6> <5> <4> 3 2 1 0 Address After reset R/W

SINT 0 CLD SIC SVAM 0 0 0 0 FF63H 00H R/WNote 1

R/W
SVAM SVA bit to be used as slave address
0 Bits 0 to 7
1 Bits 1 to 7

R/W
SIC INTCSI0 interrupt source selectionNote 2
0 CSIIF0 is set upon termination of serial interface
channel 0 transfer
1 CSIIF0 is set upon bus release detection or
termination of serial interface channel 0 transfer

R
CLD SCK0/P27 pin levelNote 3
0 Low level
1 High level

Notes 1. Bit 6 (CLD) is a read-only bit.

2. When using wakeup function in the SBI mode, clear SIC to 0.
3. When CSIE0 = 0, CLD becomes 0.

Caution Be sure to clear bits 0 to 3 to 0.

Remark SVA: Slave address register

CSIIF0: Interrupt request flag corresponding to INTCSI0
CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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16.4 Operations of Serial Interface Channel 0

The following four operating modes are available for serial interface channel 0.

• Operation stop mode

• 3-wire serial I/O mode
• SBI mode
• 2-wire serial I/O mode

16.4.1 Operation stop mode

Serial transfer is not carried out in the operation stop mode. Thus, power consumption can be reduced. Serial
I/O shift register 0 (SIO0) does not carry out shift operations either and thus it can be used as an ordinary 8-bit register.
In the operation stop mode, the P25/SI0/SB0, P26/SO0/SB1, and P27/SCK0 pins can be used as ordinary I/O ports.

(1) Register setting

The operation stop mode is set by serial operating mode register 0 (CSIM0).
CSIM0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM0 to 00H.

Symbol <7> <6> <5> 4 3 2 1 0 Address After reset R/W

CSIM0 CSIE0 COI WUP CSIM04 CSIM03 CSIM02 CSIM01 CSIM00 FF60H 00H R/W

R/W CSIE0 Serial interface channel 0 operation control

0 Operation stopped
1 Operation enabled

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16.4.2 3-wire serial I/O mode operation

The 3-wire serial I/O mode is valid for connection of peripheral I/O units and display controllers which incorporate
a conventional clocked serial interface as is the case with the 75X/XL, 78K, and 17K Series.
Communication is carried out with the three lines of the serial clock (SCK0), serial output (SO0), and serial input
(SI0).

(1) Register setting

The 3-wire serial I/O mode is set by serial operating mode register 0 (CSIM0) and the serial bus interface control
register (SBIC).

(a) Serial operating mode register 0 (CSIM0)

CSIM0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM0 to 00H.

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Symbol <7> <6> <5> 4 3 2 1 0 Address After reset R/W

CSIM0 CSIE0 COI WUP CSIM04 CSIM03 CSIM02 CSIM01 CSIM00 FF60H 00H R/WNote 1

R/W CSIM01 CSIM00 Serial interface channel 0 clock selection

0 × Input clock to SCK0 pin from off-chip
1 0 8-bit timer register 2 (TM2) output
1 1 Clock specified by bits 0 to 3 of timer clock select register 3 (TCL3)

R/W CSIM CSIM CSIM PM25 P25 PM26 P26 PM27 P27 Operation Start bit SIO/SB0/P25 SO0/SB1/P26 SCK0/P27
04 03 02 mode pin function pin function pin function
Note 2 Note 2
0 × 0 1 × 0 0 0 1 3-wire serial MSB SI0Note 2 SO0 SCK0
l/O mode (input) (CMOS output) (CMOS I/O)
1 LSB

1 0 SBI mode (see 16.4.3 SBI mode operation.)

1 1 2-wire serial I/O mode (see 16.4.4 2-wire serial I/O mode operation.)

R/W WUP Wakeup function controlNote 3

0 Interrupt request signal generation with each serial transfer in any mode
1 Interrupt request signal generation when the address received after bus release
(when CMDD = RELD = 1) matches the slave address register data in SBI mode

R/W CSIE0 Serial interface channel 0 operation control

0 Operation stopped
1 Operation enabled

Notes 1. Bit 6 (COI) is a read-only bit.

2. Can be used as P25 (CMOS input/output) when used only for transmission.
3. Be sure to clear WUP to 0 when the 3-wire serial I/O mode is selected.

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

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(b) Serial bus interface control register (SBIC)

SBIC is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SBIC to 00H.

Symbol <7> <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

SBIC BSYE ACKD ACKE ACKT CMDD RELD CMDT RELT FF61H 00H R/W

R/W RELT When RELT = 1, the SO0 Iatch is set to 1. After the SO0 Iatch is set, RELT is automatically cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

R/W CMDT When CMDT = 1, the SO0 Iatch is cleared to 0. After the SO0 latch is cleared, CMDT is automatically
cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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(2) Communication operation

The 3-wire serial I/O mode is used for data transmission/reception in 8-bit units. Data transmission/reception
is carried out bit-wise in synchronization with the serial clock.
Shift operations of serial I/O shift register 0 (SIO0) are carried out at the falling edge of the serial clock (SCK0).
The transmitted data is held in the SO0 latch and is output from the SO0 pin. The received data input to the
SI0 pin is latched in SIO0 at the rising edge of SCK0.
Upon termination of 8-bit transfer, SIO0 operation stops automatically and the interrupt request flag (CSIIF0)
is set.

Figure 16-7. 3-Wire Serial I/O Mode Timing

SCK0 1 2 3 4 5 6 7 8

SI0 DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0

SO0 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0

CSIIF0

End of transfer
Transfer start at the falling edge of SCK0

The SO0 pin is a CMOS output pin and outputs the current SO0 latch status. Thus, the SO0 pin output status
can be manipulated by setting bit 0 (RELT) and bit 1 (CMDT) of the serial bus interface control register (SBIC).
However, do not carry out this manipulation during serial transfer.
Control the SCK0 pin output level in the output mode (internal system clock mode) by manipulating the P27
output latch (see 16.4.5 SCK0/P27 pin output manipulation).

(3) Other signals

Figure 16-8 shows the RELT and CMDT operations.

Figure 16-8. RELT and CMDT Operations

SO0 latch

RELT

CMDT

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(4) MSB/LSB switching as the start bit

In the 3-wire serial I/O mode, it is possible to select transfer to start from the MSB or LSB.
Figure 16-9 shows the configuration of serial I/O shift register 0 (SIO0) and the internal bus. As shown in the
figure, the MSB/LSB can be read or written in reverse form.
MSB/LSB switching as the start bit can be specified by bit 2 (CSIM02) of serial operating mode register 0
(CSIM0).

Figure 16-9. Circuit for Switching Transfer Bit Order

7
6
Internal bus
1
0
LSB-first
MSB-first Read/write gate Read/write gate

SO0 latch
SI0 Serial I/O shift register 0 (SIO0) D Q

SO0

SCK0

Start bit switching is realized by switching the bit order for data write to SIO0. The SIO0 shift order remains
unchanged.
Thus, switching between MSB-first and LSB-first must be performed before writing data to SIO0.

(5) Transfer start

Serial transfer is started by setting transfer data to serial I/O shift register 0 (SIO0) when the following two
conditions are satisfied.

• Serial interface channel 0 operation control bit (CSIE0) = 1.

• Internal serial clock is stopped or SCK0 is a high level after 8-bit serial transfer.

Caution If CSIE0 is set to 1 after data write to SIO0, transfer does not start.

Upon termination of 8-bit transfer, serial transfer automatically stops and the interrupt request flag (CSIIF0)
is set.

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16.4.3 SBI mode operation

SBI (Serial Bus Interface) is a high-speed serial interface that complies with the NEC Electronics serial bus format.
SBI uses a single master device and employs a clocked serial I/O format with the addition of a bus configuration
function. This function enables devices to communicate using only two lines. Thus, when making up a serial bus
with two or more microcontrollers and peripheral ICs, the number of ports to be used and the number of wires on
the board can be decreased.
The master device outputs three kinds of data to slave devices on the serial data bus: “addresses” to select a device
to be communicated with, “commands” to instruct the selected device, and “data” which is actually required.
The slave device can identify the received data as “address”, “command”, or “data” by hardware. An application
program that controls serial interface channel 0 can be simplified by using this function.
The SBI function is incorporated into various devices including the 75X/XL Series and 78K Series.
Figure 16-10 shows a serial bus configuration example when a CPU having a serial interface compliant with SBI
and peripheral ICs are used.
In SBI, the SB0 (SB1) serial data bus pin is an open-drain output pin and therefore the serial data bus line behaves
in the same way as a wired-OR configuration. In addition, a pull-up resistor must be connected to the serial data
bus line.
When the SBI mode is used, see (11) SBI mode precautions (d) described later.

Figure 16-10. Example of Serial Bus Configuration with SBI

VDD0

Serial clock
SCK0 SCK0 Slave CPU
Master CPU
Serial data bus
SB0 (SB1) SB0 (SB1) Address 1

SCK0 Slave CPU

SB0 (SB1) Address 2

• •
• •
• •

SCK0 Slave IC

SB0 (SB1) Address N

Caution When exchanging the master CPU/slave CPU, a pull-up resistor is necessary for the serial clock
line (SCK0) as well because serial clock line (SCK0) input/output switching is carried out
asynchronously between the master and slave CPUs.

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(1) SBI functions

In the conventional serial I/O format, when a serial bus is configured by connecting two or more devices, many
ports and wiring are necessary to provide chip select signals to identify commands and data, and to judge
the busy state, because only the data transfer function is available. If these operations are to be controlled
by software, the software load becomes very heavy.
In SBI, a serial bus can be configured with the two signal lines of the serial clock SCK0 and serial data bus
SB0 (SB1). Thus, use of SBI leads to a reduction in the number of microcontroller ports and the amount of
wiring and routing on the board.
The SBI functions are described below.

(a) Address/command/data identification function

Serial data is distinguished as addresses, commands, and data.

(b) Chip select function by address transmission

The master executes slave chip selection by address transmission.

(c) Wakeup function

The slave can easily judge address reception (chip select judgment) using the wakeup function (which
can be set/reset by software).
When the wakeup function is set, the interrupt request signal (INTCSI0) is generated upon reception of
a match address.
Thus, when communication is executed with two or more devices, the CPU except the selected slave
device can operate regardless of serial communications.

(d) Acknowledge signal (ACK) control function

The acknowledge signal used to check serial data reception is controlled.

(e) Busy signal (BUSY) control function

The busy signal used to report the slave busy state is controlled.

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(2) SBI definition

The SBI serial data format and the signals to be used are defined as follows.
Serial data to be transferred by SBI consists of three kinds of data: “address”, “command”, and “data”.
Figure 16-11 shows the address, command, and data transfer timing.

Figure 16-11. SBI Transfer Timing

Address transfer

SCK0 8 9

SB0 (SB1) A7 A0 ACK BUSY

Bus release
signal Address
Command transfer
Command signal

SCK0 9

SB0 (SB1) C7 C0 ACK BUSY READY

Command

Data transfer

SCK0 8 9

SB0 (SB1) D7 D0 ACK BUSY READY

Data

Remark The broken lines indicate the READY status.

The bus release signal and the command signal are output by the master device. BUSY is output by the slave
device. ACK can be output by either the master or slave device (normally, the 8-bit data receiver outputs).
Serial clocks continue to be output by the master device from 8-bit data transfer start to BUSY reset.

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(a) Bus release signal (REL)

The bus release signal is recognized when the SB0 (SB1) line changes from low level to high level when
the SCK0 line is at high level (without serial clock output).
This signal is output by the master device.

Figure 16-12. Bus Release Signal

SCK0 “H”

SB0 (SB1)

The bus release signal indicates that the master device is going to transmit an address to the slave device.
The slave device incorporates hardware to detect the bus release signal.

Caution The transition of the SB0 (SB1) line from low to high when the SCK0 line is high is
recognized as a bus release signal. If the transition timing of the bus is shifted due to
the influence of board capacitance, transmitted data may be judged as a bus release
signal. Exercise care in wiring so that noise is not superimposed on the signal lines.

(b) Command signal (CMD)

The command signal is recognized when the SB0 (SB1) line changes from high level to low level when
the SCK0 line is at high level (without serial clock output). This signal is output by the master device.

Figure 16-13. Command Signal

SCK0 “H”

SB0 (SB1)

The command signal indicates that the master is going to transmit a command to the slave (however,
a command signal following a bus release signal indicates that an address is transmitted).
The slave device incorporates hardware to detect the command signal.

Caution The transition of the SB0 (SB1) line from high to low when the SCK0 line is high is
recognized as a command signal. If the transition timing of the bus is shifted due to the
influence of board capacitance, transmitted data may be judged as a command signal.
Exercise care in wiring so that noise is not superimposed on the signal lines.

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(c) Address
An address is 8-bit data which the master device outputs to the slave devices connected to the bus line
in order to select a particular slave device.

Figure 16-14. Addresses

SCK0 1 2 3 4 5 6 7 8

SB0 (SB1) A7 A6 A5 A4 A3 A2 A1 A0

Address
Bus release
signal Command signal

8-bit data following bus release and command signals is defined as an “address”. In the slave device,
this condition is detected by hardware and whether or not 8-bit data matches the own specification number
(slave address) is checked by hardware. If the 8-bit data matches the slave address, the slave device
has been selected. After that, communication with the master device continues until a release instruction
is received from the master device.

Figure 16-15. Slave Selection by Address

Master Slave 1 Not selected

Slave 2
Address transmission
Slave 2 Selected

Slave 3 Not selected

Slave 4 Not selected

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(d) Commands and data

The master device transmits commands to, and transmits/receives data to/from the slave device selected
by address transmission.

Figure 16-16. Commands

SCK0 1 2 3 4 5 6 7 8

SB0 (SB1) C7 C6 C5 C4 C3 C2 C1 C0

Command signal Command

Figure 16-17. Data

SCK0 1 2 3 4 5 6 7 8

SB0 (SB1) D7 D6 D5 D4 D3 D2 D1 D0

Data

8-bit data following a command signal is defined as “command” data. 8-bit data without a command signal
is defined as “data”. Command and data operation procedures can be determined by the user according
to their communication specifications.

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(e) Acknowledge signal (ACK)

The acknowledge signal is used to check serial data reception between the transmitter and receiver.

Figure 16-18. Acknowledge Signal

[When output in synchronization with 11th SCK0 clock]

SCK0 8 9 10 11

SB0 (SB1) ACK

[When output in synchronization with 9th SCK0 clock]

SCK0 8 9

SB0 (SB1) ACK

Remark The broken lines indicate the READY status.

The acknowledge signal is one-shot pulse generated at the falling edge of SCK0 after 8-bit data transfer.
It can be positioned anywhere and can be synchronized with any SCK0 clock.
After 8-bit data transmission, the transmitter checks whether the receiver has returned the acknowledge
signal. If the acknowledge signal is not returned for the preset period of time after data transmission,
it can be judged that data reception has not been carried out correctly.

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(f) Busy signal (BUSY) and ready signal (READY)

The BUSY signal is used to report to the master device that the slave device is not ready for data
transmission/reception.
The READY signal is used to report to the master device that the slave device is ready for data
transmission/reception.

Figure 16-19. BUSY and READY Signals

SCK0 8 9

SB0 (SB1) ACK BUSY READY

In SBI, the slave device notifies the master device of the busy state by setting the SB0 (SB1) line to low
level.
BUSY signal output follows acknowledge signal output from the master or slave device. It is set/reset
at the falling edge of SCK0. When the BUSY signal is reset, the master device automatically terminates
the output of the SCK0 serial clock.
When the BUSY signal is reset and the READY signal is set, the master device can start the next transfer.

Caution In the SBI mode, the BUSY signal is output until the next serial clock (SCK0) falls after
a command that resets the BUSY signal has been issued. If WUP is set to 1 during this
period by mistake, the BUSY signal is not reset. Therefore, be sure to confirm that the
SB0 (SB1) pin has gone high after resetting the BUSY signal, by setting WUP to 1.

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(3) Register setting

The SBI mode is set by serial operating mode register 0 (CSIM0), the serial bus interface control register
(SBIC), and the interrupt timing specification register (SINT).

(a) Serial operating mode register 0 (CSIM0)

CSIM0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM0 to 00H.

Symbol <7> <6> <5> 4 3 2 1 0 Address After reset R/W

CSIM0 CSIE0 COI WUP CSIM04 CSIM03 CSIM02 CSIM01 CSIM00 FF60H 00H R/WNote 1

R/W CSIM01 CSIM00 Serial interface channel 0 clock selection

0 × Input clock to SCK0 pin from off-chip
1 0 8-bit timer register 2 (TM2) output
1 1 Clock specified with bits 0 to 3 of timer clock select register 3 (TCL3)

R/W CSIM CSIM CSIM PM25 P25 PM26 P26 PM27 P27 Operation Start bit SI0/SB0/P25 SO0/SB1/P26 SCK0/P27
04 03 02 mode pin function pin function pin function

0 × 3-wire serial I/O mode (see 16.4.2 3-wire serial I/O mode operation.)
Note 2 Note 2
1 0 0 × × 0 0 0 1 SBI mode MSB P25 SB1 SCK0
(CMOS I/O) (N-ch (CMOS I/O)
open-drain I/O)
Note 2 Note 2
1 0 0 × × 0 1 SB0 P26
(N-ch (CMOS I/O)
open-drain I/O)

1 1 2-wire serial I/O mode (see 16.4.4 2-wire serial I/O mode operation.)

Note 3
R/W WUP Wakeup function control
0 Interrupt request signal generation with each serial transfer in any mode
1 Interrupt request signal generation when the address received after bus release
(when CMDD = RELD = 1) matches the slave address register (SVA) data in SBI mode

Note 4
R COI Slave address comparison result flag
0 Slave address register (SVA) not equal to serial I/O shift register 0 (SIO0) data
1 Slave address register (SVA) equal to serial I/O shift register 0 (SIO0) data

R/W CSIE0 Serial interface channel 0 operation control

0 Operation stopped
1 Operation enabled

Notes 1. Bit 6 (COI) is a read-only bit.

2. Can be used as a port function.
3. When using the wakeup function (WUP = 1), clear bit 5 (SIC) of the interrupt timing specification
register (SINT) to 0.
4. When CSIE0 = 0, COI becomes 0.

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch
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 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

(b) Serial bus interface control register (SBIC)

SBIC is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SBIC to 00H.

Symbol <7> <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

SBIC BSYE ACKD ACKE ACKT CMDD RELD CMDT RELT FF61H 00H R/WNote

R/W RELT Used for bus release signal output.

When RELT = 1, the SO0 Iatch is set to 1. After the SO0 latch is set, RELT is automatically cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

R/W CMDT Used for command signal output.

When CMDT = 1, the SO0 Iatch is cleared to 0. After the SO0 latch is cleared, CMDT is automatically
cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

R RELD Bus release detection

Clear conditions (RELD = 0) Set conditions (RELD = 1)

• When transfer start instruction is executed • When bus release signal (REL) is detected
• If SIO0 and SVA values do not match in address
reception (only when WUP = 1)
• When CSIE0 = 0
• When RESET input is applied

R CMDD Command detection

Clear conditions (CMDD = 0) Set conditions (CMDD = 1)

• When transfer start instruction is executed • When command signal (CMD) is detected
• When bus release signal (REL) is detected
• When CSIE0 = 0
• When RESET input is applied

R/W ACKT The acknowledge signal is output in synchronization with the falling edge of the SCK0 clock just after
execution of the instruction that sets this bit to 1 and, after acknowledge signal output, ACKT is automatically
cleared to 0.
ACKT is used with ACKE = 0. ACKT is also cleared to 0 upon start of serial interface transfer or when
CSIE0 = 0.

R/W ACKE Acknowledge signal automatic output control

0 Acknowledge signal automatic output disable (output by ACKT enabled)

1 Before completion of The acknowledge signal is output in synchronization with the falling edge of the 9th
transfer SCK0 clock (automatically output when ACKE = 1).
After completion of The acknowledge signal is output in synchronization with falling edge of the SCK0
transfer clock just after execution of the instruction that sets this bit to 1
(automatically output when ACKE = 1).
However, ACKE is not automatically cleared to 0 after acknowledge signal output.

(Cont’d)
Note Bits 2, 3, and 6 (RELD, CMDD and ACKD) are read-only bits.

Remarks 1. Bits 0, 1, and 4 (RELT, CMDT, and ACKT) are 0 when read after data setting.
2. CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

R ACKD Acknowledge detection

Clear conditions (ACKD = 0) Set conditions (ACKD = 1)

• When SCK0 falls immediately after busy mode is • When the acknowledge signal (ACK) is detected at the
released after transfer start instruction execution. rising edge of the SCK0 clock after completion of
• When CSIE0 = 0 transfer
• When RESET input is applied

Note
R/W Synchronizing busy signal output control
BSYE
0 Disable the busy signal which is output in synchronization with the falling edge of SCK0 clock just after
execution of the instruction that clears this bit to 0 (set READY status).

1 Output the busy signal at the falling edge of the SCK0 clock following the acknowledge signal.

Note Busy mode can be cleared by start of serial interface transfer. However, the BSYE flag is not
cleared to 0.

Remark CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

(c) Interrupt timing specification register (SINT)

SINT is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SINT to 00H.

Symbol 7 <6> <5> <4> 3 2 1 0 Address After reset R/W

SINT 0 CLD SIC SVAM 0 0 0 0 FF63H 00H R/WNote 1

R/W
SVAM SVA bit to be used as slave address
0 Bits 0 to 7
1 Bits 1 to 7

R/W
SIC INTCSI0 interrupt source selectionNote 2

0 CSIIF0 is set upon termination of serial interface

channel 0 transfer

1 CSIIF0 is set upon bus release detection or

termination of serial interface channel 0 transfer

R
CLD SCK0/P27 pin levelNote 3
0 Low level
1 High level

Caution Be sure to clear bits 0 to 3 to 0.

Notes 1. Bit 6 (CLD) is a read-only bit.

2. When using wakeup function in the SBI mode, clear SIC to 0.
3. When CSIE0 = 0, CLD becomes 0.

Remark SVA: Slave address register

CSIIF0: Interrupt request flag corresponding to INTCSI0
CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

(4) Various signals

Figures 16-20 to 16-25 show various signals and flag operations in SBI. Table 16-3 lists various signals in
SBI.

Figure 16-20. RELT, CMDT, RELD, and CMDD Operations (Master)

Slave address write to SIO0

(transfer start instruction)

SIO0

SCK0

SB0 (SB1)

RELT

CMDT

RELD

CMDD

Figure 16-21. RELD and CMDD Operations (Slave)

Write FFH to SIO0

(transfer start instruction) Transfer start instruction

SIO0 A7 A6 A1 A0

SCK0 1 2 7 8 9
READY
SB0 (SB1) A7 A6 A1 A0 ACK

Slave address When addresses match

RELD

When addresses do not match

CMDD

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 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

Figure 16-22. ACKT Operation

SCK0 6 7 8 9

SB0 (SB1) D2 D1 D0 ACK ACK signal is output for

a period of one clock
just after setting
ACKT

If ACKT is set
during this period

Caution Do not set ACKT before completion of transfer.

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 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

Figure 16-23. ACKE Operations

(a) When ACKE = 1 upon completion of transfer

SCK0 1 2 7 8 9

SB0 (SB1) D7 D6 D2 D1 D0 ACK ACK signal is output

at 9th clock

ACKE

When ACKE = 1 at this point

(b) When set after completion of transfer

SCK0 6 7 8 9

SB0 (SB1) D2 D1 D0 ACK ACK signal is output for

a period of one clock
just after setting
ACKE

If ACKE is set during this period and it is

still 1 at the falling edge of the next SCK0

(c) When ACKE = 0 upon completion of transfer

SCK0 1 2 7 8 9

SB0 (SB1) D7 D6 D2 D1 D0 ACK signal is not output

ACKE

When ACKE = 0 at this point

(d) When ACKE = 1 period is short

SCK0

SB0 (SB1) D2 D1 D0 ACK signal is not output

ACKE

If ACKE is set and then cleared during this

period and it is still 0 at the falling edge of SCK0

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 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

Figure 16-24. ACKD Operations

(a) When ACK signal is output at 9th SCK0 clock

Transfer Start
Instruction
SIO0
Transfer Start
SCK0 6 7 8 9

SB0 (SB1) D2 D1 D0 ACK

ACKD

(b) When ACK signal is output after 9th SCK0 clock

Transfer start
instruction
SIO0
Transfer start
SCK0 6 7 8 9

SB0 (SB1) D2 D1 D0 ACK

ACKD

(c) Clear timing when transfer start is instructed during BUSY

Transfer start
instruction
SIO0

SCK0 6 7 8 9

SB0 (SB1) D2 D1 D0 ACK BUSY D7 D6

ACKD

Figure 16-25. BSYE Operation

SCK0 6 7 8 9

SB0 (SB1) D2 D1 D0 ACK BUSY

BSYE

If BSYE is reset during this period and

When BSYE = 1 at this point
it is still 0 at the falling edge of SCK0

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 Table 16-3. Various Signals in SBI Mode (1/2)

Output Output
Signal Name Definition Timing Chart Effects on Flag Meaning of Signal
Device Conditions

Bus release Master SB0 (SB1) rising edge • RELT set • RELD set CMD signal is output
SCK0 “H”
signal when SCK0 = 1 • CMDD clear to indicate that
(REL) transmit data is an
SB0 (SB1)

CHAPTER 16
address.

Command Master SB0 (SB1) falling edge • CMDT set • CMDD set i) Transmit data is an
signal when SCK0 = 1 address after REL
(CMD) SCK0 “H” signal output.
ii) REL signal is not

SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

SB0 (SB1) output and trans-
mit data is an
User's Manual U12013EJ3V2UD

command.

Acknowledge Master/ Low-level signal output to 1 ACKE = 1 • ACKD set Completion of

signal slave SB0 (SB1) during one- 2 ACKT set reception
(ACK) clock period of SCK0 after
completion of serial
reception [Synchronous BUSY output]

Busy signal Slave [Synchronous BUSY signal] • BSYE = 1 — Serial receive

(BUSY) Low-level signal output to disabled because of
SB0 (SB1) following SCK0 9 processing
acknowledge signal ACK BUSY
SB0 (SB1) D0 READY
Ready signal Slave High-level signal output to 1 BSYE = 0 — Serial receive
ACK BUSY
(READY) SB0 (SB1) before serial 2 Execution of enabled
SB0 (SB1) D0 READY
transfer start and after instruction for
completion of serial data write to
transfer SIO0
(transfer start
instruction)
317
318

Table 16-3. Various Signals in SBI Mode (2/2)

Output Output
Signal Name Definition Timing Chart Effects on Flag Meaning of Signal
Device Conditions

Serial clock Master Synchronous clock to output When CSIE0 = 1, CSIIF0 set (rising Timing of signal
(SCK0) address/command/data, execution of edge of 9th clock output to serial data
ACK signal, synchronous SCK0 1 2 7 8 9 10 instruction for of SCK0)Note 1 bus

CHAPTER 16
BUSY signal, etc. Address/ data write to
command/data is transferred SB0 (SB1) SIO0 (serial
with the first eight transfer start
synchronous clocks. instruction)Note 2

Address Master 8-bit data transferred in Address value of

SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

(A7 to A0) synchronization with SCK0 SCK0 1 2 7 8 slave device on the
after output of REL and serial bus
User's Manual U12013EJ3V2UD

CMD signals SB0 (SB1)

REL CMD

Command Master 8-bit data transferred in Instructions and

(C7 to C0) synchronization with SCK0 SCK0 1 2 7 8 messages to the
after output of only CMD slave device
signal without REL signal SB0 (SB1)
output
CMD

Data Master/ 8-bit data transferred in Numeric values to be

(D7 to D0) slave synchronization with SCK0 1 2 7 8 processed by slave
SCK0
without output of REL and or master device
CMD signals
SB0 (SB1)

Notes 1. When WUP = 0, CSIIF0 is set at the rising edge of the 9th clock of SCK0.
When WUP = 1, an address is received. Only when the address matches the slave address register (SVA) value, CSIIF0 is set (if the address does not
match the value of SVA, RELD is cleared).
2. In the BUSY state, transfer starts after the READY state is set.
 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

(5) Pin configuration

The serial clock pin SCK0 and serial data bus pin SB0 (SB1) have the following configurations.

(a) SCK0 ............ Serial clock I/O pin

1 Master ... CMOS and push-pull output
2 Slave ...... Schmitt input
(b) SB0 (SB1) .... Serial data I/O alternate-function pin
Both master and slave devices have an N-ch open-drain output and a Schmitt input.

Because the serial data bus line has an N-ch open-drain output, an external pull-up resistor is necessary.

Figure 16-26. Pin Configuration

Slave device

Master service

SCK0 SCK0 (Clock output)

Clock output Clock input

Serial clock

(Clock input)
VDD0

N-ch open-drain RL N-ch open-drain

SB0 (SB1) SB0 (SB1)

SO0 Serial data bus SO0

VSS0 VSS0

SI0 SI0

Caution Because the N-ch open-drain output must made to go into a high-impedance state during
data reception, write FFH to serial I/O shift register 0 (SIO0) in advance. The N-ch open-drain
output can always go into a high-impedance state during transfer. However, when the wake-
up function specification bit (WUP) = 1, the N-ch open-drain output always goes into a high-
impedance state. Thus, it is not necessary to write FFH to SIO0 before reception.

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 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

(6) Address match detection method

In the SBI mode, the master transmits a slave address to select a specific slave device.
A match of the addresses can be automatically detected by hardware. CSIIF0 is set only when the slave
address transmitted by the master matches the address set to SVA when the wakeup function specification
bit (WUP) = 1.
If bit 5 (SIC) of the interrupt timing specify register (SINT) is set, the wakeup function cannot be used even
if WUP is set (an interrupt request signal is generated when bus release is detected). To use the wake-up
function, clear SIC to 0.

Cautions 1. Slave selection/non-selection is detected by matching of the slave address received after
bus release (RELD = 1).
For this match detection, the match interrupt request (INTCSI0) of the address to be
generated with WUP = 1 is normally used. Thus, execute selection/non-selection
detection by slave address when WUP = 1.
2. When detecting selection/non-selection without the use of an interrupt request with WUP
= 0, do so by means of transmission/reception of the command preset by program instead
of using the address match detection method.

(7) Error detection

In the SBI mode, the serial bus SB0 (SB1) status being transmitted is fetched into the destination device, that
is, serial I/O shift register 0 (SIO0). Thus, transmit errors can be detected in the following ways.

(a) Method of comparing SIO0 data before and after transmission

In this case, if the two data differ from each other, a transmit error is judged to have occurred.

(b) Method of using the slave address register (SVA)

Transmit data is set to both SIO0 and SVA and is transmitted. After termination of transmission, the COI
bit (match signal coming from the address comparator) of serial operating mode register 0 (CSIM0) is
tested. If “1”, normal transmission is judged to have been carried out. If “0”, a transmit error is judged
to have occurred.

(8) Communication operation

In the SBI mode, the master device normally selects one slave device as the communication target from among
two or more devices by outputting an “address” to the serial bus.
After the communication target device has been determined, commands and data are transmitted/received
and serial communication is realized between the master and slave device.
Figures 16-27 to 16-30 show data communication timing charts.
Shift operations of serial I/O shift register 0 (SIO0) are carried out at the falling edge of the serial clock (SCK0).
Transmit data is latched into the SO0 latch and is output with the MSB set as the first bit from the SB0/P25
or SB1/P26 pin. Receive data input to the SB0 (or SB1) pin at the rising edge of SCK0 is latched into SIO0.

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 Figure 16-27. Address Transmission from Master Device to Slave Device (WUP = 1)

Master device processing (transmitter)

CMDT RELT CMDT Write Interrupt servicing

Program processing set set set
to SIO0 (preparation for the next serial transfer)

CHAPTER 16
Hardware operation Serial transmission INTCSI0 ACKD SCK0
generation set stop

SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

Transfer line

SCK0 pin 1 2 3 4 5 6 7 8 9
User's Manual U12013EJ3V2UD

SB0 (SB1) pin A7 A6 A5 A4 A3 A2 A1 A0 ACK BUSY READY

Address

Slave device processing (receiver)

ACKT BUSY
Program processing WUP←0 set clear

Hardware operation CMDD CMDD CMDD

Serial reception INTCSI0 ACK BUSY BUSY
set clear set generation output output clear
RELD
set
(When SVA = SIO0)
321
322

Figure 16-28. Command Transmission from Master Device to Slave Device

Master device processing (transmitter)

CMDT Write Interrupt servicing

Program processing set
to SIO0 (preparation for the next serial transfer)

CHAPTER 16
Hardware operation Serial transmission INTCSI0 ACKD SCK0
generation set stop

SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

Transfer line

SCK0 pin 1 2 3 4 5 6 7 8 9
User's Manual U12013EJ3V2UD

SB0 (SB1) pin C7 C6 C5 C4 C3 C2 C1 C0 ACK BUSY READY

Command

Slave device processing (receiver)

SIO0 Command ACKT BUSY

Program processing read analysis set clear

Hardware operation CMDD

Serial reception INTCSI0 ACK BUSY BUSY
set generation output output clear
 Figure 16-29. Data Transmission from Master Device to Slave Device

Master device processing (transmitter)

Write Interrupt servicing

Program processing
to SIO0 (preparation for the next serial transfer)

CHAPTER 16
Hardware operation Serial transmission INTCSI0 ACKD SCK0
generation set stop

SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

Transfer line

SCK0 pin 1 2 3 4 5 6 7 8 9
User's Manual U12013EJ3V2UD

SB0 (SB1) pin D7 D6 D5 D4 D3 D2 D1 D0 ACK BUSY READY

Data

Slave device processing (receiver)

SIO0 ACKT BUSY

Program processing read set clear

Hardware operation Serial reception INTCSI0 ACK BUSY BUSY

generation output output clear
323
324

Figure 16-30. Data Transmission from Slave Device to Master Device

Master device processing (receiver)

Program processing FFH write SIO0 ACKT FFH Write Receive data processing
to SIO0 read set to SIO0

CHAPTER 16
SCK0 INTCSI0 ACK Serial
Hardware operation Serial reception reception
stop generation output

SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

Transfer line

SCK0 pin 1 2 3 4 5 6 7 8 9 1 2
User's Manual U12013EJ3V2UD

SB0 (SB1) pin BUSY READY D7 D6 D5 D4 D3 D2 D1 D0 ACK BUSY D7 D6

READY

Data

Slave device processing (transmitter)

Write Write
Program processing to SIO0 to SIO0

Hardware operation BUSY Serial transmission INTCSI0 ACKD BUSY BUSY

clear generation set output clear
 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

(9) Transfer start

Serial transfer is started by setting transfer data to serial I/O shift register 0 (SIO0) when the following two
conditions are satisfied.

• Serial interface channel 0 operation control bit (CSIE0) = 1

• Internal serial clock is stopped or SCK0 is at high level after 8-bit serial transfer.

Cautions 1. If CSIE0 is set to “1” after data write to SIO0, transfer does not start.
2. Because the N-ch open-drain output must go into a high-impedance state during data
reception, write FFH to SIO0 in advance.
However, when the wakeup function specification bit (WUP) = 1, the N-ch open-drain
output always goes into a high-impedance state. Thus, it is not necessary to write FFH
to SIO0 before reception.
3. If data is written to SIO0 when the slave is busy, the data is not lost.
When the busy state is cleared and SB0 (or SB1) input is set to the high level (READY)
state, transfer starts.

Upon termination of 8-bit transfer, serial transfer automatically stops and the interrupt request flag (CSIIF0)
is set.
For pins that are to be used for data I/O, be sure to carry out the following settings before serial transfer of
the 1st byte after RESET input.

<1> Set the P25 and P26 output latches to 1.

<2> Set bit 0 (RELT) of the serial bus interface control register (SBIC) to 1.
<3> Reset the P25 and P26 output latches from 1 to 0.

(10) Judging busy state of slave

When the device is in the master mode, follow the procedure below to judge whether the slave device is in
the busy state or not.

<1> Detect acknowledge signal (ACK) or interrupt request signal generation.

<2> Set the port mode register PM25 (or PM26) of the SB0/P25 (or SB1/P26) pin to the input mode.
<3> Read out the pin state (when the pin level is high, the READY state is set).

After detection of the READY state, clear the port mode register to 0 and return to the output mode.

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 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

(11) SBI mode precautions

(a) Slave selection/non-selection is detected by match detection of the slave address received after bus
release (RELD = 1).
For this match detection, the match interrupt request (INTCSI0) of the address to be generated with WUP
= 1 is normally used. Thus, execute selection/non-selection detection by slave address when WUP =
1.

(b) When detecting selection/non-selection without the use of an interrupt with WUP = 0, do so by means
of transmission/reception of the command preset by program instead of using the address match detection
method.

(c) In the SBI mode, the BUSY signal is output until the next serial clock falls after a command that resets
the BUSY signal has been issued. If WUP is set to 1 during this period by mistake, the BUSY signal is
not reset. Therefore, be sure to confirm that the SB0 (SB1) pin has gone high after resetting the BUSY
signal, by setting WUP to 1.

(d) For pins that are to be used for data I/O, be sure to carry out the following settings before serial transfer
of the 1st byte after RESET input.

<1> Set the P25 and P26 output latches to 1.

<2> Set bit 0 (RELT) of the serial bus interface control register (SBIC) to 1.
<3> Reset the P25 and P26 output latches from 1 to 0.

(e) The transition of the SB0 (SB1) line from low to high or from high to low when the SCK0 line is high is
recognized as a bus release signal or a command signal, respectively. If the transition timing of the bus
is shifted due to the influence of board capacitance, transmitted data may be judged as a bus release
signal (or a command signal). Exercise care in wiring so that noise is not superimposed on the signal
lines.

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 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

16.4.4 2-wire serial I/O mode operation

The 2-wire serial I/O mode can cope with any communication format by program.
Communication is basically carried out with the two lines of the serial clock (SCK0) and serial data input/output
(SB0 or SB1).

Figure 16-31. Serial Bus Configuration Example Using 2-Wire Serial I/O Mode

VDD0 VDD0

Master Slave

SCK0 SCK0

SB0 (SB1) SB0 (SB1)

(1) Register setting

The 2-wire serial I/O mode is set by serial operating mode register 0 (CSIM0), the serial bus interface control
register (SBIC), and the interrupt timing specification register (SINT).

(a) Serial operating mode register 0 (CSIM0)

CSIM0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM0 to 00H.

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 CHAPTER 16 SERIAL INTERFACE CHANNEL 0 (µPD780058 SUBSERIES)

Symbol <7> <6> <5> 4 3 2 1 0 Address After reset R/W

CSIM0 CSIE0 COI WUP CSIM04 CSIM03 CSIM02 CSIM01 CSIM00 FF60H 00H R/WNote 1

R/W CSIM01 CSIM00 Serial interface channel 0 clock selection

0 × Input clock to SCK0 pin from off-chip
1 0 8-bit timer register 2 (TM2) output
1 1 Clock specified with bits 0 to 3 of timer clock select register 3 (TCL3)

R/W CSIM CSIM CSIM PM25 P25 PM26 P26 PM27 P27 Operation Start bit SIO/SB0/P25 SO0/SB1/P26 SCK0/P27
04 03 02 mode pin function pin function pin function

0 × 3-wire serial I/O mode (see 16.4.2 3-wire serial I/O mode operation)

1 0 SBI mode (see 16.4.3 SBI mode operation)

Note 2 Note 2
1 1 0 × × 0 0 0 1 2-wire serial MSB P25 SB1 SCK0
l/O mode (CMOS I/O) (N-ch (N-ch
open-drain I/O) open-drain I/O)
Note 2 Note 2
1 0 0 × × 0 1 SB0 P26
(N-ch (CMOS I/O)
open-drain I/O)

R/W WUP Wakeup function controlNote 3

0 Interrupt request signal generation with each serial transfer in any mode

1 Interrupt request signal generation when the address received after bus release
(when CMDD = RELD = 1) matches the slave address register (SVA) data in SBI mode

R COI Slave address comparison result flagNote 4

0 Slave address register (SVA) not equal to serial I/O shift register 0 (SIO0) data
1 Slave address register (SVA) equal to serial I/O shift register 0 (SIO0) data

R/W CSIE0 Serial interface channel 0 operation control

0 Operation stopped
1 Operation enabled

Notes 1. Bit 6 (COI) is a read-only bit.

2. Can be used freely as a port function.
3. Be sure to set WUP to 0 in the 2-wire serial I/O mode.
4. When CSIE0 = 0, COI becomes 0.

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

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(b) Serial bus interface control register (SBIC)

SBIC is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SBIC to 00H.

Symbol <7> <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

SBIC BSYE ACKD ACKE ACKT CMDD RELD CMDT RELT FF61H 00H R/W

R/W RELT When RELT = 1, the SO0 Iatch is set to 1. After the SO0 Iatch is set, RELT is automatically cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

R/W CMDT When CMDT = 1, the SO0 Iatch is cleared to 0. After the SO0 latch is cleared, CMDT is automatically
cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

(c) Interrupt timing specification register (SINT)

SINT is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SINT to 00H.

Symbol 7 <6> <5> <4> 3 2 1 0 Address After reset R/W

SINT 0 CLD SIC SVAM 0 0 0 0 FF63H 00H R/WNote 1

R/W
SIC INTCSI0 interrupt factor selection
0 CSIIF0 is set upon termination of serial interface
channel 0 transfer

1 CSIIF0 is set upon bus release detection or

termination of serial interface channel 0 transfer

R
CLD SCK0/P27 pin levelNote 2
0 Low level
1 High level

Caution Be sure to clear bits 0 to 3 to 0.

Notes 1. Bit 6 (CLD) is a read-only bit.

2. When CSIE0 = 0, CLD becomes 0.

Remark CSIIF0: Interrupt request flag corresponding to INTCSI0

CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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(2) Communication operation

The 2-wire serial I/O mode is used for data transmission/reception in 8-bit units. Data transmission/reception
is carried out bit-wise in synchronization with the serial clock.
Shift operations of serial I/O shift register 0 (SIO0) are carried out in synchronization with the falling edge of
the serial clock (SCK0). The transmit data is held in the SO0 latch and is output from the SB0/P25 (or SB1/
P26) pin on an MSB-first basis. The receive data input from the SB0 (or SB1) pin is latched into the SIO0
at the rising edge of SCK0.
Upon termination of 8-bit transfer, the SIO0 operation stops automatically and the interrupt request flag
(CSIIF0) is set.

Figure 16-32. 2-Wire Serial I/O Mode Timing

SCK0 1 2 3 4 5 6 7 8

SB0 (SB1) D7 D6 D5 D4 D3 D2 D1 D0

CSIIF0
End of transfer

Transfer start at the falling edge of SCK0

The SB0 (or SB1) pin specified for the serial data bus is an N-ch open-drain I/O and thus it must be externally
connected to a pull-up resistor. Because an N-ch open-drain output must go into a high-impedance state during
data reception, write FFH to SIO0 in advance.
The SB0 (or SB1) pin generates the SO0 latch status and thus the SB0 (or SB1) pin output status can be
manipulated by setting bit 0 (RELT) and bit 1 (CMDT) of the serial bus interface control register (SBIC).
However, do not carry out this manipulation during serial transfer.
Control the SCK0 pin output level in the output mode (internal system clock mode) by manipulating the P27
output latch (see 16.4.5 SCK0/P27 pin output manipulation).

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(3) Other signals

Figure 16-33 shows the RELT and CMDT operations.

Figure 16-33. RELT and CMDT Operations

SO0 latch

RELT

CMDT

(4) Transfer start

Serial transfer is started by setting transfer data to serial I/O shift register 0 (SIO0) when the following two
conditions are satisfied.

• Serial interface channel 0 operation control bit (CSIE0) = 1

• Internal serial clock is stopped or SCK0 is high level after 8-bit serial transfer.

Cautions 1. If CSIE0 is set to 1 after data write to SIO0, transfer does not start.
2. Because the N-ch open-drain output must go into a high-impedance state during data
reception, write FFH to SIO0 in advance.

Upon termination of 8-bit transfer, serial transfer automatically stops and the interrupt request flag (CSIIF0)
is set.

(5) Error detection

In the 2-wire serial I/O mode, the serial bus SB0 (SB1) status being transmitted is fetched into the destination
device, that is, serial I/O shift register 0 (SIO0). Thus, transmit errors can be detected in the following ways.

(a) Method of comparing SIO0 data before and after transmission

In this case, if the two data differ from each other, a transmit error is judged to have occurred.

(b) Method of using the slave address register (SVA)

Transmit data is set to both SIO0 and SVA and is transmitted. After termination of transmission, the COI
bit (match signal coming from the address comparator) of serial operating mode register 0 (CSIM0) is
tested. If “1”, normal transmission is judged to have been carried out. If “0”, a transmit error is judged
to have occurred.

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16.4.5 SCK0/P27 pin output manipulation

Because the SCK0/P27 pin incorporates an output latch, static output is also possible by software in addition to
normal serial clock output.
P27 output latch manipulation enables any value of SCK0 to be set by software. (The SI0/SB0 and SO0/SB1 pins
are controlled by bits 0 and 1 (RELT and CMDT) of the serial bus interface control register (SBIC).)
The procedure for manipulating the SCK0/P27 pin output is described below.

1 Set serial operating mode register 0 (CSIM0) (SCK0 pin: Output mode, serial operation: Enabled). SCK0 =
1 while serial transfer is suspended.
2 Manipulate the P27 output latch with a bit manipulation instruction.

Figure 16-34. SCK0/P27 Pin Configuration

Manipulated by bit
manipulation instruction
SCK0/P27 To internal P27
circuit Output Latch

SCK0 (1 while transfer is stopped)

from serial clock
controller
When CSIE0 = 1
and
CSIM01 and CSIM00 are 1 and 0, or 1 and 1.

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The µPD780058Y Subseries incorporates three serial interface channels. Differences between channels 0, 1,
and 2 are as follows (see CHAPTER 18 SERIAL INTERFACE CHANNEL 1 for details of serial interface channel
1 and CHAPTER 19 SERIAL INTERFACE CHANNEL 2 for details of serial interface channel 2).

Table 17-1. Differences Between Channels 0, 1, and 2

Serial Transfer Mode Channel 0 Channel 1 Channel 2

3-wire serial I/O Clock selection fXX/2, fXX/22, fXX/23, fXX/2, fXX/22, fXX/23, External clock, baud
fXX/24, fXX/25, fXX/26, fXX/24, fXX/25, fXX/26, rate generator output
fXX/27, fXX/28, external fXX/27, fXX/28, external
clock, TO2 output clock, TO2 output
Transfer method MSB/LSB switchable as MSB/LSB switchable as MSB/LSB switchable as
the start bit the start bit the start bit
Automatic transmit/
receive function
Transfer end flag Serial transfer end Serial transfer end Serial transfer end
interrupt request flag interrupt request flag interrupt request flag
(CSIIF0) (CSIIF1) (SRIF)
2-wire serial I/O Use possible None None
I 2C bus (Inter IC Bus)
UART None Use possible
(Asynchronous serial interface) Timer-division
transfer function

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17.1 Functions of Serial Interface Channel 0

Serial interface channel 0 employs the following four modes.

• Operation stop mode

• 3-wire serial I/O mode
• 2-wire serial I/O mode
• I2C (Inter IC) bus mode

Caution Do not change the operating mode (3-wire serial I/O, 2-wire serial I/O, or SBI) while serial interface
channel 0 is enabled to operate. To change the operating mode, stop the serial operation first.

(1) Operation stop mode

This mode is used when serial transfer is not carried out. Power consumption can be reduced in this mode.

(2) 3-wire serial I/O mode (MSB-/LSB-first selectable)

This mode is used for 8-bit data transfer using three lines, one each for the serial clock (SCK0), serial output
(SO0) and serial input (SI0). This mode enables simultaneous transmission/reception and therefore reduces
the data transfer processing time.
The start bit of transferred 8-bit data is switchable between MSB and LSB, so that devices can be connected
regardless of their start bit recognition.
This mode should be used when connecting with peripheral I/O devices or display controllers which incorporate
a conventional clocked serial interface as is the case with the 75X/XL, 78K, and 17K Series.

(3) 2-wire serial I/O mode (MSB-first)

This mode is used for 8-bit data transfer using two lines of serial clock (SCK0) and serial data bus (SB0 or
SB1).
This mode enables to cope with any one of the possible data transfer formats by controlling the SCK0 level
and the SB0 or SB1 output level. Thus, the handshake line previously necessary for connection of two or
more devices can be removed, resulting in the increased number of available I/O ports.

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(4) I2C (Inter IC) bus mode (MSB-first)

This mode is used for 8-bit data transfer with two or more devices using the two lines of the serial clock (SCL)
and serial data bus (SDA0 or SDA1).
This mode complies with the I2C bus format. In this mode, the transmitter outputs three kinds of data onto
the serial data bus: “start condition”, “data”, and “stop condition”, to be actually sent or received. The receiver
automatically distinguishes the received data as “start condition”, “data”, or “stop condition”, by hardware.

Figure 17-1. Serial Bus Configuration Example Using I2C Bus

VDD0 VDD0

Master CPU Slave CPU1

SCL SCL

SDA0 (SDA1) SDA0 (SDA1)

Slave CPU2

SCL

SDA0 (SDA1)

Slave CPUn

SCL

SDA0 (SDA1)

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17.2 Configuration of Serial Interface Channel 0

Serial interface channel 0 consists of the following hardware.

Table 17-2. Configuration of Serial Interface Channel 0

Item Configuration

Registers Serial I/O shift register 0 (SIO0)

Slave address register (SVA)
Control registers Timer clock select register 3 (TCL3)
Serial operating mode register 0 (CSIM0)
Serial bus interface control register (SBIC)
Interrupt timing specify register (SINT)
Port mode register 2 (PM2)Note

Note See Figure 6-7 Block Diagram of P20, P21, and P23 to P26 and Figure 6-8 Block Diagram of P22

and P27.

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Figure 17-2. Block Diagram of Serial Interface Channel 0

Internal bus

Serial bus interface

Serial operating mode register 0 control register
CSIM CSIM CSIM CSIM CSIM Slave address
CSIE0 COI WUP BSYE ACKD ACKE ACKT CMDD RELD CMDT RELT
04 03 02 01 00 register (SVA)
SVAM
Match
BSYE

Controller

SI0/SB0/ Serial I/O shift CLR SET

SDA0/P25 Selector D Q
P25 register 0 (SIO0)
PM25
Output latch
Output
control
SO0/SB1/ Selector Acknowledge
SDA1/P26 output circuit
PM26 Stop condition/ ACKD
Output start condition/ CMDD WUP
control acknowledge Interrupt
detector RELD
request
CLD P26 Output latch
signal
SCK0/ Serial clock INTCSI0
generator
SCL/P27 counter
PM27 TO2
Output Serial clock 1/16
control Selector Selector fXX/2 to fXX/28
controller Divider

CSIM00 CSIM00 2 4
CSIM01 CSIM01

P27
Output latch

CLD SIC SVAM CLC WREL WAT1 WAT0 TCL33 TCL32 TCL31 TCL30

Interrupt timing Timer clock

specify register select
register 3

Internal bus

Remark The output control block performs selection between CMOS output and N-ch open-drain output.

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(1) Serial I/O shift register 0 (SIO0)

SIO0 is an 8-bit register used to carry out parallel-serial conversion and to carry out serial transmission/
reception (shift operation) in synchronization with the serial clock.
SIO0 is set with an 8-bit memory manipulation instruction.
When bit 7 (CSIE0) of serial operating mode register 0 (CSIM0) is 1, writing data to SIO0 starts a serial
operation.
In transmission, data written to SIO0 is output to the serial output (SO0) or serial data bus (SB0/SB1). In
reception, data is read from the serial input (SI0) or SB0/SB1 to SIO0.
Note that, if a bus is driven in the I2C bus mode or 2-wire serial I/O mode, the bus pins must serve for both
input and output. Therefore, the transmission N-ch transistor of the device which will start reception of data
must be turned off beforehand. Consequently, write FFH to SIO0 in advance.
In the I2C bus mode, set SIO0 to FFH with bit 7 (BSYE) of the serial bus interface control register (SBIC) set
to 1.
RESET input makes SIO0 undefined.

Caution Do not execute an instruction that writes SIO0 in the I2C bus mode while WUP (bit 5 of serial
operating mode register 0 (CSIM0)) = 1. Even if such an instruction is not executed, data
can be received when the wake-up function is used (WUP = 1). For the detail of the wake-
up function, see 17.4.4 (1) (c) Wake-up function.

(2) Slave address register (SVA)

SVA is an 8-bit register used to set the slave address value for connection of a slave device to the serial bus.
SVA is set with an 8-bit memory manipulation instruction. This register is not used in the 3-wire serial I/O
mode.
The master device outputs a slave address to the connected slave devices for selection of a particular slave
device. These two data (the slave address output from the master device and the SVA value) are compared
with an address comparator. If they match, the slave device has been selected. In that case, bit 6 (COI) of
serial operating mode register 0 (CSIM0) becomes 1.
Address comparison can also be executed on the data of LSB-masked higher 7 bits by setting bit 4 (SVAM)
of the interrupt timing specify register (SINT) to 1.
If no matching is detected in address reception, bit 2 (RELD) of the serial bus interface control register (SBIC)
is cleared to 0. In the I2C bus mode, the wakeup function can be used by setting bit 5 (WUP) of CSIM0 to
1. In this case, the interrupt request signal (INTCSI0) is generated when the slave address output by the master
matches the SVA value (the interrupt request signal is also generated when the stop condition is detected),
and it can be learned by this interrupt request that the master requests for communication. To use the wakeup
function, set SIC to 1.
Further, an error can be detected by using SVA when the device transmits data as a master or slave device
in I2C bus mode or 2-wire serial I/O mode.
RESET input makes SVA undefined.

(3) SO0 latch

This latch holds the SI0/SB0/SDA0/P25 and SO0/SB1/SDA1/P26 pin levels. It can be directly controlled by
software.

(4) Serial clock counter

This counter counts the serial clocks to be output and input during transmission/reception to check whether
8-bit data has been transmitted/received.

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(5) Serial clock controller

This circuit controls serial clock supply to serial I/O shift register 0 (SIO0). When the internal system clock
is used, the circuit also controls clock output to the SCK0/SCL/P27 pin.

(6) Interrupt signal generator

This circuit controls interrupt request signal generation. It generates interrupt request signals according to
the settings of interrupt timing specification register (SINT) bits 0 and 1 (WAT0, WAT1) and serial operation
mode register 0 (CSIM0) bit 5 (WUP), as shown in Table 17-3.

(7) Acknowledge output circuit and stop condition/start condition/acknowledge detector

These two circuits output and detect various control signals in the I2C mode.
These do not operate in the 3-wire serial I/O mode and 2-wire serial I/O mode.

Table 17-3. Interrupt Request Signal Generation of Serial Interface Channel 0

Serial Transfer Mode BSYE WUP WAT1 WAT0 ACKE Description

3-wire or 2-wire serial I/O mode 0 0 0 0 0 An interrupt request signal is generated each time 8
serial clocks are counted.
Other than above Setting prohibited
I2C bus mode (transmit) 0 0 1 0 0 An interrupt request signal is generated each time 8
serial clocks are counted (8-clock wait).
Normally, during transmission the settings WAT21,
WAT0 = 1, 0, are not used. They are used only when
wanting to coordinate receive time and processing
systematically using software. ACK information is
generated by the receiving side, thus ACKE should be
set to 0 (disable).
1 1 0 An interrupt request signal is generated each time 9
serial clocks are counted (9-clock wait).
ACK information is generated by the receiving side,
thus ACKE should be set to 0 (disable).
Other than above Setting prohibited
I2C bus mode (receive) 1 0 1 0 0 An interrupt request signal is generated each time 8
serial clocks are counted (8-clock wait).
ACK information is output by manipulating ACKT by
software after an interrupt request is generated.
1 1 0/1 An interrupt request signal is generated each time 9
serial clocks are counted (9-clock wait).
To automatically generate ACK information, preset
ACKE to 1 before transfer start. However, in the case
of the master, set ACKE to 0 (disable) before receiving
the last data.
1 1 1 1 1 After an address is received, if the values of serial I/
O shift register 0 (SI00) and the slave address
register (SVA) match, and if the stop condition is
detected, an interrupt request signal is generated.
To automatically generate ACK information, preset
ACKE to 1 (enable) before transfer start.
Other than above Setting prohibited

Remark BSYE: Bit 7 of the serial bus interface control register (SBIC)
ACKE: Bit 5 of the serial bus interface control register (SBIC)

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17.3 Control Registers of Serial Interface Channel 0

The following four registers are used to control serial interface channel 0.

• Timer clock select register 3 (TCL3)

• Serial operating mode register 0 (CSIM0)
• Serial bus interface control register (SBIC)
• Interrupt timing specification register (SINT)

(1) Timer clock select register 3 (TCL3)

This register sets the serial clock of serial interface channel 0.
TCL3 is set with an 8-bit memory manipulation instruction.
RESET input sets TCL3 to 88H.

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Figure 17-3. Format of Timer Clock Select Register 3

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

TCL3 TCL37 TCL36 TCL35 TCL34 TCL33 TCL32 TCL31 TCL30 FF43H 88H R/W

TCL33 TCL32 TCL31 TCL30 Serial interface channel 0 serial clock selection
Serial clock in I2C bus mode Serial clock in 2-wire or 3-wire
serial I/O mode
MCS = 1 MCS = 0 MCS = 1 MCS = 0

0 1 1 0 f XX/25 Setting prohibited f X/2 (78.1 kHz)

6 f XX/2 Setting prohibited f X/2 (1.25 MHz)
2

0 1 1 1 f XX/26 f X/26 (78.1 kHz) f X/27 (39.1 kHz) f XX/22 f X/22 (1.25 MHz) f X/23 (625 kHz)

1 0 0 0 f XX/27 f X/27 (39.1 kHz) f X/28 (19.5 kHz) f XX/23 f X/23 (625 kHz) f X/24 (313 kHz)

1 0 0 1 f XX/28 f X/28 (19.5 kHz) f X/29 (9.77 kHz) f XX/24 f X/24 (313 kHz) f X/25 (156 kHz)

1 0 1 0 f XX/29 f X/29 (9.77 kHz) f X/210 (4.88 kHz) f XX/25 f X/25 (156 kHz) f X/26 (78.1 kHz)

1 0 1 1 f XX/210 f X/210 (4.88 kHz) f X/211 (2.44 kHz) f XX/26 f X/26 (78.1 kHz) f X/27 (39.1 kHz)

1 1 0 0 f XX/211 f X/211 (2.44 kHz) f X/212 (1.22 kHz) f XX/27 f X/27 (39.1 kHz) f X/28 (19.5 kHz)

1 1 0 1 f XX/212 f X/212 (1.22 kHz) f X/213 (0.61 kHz) f XX/28 f X/28 (19.5 kHz) f X/29 (9.8 kHz)

Other than above Setting prohibited

TCL37 TCL36 TCL35 TCL34 Serial interface channel 1 serial clock selection

MCS = 1 MCS = 0

0 1 1 0 f XX/2 Setting prohibited f X/22 (1.25 MHz)

0 1 1 1 f XX/22 f X/22 (1.25 MHz) f X/23 (625 kHz)

1 0 0 0 f XX/23 f X/23 (625 kHz) f X/24 (313 kHz)

1 0 0 1 f XX/24 f X/24 (313 kHz) f X/25 (156 kHz)

1 0 1 0 f XX/25 f X/25 (156 kHz) f X/26 (78.1 kHz)

1 0 1 1 f XX/26 f X/26 (78.1 kHz) f X/27 (39.1 kHz)

1 1 0 0 f XX/27 f X/27 (39.1 kHz) f X/28 (19.5 kHz)

1 1 0 1 f XX/28 f X/28 (19.5 kHz) f X/29 (9.8 kHz)

Other than above Setting prohibited

Caution When rewriting TCL3 to other data, stop the serial transfer operation beforehand.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. MCS: Bit 0 of oscillation mode select register (OSMS)
4. Values in parentheses apply to operation with fX = 5.0 MHz.

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(2) Serial operating mode register 0 (CSIM0)

This register sets the serial interface channel 0 serial clock, operating mode, operation enable/stop wakeup
function and displays the address comparator match signal.
CSIM0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM0 to 00H.

Caution Do not change the operating mode (3-wire serial I/O, 2-wire serial I/O, or SBI) while serial
interface channel 0 is enabled to operate. To change the operating mode, stop the serial
operation first.

Figure 17-4. Format of Serial Operating Mode Register 0

Symbol <7> <6> <5> 4 3 2 1 0 Address After reset R/W

CSIM0 CSIE0 COI WUP CSIM04 CSIM03 CSIM02 CSIM01 CSIM00 FF60H 00H R/WNote 1

R/W CSIM01 CSIM00 Serial interface channel 0 clock selection

0 × Input clock to SCK0/SCL pin from off-chip
1 0 8-bit timer register 2 (TM2) output Note 2
1 1 Clock specified by bits 0 to 3 of timer clock select register 3 (TCL3)

R/W CSIM CSIM CSIM Operation SI0/SB0/SDA0/ SO0/SB1/SDA1/ SCK0/SCL/P27

PM25 P25 PM26 P26 PM27 P27 Start Bit
04 03 02 mode P25 pin function P26 pin function pin function
Note 3 Note 3
0 3-wire serial MSB SI0Note 3 SO0 SCK0
0 × 1 × 0 0 0 1
1 l/O mode (Input) (CMOS output) (CMOS I/O)
LSB
Note 4 Note 4
1 1 0 × × 0 0 0 1 2-wire serial MSB P25 SB1/SDA1 SCK0/SCL
l/O mode (CMOS I/O) (N-ch (N-ch
or open-drain I/O) open-drain I/O)
Note 4 Note 4
I2C bus mode
1 0 0 × × 0 1 SB0/SDA0 P26
(N-ch (CMOS I/O)
open-drain

R/W WUP Wake-up function controlNote 5

0 Interrupt request signal generation with each serial transfer in any mode

1 Interrupt request signal generation when the address received after detecting start condition
(when CMDD = 1) matches the slave address register (SVA) data in I2C bus mode

Note 6
R COI Slave address comparison result flag
0 Slave address register (SVA) not equal to serial I/O shift register 0 (SIO0) data
1 Slave address register (SVA) equal to serial I/O shift register 0 (SIO0) data

R/W CSIE0 Serial interface channel 0 operation control

0 Operation stopped
1 Operation enabled

Notes 1. Bit 6 (COI) is a read-only bit.

2. In I2C bus mode, the clock frequency becomes 1/16 of that output from TO2.
3. Can be used as P25 (CMOS input/output) when used only for transmission.
4. Can be used freely as a port function.
5. To use the wakeup function (WUP = 1), set bit 5 (SIC) of the interrupt timing specification
register (SINT) to 1. Do not execute an instruction that writes serial I/O shift register 0 (SIO0)
while WUP = 1.
6. When CSIE0 = 0, COI becomes 0.

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch
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(3) Serial bus interface control register (SBIC)

This register sets the serial bus interface operation and displays statuses.
SBIC is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SBIC to 00H.

Figure 17-5. Format of Serial Bus Interface Control Register (1/2)

Symbol <7> <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

SBIC BSYE ACKD ACKE ACKT CMDD RELD CMDT RELT FF61H 00H R/WNote

R/W RELT Used for stop condition signal output.

When RELT = 1, the SO0 Iatch is set to 1. After the SO0 latch is set, RELT is automatically cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

R/W CMDT Used for start condition signal output.

When CMDT = 1, the SO0 Iatch is cleared to 0. After the SO0 latch is cleared, CMDT is automatically
cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

R RELD Stop condition detection

Clear conditions (RELD = 0) Set conditions (RELD = 1)

• When transfer start instruction is executed • When stop condition signal is detected
• If SIO0 and SVA values do not match in
address reception
• When CSIE0 = 0
• When RESET input is applied

R CMDD Start condition detection

Clear conditions (CMDD = 0) Set conditions (CMDD = 1)

• When transfer start instruction is executed • When start condition signal is detected
• When stop condition signal is detected
• When CSIE0 = 0
• When RESET input is applied

R/W ACKT Used to generate the ACK signal by software when 8-clock wait mode is selected.
Keeps SDA0 (SDA1) low from set instruction (ACKT = 1) execution to the next falling edge of SCL.
ACKT is also cleared to 0 upon start of serial interface transfer or when CSIE0 = 0.

Note Bits 2, 3, and 6 (RELD, CMDD, and ACKD) are read-only bits.

Remark CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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Figure 17-5. Format of Serial Bus Interface Control Register (2/2)

R/W ACKE Acknowledge signal output controlNote 1

0 Acknowledge signal automatic output disable (However, output by ACKT enabled)
Used for reception when 8-clock wait mode is selected or for transmission. Note 2

1 Enables acknowledge signal automatic output.

Outputs the acknowledge signal in synchronization with the falling edgethe
of 9th SCL clock cycle
(automatically output when ACKE = 1).
However, ACKE is not automatically cleared to 0 after acknowledge signal is output.
Used in reception with 9-clock wait mode selected.

R ACKD Acknowledge detection

Clear conditions (ACKD = 0) Set conditions (ACKD = 1)

• While executing the transfer start instruction • When acknowledge signal (ACK) is detected at the
• When CSIE0 = 0 rising edge of the SCL clock after completion of
• When RESETinput is applied transfer

Note 3
R/W
BSYE Control of N-ch open-drain output for transmission in I2C Bus ModeNote 4

0 Output enabled (transmission)

1 Output disabled (reception)

Notes 1. Setting should be performed before transfer.

2. If 8-clock wait mode is selected, the acknowledge signal at reception must be output using ACKT.
3. The busy mode can be cleared by start of serial interface transfer or reception of address signal.
However, the BSYE flag is not cleared to 0.
4. When using the wakeup function, be sure to set BSYE to 1.

Remark CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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(4) Interrupt timing specification register (SINT)

This register sets the bus release interrupt and address mask functions and displays the SCK0/SCL pin level
status.
SINT is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SINT to 00H.

Figure 17-6. Format of Interrupt Timing Specification Register (1/2)

Symbol 7 <6> <5> <4> <3> <2> 1 0 Address After reset R/W

SINT 0 CLD SIC SVAM CLC WREL WAT1 WAT0 FF63H 00H R/WNote 1

R/W WAT1 WAT0 Wait and interrupt control

0 0 Generates interrupt servicing request at rising edge of 8th SCK0 clock cycle
(keeping clock output in high impedance).

0 1 Setting prohibited

1 0 Used in I2C bus mode (8-clock wait).

Generates interrupt servicing request at rising edge of 8th SCK0 clock cycle.
(In the case of master device, makes SCL output low to enter wait state after 8 clock pulses are
output. In the case of slave device, makes SCL output low to request wait state after 8 clock
pulses are input.)

1 1 Used in I2C bus mode (9-clock wait).

Generates interrupt servicing request at rising edge of 9th SCK0 clock cycle.
(In the case of master device, makes SCL output low to enter wait state after 9 clock pulses are
output. In the case of slave device, makes SCL output low to request wait state after 9 clock
pulses are input.)

R/W WREL Wait sate release control

0 Wait state has been released.

1 Release wait state. Automatically cleared to 0 when the state is released

(Used to cancel wait state by means of WAT0 and WAT1.)

R/W CLC Clock level controlNote 2

0 Used in I2C bus mode.
Make output level of SCL pin low unless serial transfer is being performed.

1 Used in I2C bus mode.

Make SCL pin enter high-impedance state unless serial transfer is being performed
(except for clock line which is kept high).
Used to enable master device to generate start condition and stop condition signals.

Notes 1. Bit 6 (CLD) is a read-only bit.

2. When not using the I2C mode, clear CLC to 0.

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Figure 17-6. Format of Interrupt Timing Specification Register (2/2)

R/W SVAM SVA bit to be used as slave address

0 Bits 0 to 7
1 Bits 1 to 7

R/W SIC INTCSI0 interrupt source selection Note 1

0 CSIIF0 is set to 1 upon termination of serial interface channel 0 transfer

1 CSIIF0 is set to 1 upon stop condition detection or termination of serial interface channel 0 transfer

R CLD SCK0/SCL pin levelNote 2

0 Low level
1 High level

Notes 1. When using the wakeup function in the I2C mode, clear SIC to 0.
2. When CSIE0 = 0, CLD becomes 0.

Remark SVA: Slave address register

CSIIF0: Interrupt request flag corresponding to INTCSI0
CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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17.4 Operations of Serial Interface Channel 0

The following four operating modes are available for serial interface channel 0.

• Operation stop mode

• 3-wire serial I/O mode
• 2-wire serial I/O mode
• I2C (Inter IC) bus mode

17.4.1 Operation stop mode

Serial transfer is not carried out in the operation stop mode. Thus, power consumption can be reduced. Serial
I/O shift register 0 (SIO0) does not carry out shift operations either and thus it can be used as an ordinary 8-bit register.
In the operation stop mode, the P25/SI0/SB0/SDA0, P26/SO0/SB1/SDA1, and P27/SCK0/SCL pins can be used
as general I/O ports.

(1) Register setting

The operation stop mode is set by serial operating mode register 0 (CSIM0).
CSIM0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM0 to 00H.

Symbol <7> <6> <5> 4 3 2 1 0 Address After reset R/W

CSIM0 CSIE0 COI WUP CSIM04 CSIM03 CSIM02 CSIM01 CSIM00 FF60H 00H R/W

R/W CSIE0 Serial interface channel 0 operation control

0 Operation stopped
1 Operation enabled

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17.4.2 3-wire serial I/O mode operation

The 3-wire serial I/O mode is valid for connection of peripheral I/O units and display controllers which incorporate
a conventional clocked serial interface as is the case with the 75X/XL, 78K, and 17K Series.
Communication is carried out with the three lines of the serial clock (SCK0), serial output (SO0), and serial input
(SI0).

(1) Register setting

The 3-wire serial I/O mode is set by serial operating mode register 0 (CSIM0) and the serial bus interface control
register (SBIC).

(a) Serial operating mode register 0 (CSIM0)

CSIM0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM0 to 00H.

Symbol <7> <6> <5> 4 3 2 1 0 Address After reset R/W

CSIM0 CSIE0 COI WUP CSIM04 CSIM03 CSIM02 CSIM01 CSIM00 FF60H 00H R/WNote 1

R/W CSIM01 CSIM00 Serial interface channel 0 clock selection

0 × Input clock to SCK0 pin from off-chip
1 0 8-bit timer register 2 (TM2) output
1 1 Clock specified with bits 0 to 3 of timer clock select register 3 (TCL3)

R/W CSIM CSIM CSIM Operation SIO/SB0/SDA0 SO0/SB1/SDA1 SCK0/SCL/P27

PM25 P25 PM26 P26 PM27 P27 Start bit
04 03 02 mode /P25 pin function /P26 pin function pin function
Note 2 Note 2
0 × 0 1 × 0 0 0 1 3-wire serial MSB SI0Note 2 SO0 SCK0
1 l/O mode LSB (input) (CMOS output) (CMOS I/O)

1 1 2-wire serial I/O mode (see 17.4.3 2-wire serial I/O mode operation.)
or
2 2
I C bus mode (see 17.4.4 I C bus mode operation.)

R/W WUP Wake-up function controlNote 3

0 Interrupt request signal generation with each serial transfer in any mode

1 Interrupt request signal generation when the address received after detecting start condition
(when CMDD = 1) matches the slave address register (SVA) data in I2C bus mode

R/W CSIE0 Serial interface channel 0 operation control

0 Operation stopped
1 Operation enabled

Notes 1. Bit 6 (COI) is a read-only bit.

2. Can be used as P25 (CMOS input/output) when used only for transmission.
3. Be sure to clear WUP to 0 when the 3-wire serial I/O mode is selected.

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

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(b) Serial bus interface control register (SBIC)

SBIC is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SBIC to 00H.
Symbol <7> <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

SBIC BSYE ACKD ACKE ACKT CMDD RELD CMDT RELT FF61H 00H R/W

R/W RELT When RELT = 1, the SO0 Iatch is set to 1. After the SO0 Iatch is set, RELT is automatically cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

R/W CMDT When CMDT = 1, the SO0 Iatch is cleared to 0. After the SO0 latch is cleared, CMDT is automatically
cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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(2) Communication operation

The 3-wire serial I/O mode is used for data transmission/reception in 8-bit units. Data transmission/reception
is carried out bit-wise in synchronization with the serial clock.
Shift operations of serial I/O shift register 0 (SIO0) are carried out at the falling edge of the serial clock (SCK0).
The transmitted data is held in the SO0 latch and is output from the SO0 pin. The received data input to the
SI0 pin is latched in SIO0 at the rising edge of SCK0.
Upon termination of 8-bit transfer, SIO0 operation stops automatically and the interrupt request flag (CSIIF0)
is set.

Figure 17-7. 3-Wire Serial I/O Mode Timing

SCK0 1 2 3 4 5 6 7 8

SI0 DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0

SO0 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0

CSIIF0

End of transfer
Transfer start at the falling edge of SCK0

The SO0 pin is a CMOS output pin and outputs the current SO0 latch status. Thus, the SO0 pin output status
can be manipulated by setting bit 0 (RELT) and bit 1 (CMDT) of the serial bus interface control register (SBIC).
However, do not carry out this manipulation during serial transfer.
Control the SCK0 pin output level in the output mode (internal system clock mode) by manipulating the P27
output latch (see 17.4.8 SCK0/SCL/P27 pin output manipulation).

(3) Other signals

Figure 17-8 shows RELT and CMDT operations.

Figure 17-8. RELT and CMDT Operations

SO0 latch

RELT

CMDT

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(4) MSB/LSB switching as the start bit

In the 3-wire serial I/O mode, it is possible to select transfer to start from the MSB or LSB.
Figure 17-9 shows the configuration of serial I/O shift register 0 (SIO0) and the internal bus. As shown in the
figure, the MSB/LSB can be read or written in reverse form.
MSB/LSB switching as the start bit can be specified by bit 2 (CSIM02) of serial operating mode register 0
(CSIM0).

Figure 17-9. Circuit for Switching Transfer Bit Order

7
6
Internal bus
1
0
LSB-first
MSB-first Read/write gate Read/write gate

SO0 latch
SI0 Serial I/O shift register 0 (SIO0) D Q

SO0

SCK0

Start bit switching is realized by switching the bit order for data write to SIO0. The SIO0 shift order remains
unchanged.
Thus, switching between MSB-first and LSB-first must be performed before writing data to SIO0.

(5) Transfer start

Serial transfer is started by setting transfer data to serial I/O shift register 0 (SIO0) when the following two
conditions are satisfied.

• Serial interface channel 0 operation control bit (CSIE0) = 1.

• Internal serial clock is stopped or SCK0 is a high level after 8-bit serial transfer.

Caution If CSIE0 is set to 1 after data write to SIO0, transfer does not start.

Upon termination of 8-bit transfer, serial transfer automatically stops and the interrupt request flag (CSIIF0)
is set.

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17.4.3 2-wire serial I/O mode operation

The 2-wire serial I/O mode can cope with any communication format by program.
Communication is basically carried out with the two lines of the serial clock (SCK0) and serial data input/output
(SB0 or SB1).

Figure 17-10. Serial Bus Configuration Example Using 2-Wire Serial I/O Mode

VDD0 VDD0

Master Slave

SCK0 SCK0

SB0 (SB1) SB0 (SB1)

(1) Register setting

The 2-wire serial I/O mode is set by serial operating mode register 0 (CSIM0), the serial bus interface control
register (SBIC), and the interrupt timing specify register (SINT).

(a) Serial operating mode register 0 (CSIM0)

CSIM0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM0 to 00H.

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Symbol <7> <6> <5> 4 3 2 1 0 Address After reset R/W

CSIM0 CSIE0 COI WUP CSIM04 CSIM03 CSIM02 CSIM01 CSIM00 FF60H 00H R/WNote 1

R/W CSIM01 CSIM00 Serial interface channel 0 clock selection

0 × Input clock to SCK0 pin from off-chip
1 0 8-bit timer register 2 (TM2) output
1 1 Clock specified by bits 0 to 3 of timer clock select register 3 (TCL3)

R/W CSIM CSIM CSIM PM25 P25 PM26 P26 PM27 P27 Operation Start bit SI0/SB0/SDA0 SO0/SB1/SDA1 SCK0/SCL/P27
04 03 02 mode /P25 pin function /P26 pin function pin function

0 × 3-wire serial I/O mode (see 17.4.2 3-wire serial I/O mode operation)
Note 2 Note 2
2-wire serial MSB P25 SB1/SDA1 SCK0/SCL
1 1 0 × × 0 0 0 1
l/O mode (CMOS I/O) (N-ch (N-ch
or open-drain I/O open-drain I/O)
I2C bus mode
Note 2 Note 2
SB0/SDA0 P26
1 0 0 × × 0 1 (N-ch (CMOS I/O)
open-drain I/O)

R/W WUP Wakeup function controlNote 3

0 Interrupt request signal generation with each serial transfer in any mode

1 Interrupt request signal generation when the address received after detecting start condition
(when CMDD = 1) matches the slave address register (SVA) data in I2C bus mode

R COI Slave address comparison result flagNote 4

0 Slave address register (SVA) not equal to serial I/O shift register 0 (SIO0) data
1 Slave address register (SVA) equal to serial I/O shift register 0 (SIO0) data

R/W CSIE0 Serial interface channel 0 operation control

0 Operation stopped
1 Operation enabled

Notes 1. Bit 6 (COI) is a read-only bit.

2. Can be used freely as port function.
3. Be sure to clear WUP to 0 when the 2-wire serial I/O mode.
4. When CSIE0 = 0, COI becomes 0.

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

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(b) Serial bus interface control register (SBIC)

SBIC is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SBIC to 00H.

Symbol <7> <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

SBIC BSYE ACKD ACKE ACKT CMDD RELD CMDT RELT FF61H 00H R/W

R/W RELT When RELT = 1, the SO0 Iatch is set to 1. After the SO0 Iatch is set, RELT is automatically cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

R/W CMDT When CMDT = 1, the SO0 Iatch is cleared to 0. After the SO0 latch is cleared, CMDT is automatically
cleared to 0.
It is also cleared to 0 when CSIE0 = 0.

CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

(c) Interrupt timing specify register (SINT)

SINT is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SINT to 00H.

Symbol 7 <6> <5> <4> <3> <2> 1 0 Address After reset R/W

SINT 0 CLD SIC SVAM CLC WREL WAT1 WAT0 FF63H 00H R/WNote 1

R/W SIC INTCSI0 interrupt source selection

0 CSIIF0 is set to 1 upon termination of serial interface channel 0 transfer

1 CSIIF0 is set to 1 upon bus release detection or termination of serial interface channel 0 transfer

R CLD SCK0 pin levelNote 2

0 Low level

1 High level

Notes 1. Bit 6 (CLD) is a read-only bit.

2. When CSIE0 = 0, CLD becomes 0.

Caution Be sure to clear bits 0 to 3 to 0 in the 2-wire serial I/O mode is used.

Remark CSIIF0: Interrupt request flag corresponding to INTCSI0

CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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(2) Communication operation

The 2-wire serial I/O mode is used for data transmission/reception in 8-bit units. Data transmission/reception
is carried out bit-wise in synchronization with the serial clock.
Shift operations of serial I/O shift register 0 (SIO0) are carried out in synchronization with the falling edge of
the serial clock (SCK0). The transmit data is held in the SO0 latch and is output from the SB0/SDA0/P25 (or
SB1/SDA1/P26) pin on an MSB-first basis. The receive data input from the SB0 (or SB1) pin is latched into
the SIO0 at the rising edge of SCK0.
Upon termination of 8-bit transfer, the SIO0 operation stops automatically and the interrupt request flag
(CSIIF0) is set.

Figure 17-11. 2-Wire Serial I/O Mode Timing

SCK0 1 2 3 4 5 6 7 8

SB0 (SB1) D7 D6 D5 D4 D3 D2 D1 D0

CSIIF0
End of Transfer

Transfer Start at the Falling Edge of SCK0

The SB0 (or SB1) pin specified for the serial data bus is an N-ch open-drain input/output and thus it must be
externally connected to a pull-up resistor. Because N-ch open-drain output must go into a high-impedance
state during data reception, write FFH to SIO0 in advance.
The SB0 (or SB1) pin generates the SO0 latch status and thus the SB0 (or SB1) pin output status can be
manipulated by setting bit 0 (RELT) and bit 1 (CMDT) of the serial bus interface control register (SBIC).
However, do not carry out this manipulation during serial transfer.
Control the SCK0 pin output level in the output mode (internal system clock mode) by manipulating the P27
output latch (see 17.4.8 SCK0/SCL/P27 pin output manipulation).

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(3) Other signals

Figure 17-12 shows the RELT and CMDT operations.

Figure 17-12. RELT and CMDT Operations

SO0 latch

RELT

CMDT

(4) Transfer start

Serial transfer is started by setting transfer data to serial I/O shift register 0 (SIO0) when the following two
conditions are satisfied.

• Serial interface channel 0 operation control bit (CSIE0) = 1

• Internal serial clock is stopped or SCK0 is at high level after 8-bit serial transfer.

Cautions 1. If CSIE0 is set to 1 after data write to SIO0, transfer does not start.
2. Because the N-ch open-drain output must go into a high-impedance state during data
reception, write FFH to SIO0 in advance.

Upon termination of 8-bit transfer, serial transfer automatically stops and the interrupt request flag (CSIIF0)
is set.

(5) Error detection

In the 2-wire serial I/O mode, the serial bus SB0 (SB1) status being transmitted is fetched into the destination
device, that is, serial I/O shift register 0 (SIO0). Thus, transmit error can be detected in the following way.

(a) Method of comparing SIO0 data before transmission to that after transmission
In this case, if two data differ from each other, a transmit error is judged to have occurred.

(b) Method of using the slave address register (SVA)

Transmit data is set to both SIO0 and SVA and is transmitted. After termination of transmission, COI bit
(match signal coming from the address comparator) of serial operating mode register 0 (CSIM0) is tested.
If “1”, normal transmission is judged to have been carried out. If “0”, a transmit error is judged to have
occurred.

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17.4.4 I2C bus mode operation

The I2C bus mode is provided for when communication operations are performed between a single master device
and multiple slave devices. This mode configures a serial bus that includes only a single master device, and is
based on the clocked serial I/O format with the addition of bus configuration functions, which allow the master device
to communicate with a number of (slave) devices using only two lines: a serial clock (SCL) line and serial data bus
(SDA0 or SDA1) line. Consequently, when the user plans to configure a serial bus which includes multiple
microcontrollers and peripheral devices, using this configuration results in reduction of the required number of port
pins and on-board wires.
In the I2C bus specification, the master sends start condition, data, and stop condition signals to slave devices via
the serial data bus, while slave devices automatically detect and distinguish the type of signals using a signal detection
function incorporated as hardware. The application program that controls the I2C bus can be simplified by using this
function.
An example of a serial bus configuration is shown in Figure 17-13. This system below is composed of CPUs and
peripheral ICs having serial interface hardware that complies with the I2C bus specification.
Note that pull-up resistors are required to connect to both the serial clock line and serial data bus line, because
open-drain buffers are used for the serial clock pin (SCL) and the serial data bus pin (SDA0 or SDA1) on the I2C bus.
The signals used in the I2C bus mode are described in Table 17-4.

Figure 17-13. Example of Serial Bus Configuration Using I2C Bus

VDD0 VDD0

Master CPU Slave CPU1

Serial clock
SCL SCL

Serial data bus

SDA0 (SDA1) SDA0 (SDA1)

Slave CPU2

SCL

SDA0 (SDA1)

Slave IC

SCL

SDA

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(1) I2C bus mode functions

In the I2C bus mode, the following functions are available.

(a) Automatic identification of serial data

Slave devices automatically detect and identify start condition, data, and stop condition signals sent in
series via the serial data bus.

(b) Chip selection by specifying device addresses

The master device can select a specific slave device connected to the I2C bus and communicate with it
by sending in advance the address data corresponding to the destination device.

(c) Wakeup function

When address data is sent from the master device, slave devices compare it with the value registered in
their internal slave address registers. If the values in one of the slave devices match, the slave device
internally generates an interrupt request signal to terminate the current processing and communicates
with the master device (the interrupt request also occurs when the stop condition is detected). Therefore,
CPUs other than the selected slave device on the I2C bus can perform independent operations during
the serial communication.

(d) Acknowledge signal (ACK) control function

The master device and a slave device send and receive acknowledge signals to confirm that the serial
communication has been executed normally.

(e) Wait signal (WAIT) control function

When a slave device is preparing for data transmission or reception and requires more waiting time, the
slave device outputs a wait signal on the bus to inform the master device of the wait status.

(2) I2C bus definition

This section describes the format of serial data communications and functions of the signals used in the
I2C bus mode.
First, the transfer timing of the “start condition”, “data”, and “stop condition” signals, which are output onto
the signal data bus of the I2C bus, is shown in Figure 17-14.

Figure 17-14. I2C Bus Serial Data Transfer Timing

SCL 1 to 7 8 9 1 to 7 8 9 1 to 7 8 9

SDA0 (SDA1)

Start Address R/W ACK Data ACK Data ACK Stop

condition condition

The start condition, slave address, and stop condition signals are output by the master. The acknowledge
signal (ACK) is output by either the master or the slave device (normally by the device which has received
the 8-bit data that was sent). A serial clock (SCL) is continuously supplied from the master device.

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(a) Start condition

When the SDA0 (SDA1) pin level is changed from high to low while the SCL pin is high, this transition is
recognized as the start condition signal. This start condition signal, which is created using the SCL and
SDA0 (or SDA1) pins, is output from the master device to slave devices to initiate a serial transfer. See
17.4.5 Cautions on Use of I2C Bus Mode, for details of the start condition output.
The start condition signal is detected by hardware incorporated in slave devices.

Figure 17-15. Start Condition

H
SCL

SDA0 (SDA1)

(b) Address
The 7 bits following the start condition signal are defined as an address.
The 7-bit address data is output by the master device to specify a specific slave from among those
connected to the bus line. Each slave device on the bus line must therefore have a different address.
Therefore, after a slave device detects the start condition, it compares the 7-bit address data received
and the data of the slave address register (SVA). After the comparison, only the slave device in which
the data are a match becomes the communication partner, and subsequently performs communication
with the master device until the master device sends a start condition or stop condition signal.

Figure 17-16. Address

SCL 1 2 3 4 5 6 7

SDA0 (SDA1) A6 A5 A4 A3 A2 A1 A0 R/W

Address

(c) Transfer direction specification

The 1 bit that follows the 7-bit address data will be sent from the master device, and it is defined as the
transfer direction specification bit. If this bit is 0, it is the master device which will send data to the slave.
If it is 1, it is the slave device which will send data to the master.

Figure 17-17. Transfer Direction Specification

SCL 1 2 3 4 5 6 7 8

SDA0 (SDA1) A6 A5 A4 A3 A2 A1 A0 R/W

Transfer direction
specification

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(d) Acknowledge signal (ACK)

The acknowledge signal indicates that the transferred serial data has definitely been received. This
signal is used between the transmitting side and receiving side devices for confirmation of correct data
transfer. In principle, the receiving side device returns an acknowledge signal to the transmitting device
each time it receives 8-bit data. The only exception is when the receiving side is the master device and
the 8-bit data is the last transfer data; the master device outputs no acknowledge signal in this case.
The transmitting side that has transferred 8-bit data waits for the acknowledge signal which will be sent
from the receiving side. If the transmitting side device receives the acknowledge signal, which means a
successful data transfer, it proceeds to the next processing. If this signal is not sent back from the slave
device, this means that the data sent has not been received by the slave device, and therefore the
master device outputs a stop condition signal to terminate subsequent transmissions.

Figure 17-18. Acknowledge Signal

SCL 1 2 3 4 5 6 7 8 9

SDA0 (SDA1) A6 A5 A4 A3 A2 A1 A0 R/W ACK

(e) Stop condition

If the SDA0 (SDA1) pin level changes from low to high while the SCL pin is high, this transition is defined
as a stop condition signal.
The stop condition signal is output from the master to the slave device to terminate a serial transfer.
The stop condition signal is detected by hardware incorporated in the slave device.

Figure 17-19. Stop Condition

H
SCL

SDA0 (SDA1)

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(f) Wait signal (WAIT)

The wait signal is output by a slave device to inform the master device that the slave device is in a wait
state due to preparing for transmitting or receiving data.
During the wait state, the slave device continues to output the wait signal by keeping the SCL pin low to
delay subsequent transfers. When the wait state is released, the master device can start the next transfer.
For the releasing operation of slave devices, see 17.4.5 Cautions on Use of I2C Bus Mode.

Figure 17-20. Wait Signal

(a) Wait of 8 clock cycles

Set low because slave device drives low,

though master device returns to Hi-Z state.
No wait is inserted after 9th clock cycle
(and before master device starts next transfer).

SCL of
6 7 8 9 1 2 3 4
master device

SCL of
slave device

SCL

SDA0 (SDA1) D2 D1 D0 ACK D7 D6 D5 D4

Output by manipulating ACKT

(b) Wait of 9 clock cycles

Set low because slave device drives low,

though master device returns to Hi-Z state.

SCL of
master device 6 7 8 9 1 2 3

SCL of
slave device

SCL

SDA0 (SDA1) D2 D1 D0 ACK D7 D6 D5

Output based on the value set in ACKE in advance

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(3) Register setting

The I 2C mode setting is performed by serial operating mode register 0 (CSIM0), the serial bus interface
control register (SBIC), and the interrupt timing specification register (SINT).

(a) Serial operating mode register 0 (CSIM0)

CSIM0 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM0 to 00H.

Symbol <7> <6> <5> 4 3 2 1 0 Address After reset R/W

CSIM0 CSIE0 COI WUP CSIM04 CSIM03 CSIM02 CSIM01 CSIM00 FF60H 00H R/WNote 1

R/W CSIM01 CSIM00 Serial interface channel 0 clock selection

0 × Input clock from off-chip to SCL pin
1 0 8-bit timer register 2 (TM2) outputNote 2
1 1 Clock specified with bits 0 to 3 of timer clock select register 3 (TCL3)

R/W CSIM CSIM CSIM PM25 P25 PM26 P26 PM27 P27 Operation Start SI0/SB0/SDA0/ SO0/SB1/SDA1/ SCK0/SCL/P27
04 03 02 mode bit P25 pin function P26 pin function pin function
0 × 3-wire serial I/O mode (see 17.4.2 Operation in 3-wire serial I/O mode)
1 1 0 × × 0 0 0 1 2-wire MSB P25 SB1/SDA1 SCK0/SCL
Note 3 Note 3 serial I/O or (CMOS I/O) N-ch open- N-ch open-
I2C bus mode drain I/O drain I/O
1 1 1 0 0 × × 0 1 2-wire MSB SB0/SDA0 P26 SCK0/SCL
Note 3 Note 3 serial I/O or N-ch open- (CMOS I/O) N-ch open-
I2C bus mode drain I/O drain I/O

R/W WUP Wake-up function controlNote 4

0 Interrupt request signal generation with each serial transfer in any mode
1 In I2C bus mode, interrupt request signal is generated when the address data received after start condition
detection (when CMDD = 1) matches data in slave address register (SVA).

R COI Slave address comparison result flagNote 5

0 Slave address register (SVA) not equal to data in serial I/O shift register 0 (SIO0)
1 Slave address register (SVA) equal to data in serial I/O shift register 0 (SIO0)

R/W CSIE0 Serial interface channel 0 operation control

0 Operation stopped.
1 Operation enabled.

Notes 1. Bit 6 (COI) is a read-only bit.

2. In the I2C bus mode, the clock frequency is 1/16 of the clock frequency output by TO2.
3. Can be used freely as a port.
4. To use the wakeup function (WUP = 1), set bit 5 (SIC) of the interrupt timing specification
register (SINT) to 1. Do not execute an instruction that writes serial I/O shift register 0 (SIO0)
while WUP = 1.
5. When CSIE0 = 0, COI is 0.

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

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(b) Serial bus interface control register (SBIC)

SBIC is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SBIC to 00H.
Symbol <7> <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

SBIC BSYE ACKD ACKE ACKT CMDD RELD CMDT RELT FF61H 00H R/WNote 1

R/W RELT Use for stop condition output. When RELT = 1, the SO0 latch is set to 1. After the SO0 latch is set, RELT
is automatically cleared to 0. Also cleared to 0 when CSIE0 = 0.

R/W CMDT Use for start condition output. When CMDT = 1, the SO0 latch is cleared to 0. After the SO0 latch is
cleared, CMDT is automatically cleared to 0. It is also cleared to 0 when CSIE0 = 0.

R RELD Stop condition detection

0 Clear conditions
• When transfer start instruction is executed
• If SIO0 and SVA values do not match in address reception
• When CSIE0 = 0
• When RESET input is applied
1 Setting condition
• When stop condition is detected

R CMDD Start condition detection

0 Clear conditions
• When transfer start instruction is executed
• When stop condition is detected
• When CSIE0 = 0
• When RESET input is applied
1 Setting condition
• When start condition is detected

R/W ACKT SDA0 (SDA1) is set to low after the Set instruction execution (ACKT = 1) before the next SCL falling edge.
Used for generating an ACK signal by software if the 8-clock wait mode is selected. Cleared to 0 if CSIE0
= 0 when a transfer by the serial interface is started.

R/W ACKE Acknowledge signal automatic output controlNote 2

0 Disabled (with ACKT enabled). Used when receiving data in the 8-clock wait mode or when transmitting
data.Note 3
1 Enabled.
After completion of transfer, the acknowledge signal is output in ACKE is synchronization with the 9th falling
edge of the SCL clock (automatically output when ACKE = 1). However, ACKE is not automatically cleared to
0 after acknowledge signal is output. It is used for reception when the 9-clock wait mode is selected.

R ACKD Acknowledge detection

0 Clear Conditions
• When transfer start instruction is executed
• When CSIE0 = 0
• When RESET input is applied
1 Set Conditions
• When the acknowledge signal is detected at the rising edge of SCL clock after completion of transfer
Note 4
R/W Control of N-ch open-drain output for transmission in I2C bus modeNote 5
BSYE

0 Output enabled (transmission)

1 Output disabled (reception)
Notes 1. Bits 2, 3, and 6 (RELD, CMDD, ACKD) are read-only bits.
2. This setting must be performed prior to transfer start.
3. In the 8-clock wait mode, use ACKT for output of the acknowledge signal after normal data
reception.
4. The busy mode can be released by the start of a serial interface transfer or reception of an address
signal. However, the BSYE flag is not cleared.
5. When using the wakeup function, be sure to set BSYE to 1.

Remark CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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(c) Interrupt timing specification register (SINT)

SINT is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SINT to 00H.

Symbol 7 <6> <5> <4> <3> <2> 1 0 Address After reset R/W

SINT 0 CLD SIC SVAM CLC WREL WAT1 WAT0 FF63H 00H R/WNote 1

R/W WAT1 WAT0 Interrupt control by waitNote 2

0 0 Interrupt service request is generated on rise of 8th SCK0 clock cycle (clock output is high
impedance).
0 1 Setting prohibited
1 0 Used in I2C bus mode (8-clock wait)
Generates an interrupt service request on rise of 8th SCL clock cycle. (In case of master device,
SCL pin is driven low after output of 8 clock cycles, to enter the wait state. In case of slave device,
SCL pin is driven low after input of 8 clock cycles, to require the wait state.)
1 1 Used in I2C bus mode (9-clock wait)
Generates an interrupt service request on rise of 9th SCL clock cycle. (In case of master device,
SCL pin is driven low after output of 9 clock cycles, to enter the wait state. In case of slave device,
SCL pin is driven low after input of 9 clock cycles, to require the wait state.)

R/W WREL Wait release control

0 Indicates that the wait state has been released.
1 Releases the wait state. Automatically cleared to 0 after releasing the wait state. This bit is used to release
the wait state set by means of WAT0 and WAT1.

R/W CLC Clock level control

0 Used in I2C bus mode. In cases other than serial transfer, SCL pin output is driven low.
1 Used in I2C bus mode. In cases other than serial transfer, SCL pin output is set to high impedance. (Clock
line is held high.) Used by master device to generate the start condition and stop condition signals.

R/W SVAM SVA bits used as slave address

0 Bits 0 to 7
1 Bits 1 to 7

R/W SIC INTCSI0 interrupt source selectionNote 3

0 CSIIF0 is set to 1 after end of serial interface channel 0 transfer.
1 CSIIF0 is set to 1 after end of serial interface channel 0 transfer or when stop condition is detected.

R CLD SCL pin levelNote 4

0 Low level
1 High level

Notes 1. Bit 6 (CLD) is read-only.

2. When the I2C bus mode is used, be sure to set WAT0 and WAT1 to 1 and 0, or 1 and 1, respectively.
3. When using the wakeup function in I2C mode, be sure to set SIC to 1.
4. When CSIE0 = 0, CLD is 0.

Remark SVA: Slave address register

CSIIF0: Interrupt request flag corresponding to INTCSI0
CSIE0: Bit 7 of serial operating mode register 0 (CSIM0)

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(4) Various signals

A list of signals in the I2C bus mode is given in Table 17-4.

Table 17-4. Signals in I2C Bus Mode

Signal name Description

Start condition Definition: SDA0 (SDA1) falling edge when SCL is highNote 1
Function: Indicates that serial communication starts and subsequent data is address data.
Signaled by: Master
Signaled when: CMDT is set.
Affected flag(s): CMDD (is set.)
Stop condition Definition: SDA0 (SDA1) rising edge when SCL is highNote 1
Function: Indicates end of serial transmission.
Signaled by: Master
Signaled when: RELT is set.
Affected flag(s): RELD (is set) and CMDD (is cleared)
Acknowledge signal (ACK) Definition: Low level of SDA0 (SDA1) pin during one SCL clock cycle after serial reception
Function: Indicates completion of reception of 1 byte.
Signaled by: Master or slave
Signaled when: ACKT is set with ACKE = 1.
Affected flag(s): ACKD (is set.)
Wait (WAIT) Definition: Low-level signal output to SCL
Function: Indicates state in which serial reception is not possible.
Signaled by: Slave
Signaled when: WAT1, WAT0 = 1x.
Affected flag(s): None
Serial clock (SCL) Definition: Synchronization clock for output of various signals
Function: Serial communication synchronization signal.
Signaled by: Master
Signaled when: See Note 2 below.
Affected flag(s): CSIIF0. Also see Note 3 below.
Address (A6 to A0) Definition: 7-bit data synchronized with SCL immediately after start condition signal
Function: Indicates address value for specification of slave on serial bus.
Signaled by: Master
Signaled when: See Note 2 below.
Affected flag(s): CSIIF0. Also see Note 3 below.
Transfer direction (R/W) Definition: 1-bit data output in synchronization with SCL after address output
Function: Indicates whether data transmission or reception is to be performed.
Signaled by: Master
Signaled when: See Note 2 below.
Affected flag(s): CSIIF0. Also see Note 3 below.
Data (D7 to D0) Definition: 8-bit data synchronized with SCL, not immediately after start condition
Function: Contains data to be actually sent.
Signaled by: Master or slave
Signaled when: See Note 2 below.
Affected flag(s): CSIIF0. Also see Note 3 below.

Notes 1. The level of the serial clock can be controlled with bit 3 (CLC) of interrupt timing specify register
(SINT).
2. Execution of instruction to write data to SIO0 when CSIE0 = 1 (serial transfer start directive). In
the wait state, the serial transfer operation will be started after the wait state is released.
3. If the 8-clock wait is selected when WUP = 0, CSIIF0 is set at the rising edge of the 8th clock cycle
of SCL. If the 9-clock wait is selected when WUP = 0, CSIIF0 is set at the rising edge of the 9th
clock cycle of SCL. CSIIF0 is set if an address is received and that address matches the value
of the slave address register (SVA) when WUP = 1, or if the stop condition is detected.

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(5) Pin configurations

The configurations of the serial clock pin SCL and the serial data bus pins SDA0 (SDA1) are shown below.

(a) SCL
Pin for serial clock input/output alternate-function pin.
<1> Master ..... N-ch open-drain output
<2> Slave ....... Schmitt input

(b) SDA0 (SDA1)

Serial data I/O alternate-function pin.
Uses N-ch open-drain output and Schmitt-input buffers for both master and slave devices.

Note that pull-up resistors are required to be connected to both the serial clock line and serial data bus
line, because open-drain buffers are used for the serial clock pin (SCL) and the serial data bus pin
(SDA0 or SDA1) on the I2C bus.

Figure 17-21. Pin Configuration

VDD0 Slave devices

Master device

SCL SCL
Clock output VDD0 (Clock output)
VSS0 VSS0
(Clock input) Clock input

SDA0 (SDA1)
Data output SDA0 (SDA1) Data output
VSS0 VSS0
Data input Data input

Caution To receive data, the N-ch open-drain output must made to go into a high-impedance
state. Therefore, set bit 7 (BSYE) of the serial bus interface control register (SBIC) to
1 in advance, and write FFH to serial I/O shift register 0 (SIO0).
When the wakeup function is used (by setting bit 5 (WUP) of serial operating mode
register 0 (CSIM0)), however, do not write FFH to SIO0 before reception. Even if FFH
is not written to SIO0, the N-ch open-drain output always goes into a high-impedance
state.

(6) Address match detection method

In the I2C mode, the master can select a specific slave device by sending slave address data.
A match of the addresses can be automatically detected by hardware. CSIIF0 is set if the slave address
transmitted by the master matches the value set to the slave address register (SVA) when a slave device
address has a slave register (SVA), and the wakeup function specification bit (WUP) = 1 (CSIIF0 is also
set when the stop condition is detected).
When using the wakeup function, set SIC to 1.

Caution Slave selection/non-selection is detected by matching of the data (address) received after
the start condition.
For this match detection, the match interrupt request (INTCSI0) of the address to be
generated with WUP = 1 is normally used. Thus, execute selection/non-selection detection
by slave address when WUP = 1.

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(7) Error detection

In the I2C bus mode, transmission error detection can be performed by the following methods because the
serial bus SDA0 (SDA1) status during transmission is also taken into the serial I/O shift register 0 (SIO0)
register of the transmitting device.

(a) Comparison of SIO0 data before and after transmission

In this case, a transmission error is judged to have occurred if the two data values are different.

(b) Using the slave address register (SVA)

Transmit data is set in SIO0 and SVA before transmission is performed. After transmission, the COI bit
(match signal from the address comparator) of serial operating mode register 0 (CSIM0) is tested: “1”
indicates normal transmission, and “0” indicates a transmission error.

(8) Communication operation

In the I2C bus mode, the master selects the slave device to be communicated with from among multiple
devices by outputting address data onto the serial bus.
After the slave address data, the master sends the R/W bit which indicates the data transfer direction, and
starts serial communication with the selected slave device.
Data communication timing charts are shown in Figures 17-22 and 17-23.
In the transmitting device, serial I/O shift register 0 (SIO0) shifts transmission data to the SO latch in
synchronization with the falling edge of the serial clock (SCL), the SO0 latch outputs the data on an MSB-
first basis from the SDA0 or SDA1 pin to the receiving device.
In the receiving device, the data input from the SDA0 or SDA1 pin is taken into the SIO0 in synchronization
with the rising edge of SCL.

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Figure 17-22. Data Transmission from Master to Slave

(Both Master and Slave Selected 9-Clock Wait) (1/3)

(a) Start condition to address

Master device operation

SIO0 ← Address SIO0 ← Data

Write SIO0
COI
ACKD
CMDD
RELD L
CLD
P27 H
WUP L
BSYE L
ACKE L
CMDT
RELT L
CLC
WREL L
SIC L
INTCSI0

Transfer line
SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5
SDA0 A6 A5 A4 A3 A2 A1 A0 W ACK D7 D6 D5 D4 D3

Slave device operation

SIO0 ← FFH
Write SIO0
COI
ACKD
CMDD
RELD L
CLD
P27
WUP
BSYE H
ACKE H
CMDT L
RELT L
CLC L
WREL L
SIC H
INTCSI0
CSIE0 H
P25 L
PM25 L
PM27 L

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Figure 17-22. Data Transmission from Master to Slave

(Both Master and Slave Selected 9-Clock Wait) (2/3)

(b) Data

Master device operation

SIO0 ← Address SIO0 ← Data

Write SIO0
COI
ACKD
CMDD
RELD L
CLD
P27 H
WUP L
BSYE L
ACKE L
CMDT L
RELT L
CLC L
WREL L
SIC L
INTCSI0

Transfer line
SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5
SDA0 D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3

Slave device operation

SIO0 ← FFH SIO0 ← FFH
Write SIO0
COI
ACKD
CMDD
RELD L
CLD
P27
WUP L
BSYE H
ACKE H
CMDT L
RELT L
CLC L
WREL L
SIC H
INTCSI0
CSIE0 H
P25 L
PM25 L
PM27 L

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Figure 17-22. Data Transmission from Master to Slave

(Both Master and Slave Selected 9-Clock Wait) (3/3)

(c) Stop condition

Master device operation

SIO0 ← Data SIO0 ← Address

Write SIO0
COI
ACKD
CMDD
RELD L
CLD
P27 H
WUP L
BSYE L
ACKE L
CMDT
RELT
CLC
WREL L
SIC L
INTCSI0

Transfer line
SCL 1 2 3 4 5 6 7 8 9 1 2 3 4
SDA0 D7 D6 D5 D4 D3 D2 D1 D0 ACK A6 A5 A4 A3

Slave device operation

SIO0 ← FFH SIO0 ← FFH
Write SIO0
COI
ACKD
CMDD
RELD
CLD
P27
WUP
BSYE H
ACKE H
CMDT L
RELT
CLC L
WREL L
SIC H
INTCSI0
CSIE0
P25
PM25
PM27 L

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Figure 17-23. Data Transmission from Slave to Master

(Both Master and Slave Selected 9-Clock Wait) (1/3)

(a) Start condition to address

Master device operation

SIO0 ← Address SIO0 ← FFH

Write SIO0
COI
ACKD
CMDD
RELD L
CLD
P27 H
WUP L
BSYE
ACKE
CMDT
RELT L
CLC
WREL L
SIC L
INTCSI0

Transfer line
SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5
SDA0 A6 A5 A4 A3 A2 A1 A0 R ACK D7 D6 D5 D4 D3

Slave device operation

SIO0 ← Data
Write SIO0
COI
ACKD
CMDD
RELD L
CLD
P27
WUP
BSYE
ACKE
CMDT L
RELT L
CLC L
WREL L
SIC H
INTCSI0
CSIE0 H
P25 L
PM25 L
PM27 L

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Figure 17-23. Data Transmission from Slave to Master

(Both Master and Slave Selected 9-Clock Wait) (2/3)

(b) Data

Master device operation

SIO0 ← FFH SIO0 ← FFH

Write SIO0
COI
ACKD
CMDD
RELD L
CLD
P27 H
WUP L
BSYE H
ACKE H
CMDT L
RELT L
CLC L
WREL L
SIC L
INTCSI0

Transfer line
SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5
SDA0 D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3

Slave device operation

SIO0 ← Data SIO0 ← Data
Write SIO0
COI
ACKD
CMDD
RELD L
CLD
P27
WUP L
BSYE L
ACKE L
CMDT L
RELT L
CLC L
WREL L
SIC H
INTCSI0
CSIE0 H
P25 L
PM25 L
PM27 L

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Figure 17-23. Data Transmission from Slave to Master

(Both Master and Slave Selected 9-Clock Wait) (3/3)

(c) Stop condition

Master device operation

SIO0 ← FFH SIO0 ← Address

Write SIO0
COI
ACKD
CMDD
RELD L
CLD
P27 H
WUP L
BSYE
ACKE
CMDT
RELT
CLC
WREL L
SIC L
INTCSI0

Transfer line
SCL 1 2 3 4 5 6 7 8 9 1 2 3 4
SDA0 D7 D6 D5 D4 D3 D2 D1 D0 NAK A6 A5 A4 A3

Slave device operation

SIO0 ← Data
Write SIO0
COI
ACKD
CMDD
RELD
CLD
P27
WUP
BSYE
ACKE
CMDT L
RELT L
CLC L
WREL
SIC H
INTCSI0
CSIE0 H
P25 L
PM25 L
PM27 L

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(9) Transfer start

A serial transfer is started by setting transfer data in serial I/O shift register 0 (SIO0) if the following two
conditions have been satisfied.

• The serial interface channel 0 operation control bit (CSIE0) = 1.

• After an 8-bit serial transfer, the internal serial clock is stopped or SCL is low.

Cautions 1. Be sure to set CSIE0 to 1 before writing data in SIO0. Setting CSIE0 to 1 after writing data
in SIO0 does not initiate transfer operation.
2. Because the N-ch open-drain output must made to go into a high-impedance state during
data reception, set bit 7 (BSYE) of the serial bus interface control register (SBIC) to 1
before writing FFH to SIO0.
Do not write FFH to SIO0 before reception when the wakeup function is used (by setting
bit 5 (WUP) of serial operating mode register 0 (CSIM0)). Even if FFH is not written to
SIO0, the N-ch open-drain output always goes into a high-impedance state.
3. If data is written to SIO0 while the slave is in the wait state, that data is held. The transfer
is started when SCL is output after the wait state is cleared.

When an 8-bit data transfer ends, serial transfer is stopped automatically and the interrupt request flag
(CSIIF0) is set.

17.4.5 Cautions on use of I2C bus mode

(1) Start condition output (master)

The SCL pin normally outputs a low-level signal when no serial clock is output. It is necessary to change
the SCL pin to high in order to output a start condition signal. Set CLC to 1 in the interrupt timing specification
register (SINT) to drive the SCL pin high.
After setting CLC, clear CLC to 0 and return the SCL pin to low. If CLC remains 1, no serial clock is
output.
If it is the master device which outputs the start condition and stop condition signals, confirm that CLD is
set to 1 after setting CLC to 1; a slave device may have set SCL to low (wait state).

Figure 17-24. Start Condition Output

SCL

SDA0 (SDA1)

CLC

CMDT

CLD

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(2) Slave wait release (slave transmission)

Slave wait status is released by WREL flag (bit 2 of interrupt timing specification register (SINT)) setting or
execution of a serial I/O shift register 0 (SIO0) write instruction.
If the slave sends data, the wait is immediately released by execution of an SIO0 write instruction and the
clock rises without the start transmission bit being output in the data line. Therefore, as shown in Figure
17-25, data should be transmitted by manipulating the P27 output latch through the program. At this time,
control the low-level width (“a” in Figure 17-25) of the first serial clock at the timing used for setting the
P27 output latch to 1 after execution of an SIO0 write instruction.
In addition, if the acknowledge signal from the master is not output (if data transmission from the slave is
completed), set 1 in the WREL flag of SINT and release the wait.
For this timing, see Figure 17-23.

Figure 17-25. Slave Wait Release (Transmission)

Master device operation

Writing
Software operation FFH
to SIO0

Hardware operation Setting Setting

Serial reception
ACKD CSIIF0

Transfer line

SCL 9 a 1 2 3

SDA0 (SDA1) A0 R ACK D7 D6 D5

Slave device operation

P27 Write P27

Software operation Output data Output
latch 0 to SIO0 latch 1

Hardware operation ACK Setting Wait

output CSIIF0 release Serial transmission

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(3) Slave wait release (slave reception)

The slave is released from the wait status when the WREL flag (bit 2 of the interrupt timing specification
register (SINT)) is set or when an instruction that writes data to serial I/O shift register 0 (SIO0) is executed.
When the slave receives data, the first bit of the data sent from the master may not be received if the SCL
line immediately goes into a high-impedance state after an instruction that writes data to SIO has been
executed.
This is because SIO0 does not start operating if the SCL line is in the high-impedance state while the
instruction that writes data to SIO0 is being executed (until the next instruction is executed).
Therefore, receive the data by manipulating the output latch of P27 by program, as shown in Figure 17-26.
For this timing, see Figure 17-22.

Figure 17-26. Slave Wait Release (Reception)

Master device operation

Writing
Software operation data to
SIO0

Setting Setting
Hardware operation Serial transmission
ACKD CSIIF0

Transfer line

SCL 9 1 2 3

SDA0 (SDA1) A0 W ACK D7 D6 D5

Slave device operation

P27 Write P27

Software operation Output FFH Output
latch 0 to SIO0 latch 1

ACK Setting Wait

Hardware operation Serial reception
output CSIIF0 release

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(4) Reception completion of slave

In the reception completion processing of the slave, check bit 3 (CMDD) of the serial bus interface control
register (SBIC) and bit 6 (COI) of serial operation mode register 0 (CSIM0) (when CMDD = 1). This is to
avoid the situation where the slave cannot judge which of the start condition and data comes first and
therefore the wakeup condition cannot be used when the slave receives an undefined number of data from
the master.

17.4.6 Restrictions in I2C bus mode 1

The following restrictions are applied to the µPD780058Y Subseries.

• Restrictions when used as slave device in I2C bus mode

Target device: µPD780053Y, 780054Y, 780055Y, 780056Y, 780058BY, 78F0058Y, IE-780308-R-EM,

IE-780308-NS-EM1

Description: If the wakeup function is executed (by setting bit 5 of serial operating mode register 0
(CSIM0) to 1) in the serial transfer statusNote, the µPD780058Y Subseries checks the
address of the data between the other slaves and the master. If that data happens to
match the slave address of the µPD780058Y Subseries, the µPD780058Y Subseries
takes part in communication, destroying the communication data.

Note The serial transfer status is the status from when data is written to serial I/O shift
register 0 (SIO0) until the interrupt request flag (CSIIF0) is set to 1 by completion
of the serial transfer.

Preventive measure: The above phenomenon can be avoided by modifying the program.
Before executing the wakeup function, execute the following program that clears the
serial transfer status. When executing the wakeup function, do not execute an instruction
that writes data to SIO0. Even if such an instruction is not executed, data can be received
when the wakeup function is executed.
This program releases the serial transfer status. To release the serial transfer status,
serial interface channel 0 must be disabled once (by clearing the CSIE0 flag (bit 7 of the
serial operating mode register (CSIM0) to 0). If serial interface channel 0 is disabled in
the I2C bus mode, however, the SCL pin outputs a high level, and the SDA0 (SDA1) pin
outputs a low level, affecting communication of the I2C bus. Therefore, this program
makes the SCL and SDA0 (SDA1) pins go into a high-impedance state to prevent the
I2C bus from being affected.
In this example, the SDA0 (/P25) pin is used as a serial data input/output pin. When
SDA1 (/P26) is used, take P2.5 and PM2.5 in the program example below as P2.6 and
PM2.6.
For the timing of each signal when this program is executed, see Figure 17-22.

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• Example of program releasing serial transfer status

SET1 P2.5; <1>

SET1 PM2.5; <2>
SET1 PM2.7; <3>
CLR1 CSIE0; <4>
SET1 CSIE0; <5>
SET1 RELT; <6>
CLR1 PM2.7; <7>
CLR1 P2.5; <8>
CLR1 PM2.5; <9>

<1> This instruction prevents the SDA0 pin from outputting a low level when the I2C bus mode is restored
by instruction <5>. The output of the SDA0 pin goes into a high-impedance state.
<2> This instruction sets the P25 (/SDA0) pin in the input mode to protect the SDA0 line from adverse
influence when the port mode is set by instruction <4>. The P25 pin is set in the input mode when
instruction <2> is executed.
<3> This instruction sets the P27 (/SCL) pin in the input mode to protect the SCL line from adverse influence
when the port mode is set by instruction <4>. The P27 pin is set in the input mode when instruction
<3> is executed.
<4> This instruction changes the mode from I2C bus mode to port mode.
<5> This instruction restores the I2C bus mode from the port mode.
<6> This instruction prevents the SDA0 pin from outputting a low level when instruction <8> is executed.
<7> This instruction sets the P27 pin in the output mode because the P27 pin must be in the output mode
in the I2C bus mode.
<8> This instruction clears the output latch of the P25 pin to 0 because the output latch of the P25 pin
must be cleared to 0 in the I2C bus mode.
<9> This instruction sets the P25 pin in the output mode because the P25 pin must be in the output mode
in the I2C bus mode.

Remark RELT: Bit 0 of serial bus interface control register (SBIC)

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17.4.7 Restrictions in I2C bus mode 2

When using the I2C bus mode under the following conditions, the STOP condition is detected and an interrupt
occurs when CSIE0 is set to 1. To enable the operation (by setting CSIE0 to 1), therefore, perform the following
processing.

Condition: If a low level is used when CSIE0 is set to 1 when using the P26/SDA as the SDA line and P25/SDA0
as an input port

(1) When operation is enabled

SET1 CSIMK0 ; Disables INTCSI0 interrupt.

SET1 CSIE0 ; Enables IIC operation.
CLR1 CSIIF0 ; Clears INTCSI0 interrupt request flag.
CLR1 CSIMK0 ; Enables INTCSI0 interrupt.

Cautions 1. After that, RELD = 1 (stop condition is detected) until data that does not match the source
station slave address (SVA) is received.
2. Even if a start condition is satisfied while RELD = 1 (stop condition is detected), the
interrupt occurs if it is enabled and CMDD = 1 (start condition is detected).

(2) When using as slave device in I2C bus mode (if restrictions in 17.4.6 apply)
Example of program releasing serial transfer status

SET1 CSIMK0 ; Disables INTCSI0 interrupt.

SET1 P2.6
SET1 PM2.6
SET1 PM2.7
CLR1 CSIE0 ; Stops IIC operation.
SET1 CSIE0 ; Enables IIC operation.
CLR1 CSIIF0 ; Clears INTCSI0 interrupt request flag.
CLR1 CSIMK0 ; Enables INTCSI0 interrupt.
SET1 RELT
CLR1 PM2.7
CLR1 P2.6
CLR1 PM2.6

Cautions 1. After that, RELD = 1 (stop condition is detected) until data that does not match the source
station slave address (SVA) is received.
2. Even if a start condition is satisfied while RELD = 1 (stop condition is detected), the
interrupt occurs if it is enabled and CMDD = 1 (start condition is detected).

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17.4.8 SCK0/SCL/P27 pin output manipulation

The SCK0/SCL/P27 pin can execute static output via software, in addition to outputting the normal serial clock.
The value of the serial clock can also be arbitrarily set by software (the SI0/SB0/SDA0 and SO0/SB1/SDA1 pins
are controlled by bit 0 (RELT) and bit 1 (CMDT) of the serial bus interface control register (SBIC)).
The SCK0/SCL/P27 pin output should be manipulated as described below.

(1) In 3-wire serial I/O mode and 2-wire serial I/O mode
The output level of the SCK0/SCL/P27 pin is manipulated by the P27 output latch.

<1> Set serial operating mode register 0 (CSIM0) (SCK0 pin: Output mode, serial operation: Enabled).
SCK0 = 1 while serial transfer is stopped.
<2> Manipulate the contents of the P27 output latch by executing a bit manipulation instruction.

Figure 17-27. SCK0/SCL/P27 Pin Configuration

Manipulated by bit manipulation instruction

SCK0/SCL/P27 To internal logic P27

Output latch

SCK0 (1 while transfer is stopped)

From serial clock
CSIE0 = 1 and CSIM01, CSIM00 are 1, 0 or 1, 1, respectively controller

(2) In I2C bus mode

The output level of the SCK0/SCL/P27 pin is manipulated by the CLC bit of the interrupt timing specification
register (SINT).

<1> Set serial operating mode register 0 (CSIM0) (SCL pin: Output mode, serial operation: Enabled). Set
the P27 output latch to 1. SCL = 0 while serial transfer is stopped.
<2> Manipulate the CLC bit of SINT by executing a bit manipulation instruction.

Figure 17-28. SCK0/SCL/P27 Pin Configuration

Set 1

SCK0/SCL/P27 To internal logic P27

Output latch

Note
SCL
From serial clock
CSIE0 = 1 and CSIM01 and CSIM00 are 1, 0 or 1, 1, respectively controller

Note The level of the SCL signal is in accordance with the contents of the logic circuits shown in Figure
17-29.

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Figure 17-29. Logic Circuit of SCL Signal

CLC (manipulated by bit manipulation instruction)

SCL Wait request signal

Serial clock (low while transfer is stopped)

Remarks 1. This figure indicates the relationship of the signals and does not indicate the internal circuit.
2. CLC: Bit 3 of interrupt timing specification register (SINT)

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18.1 Functions of Serial Interface Channel 1

Serial interface channel 1 employs the following three modes.

• Operation stop mode

• 3-wire serial I/O mode
• 3-wire serial I/O mode with automatic transmit/receive function

(1) Operation stop mode

This mode is used when serial transfer is not carried out to reduce power consumption.

(2) 3-wire serial I/O mode (MSB-/LSB-first switchable)

This mode is used for 8-bit data transfer using three lines: a serial clock (SCK1), serial output (SO1), and
serial input (SI1).
The 3-wire serial I/O mode enables simultaneous transmission/reception and so decreases the data transfer
processing time.
Since the start bit of 8-bit data to undergo serial transfer is switchable between the MSB and LSB, connection
is enabled with either start bit device.
The 3-wire serial I/O mode is valid for connection of peripheral I/O units and display controllers which
incorporate a conventional synchronous serial interface such as the 75X/XL, 78K, and 17K Series.

(3) 3-wire serial I/O mode with automatic transmit/receive function (MSB-/LSB-first switchable)
This mode is equivalent to the 3-wire serial I/O mode with the addition of an automatic transmit/receive function.
The automatic transmit/receive function is used to transmit/receive data with a maximum of 32 bytes. This
function enables the hardware to transmit/receive data to/from the OSD (On Screen Display) device and a
device with built-in display controller/driver independently of the CPU, thus alleviating the software load.

Caution When using the P23/STB/TxD1 and P24/BUSY/RxD1 pins in the asynchronous serial interface
(UART) mode of serial interface channel 2, the busy control option and busy & strobe control
option are invalid.

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18.2 Configuration of Serial Interface Channel 1

Serial interface channel 1 consists of the following hardware.

Table 18-1. Configuration of Serial Interface Channel 1

Item Configuration
Registers Serial I/O shift register 1 (SIO1)
Automatic data transmit/receive address pointer (ADTP)
Control registers Timer clock select register 3 (TCL3)
Serial operating mode register 1 (CSIM1)
Automatic data transmit/receive control register (ADTC)
Automatic data transmit/receive interval specification register (ADTI)
Port mode register 2 (PM2)Note

Note See Figures 6-5 and 6-7 Block Diagram of P20, P21, and P23 to P26 and Figures 6-6 and 6-8 Block
Diagram of P22 and P27.

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Figure 18-1. Block Diagram of Serial Interface Channel 1

Internal bus

Automatic data
transmit/receive
Buffer RAM address pointer
(ADTP)

Internal bus

ATE Automatic data Automatic data

transmit/receive interval transmit/receive Serial operating
specify register control register mode register 1
DIR DIR
ADTI ADTI ADTI ADTI ADTI ADTI RE ARLD ERCE ERR TRF STRB BUSY BUSY CSIE1 DIR ATE CSIM CSIM
7 4 3 2 1 0 1 0 11 10
Serial I/O
SI1/
P20 shift register 1 TRF
Match ADTI0 to ADTI4
(SIO1)
PM21 Selector
SO1/
P21 P21 output
latch 5-bit counter
PM23
STB/
TxD1/P23 Hand-
BUSY/ shake
RxD1/P24

ARLD

Serial clock INTCSI1

counter
SIOI write
Selector

Clear
SCK1/ Selector fXX/2 to fXX/28
Selector
P22 R
Q TO2 4
S
PM22 P22 output latch TCL TCL TCL TCL
37 36 35 34
Timer clock
select register 3

Internal bus

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(1) Serial I/O shift register 1 (SIO1)

This is an 8-bit register used to carry out parallel/serial conversion and to carry out serial transmission/
reception (shift operations) in synchronization with the serial clock.
SIO1 is set with an 8-bit memory manipulation instruction.
When the value in bit 7 (CSIE1) of serial operating mode register 1 (CSIM1) is 1, writing data to SIO1 starts
serial operation.
In transmission, data written to SIO1 is output to the serial output (SO1). In reception, data is read from the
serial input (SI1) to SIO1.
RESET input makes SIO1 undefined.

Caution Do not write data to SIO1 while the automatic transmit/receive function is activated.

(2) Automatic data transmit/receive address pointer (ADTP)

This register stores the value of (the number of transmit data bytes – 1) while the automatic transmit/receive
function is activated. As data is transferred/received, the pointer is automatically decremented.
ADTP is set with an 8-bit memory manipulation instruction. The higher 3 bits must be cleared to 0.
RESET input clears ADTP to 00H.

Caution Do not write data to ADTP while the automatic transmit/receive function is activated.

(3) Serial clock counter

This counter counts the serial clocks to be output and input during transmission/reception to check whether
8-bit data has been transmitted/received.

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18.3 Control Registers of Serial Interface Channel 1

The following four registers are used to control serial interface channel 1.

• Timer clock select register 3 (TCL3)

• Serial operating mode register 1 (CSIM1)
• Automatic data transmit/receive control register (ADTC)
• Automatic data transmit/receive interval specification register (ADTI)

(1) Timer clock select register 3 (TCL3)

This register sets the serial clock of serial interface channel 1.
TCL3 is set with an 8-bit memory manipulation instruction.
RESET input sets TCL3 to 88H.

Remark Besides setting the serial clock of serial interface channel 1, TCL3 sets the serial clock of serial
interface channel 0.

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Figure 18-2. Format of Timer Clock Select Register 3

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

TCL3 TCL37 TCL36 TCL35 TCL34 TCL33 TCL32 TCL31 TCL30 FF43H 88H R/W

TCL37 TCL36 TCL35 TCL34 Serial interface channel 1 serial clock selection

MCS = 1 MCS = 0

0 1 1 0 fXX/2 Setting prohibited fX/22 (1.25 MHz)

0 1 1 1 fXX/22 fX/22 (1.25 MHz) fX/23 (625 kHz)

1 0 0 0 fXX/23 fX/23 (625 kHz) fX/24 (313 kHz)

1 0 0 1 fXX/24 fX/24 (313 kHz) fX/25 (156 kHz)

1 0 1 0 fXX/25 fX/25 (156 kHz) fX/26 (78.1 kHz)

1 0 1 1 fXX/26 fX/26 (78.1 kHz) fX/27 (39.1 kHz)

1 1 0 0 fXX/27 fX/27 (39.1 kHz) fX/28 (19.5 kHz)

1 1 0 1 fXX/28 fX/28 (19.5 kHz) fX/29 (9.8 kHz)

Other than above Setting prohibited

Caution When rewriting other data to TCL3 , stop the serial transfer operation beforehand.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. MCS: Bit 0 of oscillation mode select register (OSMS)
4. Values in parentheses apply to operation with fX = 5.0 MHz

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(2) Serial operating mode register 1 (CSIM1)

This register sets the serial interface channel 1 serial clock, operating mode, operation enable/stop and
automatic transmit/receive operation enable/stop.
CSIM1 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM1 to 00H.

Figure 18-3. Format of Serial Operation Mode Register 1

Symbol <7> 6 <5> 4 3 2 1 0 Address After reset R/W

CSIM1 CSIE1 DIR ATE 0 0 0 CSIM11 CSIM10 FF68H 00H R/W

CSIM11 CSIM10 Serial interface channel 1 clock selection

0 × External clock input to SCK1 pinNote 1
1 0 8-bit timer register 2 (TM2) output
1 1 Clock specified by bits 4 to 7 of timer clock select register 3 (TCL3)

ATE Serial interface channel 1 operating mode selection

0 3-wire serial I/O mode
1 3-wire serial I/O mode with automatic transmit/receive function

DIR Start bit SI1 pin function SO1 pin function

0 MSB SI1/P20 (input) SO1 (CMOS output)
1 LSB

CSIE1 CSIM11 PM20 P20 PM21 P21 PM22 P22 Shift register Serial clock counter SI1/P20 pin SO1/P21 pin SCK1/P22
1 operation operation control function function pin function
Note 2 Note 2 Note 2 Note 2 Note 2 Note 2
Operation Clear P20 P21 P22
0 × × × × × × ×
stop (CMOS I/O) (CMOS I/O) (CMOS I/O)

Note 3 Note 3
Operation Count SI1Note 3 SO1 (CMOS SCK1
1 0 1 × 0 0 1 × enable operation (input) output) (input)
1 0 1 SCK1
(CMOS
output)

Notes 1. If the external clock input has been selected with CSIM11 cleared to 0, clear bit 1 (BUSY1) and
bit 2 (STRB) of the automatic data transmit/receive control register (ADTC) to 0, 0.
2. Can be used freely as a port function.
3. Can be used as P20 (CMOS I/O) when only transmission is performed (clear bit 7 (RE) of ADTC
to 0).

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

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(3) Automatic data transmit/receive control register (ADTC)

This register sets automatic receive enable/disable, the operating mode, strobe output enable/disable, busy
input enable/disable, error check enable/disable and displays automatic transmit/receive execution and error
detection.
ADTC is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears ADTC to 00H.

Figure 18-4. Format of Automatic Data Transmit/Receive Control Register

Symbol <7> <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

ADTC RE ARLD ERCE ERR TRF STRB BUSY1 BUSY0 FF69H 00H R/WNote 1

R/W
BUSY1 BUSY0 Busy input control
0 × Not using busy input
1 0 Busy input enabled (active high)
1 1 Busy input enabled (active low)

R/W
STRB Strobe output control
0 Strobe output disabled
1 Strobe output enabled

R
TRF Status of automatic transmit/receive functionNote 2
0 Detection of termination of automatic transmission/
reception. (This bit is set to 0 upon suspension of
automatic transmission/reception or when ARLD = 0.)
1 During automatic transmission/reception
(This bit is set to 1 when data is written to SIO1.)

R
ERR Error detection of automatic transmit/receive function

No error
0
(This bit is set to 0 when data is written to SIO1.)

1 Error occurred

R/W
ERCE Error check control of automatic transmit/receive function

0 Error check disabled

1 Error check enabled (only when BUSY1 = 1)

R/W
ARLD Operating mode selection of automatic transmit/receive function

0 One-shot mode
1 Repetitive one-shot mode

R/W
RE Receive control of automatic transmit/receive function

0 Receive disabled
1 Receive enabled

Notes 1. Bits 3 and 4 (TRF and ERR) are read-only bits.

2. The termination of automatic transmission/reception should be judged by using TRF, not CSIIF1
(interrupt request flag).

Cautions 1. When an external clock input is selected by clearing bit 1 (CSIM11) of serial operating mode
register 1 (CSIM1) to 0, clear STRB and BUSY1 of ADTC to 0, 0.
2. When using the P23/STB/TxD1 and P24/BUSY/RxD1 pins in the asynchronous serial interface
(UART) mode of serial interface channel 2, the busy control option and busy & strobe control
option are invalid.

Remark ×: don’t care

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(4) Automatic data transmit/receive interval specification register (ADTI)

This register sets the automatic data transmit/receive function data transfer interval.
ADTI is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears ADTI to 00H.

Figure 18-5. Format of Automatic Data Transmit/Receive Interval Specification Register (1/4)

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

ADTI ADTI7 0 0 ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 FF6BH 00H R/W

ADTI7 Data transfer interval control

0 No control of interval by ADTINote 1
1 Control of interval by ADTI (ADTI0 to ADTI4)

ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 Data transfer interval specification (fXX = 5.0 MHz operation)

MinimumNote 2 MaximumNote 2

0 0 0 0 0 18.4 µ s + 0.5/fSCK 20.0 µ s + 1.5/fSCK

0 0 0 0 1 31.2 µ s + 0.5/fSCK 32.8 µ s + 1.5/fSCK

0 0 0 1 0 44.0 µ s + 0.5/fSCK 45.6 µ s + 1.5/fSCK

0 0 0 1 1 56.8 µ s + 0.5/fSCK 58.4 µ s + 1.5/fSCK

0 0 1 0 0 69.6 µ s + 0.5/fSCK 71.2 µ s + 1.5/fSCK

0 0 1 0 1 82.4 µ s + 0.5/fSCK 84.0 µ s + 1.5/fSCK

0 0 1 1 0 95.2 µ s + 0.5/fSCK 96.8 µ s + 1.5/fSCK

0 0 1 1 1 108.0 µ s + 0.5/fSCK 109.6 µ s + 1.5/fSCK

0 1 0 0 0 120.8 µ s + 0.5/fSCK 122.4 µ s + 1.5/fSCK

0 1 0 0 1 133.6 µ s + 0.5/fSCK 135.2 µ s + 1.5/fSCK

0 1 0 1 0 146.4 µ s + 0.5/fSCK 148.0 µ s + 1.5/fSCK

0 1 0 1 1 159.2 µ s + 0.5/fSCK 160.8 µ s + 1.5/fSCK

0 1 1 0 0 172.0 µ s + 0.5/fSCK 173.6 µ s + 1.5/fSCK

0 1 1 0 1 184.8 µ s + 0.5/fSCK 186.4 µ s + 1.5/fSCK

0 1 1 1 0 197.6 µ s + 0.5/fSCK 199.2µs + 1.5/fSCK

0 1 1 1 1 210.4 µ s + 0.5/fSCK 212.0 µ s + 1.5/fSCK

Notes 1. The interval is dependent only on the CPU processing.

2. The data transfer interval includes an error. The data transfer minimum and maximum intervals are
found from the following expressions (n: Value set in ADTI0 to ADTI4). However, if a minimum which
is calculated by the following expression is smaller than 2/fSCK, the minimum interval time is 2/fSCK.

Minimum = (n + 1) × 26 + 28 + 0.5 , Maximum = (n + 1) × 26 + 36 + 1.5

fXX fXX fSCK fXX fXX fSCK
Cautions 1. Do not write anything to ADTI while automatic transmission/reception is in progress (bit 3
(TRF) of the ADTC register = 1).
2. Be sure to clear bits 5 and 6 to 0.
3. When controlling the data transfer interval by means of automatic transmission/reception
using ADTI, busy control (see 18.4.3 (4) (a) Busy control option) is invalid.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fSCK: Serial clock frequency
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Figure 18-5. Format of Automatic Data Transmit/Receive Interval Specification Register (2/4)

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

ADTI ADTI7 0 0 ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 FF6BH 00H R/W

ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 Data transfer interval specification (fXX = 5.0 MHz operation)

MinimumNote MaximumNote

1 0 0 0 0 223.2 µ s + 0.5/fSCK 224.8 µ s + 1.5/fSCK

1 0 0 0 1 236.0 µ s + 0.5/fSCK 237.6 µ s + 1.5/fSCK

1 0 0 1 0 248.8 µ s + 0.5/fSCK 250.4 µ s + 1.5/fSCK

1 0 0 1 1 261.6 µ s + 0.5/fSCK 263.2 µ s + 1.5/fSCK

1 0 1 0 0 274.4 µ s + 0.5/fSCK 276.0 µ s + 1.5/fSCK

1 0 1 0 1 287.2 µ s + 0.5/fSCK 288.8 µ s + 1.5/fSCK

1 0 1 1 0 300.0 µ s + 0.5/fSCK 301.6 µ s + 1.5/fSCK

1 0 1 1 1 312.8 µ s + 0.5/fSCK 314.4 µ s + 1.5/fSCK

1 1 0 0 0 325.6 µ s + 0.5/fSCK 327.2 µ s + 1.5/fSCK

1 1 0 0 1 338.4 µ s + 0.5/fSCK 340.0 µ s + 1.5/fSCK

1 1 0 1 0 351.2 µ s + 0.5/fSCK 352.8 µ s + 1.5/fSCK

1 1 0 1 1 364.0 µ s + 0.5/fSCK 365.6 µ s + 1.5/fSCK

1 1 1 0 0 376.8 µ s + 0.5/fSCK 378.4 µ s + 1.5/fSCK

1 1 1 0 1 389.6 µ s + 0.5/fSCK 391.2 µ s + 1.5/fSCK

1 1 1 1 0 402.4 µ s + 0.5/fSCK 404.0 µ s + 1.5/fSCK

1 1 1 1 1 415.2 µ s + 0.5/fSCK 416.8 µ s + 1.5/fSCK

Note The data transfer interval includes an error. The data transfer minimum and maximum intervals
are found from the following expressions (n: Value set in ADTI0 to ADTI4). However, if a minimum
which is calculated by the following expression is smaller than 2/fSCK, the minimum interval time
is 2/fSCK.

Minimum = (n + 1) × 26 + 28 + 0.5
fXX fXX fSCK

Maximum = (n + 1) × 26 + 36 + 1.5
fXX fXX fSCK

Cautions 1. Do not write to ADTI during operation of the automatic data transmit/receive function.
2. Be sure to clear bits 5 and 6 to 0.
3. When controlling the data transfer interval by means of automatic transmission/
reception using ADTI, busy control (see 18.4.3 (4) (a) Busy control option) is invalid.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fSCK: Serial clock frequency

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Figure 18-5. Format of Automatic Data Transmit/Receive Interval Specification Register (3/4)
Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

ADTI ADTI7 0 0 ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 FF6BH 00H R/W

ADTI7 Data transfer interval control

Note 1
0 No control of interval by ADTI
1 Control of interval by ADTI (ADTI0 to ADTI4)

ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 Data transfer interval specification (fXX = 2.5 MHz operation)

MinimumNote 2 MaximumNote 2

0 0 0 0 0 36.8 µ s + 0.5/fSCK 40.0 µ s + 1.5/fSCK

0 0 0 0 1 62.4 µ s + 0.5/fSCK 65.6 µ s + 1.5/fSCK

0 0 0 1 0 88.0 µ s + 0.5/fSCK 91.2 µ s + 1.5/fSCK

0 0 0 1 1 113.6 µ s + 0.5/fSCK 116.8 µ s + 1.5/fSCK

0 0 1 0 0 139.2 µ s + 0.5/fSCK 142.4 µ s + 1.5/fSCK

0 0 1 0 1 164.8 µ s + 0.5/fSCK 168.0 µ s + 1.5/fSCK

0 0 1 1 0 190.4 µ s + 0.5/fSCK 193.6 µ s + 1.5/fSCK

0 0 1 1 1 216.0 µ s + 0.5/fSCK 219.2 µ s + 1.5/fSCK

0 1 0 0 0 241.6 µ s + 0.5/fSCK 244.8 µ s + 1.5/fSCK

0 1 0 0 1 267.2 µ s + 0.5/fSCK 270.4 µ s + 1.5/fSCK

0 1 0 1 0 292.8 µ s + 0.5/fSCK 296.0 µ s + 1.5/fSCK

0 1 0 1 1 318.4 µ s + 0.5/fSCK 321.6 µ s + 1.5/fSCK

0 1 1 0 0 344.0 µ s + 0.5/fSCK 347.2 µ s + 1.5/fSCK

0 1 1 0 1 369.6 µ s + 0.5/fSCK 372.8 µ s + 1.5/fSCK

0 1 1 1 0 395.2 µ s + 0.5/fSCK 398.4 µ s + 1.5/fSCK

0 1 1 1 1 420.8 µ s + 0.5/fSCK 424.0 µ s + 1.5/fSCK

Notes 1. The interval is dependent only on the CPU processing.

2. The data transfer interval includes an error. The data transfer minimum and maximum intervals
are found from the following expressions (n: Value set in ADTI0 to ADTI4). However, if a
minimum which is calculated by the following expression is smaller than 2/fSCK, the minimum
interval time is 2/fSCK.

Minimum = (n + 1) × 26 + 28 + 0.5
fXX fXX fSCK

Maximum = (n + 1) × 26 + 36 + 1.5
fXX fXX fSCK

Cautions 1. Do not write to ADTI during operation of the automatic data transmit/receive function.
2. Be sure to clear bits 5 and 6 to 0.
3. When controlling the data transfer interval by means of automatic transmission/
reception using ADTI, busy control (see 18.4.3 (4) (a) Busy control option) is invalid.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fSCK: Serial clock frequency

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Figure 18-5. Format of Automatic Data Transmit/Receive Interval Specification Register (4/4)

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

ADTI ADTI7 0 0 ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 FF6BH 00H R/W

ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 Data transfer interval specification (fXX = 2.5 MHz operation)

MinimumNote MaximumNote

1 0 0 0 0 446.4 µ s + 0.5/fSCK 449.6 µ s + 1.5/fSCK

1 0 0 0 1 472.0 µ s + 0.5/fSCK 475.2 µ s + 1.5/fSCK

1 0 0 1 0 497.6 µ s + 0.5/fSCK 500.8 µ s + 1.5/fSCK

1 0 0 1 1 523.2 µ s + 0.5/fSCK 526.4 µ s + 1.5/fSCK

1 0 1 0 0 548.8 µ s + 0.5/fSCK 552.0 µ s + 1.5/fSCK

1 0 1 0 1 574.4 µ s + 0.5/fSCK 577.6 µ s + 1.5/fSCK

1 0 1 1 0 600.0 µ s + 0.5/fSCK 603.2 µ s + 1.5/fSCK

1 0 1 1 1 625.6 µ s + 0.5/fSCK 628.8 µ s + 1.5/fSCK

1 1 0 0 0 651.2 µ s + 0.5/fSCK 654.4 µ s + 1.5/fSCK

1 1 0 0 1 676.8 µ s + 0.5/fSCK 680.0 µ s + 1.5/fSCK

1 1 0 1 0 702.4 µ s + 0.5/fSCK 705.6 µ s + 1.5/fSCK

1 1 0 1 1 728.0 µ s + 0.5/fSCK 731.2 µ s + 1.5/fSCK

1 1 1 0 0 753.6 µ s + 0.5/fSCK 756.8 µ s + 1.5/fSCK

1 1 1 0 1 779.2 µ s + 0.5/fSCK 782.4 µ s + 1.5/fSCK

1 1 1 1 0 804.8 µ s + 0.5/fSCK 808.0 µ s + 1.5/fSCK

1 1 1 1 1 830.4 µ s + 0.5/fSCK 833.6 µ s + 1.5/fSCK

Note The data transfer interval includes an error. The data transfer minimum and maximum intervals
are found from the following expressions (n: Value set in ADTI0 to ADTI4). However, if a minimum
which is calculated by the following expression is smaller than 2/fSCK, the minimum interval time
is 2/fSCK.

Minimum = (n + 1) × 26 + 28 + 0.5
fXX fXX fSCK

Maximum = (n + 1) × 26 + 36 + 1.5
fXX fXX fSCK

Cautions 1. Do not write to ADTI during operation of the automatic data transmit/receive function.
2. Be sure to clear bits 5 and 6 to 0.
3. When controlling the data transfer interval by means of automatic transmission/
reception using ADTI, busy control (see 18.4.3 (4) (a) Busy control option) is invalid.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fSCK: Serial clock frequency

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18.4 Operations of Serial Interface Channel 1

The following three operating modes are available for serial interface channel 1.

• Operation stop mode

• 3-wire serial I/O mode
• 3-wire serial I/O mode with automatic transmit/receive function

18.4.1 Operation stop mode

Serial transfer is not carried out in the operation stop mode. Thus, power consumption can be reduced. Serial
I/O shift register 1 (SIO1) does not carry out shift operations either, and thus it can be used as an ordinary 8-bit register.
In the operation stop mode, the P20/SI1, P21/SO1, P22/SCK1, P23/STB/TxD1, and P24/BUSY/RxD1 pins can
be used as ordinary I/O ports.

(1) Register setting

The operation stop mode is set by serial operating mode register 1 (CSIM1).
CSIM1 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM1 to 00H.

Symbol <7> 6 <5> 4 3 2 1 0 Address After reset R/W

CSIM1 CSIE1 DIR ATE 0 0 0 CSIM11 CSIM10 FF68H 00H R/W

CSIE1 CSIM11 PM20 P20 PM21 P21 PM22 P22 Shift register Serial clock counter SI1/P20 pin SO1/P21 pin SCK1/P22
1 operation operation control function function pin function
Note 1 Note 1 Note 1 Note 1 Note 1 Note 1
Operation Clear P20 P21 P22
0 × × × × × × ×
stop (CMOS I/O) (CMOS I/O) (CMOS I/O)

Note 2 Note 2
Operation Count SI1Note 2 SO1 (CMOS SCK1
1 0 1 × 0 0 1 ×
enable operation (input) output) (input)
1 0 1 SCK1
(CMOS
output)

Notes 1. Can be used freely as a port function.

2. Can be used as P20 (CMOS I/O) when only transmission is performed (clear bit 7 (RE) of the
automatic data transmit/receive control register (ADTC) to 0).

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

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18.4.2 3-wire serial I/O mode operation

The 3-wire serial I/O mode is useful for connection of peripheral I/O units and display controllers which incorporate
a conventional clocked serial interface such as the 75X/XL, 78K and 17K Series.
Communication is carried out using the three lines of the serial clock (SCK1), serial output (SO1) and serial input
(SI1).

(1) Register setting

The 3-wire serial I/O mode is set by serial operating mode register 1 (CSIM1).
CSIM1 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM1 to 00H.
Symbol <7> 6 <5> 4 3 2 1 0 Address After reset R/W

CSIM1 CSIE1 DIR ATE 0 0 0 CSIM11 CSIM10 FF68H 00H R/W

CSIM11 CSIM10 Serial interface channel 1 clock selection

0 × External clock input to SCK1 pinNote
1 0 8-bit timer register 2 (TM2) output
1 1 Clock specified by bits 4 to 7 of timer clock select register 3 (TCL3)

ATE Serial interface channel 1 operating mode selection

0 3-wire serial I/O mode

1 3-wire serial I/O mode with automatic transmit/receive function

DIR Start bit SO1 pin function SO1 pin function

0 MSB SI1/P20 (Input) SO1 (CMOS output)
1 LSB

Note If the external clock input has been selected by setting CSIM11 to 0, set bit 1 (BUSY1) and bit 2 (STRB)
of the automatic data transmit/receive control register (ADTC) to 0, 0.

Remark ×: don’t care

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CSIE1 CSIM11 PM20 P20 PM21 P21 PM22 P22 Shift register 1 Serial clock counter SI1/P20 pin SO1/P21 pin SCK1/P22
operation operation control function function pin function
Note 1 Note 1 Note 1 Note 1 Note 1 Note 1
Operation Clear P20 P21 P22
0 × × × × × × ×
stop (CMOS I/O) (CMOS I/O) (CMOS I/O)

Note 2 Note 2
Operation Count SI1Note 2 SO1 (CMOS SCK1
1 0 1 × 0 0 1 × (input) output)
enable operation (input)

1 0 1 SCK1
(CMOS
output)

Notes 1. Can be used freely as a port function.

2. Can be used as P20 (CMOS input/output) when only transmission is performed (clear bit 7 (RE)
of ADTC to 0).

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

(2) Communication operation

The 3-wire serial I/O mode is used for data transmission/reception in 8-bit units. Data transmission/reception
is carried out bit-wise in synchronization with the serial clock.
Shift operations of serial I/O shift register 1 (SIO1) are carried out at the falling edge of the serial clock SCK1.
The transmit data is held in the SO1 latch and is output from the SO1 pin. The receive data input to the SI1
pin is latched into SIO1 at the rising edge of SCK1.
Upon termination of 8-bit transfer, the SIO1 operation stops automatically and the interrupt request flag
(CSIIF1) is set.

Figure 18-6. 3-Wire Serial I/O Mode Timing

SCK1 1 2 3 4 5 6 7 8

SI1 DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0

SO1 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0

CSIIF1

End of transfer
Transfer start at the falling edge of SCK1

SIO1 write

Caution The SO1 pin becomes low level by writing SIO1.

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(3) MSB/LSB switching as the start bit

In 3-wire serial I/O mode, it is possible to select transfer to start from the MSB or LSB.
Figure 18-7 shows the configuration of serial I/O shift register 1 (SIO1) and the internal bus. As shown in the
figure, the MSB/LSB can be read or written in reverse form.
MSB/LSB switching as the start bit can be specified by bit 6 (DIR) of serial operating mode register 1 (CSIM1).

Figure 18-7. Circuit for Switching Transfer Bit Order

7
6
Internal bus
1
0
LSB-first
MSB-first Read/write gate Read/write gate

SO1 latch
SI1 Shift register 1 (SIO1) D Q

SO1

SCK1

Start bit switching is realized by switching the bit order for data write to SIO1. The SIO1 shift order remains
unchanged.
Thus, switching between MSB-first and LSB-first must be performed before writing data to the shift register.

(4) Transfer start

Serial transfer is started by setting transfer data to serial I/O shift register 1 (SIO1) when the following two
conditions are satisfied.

• Serial interface channel 1 operation control bit (CSIE1) = 1

• Internal serial clock is stopped or SCK1 is a high level after 8-bit serial transfer.

Caution If CSIE1 is set to 1 after data write to SIO1, transfer does not start.

Upon termination of 8-bit transfer, serial transfer automatically stops and the interrupt request flag (CSIIF1)
is set.

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18.4.3 3-wire serial I/O mode operation with automatic transmit/receive function
This 3-wire serial I/O mode is used for transmission/reception of a maximum of 32 bytes of data without the use
of software. Once transfer is started, the set number of bytes of the data prestored in the RAM can be transmitted,
and the set number of bytes of data can be received and stored in the RAM.
Handshake signals (STB and BUSY) are supported by hardware to transmit/receive data continuously. An OSD
(On Screen Display) LSI and peripheral LSI including an LCD controller/driver can thus be connected without difficulty.

(1) Register setting

The 3-wire serial I/O mode with automatic transmit/receive function is set by serial operating mode register
1 (CSIM1), the automatic data transmit/receive control register (ADTC) and the automatic data transmit/
receive interval specification register (ADTI).

(a) Serial operating mode register 1 (CSIM1)

CSIM1 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM1 to 00H.

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Symbol <7> 6 <5> 4 3 2 1 0 Address After reset R/W

CSIM1 CSIE1 DIR ATE 0 0 0 CSIM11 CSIM10 FF68H 00H R/W

CSIM11 CSIM10 Serial interface channel 1 clock selection

0 × External clock input to SCK1 pinNote 1
1 0 8-bit timer register 2 (TM2) output
1 1 Clock specified by bits 4 to 7 of timer clock select register 3 (TCL3)

ATE Serial interface channel 1 operating mode selection

0 3-wire serial I/O mode
1 3-wire serial I/O mode with automatic transmit/receive function

DIR Start bit SI1 pin function SO1 pin function

0 MSB SI1/P20 (input) SO1 (CMOS output)
1 LSB

CSIE1 CSIM11 PM20 P20 PM21 P21 PM22 P22 Shift register 1 Serial clock counter SI1/P20 pin SO1/P21 pin SCK1/P22
operation operation control function function pin function
Note 2 Note 2 Note 2 Note 2 Note 2 Note 2
Operation Clear P20 P21 P22
0 × × × × × × ×
stop (CMOS I/O) (CMOS I/O) (CMOS I/O)
Note 3 Note 3
Operation Count SI1Note 3 SO1 (CMOS SCK1
1 0 1 × 0 0 1 ×
enable operation (input) output) (input)

1 0 1 SCK1
(CMOS
output)

Notes 1. If the external clock input has been selected by clearing CSIM11 to 0, clear bit 1 (BUSY 1)
and bit 2 (STRB) of the automatic data transmit/receive control register (ADTC) to 0, 0.
2. Can be used freely as a port function.
3. Can be used as P20 (CMOS input/output) when only transmission is performed (clear bit 7
(RE) of ADTC to 0).

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

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(b) Automatic data transmit/receive control register (ADTC)

ADTC is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears ADTC to 00H.
Symbol <7> <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

ADTC RE ARLD ERCE ERR TRF STRB BUSY1 BUSY0 FF69H 00H R/WNote 1

R/W
BUSY1 BUSY0 Busy input control
0 × Not using busy input
1 0 Busy input enabled (active high)
1 1 Busy input enabled (active low)

R/W
STRB Strobe output control
0 Strobe output disabled
1 Strobe output enabled

R
TRF Status of automatic transmit/receive functionNote 2
0 Detection of termination of automatic transmission/reception
(This bit is set to 0 upon suspension of automatic
transmission/reception or when ARLD = 0.)
1 During automatic transmission/reception
(This bit is set to 1 when data is written to SIO1.)

R
ERR Error detection of automatic transmit/receive function

0 No error
(This bit is set to 0 when data is written to SIO1.)

1 Error occurred

R/W
ERCE Error check control of automatic transmit/receive function

0 Error check disabled

1 Error check enabled (only when BUSY1 = 1)

R/W
ARLD Operating mode selection of automatic transmit/receive
function
0 One-shot mode
1 Repetitive one-shot mode

R/W
RE Receive control of automatic transmit/receive function

0 Receive disabled
1 Receive enabled

Notes 1. Bits 3 and 4 (TRF and ERR) are read-only bits.

2. The termination of automatic transmission/reception should be judged by using TRF, not CSIIF1
(interrupt request flag).

Caution When an external clock input is selected by clearing bit 1 (CSIM11) of serial operating
mode register 1 (CSIM1) to 0, clear STRB and BUSY1 of ADTC to 0, 0 (handshake control
cannot be executed when an external clock is input).

Remark ×: don’t care

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(c) Automatic data transmit/receive interval specification register (ADTI)

This register sets the automatic data transmit/receive function data transfer interval.
ADTI is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears ADTI to 00H.
Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

ADTI ADTI7 0 0 ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 FF6BH 00H R/W

ADTI7 Data transfer interval control

Note 1
0 No control of interval by ADTI
1 Control of interval by ADTI (ADTI0 to ADTI4)

ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 Data transfer interval specification (fXX = 5.0 MHz operation)

MinimumNote 2 MaximumNote 2

0 0 0 0 0 18.4 µ s + 0.5/fSCK 20.0 µ s + 1.5/fSCK

0 0 0 0 1 31.2 µ s + 0.5/fSCK 32.8 µ s + 1.5/fSCK

0 0 0 1 0 44.0 µ s + 0.5/fSCK 45.6 µ s + 1.5/fSCK

0 0 0 1 1 56.8 µ s + 0.5/fSCK 58.4 µ s + 1.5/fSCK

0 0 1 0 0 69.6 µ s + 0.5/fSCK 71.2 µ s + 1.5/fSCK

0 0 1 0 1 82.4 µ s + 0.5/fSCK 84.0 µ s + 1.5/fSCK

0 0 1 1 0 95.2 µ s + 0.5/fSCK 96.8 µ s + 1.5/fSCK

0 0 1 1 1 108.0 µ s + 0.5/fSCK 109.6 µ s + 1.5/fSCK

0 1 0 0 0 120.8 µ s + 0.5/fSCK 122.4 µ s + 1.5/fSCK

0 1 0 0 1 133.6 µ s + 0.5/fSCK 135.2 µ s + 1.5/fSCK

0 1 0 1 0 146.4 µ s + 0.5/fSCK 148.0 µ s + 1.5/fSCK

0 1 0 1 1 159.2 µ s + 0.5/fSCK 160.8 µ s + 1.5/fSCK

0 1 1 0 0 172.0 µ s + 0.5/fSCK 173.6 µ s + 1.5/fSCK

0 1 1 0 1 184.8 µ s + 0.5/fSCK 186.4 µ s + 1.5/fSCK

0 1 1 1 0 197.6 µ s + 0.5/fSCK 199.2 µ s + 1.5/fSCK

0 1 1 1 1 210.4 µ s + 0.5/fSCK 212.0 µ s + 1.5/fSCK

Notes 1. The interval is dependent only on the CPU processing.

2. The data transfer interval includes an error. The data transfer minimum and maximum intervals
are found from the following expressions (n: Value set in ADTI0 to ADTI4). However, if a
minimum which is calculated by the following expression is smaller than 2/fSCK, the minimum
interval time is 2/fSCK.

Minimum = (n + 1) × 26 + 28 + 0.5 , Maximum = (n + 1) × 26 + 36 + 1.5

fXX fXX fSCK fXX fXX fSCK
Cautions 1. Do not write to ADTI during operation of the automatic data transmit/receive function.
2. Be sure to clear bits 5 and 6 to 0.
3. When controlling the data transfer interval by means of automatic transmission/
reception using ADTI, busy control (see 18.4.3 (4) (a) Busy control option) is invalid.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fSCK: Serial clock frequency

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Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

ADTI ADTI7 0 0 ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 FF6BH 00H R/W

ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 Data transfer interval specification (fXX = 5.0 MHz operation)

MinimumNote MaximumNote

1 0 0 0 0 223.2 µ s + 0.5/fSCK 224.8 µ s + 1.5/fSCK

1 0 0 0 1 236.0 µ s + 0.5/fSCK 237.6 µ s + 1.5/fSCK

1 0 0 1 0 248.8 µ s + 0.5/fSCK 250.4 µ s + 1.5/fSCK

1 0 0 1 1 261.6 µ s + 0.5/fSCK 263.2 µ s + 1.5/fSCK

1 0 1 0 0 274.4 µ s + 0.5/fSCK 276.0 µ s + 1.5/fSCK

1 0 1 0 1 287.2 µ s + 0.5/fSCK 288.8 µ s + 1.5/fSCK

1 0 1 1 0 300.0 µ s + 0.5/fSCK 301.6 µ s + 1.5/fSCK

1 0 1 1 1 312.8 µ s + 0.5/fSCK 314.4 µ s + 1.5/fSCK

1 1 0 0 0 325.6 µ s + 0.5/fSCK 327.2 µ s + 1.5/fSCK

1 1 0 0 1 338.4 µ s + 0.5/fSCK 340.0 µ s + 1.5/fSCK

1 1 0 1 0 351.2 µ s + 0.5/fSCK 352.8 µ s + 1.5/fSCK

1 1 0 1 1 364.0 µ s + 0.5/fSCK 365.6 µ s + 1.5/fSCK

1 1 1 0 0 376.8 µ s + 0.5/fSCK 378.4 µ s + 1.5/fSCK

1 1 1 0 1 389.6 µ s + 0.5/fSCK 391.2 µ s + 1.5/fSCK

1 1 1 1 0 402.4 µ s + 0.5/fSCK 404.0 µ s + 1.5/fSCK

1 1 1 1 1 415.2 µ s + 0.5/fSCK 416.8 µ s + 1.5/fSCK

Note The data transfer interval includes an error. The data transfer minimum and maximum intervals
are found from the following expressions (n: Value set in ADTI0 to ADTI4). However, if a minimum
which is calculated by the following expression is smaller than 2/fSCK, the minimum interval time
is 2/fSCK.

Minimum = (n + 1) × 26 + 28 + 0.5
fXX fXX fSCK

Maximum = (n + 1) × 26 + 36 + 1.5
fXX fXX fSCK

Cautions 1. Do not write to ADTI during operation of the automatic data transmit/receive function.
2. Be sure to clear bits 5 and 6 to 0.
3. When controlling the data transfer interval by means of automatic transmission/
reception using ADTI, busy control (see 18.4.3 (4) (a) Busy control option) is invalid.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fSCK: Serial clock frequency

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Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

ADTI ADTI7 0 0 ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 FF6BH 00H R/W

ADTI7 Data transfer interval control

0 No control of interval by ADT INote 1
1 Control of interval by ADTI (ADTI0 to ADTI4)

ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 Data transfer interval specification (fXX = 2.5 MHz operation)

MinimumNote 2 MaximumNote 2

0 0 0 0 0 36.8 µ s + 0.5/fSCK 40.0 µ s + 1.5/fSCK

0 0 0 0 1 62.4 µ s + 0.5/fSCK 65.6 µ s + 1.5/fSCK

0 0 0 1 0 88.0 µ s + 0.5/fSCK 91.2 µ s + 1.5/fSCK

0 0 0 1 1 113.6 µ s + 0.5/fSCK 116.8 µ s + 1.5/fSCK

0 0 1 0 0 139.2 µ s + 0.5/fSCK 142.4 µ s + 1.5/fSCK

0 0 1 0 1 164.8 µ s + 0.5/fSCK 168.0 µ s + 1.5/fSCK

0 0 1 1 0 190.4 µ s + 0.5/fSCK 193.6 µ s + 1.5/fSCK

0 0 1 1 1 216.0 µ s + 0.5/fSCK 219.2 µ s + 1.5/fSCK

0 1 0 0 0 241.6 µ s + 0.5/fSCK 244.8 µ s + 1.5/fSCK

0 1 0 0 1 267.2 µ s + 0.5/fSCK 270.4 µ s + 1.5/fSCK

0 1 0 1 0 292.8 µ s + 0.5/fSCK 296.0 µ s + 1.5/fSCK

0 1 0 1 1 318.4 µ s + 0.5/fSCK 321.6 µ s + 1.5/fSCK

0 1 1 0 0 344.0 µ s + 0.5/fSCK 347.2 µ s + 1.5/fSCK

0 1 1 0 1 369.6 µ s + 0.5/fSCK 372.8 µ s + 1.5/fSCK

0 1 1 1 0 395.2 µ s + 0.5/fSCK 398.4 µ s + 1.5/fSCK

0 1 1 1 1 420.8 µ s + 0.5/fSCK 424.0 µ s + 1.5/fSCK

Notes 1. The interval is dependent only on the CPU processing.

2. The data transfer interval includes an error. The data transfer minimum and maximum intervals
are found from the following expressions (n: Value set in ADTI0 to ADTI4). However, if a
minimum which is calculated by the following expression is smaller than 2/fSCK, the minimum
interval time is 2/fSCK.

Minimum = (n + 1) × 26 + 28 + 0.5
fXX fXX fSCK
6
Maximum = (n + 1) × 2 + 36 + 1.5
fXX fXX fSCK

Cautions 1. Do not write to ADTI during operation of the automatic data transmit/receive function.
2. Be sure to clear bits 5 and 6 to 0.
3. When controlling the data transfer interval by means of automatic transmission/
reception using ADTI, busy control (see 18.4.3 (4) (a) Busy control option) is invalid.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fSCK: Serial clock frequency

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Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

ADTI ADTI7 0 0 ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 FF6BH 00H R/W

ADTI4 ADTI3 ADTI2 ADTI1 ADTI0 Data transfer interval specification (fXX = 2.5 MHz operation)

MinimumNote MaximumNote

1 0 0 0 0 446.4 µ s + 0.5/fSCK 449.6 µ s + 1.5/fSCK

1 0 0 0 1 472.0 µ s + 0.5/fSCK 475.2 µ s + 1.5/fSCK

1 0 0 1 0 497.6 µ s + 0.5/fSCK 500.8 µ s + 1.5/fSCK

1 0 0 1 1 523.2 µ s + 0.5/fSCK 526.4 µ s + 1.5/fSCK

1 0 1 0 0 548.8 µ s + 0.5/fSCK 552.0 µ s + 1.5/fSCK

1 0 1 0 1 574.4 µ s + 0.5/fSCK 577.6 µ s + 1.5/fSCK

1 0 1 1 0 600.0 µ s + 0.5/fSCK 603.2 µ s + 1.5/fSCK

1 0 1 1 1 625.6 µ s + 0.5/fSCK 628.8 µ s + 1.5/fSCK

1 1 0 0 0 651.2 µ s + 0.5/fSCK 654.4 µ s + 1.5/fSCK

1 1 0 0 1 676.8 µ s + 0.5/fSCK 680.0 µ s + 1.5/fSCK

1 1 0 1 0 702.4 µ s + 0.5/fSCK 705.6 µ s + 1.5/fSCK

1 1 0 1 1 728.0 µ s + 0.5/fSCK 731.2 µ s + 1.5/fSCK

1 1 1 0 0 753.6 µ s + 0.5/fSCK 756.8 µ s + 1.5/fSCK

1 1 1 0 1 779.2 µ s + 0.5/fSCK 782.4 µ s + 1.5/fSCK

1 1 1 1 0 804.8 µ s + 0.5/fSCK 808.0 µ s + 1.5/fSCK

1 1 1 1 1 830.4 µ s + 0.5/fSCK 833.6 µ s + 1.5/fSCK

Note The data transfer interval includes an error. The data transfer minimum and maximum intervals
are found from the following expressions (n: Value set in ADTI0 to ADTI4). However, if a minimum
which is calculated by the following expression is smaller than 2/fSCK, the minimum interval time
is 2/fSCK.

Minimum = (n + 1) × 26 + 28 + 0.5
fXX fXX fSCK

Maximum = (n + 1) × 26 + 36 + 1.5
fXX fXX fSCK

Cautions 1. Do not write to ADTI during operation of the automatic data transmit/receive function.
2. Be sure to clear bits 5 and 6 to 0.
3. When controlling the data transfer interval by means of automatic transmission/
reception using ADTI, busy control (see 18.4.3 (4) (a) Busy control option) is invalid.

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. fSCK: Serial clock frequency

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(2) Automatic transmit/receive data setting

(a) Transmit data setting

<1> Write transmit data from the least significant address FAC0H of buffer RAM (up to FADFH at
maximum). The transmit data should be in order from higher address to lower address.
<2> Set the value obtained by subtracting 1 from the number of transmit data bytes to the automatic
data transmit/receive address pointer (ADTP).

(b) Automatic transmit/receive mode setting

<1> Set CSIE1 and ATE of serial operating mode register 1 (CSIM1) to 1.
<2> Set RE of the automatic data transmit/receive control register (ADTC) to 1.
<3> Set a data transmit/receive interval in the automatic data transmit/receive interval specification
register (ADTI).
<4> Write any value to serial I/O shift register 1 (SIO1) (transfer start trigger).

Caution Writing any value to SIO1 orders the start of the automatic transmit/receive operation;
the written value has no meaning.

The following operations are automatically carried out when (a) and (b) are carried out.

• After the buffer RAM data specified by ADTP is transferred to SIO1, transmission is carried out (start
of automatic transmission/reception).
• The received data is written to the buffer RAM address specified by ADTP.
• ADTP is decremented and the next data transmission/reception is carried out. Data transmission/
reception continues until the ADTP decremental output becomes 00H and the data at address FAC0H
is output (end of automatic transmission/reception).
• When automatic transmission/reception is terminated, TRF is cleared to 0.

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(3) Communication operation

(a) Basic transmission/reception mode

This transmission/reception mode is the same as the 3-wire serial I/O mode in which the specified number
of data are transmitted/received in 8-bit units.
Serial transfer is started when any data is written to serial I/O shift register 1 (SIO1) while bit 7 (CSIE1)
of serial operating mode register 1 (CSIM1) is set to 1.
When the final byte has been sent, an interrupt request flag (CSIIF1) is set. However, judge the
termination of auto transmit and receive not by CSIIF1, but by bit 3 (TRF) of the automatic data transmit/
receive control register (ADTC).
If busy control and strobe control are not executed, the P23/STB/TxD1 and P24/BUSY/RxD1 pins can
be used as normal I/O ports.
Figure 18-8 shows the basic transmission/reception mode operation timing, and Figure 18-9 shows the
operation flowchart. Figure 18-10 shows the operation of the internal buffer RAM when 6 bytes of data
are transmitted or received.

Figure 18-8. Basic Transmission/Reception Mode Operation Timing

Interval

SCK1

SO1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

SI1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

CSIIF1

TRF

Cautions 1. Because, in the basic transmission/reception mode, the automatic transmit/receive

function writes/reads data to/from the internal buffer RAM after 1-byte transmission/
reception, an interval is inserted until the next transmission/reception. As the buffer
RAM write/read is performed at the same time as CPU processing, the maximum
interval is dependent upon the CPU processing and the value of the automatic data
transmit/receive interval specification register (ADTI) (see (5) Automatic data trans-
mit/receive interval).
2. When TRF is cleared, the SO1 pin becomes low level.

Remark CSIIF1: Interrupt request flag

TRF: Bit 3 of automatic data transmit/receive control register (ADTC)

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Figure 18-9. Basic Transmission/Reception Mode Flowchart

Start

Write transmit data

in internal buffer RAM

Set ADTP to the value (pointer

value) obtained by subtracting 1
from the number of transmit
data bytes Software execution

Set the transmission/reception

operation interval time in ADTI

Write any data to SIO1

(Start trigger)

Write transmit data from

internal buffer RAM to SIO1

Transmission/reception
Decrement pointer value
operation

Hardware execution
Write receive data from
SIO1 to internal buffer RAM

No
Pointer value = 0

Yes

No
TRF = 0
Software execution

Yes
End

ADTP: Automatic data transmit/receive address pointer

ADTI: Automatic data transmit/receive interval specification register
SIO1: Serial I/O shift register 1
TRF: Bit 3 of automatic data transmit/receive control register (ADTC)

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In 6-byte transmission/reception (ARLD = 0, RE = 1) in basic transmit/receive mode, the internal buffer RAM
operates as follows.

(i) Before transmission/reception (see Figure 18-10 (a))

After any data has been written to serial I/O shift register 1 (SIO1) (start trigger: this data is not
transferred), transmit data 1 (T1) is transferred from the internal buffer RAM to SIO1. When
transmission of the first byte is completed, receive data 1 (R1) is transferred from SIO1 to the buffer
RAM, and the automatic data transmit/receive address pointer (ADTP) is decremented. Then transmit
data 2 (T2) is transferred from the internal buffer RAM to SIO1.

(ii) 4th byte transmission/reception point (see Figure 18-10 (b))

Transmission/reception of the third byte is completed, and transmit data 4 (T4) is transferred from
the internal buffer RAM to SIO1. When transmission of the fourth byte is completed, receive data
4 (R4) is transferred from SIO1 to the internal buffer RAM, and ADTP is decremented.

(iii) Completion of transmission/reception (see Figure 18-10 (c))

When transmission of the sixth byte is completed, receive data 6 (R6) is transferred from SIO1 to
the internal buffer RAM, and the interrupt request flag (CSIIF1) is set (INTCSI1 generation).

Figure 18-10. Internal Buffer RAM Operation in 6-Byte Transmission/Reception

(in Basic Transmit/Receive Mode) (1/2)

(a) Before transmission/reception

FADFH

FAC5H Transmit data 1 (T1) Receive data 1 (R1) SIO1

Transmit data 2 (T2)

Transmit data 3 (T3)

5 ADTP
Transmit data 4 (T4) –1
Transmit data 5 (T5)

FAC0H Transmit data 6 (T6) 0 CSIIF1

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Figure 18-10. Internal Buffer RAM Operation in 6-Byte Transmission/Reception

(in Basic Transmit/Receive Mode) (2/2)

(b) 4th byte transmission/reception

FADFH

FAC5H Receive data 1 (R1) Receive data 4 (R4) SIO1

Receive data 2 (R2)

Receive data 3 (R3)

2 ADTP
Transmit data 4 (T4) –1
Transmit data 5 (T5)

FAC0H Transmit data 6 (T6) 0 CSIIF1

(c) Completion of transmission/reception

FADFH

FAC5H Receive data 1 (R1) SIO1

Receive data 2 (R2)

Receive data 3 (R3)

0 ADTP
Receive data 4 (R4)

Receive data 5 (R5)

FAC0H Receive data 6 (R6) 1 CSIIF1

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(b) Basic transmission mode

In this mode, 8-bit unit data is transmitted the specified number of times.
Serial transfer is started when any data is written to serial I/O shift register 1 (SIO1) while bit 7 (CSIE1)
of serial operating mode register 1 (CSIM1) is set to 1.
When the final byte has been sent, an interrupt request flag (CSIIF1) is set. However, judge the termination
of automatic transmit and receive not by CSIIF1, but by bit 3 (TRF) of the automatic data transmit/receive
control register (ADTC).
If a receive operation, busy control and strobe control are not executed, the P20/SI1, P23/STB/TxD1 and
P24/BUSY/RxD1 pins can be used as normal I/O ports.
Figure 18-11 shows the basic transmission mode operation timing, and Figure 18-12 shows the operation
flowchart. Figure 18-13 shows the operation of the internal buffer RAM when 6 bytes of data are
transmitted or received.

Figure 18-11. Basic Transmission Mode Operation Timing

Interval

SCK1

SO1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

CSIIF1

TRF

Cautions 1. Because, in the basic transmission mode, the automatic transmit/receive function
reads data from the internal buffer RAM after 1-byte transmission, an interval is
inserted until the next transmission. As buffer RAM read is performed at the same
time as CPU processing, the maximum interval is dependent upon the CPU process-
ing and the value of the automatic data transmit/receive interval specification
register (ADTI) (see (5) Automatic data transmit/receive interval).
2. When TRF is cleared, the SO1 pin becomes low level.

Remark CSIIF1: Interrupt request flag

TRF: Bit 3 of automatic data transmit/receive control register (ADTC)

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Figure 18-12. Basic Transmission Mode Flowchart

Start

Write transmit data

in internal buffer RAM

Set ADTP to the value (pointer

value) obtained by subtracting 1
from the number of transmit
data bytes Software execution

Set the transmission/reception

operation interval time in ADTI

Write any data to SIO1

(Start trigger)

Write transmit data from

Decrement pointer value
internal buffer RAM to SIO1

Transmit operation
Hardware execution

No
Pointer value = 0

Yes

No
TRF = 0
Software execution

Yes
End

ADTP: Automatic data transmit/receive address pointer

ADTI: Automatic data transmit/receive interval specification register
SIO1: Serial I/O shift register 1
TRF: Bit 3 of automatic data transmit/receive control register (ADTC)

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In 6-byte transmission (ARLD = 0, RE = 0) in basic transmit mode, the internal buffer RAM operates as follows.

(i) Before transmission (see Figure 18-13 (a).)

After any data has been written to serial I/O shift register 1 (SIO1) (start trigger: this data is not
transferred), transmit data 1 (T1) is transferred from the internal buffer RAM to SIO1. When
transmission of the first byte is completed, the automatic data transmit/receive address pointer
(ADTP) is decremented. Then transmit data 2 (T2) is transferred from the internal buffer RAM to SIO1.

(ii) 4th byte transmission point (see Figure 18-13 (b).)

Transmission of the third byte is completed, and transmit data 4 (T4) is transferred from the internal
buffer RAM to SIO1. When transmission of the fourth byte is completed, ADTP is decremented.

(iii) Completion of transmission (see Figure 18-13 (c).)

When transmission of the sixth byte is completed, the interrupt request flag (CSIIF1) is set (INTCSI1
generation).

Figure 18-13. Internal Buffer RAM Operation in 6-Byte Transmission

(in Basic Transmit Mode) (1/2)

(a) Before transmission

FADFH

FAC5H Transmit data 1 (T1) SIO1

Transmit data 2 (T2)

Transmit data 3 (T3)

5 ADTP
Transmit data 4 (T4) –1
Transmit data 5 (T5)

FAC0H Transmit data 6 (T6) 0 CSIIF1

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Figure 18-13. Internal Buffer RAM Operation in 6-Byte Transmission

(in Basic Transmit Mode) (2/2)

(b) 4th byte transmission point

FADFH

FAC5H Transmit data 1 (T1) SIO1

Transmit data 2 (T2)

Transmit data 3 (T3)

2 ADTP
Transmit data 4 (T4) –1
Transmit data 5 (T5)

FAC0H Transmit data 6 (T6) 0 CSIIF1

(c) Completion of transmission

FADFH

FAC5H Transmit data 1 (T1) SIO1

Transmit data 2 (T2)

Transmit data 3 (T3)

0 ADTP
Transmit data 4 (T4)

Transmit data 5 (T5)

FAC0H Transmit data 6 (T6) 1 CSIIF1

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(c) Repeat transmission mode

In this mode, data stored in the internal buffer RAM is transmitted repeatedly.
Serial transmission is started by writing any data to serial I/O shift register 1 (SIO1) when bit 7 (CSIE1)
of serial operating mode register 1 (CSIM1) is set to 1.
Unlike the basic transmission mode, after the final byte (data at address FAC0H) has been transmitted,
the interrupt request flag (CSIIF1) is not set, the value at the time when transmission was started is set
in the automatic data transmit/receive address pointer (ADTP) again, and the internal buffer RAM contents
are transmitted again.
When a reception operation, busy control and strobe control are not performed, the P20/SI1, P23/STB/
TxD1 and P24/BUSY/RxD1 pins can be used as normal I/O ports.
The repeat transmission mode operation timing is shown in Figure 18-14, and the operation flowchart in
Figure 18-15. Figure 18-16 shows the operation of the internal buffer RAM when 6 bytes of data are
transmitted in the repeat transmission mode.

Figure 18-14. Repeat Transmission Mode Operation Timing

Interval Interval

SCK1

SO1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5

Caution Because, in the repeat transmission mode, a read is performed on the buffer RAM after
the transmission of one byte, an interval is inserted in the period up to the next
transmission. As buffer RAM read is performed at the same time as CPU processing,
the maximum interval is dependent upon the CPU operation and the value of the
automatic data transmit/receive interval specification register (ADTI) (see (5) Automatic
data transmit/receive interval).

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Figure 18-15. Repeat Transmission Mode Flowchart

Start

Write transmit data

in internal buffer RAM

Set ADTP to the value (pointer

value) obtained by subtracting 1
from the number of transmit
data bytes Software execution

Set the transmission/reception

operation interval time in ADTI

Write any data to SIO1

(start trigger)

Write transmit data from

Decrement pointer value
internal buffer RAM to SIO1

Transmit operation

Hardware execution
No
Pointer value = 0

Yes

Reset ADTP

ADTP: Automatic data transmit/receive address pointer

ADTI: Automatic data transmit/receive interval specification register
SIO1: Serial I/O shift register 1

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In 6-byte transmission (ARLD = 1, RE = 0) in repeat transmit mode, the internal buffer RAM operates as follows.

(i) Before transmission (see Figure 18-16 (a).)

After any data has been written to serial I/O shift register 1 (SIO1) (start trigger: this data is not
transferred), transmit data 1 (T1) is transferred from the internal buffer RAM to SIO1. When
transmission of the first byte is completed, the automatic data transmit/receive address pointer
(ADTP) is decremented. Then transmit data 2 (T2) is transferred from the internal buffer RAM to SIO1.

(ii) Upon completion of transmission of 6 bytes (see Figure 18-16 (b).)

When transmission of the sixth byte is completed, the interrupt request flag (CSIIF1) is not set.
The internal pointer value is reset in ADTP.

(iii) 7th byte transmission point (see Figure 18-16 (c).)

Transmit data 1 (T1) is transferred from the internal buffer RAM to SIO1 again. When transmission
of the first byte is completed, ADTP is decremented. Then transmit data 2 (T2) is transferred from
the internal buffer RAM to SIO1.

Figure 18-16. Internal Buffer RAM Operation in 6-Byte Transmission

(in Repeat Transmit Mode) (1/2)

(a) Before transmission

FADFH

FAC5H Transmit data 1 (T1) SIO1

Transmit data 2 (T2)

Transmit data 3 (T3)

5 ADTP
Transmit data 4 (T4) –1
Transmit data 5 (T5)

FAC0H Transmit data 6 (T6) 0 CSIIF1

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Figure 18-16. Internal Buffer RAM Operation in 6-Byte Transmission

(in Repeat Transmit Mode) (2/2)

(b) Upon completion of transmission of 6 bytes

FADFH

FAC5H Transmit data 1 (T1) SIO1

Transmit data 2 (T2)

Transmit data 3 (T3)

0 ADTP
Transmit data 4 (T4)

Transmit data 5 (T5)

FAC0H Transmit data 6 (T6) 0 CSIIF1

(c) 7th byte transmission point

FADFH

FAC5H Transmit data 1 (T1) SIO1

Transmit data 2 (T2)

Transmit data 3 (T3)

5 ADTP
Transmit data 4 (T4) –1
Transmit data 5 (T5)

FAC0H Transmit data 6 (T6) 0 CSIIF1

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(d) Automatic transmission/reception suspending and restart

Automatic transmission/reception can be temporarily suspended by clearing bit 7 (CSIE1) of serial
operating mode register 1 (CSIM1) to 0.
If during 8-bit data transfer, the transmission/reception is not suspended if bit 7 (CSIE1) is cleared to 0.
It is suspended upon completion of 8-bit data transfer.
When suspended, bit 3 (TRF) of the automatic data transmit/receive control register (ADTC) is cleared
to 0 after transfer of the 8th bit, and all the port pins used as serial interface alternate-function pins (P20/
SI1, P21/SO1, P22/SCK1, P23/STB/TxD1 and P24/BUSY/RxD1) are set to the port mode.
To restart automatic transmission/reception, set CSIE1 to 1 and write the desired value to serial I/O shift
register 1 (SIO1). The remaining data can be transmitted in this way.

Cautions 1. If the HALT instruction is executed during automatic transmission/reception, transfer

is suspended and the HALT mode is set, even if 8-bit data transfer is in progress.
When the HALT mode is cleared, automatic transmission/reception is restarted from
the suspended point.
2. When suspending automatic transmission/reception, do not change the operating
mode to 3-wire serial I/O mode while TRF = 1.

Figure 18-17. Automatic Transmission/Reception Suspension and Restart

CSIE1 = 0 (suspended command) Suspend

Restart command
CSIE1 = 1, write to SIO1
SCK1

SO1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

SI1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

CSIE1: Bit 7 of serial operating mode register 1 (CSIM1)

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(4) Synchronization control

Busy control and strobe control are functions to synchronize transmission/reception between the master
device and a slave device.
By using these functions, a shift in bits being transmitted or received can be detected.

(a) Busy control option

Busy control is a function to keep the serial transmission/reception by the master device waiting while
the busy signal output by a slave device to the master is active.
When using this busy control option, the following conditions must be satisfied.

• Bit 5 (ATE) of serial operating mode register 1 (CSIM1) is set to 1.

• Bit 1 (BUSY1) of the automatic data transmit/receive control register (ADTC) is set to 1.

Figure 18-18 shows the system configuration of the master device and a slave device when the busy
control option is used.

Figure 18-18. System Configuration When Busy Control Option Is Used

Master device
( µPD780058, 780058Y Subseries) Slave device

SCK1 SCK1

SO1 SI1
SI1 SO1

BUSY

The master device inputs the busy signal output by the slave device to the BUSY/P24 pin. The master
device samples the input busy signal in synchronization with the falling edge of the serial clock. Even
if the busy signal becomes active while 8-bit data is being transmitted or received, transmission/reception
by the master is not kept waiting. If the busy signal is active at the rising edge of the serial clock 2 clocks
after completion of transmission/reception of the 8-bit data, the busy input becomes valid. After that, the
master transmission/reception is kept waiting while the busy signal is active.
The active level of the busy signal is set by bit 0 (BUSY0) of ADTC.

BUSY0 = 0: Active high

BUSY0 = 1: Active low

When using the busy control option, select the internal clock as the serial clock. Control with the busy
signal cannot be implemented with an external clock.
Figure 18-19 shows the operation timing when the busy control option is used.

Caution Busy control cannot be used simultaneously with the interval time control function of
the automatic data transmit/receive interval specification register (ADTI). If used, busy
control is invalid.

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Figure 18-19. Operation Timing When Busy Control Option Is Used (When BUSY0 = 0)

SCK1

SO1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

SI1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

BUSY

Wait
CSIIF1

Clears busy input

Busy input is valid

TRF

Caution If TRF is cleared, the SO1 pin goes low.

Remark CSIIF1: Interrupt request flag

TRF: Bit 3 of the automatic data transmit/receive control register (ADTC)

When the busy signal becomes inactive, waiting is released. If the sampled busy signal is inactive,
transmission/reception of the next 8-bit data is started at the falling edge of the next clock.
Because the busy signal is asynchronous to the serial clock, it takes up to 1 clock until the busy signal
is sampled, even if made inactive by the slave. It takes 0.5 clock until data transfer is started after the
busy signal was sampled.
To accurately release waiting, the slave must keep the busy signal inactive at least for the duration of
1.5 clocks.
Figure 18-20 shows the timing of the busy signal and wait release. This figure shows an example where
the busy signal is active as soon as transmission/reception has been started.

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Figure 18-20. Busy Signal and Wait Release (When BUSY0 = 0)

SCK1

SO1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

SI1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

BUSY 1.5 clocks (min.)

(Active high) If made inactive
immediately after
sampled Wait
Busy input released
Busy input valid

(b) Busy & strobe control option

Strobe control is a function to synchronize data transmission/reception between the master and slave
devices. The master device outputs the strobe signal from the STB/P23 pin when 8-bit transmission/
reception has been completed. By this signal, the slave device can determine the timing of the end of
data transmission. Therefore, synchronization is established even if a bit shift occurs because noise is
superimposed on the serial clock, and transmission of the next byte is not affected by the bit shift.
To use the strobe control option, the following conditions must be satisfied.

• Bit 5 (ATE) of serial operating mode register 1 (CSIM1) is set to 1.

• Bit 2 (STRB) of the automatic data transmit/receive control register (ADTC) is set to 1.

Usually, the busy control and strobe control options are simultaneously used as handshake signals. In
this case, the strobe signal is output from the STB/P23 pin, the BUSY/P24 pin is sampled, and
transmission/reception can be kept waiting while the busy signal is input.
When the strobe control option is not used, the P23/STB pin can be used as a normal I/O port pin.
Figure 18-21 shows the operation timing when the busy & strobe control options are used.
When the strobe control option is used, the interrupt request flag (CSIIF1) that is set on completion of
transmission/reception is set after the strobe signal is output.

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Figure 18-21. Operation Timing When Busy & Strobe Control Options Are Used (When BUSY0 = 0)

SCK1

SO1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

SI1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

STB

BUSY

CSIIF1

Busy input released

Busy input valid

TRF

Caution When TRF is cleared, the SO1 pin goes low.

Remark CSIIF1: Interrupt request flag

TRF: Bit 3 of the automatic data transmit/receive control register (ADTC)

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(c) Bit shift detection by busy signal

During automatic transmission/reception, a bit shift of the serial clock of the slave device may occur
because noise is superimposed on the serial clock signal output by the master device. Unless the strobe
control option is used at this time, the bit shift affects transmission of the next byte. In this case, the master
can detect the bit shift by checking the busy signal during transmission by using the busy control option.
A bit shift is detected by using the busy signal as follows.
The slave outputs the busy signal after the rising of the eighth serial clock during data transmission/
reception (to not keep transmission/reception waiting by the busy signal at this time, make the busy signal
inactive within 2 clocks).
The master samples the busy signal in synchronization with the falling edge of the leading side of the
serial clock. If a bit shift does not occur, all the eight serial clocks that have been sampled are inactive.
If the sampled serial clocks are active, it is assumed that a bit shift has occurred, and error processing
is executed (by setting bit 4 (ERR) of the automatic data transmit/receive control register (ADTC) to 1).
Figure 18-22 shows the operation timing of the bit shift detection function by the busy signal.

Figure 18-22. Operation Timing of Bit Shift Detection Function by Busy Signal (When BUSY0 = 1)

SCK1
(master)
Bit shift due to noise
SCK1
(slave)

SO1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D7 D6 D5 D4 D3 D2 D1 D0

SI1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D7 D6 D5 D4 D3 D2 D1 D0

BUSY

CSIIF1

CSIE1

ERR

Busy not detected Error interrupt request

generated
Error detected

CSIIF1: Interrupt request flag

CSIE1: Bit 7 of serial operating mode register 1 (CSIM1)
ERR: Bit 4 of the automatic data transmit/receive control register (ADTC)

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(5) Automatic transmit/receive interval time

When using the automatic transmit/receive function, the read/write operations from/to the internal buffer RAM
are performed after transmitting/receiving one byte. Therefore, an interval is inserted before the next transmit/
receive operation.
Since the read/write operations from/to the buffer RAM are performed in parallel with the CPU processing when
using the automatic transmit/receive function with the internal clock, the interval depends on the value which
is set in the automatic transmit/receive interval specification register (ADTI) and the CPU processing at the
rising edge of the eighth serial clock. Whether it depends on the ADTI or not can be selected by setting bit
7 of ADTI (ADTI7). When it is cleared to 0, the interval depends only on the CPU processing. When it is set
to 1, the interval depends on the contents of ADTI or the CPU processing, whichever is greater.
When the automatic transmit/receive function is used with an external clock, it must be selected so that the
interval may be longer than the value indicated by paragraph (b).

Figure 18-23. Automatic Data Transmit/Receive Interval Time

Interval

SCK1

SO1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

SI1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

CSIIF1

CSIIF1: Interrupt request flag

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(a) When the automatic transmit/receive function is used with the internal clock
If bit 1 (CSIM11) of serial operating mode register 1 (CSIM1) is set to 1, the internal clock operates.
If the automatic transmit/receive function is operated with the internal clock, the interval timing according
to CPU processing is as follows.
When bit 7 (ADTI7) of the automatic data transmit/receive interval specification register (ADTI) is cleared
to 0, the interval depends on the CPU processing. When ADTI7 is set to 1, it depends on the contents
of ADTI or the CPU processing, whichever is greater.
See Figure 18-5 Automatic Data Transmit/Receive Interval Specification Register Format for the
intervals set by ADTI.

Table 18-2. Interval Timing According to CPU Processing (When Internal Clock Is Operating)

CPU Processing Interval Time

When using multiplication instruction Max. (2.5TSCK, 13TCPU)

When using division instruction Max. (2.5TSCK, 20TCPU)
External access 1 wait mode Max. (2.5TSCK, 9TCPU)
Other than above Max. (2.5TSCK, 7TCPU)

TSCK: 1/fSCK
fSCK: Serial clock frequency
TCPU: 1/fCPU
fCPU: CPU clock (set by bits 0 to 2 (PCC0 to PCC2) of the processor clock control register
(PCC) and bit 0 (MCS) of the oscillation mode select register (OSMS))
MAX. (a, b): a or b, whichever is greater

Figure 18-24. Operation Timing with Automatic Data Transmit/Receive Function Performed Using
Internal Clock

fX

TCPU

f CPU

TSCK Interval

SCK1

SO1 D7 D6 D5 D4 D3 D2 D1 D0

SI1 D7 D6 D5 D4 D3 D2 D1 D0

f X: Main system clock oscillation frequency

fCPU: CPU clock (set by bits 0 to 2 (PCC0 to PCC2) of the processor clock control register (PCC))
TCPU: 1/fCPU
TSCK: 1/fSCK
fSCK: Serial clock frequency

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(b) When using automatic transmit/receive function with external clock

An external clock is used when bit 1 (CSIM11) of serial operating mode register 1 (CSIM1) is cleared to
0.
To use the automatic transmit/receive function with an external clock, the external clock must be input
so that the interval time is as follows.

Table 18-3. Interval Time According to CPU Processing (with External Clock)

CPU Processing Interval Time

When using multiplication instruction 13TCPU or more

When using division instruction 20TCPU or more
External access 1 wait mode 9TCPU or more
Other than above 7TCPU or more

TCPU: 1/fCPU
fCPU: CPU clock (set by the bits 0 to 2 (PCC0 to PCC2) of the processor clock control register (PCC)
and bit 0 (MCS) of the oscillation mode select register (OSMS))

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19.1 Functions of Serial Interface Channel 2

Serial interface channel 2 has the following three modes.

• Operation stop mode

• Asynchronous serial interface (UART) mode (with time-division transfer function)
• 3-wire serial I/O mode

(1) Operation stop mode

This mode is used when serial transfer is not carried out to reduce power consumption.

(2) Asynchronous serial interface (UART) mode (with time-division transfer function)
In this mode, one byte of data is transmitted/received following the start bit, and full-duplex operation is
possible.
A dedicated UART baud rate generator is incorporated, allowing communication over a wide range of baud
rates. In addition, the baud rate can be defined by dividing the clock input to the ASCK pin.
The MIDI standard baud rate (31.25 kbps) can be used by employing the dedicated UART baud rate generator.
Two sets of data I/O pins (RxD and TxD) are provided, and the pin to be used can be selected by software
(time-division transfer function). However, only one set of pins can be used at one time.

Cautions 1. If it is not necessary to change the data I/O pin, use of the RxD0/SI2/P70 and TxD0/SO2/
P71 pins is recommended. If only port 2 (RxD1/BUSY/P24 and TxD1/STB/P23) is used
as data I/O pins, the function of port 7 is limited.
2. When using the busy control option or busy & strobe control option in the 3-wire serial
I/O mode with automatic transmit/receive function of serial interface channel 1, the RxD1/
BUSY/P24 and TxD1/STB/P23 pins cannot be used as data I/O pins.

(3) 3-wire serial I/O mode (MSB-first/LSB-first switchable)

In this mode, 8-bit data transfer is performed using three lines: the serial clock (SCK2), and serial data lines
(SI2, SO2).
In the 3-wire serial I/O mode, simultaneous transmission and reception is possible, increasing the data transfer
processing speed.
Either the MSB or LSB can be specified as the start bit for an 8-bit data serial transfer, allowing connection
to devices using either as the start bit.
The 3-wire serial I/O mode is useful for connection to peripheral I/Os and display controllers, etc., which
incorporate a conventional clocked serial interface, such as the 75X/XL Series, 78K Series, 17K Series, etc.

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19.2 Configuration of Serial Interface Channel 2

Serial interface channel 2 consists of the following hardware.

Table 19-1. Configuration of Serial Interface Channel 2

Item Configuration
Registers Transmit shift register (TXS)
Receive shift register (RXS)
Receive buffer register (RXB)
Control registers Serial operating mode register 2 (CSIM2)
Asynchronous serial interface mode register (ASIM)
Asynchronous serial interface status register (ASIS)
Baud rate generator control register (BRGC)
Serial interface pin select register (SIPS)

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Figure 19-1. Block Diagram of Serial Interface Channel 2

Internal bus

Asynchronous Asynchronous
Serial interface pin serial interface serial interface
select register status register mode register
Receive buffer Direction
SIPS21 SIPS20 register PE FE OVE TXE RXE PS1 PS0 CL SL ISRM SCK
controller
(RXB/SIO2)

Transmit shift
Direction register
controller
(TXS/SIO2)
Selector

RxD0/SI2/P70
Receive shift
register (RXS)
RxD1/BUSY/P24
Selector

TxD0/SO2/P71
PM71
TxD1/STB/P23 INTSER SCK Output
Reception Transmission controller
PM23
controller INTSR/INTCSI2 controller
PM72 ISRM INTST

ASCK/
SCK2/P72
Note
Baud rate generator
f XX to f XX /210

CSIE2
SCK
TXE 4 4 CSCK
RXE

CSIE2
CSIM CSCK
MDL3 MDL2 MDL1 MDL0 TPS3 TPS2 TPS1 TPS0
22
Serial operating Baud rate generator
mode register 2 control register

Internal bus

Note See Figure 19-2 for the baud rate generator configuration.

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Figure 19-2. Baud Rate Generator Block Diagram

CSIE2
TXE
Start bit
sampling clock

5-bit
counter
Selector

Selector
ASCK/SCK2/P72
Transmit

Selector
clock
1/2 Match Selector f XX to f XX /210
4 TPS0 to TPS3
MDL0 to MDL3 SCK
CSCK

Decoder
4
Selector

Receive
clock Match
1/2

5-bit
counter

RXE
Start bit detection TPS3 TPS2 TPS1 TPS0 MDL3 MDL2 MDL1 MDL0

Baud rate generator

control register

Internal bus

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(1) Transmit shift register (TXS)

This register is used to set the transmit data. The data written in TXS is transmitted as serial data.
If the data length is specified as 7 bits, bits 0 to 6 of the data written in TXS are transferred as transmit data.
Writing data to TXS starts the transmit operation.
TXS is written with an 8-bit memory manipulation instruction. It cannot be read.
RESET input sets TXS to FFH.

Caution TXS must not be written during a transmit operation. TXS and the receive buffer register
(RXB) are allocated to the same address, and when a read is performed, the value of RXB
is read.

(2) Receive shift register (RXS)

This register is used to convert serial data input to the RxD0 (RxD1) pin into parallel data. When one byte
of data is received, the receive data is transferred to the receive buffer register (RXB).
RXS cannot be directly manipulated by a program.

(3) Receive buffer register (RXB)

This register holds receive data. Each time one byte of data is received, new receive data is transferred from
the receive shift register (RXS).
If the data length is specified as 7 bits, the receive data is transferred to bits 0 to 6 of RXB, and the MSB of
RXB is always cleared to 0.
RXB is read with an 8-bit memory manipulation instruction. It cannot be written to.
RESET input sets RXB to FFH.

Caution RXB and the transmit shift register (TXS) are allocated to the same address, and when a write
is performed, the value is written to TXS.

(4) Transmission controller

This circuit performs transmit operation control such as the addition of a start bit, parity bit, and stop bit to
data written in the transmit shift register (TXS) in accordance with the contents set in the asynchronous serial
interface mode register (ASIM).

(5) Reception controller

This circuit controls receive operations in accordance with the contents set in the asynchronous serial interface
mode register (ASIM). It performs error checks for parity errors, etc., during a receive operation, and if an
error is detected, sets a value in the asynchronous serial interface status register (ASIS) in accordance with
the error contents.

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19.3 Control Registers of Serial Interface Channel 2

Serial interface channel 2 is controlled by the following five registers.

• Serial operating mode register 2 (CSIM2)

• Asynchronous serial interface mode register (ASIM)
• Asynchronous serial interface status register (ASIS)
• Baud rate generator control register (BRGC)
• Serial interface pin select register (SIPS)

(1) Serial operating mode register 2 (CSIM2)

This register is set when serial interface channel 2 is used in the 3-wire serial I/O mode.
CSIM2 is set with a 1-bit or an 8-bit memory manipulation instruction.
RESET input sets CSIM2 to 00H.

Figure 19-3. Format of Serial Operating Mode Register 2

Symbol <7> 6 5 4 3 2 1 0 Address After reset R/W

CSIM2 CSIE2 0 0 0 0 CSIM

CSCK 0 FF72H 00H R/W
22

CSCK Clock selection in 3-wire serial I/O mode

0 Input clock from off-chip to SCK2 pin
1 Dedicated baud rate generator output

CSIM22 First bit specification

0 MSB
1 LSB

CSIE2 Operation control in 3-wire serial I/O mode

0 Operation stopped
1 Operation enabled

Cautions 1. Be sure to clear bits 0 and 3 to 6 to 0.

2. When UART mode is selected, CSIM2 should be cleared to 00H.

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(2) Asynchronous serial interface mode register (ASIM)

This register is set when serial interface channel 2 is used in the asynchronous serial interface mode.
ASIM is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears ASIM to 00H.

Figure 19-4. Format of Asynchronous Serial Interface Mode Register

Symbol <7> <6> 5 4 3 2 1 0 Address After reset R/W

ASIM TXE RXE PS1 PS0 CL SL ISRM SCK FF70H 00H R/W

SCK Clock selection in asynchronous serial interface

mode
0 Input clock from off-chip to ASCK pin
1 Dedicated baud rate generator outputNote

ISRM Control of reception completion interrupt request

in case of error occurrence
0 Reception completion interrupt request generated
in case of error occurrence

1 Reception completion interrupt request not

generated in case of error occurrence

SL Transmit data stop bit length specification

0 1 bit
1 2 bits

CL Character length specification

0 7 bits
1 8 bits

PS1 PS0 Parity bit specification

0 0 No parity

0 1 0 parity always added in transmission.

No parity test in reception (parity error not
generated).

1 0 Odd parity
1 1 Even parity

RXE Receive operation control

0 Receive operation stopped
1 Receive operation enabled

TXE Transmit operation control

0 Transmit operation stopped
1 Transmit operation enabled

Note When SCK is set to 1 and the baud rate generator output is selected, the ASCK pin can be used as
an I/O port.

Cautions 1. When the 3-wire serial I/O mode is selected, ASIM should be cleared to 00H.
2. The serial transmit/receive operation must be stopped before changing the operating
mode.
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Table 19-2. Operating Mode Settings of Serial Interface Channel 2 (1/2)

(1) Operation stop mode

ASIM CSIM2 SIPS PM70 P70 PM71 P71 PM23 P23 PM24 P24 PM72 P72 Start Shift P70/SI2/ P71/SO2/ P23/STB/ P24/BUSY/ P72/SCK2
bit clock RxD0 pin TxD0 pin TxD1 pin RxD1 pin /ASCK pin
TXE RXE SCK CSIE2 CSIM22 CSCK SIPS21 SIPS20 function function function function function

0 0 × 0 × × × × ×Note 1 ×Note 1 ×Note 1 ×Note 1 ×Note 1 ×Note 1 ×Note 1 ×Note 1 ×Note 1 ×Note 1 — — P70 P71 P23/STB P24/BUSY P72

Other than above Setting prohibited

(2) 3-wire serial I/O mode

ASIM CSIM2 SIPS PM70 P70 PM71 P71 PM23 P23 PM24 P24 PM72 P72 Start Shift P70/SI2/ P71/SO2/ P23/STB/ P24/BUSY/ P72/SCK2
bit clock RxD0 pin TxD0 pin TxD1 pin RxD1 pin /ASCK pin
TXE RXE SCK CSIE2 CSIM22 CSCK SIPS21 SIPS20 function function function function function
Note 1 Note 1 Note 1 Note 1 Note 2
0 0 0 1 0 0 × × ×
Note 2 Note 2
× 0 1 × × × × 1 × MSB External SI2 SO2 P23/STB P24/BUSY SCK2 input
clock (CMOS
output)
1 0 1 Internal SCK2 output
clock

1 1 0 1 × LSB External SI2 Note 2 SO2 SCK2 input

clock (CMOS
output)
1 0 1 Internal SCK2 output
clock

Other than above Setting prohibited

Notes 1. Can be used freely as a port function.

2. Can be used as P70 (CMOS I/O) when only transmission is performed.

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

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Table 19-2. Operating Mode Setting of Serial Interface Channel 2 (2/2)

(3) Asynchronous serial interface mode

ASIM CSIM2 SIPS PM70 P70 PM71 P71 PM23 P23 PM24 P24 PM72 P72 Start Shift P70/SI2/ P71/SO2/ P23/STB/ P24/BUSY/ P72/SCK2
bit clock RxD0 pin TxD0 pin TxD1 pin RxD1 pin /ASCK pin
TXE RXE SCK CSIE2 CSIM22 CSCK SIPS21 SIPS20 function function function function function
Note 1 Note 1 Note 1 Note 1
1 0 0 0 0 0 0 0 ×
Note 1 Note 1
× 0 1 × × × × 1 × LSB External P70 TxD0 P23/STB P24/BUSY ASCK input
clock (CMOS
output)
1 ×
Note 1
×
Note 1 Internal P72
clock

0 1 0 0 0 0 0 0 1 × ×
Note 1
×
Note 1
×
Note 1
×
Note 1
×
Note 1
×
Note 1
1 × External RxD0 P71 ASCK input
clock

1 ×
Note 1
×
Note 1 Internal P72
clock

1 1 0 0 0 0 0 0 1 × 0 1 ×Note 1 ×Note 1 ×Note 1 ×Note 1 1 × External TxD0 ASCK input

clock (CMOS
output)
1 ×
Note 1
×
Note 1 Internal P72
clock
Note 1
0 ×
Note 1 Note 1
1 0 0 0 0 0 1 × 0 1 0 Note 2 × ×
Note 1
1 × External P70 High TxD1 P24/BUSY ASCK input
clock output

1 ×
Note 1
×
Note 1 Internal P72
clock

0 1 0 0 0 0 0 1 1 × ×
Note 1
×
Note 1
×
Note 1
×
Note 1
1 × 1 × External P70 P71 P23/STB RxD1 ASCK input
clock (Input)

1 Note 1 Note 1 Internal P72

× ×
clock

1 1 0 0 0 0 1 1 1 × 0 1 0 Note 2 1 × 1 × External P70 High TxD1 RxD1 ASCK input

clock (Input) output

1 Note 1 Note 1 Internal P72

× ×
clock

Other than above Setting prohibited

Notes 1. Can be used freely as a port function.

2. The set value differs between when the actual device operates and when emulation is executed
by the in-circuit emulator. For details, see 19.4.5 Restrictions in UART mode 2.

Remark ×: don’t care

PM××: Port mode register
P××: Port output latch

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(3) Asynchronous serial interface status register (ASIS)

This is a register which displays the type of error when a reception error occurs in the asynchronous serial
interface mode.
ASIS is read with a 1-bit or 8-bit memory manipulation instruction.
In 3-wire serial I/O mode, the contents of ASIS are undefined.
RESET input clears ASIS to 00H.

Figure 19-5. Format of Asynchronous Serial Interface Status Register

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

ASIS 0 0 0 0 0 PE FE OVE FF71H 00H R

OVE Overrun Error Flag

0 Overrun error did not occur
1 Overrun error occurredNote 1
(When next receive operation is completed before
data is read from receive buffer register)

FE Framing error flag

0 Framing error did not occur
1 Framing error occurredNote 2
(When stop bit is not detected)

PE Parity error flag

0 Parity error did not occur
1 Parity error occurred (when transmit data parity
does not match)

Notes 1. The receive buffer register (RXB) must be read when an overrun error occurs. Overrun errors will
continue to occur until RXB is read.
2. Even if the stop bit length has been set as 2 bits by bit 2 (SL) of the asynchronous serial interface
mode register (ASIM), only single stop bit detection is performed during reception.

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(4) Baud rate generator control register (BRGC)

This register sets the serial clock for serial interface channel 2.
BRGC is set with an 8-bit memory manipulation instruction.
RESET input clears BRGC to 00H.

Figure 19-6. Format of Baud Rate Generator Control Register (1/2)

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

BRGC TPS3 TPS2 TPS1 TPS0 MDL3 MDL2 MDL1 MDL0 FF73H 00H R/W

MDL3 MDL2 MDL1 MDL0 Baud rate generator input clock selection k
0 0 0 0 fSCK/16 0

0 0 0 1 fSCK/17 1

0 0 1 0 fSCK/18 2

0 0 1 1 fSCK/19 3

0 1 0 0 fSCK/20 4

0 1 0 1 fSCK/21 5

0 1 1 0 fSCK/22 6

0 1 1 1 fSCK/23 7

1 0 0 0 fSCK/24 8

1 0 0 1 fSCK/25 9

1 0 1 0 fSCK/26 10

1 0 1 1 fSCK/27 11

1 1 0 0 fSCK/28 12

1 1 0 1 fSCK/29 13

1 1 1 0 fSCK/30 14

1 1 1 1 fSCKNote —

Note Can only be used in 3-wire serial I/O mode.

Remarks 1. fSCK: 5-bit counter source clock

2. k: Value set in MDL0 to MDL3 (0 ≤ k ≤ 14)

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Figure 19-6. Format of Baud Rate Generator Control Register (2/2)

TPS3 TPS2 TPS1 TPS0 5-bit counter source clock selection n

MCS = 1 MCS = 0
0 0 0 0 fXX/210 fXX/210 (4.9 kHz) fX/211 (2.4 kHz) 11
0 1 0 1 fXX fX (5.0 MHz) fX/2 (2.5 MHz) 1

0 1 1 0 fXX/2 fX/2 (2.5 MHz) fX/22 (1.25 MHz) 2

0 1 1 1 fXX/22 fX/22 (1.25 MHz) fX/23 (625 kHz) 3
1 0 0 0 fXX/23 fX/23 (625 kHz) fX/24 (313 kHz) 4

1 0 0 1 fXX/24 fX/24 (313 kHz) fX/25 (156 kHz) 5

1 0 1 0 fXX/25 fX/25 (156 kHz) fX/26 (78.1 kHz) 6
1 0 1 1 fXX/26 fX/26 (78.1 kHz) fX/27 (39.1 kHz) 7

1 1 0 0 fXX/27 fX/27 (39.1 kHz) fX/28 (19.5 kHz) 8

1 1 0 1 fXX/28 fX/28 (19.5 kHz) fX/29 (9.8 kHz) 9
1 1 1 0 fXX/29 fX/29 (9.8 kHz) fX/210 (4.9 kHz) 10

Other than above Setting prohibited

Caution When BRGC is written during a communication operation, baud rate generator output is
disrupted and communication cannot be performed normally. Therefore, BRGC must not
be written during a communication operation.

Remarks 1. fX: Main system clock oscillation frequency

2. fXX: Main system clock frequency (fX or fX/2)
3. MCS: Bit 0 of the oscillation mode select register (OSMS)
4. n: Value set in TPS0 to TPS3 (1 ≤ n ≤ 11)
5. Values in parentheses apply to operation with fX = 5.0 MHz

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The baud rate transmit/receive clock generated is either a signal divided from the main system clock, or a signal
divided from the clock input from the ASCK pin.

(a) Generation of baud rate transmit/receive clock from main system clock
The transmit/receive clock is generated by dividing the main system clock. The baud rate generated from
the main system clock is obtained from the following expression.

fXX
[Baud rate] = [Hz]
2n × (k + 16)

where, fX : Main system clock oscillation frequency

fXX: Main system clock frequency (fX or fX/2)
n: Value set in TPS0 to TPS3 (1 ≤ n ≤ 11)
k: Value set in MDL0 to MDL3 (0 ≤ k ≤ 14)

Table 19-3. Relationship Between Main System Clock and Baud Rate

Baud fX = 5.0 MHz fX = 4.19 MHz

Rate
MCS = 1 MCS = 0 MCS = 1 MCS = 0
(bps)
BRGC Set Value Error (%) BRGC Set Value Error (%) BRGC Set Value Error (%) BRGC Set Value Error (%)
75 – 00H 1.73 0BH 1.14 EBH 1.14
110 06H 0.88 E6H 0.88 03H –2.01 E3H –2.01
150 00H 1.73 E0H 1.73 EBH 1.14 DBH 1.14
300 E0H 1.73 D0H 1.73 DBH 1.14 CBH 1.14
600 D0H 1.73 C0H 1.73 CBH 1.14 BBH 1.14
1,200 C0H 1.73 B0H 1.73 BBH 1.14 ABH 1.14
2,400 B0H 1.73 A0H 1.73 ABH 1.14 9BH 1.14
4,800 A0H 1.73 90H 1.73 9BH 1.14 8BH 1.14
9,600 90H 1.73 80H 1.73 8BH 1.14 7BH 1.14
19,200 80H 1.73 70H 1.73 7BH 1.14 6BH 1.14
31,250 74H 0 64H 0 71H –1.31 61H –1.31
38,400 70H 1.73 60H 1.73 6BH 1.14 5BH 1.14
76,800 60H 1.73 50H 1.73 5BH 1.14 — —

Remark MCS: Bit 0 of the oscillation mode select register (OSMS)

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(b) Generation of baud rate transmit/receive clock from external clock input from ASCK pin
The transmit/receive clock is generated by dividing the clock input from the ASCK pin. The baud rate
generated from the clock input from the ASCK pin is obtained from the following expression.

fASCK
[Baud rate] = [Hz]
2 × (k + 16)

fASCK: Frequency of clock input to ASCK pin

k: Value set in MDL0 to MDL3 (0 ≤ k ≤ 14)

Table 19-4. Relationship Between ASCK Pin Input Frequency and Baud Rate (When BRGC Is Set to 00H)

Baud Rate (bps) ASCK Pin Input Frequency

75 2.4 kHz
110 3.52 kHz
150 4.8 kHz
300 9.6 kHz
600 19.2 kHz
1,200 38.4 kHz
2,400 76.8 kHz
4,800 153.6 kHz
9,600 307.2 kHz
19,200 614.4 kHz
31,250 1,000.0 kHz
38,400 1,228.8 kHz

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(5) Serial interface pin select register (SIPS)

This register selects the input/output pins when serial interface channel 2 is used in the asynchronous serial
interface mode (with time-division transfer function).
SIPS is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SIPS to 00H.
To select the input/output pins, the port mode register and the output latch of the port must be set. For details,
see Table 19-2 Operating Mode Settings of Serial Interface Channel 2.

Figure 19-7. Format of Serial Interface Pin Select Register

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

SIPS 0 0 SIPS21 SIPS20 0 0 0 0 FF75H 00H R/W

SIPS21 SIPS20 Selection input/output pin of asynchronous serial interface

0 0 Input pin: RxD0/SI2/P70

Output pin: TxD0/SO2/P71

0 1 Input pin: RxD1/BUSY/P24

Output pin: TxD0/SO2/P71

1 0 Input pin: RxD0/SI2/P70

Output pin: TxD1/STB/P23

1 1 Input pin: RxD1/BUSY/P24

Output pin: TxD1/STB/P23

Cautions 1. Select the input/output pins after stopping serial transmission/reception.

2. When using the busy control option or busy & strobe control option in the 3-wire serial
I/O mode with automatic transmit/receive function of serial interface channel 1, the RxD1/
BUSY/P24 and TxD1/STB/P23 pins cannot be used as data I/O pins.
3. SIPS21 is valid only when the TXE flag is “1” and SIPS20 is valid only when the RXE flag
is “1”.
4. There are restrictions when SIPS21 = 1 (when the TxD1 pin is used as an output pin for
UART transmission). For details, see 19.4.5 Restrictions in UART mode 2.

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19.4 Operation of Serial Interface Channel 2

The following three operating modes are available for serial interface channel 2.

• Operation stop mode

• Asynchronous serial interface (UART) mode (with time-division transfer function)
• 3-wire serial I/O mode

19.4.1 Operation stop mode

In the operation stop mode, serial transfer is not performed, and therefore power consumption can be reduced.
In the operation stop mode, the P70/SI2/RxD0, P71/SO2/TxD0, and P72/SCK2/ASCK pins can be used as normal
I/O ports and the P23/STB/TxD1, P24/BUSY/RxD1 pins can be used as normal I/O ports or as the strobe output and
busy input for serial interface automatic transmit/receive.

(1) Register setting

Operation stop mode is set by serial operating mode register 2 (CSIM2) and the asynchronous serial interface
mode register (ASIM).

(a) Serial operating mode register 2 (CSIM2)

CSIM2 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM2 to 00H.

Symbol <7> 6 5 4 3 2 1 0 Address After reset R/W

CSIM2 CSIE2 0 0 0 0 CSIM CSCK 0 FF72H 00H R/W

22

CSIE2 Operation control in 3-wire serial I/O mode

0 Operation stopped
1 Operation enabled

Caution Be sure to clear bits 0 and 3 to 6 to 0.

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(b) Asynchronous serial interface mode register (ASIM)

ASIM is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears ASIM to 00H.

Symbol <7> <6> 5 4 3 2 1 0 Address After reset R/W

ASIM TXE RXE PS1 PS0 CL SL ISRM SCK FF70H 00H R/W

RXE Receive operation control

0 Receive operation stopped
1 Receive operation enabled

TXE Transmit operation control

0 Transmit operation stopped
1 Transmit operation enabled

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19.4.2 Asynchronous serial interface (UART) mode (with time-division transfer function)
In this mode, one byte of data is transmitted/received following the start bit, and full-duplex operation is possible.
A dedicated UART baud rate generator is incorporated, allowing communication over a wide range of baud rates.
In addition, the baud rate can be defined by dividing the clock input to the ASCK pin.
The MIDI standard baud rate (31.25 kbps) can be used by employing the dedicated UART baud rate generator.
Two sets of data I/O pins (RxD and TxD) are provided, and the pin to be used can be selected by software (time-
division transfer function). However, only one set of pins can be used at one time.

Cautions 1. If it is not necessary to change the data I/O pin, use of the RxD0/SI2/P70 and TxD0/SO2/P71
pins is recommended. If only port 2 (RxD1/BUSY/P24 and TxD1/STB/P23) is used as data I/O
pins, the function of port 7 is limited.
2. When using the busy control option or busy & strobe control option in the 3-wire serial I/O
mode with automatic transmit/receive function of serial interface channel 1, the RxD1/BUSY/
P24 and TxD1/STB/P23 pins cannot be used as data I/O pins.

(1) Register setting

UART mode (with time-division transfer function) is set by serial operating mode register 2 (CSIM2), the
asynchronous serial interface mode register (ASIM), the asynchronous serial interface status register (ASIS),
the baud rate generator control register (BRGC), and the serial interface pin select register (SIPS).

(a) Serial operating mode register 2 (CSIM2)

CSIM2 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM2 to 00H.
When the UART mode is selected, CSIM2 should be cleared to 00H.

Symbol <7> 6 5 4 3 2 1 0 Address After reset R/W

CSIM
CSIM2 CSIE2 0 0 0 0 CSCK 0 FF72H 00H R/W
22

CSCK Clock selection in 3-wire serial I/O mode

0 Input clock from off-chip to SCK2 pin
1 Dedicated baud rate generator output

CSIM22 First bit specification

0 MSB
1 LSB

CSIE2 Operation control in 3-wire serial I/O mode

0 Operation stopped
1 Operation enabled

Caution Be sure to clear bits 0 and 3 to 6 to 0.

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(b) Asynchronous serial interface mode register (ASIM)

ASIM is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears ASIM to 00H.

Symbol <7> <6> 5 4 3 2 1 0 Address After reset R/W

ASIM TXE RXE PS1 PS0 CL SL ISRM SCK FF70H 00H R/W

SCK Clock selection in asynchronous serial interface mode

0 Input clock from off-chip to ASCK pin

1 Dedicated baud rate generator outputNote

ISRM Control of reception completion interrupt request

in case of error occurrence
0 Reception completion interrupt request generated
in case of error occurrence
1 Reception completion interrupt request not
generated in case of error occurrence

SL Transmit data stop bit length specification

0 1 bit
1 2 bits

CL Character length specification

0 7 bits
1 8 bits

PS1 PS0 Parity bit specification

0 0 No parity

0 1 0 parity always added in transmission.

No parity test in reception (parity error not
generated).
1 0 Odd parity
1 1 Even parity

RXE Receive operation control

0 Receive operation stopped
1 Receive operation enabled

TXE Transmit operation control

0 Transmit operation stopped
1 Transmit operation enabled

Note When SCK is set to 1 and the baud rate generator output is selected, the ASCK pin can be used
as an I/O port.

Caution The serial transmit/receive operation must be stopped before changing the operating
mode.

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(c) Asynchronous serial interface status register (ASIS)

ASIS is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears ASIS to 00H.

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

ASIS 0 0 0 0 0 PE FE OVE FF71H 00H R

OVE Overrun error flag

0 Overrun error did not occur
1 Overrun error occurredNote 1
(When next receive operation is completed before
data from receive buffer register is read)

FE Framing error flag

0 Framing error did not occur

1 Framing error occurredNote 2

(When stop bit is not detected)

PE Parity error flag

0 Parity error did not occur
1 Parity error occurred
(When transmit data parity does not match)

Notes 1. The receive buffer register (RXB) must be read when an overrun error occurs. Overrun errors
will continue to occur until RXB is read.
2. Even if the stop bit length has been set as 2 bits by bit 2 (SL) of the asynchronous serial
interface mode register (ASIM), only single stop bit detection is performed during reception.

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(d) Baud rate generator control register (BRGC)

BRGC is set with an 8-bit memory manipulation instruction.
RESET input clears BRGC to 00H.

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

BRGC TPS3 TPS2 TPS1 TPS0 MDL3 MDL2 MDL1 MDL0 FF73H 00H R/W

MDL3 MDL2 MDL1 MDL0 Baud rate generator input clock selection k
0 0 0 0 fSCK/16 0

0 0 0 1 fSCK/17 1

0 0 1 0 fSCK/18 2

0 0 1 1 fSCK/19 3

0 1 0 0 fSCK/20 4

0 1 0 1 fSCK/21 5

0 1 1 0 fSCK/22 6

0 1 1 1 fSCK/23 7

1 0 0 0 fSCK/24 8

1 0 0 1 fSCK/25 9

1 0 1 0 fSCK/26 10

1 0 1 1 fSCK/27 11

1 1 0 0 fSCK/28 12

1 1 0 1 fSCK/29 13

1 1 1 0 fSCK/30 14

(Cont’d)

Remark fSCK: 5-bit counter source clock

k: Value set in MDL0 to MDL3 (0 ≤ k ≤ 14)

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TPS3 TPS2 TPS1 TPS0 5-Bit counter source clock selection n

MCS = 1 MCS = 0
0 0 0 0 fXX/210 fX/210 (4.9 kHz) fX/211 (2.4 kHz) 11

0 1 0 1 fXX fX (5.0 MHz) fX/2 (2.5 MHz) 1

0 1 1 0 fXX/2 fX/2 (2.5 MHz) fX/22 (1.25 MHz) 2
0 1 1 1 fXX/22 fX/22 (1.25 MHz) fX/23 (625 kHz) 3

1 0 0 0 fXX/23 fX/23 (625 kHz) fX/24 (313 kHz) 4

1 0 0 1 fXX/24 fX/24 (313 kHz) fX/25 (156 kHz) 5
1 0 1 0 fXX/25 fX/25 (156 kHz) fX/26 (78.1 kHz) 6

1 0 1 1 fXX/26 fX/26 (78.1 kHz) fX/27 (39.1 kHz) 7

1 1 0 0 fXX/27 fX/27 (39.1 kHz) fX/28 (19.5 kHz) 8
1 1 0 1 fXX/28 fX/28 (19.5 kHz) fX/29 (9.8 kHz) 9

1 1 1 0 fXX/29 fX/29 (9.8 kHz) fX/210 (4.9 kHz) 10

Other than above Setting prohibited

Caution When BRGC is written during a communication operation, baud rate generator output
is disrupted and communication cannot be performed normally. Therefore, BRGC must
not be written to during a communication operation.

Remarks 1. fX: Main system clock oscillation frequency

2. fXX: Main system clock frequency (fX or fX/2)
3. MCS: Bit 0 of the oscillation mode select register (OSMS)
4. n: Value set in TPS0 to TPS3 (1 ≤ n ≤ 11)
5. Values in parentheses apply to operation with fX = 5.0 MHz.

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The baud rate transmit/receive clock generated is either a signal divided from the main system clock, or
a signal divided from the clock input from the ASCK pin.

(i) Generation of baud rate transmit/receive clock from main system clock
The transmit/receive clock is generated by dividing the main system clock. The baud rate generated
from the main system clock is obtained from the following expression.

fXX
[Baud rate] = [Hz]
2n × (k + 16)

where, fX : Main system clock oscillation frequency

fXX: Main system clock frequency (fX or fX/2)
n: Value set in TPS0 to TPS3 (1 ≤ n ≤ 11)
k: Value set in MDL0 to MDL3 (0 ≤ k ≤ 14)

Table 19-5. Relationship Between Main System Clock and Baud Rate

Baud fX = 5.0 MHz fX = 4.19 MHz

Rate
MCS = 1 MCS = 0 MCS = 1 MCS = 0
(bps)
BRGC Set Value Error (%) BRGC Set Value Error (%) BRGC Set Value Error (%) BRGC Set Value Error (%)
75 – 00H 1.73 0BH 1.14 EBH 1.14
110 06H 0.88 E6H 0.88 03H –2.01 E3H –2.01
150 00H 1.73 E0H 1.73 EBH 1.14 DBH 1.14
300 E0H 1.73 D0H 1.73 DBH 1.14 CBH 1.14
600 D0H 1.73 C0H 1.73 CBH 1.14 BBH 1.14
1,200 C0H 1.73 B0H 1.73 BBH 1.14 ABH 1.14
2,400 B0H 1.73 A0H 1.73 ABH 1.14 9BH 1.14
4,800 A0H 1.73 90H 1.73 9BH 1.14 8BH 1.14
9,600 90H 1.73 80H 1.73 8BH 1.14 7BH 1.14
19,200 80H 1.73 70H 1.73 7BH 1.14 6BH 1.14
31,250 74H 0 64H 0 71H –1.31 61H –1.31
38,400 70H 1.73 60H 1.73 6BH 1.14 5BH 1.14
76,800 60H 1.73 50H 1.73 5BH 1.14 — —

Remark MCS: Bit 0 of the oscillation mode select register (OSMS)

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(ii) Generation of baud rate transmit/receive clock from external clock input from ASCK pin
The transmit/receive clock is generated by dividing the clock input from the ASCK pin. The baud rate
generated from the clock input from the ASCK pin is obtained from the following expression.

fASCK
[Baud rate] = [Hz]
2 × (k + 16)

where, fASCK: Frequency of clock input to ASCK pin

k: Value set in MDL0 to MDL3 (0 ≤ k ≤ 14)

Table 19-6. Relationship Between ASCK Pin Input Frequency and Baud Rate (When BRGC Is Set to 00H)

Baud Rate (bps) ASCK Pin Input Frequency

75 2.4 kHz
110 3.52 kHz
150 4.8 kHz
300 9.6 kHz
600 19.2 kHz
1,200 38.4 kHz
2,400 76.8 kHz
4,800 153.6 kHz
9,600 307.2 kHz
19,200 614.4 kHz
31,250 1,000.0 kHz
38,400 1,228.8 kHz

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(e) Serial interface pin select register (SIPS)

SIPS is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears SIPS to 00H.
To select the input/output pins, the port mode register and the output latch of the port must be set. For
details, see Table 19-2 Operating Mode Settings of Serial Interface Channel 2.

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

SIPS 0 0 SIPS21 SIPS20 0 0 0 0 FF75H 00H R/W

SIPS21 SIPS20 Selection of input/output pin of asynchronous serial interface

0 0 Input pin: RxD0/SI2/P70

Output pin: TxD0/SO2/P71

0 1 Input pin: RxD1/BUSY/P24

Output pin: TxD0/SO2/P71

1 0 Input pin: RxD0/SI2/P70

Output pin: TxD1/STB/P23

1 1 Input pin: RxD1/BUSY/P24

Output pin: TxD1/STB/P23

Cautions 1. Select the input/output pins after stopping serial transmission/reception.

2. When using the busy control option or busy & strobe control option in the 3-wire serial
I/O mode with automatic transmit/receive function of serial interface channel 1, the RxD1/
BUSY/P24 and TxD1/STB/P23 pins cannot be used as data I/O pins.
3. SIPS21 is valid only when the TXE flag is “1” and SIPS20 is valid only when the RXE flag
is “1”.
4. There are restrictions when SIPS21 = 1 (when the TxD1 pin is used as an output pin for
UART transmission). For details, see 19.4.5 Restrictions in UART mode 2.

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(2) Communication operation

(a) Data format

The transmit/receive data format is as shown in Figure 19-8.

Figure 19-8. Format of Asynchronous Serial Interface Transmit/Receive Data

One data frame

Start Parity
D0 D1 D2 D3 D4 D5 D6 D7 Stop bit
bit bit

Character bit

One data frame consists of the following bits:

• Start bits .................. 1 bit

• Character bits ......... 7 bits/8 bits
• Parity bits ................ Even parity/odd parity/0 parity/no parity
• Stop bits .................. 1 bit/2 bits

The specification of character bit length, parity selection, and specification of stop bit length for each data
frame is carried out by the asynchronous serial interface mode register (ASIM).
When 7 bits are selected as the number of character bits, only the lower 7 bits (bits 0 to 6) are valid; in
transmission the most significant bit (bit 7) is ignored, and in reception the most significant bit (bit 7) is
always “0”.
The serial transfer rate is selected by means of ASIM and the baud rate generator control register (BRGC).
If a serial data receive error occurs, the receive error contents can be determined by reading the status
of the asynchronous serial interface status register (ASIS).

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(b) Parity types and operation

The parity bit is used to detect a bit error in the communication data. Normally, the same kind of parity
bit is used on the transmitting side and the receiving side. With even parity and odd parity, a 1-bit (odd
number) error can be detected. With 0 parity and no parity, an error cannot be detected.

(i) Even parity

• Transmission
The number of bits with a value of “1”, including the parity bit, in the transmit data is controlled to
be even.
The value of the parity bit is as follows:

Number of bits with a value of “1” in transmit data is odd: 1

Number of bits with a value of “1” in transmit data is even: 0

• Reception
The number of bits with a value of “1”, including the parity bit, in the receive data is counted. If
it is odd, a parity error occurs.

(ii) Odd parity

• Transmission
Conversely to the situation with even parity, the number of bits with a value of “1”, including the
parity bit, in the transmit data is controlled to be odd. The value of the parity bit is as follows:

Number of bits with a value of “1” in transmit data is odd: 0

Number of bits with a value of “1” in transmit data is even: 1

• Reception
The number of bits with a value of “1”, including the parity bit, in the receive data is counted. If
it is even, a parity error occurs.

(iii) 0 Parity
When transmitting, the parity bit is set to “0” irrespective of the transmit data.
At reception, a parity bit check is not performed. Therefore, a parity error does not occur, irrespective
of whether the parity bit is set to “0” or “1”.

(iv) No parity
A parity bit is not added to the transmit data. At reception, data is received assuming that there is
no parity bit. Since there is no parity bit, a parity error does not occur.

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(c) Transmission
A transmit operation is started by writing transmit data to the transmit shift register (TXS). The start bit,
parity bit and stop bit(s) are added automatically.
When the transmit operation starts, the data in the transmit shift register (TXS) is shifted out, and when
the transmit shift register (TXS) is empty, a transmission completion interrupt request (INTST) is
generated.

Figure 19-9. Asynchronous Serial Interface Transmission Completion Interrupt Request Generation Timing

(a) Stop bit length: 1

STOP
TxD0 (TxD1) (output) D0 D1 D2 D6 D7 Parity

START

INTST

(b) Stop bit length: 2

TxD0 (TxD1) (output) D0 D1 D2 D6 D7 Parity STOP

START

INTST

Caution Rewriting the asynchronous serial interface mode register (ASIM) should not be per-
formed during a transmit operation. If rewriting the ASIM is performed during transmis-
sion, subsequent transmit operations may not be possible (the normal state is restored
by RESET input).
It is possible to determine whether transmission is in progress by software by using a
transmission completion interrupt request (INTST) or the interrupt request flag (STIF)
set by INTST.

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(d) Reception
When the RXE bit of the asynchronous serial interface mode register (ASIM) is set to 1, a receive operation
is enabled and sampling of the RxD0 (RxD1) pin input is started.
RxD0 (RxD1) pin input sampling is performed using the serial clock specified by ASIM.
When the RxD0 (RxD1) pin input becomes low, the 5-bit counter of the baud rate generator (see Figure
19-2) starts counting, and at the time when the half time determined by specified baud rate has passed,
the data sampling start timing signal is output. If the RxD0 (RxD1) pin input sampled again as a result
of this start timing signal is low, it is identified as a start bit, the 5-bit counter is initialized and starts counting,
and data sampling is performed. When character data, a parity bit, and one stop bit are detected after
the start bit, reception of one frame of data ends.
When one frame of data has been received, the receive data in the shift register is transferred to the receive
buffer register (RXB), and a reception completion interrupt request (INTSR) is generated.
If an error occurs, the receive data in which the error occurred is still transferred to RXB. If bit 1 (ISRM)
of ASIM is cleared to 0 on occurrence of the error, INTSR is generated.
If the RXE bit is reset to 0 during the receive operation, the receive operation is stopped immediately.
In this case, the contents of RXB and the asynchronous serial interface status register (ASIS) are not
changed, and INTSR and INTSER are not generated.

Figure 19-10. Asynchronous Serial Interface Reception Completion Interrupt Request Generation Timing

STOP
RxD0 (RxD1) (input) D0 D1 D2 D6 D7 Parity

START

INTSR

Caution The receive buffer register (RXB) must be read even if a receive error occurs. If RXB
is not read, an overrun error will occur when the next data is received, and the receive
error state will continue indefinitely.

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(e) Receive errors

Three kinds of errors can occur during a receive operation: a parity error, framing error, or overrun error.
The data reception result error flag is set in the asynchronous serial interface status register (ASIS) and
a receive error interrupt request (INTSER) is generated. The receive error interrupt is generated faster
than receive completion interrupt (INTSR). Receive error causes are shown in Table 19-7.
It is possible to determine what kind of error occurred during reception by reading the contents of ASIS
in the reception error interrupt servicing (see Figures 19-10 and 19-11).
The contents of ASIS are reset to 0 by reading the receive buffer register (RXB) or receiving the next data
(if there is an error in the next data, the corresponding error flag is set).

Table 19-7. Receive Error Causes

Receive Errors Cause

Parity error Transmission-time parity specification and reception data parity do not match
Framing error Stop bit not detected
Overrun error Reception of next data is completed before data is read from receive register buffer

Figure 19-11. Receive Error Timing

RXD (input) D0 D1 D2 D6 D7 Parity STOP

START

INTSRNote

INTSER (when framing/

overrun error occurs)

INTSER (when parity

error occurs)

Note INTSR is not generated if a receive error occurs while bit 1 (ISRM) of the asynchronous serial
interface mode register (ASIM) is set to 1.

Cautions 1. The contents of the asynchronous serial interface status register (ASIS) are reset to
0 by reading the receive buffer register (RXB) or receiving the next data. To ascertain
the error contents, ASIS must be read before reading RXB.
2. The receive buffer register (RXB) must be read even if a receive error occurs. If RXB
is not read, an overrun error will occur when the next data is received, and the receive
error state will continue indefinitely.

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(3) UART mode cautions

(a) When the transmission under execution has been stopped by clearing bit 7 (TXE) of the asynchronous
serial interface mode register (ASIM) to 0, be sure to set the transmit shift register (TXS) to FFH, then
set TXE to 1 before executing the next transmission.

(b) When the reception under execution has been stopped by clearing bit 6 (RXE) of the asynchronous serial
interface mode register (ASIM) to 0, the status of the receive buffer register (RXB) and whether the receive
completion interrupt request (INTSR) is generated differ depending on the timing at which reception is
stopped. Figure 19-12 shows the timing.

Figure 19-12. Status of Receive Buffer Register (RXB) and Generation of

Interrupt Request (INTSR) When Reception Is Stopped

RxD0 (RxD1) pin Parity

RXB

INTSR

<1> <3>

<2>

When RXE is cleared to 0 at the time indicated by <1>, RXB holds the previous data and does not generate
INTSR.
When RXE is cleared to 0 at the time indicated by <2>, RXB renews the data and does not generate INTSR.
When RXE is cleared to 0 at the time indicated by <3>, RXB renews the data and generates INTSR.

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19.4.3 3-wire serial I/O mode

The 3-wire serial I/O mode is useful for connection of peripheral I/Os and display controllers, etc., which incorporate
a conventional clocked serial interface, such as the 75X/XL Series, 78K Series, 17K Series, etc.
Communication is performed using three lines: the serial clock (SCK2), serial output (SO2), and serial input (SI2).
In the 3-wire serial I/O mode, the P23/STB/TxD1, P24/BUSY/RxD1 pins can be used as normal I/O ports.

(1) Register setting

3-wire serial I/O mode is set by serial operating mode register 2 (CSIM2), the asynchronous serial interface
mode register (ASIM), and the baud rate generator control register (BRGC).

(a) Serial operating mode register 2 (CSIM2)

CSIM2 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CSIM2 to 00H.

Symbol <7> 6 5 4 3 2 1 0 Address After reset R/W

CSIM2 CSIE2 0 0 0 0 CSIM

CSCK 0 FF72H 00H R/W
22

CSCK Clock selection in 3-wire serial I/O mode

0 Input clock from off-chip to SCK2 pin
1 Dedicated baud rate generator output

CSIM22 First bit specification

0 MSB
1 LSB

CSIE2 Operation control in 3-wire serial I/O mode

0 Operation stopped
1 Operation enabled

Caution Be sure to clear bits 0 and 3 to 6 to 0.

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(b) Asynchronous serial interface mode register (ASIM)

ASIM is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears ASIM to 00H.
When the 3-wire serial I/O mode is selected, ASIM should be cleared to 00H.

Symbol <7> <6> 5 4 3 2 1 0 Address After reset R/W

ASIM TXE RXE PS1 PS0 CL SL ISRM SCK FF70H 00H R/W

SCK Clock selection in asynchronous serial interface mode

0 Input clock from off-chip to ASCK pin

1 Dedicated baud rate generator output

ISRM Control of reception completion interrupt request

in case of error occurrence
0 Reception completion interrupt request generated
in case of error occurrence
1 Reception completion interrupt request not
generated in case of error occurrence

SL Transmit data stop bit length specification

0 1 bit
1 2 bits

CL Character length specification

0 7 bits
1 8 bits

PS1 PS0 Parity bit specification

0 0 No parity
0 1 0 parity always added in transmission.
No parity test in reception (parity error not
generated).
1 0 Odd parity
1 1 Even parity

RXE Receive operation control

0 Receive operation stopped
1 Receive operation enabled

TXE Transmit operation control

0 Transmit operation stopped
1 Transmit operation enabled

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(c) Baud rate generator control register (BRGC)

BRGC is set with an 8-bit memory manipulation instruction.
RESET input clears BRGC to 00H.

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

BRGC TPS3 TPS2 TPS1 TPS0 MDL3 MDL2 MDL1 MDL0 FF73H 00H R/W

MDL3 MDL2 MDL1 MDL0 Baud rate generator input clock selection k
0 0 0 0 fSCK/16 0

0 0 0 1 fSCK/17 1

0 0 1 0 fSCK/18 2

0 0 1 1 fSCK/19 3

0 1 0 0 fSCK/20 4

0 1 0 1 fSCK/21 5

0 1 1 0 fSCK/22 6

0 1 1 1 fSCK/23 7

1 0 0 0 fSCK/24 8

1 0 0 1 fSCK/25 9

1 0 1 0 fSCK/26 10

1 0 1 1 fSCK/27 11

1 1 0 0 fSCK/28 12

1 1 0 1 fSCK/29 13

1 1 1 0 fSCK/30 14

1 1 1 1 fSCK —

(Cont’d)

Remark fSCK: 5-bit counter source clock

k: Value set in MDL0 to MDL3 (0 ≤ k ≤ 14)

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TPS3 TPS2 TPS1 TPS0 5-bit counter source clock selection n

MCS = 1 MCS = 0

0 0 0 0 fXX/210 fX/210 (4.9 kHz) fX/211 (2.4 kHz) 11

0 1 0 1 fXX fX (5.0 MHz) fX/2 (2.5 MHz) 1
0 1 1 0 fXX/2 fX/2 (2.5 MHz) fX/22 (1.25 MHz) 2

0 1 1 1 fXX/22 fX/22 (1.25 MHz) fX/23 (625 kHz) 3

1 0 0 0 fXX/23 fX/23 (625 kHz) fX/24 (313 kHz) 4
1 0 0 1 fXX/24 fX/24 (313 kHz) fX/25 (156 kHz) 5

1 0 1 0 fXX/25 fX/25 (156 kHz) fX/26 (78.1 kHz) 6

1 0 1 1 fXX/26 fX/26 (78.1 kHz) fX/27 (39.1 kHz) 7
1 1 0 0 fXX/27 fX/27 (39.1 kHz) fX/28 (19.5 kHz) 8

1 1 0 1 fXX/28 fX/28 (19.5 kHz) fX/29 (9.8 kHz) 9

1 1 1 0 fXX/29 fX/29 (9.8 kHz) fX/210 (4.9 kHz) 10
Other than above Setting prohibited

Caution When BRGC is written during a communication operation, baud rate generator output
is disrupted and communication cannot be performed normally. Therefore, BRGC must
not be written during a communication operation.

Remarks 1. fX: Main system clock oscillation frequency

2. fXX: Main system clock frequency (fX or fX/2)
3. MCS: Bit 0 of the oscillation mode select register (OSMS)
4. n: Value set in TPS0 to TPS3 (1 ≤ n ≤ 11)
5. Values in parentheses apply to operation with fX = 5.0 MHz.

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When the internal clock is used as the serial clock in the 3-wire serial I/O mode, set BRGC as described below.
BRGC setting is not required if an external serial clock is used.

(i) When the baud rate generator is not used:

Select the serial clock frequency using TPS0 to TPS3. Be sure then to set MDL0 to MDL3 to 1,1,1,1.
The serial clock frequency becomes the same as the source clock frequency for the 5-bit counter.

(ii) When the baud rate generator is used:

Select the serial clock frequency using TPS0 to TPS3. Be sure then to set MDL0 to MDL3 to 1,1,1,1.

The serial clock frequency is calculated by the following formula:

fXX
Serial clock frequency = n [Hz]
2 × (k + 16)

Remarks 1. fX: Main system clock oscillation frequency

2. fXX: Main system clock frequency (fX or fX/2)
3. n: Value set in TPS0 to TPS3 (1 ≤ n ≤ 11)
4. k: Value set in MDL0 to MDL3 (0 ≤ k ≤ 14)

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(2) Communication operation

In the 3-wire serial I/O mode, data transmission/reception is performed in 8-bit units. Data is transmitted/
received bit-wise synchronization with the serial clock.
Transmit shift register (TXS/SIO2) and receive shift register (RXS) shift operations are performed in
synchronization with the fall of the serial clock SCK2. Then transmit data is held in the SO2 latch and output
from the SO2 pin. Also, receive data input to the SI2 pin is latched in the receive buffer register (RXB/SIO2)
on the rise of SCK2.
At the end of an 8-bit transfer, the operation of TXS/SIO2 or RXS stops automatically, and the interrupt request
flag (SRIF) is set.

Figure 19-13. 3-Wire Serial I/O Mode Timing

SCK2 1 2 3 4 5 6 7 8

SI2 DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0

SO2 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0

SRIF

End of transfer
Transfer start at the falling edge of SCK2

(3) MSB/LSB switching as the start bit

In the 3-wire serial I/O mode, it is possible to select transfer to start from the MSB or LSB.
Figure 19-14 shows the configuration of the transmit shift register (TXS/SIO2) and internal bus. As shown
in the figure, the MSB/LSB can be read or written in reverse form.
MSB/LSB switching as the start bit can be specified by bit 2 (CSIM22) of serial operating mode register 2
(CSIM2).

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Figure 19-14. Circuit for Switching Transfer Bit Order

7
6
Internal bus
1
0
LSB-first
MSB-first Read/write gate Read/write gate

SO2 latch
SI2 Transmit shift register (TXS/SIO2) D Q

SO2

SCK2

Start bit switching is realized by switching the bit order for data write to SIO2. The SIO2 shift order remains
unchanged.
Thus, switching between MSB-first and LSB-first must be performed before writing data to the shift register.

(4) Transfer start

Serial transfer is started by setting transfer data to the transmission shift register (TXS/SIO2) when the
following two conditions are satisfied.

• Serial interface channel 2 operation control bit (CSIE2) = 1

• Internal serial clock is stopped or SCK2 is a high level after 8-bit serial transfer.

Caution If CSIE2 is set to 1 after data write to TXS/SIO2, transfer does not start.

Remark CSIE2: Bit 7 of serial operating mode register 2 (CSIM2)

Upon termination of 8-bit transfer, serial transfer automatically stops and the interrupt request flag (SRIF) is
set.

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19.4.4 Restrictions in UART mode 1

In the UART mode, the reception completion interrupt request (INTSR) is generated a certain time after the
reception error interrupt (INTSER) is generated and then cleared. Consequently, the following phenomenon may
occur.

• Description
If bit 1 (ISRM) of the asynchronous serial interface mode register (ASIM) is set to 1, the reception completion
interrupt request (INTSR) is not generated on occurrence of a reception error. If the receive buffer register (RXB)
is read at certain timing (“a” in Figure 19-15) during the reception error interrupt (INTSER) servicing, the internal
error flag is cleared to 0. As a result, it is judged that no reception error has occurred, and INTSR, which should
not be generated, is generated. Figure 19-15 illustrates this operation.

Figure 19-15. Reception Completion Interrupt Request Generation Timing (When ISRM = 1)

fSCK

INTSER (when framing/

overrun error occurs)
a
Error Flag
(internal flag)

Cleared on
INTSR reading RXB

Interrupt processing
routine of CPU

Reading RXB It is judged that reception error has not

occurred, and INTSR is generated

Remark ISRM: Bit 1 of the asynchronous serial interface mode register (ASIM)
fSCK: Source clock of 5-bit counter of baud rate generator
RXB: Receive buffer register

To avoid this phenomenon, take the following measures.

• Preventive measures

• In case of framing error or overrun error

Disable the receive buffer register (RXB) from being read for a certain period (T2 in Figure 19-16) after the
reception error interrupt request (INTSER) has been generated.

• In case of parity error

Disable the receive buffer register (RXB) from being read for a certain period (T1 + T2 in Figure 19-16) after
the reception error interrupt request (INTSER) has been generated.

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Figure 19-16. Receive Buffer Register Read Disable Period

RXD (input) D0 D1 D2 D6 D7 Parity STOP

START

INTSR

INTSER (when framing/

overrun error occurs)

INTSER (when parity

error occurs)

T1 T2

T1: Time of one data of baud rate selected by baud rate generator control register (BRGC) (1/baud rate)
T2: Time of 2 clocks of source clock (fSCK) of 5-bit counter selected by BRGC

• Example of preventive measures

Here is an example of the above preventive measures.

[Conditions]
fX = 5.0 MHz
Processor clock control register (PCC) = 00H
Oscillation mode select register (OSMS) = 01H
Baud rate generator control register (BRGC) = B0H (2,400 bps selected as baud rate)
TCY = 0.4 µs (tCY = 0.2 µs)
1
T1 = = 416.7 µs
2,400
T2 = 12.8 × 2 = 25.6 µs
T1 + T2
= 2,212 (clocks)
tCY

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[Example]

UART receive error interrupt

(INTSER) servicing
Main processing

EI

INTSER generated

Seven CPU clocks (MIN.) Instructions of

(time from generation of 2,205 CPU
interrupt request to processing) clocks (MIN.)
are necessary.

MOV A, RXB

RETI

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19.4.5 Restrictions in UART mode 2

To use the TxD1/STB/P23 pin to output UART data by using the time-division transfer function, perform the
following processing when the transmit operation is enabled and when the transmit/receive operation is stopped.
The output circuit of the alternate function of this TxD1/STB/P23 pin differs between the actual device and the in-
circuit emulator (see Figure 19-17). Therefore, delete the underlined part in the examples below when executing
emulation with the in-circuit emulator (IE).

Condition: Serial interface pin select register (SIPS) = 20H or 30H

(when using TxD1 pin as output pin for UART transmission)

(1) When transmit operation is enabled

CLR1 PM2.3 ; Sets P23 (TXD1) pin to output mode.

SET1 P2.3 ; Sets output latch of P23 to “1”.
SET1 ASIM.7 ; Enables transmission (TXE = 1).
CLR1 P2.3 ; This line is necessary only for the actual device. Delete it when the IE is used.
MOV TXS, #BYTE ; Transfers transmit data (#BYTE) to transmit shift register.

Cautions 1. Perform this processing each time a transmit operation is enabled by using the TxD1 pin as
an output pin.
2. Perform this processing each time the output pin is switched from the TxD0 pin to the TxD1
pin because the transmit operation must be stopped once and then enabled again.

(2) When transmit operation is stopped

SET1 P2.3 ; This line is necessary only for the actual device. Delete it when the IE is used.
CLR1 ASIM.7 ; Stops transmission (TXE = 0).

Cautions 1. Perform this processing each time a transmit operation is enabled by using the TxD1 pin as
an output pin.
2. Perform this processing each time the output pin is switched from the TxD0 pin to the TxD1
pin because the transmit operation must be stopped once and then enabled again.

Figure 19-17. P23 Output Selector

Alternate output signal (TxD1)

(Actual device) P23/STB/TxD1
Output latch of P23

PM23

Alternate output signal (TxD1)

(In-circuit emulator) P23/STB/TxD1
Output latch of P23

PM23

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20.1 Real-Time Output Port Functions

Data set previously in the real-time output buffer register can be transferred to the output latch by hardware
concurrently with the generation of a timer interrupt request or external interrupt request, then output externally. This
is called the real-time output function. The pins that output data externally are called real-time output ports.
By using a real-time output, a signal which has no jitter can be output. This port is therefore suitable for control
of stepper motors, etc.
Port mode/real-time output port mode can be specified in 1-bit units.

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20.2 Real-Time Output Port Configuration

The real-time output port consists of the following hardware.

Table 20-1. Real-Time Output Port Configuration

Item Configuration
Register Real-time output buffer register (RTBL, RTBH)
Control registers Port mode register 12 (PM12)
Real-time output port mode register (RTPM)
Real-time output port control register (RTPC)

Figure 20-1. Real-Time Output Port Block Diagram

Internal bus

Real-time output port

control register
Port mode
BYTE EXTR register 12
(PM12)

INTP2 Real-time output Real-time output

Output trigger buffer register buffer register
INTTM1
controller higher 4 bits lower 4 bits
INTTM2 (RTBH) (RTBL)

Real-time output port

mode register (RTPM)

Output latch

P127 P120

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(1) Real-time output buffer registers (RTBL, RTBH)

The addresses of RTBL and RTBH are mapped individually in the special function register (SFR) area as shown
in Figure 20-2.
When specifying 4 bits × 2 channels as the operating mode, data is set individually to RTBL and RTBH.
When specifying 8 bits × 1 channel as the operating mode, data is set to both RTBL and RTBH by writing 8-
bit data to either RTBL or RTBH.
Table 20-2 shows the operations during manipulation of RTBL and RTBH.

Figure 20-2. Real-Time Output Buffer Register Configuration

Higher Lower
4 bits 4 bits
FF30H RTBL

FF31H RTBH

Table 20-2. Operation in Real-Time Output Buffer Register Manipulation

Operating Mode Register to Be ReadingNote 1 WritingNote 2

Manipulated Higher 4 Bits Lower 4 Bits Higher 4 Bits Lower 4 Bits
4 bits × 2 channels RTBL RTBH RTBL Invalid RTBL
RTBH RTBH RTBL RTBH Invalid
8 bits × 1 channel RTBL RTBH RTBL RTBH RTBL
RTBH RTBH RTBL RTBH RTBL

Notes 1. Only the bits set in the real-time output port mode can be read. When a bit set in the port mode
is read, 0 is read.
2. After setting data in the real-time output port, output data should be set to RTBL and RTBH by the
time a real-time output trigger is generated.

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20.3 Real-Time Output Port Control Registers

The following three registers control the real-time output port.

• Port mode register 12 (PM12)

• Real-time output port mode register (RTPM)
• Real-time output port control register (RTPC)

(1) Port mode register 12 (PM12)

This register sets the input or output mode of the port 12 pins (P120 to P127) which function alternately as
real-time output pins (RTP0 to RTP7). To use port 12 as a real-time output port, the port pin that performs
real-time output must be set in the output mode (PM12n = 0: n = 0 to 7).
PM12 is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input sets PM12 to FFH.

Figure 20-3. Format of Port Mode Register 12

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

PM12 PM127 PM126 PM125 PM124 PM123 PM122 PM121 PM120 FF2CH FFH R/W

PM12n Selection of I/O mode of P12n pin (n = 0 to 7)

0 Output mode (output buffer on)

1 Input mode (output buffer off)

(2) Real-time output port mode register (RTPM)

This register selects the real-time output port mode/port mode in 1-bit units.
RTPM is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears RTPM to 00H.

Figure 20-4. Format of Real-Time Output Port Mode Register

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

RTPM RTPM7 RTPM6 RTPM5 RTPM4 RTPM3 RTPM2 RTPM1 RTPM0 FF34H 00H R/W

RTPMn Real-time output port selection (n = 0 to 7)

0 Port mode

1 Real-time output port mode

Cautions 1. When using these bits as a real-time output port, set the ports at which real-time output
is performed to the output mode (clear the corresponding bit of port mode register 12
(PM12) to 0).
2. In ports specified as real-time output ports, data cannot be set to the output latch.
Therefore, when setting an initial value, data should be set to the output latch before
setting the real-time output mode.

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(3) Real-time output port control register (RTPC)

This register sets the real-time output port operating mode and output trigger.
Table 20-3 shows the relationship between the operating mode of the real-time output port and output trigger.
RTPC is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears RTPC to 00H.

Figure 20-5. Format of Real-Time Output Port Control Register

Symbol 7 6 5 4 3 2 <1> <0> Address After reset R/W

RTPC 0 0 0 0 0 0 BYTE EXTR FF36H 00H R/W

EXTR Real-time output control by INTP2

0 INTP2 not specified as real-time output trigger

1 INTP2 specified as real-time output trigger

BYTE Real-time output port operating mode

0 4 bits × 2 channels

1 8 bits × 1 channel

Table 20-3. Real-Time Output Port Operating Mode and Output Trigger

BYTE EXTR Operating Mode RTBH → Port Output RTBL → Port Output
0 0 4 bits × 2 channels INTTM2 INTTM1
1 INTTM1 INTP2
1 0 8 bits × 1 channel INTTM1
1 INTP2

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21.1 Interrupt Function Types

The following three types of interrupt functions are used.

(1) Non-maskable interrupt

This interrupt is acknowledged unconditionally even in the interrupt disabled status. It does not undergo
interrupt priority control and is given top priority over all other interrupt requests.
It generates a standby release signal.
One interrupt source from the watchdog timer is provided as a non-maskable interrupt source.

(2) Maskable interrupts

These interrupts undergo mask control. Maskable interrupts can be divided into a high interrupt priority group
and a low interrupt priority group by setting the priority specification flag registers (PR0L, PR0H, PR1L).
High-priority interrupts can be given priority over to low priority interrupts by using multiple interrupt servicing.
If two or more interrupts with the same priority are generated simultaneously, each interrupt has a predeter-
mined priority (see Table 21-1).
A standby release signal is generated.
Six external interrupt sources and thirteen internal interrupt sources are provided as maskable interrupt
sources.

(3) Software interrupt

This is a vectored interrupt that occurs when the BRK instruction is executed. It is acknowledged even in a
disabled state. The software interrupt does not undergo interrupt priority control.

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21.2 Interrupt Sources and Configuration

A total of 21 non-maskable, maskable, and software interrupts are provided as interrupt sources (see Table
21-1).

Table 21-1. Interrupt Source List (1/2)

Interrupt Default Interrupt Source Internal/ Vector Basic

Table Configuration
Type PriorityNote 1 External
Name Trigger Address TypeNote 2
Non- — INTWDT Watchdog timer overflow (with Internal 0004H (A)
maskable watchdog timer mode 1 selected)
Maskable 0 INTWDT Watchdog timer overflow (with (B)
interval timer mode selected)
1 INTP0 Pin input edge detection External 0006H (C)
2 INTP1 0008H (D)
3 INTP2 000AH
4 INTP3 000CH
5 INTP4 000EH
6 INTP5 0010H
7 INTCSI0 End of serial interface channel 0 Internal 0014H (B)
transfer
8 INTCSI1 End of serial interface channel 1 0016H
transfer
9 INTSER Occurrence of serial interface channel 2 0018H
UART reception error
10 INTSR End of serial interface channel 2 001AH
UART reception
INTCSI2 End of serial interface channel 2
3-wire transfer
11 INTST End of serial interface channel 2 001CH
UART transfer

Notes 1. The default priority is the priority used when two or more maskable interrupt requests are generated
simultaneously. 0 is the highest priority and 17 is the lowest.
2. Basic configuration types (A) to (E) correspond to (A) to (E) of Figure 21-1.

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Table 21-1. Interrupt Source List (2/2)

Interrupt Default Interrupt Source Internal/ Vector Basic

Table Configuration
Type PriorityNote 1 External
Name Trigger Address TypeNote 2
Maskable 12 INTTM3 Reference time interval signal from Internal 001EH (B)
watch timer
13 INTTM00 Generation of 16-bit timer register, 0020H
capture/compare register 00 (CR00)
match signal
14 INTTM01 Generation of 16-bit timer register, 0022H
capture/compare register 01 (CR01)
match signal
15 INTTM1 Generation of 8-bit timer/event 0024H
counter 1 match signal
16 INTTM2 Generation of 8 bit timer/event 0026H
counter 2 match signal
17 INTAD End of A/D converter conversion 0028H
Software — BRK BRK instruction execution — 003EH (E)

Notes 1. The default priority is the priority used when two or more maskable interrupt requests are generated
simultaneously. 0 is the highest priority and 17 is the lowest.
2. Basic configuration types (A) to (E) correspond to (A) to (E) of Figure 21-1.

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Figure 21-1. Basic Configuration of Interrupt Function (1/2)

(A) Internal non-maskable interrupt

Internal bus

Interrupt Vector table

Priority controller address
request generator

Standby
release signal

(B) Internal maskable interrupt

Internal bus

MK IE PR ISP

Vector table
Interrupt Priority controller address
IF generator
request

Standby
release signal

(C) External maskable interrupt (INTP0)

Internal bus

Sampling clock External interrupt mode

select register MK IE PR ISP
(SCS) register (INTM0)

Vector table
Interrupt Sampling Edge Priority controller address
IF generator
request clock detector

Standby
release signal

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Figure 21-1. Basic Configuration of Interrupt Function (2/2)

(D) External maskable interrupt (except INTP0)

Internal bus

External interrupt
mode register MK IE PR ISP
(INTM0, INTM1)

Vector table
Interrupt Edge Priority controller address
IF generator
request detector

Standby
release signal

(E) Software interrupt

Internal bus

Interrupt Vector table

Priority controller address
request generator

Remark IF: Interrupt request flag

IE: Interrupt enable flag
ISP: Inservice priority flag
MK: Interrupt mask flag
PR: Priority specification flag

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21.3 Interrupt Function Control Registers

The following six types of registers are used to control the interrupt functions.

• Interrupt request flag register (IF0L, IF0H, IF1L)

• Interrupt mask flag register (MK0L, MK0H, MK1L)
• Priority specification flag register (PR0L, PR0H, PR1L)
• External interrupt mode register (INTM0, INTM1)
• Sampling clock select register (SCS)
• Program status word (PSW)

Table 21-2 gives a listing of interrupt request flags, interrupt mask flags, and priority specification flags
corresponding to interrupt request sources.

Table 21-2. Various Flags Corresponding to Interrupt Request Sources

Interrupt Source Interrupt Request Flag Interrupt Mask Flag Priority Specification Flag
Register Register Register
INTWDT TMIF4 IF0L TMMK4 MK0L TMPR4 PR0L
INTP0 PIF0 PMK0 PPR0
INTP1 PIF1 PMK1 PPR1
INTP2 PIF2 PMK2 PPR2
INTP3 PIF3 PMK3 PPR3
INTP4 PIF4 PMK4 PPR4
INTP5 PIF5 PMK5 PPR5
INTCSI0 CSIIF0 IF0H CSIMK0 MK0H CSIPR0 PR0H
INTCSI1 CSIIF1 CSIMK1 CSIPR1
INTSER SERIF SERMK SERPR
INTSR/INTCSI2 SRIF SRMK SRPR
INTST STIF STMK STPR
INTTM3 TMIF3 TMMK3 TMPR3
INTTM00 TMIF00 TMMK00 TMPR00
INTTM01 TMIF01 TMMK01 TMPR01
INTTM1 TMIF1 IF1L TMMK1 MK1L TMPR1 PR1L
INTTM2 TMIF2 TMMK2 TMPR2
INTAD ADIF ADMK ADPR

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(1) Interrupt request flag registers (IF0L, IF0H, IF1L)

The interrupt request flag is set to 1 when the corresponding interrupt request is generated or an instruction
is executed. It is cleared to 0 when an instruction is executed upon acknowledgment of an interrupt request
or upon application of RESET input.
IF0L, IF0H, and IF1L are set with a 1-bit or an 8-bit memory manipulation instruction. If IF0L and IF0H are
used as the 16-bit register IF0, use a 16-bit memory manipulation instruction for setting.
RESET input clears these registers to 00H.

Figure 21-2. Format of Interrupt Request Flag Register

Symbol 7 <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

IF0L 0 PIF5 PIF4 PIF3 PIF2 PIF1 PIF0 TMIF4 FFE0H 00H R/W

<7> <6> <5> <4> <3> <2> <1> <0>

IF0H TMIF01 TMIF00 TMIF3 STIF SRIF SERIF CSIIF1 CSIIF0 FFE1H 00H R/W

<7> 6 5 4 3 <2> <1> <0>

Note
IF1L WTIF 0 0 0 0 ADIF TMIF2 TMIF1 FFE2H 00H R/W

× × IF× Interrupt request flag

0 No interrupt request signal

1 Interrupt request signal is generated;

interrupt request state

Note WTIF is the test input flag. A vectored interrupt request is not generated.

Cautions 1. The TMIF4 flag is R/W enabled only when the watchdog timer is used as an interval timer.
If the watchdog timer is used in watchdog timer mode 1, clear the TMIF4 flag to 0.
2. Be sure to clear IF0L bit 7 and IF1L bits 3 to 6 to 0.
3. When an interrupt is acknowledged, the interrupt request flag is automatically cleared,
and then servicing of the interrupt routine is started.

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(2) Interrupt mask flag registers (MK0L, MK0H, MK1L)

The interrupt mask flag is used to enable/disable the corresponding maskable interrupt service and to set
standby clear enable/disable.
MK0L, MK0H, and MK1L are set with a 1-bit or an 8-bit memory manipulation instruction. If MK0L and MK0H
are used as the 16-bit register MK0, use a 16-bit memory manipulation instruction for setting.
RESET input sets these registers to FFH.

Figure 21-3. Format of Interrupt Mask Flag Register

Symbol 7 <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

MK0L 1 PMK5 PMK4 PMK3 PMK2 PMK PMK TMMK4 FFE4H FFH R/W

<7> <6> <5> <4> <3> <2> <1> <0>

MK0H TMMK01 TMMK00 TMMK3 STMK SRMK SERMK CSIMK1 CSIMK0 FFE5H FFH R/W

<7> 6 5 4 3 <2> <1> <0>

Note
MK1L WTMK 1 1 1 1 ADMK TMMK2 TMMK1 FFE6H FFH R/W

× × MK × Interrupt servicing control

0 Interrupt servicing enabled

1 Interrupt servicing disabled

Note WTMK controls standby mode release enable/disable; it does not control the interrupt function.

Cautions 1. If the TMMK4 flag is read when the watchdog timer is used in watchdog timer mode 1,
the MK0 value becomes undefined.
2. Because port 0 also functions as an external interrupt request input, when the output
level is changed by specifying the output mode of the port function, an interrupt request
flag is set. Therefore, the interrupt mask flag should be set to 1 before using the output
mode.
3. Be sure to set MK0L bit 7 and MK1L bits 3 to 6 to 1.

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(3) Priority specification flag registers (PR0L, PR0H, and PR1L)

The priority specification flags are used to set the corresponding maskable interrupt priorities.
PR0L, PR0H, and PR1L are set with a 1-bit or an 8-bit memory manipulation instruction. If PR0L and PR0H
are used as the 16-bit register PR0, use a 16-bit memory manipulation instruction for setting.
RESET input sets these registers to FFH.

Figure 21-4. Format of Priority Specification Flag Register

Symbol 7 <6> <5> <4> <3> <2> <1> <0> Address After reset R/W

PR0L 1 PPR5 PPR4 PPR3 PPR2 PPR1 PPR0 TMPR4 FFE8H FFH R/W

<7> <6> <5> <4> <3> <2> <1> <0>

PR0H TMPR01 TMPR00 TMPR3 STPR SRPR SERPR CSIPR1 CSIPR0 FFE9H FFH R/W

7 6 5 4 3 <2> <1> <0>

PR1L 1 1 1 1 1 ADPR TMPR2 TMPR1 FFEAH FFH R/W

× × PR × Priority level selection

0 High priority level

1 Low priority level

Cautions 1. If the watchdog timer is used in watchdog timer mode 1, set the TMPR4 flag to 1.
2. Be sure to set PR0L bit 7 and PR1L bits 3 to 7 to 1.

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(4) External interrupt mode registers (INTM0, INTM1)

These registers set the valid edge for INTP0 to INTP5, TI00, and TI01.
INTM0 specifies the valid edges of interrupt pins INTP0 to INTP2, TI00, and TI01, and INTM1 specifies the
valid edges of INTP3 to INTP5.
INTM0 and INTM1 are set with an 8-bit memory manipulation instruction.
RESET input clears these registers to 00H.

Figure 21-5. Format of External Interrupt Mode Register 0

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

INTM0 ES31 ES30 ES21 ES20 ES11 ES10 0 0 FFECH 00H R/W

ES11 ES10 INTP0/TI00 valid edge selection

0 0 Falling edge

0 1 Rising edge

1 0 Setting prohibited

1 1 Both rising and falling edges

ES21 ES20 INTP1/TI01 valid edge selection

0 0 Falling edge

0 1 Rising edge

1 0 Setting prohibited

1 1 Both rising and falling edges

ES31 ES30 INTP2 valid edge selection

0 0 Falling edge

0 1 Rising edge

1 0 Setting prohibited

1 1 Both rising and falling edges

Caution When using the TI00/P00/INTP0 and TI01/P01/INTP1 pins as timer input pins (TI00 and
TI01), stop the operation of 16-bit timer 0 by clearing bits 1 to 3 (TMC01 to TMC03) of
the 16-bit timer mode control register (TMC0) to 0, 0, 0, before setting the valid edge of
TI00 and TI01. The valid edge is set by bits 2 and 3 (ES10 and ES11) of external interrupt
mode register 0 (INTM0). When using the TI00/P00/INTP0 and TI01/P01/INTP1 pins as
external interrupt input pins (INTP0 and INTP1), the valid edge of INTP0 and INTP1 may
be set while 16-bit timer 0 is operating.

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Figure 21-6. Format of External Interrupt Mode Register 1

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

INTM1 0 0 ES61 ES60 ES51 ES50 ES41 ES40 FFEDH 00H R/W

ES41 ES40 INTP3 valid edge selection

0 0 Falling edge

0 1 Rising edge

1 0 Setting prohibited

1 1 Both rising and falling edges

ES51 ES50 INTP4 valid edge selection

0 0 Falling edge

0 1 Rising edge

1 0 Setting prohibited

1 1 Both rising and falling edges

ES61 ES60 INTP5 valid edge selection

0 0 Falling edge

0 1 Rising edge

1 0 Setting prohibited

1 1 Both rising and falling edges

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(5) Sampling clock select register (SCS)

This register is used to set the clock for sampling the valid edge input to INTP0. When remote controlled data
reception is carried out using INTP0, digital noise is eliminated using the sampling clock.
SCS is set with an 8-bit memory manipulation instruction.
RESET input clears SCS to 00H.

Figure 21-7. Format of Sampling Clock Select Register

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

SCS 0 0 0 0 0 0 SCS1 SCS0 FF47H 00H R/W

SCS1 SCS0 INTP0 sampling clock selection

MCS = 1 MCS = 0
N
0 0 fXX/2
7
0 1 fXX/2 fX/27 (39.1 kHz) 8
fX/2 (19.5 kHz)
5
1 0 fXX/2 fX/25 (156.3 kHz) fX/26 (78.1 kHz)

1 1 fXX/26 fX/26 (78.1 kHz) fX/27 (39.1 kHz)

Caution fXX/2N is the clock supplied to the CPU and fXX/25, fXX/26, and fXX/27 are clocks supplied to the
peripheral hardware. fXX/2N stops in the HALT mode.

Remarks 1. N: Value (N = 0 to 4) of bits 0 to 2 (PCC0 to PCC2) of processor clock control register (PCC)
2. fXX: Main system clock frequency (fX or fX/2)
3. fX: Main system clock oscillation frequency
4. MCS: Bit 0 of the oscillation mode select register (OSMS)
5. Values in parentheses apply to operation with fX = 5.0 MHz.

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When the sampled INTP0 input level is the active level twice in succession, the noise eliminator sets the
interrupt request flag (PIF0) to 1.
Figure 21-8 shows the I/O timing of the noise eliminator.

Figure 21-8. Noise Eliminator I/O Timing (During Rising Edge Detection)

(a) When input is less than the sampling cycle (tSMP)

tSMP

Sampling clock

INTP0

PIF0 “L”

Because the INTP0 level is not high when it is sampled,

PIF0 output remains at low level.

(b) When input is equal to or twice the sampling cycle (tSMP)

tSMP

Sampling clock

<1> <2>
INTP0

PIF0
Because the sampled INTP0 level is high twice in succession in <2>,
the PIF0 flag is set to 1.

(c) When input is more than twice the cycle frequency (tSMP)

tSMP

Sampling clock

INTP0

PIF0
Because the INTP0 level is high twice in succession,
the PIF0 flag is set to 1.

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(6) Program status word (PSW)

The program status word is a register used to hold the instruction execution result and the current status of
an interrupt request. The IE flag, which sets maskable interrupt enable/disable, and the ISP flag, which controls
multiple interrupt servicing, are mapped to the PSW.
Besides 8-bit unit read/write, this register can also be manipulated by a bit manipulation instructions and
dedicated instructions (EI and DI). When a vectored interrupt request is acknowledged or when the BRK
instruction is executed, the contents of the PSW are automatically saved to the stack and the IE flag is reset
to 0. If a maskable interrupt request is acknowledged, the contents of the priority specification flag of the
acknowledged interrupt are transferred to the ISP flag. The contents of the PSW can also be saved into the
stack with the PUSH PSW instruction. The contents are reset from the stack with the RETI, RETB, and POP
PSW instructions.
RESET input sets the PSW to 02H.

Figure 21-9. Format of Program Status Word

7 6 5 4 3 2 1 0 After reset

PSW IE Z RBS1 AC RBS0 0 ISP CY 02H

Used when normal instruction is executed

ISP Priority of interrupt currently being received

0 High-priority interrupt servicing
(low-priority interrupts disabled)

1 Interrupt request not acknowledged or low-priority

interrupt servicing
(all maskable interrupts enabled)

IE Interrupt request acknowledge enable/disable

0 Disabled

1 Enabled

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21.4 Interrupt Servicing Operations

21.4.1 Non-maskable interrupt request acknowledgment operation

A non-maskable interrupt request is unconditionally acknowledged even if interrupt requests are in an acknowl-
edgment disabled state. It does not undergo interrupt priority control and has the highest priority of all interrupts.
If a non-maskable interrupt request is acknowledged, the contents of the acknowledged interrupt are saved in the
stack, PSW and PC, in that order, the IE and ISP flags are reset to 0, and the vector table contents are loaded into
the PC and branched.
A new non-maskable interrupt request generated during execution of a non-maskable interrupt servicing program
is acknowledged after the current execution of the non-maskable interrupt servicing program is terminated (following
RETI instruction execution) and one main routine instruction is executed. If a new non-maskable interrupt request
is generated twice or more during non-maskable interrupt service program execution, only one non-maskable interrupt
request is acknowledged after termination of the non-maskable interrupt service program execution.
Figure 21-10 shows the flowchart illustrating how a non-maskable interrupt request occurs and is acknowledged.
Figure 21-11 shows the acknowledgment timing of a non-maskable interrupt request. Figure 21-12 shows the
acknowledgment operation of multiple non-maskable interrupt requests.

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Figure 21-10. Non-Maskable Interrupt Request Occurrence and Acknowledgment Flowchart

Start

WDTM4 = 1
(with watchdog timer No
mode selected)?
Interval timer
Yes

No
Overflow in WDT?

Yes

WDTM3 = 0
(with non-maskable No
interrupt selected)?
Reset processing
Yes
Interrupt request generation

No
WDT interrupt servicing?
Interrupt request
held pending
Yes

Interrupt control No
register unaccessed?

Yes
Interrupt
servicing start

WDTM: Watchdog timer mode register

WDT: Watchdog timer

Figure 21-11. Non-Maskable Interrupt Request Acknowledgment Timing

PSW and PC save, jump Interrupt servicing

CPU instruction Instruction Instruction to interrupt servicing program

TMIF4

An interrupt request generated during this period is acknowledged

at the timing marked .

TMIF4 : Watchdog timer interrupt request flag

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Figure 21-12. Non-Maskable Interrupt Request Acknowledgment Operation

(a) If a new non-maskable interrupt request is generated during

non-maskable interrupt servicing program execution

Main routine

NMI request <1> execution

NMI request <1>
NMI request <2> NMI request <2> held pending
1 instruction
execution

Pending NMI request <2> serviced

(b) If two non-maskable interrupt requests are generated during

non-maskable interrupt servicing program execution

Main routine

NMI request <1> execution

NMI request <2> held pending
NMI request <1> NMI request <2> NMI request <3> held pending
NMI request <3>
1 instruction
execution

Pending NMI request <2> serviced

NMI request <3> is not acknowledged

(NMI request is acknowledged only once
even if it occurs twice or more).

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21.4.2 Maskable interrupt request acknowledgment operation

A maskable interrupt request becomes acknowledgeable when the corresponding interrupt request flag is set to
1 and the corresponding interrupt mask (MK) flag is cleared to 0. A vectored interrupt request is acknowledged in
an interrupt enabled state (with the IE flag set to 1). However, a low-priority interrupt is not acknowledged during
high-priority interrupt servicing (with the ISP flag reset to 0).
Wait times from maskable interrupt request generation to interrupt servicing are shown in Table 21-3.
For the timing to acknowledge an interrupt request, see Figures 21-14 and 21-15.

Table 21-3. Times from Maskable Interrupt Request Generation to Interrupt Servicing

Minimum Time Maximum TimeNote

When ××PR = 0 7 clocks 32 clocks
When ××PR = 1 8 clocks 33 clocks

Note If an interrupt request is generated just before a divide instruction, the wait time becomes the
maximum.

1
Remark 1 clock: (fCPU: CPU clock)
fCPU

If two or more maskable interrupt requests are generated simultaneously, the request specified as higher priority
with the priority specification flag is acknowledged first. If two or more requests specified as the same priority by the
interrupt priority specification flag are generated simultaneously, the one with the higher default priority is acknowl-
edged first.
Any pending interrupt requests are acknowledged when they become acknowledgeable.
Figure 21-13 shows an interrupt request acknowledgment algorithm.
If a maskable interrupt request is acknowledged, the contents of acknowledged interrupt are saved in the stack,
program status word (PSW) and program counter (PC), in that order, the IE flag is reset to 0, and the acknowledged
interrupt priority specification flag contents are transferred to the ISP flag. Further, the vector table data determined
for each interrupt request is loaded into the PC and branched.
Restoration from the interrupt is possible with the RETI instruction.

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Figure 21-13. Interrupt Request Acknowledgment Processing Algorithm

Start

No
× × IF = 1?

Yes (Interrupt request

generation)
No
× × MK = 0?

Yes
Interrupt request
held pending
Yes (high priority)
× × PR = 0?

No (low priority)
Any high-
priority interrupt among Any
Yes
simultaneously generated simultaneously Yes
××PR = 0 interrupt generated ××PR = 0
interrupt
requests? requests?
Interrupt request
held pending Interrupt request
No No held pending

No Any
IE = 1? simultaneously
generated high-priority Yes
interrupt
Interrupt request Yes requests?
held pending Interrupt request
Vectored interrupt No held pending
servicing
No
IE = 1?

Yes Interrupt request

held pending
No
ISP = 1?

Yes Interrupt request

held pending
Vectored interrupt
servicing

××IF: Interrupt request flag

××MK: Interrupt mask flag
××PR: Priority specification flag
IE: Flag that controls maskable interrupt request acknowledge (1 = enable, 0 = disable)
ISP: Flag indicating priority of interrupt currently being serviced (0 = interrupt with high priority is being
serviced.
1 = interrupt request is not acknowledged or interrupt with low priority being serviced).

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Figure 21-14. Interrupt Request Acknowledgment Timing (Minimum Time)

6 clocks

PSW and PC save, Interrupt

CPU processing Instruction Instruction jump to interrupt servicing
servicing program

× × IF
(× × PR = 1)
8 clocks

× × IF
(× × PR = 0)
7 clocks
1
Remark 1 clock: (fCPU: CPU clock)
fCPU

Figure 21-15. Interrupt Request Acknowledgment Timing (Maximum Time)

25 clocks 6 clocks

PSW and PC save, Interrupt

CPU processing Instruction Divide instruction jump to interrupt servicing
servicing program

× × IF
(× × PR = 1)
33 clocks

× × IF
(× × PR = 0)
32 clocks

1
Remark 1 clock: (fCPU: CPU clock)
fCPU

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21.4.3 Software interrupt request acknowledgment operation

A software interrupt request is acknowledged by BRK instruction execution. Software interrupts cannot be
disabled.
If a software interrupt request is acknowledged, the contents of the acknowledged interrupt are saved in the stack,
program status word (PSW) and program counter (PC), in that order, the IE flag is reset to 0 and the contents of the
vector tables (003EH and 003FH) are loaded into the PC and branched.
Restoration from the software interrupt is possible with the RETB instruction.

Caution Do not use the RETI instruction for restoring from the software interrupt.

21.4.4 Multiple interrupt servicing

Acknowledging another interrupt request while one interrupt is being serviced is called multiple interrupt servicing.
Multiple interrupt servicing does not occur unless interrupt requests are enabled (IE = 1) (except the non-maskable
interrupt). When an interrupt request is acknowledged, the other interrupts are disabled (IE = 0). To enable multiple
interrupt servicing, therefore, the IE flag must be set to 1 by executing the EI instruction during interrupt servicing
and interrupts must be enabled. Even if interrupt requests are enabled, multiple interrupt servicing may not be
possible. However, this is controlled by the programmable priority.
An interrupt has two types of priorities: the default priority and the programmable priority. Multiple interrupt servicing
is controlled by the programmable priority.
In the EI status, if an interrupt request with a priority that is the same or higher than that of the interrupt currently
being serviced is generated, the interrupt is acknowledged for multiple interrupt servicing. If an interrupt request with
a priority lower than that of the interrupt currently being serviced is generated, the interrupt is not acknowledged for
multiple interrupt servicing.
If interrupts are disabled, or if multiple interrupt servicing is not enabled because the interrupt has a low priority,
the interrupt is held pending. After the servicing of the current interrupt has been completed, and after one instruction
of the main processing has been executed, the pending interrupt is acknowledged.
Multiple interrupt servicing is not enabled while a non-maskable interrupt is being serviced.
Table 21-4 shows the interrupt requests enabled for multiple interrupt servicing. Figure 21-16 shows multiple
interrupt servicing examples.

Table 21-4. Interrupt Request Enabled for Multiple Interrupt Servicing During Interrupt Servicing

Multiple Interrupt Non-maskable Maskable Interrupt Request

Request Interrupt PR = 0 PR = 1
Request
Interrupt Being Serviced IE = 1 IE = 0 IE = 1 IE = 0
Non-maskable interrupt D D D D D
Maskable interrupt ISP = 0 E E D D D
ISP = 1 E E D E D
Software interrupt E E D E D

Remarks 1. E: Multiple interrupt servicing enabled

2. D: Multiple interrupt servicing disabled
3. ISP and IE are flags contained in the PSW
ISP = 0: An interrupt with a higher priority is being serviced
ISP = 1: An interrupt request is not acknowledged or an interrupt with a lower
priority is being serviced
IE = 0: Interrupt request acknowledgment is disabled
IE = 1: Interrupt request acknowledgment is enabled
4. PR is a flag contained in PR0L, PR0H, and PR1L
PR = 0: Higher priority level
PR = 1: Lower priority level
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Figure 21-16. Multiple Interrupt Servicing Example (1/2)

Example 1. Multiple interrupt servicing occurs twice

Main processing INTxx INTyy INTzz

servicing servicing servicing

IE = 0 IE = 0 IE = 0
EI
EI EI

INTxx INTyy INTzz

(PR = 1) (PR = 0) (PR = 0)
RETI

RETI RETI

Two interrupt requests, INTyy and INTzz, are acknowledged while the INTxx interrupt is being serviced. Before
each interrupt request is acknowledged, the EI instruction is always issued and interrupt requests are enabled.

Example 2. Multiple interrupt servicing does not occur because of interrupt priority

Main processing INTxx INTyy

servicing servicing

EI IE = 0
EI
INTyy
INTxx (PR = 1)
(PR = 0)
RETI

1 instruction
execution IE = 0

RETI

INTyy, which occurs while INTxx is being serviced is not acknowledged for multiple interrupt servicing because
the priority of INTyy is lower than that of INTxx. INTyy is held pending and is acknowledged after one instruction
of the main processing has been executed.

PR = 0: High-priority interrupt
PR = 1: Low-priority interrupt
IE = 0: Interrupt acknowledgment disabled

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Figure 21-16. Multiple Interrupt Servicing Example (2/2)

Example 3. Multiple interrupt servicing does not occur because interrupts are not enabled

Main processing INTxx INTyy

servicing servicing

EI IE = 0

INTyy
INTxx (PR = 0)
(PR = 0) RETI

1 instruction
IE = 0
execution

RETI

In the servicing of INTxx, other interrupts are not enabled (the EI instruction is not executed). Therefore, INTyy
is not acknowledged for multiple interrupt servicing. This interrupt is held pending and acknowledged after one
instruction of the main processing has been executed.

PR = 0: High-priority interrupt
IE = 0: Interrupt acknowledgment disabled

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21.4.5 Interrupt request pending

For some instructions, even if an interrupt is generated while that instruction is being executed, the interrupt is
held pending until execution of the next instruction is completed. The instructions that hold interrupt requests pending
(interrupt request pending) are shown below.

• MOV PSW, #byte

• MOV A, PSW
• MOV PSW, A
• MOV1 PSW.bit, CY
• MOV1 CY, PSW.bit
• AND1 CY, PSW.bit
• OR1 CY, PSW.bit
• XOR1 CY, PSW.bit
• SET1 PSW.bit
• CLR1 PSW.bit
• RETB
• RETI
• PUSH PSW
• POP PSW
• BT PSW.bit, $addr16
• BF PSW.bit, $addr16
• BTCLR PSW.bit, $addr16
• EI
• DI
• Manipulation instructions for IF0L, IF0H, IF1L, MK0L, MK0H, MK1L, PR0L, PR0H, PR1L, INTM0, INTM1
registers

Caution The BRK instruction is not an interrupt request pending instruction. However, the IE flag is
cleared to 0 by a software interrupt that is started by BRK instruction execution. Thus, even if
a maskable interrupt request is generated during BRK instruction execution, that interrupt
request is not acknowledged. However, a non-maskable interrupt request is acknowledged.

Figure 21-17 shows the timing at which an interrupt request is held pending.

Figure 21-17. Interrupt Request Pending Timing

Save PSW and PC, Interrupt servicing

CPU processing Instruction N Instruction M
jump to interrupt servicing program

× × IF

Remarks 1. Instruction N: Instruction that holds interrupts requests pending

2. Instruction M: Instructions other than instruction N
3. The ××PR (priority level) values do not affect the operation of ××IF (interrupt request).

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21.5 Test Function

When the watch timer overflows and the port 4 falling edge is detected, the internal test input flag is set to 1, and
the standby release signal is generated.
Unlike the interrupt function, vectored processing is not performed.
There are two test input sources as shown in Table 21-5. The basic configuration is shown in Figure 21-18.

Table 21-5. Test Input Sources

Test Input Sources Internal/

Name Trigger External

INTWT Watch timer overflow Internal

INTPT4 Falling edge detection at port 4 External

Figure 21-18. Basic Configuration of Test Function

Internal bus

MK

Test input Standby

signal IF release signal

Remark IF: Test input flag

MK: Test mask flag

21.5.1 Registers controlling test function

The test function is controlled by the following three registers.

• Interrupt request flag register 1L (IF1L)

• Interrupt mask flag register 1L (MK1L)
• Key return mode register (KRM)

The names of the test input flags and test mask flags corresponding to the test input signals are listed in Table
21-6.

Table 21-6. Flags Corresponding to Test Input Signals

Test Input Signal Name Test Input Flag Test Mask Flag
INTWT WTIF WTMK
INTPT4 KRIF KRMK

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(1) Interrupt request flag register 1L (IF1L)

This register indicates whether a watch timer overflow is detected or not.
IF1L is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears IF1L to 00H.

Figure 21-19. Format of Interrupt Request Flag Register 1L

Symbol <7> 6 5 4 3 <2> <1> <0> Address After reset R/W

IF1L WTIF 0 0 0 0 ADIF TMIF2 TMIF1 FFE2H 00H R/W

WTIF Watch timer overflow detection flag

0 Not detected

1 Detected

Caution Be sure to clear bits 3 to 6 to 0.

(2) Interrupt mask flag register 1L (MK1L)

This register is used to set the standby mode enable/disable at the time the standby mode is released by the
watch timer.
MK1L is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input sets MK1L to FFH.

Figure 21-20. Format of Interrupt Mask Flag Register 1L

Symbol <7> 6 5 4 3 <2> <1> <0> Address After reset R/W

MK1L WTMK 1 1 0 0 ADMK TMMK2 TMMK1 FFE6H FFH R/W

WTMK Standby mode control by watch timer

0 Releasing the standby mode enabled

1 Releasing the standby mode disabled

Caution Be sure to set bits 3 to 6 to 1.

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(3) Key return mode register (KRM)

This register is used to set enable/disable of standby function clear by the key return signal (port 4 falling edge
detection).
KRM is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input sets KRM to 02H.

Figure 21-21. Format of Key Return Mode Register

Symbol 7 6 5 4 3 2 <1> <0> Address After reset R/W

KRM 0 0 0 0 0 0 KRMK KRIF FFF6H 02H R/W

KRIF Key return signal

0 Not detected

1 Detected (port 4 falling edge detection)

KRMK Standby mode control by key return signal

0 Standby mode release enabled

1 Standby mode release disabled

Caution When port 4 falling edge detection is used, be sure to clear KRIF to 0 (it is not cleared to 0
automatically).

21.5.2 Test input signal acknowledgment operation

(1) Internal test signal (INTWT)

INTWT is generated when the watch timer overflows, and sets the WTIF flag. Unless interrupts are masked
by the interrupt mask flag (WTMK) at this time, the standby release signal is generated.
The watch function is realized by checking the WTIF flag at a shorter cycle than the watch timer overflow cycle.

(2) External test input signal (INTPT4)

INTPT4 is generated when a falling edge is input to the port 4 pins (P40 to P47), and KRIF is set. Unless
interrupts are masked by the interrupt mask flag (KRMK) at this time, the standby release signal is generated.
If port 4 is used as a key matrix return signal input, whether or not a key input has been applied can be checked
from the KRIF status.

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22.1 External Device Expansion Function

The external device expansion function connects external devices to areas other than the internal ROM, RAM,
and SFR. Ports 4 to 6 are used for connection of external devices. Ports 4 to 6 control addresses/data, the read/
write strobe, wait, address strobe etc.

Table 22-1. Pin Functions in External Memory Expansion Mode

Pin Function When External Device Is Connected Alternate Function

Name Function
AD0 to AD7 Multiplexed address/data bus P40 to P47
A8 to A15 Address bus P50 to P57
RD Read strobe signal P64
WR Write strobe signal P65
WAIT Wait signal P66
ASTB Address strobe signal P67

Table 22-2. State of Port 4 to 6 Pins in External Memory Expansion Mode

Ports and Bits Port 4 Port 5 Port 6

External
Expansion Modes 0 to 7 0 1 2 3 4 5 6 7 0 to 3 4 to 7
Single-chip mode Port Port Port Port
256-byte expansion mode Address/data Port Port RD, WR, WAIT, ASTB
4 KB expansion mode Address/data Address Port Port RD, WR, WAIT, ASTB
16 KB expansion mode Address/data Address Port Port RD, WR, WAIT, ASTB
Full-address mode Address/data Address Port RD, WR, WAIT, ASTB

Caution When the external wait function is not used, the WAIT pin can be used as a port in all modes.

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Memory maps when using the external device expansion function are as follows.

Figure 22-1. Memory Map When Using External Device Expansion Function (1/3)

(a) Memory map of µPD780053 and 780053Y, (b) Memory map of µPD780054 and 780054Y,
and µPD780058, 780058B, 780058BY, and µPD780058, 780058B, 780058BY,
78F0058, and 78F0058Y with internal ROM 78F0058, and 78F0058Y with internal ROM
(flash memory) set to 24 KB (flash memory) set to 32 KB

FFFFH FFFFH
SFR SFR
FF00H FF00H
FEFFH FEFFH

Internal high-speed RAM Internal high-speed RAM

FB00H FB00H
FAFFH FAFFH
Reserved Reserved
FAE0H FAE0H
FADFH FADFH
Internal buffer RAM Internal buffer RAM
FAC0H FAC0H
FABFH FABFH
Reserved Reserved
FA80H FA80H
FA7FH FA7FH

Full-address mode Full-address mode

(when MM2 to MM0 = 111) (when MM2 to MM0 = 111)

A000H C000H
9FFFH BFFFH

16 KB expansion mode 16 KB expansion mode

(when MM2 to MM0 = 101) (when MM2 to MM0 = 101)

7000H 9000H
6FFFH 8FFFH
4 KB expansion mode 4 KB expansion mode
(when MM2 to MM0 = 100) (when MM2 to MM0 = 100)
6100H 8100H
60FFH 80FFH
256-byte expansion mode 256-byte expansion mode
(when MM2 to MM0 = 011) (when MM2 to MM0 = 011)
6000H 8000H
5FFFH 7FFFH

Single-chip mode Single-chip mode

0000H 0000H

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Figure 22-1. Memory Map When Using External Device Expansion Function (2/3)

(c) Memory map of µPD780055 and 780055Y, (d) Memory map of µPD780056 and 780056Y,
and µPD780058, 780058B, 780058BY, and µPD780058, 780058B, 780058BY,
78F0058, and 78F0058Y with internal ROM 78F0058, and 78F0058Y with internal ROM
(flash memory) set to 40 KB (flash memory) set to 48 KB

FFFFH FFFFH
SFR SFR
FF00H FF00H
FEFFH FEFFH

Internal high-speed RAM Internal high-speed RAM

FB00H FB00H
FAFFH FAFFH
Reserved Reserved
FAE0H FAE0H
FADFH FADFH
Internal buffer RAM Internal buffer RAM
FAC0H FAC0H
FABFH FABFH
Reserved Reserved
FA80H FA80H
FA7FH FA7FH

Full-address mode
Full-address mode
(when MM2 to MM0 = 111)
(when MM2 to MM0 = 111)
or
E000H 16 KB expansion mode
DFFFH (when MM2 to MM0 = 101)
16 KB expansion mode
(when MM2 to MM0 = 101) D000H
CFFFH
B000H
AFFFH 4 KB expansion mode
(when MM2 to MM0 = 100)
4 KB expansion mode
(when MM2 to MM0 = 100) C100H
A100H
C0FFH
A0FFH 256-byte expansion mode
256-byte expansion mode C000H (when MM2 to MM0 = 011)
A000H (when MM2 to MM0 = 011) BFFFH
9FFFH

Single-chip mode
Single-chip mode

0000H 0000H

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Figure 22-1. Memory Map When Using External Device Expansion Function (3/3)

(e) µPD780058, 780058B, 780058BY, 78F0058, (f) µPD780058, 780058B, 780058BY, 78F0058,
78F0058Y Memory map when internal ROM 78F0058Y Memory map when internal ROM
(flash memory) size is 56 KB (flash memory) size is 60 KB

FFFFH FFFFH
SFR SFR
FF00H FF00H
FEFFH FEFFH

Internal high-speed RAM Internal high-speed RAM

FB00H FB00H
FAFFH FAFFH
Reserved Reserved
FAE0H FAE0H
FADFH FADFH
Internal buffer RAM Internal buffer RAM
FAC0H FAC0H
FABFH FABFH
Reserved Reserved
F800H F800H
F7FFH F7FFH
Internal expansion RAM Internal expansion RAM
F400H F400H
F3FFH F3FFH
Full-address mode
(when MM2 to MM0 = 111)
or Reserved
16 KB expansion mode
(when MM2 to MM0 = 101)
F000H F000H
EFFFH EFFFH
4 KB expansion mode
(when MM2 to MM0 = 100)
E100H
F0FFH
256-byte expansion mode
(when MM2 to MM0 = 011)
E000H
DFFFH

Single-chip mode

Single-chip mode

0000H 0000H

Caution When the internal ROM (flash memory) size is 60 KB, the area from F000H to F3FFH cannot be
used. F000H to F3FFH can be used as external memory by setting the internal ROM (flash
memory) size to 56 KB or less using the internal memory size switching register (IMS).

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22.2 External Device Expansion Function Control Register

The external device expansion function is controlled by the memory expansion mode register (MM) and internal
memory size switching register (IMS).

(1) Memory expansion mode register (MM)

MM sets the wait count and external expansion area, and also sets the input/output mode of port 4.
MM is set with a 1-bit memory or 8-bit memory manipulation instruction.
RESET input sets MM to 10H.

Figure 22-2. Format of Memory Expansion Mode Register

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

MM 0 0 PW1 PW0 0 MM2 MM1 MM0 FFF8H 10H R/W

MM2 MM1 MM0 Single-chip/ P40 to P47, P50 to P57, P64 to P67 pin state
memory expansion
mode selection P40 to P47 P50 to P53 P54, P55 P56, P57 P64 to P67

0 0 0 Single-chip mode Port Input Port mode

mode
0 0 1 Output

0 1 1 Memory 256-byte AD0 to AD7 Port mode

expansion mode
mode
1 0 0 4 KB A8 to A11 Port mode P64 = RD
mode P65 = WR
P66 = WAIT
1 0 1 16 KB A12, A13 Port mode P67 = ASTB
mode
1 1 1 Full- A14, A15
address
Note
mode

Other than above Setting prohibited

PW1 PW0 Wait control

0 0 No wait

0 1 Wait (one wait state insertion)

1 0 Setting prohibited

1 1 Wait control by external wait pin

Note The full-address mode allows external expansion to the entire 64 KB address space except for the
internal ROM, RAM, and SFR areas and the reserved areas.

Remark P60 to P63 are used as port pins without regard to the mode (single-chip mode or memory expansion
mode).

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(2) Internal memory size switching register (IMS)

This register specifies the internal memory size. In principle, use IMS in the default status. However, when
using the external device expansion function with the µPD780058, 780058B, and 780058BY, set IMS so that
the internal ROM capacity is 56 KB or less.
IMS is set with an 8-bit memory manipulation instruction.
RESET input sets IMS to the value indicated in Table 22-3.

Figure 22-3. Format of Internal Memory Size Switching Register

Symbol 7 6 5 4 3 2 1 0
Address After reset R/W
IMS RAM2 RAM1 RAM0 0 ROM3 ROM2 ROM1 ROM0
FFF0H Note R/W

ROM3 ROM2 ROM1 ROM0 Internal ROM size selection

0 1 1 0 24 KB

1 0 0 0 32 KB

1 0 1 0 40 KB

1 1 0 0 48 KB

1 1 1 0 56 KB

1 1 1 1 60 KB

Other than above Setting prohibited

RAM2 RAM1 RAM0 Internal high-speed RAM size selection

1 1 0 1,024 bytes

Other than above Setting prohibited

Note The values after reset depend on the product (see Table 22-3).

Table 22-3. Values After Internal Memory Size Switching Register Is Reset

Part Number Reset Value

µPD780053, 780053Y C6H
µPD780054, 780054Y C8H
µPD780055, 780055Y CAH
µPD780056, 780056Y CCH
µPD780058, 780058B, 780058BY CFH

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22.3 External Device Expansion Function Timing

The timing control signal output pins in the external memory expansion mode are as follows.

(1) RD pin (alternate function: P64)

Read strobe signal output pin. The read strobe signal is output upon the occurrence of data accesses and
instruction fetches from external memory.
During internal memory access, the read strobe signal is not output (maintains high level).

(2) WR pin (alternate function: P65)

Write strobe signal output pin. The write strobe signal is output upon the occurrence of data access to external
memory.
During internal memory access, the write strobe signal is not output (maintains high level).

(3) WAIT pin (alternate function: P66)

External wait signal input pin. When the external wait is not used, the WAIT pin can be used as an I/O port.
During internal memory access, the external wait signal is ignored.

(4) ASTB pin (alternate function: P67)

Address strobe signal output pin. The ASTB signal is output without regard to data accesses and instruction
fetches from external memory. The ASTB signal is also output when the internal memory is accessed.

(5) AD0 to AD7, A8 to A15 pins (alternate function: P40 to P47, P50 to P57)
Address/data signal output pin. A valid signal is output or input during data accesses and instruction fetches
from external memory.
These signals change when the internal memory is accessed (output values are undefined).

The timing charts are shown in Figures 22-4 to 22-7.

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Figure 22-4. Instruction Fetch from External Memory

(a) No wait (PW1, PW0 = 0, 0) setting

ASTB

RD

AD0 to AD7 Lower address Operation code

A8 to A15 Higher address

(b) Wait (PW1, PW0 = 0, 1) setting

ASTB

RD

AD0 to AD7 Lower address Operation code

A8 to A15 Higher address

Internal wait signal
(1-clock wait)

(c) External wait (PW1, PW0 = 1, 1) setting

ASTB

RD

AD0 to AD7 Lower address Operation code

A8 to A15 Higher address

WAIT

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Figure 22-5. External Memory Read Timing

(a) No wait (PW1, PW0 = 0, 0) setting

ASTB

RD

AD0 to AD7 Lower address Read data

A8 to A15 Higher address

(b) Wait (PW1, PW0 = 0, 1) setting

ASTB

RD

AD0 to AD7 Lower address Read data

A8 to A15 Higher address

Internal wait signal
(1-clock wait)

(c) External wait (PW1, PW0 = 1, 1) setting

ASTB

RD

AD0 to AD7 Lower address Read data

A8 to A15 Higher address

WAIT

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Figure 22-6. External Memory Write Timing

(a) No wait (PW1, PW0 = 0, 0) setting

ASTB

WR
Hi-Z
AD0 to AD7 Lower address Write data

A8 to A15 Higher address

(b) Wait (PW1, PW0 = 0, 1) setting

ASTB

WR
Hi-Z
AD0 to AD7 Lower address Write data

A8 to A15 Higher address

Internal wait signal
(1-clock wait)

(c) External wait (PW1, PW0 = 1, 1) setting

ASTB

WR

Hi-Z
AD0 to AD7 Lower address Write data

A8 to A15 Higher address

WAIT

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Figure 22-7. External Memory Read Modify Write Timing

(a) No wait (PW1, PW0 = 0, 0) setting

ASTB

RD

WR
Hi-Z
AD0 to AD7 Lower address Read data Write data

A8 to A15 Higher address

(b) Wait (PW1, PW0 = 0, 1) setting

ASTB

RD

WR
Hi-Z
AD0 to AD7 Lower address Read data Write data

A8 to A15 Higher address

Internal wait signal
(1-clock wait)

(c) External wait (PW1, PW0 = 1, 1) setting

ASTB

RD

WR
Hi-Z
AD0 to AD7 Lower address Read data Write data

A8 to A15 Higher address

WAIT

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22.4 Example of Connection with Memory

Figure 22-8 shows an example of the connection between the µPD780054 and external memory. SRAM is used
as the external memory in this diagram. In addition, the external device expansion function is used in the full-address
mode, and the addresses from 0000H to 7FFFH (32 KB) are allocated to internal ROM, and the addresses after 8000H
to SRAM.

Figure 22-8. Example of Connection Between µPD780054 and Memory

µ PD780054 µ PD43256B
VDD
CS
RD OE
WR Data
WE bus
I/O1 to I/O8
A8 to A14 A0 to A14
Address
74HC573 bus

ASTB LE

Q0 to Q7
AD0 to AD7 D0 to D7
OE

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23.1 Standby Function and Configuration

23.1.1 Standby function

The standby function is designed to decrease the power consumption of the system. The following two modes
are available.

(1) HALT mode

HALT instruction execution sets the HALT mode. The HALT mode is used to stop the CPU operation clock.
The system clock oscillator continues oscillating. In this mode, the current consumption cannot be decreased
as much as in the STOP mode, but the HALT mode is effective for restarting immediately upon interrupt request
and to carry out intermittent operations such as in watch applications.

(2) STOP mode

STOP instruction execution sets the STOP mode. In the STOP mode, the main system clock oscillator stops
and the whole system stops. The CPU current consumption can be considerably decreased.
Data memory low-voltage hold (down to VDD = 1.8 V) is possible. Thus, the STOP mode is effective for holding
data memory contents with ultra-low current consumption. Because this mode can be cleared upon interrupt
request, it enables intermittent operations to be carried out.
However, because a wait time is necessary to secure oscillation stabilization after the STOP mode is released,
select the HALT mode if it is necessary to start processing immediately upon interrupt request.

In any mode, all the contents of the registers, flags and data memory just before standby mode is set are held.
The I/O port output latches and output buffer statuses are also held.

Cautions 1. The STOP mode can be used only when the system operates on the main system clock
(subsystem clock oscillation cannot be stopped). The HALT mode can be used with either
the main system clock or the subsystem clock.
2. When shifting to the STOP mode, be sure to stop the peripheral hardware operation before
executing the STOP instruction.
3. The following sequence is recommended for power consumption reduction of the A/D
converter when the standby function is used: first clear bit 7 (CS) of the A/D converter mode
register (ADM) to 0 to stop the A/D conversion operation, and then execute the HALT or STOP
instruction.

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23.1.2 Standby function control register

The wait time after the STOP mode is released upon interrupt request until the oscillation stabilizes is controlled
by the oscillation stabilization time select register (OSTS).
OSTS is set with an 8-bit memory manipulation instruction.
RESET input sets OSTS to 04H. However, it takes 217/fX, not 218/fX, until the STOP mode is released by RESET
input.

Figure 23-1. Format of Oscillation Stabilizat Time Select Register

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

OSTS 0 0 0 0 0 OSTS2 OSTS1 OSTS0 FFFAH 04H R/W

OSTS2 OSTS1 OSTS0 Selection of oscillation stabilization

time when STOP mode is released
MCS = 1 MCS = 0

0 0 0 212/f XX 212/f X (819 µs) 13

2 /f X (1.64 ms)
14 14 15
0 0 1 2 /f XX 2 /f X (3.28 ms) 2 /f X (6.55 ms)
15 15 16
0 1 0 2 /f XX 2 /f X (6.55 ms) 2 /f X (13.1 ms)
16 16 17
0 1 1 2 /f XX 2 /f X (13.1 ms) 2 /f X (26.2 ms)

1 0 0 217/f XX 217/f X (26.2 ms) 218/f X (52.4 ms)

Other than above Setting prohibited

Caution The wait time that elapses when the STOP mode is released does not include the time required
for the clock to start oscillation (see “a” in the illustration below) after the STOP mode is released.
The same applies when the STOP mode is released by RESET input and by generation of an
interrupt request.

STOP mode release

X1 pin voltage
waveform

Remarks 1. fXX: Main system clock frequency (fX or fX/2)

2. fX: Main system clock oscillation frequency
3. MCS: Bit 0 of the oscillation mode select register (OSMS)
4. Values in parentheses apply to operation with fX = 5.0 MHz

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23.2 Standby Function Operations

23.2.1 HALT mode

(1) HALT mode setting and operating status

The HALT mode is set by executing the HALT instruction. It can be set when using either the main system
clock or the subsystem clock.
The operating status in the HALT mode is described below.

Table 23-1. HALT Mode Operating Status

Setting of HALT Mode On Execution of HALT Instruction During Main On Execution of HALT Instruction during
System Clock Operation Subsystem Clock Operation
Without subsystem With subsystem When main system clock When main system
Item clockNote 1 clock Note 2 continues oscillation clock stops oscillation
Clock generator Both main system and subsystem clocks can be oscillated. Clock supply to the CPU stops.
CPU Operation stops
Ports (output latches) Status before HALT mode setting is held
16-bit timer/event counter Operable Operable when watch
timer output is selected
as count clock (fXT is
selected as count clock
of watch timer) or when
TI00 is selected
8-bit timer/event counter Operable Operable when TI1 or
TI2 is selected as
count clock
Watch timer Operable when fXX/27 is Operable Operable when fXT is
selected as count clock selected as count clock
Watchdog timer Operable Operation stops
A/D converter Operable Operation stops
D/A converter Operable
Real-time output port Operable
Serial interface Other than Operable Operable when
automatic external SCK is used
transmit/
receive
function
Automatic Operation stops
transmit/
receive
function
External interrupt INTP0 INTP0 is operable when clock supplied for peripheral hardware is selected Operation stops
requests as sampling clock (fXX/25, fXX/26, fXX/27)
INTP1 to INTP5 Operable
Bus line for AD0 to AD7 High impedance
external A0 to A15 Status before HALT mode setting is held
expansion
ASTB Low level
WR, RD High level
WAIT High impedance

Notes 1. Including when an external clock is not supplied

2. Including when an external clock is supplied

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(2) HALT mode release

The HALT mode can be released by the following four types of sources.

(a) Release by unmasked interrupt request

If an unmasked interrupt request is generated, the HALT mode is released. If interrupt request
acknowledgment is enabled, vectored interrupt servicing is carried out. If disabled, the next address
instruction is executed.

Figure 23-2. HALT Mode Release by Interrupt Request Generation

HALT Interrupt
instruction request Wait

Standby
release signal

Operating
mode HALT mode Wait Operating mode

Oscillation
Clock

Remarks 1. The broken lines indicate the case when the interrupt request which has released the
standby status is acknowledged.
2. The wait time will be as follows:
• When the program branches to the vector table: 8 to 9 clocks
• When the program does not branch to the vector table: 2 to 3 clocks

(b) Release by non-maskable interrupt request generation

If a non-maskable interrupt request is generated, the HALT mode is released and vectored interrupt
servicing is carried out irrespective of whether interrupt request acknowledgment is enabled or disabled.

(c) Release by unmasked test input

If an unmasked test signal is input, the HALT mode is released, and the next address instruction of the
HALT instruction is executed.

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(d) Release by RESET input

If the RESET signal is input, the HALT mode is released. As is the case with a normal reset operation,
the program is executed after branch to the reset vector address.

Figure 23-3. HALT Mode Release by RESET Input

Wait
HALT (217/f X : 26.2 ms)
Instruction

RESET
signal
Oscillation
Operating Reset stabilization Operating
mode HALT mode period wait status mode
Oscillation
Oscillation stop Oscillation
Clock

Remarks 1. fX: Main system clock oscillation frequency

2. Values in parentheses apply to operation with fX = 5.0 MHz.

Table 23-2. Operation After HALT Mode Release

Release Source MK×× PR×× IE ISP Operation

Maskable interrupt 0 0 0 × Next address instruction execution
request 0 0 1 × Interrupt servicing execution
0 1 0 1 Next address instruction execution
0 1 × 0
0 1 1 1 Interrupt servicing execution
1 × × × HALT mode hold
Non-maskable interrupt – – × × Interrupt servicing execution
request
Test input 0 – × × Next address instruction execution
1 – × × HALT mode hold
RESET input – – × × Reset processing

Remark ×: don’t care

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23.2.2 STOP mode

(1) STOP mode setting and operating status

The STOP mode is set by executing the STOP instruction. It can be set only when using the main system
clock.

Cautions 1. When the STOP mode is set, the X2 pin is internally connected to VDD1 via a pull-up resistor
to minimize the leakage current at the crystal oscillator. Thus, do not use the STOP mode
in a system where an external clock is used for the main system clock.
2. Because the interrupt request signal is used to clear the standby mode, if there is an
interrupt source with the interrupt request flag set and the interrupt mask flag reset, the
standby mode is immediately cleared if set. Thus, the STOP mode is reset to the HALT
mode immediately after execution of the STOP instruction. After the wait time set using
the oscillation stabilization time select register (OSTS) elapses, the operating mode is
set.

The operating status in the STOP mode is described below.

Table 23-3. STOP Mode Operating Status

Setting of STOP Mode

With Subsystem Clock Without Subsystem Clock
Item
Clock generator Only main system clock stops oscillation
CPU Operation stops
Ports (output latches) Status before STOP mode setting is held
16-bit timer/event counter Operable when watch timer output is Operation stops
selected as count clock (fXT is selected as
count clock of watch timer)
8-bit timer/event counter Operable when TI1 and TI2 are selected for the count clock
Watch timer Operable when fXT is selected for the Operation stops
count clock
Watchdog timer Operation stops
A/D converter
D/A converter Operable
Real-time output port Operable when external trigger is used or TI1 and TI2 are selected for the 8-bit
timer/event counter count clock
Serial interface Other than Operable when externally supplied clock is specified as the serial clock
automatic
transmit/receive
function and
UART
Automatic Operation stops
transmit/receive
function and
UART
External interrupt INTP0 Not operable
requests INTP1 to INTP5 Operable
Bus line for AD0 to AD7 High impedance
external A0 to A15 Status before STOP mode setting is held
expansion
ASTB Low level
WR, RD High level
WAIT High impedance

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(2) STOP mode release

The STOP mode can be released by the following three types of sources.

(a) Release by unmasked interrupt request

If an unmasked interrupt request is generated, the STOP mode is released. If interrupt request
acknowledgment is enabled after the lapse of oscillation stabilization time, vectored interrupt servicing
is carried out. If interrupt request acknowledgment is disabled, the next address instruction is executed.

Figure 23-4. STOP Mode Release by Interrupt Request Generation

Wait
STOP Interrupt (time set by OSTS)
instruction request

Standby
release signal

Operating Oscillation stabilization Operating

mode STOP mode wait status mode

Oscillation Oscillation stop Oscillation

Clock

Remark The broken lines indicate the case when the interrupt request which has released the standby
status is acknowledged.

(b) Release by unmasked test input

If an unmasked test signal is input, the STOP mode is released. After the lapse of oscillation stabilization
time, the instruction at the next address of the STOP instruction is executed.

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(c) Release by RESET input

If the RESET signal is input, the STOP mode is released and after the lapse of oscillation stabilization
time, a reset operation is carried out.

Figure 23-5. STOP Mode Release by RESET Input

Wait
STOP (217/f X : 26.2 ms)
instruction

RESET
signal
Oscillation
Operating Reset stabilization Operating
mode STOP mode period wait status mode

Oscillation Oscillation stop Oscillation

Clock

Remarks 1. fX: Main system clock oscillation frequency

2. Values in parentheses apply to operation with fX = 5.0 MHz.

Table 23-4. Operation After STOP Mode Release

Release Source MK×× PR×× IE ISP Operation

Maskable interrupt request 0 0 0 × Next address instruction execution
0 0 1 × Interrupt servicing execution
0 1 0 1 Next address instruction execution
0 1 × 0
0 1 1 1 Interrupt servicing execution
1 × × × STOP mode hold
Test input 0 – × × Next address instruction execution
1 – × × STOP mode hold
RESET input – – × × Reset processing

Remark ×: don’t care

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24.1 Reset Function

The following two operations are available to generate a reset signal.

(1) External reset input by RESET pin

(2) Internal reset by watchdog timer program loop time detection

The external reset and internal reset have no functional differences. In both cases, program execution starts at
the address at 0000H and 0001H by RESET input.
When a low level is input to the RESET pin or the watchdog timer overflows, a reset is applied and each hardware
unit is set to the status shown in Table 24-1. Each pin is high impedance during reset input or during the oscillation
stabilization time just after reset is released.
When a high level is input to the RESET pin, the reset is cleared and program execution starts after the lapse of
oscillation stabilization time (217/fX). The reset applied by watchdog timer overflow is automatically cleared after a
reset and program execution starts after the lapse of oscillation stabilization time (217/fX) (see Figures 24-2 to 24-
4).

Cautions 1. For an external reset, input a low level to the RESET pin for 10 µs or more.
2. During reset input, main system clock oscillation remains stopped but subsystem clock
oscillation continues.
3. When the STOP mode is cleared by reset, the STOP mode contents are held during reset input.
However, the port pin becomes high impedance.

Figure 24-1. Reset Function Block Diagram

Reset
RESET Reset controller signal

Over-
flow Interrupt
Count clock Watchdog timer function

Stop

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Figure 24-2. Reset Timing by RESET Input

X1

Reset period Oscillation Normal operation

Normal operation stabilization
(oscillation (reset processing)
stop) time wait

RESET

Internal
reset signal

Delay
Delay
Hi-Z
Port pin

Figure 24-3. Reset Timing due to Watchdog Timer Overflow

X1

Normal operation Reset period Oscillation Normal operation

(oscillation stabilization (reset processing)
Watchdog
stop) time wait
timer
overflow

Internal
reset signal

Hi-Z
Port pin

Figure 24-4. Reset Timing by RESET Input in STOP Mode

X1

STOP instruction execution

Stop status Reset period Oscillation Normal operation
Normal operation (oscillation (oscillation stabilization
stop) stop) time wait (reset processing)

RESET

Internal
reset signal

Delay Delay

Hi-Z
Port pin

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Table 24-1. Hardware Status After Reset (1/2)

Hardware Status After Reset

Program counter (PC)Note 1 The contents of the reset vector
tables (0000H and 0001H) are
set.
Stack pointer (SP) Undefined
Program status word (PSW) 02H
RAM Data memory UndefinedNote 2
General register UndefinedNote 2
Ports (output latches) Ports 0 to 3, 7, 12, 13 00H
(P0 to P3, P7, P12, P13)
Ports 4 to 6 (P4 to P6) Undefined
Port mode registers (PM0 to PM3, PM5 to PM7, PM12, PM13) FFH
Pull-up resistor option registers (PUOH, PUOL) 00H
Processor clock control register (PCC) 04H
Oscillation mode select register (OSMS) 00H
Internal memory size switching register (IMS) Note 3

Internal expansion RAM size switching register (IXS)Note 4 0AH

Memory expansion mode register (MM) 10H
Oscillation stabilization time select register (OSTS) 04H
16-bit timer/event counter Timer register (TM0) 00H
Capture/compare registers (CR00, CR01) Undefined
Clock select register (TCL0) 00H
Mode control register (TMC0) 00H
Capture/compare control register 0 (CRC0) 04H
Output control register (TOC0) 00H
8-bit timer/event counters 1 and 2 Timer register (TM1, TM2) 00H
Compare registers (CR10, CR20) Undefined
Clock select register (TCL1) 00H
Mode control registers (TMC1) 00H
Output control register (TOC1) 00H

Notes 1. During reset input or oscillation stabilization time wait, only the PC contents among the hardware
statuses become undefined. All other hardware statuses remain unchanged after reset.
2. If the reset signal is input in the standby mode, the status before reset is retained even after reset.
3. The values after reset depend on the product.
µPD780053, 780053Y: C6H, µPD780054, 780054Y: C8H, µPD780055, 780055Y: CAH,
µPD780056, 780056Y: CCH, µPD780058, 780058B, 780058BY: CFH, µPD78F0058, 78F0058Y: CFH
4. Provided only in the µPD780058, 780058B, 780058BY, 78F0058, and 78F0058Y.

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Table 24-1. Hardware Status After Reset (2/2)

Hardware Status After Reset

Watch timer Mode control register (TMC2) 00H
Clock select register (TCL2) 00H
Watchdog timer
Mode register (WDTM) 00H
Serial interface Clock select register (TCL3) 88H
Shift registers (SIO0, SIO1) Undefined
Mode registers (CSIM0, CSIM1, CSIM2) 00H
Serial bus interface control register (SBIC) 00H
Slave address register (SVA) Undefined
Automatic data transmit/receive control register (ADTC) 00H
Automatic data transmit/receive address pointer (ADTP) 00H
Automatic data transmit/receive interval specification register (ADTI) 00H
Asynchronous serial interface mode register (ASIM) 00H
Asynchronous serial interface status register (ASIS) 00H
Baud rate generator control register (BRGC) 00H
Serial interface pin select register (SIPS) 00H
Transmit shift register (TXS) FFH
Receive buffer register (RXB)
Interrupt timing specification register (SINT) 00H
A/D converter Mode register (ADM) 01H
Conversion result register (ADCR) Undefined
Input select register (ADIS) 00H
D/A converter Mode register (DAM) 00H
Conversion value setting registers (DACS0, DACS1) 00H
Real-time output port Mode register (RTPM) 00H
Control register (RTPC) 00H
Buffer registers (RTBL, RTBH) 00H
ROM correctionNote Correction address registers (CORAD0, CORAD1) 0000H
Correction control register (CORCN) 00H
Interrupts Request flag registers (IF0L, IF0H, IF1L) 00H
Mask flag registers (MK0L, MK0H, MK1L) FFH
Priority specification flag registers (PR0L, PR0H, PR1L) FFH
External interrupt mode registers (INTM0, INTM1) 00H
Key return mode register (KRM) 02H
Sampling clock select register (SCS) 00H

Note Provided only in the µPD780058, 780058B, 780058BY, 78F0058, and 78F0058Y.

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25.1 ROM Correction Function

The µPD780058, 780058B, 780058BY, 78F0058, 78F0058Y can replace part of a program in the mask ROM or
flash memory with a program in the internal expansion RAM.
Instruction bugs found in the mask ROM or flash memory can be avoided, and program flow can be changed by
using the ROM correction function.
The ROM correction function can be used to correct two places (max.) of the internal ROM or flash memory
(program).

Cautions 1. ROM correction can be used only for the µPD780058, 780058B, 780058BY, 78F0058, and
78F0058Y.
2. ROM correction function cannot be emulated by the in-circuit emulator (IE-78000-R, IE-78000-
R-A, IE-78K0-NS, IE-78K0-NS-A, IE-78001-R-A).

25.2 ROM Correction Configuration

The ROM correction function consists of the following hardware.

Table 25-1. ROM Correction Configuration

Item Configuration

Registers Correction address registers 0, 1 (CORAD0, CORAD1)

Control register Correction control register (CORCN)

Figure 25-1 shows a block diagram of the ROM correction function.

Figure 25-1. ROM Correction Block Diagram

Program counter (PC)

Match
Comparator Correction branch request
signal (BR !F7FDH)

Correction address
CORENn CORSTn
register (CORADn)
Correction control register

Internal bus

Remark n = 0, 1

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(1) Correction address registers 0, 1 (CORAD0, CORAD1)

These registers set the start address (correction address) of the instruction(s) to be corrected in the mask ROM
or flash memory.
The ROM correction function corrects two places (max.) of the program. Addresses are set to two registers,
CORAD0 and CORAD1. If only one place needs to be corrected, set the address to either of the registers.
CORAD0 and CORAD1 are set with a 16-bit memory manipulation instruction.
RESET input clears CORAD0 and CORAD1 to 0000H.

Figure 25-2. Format of Correction Address Registers 0 and 1

Symbol 15 0 Address After reset R/W

CORAD0 FF38H/FF39H 0000H R/W

CORAD1 FF3AH/FF3BH 0000H R/W

Cautions 1. Set CORAD0 and CORAD1 when bit 1 (COREN0) and bit 3 (COREN1) of the correction
control register (CORCN: See Figure 25-3) are 0.
2. Only addresses where operation codes are stored can be set to CORAD0 and CORAD1.
3. Do not set the following addresses to CORAD0 and CORAD1.
• Address value in table area of table reference instruction (CALLT instruction): 0040H
to 007FH
• Address value in vector table area: 0000H to 003FH

(2) Comparator
The comparator continuously compares the correction address value set in correction address registers 0 and
1 (CORAD0, CORAD1) with the fetch address value. When bit 1 (COREN0) or bit 3 (COREN1) of the correction
control register (CORCN) is 1 and the correction address matches the fetch address value, the correction
branch request signal (BR !F7FDH) is generated from the ROM correction circuit.

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25.3 ROM Correction Control Registers

The ROM correction function is controlled by the correction control register (CORCN).

(1) Correction control register (CORCN)

This register controls whether or not the correction branch request signal is generated when the fetch
address matches the correction address set in correction address registers 0 and 1. The correction control
register consists of correction enable flags (COREN0, COREN1) and correction status flags (CORST0,
CORST1). The correction enable flags enable or disable the comparator match detection signal, and
correction status flags show that the values match.
CORCN is set with a 1-bit or 8-bit memory manipulation instruction.
RESET input clears CORCN to 00H.

Figure 25-3. Format of Correction Control Register

Symbol 7 6 5 4 <3> <2> <1> <0> Address After reset R/W

CORCN 0 0 0 0 COREN1 CORST1 COREN0 CORST0 FF8AH 00H R/WNote

CORST0 Correction address register 0 and fetch address match detection

0 Not detected

1 Detected

COREN0 Correction address register 0 and fetch address

match detection control

0 Disabled

1 Enabled

CORST1 Correction address register 1 and fetch address match detection

0 Not detected

1 Detected

COREN1 Correction address register 1 and fetch address

match detection control

0 Disabled

1 Enabled

Note Bits 0 and 2 are read-only bits.

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25.4 ROM Correction Application

(1) Store the correction address and instruction after correction (patch program) to nonvolatile memory (such as
EEPROMTM) outside the microcontroller.
When two places should be corrected, store the branch destination judgment program as well. The branch
destination judgment program checks which one of the addresses set to correction address registers 0 and
1 (CORAD0 or CORAD1) generates the correction branch.

Figure 25-4. Example of Storing to EEPROM (When One Place Is Corrected)

EEPROM Source program

00H 00
CSEG AT 1000H
01H 10

02H 0D ADD A, #2
RA78K/0
02
BR !1002H
9B

02

10

FFH

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(2) Assemble in advance the initialization routine as shown in Figure 25-5 to correct the program.

Figure 25-5. Initialization Routine

Initialization

ROM correction

Is ROM No
correction used?Note

Yes

Load the contents of external nonvolatile memory

into internal expansion RAM
Correction address register setting
ROM correction operation enabled

Main program

Note Whether the ROM correction function is used or not should be judged by the port input level. For example,
when the P20 input level is high, ROM correction is used, otherwise, it is not used.

(3) After reset, store the contents that were previously stored in the external nonvolatile memory by the user
initialization routine for ROM correction to internal expansion RAM (see Figure 25-5).
Set the start address of the instruction to be corrected to CORAD0 and CORAD1, and set bits 1 and 3
(COREN0, COREN1) of the correction control register (CORCN) to 1.

(4) Set the entire-space branch instruction (BR !addr16) to the specified address (F7FDH) of the internal
expansion RAM using the main program.

(5) After the main program is started, the fetch address value and the values set in CORAD0 and CORAD1 are
continuously compared by the comparator in the ROM correction circuit. When these values match, the
correction branch request signal is generated. Simultaneously the corresponding correction status flag
(CORST0 or CORST1) is set to 1.

(6) Branch to the address F7FDH via the correction branch request signal.

(7) Branch to the internal expansion RAM address set by the main program via the entire-space branch instruction
of the address F7FDH.

(8) When one place is corrected, the correction program is executed. When two places are corrected, the
correction status flag is checked by the branch destination judgment program, and the program branches to
the correction program.

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Figure 25-6. ROM Correction Operation

Internal ROM (flash memory) program start

Does fetch address No

match correction
address?

Yes
ROM correction

Set correction status flag

Correction branch
(branch to address F7FDH)

Correction program execution

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25.5 ROM Correction Usage Example

An example of ROM correction when the instruction at address 1000H “ADD A, #1” is changed to “ADD A, #2”
is shown below.

Figure 25-7. ROM Correction Usage Example

Internal ROM or flash memory Internal expansion RAM

0000H F400H

0080H Program start

F702H ADD A, #2
(3) BR !1002H
1000H ADD A, #1
1002H MOV B, A (2)

(1)
F7FDH
BR !F702H
F7FFH
EFFFH

(1) The program branches to address F7FDH when the preset value 1000H in the correction address register
matches the fetch address value after the main program is started.

(2) The program branches to any address (address F702H in this example) by setting the entire-space branch
instruction (BR !addr16) to address F7FDH by the main program.

(3) The program returns to the internal ROM (flash memory) program after executing the substitute instruction
ADD A, #2.

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25.6 Program Execution Flow

Figures 25-8 and 25-9 show the program transition diagrams when the ROM correction is used.

Figure 25-8. Program Transition Diagram (When One Place Is Corrected)

FFFFH

F7FFH
BR !JUMP
F7FDH

(2)

Correction program
JUMP

(1)
(3)
Internal ROM

Correction place
xxxxH

Internal ROM
(flash memory)
0000H

(1) The program branches to address F7FDH when the fetch address matches the correction address
(2) The program branches to the correction program
(3) The program returns to the internal ROM (flash memory) program

Remark Shaded area: Internal expansion RAM

JUMP: Correction program start address

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Figure 25-9. Program Transition Diagram (When Two Places Are Corrected)

FFFFH

F7FFH (6)
BR !JUMP
F7FDH (2)
Correction program 2
yyyyH
(7)
Correction program 1
xxxxH
(3)
Destination judge program
JUMP (8)

(4)

Internal ROM (5)

(flash memory)
(1)
Correction place 2

Internal ROM
(flash memory)

Correction place 1

Internal ROM
(flash memory)
0000H

(1) The program branches to address F7FDH when the fetch address matches the correction address
(2) The program branches to the branch destination judgment program
(3) The program branches to correction program 1 via the branch destination judgment program (BTCLR
!CORST0, $xxxxH)
(4) The program returns to the internal ROM (flash memory) program
(5) The program branches to address F7FDH when the fetch address matches the correction address
(6) The program branches to the branch destination judgment program
(7) The program branches to correction program 2 via the branch destination judgment program (BTCLR
!CORST1, $yyyyH)
(8) The program returns to the internal ROM (flash memory) program

Remark Shaded Area: Internal expansion RAM

JUMP: Destination judge program start address

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25.7 ROM Correction Cautions

(1) Address values set in correction address registers 0 and 1 (CORAD0, CORAD1) must be addresses where
instruction codes are stored.

(2) Correction address registers 0 and 1 (CORAD0, CORAD1) should be set when the correction enable flag
(COREN0, COREN1) is 0 (when the correction branch is in the disabled state). If an address is set to CORAD0
or CORAD1 when COREN0 or COREN1 is 1 (when the correction branch is in the enabled state), the correction
branch may start with a different address from the set address value.

(3) Do not set the address value of an instruction immediately after the instruction that sets the correction enable
flag (COREN0, COREN1) to 1, to correction address register 0 or 1 (CORAD0, CORAD1); otherwise the
correction branch may not start.

(4) Do not set the address value in the table area of the table reference instruction (CALLT instruction) (0040H
to 007FH), and the address value in the vector table area (0000H to 003FH) to correction address registers
0 and 1 (CORAD0, CORAD1).

(5) Do not set two addresses immediately after the instructions shown below to correction address registers 0
and 1 (CORAD0, CORAD1). (That is, when the mapped terminal address of these instructions is N, do not
set the address values of N + 1 and N + 2.)

• RET
• RETI
• RETB
• BR $addr16
• STOP
• HALT

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 CHAPTER 26 µPD78F0058, 78F0058Y

The µPD78F0058 and 78F0058Y have flash memory whose contents can be written, erased, rewritten with the
device mounted on a PC board. Table 26-1 lists the differences between the flash memory versions (µPD78F0058
and 78F0058Y) and the mask ROM versions (µPD780053, 780054, 780055, 780056, 780058, 780058B, 780053Y,
780054Y, 780055Y, 780056Y, and 780058BY).

Table 26-1. Differences Between µPD78F0058, 78F0058Y and Mask ROM Versions

Item µPD78F0058 µPD78F0058Y Mask ROM Versions

µPD780058 Subseries µPD780058Y Subseries
Internal ROM structure Flash memory Mask ROM
Internal ROM capacity 60 KB µPD780053, 780053Y: 24 KB
µPD780054, 780054Y: 32 KB
µPD780055, 780055Y: 40 KB
µPD780056, 780056Y: 48 KB
µPD780058, 780058B, 780058BY: 60 KB
Internal expansion RAM capacity 1,024 bytes µPD780053, 780053Y: None
µPD780054, 780054Y: None
µPD780055, 780055Y: None
µPD780056, 780056Y: None
µPD780058, 780058B, 780058BY: 1,024 bytes
Internal ROM capacity ChangeableNote 1 Not changeable
changeable/not changeable using
internal memory size switching
register (IMS)
Internal expansion RAM capacity ChangeableNote 2 Not changeable
changeable/not changeable using
interna expansion RAM size
switching register (IXS)
Supply voltage VDD = 2.7Note 3 to 5.5 V VDD = 1.8 to 5.5 V
IC pin Not provided Provided
VPP pin Provided Not provided
P60 to P63 pin mask option Not provided Provided
with on-chip pull-up resistors
Serial interface (SBI) Provided Not provided Provided Not provided
2
Serial interface (I C) Not provided Provided Not provided Provided

Notes 1. Flash memory is set to 60 KB by RESET input.

2. Internal expansion RAM is set to 1,024 bytes by RESET input.
3. VDD = 2.2 V can also be supplied. Contact an NEC Electronics sales representative for details.

Caution There are differences in noise immunity and noise radiation between the flash memory and mask
ROM versions. When pre-producing an application set with the flash memory version and then
mass-producing it with the mask ROM version, be sure to conduct sufficient evaluations for the
commercial samples (not engineering samples) of the mask ROM version.

Remark Only the µPD780058, 780058B, 78F0058, 780058BY, and 78F0058Y are provided with an internal
expansion RAM size switching register.

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 CHAPTER 26 µPD78F0058, 78F0058Y

26.1 Internal memory Size Switching Register

The µPD78F0058 and 78F0058Y allow users to define the internal ROM size using the internal memory size
switching register (IMS), so that the same memory mapping as that of a mask ROM version with a different-size internal
ROM is possible.
IMS is set with an 8-bit memory manipulation instruction.
RESET input sets IMS to CFH.

Figure 26-1. Format of Memory Size Switching Register

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

IMS RAM2 RAM1 RAM0 0 ROM3 ROM2 ROM1 ROM0 FFF0H CFH R/W

ROM3 ROM2 ROM1 ROM0 Internal ROM capacity selection

0 1 1 0 24 KB

1 0 0 0 32 KB

1 0 1 0 40 KB

1 1 0 0 48 KB

1 1 1 0 56 KBNote

1 1 1 1 60 KB

Other than above Setting prohibited

RAM2 RAM1 RAM0 Internal high-speed RAM capacity selection

1 1 0 1,024 bytes
Other than above Setting prohibited

Note When using the external device expansion function of the µPD780058, 780058B, 780058BY, 78F0058,
and 78F0058Y, set the internal ROM capacity to 56 KB or less.

The IMS settings to give the same memory map as mask ROM versions are shown in Table 26-2.

Table 26-2. Internal Memory Size Switching Register Setting Values

Target Mask ROM Version IMS Setting Value

µPD780053, 780053Y C6H
µPD780054, 780054Y C8H
µPD780055, 780055Y CAH
µPD780056, 780056Y CCH
µPD780058, 780058B, 780058BY CFH

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26.2 Internal Expansion RAM Size Switching Register

The µPD78F0058 and 78F0058Y allow users to define the internal expansion RAM size by using the internal
expansion RAM size switching register (IXS), so that the same memory mapping as that of a mask ROM version with
a different-size internal expansion RAM is possible.
IXS is set with an 8-bit memory manipulation instruction.
RESET input sets IXS to 0AH.

Figure 26-2. Format of Internal Expansion RAM Size Switching Register

Symbol 7 6 5 4 3 2 1 0 Address After reset R/W

IXS 0 0 0 0 IXRAM3 IXRAM2 IXRAM1 IXRAM0 FFF4H 0AH W

IXRAM3 IXRAM2 IXRAM1 IXRAM0 Internal extension RAM capacity selection

1 1 0 0 0 bytes
1 0 1 0 1,024 bytes

Other than above Setting prohibited

The IXS settings that give the same memory map as the mask ROM versions are shown in Table 26-3.

Table 26-3. Internal Expansion RAM Size Switching Register Setting Values

Target Mask ROM Version IXS Setting Value

µPD780053, 780053Y 0CH
µPD780054, 780054Y
µPD780055, 780055Y
µPD780056, 780056Y
µPD780058, 780058B, 780058BY 0AH

Remark If a program for the µPD78F0058 or 78F0058Y

which includes “MOV IXS, #0CH” is implemented
with the µPD780053, 780053Y, 780054, 780054Y,
780055, 780055Y, 780056, or 780056Y, this
instruction is ignored and causes no malfunction.

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 CHAPTER 26 µPD78F0058, 78F0058Y

26.3 Flash Memory Characteristics

Flash memory programming is performed by connecting a dedicated flash programmer (Flashpro III (part no. FL-
PR3, PG-FP3)/Flashpro IV (part no. FL-PR4, PG-FP4)) to the target system with the flash memory mounted on the
target system (on-board). A flash memory writing adapter (program adapter), which is a target board used exclusively
for programming, is also provided.

Remark FL-PR3, FL-PR4, and the program adapter are products of Naito Densei Machida Mfg. Co., Ltd. (TEL
+81-45-475-4191).

Programming using flash memory has the following advantages.

• Software can be modified after the microcontroller is solder-mounted on the target system.
• Distinguishing software facilities low-quantity, varied model production
• Easy data adjustment when starting mass production

26.3.1 Programming environment

The following shows the environment required for µPD78F0058, 78F0058Y flash memory programming.
When Flashpro III (part no. FL-PR3, PG-FP3) or Flashpro IV (part no. FL-PR4, PG-FP4) is used as a dedicated
flash programmer, a host machine is required to control the dedicated flash programmer. Communication between
the host machine and flash programmer is performed via RS-232C/USB (Rev. 1.1).
For details, refer to the manuals for Flashpro III/Flashpro IV.

Remark USB is supported by Flashpro IV only.

Figure 26-3. Environment for Writing Program to Flash Memory

VPP

RS-232C VDD
VSS
USB
RESET
Dedicated flash SIO/UART/PORT µ PD78F0058,
programmer µPD78F0058Y
Host machine

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 CHAPTER 26 µPD78F0058, 78F0058Y

26.3.2 Communication mode

Use the communication mode shown in Table 26-4 to perform communication between the dedicated flash
programmer and µPD78F0058, 78F0058Y.

Table 26-4. Communication Mode List

Communication TYPE SettingNote 1 Pins Used Number

Mode COMM PORT SIO Clock CPU Flash Clock Multiple of VPP
CLOCK Rate Pulses

3-wire serial I/O SIO ch-0 100 Hz to Optional 1 to 1.0 P27/SCK0/SCL 0

(3 wired, sync.) 1.25 MHzNote 2 5 MHzNote 2 P26/SO0/SB1/SDA1
P25/SI0/SB0/SDA0
SIO ch-1 P22/SCK1 1
(3 wired, sync.) P21/SO1
P20/SI1
SIO ch-2 P72/SCK2/ASCK 2
(3 wired, sync.) P71/SO2/TxD0
P70/SI2/RxD0
UART (UART0) UART ch-0 4,800 to Optional 1 to 1.0 P71/SO2/TxD0 8
(Async.) 76,800 bpsNotes 2, 3 5 MHzNote 2 P70/SI2/RxD0
UART ch-1 P23/TxD1 9
(Async.) P24/RxD1
Pseudo 3-wire Port A 100 Hz to Optional 1 to 1.0 P32/TO2 12
serial I/O (Pseudo-3 wired) 1 kHz 5 MHzNote 2 (Serial clock I/O)
P31/TO1
(Serial data output)
P30/TO0
(Serial data input)

Notes 1. Selection items for TYPE settings on the dedicated flash programmer (Flashpro III (part no. FL-PR3,
PG-FP3)/Flashpro IV (part no. FL-PR4, PG-FP4)).
2. The possible setting range differs depending on the voltage. For details, see CHAPTER 29 ELEC-
TRICAL SPECIFICATIONS (FLASH MEMORY VERSION), CHAPTER 30 ELECTRICAL SPECIFI-
CATIONS (FLASH MEMORY VERSION (VDD = 2.2 V).
3. Because factors other than the baud rate error, such as the signal waveform slew, also affect UART
communication, thoroughly evaluate the slew as well as the baud rate error.

Figure 26-4. Communication Mode Selection Format

VPP pulses
10 V

VPP VDD

VSS

VDD
RESET
VSS Flash memory write mode

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 CHAPTER 26 µPD78F0058, 78F0058Y

Figure 26-5. Example of Connection with Dedicated Flash Programmer (1/2)

(a) 3-wire serial I/O (SIO ch-0)

Dedicated flash programmer µ PD78F0058, 78F0058Y

VPP1 VPP
VDD VDD0, VDD1, AVREF
RESET RESET
SCK SCK0
SO SI0
SI SO0
CLKNote X1
GND VSS0, VSS1, AVSS

(b) 3-wire serial I/O (SIO ch-1)

Dedicated flash programmer µ PD78F0058, 78F0058Y

VPP1 VPP
VDD VDD0, VDD1, AVREF
RESET RESET
SCK SCK1
SO SI1
SI SO1
CLKNote X1
GND VSS0, VSS1, AVSS

(c) 3-wire serial I/O (SIO ch-2)

Dedicated flash programmer µ PD78F0058, 78F0058Y

VPP1 VPP
VDD VDD0, VDD1, AVREF
RESET RESET
SCK SCK2
SO SI2
SI SO2
Note
CLK X1
GND VSS0, VSS1, AVSS

Note Connect this pin when the system clock is supplied from the dedicated flash programmer. If a resonator
is already connected to the X1 pin, the CLK pin does not need to be connected.

Caution The VDD0 and VDD1 pins, if already connected to the power supply, must be connected to the VDD
pin of the dedicated flash programmer. When using the power supply connected to the VDD0 and
VDD1 pins, supply voltage before starting programming.

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Figure 26-5. Example of Connection with Dedicated Flash Programmer (2/2)

(d) UART (UART ch-0)

Dedicated flash programmer µ PD78F0058, 78F0058Y

VPP1 VPP
VDD VDD0, VDD1, AVREF
RESET RESET
SO (TXD) RXD0
SI (RXD) TXD0
CLKNote X1
GND VSS0, VSS1, AVSS

(e) UART (UART ch-1)

Dedicated flash programmer µ PD78F0058, 78F0058Y

VPP1 VPP
VDD VDD0, VDD1, AVREF
RESET RESET
SO (TXD) RXD1
SI (RXD) TXD1
CLKNote X1
GND VSS0, VSS1, AVSS

(f) Pseudo 3-wire serial I/O

Dedicated flash programmer µ PD78F0058, 78F0058Y

VPP1 VPP
VDD VDD0, VDD1, AVREF
RESET RESET
SCK P32
SO P30
SI P31
Note
CLK X1
GND VSS0, VSS1, AVSS

Note Connect this pin when the system clock is supplied from the dedicated flash programmer. If a resonator
is already connected to the X1 pin, the CLK pin does not need to be connected.

Caution The VDD0 and VDD1 pins, if already connected to the power supply, must be connected to the VDD
pin of the dedicated flash programmer. When using the power supply connected to the VDD0 and
VDD1 pins, supply voltage before starting programming.

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 CHAPTER 26 µPD78F0058, 78F0058Y

If Flashpro III (part no. FL-PR3, PG-FP3)/Flashpro IV is used as a dedicated flash programmer, the following signals
are generated for the µPD78F0058, 78F0058Y. For details, refer to the manual of Flashpro III/Flashpro IV.

Table 26-5. Pin Connection List

Signal Name I/O Pin Function Pin Name 3-Wire UART Pseudo 3-Wire
Serial I/O Serial I/O

VPP1 Output Write voltage VPP

VPP2 − − − × × ×

VDD I/O VDD voltage generation/ VDD0, VDD1, AVREF Note Note Note

voltage monitoring

GND − Ground VSS0, VSS1, AVSS

CLK Output Clock output X1 ×

RESET Output Reset signal RESET

SI (RxD) Input Reception signal SO0/SO1/SO2/TxD0/TxD1/P31

SO (TxD) Output Transmit signal SI0/SI1/SI2/RxD0/RxD1/P30

SCK Output Transfer clock SCK0/SCK1/SCK2/P32 ×

HS Input Handshake signal − × × ×

Note VDD voltage must be supplied before programming is started.

Remark : Pin must be connected.

: If the signal is supplied on the target board, pin does not need to be connected.
×: Pin does not need to be connected.

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26.3.3 On-board pin processing

When performing programming on the target system, provide a connector on the target system to connect the
dedicated flash programmer.
An on-board function that allows switching between normal operation mode and flash memory programming mode
may be required in some cases.

<VPP pin>
In normal operation mode, input 0 V to the VPP pin. In flash memory programming mode, a write voltage of 10.0
V (TYP.) is supplied to the VPP pin, so perform the following.

(1) Connect a pull-down resistor (RVPP = 10 kΩ) to the VPP pin.

(2) Use the jumper on the board to switch the VPP pin input to either the programmer or directly to GND.

A VPP pin connection example is shown below.

Figure 26-6. VPP Pin Connection Example

µ PD78F0058, 78F0058Y

Connection pin of dedicated flash programmer

VPP

Pull-down resistor (RVPP)

<Serial interface pins>

The following shows the pins used by the serial interface.

Serial Interface Pins Used

3-wire serial I/O SI0, SO0, SCK0

SI1, SO1, SCK1

SI2, SO2, SCK2

UART RxD0, TxD0

RxD1, TxD1

Pseudo 3-wire serial I/O P30, P31, P32

When connecting the dedicated flash programmer to a serial interface pin that is connected to another device on-
board, signal conflict or abnormal operation of the other device may occur. Care must therefore be taken with
such connections.

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 CHAPTER 26 µPD78F0058, 78F0058Y

(1) Signal conflict

If the dedicated flash programmer (output) is connected to a serial interface pin (input) that is connected to
another device (output), a signal conflict occurs. To prevent this, isolate the connection with the other device
or set the other device to the output high impedance status.

Figure 26-7. Signal Conflict (Input Pin of Serial Interface)

µPD78F0058, 78F0058Y
Connection pin of
dedicated flash
Signal conflict programmer
Input pin
Other device

Output pin

In the flash memory programming mode, the signal output by another

device and the signal sent by the dedicated flash programmer conflict,
therefore, isolate the signal of the other device.

(2) Abnormal operation of other device

If the dedicated flash programmer (output or input) is connected to a serial interface pin (input or output) that
is connected to another device (input), a signal is output to the device, and this may cause an abnormal
operation. To prevent this abnormal operation, isolate the connection with the other device or set so that the
input signals to the other device are ignored.

Figure 26-8. Abnormal Operation of Other Device

µ PD78F0058, 78F0058Y
Connection pin of
dedicated flash
programmer
Pin
Other device

Input pin

If the signal output by the µPD78F0058, 78F0058Y affects another device

in the flash memory programming mode, isolate the signals of the other
device.

µPD78F0058, 78F0058Y
Connection pin of
dedicated flash
programmer
Pin
Other device

Input pin

If the signal output by the dedicated flash programmer affects another

device in the flash memory programming mode, isolate the signals of the
other device.

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 CHAPTER 26 µPD78F0058, 78F0058Y

<RESET pin>
If the reset signal of the dedicated flash programmer is connected to the RESET pin connected to the reset signal
generator on-board, a signal conflict occurs. To prevent this, isolate the connection with the reset signal generator.
If the reset signal is input from the user system in the flash memory programming mode, a normal programming
operation cannot be performed. Therefore, do not input reset signals from other than the dedicated flash
programmer.

Figure 26-9. Signal Conflict (RESET Pin)

µ PD78F0058, 78F0058Y
Connection pin of
dedicated flash
Signal conflict programmer
RESET
Reset signal generator

Output pin

The signal output by the reset signal generator and the signal output from
the dedicated flash programmer conflict in the flash memory programming
mode, so isolate the signal of the reset signal generator.

<Port pins>
When the µPD78F0058 and 78F0058Y enter the flash memory programming mode, all the pins other than those
that communicate in flash memory programming are in the same status as immediately after reset.
If the external device does not recognize initial statuses such as the output high impedance status, therefore,
connect the external device to VDD0 or VSS0 via a resistor.

<Oscillator>
When using the on-board clock, connect X1, X2, XT1, and XT2 as required in the normal operation mode.
When using the clock output of the flash programmer, connect it directly to X1, disconnecting the main oscillator
on-board, and leave the X2 pin open. The subsystem clock conforms to the normal operation mode.

<Power supply>
To use the power output from the flash programmer, connect the VDD0 and VDD1 pins to VDD of the flash programmer,
and the VSS0 and VSS1 pins to GND of the flash programmer.
To use the on-board power supply, make connections that accord with the normal operation mode. However,
because the voltage is monitored by the flash programmer, be sure to connect VDD of the flash programmer.
Supply the same power as in the normal operation mode to the other power supply pins (AVREF0, AVREF1, and AVSS).

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 CHAPTER 26 µPD78F0058, 78F0058Y

26.3.4 Connection of adapter for flash writing

The following figures show examples of the recommended connection when the adapter for flash writing is used.

Figure 26-10. Wiring Example for Flash Writing Adapter in 3-Wire Serial I/O Mode (SIO ch-0)

VDD (2.7 to 5.5 V)

GND

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
1 60
2 59
3 58
4 57
5 56
6 55
7 54
8 53
9 52
10 51
µPD78F0058 50
11
µ PD78F0058Y 49
12
13 48
14 47
15 46
16 45
17 44
18 43
19 42
20 41
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

GND
VDD
VDD2 (LVDD)

SI SO SCK CLKOUT RESET VPP RESERVE/HS

WRITER INTERFACE

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 CHAPTER 26 µPD78F0058, 78F0058Y

Figure 26-11. Wiring Example for Flash Writing Adapter in 3-Wire Serial I/O Mode (SIO ch-1)

VDD (2.7 to 5.5 V)

GND

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
1 60
2 59
3 58
4 57
5 56
6 55
7 54
8 53
9 52
10 51
µ PD78F0058 50
11
µPD78F0058Y 49
12
13 48
14 47
15 46
16 45
17 44
18 43
19 42
20 41
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

GND
VDD
VDD2 (LVDD)

SI SO SCK CLKOUT RESET VPP RESERVE/HS

WRITER INTERFACE

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 CHAPTER 26 µPD78F0058, 78F0058Y

Figure 26-12. Wiring Example for Flash Writing Adapter in 3-Wire Serial I/O Mode (SIO ch-2)

VDD (2.7 to 5.5 V)

GND

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
1 60
2 59
3 58
4 57
5 56
6 55
7 54
8 53
9 52
10 51
µ PD78F0058 50
11
µ PD78F0058Y 49
12
13 48
14 47
15 46
16 45
17 44
18 43
19 42
20 41
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

GND
VDD
VDD2 (LVDD)

SI SO SCK CLKOUT RESET VPP RESERVE/HS

WRITER INTERFACE

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 CHAPTER 26 µPD78F0058, 78F0058Y

Figure 26-13. Wiring Example for Flash Writing Adapter in UART Mode (UART ch-0)

VDD (2.7 to 5.5 V)

GND

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
1 60
2 59
3 58
4 57
5 56
6 55
7 54
8 53
9 52
10 51
µ PD78F0058 50
11
µ PD78F0058Y 49
12
13 48
14 47
15 46
16 45
17 44
18 43
19 42
20 41
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

GND
VDD
VDD2 (LVDD)

SI SO SCK CLKOUT RESET VPP RESERVE/HS

WRITER INTERFACE

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 CHAPTER 26 µPD78F0058, 78F0058Y

Figure 26-14. Wiring Example for Flash Writing Adapter in UART Mode (UART ch-1)

VDD (2.7 to 5.5 V)

GND

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
1 60
2 59
3 58
4 57
5 56
6 55
7 54
8 53
9 52
10 51
µPD78F0058 50
11
µ PD78F0058Y 49
12
13 48
14 47
15 46
16 45
17 44
18 43
19 42
20 41
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

GND
VDD
VDD2 (LVDD)

SI SO SCK CLKOUT RESET VPP RESERVE/HS

WRITER INTERFACE

550 User's Manual U12013EJ3V2UD

 CHAPTER 26 µPD78F0058, 78F0058Y

Figure 26-15. Wiring Example for Flash Writing Adapter in Pseudo 3-Wire Mode

VDD (2.7 to 5.5 V)

GND

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
1 60
2 59
3 58
4 57
5 56
6 55
7 54
8 53
9 52
10 51
µ PD78F0058 50
11
µ PD78F0058Y 49
12
13 48
14 47
15 46
16 45
17 44
18 43
19 42
20 41
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

GND
VDD
VDD2 (LVDD)

SI SO SCK CLKOUT RESET VPP RESERVE/HS

WRITER INTERFACE

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 CHAPTER 27 INSTRUCTION SET OVERVIEW

This chapter describes each instruction set of the µPD780058 and 780058Y Subseries in table form. For details
of the operations and operation codes, refer to the separate document 78K/0 Series Instructions User’s Manual
(U12326E).

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27.1 Conventions Used in Operation List

27.1.1 Operand identifiers and description methods

Operands are described in the “Operand” column of each instruction in accordance with the description method
of the instruction operand identifier (refer to the assembler specifications for details). When there are two or more
description methods, select one of them. Uppercase letters and the symbols #, !, $ and [ ] are keywords and must
be described as they are. Each symbol has the following meaning.

• #: Immediate data specification

• !: Absolute address specification
• $: Relative address specification
• [ ]: Indirect address specification

In the case of immediate data, describe an appropriate numeric value or a label. When using a label, be sure to
describe the #, !, $, and [ ] symbols.
For operand register identifiers, r and rp, either function names (X, A, C, etc.) or absolute names (names in
parentheses in the table below, R0, R1, R2, etc.) can be used for description.

Table 27-1. Operand Identifiers and Description Methods

Identifier Description Method

r X (R0), A (R1), C (R2), B (R3), E (R4), D (R5), L (R6), H (R7),

rp AX (RP0), BC (RP1), DE (RP2), HL (RP3)
sfr Special-function register symbolNote
sfrp Special-function register symbol (16-bit manipulatable register even addresses only)Note
saddr FE20H to FF1FH Immediate data or label
saddrp FE20H to FF1FH Immediate data or label (even address only)
addr16 0000H to FFFFH Immediate data or label
(Only even addresses for 16-bit data transfer instructions)
addr11 0800H to 0FFFH Immediate data or label
addr5 0040H to 007FH Immediate data or label (even address only)

word 16-bit immediate data or label

byte 8-bit immediate data or label
bit 3-bit immediate data or label
RBn RB0 to RB3

Note Addresses from FFD0H to FFDFH cannot be accessed with these operands.

Remark For special-function register symbols, see Table 5-2 Special-Function Register List.

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 CHAPTER 27 INSTRUCTION SET OVERVIEW

27.1.2 Description of operation column

A: A register; 8-bit accumulator
X: X register
B: B register
C: C register
D: D register
E: E register
H: H register
L: L register
AX: AX register pair; 16-bit accumulator
BC: BC register pair
DE: DE register pair
HL: HL register pair
PC: Program counter
SP: Stack pointer
PSW: Program status word
CY: Carry flag
AC: Auxiliary carry flag
Z: Zero flag
RBS: Register bank select flag
IE: Interrupt request enable flag
NMIS: Non-maskable interrupt servicing flag
( ): Memory contents indicated by address or register contents in parentheses
×H, ×L: Higher 8 bits and lower 8 bits of 16-bit register
: Logical product (AND)
: Logical sum (OR)
: Exclusive logical sum (exclusive OR)
——: Inverted data
addr16: 16-bit immediate data or label
jdisp8: Signed 8-bit data (displacement value)

27.1.3 Description of flag operation column

(Blank): Nt affected
0: Cleared to 0
1: Set to 1
×: Set/cleared according to the result
R: Previously saved value is restored

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27.2 Operation List

Instruction Clocks Flag

Group Mnemonic Operands Bytes Operation
Note 1 Note 2 Z AC CY
8-bit data MOV r, #byte 2 4 – r ← byte
transfer saddr, #byte 3 6 7 (saddr) ← byte
sfr, #byte 3 – 7 sfr ← byte
A, r Note 3 1 2 – A←r
r, A Note 3 1 2 – r←A
A, saddr 2 4 5 A ← (saddr)
saddr, A 2 4 5 (saddr) ← A
A, sfr 2 – 5 A ← sfr
sfr, A 2 – 5 sfr ← A
A, !addr16 3 8 9+n A ← (addr16)
!addr16, A 3 8 9+m (addr16) ← A
PSW, #byte 3 – 7 PSW ← byte × × ×
A, PSW 2 – 5 A ← PSW
PSW, A 2 – 5 PSW ← A × × ×
A, [DE] 1 4 5+n A ← (DE)
[DE], A 1 4 5+m (DE) ← A
A, [HL] 1 4 5+n A ← (HL)
[HL], A 1 4 5+m (HL) ← A
A, [HL + byte] 2 8 9+n A ← (HL + byte)
[HL + byte], A 2 8 9+m (HL + byte) ← A
A, [HL + B] 1 6 7+n A ← (HL + B)
[HL + B], A 1 6 7+m (HL + B) ← A
A, [HL + C] 1 6 7+n A ← (HL + C)
[HL + C], A 1 6 7+m (HL + C) ← A
XCH A, r Note 3 1 2 – A↔r
A, saddr 2 4 6 A ↔ (saddr)
A, sfr 2 – 6 A ↔ sfr
A, !addr16 3 8 10 + n + m A ↔ (addr16)

A, [DE] 1 4 6+n+m A ↔ (DE)

A, [HL] 1 4 6+n+m A ↔ (HL)
A, [HL + byte] 2 8 10 + n + m A ↔ (HL + byte)

A, [HL + B] 2 8 10 + n + m A ↔ (HL + B)

A, [HL + C] 2 8 10 + n + m A ↔ (HL + C)

Notes 1. When the internal high-speed RAM area is accessed or instruction that performs no data access is
executed.
2. When an area except the internal high-speed RAM area is accessed.
3. Except “r = A”

Remarks 1. One instruction clock cycle is one cycle of the CPU clock (fCPU) selected by the processor clock
control register (PCC).
2. This clock cycle applies to the internal ROM program.
3. n is the number of waits when external memory expansion area is read from.
4. m is the number of waits when external memory expansion area is written to.

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 CHAPTER 27 INSTRUCTION SET OVERVIEW

Instruction Clocks Flag

Mnemonic Operands Bytes Operation
Group Note 1 Note 2 Z AC CY
16-bit MOVW rp, #word 3 6 – rp ← word
data saddrp, #word 4 8 10 (saddrp) ← word
transfer
sfrp, #word 4 – 10 sfrp ← word
AX, saddrp 2 6 8 AX ← (saddrp)
saddrp, AX 2 6 8 (saddrp) ← AX
AX, sfrp 2 – 8 AX ← sfrp
sfrp, AX 2 – 8 sfrp ← AX
AX, rp Note 3 1 4 – AX ← rp
rp, AX Note 3 1 4 – rp ← AX
AX, !addr16 3 10 12 + 2n AX ← (addr16)
!addr16, AX 3 10 12 + 2m (addr16) ← AX
XCHW AX, rp Note 3 1 4 – AX ↔ rp
8-bit ADD A, #byte 2 4 – A, CY ← A + byte × × ×
operation saddr, #byte 3 6 8 (saddr), CY ← (saddr) + byte × × ×
A, r Note 4 2 4 – A, CY ← A + r × × ×
r, A 2 4 – r, CY ← r + A × × ×
A, saddr 2 4 5 A, CY ← A + (saddr) × × ×
A, !addr16 3 8 9+n A, CY ← A + (addr16) × × ×
A, [HL] 1 4 5+n A, CY ← A + (HL) × × ×
A, [HL + byte] 2 8 9+n A, CY ← A + (HL + byte) × × ×
A, [HL + B] 2 8 9+n A, CY ← A + (HL + B) × × ×
A, [HL + C] 2 8 9+n A, CY ← A + (HL + C) × × ×
ADDC A, #byte 2 4 – A, CY ← A + byte + CY × × ×
saddr, #byte 3 6 8 (saddr), CY ← (saddr) + byte + CY × × ×
A, r Note 4 2 4 – A, CY ← A + r + CY × × ×
r, A 2 4 – r, CY ← r + A + CY × × ×
A, saddr 2 4 5 A, CY ← A + (saddr) + CY × × ×
A, !addr16 3 8 9+n A, CY ← A + (addr16) + CY × × ×
A, [HL] 1 4 5+n A, CY ← A + (HL) + CY × × ×
A, [HL + byte] 2 8 9+n A, CY ← A + (HL + byte) + CY × × ×
A, [HL + B] 2 8 9+n A, CY ← A + (HL + B) + CY × × ×
A, [HL + C] 2 8 9+n A, CY ← A + (HL + C) + CY × × ×

Notes 1. When the internal high-speed RAM area is accessed or instruction that performs no data access is
executed.
2. When an area except the internal high-speed RAM area is accessed
3. Only when rp = BC, DE, or HL
4. Except “r = A”

Remarks 1. One instruction clock cycle is one cycle of the CPU clock (fCPU) selected by the processor clock
control register (PCC).
2. This clock cycle applies to the internal ROM program.
3. n is the number of waits when external memory expansion area is read from.
4. m is the number of waits when external memory expansion area is written to.

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 CHAPTER 27 INSTRUCTION SET OVERVIEW

Instruction Clocks Flag

Mnemonic Operands Bytes Operation
Group Note 1 Note 2 Z AC CY
8-bit SUB A, #byte 2 4 – A, CY ← A – byte × × ×
operation saddr, #byte 3 6 8 (saddr), CY ← (saddr) – byte × × ×
A, r Note 3 2 4 – A, CY ← A – r × × ×
r, A 2 4 – r, CY ← r – A × × ×
A, saddr 2 4 5 A, CY ← A – (saddr) × × ×
A, !addr16 3 8 9+n A, CY ← A – (addr16) × × ×
A, [HL] 1 4 5+n A, CY ← A – (HL) × × ×
A, [HL + byte] 2 8 9+n A, CY ← A – (HL + byte) × × ×
A, [HL + B] 2 8 9+n A, CY ← A – (HL + B) × × ×
A, [HL + C] 2 8 9+n A, CY ← A – (HL + C) × × ×
SUBC A, #byte 2 4 – A, CY ← A – byte – CY × × ×
saddr, #byte 3 6 8 (saddr), CY ← (saddr) – byte – CY × × ×
A, r Note 3 2 4 – A, CY ← A – r – CY × × ×
r, A 2 4 – r, CY ← r – A – CY × × ×
A, saddr 2 4 5 A, CY ← A – (saddr) – CY × × ×
A, !addr16 3 8 9+n A, CY ← A – (addr16) – CY × × ×
A, [HL] 1 4 5+n A, CY ← A – (HL) – CY × × ×
A, [HL + byte] 2 8 9+n A, CY ← A – (HL + byte) – CY × × ×
A, [HL + B] 2 8 9+n A, CY ← A – (HL + B) – CY × × ×
A, [HL + C] 2 8 9+n A, CY ← A – (HL + C) – CY × × ×
AND A, #byte 2 4 – A←A byte ×
saddr, #byte 3 6 8 (saddr) ← (saddr) byte ×
A, r Note 3 2 4 – A←A r ×
r, A 2 4 – r←r A ×
A, saddr 2 4 5 A←A (saddr) ×
A, !addr16 3 8 9+n A←A (addr16) ×
A, [HL] 1 4 5+n A←A (HL) ×
A, [HL + byte] 2 8 9+n A←A (HL + byte) ×
A, [HL + B] 2 8 9+n A←A (HL + B) ×
A, [HL + C] 2 8 9+n A←A (HL + C) ×

Notes 1. When the internal high-speed RAM area is accessed or instruction that performs no data access is
executed.
2. When an area except the internal high-speed RAM area is accessed
3. Except “r = A”

Remarks 1. One instruction clock cycle is one cycle of the CPU clock (fCPU) selected by the processor clock
control register (PCC).
2. This clock cycle applies to the internal ROM program.
3. n is the number of waits when external memory expansion area is read from.

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 CHAPTER 27 INSTRUCTION SET OVERVIEW

Instruction Clocks Flag

Mnemonic Operands Bytes Operation
Group Note 1 Note 2 Z AC CY
8-bit OR A, #byte 2 4 – A ← A byte ×
operation saddr, #byte 3 6 8 (saddr) ← (saddr) byte ×
A, r Note 3 2 4 – A←A r ×
r, A 2 4 – r←r A ×
A, saddr 2 4 5 A ← A (saddr) ×
A, !addr16 3 8 9+n A ← A (addr16) ×
A, [HL] 1 4 5+n A ← A (HL) ×
A, [HL + byte] 2 8 9+n A ← A (HL + byte) ×
A, [HL + B] 2 8 9+n A ← A (HL + B) ×
A, [HL + C] 2 8 9+n A ← A (HL + C) ×
XOR A, #byte 2 4 – A←A byte ×
saddr, #byte 3 6 8 (saddr) ← (saddr) byte ×
A, r Note 3 2 4 – A←A r ×
r, A 2 4 – r←r A ×
A, saddr 2 4 5 A←A (saddr) ×
A, !addr16 3 8 9+n A←A (addr16) ×
A, [HL] 1 4 5+n A←A (HL) ×
A, [HL + byte] 2 8 9+n A←A (HL + byte) ×
A, [HL + B] 2 8 9+n A←A (HL + B) ×
A, [HL + C] 2 8 9+n A←A (HL + C) ×
CMP A, #byte 2 4 – A – byte × × ×
saddr, #byte 3 6 8 (saddr) – byte × × ×
A, r Note 3 2 4 – A–r × × ×
r, A 2 4 – r–A × × ×
A, saddr 2 4 5 A – (saddr) × × ×
A, !addr16 3 8 9+n A – (addr16) × × ×
A, [HL] 1 4 5+n A – (HL) × × ×
A, [HL + byte] 2 8 9+n A – (HL + byte) × × ×
A, [HL + B] 2 8 9+n A – (HL + B) × × ×
A, [HL + C] 2 8 9+n A – (HL + C) × × ×

Notes 1. When the internal high-speed RAM area is accessed or instruction that performs no data access is
executed.
2. When an area except the internal high-speed RAM area is accessed
3. Except “r = A”

Remarks 1. One instruction clock cycle is one cycle of the CPU clock (fCPU) selected by the processor clock
control register (PCC).
2. This clock cycle applies to the internal ROM program.
3. n is the number of waits when external memory expansion area is read from.

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 CHAPTER 27 INSTRUCTION SET OVERVIEW

Instruction Clocks Flag

Mnemonic Operands Bytes Operation
Group Note 1 Note 2 Z AC CY
16-bit ADDW AX, #word 3 6 – AX, CY ← AX + word × × ×
operation SUBW AX, #word 3 6 – AX, CY ← AX – word × × ×
CMPW AX, #word 3 6 – AX – word × × ×
Multiply/ MULU X 2 16 – AX ← A × X
divide DIVUW C 2 25 – AX (Quotient), C (Remainder) ← AX ÷ C
Increment/ INC r 1 2 – r←r+1 × ×
decrement saddr 2 4 6 (saddr) ← (saddr) + 1 × ×
DEC r 1 2 – r←r–1 × ×
saddr 2 4 6 (saddr) ← (saddr) – 1 × ×
INCW rp 1 4 – rp ← rp + 1
DECW rp 1 4 – rp ← rp – 1
Rotate ROR A, 1 1 2 – (CY, A7 ← A0, Am – 1 ← Am) × 1 time ×
ROL A, 1 1 2 – (CY, A0 ← A7, Am + 1 ← Am) × 1 time ×
RORC A, 1 1 2 – (CY ← A0, A7 ← CY, Am – 1 ← Am) × 1 time ×
ROLC A, 1 1 2 – (CY ← A7, A0 ← CY, A m + 1 ← Am) × 1 time ×
ROR4 [HL] 2 10 12 + n + m A3 – 0 ← (HL)3 – 0, (HL)7 – 4 ← A3 – 0,
(HL)3 – 0 ← (HL)7 – 4
ROL4 [HL] 2 10 12 + n + m A3 – 0 ← (HL)7 – 4, (HL)3 – 0 ← A3 – 0,
(HL)7 – 4 ← (HL)3 – 0
BCD ADJBA 2 4 – Decimal Adjust Accumulator after × × ×
adjust Addition
ADJBS 2 4 – Decimal Adjust Accumulator after × × ×
Subtract
Bit MOV1 CY, saddr.bit 3 6 7 CY ← (saddr.bit) ×
manipu- CY, sfr.bit 3 – 7 CY ← sfr.bit ×
lation
CY, A.bit 2 4 – CY ← A.bit ×
CY, PSW.bit 3 – 7 CY ← PSW.bit ×
CY, [HL].bit 2 6 7+n CY ← (HL).bit ×
saddr.bit, CY 3 6 8 (saddr.bit) ← CY
sfr.bit, CY 3 – 8 sfr.bit ← CY
A.bit, CY 2 4 – A.bit ← CY
PSW.bit, CY 3 – 8 PSW.bit ← CY × ×
[HL].bit, CY 2 6 8+n+m (HL).bit ← CY

Notes 1. When the internal high-speed RAM area is accessed or instruction that performs no data access is
executed.
2. When an area except the internal high-speed RAM area is accessed

Remarks 1. One instruction clock cycle is one cycle of the CPU clock (fCPU) selected by the processor clock
control register (PCC).
2. This clock cycle applies to the internal ROM program.
3. n is the number of waits when external memory expansion area is read from.
4. m is the number of waits when external memory expansion area is written to.

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 CHAPTER 27 INSTRUCTION SET OVERVIEW

Instruction Clocks Flag

Mnemonic Operands Bytes Operation
Group Note 1 Note 2 Z AC CY
Bit AND1 CY, saddr.bit 3 6 7 CY ← CY (saddr.bit) ×
manipu- CY, sfr.bit 3 – 7 CY ← CY sfr.bit ×
lation
CY, A.bit 2 4 – CY ← CY A.bit ×
CY, PSW.bit 3 – 7 CY ← CY PSW.bit ×
CY, [HL].bit 2 6 7+n CY ← CY (HL).bit ×
OR1 CY, saddr.bit 3 6 7 CY ← CY (saddr.bit) ×
CY, sfr.bit 3 – 7 CY ← CY sfr.bit ×
CY, A.bit 2 4 – CY ← CY A.bit ×
CY, PSW.bit 3 – 7 CY ← CY PSW.bit ×
CY, [HL].bit 2 6 7+n CY ← CY (HL).bit ×
XOR1 CY, saddr.bit 3 6 7 CY ← CY (saddr.bit) ×
CY, sfr.bit 3 – 7 CY ← CY sfr.bit ×
CY, A.bit 2 4 – CY ← CY A.bit ×
CY, PSW.bit 3 – 7 CY ← CY PSW.bit ×
CY, [HL].bit 2 6 7+n CY ← CY (HL).bit ×
SET1 saddr.bit 2 4 6 (saddr.bit) ← 1
sfr.bit 3 – 8 sfr.bit ← 1
A.bit 2 4 – A.bit ← 1
PSW.bit 2 – 6 PSW.bit ← 1 × × ×
[HL].bit 2 6 8 + n + m (HL).bit ← 1

CLR1 saddr.bit 2 4 6 (saddr.bit) ← 0

sfr.bit 3 – 8 sfr.bit ← 0
A.bit 2 4 – A.bit ← 0
PSW.bit 2 – 6 PSW.bit ← 0 × × ×
[HL].bit 2 6 8 + n + m (HL).bit ← 0

SET1 CY 1 2 – CY ← 1 1
CLR1 CY 1 2 – CY ← 0 0
NOT1 CY 1 2 – CY ← CY ×

Notes 1. When the internal high-speed RAM area is accessed or instruction that performs no data access is
executed.
2. When an area except the internal high-speed RAM area is accessed

Remarks 1. One instruction clock cycle is one cycle of the CPU clock (fCPU) selected by the processor clock
control register (PCC).
2. This clock cycle applies to the internal ROM program.
3. n is the number of waits when external memory expansion area is read from.
4. m is the number of waits when external memory expansion area is written to.

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Instruction Clocks Flag

Mnemonic Operands Bytes Operation
Group Note 1 Note 2 Z AC CY
Call/return CALL !addr16 3 7 – (SP – 1) ← (PC + 3)H, (SP – 2) ← (PC + 3)L,
PC ← addr16, SP ← SP – 2
CALLF !addr11 2 5 – (SP – 1) ← (PC + 2)H, (SP – 2) ← (PC + 2)L,
PC15 – 11 ← 00001, PC10 – 0 ← addr11,
SP ← SP – 2
CALLT [addr5] 1 6 – (SP – 1) ← (PC + 1)H, (SP – 2) ← (PC + 1)L,
PCH ← (00000000, addr5 + 1),
PCL ← (00000000, addr5),
SP ← SP – 2
BRK 1 6 – (SP – 1) ← PSW, (SP – 2) ← (PC + 1)H,
(SP – 3) ← (PC + 1)L, PCH ← (003FH),
PCL ← (003EH), SP ← SP – 3, IE ← 0
RET 1 6 – PCH ← (SP + 1), PCL ← (SP),
SP ← SP + 2
RETI 1 6 – PCH ← (SP + 1), PCL ← (SP),
PSW ← (SP + 2), SP ← SP + 3, R R R
NMIS ← 0
RETB 1 6 – PCH ← (SP + 1), PCL ← (SP), R R R
PSW ← (SP + 2), SP ← SP + 3
Stack PUSH PSW 1 2 – (SP – 1) ← PSW, SP ← SP – 1
manipu- rp 1 4 – (SP – 1) ← rpH, (SP – 2) ← rpL,
lation SP ← SP – 2
POP PSW 1 2 – PSW ← (SP), SP ← SP + 1 R R R
rp 1 4 – rpH ← (SP + 1), rpL ← (SP),
SP ← SP + 2
MOVW SP, #word 4 – 10 SP ← word
SP, AX 2 – 8 SP ← AX
AX, SP 2 – 8 AX ← SP
Uncondi- BR !addr16 3 6 – PC ← addr16
tional $addr16 2 6 – PC ← PC + 2 + jdisp8
branch
AX 2 8 – PCH ← A, PCL ← X
Conditional BC $addr16 2 6 – PC ← PC + 2 + jdisp8 if CY = 1
branch BNC $addr16 2 6 – PC ← PC + 2 + jdisp8 if CY = 0
BZ $addr16 2 6 – PC ← PC + 2 + jdisp8 if Z = 1
BNZ $addr16 2 6 – PC ← PC + 2 + jdisp8 if Z = 0

Notes 1. When the internal high-speed RAM area is accessed or instruction that performs no data access is
executed.
2. When an area except the internal high-speed RAM area is accessed

Remarks 1. One instruction clock cycle is one cycle of the CPU clock (fCPU) selected by the processor clock
control register (PCC).
2. This clock cycle applies to the internal ROM program.

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Instruction Clocks Flag

Mnemonic Operands Bytes Operation
Group Note 1 Note 2 Z AC CY
Condi- BT saddr.bit, $addr16 3 8 9 PC ← PC + 3 + jdisp8 if (saddr.bit) = 1
tional sfr.bit, $addr16 4 – 11 PC ← PC + 4 + jdisp8 if sfr.bit = 1
branch
A.bit, $addr16 3 8 – PC ← PC + 3 + jdisp8 if A.bit = 1
PSW.bit, $addr16 3 – 9 PC ← PC + 3 + jdisp8 if PSW.bit = 1
[HL].bit, $addr16 3 10 11 + n PC ← PC + 3 + jdisp8 if (HL).bit = 1
BF saddr.bit, $addr16 4 10 11 PC ← PC + 4 + jdisp8 if (saddr.bit) = 0
sfr.bit, $addr16 4 – 11 PC ← PC + 4 + jdisp8 if sfr.bit = 0
A.bit, $addr16 3 8 – PC ← PC + 3 + jdisp8 if A.bit = 0
PSW.bit, $addr16 4 – 11 PC ← PC + 4 + jdisp8 if PSW. bit = 0
[HL].bit, $addr16 3 10 11 + n PC ← PC + 3 + jdisp8 if (HL).bit = 0
BTCLR saddr.bit, $addr16 4 10 12 PC ← PC + 4 + jdisp8
if (saddr.bit) = 1
then reset (saddr.bit)
sfr.bit, $addr16 4 – 12 PC ← PC + 4 + jdisp8 if sfr.bit = 1
then reset sfr.bit
A.bit, $addr16 3 8 – PC ← PC + 3 + jdisp8 if A.bit = 1
then reset A.bit
PSW.bit, $addr16 4 – 12 PC ← PC + 4 + jdisp8 if PSW.bit = 1 × × ×
then reset PSW.bit
[HL].bit, $addr16 3 10 12 + n + m PC ← PC + 3 + jdisp8 if (HL).bit = 1
then reset (HL).bit
DBNZ B, $addr16 2 6 – B ← B – 1, then
PC ← PC + 2 + jdisp8 if B ≠ 0
C, $addr16 2 6 – C ← C –1, then
PC ← PC + 2 + jdisp8 if C ≠ 0
saddr, $addr16 3 8 10 (saddr) ← (saddr) – 1, then
PC ← PC + 3 + jdisp8 if (saddr) ≠ 0
CPU SEL RBn 2 4 – RBS1, 0 ← n
control NOP 1 2 – No Operation
EI 2 – 6 IE ← 1 (Enable Interrupt)
DI 2 – 6 IE ← 0 (Disable Interrupt)
HALT 2 6 – Set HALT Mode
STOP 2 6 – Set STOP Mode

Notes 1. When the internal high-speed RAM area is accessed or instruction that performs no data access is
executed.
2. When an area except the internal high-speed RAM area is accessed

Remarks 1. One instruction clock cycle is one cycle of the CPU clock (fCPU) selected by the processor clock
control register (PCC).
2. This clock cycle applies to the internal ROM program.
3. n is the number of waits when external memory expansion area is read from.
4. m is the number of waits when external memory expansion area is written to.

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27.3 Instructions Listed by Addressing Type

(1) 8-bit instructions

MOV, XCH, ADD, ADDC, SUB, SUBC, AND, OR, XOR, CMP, MULU, DIVUW, INC, DEC, ROR, ROL, RORC,
ROLC, ROR4, ROL4, PUSH, POP, DBNZ

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Second Operand [HL + byte]

#byte A rNote sfr saddr !addr16 PSW [DE] [HL] [HL + B] $addr16 1 None
First Operand [HL + C]
A ADD MOV MOV MOV MOV MOV MOV MOV MOV ROR
ADDC XCH XCH XCH XCH XCH XCH XCH ROL
SUB ADD ADD ADD ADD ADD RORC
SUBC ADDC ADDC ADDC ADDC ADDC ROLC
AND SUB SUB SUB SUB SUB
OR SUBC SUBC SUBC SUBC SUBC
XOR AND AND AND AND AND
CMP OR OR OR OR OR
XOR XOR XOR XOR XOR
CMP CMP CMP CMP CMP
r MOV MOV INC
ADD DEC
ADDC
SUB
SUBC
AND
OR
XOR
CMP

B, C DBNZ
sfr MOV MOV
saddr MOV MOV DBNZ INC
ADD DEC
ADDC
SUB
SUBC
AND
OR
XOR
CMP

!addr16 MOV
PSW MOV MOV PUSH
POP
[DE] MOV

[HL] MOV ROR4

ROL4
[HL + byte] MOV
[HL + B]
[HL + C]
X MULU

C DIVUW

Note Except r = A

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(2) 16-bit instructions

MOVW, XCHW, ADDW, SUBW, CMPW, PUSH, POP, INCW, DECW

Second Operand
#word AX rp Note sfrp saddrp !addr16 SP None
1st Operand
AX ADDW MOVW MOVW MOVW MOVW MOVW
SUBW XCHW
CMPW

rp MOVW MOVWNote INCW

DECW
PUSH
POP
sfrp MOVW MOVW
saddrp MOVW MOVW

!addr16 MOVW
SP MOVW MOVW

Note Only when rp = BC, DE, HL

(3) Bit manipulation instructions

MOV1, AND1, OR1, XOR1, SET1, CLR1, NOT1, BT, BF, BTCLR

Second Operand
A.bit sfr.bit saddr.bit PSW.bit [HL].bit CY $addr16 None
First Operand

A.bit MOV1 BT SET1

BF CLR1
BTCLR
sfr.bit MOV1 BT SET1
BF CLR1
BTCLR
saddr.bit MOV1 BT SET1
BF CLR1
BTCLR

PSW.bit MOV1 BT SET1

BF CLR1
BTCLR
[HL].bit MOV1 BT SET1
BF CLR1
BTCLR
CY MOV1 MOV1 MOV1 MOV1 MOV1 SET1
AND1 AND1 AND1 AND1 AND1 CLR1
OR1 OR1 OR1 OR1 OR1 NOT1
XOR1 XOR1 XOR1 XOR1 XOR1

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(4) Call/instructions/branch instructions

CALL, CALLF, CALLT, BR, BC, BNC, BZ, BNZ, BT, BF, BTCLR, DBNZ

Second Operand
AX !addr16 !addr11 [addr5] $addr16
First Operand
Basic instruction BR CALL CALLF CALLT BR
BR BC
BNC
BZ
BNZ

Compound BT
instruction BF
BTCLR
DBNZ

(5) Other instructions

ADJBA, ADJBS, BRK, RET, RETI, RETB, SEL, NOP, EI, DI, HALT, STOP

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Absolute Maximum Ratings (TA = 25°C)

Parameter Symbol Conditions Ratings Unit

Supply voltage VDD –0.3 to +6.5 V

AVREF0 –0.3 to VDD + 0.3 V
AVREF1 –0.3 to VDD + 0.3 V

AVSS –0.3 to +0.3 V

Input voltage VI1 P00 to P05, P07, P10 to P17, P20 to P27, P30 to P37, –0.3 to VDD + 0.3 V
P40 to P47, P50 to P57, P64 to P67, P70 to P72,
P120 to P127, P130, P131, X1, X2, XT2, RESET
VI2 P60 to P63 N-ch open drain –0.3 to +16 V

Output voltage VO –0.3 to VDD + 0.3 V

Analog input voltage V AN P10 to P17 Analog input pin AVSS – 0.3 to AVREF0 + 0.3 V
Output IOH Per pin –10 mA
current, high
Total for P01 to P05, P30 to P37, P56, P57, P60 to P67, –15 mA
P120 to P127
Total for P10 to P17, P20 to P27, P40 to P47, –15 mA
P50 to P55, P70 to P72, P130, P131
Output IOLNote Per pin for other than P50 to P57, Peak value 20 mA
current, low P60 to P63 rms value 15 mA
Per pin for P50 to P57, P60 to P63 Peak value 30 mA
rms value 10 mA

Total for P50 to P55 Peak value 100 mA

rms value 70 mA
Total for P56, P57, P60 to P63 Peak value 100 mA

rms value 70 mA
Total for P10 to P17, P20 to P27, Peak value 50 mA
P40 to P47, P70 to P72, P130, P131 rms value 20 mA

Total for P01 to P05, P30 to P37, Peak value 50 mA

P64 to P67, P120 to P127 rms value 20 mA
Operating ambient TA –40 to +85 °C
temperature
Storage Tstg –65 to +150 °C
temperature

Note The rms value should be calculated as follows: [rms value] = [Peak value] × √Duty

Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions that
ensure that the absolute maximum ratings are not exceeded.

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Main System Clock Oscillator Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)

Resonator Recommended Circuit Parameter Conditions MIN. TYP. MAX. Unit

Ceramic X2 X1 IC Oscillation VDD = Oscillation 1.0 5.0 MHz
resonator frequency (fX)Note 1 voltage range
Oscillation After VDD reaches 4 ms
C2 C1
stabilization timeNote 2 oscillation voltage range
MIN.

Crystal X2 X1 IC Oscillation 1.0 5.0 MHz

resonator frequency (fX)Note 1
Oscillation VDD = 4.5 to 5.5 V 10 ms
C2 C1
stabilization timeNote 2 VDD = 1.8 to 5.5 V 30

External X1 input 1.0 5.0 MHz

X2 X1
clock frequency (fX)Note 1
X1 input 85 500 ns
high-/low-level width
(tXH , tXL)

Notes 1. Indicates only oscillator characteristics. See AC Characteristics for instruction execution time.
2. Time required to stabilize oscillation after reset or STOP mode release.

Cautions 1. When using the main system clock oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.

• Keep the wiring length as short as possible.

• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as VSS1.
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.

2. When the main system clock is stopped and the system is operating on the subsystem clock,
wait until the oscillation stabilization time has been secured by the program before switching
back to the main system clock.

Remark For the resonator selection and oscillator constant, customers are requested to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.

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Subsystem Clock Oscillator Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)

Resonator Recommended Circuit Parameter Conditions MIN. TYP. MAX. Unit

Crystal IC XT2 XT1 Oscillation 32 32.768 35 kHz
resonator R2 frequency (fXT)Note 1
Oscillation VDD = 4.5 to 5.5 V 1.2 2 s
C4 C3
stabilization timeNote 2 VDD = 1.8 to 5.5 V 10

External XT1 input 32 35 kHz

XT2 XT1
clock frequency (fXT)Note 1
XT1 input 12 15 µs
high-/low-level width
(tXTH , tXTL)

Notes 1. Indicates only oscillator characteristics. See AC Characteristics for instruction execution time.
2. Time required to stabilize oscillation after VDD reaches oscillation voltage MIN.

Cautions 1. When using the subsystem clock oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.

• Keep the wiring length as short as possible.

• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as VSS1.
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.

2. The subsystem clock oscillator is designed as a low-amplitude circuit for reducing current
consumption, and is more prone to malfunction due to noise than the main system clock
oscillator. Particular care is therefore required with the wiring method when the subsystem
clock is used.

Remark For the resonator selection and oscillator constant, customers are requested to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.

Capacitance (TA = 25°C, VDD = VSS = 0 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Input CIN f = 1 MHz 15 pF

capacitance Unmeasured pins returned to 0 V.
I/O CIO f = 1 MHz P01 to P05, P10 to P17, 15 pF
capacitance Unmeasured pins returned P20 to P27, P30 to P37,
to 0 V. P40 to P47, P50 to P57,
P64 to P67, P70 to P72,
P120 to P127, P130, P131
P60 to P63 20 pF

Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of port pins.

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DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Input voltage, VIH1 P10 to P17, P21, P23, P30 to P32, VDD = 2.7 to 5.5 V 0.7VDD VDD V
high P35 to P37, P40 to P47,
P50 to P57, P64 to P67, P71, VDD = 1.8 to 5.5 V 0.8VDD VDD V
P120 to P127, P130, P131
VIH2 P00 to P05, P20, P22, P24 to P27, VDD = 2.7 to 5.5 V 0.8VDD VDD V
P33, P34, P70, P72, RESET VDD = 1.8 to 5.5 V 0.85VDD VDD V
VIH3 P60 to P63 VDD = 2.7 to 5.5 V 0.7VDD 15 V
(N-ch open drain) VDD = 1.8 to 5.5 V 0.8VDD 15 V
VIH4 X1, X2 VDD = 2.7 to 5.5 V VDD – 0.5 VDD V
VDD = 1.8 to 5.5 V VDD – 0.2 VDD V
VIH5 XT1/P07, XT2 4.5 V ≤ VDD ≤ 5.5 V 0.8VDD VDD V
2.7 V ≤ VDD < 4.5 V 0.9VDD VDD V
1.8 V ≤ VDD < 2.7 VNote 0.9VDD VDD V
Input voltage, VIL1 P10 to P17, P21, P23, P30 to P32, VDD = 2.7 to 5.5 V 0 0.3VDD V
low P35 to P37, P40 to P47,
P50 to P57, P64 to P67, P71, VDD = 1.8 to 5.5 V 0 0.2VDD V
P120 to P127, P130, P131
VIL2 P00 to P05, P20, P22, P24 to P27, VDD = 2.7 to 5.5 V 0 0.2VDD V
P33, P34, P70, P72, RESET VDD = 1.8 to 5.5 V 0 0.15VDD V
VIL3 P60 to P63 4.5 V ≤ VDD ≤ 5.5 V 0 0.3VDD V
2.7 V ≤ VDD < 4.5 V 0 0.2VDD V
1.8 V ≤ VDD < 2.7 V 0 0.1VDD V
VIL4 X1, X2 VDD = 2.7 to 5.5 V 0 0.4 V
VDD = 1.8 to 5.5 V 0 0.2 V
VIL5 XT1/P07, XT2 4.5 V ≤ VDD ≤ 5.5 V 0 0.2VDD V
2.7 V ≤ VDD < 4.5 V 0 0.1VDD V
1.8 V ≤ VDD < 2.7 VNote 0 0.1VDD V
Output voltage, VOH VDD = 4.5 to 5.5 V, IOH = –1 mA VDD – 1.0 V
high VDD = 1.8 to 5.5 V, IOH = –100 µA VDD – 0.5 V
Output voltage, VOL1 P50 to P57, P60 to P63 VDD = 4.5 to 5.5 V, 0.4 2.0 V
low IOL = 15 mA
P01 to P05, P10 to P17, P20 to VDD = 4.5 to 5.5 V, 0.4 V
P27, P30 to P37, P40 to P47, IOL = 1.6 mA
P64 to P67, P70 to P72, P120 to
P127, P130, P131
VOL2 SB0, SB1, SCK0 VDD = 4.5 to 5.5 V, 0.2VDD V
open drain,
pulled-up (R = 1 kΩ)
VOL3 IOL = 400 µA 0.5 V

Note When P07/XT1 pin is used as P07, the inverse phase of P07 should be input to XT2 pin using an inverter.

Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of port pins.

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DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Input leakage ILIH1 VIN = VDD P00 to P05, P10 to P17, P20 to P27, 3 µA
current, high P30 to P37, P40 to P47, P50 to P57,
P60 to P67, P70 to P72, P120 to
P127, P130, P131, RESET
ILIH2 X1, X2, XT1/P07, XT2 20 µA
ILIH3 VIN = 15 V P60 to P63 80 µA
Input leakage ILIL1 VIN = 0 V P00 to P05, P10 to P17, P20 to P27, –3 µA
current, low P30 to P37, P40 to P47, P50 to P57,
P64 to P67, P70 to P72,
P120 to P127, P130, P131, RESET
ILIL2 X1, X2, XT1/P07, XT2 –20 µA
ILIL3 P60 to P63 –3 Note µA
Mask option pull-up R1 VIN = 0 V, P60 to P63 20 40 120 kΩ
resistor
Software pull-up R2 VIN = 0 V, P01 to P05, P10 to P17, P20 to P27, 15 30 90 kΩ
resistor P30 to P37, P40 to P47, P50 to P57, P64 to P67,
P70 to P72, P120 to P127, P130, P131

Note When pull-up resistors are not connected to P60 to P63 (specified by the mask option), a low-level input
leakage current of –200 µA (MAX.) flows only for 1.5 clocks (without wait) after a read instruction has been
executed to port 6 (P6) or port mode register 6 (PM6). At times other than this 1.5-clock interval, a –3 µA
(MAX.) current flows.

Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of port pins.

DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Output current, high IOH Per pin –1 mA
Total for all pins –15 mA
Output current, low IOL Per pin for P01 to P05, P10 to P17, P20 to P27, 10 mA
P30 to P37, P40 to P47, P50 to P57, P64 to P67,
P70 to P72, P120 to P127, P130, P131
Per pin for P50 to P57, P60 to P63 15 mA
Total for P10 to P17, P20 to P27, P40 to P47, 10 mA
P70 to P72, P130, P131
Total for P01 to P05, P30 to P37, P64 to P67, 10 mA
P120 to P127
Total for P50 to P57, P60 to P63 70 mA

Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of port pins.

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DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Power supply IDD1 5.0 MHz crystal oscillation VDD = 5.0 V ±10%Note 1 3.5 7.7 mA
currentNote 5 operating mode
VDD = 3.0 V ±10%Note 2 0.92 2.2 mA
(fXX = 2.5 MHz)Note 3
VDD = 2.0 V ±10%Note 2 0.47 1.2 mA
5.0 MHz crystal oscillation VDD = 5.0 V ±10%Note 1 6.1 12.3 mA
operating mode
(fXX = 5.0 MHz)Note 4 VDD = 3.0 V ±10%Note 2 1.6 3.5 mA
IDD2 5.0 MHz crystal oscillation VDD = 5.0 V ±10%
HALT mode
Peripheral functions 5.5 mA
(fXX = 2.5 MHz)Note 3
operating
Peripheral functions 0.97 2.4 mA
not operating
VDD = 3.0 V ±10%
Peripheral functions 2.1 mA
operating
Peripheral functions 0.38 0.92 mA
not operating
VDD = 2.0 V ±10%
Peripheral functions 1.1 mA
operating
Peripheral functions 0.19 0.46 mA
not operating
5.0 MHz crystal oscillation VDD = 5.0 V ±10%
HALT mode
(fXX = 5.0 MHz)Note 4 Peripheral functions 7.5 mA
operating
Peripheral functions 1.2 2.9 mA
not operating
VDD = 3.0 V ±10%
Peripheral functions 3.3 mA
operating
Peripheral functions 0.48 1.2 mA
not operating
IDD3 32.768 kHz crystal oscillation VDD = 5.0 V ±10% 46 92 µA
operating modeNote 6
VDD = 3.0 V ±10% 25 50 µA
VDD = 2.0 V ±10% 12.5 25 µA
IDD4 32.768 kHz crystal oscillation VDD = 5.0 V ±10% 22.5 50 µA
HALT modeNote 6
VDD = 3.0 V ±10% 3.2 13.2 µA
VDD = 2.0 V ±10% 1.5 11.5 µA
IDD5 XT1 = VDD VDD = 5.0 V ±10% 1.0 30 µA
STOP mode
When feedback resistor is used VDD = 3.0 V ±10% 0.5 10 µA
VDD = 2.0 V ±10% 0.3 10 µA
IDD6 XT1 = VDD VDD = 5.0 V ±10% 0.1 30 µA
STOP mode
When feedback resistor is not VDD = 3.0 V ±10% 0.05 10 µA
used VDD = 2.0 V ±10% 0.05 10 µA

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Notes 1. High-speed mode operation (when the processor clock control register (PCC) is cleared to 00H).
2. Low-speed mode operation (when the PCC is set to 04H).
3. Operation with main system clock fXX = fX/2 (when the oscillation mode select register (OSMS) is cleared
to 00H)
4. Operation with main system clock fXX = fX (when OSMS is set to 01H)
5. Refer to the current flowing to the VDD0 and VDD1 pins. The current flowing to the A/D converter, D/A
converter, and on-chip pull-up resistor is not included.
6. When the main system clock operation is stopped.

AC Characteristics

(1) Basic operation (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Cycle time TCY Operating with main system VDD = 2.7 to 5.5 V 0.8 64 µs
(Minimum clock (fXX = 2.5 MHz)Note 1 VDD = 1.8 to 5.5 V 2.0 64 µs
instruction
Operating with main system 3.5 V ≤ VDD ≤ 5.5 V 0.4 32 µs
execution time)
clock (fXX = 5.0 MHz)Note 2 2.7 V ≤ VDD < 3.5 V 0.8 32 µs
Operating on subsystem clock 40Note 3 122 125 µs
TI00 input high-/ tTIH00 3.5 V ≤ VDD ≤ 5.5 V 2/fsam + 0.1Note 4 µs
low-level width tTIL00 2.7 V ≤ VDD < 3.5 V 2/fsam + 0.2Note 4 µs
1.8 V ≤ VDD < 2.7 V 2/fsam + 0.5Note 4 µs
TI01 input high-/ tTIH01 VDD = 2.7 to 5.5 V 10 µs
low-level width tTIL01 VDD = 1.8 to 5.5 V 20 µs
TI1, TI2 input fTI1 VDD = 4.5 to 5.5 V 0 4 MHz
frequency VDD = 1.8 to 5.5 V 0 275 kHz
TI1, TI2 input tTIH1 VDD = 4.5 to 5.5 V 100 ns
high-/low-level tTIL1 VDD = 1.8 to 5.5 V 1.8 µs
width
Interrupt request tINTH INTP0 3.5 V ≤ VDD ≤ 5.5 V 2/fsam + 0.1Note 4 µs
input high-/ tINTL 2.7 V ≤ VDD < 3.5 V 2/fsam + 0.2Note 4 µs
low-level width 1.8 V ≤ VDD < 2.7 V 2/fsam + 0.5Note 4 µs
INTP1 to INTP5, P40 to P47 VDD = 2.7 to 5.5 V 10 µs
VDD = 1.8 to 5.5 V 20 µs
RESET low- tRSL VDD = 2.7 to 5.5 V 10 µs
level width
VDD = 1.8 to 5.5 V 20 µs

Notes 1. Operation with main system clock fXX = fX/2 (when the oscillation mode select register (OSMS) is cleared
to 00H)
2. Operation with main system clock fXX = fX (when OSMS is set to 01H)
3. Value when external clock is used. When a crystal resonator is used, it is 114 µs (MIN.)
4. Selection of fsam = fXX/2N, fXX/32, fXX/64, and fXX/128 is possible with bits 0 and 1 (SCS0, SCS1) of the sampling
clock select register (SCS) (when N = 0 to 4).

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TCY vs. VDD (@fXX = fX/2 main system clock operation) TCY vs. VDD (@fXX = fX main system clock operation)

60 60

10 10

Operation guaranteed Operation

Cycle time TCY [µs]

Cycle time TCY [µs]

range guaranteed
range

2.0 2.0

1.0 1.0

0.5 0.5
0.4 0.4

0 0
1 2 3 4 5 6 1 2 3 4 5 6
Supply voltage VDD [V] Supply voltage VDD [V]

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(2) Read/write operation

(a) When MCS = 1, PCC2 to PCC0 = 000B (TA = –40 to +85°C, VDD = 3.5 to 5.5 V)

Parameter Symbol Conditions MIN. MAX. Unit

ASTB high-level width tASTH 0.85tCY – 50 ns

Address setup time tADS 0.85tCY – 50 ns

Address hold time tADH 50 ns

Time from address to data input tADD1 (2.85 + 2n)tCY – 80 ns

tADD2 (4 + 2n)tCY – 100 ns

Time from RD↓ to data input tRDD1 (2 + 2n)tCY – 100 ns

tRDD2 (2.85 + 2n)tCY – 100 ns

Read data hold time tRDH 0 ns

RD low-level width tRDL1 (2 + 2n)tCY – 60 ns

tRDL2 (2.85 + 2n)tCY – 60 ns

Time from RD↓ to WAIT↓ input tRDWT1 0.85tCY – 50 ns

tRDWT2 2tCY – 60 ns

Time from WR↓ to WAIT↓ input tWRWT 2tCY – 60 ns

WAIT low-level width tWTL (1.15 + 2n)tCY (2 + 2n)tCY ns

Write data setup time tWDS (2.85 + 2n)tCY – 100 ns

Write data hold time tWDH 20 ns

WR low-level width tWRL (2.85 + 2n)tCY – 60 ns

Delay time from ASTB↓ to RD↓ tASTRD 25 ns

Delay time from ASTB↓ to WR↓ tASTWR 0.85tCY + 20 ns

Delay time from RD↑ to ASTB↑ tRDAST 0.85tCY – 10 1.15tCY + 20 ns

at external fetch

Time from RD↑ to address hold tRDADH 0.85tCY – 50 1.15tCY + 50 ns

at external fetch

Time from RD↑ to write data output tRDWD 40 ns

Time from WR↓ to write data output tWRWD 0 50 ns

Time from WR↑ to address hold tWRADH 0.85tCY 1.15tCY + 40 ns

Delay time from WAIT↑ to RD↑ tWTRD 1.15tCY + 40 3.15tCY + 40 ns

Delay time from WAIT↑ to WR↑ tWTWR 1.15tCY + 30 3.15tCY + 30 ns

Remarks 1. MCS: Bit 0 of the oscillation mode select register (OSMS)

2. PCC2 to PCC0: Bits 2 to 0 of the processor clock control register (PCC)
3. tCY = TCY/4
4. n indicates the number of waits.

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(b) When MCS = 0 or PCC2 to PCC0 ≠ 000B (TA = –40 to +85°C, VDD = 2.7 to 5.5 V)

Parameter Symbol Conditions MIN. MAX. Unit

ASTB high-level width tASTH tCY – 80 ns

Address setup time tADS tCY – 80 ns
Address hold time tADH 0.4tCY – 10 ns
Time from address to data input tADD1 (3 + 2n)tCY – 160 ns
tADD2 (4 + 2n)tCY – 200 ns
Time from RD↓ to data input tRDD1 (1.4 + 2n)tCY – 70 ns
tRDD2 (2.4 + 2n)tCY – 70 ns
Read data hold time tRDH 0 ns
RD low-level width tRDL1 (1.4 + 2n)tCY – 20 ns
tRDL2 (2.4 + 2n)tCY – 20 ns
Time from RD↓ to WAIT↓ input tRDWT1 tCY – 100 ns
tRDWT2 2tCY – 100 ns
Time from WR↓ to WAIT↓ input tWRWT 2tCY – 100 ns
WAIT low-level width tWTL (1 + 2n)tCY (2 + 2n)tCY ns
Write data setup time tWDS (2.4 + 2n)tCY – 60 ns
Write data hold time tWDH 20 ns
WR low-level width tWRL (2.4 + 2n)tCY – 20 ns
Delay time from ASTB↓ to RD↓ tASTRD 0.4tCY – 30 ns
Delay time from ASTB↓ to WR↓ tASTWR 1.4tCY – 30 ns
Delay time from RD↑ to tRDAST tCY – 10 tCY + 20 ns
ASTB↑ at external fetch
Time from RD↑ to address tRDADH tCY – 50 tCY + 50 ns
hold at external fetch
Time from RD↑ to write data tRDWD 0.4tCY – 20 ns
output
Time from WR↓ to write data tWRWD 0 60 ns
output
Time from WR↑ to address hold tWRADH tCY tCY + 60 ns
Delay time from WAIT↑ to RD↑ tWTRD 0.6tCY + 180 2.6tCY + 180 ns
Delay time from WAIT↑ to WR↑ tWTWR 0.6tCY + 120 2.6tCY + 120 ns

Remarks 1. MCS: Bit 0 of the oscillation mode select register (OSMS)

2. PCC2 to PCC0: Bits 2 to 0 of the processor clock control register (PCC)
3. tCY = TCY/4
4. n indicates the number of waits.

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(c) When MCS = 0 or PCC2 to PCC0 ≠ 000B (TA = –40 to +85°C, VDD = 1.8 to 2.7 V)

Parameter Symbol Conditions MIN. MAX. Unit

ASTB high-level width tASTH tCY – 150 ns

Address setup time tADS tCY – 150 ns
Address hold time tADH 0.37tCY – 40 ns
Time from address to data input tADD1 (3 + 2n)tCY – 320 ns
tADD2 (4 + 2n)tCY – 300 ns
Time from RD↓ to data input tRDD1 (1.37 + 2n)tCY – 120 ns
tRDD2 (2.37 + 2n)tCY – 120 ns
Read data hold time tRDH 0 ns
RD low-level width tRDL1 (1.37 + 2n)tCY – 20 ns
tRDL2 (2.37 + 2n)tCY – 20 ns
Time from RD↓ to WAIT↓ input tRDWT1 tCY – 200 ns
tRDWT2 2tCY – 200 ns
Time from WR↓ to WAIT↓ input tWRWT 2tCY – 200 ns
WAIT low-level width tWTL (1 + 2n)tCY (2 + 2n)tCY ns
Write data setup time tWDS (2.37 + 2n)tCY – 100 ns
Write data hold time tWDH 20 ns
WR low-level width tWRL (2.37 + 2n)tCY – 20 ns
Delay time from ASTB↓ to RD↓ tASTRD 0.37tCY – 50 ns
Delay time from ASTB↓ to WR↓ tASTWR 1.37tCY – 50 ns
Delay time from RD↑ to ASTB at tRDAST tCY – 10 tCY + 20 ns
external fetch
Time from RD↑ to address hold tRDADH tCY – 50 tCY + 50 ns
at external fetch
Time from RD↑ to write data output tRDWD 0.37tCY – 40 ns
Time from WR↓ to write data output tWRWD 0 120 ns
Time from WR↑ to address hold tWRADH tCY tCY + 120 ns
Delay time from WAIT↑ to RD↑ tWTRD 0.63tCY + 350 2.63tCY + 350 ns
Delay time from WAIT↑ to WR↑ tWTWR 0.63tCY + 240 2.63tCY + 240 ns

Remarks 1. MCS: Bit 0 of the oscillation mode select register (OSMS)

2. PCC2 to PCC0: Bits 2 to 0 of the processor clock control register (PCC)
3. tCY = TCY/4
4. n indicates the number of waits.

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(3) Serial interface (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)

(a) Serial interface channel 0

(i) 3-wire serial I/O mode (SCK0 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY1 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.0 V ≤ VDD < 2.7 V 3,200 ns
1.8 V ≤ VDD < 2.0 V 4,800 ns
SCK0 high-/low-level tKH1, tKL1 VDD = 4.5 to 5.5 V tKCY1/2 – 50 ns
width VDD = 1.8 to 5.5 V tKCY1/2 – 100 ns
SI0 setup time tSIK1 4.5 V ≤ VDD ≤ 5.5 V 100 ns
(to SCK0↑)
2.7 V ≤ VDD < 4.5 V 150 ns
2.0 V ≤ VDD < 2.7 V 300 ns
1.8 V ≤ VDD < 2.0 V 400 ns
SI0 hold time tKSI1 400 ns
(from SCK0↑)
Delay time from SCK0↓ tKSO1 C = 100 pFNote 300 ns
to SO0 output

Note C is the load capacitance of the SCK0 and SO0 output lines.

(ii) 3-wire serial I/O mode (SCK0 ... External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY2 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.0 V ≤ VDD < 2.7 V 3,200 ns
1.8 V ≤ VDD < 2.0 V 4,800 ns
SCK0 high-/low-level tKH2, tKL2 4.5 V ≤ VDD ≤ 5.5 V 400 ns
width 2.7 V ≤ VDD < 4.5 V 800 ns
2.0 V ≤ VDD < 2.7 V 1,600 ns
1.8 V ≤ VDD < 2.0 V 2,400 ns
SI0 setup time tSIK2 2.0 V ≤ VDD ≤ 5.5 V 100 ns
(to SCK0↑) 1.8 V ≤ VDD < 2.0 V 150 ns
SI0 hold time tKSI2 400 ns
(from SCK0↑)
Delay time from SCK0↓ tKSO2 C = 100 pFNote VDD = 2.0 to 5.5V 300 ns
to SO0 output VDD = 1.8 to 5.5V 500 ns
SCK0 rise/fall time tR2, tF2 When using external device 160 ns
expansion function

When not using external device 1,000 ns

expansion function

Note C is the load capacitance of the SO0 output line.

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(iii) 2-wire serial I/O mode (SCK0 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY3 R = 1 kΩ, 2.7 V ≤ VDD ≤ 5.5 V 1,600 ns
C = 100 pFNote 2.0 V ≤ VDD < 2.7 V 3,200 ns

1.8 V ≤ VDD < 2.0 V 4,800 ns

SCK0 high-level width tKH3 VDD = 2.7 to 5.5 V tKCY3/2 – 160 ns

VDD = 1.8 to 5.5 V tKCY3/2 – 190 ns

SCK0 low-level width tKL3 VDD = 4.5 to 5.5 V tKCY3/2 – 50 ns

VDD = 1.8 to 5.5 V tKCY3/2 – 100 ns

SB0, SB1 setup time tSIK3 4.5 V ≤ VDD ≤ 5.5 V 300 ns

(to SCK0↑) 2.7 V ≤ VDD < 4.5 V 350 ns

2.0 V ≤ VDD < 2.7 V 400 ns

1.8 V ≤ VDD < 2.0 V 500 ns
SB0, SB1 hold time tKSI3 600 ns
(from SCK0↑) ns
Delay time from SCK0↓ tKSO3 0 300 ns
to SB0, SB1 output

Note R and C are the load resistance and load capacitance of the SCK0, SB0, and SB1 output lines.
(iv) 2-wire serial I/O mode (SCK0 ... Internal clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY4 2.7 V ≤ VDD ≤ 5.5 V 1,600 ns

2.0 V ≤ VDD < 2.7 V 3,200 ns

1.8 V ≤ VDD < 2.0 V 4,800 ns

SCK0 high-level width tKH4 2.7 V ≤ VDD ≤ 5.5 V 650 ns

2.0 V ≤ VDD < 2.7 V 1,300 ns

1.8 V ≤ VDD < 2.0 V 2,100 ns

SCK0 low-level width tKL4 2.7 V ≤ VDD ≤ 5.5 V 800 ns

2.0 V ≤ VDD < 2.7 V 1,600 ns

1.8 V ≤ VDD < 2.0 V 2,400 ns

SB0, SB1 setup time tSIK4 VDD = 2.0 to 5.5 V 100 ns

(to SCK0↑) VDD = 1.8 to 5.5 V 150 ns

SB0, SB1 hold time tKSI4 tKCY4/2 ns

(from SCK0↑)

Delay time from SCK0↓ tKSO4 R = 1 kΩ, 4.5 V ≤ VDD ≤ 5.5 V 0 300 ns
to SB0, SB1 output C = 100 pFNote 2.0 V ≤ VDD < 4.5 V 0 500 ns

1.8 V ≤ VDD < 2.0 V 0 800 ns

SCK0 rise/fall time tR4, tF4 When using external device 160 ns
expansion function

When not using external device 1,000 ns

expansion function

Note R and C are the load resistance and load capacitance of the SB0 and SB1 output lines.

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(v) SBI mode (SCK0 ... Internal clock output) (µPD78005x only)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY5 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.0 V ≤ VDD < 4.5 V 3,200 ns
1.8 V ≤ VDD < 2.0 V 4,800 ns
SCK0 high-/low-level tKH5, tKL5 4.5 V ≤ VDD ≤ 5.5 V tKCY5/2 – 50 ns
width 1.8 V ≤ VDD < 4.5 V tKCY5/2 – 150 ns
SB0, SB1 setup time tSIK5 4.5 V ≤ VDD ≤ 5.5 V 100 ns
(to SCK0↑) 2.0 V ≤ VDD < 4.5 V 300 ns
1.8 V ≤ VDD < 2.0 V 400 ns
SB0, SB1 hold time tKSI5 tKCY5/2 ns
(from SCK0↑)
Delay time from SCK0↓ tKSO5 R = 1 kΩ, VDD = 4.5 to 5.5 V 0 250 ns
to SB0, SB1 output C = 100 pFNote VDD = 1.8 to 5.5 V 0 1,000 ns
SB0, SB1↓ from SCK0↑ tKSB tKCY5 ns
SCK0↓ from SB0, SB1↓ tSBK tKCY5 ns
SB0, SB1 high-level width tSBH tKCY5 ns
SB0, SB1 low-level width tSBL tKCY5 ns

Note R and C are the load resistance and load capacitance of the SCK0, SB0, and SB1 output lines.

(vi) SBI mode (SCK0 ... External clock input) (µPD78005x only)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY6 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.0 V ≤ VDD < 4.5 V 3,200 ns
1.8 V ≤ VDD < 2.0 V 4,800 ns
SCK0 high-/low-level tKH6, tKL6 4.5 V ≤ VDD ≤ 5.5 V 400 ns
width 2.0 V ≤ VDD < 4.5 V 1,600 ns
1.8 V ≤ VDD < 2.0 V 2,400 ns
SB0, SB1 setup time tSIK6 4.5 V ≤ VDD ≤ 5.5 V 100 ns
(to SCK0↑) 2.0 V ≤ VDD < 4.5 V 300 ns
1.8 V ≤ VDD < 2.0 V 400 ns
SB0, SB1 hold time tKSI6 tKCY6/2 ns
(from SCK0↑)
Delay time from SCK0↓ tKSO6 R = 1 kΩ, VDD = 4.5 to 5.5 V 0 300 ns
to SB0, SB1 output C = 100 pFNote VDD = 1.8 to 5.5 V 0 1,000 ns
SB0, SB1↓ from SCK0↑ tKSB tKCY6 ns
SCK0↓ from SB0, SB1↓ tSBK tKCY6 ns
SB0, SB1 high-level width tSBH tKCY6 ns
SB0, SB1 low-level width tSBL tKCY6 ns
SCK0 rise/fall time tR6, tF6 When using external device 160 ns
expansion function
When not using external device 1,000 ns
expansion function

Note R and C are the load resistance and load capacitance of the SB0 and SB1 output lines.

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(vii) I2C bus mode (SCL ... Internal clock output) (µPD78005xY only)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCL cycle time tKCY7 R = 1 KΩ, 2.7 V ≤ V DD ≤ 5.5 V 10 µs
C = 100 pFNote 2.0 V ≤ VDD < 2.7 V 20 µs
1.8 V ≤ VDD < 2.0 V 30 µs
SCL high-level width tKH7 VDD = 2.7 to 5.5 V tKCY7 – 160 ns
VDD = 1.8 to 5.5 V tKCY7 – 190 ns
SCL low-level width tKL7 VDD = 4.5 to 5.5 V tKCY7 – 50 ns
VDD = 1.8 to 5.5 V tKCY7 – 100 ns
SDA0, SDA1 setup time tSIK7 2.7 V ≤ V DD ≤ 5.5 V 200 ns
(to SCL↑) 2.0 V ≤ VDD < 2.7 V 300 ns
1.8 V ≤ VDD < 2.0 V 400 ns
SDA0, SDA1 hold time tKSI7 0 ns
(from SCL↓)
Delay time from SCL↓ tKSO7 4.5 V ≤ V DD ≤ 5.5 V 0 300 ns
to SDA0, SDA1 output 2.0 V ≤ VDD < 4.5 V 0 500 ns
1.8 V ≤ VDD < 2.0 V 0 600 ns
SDA0, SDA1↓ from SCL↑ or tKSB 200 ns
SDA0, SDA1↑ from SCL↓
SCL↓ from SDA0, SDA1↓ tSBK VDD = 2.0 to 5.5 V 400 ns
VDD = 1.8 to 5.5 V 500 ns
SDA0, SDA1 high-level width tSBH 500 ns

Note R and C are the load resistance and load capacitance of the SCL, SDA0, and SDA1 output lines.

(viii) I2C bus mode (SCL ... External clock input) (µPD78005xY only)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCL cycle time tKCY8 1,000 ns
SCL high-/low-level width tKH8, VDD = 2.0 to 5.5 V 400 ns
tKL8 VDD = 1.8 to 5.5 V 600 ns
SDA0, SDA1 setup time tSIK8 VDD = 2.0 to 5.5 V 200 ns
(to SCL↑) VDD = 1.8 to 5.5 V 300 ns
SDA0, SDA1 hold time tKSI8 0 ns
(from SCL↓)
Delay time from SCL↓ tKSO8 R = 1 kΩ, 4.5 V ≤ V DD ≤ 5.5 V 0 300 ns
to SDA0, SDA1 output C = 100 pFNote 2.0 V ≤ VDD < 4.5 V 0 500 ns
1.8 V ≤ VDD < 2.0 V 0 600 ns
SDA0, SDA1↓ from SCL↑ or tKSB 200 ns
SDA0, SDA1↑ from SCL↑
SCL↓ from SDA0, SDA1↓ tSBK VDD = 2.0 to 5.5 V 400 ns
VDD = 1.8 to 5.5 V 500 ns
SDA0, SDA1 high-level width tSBH VDD = 2.0 to 5.5 V 500 ns
VDD = 1.8 to 5.5 V 800 ns
SCL rise/fall time tR8, When using external device expansion 160 ns
tF8 function
When not using external device 1 µs
expansion function

Note R and C are the load resistance and load capacitance of the SDA0 and SDA1 output lines.

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(b) Serial interface channel 1

(i) 3-wire serial I/O mode (SCK1 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK1 cycle time tKCY9 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.0 V ≤ VDD < 2.7 V 3,200 ns
1.8 V ≤ VDD < 2.0 V 4,800 ns
SCK1 high/low-level width tKH9, tKL9 VDD = 4.5 to 5.5 V tKCY9/2 – 50 ns
VDD = 1.8 to 5.5 V tKCY9/2 – 100 ns
SI1 setup time (to SCK1↑) tSIK9 4.5 V ≤ VDD ≤ 5.5 V 100 ns
2.7 V ≤ VDD < 4.5 V 150 ns
2.0 V ≤ VDD < 2.7 V 300 ns
1.8 V ≤ VDD < 2.0 V 400 ns
SI1 hold time (from SCK1↑) tKSI9 400 ns
Delay time from SCK1↓ to SO1 tKSO9 C = 100 pFNote 300 ns
output

Note C is the load capacitance of the SCK1 and SO1 output lines.

(ii) 3-wire serial I/O mode (SCK1 ... External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK1 cycle time tKCY10 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.0 V ≤ VDD < 2.7 V 3,200 ns
1.8 V ≤ VDD < 2.0 V 4,800 ns
SCK1 high/low-level width tKH10,tKL10 4.5 V ≤ VDD ≤ 5.5 V 400 ns
2.7 V ≤ VDD < 4.5 V 800 ns
2.0 V ≤ VDD < 2.7 V 1,600 ns
1.8 V ≤ VDD < 2.0 V 2,400 ns
SI1 setup time (to SCK1↑) tSIK10 VDD = 2.0 to 5.5 V 100 ns
VDD = 1.8 to 5.5 V 150 ns
SI1 hold time (from SCK1↑) tKIS10 400 ns
Delay time from SCK1↓ to SO1 tKSO10 C = 100 pFNote VDD = 2.0 to 5.5 V 300 ns
output VDD = 1.8 to 5.5 V 500 ns
SCK1 rise/fall time tR10, tF10 When using external device 160 ns
expansion function
When not using external device 1,000 ns
expansion function

Note C is the load capacitance of the SO1 output line.

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(iii) 3-wire serial I/O mode with automatic transmit/receive function (SCK1 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK1 cycle time tKCY11 4.5 V ≤ V DD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.0 V ≤ VDD < 2.7 V 3,200 ns
1.8 V ≤ VDD < 2.0 V 4,800 ns
SCK1 high-/low-level width tKH11,tKL11 VDD = 4.5 to 5.5 V tKCY11/2 – 50 ns
VDD = 1.8 to 5.5 V tKCY11/2 – 100 ns
SI1 setup time (to SCK1↑) tSIK11 4.5 V ≤ V DD ≤ 5.5 V 100 ns
2.7 V ≤ VDD < 4.5 V 150 ns
2.0 V ≤ VDD < 2.7 V 300 ns
1.8 V ≤ VDD < 2.0 V 400 ns
SI1 hold time (from SCK1↑) tKSI11 400 ns
Delay time from SCK1↓ to SO1 tKSO11 C = 100 pFNote 300 ns
output
STB↑ from SCK1↑ tSBD tKCY11/2 – 100 tKCY11/2 + 100 ns
Strobe signal high-level width tSBW 2.7 V ≤ VDD < 5.5 V tKCY11 – 30 tKCY11 + 30 ns
2.0 V < VDD < 2.7 V tKCY11 – 60 tKCY11 + 60 ns
1.8 V ≤ VDD < 2.0 V tKCY11 – 90 tKCY11 + 90 ns
Busy signal setup time tBYS 100 ns
(to busy signal detection timing)
Busy signal hold time tBYH 4.5 V ≤ V DD ≤ 5.5 V 100 ns
(from busy signal detection timing) 2.7 V ≤ VDD < 4.5 V 150 ns
2.0 V ≤ VDD < 2.7 V 200 ns
1.8 V ≤ VDD < 2.0 V 300 ns

SCK1↓ from busy inactive tSPS 2tKCY11 ns

Note C is the load capacitance of the SCK1 and SO1 output lines.

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(iv) 3-wire serial I/O mode with automatic transmit/receive function (SCK1...External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK1 cycle time tKCY12 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.0 V ≤ VDD < 2.7 V 3,200 ns
1.8 V ≤ VDD < 2.0 V 4,800 ns
SCK1 high-/low-level width tKH12, 4.5 V ≤ VDD ≤ 5.5 V 400 ns
tKL12 2.7 V ≤ VDD < 4.5 V 800 ns
2.0 V ≤ VDD < 2.7 V 1,600 ns
1.8 V ≤ VDD < 2.0 V 2,400 ns
SI1 setup time (to SCK1↑) tSIK12 VDD = 2.0 to 5.5 V 100 ns
VDD = 1.8 to 5.5 V 150 ns
SI1 hold time (from SCK1↑) tKSI12 400 ns
Delay time from SCK1↓ to SO1 tKSO12 C = 100 pFNote VDD = 2.0 to 5.5 V 300 ns
output VDD = 1.8 to 5.5 V 500 ns
SCK1 rise/fall time tR12, tF12 When using external device 160 ns
expansion function
When not using external device 1,000 ns
expansion function

Note C is the load capacitance of the SO1 output line.

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(c) Serial interface channel 2

(i) 3-wire serial I/O mode (SCK2...Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK2 cycle time tKCY13 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.0 V ≤ VDD < 2.7 V 3,200 ns
1.8 V ≤ VDD < 2.0 V 4,800 ns
SCK2 high-/low-level width tKH13, VDD = 4.5 to 5.5 V tKCY13/2 – 50 ns
tKL13 VDD = 1.8 to 5.5 V tKCY13/2 – 100 ns
SI2 setup time (to SCK2↑) tSIK13 4.5 V ≤ VDD ≤ 5.5 V 100 ns
2.7 V ≤ VDD < 4.5 V 150 ns
2.0 V ≤ VDD < 2.7 V 300 ns
1.8 V ≤ VDD < 2.0 V 400 ns
SI2 hold time (from SCK2↑) tKSI13 400 ns
Delay time from SCK2↓ to SO2 tKSO13 C = 100 pFNote 300 ns
output

Note C is the load capacitance of the SO2 output line.

(ii) 3-wire serial I/O mode (SCK2...External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK2 cycle time tKCY14 4.5 V ≤ V DD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.0 V ≤ VDD < 2.7 V 3,200 ns
1.8 V ≤ VDD < 2.0 V 4,800 ns
SCK2 high-/low-level width tKH14, 4.5 V ≤ V DD ≤ 5.5 V 400 ns
tKL14 2.7 V ≤ VDD < 4.5 V 800 ns
2.0 V ≤ VDD < 2.7 V 1,600 ns
1.8 V ≤ VDD < 2.0 V 2,400 ns
SI2 setup time (to SCK2↑) tSIK14 VDD = 2.0 to 5.5 V 100 ns
VDD = 1.8 to 5.5 V 150 ns
SI2 hold time (from SCK2↑) tKSI14 400 ns
Delay time from SCK2↓ to SO2 tKSO14 C = 100 pFNote VDD = 2.0 to 5.5 V 300 ns
output VDD = 2.0 to 5.5 V 500 ns
SCK2 rise/fall time tR14, Other than below 160 ns
tF14 VDD = 4.5 to 5.5 V 1 µs
When not using external device
expansion function

Note C is the load capacitance of the SO2 output line.

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(iii) UART mode (dedicated baud rate generator output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Transfer rate 4.5 V ≤ VDD ≤ 5.5 V 78,125 bps
2.7 V ≤ VDD < 4.5 V 39,063 bps

2.0 V ≤ VDD < 2.7 V 19,531 bps

1.8 V ≤ VDD < 2.0 V 9,766 bps

(iv) UART mode (external clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

ASCK cycle time tKCY15 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.0 V ≤ VDD < 2.7 V 3,200 ns
1.8 V ≤ VDD < 2.0 V 4,800 ns
ASCK high-/low-level width tKH15, 4.5 V ≤ VDD ≤ 5.5 V 400 ns
tKL15 2.7 V ≤ VDD < 4.5 V 800 ns
2.0 V ≤ VDD < 2.7 V 1,600 ns
1.8 V ≤ VDD < 2.0 V 2,400 ns
Transfer rate 4.5 V ≤ VDD ≤ 5.5 V 39,063 bps
2.7 V ≤ VDD < 4.5 V 19,531 bps
2.0 V ≤ VDD < 2.7 V 9,766 bps
1.8 V ≤ VDD < 2.0 V 6,510 bps
ASCK rise/fall time tR15, VDD = 4.5 to 5.5 V, 1,000 ns
tF15 when not using external device
expansion function.
Other than above 160 ns

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AC Timing Measurement Points (Excluding X1, XT1 Inputs)

0.8VDD Point of 0.8VDD

0.2VDD measurement 0.2VDD

Clock Timing

1/fX

tXL tXH

VIH4 (MIN.)
X1 input
VIL4 (MAX.)

1/fXT

tXTL tXTH

VIH5 (MIN.)
XT1 input
VIL5 (MAX.)

TI Timing

tTIL00, tTIL01 tTIH00, tTIH01

TI00, TI01

1/fTI1

tTIL1 tTIH1

TI1, TI2

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Interrupt Request Input Timing

tINTL tINTH

INTP0 to INTP5,
P40 to P47

RESET Input Timing

tRSL

RESET

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Read/Write Operation

External fetch (no wait):

A8 to A15 Higher 8-bit address

tADD1
Lower Hi-Z
AD0 to AD7 8-bit Operation
address code
tADS tRDD1 tRDADH
tADH
tASTH
tRDAST
ASTB

RD

tASTRD tRDL1 tRDH

External fetch (wait insertion):

A8 to A15 Higher 8-bit address

tADD1
Lower Hi-Z Operation
AD0 to AD7 8-bit
address code
tADS tRDD1 tRDADH
tADH
tASTH
tRDAST
ASTB

RD

tASTRD tRDL1 tRDH

WAIT
tWTRD
tRDWT1 tWTL

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External data access (no wait):

A8 to A15 Higher 8-bit address

tADD2
Lower Hi-Z Hi-Z Hi-Z
AD0 to AD7 8-bit Read data Write data
address
tADS tRDD2
tADH tRDH
tASTH
ASTB

RD
tASTRD tWDH
tRDL2 tRDWD tWDS
tWRADH
tWRWD
WR

tASTWR tWRL

External data access (wait insertion):

A8 to A15 Higher 8-bit address

tADD2
Lower Hi-Z Hi-Z Hi-Z
AD0 to AD7 8-bit Read data Write data
address
tADS tRDD2
tADH tRDH
tASTH
ASTB

tASTRD

RD
tWDH
tRDL2 tRDWD tWDS

tWDWR
WR

tASTWR tWRL tWRADH

WAIT
tRDWT2 tWTRD
tWTL tWRWT tWTL tWTWR

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Serial Transfer Timing

3-wire serial I/O mode:

tKCYm

tKLm tKHm
tRn tFn

SCK0 to SCK2

tSIKm tKSIm

SI0 to SI2 Input data

tKSOm

SO0 to SO2 Output data

m = 1, 2, 9, 10, 13, 14
n = 2, 10, 14

2-wire serial I/O mode:

tKCY3, 4

tKL3, 4 tKH3, 4
tR4 tF4

SCK0

tSIK3, 4 tKSI3, 4
tKSO3, 4

SB0, SB1

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SBI mode (bus release signal transfer):

tKCY5, 6

tKL5, 6 tKH5, 6
tR6 tF6

SCK0

tKSB tSBL tSBH tSBK tSIK5, 6 tKSI5, 6

SB0, SB1

tKSO5, 6

SBI mode (command signal transfer):

tKCY5,6

tKL5, 6 tKH5, 6
tF6
tR6

SCK0

tSIK5, 6
tKSB tSBK tKSI5, 6

SB0, SB1

tKSO5, 6

I2C bus mode:

tF8 tR8
tKCYm

SCL
tKSB
tSIKm tKSB
tKLm tKHm
tKSIm
tKSOm tSBK

SDA0,
SDA1

tSBH tSIKm

m = 7, 8

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3-wire serial I/O mode with automatic transmit/receive function:

SO1 D2 D1 D0 D7

SI1 D2 D1 D0 D7

tSIK11, 12 tKSI11, 12
tKH11, 12
tKSO11, 12 tF12

SCK1
tR12
tSBD tSBW
tKL11, 12

tKCY11, 12
STB

3-wire serial I/O mode with automatic transmit/receive function (busy processing):

SCK1 7 8 9Note 10Note 10 + nNote 1

tBYS tBYH tSPS

BUSY
(Active high)

Note The signal is not actually driven low here; it is shown as such to indicate the timing.

UART mode (external clock input):

t KCY15

t KL15 t KH15
tR15 tF15

ASCK

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A/D Converter Characteristics

(µPD780053, 780053(A), 780054, 780054(A), 780055, 780055(A), 780056, 780056(A), 780058B, 780058B(A),
780053Y, 780053Y(A), 780054Y, 780054Y(A), 780055Y, 780055Y(A), 780056Y, 780056Y(A), 780058BY,
780058BY(A))
(TA = –40 to +85°C, VDD = 1.8 to 5.5 V, AVSS = VSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Resolution 8 8 8 bit
Overall errorNote 1 1.8 V ≤ AVREF0 < 2.7 V ±1.4 %FSR
2.7 V ≤ AVREF0 ≤ 5.5 V ±0.6 %FSR
Conversion time TCONV1 1.8 V ≤ AVREF0 < 2.7 V 40 100 µs
TCONV2 2.7 V ≤ AVREF0 ≤ 5.5 V 16 100 µs
Analog input voltage VIAN AVSS AVREF0 V
Reference voltage AVREF0 1.8 VDD V
AVREF0 current IREF0 When A/D converter is operatingNote 2 500 1,500 µA
When A/D converter is not operatingNote 3 0 3 µA

Notes 1. Excludes quantization error (±1/2 LSB). This value is indicated as a ratio to the full-scale value (%FSR).
2. The current flowing to the AVREF0 pin when bit 7 (CS) of the A/D converter mode register (ADM) is 1.
3. The current flowing to the AVREF0 pin when bit 7 (CS) of the A/D converter mode register (ADM) is 0.

A/D Converter Characteristics (µPD780058)

(TA = –40 to +85°C, VDD = 2.7 to 5.5 V, AVSS = VSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Resolution 8 8 8 bit
Overall errorNote 1 ±0.6 %FSR
Conversion time TCONV 16 100 µs
Analog input voltage VIAN AVSS AVREF0 V
Reference voltage AVREF0 2.7 VDD V
AVREF0 current IREF0 When A/D converter is operatingNote 2 500 1,500 µA
When A/D converter is not operatingNote 3 0 3 µA

Notes 1. Excludes quantization error (±1/2 LSB). This value is indicated as a ratio to the full-scale value (%FSR).
2. The current flowing to the AVREF0 pin when bit 7 (CS) of the A/D converter mode register (ADM) is 1.
3. The current flowing to the AVREF0 pin when bit 7 (CS) of the A/D converter mode register (ADM) is 0.

Caution The operating voltage range of the A/D converter and D/A converter of the µPD780058 is VDD = 2.7 to
5.5 V.

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D/A Converter Characteristics

(µPD780053, 780053(A), 780054, 780054(A), 780055, 780055(A), 780056, 780056(A), 780058B, 780058B(A),
780053Y, 780053Y(A), 780054Y, 780054Y(A), 780055Y, 780055Y(A), 780056Y, 780056Y(A), 780058BY,
780058BY(A))
(TA = –40 to +85°C, VDD = 1.8 to 5.5 V, AVSS = VSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Resolution 8 bit
Overall error R=2 MΩNote 1 ±1.2 %
R=4 MΩNote 1 ±0.8 %
R = 10 MΩNote 1 ±0.6 %
Note 1
Settling time C = 30 pF AVREF1 = 1.8 to 2.7 V 10 µs
AVREF1 = 1.8 to 5.5 V 15 µs
Output resistance RO Note 2 8 kΩ
Analog reference voltage AVREF1 1.8 VDD V
AVREF1 current IREF1 Note 2 2.5 mA
Resistance between AVREF1 and AVSS RAIREF1 DACS0, DACS1 = 55HNote 2 4 8 kΩ

Notes 1. R and C are the D/A converter output pin load resistance and load capacitance, respectively.
2. Value for one D/A converter channel

Remark DACS0 and DACS1: D/A conversion value setting registers 0, 1

D/A Converter Characteristics (µPD780058)

(TA = –40 to +85°C, VDD = 2.7 to 5.5 V, AVSS = VSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Resolution 8 bit
Overall error R=2 MΩNote 1 ±1.2 %
R=4 MΩNote 1 0.8 %
R = 10 MΩNote 1 0.6 %
Note 1
Settling time C = 30 pF 15 µs
Output resistance RO Note 2 8 kΩ
Analog reference voltage AVREF1 2.7 VDD V
AVREF1 current IREF1 Note 2 2.5 mA
Resistance between AVREF1 and AVSS RAIREF1 DACS0, DACS1 = 55HNote 2 4 8 kΩ

Notes 1. R and C are the D/A converter output pin load resistance and load capacitance, respectively.
2. Value for one D/A converter channel

Remark DACS0 and DACS1: D/A conversion value setting registers 0, 1

Caution The operating voltage range of the A/D converter and D/A converter of the µPD780058 is VDD = 2.7 to
5.5 V.

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Data Memory STOP Mode Low Supply Voltage Data Retention Characteristics (TA = –40 to +85°C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Data retention supply VDDDR 1.8 5.5 V
voltage

Data retention supply IDDDR VDDDR = 1.8 V 0.1 10 µA

current Subsystem clock stop and feed-back resistor
disconnected

Release signal set time tSREL 0 µs

17
Oscillation stabilization tWAIT Release by RESET 2 /fX ms
wait time
Release by interrupt request Note ms

Note Selection of 212/fXX and 214/fXX to 217/fXX is possible with bits 0 to 2 (OSTS0 to OSTS2) of the oscillation stabilization
time select register (OSTS).

Remark fXX: Main system clock frequency (fX or fX/2)

fX: Main system clock oscillation frequency

Data Retention Timing (STOP Mode Release by RESET)

Internal reset operation

HALT mode

STOP mode Operating mode

Data retention mode

VDD VDDDR
tSREL
STOP instruction execution

RESET

tWAIT

Data Retention Timing (Standby Release Signal: STOP Mode Release by Interrupt Request Signal)

HALT mode

STOP mode Operating mode

Data retention mode

VDD VDDDR
tSREL
STOP instruction execution

Standby release signal

(Interrupt request)

tWAIT

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Absolute Maximum Ratings (TA = 25°C)

Parameter Symbol Conditions Ratings Unit

Supply voltage VDD –0.3 to +6.5 V

VPP Note 1 –0.3 to +10.5 V

AVREF0 –0.3 to VDD + 0.3 V

AVREF1 –0.3 to VDD + 0.3 V
AVSS –0.3 to +0.3 V
Input voltage VI1 P00 to P05, P07, P10 to P17, P20 to P27, P30 to P37, –0.3 to VDD + 0.3 V
P40 to P47, P50 to P57, P64 to P67, P70 to P72,
P120 to P127, P130, P131, X1, X2, XT2, RESET
VI2 P60 to P63 N-ch open drain –0.3 to +16 V
Output voltage VO –0.3 to VDD + 0.3 V

Analog input voltage V AN P10 to P17 Analog input pin AVSS – 0.3 to AVREF0 + 0.3 V
Output IOH Per pin –10 mA
current, high
Total for P01 to P05, P30 to P37, P56, P57, P60 to P67, –15 mA
P120 to P127
Total for P10 to P17, P20 to P27, P40 to P47, –15 mA
P50 to P55, P70 to P72, P130, P131
Output IOLNote 2 Per pin for other than P50 to P57, Peak value 20 mA
current, low P60 to P63 rms value 10 mA

Per pin for P50 to P57, P60 to P63 Peak value 30 mA

rms value 15 mA
Total for P50 to P55 Peak value 100 mA

rms value 70 mA
Total for P56, P57, P60 to P63 Peak value 100 mA
rms value 70 mA

Total for P10 to P17, P20 to P27, Peak value 50 mA

P40 to P47, P70 to P72, P130, P131 rms value 20 mA
Total for P01 to P05, P30 to P37, Peak value 50 mA
P64 to P67, P120 to P127 rms value 20 mA
Operating ambient TA During normal operation –40 to +85 °C
temperature During flash memory programming 10 to 40 °C
Storage Tstg –65 to +125 °C
temperature

(The Note is described on the next page.)

Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions that
ensure that the absolute maximum ratings are not exceeded.

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Notes 1. Make sure that the following conditions of the VPP voltage application timing are satisfied when the flash
memory is written.
- When supply voltage rises
VPP must exceed VDD 10 µs or more after VDD has reached the lower-limit value (2.7 V) of the operating
voltage range (see a in the figure below).
- When supply voltage drops
VDD must be lowered 10 µs or more after VPP falls below the lower-limit value (2.7 V) of the operating
voltage range of VDD (see b in the figure below).

2.7 V
VDD
0V
a b

VPP
2.7 V

0V

2. The rms value should be calculated as follows: [rms value] = [Peak value] × √Duty

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Main System Clock Oscillator Characteristics (TA = –40 to +85°C, VDD = 2.7 to 5.5 V)

Resonator Recommended Circuit Parameter Conditions MIN. TYP. MAX. Unit

Ceramic X2 X1 VPP Oscillation VDD = Oscillation 1.0 5.0 MHz
resonator frequency (fX)Note 1 voltage range
Oscillation After VDD reaches 4 ms
C2 C1
stabilization timeNote 2 oscillation voltage range
MIN.

Crystal X2 X1 VPP Oscillation 1.0 5.0 MHz

resonator frequency (fX)Note 1
Oscillation VDD = 4.5 to 5.5 V 10 ms
C2 C1
stabilization timeNote 2 VDD = 2.7 to 5.5 V 30

External X1 input 1.0 5.0 MHz

clock X2 X1
frequency (fX)Note 1
X1 input 85 500 ns
high-/low-level width
(tXH , tXL)

Notes 1. Indicates only oscillator characteristics. See AC Characteristics for instruction execution time.
2. Time required to stabilize oscillation after reset or STOP mode release.

Cautions 1. When using the main system clock oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.

• Keep the wiring length as short as possible.

• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as VSS1.
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.

2. When the main system clock is stopped and the system is operating on the subsystem clock,
wait until the oscillation stabilization time has been secured by the program before switching
back to the main system clock.

Remark For the resonator selection and oscillator constant, customers are requested to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.

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Subsystem Clock Oscillator Characteristics (TA = –40 to +85°C, VDD = 2.7 to 5.5 V)

Resonator Recommended Circuit Parameter Conditions MIN. TYP. MAX. Unit

Crystal VPP XT2 XT1 Oscillation 32 32.768 35 kHz
resonator R2 frequency (fXT)Note 1
Oscillation VDD = 4.5 to 5.5 V 1.2 2 s
C4 C3
stabilization timeNote 2 10
VDD = 4.5 to 5.5 V

External XT1 input 32 35 kHz

XT2 XT1
clock frequency (fXT)Note 1
XT1 input 12 15 µs
high-/low-level width
(tXTH , tXTL)

Notes 1. Indicates only oscillator characteristics. See AC Characteristics for instruction execution time.
2. Time required to stabilize oscillation after VDD reaches oscillation voltage range MIN.

Cautions 1. When using the subsystem clock oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.

• Keep the wiring length as short as possible.

• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as VSS1.
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.

2. The subsystem clock oscillator is designed as a low-amplitude circuit for reducing current
consumption, and is more prone to malfunction due to noise than the main system clock
oscillator. Particular care is therefore required with the wiring method when the subsystem
clock is used.

Remark For the resonator selection and oscillator constant, customers are requested to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.

Capacitance (TA = 25°C, VDD = VSS = 0 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Input CIN f = 1 MHz 15 pF

capacitance Unmeasured pins returned to 0 V.
I/O CIO f = 1 MHz P01 to P05, P10 to P17, 15 pF
capacitance Unmeasured pins returned P20 to P27, P30 to P37,
to 0 V. P40 to P47, P50 to P57,
P64 to P67, P70 to P72,
P120 to P127, P130, P131
P60 to P63 20 pF

Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of port pins.

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DC Characteristics (TA = –40 to +85°C, VDD = 2.7 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Input voltage, VIH1 P10 to P17, P21, P23, P30 to P32, VDD = 2.7 to 5.5 V 0.7 VDD VDD V
high P35 to P37, P40 to P47,
P50 to P57, P64-P67, P71,
P120 to P127, P130, P131
VIH2 P00 to P05, P20, P22, P24 to P27, VDD = 2.7 to 5.5 V 0.8 VDD VDD V
P33, P34, P70, P72, RESET

VIH3 P60 to P63 VDD = 2.7 to 5.5 V 0.7 VDD 15 V

(N-ch open drain)

VIH4 X1, X2 VDD = 2.7 to 5.5 V VDD – 0.5 VDD V

VIH5 XT1/P07, XT2 4.5 V ≤ VDD ≤ 5.5 V 0.8 VDD VDD V
2.7 V ≤ VDD < 4.5 V 0.9 VDD VDD V
Input voltage, VIL1 P10 to P17, P21, P23, P30 to P32, VDD = 2.7 to 5.5 V 0 0.3 VDD V
low P35 to P37, P40 to P47,
P50 to P57, P64 to P67, P71,
P120 to P127, P130, P131
VIL2 P00 to P05, P20, P22, P24 to P27, VDD = 2.7 to 5.5 V 0 0.2VDD V
P33, P34, P70, P72, RESET
VIL3 P60 to P63 4.5 V ≤ VDD ≤ 5.5 V 0 0.3VDD V
2.7 V ≤ VDD < 4.5 V 0 0.2VDD V
VIL4 X1, X2 VDD = 2.7 to 5.5 V 0 0.4 V
VIL5 XT1/P07, XT2 4.5 V ≤ VDD ≤ 5.5 V 0 0.2VDD V
2.7 V ≤ VDD < 4.5 V 0 0.1VDD V
Output voltage, VOH VDD = 4.5 to 5.5 V, IOH = –1 mA VDD – 1.0 V
high VDD = 2.7 to 5.5 V, IOH = –100 µA VDD – 0.5 V
Output voltage, VOL1 P50 to P57, P60 to P63 VDD = 4.5 to 5.5 V, 0.4 2.0 V
low IOL = 15 mA
P01 to P05, P10 to P17, VDD = 4.5 to 5.5 V, 0.4 V
P20 to P27, P30 to P37, IOL = 1.6 mA
P40 to P47, P64 to P67,
P70 to P72, P120-P127, P130,
P131
VOL2 SB0, SB1, SCK0 VDD = 4.5 to 5.5 V, 0.2 VDD V
open drain,
pulled-up (R = 1 kΩ)
VOL3 IOL = 400 µA 0.5 V

Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of port pins.

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DC Characteristics (TA = –40 to +85°C, VDD = 2.7 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Input leakage ILIH1 VIN = VDD P00 to P05, P10 to P17, P20 to P27, 3 µA
current, high P30 to P37, P40 to P47, P50 to P57,
P60 to P67, P70 to P72,
P120 to P127, P130, P131, RESET
ILIH2 X1, X2, XT1/P07, XT2 20 µA
ILIH3 VIN = 15 V P60 to P63 80 µA
Input leakage ILIL1 VIN = 0 V P00 to P05, P10 to P17, P20 to P27, –3 µA
current, low P30 to P37, P40 to P47, P50 to P57,
P64 to P67, P70 to P72,
P120 to P127, P130, P131, RESET
ILIL2 X1, X2, XT1/P07, XT2 –20 µA
ILIL3 P60-P63 –3 Note µA
Software pull-up R VIN = 0 V, P01 to P05, P10 to P17, P20 to P27, 15 30 90 kΩ
resistor P30 to P37, P40 to P47, P50 to P57, P64 to P67,
P70 to P72, P120 to P127, P130, P131

Note A low-level input leakage current of –200 µA (MAX.) flows only for 1.5 clocks (without wait) after a read
instruction has been executed to port 6 (P6) or port mode register 6 (PM6). At times other than this 1.5-clock
interval, a –3 µA (MAX.) current flows.

Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of port pins.

DC Characteristics (TA = –40 to +85°C, VDD = 2.7 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Output current, high IOH Per pin –1 mA
Total for all pins –15 mA
Output current, low IOL Per pin for P01 to P05, P10 to P17, P20 to P27, 10 mA
P30 to P37, P40 to P47, P50 to P57, P64 to P67,
P70 to P72, P120 to P127, P130, P131
Per pin for P50 to P57, P60 to P63 15 mA

Total for P10 to P17, P20 to P27, P40 to P47, 10 mA

P70 to P72, P130, P131
Total for P01 to P05, P30 to P37, P64 to P67, 10 mA
P120 to P127
Total for P50 to P57, P60 to P63 70 mA

Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of port pins.

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DC Characteristics (TA = –40 to +85°C, VDD = 2.7 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Power supply IDD1Note 5 5.0 MHz crystal oscillation VDD = 5.0 V ±10%Note 1 6.2 12.5 mA
operating mode
current VDD = 3.0 V ±10%Note 2
(fXX = 2.5 MHz)Note 3 1.3 3.1 mA
5.0 MHz crystal oscillation VDD = 5.0 V ±10%Note 1 13.1 25.7 mA
operating mode
(fXX = 5.0 MHz)Note 4 VDD = 3.0 V ±10%Note 2 2.1 4.9 mA
IDD2 5.0 MHz crystal oscillation VDD = 5.0 V ±10%
HALT mode
Peripheral functions 5.6 mA
(fXX = 2.5 MHz)Note 3
operating
Peripheral functions 1.0 2.8 mA
not operating
VDD = 3.0 V ±10%
Peripheral functions 2.9 mA
operating
Peripheral functions 0.44 1.1 mA
not operating
5.0 MHz crystal oscillation VDD = 5.0 V ±10%
HALT mode
(fXX = 5.0 MHz)Note 4 Peripheral functions 8.4 mA
operating
Peripheral functions 1.3 3.1 mA
not operating
VDD = 3.0 V ±10%
Peripheral functions 4.5 mA
operating
Peripheral functions 0.6 1.5 mA
not operating
IDD3Note 5 32.768 kHz crystal oscillation VDD = 5.0 V ±10% 110 220 µA
operating modeNote 6
VDD = 3.0 V ±10% 86 172 µA
IDD4Note 5 32.768 kHz crystal oscillation VDD = 5.0 V ±10% 22.5 50 µA
HALT modeNote 6
VDD = 3.0 V ±10% 3.2 13.2 µA
IDD5Note 5 XT1 = VDD VDD = 5.0 V ±10% 1.0 30 µA
STOP mode
When feedback resistor is used VDD = 3.0 V ±10% 0.5 10 µA
IDD6Note 5 XT1 = VDD VDD = 5.0 V ±10% 0.1 30 µA
STOP mode
VDD = 3.0 V ±10% 0.05 10 µA
When feedback resistor is not
used

Notes 1. High-speed mode operation (when the processor clock control register (PCC) is cleared to 00H).
2. Low-speed mode operation (when PCC is set to 04H).
3. Operation with main system clock fXX = fX/2 (when the oscillation mode select register (OSMS) is cleared
to 00H)
4. Operation with main system clock fXX = fX (when OSMS is set to 01H)
5. Refers to the current flowing to the VDD0 and VDD1 pins. The current flowing to the A/D converter, D/A
converter, and on-chip pull-up resistor is not included.
6. When the main system clock operation is stopped.

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AC Characteristics

(1) Basic operation (TA = –40 to +85°C, VDD = 2.7 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Cycle time TCY Operating with main system VDD = 2.7 to 5.5 V 0.8 64 µs
(Min. instruction clock (fXX = 2.5 MHz)Note 1
execution time)
Operating with main system 3.5 V ≤ VDD ≤ 5.5 V 0.4 32 µs
clock (fXX = 5.0 MHz)Note 2 2.7 V ≤ VDD < 3.5 V 0.8 32 µs
Operating with subsystem clock 40Note 3 122 125 µs
TI00 input high-/ tTIH00 3.5 V ≤ V DD ≤ 5.5 V 2/fsam + 0.1Note 4 µs
low-level width tTIL00 2.7 V ≤ VDD < 3.5 V 2/fsam + 0.2Note 4 µs
TI01 input high-/ tTIH01 VDD = 2.7 to 5.5 V 10 µs
low-level width tTIL01
TI1, TI2 input fTI1 VDD = 4.5 to 5.5 V 0 4 MHz
frequency VDD = 2.7 to 5.5 V 0 275 kHz
TI1, TI2 input tTIH1 VDD = 4.5 to 5.5 V 100 ns
high-/low-level tTIL1 VDD = 2.7 to 5.5 V 1.8 µs
width
Interrupt request tINTH INTP0 3.5 V ≤ VDD ≤ 5.5 V 2/fsam + 0.1Note 4 µs
input high-/ tINTL 2.7 V ≤ VDD < 3.5 V 2/fsam + 0.2Note 4 µs
low-level width INTP1 to INTP5, P40 to P47 VDD = 2.7 to 5.5 V 10 µs
RESET low- tRSL VDD = 2.7 to 5.5 V 10 µs
level width

Notes 1. Operation with main system clock fXX = fX/2 (when the oscillation mode select register (OSMS) is cleared
to 00H)
2. Operation with main system clock fXX = fX (when OSMS is set to 01H)
3. Value when external clock is used. When a crystal resonator is used, it is 114 µs (MIN.)
4. Selection of fsam = fXX/2N, fXX/32, fXX/64, and fXX/128 is possible with bits 0 and 1 (SCS0, SCS1) of the sampling
clock select register (SCS) (when N = 0 to 4).

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TCY vs. VDD (@fXX = fX/2 main system clock operation) TCY vs. VDD (@fXX = fX main system clock operation)

60 60

10 10
Guaranteed
Cycle time TCY [µs]

Operation

Cycle time TCY [µs]

operation
range guaranteed
range

2.0 2.0

1.0 1.0

0.5 0.5
0.4 0.4

0 0
1 2 3 4 5 6 1 2 3 4 5 6
Supply voltage VDD [V] Supply voltage VDD [V]

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(2) Read/write operation

(a) When MCS = 1, PCC2 to PCC0 = 000B (TA = –40 to +85°C, VDD = 3.5 to 5.5 V)

Parameter Symbol Conditions MIN. MAX. Unit

ASTB high-level width tASTH 0.85tCY – 50 ns

Address setup time tADS 0.85tCY – 50 ns

Address hold time tADH 50 ns

Data input time from address tADD1 (2.85 + 2n)tCY – 80 ns

tADD2 (4 + 2n)tCY – 100 ns

Data input time from RD↓ tRDD1 (2 + 2n)tCY – 100 ns

tRDD2 (2.85 + 2n)tCY – 100 ns

Read data hold time tRDH 0 ns

RD low-level width tRDL1 (2 + 2n)tCY – 60 ns

tRDL2 (2.85 + 2n)tCY – 60 ns

WAIT↓ input time from RD↓ tRDWT1 0.85tCY – 50 ns

tRDWT2 2tCY – 60 ns

WAIT↓ input time from WR↓ tWRWT 2tCY – 60 ns

WAIT low-level width tWTL (1.15 + 2n)tCY (2 + 2n)tCY ns

Write data setup time tWDS (2.85 + 2n)tCY – 100 ns

Write data hold time tWDH 20 ns

WR low-level width tWRL (2.85 + 2n)tCY – 60 ns

RD↓ delay time from ASTB↓ tASTRD 25 ns

WR↓ delay time from ASTB↓ tASTWR 0.85tCY + 20 ns

ASTB↑ delay time from tRDAST 0.85tCY – 10 1.15tCY + 20 ns

RD↑ at external fetch

Address hold time from tRDADH 0.85tCY – 50 1.15tCY + 50 ns

RD↑ at external fetch

Write data output time from RD↑ tRDWD 40 ns

Write data output time from WR↓ tWRWD 0 50 ns

Address hold time from WR↑ tWRADH 0.85tCY 1.15tCY + 40 ns

RD↑ delay time from WAIT↑ tWTRD 1.15tCY + 40 3.15tCY + 40 ns

WR↑ delay time from WAIT↑ tWTWR 1.15tCY + 30 3.15tCY + 30 ns

Remarks 1. MCS: Bit 0 of the oscillation mode select register (OSMS)

2. PCC2 to PCC0: Bits 2 to 0 of the processor clock control register (PCC)
3. tCY = TCY/4
4. n indicates the number of waits.

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(b) When MCS = 0 or PCC2 to PCC0 ≠ 000B (TA = –40 to +85°C, VDD = 2.7 to 5.5 V)

Parameter Symbol Conditions MIN. MAX. Unit

ASTB high-level width tASTH tCY – 80 ns

Address setup time tADS tCY – 80 ns
Address hold time tADH 0.4tCY – 10 ns
Data input time from address tADD1 (3 + 2n)tCY – 160 ns
tADD2 (4 + 2n)tCY – 200 ns
Data input time from RD↓ tRDD1 (1.4 + 2n)tCY – 70 ns
tRDD2 (2.4 + 2n)tCY – 70 ns
Read data hold time tRDH 0 ns
RD low-level width tRDL1 (1.4 + 2n)tCY – 20 ns
tRDL2 (2.4 + 2n)tCY – 20 ns
WAIT↓ input time from RD↓ tRDWT1 tCY – 100 ns
tRDWT2 2tCY – 100 ns
WAIT↓ input time from WR↓ tWRWT 2tCY – 100 ns
WAIT low-level width tWTL (1 + 2n)tCY (2 + 2n)tCY ns
Write data setup time tWDS (2.4 + 2n)tCY – 60 ns
Write data hold time tWDH 20 ns
WR low-level width tWRL (2.4 + 2n)tCY – 20 ns
RD↓ delay time from ASTB↓ tASTRD 0.4tCY – 30 ns
WR↓ delay time from ASTB↓ tASTWR 1.4tCY – 30 ns
ASTB↑ delay time from RD↑ tRDAST tCY – 10 tCY + 20 ns
at external fetch
Address hold time from tRDADH tCY – 50 tCY + 50 ns
RD↑ at external fetch
Write data output time from tRDWD 0.4tCY – 20 ns
RD↑
Write data output time from tWRWD 0 60 ns
WR↓
Address hold time from WR↑ tWRADH tCY tCY + 60 ns
RD↑ delay time from WAIT↑ tWTRD 0.6tCY + 180 2.6tCY + 180 ns
WR↑ delay time from WAIT↑ tWTWR 0.6tCY + 120 2.6tCY + 120 ns

Remarks 1. MCS: Bit 0 of the oscillation mode select register (OSMS)

2. PCC2 to PCC0: Bits 2 to 0 of the processor clock control register (PCC)
3. tCY = TCY/4
4. n indicates the number of waits.

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(3) Serial interface (TA = –40 to +85°C, VDD = 2.7 to 5.5 V)

(a) Serial interface channel 0

(i) 3-wire serial I/O mode (SCK0 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY1 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
SCK0 high-/low-level tKH1, tKL1 VDD = 4.5 to 5.5 V tKCY1/2 – 50 ns
width VDD = 2.7 to 5.5 V tKCY1/2 – 100 ns
SI0 setup time tSIK1 4.5 V ≤ VDD ≤ 5.5 V 100 ns
(to SCK0↑) 2.7 V ≤ VDD < 4.5 V 150 ns
SI0 hold time tKSI1 400 ns
(from SCK0↑)

SO0 output delay time tKSO1 C = 100 pFNote 300 ns

from SCK0↓

Note C is the load capacitance of the SCK0 and SO0 output lines.

(ii) 3-wire serial I/O mode (SCK0 ... External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY2 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
SCK0 high-/low-level tKH2, tKL2 4.5 V ≤ VDD ≤ 5.5 V 400 ns
width 2.7 V ≤ VDD < 4.5 V 800 ns
SI0 setup time tSIK2 2.7 V ≤ VDD ≤ 5.5 V 100 ns
(to SCK0↑)

SI0 hold time tKSI2 400 ns

(from SCK0↑)

SO0 output delay time tKSO2 C = 100 pFNote 300 ns

from SCK0↓

SCK0 rise/fall time tR2, tF2 When using external device 160 ns
expansion function
When not using external device 1,000 ns
expansion function

Note C is the load capacitance of the SO0 output line.

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(iii) 2-wire serial I/O mode (SCK0 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY3 R = 1 kΩ, 2.7 V ≤ VDD ≤ 5.5 V 1,600 ns

SCK0 high-level width tKH3 C = 100 pFNote VDD = 2.7 to 5.5 V tKCY3/2 – 160 ns

SCK0 low-level width tKL3 VDD = 4.5 to 5.5 V tKCY3/2 – 50 ns

VDD = 2.7 to 5.5 V tKCY3/2 – 100 ns

SB0, SB1 setup time tSIK3 4.5 V ≤ VDD ≤ 5.5 V 300 ns
(to SCK0↑)
2.7 V ≤ VDD < 4.5 V 350 ns

SB0, SB1 hold time tKSI3 600 ns

(from SCK0↑)
SB0, SB1 output delay tKSO3 0 300 ns
time from SCK0↓

Note R and C are the load resistance and load capacitance of the SCK0, SB0, and SB1 output lines.

(iv) 2-wire serial I/O mode (SCK0 ... External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY4 2.7 V ≤ VDD ≤ 5.5 V 1,600 ns

SCK0 high-level width tKH4 2.7 V ≤ VDD ≤ 5.5 V 650 ns

SCK0 low-level width tKL4 2.7 V ≤ VDD ≤ 5.5 V 800 ns

SB0, SB1 setup time tSIK4 VDD = 2.7 to 5.5 V 100 ns
(to SCK0↑)
SB0, SB1 hold time tKSI4 tKCY4/2 ns
(from SCK0↑)
SB0, SB1 output delay tKSO4 R = 1 kΩ, 4.5 V ≤ VDD ≤ 5.5 V 0 300 ns
time from SCK0↓ C = 100 pFNote
2.7 V ≤ VDD < 4.5 V 0 500 ns

SCK0 rise/fall time tR4, tF4 When using external device 160 ns
expansion function

When not using external device 1,000 ns

expansion function

Note R and C are the load resistance and load capacitance of the SB0 and SB1 output lines.

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(v) SBI mode (SCK0 ... Internal clock output) (µPD78F0058 only)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY5 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 3,200 ns
SCK0 high-/low-level tKH5, tKL5 4.5 V ≤ VDD ≤ 5.5 V tKCY5/2 – 50 ns
width 2.7 V ≤ VDD < 4.5 V tKCY5/2 – 150 ns
SB0, SB1 setup time tSIK5 4.5 V ≤ VDD ≤ 5.5 V 100 ns
(to SCK0↑) 2.7 V ≤ VDD < 4.5 V 300 ns
SB0, SB1 hold time tKSI5 tKCY5/2 ns
(from SCK0↑)
SB0, SB1 output delay tKSO5 R = 1 kΩ, VDD = 4.5 to 5.5 V 0 250 ns
time from SCK0↓ C = 100 pFNote VDD = 2.7 to 5.5 V 0 1,000 ns
SB0, SB1↓ from SCK0↑ tKSB tKCY5 ns
SCK0↓ from SB0, SB1↓ tSBK tKCY5 ns
SB0, SB1 high-level width tSBH tKCY5 ns
SB0, SB1 low-level width tSBL tKCY5 ns

Note R and C are the load resistance and load capacitance of the SCK0, SB0, and SB1 output lines.

(vi) SBI mode (SCK0 ... External clock input) (µPD78F0058 only)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY6 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 3,200 ns
SCK0 high-/low-level tKH6, tKL6 4.5 V ≤ VDD ≤ 5.5 V 400 ns
width 2.7 V ≤ VDD < 4.5 V 1,600 ns
SB0, SB1 setup time tSIK6 4.5 V ≤ VDD ≤ 5.5 V 100 ns
(to SCK0↑) 2.7 V ≤ VDD < 4.5 V 300 ns
SB0, SB1 hold time tKSI6 tKCY6/2 ns
(from SCK0↑)
SB0, SB1 output delay tKSO6 R = 1 kΩ, VDD = 4.5 to 5.5 V 0 300 ns
time from SCK0↓ C = 100 pFNote VDD = 2.7 to 5.5 V 0 1,000 ns
SB0, SB1↓ from SCK0↑ tKSB tKCY6 ns
SCK0↓ from SB0, SB1↓ tSBK tKCY6 ns
SB0, SB1 high-level width tSBH tKCY6 ns
SB0, SB1 low-level width tSBL tKCY6 ns
SCK0 rise/fall time tR6, tF6 When using external device 160 ns
expansion function
When not using external device 1,000 ns
expansion function

Note R and C are the load resistance and load capacitance of the SB0 and SB1 output lines.

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(vii) I2C bus mode (SCL ... Internal clock output) (µPD78F0058Y only)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCL cycle time tKCY7 R = 1 kΩ, 2.7 V ≤ VDD < 5.5 V 10 µs
SCL high-level width tKH7 C = 100 pFNote 2.7 V ≤ VDD < 5.5 V tKCY7 – 160 µs
SCL low-level width tKL7 4.5 V ≤ VDD < 5.5 V tKCY7 – 50 ns
2.7 V ≤ VDD < 4.5 V tKCY7 – 100 ns
SDA0, SDA1 setup time tSIK7 2.7 V ≤ VDD < 5.5 V 200 ns
(to SCL↑)

SDA0, SDA1 hold time tKSI7 0 ns

(from SCL↓)
SDA0, SDA1 output delay tKSO7 4.5 V ≤ VDD < 5.5 V 0 300 ns
time from SCL↓ 2.7 V ≤ VDD < 4.5 V 0 500 ns
SDA0, SDA1↓ from SCL↑ tKSB 200 ns
or SDA0, SDA1↑ from SCL↑
SCL↓ from SDA0, SDA1↓ tSBK 400 ns
SDA0, SDA1 high-level width tSBH 500 ns

Note R and C are the load resistance and load capacitance of the SCL, SDA0, and SDA1 output lines.

(viii) I2C bus mode (SCL ... External clock input) (µPD78F0058Y only)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
SCL cycle time tKCY8 1 µs
SCL high-level width tKH8 400 ns
SDA0, SDA1 setup time tSIK8 200 ns
(to SCL↑)

SDA0, SDA1 hold time tKSI8 0 ns

(from SCL↓)
SDA0, SDA1 output delay tKSO8 R = 1 kΩ, 4.5 V ≤ VDD < 5.5 V 0 300 ns
time from SCL↓ C = 100 pFNote 2.7 V ≤ VDD < 4.5 V 0 500 ns
SDA0, SDA1↓ from SCL↑ tKSB 200 ns
or SDA0, SDA1↑ from SCL↑
SCL↓ from SDA0, SDA1↓ tSBK 400 ns

SDA0, SDA1 high-level width tSBH 500 ns

Note R and C are the load resistance and load capacitance of the SDA0 and SDA1 output lines.

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(b) Serial interface channel 1

(i) 3-wire serial I/O mode (SCK1 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK1 cycle time tKCY9 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
SCK1 high-/low-level width tKH9, tKL9 VDD = 4.5 to 5.5 V tKCY9/2 – 50 ns
VDD = 2.7 to 5.5 V tKCY9/2 – 100 ns
SI1 setup time (to SCK1↑) tSIK9 4.5 V ≤ VDD ≤ 5.5 V 100 ns
2.7 V ≤ VDD < 4.5 V 150 ns
SI1 hold time (from SCK1↑) tKSI9 400 ns
SO1 output delay time from SCK1↓ tKSO9 C = 100 pFNote 300 ns

Note C is the load capacitance of the SCK1 and SO1 output lines.

(ii) 3-wire serial I/O mode (SCK1 ... External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK1 cycle time tKCY10 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
SCK1 high-/low-level width tKH10, tKL10 4.5 V ≤ VDD ≤ 5.5 V 400 ns
2.7 V ≤ VDD < 4.5 V 800 ns
SI1 setup time (to SCK1↑) tSIK10 VDD = 2.7 to 5.5 V 100 ns
SI1 hold time (from SCK1↑) tKIS10 400 ns
SO1 output delay time from SCK1↓ tKSO10 C = 100 pFNote VDD = 2.7 to 5.5 V 300 ns
SCK1 rise/fall time tR10, tF10 When using external device 160 ns
expansion function
When not using external device 1,000 ns
expansion function

Note C is the load capacitance of the SO1 output line.

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(iii) 3-wire serial I/O mode with automatic transmit/receive function (SCK1 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK1 cycle time tKCY11 4.5 V ≤ V DD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
SCK1 high-/low-level width tKH11, tKL11 VDD = 4.5 to 5.5 V tKCY11/2 – 50 ns
VDD = 2.7 to 5.5 V tKCY11/2 – 100 ns
SI1 setup time (to SCK1↑) tSIK11 4.5 V ≤ V DD ≤ 5.5 V 100 ns
2.7 V ≤ VDD < 4.5 V 150 ns
SI1 hold time (from SCK1↑) tKSI11 400 ns
SO1 output delay time from SCK1↓ tKSO11 C = 100 pFNote 300 ns
STB↑ from SCK1↑ tSBD tKCY11/2 – 100 tKCY11/2 + 100 ns
Strobe signal high-level width tSBW 2.7 V ≤ VDD < 5.5 V tKCY11 – 30 tKCY11 + 30 ns
Busy signal setup time tBYS 100 ns
(to busy signal detection timing)
Busy signal hold time tBYH 4.5 V ≤ V DD ≤ 5.5 V 100 ns
(from busy signal detection timing) 2.7 V ≤ VDD < 4.5 V 150 ns

SCK1↓ from busy inactive tSPS 2tKCY11 ns

Note C is the load capacitance of the SCK1 and SO1 output lines.

(iv) 3-wire serial I/O mode with automatic transmit/receive function (SCK1 ... External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK1 cycle time tKCY12 4.5 V ≤ V DD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
SCK1 high-/low-level width tKH12, 4.5 V ≤ V DD ≤ 5.5 V 400 ns
tKL12 2.7 V ≤ VDD < 4.5 V 800 ns
SI1 setup time (to SCK1↑) tSIK12 VDD = 2.7 to 5.5 V 100 ns
SI1 hold time (from SCK1↑) tKSI12 400 ns
SO1 output delay time from SCK1↓ tKSO12 C = 100 pFNote VDD = 2.7 to 5.5 V 300 ns
SCK1 rise/fall time tR12, tF12 When using external device 160 ns
expansion function
When not using external device 1,000 ns
expansion function

Note C is the load capacitance of the SO1 output line.

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(c) Serial interface channel 2

(i) 3-wire serial I/O mode (SCK2 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK2 cycle time tKCY13 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
SCK2 high-/low-level width tKH13, VDD = 4.5 to 5.5 V tKCY13/2 – 50 ns
tKL13 VDD = 2.7 to 5.5 V tKCY13/2 – 100 ns
SI2 setup time (to SCK2↑) tSIK13 4.5 V ≤ VDD ≤ 5.5 V 100 ns
2.7 V ≤ VDD < 4.5 V 150 ns
SI2 hold time (from SCK2↑) tKSI13 400 ns
SO2 output delay time from SCK2↓ tKSO13 C = 100 pFNote 300 ns

Note C is the load capacitance of the SO2 output line.

(ii) 3-wire serial I/O mode (SCK2 ... External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK2 cycle time tKCY14 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
SCK2 high-/low-level width tKH14, 4.5 V ≤ VDD ≤ 5.5 V 400 ns
tKL14 2.7 V ≤ VDD < 4.5 V 800 ns
SI2 setup time (to SCK2↑) tSIK14 VDD = 2.7 to 5.5 V 100 ns
SI2 hold time (from SCK2↑) tKSI14 400 ns
SO2 output delay time from SCK2↓ tKSO14 C = 100 pFNote VDD = 2.7 to 5.5 V 300 ns
SCK2 rise/fall time tR14, Other than below 160 ns
tF14 VDD = 4.5 to 5.5 V 1 µs
When not using external device
expansion function

Note C is the load capacitance of the SO2 output line.

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(iii) UART mode (dedicated baud rate generator output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Transfer rate 4.5 V ≤ VDD ≤ 5.5 V 78,125 bps
2.7 V ≤ VDD < 4.5 V 39,063 bps

(iv) UART mode (external clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

ASCK cycle time tKCY15 4.5 V ≤ V DD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
ASCK high-/low-level width tKH15, tKL15 4.5 V ≤ V DD ≤ 5.5 V 400 ns
2.7 V ≤ VDD < 4.5 V 800 ns
Transfer rate 4.5 V ≤ V DD ≤ 5.5 V 39,063 bps
2.7 V ≤ VDD < 4.5 V 19,531 bps
ASCK rise/fall time tR15, tF15 VDD = 4.5 to 5.5 V, 1,000 ns
when not using external device
expansion function.
Other than above 160 ns

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AC Timing Measurement Points (Excluding X1, XT1 Inputs)

0.8VDD Point of 0.8VDD

0.2VDD measurement 0.2VDD

Clock Timing

1/fX

tXL tXH

VIH4 (MIN.)
X1 input
VIL4 (MAX.)

1/fXT

tXTL tXTH

VIH5 (MIN.)
XT1 input
VIL5 (MAX.)

TI Timing

tTIL00, tTIL01 tTIH00, tTIH01

TI00, TI01

1/fTI1

tTIL1 tTIH1

TI1, TI2

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Interrupt Request Input Timing

tINTL tINTH

INTP0 to INTP5,
P40 to P47

RESET Input Timing

tRSL

RESET

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Read/Write Operation

External fetch (no wait):

A8 to A15 Higher 8-bit address

tADD1
Lower Hi-Z
AD0 to AD7 8-bit Operation
address code
tADS tRDD1 tRDADH
tADH
tASTH
tRDAST
ASTB

RD

tASTRD tRDL1 tRDH

External fetch (wait insertion):

A8 to A15 Higher 8-bit address

tADD1
Lower Hi-Z Operation
AD0 to AD7 8-bit
address code
tADS tRDD1 tRDADH
tADH
tASTH
tRDAST
ASTB

RD

tASTRD tRDL1 tRDH

WAIT
tWTRD
tRDWT1 tWTL

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External data access (no wait):

A8 to A15 Higher 8-bit address

tADD2
Lower Hi-Z Hi-Z Hi-Z
AD0 to AD7 8-bit Read data Write data
address
tADS tRDD2
tADH tRDH
tASTH
ASTB

RD
tASTRD tWDH
tRDL2 tRDWD tWDS
tWRADH
tWRWD
WR

tASTWR tWRL

External data access (wait insertion):

A8 to A15 Higher 8-bit address

tADD2
Lower Hi-Z Hi-Z Hi-Z
AD0 to AD7 8-bit Read data Write data
address
tADS tRDD2
tADH tRDH
tASTH
ASTB

tASTRD

RD
tWDH
tRDL2 tRDWD tWDS

tWRWD
WR

tASTWR tWRL tWRADH

WAIT
tRDWT2 tWTRD
tWTL tWRWT tWTL tWTWR

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Serial Transfer Timing

3-wire serial I/O mode:

tKCYm

tKLm tKHm
tRn tFn

SCK0 to SCK2

tSIKm tKSIm

SI0 to SI2 Input data

tKSOm

SO0 to SO2 Output data

m = 1, 2, 9, 10, 13, 14
n = 2, 10, 14

2-wire serial I/O mode:

tKCY3, 4

tKL3, 4 tKH3, 4
tR4 tF4

SCK0

tSIK3, 4 tKSI3, 4
tKSO3, 4

SB0, SB1

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SBI mode (bus release signal transfer):

tKCY5, 6

tKL5, 6 tKH5, 6
tR6 tF6

SCK0

tKSB tSBL tSBH tSBK tSIK5, 6 tKSI5, 6

SB0, SB1

tKSO5, 6

SBI mode (command signal transfer):

tKCY5,6

tKL5, 6 tKH5, 6
tF6
tR6

SCK0

tSIK5, 6
tKSB tSBK tKSI5, 6

SB0, SB1

tKSO5, 6

I2C bus mode:

tKCYm

SCL
tKSB
tSIKm tKSB
tKLm tKHm
tKSIm
tKSOm tSBK

SDA0,
SDA1

tSBH tSIKm

m = 7, 8

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3-wire serial I/O mode with automatic transmit/receive function:

SO1 D2 D1 D0 D7

SI1 D2 D1 D0 D7

tSIK11, 12 tKSI11, 12
tKH11, 12
tKSO11, 12 tF12

SCK1
tR12
tSBD tSBW
tKL11, 12

tKCY11, 12
STB

3-wire serial I/O mode with automatic transmit/receive function (busy processing):

SCK1 7 8 9Note 10Note 10 + nNote 1

tBYS tBYH tSPS

BUSY
(Active high)

Note The signal is not actually driven low here; it is shown as such to indicate the timing.

UART mode (external clock input):

t KCY15

t KL15 t KH15
tR15 tF15

ASCK

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A/D Converter Characteristics (TA = –40 to +85°C, VDD = 2.7 to 5.5 V, AVSS = VSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Resolution 8 8 8 bit
Overall errorNote 1 2.7 V ≤ AVREF0 < 4.5 V ±1.0 %FSR
4.5 V ≤ AVREF0 ≤ 5.5 V ±0.6 %FSR
Conversion time TCONV 2.7 V ≤ AVREF0 ≤ 5.5 V 16 100 µs
Analog input voltage VIAN AVSS AVREF0 V
Reference voltage AVREF0 2.7 VDD V
AVREF0 current IREF0 When A/D converter is operatingNote 2 500 1,500 µA
When A/D converter is not operatingNote 3 0 3 µA

Notes 1. Excludes quantization error (±1/2 LSB). This value is indicated as a ratio to the full-scale value (%FSR).
2. The current flowing to the AVREF0 pin when bit 7 (CS) of the A/D converter mode register (ADM) is 1.
3. The current flowing to the AVREF0 pin when bit 7 (CS) of the A/D converter mode register (ADM) is 0.

D/A Converter Characteristics (TA = –40 to +85°C, VDD = 2.7 to 5.5 V, AVSS = VSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Resolution 8 bit
Overall error R=2 MΩNote 1 ±1.2 %
R = 4 MΩNote 1 ±0.8 %
R = 10 MΩNote 1 ±0.6 %
Note 1
Settling time C = 30 pF 15 µs
Output resistance RO Note 2 8 kΩ
Analog reference voltage AVREF1 1.8 VDD V
AVREF1 current IREF1 Note 2 2.5 mA
Resistance between AVREF1 and AVSS RAIREF1 DACS0, DACS1 = 55HNote 2 4 8 kΩ

Notes 1. R and C are the D/A converter output pin load resistance and load capacitance, respectively.
2. Value for one D/A converter channel

Remark DACS0 and DACS1: D/A conversion value set registers 0, 1

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Data Memory STOP Mode Low Supply Voltage Data Retention Characteristics (TA = –40 to +85°C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Data retention power VDDDR 1.8 5.5 V
supply voltage

Data retention power IDDDR VDDDR = 1.8 V 0.1 10 µA

supply current Subsystem clock stop and feed-back resistor
disconnected

Release signal set time tSREL 0 µs

17
Oscillation stabilization tWAIT Release by RESET 2 /fX ms
wait time
Release by interrupt request Note ms

Note Selection of 212/fXX and 214/fXX to 217/fXX is possible with bits 0 to 2 (OSTS0 to OSTS2) of the oscillation stabilization
time select register (OSTS).

Remark fXX: Main system clock frequency (fX or fX/2)

fX: Main system clock oscillation frequency

Data Retention Timing (STOP Mode Release by RESET)

Internal reset operation

HALT mode

STOP mode Operating mode

Data retention mode

VDD VDDDR
tSREL
STOP instruction execution

RESET

tWAIT

Data Retention Timing (Standby Release Signal: STOP Mode Release by Interrupt Request Signal)

HALT mode

STOP mode Operating mode

Data retention mode

VDD VDDDR
tSREL
STOP instruction execution

Standby release signal

(Interrupt request)

tWAIT

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Flash Memory Programming Characteristics (VDD = 2.7 to 5.5 V, TA = 10 to 40°C)

(1) Write/delete characteristics

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Write current (VDD pin)Note 1 IDDW When VPP = VPP1 5.0 MHz crystal oscillation 15.5 mA
operation mode
(fXX = 2.5 MHz)Note 2

5.0 MHz crystal oscillation 28.7 mA

operation mode
(fXX = 5.0 MHz)Note 3

Write current (VPP pin)Note 1 IPPW When VPP = VPP1 5.0 MHz crystal oscillation 19.5 mA
operation mode
(fXX = 2.5 MHz)Note 2

5.0 MHz crystal oscillation 32.7 mA

operation mode
(fXX = 5.0 MHz)Note 3

Delete current (VDD pin)Note 1 IDDE When VPP = VPP1 5.0 MHz crystal oscillation 15.5 mA
operation mode
(fXX = 2.5 MHz)Note 2

5.0 MHz crystal oscillation 28.7 mA

operation mode
(fXX = 5.0 MHz)Note 3

Delete current (VPP pin)Note 1 IPPE When VPP = VPP1 100 mA

Unit delete time tER 0.5 1 1 s
Total delete time tERA 20 s
Number of overwrite CWRT Delete and write are counted as one cycle 20 times
VPP power supply voltage VPP0 In normal mode 0 0.2 VDD V
VPP1 At flash memory programming 9.7 10.0 10.3 V

Notes 1. AVREF current and Port current (current flowing to internal pull-up resistor) are not included.
2. When main system clock is operating at fXX = fXX/2 (when oscillation mode select register (OSMS) is
cleared to 00H).
3. When main system clock is operating at fXX = fXX (when OSMS is set to 01H).

2) Serial write operation characteristics

Parameter Symbol Conditions MIN. TYP. MAX. Unit

VPP setup time tPSRON VPP high voltage 1.0 µs

VPP↑ setup time from VDD↑ tDRPSR VPP high voltage 10 µs
RESET↑ setup time from VPP↑ tPSRRF VPP high voltage 1.0 µs
VPP count start time from RESET↑ tRFCF 1.0 µs

Count execution time tCOUNT 2.0 ms

VPP counter high-level width tCH 8.0 µs
VPP counter low-level width tCL 8.0 µs
VPP counter noise elimination width tNFW 40 ns

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Flash Write Mode Setting Timing

VDD
VDD
0V tDRPSR tRFCF tCH

VPPH

VPP VPP

VPPL tCL

tPSRON tPSRRF

tCOUNT
VDD
RESET (input)
0V

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Caution The product that can operate on VDD = 2.2 V has “0232” or later as the first 4 digits of the lot number
inscribed on the package.

If this number is “0232” or later,

VDD = 2.2 V
Lot number
Year Week Rank
code code

Internal control code

Absolute Maximum Ratings (TA = 25°C)

Parameter Symbol Conditions Ratings Unit

Supply voltage VDD –0.3 to +6.5 V

VPP Note –0.3 to +10.5 V

AVREF0 –0.3 to VDD + 0.3 V
AVREF1 –0.3 to VDD + 0.3 V

AVSS –0.3 to +0.3 V

Input voltage VI1 P00 to P05, P07, P10 to P17, P20 to P27, P30 to P37, –0.3 to VDD + 0.3 V
P40 to P47, P50 to P57, P64 to P67, P70 to P72,
P120 to P127, P130, P131, X1, X2, XT2, RESET
VI2 P60 to P63 N-ch open drain –0.3 to +16 V
Output voltage VO –0.3 to VDD + 0.3 V
Analog input voltage V AN P10 to P17 Analog input pin AVSS – 0.3 to AVREF0 + 0.3 V

Note Make sure that the following conditions of the VPP voltage application timing are satisfied when the flash
memory is written.
• When supply voltage rises
VPP must exceed VDD 10 µs or more after VDD has reached the lower-limit value (2.2 V) of the operating voltage
range (see a in the figure below).
• When supply voltage drops
VDD must be lowered 10 µs or more after VPP falls below the lower-limit value (2.2 V) of the operating voltage
range of VDD (see b in the figure below).

2.2 V
VDD
0V
a b

VPP
2.2 V

0V

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 CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION (VDD = 2.2 V))

Absolute Maximum Ratings (TA = 25°C)

Parameter Symbol Conditions Ratings Unit

Output IOH Per pin –10 mA

current, high
Total for P01 to P05, P30 to P37, P56, P57, P60 to P67, –15 mA
P120 to P127
Total for P10 to P17, P20 to P27, P40 to P47, –15 mA
P50 to P55, P70 to P72, P130, P131

Output IOLNote Per pin for other than P50 to P57, Peak value 20 mA
current, low P60 to P63 rms value 10 mA
Per pin for P50 to P57, P60 to P63 Peak value 30 mA

rms value 15 mA
Total for P50 to P55 Peak value 100 mA
rms value 70 mA

Total for P56, P57, P60 to P63 Peak value 100 mA

rms value 70 mA
Total for P10 to P17, P20 to P27, Peak value 50 mA
P40 to P47, P70 to P72, P130, P131 rms value 20 mA
Total for P01 to P05, P30 to P37, Peak value 50 mA
P64 to P67, P120 to P127 rms value 20 mA

Operating ambient TA During normal operation –40 to +85 °C

temperature During flash memory programming 10 to 40 °C
Storage Tstg –65 to +125 °C
temperature

Note The rms value should be calculated as follows: [rms value] = [Peak value] × √Duty

Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions that
ensure that the absolute maximum ratings are not exceeded.

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Main System Clock Oscillator Characteristics (TA = –40 to +85°C, VDD = 2.2 to 5.5 V)

Resonator Recommended Circuit Parameter Conditions MIN. TYP. MAX. Unit

Ceramic X2 X1 VPP Oscillation VDD = Oscillation 1.0 5.0 MHz
resonator frequency (fX)Note 1 voltage range
Oscillation After VDD reaches 4 ms
C2 C1
stabilization timeNote 2 oscillation voltage range
MIN.

Crystal X2 X1 VPP Oscillation 1.0 5.0 MHz

resonator frequency (fX)Note 1
Oscillation VDD = 4.5 to 5.5 V 10 ms
C2 C1
stabilization timeNote 2 VDD = 2.2 to 5.5 V 30

External X1 input 1.0 5.0 MHz

clock X2 X1
frequency (fX)Note 1
X1 input 85 500 ns
high-/low-level width
(tXH , tXL)

Notes 1. Indicates only oscillator characteristics. See AC Characteristics for instruction execution time.
2. Time required to stabilize oscillation after reset or STOP mode release.

Cautions 1. When using the main system clock oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.

• Keep the wiring length as short as possible.

• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as VSS1.
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.

2. When the main system clock is stopped and the system is operating on the subsystem clock,
wait until the oscillation stabilization time has been secured by the program before switching
back to the main system clock.

Remark For the resonator selection and oscillator constant, customers are requested to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.

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Subsystem Clock Oscillator Characteristics (TA = –40 to +85°C, VDD = 2.2 to 5.5 V)

Resonator Recommended Circuit Parameter Conditions MIN. TYP. MAX. Unit

Crystal VPP XT2 XT1 Oscillation 32 32.768 35 kHz
resonator R2 frequency (fXT)Note 1
Oscillation VDD = 4.5 to 5.5 V 1.2 2 s
C4 C3
stabilization timeNote 2 10
VDD = 2.2 to 5.5 V

External XT1 input 32 35 kHz

XT2 XT1
clock frequency (fXT)Note 1
XT1 input 12 15 µs
high-/low-level width
(tXTH , tXTL)

Notes 1. Indicates only oscillator characteristics. See AC Characteristics for instruction execution time.
2. Time required to stabilize oscillation after VDD reaches oscillation voltage range MIN.

Cautions 1. When using the subsystem clock oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.

• Keep the wiring length as short as possible.

• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as VSS1.
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.

2. The subsystem clock oscillator is designed as a low-amplitude circuit for reducing current
consumption, and is more prone to malfunction due to noise than the main system clock
oscillator. Particular care is therefore required with the wiring method when the subsystem
clock is used.

Remark For the resonator selection and oscillator constant, customers are requested to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.

Capacitance (TA = 25°C, VDD = VSS = 0 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Input CIN f = 1 MHz 15 pF

capacitance Unmeasured pins returned to 0 V.
I/O CIO f = 1 MHz P01 to P05, P10 to P17, 15 pF
capacitance Unmeasured pins returned P20 to P27, P30 to P37,
to 0 V. P40 to P47, P50 to P57,
P64 to P67, P70 to P72,
P120 to P127, P130, P131
P60 to P63 20 pF

Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of port pins.

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DC Characteristics (TA = –40 to +85°C, VDD = 2.2 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Input voltage, VIH1 P10 to P17, P21, P23, P30 to P32, VDD = 2.7 to 5.5 V 0.7 VDD VDD V
high P35 to P37, P40 to P47, VDD = 2.2 to 5.5 V 0.8 VDD VDD V
P50 to P57, P64 to P67, P71,
P120 to P127, P130, P131
VIH2 P00 to P05, P20, P22, P24 to P27, VDD = 2.7 to 5.5 V 0.8 VDD VDD V
P33, P34, P70, P72, RESET VDD = 2.2 to 5.5 V 0.85 VDD VDD V
VIH3 P60 to P63 VDD = 2.7 to 5.5 V 0.7 VDD 15 V
(N-ch open drain) VDD = 2.2 to 5.5 V 0.8 VDD 15 V
VIH4 X1, X2 VDD = 2.7 to 5.5 V VDD – 0.5 VDD V
VDD = 2.2 to 5.5 V VDD – 0.2 VDD V
VIH5 XT1/P07, XT2 4.5 V ≤ VDD ≤ 5.5 V 0.8 VDD VDD V
2.7 V ≤ VDD < 4.5 V 0.9 VDD VDD V
2.2 V ≤ VDD < 2.7 V 0.9 VDD VDD V
Input voltage, VIL1 P10 to P17, P21, P23, P30 to P32, VDD = 2.7 to 5.5 V 0 0.3 VDD V
low P35 to P37, P40 to P47, VDD = 2.2 to 5.5 V 0 0.2 VDD V
P50 to P57, P64 to P67, P71,
P120 to P127, P130, P131
VIL2 P00 to P05, P20, P22, P24 to P27, VDD = 2.7 to 5.5 V 0 0.2 VDD V
P33, P34, P70, P72, RESET VDD = 2.2 to 5.5 V 0 0.15 VDD V
VIL3 P60 to P63 4.5 V ≤ VDD ≤ 5.5 V 0 0.3 VDD V
2.7 V ≤ VDD < 4.5 V 0 0.2 VDD V
2.2 V ≤ VDD < 2.7 V 0 0.1 VDD V
VIL4 X1, X2 VDD = 2.7 to 5.5 V 0 0.4 V
VDD = 2.2 to 5.5 V 0 0.2 V
VIL5 XT1/P07, XT2 4.5 V ≤ VDD ≤ 5.5 V 0 0.2 VDD V
2.7 V ≤ VDD < 4.5 V 0 0.1 VDD V
2.2 V ≤ VDD < 2.7 V 0 0.1 VDD V
Output voltage, VOH VDD = 4.5 to 5.5 V, IOH = –1 mA VDD – 1.0 V
high VDD = 2.2 to 5.5 V, IOH = –100 µA VDD – 0.5 V
Output voltage, VOL1 P50 to P57, P60 to P63 VDD = 4.5 to 5.5 V, 0.4 2.0 V
low IOL = 15 mA
P01 to P05, P10 to P17, VDD = 4.5 to 5.5 V, 0.4 V
P20 to P27, P30 to P37, IOL = 1.6 mA
P40 to P47, P64 to P67,
P70 to P72, P120-P127, P130,
P131
VOL2 SB0, SB1, SCK0 VDD = 4.5 to 5.5 V, 0.2VDD V
open drain,
pulled-up (R = 1 kΩ)
VOL3 IOL = 400 µA 0.5 V

Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of port pins.

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 CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION (VDD = 2.2 V))

DC Characteristics (TA = –40 to +85°C, VDD = 2.2 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Input leakage ILIH1 VIN = VDD P00 to P05, P10 to P17, P20 to P27, 3 µA
current, high P30 to P37, P40 to P47, P50 to P57,
P60 to P67, P70 to P72,
P120 to P127, P130, P131, RESET
ILIH2 X1, X2, XT1/P07, XT2 20 µA
ILIH3 VIN = 15 V P60 to P63 80 µA
Input leakage ILIL1 VIN = 0 V P00 to P05, P10 to P17, P20 to P27, –3 µA
current, low P30 to P37, P40 to P47, P50 to P57,
P64 to P67, P70 to P72,
P120 to P127, P130, P131, RESET
ILIL2 X1, X2, XT1/P07, XT2 –20 µA
ILIL3 P60-P63 –3 Note µA
Software pull-up R VIN = 0 V, P01 to P05, P10 to P17, P20 to P27, 15 30 90 kΩ
resistor P30 to P37, P40 to P47, P50 to P57, P64 to P67,
P70 to P72, P120 to P127, P130, P131

Note A low-level input leakage current of –200 µA (MAX.) flows only for 1.5 clocks (without wait) after a read
instruction has been executed to port 6 (P6) or port mode register 6 (PM6). At times other than this 1.5-clock
interval, a –3 µA (MAX.) current flows.

Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of port pins.

DC Characteristics (TA = –40 to +85°C, VDD = 2.2 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Output current, high IOH Per pin –1 mA
Total for all pins –15 mA
Output current, low IOL Per pin for P01 to P05, P10 to P17, P20 to P27, 10 mA
P30 to P37, P40 to P47, P50 to P57, P64 to P67,
P70 to P72, P120 to P127, P130, P131
Per pin for P50 to P57, P60 to P63 15 mA

Total for P10 to P17, P20 to P27, P40 to P47, 10 mA

P70 to P72, P130, P131
Total for P01 to P05, P30 to P37, P64 to P67, 10 mA
P120 to P127
Total for P50 to P57. P60 to P63 70 mA

Remark Unless specified otherwise, the characteristics of alternate-function pins are the same as those of port pins.

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DC Characteristics (TA = –40 to +85°C, VDD = 2.2 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit
Power supply IDD1Note 5 5.0 MHz crystal oscillation VDD = 5.0 V ±10%Note 1 6.2 12.5 mA
current operating mode VDD = 3.0 V ±10%Note 2 1.3 3.1 mA
(fXX = 2.5 MHz)Note 3
VDD = 2.2 VNote 2 0.68 1.6 mA
5.0 MHz crystal oscillation VDD = 5.0 V ±10%Note 1 13.1 25.7 mA
operating mode
(fXX = 5.0 MHz)Note 4 VDD = 3.0 V ±10%Note 2 2.1 4.9 mA
IDD2 5.0 MHz crystal oscillation VDD = 5.0 V ±10%
HALT mode Peripheral functions 5.6 mA
(fXX = 2.5 MHz)Note 3 operating
Peripheral functions 1.0 2.8 mA
not operating
VDD = 3.0 V ±10%
Peripheral functions 2.9 mA
operating
Peripheral functions 0.44 1.1 mA
not operating
VDD = 2.2 V
Peripheral functions 1.5 mA
operating
Peripheral functions 0.25 0.6 mA
not operating
5.0 MHz crystal oscillation VDD = 5.0 V ±10%
HALT mode
Peripheral functions 8.4 mA
(fXX = 5.0 MHz)Note 4
operating
Peripheral functions 1.3 3.1 mA
not operating
VDD = 3.0 V ±10%
Peripheral functions 4.5 mA
operating
Peripheral functions 0.6 1.5 mA
not operating
IDD3Note 5 32.768 kHz crystal oscillation VDD = 5.0 V ±10% 110 220 µA
operating modeNote 6 VDD = 3.0 V ±10% 86 172 µA
VDD = 2.2 V 70 140 µA
IDD4Note 5 32.768 kHz crystal oscillation VDD = 5.0 V ±10% 22.5 56 µA
HALT modeNote 6 VDD = 3.0 V ±10% 3.2 13.2 µA
VDD = 2.2 V 1.5 11.5 µA
IDD5Note 5 XT1 = VDD VDD = 5.0 V ±10% 1.0 30 µA
STOP mode VDD = 3.0 V ±10% 0.5 10 µA
When feedback resistor is used VDD = 2.2 V 0.3 10 µA

IDD6Note 5 XT1 = VDD VDD = 5.0 V ±10% 0.1 30 µA

STOP mode VDD = 3.0 V ±10% 0.05 10 µA
When feedback resistor is not used VDD = 2.2 V 0.05 10 µA

Notes 1. High-speed mode operation (when the processor clock control register (PCC) is cleared to 00H).
2. Low-speed mode operation (when PCC is set to 04H).
3. Operation with main system clock fXX = fX/2 (when the oscillation mode select register (OSMS) is cleared
to 00H)
4. Operation with main system clock fXX = fX (when OSMS is set to 01H)
5. Refers to the current flowing to the VDD0 and VDD1 pins. The current flowing to the A/D converter, D/A
converter, and on-chip pull-up resistor is not included.
6. When the main system clock operation is stopped.

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AC Characteristics

(1) Basic operation (TA = –40 to +85°C, VDD = 2.2 to 5.5 V)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Cycle time TCY Operating with main system VDD = 2.7 to 5.5 V 0.8 64 µs
(Min. instruction clock (fXX = 2.5 MHz)Note 1 VDD = 2.2 to 5.5 V 2.0 64 µs
execution time)
Operating with main system 3.5 V ≤ VDD ≤ 5.5 V 0.4 32 µs
clock (fXX = 5.0 MHz)Note 2 2.7 V ≤ VDD < 3.5 V 0.8 32 µs
Operating with subsystem clock 40Note 3 122 125 µs
TI00 input high-/ tTIH00 3.5 V ≤ V DD ≤ 5.5 V 2/fsam + 0.1Note 4 µs
low-level width tTIL00 2.7 V ≤ VDD < 3.5 V 2/fsam + 0.2Note 4 µs
2.2 V ≤ VDD < 2.7 V 2/fsam + 0.5Note 4 µs
TI01 input high-/ tTIH01 VDD = 2.7 to 5.5 V 10 µs
low-level width tTIL01 VDD = 2.2 to 5.5 V 20 µs
TI1, TI2 input fTI1 VDD = 4.5 to 5.5 V 0 4 MHz
frequency VDD = 2.2 to 5.5 V 0 275 kHz
TI1, TI2 input tTIH1 VDD = 4.5 to 5.5 V 100 ns
high-/low-level tTIL1 VDD = 2.2 to 5.5 V 1.8 µs
width
Interrupt request tINTH INTP0 3.5 V ≤ VDD ≤ 5.5 V 2/fsam + 0.1Note 4 µs
input high-/ tINTL 2.7 V ≤ VDD < 3.5 V 2/fsam + 0.2Note 4 µs
low-level width 2.2 V ≤ VDD < 2.7 V 2/fsam + 0.5Note 4 µs
INTP1 to INTP5, P40 to P47 VDD = 2.7 to 5.5 V 10 µs
VDD = 2.2 to 5.5 V 20 µs
RESET low- tRSL VDD = 2.7 to 5.5 V 10 µs
level width VDD = 2.2 to 5.5 V 20 µs

Notes 1. Operation with main system clock fXX = fX/2 (when the oscillation mode select register (OSMS) is cleared
to 00H)
2. Operation with main system clock fXX = fX (when OSMS is set to 01H)
3. Value when external clock is used. When a crystal resonator is used, it is 114 µs (MIN.)
4. Selection of fsam = fXX/2N, fXX/32, fXX/64, and fXX/128 is possible with bits 0 and 1 (SCS0, SCS1) of the sampling
clock select register (SCS) (when N = 0 to 4).

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TCY vs. VDD (@fXX = fX/2 main system clock operation) TCY vs. VDD (@fXX = fX main system clock operation)

60 60

10 10
Guaranteed
Operation

Cycle time TCY [µs]

Cycle time TCY [µs]

operation
guaranteed
range
range

2.0 2.0

1.0 1.0

0.5 0.5
0.4 0.4

0 0
1 2 3 4 5 6 1 2 3 4 5 6
Supply voltage VDD [V] Supply voltage VDD [V]

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(2) Read/write operation

(a) When MCS = 1, PCC2 to PCC0 = 000B (TA = –40 to +85°C, VDD = 3.5 to 5.5 V)

Parameter Symbol Conditions MIN. MAX. Unit

ASTB high-level width tASTH 0.85tCY – 50 ns

Address setup time tADS 0.85tCY – 50 ns

Address hold time tADH 50 ns

Data input time from address tADD1 (2.85 + 2n)tCY – 80 ns

tADD2 (4 + 2n)tCY – 100 ns

Data input time from RD↓ tRDD1 (2 + 2n)tCY – 100 ns

tRDD2 (2.85 + 2n)tCY – 100 ns

Read data hold time tRDH 0 ns

RD low-level width tRDL1 (2 + 2n)tCY – 60 ns

tRDL2 (2.85 + 2n)tCY – 60 ns

WAIT↓ input time from RD↓ tRDWT1 0.85tCY – 50 ns

tRDWT2 2tCY – 60 ns

WAIT↓ input time from WR↓ tWRWT 2tCY – 60 ns

WAIT low-level width tWTL (1.15 + 2n)tCY (2 + 2n)tCY ns

Write data setup time tWDS (2.85 + 2n)tCY – 100 ns

Write data hold time tWDH 20 ns

WR low-level width tWRL (2.85 + 2n)tCY – 60 ns

RD↓ delay time from ASTB↓ tASTRD 25 ns

WR↓ delay time from ASTB↓ tASTWR 0.85tCY + 20 ns

ASTB↑ delay time from tRDAST 0.85tCY – 10 1.15tCY + 20 ns

RD↑ at external fetch

Address hold time from tRDADH 0.85tCY – 50 1.15tCY + 50 ns

RD↑ at external fetch

Write data output time from RD↑ tRDWD 40 ns

Write data output time from WR↓ tWRWD 0 50 ns

Address hold time from WR↑ tWRADH 0.85tCY 1.15tCY + 40 ns

RD↑ delay time from WAIT↑ tWTRD 1.15tCY + 40 3.15tCY + 40 ns

WR↑ delay time from WAIT↑ tWTWR 1.15tCY + 30 3.15tCY + 30 ns

Remarks 1. MCS: Bit 0 of the oscillation mode select register (OSMS)

2. PCC2 to PCC0: Bits 2 to 0 of the processor clock control register (PCC)
3. tCY = TCY/4
4. n indicates the number of waits.

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(b) When MCS = 0 or PCC2 to PCC0 ≠ 000B (TA = –40 to +85°C, VDD = 2.7 to 5.5 V)

Parameter Symbol Conditions MIN. MAX. Unit

ASTB high-level width tASTH tCY – 80 ns

Address setup time tADS tCY – 80 ns
Address hold time tADH 0.4tCY – 10 ns
Data input time from address tADD1 (3 + 2n)tCY – 160 ns
tADD2 (4 + 2n)tCY – 200 ns
Data input time from RD↓ tRDD1 (1.4 + 2n)tCY – 70 ns
tRDD2 (2.4 + 2n)tCY – 70 ns
Read data hold time tRDH 0 ns
RD low-level width tRDL1 (1.4 + 2n)tCY – 20 ns
tRDL2 (2.4 + 2n)tCY – 20 ns
WAIT↓ input time from RD↓ tRDWT1 tCY – 100 ns
tRDWT2 2tCY – 100 ns
WAIT↓ input time from WR↓ tWRWT 2tCY – 100 ns
WAIT low-level width tWTL (1 + 2n)tCY (2 + 2n)tCY ns
Write data setup time tWDS (2.4 + 2n)tCY – 60 ns
Write data hold time tWDH 20 ns
WR low-level width tWRL (2.4 + 2n)tCY – 20 ns
RD↓ delay time from ASTB↓ tASTRD 0.4tCY – 30 ns
WR↓ delay time from ASTB↓ tASTWR 1.4tCY – 30 ns
ASTB↑ delay time from RD↑ tRDAST tCY – 10 tCY + 20 ns
at external fetch
Address hold time from tRDADH tCY – 50 tCY + 50 ns
RD↑ at external fetch
Write data output time from tRDWD 0.4tCY – 20 ns
RD↑
Write data output time from tWRWD 0 60 ns
WR↓
Address hold time from WR↑ tWRADH tCY tCY + 60 ns
RD↑ delay time from WAIT↑ tWTRD 0.6tCY + 180 2.6tCY + 180 ns
WR↑ delay time from WAIT↑ tWTWR 0.6tCY + 120 2.6tCY + 120 ns

Remarks 1. MCS: Bit 0 of the oscillation mode select register (OSMS)

2. PCC2 to PCC0: Bits 2 to 0 of the processor clock control register (PCC)
3. tCY = TCY/4
4. n indicates the number of waits.

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(c) When MCS = 0 or PCC2 to PCC0 ≠ 000B (TA = –40 to +85°C, VDD = 2.2 to 5.5 V)

Parameter Symbol Conditions MIN. MAX. Unit

ASTB high-level width tASTH tCY – 150 ns

Address setup time tADS tCY – 150 ns
Address hold time tADH 0.37tCY – 40 ns
Data input time from address tADD1 (3 + 2n)tCY – 320 ns
tADD2 (4 + 2n)tCY – 300 ns
Data input time from RD↓ tRDD1 (1.37 + 2n)tCY – 120 ns
tRDD2 (2.37 + 2n)tCY – 120 ns
Read data hold time tRDH 0 ns
RD low-level width tRDL1 (1.37 + 2n)tCY – 20 ns
tRDL2 (2.37 + 2n)tCY – 20 ns
WAIT↓ input time from RD↓ tRDWT1 tCY – 200 ns
tRDWT2 2tCY – 200 ns
WAIT↓ input time from WR↓ tWRWT 2tCY – 200 ns
WAIT low-level width tWTL (1 + 2n)tCY (2 + 2n)tCY ns
Write data setup time tWDS (2.37 + 2n)tCY – 100 ns
Write data hold time tWDH 20 ns
WR low-level width tWRL (2.37 + 2n)tCY – 20 ns
RD↓ delay time from ASTB↓ tASTRD 0.37tCY – 50 ns
WR↓ delay time from ASTB↓ tASTWR 1.37tCY – 50 ns
ASTB↑ delay time from RD↑ tRDAST tCY – 10 tCY + 20 ns
at external fetch
Address hold time from tRDADH tCY – 50 tCY + 50 ns
RD↑ at external fetch
Write data output time from tRDWD 0.37tCY – 40 ns
RD↑
Write data output time from tWRWD 0 120 ns
WR↓
Address hold time from WR↑ tWRADH tCY tCY + 120 ns
RD↑ delay time from WAIT↑ tWTRD 0.63tCY + 350 2.63tCY + 350 ns
WR↑ delay time from WAIT↑ tWTWR 0.63tCY + 240 2.63tCY + 240 ns

Remarks 1. MCS: Bit 0 of the oscillation mode select register (OSMS)

2. PCC2 to PCC0: Bits 2 to 0 of the processor clock control register (PCC)
3. tCY = TCY/4
4. n indicates the number of waits.

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(3) Serial interface (TA = –40 to +85°C, VDD = 2.7 to 5.5 V)

(a) Serial interface channel 0

(i) 3-wire serial I/O mode (SCK0 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY1 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.2 V ≤ VDD < 2.7 V 3,200 ns
SCK0 high-/low-level tKH1, tKL1 VDD = 4.5 to 5.5 V tKCY1/2 – 50 ns
width VDD = 2.2 to 5.5 V tKCY1/2 – 100 ns
SI0 setup time tSIK1 4.5 V ≤ VDD ≤ 5.5 V 100 ns
(to SCK0↑) 2.7 V ≤ VDD < 4.5 V 150 ns
2.2 V ≤ VDD < 2.7 V 300 ns
SI0 hold time tKSI1 400 ns
(from SCK0↑)

SO0 output delay time tKSO1 C = 100 pFNote 300 ns

from SCK0↓

Note C is the load capacitance of the SCK0 and SO0 output lines.

(ii) 3-wire serial I/O mode (SCK0 ... External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY2 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.2 V ≤ VDD < 2.7 V 3,200 ns
SCK0 high-/low-level tKH2, tKL2 4.5 V ≤ VDD ≤ 5.5 V 400 ns
width 2.7 V ≤ VDD < 4.5 V 800 ns
2.2 V ≤ VDD < 2.7 V 1,600 ns
SI0 setup time tSIK2 100 ns
(to SCK0↑)

SI0 hold time tKSI2 400 ns

(from SCK0↑)

SO0 output delay time tKSO2 C = 100 pFNote 300 ns

from SCK0↓

SCK0 rise/fall time tR2, tF2 When using external device 160 ns
expansion function
When not using external device 1,000 ns
expansion function

Note C is the load capacitance of the SO0 output line.

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(iii) 2-wire serial I/O mode (SCK0 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY3 R = 1 kΩ, 2.7 V ≤ VDD ≤ 5.5 V 1,600 ns
C = 100 pFNote 2.2 V ≤ VDD < 2.7 V 3,200 ns

SCK0 high-level width tKH3 VDD = 2.7 to 5.5 V tKCY3/2 – 160 ns

VDD = 2.2 to 5.5 V tKCY3/2 – 190 ns

SCK0 low-level width tKL3 VDD = 4.5 to 5.5 V tKCY3/2 – 50 ns

VDD = 2.2 to 5.5 V tKCY3/2 – 100 ns

SB0, SB1 setup time tSIK3 4.5 V ≤ VDD ≤ 5.5 V 300 ns
(to SCK0↑)
2.7 V ≤ VDD < 4.5 V 350 ns
2.2 V ≤ VDD < 2.7 V 400 ns
SB0, SB1 hold time tKSI3 600 ns
(from SCK0↑)

SB0, SB1 output delay tKSO3 0 300 ns

time from SCK0↓

Note R and C are the load resistance and load capacitance of the SCK0, SB0, and SB1 output lines.

(iv) 2-wire serial I/O mode (SCK0 ... External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY4 2.7 V ≤ VDD ≤ 5.5 V 1,600 ns

2.2 V ≤ VDD < 2.7 V 3,200 ns

SCK0 high-level width tKH4 2.7 V ≤ VDD ≤ 5.5 V 650 ns

2.2 V ≤ VDD < 2.7 V 1,300 ns

SCK0 low-level width tKL4 2.7 V ≤ VDD ≤ 5.5 V 800 ns
2.2 V ≤ VDD < 2.7 V 1,600 ns
SB0, SB1 setup time tSIK4 100 ns
(to SCK0↑)
SB0, SB1 hold time tKSI4 tKCY4/2 ns
(from SCK0↑)
SB0, SB1 output delay tKSO4 R = 1 kΩ, 4.5 V ≤ VDD ≤ 5.5 V 0 300 ns
time from SCK0↓
C = 100 pFNote
2.2 V ≤ VDD < 4.5 V 0 500 ns

SCK0 rise/fall time tR4, tF4 When using external device 160 ns
expansion function

When not using external device 1,000 ns

expansion function

Note R and C are the load resistance and load capacitance of the SB0 and SB1 output lines.

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(v) SBI mode (SCK0 ... Internal clock output) (µPD78F0058, 78F0058Y only)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY5 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.2 V ≤ VDD < 4.5 V 3,200 ns
SCK0 high-/low-level tKH5, tKL5 4.5 V ≤ VDD ≤ 5.5 V tKCY5/2 – 50 ns
width 2.2 V ≤ VDD < 4.5 V tKCY5/2 – 150 ns
SB0, SB1 setup time tSIK5 4.5 V ≤ VDD ≤ 5.5 V 100 ns
(to SCK0↑) 2.2 V ≤ VDD < 4.5 V 300 ns
SB0, SB1 hold time tKSI5 tKCY5/2 ns
(from SCK0↑)
SB0, SB1 output delay tKSO5 R = 1 kΩ, VDD = 4.5 to 5.5 V 0 250 ns
time from SCK0↓ C = 100 pFNote VDD = 2.2 to 5.5 V 0 1,000 ns
SB0, SB1↓ from SCK0↑ tKSB tKCY5 ns
SCK0↓ from SB0, SB1↓ tSBK tKCY5 ns
SB0, SB1 high-level width tSBH tKCY5 ns
SB0, SB1 low-level width tSBL tKCY5 ns

Note R and C are the load resistance and load capacitance of the SCK0, SB0, and SB1 output lines.

(vi) SBI mode (SCK0 ... External clock input) (µPD78F0058, 78F0058Y only)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK0 cycle time tKCY6 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.2 V ≤ VDD < 4.5 V 3,200 ns
SCK0 high-/low-level tKH6, tKL6 4.5 V ≤ VDD ≤ 5.5 V 400 ns
width 2.2 V ≤ VDD < 4.5 V 1,600 ns
SB0, SB1 setup time tSIK6 4.5 V ≤ VDD ≤ 5.5 V 100 ns
(to SCK0↑) 2.2 V ≤ VDD < 4.5 V 300 ns
SB0, SB1 hold time tKSI6 tKCY6/2 ns
(from SCK0↑)
SB0, SB1 output delay tKSO6 R = 1 kΩ, VDD = 4.5 to 5.5 V 0 300 ns
time from SCK0↓ C = 100 pFNote VDD = 2.2 to 5.5 V 0 1,000 ns
SB0, SB1↓ from SCK0↑ tKSB tKCY6 ns
SCK0↓ from SB0, SB1↓ tSBK tKCY6 ns
SB0, SB1 high-level width tSBH tKCY6 ns
SB0, SB1 low-level width tSBL tKCY6 ns
SCK0 rise/fall time tR6, tF6 When using external device 160 ns
expansion function
When not using external device 1,000 ns
expansion function

Note R and C are the load resistance and load capacitance of the SB0 and SB1 output lines.

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(vii) I2C bus mode (SCL ... Internal clock output) (µPD78F0058Y only)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
SCL cycle time tKCY7 R = 1 kΩ, 2.7 V ≤ VDD ≤ 5.5 V 10 µs
C = 100 pFNote 2.2 V ≤ VDD < 2.7 V 20 ns
SCL high-level width tKH7 VDD = 2.7 to 5.5 V tKCY7 – 160 ns
VDD = 2.2 to 5.5 V tKCY7 – 190 ns
SCL low-level width tKL7 VDD = 4.5 to 5.5 V tKCY7 – 50 ns
VDD = 2.2 to 5.5 V tKCY7 – 100 ns
SDA0, SDA1 setup time tSIK7 2.7 V ≤ VDD ≤ 5.5 V 200 ns
(to SCL↑) 2.2 V ≤ VDD < 2.7 V 300 ns
SDA0, SDA1 hold time tKSI7 0 ns
(from SCL↓)
SDA0, SDA1 output delay tKSO7 4.5 V ≤ VDD ≤ 5.5 V 0 300 ns
time from SCL↓ 2.2 V ≤ VDD < 4.5 V 0 500 ns
SDA0, SDA1↓ from SCL↑ tKSB 200 ns
or SDA0, SDA1↑ from SCL↑
SCL↓ from SDA0, SDA1↓ tSBK 400 ns
SDA0, SDA1 high-level width tSBH 500 ns

Note R and C are the load resistance and load capacitance of the SCL, SDA0, and SDA1 output lines.

(viii) I2C bus mode (SCL ... External clock input) (µPD78F0058Y only)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
SCL cycle time tKCY8 1 µs
SCL high-level width tKH8 400 ns
SDA0, SDA1 setup time tSIK8 200 ns
(to SCL↑)

SDA0, SDA1 hold time tKSI8 0 ns

(from SCL↓)
SDA0, SDA1 output delay tKSO8 R = 1 kΩ, 4.5 V ≤ VDD ≤ 5.5 V 0 300 ns
time from SCL↓ C = 100 pFNote 2.2 V ≤ VDD < 4.5 V 0 500 ns

SDA0, SDA1↓ from SCL↑ tKSB 200 ns

or SDA0, SDA1↑ from SCL↑
SCL↓ from SDA0, SDA1↓ tSBK 400 ns
SDA0, SDA1 high-level width tSBH 500 ns

Note R and C are the load resistance and load capacitance of the SDA0 and SDA1 output lines.

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(b) Serial interface channel 1

(i) 3-wire serial I/O mode (SCK1 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK1 cycle time tKCY9 4.5 V ≤ V DD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.2 V ≤ VDD < 2.7 V 3,200 ns
SCK1 high-/low-level width tKH9, tKL9 VDD = 4.5 to 5.5 V tKCY9/2 – 50 ns
VDD = 2.2 to 5.5 V tKCY9/2 – 100 ns
SI1 setup time (to SCK1↑) tSIK9 4.5 V ≤ V DD ≤ 5.5 V 100 ns
2.7 V ≤ VDD < 4.5 V 150 ns
2.2 V ≤ VDD < 2.7 V 300 ns
SI1 hold time (from SCK1↑) tKSI9 400 ns
SO1 output delay time from SCK1↓ tKSO9 C = 100 pFNote 300 ns

Note C is the load capacitance of the SCK1 and SO1 output lines.

(ii) 3-wire serial I/O mode (SCK1 ... External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK1 cycle time tKCY10 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns

2.2 V ≤ VDD < 2.7 V 3,200 ns

SCK1 high-/low-level width tKH10, tKL10 4.5 V ≤ VDD ≤ 5.5 V 400 ns
2.7 V ≤ VDD < 4.5 V 800 ns

2.2 V ≤ VDD < 2.7 V 1,600 ns

SI1 setup time (to SCK1↑) tSIK10 100 ns
SI1 hold time (from SCK1↑) tKIS10 400 ns
SO1 output delay time from SCK1↓ tKSO10 C = 100 pFNote 300 ns
SCK1 rise/fall time tR10, tF10 When using external device 160 ns
expansion function
When not using external device 1,000 ns
expansion function

Note C is the load capacitance of the SO1 output line.

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(iii) 3-wire serial I/O mode with automatic transmit/receive function (SCK1 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK1 cycle time tKCY11 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.2 V ≤ VDD < 2.7 V 3,200 ns
SCK1 high-/low-level width tKH11, tKL11 VDD = 4.5 to 5.5 V tKCY11/2 – 50 ns
VDD = 2.2 to 5.5 V tKCY11/2 – 100 ns
SI1 setup time (to SCK1↑) tSIK11 4.5 V ≤ VDD ≤ 5.5 V 100 ns
2.7 V ≤ VDD < 4.5 V 150 ns
2.2 V ≤ VDD < 2.7 V 300 ns
SI1 hold time (from SCK1↑) tKSI11 400 ns
SO1 output delay time from SCK1↓ tKSO11 C = 100 pFNote 300 ns
STB↑ from SCK1↑ tSBD tKCY11/2 – 100 tKCY11/2 + 100 ns
Strobe signal high-level width tSBW 2.7 V ≤ VDD < 5.5 V tKCY11 – 30 tKCY11 + 30 ns
2.2 V ≤ VDD < 2.7 V tKCY11 – 60 tKCY11 + 60 ns
Busy signal setup time tBYS 100 ns
(to busy signal detection timing)
Busy signal hold time tBYH 4.5 V ≤ VDD ≤ 5.5 V 100 ns
(from busy signal detection timing) 2.7 V ≤ VDD < 4.5 V 150 ns
2.2 V ≤ VDD < 2.7 V 200 ns

SCK1↓ from busy inactive tSPS 2tKCY11 ns

Note C is the load capacitance of the SCK1 and SO1 output lines.

(iv) 3-wire serial I/O mode with automatic transmit/receive function (SCK1 ... External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK1 cycle time tKCY12 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.2 V ≤ VDD < 2.7 V 3,200 ns
SCK1 high-/low-level width tKH12, 4.5 V ≤ VDD ≤ 5.5 V 400 ns
tKL12 2.7 V ≤ VDD < 4.5 V 800 ns
2.2 V ≤ VDD < 2.7 V 1,600 ns
SI1 setup time (to SCK1↑) tSIK12 100 ns
SI1 hold time (from SCK1↑) tKSI12 400 ns
SO1 output delay time from SCK1↓ tKSO12 C = 100 pFNote 300 ns
SCK1 rise/fall time tR12, tF12 When using external device 160 ns
expansion function
When not using external device 1,000 ns
expansion function

Note C is the load capacitance of the SO1 output line.

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(c) Serial interface channel 2

(i) 3-wire serial I/O mode (SCK2 ... Internal clock output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK2 cycle time tKCY13 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.2 V ≤ VDD < 2.7 V 3,200 ns
SCK2 high-/low-level width tKH13, VDD = 4.5 to 5.5 V tKCY13/2 – 50 ns
tKL13 VDD = 2.2 to 5.5 V tKCY13/2 – 100 ns
SI2 setup time (to SCK2↑) tSIK13 4.5 V ≤ VDD ≤ 5.5 V 100 ns
2.7 V ≤ VDD < 4.5 V 150 ns
2.2 V ≤ VDD < 2.7 V 300 ns
SI2 hold time (from SCK2↑) tKSI13 400 ns
SO2 output delay time from SCK2↓ tKSO13 C = 100 pFNote 300 ns

Note C is the load capacitance of the SO2 output line.

(ii) 3-wire serial I/O mode (SCK2 ... External clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

SCK2 cycle time tKCY14 4.5 V ≤ V DD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.2 V ≤ VDD < 2.7 V 3,200 ns
SCK2 high-/low-level width tKH14, 4.5 V ≤ V DD ≤ 5.5 V 400 ns
tKL14 2.7 V ≤ VDD < 4.5 V 800 ns
2.2 V ≤ VDD < 2.7 V 1,600 ns
SI2 setup time (to SCK2↑) tSIK14 100 ns
SI2 hold time (from SCK2↑) tKSI14 400 ns
SO2 output delay time from SCK2↓ tKSO14 C = 100 pFNote 300 ns
SCK2 rise/fall time tR14, Other than below 160 ns
tF14 VDD = 4.5 to 5.5 V 1 µs
When not using external device
expansion function

Note C is the load capacitance of the SO2 output line.

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 CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION (VDD = 2.2 V))

(iii) UART mode (dedicated baud rate generator output)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Transfer rate 4.5 V ≤ VDD ≤ 5.5 V 78,125 bps
2.7 V ≤ VDD < 4.5 V 39,063 bps

2.2 V ≤ VDD < 2.7 V 19,531 bps

(iv) UART mode (external clock input)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

ASCK cycle time tKCY15 4.5 V ≤ VDD ≤ 5.5 V 800 ns
2.7 V ≤ VDD < 4.5 V 1,600 ns
2.2 V ≤ VDD < 2.7 V 3,200 ns
ASCK high-/low-level width tKH15, tKL15 4.5 V ≤ VDD ≤ 5.5 V 400 ns
2.7 V ≤ VDD < 4.5 V 800 ns
2.2 V ≤ VDD < 2.7 V 1,600 ns
Transfer rate 4.5 V ≤ VDD ≤ 5.5 V 39,063 bps
2.7 V ≤ VDD < 4.5 V 19,531 bps
2.2 V ≤ VDD < 2.7 V 9,766 bps
ASCK rise/fall time tR15, tF15 VDD = 4.5 to 5.5 V, 1,000 ns
when not using external device
expansion function.
Other than above 160 ns

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AC Timing Measurement Points (Excluding X1, XT1 Inputs)

0.8VDD Point of 0.8VDD

0.2VDD measurement 0.2VDD

Clock Timing

1/fX

tXL tXH

VIH4 (MIN.)
X1 input
VIL4 (MAX.)

1/fXT

tXTL tXTH

VIH5 (MIN.)
XT1 input
VIL5 (MAX.)

TI Timing

tTIL00, tTIL01 tTIH00, tTIH01

TI00, TI01

1/fTI1

tTIL1 tTIH1

TI1, TI2

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 CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION (VDD = 2.2 V))

Interrupt Request Input Timing

tINTL tINTH

INTP0 to INTP5,
P40 to P47

RESET Input Timing

tRSL

RESET

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Read/Write Operation

External fetch (no wait):

A8 to A15 Higher 8-bit address

tADD1
Lower Hi-Z
AD0 to AD7 8-bit Operation
address code
tADS tRDD1 tRDADH
tADH
tASTH
tRDAST
ASTB

RD

tASTRD tRDL1 tRDH

External fetch (wait insertion):

A8 to A15 Higher 8-bit address

tADD1
Lower Hi-Z Operation
AD0 to AD7 8-bit
address code
tADS tRDD1 tRDADH
tADH
tASTH
tRDAST
ASTB

RD

tASTRD tRDL1 tRDH

WAIT
tWTRD
tRDWT1 tWTL

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 CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION (VDD = 2.2 V))

External data access (no wait):

A8 to A15 Higher 8-bit address

tADD2
Lower Hi-Z Hi-Z Hi-Z
AD0 to AD7 8-bit Read data Write data
address
tADS tRDD2
tADH tRDH
tASTH
ASTB

RD
tASTRD tWDH
tRDL2 tRDWD tWDS
tWRADH
tWRWD
WR

tASTWR tWRL

External data access (wait insertion):

A8 to A15 Higher 8-bit address

tADD2
Lower Hi-Z Hi-Z Hi-Z
AD0 to AD7 8-bit Read data Write data
address
tADS tRDD2
tADH tRDH
tASTH
ASTB

tASTRD

RD
tWDH
tRDL2 tRDWD tWDS

tWRWD
WR

tASTWR tWRL tWRADH

WAIT
tRDWT2 tWTRD
tWTL tWRWT tWTL tWTWR

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Serial Transfer Timing

3-wire serial I/O mode:

tKCYm

tKLm tKHm
tRn tFn

SCK0 to SCK2

tSIKm tKSIm

SI0 to SI2 Input data

tKSOm

SO0 to SO2 Output data

m = 1, 2, 9, 10, 13, 14
n = 2, 10, 14

2-wire serial I/O mode:

tKCY3, 4

tKL3, 4 tKH3, 4
tR4 tF4

SCK0

tSIK3, 4 tKSI3, 4
tKSO3, 4

SB0, SB1

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 CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION (VDD = 2.2 V))

SBI mode (bus release signal transfer):

tKCY5, 6

tKL5, 6 tKH5, 6
tR6 tF6

SCK0

tKSB tSBL tSBH tSBK tSIK5, 6 tKSI5, 6

SB0, SB1

tKSO5, 6

SBI mode (command signal transfer):

tKCY5,6

tKL5, 6 tKH5, 6
tF6
tR6

SCK0

tSIK5, 6
tKSB tSBK tKSI5, 6

SB0, SB1

tKSO5, 6

I2C bus mode:

tKCYm

SCL
tKSB
tSIKm tKSB
tKLm tKHm
tKSIm
tKSOm tSBK

SDA0,
SDA1

tSBH tSIKm

m = 7, 8

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3-wire serial I/O mode with automatic transmit/receive function:

SO1 D2 D1 D0 D7

SI1 D2 D1 D0 D7

tSIK11, 12 tKSI11, 12
tKH11, 12
tKSO11, 12 tF12

SCK1
tR12
tSBD tSBW
tKL11, 12

tKCY11, 12
STB

3-wire serial I/O mode with automatic transmit/receive function (busy processing):

SCK1 7 8 9Note 10Note 10 + nNote 1

tBYS tBYH tSPS

BUSY
(Active high)

Note The signal is not actually driven low here; it is shown as such to indicate the timing.

UART mode (external clock input):

t KCY15

t KL15 t KH15
tR15 tF15

ASCK

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 CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION (VDD = 2.2 V))

A/D Converter Characteristics (TA = –40 to +85°C, VDD = 2.2 to 5.5 V, AVSS = VSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Resolution 8 8 8 bit
Overall errorNote 1 2.7 V ≤ AVREF0 ≤ 5.5 V ±0.6 %FSR
2.2 V ≤ AVREF0 < 2.7 V ±1.4 %FSR
Conversion time TCONV1 2.2 V ≤ AVREF0 < 2.7 V 40 100 µs
TCONV2 2.7 V ≤ AVREF0 < 5.5 V 16 100 µs
Analog input voltage VIAN AVSS AVREF0 V
Reference voltage AVREF0 2.2 VDD V
AVREF0 current IREF0 When A/D converter is operatingNote 2 500 1,500 µA
When A/D converter is not operatingNote 3 0 3.0 µA

Notes 1. Excludes quantization error (±1/2 LSB). This value is indicated as a ratio to the full-scale value (%FSR).
2. The current flowing to the AVREF0 pin when bit 7 (CS) of the A/D converter mode register (ADM) is 1.
3. The current flowing to the AVREF0 pin when bit 7 (CS) of the A/D converter mode register (ADM) is 0.

D/A Converter Characteristics (TA = –40 to +85°C, VDD = 2.2 to 5.5 V, AVSS = VSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Resolution 8 bit
Overall error R=2 MΩNote 1 ±1.2 %
R = 4 MΩNote 1 ±0.8 %
R = 10 MΩNote 1 ±0.6 %
Overall errorNote 1 C= 30 pFNote 1 AVREF1 = 2.2 to 2.7 V 10 µs
AVREF1 = 2.2 to 5.5 V 15 µs
Output resistance RO Note 2 8 kΩ
Analog reference voltage AVREF1 1.8 VDD V
AVREF1 current IREF1 Note 2 2.5 mA
Resistance between AVREF1 and AVSS RAIREF1 DACS0, DACS1 = 55HNote 2 4 8 kΩ

Notes 1. R and C are the D/A converter output pin load resistance and load capacitance, respectively.
2. Value for one D/A converter channel

Remark DACS0 and DACS1: D/A conversion value set registers 0, 1

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 CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION (VDD = 2.2 V))

Data Memory STOP Mode Low Supply Voltage Data Retention Characteristics (TA = –40 to +85°C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Data retention power VDDDR 1.8 5.5 V
supply voltage

Data retention power IDDDR VDDDR = 1.8 V 0.1 10 µA

supply current Subsystem clock stop and feed-back resistor
disconnected

Release signal set time tSREL 0 µs

17
Oscillation stabilization tWAIT Release by RESET 2 /fX ms
wait time
Release by interrupt request Note ms

Note Selection of 212/fXX and 214/fXX to 217/fXX is possible with bits 0 to 2 (OSTS0 to OSTS2) of the oscillation stabilization
time select register (OSTS).

Remark fXX: Main system clock frequency (fX or fX/2)

fX: Main system clock oscillation frequency

Data Retention Timing (STOP Mode Release by RESET)

Internal reset operation

HALT mode

STOP mode Operating mode

Data retention mode

VDD VDDDR
tSREL
STOP instruction execution

RESET

tWAIT

Data Retention Timing (Standby Release Signal: STOP Mode Release by Interrupt Request Signal)

HALT mode

STOP mode Operating mode

Data retention mode

VDD VDDDR
tSREL
STOP instruction execution

Standby release signal

(Interrupt request)

tWAIT

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 CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH MEMORY VERSION (VDD = 2.2 V))

Flash Memory Programming Characteristics (VDD = 2.7 to 5.5 V, TA = 10 to 40°C)

(1) Write/erase characteristics

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Write current (VDD pin)Note 1 IDDW When VPP = VPP1 5.0 MHz crystal oscillation 15.5 mA
operation mode
(fXX = 2.5 MHz)Note 2

5.0 MHz crystal oscillation 28.7 mA

operation mode
(fXX = 5.0 MHz)Note 3

Write current (VPP pin)Note 1 IPPW When VPP = VPP1 5.0 MHz crystal oscillation 19.5 mA
operation mode
(fXX = 2.5 MHz)Note 2

5.0 MHz crystal oscillation 32.7 mA

operation mode
(fXX = 5.0 MHz)Note 3

Erase current (VDD pin)Note 1 IDDE When VPP = VPP1 5.0 MHz crystal oscillation 15.5 mA
operation mode
(fXX = 2.5 MHz)Note 2

5.0 MHz crystal oscillation 28.7 mA

operation mode
(fXX = 5.0 MHz)Note 3

Erase current (VPP pin)Note 1 IPPE When VPP = VPP1 100 mA

Unit erase time tER 0.5 1 1 s
Total erase time tERA 20 s
Number of overwrites CWRT Erase and write are counted as one cycle 20 times
VPP power supply voltage VPP0 In normal mode 0 0.2 VDD V
VPP1 During flash memory programming 9.7 10.0 10.3 V

Notes 1. AVREF current and port current (current flowing to internal pull-up resistors) are not included.
2. When main system clock is operating at fXX = fXX/2 (when oscillation mode select register (OSMS) is cleared
to 00H).
3. When main system clock is operating at fXX = fXX (when OSMS is set to 01H).

2) Serial write operation characteristics

Parameter Symbol Conditions MIN. TYP. MAX. Unit

VPP setup time tPSRON VPP high voltage 1.0 µs

VPP↑ setup time from VDD↑ tDRPSR VPP high voltage 10 µs
RESET↑ setup time from VPP↑ tPSRRF VPP high voltage 1.0 µs
VPP count start time from RESET↑ tRFCF 1.0 µs

Count execution time tCOUNT 2.0 ms

VPP counter high-level width tCH 8.0 µs
VPP counter low-level width tCL 8.0 µs
VPP counter noise elimination width tNFW 40 ns

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Flash Write Mode Setting Timing

VDD
VDD
0V tDRPSR tRFCF tCH

VPPH

VPP VPP

VPPL tCL

tPSRON tPSRRF

tCOUNT
VDD
RESET (input)
0V

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 CHAPTER 31 CHARACTERISTICS CURVES (REFERENCE VALUES)

VDD vs IDD (mask ROM version, fX = 5.0 MHz, fXX = 2.5 MHz)
(TA = 25°C)
10

PCC = 00H

PCC = 01H
PCC = 02H
PCC = 03H
PCC = 04H
PCC = 30H
1 HALT (X1 oscillating, XT1 oscillating)
Supply current IDD [mA]

0.1

PCC = B0H

HALT (X1 stopped, XT1 oscillating)

0.01

0.001
0 2 3 4 5 6 7

Supply voltage VDD [V]

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VDD vs IDD (mask ROM version, fX = fXX = 5.0 MHz)

(TA = 25°C)
10

PCC = 00H

PCC = 01H

PCC = 02H
PCC = 03H
PCC = 04H
PCC = 30H
HALT (X1 oscillating, Approximately the same curve
XT1 oscillating)
1
Supply current IDD [mA]

0.1

PCC = B0H

HALT (X1 stopped, XT1 oscillating)

0.01

0.001
0 2 3 4 5 6 7

Supply voltage VDD [V]

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 CHAPTER 32 PACKAGE DRAWINGS

80-PIN PLASTIC QFP (14x14)

60 41
61 40

detail of lead end

C D

R
Q

80 21
1 20

J
G H I M

P
K
S

N S L

NOTE
M
ITEM MILLIMETERS
Each lead centerline is located within 0.13 mm of A 17.20±0.20
its true position (T.P.) at maximum material condition. B 14.00±0.20
C 14.00±0.20
D 17.20±0.20
F 0.825
G 0.825
H 0.32±0.06
I 0.13
J 0.65 (T.P.)
K 1.60±0.20
L 0.80±0.20
M 0.17 +0.03
−0.07
N 0.10
P 1.40±0.10
Q 0.125±0.075
R +7°
3° −3°

S 1.70 MAX.
P80GC-65-8BT-1

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 CHAPTER 32 PACKAGE DRAWINGS

80-PIN PLASTIC TQFP (FINE PITCH) (12x12)

A
B

60 41
61 40

detail of lead end

C D

Q R

80 21
1 20

F
G J
H I M

P K
S

N S L
M
NOTE ITEM MILLIMETERS
Each lead centerline is located within 0.10 mm of A 14.0±0.2
its true position (T.P.) at maximum material condition. B 12.0±0.2
C 12.0±0.2
D 14.0±0.2
F 1.25
G 1.25
H 0.22±0.05
I 0.10
J 0.5 (T.P.)
K 1.0±0.2
L 0.5±0.2
M 0.145±0.05
N 0.10
P 1.0±0.05
Q 0.1±0.05
R 3° +7°
−3°
S 1.2 MAX.
S80GK-50-9EU-1

User's Manual U12013EJ3V2UD 661

 CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS

The µ PD780058 and 780058Y Subseries should be soldered and mounted under the following recommended
conditions.
For details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC Electronics
sales representative.

Table 33-1. Surface Mounting Type Soldering Conditions (1/4)

(1) µ PD780053GC-×××-8BT: 80-pin plastic QFP (14 × 14)

µ PD780054GC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780055GC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780056GC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780058GC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780058BGC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780053YGC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780054YGC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780055YGC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780056YGC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780058BYGC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780053GC(A)-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780054GC(A)-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780055GC(A)-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780056GC(A)-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780058BGC(A)-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780053YGC(A)-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780054YGC(A)-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780055YGC(A)-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780056YGC(A)-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD780058BYGC(A)-×××-8BT: 80-pin plastic QFP (14 × 14)

Soldering Soldering Conditions Recommended

Method Condition Symbol
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. IR35-00-2
(at 210°C or higher), Count: Twice or less
VPS Package peak temperature: 215°C, Time: 40 seconds max. VP15-00-2
(at 200°C or higher), Count: Twice or less
Wave soldering Soldering bath temperature: 260°C or less, Time: 10 seconds max., WS60-00-1
Count: Once, Preheating temperature: 120°C max. (package surface temperature)
Partial heating Pin temperature: 300°C or less, Time: 3 seconds max. (per pin row) –

Caution Do not use different soldering methods together (except for partial heating).

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Table 33-1. Surface Mounting Type Soldering Conditions (2/4)

(2) µ PD78F0058GC-8BT: 80-pin plastic QFP (14 × 14)

µ PD78F0058YGC-8BT: 80-pin plastic QFP (14 × 14)

Soldering Soldering Conditions Recommended

Method Condition Symbol
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher), IR35-107-2
Note
Count: Twice or less, Exposure limit: 7 days (after that, prebake at 125°C for 10 hours)
VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), VP15-107-2
Note
Count: Twice or less, Exposure limit: 7 days (after that, prebake at 125°C for 10 hours)
Wave soldering Soldering bath temperature: 260°C or less, Time: 10 seconds max., WS60-107-1
Count: Once, Preheating temperature: 120°C max. (package surface temperature),
Note
Exposure limit: 7 days (after that, prebake at 125°C for 10 hours)

Partial heating Pin temperature: 300°C or less, Time: 3 seconds max. (per pin row) –

Note After opening the dry pack, store it below 25°C and 65% RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

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 CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS

Table 33-1. Surface Mounting Type Soldering Conditions (3/4)

(3) µ PD780053GK-×××-9EU: 80-pin plastic TQFP (12 × 12)

µ PD780054GK-×××-9EU: 80-pin plastic TQFP (12 × 12)
µ PD780055GK-×××-9EU: 80-pin plastic TQFP (12 × 12)
µ PD780056GK-×××-9EU: 80-pin plastic TQFP (12 × 12)
µ PD780058GK-×××-9EU: 80-pin plastic TQFP (12 × 12)
µ PD780058BGK-×××-9EU: 80-pin plastic TQFP (12 × 12)
µ PD780053YGK-×××-9EU: 80-pin plastic TQFP (12 × 12)
µ PD780054YGK-×××-9EU: 80-pin plastic TQFP (12 × 12)
µ PD780055YGK-×××-9EU: 80-pin plastic TQFP (12 × 12)
µ PD780056YGK-×××-9EU: 80-pin plastic TQFP (12 × 12)
µ PD780058BYGK-×××-9EU: 80-pin plastic TQFP (12 × 12)

Soldering Soldering Conditions Recommended

Method Condition Symbol
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher), IR35-107-2
Note
Count: Twice or less, Exposure limit: 7 days (after that, prebake at 125°C for 10 hours)
VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), VP15-107-2
Note
Count: Twice or less, Exposure limit: 7 days (after that, prebake at 125°C for 10 hours)
Wave soldering – –
Partial heating Pin temperature: 300°C or less, Time: 3 seconds max. (per pin row) –

Note After opening the dry pack, store it below 25°C and 65% RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

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 CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS

Table 33-1. Surface Mounting Type Soldering Conditions (4/4)

(4) µ PD78F0058GK-9EU: 80-pin plastic TQFP (12 × 12)

µ PD78F0058YGK-9EU: 80-pin plastic TQFP (12 × 12)

Soldering Soldering Conditions Recommended

Method Condition Symbol
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher), IR35-103-2
Note
Count: Twice or less, Exposure limit: 3 days (after that, prebake at 125°C for 10 hours)
VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), VP15-103-2
Note
Count: Twice or less, Exposure limit: 3 days (after that, prebake at 125°C for 10 hours)
Wave soldering – –
Partial heating Pin temperature: 300°C or less, Time: 3 seconds max. (per pin row) –

Note After opening the dry pack, store it below 25°C and 65% RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

User's Manual U12013EJ3V2UD 665

 APPENDIX A DIFFERENCES BETWEEN µPD78054, 78058F, AND 780058 SUBSERIES

Table A-1 shows the major differences between the µPD78054, 78058F, and 780058 Subseries.

Table A-1. Major Differences Between µPD78054, 78058F, and 780058 Subseries (1/2)

Product Name µPD78054 Subseries µPD78058F Subseries µPD780058 Subseries

Item
EMI noise measures None Provided Provided
Supply voltage VDD = 2.0 to 6.0 V VDD = 2.7 to 6.0 V VDD = 1.8 to 5.5 VNote
PROM version µPD78P054, 78P058 µPD78P058F None
Flash memory version None None µPD78F0058
Internal ROM size µPD78052: 16 KB µPD78056F: 48 KB µPD780053: 24 KB
µPD78053: 24 KB µPD78058F: 60 KB µPD780054: 32 KB
µPD78054: 32 KB µPD78P058F: 60 KB µPD780055: 40 KB
µPD78P054: 32 KB µPD780056: 48 KB
µPD78056: 48 KB µPD780058B: 60 KB
µPD78058: 60 KB µPD780058: 60 KB
µPD78P058: 60 KB µPD78F0058: 60 KB
Internal high-speed RAM size µPD78052: 512 bytes 1,024 bytes 1,024 bytes
µPD78053, 78054, 78P054,
78056, 78058, 78P058:
1,024 bytes
I/O ports Total: 69 pins Total: 68 pins
• CMOS input: 2 pins • CMOS input: 2 pins
• CMOS I/O: 63 pins • CMOS I/O: 62 pins
• N-ch open-drain I/O: 4 pins • N-ch open-drain I/O: 4 pins
AVDD pin Power supply for A/D Power supply for A/D None (power supplied to port
converter converter and port output output buffer is VDD0)
buffer
AVREF0 pin Reference voltage input to A/D converter Reference voltage input and
analog power supply to A/D
converter
Caution on operation – – The results of the first A/D
immediately after A/D conversion immediately after
conversion starts the A/D conversion operation
has started (CS set to 1)
may not satisfy the ratings;
therefore take appropriate
measures such as discarding
the results.
Serial interface channel 2 3-wire serial I/O/UART mode 3-wire serial I/O/UART mode
with time division function
External maskable interrupts 7 sources 6 sources
Emulation probe EP-78230GC-R, EP-78054GK-R NP-80GC,
NP-80GK,
EP-78230GC-R,
EP-78054GK-R
Device file DF78054 DF780058

Note VDD of flash memory version (µPD78F0058) = 2.7 to 5.5 V

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 APPENDIX A DIFFERENCES BETWEEN µPD78054, 78058F, AND 780058 SUBSERIES

Table A-1. Major Differences Between µPD78054, 78058F, and 780058 Subseries (2/2)

Product Name µPD78054 Subseries µPD78058F Subseries µPD780058 Subseries

Item
Package • 80-pin plastic QFP • 80-pin plastic QFP • 80-pin plastic QFP
(14 × 14) (14 × 14) (14 × 14)
• 80-pin plastic QFP • 80-pin plastic QFP • 80-pin plastic TQFP
(14 × 14) (14 × 14) (Fine pitch) (12 × 12)
• 80-pin ceramic WQFN • 80-pin plastic TQFP
(14 × 14) (Fine pitch) (12 × 12)
(µPD78P054, 78P058 only) (µPD78058F only)
Electrical specifications and Refer to data sheet of individual product. See CHAPTERS 28 to 30
recommended soldering ELECTRICAL
conditions SPECIFICATIONS and
CHAPTER 33
RECOMMENDED
SOLDERING CONDITIONS.

User's Manual U12013EJ3V2UD 667

 APPENDIX B DEVELOPMENT TOOLS

The following development tools are available for the development of systems which employ the µPD780058,
780058Y Subseries.
Figure B-1 shows a configuration example of the tools.

• Support for PC98-NX series

Unless otherwise specified, products supported by IBM PC/ATTM compatible machines can be used for PC98-
NX series computers. When using PC98-NX series computers, refer to the description for IBM PC/AT
compatible machines.

• Windows
Unless otherwise specified, “Windows” means the following OSs.
• Windows 3.1
• Windows 95
• Windows 98
• Windows 2000
• Windows NTTM Ver. 4.0

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 APPENDIX B DEVELOPMENT TOOLS

Figure B-1. Configuration of Development Tools

Software package

• Software package

Language processing software Debugging software

• Assembler package • Integrated debugger

• C compiler package • System simulator
• Device file
• C library source fileNote 1

Control software
• Project Manager
(Windows only)Note 2 Embedded software

• Real-time OS

Host machine (PC or EWS)

Interface adapter,
PC card interface, etc.

Power supply unit

Flash memory In-circuit emulator

write environment

Emulation board
Flash programmer

Flash memory I/O board

write adapter

Performance board
Flash memory

Emulation probe

Conversion socket or
conversion adapter

Target system

Notes 1. The C library source file is not included in the software package.
2. The Project Manager is included in the assembler package.
The Project Manager is only used for Windows.

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 APPENDIX B DEVELOPMENT TOOLS

B.1 Software Package

SP78K0 This package contains various software tools for 78K/0 Series development.
Software package The following tools are included.
RA78K0, CC78K0, ID78K0-NS, SM78K0, and various device files

Part Number: µS××××SP78K0

Remark ×××× in the part number differs depending on the OS used.

µS××××SP78K0

×××× Host Machine OS Supply Medium

AB17 PC-9800 series, Windows (Japanese version) CD-ROM

BB17 IBM PC/AT compatibles Windows (English version)

B.2 Language Processing Software

RA78K0 This assembler converts programs written in mnemonics into object codes executable
Assembler package with a microcontroller.
Further, this assembler is provided with functions capable of automatically creating
symbol tables and branch instruction optimization.
This assembler should be used in combination with a device file (DF780058) (sold
separately).
<Precaution when using RA78K0 in PC environment>
This assembler package is a DOS-based application. It can also be used in Windows,
however, by using the Project Manager (included in assembler package) in Windows.

Part Number: µS××××RA78K0

CC78K0 This compiler converts programs written in C language into object codes executable with
C compiler package a microcontroller.
This compiler should be used in combination with an assembler package and device file
(both sold separately).
<Precaution when using CC78K0 in PC environment>
This C compiler package is a DOS-based application. It can also be used in Windows,
however, by using the Project Manager (included in assembler package) in Windows.

Part Number: µS××××CC78K0

DF780058Note 1 This file contains information peculiar to the device.
Device file This device file should be used in combination with tools (RA78K0, CC78K0, SM78K0,
ID78K0-NS, ID78K0, and RX78K0) (sold separately).
The corresponding OS and host machine differ depending on the tool used.

Part Number: µS××××DF780058

CC78K0-LNote 2 This is a source file of functions configuring the object library included in the C compiler
C library source file package.
This file is required to match the object library included in C compiler package to the
user’s specifications.
It does not depend on the operating environment because it is a source file.

Part Number: µS××××CC78K0-L

Notes 1. The DF780058 can be used in common with the RA78K0, CC78K0, SM78K0, ID78K0-NS, ID78K0, and
RX78K0.
2. CC78K0-L is not included in the software package (SP78K0).

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 APPENDIX B DEVELOPMENT TOOLS

Remark ×××× in the part number differs depending on the host machine and OS used.

µS××××RA78K0
µS××××CC78K0

×××× Host Machine OS Supply Medium

AB13 PC-9800 series, Windows (Japanese version) 3.5-inch 2HD FD

BB13 IBM PC/AT and compatibles Windows (English version)

AB17 Windows (Japanese version) CD-ROM

BB17 Windows (English version)

3P17 HP9000 series 700TM HP-UXTM (Rel. 10.10)

3K17 SPARCstationTM SunOSTM (Rel. 4.1.4),

SolarisTM (Rel. 2.5.1)

µS××××DF780058
µS××××CC78K0-L

×××× Host Machine OS Supply Medium

AB13 PC-9800 series, Windows (Japanese version) 3.5-inch 2HD FD

BB13 IBM PC/AT and compatibles Windows (English version)

3P16 HP9000 series 700 HP-UX (Rel. 10.10) DAT

3K13 SPARCstation SunOS (Rel. 4.1.4), 3.5-inch 2HD FD

3K15 Solaris (Rel. 2.5.1) 1/4-inch CGMT

B.3 Control Software

Project Manager This is control software designed to enable efficient user program development in the
Windows environment. All operations used in development of a user program, such as
starting the editor, building, and starting the debugger, can be performed from the Project
Manager.
<Caution>
The Project Manager is included in the assembler package (RA78K0).
It can only be used in Windows.

B.4 Flash Memory Writing Tools

Flashpro III Flash programmer dedicated to microcontrollers with on-chip flash memory.
(Part number: FL-PR3, PG-FP3)
Flashpro IV
(Part number: FL-PR4, PG-FP4)
Flash programmer

FA-80GC-8BT Flash memory writing adapter used connected to Flashpro III/Flashpro IV.
FA-80GK-9EU • FA-80GC-8BT: 80-pin plastic QFP (GC-8BT type)
Flash memory writing adapter • FA-80GK-9EU: 80-pin plastic TQFP (GK-9EU type)

Remark FL-PR3, FL-PR4, FA-80GC-8EU, and FA-80GK-9EU are products of Naito Densei Machida Mfg. Co.,
Ltd.
Contact: +81-45-475-4191 Naito Densei Machida Mfg. Co., Ltd.

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 APPENDIX B DEVELOPMENT TOOLS

B.5 Debugging Tools (Hardware)

B.5.1 When using in-circuit emulator IE-78K0-NS, IE-78K0-NS-A

IE-78K0-NS The in-circuit emulator serves to debug hardware and software when developing
In-circuit emulator application systems using a 78K/0 Series product. It corresponds to an integrated
debugger (ID78K0-NS). This emulator should be used in combination with a power
supply unit, emulation probe, and interface adapter which is required to connect this
emulator to the host machine.

IE-78K0-NS-PA This board is used for extending the IE-78K0-NS functions, and is used connected to
Performance board the IE-78K0-NS. With the addition of this board, the addition of a coverage function,
enhancement of tracer and timer functions, and other such debugging function
enhancements are possible.

IE-78K0-NS-A In-circuit emulator that combines the IE-78K0-NS and IE-78K0-NS-PA

In-circuit emulator
IE-70000-MC-PS-B This adapter is used for supplying power from a 100 to 240 V AC output.
Power supply unit

IE-70000-98-IF-C This adapter is required when using a PC-9800 series computer (except notebook type)
Interface adapter as the IE-78K0-NS host machine (C bus compatible).

IE-70000-CD-IF-A This is PC card and interface cable required when using a notebook-type computer as
PC card interface the IE-78K0-NS host machine (PCMCIA socket compatible).

IE-70000-PC-IF-C This adapter is required when using an IBM PC/AT compatible computer as the IE-78K0-
Interface adapter NS host machine (ISA bus compatible).

IE-70000-PCI-IF-A This adapter is required when using a PC with a PCI bus as the IE-78K0-NS host
Interface adapter machine.

IE-780308-NS-EM1 This board emulates the operations of the peripheral hardware peculiar to a device
Emulation board (common to µPD780308 subseries). It should be used in combination with an in-circuit
emulator.

NP-80GC-TQ This probe is used to connect the in-circuit emulator to the target system and is designed
NP-H80GC-TQ for an 80-pin plastic QFP (GC-8BT type). It should be used in combination with the TGC-
Emulation probe 080SBP.

TGC-080SBP This conversion socket connects the NP-80GC-TQ or NP-H80GC-TQ to the target
Conversion adapter system board designed to mount an 80-pin plastic QFP (GC-8BT type).
(See Figure B-2)

NP-80GC This probe is for an 80-pin plastic QFP (GC-8BT type) and connects an in-circuit
Emulation Probe emulator and the target system.

EV-9200GC-80 This conversion socket connects the board of the target system created to mount an
Conversion Socket 80-pin plastic QFP (GC-8BT type) and NP-80GC.
(See Figure B-2)

NP-80GK This probe is for an 80-pin plastic TQFP (GK-9EU type) and connects an in-circuit
Emulation Probe emulator and the target system.
TGK-080SDW This conversion adapter connects the board of the target system created to mount
Conversion Adapter 80-pin plastic TQFP (GK-9EU type) and TGK-080SDW.

(See Figure B-3)

Remarks 1. NP-80GC, NP-80GC-TQ, NP-H80GC-TQ, and NP-80GK are products of Naito Densei Machida Mfg.
Co., Ltd.
Contact: +81-45-475-4191 Naito Densei Machida Mfg. Co., Ltd.
2. TGC-080SBP and TGK-080SDW are products of TOKYO ELETECH CORPORATION.
Inquiry: Daimaru Kogyo, Ltd. Phone: Tokyo +81-3-3820-7112 Electronics Dept.
Osaka +81-6-6244-6672 Electronics 2nd Dept.

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B.5.2 When using in-circuit emulator IE-78001-R-A

IE-78001-R-A This is an in-circuit emulator for debugging the hardware and software when an
In-circuit emulator application system using the 78K/0 Series is developed. It supports an integrated
debugger (ID78K0). This emulator is used with an emulation probe and interface
adapter for connecting a host machine.

IE-70000-98-IF-C This adapter is necessary when a PC-9800 series PC (except notebook type) is
Interface adapter used as the host machine for the IE-78001-R-A (C bus compatible).

IE-70000-PC-IF-C This adapter is necessary when an IBM PC/AT or compatible machine is used as
Interface adapter the host machine for the IE-78001-R-A (ISA bus compatible).

IE-780308-R-EM This board is used with an in-circuit emulator to emulate device-specific peripheral
Emulation board hardware.

EP-78230GC-R This probe is for an 80-pin plastic QFP (GC-8BT type) and connects an in-circuit
Emulation probe emulator and the target system.

EV-9200GC-80 This conversion socket connects the board of the target system created to mount an
Conversion socket 80-pin plastic QFP (GC-8BT type) and EP-78230GC-R.
(See Figure B-2)

EP-78054GK-R This probe is for an 80-pin plastic TQFP (GK-9EU type) and connects an in-circuit
Emulation probe emulator and the target system.

TGK-080SDW This conversion adapter connects the board of the target system created to mount
Conversion adapter an 80-pin plastic TQFP (GK-9EU type) and EP-78054GK-R.
(See Figure B-3)

Remarks 1. TGK-080SDW is a product of TOKYO ELETECH CORPORATION.

Inquiry: Daimaru Kogyo, Ltd. Phone: Tokyo +81-3-3820-7112 Electronics Dept.
Osaka +81-6-6244-6672 Electronics 2nd Dept.
2. The EV-9200GC-80 is sold in sets of five units.
3. The TGK-080SDW is sold in single units.

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 APPENDIX B DEVELOPMENT TOOLS

B.6 Debugging Tools (Software)

SM78K0 This is a system simulator for the 78K/0 Series. The SM78K0 is Windows-based
System simulator software.
It is used to perform debugging at the C source level or assembler level while simulating
the operation of the target system on a host machine.
Use of the SM78K0 allows the execution of application logical testing and performance
testing on an independent basis from hardware development, thereby providing higher
development efficiency and software quality.
The SM78K0 should be used in combination with a device file (DF780058) (sold
separately).

Part Number: µS××××SM78K0

ID78K0-NS This debugger supports the in-circuit emulators for the 78K/0 Series. The
Integrated debugger ID78K0-NS is Windows-based software.
(supporting in-circuit emulators It has improved C-compatible debugging functions and can display the results of
IE-78K0-NS and IE-78K0-NS-A) tracing with the source program using an integrating window function that associates
the source program, disassemble display, and memory display with the trace result.
ID78K0
It should be used in combination with a device file (sold separately).
Integrated debugger
(supporting in-circuit emulator Part Number: µS××××ID78K0-NS
IE-78001-R-A) µS××××ID78K0

Remark ×××× in the part number differs depending on the host machine and OS used.

µS××××SM78K0
µS××××ID78K0-NS
µS××××ID78K0

×××× Host Machine OS Supply Medium

AB13 PC-9800 series, Windows (Japanese version) 3.5-inch 2HD FD

IBM PC/AT and compatibles
BB13 Windows (English version)

AB17 Windows (Japanese version) CD-ROM

BB17 Windows (English version)

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 APPENDIX B DEVELOPMENT TOOLS

B.7 Embedded Software

RX78K0 The RX78K0 is a real-time OS conforming to the µITRON specifications.

Real-time OS A tool (configurator) for generating the nucleus of the RX78K0 and multiple information
tables is supplied.
Used in combination with an assembler package (RA78K0) and device file (DF780058)
(both sold separately).
<Precaution when using RX78K0 in PC environment>
The real-time OS is a DOS-based application. It should be used in the DOS prompt when
using in Windows.
Part number: µS××××RX78013-∆∆∆∆

Caution When purchasing the RX78K0, fill in the purchase application form in advance and sign the user
agreement.

Remark ×××× and ∆∆∆∆ in the part number differ depending on the host machine and OS used.

µS××××RX78013-∆∆∆∆

∆∆∆∆ Product Outline Maximum Number for Use in Mass Production

001 Evaluation object Do not use for mass-produced product.

100K Mass-production object 0.1 million units

001M 1 million units
010M 10 million units
S01 Source program Source program for mass-produced object

×××× Host Machine OS Supply Medium

AA13 PC-9800 series Windows (Japanese version) 3.5-inch 2HD FD

AB13 IBM PC/AT and compatibles Windows (Japanese version)

BB13 Windows (English version)

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 APPENDIX B DEVELOPMENT TOOLS

B.8 System-Upgrade Method from Former In-Circuit Emulator for 78K/0 Series to IE-78001-R-A

If you already have a former in-circuit emulator for 78K/0 Series microcontrollers (IE-78000-R or IE-78000-R-A),
that in-circuit emulator can operate as an equivalent to the IE-78001-R-A by replacing its internal break board with
the IE-78001-R-BK.

Table B-1. System-Upgrade Method from Former In-Circuit Emulator for 78K/0 Series to IE-78001-R-A

In-Circuit Emulator Owned In-Circuit Emulator Cabinet System-UpNote Board to Be Purchased

IE-78000-R Required IE-78001-R-BK

IE-78000-R-A Not required

Note For upgrading a cabinet, send your in-circuit emulator to NEC Electronics.

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 APPENDIX B DEVELOPMENT TOOLS

B.9 Drawing and Footprint for Conversion Socket (EV-9200GC-80)

Figure B-2. EV-9200GC-80 Drawing (For Reference Only)

A M
E B N O
F

R
D

S
J

K
L
EV-9200GC-80

Q
No.1 pin index
P

G
H
I
EV-9200GC-80-G0
ITEM MILLIMETERS INCHES
A 18.0 0.709
B 14.4 0.567
C 14.4 0.567
D 18.0 0.709
E 4-C 2.0 4-C 0.079
F 0.8 0.031
G 6.0 0.236
H 16.0 0.63
I 18.7 0.736
J 6.0 0.236
K 16.0 0.63
L 18.7 0.736
M 8.2 0.323
O 8.0 0.315
N 2.5 0.098
P 2.0 0.079
Q 0.35 0.014
R φ 2.3 φ 0.091

S φ 1.5 φ 0.059

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 APPENDIX B DEVELOPMENT TOOLS

Figure B-3. EV-9200GC-80 Footprint (For Reference Only)

Based on EV-9200GC-80
(2) Pad drawing (in mm)

J
K

D
E
F

H
L

I
C
B
A

EV-9200GC-80-P1E
ITEM MILLIMETERS INCHES
A 19.7 0.776
B 15.0 0.591
C 0.65±0.02 × 19=12.35±0.05 0.026+0.001
–0.002 × 0.748=0.486 –0.002
+0.003

D 0.65±0.02 × 19=12.35±0.05 0.026+0.001

–0.002 × 0.748=0.486 –0.002
+0.003

E 15.0 0.591
F 19.7 0.776
G 6.0 ± 0.05 0.236+0.003
–0.002

H 6.0 ± 0.05 0.236+0.003

–0.002

I 0.35 ± 0.02 0.014+0.001

–0.001

J φ 2.36 ± 0.03 φ 0.093+0.001

–0.002

K φ 2.3 φ 0.091

L φ 1.57 ± 0.03 φ 0.062+0.001

–0.002

Caution Dimensions of mount pad for EV-9200 and that for target
device (QFP) may be different in some parts. For the
recommended mount pad dimensions for QFP, refer to
"SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL" (C10535E).

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 APPENDIX B DEVELOPMENT TOOLS

B.10 Drawing of Conversion Adapter (TGK-080SDW, TGC-080SBP)

Figure B-4. TGK-080SDW Drawing (For Reference Only) (Unit: mm)

TGK-080SDW (TQPACK080SD + TQSOCKET080SDW)

Package dimension (unit: mm)

A
B
C U
T
D V
R
Q
Q
Q c e
M2 screw
H b
G F E P a
S
O d
O
O
N
K W Z
I JJJ L L LM
X
Y
g v
k f u
r
t
j
i s
h q
p
l Protrusion : 4 places
n o
m
ITEM MILLIMETERS INCHES ITEM MILLIMETERS INCHES
A 18.0 0.709 a 0.5x19=9.5±0.10 0.020x0.748=0.374±0.004
B 11.77 0.463 b 0.25 0.010
C 0.5x19=9.5 0.020x0.748=0.374 c φ 5.3 φ 0.209
D 0.5 0.020 d φ 5.3 φ 0.209
E 0.5x19=9.5 0.020x0.748=0.374 e φ 1.3 φ 0.051
F 11.77 0.463 f φ 3.55 φ 0.140
G 18.0 0.709 g φ 0.3 φ 0.012
H 0.5 0.020 h 1.85±0.2 0.073±0.008
I 1.58 0.062 i 3.5 0.138
J 1.2 0.047 j 2.0 0.079
K 7.64 0.301 k 3.0 0.118
L 1.2 0.047 l 0.25 0.010
M 1.58 0.062 m 14.0 0.551
N 1.58 0.062 n 1.4±0.2 0.055±0.008
O 1.2 0.047 o 1.4±0.2 0.055±0.008
P 7.64 0.301 p h=1.8 φ 1.3 h=0.071 φ 0.051
Q 1.2 0.047 q 0~5° 0.000~0.197°
R 1.58 0.062 r 5.9 0.232
S φ 3.55 φ 0.140 s 0.8 0.031
T C 2.0 C 0.079 t 2.4 0.094
U 12.31 0.485 u 2.7 0.106
V 10.17 0.400 v 3.9 0.154
W 6.8 0.268 TGK-080SDW-G1E
X 8.24 0.324
Y 14.8 0.583
Z 1.4±0.2 0.055±0.008

note: Product by TOKYO ELETECH CORPORATION.

User's Manual U12013EJ3V2UD 679

 APPENDIX B DEVELOPMENT TOOLS

Figure B-5. TGC-080SBP Drawing (For Reference Only) (Unit: mm)

Reference diagram: TGC-080SBP (TQPACK080SB+TQSOCKET080SBP)

Package dimension (unit: mm)

I A J
B K
C W

G F E D L V

S
Protrusion height T
U
M

O
H
P
Y Q
Z

g X
m
l
c
a
;

f ITEM MILLIMETERS INCHES ITEM MILLIMETERS INCHES

A 21.0 0.827 a (16.95) (0.667)
b e B 0.65x19=12.35 0.026x0.748=0.486 b 7.35 0.289
C 0.65 0.026 c 1.2 0.047
d D 10.35 0.407 d 1.85 0.073
E 12.75 0.502 e 3.5 0.138
j k
h i F 15.15 0.596 f 2.0 0.079
G 17.55 0.691 g 6.0 0.236
H 14.47 0.570 h 0.25 0.010
I C 2.0 C 0.079 i 13.95 0.549
J 14.95 0.589 j 1.025 0.040
K 13.95 0.549 k 1.025 0.040
L 13.7 0.539 l 2.4 0.094
M 1.15 0.045 m 2.7 0.106
N 1.15 0.045 TGC-080SBP-G0E
O 12.62 0.497
P 17.52 0.690
Q 21.0 0.827
R 5.0 0.197
S 4- φ 1.3 4- φ 0.051
T 1.8 0.071
U φ 5.3 φ 0.209
V 7.7 0.303
W 4-C 1.0 4-C 0.039
X φ 3.55 φ 0.140
Y φ 0.9 φ 0.035
Z φ 0.3 φ 0.012

note: Product by TOKYO ELETECH CORPORATION.

680 User's Manual U12013EJ3V2UD

 APPENDIX B DEVELOPMENT TOOLS

B.11 Cautions on Designing Target System

Figures B-6 to B-9 show the conditions when connecting the emulation probe to the conversion socket. Follow
the configuration below and consider the shape of parts to be mounted on the target system when designing a system.

(1) NP-80GC, NP-80GC-TQ, NP-H80GC-TQ

Figure B-6. Distance Between In-Circuit Emulator and Conversion Socket (80GC)

In-circuit emulator
IE-78K0-NS or IE-78K0-NS-A

Target system

Emulation board
IE-780308-NS-EM1

155 mmNote

CN6

Emulation probe
NP-80GC, NP-80GC-TQ, Conversion socket
NP-H80GC-TQ EV-9200GC-80 or
conversion adapter
TGC-080SBP

Note When NP-H80GC-TQ is used, the distance is 355 mm.

Remark NP-80GC, NP-80GC-TQ, and NP-H80GC-TQ are products of Naito Densei Machida Mfg. Co., Ltd.
TGC-080SBP is a product of TOKYO ELETECH CORPORATION.

User's Manual U12013EJ3V2UD 681

 APPENDIX B DEVELOPMENT TOOLS

Figure B-7. Connection Condition of Target System (NP-80GC-TQ)

Emulation board
IE-780308-NS-EM1

Emulation probe
NP-80GC-TQ

23 mm

Conversion socket
TGC-080SBP 11 mm

40 mm 34 mm

Target system

Remark NP-80GC-TQ is a product of Naito Densei Machida Mfg. Co., Ltd.

TGC-080SBP is a product of TOKYO ELETECH CORPORATION.

682 User's Manual U12013EJ3V2UD

 APPENDIX B DEVELOPMENT TOOLS

(2) NP-80GK, NP-H80GK-TQ

Figure B-8. Distance Between In-Circuit Emulator and Conversion Socket (80GK)

In-circuit emulator
IE-78K0-NS or IE-78K0-NS-A

Target system

Emulation board
IE-780308-NS-EM1

155 mmNote

CN6

Emulation probe
NP-80GK, NP-H80GK-TQ Conversion adapter
TGK-080SDW

Note When NP-H80GK-TQ is used, the distance is 355 mm.

Remark NP-80GK and NP-H80GK-TQ are products of Naito Densei Machida Mfg. Co., Ltd.
TGK-080SDW is a product of TOKYO ELETECH CORPORATION.

User's Manual U12013EJ3V2UD 683

 APPENDIX B DEVELOPMENT TOOLS

Figure B-9. Connection Condition of Target System (NP-80GK)

Emulation board
IE-780308-NS-EM1

Emulation probe
NP-80GK

23 mm

Extension probe
TGK-080SDW 11 mm

40 mm 34 mm

Target system

Remark NP-80GK is a product of Naito Densei Machida Mfg. Co., Ltd.

TGK-080SDW is a product of TOKYO ELETECH CORPORATION.

684 User's Manual U12013EJ3V2UD

 APPENDIX C REGISTER INDEX

C.1 Register Index (Register Name)

16-bit timer mode control register (TMC0) ........................................................................................................ 171

16-bit timer output control register (TOC0) ....................................................................................................... 174
16-bit timer register (TM0) ................................................................................................................................. 168
8-bit timer mode control register (TMC1) .......................................................................................................... 216
8-bit timer output control register (TOC1) ......................................................................................................... 217
8-bit timer register 1 (TM1) ................................................................................................................................ 213
8-bit timer register 2 (TM2) ................................................................................................................................ 213

[A]
A/D conversion result register (ADCR) ............................................................................................................. 256
A/D converter input select register (ADIS) ........................................................................................................ 260
A/D converter mode register (ADM) .................................................................................................................. 258
Asynchronous serial interface mode register (ASIM) ....................................................................................... 433
Asynchronous serial interface status register (ASIS) ....................................................................................... 436
Automatic data transmit/receive address pointer (ADTP) ................................................................................ 385
Automatic data transmit/receive control register (ADTC) ................................................................................ 389
Automatic data transmit/receive interval specification register (ADTI) ............................................................ 390

[B]
Baud rate generator control register (BRGC) ................................................................................................... 437

[C]
Capture/compare control register 0 (CRC0) ..................................................................................................... 173
Capture/compare register 00 (CR00) ................................................................................................................ 167
Capture/compare register 01 (CR01) ................................................................................................................ 168
Compare register 10 (CR10) ............................................................................................................................. 213
Compare register 20 (CR20) ............................................................................................................................. 213
Correction address register 0 (CORAD0) ......................................................................................................... 526
Correction address register 1 (CORAD1) ......................................................................................................... 526
Correction control register (CORCN) ................................................................................................................ 527

[D]
D/A conversion value set register 0 (DACS0) .................................................................................................. 277
D/A conversion value set register 1 (DACS1) .................................................................................................. 277
D/A converter mode register (DAM) .................................................................................................................. 278

[E]
External interrupt mode register 0 (INTM0) ............................................................................................. 177, 483
External interrupt mode register 1 (INTM1) ............................................................................................. 261, 483

[I]
Internal expansion RAM size switching register (IXS) ..................................................................................... 537
Internal memory size switching register (IMS) ........................................................................................ 506, 536

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 APPENDIX C REGISTER INDEX

Interrupt mask flag register 0H (MK0H) ............................................................................................................ 481

Interrupt mask flag register 0L (MK0L) ............................................................................................................. 481
Interrupt mask flag register 1L (MK1L) .................................................................................................... 481, 499
Interrupt request flag register 0H (IF0H) ........................................................................................................... 480
Interrupt request flag register 0L (IF0L) ............................................................................................................ 480
Interrupt request flag register 1L (IF1L) ................................................................................................... 480, 499
Interrupt timing specification register (SINT) ........................................................................................... 294, 345

[K]
Key return mode register (KRM) .............................................................................................................. 143, 500

[M]
Memory expansion mode register (MM) .................................................................................................. 142, 505

[O]
Oscillation mode select register (OSMS) .......................................................................................................... 151
Oscillation stabilization time select register (OSTS) ........................................................................................ 514

[P]
Port 0 (P0) ......................................................................................................................................................... 122
Port 1 (P1) ......................................................................................................................................................... 124
Port 12 (P12) ...................................................................................................................................................... 136
Port 13 (P13) ...................................................................................................................................................... 137
Port 2 (P2) ................................................................................................................................................ 125, 127
Port 3 (P3) ......................................................................................................................................................... 129
Port 4 (P4) ......................................................................................................................................................... 130
Port 5 (P5) ......................................................................................................................................................... 131
Port 6 (P6) ......................................................................................................................................................... 132
Port 7 (P7) ......................................................................................................................................................... 134
Port mode register 0 (PM0) ............................................................................................................................... 138
Port mode register 1 (PM1) ............................................................................................................................... 138
Port mode register 12 (PM12) .................................................................................................................. 138, 472
Port mode register 13 (PM13) ........................................................................................................................... 138
Port mode register 2 (PM2) ............................................................................................................................... 138
Port mode register 3 (PM3) ............................................................................................. 138, 176, 218, 249, 253
Port mode register 5 (PM5) ............................................................................................................................... 138
Port mode register 6 (PM6) ............................................................................................................................... 138
Port mode register 7 (PM7) ............................................................................................................................... 138
Priority specify flag register 0H (PR0H) ............................................................................................................ 482
Priority specify flag register 0L (PR0L) ............................................................................................................. 482
Priority specify flag register 1L (PR1L) ............................................................................................................. 482
Processor clock control register (PCC) ............................................................................................................. 148
Program status word (PSW) ....................................................................................................................... 96, 487
Pull-up resistor option register H (PUOH) ........................................................................................................ 141
Pull-up resistor option register L (PUOL) .......................................................................................................... 141

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 APPENDIX C REGISTER INDEX

[R]
Real-time output buffer register H (RTBH) ....................................................................................................... 471
Real-time output buffer register L (RTBL) ........................................................................................................ 471
Real-time output port control register (RTPC) .................................................................................................. 473
Real-time output port mode register (RTPM) ................................................................................................... 472
Receive buffer register (RXB) ........................................................................................................................... 431
Receive shift register (RXS) .............................................................................................................................. 431

[S]
Sampling clock select register (SCS) ....................................................................................................... 178, 485
Serial bus interface control register (SBIC) ............................................................................................. 293, 343
Serial I/O shift register 0 (SIO0) ............................................................................................................... 286, 338
Serial I/O shift register 1 (SIO1) ........................................................................................................................ 385
Serial interface pin select register (SIPS) ......................................................................................................... 441
Serial operating mode register 0 (CSIM0) ............................................................................................... 290, 342
Serial operating mode register 1 (CSIM1) ........................................................................................................ 388
Serial operating mode register 2 (CSIM2) ........................................................................................................ 432
Slave address register (SVA) ................................................................................................................... 286, 338

[T]
Timer clock select register 0 (TCL0) ........................................................................................................ 169, 247
Timer clock select register 1 (TCL1) ................................................................................................................. 214
Timer clock select register 2 (TCL2) ................................................................................................ 233, 241, 251
Timer clock select register 3 (TCL3) ................................................................................................ 288, 340, 386
Transmit shift register (TXS) ............................................................................................................................. 431

[W]
Watch timer mode control register (TMC2) ...................................................................................................... 236
Watchdog timer mode register (WDTM) ........................................................................................................... 243

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 APPENDIX C REGISTER INDEX

C.2 Register Index (Symbol)

[A]
ADCR: A/D conversion result register ........................................................................................................ 256
ADIS: A/D converter input select register ................................................................................................. 260
ADM: A/D converter mode register .......................................................................................................... 258
ADTC: Automatic data transmit/receive control register ........................................................................... 389
ADTI: Automatic data transmit/receive interval specification register .................................................... 390
ADTP: Automatic data transmit/receive address pointer .......................................................................... 385
ASIM: Asynchronous serial interface mode register ................................................................................ 433
ASIS: Asynchronous serial interface status register ............................................................................... 436

[B]
BRGC: Baud rate generator control register .............................................................................................. 437

[C]
CORAD0: Correction address register 0 ......................................................................................................... 526
CORAD1: Correction address register 1 ......................................................................................................... 526
CORCN: Correction control register .............................................................................................................. 527
CR00: Capture/compare register 00 .......................................................................................................... 167
CR01: Capture/compare register 01 .......................................................................................................... 168
CR10: Compare register 10 ....................................................................................................................... 213
CR20: Compare register 20 ....................................................................................................................... 213
CRC0: Capture/compare control register 0 ............................................................................................... 173
CSIM0: Serial operating mode register 0 ........................................................................................... 290, 342
CSIM1: Serial operating mode register 1 .................................................................................................... 388
CSIM2: Serial operating mode register 2 .................................................................................................... 432

[D]
DACS0: D/A conversion value set register 0 ............................................................................................... 277
DACS1: D/A conversion value set register 1 ............................................................................................... 277
DAM: D/A converter mode register .......................................................................................................... 278

[I]
IF0H: Interrupt request flag register 0H ................................................................................................... 480
IF0L: Interrupt request flag register 0L .................................................................................................... 480
IF1L: Interrupt request flag register 1L ........................................................................................... 480, 499
IMS: Internal memory size switching register ............................................................................... 506, 536
INTM0: External interrupt mode register 0 ........................................................................................ 177, 483
INTM1: External interrupt mode register 1 ........................................................................................ 261, 483
IXS: Internal expansion RAM size switching register ............................................................................ 537

[K]
KRM: Key return mode register ....................................................................................................... 143, 500

[M]
MK0H: Interrupt mask flag register 0H ....................................................................................................... 481
MK0L: Interrupt mask flag register 0L ....................................................................................................... 481

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 APPENDIX C REGISTER INDEX

MK1L: Interrupt mask flag register 1L .............................................................................................. 481, 499

MM: Memory expansion mode register ......................................................................................... 142, 505

[O]
OSMS: Oscillation mode selection register ................................................................................................ 151
OSTS: Oscillation stabilization time select register ................................................................................... 514

[P]
P0: Port 0 ............................................................................................................................................... 122
P1: Port 1 ............................................................................................................................................... 124
P12: Port 12 ............................................................................................................................................. 136
P13: Port 13 ............................................................................................................................................. 137
P2: Port 2 ...................................................................................................................................... 125, 127
P3: Port 3 ............................................................................................................................................... 129
P4: Port 4 ............................................................................................................................................... 130
P5: Port 5 ............................................................................................................................................... 131
P6: Port 6 ............................................................................................................................................... 132
P7: Port 7 ............................................................................................................................................... 134
PCC: Processor clock control register ..................................................................................................... 148
PM0: Port mode register 0 ....................................................................................................................... 138
PM1: Port mode register 1 ....................................................................................................................... 138
PM12: Port mode register 12 ............................................................................................................ 138, 472
PM13: Port mode register 13 ..................................................................................................................... 138
PM2: Port mode register 2 ....................................................................................................................... 138
PM3: Port mode register 3 ..................................................................................... 138, 176, 218, 249, 253
PM5: Port mode register 5 ....................................................................................................................... 138
PM6: Port mode register 6 ....................................................................................................................... 138
PM7: Port mode register 7 ....................................................................................................................... 138
PR0H: Priority specification flag register 0H ............................................................................................. 482
PR0L: Priority specification flag register 0L .............................................................................................. 482
PR1L: Priority specification flag register 1L .............................................................................................. 482
PSW: Program status word ................................................................................................................ 96, 487
PUOH: Pull-up resistor option register H ................................................................................................... 141
PUOL: Pull-up resistor option register L .................................................................................................... 141

[R]
RTBH: Real-time output buffer register H .................................................................................................. 471
RTBL: Real-time output buffer register L .................................................................................................. 471
RTPC: Real-time output port control register ............................................................................................ 473
RTPM: Real-time output port mode register .............................................................................................. 472
RXB: Receive buffer register .................................................................................................................... 431
RXS: Receive shift register ...................................................................................................................... 431

[S]
SBIC: Serial bus interface control register ...................................................................................... 293, 343
SCS: Sampling clock select register ............................................................................................... 178, 485
SFR: Special-function register ................................................................................................................. 115
SINT: Interrupt timing specification register .................................................................................... 294, 345

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 APPENDIX C REGISTER INDEX

SIO0: Serial I/O shift register 0 ........................................................................................................ 286, 338

SIO1: Serial I/O shift register 1 ................................................................................................................. 385
SIPS: Serial interface pin select register .................................................................................................. 441
SVA: Slave address register ........................................................................................................... 286, 338

[T]
TCL0: Timer clock select register 0 ................................................................................................. 169, 247
TCL1: Timer clock select register 1 .......................................................................................................... 214
TCL2: Timer clock select register 2 ......................................................................................... 233, 241, 251
TCL3: Timer clock select register 3 ......................................................................................... 288, 340, 386
TM0: 16-bit timer register ......................................................................................................................... 168
TM1: 8-bit timer register 1 ........................................................................................................................ 213
TM2: 8-bit timer register 2 ........................................................................................................................ 213
TMC0: 16-bit timer mode control register .................................................................................................. 171
TMC1: 8-bit timer mode control register .................................................................................................... 216
TMC2: Watch timer mode control register ................................................................................................. 236
TOC0: 16-bit timer output control register ................................................................................................. 174
TOC1: 8-bit timer output control register ................................................................................................... 217
TXS: Transmit shift register ..................................................................................................................... 431

[W]
WDTM: Watchdog timer mode register ....................................................................................................... 243

690 User's Manual U12013EJ3V2UD

 APPENDIX D REVISION HISTORY

The revision history of this edition is listed in the table below. “Chapter” indicates the chapter of the previous edition
where the revision was made.

Edition Revisions Chapter

2nd Change of following block diagrams of ports: CHAPTER 6 PORT FUNCTIONS

edition Figures 6-5 and 6-7 P20, P21, and P23 to P26 Block Diagram,
Figures 6-6 and 6-8 P22 and P27 Block Diagram, Figure 6-9
P30 to P37 Block Diagram, and Figure 6-16 P71 and P72
Block Diagram

Addition of Table 7-2 Relationships between CPU Clock and CHAPTER 7 CLOCK GENERATOR
Minimum Instruction Execution Time

Addition of Figures 9-10 and 9-13 Square Wave Output CHAPTER 9 8-BIT TIMER/EVENT COUNTER
Operation Timing

Addition of (7) Conversion result immediately after A/D CHAPTER 14 A/D CONVERTER
converter start to 14.5 How to Read the A/D Converter
Characteristics Table

Correction of Note on BSYE in Figure 16-5 Serial Bus CHAPTER 16 SERIAL INTERFACE
Interface Control Register Format CHANNEL 0 (µPD780058 Subseries)

Addition of Caution to 16.4.3 (2) (a) Bus release signal (REL)

and (b) Command signal (CMD)

Addition of (3) MSB/LSB switching as the start bit to 18.4.2 CHAPTER 18 SERIAL INTERFACE
3-wire serial I/O mode operation CHANNEL 1

Change of 18.4.3 (3) (d) Busy control option, (e) Busy &
strobe control option, and (f) Bit slippage detection function
in old edition to (4) Synchronization control, and improvement
of explanation

Correction of Figure 19-11 Receive Error Timing CHAPTER 19 SERIAL INTERFACE

Addition of (3) MSB/LSB switching as the start bit to 19.4.3 CHANNEL 2

3-wire serial I/O mode

Addition of 19.4.4 Restrictions in UART mode

Addition of Note to 26.1 Memory Size Switching Register CHAPTER 26 µPD78F0058, 78F0058Y

26.3 Flash Memory Programming

Change of product name of flash programmer from Flashpro to
Flashpro II

Addition of APPENDIX A DIFFERENCES AMONG µPD78054, APPENDIX A DIFFERENCES AMONG

78058F, AND 780058 SUBSERIES µPD78054, 78058F, AND 780058 SUBSERIES

Total revision: Support of in-circuit emulators IE-78K0-NS and APPENDIX B DEVELOPMENT TOOLS
IE-78001-R-A

Total revision: Deletion of fuzzy inference development support APPENDIX C EMBEDDED SOFTWARE
system

User's Manual U12013EJ3V2UD 691

 APPENDIX D REVISION HISTORY

Edition Revisions Chapter

3rd edition Deletion of following product Throughout

• µPD780058Y
Addition of following products
• µPD780058B, 780058BY, 780053(A), 780053Y(A), 780054(A), 780054Y(A),
780055(A), 780055Y(A), 780056(A), 780056Y(A), 780058B(A), 780058BY(A)
Deletion of following packages
• 80-pin plastic QFP (GC-3B9 type)
• 80-pin plastic TQFP (GK-BE9 type)

Addition of following package

• 80-pin plastic TQFP (GK-9EU type)
1.1 Features, 1.7 Outline of Functions CHAPTER 1 OUTLINE
• Change of operating voltage range of A/D and D/A converters of (µPD780058 SUBSERIES)
µPD780058 and 78F0058
• Change of supply voltage of µPD78F0058
Addition of 1.9 Differences Between Standard Model and (A) Model

2.1 Features, 2.7 Outline of Functions CHAPTER 2 OUTLINE

• Change of operating voltage range of A/D and D/A converters of (µPD780058Y SUBSERIES)
µPD78F0058Y
• Change of supply voltage of µPD78F0058Y
Addition of 2.9 Differences Between Standard Model and (A) Model
Change of processing when A/D converter is not used in 3.2.11 AVREF0 CHAPTER 3 PIN FUNCTIONS

Change of recommended connection of unused pins and connection of P60 (µPD780058 SUBSERIES)
to P63, AVREF1, and VPP pins in Table 3-1 Pin I/O Circuit Types
Change of processing when A/D converter is not used in 4.2.11 AVREF0 CHAPTER 4 PIN FUNCTIONS
Change of recommended connection of unused pins and connection of P60 (µPD780058Y SUBSERIES)
to P63, AVREF1, and VPP pins in Table 4-1 Pin I/O Circuit Types
Modification of Note 2 in 6.2.8 Port 6 CHAPTER 6 PORT FUNCTIONS

Addition of note on feedback resistor to Figure 7-3 Format of Processor CHAPTER 7 CLOCK
Clock Control Register GENERATOR
Addition of Table 8-5 INTP1/TI01 Pin Valid Edge and CR00 Capture CHAPTER 8 16-BIT
Trigger Valid Edge TIMER/EVENT COUNTER
Addition of Table 8-6 INTP0/TI00 Pin Valid Edge and CR01 Capture
Trigger Valid Edge

Correction of note on valid edge of INTP0/TI00/P00 and INTP1/TI01/P01 pin

in Figure 8-8 Format of External Interrupt Mode Register 0
Addition of Figure 8-17 Configuration of PPG Output
Addition of Figure 8-18 PPG Output Operation Timing
8.5 16-Bit Timer/Event Counter Operating Cautions
Addition of description on TI01/P01/INTP1 to (5) Valid edge setting
Addition of (c) One-shot pulse output function to (6) Re-trigger of
one-shot pulse
Addition of (8) Conflict operation
Addition of (9) Timer operation
Addition of (10) Capture operation
Addition of (11) Compare operation
Addition of (12) Edge detection

Modification of note on changing count clock in Figure 10-2 Format of CHAPTER 10 WATCH TIMER
Timer Clock Select Register 2

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 APPENDIX D REVISION HISTORY

Edition Revisions Chapter

3rd edition Modification of note on changing count clock in Figure 11-2 Format of CHAPTER 11 WATCHDOG
Timer Clock Select Register 2 TIMER

Addition of note on rewriting TCL2 in Figure 13-2 Format of Timer Clock CHAPTER 13 BUZZER
Select Register 2 OUTPUT CONTROLLER
Modification of Figure 14-5 A/D Converter Basic Operation CHAPTER 14 A/D
Addition of Table 14-2 A/D Conversion Sampling Time and A/D CONVERTER
Converter Start Delay Time
Addition of 14.5 How to Read A/D Converter Characteristics Table

14.6 A/D Converter Cautions

Change of description in (1) Power consumption in standby mode
Addition of (3) Conflicting operations
Addition of (6) Input impedance of ANI0 to ANI7 pins
Addition of (10) Timing at which A/D conversion result is undefined
Addition of (11) Notes on board design
Addition of (12) AVREF0 pin
Addition of (13) Internal equivalent circuit of ANI0 to ANI7 pins and
permissible signal source impedance
Addition of description of processing when D/A converter is not used in CHAPTER 15 D/A
15.5 D/A Converter Cautions (3) AVREF1 pin CONVERTER
Addition of 17.4.7 Restrictions in I2C bus mode 2 CHAPTER 17 SERIAL
INTERFACE CHANNEL 0
(µPD780058Y SUBSERIES)

Addition of 19.4.5 Restrictions in UART mode 2 CHAPTER 19 SERIAL

INTERFACE CHANNEL 2
Addition of Caution when interrupt is acknowledged to Figure 21-2 Format CHAPTER 21 INTERRUPT
of Interrupt Request Flag Register AND TEST FUNCTIONS
Addition of description on TI01/P01/INTP1 pin to Figure 21-5 Format of
External Interrupt Mode Register 0
Addition of Caution to 25.1 ROM Correction Function CHAPTER 25 ROM
CORRECTION

Modification of Table 26-1 Differences Between µPD78F0058, 78F0058Y CHAPTER 26 µPD78F0058,

and Mask ROM Versions 78F0058Y
Total revision of description on flash memory programming as 26.3 Flash
Memory Characteristics
Addition of CHAPTER 28 ELECTRICAL SPECIFICATIONS (MASK ROM CHAPTER 28 ELECTRICAL
VERSION) SPECIFICATIONS (MASK
ROM VERSION)

Addition of CHAPTER 29 ELECTRICAL SPECIFICATIONS (FLASH CHAPTER 29 ELECTRICAL

MEMORY VERSION) SPECIFICATIONS (FLASH
MEMORY VERSION)
Addition of CHAPTER 30 ELECTRICAL SPECIFICATIONS (FLASH CHAPTER 30 ELECTRICAL
MEMORY VERSION (VDD = 2.2 V)) SPECIFICATIONS
(FLASH MEMORY VERSION
(VDD = 2.2 V))
Addition of CHAPTER 31 CHARACTERISTICS CURVES (REFERENCE CHAPTER 31
VALUES) CHARACTERISTICS CURVES
(REFERENCE VALUES)

Addition of CHAPTER 32 PACKAGE DRAWINGS CHAPTER 32 PACKAGE

DRAWINGS

User's Manual U12013EJ3V2UD 693

 APPENDIX D REVISION HISTORY

Edition Revisions Chapter

3rd edition Addition of CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS CHAPTER 33 RECOMMENDED
SOLDERING CONDITIONS

Correction of APPENDIX A DIFFERENCES BETWEEN µPD78054, 78058F, APPENDIX A DIFFERENCES

AND 780058 BETWEEN µPD78054, 78058F,
AND 780058 SUBSERIES
Total revision of APPENDIX B DEVELOPMENT TOOLS APPENDIX B DEVELOPMENT
Transfer of description of embedded software to APPENDIX B TOOLS
DEVELOPMENT TOOLS

694 User's Manual U12013EJ3V2UD