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ABSTRACT For MEMS

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Leela Krishna
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49 views1 page

ABSTRACT For MEMS

Uploaded by

Leela Krishna
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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ABSTRACT

V.Ramya Sri

EEE

[email protected]

TOPIC: MEMS(Micro Electrical Mechanical System) in Space Applications

The future of robotic missions is in ever – Packaging likewise needs to be considered


smaller platforms and Micro Electro part of the system. CAD and
Mechanical Systems(MEMS) will be key simultaneous tools will be required for the
in this development. New measurement entire system: electronics, sensor (and/or
schemes may be required instead of actuator), and package. Thermal,
brute-force miniaturization of current mechanical and electrical analysis under
instruments. Trade-offs between mass harsh conditions will be required. For
and sensitivity need to be addressed in space applications, MEMS devices must
mission planning. Suits of sensors may be flight qualified for vibration, shock,
replace large , highly sensitive macro- radiation, temperature, vacuum
instruments. E.g. MEMS- Based specifications and must meet reduced
microgyros currently have higher drift mass, power and volume budgets . MEMS
rates than spinning mass gyros used in reliability is essential for space
Cassini-like missions, but used in applications. Long lifetimes, self –
conjunction with micro accelerometers, test,self-caliberation and potentially
star- trackers or sun- sensors, provide evolvable systems need to be created.
capable inertial navigation systems. Packing of MEMS must protect devices
Therefore, the “system” aspect of MEMS from harsh environment; packing needs
is essential for the trend towards micro to be included in sensor / actuator
missions. Sensor interfaces must be development
designed for flight.

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