ALPHA OM-550 HRL1 ®

Non-Eutectic, Low Temperature, Solder Paste for Assemblies with

Temperature Sensitive Substrates, Components, and High Warpage Chips Variab
Sn-57.6
SBX02
HRL1
SAC30

Revolutionizing Low Temperature Drop Shock Results

Solder Reliability 99.9
Drop Shock Results
Weibull
Weibull
99 Variable
Sn-57.6Bi 0.4Ag
ALPHA OM-550 HRL1 is a high reliability, low temperature 90
80 SBX02
70 HRL1
solder paste designed to increase production yield and reduce 60

Cumulative Failures, %
50 SAC305
40 Variable
component warpage. The ALPHA HRL1 alloy has a melting 30
20
Sn-57.6Bi0.4Ag Shape Ch.Life
Variable
N
SBX02 1.040 147.2 30
point significantly lower than SAC 305 and was designed to 10 HRL1
Drop Shock Results
1.037 Sn-57.6Bi0.4Ag
321.9 45
SAC305 1.303 951.2
SBX02 45
exhibit improved drop shock and thermal cycling performance. 99.9
5 Weibull 1.435 874.6
HRL1 85
3
A minimum peak temperature of only 185°C vs 245°C reduces 99
2 SAC305
First Failure
Sn-57.6Bi-0.4Ag: 20 drop
90
energy consumption in the SMT process. Drop Shock Results 80
70
1 SBX02:
HRL1:
20 drop
80 drop
Weibull 60 HRL1

Cumulative Failures, %
50 SAC305: 88 drop
Drop Shock Results
99.9 40
99 30
Shape Ch.Life N AD
Improved Reliability 90
80 99.9
20
0.1
Weibull 1.040 147.2 30 1.241
99 10 1.037 321.9 45 1.432
● ALPHA OM-550 HRL1 mechanical reliability is comparable
70 0.1 1 10 100 1000 10000
60 1.303 951.2 45 0.447
Cumulative Failures, %

50
90
5 Number of Drops 1.435 874.6 85 0.573
40
80 3
to SAC305 and significantly improved over other low 30
20
70
60
2 Shape
1.040
Ch.Life
147.2
N
30
AD
1.241
P
<0.010
First Failure
Sn-57.6Bi-0.4Ag: 20 drops
Cumulative Failures, %

50 1 SBX02: 20 drops
temperature solders. 10 40
30
1.037
1.303
321.9
951.2
45
45
1.432
0.447
<0.010
>0.250 HRL1: 80 drops
5
1.435 874.6
HRL1
85 0.573 0.147
Shape Ch.Life
SAC305: 88Ndrops AD
20
● Drop shock performance in SAC mixed alloy joints increased 3
2 10 First Failure
1.040
1.037
147.2
321.9
30
45
1.241
1.432
Sn-57.6Bi-0.4Ag: 20 drops 1.303 951.2 45 0.447
by 100% compared to other SnBi alloys. 1 5 0.1
0.1 SBX02:1 20 drops
10 100 1000 1.435
10000 874.6 85 0.573
HRL1: 80 drops
HRL1 3
Number of Drops
● Thermal cycling reliability in SAC mixed alloy joints improved 2 SAC305: 88 drops First Failure
Sn-57.6Bi-0.4Ag: 20 drops
1 SBX02: 20 drops
by 20%. 0.1
HRL1
HRL1: 80 drops
0.1 1 10 100 1000 10000 SAC305: 88 drops
● HRL1 alloy shows best compatibility with SAC alloy
Numbervs.of other
Drops

low temperature SnBi alloys. 0.1

0.1 1 10 100 1000 10000
Number of Drops
ALPHA OM-550 HRL1 Peak Reflow
Temperature Process Window vs. Other Alloys
KEY FEATURES 280
270 99.9

270°C
260
250
Temperature (°C)

240 245°C
● Long Stencil Life: Tested up to 12 hours of continuous 230

printing. 220
210
● Good Voiding on various packages: BGAs, MLFs, DPAK & NWO 200
200°C
HRL1 mixed alloy
190 Mixed Alloy
defects. 180
185°C–195°C
180°C 180°C

● Low temp reflow eliminates Head-in-Pillow & NWO defect. 170

160
175°C

160°C 160°C
● Air & N2 reflow capable. 150
SAC305 OM-550 HRL1 SBX02 SnBiAg0.4
Alloy Alloy Alloy Alloy
● Compatible with SAC305 components.

* Zero-Halogen is defined as no halogen intentionally added to the formulation.

ASSEMBLY SOLUTIONS
 ALPHA® OM-550 HRL1
Non-Eutectic, Low Temperature, Solder Paste for Assemblies with
Temperature Sensitive Substrates, Components, and High Warpage Chips

REDUCTION IN SHEAR STRENGTH % AFTER THERMAL CYCLING

NO. CVP-390 CVP-390 OM-535 OM-550 OM-550
CYCLES SAC305 T4 SAC305 T5 SBX02 T4 HRL1 T4 HRL1 T5

ALPHA OM-550 HRL1 exhibits

500 43.3% 45.3% 3.8% 5.4% 13.5%
the lowest drop in shear 1000 67.6% 71.3% 32.3% 16.2% 25.6%
strength after thermal cycling.
The HRL1 alloy loses less shear 1500 74.1% 78.7% 62.0% 34.7% 44.4%
strength than SAC305 for both
mixed alloy joints and joints 2000 80.0% 84.6% 68.4% 50.1% 52.4%
with HRL1 alone. 2500 80.1% 82.8% 76.5% 58.7% 54.5%

PERFORMANCE SUMMARY
PROCESS BENEFITS PROPERTIES PERFORMANCE CAPABILITIES
180 micron using 4 mil stencil
Fine Feature Print Definition
250 micron using 5 mil stencil
Print Process Window Tack/Stencil Life Over 12 hours stencil life
Print Speed Range 25–150mm/s (1– 6 in.sec)
Reflow Environment Air and Nitrogen
Resistance to Voids Meets IPC 7095 Class III Requirements
Random Solder Balls Passes in preferred category
Head-in-Pillow High Resistance to Head-in-Pillow Defects
Reflow Process Yield
Non Wet Open (NWO) High Resistance to NWO Defects
Residue Profile Pin Testable
Coalescence Coalesces down to 170 microns
Flux Residue Cosmetics Clear
SIR IPC SIR J-STD-004B and Bellcore SIR
Electrical Reliability
J-STD-004B Classification ROL0 (Halide-Free)
Environmental Halogen Content Zero-Halogen

Significantly
Improved Drop Shock
Performance versus
other low temperature
alloys. Drop shock
comparable to SAC305.
Reduced Reflow Temperatures Eliminate component warpage

macdermidalpha.com
July 2020 Alpha is a product brand of MacDermid Alpha Electronics Solutions.

For more information, contact us at [email protected]

© 2020 MacDermid, Inc. and its group of companies. All rights reserved.
® and ™ are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries.

ASSEMBLY SOLUTIONS