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0% found this document useful (0 votes)
200 views462 pagesAloka SSD-680 - Service Manual
Uploaded by
Omer KurtCopyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF or read online on Scribd
/ 462
Aloka ———————_,
SERVICE MANUAL
ECHO CAMERA
SSD - 680EX / SSD - 680STD
1/2
English Edition
Document Number + N2-0187
Document Revision: 4
Edited by
ALOKA ME Service Center
‘Approved by Checked by Written by,
X. Xena | (EMabachionh po?
2S = Sly - 25-Jul-1904] 22 - eb - 190
Copyright ALOKA co., Ltd.
6-2-1, Mure, Mitaka~shi, Tokyo, Japan
EE ,
Rev. 4 (22Jul-1990) Contents of $§0-6808x/SSD-680S00 SERVICE WAXUAL
SSD-680EX/SSD-680STD SERVICE MANUAL 1/2 CONTENTS
Section 1
Section 2
Sectoin 3
Section 4
Section 5
ret
18
1
a
22
23
24
25
26
24
28
2
a4
2
a
36
PAGE
How to.use this Service Manual PAGE 11~1.5 (Saheets)
Service Mana
(Contents of ths Service Manual
‘Construction ofthis Service Marsal
(Contents of Bach Setion . :
Difference botween SSD-6608X and SSD.680STD
Precautions PAGE 21~2.4 (2ehects)
Precautions Agaainst Bloctrieal Hazes to Serviceman
Precautions Agaainst Mechenieal Hazerd to Serviceman
Precautions Agaainst Germ Hazerds to Serviceman
Precaution for Keeping Hlectrical Safety
Precautions for Keeping Mechanica Sfety
Precautions for Keeping Cheneal Safety
Precautions tobe Made at Service Center
(Care tobe Taken inthe Sled
‘Before repairing PAGE $.1~$.15 (sheets)
Repair workon the description of Service Manual
‘Modification work onthe decription of Serve Manal
‘esting tho Buckup Memory RAM)
Display method or Color Test Paters
Care on Handling of Surface Mount Device (MD), and
‘Sarface Maunt TEehnology (SMT) PCBs
‘Disassembling Procedure PAGE 41-474 (37shets)
‘SSD-6808X Disassembling Instructions
SSD.680STD Disassembling Instretions
INSTALLATION PROCEDURES
‘SSD-S80BX, SSD-880STD
SYSTEM BLOCK DAIGRAM PAGE 5.1~52 (2sseots)
SSSD.680EX SYSTEM BLOCK
SSSD.680STD SYSTEM BLOCK
nH Rev 4 2s
2
“a
1984) Contents of SSD-68DEX/SSD-560S2D SERVICE MANUAL
Section 6 PCB BLOCK DIAGRAM PAGE 61~6-111 (68sheets)
er
62
6a
4
65.
66
re
8
69
10
on
ez
13
615
e168
oir
eis
19
620
oa
22
623
ren
625
626
628
EP-2265
EP-254
EP-285
EP-356
EPUSt
EP-3458
EP-3450
EP-3461
EP-3468
EP-264
EP-3465
P9525
EP-252
EPs2t7
EP-3206
EP-2620
EP-2729
EP.2618
E2620
EPTT
EP-2651
EP.3297
EP-5100
EPSUS
EPA
EP.2218
EP-2228
E3445
EP-9260
EP-2810
P9259
EP.2812
MAIN CONTROL os
PROBE SELECTOR
including EP.S453 PROBE SELECT RELAY)
RX SELECT
TXT
1x2
Vea cess
RX FOCUS, co
MAIN AMP & COLOR ITF
BPP & GAIN CONTROL
‘TX TRIGGER GENE
(GRU TIMING & ADDRESS
(BU INTERFACE .
RX SELECT CONT
BAW MEMORY :
DSC ADDRESS
sc TIMING
AD, DIA secscsoose
DUAL MPU ;
Agpe
us mF
COLOR DIA sens .
CINE BOW MEMORY
COLOR FLOW PROCESSOR
COLOR LINE BUFFER 0 osoccnss
COLOR POST PROCESS
COLOR MEMORY VEL /COLOR MEMORY VAR
COLOR CINE MEMORY
VIDEO ITF
DOP TxRX -
DOP CONTROLLER
OP FILTER
DOP INTERFACE 7
NJK-196A. FFT board :
NJK-196A OUTPUT bosrd
EPsut
EP.2341
Rev. 4 (221-1994)
PHYSIO AMP (OPTION)
BOG MEMORY (OPTION)
geen
Suasezaresssess
seepece
102
104
108
no Section
Contents of SSD-G80EK/SSD-68057D SERVICE MANUAL
7 Cireuit Diagram PAGE 7-1~7:187 (68 sheets)
71 Sspss0Ex
71441 PSC-I18 MAIN UNIT CABLE CONNECTION
712 Cables
CABLE CABLE
CABLES CABLES
CABLES —CABLIENE
CABLEIS CABLES
CABLEISR — CABLESOB
CABLESSB CABLES?
CABLES CABLE 4«C
CABLES —CABLESO
CABLES? CABLES
CABLE10B CABLE 200
(CABLE 205/205
(CABLE208 CABLE207
CABLE20@ CABLE 210C
CABLE2I2 CABLE DIO
(CABLEG00 CABLE6Ot
CABLEGS — CABLEGOT
CABLEGO —CABLESIO
CABLEGI2 CABLE S20
CABLEG22 — CABLESIS,
1113 MAIN BODY
LeKEY-19 MAIN PANEL
I-KEY-26 FULL KEYBOARD
P2612 BLIND PANEL
EPS13 POWER LAMP
P.2510 PHONE JACK
14 1K & RX UNIT
capLEa
CABLE?
CABLEI2
CABLET
(CABLESI
CABLESEB
(CABLEAEB
CABLESI
‘CABLE 1028
‘CABLE202
CABLE 206
CABLE 208
cABLEauB.
CABLEZI6
caBLE 602
(CABLE 608
cABLESI1
CABLES21
CABLE 62s
(GEU-64 CABLE CONNECTION
P3466 MOTHER BOARD
‘126 psc UNIT
{UIMS25 SCHEMATIC DIAGRAM
EP-245T MOTHER BOARD
P.2700 FOOT SWITCH CONNECTOR
EPSY79_ S-VHS CONNECTOR
a
“@
6
0
a
60
aSBe
6
6
69
70
eae
Rey 4 @2Jul-1998) Contents of SS0-6E0E4/SSD-680STD SERVICE MANUAL
7.16 DOPPLER UNIT
‘UGR-6S0EX ...
PAE : 3
TES MAAD,
1EP.2808 MOTHER BOARD
1-4-1 POWER SUPPLY UNIT
PSU-SEB0B ......
PSU-S6800
ED.S2408
1EP.281001 (fr 5V control)
EP.2819C2 (for +16Veontrol) .
EP-29228
PTU.004 ISOLATION TRANSFORMER
COLOR TV MONITOR
TPCA1010 10 Inch color TV monitor
IPC1220 12 inch color TV monitor
7.49 ECG SIGNAL DISPLAY UNIT(OPTION)
Rev. 4 @2Jul-1094)
-PEU-6908
BU-S028
(CABEL4, CABLE 4, CABLE 42, CABLE62
L-KEY.s8 SWITCH PANEL
7
98
= 102
=103
104
2108
s107
= 108
=109
<0
ous
ee
123
12 Contents o£ $8D-G80EK/S5D-680STD SERVICE WARUAL
22. ssp.es0srD
"The diagramos marked with “e” are common to SSD-680BX.
Please refer to 7-1 SSD-S8UEX diagrames for thos.
‘721 PSC1%M MAIN UNIT CABLE CONNECTION 1-198
122 wCables
723 MAIN BODY
‘*LKEY-19 MAIN PANEL
SUKRY.26 FULL KEYBOARD
‘8p.2512 BLIND PANEL
‘EP.5143 POWER LAMP
¥EP.2510 PHONE JACK
194 TK fe RX UNIT
(GEU-S5 CABLE CONNECTION 2 1-182
‘EP-3466 MOTHER BOARD
‘725 DSC UNIT
‘UIM-326 SCHEMATIC DIAGRAM 7-199
‘#EP-3467 MOTHER BOARD
‘sEP.2700 FOOT SWITCH CONNECTOR
sEP.S179_S-VHS CONNECTOR
7.26 DOPPLER UNIF (OPTION)
‘SUGR-680S7D (Common to UGR-6808X)
SFFA188,
DMs
#5P.2808 MOTHER BOARD
7.27 POWER SUPPLY UNIT
‘#PSU-Sea0B
‘SPSU-S680C
‘HP.52408
{EP-281001 (for +5V contd)
‘BP.281902 (for +15V contro)
P2928
{#PTUO04, ISOLATION TRANSFORMER
798 BAW TV MONITOR
1P1900-TH ior NTSC) 114
1P230CV-TH (for PAL) 4196
71.29 ECG SIGNAL DISPLAY UNIF (OPTION)
sPEU-s90B
-#RU-5028
SL-KEY-6B SWITCH PANEL
~5~ Ree 4 G2 dul.1990 Contents of S8D-GB0EK/SSD-680STD SERVICE MAKUAL
8 Trouble Shooting PAGE 21-864 (32shects)
81 Introduction
82 Precsutlons ‘
8.3 ‘Tools and Measuring Instruments Required
4 —(Deleted:Applying thie Trouble Shooting)
55 Information
85-1 Automatically Setting after Powering On
8.52 Setting Switches on the PCB.
853 Usage ofthe Functions 9 be Set by the User
5-5-4 Resetting the Backup Momory (RAM)
255 POD Arrangement
85.6 Arrangement of ROMS
85:7 Correction for the Fail t Start or Lacking up
858. Power sopply unit output connector Ist
8.5.9. Preset Reord Shoot
86 Check List Mep
: 861 Phenomenon Cade La
S862. Map 0H +36
7 87 Waveform foor troubleshooting -48
__ GSD-680EX/SSD-680STD SERVICE MANUAL 2/2 CONTENTS)
si Section 9 Adjustment Procedure
Section 10 Performance Check
Section 11 Maintenance Information
Section 12 History of Improvement
Section 18 Parts List
Section 14 Outline of System
Section 15 Principle of Operation (System)
Section 16 Principle of Operation (Hardware)
Rev, 4 (22-Jul-1996) subin waazoa wo anevuaais | gaoyy : q a
|A| ZLOE-da ae ale Go nats
f
< 5
stow
I) Yi] etocaa ee ByOTY
B
|
ay
t
aANG yy VLOE-d7
jouno>
yava'nse>
Le Sraw mise
‘stoe 3 wous SLOE-dF so |LOAy, SLOE-dF Al LLOE-dI cv | ayy 2 uf BL0E-dI Wasco voy | @ e
t. wma aunpen samnouy
Ki-xy “Tray 8 :
vy XL Ht) A eaters fe
{ea} dh
Pa ' wz! We edt
eo 4
av oe
sno
waine =<]
werme t
EP-5100%
wi
ren Patirern
Generator covo une aurea
E3115
Process 1. Set the SWI whichis quipped on EP-3115* COLOR LINE BUFFER
board in DSC unit named UIMG225, to right side ae the following
figure
Process 2 Turn on the FLOW mode by the operation panel
pauses
to this dreton
op
ontr
sc utr
'BGAIN:MIN, STC:MIN
CAUTION After checking the operation withthe colo test pattern, reset the
switch setting to the original poritlon without fi, Section 8 Rebore Repairing
Care on Handling of Surface Mount Device (SMD), and Surface
‘Mount Technology (SMT) PCBs
1 is an Aloka’ poliey that neither repr nor modification of PCBs used for
SLD. is made in the Hlld ase rule because of the following reasons
he gaps between IC pins ere zm
Fine solder chips would cause @ short creult and dirt fom the hand
would cause enrrosin,
PCBs are fragile on imoact
Lf the ROM is freed into the SLD. on & hard base when replacing the
ROM, an undue fore will apply to PCBs, causing various troubles, such as:
‘© Damage to PCB intermediate layer patterns,
{© Peeling of chip devices (rsstr, capacitor, diode, ete)
janetion between eletrode and internal slemen: of chip
part) togethor
with chip device since those patiems ere rather fagile emmared with
PCBs uted before now, and
‘© Damage to parts on the reverse side in the case of PCBs of tth-ide
mounting type,
1m edaltlon tothe above, the SMD. ehip would become impossible of
reuse once it is removed from @ PCB (because af damage due to therms
stress). 80, do nat try to replace Ube chip temporally in the flé even if «
Aefetive part ean be located,
it Is noosssary a touch those PCBs beeause of software version up or
‘nother reason, however the matters mentioned above shouldbe taken Into
careful consideration,
‘The artwork of PCB is also narrow
To prevent the secondary damage, the matters above should be taken into
careful consideration wihiagh owiel none :
soi bun (CME) snivel towo costae Yo yailhasH ao ee = C)
D4 (EME) egolondeo sanoMt
albany ABO weit we ager wat Jat slag ad nu 23k
sooner gall at Wi vase sha we Mal a wl baer ok 92
ts poaalgry sod ond fad» we MCE al ed Bova ak MOR alt ME Oo
‘aa sou sidvow wooeav geimion 280% of ygge fe sot abu na OM
aartiag wu stabaurotal HOS of spurns
(ate abot tioqas fern) entra qlts Yo gail ©
‘tal made od Bods vod cwotan: of gama vaabamien ad tomer a
cretarabin ake a1
SECTION $ Before repairing
Repair work on the description of Service Manual
‘The typlesl processes fer the repair work are shows as the Flow Chart on the
rest page. Do the repair work according to this procedure. In th case of
‘modification of the Technical Bulletin or Upgrade Kit, see the nex tem 3-2
Bach procedures of lw chart are numbered to refer its detail shown from page
83. Furthermore, the Flow Chart and ita explanation show the tine when each
tection of service manual are required on repair work. This isa guide for the
‘eige of service mansal
‘The cervico manual is very important forthe repair work, especially
readjustment and performance check after eomploton of reir work. This isto
Keep the safety and quality of equipment. If you make them, you have to describe
that the treatment has been done according tothe applied section of service manu,
‘on the repair report oF the like
"The circled numbers shown in the Flow Chart on next page, are cxrrspnded to the
procedure number shown from page $8.
34 Rev.4 (22-1994) SECTION 3. Before repairing
Demand oer
“STAR
© [ren and] Tectntoat aurtetin
Tuvetgaion | Section 5-7, 1, 14-16
(a
Estee and order of] Section 8, 13
required para) | History
©
Section 3
‘at curtoner side
® oo
Section 2, 4, 8, 9
Adjustment
©
Section 10
8
© [crak ty cromer |] @
il reps repert
Aggro by costae
@ [Present repair report
yes!
@ [ Stow comments of
Demand to repair Use the prohibition to use
detetive parts) ‘on the equipment
+ +
‘Completion | | © [Teepert to castomer
END) L =
Revd (22ul-1996) 3-2 SECTION 3. Before repairing
Procedure 1 Reception of repair and investigation
Accept the repair request from the customer or distributor. A this time, tho
following plate have to be confirmed and checked,
© Model namenumber, nd serial number
[Name of eastomor, adress, phone number, and name of person in charge
(Configuration of the connection of peripheral devices
Software version or the like shown on the boot up display Gf msibe)
Detail of phenomenon appeared on the function of equipment
Make an examination what circuit may be defective as the function of
‘equipment based on the ebove information. IF you need to know eoeut the basic
‘operation and special information for the maintenance, refer to the fllowing
sections, or ask t the Technical Support,
Section Sytem Bleck Diagram
Section PCB Block Diagram
Section? Schematics
‘Section 1 Maintonance Information
Section 14 System Ouiine
Section 18 Principle of System Operation
Section 16 Prinsple of Hardware Operation
"Tho reported phenomenon may bo the original problem on the equipment Beceuse,
refer to Uhe Technical Bulletin separately isued to chock it whether defectiveness or
hot. IPit has been reported as the original problem, make a work according to the
‘Technical Bulletin.
Procedure 2. Selection of required parts and order
If you find the doubtful eireuit, order the necnecary parts, Then check the
Aelivery date and decide the date to visit on the consultation with the eustomer
For tho selection and order of parts, refer to the following sections,
> Section 8 TROUBLESHOOTING
> Section 18 PARTS LIST
or the electra! parts such aa PCB, chock tho history information on the
HISTORY of this equipment separately issued.
3-3 Revd (22-Jul-1994) SECTION 8. Before repairing
Procedure 8 Preparation of visiting the customer
Chock the required tole, measuring dovios end parts to bo replaced before the
visiting the customer. Then check the special information forthe equipment
reference with the fllowing setin,
> Section 3 BEFORE REPAIR
Procedure 4 Confirms
fon of phenomenon
Confirm the appeared phenomenon end condition to happen it with the
customer. If you dost know about the operation of equipment, refer tothe
Operation Manual attached to the equipment
Procedure 5 Repair and readjustment
Repair the defective circuit with the brought parts, ortho ropair work, road
the following seetion carefully,
> Section 2. PRECAUTIONS
‘And, examine the trouble reason depending on tho situation with fllowing section,
> Section 8 TROUBLESHOOTING
‘The electrical or mechanical readjustment may be requested depending onthe
replaced pars, Because, refer wo the fllowing section after completion of repair,
> Section 9 ADJUSTMENT
Procedure 6 Operation check
Check the eystom behavior to keep its condition as same as before :n troubl
reference with the following section. Be sure to do ecording to the description
‘because check items are depending on the portion to be treted.
> Section 10 PERFORMANCE CHECK
Rev.4 @2Jul-1994) 3-4 SECTION 8 Before repairing
Procedure 7 Judgment of the operation quality
If the result of "Procedure 6" is passed to the all standards, de the noxt
“Procedare 6", On the other sido, if not, make a judgment of “Prcedure 10"
Procedure 8 Confirm by customer, make repair repot and approve
Reconfirm the solution of trouble phenomenon withthe customer, ‘Then make a
repair report and obtain approval of customer.
‘The repair report shows not only the treatment but also the meth of readjustment
and operation check. If they have been done according tothe service manual, the
followings have to be shown,
“Readjueted according tothe Section 9 of service manual.”
“Chocked according tothe Section 10 of seroice manual, and passed.”
Procedure 9 Presentation of report and order to repair parts
ll the repair report with necessary tam, and procont it according to the
certain procedure.
I the defective parte that trouble cause included is evallable to we again by repair,
‘make an order to do, Ifyou cannot judge whethor the part can br used aguin or
ot, ase tothe Technical Support
Procedure 10 Judgment of possibility to repair again
[As tho ropult of judgment on “Proved 7", the trouble is zt slved, judge
the possibilty to make the repair work again
return to “Procedure 5° and eontinue to work,
Procedure 11 Indication of the prohibition to use
[As the cerult of Judgment on *Provedare 10", i you jadge Uhl it i impossible
to continue the repair work et ths Ue, indicate thet the equipment is still oat of
order, and also show the prohibition tote, on the equipment
3-5 Rev.4 @2Jul-1994) SECTION 8 Before repairing
Procedure 12 Report to the customer
[Report the reason why the trouble cannot be slved to the customer. ‘Then
consult about the plan of naxt repair work.
‘And do the same way from “Procedure 2
Rew. 4 @2Jul-1994) 3-6 SECTION 3. Before repairing
‘Modification work on the description of Service Manual
‘The typeal processes for the modification work are shown as the Flow Chart on
‘the next page. Do the modification work according to this procedure. In the case of
repair work, see the previous item 3-1
Bach procedures of low chart are numbered to refer its detll shown from page
39, Purthermore the Flow Chart and its explanation show the time when each
fection of service manual are required on modification work. ‘Thies a gulde for the
sage of service manual,
"The service manual is very smportant for the modification work, especially
readjustment and performance check after somplation of modificatin work, This Is
to keep the safety and quality of equipment.
"The elzeled numbers shown in the Flow Chart on next page, are ctresponded to the
procedure number shown from page 89.
3-7 Reed (2-199) SECTION 8 Before repairing
aad w nll
sun
e ——
@® aoa Tech.Bulletin [Consultation with
requires partakite | Modification | Technical Support
Procedure
Section 3
@®
@
@®
Section 10
@ [be We reps wok, T
eeeuring ta Item 31
Woaification Procedure
© [Cormier ec] vod tcat ton Procedure
Section 10,
‘Work ee normal?
‘Show commenta
the prohibition to use
on the equipment
Tompiaion >) | @ [Rae cater
‘xD, i
@ [Feu eamcoary
pert and report of
edison
Rev. 2Jul-1994) 3. SECTION 3 Before repsiring
Procedure 1 Selection of required parts / kits and order
‘Accept the maticaton request frm the customer, distributor or parson in
‘charge of sales, AE ths tne, th following pints have to be eonfrmed and
thecked to decide tho parts and kis,
Document name that announced the modification or hit requested
[Model nameinumber, and serial number
[Name of eastomer, addrss, phone number, and name of perso in charge
(Configurtion of the connection of peripheral devices
Software version or the ke shows on the bootup display
Make an examination what parts or its are required based on the above
information. For the selection, refer tothe following document separately iued, or
ask to the Technical Support,
> Tecknial Bulletin
"To confirm the detail of modification, se the Modification Procedure attached with
spplied Technical Bullen.
Depending on the modiiatin, hardware, or software, the other modifction
say be requlted. Check it with the Technical Bulletin.
‘Then, confirm the delivery date of reqlred pets or kits, and decide the date to
visit on the consultation withthe customer.
Procedure 2 Preparation of visiting the customer
(Chock the roguired tools, measuring devices and parts or kits :n be usd before
the visting the customer. Then check the special information forthe equipment
reference with the following seston and decument,
> Section’ BEFORE REPAIR
} Technical Bulletin andlor Modifeation Procedure
Procedure 3 Operation check before modification
(n the basis of work, the modification tothe defective equipmant is prohibited.
Becaut, before modification work, check the behavior of equipmest whether normal
‘oF not eceurding to following section and document,
> Sectio10 PERFORMANCE CHECK
> Operation Manual
3-9 ev 4 (@22Jul-1994) SECTION $. Before repairing
Procedure 4 Judgment of the operation quality
If the result of “Procedure 2° is passd tothe all standards, do the next
“Procedure 6". On the other side, faa, go to “Procedure 10"
Procedure 5 Modification work
Do the mosifeation work according to the fellowing document,
Modification Procedure attached with kit or Technical Bulletin
Procedure 6 Operation check after modification
‘Check the eystom behavior to keep its condition as semo as before the
‘modification, reference with th following section. Be sure to do according to the
Gescriplion because check items are depending on the portion to be trated,
> Section 10 PERFORMANCE CHECK
> Modifteation Procedure
Procedure 7 Judgment of the operation quality
If the sesult of “Procedure 6” is passed to the all standards, do the nest
“Procedure 8°, On the other sido, if not, make a judgment of “Procedare 11
Procedure 8 Confirmation by customer
‘Reconfiem any functions of equipment with the customer. ‘Thon, i ned,
introduce and explain sbout the new functions end specification added by this
modification.
Furthermore, if need, make a report to be approved by tho customer. The report
shows not only the treatment bat also the method of operation check. IF thas
boon done according to the service manuel, the fllowing has to be shown,
Checked eccording tothe Section 10 of service manual, and paced”
Rev. 4 G2Jul-1994) 3-10 SECTION 3 Before repairing
Procedure 9 Return of unnecessary parts and report of completion
‘According to the Technial Bulletin, retura the unnecessary replaced or unted
parts toon ab possible If suggested,
And, ifthe report af modification is suggested on tho same document, report it
‘wih the information required
Procedure 10 Work for the abnormal behavior of equipment
(On the result of judgment in “Procedure 4", i the equipment ces not work
‘normal, solve the problem according a item $1 “Repeie work on the description of
service manual” shown in this section,
‘When the problem is salved, return to “Procedure 5° of this itm end continue
to do the mdiiation work.
Procedure 11 Judgment of possibility to recover
‘As the reoult of judgment on “Procedure 7, Ifthe problem has bean mede by
his modilatin, judge the possibility to recover it
If evallabe, return to "Procedure 8° and continue to work
1 unavailable, go 4 "Procedure 12"
Procedure 12 Indication of the prohibition to use
As the result of judgment on “Procedure 11°, if you judge that iti impossible
to recover at this time, indicate thatthe equipment isthe out of eer, and also
show the prohibition to ute, on the equipment
Procedure 13 Report to the customer
Report tothe customer thatthe modiicatlon has not been completed because of
‘the problem on the modiieation work. ‘Then meke « sehedule t Sx and complete
ie
3-11 er & (22-1994) SECTION 8. Before repairing
Procedure 14 Asking to the Technical Support
Revs
Report to the Technical Support about the happening of problem on the modification
‘work, make an examination to solve and order the adational parts, Before the
asking, check the following point,
Name of kt, or the Sesue numberof Technical Bulletin showing the medication
Model namelnumber, and serial number
‘Configuration of the connection of peripheral deviss
Software verson or the like shown on the boot up display
Indication of equipment auch as Modification or History Lebel
Detail of phenomenon appeared on the function of equipment
(22sul-1990) 3-12 33
SECTION 8 Before repairing
Resetting the Backup Memory (RAM)
A backup feature is available ta normally store the use’ stings. Tn normal
‘uso, it will not be necessary to erase all the information wo stored. It is necesary,
however, ta reset the becksp memory with reforenco to the figure given below in|
any of the following events, ‘This method cannot be taken when th eystem cannot
be started up or leking up, because thie resetting procedure is based on tho
sft,
CAUTION. This resetting the backup memory wil erase the folloving information,
‘¢All ofthe proettngs, except INITIALIZE data
‘To et thom all over again afer resetting the momar, itis noossary
to record the sot Information by th uso of print, such as “Video
Printer”
De ot uso the customer's peinter, meansil, befor obtaining
enzant todo so
1) When the sofeare as boon altered for en upgrade or for any ther reasons,
2) When unnecessary (shnormal) character or codes is displayed isthe data which
Ihave boon sat hy ust.
Prees[ TE | ana [6 | atthe same ume
3-13 Rer.& (22-1998) HON 9 Before repairing
8-4 Display method for the Color Test Pattern
‘Tho color tst pattern display feature is available on this systom, ard ean be
‘asd forthe diagnosis to Sind the defeetiveneas on the color diplay sytom,
coion now | Vel. Var, —
Procesion lise HE
EP-5100% Swi
Test Pater
Generator” covor une aurFet
EpS3t
Procots 1. Set the SW1 which e equipped on EP.S115H COLOR LINE BUFFER
board in DSC unit named UIMES25, to right side as the flowing
‘igure.
Process 2 Turn on the FLOW mode by tho operation panel
proses
Set to this direction.
op.
unr
sc UNIT
Condition B GAIN: MIN, STC:MIN
CAUTION After checking the operation with the color test pattern, seset the
switch setting to the original position without fl
Rey.4 (@2Jul-1994) 3.14 35
SECTION 3 Before repairing
Care on Handling of Surface Mount Device (SMD), and Surface Mount
‘Technology (SMT) PCBs
It is an Aloka’ plley that nether repair nor modification of PCB used for
SSAMD. is made in the field as a rule because of the folowing reasons
etneen I row.
Fine solder chips would eause a short cicclt and drt from the hand would
OBE are fragile on impact
Ifthe ROM is forced into Ube SIMD. on a hard base when replacing the
ROM, an undue fore will apply to PCBs, causing various troubles, such
Damage to POD intermediate layer pattern,
Peeling of chip devices (resitar, eapecitor, diode, ote)
Damage to junston between electrode tnd internal elemeat of chip devices,
Peeling of patterns (especially that for mounting the parti) together with
chip device since thote pattern are rather fopile compar with PCBs used
fore now, and
‘© Damage to parts on the reverse ide in the case of PCBS of bothside
mounting type
In adiion tothe above, the SM.D. chip would become impossible of reus
once tls removed from @ PCB (because of damago duo to tharmal sre). So,
fo not try to replace the chip temporally in the Geld even If a defective part ean
be located,
IF it is neceasary to toueh thote PCBs because of suftware version up or
another reeson, however, Use matiars mentioned above should be taken into
careful consideration,
‘he artwork of PCB is ala narrow.
‘Toprevent the sooondary damage, the ould be taken into
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Cer tbE > val are ‘SSD-680EX Disassembling Instructions
1. Pans Ientifction
2. Individual Units Layout
3. Dismounting Flowchart
4. How to Remove Covers
5. How to Open Panel Escutcheon
6. How to Pullout PC Board of TX / RX
(GEU-64) and How to Remove Unit
7. How to Pullout PC Board of DSC Unit (UIM.325) and How to Remove Unit
8, How to Pullout PC Boatd of Doppler Unit (UGR-680) and How to Remove Unit
9. How to Remove Powersupply Unit (PSU-$680C)
10, How to Remove PC Board
11, How to Remove Panel Feame and PC Board of Operation Panel
12, How to Remove Observation Monitor Unit IPC-1010 /-1230)
13, How to Remove Monitor Arm (L-Ki-490 501)
14 How t Remove Top Cover
15 How to Remove VIR Remote Controller Rack
16, How to Remove Panel Lower Cover and Speaker Unit 1. Parts Identification 2. Individual Units Layout
Monitor (IPC-1010 / 1230)
TX/ RX unit (GEU-64)
Monitor arm,
(2K-4907"501)
caren
Speaker unit 3. Dismounting Flowchart
Tae
REECE) ade Pan
+
sas
||
ra
Es
Tecres : ellen Se
> [Tear > [ie
oe
+
a
a [oases
= 4, How to Remove Covers
Note: See Dismounting flowchart f
‘Operation (6) is not required for S/N 21M10886 and up.
(1) Remove screws and remove front cover. (Applicable tothe units S/N 21§08243~21M12683) (in Fig.)
{A Remove 6 screws and remove front cover. (Applicable tothe units S/N 31MD0876~) ( @ in Fig.)
(2) Remove 2 serews to remove base cover by pulling it toward you, (in Fiz.)
(3) Remove 2 screws and remove intermediate cover.( © in Fig)
(4) Remove 3 screws and remove foot est. ( in Fig.)
Intermediate cover
BNK3XBs, 2
©
Front cover
BNKS X88, 4 (SIN 21608243,
~2iM268)
BNKSX8Bs, 6 (SIN 31M00876~)
Foot rest
BNK3X@, 2 ANK4X10, 3
Fig.3 (5) Remove 6 screws and remove rear cover. (in Fig)
(6) Remove 4 serews and remove connector cove, (® in Fig.)
(7) Remove 4 serews and shif the righ side cover rearward and remove it. (© in Fig.)
(8) Remove 2 screws and remove duct. ( ® in Fig)
(9) Remove 4 screws and remove left side cover similarly as in (7). (® in Fig)
(10) Remove 2 screws snd remove power supply right side cover. (® in Fig)
(11) Remove 2 screws and remove power supply let side cover. ( @ in Fig.)
Roar cover
BKaXx6,4 ENKSX8B6, 6
Left side cover
BNKSX@Bs, 4
Connector cover
BNK3X@Bs, 2
Power supply left side cover,
(CNK3X8B5, 2 CNKS>
