Designation: B 579 – 73 (Reapproved 1993)e1

AMERICAN SOCIETY FOR TESTING AND MATERIALS

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Reprinted from the Annual Book of ASTM Standards. Copyright ASTM

Standard Specification for

Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)1
This standard is issued under the fixed designation B 579; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.

This standard has been approved for use by agencies of the Department of Defense.

e1 NOTE—Section 10 was added editorially in November 1993.

1. Scope B 183 Practice for Preparation of Low-Carbon Steel for

1.1 This specification covers the requirements for electrode- Electroplating2
posited tin-lead coatings on fabricated articles of iron, steel, B 242 Practice for Preparation of High-Carbon Steel for
copper, and copper alloys, to protect them against corrosion Electroplating2
(Note 1), to improve and preserve solderability over long B 281 Practice for Preparation of Copper and Copper-Base
periods of storage, and to improve anti-galling characteristics. Alloys for Electroplating and Conversion Coatings2
B 322 Practice for Cleaning Metals Prior to Electroplating2
NOTE 1—Some corrosion of tin-lead coatings may be expected in B 487 Test Method for Measurement of Metal and Oxide
outdoor exposure. In normal indoor exposure, tin-lead is protective on
Coating Thicknesses by Microscopical Examination of a
iron, copper, and copper alloys. Corrosion may be expected at disconti-
nuities (pits or pores) in the coating. Porosity decreases as the thickness is Cross Section2
increased. A primary use of the tin-lead coating (solder) is with the printed B 499 Test Method for Measurement of Coating Thickness
circuit industry as a solderable coating and as an etch mask material. by the Magnetic Method: Nonmagnetic Coatings on Mag-
1.2 This specification applies to electrodeposited coatings netic Basis Metals2
containing a minimum of 50 % and a maximum of 70 % tin. B 504 Test Method for Measurement of Thickness of Metal
The specification applies to mat, bright, and flow-brightened Coatings by the Coulometric Method2
tin-lead coatings. B 567 Test Method for Measurement of Coating Thickness
by the Beta Backscatter Method2
NOTE 2—Tin-lead plating baths are composed of tin and lead fluobo- B 568 Test Method for Measurement of Coating Thickness
rates and of addition agents to promote stability. The final appearance may by X-Ray Spectrometry2
be influenced by the addition of proprietary brighteners. Without bright-
eners, the coatings are mat; with brighteners, they are semibright or bright.
E 105 Practice for Probability Sampling of Materials3
Flow-brightened coatings are obtained by heating mat coatings to above E 122 Practice for Choice of Sample Size to Estimate the
the melting point of tin-lead for a few seconds and then quenching; palm Average Quality of a Lot or Process3
oil, hydrogenated oils, or fats are used as a heat-transfer medium at a 2.2 Other Standards:
temperature of 260 6 10°C (500 6 20°F), but other methods of heating MIL-STD-105 Sampling Procedures and Tables for Inspec-
are also in use. The maximum thickness for flow-brightening is about 7.5 tion by Attributes4
µm (0.3 mil); thicker coatings tend to reflow unevenly. The shape of the
MIL-STD-414 Sampling Procedures and Tables for Inspec-
part is also a factor; flat surfaces tend to reflow more unevenly than wires
or rounded shapes (Note 3). tion by Variables for Percent Defective4
NOTE 3—Volatile impurities in tin-lead coatings will cause bubbling
and foaming during flow-brightening resulting in voids and roughness.
3. Classification and Service Condition
The impurities can arise from plating solution addition agents and from 3.1 Orders for articles to be plated in accordance with this
improper rinsing and processing. specification shall specify, in addition to the ASTM designation
1.3 This specification does not apply to sheet, strip, or wire number and year of issue, the classification notation indicating
in the unfabricated form or to threaded articles having basic the basis metal and thickness of tin-lead coating required, or
major diameters up to and including 19 mm (0.75 in.). the service condition number indicating the severity of service
required for the coating. In addition, when specifying a tin-lead
2. Referenced Documents coating composition, the first number shall refer to the tin
2.1 ASTM Standards: content in percent.
3.1.1 Classification Notation:

1 2
This specification is under the jurisdiction of ASTM Committee B-8 on Annual Book of ASTM Standards, Vol 02.05.
3
Metallic and Inorganic Coatings and is the direct responsibility of Subcommittee Annual Book of ASTM Standards, Vol 14.02.
4
B08.04 on Soft Metals. Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700
Current edition approved March 29, 1973. Published June 1973. Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.

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 B 579
Symbol Classification preparation of various basis metals for electroplating be
Fe/ Iron or steel basis metals followed when appropriate: B 183, B 242, B 281, and B 322.
Cu/ Copper or copper alloy basis metals
/Sn-Pb Tin-lead coating and its composition number, when re-
5.4 When necessary, preliminary samples showing the finish
quired; for example, Sn60-Pb40 shall be supplied to and approved by the purchaser. Where rack
Number Minimum coating thickness in micrometres marks are inevitable, their location shall be the subject of
(5 to 50)
agreement between supplier and purchaser.
Suffix Letter
f flow-brightened
6. Physical Composition
b bright 6.1 Composition—The tin-lead coating composition shall
m mat
be as follows (Note 7):
An example of complete classification notation is as follows: Cu/Sn60-Pb40/5F Element Weight, %
Tin (Sn) 50 to 70
3.1.2 Service Condition Number: Lead (Pb) remainder
No. Service Condition
6.1.1 The tin percentage is calculated as follows:
4 very severe exposure
3 severe exposure
Tin, % 5 134.1 3 ~L/A 2 1! (1)
2 moderate exposure
1 mild exposure where:
L 5 weight of lead coating, g, and
NOTE 4—See Appendix X1 for additional description of exposure
A 5 weight of alloy coating, g.
conditions and examples of typical end uses. The coating thicknesses
given for each service condition are guidelines and are not intended to be NOTE 7—Only the tin content need be determined. Lead is usually
absolute values. determined by difference. A sample of the deposit can be obtained by
plating on a stainless steel panel from which the coating can be peeled or
4. Significant Surfaces by employing any recognized stripping method. The alloy composition of
4.1 Significant surfaces are defined as those surfaces nor- the deposit can be determined by methods such as gravimetric or
volumetric analysis, density measurements, atomic absorption spectropho-
mally visible (directly or by reflection) that are essential to the
tometry, X-ray fluorescence, and beta backscatter.
appearance or serviceability of the article when assembled in In addition, the alloy composition produced by a plating solution may
normal position; or those surfaces that can be the source of be obtained by comparing the weight of a tin-lead coating deposited by a
corrosion products that will deface visible surfaces on the given number of ampere-hours to the weight of lead coating produced in
assembled article. When necessary, the significant surfaces a lead fluoborate coulometer in series with the plating bath.
shall be indicated on the drawing of the part, or by the 6.2 Appearance—The tin-lead coating shall be smooth, fine
provision of suitably marked samples. grained, continuous, adherent, and shall be free of visible
NOTE 5—When significant surfaces include areas on which the speci- blisters, pits, nodules, indications of burning, excessive build-
fied thickness of deposit cannot readily be controlled, such as threads, up, staining, and other defects. Flow-brightened coatings shall
holes, deep recesses, bases of angles, and similar areas, the purchaser and not have dewetted areas or beads, and shall be free of the oil
the manufacturer should recognize the necessity for either thicker deposits used in the fusion process.
on the more accessible surfaces or for special racking. Special racks may 6.3 Thickness—The thickness of the coating on significant
involve the use of conforming, auxiliary bipolar electrodes, or noncon-
ducting shields.
surfaces shall conform to the requirements in Table 1 and Table
2.
5. Materials and Manufacture 6.3.1 Thickness Measurements—Tin-lead alloy thickness
5.1 Defects in the surface of the basis metal, such as measurements shall be made on those areas of the significant
scratches, porosity, nonconducting inclusions, roll and die surfaces where the coating would be expected to be thinnest.
marks, cold shuts, and cracks, may adversely affect the The method of determining the thickness shall be agreed upon
appearance and the performance of coatings applied thereto by the manufacturer and purchaser. Several methods are
despite the observance of the best plating practices. Accord- available depending upon the thickness of coating, the shape of
ingly, the plater’s responsibility for defects in the coating the article, and the basis metal. They include beta backscatter,
resulting from such conditions shall be waived, except when he coulometric, magnetic, microscopical, and X-ray fluorescence
is also in the position of prime contractor supplying plated test methods. The methods are outlined in 9.1.
parts. TABLE 1 Tin-Lead Alloy Coatings on Steel
NOTE 6—In order to minimize problems of this sort, the specifications Minimum
Service Classification Thickness
covering the basis material or the item to be plated should contain Condition Number
appropriate limitations on such basis metal conditions. µm mil

5.2 When required the basis metal shall be subjected to such SC4A Fe/SnPb 30 30 1.2
SC3A Fe/SnPb 20 20 0.8
polishing or buffing operations as are necessary to yield SC2 Fe/SnPb 10 10 0.4
deposits with the desired final appearance (Section 6). SC1 Fe/SnPb 5 5 0.2
SC1 Fe/SnPb 5fB 5 0.2
5.3 Proper preparatory procedures and thorough cleaning of
A
the basis metal surface are essential in order to assure satis- An undercoat of 2.5 µm (0.1 mil) copper is recommended for SC3 and SC4.
B
f 5 flow brightened or
factory adhesion and corrosion performance of the coating. m 5 mat or
Accordingly, it is suggested that the following Practices for the b 5 bright

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 B 579
TABLE 2 Tin-Lead Alloy Coatings on Copper, Copper AlloysA, 9.1.1 To meet the thickness specifications of the coatings,
and NonmetalsB the plater is advised to:
Minimum 9.1.1.1 Maintain regular control of all solutions,
Service Classification Thickness
Condition Number 9.1.1.2 Inspect the equipment at regular intervals, and
µm mil
9.1.1.3 Check thickness at periodic intervals.
SC4 Cu/SnPb 30 30 1.2
SC3 Cu/SnPb 15 15 0.6
9.1.2 The following ASTM methods are acceptable for
SC2 Cu/SnPb 8 8 0.3 measuring local thickness of the coating: B 487, B 499, B 504,
SC1 Cu/SnPb 5 5 0.2 B 567, and B 568.
SC1 Cu/SnPb 5fC 5 0.2
9.2 Adhesion:
A
If the basis metal is a brass containing more than 15 % zinc, the tin-lead
coating shall be preceded by an undercoat of at least 2.5 µm (0.1 mil) of copper
9.2.1 Burnishing Test—Rub an area of not more than 630
and nickel to prevent the diffusion of zinc into the tin-lead. The same undercoating mm2(1 in.2) of the coated surface, selected at the discretion of
shall also be applied when the basis metal is beryllium copper to assure adhesion the inspector, rapidly and firmly for 15 s with a smooth metal
of tin-lead coating.
B
Nonmetals shall be suitably sensitized and metalized prior to tin-lead coating.
implement. A suitable burnishing implement is a copper or
C
f 5 flow-brightened or steel disk used edgewise and broadside. Maintain a pressure
m 5 mat or sufficient to burnish the coating at every stroke, but not so great
b 5 bright
as to cut it. Poor adhesion will be shown by the appearance of
a loose blister which grows as burnishing is continued. If the
NOTE 8—Thicknesses determined by beta backscatter, coulometry, and quality of the coating is poor also, the blister may crack and the
X-ray fluorescence are a function of the composition as well as the coating peel away from the basis metal.
thickness of the coating. 9.2.2 Quenching Test—Heat the coating article in an oven
6.4 Adhesion—The adhesion of the coating shall be ad- for a sufficient time to reach 150 6 10°C (3006 20°F) and
equate to pass the tests described in 9.2. quench in room-temperature water. The adhesion is inadequate
6.5 Solderability: if the coating blisters, cracks, or peels.
6.5.1 When specified by the purchaser, the coating shall be 9.2.3 Reflow Test—Parts may be evaluated by immersion in
tested by one of the methods described in 9.2. The results shall a bath of palm oil at a temperature of 205–260°C (400–500°F)
be evaluated in accordance with each procedure described in until the deposit melts. A bright coating completely covering
that section. the significant surfaces indicates adequate adhesion.
6.5.2 When specified by the purchaser, the coating on 9.2.4 Bend Test—Bend a sample, with the coated surface
copper and copper alloys shall, before solderability testing, be away, over a mandrel until its two legs are parallel. The
subjected to the preliminary artificial aging treatment described mandrel shall have a diameter equal to the thickness of the
in 9.3.6 to determine if they may be expected to retain their sample. Examination at 43 magnification should show no
solderability during periods of storage. evidence of peeling or cracking.
NOTE 9—See Appendix X2 for design considerations that have an effect
9.3 Solderability:
on the selection of thickness of the coating and, ultimately, on the 9.3.1 General:
solderability of the electrodeposits. 9.3.1.1 Methods for testing the solderability of tin-lead
coated articles are based on the measurement of the extent of
7. Hydrogen Embrittlement wetting by molten solder or the determination of the minimum
7.1 High-tensile strength steels, and severely cold-worked time required to produce full or perfect wetting by solder.
steels, are susceptible to embrittlement by hydrogen in both 9.3.1.2 The extent of wetting can be observed by manual or
cleaning and plating operations. The embrittling hydrogen automatic immersion in molten solder under controlled condi-
shall be removed by heat treatment. Procedures for baking to tions.
minimize embrittlement before and after plating are covered in 9.3.1.3 Determine the minimum wetting time by carrying a
Sections 2 and 7 of Practices B 242. specimen in a fixture through a standing wave of solder at a
controlled speed and by measuring the shortest time of
8. Sampling immersion that will give complete wetting.
8.1 Test methods are time consuming and often destructive; 9.3.2 Dip Tests (Non-Automated):
therefore 100 % inspection is usually impractical. The pur- 9.3.2.1 Sample—For small articles of suitable shape and
chaser should select a suitable sampling plan for the acceptance size take the whole article for testing. For larger articles, cut a
testing of lots of coated items. In order that the manufacturer portion of suitable size for testing. A recommended panel size
(plater) may know the quality standard he is expected to meet, is 25 mm2 (1 in.2). For articles not falling into these categories,
the plan selected should be made part of the purchase contract. take samples as agreed upon between the plater and the
8.2 General information on sampling procedures is given in purchaser.
Recommended Practices E 105 and E 122. Standard sampling 9.3.3 Dip Tests (Automated)—The use of automated testers
plans are suggested in Military Standards MIL-STD-105 and eliminates possible operator errors and assures repeatable
MIL-STD-414. results; in these units, the dipping operation, temperature
control, and timing sequences are automated. One available
9. Test Methods unit provides a means for testing flat surfaces, wires, and
9.1 Thickness: component terminations by vertical immersion into the solder;

3
 B 579
in addition, a holding fixture is available to lower wire samples oven, used in the Pessel method, as a source of heat.5
horizontally and face down through the solder, the speed of 9.3.5 Globule Test:
rotation being varied to produce a range of immersion times. 9.3.5.1 This test method was devised for assessing the
Progressively increase contact times with the solder using solderability of wires, component leads, etc.
separate specimens, and determine the least time required for 9.3.5.2 This method consists of lowering the specimen of
complete wetting and the onset of dewetting by visual exami- wire (or component lead) previously fluxed, horizontally onto
a molten globule of solder, which is thereby cut in two. The
nation of the series of specimens. The best conditions of
time in seconds for the solder to flow around the wire and unite
solderability would have the shortest wetting time, and would above it is a measure of the solderability. Use a fresh pellet of
show no signs of dewetting within the longest contact time solder for each test, the size of the pellet being determined by
required. A minimum wetting time under 2 s is evidence of the diameter of the specimen wire. Commercial test machines
good solderability. An auxiliary attachment is available for the are available.
determination of spread values. The specimen is lowered onto 9.3.6 Artificial Aging (When Specified By the Purchaser):
the surface of the solder and a delay timer built into the 9.3.6.1 Place the sample for test in a suitable vessel above
equipment holds the test piece in contact with the solder for boiling water and leave it there, with the water boiling
any preselected time up to 10 s. Determine spread values as in continuously, for 24 h. Keep the vessel covered and ensure that
9.3.4. the sample does not come into contact with the wall of the
vessel and that its lower edge is not less than 50 mm (2 in.) or
9.3.4 Spread Test: more than 100 mm (4 in.) above the surface of the boiling
9.3.4.1 This method involves placement of a fixed volume water. Arrange the cover on the vessel and the steam con-
of solder on the surface of a specimen with a few drops of rosin denser, if used, so that they do not discharge condensed water
flux (Type W flux, MIL-F-14256) and heating the specimen for over the sample. Disregard any discoloration of the sample
a fixed period of time at a controlled temperature. occurring during this aging treatment. After the 24-h treatment,
remove the sample from the steam and allow it to dry in the air.
9.3.4.2 The area of spread can be measured with a planime- 9.3.6.2 Test methods outlined in 9.3.2, 9.3.3, 9.3.4, or 9.3.5
ter. are used to assess the solderability of the aged specimens.
9.3.4.3 The height of the solder blob can be measured with 10. Keywords
a stage micrometer which can be set to subtract the thickness 10.1 electrodeposited coatings, tin-lead alloy (solder plate);
of the basis metal and the “spread factor” calculated. A hot solder, tin-lead alloy; tin-lead
plate held at 250 6 5°C (480 6 9°F) may be substituted for the
5
Details of this modification are given in Pessel, “Plating,” Symposium on
Solder, ASTM STP 189, ASTM, 1965, p. 315. Although out of print, STP 189 is now
available from University Microfilms, Inc., 300 N. Zeeb Rd., Ann Arbor, MI 48106.

APPENDIXES

(Nonmandatory Information)

X1. EXAMPLES OF APPROPRIATE SERVICE CONDITIONS

X1.1 SC4—Very severe service conditions require a com- interior atmosphere. Coatings of 8 to 12 µm (0.3 to 0.5 mil),
plete coating of tin-lead free of pores. If the coating is including flow-brightening, have been reported to be satisfac-
subjected to abrasion or is exposed to corrosive liquids or tory, particularly for preserving a solderable coating for a
gases, a deposit of 30 to 125 µm (1.2 to 5.0 mil) may be shorter storage period than that given in SC3. Also, as in SC3,
required to maintain maximum protection. another application considered in this category is the use of the
tin-lead as an etch resist in the production of printed-circuit
X1.2 SC3—Severe service conditions include exposure to
boards.
dampness and to industrial atmospheres. Coatings of 12 to 30
µm (0.5 to 1.0 mil) have been reported to be satisfactory,
particularly for preserving a solderable coating after a long X1.4 SC1—Mild service conditions with less severe re-
storage period (for example, 9 months). Another application quirements than SC2. Deposits of 5 µm (0.2 mil) and less have
considered in this category is the use of the tin-lead as an etch been reported satisfactory for providing and preserving a
resist in the production of printed-circuit boards. solderable coating for short periods of storage (for example, 3
months).
X1.3 SC2—Moderate service conditions include dry or

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 B 579

X2. DESIGN CONSIDERATIONS

X2.1 General: X2.1.2.2 Interdiffusion between tin-lead coatings and cop-

X2.1.1 The properties of electrodeposited tin-lead coatings per or copper alloys does take place. The diffusion is slow at
satisfy the requirements of solderability, corrosion resistance, room temperature and rapid at elevated temperatures. Evidence
etc., outlined in the scope of this specification and their use can of diffusion is the formation of a layer of copper-tin compound
be recommended for most applications. Attention is drawn to at the interface and, if the substrate is brass, diffusion of zinc to
the effects of temperature and to long-term storage of tin-lead the surface. Diffusion may lead to darkening of a thin coating
plated articles which may be factors in designing for special and impairment of its solderability, particularly after long
applications. storage. With such thin coatings, a diffusion barrier of nickel
X2.1.2 Temperature Effects: may be advantageous, but users should consider the use of a
X2.1.2.1 Tin-lead coatings are soft and will withstand thicker coating when solderability has to be maintained over a
considerable flexing and twisting of the basis metal without period of years. An undercoat of nickel or copper must be used
serious damage. At room temperature, mat tin-lead coatings as a diffusion barrier on brass.
will oxidize slowly but flow-brightened and bright tin-lead
coatings oxidize less readily.

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