Introduction To

ANSYS EM Solutions

1 © 2011 ANSYS, Inc. 8/29/11

 Agenda

•
Electromagnetic product/industry
overview
•
Electromechanical product/industry
overview
•
Product Updates

2 © 2011 ANSYS, Inc. 8/29/11

 Two Product Segments

Electronics (HF/SI) Electromechanical

or “High (EM) or “Low
Frequency” Frequency”

3 © 2011 ANSYS, Inc. 8/29/11

 Electronics Application
Segments
Signal & Power Integrity IC Design & Verification

RF & Microwave
10.00 To rque Output
ICA: LL:=922u LDUM:=10m 7.80

Electromechanical Systems
RA:=2.991
0 LA.I [A] 0
LB.I [A] PWM_T:=60
LC.I [A]
PWM_PER:=180

-10.30 I_TARG:=9 -14.50

0 20.00m 30.00m I_HYST:=0.2 0 20.00m 30.00m
1500 rpm

+
sourceA1 Magn et0 1 ω
Q1 Q3 Q5 RA Ohm LL H
sourceA2 Magn et0 2

sourceB1

sourceB2
400 V

sourceC1

Q4 Q6 Q2 sourceC2
FEA

THRES := PWM_T VAL[0] := mod( INPUT[0] ,INPUT[1] )

QS1 INPUT[1] := PWM_PER +
ANGRAD
GAIN
Φ
LA.I EQUBL 57.3
QS2
CONST -30+PWM_PER

-LC.I EQUBL
QS3
CONST -60+PWM_PER

LB.I EQUBL
QS4
FEA1.WIRELOSS CONST -90+PWM_PER
FEA1.CORELO SS
FEA1.Isourc eA
FEA Outp uts FEA1.Vso urc eA -LA.I EQUBL
QS5
302.00k FEA1.EIso urceA
FEA1.FLUXsource A CONST -120+PWM_PER
200.00k FEA1.Isourc eB
FEA1.Vso urc eB LC.I QS6 EQUBL
FEA1.EIso urceB
FEA1.FLUXsource B
FEA1.Isourc eC
CONST -150+PWM_PER
-30.00k INPUT := -LB.I
FEA1.Vso urc eC
0 20.00m 30.00m FEA1.EIso urceC THRES1 := I_TARG - I_HYST EQUBL

FEA1.FLUXsource C VAL1 := 1
THRES2 := I_TARG + I_HYST Y0 := 1 VAL2 := 0 8.50
FEA1.PHI
FEA1.OMEGA
8.50 Q S1.VAL + 7.50
Q1.CTRL + 7.50 5.00 Q S2.VAL + 6.00
Name Va lue 5.00 Q2.CTRL + 6.00 Q S3.VAL + 4.50
FEA1.FEA_STEPS Q3.CTRL + 4.50 Q S4.VAL + 3.00
Q4.CTRL + 3.00 Q S5.VAL + 1.50
SIMPARAM1.RunTime [s] 26.41k
Q5.CTRL + 1.50 QS6.VAL
SIMPARAM1.Tota lIterations 34.51k 0
0 Q6.CTRL

4 © 2011 ANSYS, Inc. 8/29/11

SIMPARAM1.Tota lSteps 6.00k
0 20.00m 30.00m
0 20.00m 30.00m
 Electronic Trends
Electronic Systems drive toward smaller, faster, higher power,
higher complexity, and higher density.
• RF, digital, data conversion, and high-performance DSP on single
platform
• Switching power supplies at high frequency
Consumer market driving unit growth.
• Increasing demand volatility
• Shorter product life cycles
• Extreme price sensitivity.

PCB noise

System EMI Predicts Display Anomaly System SI Predicts Receiver Desensitization

5 © 2011 ANSYS, Inc. 8/29/11
 Cornerstone:
Rigorous, Physics Based
Solutions

6 © 2011 ANSYS, Inc. 8/29/11

 Cornerstone:
Automatic Adaptive Meshing
for Accuracy

7 © 2011 ANSYS, Inc. 8/29/11

 Cornerstone:
Circuit + Electromagnetics

Port3

2
Connector

1
Port1 1 3 Wav ePort2:T1 Wav ePort1:T1 Wav ePort1:T1 Wav ePort2
1 1
2 4 Wav ePort2:T2 Wav ePort1:T2 Wav ePort1:T2 Wav ePort3
Port2
2 2
Package Dif f erential_Via Transition_SL

1
C onnector

2
Port4

Dynamic Link

Simulated Measured
8 © 2011 ANSYS, Inc. 8/29/11
 Products for
Electronics

9 © 2011 ANSYS, Inc. 8/29/11

 HFSS: High Frequency
Structure Simulator
Full-wave 3D electromagnetic
field solver
• Computes electromagnetic
behavior of high-frequency and
high-speed components and
systems
• Extracts S-, Y-, and Z-parameters
• Provides 3D electromagnetic fields Simulation of RFIC in Package

Antenna on UAV
10 © 2011 ANSYS, Inc. 8/29/11
 SIwave
Full-wave Printed Circuit Board
and BGA IC Package Solver
• Unique Field Solver Based on Finite
Element Method coupled with
transmission lines
• Computes electrical behavior of
high-frequency and high-speed
PCBs and BGAs
• Extracts S-, Y-, and Z-parameters
Circuit Board Resonances
• Provides electromagnetic fields

Model Extraction for

11 © 2011 ANSYS, Inc. 8/29/11
Complex Memory Interface
 Ansoft Designer

Ansoft Designer
• Design Environment for
System-Level Electronics
– Design framework with
schematic, layout, and post-
processing
– Links to EM field solvers and
Circuit Simulation

Nexxim
• Advanced Circuit Simulator
– Transient, Harmonic Balance,
and Statistical Eye Simulation

12 © 2011 ANSYS, Inc. 8/29/11

 Signal Integrity

13 © 2011 ANSYS, Inc. 8/29/11

 Applications: Signaling
Standards
Standard interfaces
Package Backplane Connector Daughter Card Package

• DDR3, PCI Express,

HDMI, SATA, USB 3
MS SL SL
+ +

- -

Via Via Via

Serial rates of 3 to 10
Gb/s point-to-point
serial buses.

This requires reliable

signal transmission
across a host board or
between daughter
cards on a backplane
at GHz speeds.

14 © 2011 ANSYS, Inc. 8/29/11

 The Fundamental High Speed
Challenge Clean, open, logical 1 & 0 at Logical 1 & 0 can be hard to
launch from transmitter distinguish at end of long
interconnects; (this is often
called a “closed eye”)

Tx + + path + + Rcv

- - - -

Fast, sharp, edges at

transmitter launch
Smeared edges at end of
long interconnect.

We want to get digital 1’s and 0’s from transmitter to

receiver.
15 However,
© 2011 ANSYS, Inc. 8/29/11 the channel over which this occurs is a low pass
 6 Gb/s SATA Interconnect:
“Divide and Conquer” Solver
technology

Tx +
Controller Backplane SAS/SATA
Via
- Drive + Rx

FR-4 FR-4 FR-4 -

i20m

inh M1558 M1559 inl

P_12_MML130E P_12_MML130E

L=0.12u L=0.12u
W=80u W=80u
M=2 M=2

Vdd
outl outh
m=63
w=1.8u
l=6u

m=63
w=1.8u
l=6u
r_zbt_m=0.05k

r_zbt_m=0.05k
rnhr_rf

rnhr_rf

Vdd Vdd
Vss Vss

Vss

Models courtesy of

16 © 2011 ANSYS, Inc. 8/29/11

 Validation: Nexxim + QuickEye

Eye Diagram

QuickEye

17 © 2011 ANSYS, Inc. 8/29/11

 EMI/EMC

18 © 2011 ANSYS, Inc. 8/29/11

 Network Camera System

Flexible Printed Flat Flexible

Circuit (FPC) Cable (FFC)

CCD TILT
Board

CPU Board

Video
Board

Panasonic Electronic
Devices
Panasonic Communications
Co.
19 © 2011 ANSYS, Inc. 8/29/11 Molex Japan
 EMI Measurements

EMI regulation limit

20 © 2011 ANSYS, Inc. 8/29/11

 Simulation Methodology

Video board FPC TILT board FFC CPU board

SIwave SIwave
HFSS HFSS SIwave
HFSS
FFC Mid Section
0 n2
n1 n1 n2 FFC FFC
U2 U4 n2 n1 n2 n1 n2
Port1 seg1 seg2 n1
1
2

n3 n4 n3 n4 Port1 Port3

3
4

2
1
Port1
Port5 Port1 Port2 0 Port3 n3 n4 n3 n4 n3 n4
ref

2
1

0 n6 n5 Port2
Port6 n6 n5 Port3 Port4

ref

ref
Port2 Port3
Port7 Port5 Port6 n5 n6 n5 n6 n5 n6
ref
3
4

0 n8 n7 Port4
Port8 n8 n7 Port7 Port8 0 Port2 Port4

1
2

4
3
Port4 n7 n8 n7 n8 n7 n8
4
3

HFSS connector models HFSS connector models

Nexxim W-element Nexxim W-element

21 © 2011 ANSYS, Inc. 8/29/11

 Problem Discovery: TDR

Video board FPC TILT board FFC CPU board

Ansoft Corporation Impedance LVDS TDR folded

150.00
Curve Inf o
-V(Dif f1)/I(Dif f 1)
Transient
140.00

130.00

120.00

110.00
-V(Diff1)/I(Diff1)

100.00

90.00

80.00

70.00

60.00

50.00
0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00 9.00 10.00
Time [ns ]

22 © 2011 ANSYS, Inc. 8/29/11

 Reducing Differential Skew

1. Asymmetrical
component pads
removed
2. Differential vias re-
arranged so signal
will arrive at the
same time.
3. EMI test passed

23 © 2011 ANSYS, Inc. 8/29/11

 RF/Microwave

24 © 2011 ANSYS, Inc. 8/29/11

 Space-based Antenna Arrays

Typical spacecraft is host

to numerous antennas
• Important to understand
interactions between
structures
• Avoid performance
degradations
Added reflector antenna
to spacecraft bus
• X-band data relay link
• Need to evaluate potential
impact on helix array
• Antenna placement scenario

25 © 2011 ANSYS, Inc. 8/29/11

 From Components to System
Antenna element design
• Distributed solve option
– Remote Simulation Manager
• Analytical derivatives
– Design sensitivities
– SNLP optimization

Finite array design

• Multi-processing option
• Post-processing variables
Integration onto spacecraft
• 64-bit mesher
• Domain decomposition solver

26 © 2011 ANSYS, Inc. 8/29/11

 Design Exploration:
Critical Antenna Design
0.63 in
3GHz
Parameters
Helix Pitch 1 in
3GHz
0.32 in Helix Radius 0.7 in
Helix Helix
Pitch Radius
Frequency

Frequency
Acceptable
Acceptable Large solution space Helix
Helix Pitch
efficiently mapped using Radius
DSO
• 1 hr total time
4GHz 4GHz
Return Loss Acceptable ranges for design Return Loss
parameters easily
determined

27 © 2011 ANSYS, Inc. 8/29/11

 Space-based Multi-Physics

Electromagnetic

Thermal

Mechanical Stress and Strain

28 © 2011 ANSYS, Inc. 8/29/11
 Ansoft Solutions for
Electromechanical

29 © 2011 ANSYS, Inc. 8/29/11

 Maxwell: 3D Electromagnetics

30 © 2011 ANSYS, Inc. 8/29/11

 Maxwell B Field Around Motor

31 © 2011 ANSYS, Inc. 8/29/11

 Simplorer

32 © 2011 ANSYS, Inc. 8/29/11

 Simplorer:
Multiphysics Integration
Custom Framework Simulation
Model, C IcePak

Simulink

Maxwell

Fluent Q3D ANSYS

Mechanical
33 © 2011 ANSYS, Inc. 8/29/11
 Hybrid Electric
Vehicles

34 © 2011 ANSYS, Inc. 8/29/11

 HEV: System Simulation
MULTIPHYSICS
V_RO T1

ω
IGBT1 IGB T2 IGBT3 + Rotor

Im_IN T

AB C beta_IN

TTheta_IN
T

- +
Battery

Imβ
M_LOAD
LBATT_A1 t Y

ECE
ECE -- LINK
LINK
IGBT4 IGB T5 IGBT6
PRI := 1 yal ph = 0 and yb eta = 0 SET: tx:= t SET: k: =1

d- q-Current Contr oller

I_n n
I_iq yalph > 0 and ybeta >= 0

I GAIN iq I GAIN (ybe ta > 0 an d yalp h < = 0) or (yalp h < 0 and yb eta < = 0)
ybeta < 0 and yalph >= 0
SET: ga m1: =ASIN(ybet a/y)
KI := 240 KI := 29 .0 2k
G(s )

UL : = 10
GS1 true SET: ga m1: =pi -ASIN(yb eta/y)
LL := -10 true
UL : = 10
true SET: ga m1:=2* pi+ ASIN (ybeta/ y)
LL := -10 P_Iq m_r ef P _PA RT_n ust_in ust
Yt
LIMIT GAIN LIMIT GAIN GAIN
SET: kr: =(k-1)* PI3
SET: kl:= k*PI3
yq KP := 1.96 KP := 0.1161k
SET: k:=k+1 SET: ga m1: =ga m1
I_id id_ref
true
I CON ST

KI := 240
Speed Control
kl <= gam1
yd P_i d GS2 id SET: ga mr:= gam1 -kr
kr <= ga m1 and kl > ga m1
SET: tr:= kA*y*Tp*sin(PI3 - gamr)
LIMIT GAIN G (s ) GAIN SET: t l: =kA*y* Tp *sin (g amr)
SET: t 02: =(Tp-tr-t l)/2
UL : = 10 KP := 1.96
LL := -10

k=2 or k=4 or k=6 k=1 or k=3 or k=5

Phase Transformation / Control Signal Generation by Space Vector M odulation SET: z1: = 1 SET: z4:= 0 SET: z1:=0 SET: z4:=1
ICA: EQU SET: z2:= 1 SET: z5:= 0 SET: z2: = 0 SET: z5:= 1
A123 SET: z3:= 1 SET: z6:= 0 A456 SET: z3:=0 SET: z6:=1
f p:=10 k wu 32: =sq rt(3.) / 2.
theta_e l: =SYMPOD1. PHIDEG * P18 if (y>10.) {y:=10.}
Tp: =1./fp P18 := pi / 18 0.
sin th e:=sin(t he ta _el ) i1alph:=SYMPOD1.I1A
tx:=0 PI3: =pi / 3. t-tx>=t02 and k=2 t-tx>=t02 and k=4 t-tx>=t02 and k=6 t-tx>=t02 and k=1 t-tx>=t02 and k=3 t-tx>=t02 and k=5
cost he:= cos(th eta_e l) i1 beta:=(SYMPOD1. I1 A + 2 * SYMPOD 1.I1 B) / w u3
wu 3: =sqrt (3.) gam1:=0.
yal ph: =co sthe * yd .VAL - sin th e * yq .VAL i1 d:=i1 alp h * co sth e + i1b eta * si nthe
kA:=0.1 B156
ybe ta: =sint he * yd. VAL + costhe * yq .VAL i1 q:=i1 bet a * cost he - i 1al ph * sinthe A126 A234 A135 B246 B345
SET: z3:= 0 SET: z1:=1 SET: z5:=0 SET: z6: =0
y:=SQRT(SQU(yal ph)+ SQU (ybeta)) theta_m:=theta_el / 3. SET: z1:=0 SET: z2:=0
SET: z6:= 1 SET: z5:=1 SET: z4:=0 SET: z2:=1 SET: z3:= 1
SET: z4:=1

t-tx >= t 02 +t r t-tx >= t 02 +tr t-tx >= t 02 +t r t-tx >= t 02 +tr t-tx >= t 02 +t r t -tx >= t02 +tr

A246 A345 A156 B126 B234 B135

SET: z3:= 0 SET: z2:=1 SET: z6:=0 SET: z4:=0
SET: z2:=0
Phase Current RA.I [A]
RB.I [A]
SET: z1:=0
SET: z4:= 1 SET: z5:= 1 SET: z6:=1 SET: z5:= 0 SET: z3:=1 SET: z1:=1
17 2.00
RC.I [A]
t-tx >= t02+tr+tl t-tx >= t02+tr+tl t-tx >= t02 +tr+tl t-tx >= t02+tr+tl t-tx >= t02+tr+tl t -tx >= t02 +tr+tl
10 0.00

0 SET: z1:=0 SET: z4:=1 SET: z1:=1 SET: z4:= 0

E456 SET: z2:=0 SET: z5:= 1 E123 SET: z2:=1 SET: z5:=0
SET: z3:=0 SET: z6: =1 SET: z3:=1 SET: z6:=0
-10 0.00 true

-17 2.00 true PRI := 1 t-tx >= Tp

t-tx >= Tp and k = 0 SET: t x:= t
74 .9 5m 80.00m 85.00m SET: k:=0

t-tx >= Tp

35 © 2011 ANSYS, Inc. 8/29/11

 HEV: Battery Thermal
Management with ANSYS CFD
MULTIPHYSICS

ANSYS-CFD

Power Temperature

► Increase power capability,

while avoiding hot spots that
cause premature failure.
► Accurate circuit simulation for
d  SOC  0 0   SOC   1Q 
battery packs includes   =  −1
dt  V1  0

V  + − 1  I ( t )
 
R1C1   1 
 C1 
temperature dependencies V (t ) = VOCV ( SOC ) + V1 − ( Rs + RPTC ) I (t )

36 © 2011 ANSYS, Inc. 8/29/11

 HEV: System Simulation with
Simplorer MULTIPHYSICS
V_RO T1

ω
IGBT1 IGB T2 IGBT3 + Rotor

Im_IN T

AB C beta_IN

TTheta_IN
T

- +
Battery

Imβ
M_LOAD
LBATT_A1 t Y

ECE
ECE -- LINK
LINK
IGBT4 IGB T5 IGBT6
PRI := 1 yal ph = 0 and yb eta = 0 SET: tx:=t SET: k: =1

d- q-Current Contr oller

I_n n
I_iq yalph > 0 and ybeta >= 0

I GAIN iq I GAIN (ybe ta > 0 an d yalp h < = 0) or (yalp h < 0 and yb eta < = 0)
ybeta < 0 and yalph >= 0
SET: ga m1: =ASI N(ybeta/y)
KI := 240 KI := 29 .0 2k
G(s )

UL : = 10
GS1 true
LL := -10 true SET: ga m1: =pi -ASIN(yb et a/y)
UL : = 10
true SET: ga m1:=2* pi+ ASIN (ybeta/ y)
LL := -10 P_Iq m_r ef P_PA RT_n ust_in ust
Yt
LIMIT GAIN LIMIT GAIN GAIN
SET: kr:=(k-1)* PI3
SET: kl:= k*PI3
yq KP : = 1.96 KP := 0.1161k
SET: k:=k+1 SET: ga m1: =ga m1
I_id id_ref
I CON ST
true

KI := 240
Speed Control
kl <= gam1
yd P_id GS2 id SET: ga mr:= gam1 -kr
kr <= ga m1 and kl > ga m1
SET: tr:= kA*y*Tp*sin(PI3 - gamr)
LIMIT GAIN G (s ) G AIN SET: t l: =kA*y* Tp *sin (g amr)
SET: t 02: =(Tp-tr-tl)/2
UL : = 10 KP := 1.96
LL := -10

k=2 or k=4 or k=6 k=1 or k=3 or k=5

Phase Transformation / Control Signal Generation by Space Vector M odulation SET: z1:= 1 SET: z4:= 0 SET: z1:=0 SET: z4:=1
ICA: EQU SET: z2:= 1 SET: z5:= 0 SET: z2:= 0 SET: z5:= 1
A123 SET: z3:= 1 SET: z6:= 0 A456 SET: z3:=0 SET: z6:=1
fp:=10 k wu 32:=sq rt(3.) / 2.
thet a_e l: =SYMPOD1. PHIDEG * P18 if (y>10.) {y:=10.}
Tp: =1./ fp P18 :=pi / 18 0.
sin th e:=sin(the ta _el ) i1alph:=SYMPOD1.I1A
tx:=0 PI3: =pi / 3. t-tx>=t02 and k=2 t-tx>=t02 and k=4 t-tx>=t02 and k=6 t-tx>=t02 and k=1 t-tx>=t02 and k=3 t-tx>=t02 and k=5
cost he:= cos(th eta_e l) i1 beta:=(SYMPOD1. I1 A + 2 * SYMPOD 1.I1 B) / w u3
wu 3:=sqrt (3.) gam1:=0.
yal ph: =co sthe * yd .VAL - sin th e * yq .VAL i1 d:=i1 alp h * co sth e + i1b eta * si nthe
kA:=0.1 B156
ybe ta: =sint he * yd.VAL + costhe * yq .VAL i1 q:=i1 bet a * cost he - i 1al ph * sinthe A126 A234 A135 B246 B345
SET: z3: = 0 SET: z1:=1 SET: z5:=0 SET: z6:= 0
y:=SQRT(SQU(yal ph)+ SQU (ybeta)) theta_m:=theta_el / 3. SET: z1:=0 SET: z2:=0
SET: z6:= 1 SET: z5:=1 SET: z4:=0 SET: z2:=1 SET: z3:= 1
SET: z4:=1

t-tx >= t 02 +t r t-tx >= t 02 +t r t -tx >= t 02 +t r t-tx >= t 02 +t r t-tx >= t 02 +t r t -tx >= t02 +tr

A246 A345 A156 B126 B234 B135

SET: z3:= 0 SET: z2:=1 SET: z6:=0 SET: z4:=0
SET: z2:=0
Phase Current RA.I [A]
RB.I [A]
SET: z1:=0
SET: z4: = 1 SET: z5:=1 SET: z6:=1 SET: z5:= 0 SET: z3:=1 SET: z1:=1
17 2.00
RC.I [A]
t-tx >= t02+tr+tl t-tx >= t02+tr+tl t-tx >= t02 +t r+tl t-tx >= t02+tr+tl t-tx >= t02+tr+tl t-tx >= t02 +tr+tl
10 0.00

0 SET: z1:=0 SET: z4:=1 SET: z1:=1 SET: z4:=0

E456 SET: z2:=0 SET: z5:= 1 E123 SET: z2:=1 SET: z5:=0
SET: z3:=0 SET: z6: = 1 SET: z3:=1 SET: z6:=0
-10 0.00 true

-17 2.00 true PRI := 1 t-tx >= Tp

t-tx >= Tp and k = 0 SET: t x:= t
74 .9 5m 80.00m 85.00m SET: k:=0

t-tx >= Tp

37 © 2011 ANSYS, Inc. 8/29/11

 HEV MultiPhysics
STRUCTURAL MECHANICS

Temperature

Losses
Mapped Losses

38 © 2011 ANSYS, Inc. 8/29/11

 Electronics Solutions
HF/SI
• Extractors
– HFSS
– Q3D
– SIwave
• System
– Ansoft Designer IGBT1 IGB T2 IGBT3

A B C
Im_IN
b eta_IN

TTh eta_IN
T
V _R O T1

T
+
ω
Ro tor

- +

Imβ
Ba tte r y
M_L O AD

EM
L BAT T_A1 t Y

ECE
ECE -- LINK
LINK
IGBT4 IGB T5 IGBT6
PRI := 1 yal ph = 0 and yb eta = 0 SET: tx:= t SET: k:=1

d- q-Current Contr olle r

I_iq I_n n yal ph > 0 and yb eta >= 0

I G AIN iq I G AIN (ybeta > 0 an d yalph < = 0) or (yalph < 0 and yb eta <= 0)
ybe ta < 0 an d yalp h >= 0
SET: ga m1:=AS IN(ybet a/ y)
K I := 24 0 K I := 29 .0 2k

G(s)
UL := 10
GS 1

• Extractor
true true SET: ga m1:=pi - ASIN(yb eta/y)
UL := 10 LL := -10
true SET: ga m1: =2* pi+ASIN(ybeta/y)
LL := -10 P_Iq m_ref P_PART_ n ust_in ust
Yt
LIMIT G AIN LIMIT G AIN G AIN S ET: kr:=(k-1)* PI3
SE T: kl: = k*PI3
yq KP := 1.96 KP := 0.116 1k
SET: k:=k+1 SE T: gam1:=ga m1
I_id id_ref
true
I CON ST

K I := 24 0
S pee d Con trol
kl <= gam1
yd P_i d GS 2 id SET: gamr:=gam1-kr
kr <= gam1 and kl > gam1
SE T: tr:= kA* y*Tp*s in(PI3 - ga mr)
LIMIT G AIN G(s) G AIN SET: tl:=kA *y* Tp *sin (g amr)
SET: t02: =(T p-tr-tl)/2
UL := 10 KP := 1.96
LL := -10

RmXprt
k= 2 o r k= 4 or k=6 k=1 o r k= 3 or k=5

–
Ph ase Tran sforma tion / Co nt rol Signa l Ge ner ation by Sp ace Vect or M odulation SET: z1:=1 SET: z4:=0 SET: z1:=0 SET: z4:= 1
IC A: E QU SET: z2:=1 SET: z5:=0 SE T: z2:= 0 SET: z5:= 1
A123 SET: z3:=1 SET: z6:=0 A456 SET: z3:=0 SET: z6:= 1
fp:=10 k wu 32:= sq rt(3.) / 2.
theta_el:=SYMPO D1.PHI DEG * P18 if (y>10 .) {y:= 10.}
T p:=1./fp P18 := pi / 180.
sin th e:= sin(the ta _el ) i1alp h:= SYMPOD 1.I1A
tx:=0 PI3:=pi / 3. t-tx> =t02 an d k=2 t-tx> =t02 an d k=4 t-tx>=t02 and k=6 t-tx>=t02 and k=1 t-tx> =t02 an d k =3 t-tx> =t02 an d k=5
costhe:= cos(th eta_e l) i1beta:=(SYMPOD1.I1 A + 2 * SY MPOD 1.I1B) / wu3
wu 3:=sqrt(3.) gam1:= 0.
yal ph:= co sthe * yd .VAL - sin the * yq .VAL i1d:=i1 alp h * co sth e + i1b eta * si nthe
kA:=0.1 B156
ybe ta:= sinthe * yd.VAL + costhe * yq .VAL i1q:=i1 beta * costhe - i 1al ph * sinthe A126 A234 A135 B246 B345
SET: z3:=0 SET: z1:= 1 SET: z5:=0 SET: z6:=0
y:=SQRT(SQU(yal ph)+ SQU (ybeta)) theta_m: = theta _el / 3. SET: z1:=0 SET: z2:=0

Maxwell 2D/3D
SET: z6:=1 SET: z5:=1 SET: z4:= 0 SET: z2:=1 SET: z3:=1
SET: z4:=1

t-tx >= t02+tr t-tx >= t02 +tr

–
t-tx >= t02 +tr t-tx >= t 02 +tr t-tx >= t02 +tr t-tx >= t02+tr

A246 A345 A156 B126 B234 B135

SET: z3:=0 SET: z2:= 1 SET: z6:=0 S ET: z4:= 0
SET: z2:= 0
Ph ase Current RA.I [A]
RB.I [A]
SET: z1:=0
SET: z4:=1 SE T: z5: =1 SE T: z6:=1 SET: z5:= 0 SET: z3:=1 SET: z1:= 1
172.00
RC.I [ A]
t-tx >= t02 +tr+tl t-tx >= t02 +tr+tl t-tx >= t02+tr+tl t-tx >= t02 +tr+tl t-tx >= t02+tr+tl t-tx >= t02+tr+tl
100.00

• System
0 SE T: z1:= 0 S ET: z4:= 1 S ET: z1:= 1 SET: z4:=0
E456 SE T: z2:= 0 SET: z5:=1 E123 S ET: z2:= 1 S ET: z5:= 0
SE T: z3:= 0 SET: z6:=1 S ET: z3:= 1 SET: z6:= 0
-10 0.00 true

-17 2.00 true PRI := 1 t-tx >= Tp

S ET: k:=0 t-tx >= T p and k = 0 SET: tx:= t
74.95m 80.00m 85.0 0m

t-tx >= Tp

– Simplorer with Multiphysics

Integration

39 © 2011 ANSYS, Inc. 8/29/11

 Product Updates
High Frequency

40 © 2011 ANSYS, Inc. 8/29/11

 Overview
• Advanced Integrated Solver Technologies
– Finite Arrays with Domain Decomposition
– Hybrid solving
•
FEBI
•
IE Regions
• Physical Optics Solver in HFSS-IE
• New Layout interface for HFSS: Solver on
Demand in Designer
• Usability Enhancement
– Radiated fields…..
– 3D modeler improvements
• CAD Integration in Workbench
– Improved Multiphysics flow

41 © 2011 ANSYS, Inc. 8/29/11

 Advanced
Solvers:
Finite Arrays
with DDM

42 © 2011 ANSYS, Inc. 8/29/11

 Finite Arrays with Domain
Decomposition
Efficient solution for
repeating geometries
(array) with domain
decomposition technique
(DDM)

43 © 2011 ANSYS, Inc. 8/29/11

 A Review: Domain
Decomposition
Distributed memory parallel
solver technique
Distributes mesh sub-
domains to network of
processors
Distributes mesh sub-domains
to networked processors and memory
Significantly increases
simulation capacity
Highly scalable to large
numbers of processors
Automatic generation of
domains by mesh
partitioning
• User friendly
• Load balance
Hybrid iterative & direct solver
44
• © Multi-frontal
2011 ANSYS, Inc.
direct solver
8/29/11
for each sub-domain
 Finite Arrays
Solve large finite
array designs
Efficient setup and
solution
Define unit cell and
array dimensions
• Efficient geometry
creation and Memory efficient
Ø

Ø
Enabled with the HFSS HPC
representation product
Efficient Domain
Decomposition
solution
• Leverages repeating
nature of array
geometries
45 © 2011 ANSYS, Inc. 8/29/11
 Example: Skewed Waveguide
Array Unit cell shown with wireframe
•
16X16 (256 view of virtual array
elements and
excitations)
•
Skewed
Rectangular
Waveguide
(WR90) Array
–
1.3M Matrix Size
•
Using 8 cores
–
3 hrs. solution
time
–
0.4GB Memory
total
46 • Using 16 8/29/11
© 2011 ANSYS, Inc. cores
 Hybrid Solving:
Finite Element-
Boundary
Integral

47 © 2011 ANSYS, Inc. 8/29/11

 Finite Element-Boundary
Integral
• Solving
Antenna Placement Larger Problems
Study: UHF Antenna with
on Apache
Rigor
UH64 airframe
– Finite Elements with DDM
– Boundary Integral (3D Method of Moments)
– Hybrid Finite Element-Boundary Integral (FE-BI)

48 © 2011 ANSYS, Inc. 8/29/11

 Hybrid Solving: Finite Element-
Boundary Integral
Finite Elements with DDM
Apache
helicopter
• UHF antenna
placement study
@ 900 MHz
Solution volume
• 1,250 m3
• 33,750 λ3
Solution Specs
• 72 engines
• Matrix size =
47M
• 6 adaptive
passes
• 300 GB RAM
• 5 hr 30 min
49 © 2011 ANSYS, Inc. 8/29/11
 Hybrid Solving: Finite Element-
Boundary Integral
Apache helicopter Boundary Integral, 3D MoM with
• UHF antenna HFSS-IE
placement study @
900 MHz
Solution surface
• 173 m2
• 1557 λ2
Solution Specs
• 12 core MP
• 680k unknowns
• 9 adaptive passes
• 83 GB RAM
• 5 hr 28 min

50 © 2011 ANSYS, Inc. 8/29/11

 Hybrid Solving: Finite Element-
Boundary Integral
Apache helicopter Hybrid Finite Element – Boundary
Integral
• UHF antenna placement
study @ 900 MHz
FEM solution volume
• 69 m3
• 1863 λ3
IE solution surface
• 236 m2
• 2124 λ2
Solution Specs
• 12 cores total using
DDM with MP
Compared to 72 core FEM solution
• Matrix Size = 2.9M 14X less memory
• 6 adaptive passes 5.5 times faster
• 21 GB RAM
51 • ©12011hr 3 min
ANSYS, Inc. 8/29/11
 Summary of FEBI performance

Type Time, Ratio Memory, Ratio

FEM + DDM 5hr 30min, 1 300GB, 1
IE 5hr 28min, 1 83GB, 3.6
FEBI 1hr 3min, 5.5 21 GB, 14.3

52 © 2011 ANSYS, Inc. 8/29/11

 Hybrid
Solving: IE
Regions

53 © 2011 ANSYS, Inc. 8/29/11

 FEBI and Physically Separate
“Domains”
Reflector with multiple FE-BI
domains
• Conducting reflector and feed horn
each surrounded by air with FEBI
applied to surface of air volumes
– Provides integral equation “link”
between FEM domains
• But 3D MoM solution from integral
equations could be applied directly to
conducting surface only

1meter 1meter 1meter

10λ 20λ 30λ

Frequency Memory Required Frequency Memory Required Frequency Memory Required

3 GHz 2GB 6 GHz 10GB 9GHz 30GB

54 © 2011 ANSYS, Inc. 8/29/11

 HFSS Hybrid Solving – IE
Regions
•
Parallelize
d
–
IE regions
solved in
parallel.
–
Analogou
s to FEM
domains
•
Rigorous
–
Multiple
reflection
•
Automate
d
55 © 2011 ANSYS, Inc. 8/29/11
 HFSS IE Regions - Example

56 © 2011 ANSYS, Inc. 8/29/11

 Physical
Optics

57 © 2011 ANSYS, Inc. 8/29/11

 HFSS-IE PO

Asymptotic solver for

extremely large
problems
• In HFSS-IE
• Solves electrically huge
problems
– And provides first pass
“quick solution” for IE
• Currents are
approximated in
illuminated regions
– Set to zero in shadow
regions
• No ray tracing or multiple
58 “bounces”
© 2011 ANSYS, Inc. 8/29/11
 PO Examples

Notice the shadowing of the gun barrel

on the tank and the tank on the ground.

59 © 2011 ANSYS, Inc. 8/29/11

 HFSS
Transient

60 © 2011 ANSYS, Inc. 8/29/11

 Transient problems

61 © 2011 ANSYS, Inc. 8/29/11

 Aircraft: Pulsed RCS

62 © 2011 ANSYS, Inc. 8/29/11

 HFSS Transient
Introduced in HFSS 13.0
Discontinuous Galerkin Time
Domain (DGTD)
• Finite element solution
– Retains accuracy and reliability of
adapted unstructured-mesh
• Supports higher order basis functions
– Efficient for geometries with a wide
range of geometric detail
• Local time stepping
– Based on element size, order and
material property mesh elements
may advance in time with different
time steps

63 © 2011 ANSYS, Inc. 8/29/11

 HFSS Transient

Transient Network Analysis

• Separate Frequency and Time
domain “Edit Source“ settings
• Specify delay of TDR to
synchronize rise times
• Handling of partial S due to
passive ports
Transient
• Scaling and delay of individual
sources
General
• Support for general frequency
dependent materials

64 © 2011 ANSYS, Inc. 8/29/11

 Solver on
Demand

65 © 2011 ANSYS, Inc. 8/29/11

 Designer RF with HFSS - Solver
on Demand
HFSS - Solver on Demand
• Intuitive PCB design entry for
HFSS
• Chips, packages, channels,
modules, …
• Designer layouts simulated
with HFSS
– Automated boundary and port
setups
– Finite dielectrics and ground
supported
• Wave and Lumped Gap Port
– Single ended and Differential
66 – Vertical
© 2011 ANSYS, Inc. and Horizontal
8/29/11
 Usability
Enhancements

67 © 2011 ANSYS, Inc. 8/29/11

 General Enhancements
• Save Radiated field ~10X
Reduction
data only
– Reduced the amount
of stored data

• Import list for Edit

Sources
– Can include
parametric variables

• Network Installation for

clusters
– Improved reliability on
68 Linux
© 2011 ANSYS, Inc. 8/29/11
 CAD Integration on WB
Improvements
• CAD integration in ANSYS Workbench provides
direct link to 3rd party CAD tools
• Such as ProEngineer, Catia, SpaceClaim
• Added support for parametric analysis and
distributed solving of CAD parameter

69 © 2011 ANSYS, Inc. 8/29/11

 Ansoft to ANSYS Geometry
Transfer
Geometry and material assignment
•
transfer from Ansoft to ANSYS
• Consume geometry from multiple
upstream CAD sources
– Source can be any of CAD,
DesignModeler or Ansoft products
– Further geometry edits are
possible in ANSYS Design
Modeler
• Creates User Defined Model (UDM)
for each geometry input.
70 © 2011 ANSYS, Inc. 8/29/11
 Signal-, Power-
Integrity, & EMI
Update

Steve Pytel, PhD.

Signal Integrity
71 © 2011 ANSYS, Inc. 8/29/11
Product Manager
 Overview

•
ANSYS ECAD Solutions
•
HFSS for Signal Integrity
•
SIwave Full BRD and PKG Solutions
•
SI Circuit Simulation for IBIS-AMI and
Memory
•
Q3D Extractor 11.0 Updates
•
General SI Updates for HFSS, Q3D
Extractor, and DesignerSI
•
TPA Enhancements

72 © 2011 ANSYS, Inc. 8/29/11

 ANSYS ECAD Solutions

73 © 2011 ANSYS, Inc. 8/29/11

 AnsoftLinks Translation Paths
Cadence Mentor ODB++ Altium Zuken

AnsoftLinks
Static ECAD Transfer
(.anf)

TPA Q3D SIwave HFSS Designer Icepak Mechanical

Dynamic ECAD Transfer

AnsoftLinks with Extracta Solver on Demand

Cadence HFSS PlanarEM Nexxim HSPICE

Virtuoso SiP APD Allegro

74 © 2011 ANSYS, Inc. 8/29/11

 ECAD Translation Updates

Cadence
• Allegro  16.0, 16.1, 16.2, 16.3 and 16.5
• APD  16.0, 16.1, 16.2, 16.3 and 16.5
• SiP Digital/RF  16.0, 16.1, 16.2, 16.3 and 16.5
• Virtuoso  4.46, 5.0, 5.0.32 and 6.x
Mentor Graphics
• Expedition  v2005, v2007.1 thru v2007.8
• Boardstation  8.x
• Boardstation XE  v2007, v2007.1, v2007.2,
v2007.3 and v2007.7
• PADS  PowerPCB v5.2a, v2005 and
v2007
Zuken
• CR5000  9.x and lower
ODB++
75
• Altium8/29/11
© 2011 ANSYS, Inc.
Designer  R10
 HFSS for Signal Integrity

ECAD & Field Solver Improvements

76 © 2011 ANSYS, Inc. 8/29/11

 Solver on Demand: An ECAD
Interface for HFSS
Problem Description:
1. Converting package and printed circuit board layout
data to 3D mechanical CAD models creates a large
amount of unnecessary overhead in the geometry
database
2. A key capability needed for wide-spread use of HFSS
as an extraction tool is to make it accessible to
non experts
Solution:
3. When HFSS is used for package and PCB extraction a
2D Electrical CAD layout editor is better suited for
model creation and setup
4. The Designer Layout editor with Solver on Demand
improves HFSS accessibility for non-expert
77
engineers
© 2011 ANSYS, Inc. 8/29/11
who need to use HFSS for package and
 “HFSS for ECAD”

Two Design Flows for Electrical Design

• Mechanical CAD
– Connectors, Waveguides
– HFSS

• Electric CAD (layout)

– PCBs, Packages, On-chip Passives
– HFSS - Solver on Demand

78 © 2011 ANSYS, Inc. 8/29/11

 “HFSS for ECAD”
Highly automated for in layout design environment
– Primitives = traces, pads, bondwires, vias
– Net name definition
Significantly reduce engineering time interacting with
software
Lightweight interface for geometrically complex
structures
Direct import of Cadence products using Cadence
Extracta
– Allegro, APD, and SiP
Direct HFSS solve from within the Cadence environment
– Virtuoso, Allegro, APD, and SiP

79 © 2011 ANSYS, Inc. 8/29/11

 HFSS within Cadence SPB &
Virtuoso
• Dynamic ECAD Flow
• Create and Solve models with HFSS from within Cadence SPB
& Virtuoso

HFSS
Solution
Progress

80 © 2011 ANSYS, Inc. 8/29/11

 HFSS Setup & Solve in
Virtuoso

Back
a
for fin nnotation s
al rele chedu
ase led

81 © 2011 ANSYS, Inc. 8/29/11

 HFSS ECAD Layout Editor
• HFSS Solver Technology is embedded in Designer as “Solver
on Demand”

n o ne
v i ewi
a yout
+ 3 DL
2D

Export 3D HFSS Model

Solve in Designer using HFSS

82 © 2011 ANSYS, Inc. 8/29/11

 HFSS Solve for PKG merged to
PCB

Lumped ports on
package bumps

Wa
cou ve Por
tout t
bou at
nda
ry

83 © 2011 ANSYS, Inc. 8/29/11

 Parameterized Differential
Vias

84 © 2011 ANSYS, Inc. 8/29/11

 HFSS for the SI Community
Summary
New in R14
• Parameterized padstacks
• Automated causal material
• Multi-frequency point adapting
• Integrated 2D/3D views
• Huray Surface Roughness Models
• Lumped Port De-embedding
• Trapezoidal Trace Cross-sections
• Automated Virtuoso HFSS Design
• Passivity Enforced Interpolation HFSS Padstack
Editor with
Parameterization
• HFSS Solves from within Cadence

85 © 2011 ANSYS, Inc. 8/29/11

 SIwave Full BRD and PKG Solutions

DDR3 and High Speed Serial

Improvements

86 © 2011 ANSYS, Inc. 8/29/11

 Memory and High Speed Serial
Solver
Improvements GUI
Table Impedance MoM 64 bit GUI for Windows
Calculator
Table Impedance
• Ideal and non-ideal lumped Calculator
parameters (i.e Zo)
• Nexxim and HSPICE RLC
• Flight time plots
simulations • Transient Simulations with
Nexxim or HSPICE
Via to Via Coupling
PKG & PCB Automation
• Differential pair accuracy
improvements • Graphical selection
Solver Support for Pin Grouping Automation
Arbitrary Antipad • Multi-part select with
Cutouts group per part/net
definitions
• Improvement in via
modeling accuracy Improved Validation
SYZ Solver Improvements Checker
• Guaranteed • Detection of pins
8/29/11passive/causal
87 © 2011 ANSYS, Inc.
belonging to multiple pin
 DDR3 Solutions: Signal Net
Analyzer

• Displays Z0, length, time delay, and reference layer

• All possible paths (from each pin to every other pin on net)
are displayed
–
Sorted in descending order of path distance
• User can click on an individual path in the table
– Variation in Z0 is graphically displayed
– Path is highlighted in SIwave’s main layout window
• Ideal reference layer mode (default)
– Traces on top & bottom metal layers are assumed to be
microstrips
– Interior traces are assumed to be striplines
• Non-ideal reference layer mode
88 © 2011 ANSYS, Inc. 8/29/11 – Reference layer is explicitly calculated for each trace segment
– Some traces may be floating (no suitable reference layer available)
 Huray Surface Roughness &
Via-Via Coupling

89 © 2011 ANSYS, Inc. 8/29/11

 Equipotential Pads for DCIR
Power Density Plot: Without Pad Power Density Plot: With Pad

Current Density Plot: Without Pad Current Density Plot: With Pad

90 © 2011 ANSYS, Inc. 8/29/11

 SI Circuit Simulation for IBIS-AMI and
Memory

91 © 2011 ANSYS, Inc. 8/29/11

 Macro-modeling Functionality
New functionality for the SI market

Circuit
HFSS Network Data Simulation
Explorer •
Designer
•
Simplorer
•
State-space fitting •
Other
•
Passivity enforcement
Q3D •
Passivity checker
•
S-parameter visualization
•
S-matrix reduction
•
Macro-model generation

SIwave •
State Space
•
Simplorer
•
Spectre
Measured Data •
HSPICE
•
PSPICE
Designer

92 © 2011 ANSYS, Inc. 8/29/11

 Network Data Explorer

Graphic comparison showing the difference between the Z-Matrix

entries for two different decoupling capacitor schemes.

93 © 2011 ANSYS, Inc. 8/29/11

 Vendor Libraries

Design Engineers require accurate electrical

models for components when designing
circuits
A key feature of the web based library
support is ease of use. Library
installation generally requires users to
download files, uncompress them and
place them in the correct location on a
local drive.
Automated web based download from within
Designer automates these steps, making
it easy for users to keep their component
libraries up to date.
Design Kits
• DDR3, PCIe 3.0, HDMI , SATA, SAS, …
94 © 2011 ANSYS, Inc. 8/29/11
 Vendor Libraries

Accessible from the menu via Tools >

Download Component Libraries…

Filtering limits the

number of
components to be
updated.

95 © 2011 ANSYS, Inc. 8/29/11

 Automated IBIS-AMI Importing

96 © 2011 ANSYS, Inc. 8/29/11

 High Speed Serial Design With
IBIS-AMI

• Automated IBIS-AMI
Importing
– IBIS-AMI Specification
Testing
•
Pass/Fail
•
Advanced

97 © 2011 ANSYS, Inc. 8/29/11

 QuickEye Multi-core Speed Up

Linear speed improvement with multiple cores!

98 © 2011 ANSYS, Inc. 8/29/11

 Q3D Extractor 11.0

99 © 2011 ANSYS, Inc. 8/29/11

 Touch Screen Accuracy
Improvements
•
Added the ability to converge on off diagonal terms
with Touch Panel displays

100 © 2011 ANSYS, Inc. 8/29/11

 Q3D – Magnetic Materials

Simulation Time
Maxwell
Q3D AC 10 s 3D 50 min
Q3D DC 6min 30 s
Sweep 2s

Total < 7 min 50 min

Peak RAM 0.6 GB 5 GB
Electroplated Nickel has   5
Bulk Nickel has   600 Q3D
XY Plot 1 Q3DDesign2 ANSOFT
55.00 Curve Info
ACL(Coil:Coil_in,Coil:Coil_in)
Setup1 : Sw eep2

50.00
ACL(Coil:Coil_in,Coil:Coil_in) [nH]

45.00

Maxwell*
40.00

35.00

30.00

* Each additional frequency 25.00

point takes ~ 15 minutes to

0.00 0.01 0.10 1.00 10.00 100.00
Freq [MHz]

solve
101 with
© 2011 Maxwell
ANSYS, Inc. 8/29/11
L(f) HFSS
 Ansoft HPC Enhancements:
Fixed Variables
Desktop supports fixed
variables
• Solution database is NOT
indexed by these variables
• User will not sweep them
• Any change to these
variables invalidate existing
solutions
Benefits
• Faster access to solution
database
– Faster post-processing
•
Via Wizard generated
• Improved reporter-dialog project with 746 variables
response –
Only one variable, called Pad, is
swept in a parametric setup
–
Turn off “Sweep” checkbox for all
102 © 2011 ANSYS, Inc. 8/29/11
variables except Pad