Riteria For Choosing Transparent Conductors: Roy G. Gordon
Riteria For Choosing Transparent Conductors: Roy G. Gordon
In the following, we
Thermal Stability of
Transparent Conductors
TCs will generally increase in resistance Cadmium stannate is deposited by sput- Diffusion Barriers between
if heated to a high enough temperature for tering at low temperatures in amorphous Transparent Conductors
a long enough time. For example, some of form. When annealed at high tempera- and Sodium-Containing
the TCs were tested in my laboratory by tures, it crystallizes into a crystalline form Glass Substrates
heating them in air for 10 min at succes- that is stable up to at least 1100C.34 When TCs are deposited on sodium-
sively higher temperatures. Table V gives, containing glass, such as soda-lime glass,
as “stability temperatures,” the tempera- Minimum Deposition Temperature sodium can diffuse into the TC and increase
ture range within which no increase of When TCs are deposited onto a substrate, its resistance. This effect is particularly
10% in sheet resistance was noted. the temperature of the substrate generally noticeable for tin oxide, because sodium
In each case, the TC remained stable must be maintained at a sufficiently high diffuses rapidly at the high substrate tem-
to temperatures slightly above the opti- temperature in order to develop the re- peratures (often
550C) used for its depo-
mized deposition temperature. The high- quired properties in the TC. The required sition. It is common to deposit a barrier
temperature stability of tin oxide films temperatures usually increase in the fol- layer on the glass prior to the deposition
allows coated glass to be reheated in order lowing order: Ag or ITO ZnO SnO2 of tin oxide. Silica is most commonly used
to strengthen it by tempering. The thermal Cd2SnO4. Thus, silver or ITO may be pre- as the barrier layer between soda-lime glass
stability of tin oxide films is currently ferred for deposition on thermally sensitive and tin oxide, even though silica is only
limited more by the softening of glass sub- substrates, such as plastic, while cadmium partially effective in blocking the transport
strates than by any thermal decomposition stannate requires very refractory substrates of sodium. The silica layer usually serves a
of the SnO2F film. to develop its best properties. second purpose, that of eliminating the in-
terference colors that would otherwise be rates and have been scaled up to large areas.
shown by the TC film.35 Alumina is a much Table VI: Etchants for Transparent Low-pressure CVD has higher equipment
more complete barrier against diffusion of Conductors. costs than atmospheric-pressure CVD. Sol-
sodium.36 gel suffers from slow drying and reheating
Material Etchant steps, while pulsed laser deposition is only
Etching Patterns in TCs ZnO Dilute acids suitable for small areas. This ranking can
For some applications of TCs, such as ZnO Ammonium chloride give only a rough comparison of production
displays, heaters, or antennas, parts of the TiN H2O2 NH3 costs because many other factors enter into
TC must be removed. Table VI lists some In2O3 HCl HNO3 or FeCl3 a full economic analysis, including the pro-
chemicals that can be used to etch TCs. SnO2 Zn HCl duction volume and the tolerances for varia-
Zinc oxide is the easiest material to etch, SnO2 CrCl2
tions in the properties of the product.
tin oxide is the most difficult, and indium
oxide is intermediate in etching difficulty. Toxicity
Series-connected thin-film solar cells also Some of the elements used in TCs are
need to remove TCs along patterns of lines. toxic. This increases the cost of processing
This removal is usually carried out by laser Table VII: Hardness of Some them because of the need to protect work-
ablation. Transparent Conductors. ers and prevent the escape of toxic ma-
terials into the environment. Additional
Material Mohs Hardness
Chemical Durability encapsulation during use may be needed,
The ability of a TC to withstand corrosive TiN 9 as well as a provision for recycling at the
chemical environments is inversely related SnO2 6.5 end of the product’s lifetime. Toxicity of
to its ease of etching. Tin oxide is the most Soda-lime glass 6 the elements generally increases in the fol-
resistant, while zinc oxide is readily attacked In2O3 5 lowing order: Zn Sn In Ag Cd.
by acids or bases. Silver is tarnished by air ZnO 4 Cadmium compounds are carcinogens
and moisture and can be used only in ap- Ag low and thus are heavily regulated and even
plications that are hermetically sealed. prohibited from some applications.
Stability in Hydrogen Plasmas low to allow economic extraction only for Choice of Transparent
In forming amorphous-silicon solar cells the value of the indium. Thus the supply Conducting Oxides
on TC superstrates, the TC is exposed to a of indium cannot be increased significantly It is apparent from the diversity of ap-
plasma containing hydrogen atoms. These without a large increase in price sufficient plications for TCs that no one material is
plasma conditions rather easily reduce tin to make “indium mines” profitable. most suitable for all uses. Depending on
oxide, causing an increase in the optical ab- The costs of the deposition methods which material property is of most impor-
sorption by the tin oxide. Zinc oxide is much typically increase in the following order: tance, different choices are made. Table VIII
more resistant to hydrogen-plasma reduc- atmospheric-pressure CVD vacuum summarizes some of the most important
tion and may be preferred for applications evaporation magnetron sputtering criteria that may influence the choice of a
such as amorphous-silicon solar cells.37 low-pressure CVD sol-gel pulsed laser transparent conducting material.
deposition. This ranking was estimated by
Mechanical Hardness of TCs considering the lowest-cost product made Examples of Applications and
The mechanical durability of TCs is re- by each process. The speed of the process the TCs Chosen for Them
lated to the hardness of the crystals from is very important in the cost. Atmospheric- We will now see how these criteria apply
which they are formed. Their hardness val- pressure CVD, vacuum evaporation, and to a number of applications in which TCs
ues may be ranked using the Mohs scale, magnetron sputtering have high deposition are used.
in which higher values represent harder
materials.38 Table VII shows that titanium
nitride and tin oxide are even harder than
glass and can be used in applications that Table VIII: Choice of Transparent Conductors.
are exposed to contact. Zinc oxide is readily
scratched, but can be handled with care. Property Material
Thin silver films are so fragile that they Highest transparency ZnO:F, Cd2SnO4
cannot be touched and can be used only Highest conductivity In2O3Sn
when coated with protective layers. Lowest plasma frequency SnO2F, ZnOF
Highest plasma frequency Ag, TiN, In2O3Sn
Production Costs Highest work function, best contact to p-Si SnO2F, ZnSnO3
The costs of producing a transparent Lowest work function, best contact to n-Si ZnOF
conducting material depend on the cost
Best thermal stability SnO2F, TiN, Cd2SnO4
of the raw materials and the processing
of it into a thin layer. The cost of the raw Best mechanical durability TiN, SnO2F
materials generally increases in this order: Best chemical durability SnO2F
Cd Zn Ti Sn Ag In. Indium is Easiest to etch ZnOF, TiN
a rare and expensive element that is ob- Best resistance to H plasmas ZnOF
tained as a byproduct of the mining of ores Lowest deposition temperature In2O3Sn, ZnOB, Ag
for their content of other metals such as zinc Least toxic ZnOF, SnO2F
and lead. There are no “indium mines” be- Lowest cost SnO2F
cause its concentration in minerals is too
Low-Emissivity Windows in Buildings also a factor for color displays in which which also serves as the electrical resistor
TCs on window glass improve the en- the TC is deposited over thermally sensi- for heating the oven.
ergy efficiency of the window because the tive organic dyes. Low resistance is another
free electrons reflect infrared radiation for factor favoring ITO in very finely patterned Static Dissipation
wavelengths longer than the plasma wave- displays, since the ITO layer can be made TCs are placed on glass to dissipate
length. The effect is similar to that of the very thin, thus the etched topography re- static charges that can develop on xero-
silver coating in a Thermos bottle. In cold mains fairly smooth. ZnO is lower in cost graphic copiers, television tubes, and CRT
climates, the plasma wavelength should and easier to etch than ITO is, so ZnO may computer displays. Only relatively high
be fairly long, about 2 m, so that most of replace ITO in some future displays. resistances (1 k/) are needed, so the
the solar spectrum is transmitted into heat main concern is mechanical and chemical
inside the building. Fluorine-doped tin Electrochromic Mirrors and Windows durability. Tin oxide is the material of choice
oxide is the best material for this purpose Automatically dimming rear-view mir- for these applications.
because it combines a suitable plasma rors are now installed in millions of auto-
wavelength with excellent durability and mobiles. They include a pair of SnO2 Touch-Panel Controls
low cost. Billions of square feet of TC- F-coated electrodes with an electrochemi- Touch-sensitive control panels, such as
coated window glass have been installed cally active organic gel between them. The those found on appliances, elevator con-
in buildings around the world. main considerations are chemical inertness, trols, and ATM screens, are formed from
In hot climates, a short plasma wave- high transparency, and low cost. “Smart” etched TCs on glass. They sense the pres-
length, 1 m, is desirable, so that the windows with electrically controllable ence of a finger either by direct contact or
near-infrared portion of incident sunlight transmission are just entering the market- capacitively through the glass. The dura-
can be reflected out of the building. The place. Tin oxide appears to be the material bility and low cost of tin oxide make it a
metals silver and titanium nitride have of choice, for the same reasons that it is good choice for these applications.
sufficiently short plasma wavelengths for chosen for electrochromic mirrors.
this application. Silver is widely used for Electromagnetic Shielding
this application despite its poor durability; It is apparently possible to eavesdrop
it is sealed inside double-glazed panes for Defrosting Windows on computers and communications by de-
protection from air and moisture. Titanium Freezers in supermarkets pass electric tecting electromagnetic signals passing
nitride is much more durable and can be current through TCs on their display win- through windows. These stray signals can
used on exposed surfaces, even on single- dows in order to prevent moisture in the be blocked by TCs with low sheet resis-
glazed windows. The reflective gold color air from condensing on them and obscur- tance. Silver and ITO are the best materials
of TiN-coated glass can frequently be seen ing the view. Low cost and durability are for this purpose.
on large office buildings, but it is not popu- the main factors that have led to the choice
lar for residential windows. of tin oxide for this application. Invisible Security Circuits
Defrosting windows in airplanes was TC-coated glass can be used as part of
Solar Cells the first application of TCs, permitting high- invisible security circuits for windows or
The front surfaces of solar cells are cov- altitude bombing during World War II. The on glass over valuable works of art. Some
ered by transparent electrodes. In single- discovery of TCs was kept secret until after protection from fading by UV light is also
crystal silicon cells, a highly doped layer the war. Originally tin oxide was used, but provided by the TC. Any TC (except for
of the silicon itself serves as the front elec- now ITO has replaced it in modern cock- colored TiN) could be used. Silver/ZnO
trode. In thin-film cells, a TC layer serves pits because its lower resistance permits multilayers provide the best UV protection.
as the front electrode. Cadmium telluride defrosting larger window areas with rela-
and some amorphous-silicon solar cells tively low voltage (24 V). Some automobile Improving the Durability of Glass
are grown on a SnO2F-covered glass super- windshields use silver or silver-copper Some tin oxide coatings are used solely
strate. Thermal stability and low cost are alloy TCs for electrical defrosting because to take advantage of tin oxide’s extraordi-
the primary factors in this choice. The high the 12-V systems in automobiles require nary durability and have nothing to do
work function of SnO2F is also helpful in very low resistance, combined with the with its electrical conductivity. Tin oxide
making low-resistance electrical contact to legal requirement of a minimum transmis- coatings are used on the windows of bar-
the p-type amorphous-silicon layer. Other sion of 70%. The metal layers are protected code readers to improve their abrasion re-
amorphous-silicon cells are grown on flexi- in the windshield by laminating them be- sistance. Hydrofluoric acid etches glass,
ble steel or plastic substrates; in this case, tween two sheets of glass. but does not affect tin oxide. Some vandals
the top TC must be deposited at low tem- have used hydrogen-fluoride etching kits
perature on thermally sensitive cells. ITO Oven Windows (designed to etch identifying marks on auto-
or ZnO is chosen for this purpose because Tin oxide coatings are placed on oven mobile windows) to etch slogans on win-
both compounds can be deposited suc- windows to improve their safety by low- dows. Tin oxide coatings are used to protect
cessfully at low temperatures (typically ering the outside temperature of the glass windows from these attacks.
200C). to safe levels. This permits the use of win-
dows even in self-cleaning ovens that reach Conclusions
Flat-Panel Displays very high temperatures. The tin oxide coat- Transparent conductors have many
The many different styles of FPDs all ing also improves the energy efficiency of applications. There is no one TC that is
use TCs as a front electrode. Etchability is the ovens. The main criteria for this choice best for all applications. Fluorine-doped
a very important consideration in forming of material are high temperature stability, tin oxide is the most widely used TC, while
patterns in the TC electrode. The easier chemical and mechanical durability, and tin-doped indium oxide (ITO) remains pre-
etchability of ITO has favored its use over low cost. ferred for flat-panel displays. Zinc oxide
tin oxide, which is more difficult to etch. Some transparent laboratory ovens are has potential for use in more efficient and
The low deposition temperature of ITO is constructed entirely of TC-coated glass, less expensive solar cells. All of these com-
monly used transparent conducting mate- 17. J. Hu and R.G. Gordon, J. Appl. Phys. 71 lar expression was proposed by V.K. Jain and
rials and their production methods have (1992) p. 880. A.P. Kulshreshtha, Sol. Energy Mater. 4 (1981)
advantages and disadvantages that must 18. J. Hu and R.G. Gordon, J. Appl. Phys. 72 p. 151, without taking into account the reflection.
be carefully weighed for each new appli- (1992) p. 5381. 25. T.J. Coutts, X. Wu, W.P. Mulligan, and J.M.
19. J. Hu and R.G. Gordon, in Microcrystalline Webb, J. Electron. Mater. 25 (1996) p. 935.
cation. The information in this article may Semiconductors: Materials Science & Devices, ed- 26. G. Haacke, J. Appl. Phys. 47 (9) (1976)
help in choosing the most appropriate trans- ited by P.M Fauchet, C.C. Tsai, L.T. Canham, p. 4086.
parent conducting material for a new use. I. Shimizu, and Y. Aoyagi (Mater. Res. Soc. 27. For example, see S. Nudelman and S.S. Mitra,
Symp. Proc. 283, Pittsburgh, 1993) p. 891. Optical Properties of Solids, Chap. 3 (Plenum
Acknowledgments 20. H. Enoki, T. Nakayama, and J. Echigoya, Press, New York, 1969).
This work was supported in part by the Phys. Status Solidi A 129 (1992) p. 181. 28. A.R. Hutson, J. Appl. Phys. 32 (1961) p. 2287.
National Renewable Energy Laboratory 21. T. Minami, H. Sonohara, S. Takata, and H. 29. K.J. Button, C.G. Fonstad, and W. Dreybrodt,
under a subcontract for the U.S. Department Sato, Jpn. J. Appl. Phys., Part 2: Lett. 33 (1994) Phys. Rev. B 4 (1971) p. 4539.
of Energy. p. L1693. 30. W.P. Mulligan, PhD thesis, Colorado School
22. J.M. McGraw, P.A. Parilla, D.L. Schulz, of Mines, 1997.
References J. Alleman, X. Wu, W.P. Mulligan, D.S. Ginley, 31. G. Bogner, J. Phys. Chem. Solids 19 (1961)
1. J.M. Mochel, U.S. Patent No. 2,564,706 (1947). and T.J. Coutts, in Film Synthesis and Growth p. 235.
2. H.A. McMaster, U.S. Patent No. 2,429,420 Using Energetic Beams, edited by H.A. Atwater, 32. J.R. Bellingham, W.A. Phillips, and C.J.
(1947). J.T. Dickinson, D.H. Lowndes, and A. Polman Adkins, J. Mater. Sci. Lett. 11 (5) (1992) p. 263.
3. W.O. Lytle and A.E. Junge, U.S. Patent (Mater. Res. Soc. Symp. Proc. 388, Pittsburgh, 33. T. Minami (private communication).
No. 2,566,346 (1951). 1995) p. 51. 34. M. Hassanein, J. Chem. U.A.R. 9 (1966) p. 275.
4. J.M. Mochel, U.S. Patent No. 2,564,707 (1951). 23. P.F. Gerhardinger and R.J. McCurdy, in Thin 35. R.G. Gordon, U.S. Patent No. 4,187,336
5. L. Holland and G. Siddall, Vacuum III (1955). Films for Photovoltaic and Related Device Applica- (1980); U.S. Patent No. 4,419,386 (1983).
6. H.F. Dates and J.K. Davis, U.S. Patent tions, edited by D. Ginley, A. Catalano, H.W. 36. J.D. Chapple-Sokol, PhD thesis, Harvard
No. 3,331,702 (1967). Schock, C. Eberspacher, T.M. Peterson, and T. University, 1988.
7. A.J. Nozik, U.S. Patent No. 3,811,953 (1974). Wada (Mater. Res. Soc. Symp. Proc. 426, Pitts- 37. H.N. Wanka, E. Lotter, and M.B. Shubert, in
8. A.J. Nozik and G. Haacke, U.S. Patent burgh, 1996) p. 399. Amorphous Silicon Technology–1994, edited by
No. 3,957,029 (1976). 24. R.G. Gordon, in Thin Films for Photovoltaic E.A. Schiff, M. Hack, A. Madan, M. Powell, and
9. R.G. Gordon, U.S. Patent No. 4,146,657 and Related Device Applications, edited by D. A. Matsuda (Mater. Res. Soc. Symp. Proc. 336,
(1979). Ginley, A. Catalano, H.W. Schock, C. Eberspacher, Pittburgh, 1994) p. 657.
10. S.R. Kurtz and R.G. Gordon, Thin Solid Films T.M. Peterson, and T. Wada (Mater. Res. Soc. 38. D.R. Lide, ed., Handbook of Chemistry and
139 (1986) p. 277. Symp. Proc. 426, Pittsburgh, 1996) p. 419; a simi- Physics (CRC Press, Boca Raton, FL, 1999) p. 12.
11. S. Major, A. Banerjee, and K.L. Chopra, Thin ■
Solid Films 122 (1984) p. 31.
12. T. Minami, H. Nanto, and S. Takata, Jpn. J.
Appl. Phys., Part 2: Lett. 23 (1984) p. L280; T.
Minami, H. Sato, H. Nanto, and S. Takata, Jpn. J.
Appl. Phys., Part 2: Lett. 24 (1985) p. L781.
13. S.N. Qiu, C.X. Qiu, and I. Shih, Sol. Energy
Mater. 15 (1987) p. 261.
14. P.S. Vijayakumar, K.A. Blaker, R.D. Weiting,
B. Wong, A.T. Halani, and C. Park, U.S. Patent
No. 4,751,149 (1988).
15. B.H. Choi, H.B. Im, J.S. Song, and K.H. Yoon,
Thin Solid Films 193 (1990) p. 712.
16. J. Hu and R.G. Gordon, Sol. Cells 30 (1991)
p. 437.