UAM Process Parameters, Microstructure, and Mechanical
UAM Process Parameters, Microstructure, and Mechanical
Review Article
Power Ultrasonic Additive Manufacturing: Process Parameters,
Microstructure, and Mechanical Properties
Copyright © 2020 Abdullahi K. Gujba and Mamoun Medraj. This is an open access article distributed under the Creative
Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the
original work is properly cited.
Additive manufacturing (AM) for fabricating 3D metallic parts has recently received considerable attention. Among the emerging
AM technologies is ultrasonic additive manufacturing (UAM) or ultrasonic consolidation (UC), which uses ultrasonic vibrations
to bond similar or dissimilar materials to produce 3D builds. This technology has several competitive advantages over other AM
technologies, which includes fabrication of dissimilar materials and complex shapes, higher deposition rate, and fabrication at
lower temperatures, which results in no material transformation during processing. Although UAM process optimization and
microstructure have been reported in the literature, there is still lack of standardized and satisfactory understanding of the
mechanical properties of UAM builds. This could be attributed to structural defects associated with UAM processing. This article
discusses the effects of UAM process parameters on the resulting microstructure and mechanical properties. Special attention is
given to hardness, shear strength, tensile strength, fatigue, and creep measurements. Also, pull-out, push-out, and push-pin tests
commonly employed to characterize bond quality and strength have been reviewed. Finally, current challenges and drawbacks of
the process and potential applications have been addressed.
associated with interfacial friction and shearing that breaks transformation starting from feedstock to the near-net shape
up the oxide layers [10]. UAM operates at temperatures geometry [3]. This limits the range of materials that can be
much lower than the melting temperatures of the starting deposited. Compared to UAM, layer deposition is achieved
materials, usually 0.3–0.5 Tm. Melting is avoided and voids/ using solid-state bonding. Metallurgical bonds between
defects associated with high temperature are eliminated [11]. layers are achieved ultrasonically without generating molten
With this attribute, bonding of dissimilar materials becomes metal at the interface [3], and this allows for a wide range of
feasible, and the properties of each building martial are similar and dissimilar materials to be deposited. Also, UAM
retained. Similar and dissimilar builds via UAM such as Al- has a higher deposition rate as compared to other AM
Al [10, 12–15], Al-Ti [16], Al-NiTi [17], Al-SiC [18, 19], Al processes because of the lower heat input per deposited
with embedded dielectric materials (inks used in printed volume and faster heat dissipation [3, 25]. Due to the solid-
electronics industry) [20], low carbon steel [21, 22], and Al- state bonding in UAM, residual stresses and distortions are
shape memory alloy (SMA) [23] have been reported in the significantly reduced compared to direct metal deposition,
literature so far. which involves liquid-solid transformation. The high re-
Similar to other additive manufacturing processes, the sidual stresses are as a result of the rapid heating-cooling
UAM process is accompanied with periodic machining in thermal cycle during processing [26]. In an ideal AM
order to obtain the final geometry. However, only a small process, the stress field is much more complicated due to the
amount of machining is required since UAM produces a number and pattern of the heat source and heat transfer. For
near-net shape build. For this reason, UAM is sometimes AM parts, high tensile residual stresses are usually on the
referred to as hybrid additive/substantive manufacturing surface of the metal build, which could affect the mechanical
[24]. Compared with the conventional CNC machining, properties. The effect of these stresses could be mitigated via
only a little waste or scrap is formed because of machining in-process or postprocess methods [26]. In terms of ap-
after UAM. Figure 3 shows the difference between con- plications, complex geometries such as internal channels and
ventional CNC machining, which starts with a large box, and voids can be fabricated using UAM. This has been explored
UAM, which starts with a thin metal sheet and ends up with for applications such as 3D channels for microchannel
little or no scrap. To compare UAM with other AM tech- cooling and cooling channels for molds. Also, during UAM
niques, the next section discusses the competitive advantages processing, the building process can be interrupted and
of UAM over other AM processes. subsequent machining can be performed [24]. This is ex-
tremely difficult while using other manufacturing tech-
2. UAM versus Other AM Technologies niques. Another key contrast between UAM and other
techniques is the embedment of materials such as optical
UAM as a solid-state process commands several advantages fibers into metallic components. For instance, embedding
over other available AM techniques. For instance, most SiC fibers and single-mode (SM) optical fibers into Al3003
AM processes require a certain level of material phase and Al6061 matrices has been successfully reported by Li and
Advances in Materials Science and Engineering 3
Soar [27]. This is not possible with other AM techniques dynamic stresses are generated which are necessary for oxide
because of the high temperature during processing. It is removal and plastic flow [8]. Friel and Harris [28] stated that
worth noting that achieving these advantages via UAM the higher the pressure, the larger the bonding area, which
requires understanding of different process parameters and translates to a lower void volume. Depending on the ma-
their impact on resulting microstructures and properties. terial, too high pressures will lead to larger levels of de-
The next section highlights some of the important UAM formation and excessive stresses [6, 29]. Consequently, too
process parameters. low pressure will cause insufficient deformation and contact
between the build materials, thus leading to a weak bond.
3. UAM Process Parameters Therefore, an optimum force (pressure) is necessary for
quality bond with no or minimal number of voids.
The formation of high-strength and quality bond during the
UC process is dependent on the process parameters 3.2. Amplitude (μm). Amplitude, which could normally
employed. Among the most influential process parameters range from 10 to 50 μm, is the sonotrode longitudinal os-
are normal force (N), amplitude (μm), speed (mm/s), and cillatory displacement which controls the interface thick-
temperature (°C). An important component that influences ness, density of the bonded area, and the size of the deformed
these process parameters is the sonotrode which comes into area [30]. Powers and Jones [31] stated that the amplitude
direct contact with the materials and provides the necessary dictates the amount of plastic deformation between the
energy for bonding [24]. It provides uniform load and vi- building materials. Also, the higher the amplitude, the
bration to the parts bonded ultrasonically. Sonotrodes are higher the energy generated into the building material in-
usually made of titanium, aluminum, or steel with varying terface [14, 23, 32], which translates to better bonding quality
surface finish intended for different applications. For in- and strength. However, extremely high amplitude results in
stance, sonotrode made of steel has an average surface breaking of already formed bonds due to excessive stresses.
roughness (Ra) of 5.2 μm [20] and is used for low-amplitude
applications where hardness is required. Titanium is the
most used due to the low loss of vibration and high strength, 3.3. Speed (m/s). Speed is the sonotrode motion across the
while aluminum, which is usually coated with chrome or workpiece during processing and could range from 1 mm/s
nickel, is employed to reduce wear [24]. The most important to 100 mm/s [20]. The speed determines the length of time
variable UAM parameters are discussed below. the material under the sonotrode will undergo compression
and oscillation [24]. Also, the energy delivered to the
workpiece is inversely proportional to the speed employed.
3.1. Normal Force (N). Normal force, sometimes referred to For instance, Kong et al. [33] stated that at a given contact
as “pressure,” is the downward force applied by the sono- force and amplitude, decreasing the speed (from 38.8 to
trode onto the mating surfaces and can range from 100 N to 27.8 mm/s) increased the energy to the build material, which
9000 N depending on the build materials. This constant force leads to higher levels of strain hardening. However, in
provides intimate contact between the building materials another work by Kong et al. [34], they showed lack of
during processing and facilitates the plastic flow [8]. With sufficient bonding when the speed was increased from 34.5
the synergy between the force and ultrasonic oscillations, to 43.5 mm/s.
4 Advances in Materials Science and Engineering
3.4. Temperature (°C). Substrate temperature is another article, statistical analysis was performed and is discussed
process parameter which could affect the bond quality as below. Relying on the average values, Janaki Ram et al. [5]
reported by various researchers [14, 17, 29, 35, 36]. During attributed changes in % LWD to varying a single parameter,
processing, the temperature of the substrate/part can be such as saying that increasing the amplitude from 10 to
increased from the ambient condition. George and Stucker 16 μm increased the % LWD. However, this cannot be
[37] mentioned that employing a higher temperature during concluded from the data shown in Figures 4(a)–4(d).
processing results in denser and stronger bonds. This Nevertheless, since their work [5] is based on Taguchi DoE,
temperature increase is dependent on the build materials, different information can be obtained from the results as
and careful selection is necessary, especially for dissimilar discussed below.
materials. Table 1 summarizes typical process parameters Using the available data from [43], the percentage
employed for building different materials by various authors. contribution of each process parameter was calculated as
It can be said from Table 1 that the selection of process shown in Figure 4(e). It can be seen that amplitude had the
parameters is dependent on the build material(s). For in- highest contribution followed by temperature. Force had the
stance, a lower substrate temperature is selected when least contribution, which is half the contribution of tem-
building SMA NiTi with aluminum [17], whereas a higher perature. Also, the mean value of signal-to-noise ratio (S/N)
substrate temperature is selected for building similar ma- was evaluated. Since higher % LWD is desirable, larger is
terials such as 4130 steel [21]. As mentioned previously, the better option was selected for this analysis, and the results
energy transferred to the workpiece is controlled by varying are presented in Figure 4(f ). Similar to the percent con-
other process parameters as well. tribution, amplitude showed the highest S/N ratio between
UAM energy applied during processing is related to the 30 and 36 dB (Δ � 6) followed by temperature, which had an
quality of bond formed and can be quantified using S/N ratio between 31 and 36 dB (Δ � 5). Speed had the least S/
the linear weld density (LWD) approach [12, 42]. LWD is the N ratio from 32 to 34 dB (Δ � 2). This means when attrib-
length of a particular interface that appears to be bonded uting the changes in % LWD to any parameter, these average
divided by the total length of the interface inspected [12], as contributions have to be kept in mind. For instance, when
shown in equation (1). Bonded interface length refers to the the authors [5] mentioned that increasing the substrate
actual length, whereas total interface length refers to the temperature increases the LWD, the contribution of am-
apparent length measured. plitude in this increase is much higher than that of tem-
perature. Therefore, it cannot be attributed to the speed only
bonded interface length as presented in [5]. The same goes for the other parameters,
% LWD � × 100. (1)
total interface length even for the effect of amplitude because in this case, the effect
of changing the other parameters contributes around 60% in
In order to have sound bond quality, LWD must be kept varying % LWD.
as high as possible. Typically, UAM parts have LWD ranging As expected, the resulting microstructure and me-
from 45 to 95% [12]. Lower values are associated with lower chanical properties would be affected by the UAM process
UAM energies, which produce weaker bonds [42]. Param- parameters. For this reason, a significant part of the liter-
eters such as speed, amplitude, substrate temperature, and ature on UAM paid more attention to optimization of the
normal force have been associated with LWD [5]. For in- process parameters [29, 34, 40, 44] and microstructural
stance, Janaki Ram et al. [5] studied the effect of process analyses [12, 22, 28, 45, 46] of the as-built part. The mi-
parameters on the bond formation of Al3003 during UC. crostructural analyses provide substantial information about
Using design of experiments (DoE), they [5] obtained an the bonding mechanism, grain refinement, and defects,
optimum combination of parameters based on preliminary which are highlighted in the next section. To date, extensive
experiments, machine setting limits, and available literature and universally accepted mechanical properties and char-
data. Four process parameters, varied at four different levels, acterization procedure of UAM printed parts could not be
were considered, as shown in Table 2. Taguchi L16 or- found in the literature. Even though properties such as
thogonal array shown in Table 3 was employed to determine micro/nano-hardness, strength (shear and tensile), and fa-
the effect of each process parameter, and a total of 16 ex- tigue behavior have been reported, more research is still
perimental runs were carried out. needed in order to fully understand the mechanical prop-
Based on Taguchi DoE, they [5] maintained one factor as erties of UAM builds. This is discussed in more detail in
fixed while varying the other three parameters. For instance, Section 5 of this article.
for each value of amplitude, three sets of the other pa-
rameters (speed, force, and temperature) are used as shown 4. Microstructure
in Tables 2 and 3. However, the % LWD results were pre-
sented in [5] as average of values measured at different Considering the fact that there are no material transfor-
parameters as indicated by the empty-square symbol in mations associated with UAM, one would expect the
Figures 4(a) and 4(b). This unfortunately can be misleading constituent materials to retain their properties and micro-
because average values are not representative of the data structure. For this reason, most part of the literature re-
obtained in these experiments, as can be seen in Figures 4(a) garding microstructure of UAM builds focused on the
through 4(d). In these figures, the actual data for the 16 interface between the bonds. Also, one could argue that
experiments were obtained from Yang et al. [43]. In our inhomogeneity would exist in the microstructure, especially
Advances in Materials Science and Engineering 5
at the bonds. Thus, to understand the bonding quality and Table 2: Process parameters and levels selected [5].
mechanism of UAM builds, microstructural investigation is Parameter Label Level 1 Level 2 Level 3 Level 4
paramount. This aids in understanding the fundamental
Amplitude (μm) A 10 13 16 19
processes during UAM. For instance, Fujii et al. [47] ob- Speed (mm/s) B 28 32 36 40
served the microstructures of the unbonded and bonded Force (N) C 1450 1600 1750 1900
interfaces of Al6061 build using bright-field TEM, as shown Temperature (°C) D 24 66 107 149
in Figure 5.
Figure 5(a) shows asperities that are in direct physical
contact between the top and bottom surfaces of the build Table 3: Taguchi L16 experimental matrix [5].
materials. These micro-asperities are compressively de-
#
formed by applying load (force), which consequently leads to Run A B C D % LWD∗
microbond formation as shown in Figure 5(b). During the 1 1 1 1 1 18
microbond formation, the asperities are softened and crushed 2 3 4 2 1 55
under high-strain-rate deformation due to ultrasonic vibra- 3 4 2 3 1 67
tions [47]. With continuous softening and crushing, significant 4 2 3 4 1 25
5 2 4 3 2 32
amounts of microbonds are formed across the interface, as
6 4 1 4 2 76
shown in Figure 5(c). Some amount of oxide films are still 7 1 2 2 2 24
visible but are dispersed around the interface because of friction 8 3 3 1 2 55
and plastic flow. Through the dispersion of oxide films, direct 9 2 1 2 3 60
contact between the mating surfaces is achieved, and full 10 1 3 3 3 50
metallurgical bonds are formed as shown in Figure 5(d). Fi- 11 4 4 1 3 36
nally, they [47] reported that the originally elongated grains 12 3 2 4 3 57
were replaced by the newly developed fine equiaxed grains. 13 4 3 2 4 70
Sriraman et al. [36] also observed formation of equiaxed grains 14 3 1 3 4 90
in the copper build. They [36] showed that the relatively coarse 15 2 2 1 4 60
grain size of 25 μm in the as-received foils is reduced to a finer 16 1 4 4 4 42
∗
and more uniform grain size of 0.3 to 10 μm. The finer grains Average % LWD from [5].
occur due to recrystallization and movement of grain
boundaries across the interface [36]. defects, and point-like defects, which are designated as D1,
The presence of voids at the interface is one of the most D2, and D3 in Figure 7. They [5] linked the presence of these
widely reported features, and this determines a partially or defects to the UAM processing parameters. Line defects were
fully bonded interface. For instance, Hopkins et al. [14] observed in specimens having very low % LWD, deposited
observed voids at the interface of Al3003 build, as shown in using low amplitude and/or normal force. Parabolic defects
Figure 6. They [14] reported that three distinct features were are associated with the medium or medium-to-high weld
observed at the interface: areas with large voids, areas with density levels, while point defects were observed with
small crack-like voids and partial bonding, and areas where specimens with very high weld density levels [5]. Similar
there are no observable voids, which are assumed to be fully observations have been reported on Al6061-H18 [13] and
bonded. 4130 steel/steel parts [21].
Janaki Ram et al. [5] also classified these voids (defects) Generally, the presence of these voids (line, point, and
observed in Al3003 build into three different morphologies, parabolic) is associated with the sonotrode that rolls over
as shown in Figure 7. These are line defects, parabola-like several layers [5, 12, 32, 46]. For instance, the first layer
6 Advances in Materials Science and Engineering
90 90 90
LWD (%)
LWD (%)
LWD (%)
70 70 70
50 50 50
30 30 30
10 10 10
8 10 12 14 16 18 20 25 30 35 40 45 1400 1500 1600 1700 1800 1900 2000
Amplitude (µm) Speed (mm/s) Normal force (N)
Original data from [43] Original data from [43] Original data from [43]
Average data from [5] Average data from [5] Average data from [5]
Mean of SN ratios
90 35 35
30 34
LWD (%)
70
25 21.02 33
50 20 32
15 12.81 13.56
10.12 31
30 10
5 30
10 0 29
20 40 60 80 100 120 140 160
Amplitude
Speed
Force
Temperature
Error
10
13
16
19
28
32
36
40
1450
1600
1750
1900
24
66
107
149
Temperature (°C)
Figure 4: Effect of (a) amplitude, (b) speed, (c) normal force, and (d) substrate temperature on % LWD of Al3003 build material. ((a–d)
redrawn from [43], (e) and (f ) from this work).
1 μm
Figure 5: Bright-field TEM images of (a) unbonded region, (b) partially bonded region, (c) bonded region with residual oxide film, and (d)
completely bonded region [47].
300μm 300 μm
(a) (b)
bonded on the substrate usually leaves a roughened surface creates a mismatch between the smooth and rough surfaces
due the sonotrode motion [5]. The next layer to be applied and results in weak bonds with many voids [5]. A similar
has a relatively flat bottom (smooth surface) which comes in explanation was given by Levy et al. [21] where they at-
contact with the roughened surface of the first layer. This tributed the defects to the presence of oxides on the foil
Advances in Materials Science and Engineering 7
(a) (b)
(c) (d)
Figure 8: SEM micrographs of 4130 specimen before (a, b) and after (c, d) SPS treatments [21].
successfully embedded SiC fibers and single-mode (SM) microhardness along the Z-direction (height) from 159 to
optical fibers into Al3003 and Al6061 matrices using ul- 443 HV, as shown in Figure 9.
trasonic consolidation. Their [27] results showed that the Generally, heat treatment improves hardness, but the
UC process increased the hardness of alloy matrices, es- HIP showed the opposite trend. This could be due to the long
pecially at regions close to the fibers. The work-hardening heating time which resulted in significant grain growth,
effect obeyed the Hall–Petch relationship for both grains and leading to reduced hardness. SPS showed higher hardness,
sub-grains. Li et al. [20] studied the feasibility of embedding and this can be attributed to the short heating time and
electrical materials (inks widely used in the electronics in- preservation of the structure of the material [54, 55]. The
dustry) within metal matrices by UAM. To create the metal variation in microhardness across the depth of the SPS is due
matrix, a 100 μm thick Al3003 was welded on to a 5 mm thick to the specimen top surface contact with the graphite punch,
Al1050-H14. Three different dielectric materials (Commercial which resulted in carburization [21]. More work is needed in
® ™
inks, LuxPrint 8153 from DuPont , 520 Series Soldermask order to optimize the postprocessing conditions, especially
®
made by Technic, and Imagecure AQ XV501T-4 of for the HIP process. Other heating methods such as mi-
®
Sunchemical ) were embedded into UAM-fabricated Al metal
matrices, and the effect of these dielectric materials on Knoop
crowave heating might be interesting since it also produces
relatively dense materials under controlled conditions
hardness was reported. After printing, they [20] demonstrated compared to other conventional techniques [49].
Knoop hardnesses of 12.1 HK/0.01 kg, 23.0 HK/0.01 kg, and
27.3 HK/0.01 kg for 8153, XV501T-4, and 520 series dielectric
films, respectively. Moreover, they [20] pointed out that 5.2. Peel Test. Peel tests primarily provide measurements of
varying dielectric thickness had no significant effect on the the adhesive strength of tape, glue, or bonded surfaces [12].
Knoop hardness. For instance, 8153 dielectric film with Peel test is one of the techniques used in optimizing the
thicknesses of 43, 45, 48, 50, and 54 μm showed no significant process parameters involving joining of tapes. However,
differences in the Knoop microhardness. It can be said that the these tests do not provide the bulk mechanical properties
variation in thickness (for 8153 dielectric film) is within a small required for the design of UAM parts. In this case, bulk
margin; however, thickness in the range of millimeters might mechanical properties such as ultimate shear and tensile
show a significant difference. strength after UAM processing must be accounted for.
The effect of postprocessing/treatments on hardness has Despite the known limitations and capabilities of peel
also been reported in the literature. For instance, Levy et al. testing, researchers still employ this technique to quanti-
[21] studied the suitability of manufacturing low-alloy tatively assess the bond quality [6, 18, 32–34, 37]. For in-
carbon steel using UAM and the effect of posttreatments on stance, Li and Soar [18] reported the peel strength properties
the properties. SPS and HIP posttreatments were conducted of continuous SiC fibers embedded in an Al6061-O matrix
after fabrication, and the microhardness of the as-built, SPS, through ultrasonic consolidation at room temperature. They
and HIP treated conditions was reported. The as-built [18] mentioned that after embedding ≥0.8% volume fraction
showed average hardness of 206 ± 20 HV, and HIP showed of SiC in the Al matrix, the peel strength increased signif-
hardness of 153 ± 9 HV. SPS showed variation in icantly. For instance, at 2.8% volume fraction of SiC using
Advances in Materials Science and Engineering 9
Force (kN)
Load (N)
Displacement (mm)
0 1 2 3 4
Figure 10: Typical pull-out force-displacement curve of UAM as- Stroke (mm)
built (redrawn from [17]).
Figure 11: Load-stroke curve of the push-pin tests for Al6061-4130
steel and Al6061-6061 build (redrawn from [22]).
the push-pin technique [39]. This technique proposed by
Zhang et al. [58] involves pushing a pin at a specific rate usually experience a drop in properties, especially in the
while measuring the load and displacement. The maximum building direction [13, 53]. To improve the quality of welds,
load and the area under the load-displacement curve are especially in the building direction where normal load is
used in analyzing the tests [39]. Higher load and larger area applied, posttreatments such as SPS, HIP, and solutionizing
under the curve correspond to better push-pin performance. and aging have been employed and shown to enhance the
Sridharan et al. [22] reported the push-pin testing perfor- shear strength. For instance, Wolcott et al. [39] reported the
mance of Al6061-T6 foils on annealed 4130 steel (Al6061- shear strength of Al-Ti dissimilar material joints fabricated
4130) and Al-Al (Al6061-6061) builds. Figure 11 shows the using UAM. As-built and posttreated (SPS) specimens were
load-stroke curves of the push-pin tests for Al6061-4130 steel
and Al6061-6061.
tested using a 50-kN Lloyd Mechanical Test Frame where
load was applied until failure. Their [39] results showed that
®
It can be seen clearly that the Al-steel showed an average the SPS-treated specimen had higher ultimate shear strength
maximum load of 2.85 kN, and an area under the curve of (102.4 MPa) than the as-built specimen (46.3 MPa). Frac-
5.15 kN·mm. Al-Al as-built showed an average maximum tured surface showed that the as-built had a brittle failure,
force of 1.67 kN and an area of 1.53 kN·mm. Hence, the Al- whereas the SPS had ductile failure, evident from the
steel showed a higher strength than the Al-Al. This was presence of striation marks. Hopkins et al. [14] observed a
attributed to the high plastic flow at the interface resulting in similar brittle failure in UAM as-built Al3003-Al3003, which
oxide removal and asperity collapse, improving the metal- was attributed to the presence of voids and insufficient
lurgical bonds and the mechanical properties. Also, one bonding. Levy et al. [21] studied the shear strength of as-
would expect this behavior of Al-steel since steel is stronger built, SPS-, and HIP-treated SAE4130 (low alloy carbon
than aluminum. steel) parts. Figure 12 shows the typical load/displacement
Wolcott et al. [39] reported the delamination strength of curves of their shear tests.
Al-Ti UAM build using the push-pin technique. As-built and It can be seen from Figure 12 that specimens after the
heat-treated (SPS) specimens were employed, and their SPS posttreatment exhibited shear strength about two-fold
results showed that heat treatment enhanced the delami- higher than that of the as-printed one (maximum load of
nation strength compared to the as-built (untreated). This 4921 N versus 1690 N). The as-printed specimens delami-
further indicates the beneficial effect of posttreatments on nated and some layers were bent, as shown in Figure 12.
the mechanical properties of as-built joints. From Figure 12, SPS and HIP showed higher resistance to
Despite the considerable efforts made in applying the shear than the as-printed condition. Comparing SPS and
peel, pull-out, push-out, and push-pin tests, these methods HIP, SPS had higher resistance than HIP (maximum load of
are still debatable on a number of issues, including their 4921 N for SPS versus 3727 N for HIP (Figure 12)). This was
universal applicability and accuracy. Standardization of attributed to the microstructure where SPS showed only
these test methods is required in order to be able to compare small discontinuity as compared to the as-printed and HIP
different works and fully understand each test applicability conditions [21]. For this reason, the SPS remained intact
and limitations. Combining the data obtained from these despite some noticeable deformations (Figure 12). This
tests and from bulk mechanical property investigations could also be attributed to the inherent nature of the SPS
could provide more valuable information with regard to technique, which is known for fabricating highly dense
bond strength. materials with little or no voids [54, 55, 59]. More inves-
tigation is needed to determine the failure mechanisms and
optimal postprocessing conditions. The interfacial shear
5.6. Shear Strength. Shear strength of layered structures or strength of a metal matrix composite fabricated via UAM
builds is one of the most important studied properties. has recently received considerable attention [17, 60]. For
Special tooling is employed in order to ensure accurate instance, Hehr and Dapino [17] reported the interfacial
testing within the layered region/section [21]. UAM builds shear strength behavior of NiTi-Al matrix composites with
Advances in Materials Science and Engineering 11
6000
9.52mm
5000 SPS
Interface
between
4000 layers
Load (N)
3000 HIP
19.05 mm
R = 3.18mm
2000
1000
As-printed
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Extension (mm)
Figure 12: Shear test load/displacement curves and specimens after Figure 13: Illustration of tensile loading with respect to the in-
shear testing (adopted from [21]). terface (redrawn from [14]).
different fiber surface finishes, which include oxide, testing along the Z-direction (normal to the interfaces), the
roughened, etched, and mechanically polished surfaces. For samples failed by de-bonding of the tapes without significant
all tested conditions, their [17] results showed that the matrix elongation [15]. The Z-direction showed almost zero duc-
yielded prior to the interface breaking due to the adhered tility and resulted in a brittle failure, as shown in Figure 15.
aluminum. The average shear stress was near or above This is due to the presence of defects or lack of complete
the ultimate shear strength of the aluminum tapes utilized in bonding after UAM. Hopkins et al. [14] reported the
the UAM process. For all surface conditions, the matrix was the transverse tensile strength of UAM as-built Al3003-H18
weakest point in the composite. From the work presented by (tape)/Al3003-H14 (base plate). Specimens were axially
Hehr and Dapino [17], information addressing the change in loaded at 0.127 mm/s until failure, while the force and hy-
bond mechanisms due to the different surface conditions was draulic ram displacement were recorded. Their [14] graphs
not discussed. Hence, this needs further investigation. Another showed a linear force-displacement relationship, which
issue worth exploring is studying the effect of compressive indicates that the specimens failed in an elastic brittle mode.
residual stress on the shear strength of UAM builds. This could Also, specimens with higher strength showed greater dis-
not be found in the literature. placements, which implies that there were a greater number
of localized microscale areas that underwent ductile failure
[14]. The brittle failure observed in [14] is in accord with the
5.7. Tensile Strength. Similar to shear strength tests, tensile findings in [13, 15]. For the brittle failure, a sharp drop in the
tests also provide valuable mechanical properties of as-built stress-strain curve is expected after reaching the maximum
parts. In the literature, monotonic tensile properties are one load. No satisfactory explanation for this behavior was of-
of the most commonly evaluated and reported properties of fered by the authors [15]. Perhaps, this behavior could be due
AM parts [50]. For UAM builds, tensile loading is usually to the variation in bond quality across the layer. Detailed
applied normal to the interfaces [13, 15], as illustrated in fractography is needed in order to understand the failure
Figure 13. modes of the build with respect to the different directions.
The direction of loading with respect to the building As mentioned in Section 3, posttreatments of UAM or
direction has a significant effect on the observed properties. UC as-built are employed in order to enhance the me-
Sridharan et al. [15] reported tensile tests of UAM builds chanical properties of the bond, especially in the Z-direction
from Al6061-H18 tapes tested at different directions. Tensile (building direction) [13, 53]. Gussev et al. [13] studied the
dog-bone specimens were machined in three directions: X- solutionizing and aging processing in order to enhance the
direction along the travel of the sonotrode, Y-direction along tensile strength of UAM as-built Al6061-H18 bond at dif-
the sonotrode vibration, and Z-direction along the build ferent temperatures. First, the specimens were annealed at
where the load is applied normal to the interfaces, as shown 180°C for 8 h in order to restore the Mg2Si strengthening
in Figure 14. Figure 14 also shows the typical tensile test precipitate since Al6061-H18 is a precipitation-strengthened
samples cut from the build. alloy. This process is expected to improve the bond prop-
Five specimens were tested for each direction, and the erties. Second, the specimens were annealed at 330°C for 1 h
results were compared with bulk commercial wrought alloy. in order to recrystallize the grains at the interface, and fi-
Directions X and Y are considered the same; hence, they are nally, the specimens were solutionized at 580°C for 1 h,
used interchangeably in [15]. Figure 15 shows the engi- quenched in water, and aged at 180°C for 8 h. Figure 16
neering stress-strain curves for the specimens. It can be seen shows the engineering stress versus displacement curves for
from Figure 15 that the UAM part loaded in the X- and Y- the build and reference at different heat-treated conditions.
directions had lower strength and ductility than the wrought It can be seen that properties in the Z-direction improved
alloy. Also, the specimens loaded along the Z-axis showed a after each heat-treated condition. However, at 330°C-1 h, there
significant decrease in the strength level as compared to was a decrease in the properties in the X- and Y-directions
those along X- and Y-directions and wrought alloy. In including the reference. No specific explanation was given for
12 Advances in Materials Science and Engineering
16.00
Y-sonotrode vibration
5.00
Sonotrode direction-X
R = 1.40 1.20
T = 0.75
Figure 14: Schematic showing the sample extraction for mechanical testing and the dimensions of the tensile test samples (redrawn from
[15]).
200 there has been few attempts aimed at investigating the fatigue
behavior of UAM as-built aluminum alloys Al2024 [35, 71] and
150
Al3003-H18 [72]. He et al. [35] studied the fatigue of as-built
100 Al2024 made from foils compared with the monolithic alloy.
Z - direction
50
The static three-point load bending fatigue tests were conducted
at two stress levels: the maximum stresses were 89% and 70% of
0 the tensile strength for R � 0.1 (R is the stress ratio employed in
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20
Strain (mm) fatigue testing, which is the minimum peak stress divided by the
maximum peak stress). The fatigue test data are presented in
Figure 15: Typical engineering tensile curves for the UAM-pro-
duced specimens in comparison with bulk commercial alloy
Table 4. From Table 4, L1-L3 and L4-L6 represent results of Al-
(adopted from [15]). Al specimens at low and high stress levels, respectively. S1-S3
represent results at high stress levels for Al specimen, which is
higher (∼30 MPa) than the stress levels used for L4-L6. It can be
this trend, but this could be due to the interactions between the seen from the table that the fatigue life of Al-Al increased with
solute atoms and dislocation, which is dependent on the deceasing applied stress. At high stress level (89%), both Al-Al
temperature and strain rate [61]. For 180°C-8 h, the average and Al specimens had comparable fatigue life.
tensile strength was doubled. This was attributed to the synergic Wolcott and Dapino [72] reported the transverse tensile
effects of precipitation, reduction in dislocation density, and fatigue tests of the Al3003-H18 block. Their [72] stress-
mild grain coarsening [61]. Finally, for 580°C-1 h/180°C-8 h number of cycles (S-N) curve was relatively flat, and a stress
treatment, tensile strength was significantly enhanced and the threshold of 50% of the ultimate transverse tensile strength
properties in the X- and Y-directions were comparable to the exists below which failure does not occur during 3.75 × 107
reference specimen. This trend was attributed to the significant cycles. They [72] mentioned that their reported preliminary
grain refinement across the interfaces and, consequently, im- fatigue data are only a prediction. It can be said that UAM is
proving the properties. Despite the efforts made in post- still at the developing stage and much still has to be done to
processing of UAM builds, more studies are still needed in generate fatigue life data for UAM as-built parts. Generally,
order to optimize the heat treatment parameters. For instance, fatigue life data of additive manufactured parts have been
issues of overaging (grain growth) could be detrimental to the reported to have significant scatter due to the presence of
mechanical properties of the builds. Hence, more investigations defects [50]. For instance, surface roughness is one of the
are still needed in this regard. factors that limits the fatigue performance of AM parts [50].
Several considerations and factors must be addressed when
testing the fatigue life of UAM parts. The effect of defects
5.8. Fatigue. The fatigue behavior of UAM-fabricated (voids), building direction, residual stresses, surface roughness,
structures or parts is very important in order to determine postprocessing, and, most importantly, the bonding quality
potential or estimated lifetime in cyclic loading conditions. on the fatigue life must be accounted for. Process parameter
While studies of fatigue life of additive manufactured parts optimization and fatigue failure analysis are crucial to un-
have been widely reported for other AM techniques [62–70], derstand and predict fatigue life of these parts.
there are still no adequate and substantial reports on the Applying mechanical surface treatment is one of the
fatigue life performance of UAM parts. Most of the UAM most influential posttreatments that have a significant effect
reports have concentrated on optimizing processing parame- on the fatigue properties. Mechanical surface treatments
ters [14, 29, 34, 40, 44], microstructure [12, 22, 28, 41, 45, 46], plastically deform the surface and induce strain hardening.
interfacial bonding shear [17, 48] and tensile strength [13–15], Deep levels of compressive residual stresses are induced
and hardness [10, 12, 16, 20, 27]. Moreover, tests such as tensile while improving the surface and subsurface properties. The
and shear strength might provide more adequate indication/ induced stresses retard crack initiation and propagation,
Advances in Materials Science and Engineering 13
330°C-1 h
As-received 116
300 Ref. 300 114
50 Z 50
0 0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2
Displacement (mm) Displacement (mm)
Figure 16: Engineering stress versus displacement curves illustrating the effect of annealing on the mechanical behavior of the UAM Al6061
[13].
Table 4: Fatigue test data for Al-Al and Al specimens [35]. and application. So far, none of these treatments have been
explored with regard to enhancing the properties of UAM
σn Fatigue Average fatigue
Specimen n (%) builds. Addressing this research gap is paramount and could
(MPa) life (Nf ) life (Nf )
provide valuable directions into studying the fatigue life of
L1 289.04 4.72 × 104 UAM builds. Another factor that must be considered during
L2 289.04 70 6.25 × 104 4.72 × 104
fatigue life testing is surface finish/roughness of UAM builds.
L3 289.04 5.40 × 104
L4 367.50 1.87 × 104
As mentioned in Section 5, surface finish or roughness sig-
L5 367.50 89 1.81 × 104 1.66 × 104 nificantly affects the surface properties, which could limit the
L6 367.50 1.30 × 104 fatigue performance. For better fatigue performance, smooth
S1 399.84 1.39 × 104 surface finish must be produced either during fabrication or
S2 399.84 89 1.54 × 104 1.57 × 104 after fabrication. Interestingly, some of the mechanical surface
S3 399.84 1.78 × 104 treatments such as UNSM and LPB produce high-quality
σ n represents the maximum stress level applied on the nominal dangerous surface finish which could enhance the fatigue performance.
cross-section; n represents the ratio of maximum stress applied in the The high-quality surface combined with the induced com-
fatigue test to tensile strength. pressive residual stresses could provide enhanced fatigue
performance. This investigation needs considerable attention,
and process parameters must be carefully selected.
which translates to improved fatigue properties [51]. For
instance, laser shock peening (LSP) [73], shot peening (SP)
[74], ultrasonic impact peening (UIP) [75], ultrasonic 5.9. Creep. Similar to fatigue, creep behavior of other AM as-
nanocrystalline surface modification (UNSM) [76], and low built parts have been reported [77, 79–83]. However, lit-
plasticity burnishing (LPB) [77] are all mechanical surface erature works on understanding the creep behavior of UAM
treatments that have shown enhanced fatigue properties of parts could not be found. Microstructural defects are one of
components. For more details, Gujba and Medraj [51] the factors that could limit the creep behavior of materials.
reviewed the laser peening process and its impact on ma- Other factors that limit the creep behavior of UAM parts are
terial properties in comparison with SP and UIP. It is worth complexity of the creep test in selecting the test temperatures
noting that the aforementioned mechanical surface treat- and applied stresses [50]. Most of the builds via UAM are for
ments not only induce deep residual stresses but also have low temperature applications. For instance, most materials
varying levels of strain hardening [78]. Hence, the choice of fabricated by UAM are Al-based alloys, and this could be the
treatment must be made according to the desired properties reason why the creep behavior of these materials has not
14 Advances in Materials Science and Engineering
received considerable interests. However, it will be inter- microprocessors, telemetry, and sensors have been suc-
esting to build materials such as IN718 [79, 80, 83] and cessfully embedded using UAM. Since only a mild level of
IN738LC [81, 82] and investigate their creep behavior since heating is attained during processing, build material does
these are for high-temperature applications. In this case, not experience changes in phase. In other words, initial
careful selection of creep test parameters is paramount, material properties are retained in the final constituent
especially for dissimilar materials. material properties. Defects are common features observed at
the interfacial bonds that affect the properties significantly.
6. Challenges and Future Perspectives However, postprocessing treatments, such as HIP and SPS
treatments, have been shown to enhance the properties of the
Despite the need to understand the mechanical properties of bond. While significant works on process optimization and
AM as-built parts, there is still the challenge of directly microstructure of interfacial bonds have been reported, ex-
comparing the properties of materials fabricated by different tensive work with respect to mechanical properties is still
AM techniques. This is due to the many processing pa- limited. This is largely due to the lack of standardized testing
rameters, type of material fabricated, application, and procedures and limited applications. For instance, fatigue
presence of different types and quantity of defects, as well as testing and creep properties of UAM builds are still lacking. In
the limitations associated with various AM techniques. For conclusion, it is becoming clear that more work is still needed
instance, UAM has shown great potential in fabricating to standardize test procedures that would allow for compar-
metallic and metal-matrix composite parts, but the process ative studies with other technologies and help in realizing UAM
has been limited by a lack of wide range of applications such potentials. The future of UAM is highly dependent on various
as high-temperature applications. Significant efforts industrial applications where other AM technologies fall short.
[12, 17, 22, 28, 45, 46, 48] have been made to understand the For instance, UAM has shown significant progress in fabri-
interface characteristics. However, eliminating interfacial cating heat exchangers with complex geometries through in-
defects is still a challenge encountered in UAM builds even tegrating dissimilar metals, benefiting from their various
though posttreatments have shown promising results. physical and mechanical attributes.
Comparing the works of different research groups is still a
challenge. This is largely due to the lack of standardized and
acceptable mechanical property evaluation procedures for
Conflicts of Interest
comparative studies [50]. More work is still needed in order The authors declare no conflicts of interest.
to address the overwhelming challenges of understanding
the mechanical properties of AM parts. For comparative
studies, standardized testing procedures are needed. Acknowledgments
In spite of the aforementioned challenges that need to be
The authors gratefully acknowledge the financial support
addressed, UAM technology has been used successfully for
provided by Concordia University, Montreal, Canada,
different industrial applications. For instance, fabricating
through the Horizon Postdoctoral Fellowship and Natural
heat exchangers with complex internal geometries using
Sciences and Engineering Research Council (NSERC) of
high thermally conductive metals has been a challenge.
Canada.
®
However, Fabrisonic has successfully built copper and
aluminum heat exchangers using UAM. This product has
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