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FEM Simulation Lab - Problem Statement - Set 5

The document provides instructions for a finite element analysis lab examination involving a thermal stress analysis of a cover plate subjected to different temperatures on different surfaces to determine the temperature distribution and residual stresses induced. The cover plate model is to be imported, appropriate material properties and boundary conditions are to be applied including different surface temperatures and fixed supports, and the coupled temperature-displacement analysis is to be solved to obtain the requested results.

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81 views

FEM Simulation Lab - Problem Statement - Set 5

The document provides instructions for a finite element analysis lab examination involving a thermal stress analysis of a cover plate subjected to different temperatures on different surfaces to determine the temperature distribution and residual stresses induced. The cover plate model is to be imported, appropriate material properties and boundary conditions are to be applied including different surface temperatures and fixed supports, and the coupled temperature-displacement analysis is to be solved to obtain the requested results.

Uploaded by

balaji817150
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
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DE ZG513 BITS

FEM Simulation Lab using ANSYS Pilani


Pilani | Dubai | Goa | Hyderabad

Lab Examinations – Set 5

BIRLA INSTITUTE OF TECHNOLOGY AND SCIENCE, PILANI


OCT 2021
Problem Statement – Thermal stress analysis

An cover plate is subjected to a temperature of 60 deg Celsius at a friction face as shown


in Fig. 1. The outer surface of the cover plate is subjected to forced air convection (room
temp 26oC) of coefficient 100e-4 W/mm2 ˚C. The cover plate is made fixed as shown in
Fig. 2. Determine the temperature distribution on the cover plate and also the residual
stress induced at the fixed support of cover plate. The material used for analysis is
Structural Steel. Thermal conductivity is of 20e-3 W/mmoC. The coefficient of thermal
expansion 12e-6/oC. (E = 2e5 N/mm2, PR = 0.3)

Fig. 1 Fig. 2
Hints
• Import the stp file
• Material Properties – Mechanical: Young's modules, Poisson ratio, Expansion
- Thermal: Conductivity
• Step – Coupled temp-displacement
• Interaction – Surface film condition (outer surface)
• Boundary conditions – four circles fixed (Fig. 2), others – Temperature (Fig. 1)
• Mesh – Change element type to Coupled Temperature-Displacement
• Solve the analysis

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