Introduction To Phased Array Ultrasonic Technology Applications 216-220
Introduction To Phased Array Ultrasonic Technology Applications 216-220
)
Tomoscan III PA QuickScan PA OmniScan PA
Data file format: RDTIFF RDTIFF Special RDTIFF; data can be
analyzed in TomoView
Weight: < 20 kg (44.1 lbs) Custom < 20.5 kg (45.2 lbs) < 4 kg (8.82 lbs)
Portability: yes no yes
Power supply: mains mains Battery: 15 V or mains
Price: $$$ $$ $
Figure 5-6 Olympus Tomoscan III PA (left) and QuickScan PA (right). These show the
instruments in a typical configuration and installation.
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Figure 5-7 Hypertronics BQUS002 connector for pulse-echo setups (left) and BQUS009
connector for pitch-and-catch setups (right).
Figure 5-8 S-scan display for checking the pulser/receivers functionality: normal (left);
malfunctioning pulsers and receivers (white strips, right). (Standard Olympus array acceptance
procedure.)
Individual elements active in a specific group of focal laws are checked using
a linear scan. Depending on probe pitch and probe type, the operator may use
a small screwdriver with a 0.5 mm to 0.8 mm diameter or a 0.5 mm
mechanical pencil lead refill. Slowly move the screwdriver/lead refill in front
of each element and watch for ultrasonic signals. Each active element should
produce a reflection when the screwdriver is placed in front of it. Depending
on the application, a phased array probe may work properly even if 10% to
25% of its active elements are damaged (see Figure 5-9).16
Applications 199
a b
c d
Figure 5-9 Linear scanning for element/electrical connection integrity: (a) principle; (b) focal
laws for a 32-element probe; (c) S-scan display of a linear phased array probe with 10 “dead”
elements; (d) uncorrected S-scan using linear array.
Ray tracing and data plotting on component geometries (see Figure 5-10) are
very useful tools for:
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Courtesy of NDT Soft, UK
Figure 5-10 Example of ray tracing and data plotting of phased array inspection on nozzle
weld.
5.5 Aerospace
a) NDT problem
• Detecting and sizing hard-alpha and ceramic inclusions in titanium
billets with diameters from 7.5 cm to 35 cm (3 in. to 14 in.)
b) Other requirements
• Coupling check
Applications 201
• Fully automated system
• Fine mechanical adjustment
• Customized user interface
c) Ultrasonic challenge
• Coarse-grain microstructure
• Small defects (0.4 mm to 0.8 mm)
Figure 5-11 Five-MHz annular array (top) and rho-theta probe (bottom) used for titanium billet
inspection.
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