This document provides specifications for a dual N-channel enhancement mode MOSFET. Key specifications include:
- A drain-source breakdown voltage of 80V, on-state resistance of 68mΩ at 10V gate voltage, and continuous drain current rating of 3.2A.
- Absolute maximum ratings including drain-source voltage of 80V, gate-source voltage of ±25V, and continuous drain current of 3.2A at 25°C and 2.5A at 70°C.
- Electrical characteristics at 25°C including threshold voltage of 1-1.9V, on-state resistance of 44-68mΩ at 10V gate voltage, and input/output/
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P8008HVA: Dual N-Channel Enhancement Mode MOSFET
This document provides specifications for a dual N-channel enhancement mode MOSFET. Key specifications include:
- A drain-source breakdown voltage of 80V, on-state resistance of 68mΩ at 10V gate voltage, and continuous drain current rating of 3.2A.
- Absolute maximum ratings including drain-source voltage of 80V, gate-source voltage of ±25V, and continuous drain current of 3.2A at 25°C and 2.5A at 70°C.
- Electrical characteristics at 25°C including threshold voltage of 1-1.9V, on-state resistance of 44-68mΩ at 10V gate voltage, and input/output/
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P8008HVA
Dual N-Channel Enhancement Mode MOSFET
PRODUCT SUMMARY V(BR)DSS RDS(ON) ID
80V 68mΩ @VGS = 10V 3.2A
SOP-8
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted)
PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Drain-Source Voltage VDS 80 V Gate-Source Voltage VGS ±25 TA = 25 °C 3.2 Continuous Drain Current ID TA= 70 °C 2.5 1 A Pulsed Drain Current IDM 18 Avalanche Current IAS 15.8 Avalanche Energy L =0.1mH EAS 12.5 mJ TA = 25 °C 1.5 Power Dissipation PD W TA= 70°C 1 Operating Junction & Storage Temperature Range Tj, Tstg -55 to 150 °C
THERMAL RESISTANCE RATINGS
THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Lead RqJL 25 °C / W Junction-to-Ambient RqJA 80 1 Pulse width limited by maximum junction temperature.
REV 1.0 1 2014/9/4
P8008HVA Dual N-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted)
LIMITS PARAMETER SYMBOL TEST CONDITIONS UNITS MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250mA 80 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250mA 1 1.9 3 Gate-Body Leakage IGSS VDS = 0V, VGS = ±25V ±100 nA VDS = 64V, VGS = 0V 1 Zero Gate Voltage Drain Current IDSS mA VDS = 64V, VGS = 0V, TJ = 70 °C 10 Drain-Source On-State VGS = 10V, ID = 3A 44 68 RDS(ON) mΩ Resistance1 VGS = 4.5V, ID = 1A 47 78 Forward Transconductance1 gfs VDS = 10V, ID = 3A 17 S DYNAMIC Input Capacitance Ciss 576 Output Capacitance Coss VGS = 0V, VDS = 25V, f = 1MHz 63 pF Reverse Transfer Capacitance Crss 42 Gate Resistance Rg VGS = 0V, VDS = 0V, f = 1MHz 1.2 Ω 2 Qg Total Gate Charge 15 2 VDS = 80V, VGS = 10V, Gate-Source Charge Qgs 2 nC ID = 3A 2 Qgd Gate-Drain Charge 5 2 td(on) Turn-On Delay Time 14 2 tr Rise Time VDS = 40V, 6 nS Turn-Off Delay Time 2 td(off) ID @ 3A, VGS = 10V, RG = 6Ω 38 Fall Time2 tf 8 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS Continuous Current IS 1.1 A 1 VSD IF = 3A, VGS = 0V Forward Voltage 1.3 V Reverse Recovery Time trr IF = 3A, dlF/dt = 100A / μS 30 nS Reverse Recovery Charge Qrr 40 nC 1 Pulse test : Pulse Width 300 msec, Duty Cycle 2%. 2 Independent of operating temperature. 3 Pulse width limited by maximum junction temperature.