AMERICAN NATIONAL

STANDARD

ANSI/J–STD-003
APRIL 1992

JOINT
INDUSTRY
STANDARD

Solderability Tests
for
Printed Boards

1st WORKING DRAFT

C IND
NI U
O
ST
E L E CT R

R I ES

EST. 1924
A

SO
S

O
C I ATI
April 1992 IPC-STD-003

Table of Contents
1.0 SCOPE ...................................................................... 1 4.2.4 Test D—Wave Solder Test................................... 10
1.1 Scope ...................................................................... 1 4.3 Test(s) without Established Accept/
1.2 Purpose ................................................................... 1 Reject Criterion .................................................... 11
1.3 Objective................................................................. 1 4.3.1 Test E—Wetting Balance Test ............................. 11
1.4 Performance Classes .............................................. 1 5.0 EVALUATION AIDS .............................................. 12
1.5 Method Classification............................................. 1 5.1 Evaluation Aids—Surface .................................... 12
1.5.1 Tests with Established Accept/Reject 5.2 Evaluation Aids—For Class 3 Plated
Criterion.................................................................. 1 Through-holes....................................................... 12
1.5.2 Test(s) without Established Accept/
Reject Criterion ...................................................... 1 6.0 NOTES .................................................................... 12
1.6 Test Method Selection............................................ 1 6.1 Test Equipment Sources....................................... 14
1.7 Test Specimen Requirements ................................. 2 6.1.1 Edge Dip Solderability Test Apparatus ............... 14
1.8 Coating Durability.................................................. 2 6.1.2 Rotary Dip Test Apparatus................................... 14
1.9 Limitation ............................................................... 2 6.1.3 Wetting Balance Test Apparatus .......................... 14
6.1.4 Steam Aging Equipment ...................................... 14
2.0 APPLICABLE DOCUMENTS .................................. 2
6.2 Wetting Times ...................................................... 15
2.1 Industry................................................................... 3
6.3 Correction for Buoyancy...................................... 15
2.1.1 IPC .......................................................................... 3
6.4 Preheat .................................................................. 15
2.2 Government ............................................................ 3
6.5 Baking/Testing Time Delay ................................. 15
2.2.1 Federal .................................................................... 3
6.6 Prebaking .............................................................. 15
3.0 REQUIREMENTS ..................................................... 3 6.7 Safety Note........................................................... 16
3.1 Terms and Definitions ............................................ 3 6.8 Use of Non-Activated Flux.................................. 16
3.2 Materials ................................................................. 3 6.9 Other Fluxes ......................................................... 16
3.2.1 Solder...................................................................... 3 6.10 Solder Contact ...................................................... 16
3.2.2 Flux......................................................................... 3 6.11 Steam Aging ......................................................... 16
3.2.3 Flux Removal Material .......................................... 3
3.3 Equipment............................................................... 3
Figures
3.3.1 Steam Aging Apparatus.......................................... 3
Figure 1 Contact angle ....................................................... 3
3.3.2 Solder Pot/Bath ...................................................... 4
Figure 2 Edge dip solderability test .................................... 6
3.3.3 Optical Inspection Equipment................................ 4
Figure 3a Suggested test specimen—for plated
3.3.4 Dipping Equipment ................................................ 4
through-holes........................................................ 7
3.3.5 Timing Equipment.................................................. 4
Figure 3b Suggested test specimen—for surface mount
3.4 Preparation for Testing........................................... 4 features................................................................. 8
3.4.1 Specimen Preparation and Conditioning Figure 4 Rotary dip test ...................................................... 8
For Test................................................................... 4 Figure 5 Effectiveness of solder wetting of plated-
3.4.2 Steam Aging ........................................................... 4 through holes–Class 3 ......................................... 9
3.4.3 Baking..................................................................... 4 Figure 6 Wetting balance apparatus ................................ 12
3.5 Solder Bath Requirements ..................................... 4 Figure 7a Wetting time acceptance criteria........................ 13
3.5.1 Solder Temperatures............................................... 4 Figure 7b Wetting force acceptance criteria....................... 13
3.5.2 Solder Contamination Control ............................... 4 Figure 8 Wetting balance curve........................................ 14
Figure 9 Aid to evaluation................................................. 15
4.0 TEST PROCEDURES .............................................. 4
4.1 Test Procedure Limitations .................................... 4
4.1.1 Application of Flux ................................................ 5 Tables
4.2 Tests with Established Accept/Reject Criterion .... 5 Table 1 Test Method Selection.......................................... 2
4.2.1 Test A—Edge Dip Test .......................................... 5 Table 2 Accelerated Aging and Test Requirements .......... 2
4.2.2 Test B—Rotary Dip Test ....................................... 5 Table 3 Maximum Limits of Solder Bath Contaminant ..... 3
4.2.3 Test C—Solder Float Test...................................... 8 Table 4 Steam Temperature Requirements ...................... 4

iv
April 1992 J-STD-003

Solderability Tests for Printed Boards

1.0 SCOPE demand is critical. Equipment downtime cannot be toler-

ated and must function when required such as in life sup-
1.1 Scope This standard prescribes the recommended port items or missile systems. Printed boards in this class
test methods, defect definitions and illustrations for assess- are suitable for applications where high levels of assurance
ing the solderability of printed board surface conductors, are required and service is essential.
attachment lands, and plated through-holes. This standard
is intended for use by both vendor and user. 1.5 Method Classification This standard describes test
methods by which both the surface conductors (and attach-
1.2 Purpose The solderability determination is made to ment lands) and plated through-holes may be evaluated for
verify that the printed board fabrication processes and sub- solderability.
sequent storage have had no adverse effect on the solder-
ability of those portions of the printed wiring board Provisions are made for this determination to be performed
intended to be soldered. This is determined by evaluation at the time of manufacture, at the receipt of the boards by
of the solderability specimen portion of a board or repre- the user, or just prior to assembly and soldering. User and
sentative coupon which has been processed as part of the vendor shall agree to the appropriate method to be used
panel of boards and subsequently removed for testing per and their correlation.
the method selected. Standard dwell times are defined in some of the methods
called out in this standard. Variations in board heat capac-
1.3 Objective The objective of the solderability test ity may necessitate the use of longer solder dwell times
methods described in this standard is to determine the abil- (see paragraph 6.2). Any change in solder dwell shall be
ity of printed board surface conductors, attachment lands, agreed upon by user and vendor.
and plated through-holes to wet easily with solder and to
withstand the rigors of the printed board assembly pro- 1.5.1 Tests with Established Accept/Reject Criterion
cesses. Test A — Edge Dip Test (For surface conductors and
attachment lands only)
1.4 Performance Classes Three general classes have
Test B — Rotary Dip Test (For plated through-holes, sur-
been established to reflect progressive increases in sophis-
face conductors and attachment lands, solder
tication, functional performance requirements and testing/
source side)
inspection frequency. It should be recognized that there
may be an overlap of equipment categories in different Test C — Solder Float Test (For plated through-holes, sur-
classes. The user has the responsibility to specify in the face conductors and attachment lands, solder
contract or purchase order the performance class required source side)
for each product and shall indicate any exceptions to spe- Test D— Wave Solder Test (For plated through-holes, sur-
cific parameters, where appropriate. face conductors and attachment lands, solder
source side)
Class 1 General Electronic Products
Includes consumer products, some computer and computer 1.5.2 Test(s) without Established Accept/Reject
peripherals, as well as general military hardware suitable Criterion
for applications where cosmetic imperfections are not Test E — Wetting Balance Test (For surface conductors and
important and the major requirement is function of the attachment lands only)
completed printed board.
Please forward all test data generated using this test
Class 2 Dedicated Service Electronic Products method, including type of board tested (such as Type 2 or
Includes communications equipment, sophisticated busi- 12 layer, Type 3), dimensions of coupon tested, and any
ness machines, instruments and military equipment where pretreatment, to:
high performance and extended life is required and for IPC
which uninterrupted service is desired but not critical. Cer- Wetting Balance Task Group (PWB)
tain cosmetic imperfections are allowed. 2215 Sanders Road
Northbrook, IL 60062-6135
Class 3 High Reliability Electronic Products
Includes the equipment for commercial and military prod- 1.6 Test Method Selection For appropriate test selection
ucts where continued performance or performance on refer to paragraph 1.5 and Tables 1 & 2. The test selection