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MASER Decapsulation Leaflet V1a

This document describes various decapsulation services including laser ablation decapsulation, wet chemical decapsulation, microwave induced plasma decapsulation, and mechanical decapsulation. Laser decapsulation minimizes chemical usage and allows exposure of bond wires without chemicals. Wet chemical decapsulation is used for plastic and metal packaged devices. Microwave induced plasma decapsulation provides a chemical-free process. Mechanical decapsulation uses automated tools for tasks like de-lidding ceramic samples.

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37 views

MASER Decapsulation Leaflet V1a

This document describes various decapsulation services including laser ablation decapsulation, wet chemical decapsulation, microwave induced plasma decapsulation, and mechanical decapsulation. Laser decapsulation minimizes chemical usage and allows exposure of bond wires without chemicals. Wet chemical decapsulation is used for plastic and metal packaged devices. Microwave induced plasma decapsulation provides a chemical-free process. Mechanical decapsulation uses automated tools for tasks like de-lidding ceramic samples.

Uploaded by

mstevka
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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DECAPSULATION

SERVICES
LASER ABLATION DECAPSULATION

WET CHEMICAL DECAPSULATION

MICROWAVE INDUCED PLASMA DECAPSULATION (MIP)

MECHANICAL DECAPSULATION

LED LENS REMOVAL

HIGH PIN COUNT PACKAGE DECAPSULATION


DECAPSULATION
SERVICES
LASER DECAPSULATION
• Laser assisted decapsulation to minimize the amount of chemicals needed
for package decapsulation
• Exposure of bond wires /wedge bonds without the use of any chemicals
• Laser marking ability for different materials
• Ability to cut glass and remove glass covers of sensors
• Selective area decapsulation

WET CHEMICAL DECAPSULATION


• Plastic package decapsulation of Cu, Au and Al wired packages
• Polyimide layer removal of semiconductor products
• Decapsulation of devices soldered to a PCB
• RDL removal from WLCSP devices
• Complete package removal keeping the die and bond wires intact
• GaAs die decapsulation

MICROWAVE INDUCED PLASMA DECAPSULATION (MIP)


• Plasma decapsulation of copper bond wire packages
• No passivation layer / die damage due to the decapsulation process
• Cu protecting Palladium Coating unharmed
• Effective decapsulation method for harsh environment tested samples
• EOS damage unharmed after decapsulation
• Completely chemical free decapsulation process
• Silicone LED lens removal

MECHANICAL DECAPSULATION
• Automated Selected Area Polishing tool (ASAP-1)
• De-lidding of ceramic samples
• Back-side QFN sample preparation keeping the down bonds intact
• Mechanical opening of round TO-xx devices
• Through PCB sample preparation for back-side Failure Localization
• Stacked die removal

MASER Engineering B.V. | Capitool 56 | 7521 PL Enschede | P.O. box 1438 | 7500 BK Enschede | The Netherlands
Telephone: +31 53 480 26 80 | Telefax: +31 53 480 26 70 | [email protected] | www.maser.nl
FA09v1a

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