AOZ6604PI

EZBuckTM 4A Synchronous Buck Regulator

General Description Features

The AOZ6604PI works from 4.5V to 18V input voltage  4.5V to 18V operating input voltage range
range, and provides up to 4A of continuous output  Synchronous Buck with internal low RDS(ON) (55m/
current with an output voltage adjustable down to 0.8V. 28m) high-side and low-side MOSFETs
The AOZ6604PI comes in EPAD-SO8 package and is  External program soft start
rated over a -40°C to +85°C operating ambient  U-PEM (pulse energy mode) enables 86% plus
temperature range. efficiency with Io=10mA (Vin=12V, Vo=5V)
 Adjacent pin short protection
 Output voltage adjustable to 0.8V
 4A continuous output current
 600kHz PWM operation
 Cycle-by-cycle current limit
 Pre-bias start-up
 Extensive protection features
 EPAD-SO8 package

Applications
 High reliable DC/DC converters
 High performance LCD TV
 High performance cable modems

Typical Application
VIN
CVCC

CIN

VIN VCC BST

RBST
EN CBST
VOUT
AOZ6604PI LX
L1
COMP 3.3H
R1
RC
SS FB COUT

CSS GND
CC R2

Figure 1. 4A Synchronous Buck Regulator, Fs = 600kHz

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 AOZ6604PI

Ordering Information
Part Number Ambient Temperature Range Package Environmental
AOZ6604PI -40°C to +85°C 8-Pin EPAD SO Green Product

AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/media/AOSGreenPolicy.pdf for additional information.

Pin Configuration

SS 1 8 FB

EN 2 7 COMP
LX
VIN 3 6 VCC

GND 4 5 BST

Pin Description
Pin Number Pin Name Pin Function
1 SS Soft Start Pin.
2 EN Enable pin. Logic high to enable the device.
Supply voltage input. When VIN rises above the UVLO threshold and EN is logic high, the
3 VIN
device starts up.
4 GND Power ground.
Bootstrap. Requires a capacitor connected between LX and BST to form a floating supply
5 BST
across the high-side switch driver.
6 VCC Internal LDO output.
External loop compensation pin. Connect a RC network between COMP and GND to com-
7 COMP
pensate the control loop.
Feedback input. The FB pin is used to set the output voltage via a resistive voltage divider
8 FB
between the output and GND.
Exposed Pad LX Switching node. LX is the drain of the internal low-side power FETs.

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 AOZ6604PI

Absolute Maximum Ratings Maximum Operating Ratings

Exceeding the Absolute Maximum Ratings may damage The device is not guaranteed to operate beyond the
the device. Maximum Operating ratings.

Parameter Rating Parameter Rating

Supply Voltage (VIN), EN (VEN) +20V Supply Voltage (VIN) 4.5V to 18V
LX to GND -0.7V to VIN+0.3V Output Voltage Range 0.8V to 0.85*VIN
LX to GND (20ns) -5V to 22V Ambient Temperature (TA) -40°C to +85°C
VCC, FB, COMP to GND -0.3V to 6V Package Thermal Resistance 40°C/W
VBST to LX 6V EPAD SO8 (JA)

Junction Temperature (TJ) +150°C

Storage Temperature (TS) -65°C to +150°C
ESD Rating(1) 2kV

Note:
1. Devices are inherently ESD sensitive, handling precautions are
required. Human body model rating: 1.5k in series with 100pF.

Electrical Characteristics
TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V unless otherwise specified. Specifications in BOLD indicate a temperature
range of -40°C to +85°C. These specifications are guaranteed by design.

Symbol Parameter Conditions Min. Typ. Max Units

VIN Supply Voltage 4.5 18 V
VIN rising 4.0 4.47 V
VUVLO Input Under-Voltage Lockout Threshold
VIN falling 3.3 3.7 V
VCC Regulator 5 V
VCC
VCC Load Regulator ICC = 5mA 3 %
IIN Supply Current (Quiescent) IOUT = 0A 250 A
VEN = 0V
1 10
IOFF Shutdown Supply Current (-40°C < TJunction < 125°C) A
VEN = 0V 0.1
VFB Feedback Voltage TA = 25°C 0.591 0.600 0.609 V

RO Load Regulation PWM mode 0.5 %

1A < ILoad < 4A
SV Line Regulation 4.5V < VIN < 18V 1 %
IFB Feedback Voltage Input Current 200 nA
Off threshold 0.6
VEN EN Input Threshold On threshold 2 V
(-40°C < TJunction < 125°C)
VHYS EN Input Hysteresis 300 mV
IEN EN Input Current VEN = 5V 5 A
tSS SS Time CSS = 22nF 0.9 2 3.7 ms
Modulator
fO Frequency 500 600 650 kHz
DMAX Maximum Duty Cycle 85 %
DMIN Controllable Minimum Duty Cycle 6.5 %

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 AOZ6604PI

Electrical Characteristics
TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V unless otherwise specified. Specifications in BOLD indicate a temperature
range of -40°C to +85°C. These specifications are guaranteed by design.

Symbol Parameter Conditions Min. Typ. Max Units

Gmcs Current Sense Transconductance 8 A/V
Gma Error Amplifier Transconductance 300 400 500 A/V
ICH Charging Current of Error Amplifier 40 A
Protection
ILIM Current Limit 4.5 5 A
Off threshold 720
VOVP Over Voltage Protection mV
On threshold 620
TJ rising 150
TOTP Over-temperature Shutdown LImit °C
TJ falling 100
Output Stage
RH High-Side Switch On-Resistance VBST-LX = 5V 55 m
RL Low-Side Switch On-Resistance VCC = 5V 28 m

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 AOZ6604PI

Functional Block Diagram

VCC BST VIN

UVLO 5V LDO
EN &
REGULATOR
POR
+
ISEN
REFERENCE -
& SOFTSTART
BIAS Q1
ILIMIT

SS
SS
+
0.6V PWM

LEVEL SHIFTER
+ PWM

FET DRIVER
EAMP –
COMP CONTROL
FB -
LOGIC LX

+
+

Q2

COMP
600kHz
OSCILLATOR

GND

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 AOZ6604PI

Efficiency
Efficiency vs. Load Current (VIN=12V) Efficiency vs. Load Current (VIN=5V)
100 100

90 90
Efficiency (%)

Efficiency (%)
80 80

70 70
5V OUTPUT L=4.7µH
3.3V OUTPUT L=3.3µH 3.3V OUTPUT L=3.3µH
60 2.5V OUTPUT L=3.3µH 60 2.5V OUTPUT L=3.3µH
1.8V OUTPUT L=2.2µH 1.8V OUTPUT L=2.2µH
1.2V OUTPUT L=2.2µH 1.2V OUTPUT L=2.2µH
50 50
0.01 0.1 1 10 0.01 0.1 1 10
IO (A) IO (A)

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 AOZ6604PI

Typical Characteristics
Circuit of Typical Application. TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V, unless otherwise specified.

Light Load Operation Full Load Operation

VLX
VLX (5V/div)
(5V/div)

V O ripple V O ripple
(50mV/div) (50mV/div)
V IN ripple IL
(0.1V/div) (2A/div)

IL V IN ripple
(1A/div) (0.2V/div)

1µs/div 1µs/div

PEM to PWM Mode Change PWM to PEM Mode Change

VLX VLX
(5V/div) (5V/div)

VO VO
(0.1V/div) (0.1V/div)

IL
(2A/div) IL
(2A/div)

20µs/div 20µs/div

Short Protection Short Protection Recovery

VLX
(5V/div)
VLX VO
(5V/div) (1V/div)

VO
(1V/div)
IL IL
(2A/div) (2A/div)

100ms/div 100ms/div

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 AOZ6604PI

Typical Characteristics (continued)

Circuit of Typical Application. TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V, unless otherwise specified.

Start-up to Full Load 50% to 100% Load Transient

V IN
(5V/div)
VO
VO (0.1V/div)
(1V/div)

IO
IO (2A/div)
(2A/div)

2ms/div 100µs/div

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 AOZ6604PI

Detailed Description signal, at PWM comparator input. If the current signal is

less than the error voltage, the internal high-side switch is
The AOZ6604PI is a current-mode step down regulator
on. The inductor current flows from the input through the
with integrated high-side NMOS switch and low-side
inductor to the output. When the current signal exceeds
NMOS switch. It operates from a 4.5V to 18V input
the error voltage, the high-side switch is off. The inductor
voltage range and supplies up to 4A of load current.
current is freewheeling through the internal low-side N-
Features include, enable control, Power-On Reset, input
MOSFET switch to output. The internal adaptive FET
under voltage lockout, output over voltage protection,
driver guarantees no turn on overlap of both high-side
external soft-start and thermal shut down.
and low-side switch.
The AOZ6604PI is available in EPAD-SO8 package.
Comparing with regulators using freewheeling Schottky
Enable and Soft Start diodes, the AOZ6604PI uses freewheeling NMOSFET to
realize synchronous rectification. It greatly improves the
The AOZ6604PI has external soft start feature to limit in-
converter efficiency and reduces power loss in the low-
rush current and ensure the output voltage ramps up
side switch.
smoothly to regulation voltage. A soft start process
begins when the input voltage rises to 4.1V and voltage The AOZ6604PI uses a N-Channel MOSFET as the
on EN pin is HIGH. The soft start time is programmed by high-side switch. Since the NMOSFET requires a gate
external soft start capacitor, and can be calculated by voltage higher than the input voltage, a boost capacitor is
below equation: needed between LX pin and BST pin to drive the gate.
The boost capacitor is charged while LX is low.
Css  nF x0.6V
T SS  ms  = ----------------------------------------
5uA Output Voltage Programming
Output voltage can be set by feeding back the output to
the FB pin by using a resistor divider network. In the
The EN pin of the AOZ6604PI is active high. Connect the
application circuit shown in Figure 1. The T-type resistor
EN pin to VIN if enable function is not used. Pull it to
divider network includes R1 R2. Usually, a design is
ground will disable the AOZ6604PI. Do not leave it open.
started by picking a fixed R2 value and calculating the
The voltage on EN pin must be above 2 V to enable the
required R1 with equation below.
AOZ6604PI. When voltage on EN pin falls below 0.6V,
the AOZ6604PI is disabled.  R 1
V O = 0.6   1 + -------
Light Load and PWM Operation  R 2
Under low output current settings, the AOZ6604PI will
operate with pulse energy mode to obtain high efficiency. Some standard value of R1, R2 and most used output
In pulse energy mode, the PWM will not turn off until the voltage values are listed in Table 1.
inductor current reaches to 800 mA and the current
signal exceeds the error voltage. VO (V) R1 (k) R2 (k)
Steady-State Operation 1.0 10 15
Under heavy load steady-state conditions, the converter 1.2 10 10
operates in fixed frequency and Continuous-Conduction 1.5 15 10
Mode (CCM). 1.8 20 10
The AOZ6604PI integrates an internal N-MOSFET as the 2.5 31.6 10
high-side switch. Inductor current is sensed by amplifying 3.3 68.1 15
the voltage drop across the drain to source of the high 5.0 110 15
side power MOSFET. Output voltage is divided down by
the external voltage divider at the FB pin. The difference Table 1.
of the FB pin voltage and reference is amplified by the
internal transconductance error amplifier. The error Combination of R1 and R2 should be large enough to
voltage is compared against the current signal, which is avoid drawing excessive current from the output, which
sum of inductor current signal and ramp compensation will cause power loss.

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Protection Features
VO  VO 
The AOZ6604PI has multiple protection features to I CIN_RMS = I O  ---------  1 – ---------
prevent system circuit damage under abnormal V IN  V IN
conditions.
if let m equal the conversion ratio:
Over Current Protection (OCP)
VO
The sensed inductor current signal is also used for over --------
- = m
current protection. Since the AOZ6604PI employs peak V IN
current mode control, during over current conditions, the
peak inductor current is automatically limited to cycle-by The relation between the input capacitor RMS current
cycle, and if output drop to some level after current limit, and voltage conversion ratio is calculated and shown in
then the AOZ6604PI will shut down and auto restart with Figure. 2 below. It can be seen that when VO is half of
hiccup mode. VIN, CIN is under the worst current stress. The worst
current stress on CIN is 0.5·IO.
Power-On Reset (POR)
A power-on reset circuit monitors the VIN voltage. When 0.5
the VIN voltage exceeds 4V, the converter starts
operation. When VIN voltage falls below 3.7V, the 0.4
converter will be shut down.
ICIN_RMS(m) 0.3
Thermal Protection IO
0.2
An internal temperature sensor monitors the junction
temperature. It shuts down the internal control circuit and 0.1
high side NMOS if the junction temperature exceeds
150ºC. The regulator will restart automatically under the 0
control of soft-start circuit when the junction temperature 0 0.5 1
decreases to 100ºC. m

Figure 2. ICIN vs. Voltage Conversion Ratio

Application Information
For reliable operation and best performance, the input
The basic AOZ6604PI application circuit is show in
capacitors must have current rating higher than ICIN-RMS
Figure 1. Component selection is explained below.
at worst operating conditions. Ceramic capacitors are
Input Capacitor preferred for input capacitors because of their low ESR
and high current rating. Depending on the application
The input capacitor must be connected to the VIN pin and circuits, other low ESR tantalum capacitor may also be
GND pin of AOZ6604PI to maintain steady input voltage used. When selecting ceramic capacitors, X5R or X7R
and filter out the pulsing input current. The voltage rating type dielectric ceramic capacitors should be used for
of input capacitor must be greater than maximum input their better temperature and voltage characteristics. Note
voltage plus ripple voltage. that the ripple current rating from capacitor manufactures
are based on certain amount of life time. Further de-
The input ripple voltage can be approximated by rating may be necessary in practical design.
equation below::
Inductor
IO  VO  VO
V IN = -----------------   1 – ---------  --------- The inductor is used to supply constant current to output
f  C IN  V IN V IN when it is driven by a switching voltage. For given input
and output voltage inductance and switching frequency
together decide the inductor ripple current, which is:
Since the input current is discontinuous in a buck
converter, the current stress on the input capacitor is The peak inductor current is:
another concern when selecting the capacitor. For a buck
circuit, the RMS value of input capacitor current can be
I L
I Lpeak = I O + --------
calculated by: 2

High inductance gives low inductor ripple current but

requires larger size inductor to avoid saturation. Low

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 AOZ6604PI

1
V O = I L  -------------------------
8fC O
VO  VO 
I L = -----------   1 – ---------
fL  V IN
If the impedance of ESR at switching frequency
dominates, the output ripple voltage is mainly decided by
capacitor ESR and inductor ripple current. The output
ripple current reduces inductor core losses. It also ripple voltage calculation can be further simplified to:
reduces RMS current through inductor and switches,
which results in less conduction loss. Usually, peak to V O = I L  ESR CO
peak ripple current on inductor is designed to be 20% to
40% of output current.
For lower output ripple voltage across the entire
When selecting the inductor, make sure it is able to operating temperature range, X5R or X7R dielectric type
handle the peak current without saturation even at the of ceramic, or other low ESR tantalum are recommended
highest operating temperature. to be used as output capacitors.
The inductor takes the highest current in a buck circuit. In a buck converter, output capacitor current is
The conduction loss on inductor need to be checked for continuous. The RMS current of output capacitor is
thermal and efficiency requirements. decided by the peak to peak inductor ripple current. It can
be calculated by:
Surface mount inductors in different shape and styles are
available from Coilcraft, Elytone and Murata. Shielded I L
I CO_RMS = ----------
inductors are small and radiate less EMI noise. But they 12
cost more than unshielded inductors. The choice
depends on EMI requirement, price and size. Usually, the ripple current rating of the output capacitor is
a smaller issue because of the low current stress. When
Output Capacitor
the buck inductor is selected to be very small and
The output capacitor is selected based on the DC output inductor ripple current is high, output capacitor could be
voltage rating, output ripple voltage specification and overstressed.
ripple current rating.
Loop Compensation
The selected output capacitor must have a higher rated
The AOZ6604PI employs peak current mode control for
voltage specification than the maximum desired output
easy use and fast transient response. Peak current mode
voltage including ripple. De-rating needs to be
control eliminates the double pole effect of the output
considered for long term reliability.
L&C filter. It greatly simplifies the compensation loop
Output ripple voltage specification is another important design.
factor for selecting the output capacitor. In a buck
With peak current mode control, the buck power stage
converter circuit, output ripple voltage is determined by
can be simplified to be a one-pole and one-zero system
inductor value, switching frequency, output capacitor
in frequency domain. The pole is dominant pole can be
value and ESR. It can be calculated by the equation
calculated by:
below:
1 1
VO  IL  (ESRCO  ) f p1 
8  f  CO 2  CO  RL

where CO is output capacitor value and ESRCO is the The zero is a ESR zero due to output capacitor and its
Equivalent Series Resistor of output capacitor. When low ESR. It is can be calculated by:
ESR ceramic capacitor is used as output capacitor, the
1
impedance of the capacitor at the switching frequency fZ 1 
dominates. Output ripple is mainly caused by capacitor 2  CO  ESRCO
value and inductor ripple current. The output ripple
voltage calculation can be simplified to:

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 AOZ6604PI

where with Cc. Using selected crossover frequency, fC, to

calculate Rc:
CO is the output filter capacitor;
RL is load resistor value;
ESRCO is the equivalent series resistance of output VO 2  Co
capacitor; Rc  fC  
VFB GEA  GCS
The compensation design is actually to shape the
where fC is desired crossover frequency. For best
converter control loop transfer function to get desired
performance, fc is set to be about 1/10 of switching
gain and phase. Several different types of compensation
frequency:
network can be used for the AOZ6604PI. For most cases
a series capacitor and resistor network connected to the VFB is 0.6V;
COMP pin sets the pole-zero and is adequate for a stable
high-bandwidth control loop. GEA is the error amplifier transconductance,
which is 480 x 10-6 A/V;
In the AOZ6604PI, FB pin and COMP pin are the GCS is the current sense circuit transconductance,
inverting input and the output of internal error amplifier. which is 8 A/V;
A series R and C compensation network connected to
COMP provides one pole and one zero. The pole is: The compensation capacitor Cc and resistor Rc together
make a zero. This zero is put somewhere close to the
GEA dominate pole fp1 but lower than 1/5 of selected
fp 2  crossover frequency. Cc can is selected by:
2  Cc  GVEA
CO  RL
Cc 
Where Rc
GEA is the error amplifier transconductance,
which is 480 x 10-6 A/V; An easy-to-use application software which helps to
GVEA is the error amplifier voltage gain, design and simulate the compensation loop can be found
which is 4800; at www.aosmd.com.

Cc is compensation capacitor in Figure 1; Thermal Management and Layout

The zero given by the external compensation network,
Consideration
capacitor Cc and resistor Rc, is located at: In the AOZ6604PI buck regulator circuit, high pulsing
current flows through two circuit loops. The first loop
1 starts from the input capacitors to the VIN pin, to the LX
fZ 2  pad, to the filter inductor to the output capacitor and load
2  Cc  Rc and then return to the input capacitor through ground.
Current flows in the first loop when the high side switch is
To design the compensation circuit, a target crossover on. The second loop starts from inductor, to the output
frequency fC for close loop must be selected. The system capacitors and load, to the low side NMOSFET. Current
crossover frequency is where control loop has unity gain. flows in the second loop when the low side NMOSFET is
The crossover is the also called the converter on.

bandwidth. Generally a higher bandwidth means faster In PCB layout minimizing the two loops area reduces the
response to load transient. However, the bandwidth noise of this circuit and improves efficiency. A ground
should not be too high because of system stability plane is strongly recommended to connect input
concern. When designing the compensation loop, capacitor, output capacitor and GND pin of the
converter stability under all line and load condition must AOZ6604PI.
be considered.
In the AOZ6604PI buck regulator circuit, the major power
Usually, it is recommended to set the bandwidth to be dissipating components are the AOZ6604PI and the
equal or less than 1/10 of switching frequency. output inductor. The total power dissipation of converter
circuit can be measured by input power minus output
The strategy for choosing Rc and Cc is to set the cross power.
over frequency with Rc and set the compensator zero

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 AOZ6604PI

operate under the recommended environmental

P total_loss = V IN  I IN – V O  I O conditions.
The power dissipation of inductor can be approximately
calculated by output current and DCR of inductor. 1. The exposed pad (LX) is connected to internal High-
side FET source and Low-side FET drains.
P inductor_loss = IO2  R inductor  1.1 Connect a large copper plane to LX pin to help ther-
mal dissipation.
The actual junction temperature can be calculated with 2. Do not use thermal relief connection to the VIN and
power dissipation in the AOZ6604PI and thermal the GND pin. Pour a maximized copper area to the
impedance from junction to ambient. GND pin and the VIN pin to help thermal dissipation.
T junction =  P total_loss – P inductor_loss    JA 3. Input capacitor should be connected to the VIN pin
and the GND pin as close as possible.
The maximum junction temperature of AOZ6604PI is 4. Make the current trace from LX pins to L to Co to the
150ºC, which limits the maximum load current capability. GND as short as possible.
5. Pour copper plane on all unused board area and
The thermal performance of the AOZ6604PI is strongly
connect it to stable DC nodes, like VIN, GND or
affected by the PCB layout. Extra care should be taken
VOUT.
by users during design process to ensure that the IC will

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 AOZ6604PI

Package Dimensions, SO-8 EP1

Gauge plane
D0 0.2500
C

L1

E2 E3 E1 E

D1 L1'
Note 5
D
θ

7 (4x)

A2 A

B e
A1

Dimensions in millimeters Dimensions in inches

Symbols Min. Nom. Max. Symbols Min. Nom. Max.
RECOMMENDED LAND PATTERN A 1.40 1.55 1.70 A 0.055 0.061 0.067
A1 0.00 0.05 0.10 A1 0.000 0.002 0.004
3.70
A2 1.40 1.50 1.60 A2 0.055 0.059 0.063
B 0.31 0.406 0.51 B 0.012 0.016 0.020
C 0.17 — 0.25 C 0.007 — 0.010
2.20 D 4.80 4.96 5.00 D 0.189 0.195 0.197
D0 3.20 3.40 3.60 D0 0.126 0.134 0.142
5.74 D1 3.10 3.30 3.50 D1 0.122 0.130 0.138
2.71 E 5.80 6.00 6.20 E 0.228 0.236 0.244
e — 1.27 — e — 0.050 —
2.87 E1 3.80 3.90 4.00 E1 0.150 0.153 0.157
E2 2.21 2.41 2.61 E2 0.087 0.095 0.103
E3 0.40 REF E3 0.016 REF
L 0.40 0.95 1.27 L 0.016 0.037 0.050
0.80 y — — 0.10 y — — 0.004
1.27 θ 0° 3° 8° θ 0° 3° 8°
0.635
UNIT: mm | L1–L1' | — 0.04 0.12 | L1–L1' | — 0.002 0.005
L1 1.04 REF L1 0.041 REF
Notes:
1. Package body sizes exclude mold flash and gate burrs.
2. Dimension L is measured in gauge plane.
3. Tolerance 0.10mm unless otherwise specified.
4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
5. Die pad exposure size is according to lead frame design.
6. Followed from JEDEC MS-012

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 AOZ6604PI

Tape and Reel Dimensions, SO-8, EP1

Carrier Tape P1
D1
P2
T

E1

E2 E

B0
K0 D0
A0 P0 Feeding Direction
UNIT: mm
Package A0 B0 K0 D0 D1 E E1 E2 P0 P1 P2 T
SO-8 6.40 5.20 2.10 1.60 1.50 12.00 1.75 5.50 8.00 4.00 2.00 0.25
(12mm) ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10

Reel
W1

S
G

N
M K
V

R
H

W
UNIT: mm
Tape Size Reel Size M N W W1 H K S G R V
12mm ø330 ø330.00 ø97.00 13.00 17.40 ø13.00 10.60 2.00 — — —
±0.50 ±0.10 ±0.30 ±1.00 +0.50/-0.20 ±0.50

Leader/Trailer and Orientation

Trailer Tape Components Tape Leader Tape

300mm min. or Orientation in Pocket 500mm min. or
75 empty pockets 125 empty pockets

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 AOZ6604PI

Part Marking

AC00
Part Number Code
YWLT

Assembly Lot Code

Year & Week Code

LEGAL DISCLAIMER

Applications or uses as critical components in life support devices or systems are not authorized. AOS does not
assume any liability arising out of such applications or uses of its products. AOS reserves the right to make
changes to product specifications without notice. It is the responsibility of the customer to evaluate suitability of the
product for their intended application. Customer shall comply with applicable legal requirements, including all
applicable export control rules, regulations and limitations.

AOS' products are provided subject to AOS' terms and conditions of sale which are set forth at:
http://www.aosmd.com/terms_and_conditions_of_sale

LIFE SUPPORT POLICY

ALPHA AND OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.

As used herein:

1. Life support devices or systems are devices or 2. A critical component in any component of a life
systems which, (a) are intended for surgical implant into support, device, or system whose failure to perform can
the body or (b) support or sustain life, and (c) whose be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can be effectiveness.
reasonably expected to result in a significant injury of
the user.

Rev. 1.1 December 2017 www.aosmd.com Page 16 of 16