06-Jun-17

XDM-900

Product Overview

Eli Mayost
Product Line Manager
Network Solutions Division

Outline

■ Value proposition & positioning

■ Product description
■ Value proposition
■ XDM-100 PL Comparison
■ Reassignment & Migration
■ Roadmap
■ Summary

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MSPP Product portfolio

AccessWave

2011 MSPP Product Portfolio

DXC
MADM-16/64
LightSoft MADM-16/64

End-to-End Management Solution

MADM-16/64
MADM-16/64
MADM-
4/16
ADM-64

60G/100G 120G 120G 240G

MADM-1/4/16 30G
XDM100 XDM300 XDM900 XDM1000 XDM3000
ADM/TM-1/4 40G XDM2000
ADM/TM-1 15G BG-64
BG-30
2.5G
2.5G BG-20B
BG-20C
CPE/CLE Access Metro Core

Next Generation SDH

EoP, EoS, MoT ,MoE and MPLS

ATM

CWDM/DWDM

ASON – GMPLS Control Plane

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XDM-900
AccessWave

Positioning and Highlights

XDM-900 positioning
 A cost effective, high-capacity MADM-64 and MADM-16
 For Metro and Metro-Core, Cellular and Utelco networks

Highlights
 High capacity – TDM 120G LO cross connect
 MXC with built in ASTN slot (eliminate the need for IO slot)
 Enhanced Ethernet handling
– High capacity cross cards connectivity
– Up to 240G MPLS processing
 Provides combine TDM, Ethernet L1&L2 and MPLS,
– Ethernet over SDH/SONET (EoS)
– MPLS over SDH (MoT)
– Ethernet over native Ethernet I/F
– MPLS over native Ethernet (MoE)
 CWDM/DWDM and pure Ethernet based networks

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The XDM-900 Layout

I/O Modules (I1-I8):
PIM, SIM, DIOM, SDH/SONET
MCSM,CCMBR,CTRP,SIM64_XFP, Quad I/O
SIM64_2,SIM16_2,SIM4_8,SIM64_1 Slots (QA)
and SIM16_8
SIM (SIM16_1, SIM16_4,
SIM64_XFP,
MXC-900-A SIM64_2 ,SIM16_8)
120G Multiplexer
Power ,Cross Connect
,Control and ASTN SDH/SONET
(ACP-900) Quad I/O
Slots (QB)
(SIM16_1, SIM16_4,
SIM64_XFP,
SIM64_2,SIM16_8)
MXC-900-B
120G Multiplexer
Power, Cross
Connect
,Control and ASTN
(ACP-900)
FCU900
Fan Control Unit
I/O Modules (I9-I16):
PIM, SIM, DIOM, MCSM,
CCMBR,CTRP, SIM64_XFP,
ECU900 / ECU900F
External Control Unit
SIM64_2,SIM16_2,SIM4_8,SIM64_1
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and SIM16_8

Direct
XDM-900 Slot Capacity Direct
20 G 10 G
MADM-64
Ethernet
SIM64_2 & Ethernet
connection
SIM64_1 connection
IM1 5G IM2 5G 20G
IM3 5G IM4 5G I/O Modules:
PIM, SIM, DIOM,
IM5 5G IM6 5G 20G
IM7 5G IM8 5G EISMB, MCSM

QA 20G

1x48Vin
ACP-900
MXC900 A FCU

QB 20G 900
MADM-64 ACP-900
MXC900 B
1x48Vin
SIM64_2 &
SIM64_1 ECU900
Direct IM9 5G IM10 5G20GIM11 5G IM12 5G Direct
I/O Modules:
20 G 10
PIM,GSIM, DIOM,
IM13 5G IM14 5G IMI5 5G IMI6 5G EISMB, MCSM
Ethernet 20G Ethernet
connection connection
■ Full nonblocking low order 120G cross connect
■ 2 Quad I/O slots with 20G
■ 16 I/O slots with 5G ( = 4 Quad IO slots 20G)
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XDM-900 I/O Cards

■ Two aggregation SIM options (Quad I/O QA and

QB) :
■ SIM64_2
■ SIM16_8
■ New I/O cards :
■ SIM64_1
■ SIM16_2
■ SIM4_8

Modularity

■ The XDM-900 is capable of supporting all interface types

at the same time
■ Hot insertion and extraction
■ Cards and modules
■ Extension TPU/OCU shelves
■ Pluggable transceivers (XFP’s/SFP’s)
■ No limitation to the position of the I/O modules
■ Full flexibility to add more interfaces up to the maximum
capacity

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XDM-900 Slot Capacity

TPM TPM TPM TPM TC

TPM TPM TPM TPM TC

IM1 5G IM2 5G IM3 5G IM4 5G I/O Modules:

PIM, SIM, DIOM,
IM5 5G IM6 5G IM7 5G IM8 5G EISMB, MCSM
QA 20G
1x48Vin ACP-900 MXC900 A FCU
QB 20G 900
1x48Vin ACP-900 MXC900 B

ECU900
IM9 5G IM10 5G IM11 5G IM12 5G I/O Modules:
PIM, SIM, DIOM,
IM13 5G IM14 5G IMI5 5G IMI6 5G EISMB, MCSM

TPM TPM TPM TPM TC

The shelf is designed to accommodate

Up to 3 x TPU/OCU 11

Maximum Port Density Table

Traffic Type Ports per Max. Cards Max. Ports per
Module per Shelf Shelf

E1 63 16 1008

E3,DS3 3 16 48

STM-1 8 18 144

STM-4 8 18 144

STM-16 2 16 x 2 48
8 8x2
STM-64 2 6 12

Layer 1 Ethernet (10/100 BT) 8 16 128

Layer 1 Ethernet (100FX/GBE) 4 16 64

Layer 2 MPLS (10/100BT) 8 8 64

Layer 2 MPLS (100FX/GBE) 8 8 64

Layer 2 MPLS (10GE) 4 8 32

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UVPs
AccessWave

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Value Proposition

Cost effective Platform

High density – very low cost per port

Up to 12 STM-64 in 325mm - UVP

UP to 48 STM-16 in 325mm -UVP

Scalability and flexibility – low entry price (CAPEX)

Same I/O cards as XDM-100 & XDM-300 (OPEX)

UP to 3 NEs in one 2.2 rack (OPEX) – UVP

Optimized for Metro Layer (Metro / Metro Access)

Single metro platform for all services & application types

Enhanced Ethernet services (L1,L2 and MPLS)

Native Ethernet processing & handling

Hybrid & High Capacity

Powerful 120G TDM central matrix

Non-blocking HO/LO - UVP

Up to 240G MPLS processing

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XDM-100 PL Comparison
AccessWave

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XDM-900 vs. XDM-300 vs. XDM-100

XDM-900 XDM-300 XDM-100
Type MADM-16/64 MADM-16/64 MADM-4/16
Capacity [Gbps] 120 60/100 30
Size 7U 7U 4U
E1 1008 1008 504
STM-1 144 128 80
STM-4 144 64/128 48
STM-16 48 24 12
STM-64 12 6 -
MPLS Yes Yes Yes
L2 FE/GE/10GE 64/64/8 64/64/8 16/16/4
DWDM (Q3/11) Yes Yes Yes
# of λ 32 32 16
10GbE over WDM 16 16 4
ROADM No No No
ASON Yes Yes Yes
Typical /Maximum 800/1400 1000/1600 380/450
Power [W]
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Reassignment &
Migrations
AccessWave

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XDM-300 Slot Capacity (60G) & MADM64

MADM-64
SIM64_XFP

IM1 2.5G IM2 2.5G10G

IM3 2.5G IM4 2.5G I/O Modules:
PIM, SIM, DIOM,
IM5 2.5G IM6 2.5G10G
IM7 2.5G IM8 2.5G EISMB, MCSM

QA 10G

1x48Vin MXC300 A FCU

QB 10G 300
MADM-64
1x48Vin MXC300 B
SIM64_XFP
ECU300 Display

IM9 2.5G IM10 2.5G10G

IM11 2.5G IM12 2.5G I/O Modules:
PIM, SIM, DIOM,
IM13 2.5G IM14 2.5G10G
IMI5 2.5G IMI6 2.5G EISMB, MCSM

■ Full nonblocking low order 60G cross connect

■ 2 Quad I/O slots with 10G
■ 16 I/O slots with 2.5G
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XDM-300 Slot Capacity (100G) & MADM64

MADM-64
SIM64_2

IM1 5G IM2 5G 20G

IM3 5G IM4 5G I/O Modules:
PIM, SIM, DIOM,
IM5 5G IM6 5G 20G
IM7 5G IM8 5G EISMB, MCSM

QA 10G

1x48Vin MXC900 A FCU

QB 10G 300
MADM-64
1x48Vin MXC900 B
SIM64_2
ECU300 Display

IM9 5G IM10 5G 20G

IM11 5G IM12 5G I/O Modules:
PIM, SIM, DIOM,
IM13 5G IM14 5G 20G
IMI5 5G IMI6 5G EISMB, MCSM

■ Full nonblocking low order 100G cross connect

■ 2 Quad I/O slots with 10G
■ 16 I/O slots with 5GG ( = 4 Quad IO slots 20G)
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XDM-100 PL - Cards Reassignment

■SIM4_4
■ Supported by the XDM-100 and XDM-300
■ Reassign from SIM4_2

■SIM1_8
■ Supported by the XDM-100 and XDM-300
■ Reassign from SIM1_4O/SIM1_4OB

■PIM2_42
■ Supported by the XDM-100 and XDM-300
■ Reassign from PIM2_21

■PIM2_63S
■ Supported by the XDM-100,XDM-300 and XDM-900
■ Reassign from PIM2_21 , PIM2_63 and PIM2_63B

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XDM-100 PL - Cards Reassignment

■MXC900 (V8.2R3)
■Will be supported by the XDM-300
■Migration from 60G to 100G – MXC300 to MXC900

■SIM64_2 (V8.2R3)
■ Will be supported by the XDM-300 (100G)
■ Reassign from SIM64_XFP

■SIM16_2 (V8.2R3)
■ Will be supported by the XDM-300 (100G)
■ Reassign from SIM16_1

■SIM16_8 (V8.2R4)
■ Will be supported by the XDM-300 (100G)
■ Reassign from SIM16_4

■ SIM4_8 (V8.2R4)
■ Will be supported by the XDM-300 (100G)
■ Reassign from SIM4_4

Roadmap
AccessWave

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XDM-900 Roadmap – V8.2R3 (02/11)

Infrastructure:

MXC-900 – 120G XC with
control/power/timing redundancy and ASTN
slot

Supporting the existing MXC-300 matrix in
XDM-900 shelf

SDH Interfaces :

2 x STM-16 tributary interface - SIM16_2

2 x STM-64 non-colored/colored interfaces
(XFP) with OTN (G.709 EFEC support)
functionality - SIM64_2

PDH Interfaces :

Single slot 63 x E1 card – PIM2_63S

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XDM-900 Roadmap – V8.2R4 (06/11)

Infrastructure:

SONET support - MXC-900T

ASON card accommodate in the MXC-900
matrix - ACP-900

SDH Interfaces :

High density single slot STM-1/4
configurable tributary interface – SIM4_8

Quad IO slot STM-1/4/16 configurable
tributary interface - SIM16_8

Double slot cards supports one STM-64
port, non-colored/colored interfaces (XFP)
with OTN (G.709 ,EFEC support )
functionality - SIM64_1

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Summary
AccessWave

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Summary

The XDM-900 enables high capacity

Ethernet solution by cross card
connectivity

The XDM-900 platform is optimize product
for a Metro and Metro core and aggregation
application.

Enhanced capabilities (OPEX)
 Small Footprint – 3 NEs per rack
 Low power consumption

Together with the XDM-100 and XDM-300
providing high value with its very small
size .
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Thank you
Thank You

New I/O card – SIM64_2

Accommodate in any Quad I/O slots (wide card)
2 x STM-64/OC-192 interface per card
XFP colored DWDM and non-colored transmitters
Transmitter types I, S, L (10KM,40KM,80KM)
Receiver types PIN & APD
Support OTN G.709 10.7 Gbps line transceiver with EFEC

2 x STM-64/OC-192
XFPs

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New I/O card - SIM16_2

2 x STM-16/OC-48 interface per card

Based on SFP module
Colored C/DWDM and non-colored
transmitters
Transmitter types I, S,V, X, B
Receiver types PIN & APD
For all IO slots (I1-I16)

2 x STM-16/OC-48
SFPs
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MXC-900 Description

Matrix capabilities
768 x VC4 4c/4/3/1 XC
fully LO non blocking
NVM – Compact Flash
TMU - Timing unit
Power supply
ASON Slot

ACP-900

NVM (CF)

48VDC – 60VDC
Power Feed

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PIM2_63S Characteristics

■ Single slot card supports up to 63 E1’s

■ Inherent all current PIM2_63B features
■ One Clear channel support
■ IOP 1:2 support by the TPM2_63_2
■ Re-assign from PIM2_21 ,PIM2_42
and PIM2_63

63 x E1’s
(120 Ω)

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New I/O card – SIM4_8

8 X STM-1/4/OC-3/OC-12 Interfaces per Card

Electrical (STM-1) and Optical SFP Support
Transmitter Types I, S,L ,V
Receiver Types PIN and APD

8 x STM-1/4/OC-
3/OC-12
SFPs

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New Quad I/O card - SIM16_8

Accommodate in any Quad I/O slots (wide card)
Up to 8 X 16/OC-48 interfaces and Up to 8 X STM-1/4/ OC-3/OC-
12 per card or any mix up to 20G (max 6 x STM-16 & 8 x STM1/4)
Based on SFP module
Colored C/DWDM and non-colored transmitters
Transmitter types I, S,V,X, B
Receiver types PIN & APD

8 x STM-16/OC-48
SFP

8 x STM-1/4/OC-3/OC-12
SFP

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New I/O card – SIM64_1

Double slot card supporting one STM-64/OC-192 interface
XFP colored DWDM and non-colored transmitters
Transmitter types I, S, L (10KM,40KM,80KM)
Receiver types PIN & APD
Support OTN G.709 10.7 Gbps line transceiver with EFEC

1 x STM-64/OC-192
XFP

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