BT134W-600D

23
T2
SO 4Q Triac
12 June 2014 Product data sheet

1. General description
Planar passivated very sensitive gate four quadrant triac in a SOT223 surface-mounable
plastic package. This very sensitive gate "series D" triac is intended for interfacing with
low power drivers including microcontrollers.

2. Features and benefits

• Direct interfacing to logic level ICs
• Direct interfacing to low power gate drivers and microcontrollers
• High blocking voltage capability
• Planar passivated for voltage ruggedness and reliability
• Surface-mountable package
• Triggering in all four quadrants
• Very sensitive gate

3. Applications
• General purpose low power motor control
• General purpose switching and phase control

4. Quick reference data

Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDRM repetitive peak off- - - 600 V
state voltage
ITSM non-repetitive peak on- full sine wave; Tj(init) = 25 °C; - - 10 A
state current tp = 20 ms; Fig. 4; Fig. 5

IT(RMS) RMS on-state current full sine wave; Tsp ≤ 108 °C; Fig. 1; - - 1 A
Fig. 2; Fig. 3
Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; - 2 5 mA
Tj = 25 °C; Fig. 7

VD = 12 V; IT = 0.1 A; T2+ G-; - 2.5 5 mA

Tj = 25 °C; Fig. 7

VD = 12 V; IT = 0.1 A; T2- G-; - 2.5 5 mA

Tj = 25 °C; Fig. 7

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4Q Triac

Symbol Parameter Conditions Min Typ Max Unit

VD = 12 V; IT = 0.1 A; T2- G+; - 5 10 mA
Tj = 25 °C; Fig. 7

5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 T1 main terminal 1 4
T2 T1
2 T2 main terminal 2 G
sym051
3 G gate
1 2 3
4 T2 main terminal 2
SC-73 (SOT223)

6. Ordering information
Table 3. Ordering information
Type number Package
Name Description Version
BT134W-600D SC-73 plastic surface-mounted package with increased heatsink; 4 SOT223
leads

7. Marking
Table 4. Marking codes
Type number Marking code
BT134W-600D BT134W-6D

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4Q Triac

8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state voltage - 600 V

IT(RMS) RMS on-state current full sine wave; Tsp ≤ 108 °C; Fig. 1; - 1 A
Fig. 2; Fig. 3
ITSM non-repetitive peak on-state full sine wave; Tj(init) = 25 °C; - 10 A
current tp = 20 ms; Fig. 4; Fig. 5

full sine wave; Tj(init) = 25 °C; - 11 A

tp = 16.7 ms
2
I t I2t for fusing tp = 10 ms; SIN - 0.5 A s
2

dIT/dt rate of rise of on-state current IT = 1.5 A; IG = 0.2 A; dIG/dt = 0.2 A/µs; - 50 A/µs
T2+ G+
IT = 1.5 A; IG = 0.2 A; dIG/dt = 0.2 A/µs; - 50 A/µs
T2+ G-
IT = 1.5 A; IG = 0.2 A; dIG/dt = 0.2 A/µs; - 50 A/µs
T2- G-
IT = 1.5 A; IG = 0.2 A; dIG/dt = 0.2 A/µs; - 10 A/µs
T2- G+
IGM peak gate current - 2 A

PGM peak gate power - 5 W

PG(AV) average gate power over any 20 ms period - 0.5 W

Tstg storage temperature -40 150 °C

Tj junction temperature - 125 °C

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NXP Semiconductors BT134W-600D
4Q Triac

aaa-011029 aaa-011027
12 1.2
IT(RMS)
108 °C
(A) IT(RMS)
10 (A)

8 0.8

4 0.4

0 0
10-2 10-1 1 10 -50 0 50 100 150
surge duration (s) Tsp (°C)

f = 50 Hz; Tsp = 108 °C Fig. 2. RMS on-state current as a function of solder

Fig. 1. RMS on-state current as a function of surge point temperature; maximum values
duration; maximum values
aaa-011026
1.2 107
α = 180 °
Ptot Tsp(max)
α
(W) 120 °
(°C)
90 °
α 60 ° 113
0.8
30 °

0.4 119

0 125
0 0.2 0.4 0.6 0.8 1 1.2
IT(RMS) (A)

α = conduction angle
a = form factor = IT(RMS) / IT(AV)
Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values

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4Q Triac

003aae960
12
ITSM
(A)
10

IT ITSM
4

t
2
1/f
Tj(init) = 25 °C max
0
1 10 102 103 104
number of cycles

f = 50 Hz
Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
aaa-011030
103
IT ITSM

ITSM
t
(A)
T
Tj = 25 °C max

102

(1)

(2)

10
10-5 10-4 10-3 10-2 10-1
tp (s)

tp ≤ 20 ms
(1) dIT/dt limit
(2) T2- G+ quadrant limit
Fig. 5. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values

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4Q Triac

9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-sp) thermal resistance full cycle; Fig. 6 - - 15 K/W
from junction to solder
point
Rth(j-a) thermal resistance printed circuit board mounted; pad - 70 - K/W
from junction to area; full cycle
ambient printed circuit board mounted; minimum - 156 - K/W
footprint

003aae965
102

Zth(j-sp)
(K/W)

10

unidirectional
1
bidirectional

P
10-1

tp t

10-2
10-5 10-4 10-3 10-2 10-1 1 10
tp (s)

Fig. 6. Transient thermal impedance from junction to solder point as a function of pulse width

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4Q Triac

10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; - 2 5 mA
Tj = 25 °C; Fig. 7

VD = 12 V; IT = 0.1 A; T2+ G-; - 2.5 5 mA

Tj = 25 °C; Fig. 7

VD = 12 V; IT = 0.1 A; T2- G-; - 2.5 5 mA

Tj = 25 °C; Fig. 7

VD = 12 V; IT = 0.1 A; T2- G+; - 5 10 mA

Tj = 25 °C; Fig. 7

IL latching current VD = 12 V; IG = 0.1 A; T2+ G+; - 1.6 10 mA

Tj = 25 °C; Fig. 8

VD = 12 V; IG = 0.1 A; T2+ G-; - 4.5 15 mA

Tj = 25 °C; Fig. 8

VD = 12 V; IG = 0.1 A; T2- G-; - 1.2 10 mA

Tj = 25 °C; Fig. 8

VD = 12 V; IG = 0.1 A; T2- G+; - 2.2 15 mA

Tj = 25 °C; Fig. 8

IH holding current VD = 12 V; Tj = 25 °C; Fig. 9 - 1.2 10 mA

VT on-state voltage IT = 2 A; Tj = 25 °C; Fig. 10 - 1.2 1.5 V

VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C; - 0.7 1 V

Fig. 11
VD = 400 V; IT = 0.1 A; Tj = 125 °C; 0.25 0.4 - V
Fig. 11
ID off-state current VD = 600 V; Tj = 125 °C - 0.1 0.5 mA

Dynamic characteristics
dVD/dt rate of rise of off-state VDM = 402 V; Tj = 125 °C; RGT1 = 1 kΩ; - 5 - V/µs
voltage (VDM = 67% of VDRM); exponential
waveform
tgt gate-controlled turn-on ITM = 1.5 A; VD = 600 V; IG = 0.1 A; dIG/ - 2 - µs
time dt = 5 A/µs

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4Q Triac

003aae967 003aae964
3 3

IGT IL
IGT (25 °C) IL (25 °C)
(1)
(2)
2 2
(3)
(4)

(1)
(2)
(3)
1 1
(4)

0 0
-60 -10 40 90 140 -60 -10 40 90 140
Tj (°C) Tj (°C)

(1) T2- G+ Fig. 8. Normalized latching current as a function of

(2) T2- G- junction temperature
(3) T2+ G-
(4) T2+ G+
Fig. 7. Normalized gate trigger current as a function of
junction temperature
003aae966 003aae963
2.0 2
IH
IT
IH (25 °C)
(A)

1.5 1.5

1.0 1

0.5 0.5
(1) (2) (3)

0 0
-60 -10 40 90 140 0 0.5 1 1.5 2
Tj (°C) VT (V)

Fig. 9. Normalized holding current as a function of Vo = 1.00 V; Rs = 0.21 Ω

junction temperature (1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig. 10. On-state current as a function of on-state
voltage

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4Q Triac

003aae961
1.6
VGT
VGT(25 °C)

1.2

0.8

0.4

0
-60 -10 40 90 140
Tj (°C)

Fig. 11. Normalized gate trigger voltage as a function of junction temperature

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4Q Triac

11. Package outline

Plastic surface-mounted package with increased heatsink; 4 leads SOT223

D B E A X

y
HE v M A

b1

A1

1 2 3 Lp

e1 bp w M B detail X

0 2 4 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y

1.8 0.10 0.80 3.1 0.32 6.7 3.7 7.3 1.1 0.95
mm 4.6 2.3 0.2 0.1 0.1
1.5 0.01 0.60 2.9 0.22 6.3 3.3 6.7 0.7 0.85

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION

04-11-10
SOT223 SC-73
06-03-16

Fig. 12. Package outline SC-73 (SOT223)

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4Q Triac

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punitive, special or consequential damages (including - without limitation -
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whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
Document Product Definition customer for the products described herein shall be limited in accordance
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Objective Development This document contains data from Right to make changes — NXP Semiconductors reserves the right to
[short] data the objective specification for product make changes to information published in this document, including without
sheet development. limitation specifications and product descriptions, at any time and without
Preliminary Qualification This document contains data from the notice. This document supersedes and replaces all information supplied prior
[short] data preliminary specification. to the publication hereof.
sheet
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Product Production This document contains the product authorized or warranted to be suitable for use in life support, life-critical or
[short] data specification. safety-critical systems or equipment, nor in applications where failure or
sheet malfunction of an NXP Semiconductors product can reasonably be expected
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[1] Please consult the most recently issued document before initiating or damage. NXP Semiconductors and its suppliers accept no liability for
completing a design. inclusion and/or use of NXP Semiconductors products in such equipment or
[2] The term 'short data sheet' is explained in section "Definitions". applications and therefore such inclusion and/or use is at the customer’s own
[3] The product status of device(s) described in this document may have risk.
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on Quick reference data — The Quick reference data is an extract of the
the Internet at URL http://www.nxp.com. product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

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representation or warranty that such applications will be suitable for the
Preview — The document is a preview version only. The document is still specified use without further testing or modification.
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to Customers are responsible for the design and operation of their
the accuracy or completeness of information included herein and shall have applications and products using NXP Semiconductors products, and NXP
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Short data sheet — A short data sheet is an extract from a full data sheet damage, costs or problem which is based on any weakness or default
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Product specification — The information and data provided in a Product Limiting values — Stress above one or more limiting values (as defined in
data sheet shall define the specification of the product as agreed between the Absolute Maximum Ratings System of IEC 60134) will cause permanent
NXP Semiconductors and its customer, unless NXP Semiconductors and damage to the device. Limiting values are stress ratings only and (proper)
customer have explicitly agreed otherwise in writing. In no event however, operation of the device at these or any other conditions above those
shall an agreement be valid in which the NXP Semiconductors product given in the Recommended operating conditions section (if present) or the
is deemed to offer functions and qualities beyond those described in the Characteristics sections of this document is not warranted. Constant or
Product data sheet. repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.

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12.3 Disclaimers products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
Limited warranty and liability — Information in this document is believed agreed in a valid written individual agreement. In case an individual
to be accurate and reliable. However, NXP Semiconductors does not give agreement is concluded only the terms and conditions of the respective
any representations or warranties, expressed or implied, as to the accuracy agreement shall apply. NXP Semiconductors hereby expressly objects to
or completeness of such information and shall have no liability for the applying the customer’s general terms and conditions with regard to the
consequences of use of such information. NXP Semiconductors takes no purchase of NXP Semiconductors products by customer.
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the

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4Q Triac

grant, conveyance or implication of any license under any copyrights, patents

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Export control — This document as well as the item(s) described herein

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states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
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NXP Semiconductors accepts no liability for inclusion and/or use of non-
automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards,
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12.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-
CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight,
MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug,
TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP
Semiconductors N.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

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4Q Triac

13. Contents
1 General description ............................................... 1
2 Features and benefits ............................................1
3 Applications ........................................................... 1
4 Quick reference data ............................................. 1
5 Pinning information ............................................... 2
6 Ordering information ............................................. 2
7 Marking ................................................................... 2
8 Limiting values .......................................................3
9 Thermal characteristics .........................................6
10 Characteristics ....................................................... 7
11 Package outline ................................................... 10
12 Legal information .................................................11
12.1 Data sheet status ............................................... 11
12.2 Definitions ...........................................................11
12.3 Disclaimers .........................................................11
12.4 Trademarks ........................................................ 12

© NXP Semiconductors N.V. 2014. All rights reserved

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 12 June 2014

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