TC426/TC427/TC428

1.5A Dual High-Speed Power MOSFET Drivers

Features: Package Type
• High-Speed Switching (CL = 1000 pF): 30 nsec 8-Pin PDIP/SOIC/CERDIP
• High Peak Output Current: 1.5A
NC 1 8 NC
• High Output Voltage Swing: IN A 2 7 OUT A 2, 4 7, 5
- VDD -25 mV GND 3 TC426 6 VDD
Inverting
- GND +25 mV IN B 4 5 OUT B

• Low Input Current (Logic ‘0’ or ‘1’): 1 A

NC 1 8 NC
• TTL/CMOS Input Compatible IN A 2 7 OUT A 2, 4 7, 5
• Available in Inverting and Noninverting GND 3 TC427 6 VDD
Noninverting
Configurations IN B 4 5 OUT B

• Wide Operating Supply Voltage:

NC 1 8 NC 2 7
- 4.5V to 18V
IN A 2 7 OUT A
• Current Consumption: GND 3 TC428 6 VDD 4 5
- Inputs Low – 0.4 mA IN B 4 5 OUT B
Complementary
- Inputs High – 8 mA
• Single Supply Operation NC = No internal connection

• Low Output Impedance: 6

General Description:
• Pinout Equivalent of DS0026 and MMH0026
• Latch-Up Resistant: Withstands > 500 mA The TC426/TC427/TC428 are dual CMOS high-speed
Reverse Current drivers. A TTL/CMOS input voltage level is translated
into a rail-to-rail output voltage level swing. The CMOS
• ESD Protected: 2 kV
output is within 25 mV of ground or positive supply.
Applications: The low-impedance, high-current driver outputs swing
a 1000 pF load 18V in 30 nsec. The unique current and
• Switch Mode Power Supplies voltage drive qualities make the TC426/TC427/TC428
• Pulse Transformer Drive ideal power MOSFET drivers, line drivers, and DC-to-
• Clock Line Driver DC converter building blocks.
• Coax Cable Driver Input logic signals may equal the power supply voltage.
Input current is a low 1 A, making direct interface
Device Selection Table to CMOS/bipolar switch-mode power supply control
ICs possible, as well as open-collector analog
Part Temp.
Number
Package Configuration
Range comparators.
TC426COA 8-Pin SOIC Inverting 0°C to +70°C Quiescent power supply current is 8 mA maximum. The
TC426CPA 8-Pin PDIP Inverting 0°C to +70°C TC426 requires 1/5 the current of the pin-compatible
TC426EOA 8-Pin SOIC Inverting -40°C to +85°C
TC426EPA 8-Pin PDIP Inverting -40°C to +85°C
bipolar DS0026 device. This is important in DC-to-DC
TC426IJA 8-Pin CERDIP Inverting -25°C to +85°C converter applications with power efficiency constraints
TC426MJA 8-Pin CERDIP Inverting -55°C to +125°C and high-frequency switch-mode power supply
TC427COA 8-Pin SOIC Noninverting 0°C to +70°C applications. Quiescent current is typically 6 mA when
TC427CPA 8-Pin PDIP Noninverting 0°C to +70°C
TC427EOA 8-Pin SOIC Noninverting -40°C to +85°C
driving a 1000 pF load 18V at 100 kHz.
TC427EPA 8-Pin PDIP Noninverting -40°C to +85°C The inverting TC426 driver is pin-compatible with the
TC427IJA 8-Pin CERDIP Noninverting -25°C to +85°C
TC427MJA 8-Pin CERDIP Noninverting -55°C to +125°C bipolar DS0026 and MMH0026 devices. The TC427 is
TC428COA 8-Pin SOIC Complementary 0°C to +70°C noninverting; the TC428 contains an inverting and non-
TC428CPA 8-Pin PDIP Complementary 0°C to +70°C inverting driver.
TC428EOA 8-Pin SOIC Complementary -40°C to +85°C
TC428EPA 8-Pin PDIP Complementary -40°C to +85°C Other pin compatible driver families are the TC1426/
TC428IJA 8-Pin CERDIP Complementary -25°C to +85°C TC1427/TC1428, TC4426/TC4427/TC4428 and
TC428MJA 8-Pin CERDIP Complementary -55°C to +125°C
TC4426A/TC4427A/TC4428A.

 2002-2012 Microchip Technology Inc. DS21415D-page 1

TC426/TC427/TC428
Functional Block Diagram
V+

TC426
≈500 μA TC427
TC428
≈2.5 μA

Noninverting Inverting
Output Output

(TC427) (TC426)

Input

GND

NOTE: TC428 has one inverting and one noninverting driver.

Ground any unused driver input.

DS21415D-page 2  2002-2012 Microchip Technology Inc.

 TC426/TC427/TC428
1.0 ELECTRICAL *Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
CHARACTERISTICS the device. These are stress ratings only and functional
operation of the device at these or any other conditions
Absolute Maximum Ratings* above those indicated in the operation sections of the
Supply Voltage ..................................................... +20V specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
Input Voltage, Any Terminal
affect device reliability.
................................... VDD + 0.3V to GND – 0.3V
Power Dissipation (TA 70°C)
PDIP........................................................ 730 mW
CERDIP .................................................. 800 mW
SOIC ....................................................... 470 mW
Derating Factor
PDIP....................................................... 8 mW/°C
CERDIP .............................................. 6.4 mW/°C
SOIC ...................................................... 4 mW/°C
Operating Temperature Range
C Version ........................................ 0°C to +70°C
I Version ....................................... -25°C to +85°C
E Version...................................... -40°C to +85°C
M Version ................................... -55°C to +125°C
Storage Temperature Range.............. -65°C to +150°C

TC426/TC427/TC428 ELECTRICAL SPECIFICATIONS

Electrical Characteristics: TA = +25°C with 4.5V VDD18V, unless otherwise noted.
Symbol Parameter Min Typ Max Units Test Conditions
Input
VIH Logic 1, High Input Voltage 2.4 — — V
VIL Logic 0, Low Input Voltage — — 0.8 V
IIN Input Current -1 — 1 A 0VVINVDD
Output
VOH High Output Voltage VDD – 0.025 — — V
VOL Low Output Voltage — — 0.025 V
ROH High Output Resistance — 10 15  IOUT = 10 mA, VDD = 18V
ROL Low Output Resistance — 6 10  IOUT = 10 mA, VDD = 18V
IPK Peak Output Current — 1.5 — A
Switching Time (Note 1)
tR Rise Time — — 30 nsec Figure 3-1, Figure 3-2
tF Fall Time — — 30 nsec Figure 3-1, Figure 3-2
tD1 Delay Time — — 50 nsec Figure 3-1, Figure 3-2
tD2 Delay Time — — 75 nsec Figure 3-1, Figure 3-2
Power Supply
IS Power Supply Current — — 8 mA VIN = 3V (Both Inputs)
— — 0.4 VIN = 0V (Both Inputs)
Note 1: Switching times ensured by design.

 2002-2012 Microchip Technology Inc. DS21415D-page 3

TC426/TC427/TC428
TC426/TC427/TC428 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Over operating temperature range with 4.5V VDD18V, unless otherwise noted.
Input
VIH Logic 1, High Input Voltage 2.4 — — V
VIL Logic 0, Low Input Voltage — — 0.8 V
IIN Input Current -10 — 10 A 0VVINVDD
Output
VOH High Output Voltage VDD – 0.025 — — V
VOL Low Output Voltage — — 0.025 V
ROH High Output Resistance — 13 20  IOUT = 10 mA, VDD = 18V
ROL Low Output Resistance — 8 15  IOUT = 10 mA, VDD = 18V
Switching Time (Note 1)
tR Rise Time — — 60 nsec Figure 3-1, Figure 3-2
tF Fall Time — — 60 nsec Figure 3-1, Figure 3-2
tD1 Delay Time — — 75 nsec Figure 3-1, Figure 3-2
tD2 Delay Time — — 120 nsec Figure 3-1, Figure 3-2
Power Supply
IS Power Supply Current — — 12 mA VIN = 3V (Both Inputs)
— — 0.6 VIN = 0V (Both Inputs)
Note 1: Switching times ensured by design.

DS21415D-page 4  2002-2012 Microchip Technology Inc.

 TC426/TC427/TC428
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.

TABLE 2-1: PIN FUNCTION TABLE

Pin No.
(8-Pin PDIP, Symbol Description
SOIC, CERDIP)
1 NC No Internal Connection.
2 IN A Control Input A, TTL/CMOS compatible logic input.
3 GND Ground.
4 IN B Control Input B, TTL/CMOS compatible logic input.
5 OUT B CMOS totem-pole output.
6 VDD Supply input, 4.5V to 18V.
7 OUT A CMOS totem-pole output.
8 NC No internal Connection.

 2002-2012 Microchip Technology Inc. DS21415D-page 5

TC426/TC427/TC428
3.0 APPLICATIONS INFORMATION 3.4 Power Dissipation
The supply current vs frequency and supply current
3.1 Supply Bypassing vs capacitive load characteristic curves will aid in
Charging and discharging large capacitive loads determining power dissipation calculations.
quickly requires large currents. For example, charging The TC426/TC427/TC428 CMOS drivers have greatly
a 1000 pF load to 18V in 25 nsec requires an 0.72A reduced quiescent DC power consumption. Maximum
current from the device power supply. quiescent current is 8 mA compared to the DS0026 40
To ensure low supply impedance over a wide frequency mA specification. For a 15V supply, power dissipation
range, a parallel capacitor combination is recom- is typically 40 mW.
mended for supply bypassing. Low-inductance ceramic Two other power dissipation components are:
disk capacitors with short lead lengths (< 0.5 in.) should • Output stage AC and DC load power.
be used. A 1 F film capacitor in parallel with one or two
0.1 F ceramic disk capacitors normally provides • Transition state power.
adequate bypassing.
Output stage power is:
3.2 Grounding Po = PDC + PAC
= Vo (IDC) + f CL VS2
The TC426 and TC428 contain inverting drivers.
Ground potential drops developed in common ground Where:
impedances from input to output will appear as Vo = DC output voltage
negative feedback and degrade switching speed IDC = DC output load current
characteristics. f = Switching frequency
Individual ground returns for the input and output Vs = Supply voltage
circuits or a ground plane should be used.
In power MOSFET drive applications the PDC term is
negligible. MOSFET power transistors are high-imped-
3.3 Input Stage
ance, capacitive input devices. In applications where
The input voltage level changes the no-load or resistive loads or relays are driven, the PDC component
quiescent supply current. The N-channel MOSFET will normally dominate.
input stage transistor drives a 2.5 mA current source The magnitude of PAC is readily estimated for several
load. With a logic ‘1’ input, the maximum quiescent cases:
supply current is 8 mA. Logic ‘0’ input level signals
reduce quiescent current to 0.4 mA maximum. A. B.
Minimum power dissipation occurs for logic ‘0’ inputs
1. f = 200 kHZ 1. f = 200 kHz
for the TC426/TC427/TC428. Unused driver inputs
must be connected to VDD or GND. 2. CL =1000 pf 2. CL =1000 pf
3. Vs = 18V 3. Vs = 15V
The drivers are designed with 100 mV of hysteresis.
4. PAC = 65 mW 4. PAC = 45 mW
This provides clean transitions and minimizes output
stage current spiking when changing states. Input During output level state changes, a current surge will
voltage thresholds are approximately 1.5V, making the flow through the series connected N and P channel
device TTL compatible over the 4.5V to 18V supply output MOSFETS as one device is turning “ON” while
operating range. Input current is less than 1 A over the other is turning “OFF”. The current spike flows only
this range. during output transitions. The input levels should not be
The TC426/TC427/TC428 may be directly driven by maintained between the logic ‘0’ and logic ‘1’ levels.
the TL494, SG1526/1527, SG1524, SE5560, and Unused driver inputs must be tied to ground and
similar switch-mode power supply integrated circuits. not be allowed to float. Average power dissipation will
be reduced by minimizing input rise times. As shown in
the characteristic curves, average supply current is
frequency dependent.

DS21415D-page 6  2002-2012 Microchip Technology Inc.

 TC426/TC427/TC428

VDD = 18V VDD = 18V

1 μF 0.1 μF 1 μF 0.1 μF

Input 1 Output Input 1 Output

CL = 1000 pF CL = 1000 pF

2 2
Input: 100 kHz,
square wave, Input: 100 kHz,
tRISE = tFALL ≤ 10 nsec square wave,
tRISE = tFALL ≤ 10 nsec
TC426
(1/2 TC428) TC427
(1/2 TC428)

+5V
90% +5V
90%
Input
Input
10%
0V 10%
tD1 tD2 0V
tF tR
18V 18V
90% 90% 90% 90%
tD1 tD2
Output Output tR tF

10% 10% 0V 10% 10%

0V

FIGURE 3-1: Inverting Driver Switching FIGURE 3-2: Noninverting Driver

Time Test Circuit Switching Time Test Circuit

+15V
30.
29.
28.
+
0.1 μF 4.7 μF 27.
– 1N4001
VOUT (V)

26.
25.
6
– 1N4001 VOUT 24.
2 1/2 +
TC426 23.
fIN = 10 kHz 7
10 μF +
3
47 μF 22.
–

0 10 20 30 40 50 60 70 80 90 100
IOUT (mA)

FIGURE 3-3: Voltage Doubler

+15V
-5
-6
+ –
-7
0.1 μF 4.7 μF
-8
VOUT (V)

-9
-10
6 -11
1N4001 VOUT
2 1/2 + –
-12
TC426 7
fIN = 10 kHz 10 μF – -13
3
1N4001 47 μF
+ -14
0 10 20 30 40 50 60 70 80 90 100
IOUT (mA)

FIGURE 3-4: Voltage Inverter

 2002-2012 Microchip Technology Inc. DS21415D-page 7

TC426/TC427/TC428
4.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Rise and Fall Times vs. Rise and Fall Times vs.
Supply Voltage Delay Times vs. Supply Voltage Temperature
70 90 40
CL = 1000 pF CL = 1000 pF CL = 1000 pF tR
60 TA = +25°C 80 TA = +25°C 35 VDD = 18V
tD2
50 70 30
DELAY TIME (ns)
TIME (ns)

TIME (ns)
40 60 25
tF
30 50 20
tR

20 tF 40 tD1 15

10 30 10

0
0 5 10 15 20 0 5 10 15 20 -25 0 25 50 75 100 125 150
SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) TEMPERATURE (°C)

Supply Current vs. Rise and Fall Times vs.

Delay Times vs. Temperature Capacitive Load Capacitive Load
100 80 1K
CL = 1000 pF tD2 TA = +25°C 400 kHz TA = +25°C
70 tR
90 VDD = 18V VDD = 18V VDD = 18V
SUPPLY CURRENT (mA)

60
80
DELAY TIME (ns)

100
50
TIME (ns)

70 tF
40 200 kHz
60
30
10
50
20
tD1
40 10 20 kHz

30 0 1
-25 0 25 50 75 100 125 150 10 100 1000 10K 10 100 1000 10K
TEMPERATURE (°C) CAPACITIVE LOAD (pF) CAPACITIVE LOAD (pF)

Supply Current vs. Frequency High Output vs. Voltage Low Output vs. Voltage
30 2.20 1.20
TA = +25°C VDD = 18V VDD = 5V
TA = +25°C TA = +25°C
CL = 1000 pF
1.76 0.96
SUPPLY CURRENT (mA)

OUTPUT VOLTAGE (V)

⎥ VDD – VOUT ⎥ (V)

VDD = 8V
20
1.32 0.72 10V
10V
13V
0.88 0.48
10 5V 18V 15V

0.44 0.24

0
1 10 100 1000 0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100
FREQUENCY (kHz) CURRENT SOURCED (mA) CURRENT SUNK (mA)

DS21415D-page 8  2002-2012 Microchip Technology Inc.

 TC426/TC427/TC428
TYPICAL CHARACTERISTICS (CONTINUED)

Supply Voltage vs. Supply Voltage vs.

Quiescent Supply Current Quiescent Supply Current
20 20
No Load No Load
Both Inputs Logic ‘1’ Both Inputs Logic ‘0’
TA = +25°C TA = +25°C

SUPPLY VOLTAGE (V)

SUPPLY VOLTAGE (V) 15 15

10 10

5 5

0 0
1 2 3 4 5 6 0 50 100 150 200 250 300
SUPPLY CURRENT (mA) SUPPLY CURRENT (mA)

Thermal Derating Curves

1600

1400
8-Pin DIP
MAX. POWER (mW)

1200
8-Pin CERDIP
1000

800
8-Pin SOIC
600

400

200

0
0 10 20 30 40 50 60 70 80 90 100 110 120
AMBIENT TEMPERATURE (°C)

 2002-2012 Microchip Technology Inc. DS21415D-page 9

TC426/TC427/TC428
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Package marking data not available at this time.

5.2 Taping Form

Component Taping Orientation for 8-Pin MSOP Devices

User Direction of Feed

Pin 1

Standard Reel Component Orientation

for 713 Suffix Device

Carrier Tape, Number of Components Per Reel and Reel Size

Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP 12 mm 8 mm 2500 13 in

Component Taping Orientation for 8-Pin SOIC (Narrow) Devices

User Direction of Feed

Pin 1

Standard Reel Component Orientation

for 713 Suffix Device

Carrier Tape, Number of Components Per Reel and Reel Size

Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin SOIC (N) 12 mm 8 mm 2500 13 in

DS21415D-page 10  2002-2012 Microchip Technology Inc.

 TC426/TC427/TC428
5.3 Package Dimensions

Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging

8-Pin Plastic DIP

Pin 1

.260 (6.60)
.240 (6.10)

.045 (1.14) .070 (1.78)

.030 (0.76) .040 (1.02) .310 (7.87)
.400 (10.16) .290 (7.37)
.348 (8.84)

.200 (5.08)
.140 (3.56) .040 (1.02)
.020 (0.51) .015 (0.38) 3° Min.
.150 (3.81) .008 (0.20)
.115 (2.92)

.400 (10.16)
.310 (7.87)
.110 (2.79) .022 (0.56)
.090 (2.29) .015 (0.38)

Dimensions: inches (mm)

 2002-2012 Microchip Technology Inc. DS21415D-page 11

TC426/TC427/TC428
Package Dimensions (Continued)

Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging

8-Pin CERDIP (Narrow)

.110 (2.79)
.090 (2.29)
Pin 1

.300 (7.62)
.230 (5.84)

.055 (1.40) Max. .020 (0.51) Min.

.400 (10.16) .320 (8.13)

.370 (9.40) .290 (7.37)
.040 (1.02)
.200 (5.08) .020 (0.51)
.160 (4.06)

.015 (0.38) 3° Min.

.200 (5.08) .150 (3.81)
Min. .008 (0.20)
.125 (3.18)

.400 (10.16)
.320 (8.13)
.065 (1.65) .020 (0.51)
.045 (1.14) .016 (0.41)

Dimensions: inches (mm)

DS21415D-page 12  2002-2012 Microchip Technology Inc.

 TC426/TC427/TC428
Package Dimensions (Continued)

Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging

8-Pin SOIC
Pin 1

.157 (3.99) .244 (6.20)

.150 (3.81) .228 (5.79)

.050 (1.27) Typ.

.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35) .010 (0.25)
8° Max.
.007 (0.18)
.020 (0.51) .010 (0.25)
.013 (0.33) .004 (0.10) .050 (1.27)
.016 (0.40)

Dimensions: inches (mm)

 2002-2012 Microchip Technology Inc. DS21415D-page 13

TC426/TC427/TC428
6.0 REVISION HISTORY

Revision D (December 2012)

Added a note to each package outline drawing.

DS21415D-page 14  2002-2012 Microchip Technology Inc.

 TC426/TC427/TC428
THE MICROCHIP WEB SITE CUSTOMER SUPPORT
Microchip provides online support via our WWW site at Users of Microchip products can receive assistance
www.microchip.com. This web site is used as a means through several channels:
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To register, access the Microchip web site at
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registration instructions.

 2002-2012 Microchip Technology Inc. DS21415D-page 15

TC426/TC427/TC428
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
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Device: TC426/TC427/TC428 Literature Number: DS21415D

Questions:

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3. Do you find the organization of this document easy to follow? If not, why?

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6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21415D-page 16  2002-2012 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
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Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767900

QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures

== ISO/TS 16949 ==
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

 2002-2012 Microchip Technology Inc. DS21415D-page 17

 Worldwide Sales and Service
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Tel: 86-756-3210040
11/27/12
Fax: 86-756-3210049

DS21415D-page 18  2002-2012 Microchip Technology Inc.