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SIM7800 Series Hardware Design_V1.01

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 Smart Machine Smart Decision

Document Title SIM7800 Series Hardware Design

Version 1.01

Date 2019-03-19

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Status Released

Document Control ID SIM7800 Series_Hardware Design _V1.01

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General Notes

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SIMCom offers this information as a service to its customers to support the application and
engineering efforts that use the products designed by SIMCom. The information provided is based

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on the requirements specifically from the customers. SIMCom has not undertaken any independent
search for additional relevant information, including any information that may be in the customer’s
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possession. Furthermore, the system validation of the product designed by SIMCom within a larger
electronic system remains the responsibility of the customer or the customer’s system integrator.
All specifications supplied herein are subject to change without notice.
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Copyright
This document contains the proprietary technical information which is the property of SIMCom
Limited, copying of this document, giving it to others, the using or communication of the contents
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thereof are forbidden without the official authority by SIMCom. Offenders are liable to the
payment of the damages. All rights are reserved in the event of grant of a patent or the registration
of a utility model or design. All specifications supplied herein are subject to change without notice
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Copyright © SIMCom Wireless Solutions Co., Ltd. 2019

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Contents

Contents .............................................................................................................................................3

Table Index ........................................................................................................................................5

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Figure Index ......................................................................................................................................7

Revision History ................................................................................................................................9

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1 Introduction ..............................................................................................................................10
1.1 Product Outline ...................................................................................................................10
1.2 Hardware Block Diagram.................................................................................................... 11
1.3 Functional Overview ...........................................................................................................13

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2 Package Information................................................................................................................16
2.1 Pin Assignment Overview ...................................................................................................16

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2.2 Pin Description ....................................................................................................................19
2.3 Mechanical Information ......................................................................................................26
2.4 Footprint Recommendation .................................................................................................27

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2.5 SMT stencil Recommendation ............................................................................................28
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3 Interface Application ...............................................................................................................29
3.1 Power Supply ......................................................................................................................29
3.1.1 Power Supply Design Guide ........................................................................................29
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3.1.2 Recommended Power Supply Circuit ..........................................................................30

3.1.3 Voltage Monitor............................................................................................................31
3.2 Power on/Power off/Reset Function....................................................................................32
3.2.1 Power on.......................................................................................................................32
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3.2.2 Power off ......................................................................................................................33

3.2.3 Reset Function ..............................................................................................................34
3.3 SGMII Interface ..................................................................................................................35
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3.3.1 Reference schematic with AR8033 ..............................................................................36

3.3.2 Reference schematic with BCM89820 .........................................................................36
3.4 UART Interface ...................................................................................................................37
3.4.1 7-wire UART1 interface ...............................................................................................37
3.4.2 RI and DTR Behavior...................................................................................................38
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3.4.3 4-wire UART2/UART3 ................................................................................................39

3.4.4 UART configuration .....................................................................................................39
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3.5 SPI Interface ........................................................................................................................41

3.6 USB Interface with OTG.....................................................................................................41
3.6.1 USB slave mode ...........................................................................................................41
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3.6.2 USB host mode.............................................................................................................42

3.7 HSIC Interface ....................................................................................................................42
3.8 USIM Interface....................................................................................................................43
3.8.1 USIM Application Guide..............................................................................................43
3.9 I2S Interface ........................................................................................................................46
3.9.1 I2S timing .....................................................................................................................46
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3.9.2 I2S reference circuit .....................................................................................................47
3.10 SD Interface .....................................................................................................................47
3.11 I2C Interface ....................................................................................................................49
3.12 SDIO Interface .................................................................................................................50
3.13 Network status .................................................................................................................52

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3.14 Flight Mode Control ........................................................................................................52
3.15 Other interface .................................................................................................................53
3.15.1 ADC ..........................................................................................................................53

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3.15.2 LDO ..........................................................................................................................54

4 RF Specifications......................................................................................................................55
4.1 GSM/UMTS/LTE RF Specifications ..................................................................................55

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4.2 GSM /UMTS/LTE Antenna Design Guide..........................................................................57
4.3 GNSS Receiver ...................................................................................................................58
4.3.1 GNSS Technical specification ......................................................................................59

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4.3.2 GNSS Application Guide .............................................................................................59

5 Electrical Specifications...........................................................................................................61

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5.1 Absolute maximum ratings .................................................................................................61
5.2 Operating conditions ...........................................................................................................61
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5.3 Operating Mode ..................................................................................................................62
5.3.1 Operating Mode Definition ..........................................................................................62
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5.3.2 Sleep mode ...................................................................................................................63
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5.3.3 Minimum functionality mode and Flight mode ............................................................63

5.4 Current Consumption ..........................................................................................................64
5.5 ESD Notes ...........................................................................................................................65

6 SMT Production Guide ...........................................................................................................67

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6.1 Top and Bottom View of MODULE ...................................................................................67

6.2 Typical SMT Reflow Profile ...............................................................................................67
6.3 Moisture Sensitivity Level (MSL) ......................................................................................68
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6.4 Stencil Foil Design Recommendation .................................................................................68

7 Packaging ..................................................................................................................................69

Appendix..........................................................................................................................................71
A. Reference Design......................................................................................................................71
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B. Coding Schemes and Maximum Net Data Rates over Air Interface.........................................72
C. Related Documents ...................................................................................................................75
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D. Terms and Abbreviations..........................................................................................................77

E. Safety Caution ...........................................................................................................................79
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Table Index
Table 1: Module frequency bands list ................................................................................................................ 10
Table 2: General features ................................................................................................................................... 13
Table 3: IO parameters definition....................................................................................................................... 19

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Table 4: Pin description...................................................................................................................................... 19
Table 5: VBAT pins electronic characteristic ..................................................................................................... 29
Table 6: Recommended Zener diode list ............................................................................................................ 30

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Table 7: Power on timing and electronic characteristic ...................................................................................... 33
Table 8: Power off timing and electronic characteristic ..................................................................................... 34
Table 9: RESET pin electronic characteristic ..................................................................................................... 35
Table 10: UART configuration ........................................................................................................................... 40

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Table 11: Key differences between HSIC and HS-USB..................................................................................... 42
Table 12: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V) .................................................. 43

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Table 13: USIM electronic characteristic 3.0V mode (USIM_VDD=2.95V) .................................................... 43
Table 14: I2S format .......................................................................................................................................... 46
Table 15: I2S timing parameters ........................................................................................................................ 46

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Table 16: SD/MMC electronic characteristic as 2.85V (SD_DATA0-3，SD_CLK and SD_CMD) ................. 47
Table 17: SD/MMC/eMMC electronic characteristic as 1.8V (SD_DATA0-3，SD_CLK and SD_CMD) ....... 48
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Table 18:The interfaces of SIM7800 and W59 .................................................................................................. 50
Table 19: NETLIGHT pin status ........................................................................................................................ 52
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Table 20: FLIGHTMODE pin status .................................................................................................................. 53
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Table 21: ADC0, ADC1 and ADC2 electronic characteristics ........................................................................... 53

Table 22: Electronic characteristic ..................................................................................................................... 54
Table 23: Conducted transmission power .......................................................................................................... 55
Table 24: Operating frequencies ........................................................................................................................ 55
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Table 25: E-UTRA operating bands ................................................................................................................... 56

Table 26: Conducted receive sensitivity ............................................................................................................. 56
Table 27: Reference sensitivity (QPSK) ............................................................................................................ 56
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Table 28: Trace loss ........................................................................................................................................... 57

Table 29: Recommended TVS ........................................................................................................................... 58
Table 30: GPS Performance ............................................................................................................................... 59
Table 31: Absolute maximum ratings................................................................................................................. 61
Table 32: Recommended operating ratings ........................................................................................................ 61
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Table 33: 1.8V Digital I/O characteristics* ........................................................................................................ 61

Table 34: Operating temperature ........................................................................................................................ 62
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Table 35: Operating mode Definition................................................................................................................. 62

Table 36: Current consumption on VBAT Pins (VBAT=3.8V) .......................................................................... 64
Table 37: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) ............................. 65
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Table 38: Moisture Sensitivity Level and Floor Life ......................................................................................... 68

Table 39: Tray size ............................................................................................................................................. 70
Table 40: Small Carton size ............................................................................................................................... 70
Table 41: Big Carton size ................................................................................................................................... 70
Table 42: Coding Schemes and Maximum Net Data Rates over Air Interface ................................................... 72
Table 43: Related Documents ............................................................................................................................ 75
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Table 44: Terms and Abbreviations .................................................................................................................... 77
Table 45: Safety Caution .................................................................................................................................... 79

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Figure Index
Figure 1: Standard MODULE block diagram .................................................................................................... 11
Figure 2: Special MODULE block diagram....................................................................................................... 12
Figure 3: Pin assignment overview (standard) ................................................................................................... 17

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Figure 4: Pin assignment overview (special) .................................................................................................. 18
Figure 5: Dimensions (Unit: mm) ................................................................................................................... 26
Figure 6: Footprint recommendation (Unit: mm) ......................................................................................... 27

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Figure 7: Footprint recommendation (Unit: mm) ......................................................................................... 28
Figure 8: VBAT voltage drop during burst emission (GSM/GPRS) ............................................................ 29
Figure 9: Power supply application circuit .................................................................................................... 30
Figure 10: Linear regulator reference circuit ................................................................................................ 31

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Figure 11: Switching mode power supply reference circuit .......................................................................... 31
Figure 12: Reference power on/off circuit ......................................................................................................... 32

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Figure 13: Power on timing sequence ................................................................................................................ 32
Figure 14: Power off timing sequence ............................................................................................................... 34
Figure 15: Reference reset circuit ...................................................................................................................... 35

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Figure 16: Reference SGMII circuit with AR8033 ............................................................................................ 36
Figure 17: Reference SGMII circuit with BCM89820 ....................................................................................... 36
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Figure 18: UART full modem ............................................................................................................................ 37
Figure 19: UART null modem ........................................................................................................................... 37
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Figure 20: Reference circuit of level shift .......................................................................................................... 38
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Figure 21: RI behaviour（SMS and URC report） ........................................................................................... 38

Figure 22: RI behaviour（voice call） .............................................................................................................. 39
Figure 23: UART2/3 reference schematic .......................................................................................................... 39
Figure 24: USB (slave) reference circuit ............................................................................................................ 41
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Figure 25: USB (host) reference circuit ............................................................................................................. 42

Figure 26: USIM interface reference circuit ...................................................................................................... 44
Figure 27: USIM interface reference circuit with USIM_DET .......................................................................... 44
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Figure 28: I2S timing ......................................................................................................................................... 46

Figure 29: Audio codec reference circuit ........................................................................................................... 47
Figure 30: SD reference circuit .......................................................................................................................... 48
Figure 31: eMMC reference circuit .................................................................................................................... 49
Figure 32: I2C reference circuit ......................................................................................................................... 50
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Figure 33: SDIO reference circuit with W59 Module ........................................................................................ 51

Figure 34: NETLIGHT reference circuit............................................................................................................ 52
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Figure 35: Flight mode switch reference circuit................................................................................................. 53

Figure 36: Antenna matching circuit (ANT_MAIN) .......................................................................................... 57
Figure 37: Antenna matching circuit (ANT_DIV) ............................................................................................. 58
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Figure 39: Active antenna circuit ....................................................................................................................... 60

Figure 40: Top and bottom view of MODULE .................................................................................................. 67
Figure 41: The ramp-soak-spike reflow profile of MODULE ........................................................................... 67
Figure 42: packaging diagram............................................................................................................................ 69
Figure 43: Tray drawing ..................................................................................................................................... 69
Figure 44: Small carton drawing ........................................................................................................................ 70
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Figure 45: Big carton drawing ........................................................................................................................... 70
Figure 46: Standard MODULE reference schematic.......................................................................................... 71
Figure 47: Special MODULE reference schematic ............................................................................................ 72

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Revision History

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Data Version Description of change Author

Gao Fan
2018-08-16 1.00 Released
Zhang xiuyu

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Update the description of NETLIGHT signal.
Update Page 15 “Physical characteristics” to
34*40*3.1mm.

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Update the figures of “Reference schematic with Gao Fan
2019-03-19 1.01
AR8033” and “Reference schematic with AR8033”, Zhang xiuyu
move the embedded capacitors from the SGMII_TX
to the SGMII_RX lines; Add a reversed diode on the

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PHY_INT signal.

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1 Introduction

This document describes the electronic specifications, RF specifications, interfaces, mechanical

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characteristics and testing results of the SIMCom MODULE. With the help of this document and
other software application notes/user guides, users can understand and use SIM7800 series to
design and develop mobile and automotive applications quickly.

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1.1 Product Outline

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Aimed at the global market, SIM7800 supports GSM, CDMA, WCDMA, TD-SCDMA, LTE-TDD
and LTE-FDD. Users can choose SIM7800CE/E according to the wireless network configuration.
The supported radio frequency bands are described in the following table.

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Table 1: Module frequency bands list

Standard Frequency
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EGSM 900MHz  
GSM
DCS1800MHz  
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CDMA BC0
BAND1  
WCDMA BAND5 
BAND8  
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BAND34 
TD-SCDMA
BAND39 
 
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LTE-FDD B1
LTE-FDD B3  
LTE-FDD B5  
LTE-FDD
LTE-FDD B7 
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LTE-FDD B8  
LTE-FDD B20 
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LTE-FDD B28
LTE TDD B38  
LTE TDD B39 
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LTE-TDD
LTE TDD B40  
LTE TDD B41  
Category CAT4 CAT4
GNSS  

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With a physical dimension of 34.0*40.0*3.1 mm, SIM7800CE/E can meet almost any space
requirement in users’ applications.
With the SMD type of 282-PIN LGA, SIM7800CE/E had almost all interface integrated, such as
USB2.0,OTG, SGMII, HSIC, digital audio(I2S or PCM), analog audio (optional), SD, SDIO,
UARTs, SPI, I2C,ADCs, GPIOs, MAIN ANT, DIV ANT and GNSS ANT, etc.

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With all the interfaces, SIM7800CE/E can be utilized in the smart phone, PDA, industrial handheld,
machine-to-machine and especially the automotive application.

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1.2 Hardware Block Diagram

SIM7800CE/E has two versions: the standard version with all interfaces and the special version

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with codec integrated. The block diagram of SIM7800CE/E is shown in the figure below.

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USB2.0 with OTG
Front End ANT_MAIN
HSIC
High Speed
4bit SD Interface Interface MDM9628 3rd party
4bit SDIO Interface MIPI RFFE PA+SW
U1001

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Ethernet MAC ANT_DIV
SGMII 10M/100M/1000M
rd
Modem 3 party SW
UIM Card (3V/1.8V) UIM Interface
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4G/3G/2G MODEM RX I/Q
WAN RF
U1503
7-Wire UART1 Core GSM Phase
TX I/Q WTR2965
MODEM/Voice MIPI RFFE GPS
4-wire UART2/ SPI/ I2C+GPIO Low Speed Processor GNSS I/Q
Peripherals multiband
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4-wire UART3/ SPI/ I2C+GPIO (All can be
GNSS MMPA
configured as
on

Baseband U1101
4-wire SPI/ UART4/ I2C+GPIO GPIOs) MIPI RFFE

I2C1
WIFI&BT Control signal ANT_GNSS
SGMII Control signal
(MDIO)
SAW Filter
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STATUS GPIOs
NETLIGHT LDO
FLIGHTMODE
GPIOs

System Power System&

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I2S/GPIO Audio DSP

RAM+ROM Clock System
BB_CLK
19.2MHz
LPDDR2

POWER
NAND

32kHz
SPMI
8-bit

VBAT_RF

eMCP SIM7800
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19.2MHz
NAND 4Gb PMD9628 Crystal

LPDDR2 2Gb
Standard Version
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VBAT_BB
VDD_1V8
PWRKEY
RESET
ADC1
ADC2
ADC0

GND
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Figure 1: Standard MODULE block diagram

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USB2.0 with OTG

Front End ANT_MAIN
HSIC
High Speed
4bit SD Interface Interface MDM9628 3rd party
4bit SDIO Interface MIPI RFFE PA+SW
U1001
Ethernet MAC
SGMII ANT_DIV
10M/100M/1000M

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rd
Modem 3 party SW
UIM Card (3V/1.8V) UIM Interface U1503
4G/3G/2G MODEM RX I/Q
GSM Phase WAN RF
7-Wire UART1 Core
TX I/Q WTR2965
MODEM/Voice MIPI RFFE GPS
4-wire UART2/ SPI/ I2C+GPIO Low Speed Processor GNSS I/Q
Peripherals

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multiband
2-wire Debug UART3/ GPIO (All can be
GNSS MMPA
configured as GPIOs
I2C2 Baseband U1101
except I2C2) MIPI RFFE
(Address 0x34 used internal)

I2C1
WIFI&BT Control signal
ANT_GNSS

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SGMII Control signal
(MDIO)
SAW Filter
STATUS GPIOs
NETLIGHT LDO
FLIGHTMODE

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GPIOs

I2S/GPIO System Power System&

Audio DSP
RAM+ROM Clock System

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BB_CLK
19.2MHz
LPDDR2

POWER
NAND

32kHz
SPMI
PCM

8-bit
I2C2

SIM7800
id
VBAT_RF
Receiver
eMCP
Optional
Codec
NAND 4Gb PMD9628 19.2MHz
Crystal
Special Version
NAU88U10
(Codec Integrated)
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Microphone Address:0x34
LPDDR2 2Gb
on
VBAT_BB
VDD_1V8
PWRKEY
RESET
ADC1
ADC2
ADC0

GND
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Figure 2: Special MODULE block diagram

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1.3 Functional Overview

Table 2: General features

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Feature Implementation
VBAT_BB:3.3～4.3
Power supply VBAT_RF: 3.3～4.3
Single supply voltage: 3.3～4.3V

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Power consumption Current in sleep mode : <5mA
Radio frequency bands Please refer to the table 1
GSM/GPRS power class:

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--EGSM900: 4 (2W)
--DCS1800: 1 (1W)
EDGE power class:

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--EGSM900: E2 (0.5W)
--DCS1800: E1 (0.4W)
Transmitting power
CDMA 1X power class: 3 (0.25W)
UMTS power class:

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--WCDMA :3 (0.25W)
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--EVDO: 3 (0.25W)
--TD-SCDMA: 2 (0.25W)
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LTE power class: 3 (0.25W)
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GPRS multi-slot class 12

EDGE multi-slot class 12
UMTS R99 speed: 384 kbps DL/UL
HSPA+: 5.76 Mbps(UL), 42 Mbps(DL)
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Data Transmission
CDMA EVDO:Rev-0,Rev-A
Throughput
TD-HSDPA/HSUPA: 2.2 Mbps(UL),
2.8 Mbps(DL)
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LTE CAT 4 ：150 Mbps (DL)

50 Mbps (UL)
GSM/UMTS/LTE main antenna.
Antenna UMTS/LTE auxiliary antenna
GNSS antenna
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GNSS engine (GPS,GLONASS and BD)

GNSS
Protocol: NMEA
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MT, MO, CB, Text and PDU mode

SMS SMS storage: USIM card or ME(default)
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Transmission of SMS alternatively over CS or PS.

USIM interface Support identity card: 1.8V/ 3V
Support SAT class 3, GSM 11.14 Release 98
USIM application toolkit
Support USAT
Phonebook management Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN

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One SGMII interface:
 Ethernet Mac integrated in the baseband chip
 IEEE 802.3 Ethernet 10/100/1000Mbps, SGMII IF
 Supports IEEE 1588, Precision Time Protocol (PTP)
 Full duplex rated to 1 Gbps
 Half/full duplex for 10/100 Mbps

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 Can be connected to external Ethernet PHY like
SGMII feature AR8031/AR8033(industrial 1000Mbps), BCM89820(automotive
100Mbps)
One standard MDIO bus control signal:

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 Host mode only
 Dual voltage: 1.8 V or 2.85 V operation
 Default signal frequency: 6.25MHz
 MDIO_DATA is of OD-gate, and requires an external 1.5 kΩ pull-up
resistor to VMDIO.

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One HSIC port for inter-chip communication
 Totally compatible with traditional USB cable connected topologies
 High-speed:480 Mbps

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HSIC
 Signals driven at 1.2 V standard LVCMOS levels
 No power consumed unless a transfer is in progress
 No hot plug-n-play support; no hot removal/attach

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One I2S interface with dedicated main-clock for primary digital audio, the I2S
also can be configured as PCM
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 Half Rate (ETS 06.20)
 Full Rate (ETS 06.10)
 MCLK frequency: 12.288MHz (default)
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Digital Audio feature
 Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
on

 WCDMA AMR-NB
 VoLTE AMR-WB
 Echo Cancellation
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 Noise Suppression
One optional analog audio interface (MIC and RECEIVER)
 Half Rate (ETS 06.20)
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 Full Rate (ETS 06.10)

Analog Audio feature  Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
(Optional)  WCDMA AMR-NB
 VoLTE AMR-WB
 Echo Cancellation
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 Noise Suppression
UART 1:
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 Main UART by default, support high speed data transmission

 Baud rate: 300bps to 3.5Mbps(default:115200bps)
 Can be used as the AT commands or data stream channel
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UART interface  Support RTS/CTS hardware handshake

 Multiplex ability according to GSM 07.10 Multiplexer Protocol
 Could be configured as SPI, I2C or GPIOs.
UART 2:
 Secondary UART, support high speed data transmission, can be

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configured as BT_UART
 Baud rate: 300bps to 3.5Mbps(default:115200bps)
 Support RTS/CTS hardware handshake
 Could be configured as SPI, I2C or GPIOs.

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UART 3:
 Third UART, support high speed data transmission
 The two-wire UART can be configured as Debug_UART to push out the
log information.

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 Baud rate: 300bps to 3.5Mbps(default:115200bps)
 Support RTS/CTS hardware handshake
 Could be configured as SPI, I2C or GPIOs.

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SPI:
 High speed SPI interface, master mode only
SPI interface  Maximum working frequency: 50MHz

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 Single chip select (SPI_CS) signal
 Could be configured as UART, I2C or GPIOs.

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Support eMMC Version 4.5 and microSD cards version 3.0, support 200 MHz
SDR and 50 MHz DDR.
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SD interface Dual voltage domain of 2.95V and 1.8V
Host mode only
Support maximum storage of 128GB
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Support SDIO version 3.0, support 200 MHz SDR and 50 MHz DDR.
Single voltage domain of 1.8V.
SDIO
SDIO compatible to WLAN (802.11)
Host mode only
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USB 2.0 high speed interface, support USB OTG function

USB Support USB operations at low-speed and full-speed, which refer to USB1.0
and USB1.1.
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Firmware upgrade Firmware upgrade over USB interface or FOTA

Size:34*40*3.1m
Physical characteristics
Weight:8.78g
Normal operation temperature: -30°C to +80°C
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Temperature range Extended operation temperature: -40°C to +85°C*

Storage temperature -45°C to +90°C
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*Note: Module is able to make and receive voice calls, data calls, SMS and make
GPRS/UMTS/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly
from the 3GPP specifications if the temperature is outside the normal operating temperature
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range and still within the extended operating temperature range.

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2 Package Information

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2.1 Pin Assignment Overview

All functions of the MODULE will be provided through 282 pads that will be connected to the

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customers’ platform. The following two Figures are the high-level view of the pin assignment of
the MODULE.

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Standard version
（TOP VIEW）
1 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 47

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SDIO_ SDIO_ SDIO_ SDIO SGMII SGMII ETH_ ETH_ USIM I2C1 I2C1 ANT_
A
HSIC_
A A1 A DATA3 DATA1 DATA0 _CMD
GND DATA
HSIC_
STROBE GND _TX_N _RX_P GND RST_N INT_N _VDD _SDA _SCL
GND GND GNSS
GND A A47
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
SDIO_ SDIO SGMII SGMII USIM USIM VDD_
B DATA2 GND GND GND GND GND GND RESOUT
GND GND GND B
B RFU B4 _CLK
11 13 15 17 19
_TX_P
21 23
_RX_N
25 27
_N
29
_CLK
31
_DATA
33 35
1V8
37
B44 GND B
MDIO_ USIM
C GND RFU RFU RFU GND GND UART3
RFU C

lF
C
EXT_GNSS

C GPIO38/
WLAN_EN 3 C7 12 14 16 18 20
GND
22
GND
24 26
DATA
28
_RST
30
_RXD
32 34
GND
36
_LNA_EN
C41 45 ANT_
DIV

D GPIO25 5 MDIO USIM UART3

43 GND D
E GPIO59 E RFU 7 D RFU RFU RFU RFU RFU RFU VMDIO _CLK _DET _TXD RFU RFU RFU D 41 GND E GND E
PMD_GPI
F O6/SLEEP
F RFU GRFC1 F GND F
G PMD_GPIO
2/BT_EN
_CLK

G RFU GND G GND G

FORCE_

ia
H USB_BOOT/
H RFU GRFC0 H GND H
J J
COEX_RX
J26 J30 J34
PMD_GPI
O3/WLAN_
3V_EN J RFU J14 J18 J22 GND J GND
K GPIO36/ K RFU GRFC2 K GND K
L L
COEX_TX
I2S_
DIN L RFU GND L RFU

nt
I2S_ UART2
M CLK M RFU _CTS M GND M
N I2S_
WS N GND N14 N18 N22 N26 N30 N34 GND N GND N
I2S_ UART2
P P RFU P GND P
R
_TXD
R GND
DOUT
R RFU GND R GND

e
UART3 UART2
T GND T _CTS _RXD T GND T
U NC U ADC1 U14 U18 U22 U26 U30 U34 GND U GND U
UART3 UART2
V NC V _RTS
V GND V
W GND W GND
id _RTS
GND W GND W
I2S_
Y GND Y MCLK
NETLIGHT
Y GND Y
AA NC AA GND AA14 AA18 AA22 AA26 AA30 AA34 GND AA GND AA
AB NC AB SPI_ FLIGHT
AB GND AB
f
AC
CLK MODE
AC GND AC GND GND AC GND
on

SPI_
AD GND AD MOSI
RFU AD GND AD
AE USB_
OTG_EN AE ADC0 AE14 AE18 AE22 AE26 AE30 AE34 GND AE GND AE
AF RESET AF SPI_
RFU AF GND AF ANT_
AG
CS
AG
_N
USB_
VBUS AG ADC2 GND AG MAIN

AH USB_ID AH SPI_
MISO RFU AH GND AH
AJ GND AJ PWRKEY 7 41 GND AJ GND AJ
C

SD_ UART1 UART1 UART1

AK SD_CMD SD_CLK
DATA3
SD_DET RFU RFU GND RFU RFU _RTS
UART1
_DCD _RI _DTR AK AK
AK GND
5 AL7 12 14 16 18 20 22 24 26 28 30 32 34 36 43 GND
AL USB_DN
3 SD_ SD_ SD_ UART1 UART1
AL41
45 GND AL
AL VSD_IO
DATA2 DATA0 DATA1 RFU STATUS RFU GPIO24 GND GND GND _TXD _RXD
UART1
_CTS AL
AM 11 13 15 17 19 21 23 25 27 29 31 33 35 37 GND AM
USB_DP AM4 VBAT VBAT VBAT AM44
AM GND GND GND GND GND GND GND GND GND GND GND GND GND GND AM
om

_BB _RF _RF

8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
AN AN1 AN RFU RFU RFU RFU GND RFU RFU RFU RFU RFU RFU GND VBAT
_BB
VBAT
_RF
VBAT
_RF
GND GND GND RFU GND AN AN47
AN
1 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 47
POWER SD interface SGMII
C

GND USIM SGMII Control

System Control SDIO interface UART/SPI/I2C

M

ANT WIFI/BT Control I2S signal

RF Related USB with OTG Other signal

SI

ADC HSIC RFU: reserve

for future use

Figure 3: Pin assignment overview (standard)

 Smart Machine Smart Decision

SIM7800
Special version
（TOP VIEW）

ile
1 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 47
SDIO_ SDIO_ SDIO_ SDIO HSIC_ SGMII SGMII ETH_ ETH_ USIM I2C1 I2C1 ANT_
A A1 A A A
HSIC_
GND GND GND GND GND GND
DATA3 DATA1 DATA0 _CMD DATA STROBE _TX_N _RX_P RST_N INT_N _VDD _SDA _SCL GNSS A47
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40

lF
SDIO_ SDIO SGMII SGMII USIM USIM VDD_
B GND GND GND GND GND GND RESOUT
GND GND GND B
B RFU B4 DATA2 _CLK
11 13 15 17 19
_TX_P
21 23
_RX_N
25 27
_N
29
_CLK
31
_DATA
33 35
1V8
37
B44 GND B
MDIO_ USIM
C GPIO38/
3 C GND RFU RFU RFU GND GND GND GND DATA _RST
UART3
_RXD
RFU GND EXT_GNSS
_LNA_EN C 45 ANT_
C
WLAN_EN
C7 12 14 16 18 20 22 24 26 28 30 32 34 36 C41 DIV

D GPIO25 5 MDIO USIM UART3

43 GND D
E GPIO59 E RFU 7 D RFU RFU RFU RFU RFU RFU VMDIO _CLK _DET _TXD RFU RFU RFU D 41 GND E GND E

ia
PMD_GPI
F O6/SLEEP
F RFU GRFC1 F GND F
G PMD_GPIO
2/BT_EN
_CLK

G RFU GND G GND G

FORCE_
H USB_BOOT/
H RFU GRFC0 H GND H
J J
COEX_RX
J26 J30 J34
PMD_GPI
O3/WLAN_
J RFU J14 J18 J22 GND J GND

nt
3V_EN

K GPIO36/ K RFU GRFC2 K GND K

L
COEX_TX

L I2S_
DIN L RFU GND L RFU
I2S_ UART2
M CLK M RFU _CTS M GND M
N I2S_
WS N GND N14 N18 N22 N26 N30 N34 GND N GND N

e
I2S_ UART2
P DOUT P RFU P GND P
R
_TXD
R GND R RFU GND R GND
I2C2 UART2
T GND T T GND T
_SDA
id _RXD
U RECEI
VER_N U ADC1 U14 U18 U22 U26 U30 U34 GND U GND U
I2C2 UART2
V RECEI
VER_P V _SCL _RTS
V GND V
W GND W GND GND W GND W
I2S_
f
Y GND Y MCLK
NETLIGHT Y GND Y
AA MIC_N AA GND AA14 AA18 AA22 AA26 AA30 AA34 GND AA GND AA
on

AB MIC_P AB NC FLIGHT
AB GND AB
AC
MODE
AC GND AC GND GND AC GND
AD GND AD NC RFU AD GND AD
AE USB_
OTG_EN AE ADC0 AE14 AE18 AE22 AE26 AE30 AE34 GND AE GND AE
AF RESET
AF NC RFU AF GND AF
AG USB_
_N ANT_
AG
C

VBUS AG ADC2 GND AG MAIN

AH USB_ID AH NC RFU AH GND AH

AJ GND AJ PWRKEY 7 AK SD_CMD SD_CLK
SD_
SD_DET RFU RFU GND RFU RFU
UART1 UART1 UART1 UART1
AK 41 GND AJ GND AJ
DATA3 _RTS _RI _DTR
AK GND
_DCD
43 GND AK
AL 5 AL7 12 14 16 18 20 22 24 26 28 30 32 34 36 AL41 GND AL
USB_DN
3 AL VSD_IO
SD_ SD_ SD_
RFU STATUS RFU GPIO24 GND GND GND UART1 UART1 UART1
AL 45
om

DATA2 DATA0 DATA1 _TXD _RXD _CTS

AM 11 13 15 17 19 21 23 25 27 29 31 33 35 37 GND AM
USB_DP AM4 VBAT VBAT VBAT AM44
AM GND GND GND GND GND GND GND GND GND GND _BB _RF _RF
GND GND GND GND AM
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
AN AN1 AN RFU RFU RFU RFU GND RFU RFU RFU RFU RFU RFU GND VBAT
_BB
VBAT
_RF
VBAT
_RF
GND GND GND RFU GND AN AN47
AN
1 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 47
C

POWER SD interface SGMII Analog Audio

GND USIM SGMII Control
M

System Control SDIO interface UART/SPI/I2C

ANT WIFI/BT Control I2S signal

SI

RF Related USB with OTG Other signal

ADC HSIC RFU: reserve

for future use

Figure 4: Pin assignment overview (special)

SIM7800 Series_Hardware_Design _V1.01 18 2019-03-19

 Smart Machine Smart Decision

2.2 Pin Description

Table 3: IO parameters definition

ile
Pin type Description
PI Power input

lF
PO Power output
AI Analog input
AIO Analog input/output
DIO Bidirectional digital input /output

ia
DI Digital input
DO Digital output

nt
DOH Digital output with high level
DOL Digital output with low level
PU Pull up
PD Pull down

e
id
Table 4: Pin description

Default
f
Pin name Pin No. Description Comment
status
on

Power supply
Baseband power supply,
VBAT_BB AM28, AN29 PI
voltage range: 3.3～4.3V. User can connect these pins
C

AN31,AN33, RF power supply, voltage together to the same source.

VBAT_RF PI
AM30, AM32 range: 3.3～4.3V.
1.8 output with Max 50mA
current output for external
VDD_1V8 B36 PO If unused, please keep it open.
om

circuit, such as level shift

circuit.
System Control
System power on/off control
PWRKEY AJ5 DI,PU The default voltage is 0.8V;
input, active low.
C

RESET_N has been pulled up

System reset control input,
RESET_N AF3 DI, PU to 1.8V via 40Kohm resistor
active low.
internally.
M

Should be connected to the reset

System reset control output,
RESOUT_N B28 DO pin of devices, such as eMMC.
active low.
If unused, please keep it open.
SI

USB
Valid USB detection input If unused, please keep them
USB_VBUS AG1 PI,PD with 3.0~5.25V detection
voltage open.

SIM7800 Series_Hardware_Design _V1.01 19 2019-03-19

 Smart Machine Smart Decision
Negative line of the
USB_DN AL1 AIO differential, bi-directional
USB signal.
Positive line of the
USB_DP AM1 AIO differential, bi-directional

ile
USB signal.
USB_ID AH3 DI,PU USB ID input
External boost DCDC

lF
enable, if the USB_ID pin
USB_OTG_EN AE1 DO
has been pulled low, this pin
will drive high level.
HSIC interface

ia
HSIC_STROBE A17 DIO HSIC strobe Slave mode by default.
If unused, please keep them

nt
HSIC_DATA A15 DIO HSIC data open.

SD interface
SD_DATA0

SD_DATA1
AL15

AL17
DIO

DIO
e
SD data 0
SD data 1
VSD_IO is used to pull up the
SD_DATA through resistor as
id the poor drive strength of some
SD_DATA2 AL13 DIO SD data 2 SD card, do not use it to power
SD_DATA3 AK16 DIO SD data 3 the SD card.
f
The SD_SET need a pull-up
SD_CLK AK14 DO SD clock output
on

resistor of 100K connected to

SD_CMD AK12 DO SD command output VDD_1V8.
When connected to the eMMC
Voltage of data signal of the card, the RESOUT_N signal
VSD_IO AL11 PO
SD card should be connected to the reset
C

SD card insertion detect signal of the eMMC card.

SD_DET AK18 DI,PU H: SD card is removed If unused, please keep them
L: SD card is inserted open.

SDIO interface
om

SDIO_DATA0 A9 DIO SDIO data0

SDIO_DATA1 A7 DIO SDIO data1
SDIO_DATA2 B8 DIO SDIO data2 For WLAN solution by default.
If unused, please keep them
C

SDIO_DATA3 A5 DIO SDIO data3 open.

SDIO_CMD A11 DIO SDIO command
SDIO clock
M

SDIO_CLK B10 DO

WLAN control interface

GPIO36/ Module will be forced into USB
SI

GPIO36/COEX_T
K3 DIO/DO LTE&WLAN coexistence download mode by connect H3
X
data transmit pin to VDD_1V8 during power
up.
Force USB BOOT/ DO NOT PULL UP
FORCE_USB_B
H3 DI/DI LTE&WLAN coexistence FORCE_USB_BOOT/COEX_
OOT/COEX_RX RX DURING NORMAL
data receive

SIM7800 Series_Hardware_Design _V1.01 20 2019-03-19

 Smart Machine Smart Decision
GPIO38/WLAN_ GPIO38/ POWER UP!
C1 DI/DO If unused, please keep them
EN WLAN function enable
open.
PMD_GPIO6/SL PMD_GPIO6/
F3 DIO/DO
EEP_CLK Sleep clock output

ile
PMD_GPIO2/BT PMD_GPIO2/
G1 DIO/DO
_EN Bluetooth function enable
PMD_GPIO3/WL PMD_GPIO3/
J1 DIO/DO

lF
AN_3V_EN WLAN power enable
SGMII interface

SGMII_TX_P B20 AO SGMII transmit– positive

ia
SGMII_TX_N A21 AO SGMII transmit - negative
If unused, please keep them

nt
open.
SGMII_RX_P A23 AI SGMII receive – positive

SGMII_RX_N B24 AI

e
SGMII receive - negative
id
SGMII control interface

ETH_INT_N A29 DI,PU Ethernet PHY interrupt

f
on

External 1.5K pull-up resistor

ETH_RST_N A27 DO Ethernet PHY reset
from VSDIO to MDIO_DATA
and 10K pull-up resistor from
Management data VDD_1V8 to ETH_INT_N are
MDIO_DATA C27 DIO
C

input/output-data needed when the Ethernet PHY

is connected.
Management data If unused, please keep them
MDIO_CLK D26 DO
input/output-clock open.
om

Power domain of the MDIO

VMDIO D24 PO
interface

USIM interface
C

Power output for USIM card,

the voltage depends on the
USIM_VDD A31 PO
USIM card type. Its output
M

current is up to 50mA.
All lines of USIM interface
should be protected against
USIM Card data I/O, which
SI

ESD.
has been pulled up via a
10KR resistor to
USIM_DATA B32 DIO
USIM_VDD internally. Do
not pull it up or down
externally.

SIM7800 Series_Hardware_Design _V1.01 21 2019-03-19

 Smart Machine Smart Decision

USIM_CLK B30 DO USIM clock output

USIM_RST C29 DO USIM Reset output

ile
USIM_DET D28 DI USIM card detecting input.

lF
UART1 interface
UART1_TXD AL33 DOH Transmit Data 1

ia
UART1_RXD AL35 DI,PU Receive Data 1
UART1_CTS AL37 DI,PU Clear to Send 1

nt
If unused, please keep them
UART1_RTS AK30 DOH Request to send 1
open.
UART1_RI AK34 DOH Ring Indicator 1

UART1_DCD AK32 DOH

e
Carrier detects 1

UART1_DTR AK36 DI,PU

id
DTE get ready 1
UART2 interface
f
UART2_TXD P41 DOH Transmit Data 2
on

UART2_RXD T41 DI,PU Receive Data 2 If unused, please keep them

UART2_CTS M41 DI,PU Clear to Send 2 open.

UART2_RTS V41 DOH Request to send 2

C

UART3 interface

UART3_TXD D30 DOH Transmit Data 3 UART3_CTS and UART3_RTS

om

are I2C2_SDA and I2C2_SCL

UART3_RXD C31 DI,PU Receive Data 3 in the special version. And the
I2C2 interface has been pull up
UART3_CTS T7 DI,PU Clear to Send 3 internal in the special version.
If unused, please keep them
C

UART3_RTS V7 DOH Request to send 3 open.

M

SPI interface
SPI_MOSI AD7 DOL Master output slaver input
The SPI interface is NC in the
SPI_MISO AH7 DI,PD Master input slaver output
SI

special version.
SPI_CS AF7 DOH SPI chip select
If unused, please keep them
SPI_CLK AB7 DOL SPI clock open.

Analog audio interface in special version

NC(MIC_P) AB3 AI Differential audio input These pins are NC in standard

SIM7800 Series_Hardware_Design _V1.01 22 2019-03-19

 Smart Machine Smart Decision
NC(MIC_N) AA1 AI version and analog audio in
special version.
NC(Receiver_P) V3 AO
Differential audio output If unused, please keep them
NC(Receiver_N) U1 AO open.
I2C interface

ile
I2C1_SCL A35 OD I2C clock output 1 OD gate driver, pull-up resistors
of 2.2KR to the VDD_1V8 are
needed.
I2C data input/output 1

lF
I2C1_SDA A33 OD If unused, please keep them
open
I2S interface
I2S_DIN L1 DI I2S data input

ia
I2S_DOUT P3 DO I2S data output
I2S_CLK M3 DO I2S clock output If unused, please keep them
open.

nt
I2S_WS N1 DO I2S word select
I2S_MCLK Y7 DO I2S system main clock
GPIO

NETLIGHT Y41 DO
e
LED control output as
id
network status indication.

Flight Mode control input.

f
FLIGHTMOD High level(or open): Normal
AB41 DI,PU
on

E Mode
Low level: Flight Mode

Operating status output. If unused, keep them open.

High level: Power on and DO NOT PULL UP GPIO24
C

STATUS AL21 DOH

firmware ready AND GPIO25 DURING
Low level: Power off NORMAL POWER UP!
General purpose input
GPIO24 AL25 DIO
om

/output 24

General purpose input

GPIO25 D3 DIO
/output 25

General purpose input

GPIO59 E1 DIO
C

/output 59
RF interface
M

ANT_MAIN AG47 AIO MAIN antenna soldering pad

Auxiliary antenna soldering
ANT_DIV C47 AI
pad
SI

ANT_GNSS A41 AI GNSS antenna soldering pad

RF relative interface
GRFC0 H41 DO General RF control 0
If unused, please keep them
GRFC1 F41 DO General RF control 1
open.
GRFC2 K41 DO General RF control 2
SIM7800 Series_Hardware_Design _V1.01 23 2019-03-19
 Smart Machine Smart Decision
EXT_GNSS_LN
C37 DO External GNSS LNA enable
A_EN

ADC interface
Analog-digital converter
ADC0 AE5 AI
input 0

ile
Analog-digital converter If unused, please keep them
ADC1 U5 AI
input 1 open.
Analog-digital converter

lF
ADC2 AG5 AI
input 2
RFU
RFU C13 Reserved for future use

ia
RFU C15 Reserved for future use
RFU D12 Reserved for future use
RFU D14 Reserved for future use

nt
RFU C17 Reserved for future use
RFU D16 Reserved for future use
RFU
RFU
D18
D20
e
Reserved for future use
Reserved for future use
id
RFU D22 Reserved for future use
RFU C33 Reserved for future use
f
RFU D32 Reserved for future use
on

RFU D34 Reserved for future use

RFU D36 Reserved for future use
RFU B1 Reserved for future use
C

RFU E5 Reserved for future use

Please keep them open.
RFU G5 Reserved for future use
RFU J5 Reserved for future use
om

RFU L5 Reserved for future use

RFU F7 Reserved for future use
RFU H7 Reserved for future use
Reserved for future use
C

RFU K7
RFU M7 Reserved for future use
RFU R5 Reserved for future use
M

RFU P7 Reserved for future use

RFU AK26 Reserved for future use
SI

RFU AK28 Reserved for future use

RFU AL23 Reserved for future use
RFU AN5 Reserved for future use
RFU AN7 Reserved for future use
RFU AN9 Reserved for future use

SIM7800 Series_Hardware_Design _V1.01 24 2019-03-19

 Smart Machine Smart Decision
RFU AN11 Reserved for future use
RFU AK20 Reserved for future use
RFU AK22 Reserved for future use
RFU AL19 Reserved for future use

ile
RFU AN15 Reserved for future use
RFU AN17 Reserved for future use
RFU AN19 Reserved for future use

lF
RFU AN21 Reserved for future use
RFU AN23 Reserved for future use
RFU AN25 Reserved for future use

ia
RFU AN41 Reserved for future use
RFU L47 Reserved for future use

nt
RFU AD41 Reserved for future use
RFU AF41 Reserved for future use
RFU AH41 Reserved for future use
GND

e
id
R1,W1,AC1,AJ1,T3,Y3,AD3,AK3,N5,W5,AA5,AC5,AK24,AL31,AL29,AL27,AM40,AM3
8,AM36,AM34,AM26,AM24,AM22,AM20,AM18,AM16,AM14,AM12,AM10,AM8,AN43,
AN39,AN37,AN35,AN27,AN13,B47,E47,G47,J47,N47,R47,U47,W47,AA47,AC47,AE47,
GND
AJ47,AL47,AM47,AK45,AH45,AF45,AD45,AB45,Y45,V45,T45,P45,M45,K45,H45,F45,D
f
45,E43,G43,J43,L43,N43,R43,U43,W43,AA43,AC43,AE43,AG43,AJ43,C35,C25,C23,C21,
on

C19,C11,B40,B38,B34,B26,B22,B18,B16,B14,B12,A43,A39,A37,A25,A19,A13
C
om
C
M
SI

SIM7800 Series_Hardware_Design _V1.01 25 2019-03-19

 Smart Machine Smart Decision

2.3 Mechanical Information

The following figure shows the package outline drawing of MODULE.

ile
lF
ia
e nt
f id
on
C
om
C
M
SI

Figure 5: Dimensions (Unit: mm)

SIM7800 Series_Hardware_Design _V1.01 26 2019-03-19

 Smart Machine Smart Decision

2.4 Footprint Recommendation

ile
lF
ia
e nt
f id
on
C
om
C
M
SI

Figure 6: Footprint recommendation (Unit: mm)

SIM7800 Series_Hardware_Design _V1.01 27 2019-03-19

 Smart Machine Smart Decision

2.5 SMT stencil Recommendation

ile
lF
ia
e nt
f id
on
C
om

Figure 7: Footprint recommendation (Unit: mm)

C
M
SI

SIM7800 Series_Hardware_Design _V1.01 28 2019-03-19

 Smart Machine Smart Decision

3 Interface Application

ile
3.1 Power Supply

The power supply pins of SIM7800CE/E include VBAT_RF (pin AN31, pin AN33, pin AM30, pin

lF
AM32) and VBAT_BB (pin AM28& pin AM29). The 4 VBAT_RF pins supply the power to RF
circuits and the 2 VBAT_BB pins supply the power to baseband circuits. The 6 power supply pins
of SIM7800CE/E could be connected and used together (default), whereas could be used
individually.

ia
For VBAT pads (VBAT_BB and VBAT_RF), the ripple current which due to GSM/GPRS emission
burst (every 4.615ms) could rises to 2A in some condition and may cause voltage drop. So the

nt
power supply for these pads must be able to provide sufficient current up to more than 2A in order
to avoid the voltage drop to be more than 300mV.
The following figure shows the VBAT voltage ripple wave at the maximum power transmit phase.

577us 4.615ms
e
id
IVBAT Burst:2A
f
on

VBAT
Max:300mV

Figure 8: VBAT voltage drop during burst emission (GSM/GPRS)

C

Table 5: VBAT pins electronic characteristic

Symbol Description Min. Typ. Max. Unit

om

VBAT Module power voltage 3.3 3.8 4.3 V

IVBAT(peak) Module power peak current in normal mode. - 2 - A
IVBAT(power-off) Module power current in power off mode. - - 20 uA
C

3.1.1 Power Supply Design Guide

M

Make sure that the voltage on the VBAT pins will never drop below 3.3V, even during a transmit
SI

burst, when current consumption may rise up to 2A. If the voltage drops below 3.3V, the RF
performance may be affected.
Note: If the power supply for VBAT pins can support more than2A, using a total of more than
300uF capacitors is recommended, or else users must using a total of 1000uF capacitors
typically, in order to avoid the voltage drop to be more than 300mV.
Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band

SIM7800 Series_Hardware_Design _V1.01 29 2019-03-19

 Smart Machine Smart Decision
can be used for EMC.
These capacitors should be put as close as possible to VBAT pads. Also, users should keep VBAT
trace on circuit board wider than 2 mm to minimize PCB trace impedance. The following figure
shows the recommended circuit.

ile
AN31
VBAT_RF
AN33
VBAT_RF FB101
AM30
VBAT_RF VBAT
AM32
VBAT_RF
5.1V

lF
Cc Cb Ca
GND 500mW
1uF 100uF 100uF
GND
MODULE AM28
VBAT_BB
VBAT_BB AN29

ia
Cf Ce Cd
GND 10uF 100uF
100nF
GND

nt
Figure 9: Power supply application circuit
Note: The test condition: The voltage of power supply for VBAT is 3.8V, Ca,Cb and Cd were 100
µF tantalum capacitors (ESR=0.7Ω).

e
id
In addition, in order to guard for over voltage protection, it is suggested to use a zener diode with
5.1V reverse voltage and more than 500mW power dissipation.
f
on

Table 6: Recommended Zener diode list

No. Manufacturer Part Number Power dissipation Package

1 On semi MMSZ5231BT1G 500mW SOD123
C

2 Prisemi PZ3D4V2H 500mW SOD323

3 Vishay MMSZ4689-V 500mW SOD123
4 Crownpo CDZ55C5V1SM 500mW 0805
om

3.1.2 Recommended Power Supply Circuit

C

It is recommended that a switching mode power supply or a linear regulator power supply is used.
It is important to make sure that all the components used in the power supply circuit can resist the
M

current which could be more than 2A.

The following figure shows the linear regulator reference circuit with 5V input and 3.8V output.
SI

U101 MIC29302 VBAT

DC INPUT
2 4
Vin Vout
FUSE
C101+ C102 1
FB 5
+ C103
GND

On/Off R101
100uF 100K R103 C104
1uF 3 470R
PWR_CTRL
330uF 100nF
R102
47K

SIM7800 Series_Hardware_Design _V1.01 30 2019-03-19

 Smart Machine Smart Decision
Figure 10: Linear regulator reference circuit
If there is a high dropout between input and VBAT, or the efficiency is extremely important, then a
switching mode power supply will be preferable. The following figure shows the switching mode
power supply reference circuit with 12V input and 3.8V output.
DC INPUT U101 LM2596- ADJ

ile
L101 FB101 VBAT
1
Vin Vout 2
FUSE 100uH 270 ohm@100Mhz
C101 + C102 5 R101
+

GND
On/Off FB 4 D102 2.2K C103 C104
100uF
1uF
PWR_CTRL 3 330uF 100nF
MBR360

lF
R102 1K

ia
Figure 11: Switching mode power supply reference circuit
Note: The Switching Mode power supply solution for VBAT must be chosen carefully against

nt
Electro Magnetic Interference and ripple current from depraving RF performance.

3.1.3 Voltage Monitor

e
id
To monitor the VBAT voltage, the AT command “AT+CBC” can be used.
For monitoring the VBAT voltage outside or within a special range, the AT command
f
“AT+CVALARM” can be used to enable the under-voltage warning function.
on

If users need to power off MODULE when the VBAT voltage is out of a range, the AT command
“AT+CPMVT” can be used to enable under-voltage power-off function.
Note: Under-voltage warning function and under-voltage power-off function are disabled by
C

default. For more information about these AT commands, please refer to Document [1].
om
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3.2 Power on/Power off/Reset Function

3.2.1 Power on

ile
MODULE can be powered on by pulling the PWRKEY pin down to ground.
The PWRKEY pin has been pulled up with a diode to 1.8V internally, so it does not need to be
pulled up externally. It is strongly recommended to put a100nF capacitor, an ESD protection diode,

lF
close to the PWRKEY pin as it would strongly enhance the ESD performance of PWRKEY pin.
Please refer to the following figure for the recommended reference circuit.

ia
The high voltage of PWRKEY is 0.8V 1.8V

Turn on / off 1KΩ

nt
PWRKEY Power
impulse On / off logic
4.7K
100nF

47K

e MODULE
f id
Figure 12: Reference power on/off circuit
on

Note: Module could be automatically power on by connecting PWRKEY pin to ground via 0R
resistor directly.
C

The power-on scenarios are illustrated in the following figure.

om

VBAT Ton
PWRKEY
(Input)
Ton(status)
STATUS
(Output)
C

Ton(uart)

UART Port Undefined Active

M

Ton(usb)
SI

USB Port Undefined Active

Figure 13: Power on timing sequence

SIM7800 Series_Hardware_Design _V1.01 32 2019-03-19

 Smart Machine Smart Decision
Table 7: Power on timing and electronic characteristic

Symbol Parameter Min. Typ. Max. Unit

The time of active low level impulse of PWRKEY
Ton 100 500 - ms
pin to power on MODULE

ile
The time from power-on issue to STATUS pin output
Ton(status) 13 15 - s
high level(indicating power up ready ) *
Ton(uart) The time from power-on issue to UART port ready 10 11 - s

lF
Ton(usb) The time from power-on issue to USB port ready 10 11 - s
VIH Input high level voltage on PWRKEY pin 0.6 0.8 1.8 V
VIL Input low level voltage on PWRKEY pin -0.3 0 0.5 V

ia
*Note: The STATUS pin is a litter later than the USB and UART, so the high level of STATUS
indicates that the USB and UART have been initialized and ready to work .

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3.2.2 Power off

e
The following methods can be used to power off MODULE.
● Method 1: Power off MODULE by hold the PWRKEY pin to a low level at least 2.5s.
id
● Method 2: Power off MODULE by AT command “AT+CPOF”.
● Method 3: over-voltage or under-voltage automatic power off. The voltage range can be set by
f
AT command “AT+CPMVT”.
on

● Method 4: over-temperature or under-temperature automatic power off.

Note: If the temperature is outside the range of -30~+80℃, some warning will be reported via AT
port. If the temperature is outside the range of -40~+85℃, MODULE will be powered off
C

automatically.

For details about “AT+CPOF” and “AT+CPMVT”, please refer to Document [1].
om

These procedures will make MODULE disconnect from the network and allow the software to
enter a safe state, and save data before MODULE be powered off completely.
The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.
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 Smart Machine Smart Decision

Toff-on
PWRKEY Toff Ton
( Input )

STATUS

ile
( Output )
Toff(status)

Toff(uart)

lF
UART Port Active Undefined

Toff(usb)

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USB Port Active Undefined

e nt
Figure 14: Power off timing sequence
id
Table 8: Power off timing and electronic characteristic

Time value
f
Symbol Parameter Unit
Min. Typ. Max.
on

The active low level time pulse on PWRKEY pin to

Toff 2.5 -- -- s
power off MODULE
The time from power-off issue to STATUS pin output low
C

Toff(status) 16 18 - s
level(indicating power off )*
Toff(uart) The time from power-off issue to UART port off 14 16 - s
Toff(usb) The time from power-off issue to USB port off 14 16 - s
om

Toff-on The buffer time from power-off issue to power-on issue 0 - - s

*Note: The STATUS pin can be used to detect whether MODULE is powered on or not. When
MODULE has been powered on and firmware goes ready, STATUS will be high level, or else
STATUS will still low level.
C
M

3.2.3 Reset Function

MODULE can be reset by pulling the RESET_N pin down to ground.

SI

Note: This function is only used as an emergency reset, when both AT command “AT+CPOF”
and the PWRKEY pin have lost efficacy.
The RESET_N pin has been pulled up with a 40KΩ resistor to 1.8V internally, so it does not need
to be pulled up externally. It is strongly recommended to put a100pF capacitor and an ESD
protection diode close to the RESET_N pin. Please refer to the following figure for the

SIM7800 Series_Hardware_Design _V1.01 34 2019-03-19

 Smart Machine Smart Decision
recommended reference circuit.

1.8V

Treset 40K
Reset Impulse 1KΩ Reset

ile
RESET_N
Logic
4.7K
100pF

47K

lF
MODULE

ia
Figure 15: Reference reset circuit

Table 9: RESET pin electronic characteristic

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Symbol Description Min. Typ. Max. Unit

e
The active low level impulse time on RESET_N pin to
Treset 100 150 500 ms
reset MODULE
id
VIH Input high level voltage 1.17 1.8 2.1 V
VIL Input low level voltage -0.3 0 0.8 V
f
on

3.3 SGMII Interface

MODULE provides a SGMII interface with an Ethernet MAC embedded, customers could add a
C

PHY to connect to the Ethernet, and the PHY device could be controlled by the MDIO interface
and other dedicated signals.
Two Ethernet PHY are supported: AR8031/AR8033 (Qualcomm) and BCM89820 (Broadcom).
The AR8031/AR8033 is used for the industrial field and the BCM89820 is dedicated for the
om

automotive field.
Main features of SGMII:
 Ethernet Mac integrated in the module
 IEEE 802.3 Ethernet 10/100/1000Mbps, SGMII IF
 Supports IEEE 1588, Precision Time Protocol (PTP)
C

 Full duplex rated to 1 Gbps

 Half/full duplex for 10/100 Mbps
 Can be connected to external Ethernet PHY like AR8031/AR8033(industrial
M

10/100/1000Mbps), BCM89820(automotive 10/100Mbps)

 Uses 8B10B encoding of data with effective baud data rate of 1 Gbps, data rate is always 1.25
Gbps (or DDR clock is always at 625 MHz)
SI

Main features of MDIO:

 Host mode only
 Dual voltage: 1.8 V or 2.85 V operation
 Default signal frequency: 6.25MHz
 MDIO_DATA is OD-gate, and requires an external 1.5 kΩ pull-up resistor to VMDIO.

For the AR8031/AR8033, Customer should provide 3.3V to power the external Ethernet PHY
system and the current should be more than 200mA.
SIM7800 Series_Hardware_Design _V1.01 35 2019-03-19
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3.3.1 Reference schematic with AR8033

Power @ 3.3V
SIM7800 AR8031/AR8033
VDD

Transceiver

ile
SGMII_TX_P 0.1uF SIP
SGMII

SGMII_TX_M 0.1uF SIN TRXP0 MDI-P0 RJ45

0.1uF
SGMII_RX_P SOP TRXN0 MDI-N0
SGMII_RX_M SON TRXP1 MDI-P1
0.1uF VMDIO=2.95V TRXN1 MDI-N1

lF
VDD_1V8=1.8V
TRXP2 MDI-P2

1.5K
10K
TRXN2 MDI-N2
ETH_INT_N 1.8V TRXP3 MDI-P3
INT
Control

ETH_RST_N 1.8/2.95V TRXN3 MDI-N3

RSTn
1.8/2.95V
MDIO_DATA MDIO
1.8/2.95V MDC
MDIO_CLK

ia
10/100/1000M
Ethernet

nt
Figure 16: Reference SGMII circuit with AR8033

e
For the BCM89820, Customers should provide 3.3V and 1.2V to power the external Ethernet PHY
id
system and the data interface of PHY. The current of 3.3V and 1.2V should be more than 100mA
and 150mA.

3.3.2 Reference schematic with BCM89820

f
on

BCM89820
SIM7800 Power @ 3.3V
VDD
Power @ 1.2V
DVDD
BroadR-Reach
C

0.1uF
SGMII_TX_P SIP
SGMII

0.1uF
SGMII_TX_M 0.1uF SIN
SGMII_RX_P SOP
SGMII_RX_M SON TRXD0+
0.1uF VMDIO=2.95V
om

VDD_1V8=1.8V
TRXD0-
1.5K
10K

ETH_INT_N 1.8V
INT
Control

1.8/2.95V
ETH_RST_N RSTn
1.8/2.95V
MDIO_DATA MDIO
1.8/2.95V
MDIO_CLK MDC
10/100M
C

Ethernet

Figure 17: Reference SGMII circuit with BCM89820

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3.4 UART Interface

3.4.1 7-wire UART1 interface

ile
MODULE provides a 7-wire UART1 (universal asynchronous serial transmission) interface as
DCE (Data Communication Equipment). AT commands and data transmission can be performed
through UART interface.

lF
The following figures show the reference design.

MODULE ( DCE) HOST ( DTE)

ia
TXD TXD
RXD RXD

nt
RTS RTS
UART1 UART
CTS CTS
DTR DTR
DCD
RI
e DCD
RING
id
Figure 18: UART full modem
f
on

MODULE ( DCE) HOST ( DTE)

TXD TXD
C

RXD RXD
RTS RTS
UART1 CTS CTS UART
DTR DTR
om

DCD DCD
Wake up host
RI RING
Interrupt
C

Figure 19: UART null modem

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The MODULE UART is 1.8V voltage interface. If user’s UART application circuit is 3.3V voltage
interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR
provided by Texas Instruments is recommended. The following figure shows the voltage matching
SI

reference design.

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 Smart Machine Smart Decision
VDD_1V8 or
External 1V8 3.3V
TXB0108RGYR
MODULE 100nF 100nF
VCCA VCCB
OE GND
TXD A1 B1 TXD_3.3V
RXD A2 B2 RXD_3.3V

ile
RTS A3 B3 RTS_3.3V
CTS A4 B4 CTS_3.3V
DTR A5 B5 DTR_3.3V
DCD A6 B6 DCD_3.3V
RI A7 B7 RI_3.3V
47K 47K
B8

lF
A8
UART1 port

Figure 20: Reference circuit of level shift

ia
To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect
MODULE to the RS-232-C interface, for example SP3238ECA, etc.
Note: MODULE supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200,

nt
38400, 57600, 115200, 230400, 460800, 921600, 3200000, 3686400. The default band rate is
115200bps.

3.4.2 RI and DTR Behavior

e
id
The RI pin can be driven to inform the host controller such as application CPU.
Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report
f
coming, and then it will change to low level. It will stay low until the host controller clears the
on

interrupted event with “AT+CRIRS” AT command.

RI Receiving SMS and any Clear by AT+CRIRS

Idle URC report coming.
HIGH AT+CFGRI=1
C

LOW
om

RI
Idle Receiving SMS . Clear by AT+CRIRS
HIGH AT+CFGRI=0

LOW
C

Figure 21: RI behaviour（SMS and URC report）

M

Normally RI will be kept at a high level until a voice call, then it will output periodic rectangular
SI

wave with 5900ms low level and 100ms high level. It will output this kind of periodic rectangular
wave until the call is answered or hung up.

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 Smart Machine Smart Decision

RI 5900ms 100ms
HIGH

ile
LOW
Idle Ring Establish Hang up Idle
the call the call

lF
Figure 22: RI behaviour（voice call）

Note: For more details of AT commands about UART, please refer to document [1] and [22].

ia
DTR pin can be used to wake MODULE from sleep. When MODULE enters sleep mode, pulling
down DTR can wake MODULE.

nt
3.4.3 4-wire UART2/UART3

e
MODULE provides two 4-wire UART interface. AT commands and data transmission can be
performed through UART interface.
id
The following figures show the reference design.
f
MODULE HOST/Device
on

TXD TXD
RXD RXD
C

RTS RTS
CTS CTS
UART UART
om

Figure 23: UART2/3 reference schematic

Note: MODULE supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200,
C

38400, 57600, 115200, 230400, 460800, 921600, 3200000, 3686400. The default band rate is
115200bps.
M

3.4.4 UART configuration

SI

All of the UARTs can be configured as SPI, I2C and GPIOs, the configuration are listed as
following:

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 Smart Machine Smart Decision

Default mode Mode 1 Mode 2 Mode 3 Mode 4 Mode 5

① ②
UART1/2/3 SPI UART +I2C UART +GPIO I2C+GPIO GPIOs

ile
TXD SPI_MOSI TXD TXD GPIO GPIO

lF
RXD SPI_MISO RXD RXD GPIO GPIO

CTS SPI_CS I2C_SDA GPIO I2C_SDA GPIO

ia
RTS SPI_CLK I2C_SCL GPIO I2C_SCL GPIO

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Table 10: UART configuration

e
①* For the UART1 and UART2, the maximum working frequency are 38MHz. Operating
id
multiple SPI ports concurrently at maximum speed might lead to bandwidth limitations.
Therefore, SIMCOM recommends opening a software case to verify operation.
f
②*UART3_TX and UART3_RX can be configured as Debug-UART to push out the log
on

information.
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3.5 SPI Interface

SIM7800CE/E provides a SPI interface as a master only. It provides a duplex, synchronous, serial

ile
communication link with peripheral devices. Its operation voltage is 1.8V, with clock rates up to 50
MHz
The SPI interface could also be configured as UART, I2C or GPIOs, which could refer to the Table
10 above.

lF
Note：For more details of the AT commands about the SPI, please refer to document [1].

ia
3.6 USB Interface with OTG

nt
The MODULE implements a USB interface compliant with the USB2.0 specification. The module
supports three USB speeds, namely low-speed (1.5Mbps), full-speed (12Mbps) and high-speed

e
(480Mbps).The OTG function is supported through the USB_OTG_EN by enabling the external
boost DCDC to power the USB device, but the USB charging function is not supported.
id
Note：The USB_DN and USB_DP nets must be traced by 90Ohm+/-10% differential impedance.
f
3.6.1 USB slave mode
on

MODULE can be used as a USB device. MODULE supports the USB suspend and resume
mechanism which can reduce power consumption. If there is no data transmission on the USB bus,
MODULE will enter suspend mode automatically, and will be resumed by some events such as
C

voice call, receiving SMS, etc.

The reference schematic is as following:
om

USB_VBUS VBUS

USB_DN USB_DN

USB_DP USB_DP
C

D3 C1 D2 D1
USB_ID
4.7uF <1pF
M

GND GND
SIM7800 USB
Slave Host
SI

Figure 24: USB (slave) reference circuit

Because of the high bit rate on USB bus, more attention should be paid to the influence of the
junction capacitance of the ESD component on USB data lines. Typically, the capacitance should
be less than 1pF. It is recommended to use an ESD protection component such as ESD9L5.0ST5G
SIM7800 Series_Hardware_Design _V1.01 41 2019-03-19
 Smart Machine Smart Decision
provided by On Semiconductor (www.onsemi.com ).
D3 is suggested to select the diode with anti-ESD and voltage surge function, or customer could
add a ZENER diode for surge clamping.

3.6.2 USB host mode

ile
MODULE can also be used as a USB host. SIM7800CE/E uses the USB_ID signal to detect the
USB host/slave mode. It will enter host mode if the USB_ID has been pulled down and the
USB_OTG_EN will output a high level at the same time. Customers could use this signal to enable

lF
the Boost DCDC to power the external USB device.
The reference schematic is as following:
VBAT
5V DCDC

ia
VIN
GND
USB_OTG_EN EN
VOUT

nt
VBUS VBUS

USB_DN USB_DN

USB_DP

e USB_DP
id
USB_ID USB_ID

GND GND
f
D2 D1
D3 C1
SIM7800 <1pF
USB
on

4.7uF

Host Device

Figure 25: USB (host) reference circuit

C
om

3.7 HSIC Interface

HSIC is a 2-signal source synchronous serial interface which uses 240MHz DDR signaling to
provide High-Speed 480Mbps USB transfers which are 100% host driver compatible with
C

traditional USB cable-connected topologies. Full-Speed (FS) and Low-Speed (LS) USB transfers
are not directly supported by the HSIC interface (a HSIC enabled hub can provide FS and LS
support, as well as IC_USB support)
M

The differences between HSIC and USB2.0 are listed below:

SI

Table 11: Key differences between HSIC and HS-USB

HSIC USB2.0
Signal-ended signaling at 1.2 V Differential signaling
Two signals – STROBE, DATA Four wires – Ground, D+, D-, VBUS
Double data rate signaling Data inferred from differential signaling

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 Smart Machine Smart Decision
HS-USB 480 Mbps only HS/FS/LS support
Maximum trace length of 10 cm Maximum cable length of 5 m
No HS chirp protocol HS chirp protocol
Lower power consumption (digital) Higher power consumption (analog)
No concept of disconnect Hot plug/play support

ile
SIM7800 implements a HSIC interface compliant with the HSIC1.0 specification which can be
used to connect to the external IC. And the HSIC could be transferred to USB2.0 by some
dedicated Hub Controller, in that case, you could regard SIM7800 as having two USB interfaces.

lF
Note: The SIM7800 HSIC can only work as the slave by default, if the host mode is needed,
please contact simcom for more details.

ia
3.8 USIM Interface

nt
MODULE supports both 1.8V and 3.0V USIM Cards.

e
Table 12: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V)
id
Symbol Parameter Min. Typ. Max. Unit
f
USIM_
LDO power output voltage 1.75 1.8 1.95 V
VDD
on

VIH High-level input voltage 0.65*USIM_VDD - USIM_VDD +0.3 V

VIL Low-level input voltage -0.3 0 0.35*USIM_VDD V

C

VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V

VOL Low-level output voltage 0 0 0.45 V

om

Table 13: USIM electronic characteristic 3.0V mode (USIM_VDD=2.95V)

Symbol Parameter Min. Typ. Max. Unit

USIM_
C

LDO power output voltage 2.75 2.95 3.05 V

VDD

VIH High-level input voltage 0.65*USIM_VDD - USIM_VDD +0.3 V

M

VIL Low-level input voltage -0.3 0 0.25*USIM_VDD V

VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V

SI

VOL Low-level output voltage 0 0 0.45 V

3.8.1 USIM Application Guide

It is recommended to use an ESD protection component such as ESDA6V1-5W6 produced by ST

SIM7800 Series_Hardware_Design _V1.01 43 2019-03-19
 Smart Machine Smart Decision
(www.st.com ) or SMF12C produced by ON SEMI (www.onsemi.com ). Note that the USIM
peripheral circuit should be close to the USIM card socket. The following figure shows the 6-pin
SIM card holder reference circuit.

USIM Socket
USIM_VDD

ile
USIM_RST VCC GND
22Ω
RST VPP
USIM_CLK 0Ω CLK I/O
Module
C707 10M006 512
USIM_DATA

lF
22Ω

22pF 22pF 22pF TVS

(NC) (NC) (NC) 100nF

ia
nt
Figure 26: USIM interface reference circuit

e
The USIM_DET pin is used for detection of the USIM card hot plug in. User can select the 8-pin
id
USIM card holder to implement USIM card detection function.

The following figure shows the 8-pin SIM card holder reference circuit.
f
on

VCC_1V8 47K

MOLEX - 91228
USIM_VDD
VCC GND
USIM_RST 22R RST VPP
MODULE
C

USIM_CLK 0R CLK I/O

USIM_DET 22R
PRESENCE Deserved
USIM_DATA 22R
USIM Card
om

TVS1

22pF 22pF 22pF 100nF

(NC) (NC) (NC)
C
M

Figure 27: USIM interface reference circuit with USIM_DET

If the USIM card detection function is not used, user can keep the USIM_DET pin open.
SI

SIM card circuit is susceptible, the interference may cause the SIM card failures or some other
situations, so it is strongly recommended to follow these guidelines while designing:
 Make sure that the SIM card holder should be far away from the antenna while in PCB
layout.
 SIM traces should keep away from RF lines, VBAT and high-speed signal lines.
SIM7800 Series_Hardware_Design _V1.01 44 2019-03-19
 Smart Machine Smart Decision
 The traces should be as short as possible.
 Keep SIM holder’s GND connect to main ground directly.
 Shielding the SIM card signal by ground.
 Recommended to place a 0.1～1uF capacitor on USIM_VDD line and keep close to the
holder.

ile
 The rise/fall time of USIM_CLK should not be more than 40ns.
 Add some TVS and the parasitic capacitance should not exceed 60pF.

lF
ia
e nt
f id
on
C
om
C
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 Smart Machine Smart Decision

3.9 I2S Interface

ile
MODULE provides an I2S interface for external codec, which comply with the requirements in the
Phillips I2S Bus Specifications

Table 14: I2S format

lF
Characteristics Specification

Line Interface Format Linear(Fixed)

ia
Data length 16bits(Fixed)
I2S Clock/Sync Source Master Mode(Fixed)

nt
I2S Clock Rate 1.536 MHz (Default)
I2S MCLK rate 12.288MHz (Default)
Data Ordering MSB

e
Note: For more details about I2S AT commands, please refer to document [1].
id
3.9.1 I2S timing
f
on

MODULE supports 48 KHz I2S sampling rate and 32 bit coding signal (16 bit word length), the
timing diagram is showed as following:
C
om
C

Figure 28: I2S timing

Table 15: I2S timing parameters

M

Signal Parameter Description Min. Typ. Max. Unit

SI

Frequency Frequency – 12.288 12.288 MHz

T Clock period 81.380 81.380 – ns
I2S_MCLK
t(HC) Clock high 0.45T – 0.55T ns
t(LC) Clock low 0.45T – 0.55T ns
I2S_CLK Frequency Frequency 8 48 48 KHz

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 Smart Machine Smart Decision
T Clock period 20.83 20.83 125 us
t(HC) Clock high 0.45T – 0.55T ns
t(LC) Clock low 0.45T – 0.55T ns
DIN/DOUT and WS input setup
t(sr) 16.276 – – ns

ile
time
DIN/DOUT and WS input hold
t(hr) 0 – – ns
time
I2S_WS

lF
DIN/DOUT and WS output
t(dtr) – – 65.10 ns
delay
DIN/DOUT and WS output
t(htr) 0 – – ns
hold time

ia
nt
3.9.2 I2S reference circuit

e
The following figure shows the external codec reference design.
VDD_1V8
3.3V 3.3V VDD_1V8
id
2.2K 2.2K
VDDA
I2C1_SCL VDDSPK
SCLK
I2C1_SDA VDDD
SDIO
f
I2S_DIN 2.2K
ADCOUT
on

I2S_DOUT MICBIAS
DACIN
MODULE I2S_WS 1uF
FS MIC+
I2S_CLK 1uF
BCLK MIC-
I2S_MCLK MIC
MCLK
2.2K
47uF
MOUT
C

33pF 47uF
NAU88U10
Receiver

Figure 29: Audio codec reference circuit

om

3.10 SD Interface

MODULE provides a 4-bit SD/MMC/eMMC interface with clock rate up to 200 MHz.
C

When connected to a SD or MMC card, the voltage of SD interface is 1.8/2.85V, which is

compatible with Secure Digital Physical Layer Specification version 3.0 and SDIO Card
M

Specification version 3.0.It supports up to 128GB SD cards.

When connected to a eMMC card, the interface voltage will be a single 1.8V, which is compatible
with eMMC Specification, version 4.5. It supports up to 128GB eMMC cards.
SI

Table 16: SD/MMC electronic characteristic as 2.85V (SD_DATA0-3 ， SD_CLK and

SD_CMD)

Symbol Parameter Min. Typ. Max. Unit

SIM7800 Series_Hardware_Design _V1.01 47 2019-03-19

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VIH High-level input voltage 0.65*2.85 - 2.85+0.3 V

VIL Low-level input voltage -0.3 0 0.25*2.85 V

VOH High-level output voltage 0.75*2.85 2.85 2.85 V

ile
VOL Low-level output voltage 0 0 0.15*2.85 V

Table 17: SD/MMC/eMMC electronic characteristic as 1.8V (SD_DATA0-3，SD_CLK and

lF
SD_CMD)

Symbol Parameter Min. Typ. Max. Unit

VIH High-level input voltage

ia
0.7*1.8 - 1.8+0.2 V

VIL Low-level input voltage -0.3 0 0.3*1.8 V

nt
VOH High-level output voltage 1.8-0.4 1.8 1.8 V

VOL Low-level output voltage 0 0 0.45 V

e
id
Customers should provide 2.85V to power SD card system and the current should more than
350mA, which is showed below as VCC_SD. ESD/EMI components should be arranged beside SD
card socket. Refer to the following application circuit.
f
VSD_IO VCC_SD

MicroSD
on

VDD_1V8
NC
NC

NC

NC
NC

NC

Card
100K

Module VCC
SD_CMD CMD
GND
C

SD_DATA3 DATA3
SD_DATA2 DATA2

SD_DATA1 DATA1
GND
SD_DATA0 DATA0
om

CLK COMMMON
SD_CLK

SD_DET DET_SW
100nF

TVS
TVS

TVS

TVS
TVS

TVS

100nF

4.7uF
C
M

Figure 30: SD reference circuit

SI

Customers should provide 2.85V to power eMMC card system and 1.8V to power the
SDIO_DATA/CMD/CLK signals. The source of 2.85V should be able to provide more than
500mA* which showed below as VCC_eMMC, as the source of 1.8V should be able to provide
more than 300mA* which showed below as VCCQ_1V8. ESD/EMI components should be
arranged close to the eMMC card. Refer to the following application circuit.

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VCC_eMMC VCC
VCC
eMMC

100nF
2.2uF
VCC

1uF
VCC

Module VCCQ_1V8
VCCQ_1V8 VCCQ
VCCQ

100nF
2.2uF
VCCQ
VCCQ

ile
VDDIM

47K
47K
47K
47K
47K
10K

100nF
1uF
SD_CMD CMD
RESOUT_N RST
SD_CLK CLK

lF
SD_DATA0 D0
SD_DATA1 D1
SD_DATA2 D2
SD_DATA3 D3
D4
D5
D6

VSSQ
VSSQ
VSSQ
ia VSSQ
D7

VSS
VSS
VSS
VSS
VSS
VSS
DS
TVS
TVS
TVS
TVS
TVS
TVS

100K
10K
10K
10K
10K

nt
Figure 31: eMMC reference circuit

e
*NOTE: For the current of VCC_eMMC and VCCQ_1V8, customers should better refer to the
id
related datasheet of eMMC which is used. The listed current of 500mA and 300mA are just for
your reference.
f
on

SD/MMC/eMMC card layout guide lines:

● Protect SD card signals from noisy signals (clocks, SMPS, etc.).
● Up to 200 MHz clock rate, 50 Ω nominal, ±10% trace impedance
● CLK to DATA/CMD length matching < 1 mm
C

● Total routing length < 50 mm

● Spacing to all other signals = 2x line width
● Bus capacitance < 10 pF
om

3.11 I2C Interface

C

MODULE provides an I2C interface compatible with I2C specification, version 5.0, with clock rate
up to 400 kbps. Its operation voltage is 1.8V.
M

The following figure shows the I2C bus reference design.

SI

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VDD_1V8

2.2K

2.2K
I2C_SCL SCL

ile
I2C_SDA SDA

GND GND
Module I2C device

lF
Figure 32: I2C reference circuit

ia
Note：SDA and SCL have no pull-up resistors in MODULE. So, 2 external pull up resistors are
necessary in application circuit.

nt
“AT+CRIIC and AT+CWIIC” AT commands could be used to read/write register values of the
I2C peripheral devices. For more details about AT commands please refer to document [1].

e
id
3.12 SDIO Interface
f
MODULE provides a 4-bit 1.8V SDIO interface compliance to SDIO3.0 version which support up
on

to 200MHz.
The SDIO interface can be used for WLAN solution. The default WLAN MODULE is W59,
however, the application need software support.
The interfaces of W59 and SIM7800 are listed below:
C

Table 18:The interfaces of SIM7800 and W59

om

SIM7800 W59
Default Default
Pin name Pin No. Pin name Pin No.
status status
SDIO_DATA0 A9 DIO SDIO_DATA0 26 DIO

SDIO_DATA1 A7 DIO SDIO_DATA1 25 DIO

C

SDIO_DATA2 B8 DIO SDIO_DATA2 24 DIO

M

SDIO_DATA3 A5 DIO SDIO_DATA3 23 DIO

SDIO_CMD A11 DIO SDIO_CMD 28 DIO

SI

SDIO_CLK B10 DO SDIO_CLK 27 DI

GPIO36/COEX_TX K3 DO LTE_RXD 6 DI

FORCE_USB_BOOT
H3 DI LTE_TXD 5 DO
/COEX_RX

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GPIO38/WLAN_EN C1 DO WLAN_EN 9 DI

PMD_GPIO6/SLEEP
F3 DO 32KHz 4 DI
_CLK

PMD_GPIO2/BT_EN G1 DO BT_EN 2 DI

ile
I2S_CLK M3 DO PCM_CLK 13 DI

I2S_DOUT P3 DO PCM_IN 14 DI

lF
I2S_WS N1 DO PCM_SYNC 15 DI

I2S_DIN L1 DI PCM_OUT 16 DO

UART2_CTS C1 DI UART_RTS 17 DO

ia
UART2_RXD T41 DI UART_TXD 18 DO

nt
UART2_TXD P41 DO UART_RXD 19 DI

UART2_RTS F3 DO UART_CTS 20 DI

VDD_1V8 B36 PO

e VDDIO_XTAL
VDD18
10
11
PI
PI
id
PMD_GPIO3/WLAN
J1 DO
_3V_EN
f
on

SIM7800 VBAT W59

Control VIN
PMD_GPIO3/WLAN_3V_EN EN VOUT VDD_3V3
C

DCDC
PMD_GPIO6/SLEEP_CLK WLAN_SLEEP_CLK
32KHZ
GPIO36/COEX_TX LTE_RXD
FORCE_USB_BOOT/ LTE_TXD
COEX_RX
om

GPIO38/WLAN_EN WLAN_EN
SDIO_DATA0 SDIO_DATA0
SDIO_DATA1 SDIO_DATA1
WLAN SDIO_DATA2 SDIO_DATA2
SDIO_DATA3 SDIO_DATA3
C

SDIO_CMD SDIO_CMD
SDIO_CLK SDIO_CLK

UART2_RTS UART_CTS
M

UART2_RXD UART_TXD
BT_UART
UART2_TXD UART_RXD
UART2_CTS UART_RTS
BT PMD_GPIO2/BT_EN BT_EN
SI

I2S_WS PCM_SYNC
I2S_DIN PCM_OUT
BT_PCM
I2S_CLK PCM_CLK
I2S_DOUT PCM_IN

Figure 33: SDIO reference circuit with W59 Module

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Note: For more details, please refer to the “SIM7800+W59 reference design”

3.13 Network status

ile
The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the
following figure.

lF
VBAT

ia
R

nt
Module
4.7K
NETLIGHT

e
f id 47K
on

Figure 34: NETLIGHT reference circuit

C

Note: The value of the resistor named “R” depends on the LED characteristic.
The default status of netlight signal is always low, and the users could define the timing sequence
of netlight by their own.
om

The recommended timing sequence is as followed:

Table 19: NETLIGHT pin status

NETLIGHT pin status Module status

C

Always On Searching Network; Call Connect(include VOLTE,SRLTE)

200ms ON, 200ms OFF Data Transmit; 4G registered;
M

800ms ON, 800ms OFF 2G/3G registered network

OFF Power off ;Sleep
SI

Note: NETLIGHT output low level as “OFF”, and high level as “ON”.

3.14 Flight Mode Control

The FLIGHTMODE pin can be used to control MODULE to enter or exit the Flight mode. In
Flight mode, the RF circuit is closed to prevent interference with other equipments and minimize
SIM7800 Series_Hardware_Design _V1.01 52 2019-03-19
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current consumption. Bidirectional ESD protection component is suggested to add on
FLIGHTMODE pin, its reference circuit is shown in the following figure.

VDD_1V8

ile
4.7K

Switch

lF
FLIGHTMODE

4.7K

ia
Module

nt
Figure 35: Flight mode switch reference circuit

e
id
Table 20: FLIGHTMODE pin status
f
FLIGHTMODE pin status Module operation
on

Input Low Level Flight Mode: RF is closed

AT+CFUN=0: RF is closed
Input High Level
AT+CFUN=1:RF is working
C

3.15 Other interface

om

3.15.1 ADC

MODULE has 3 dedicated ADC pins named ADC0, ADC1 and ADC2.They are available for
C

digitizing analog signals such as battery voltage and so on. These electronic specifications are
shown in the following table.
M

Table 21: ADC0, ADC1 and ADC2 electronic characteristics

Characteristics Min. Typ. Max. Unit

SI

Resolution – 15 – Bits
Conversion time – 442 – us
Input Range 0.1 1.7 V
Input serial resistance 1 – – MΩ
Note: “AT+CADC=2”, “AT+CADC1=2” and “AT+CADC2=2” can be used to read the voltage of
the ADC0, ADC1 and ADC2 pins, for more details, please refer to document [1].
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3.15.2 LDO

SIM7800CE/E has a LDO power output, named VDD_1V8. The LDO is available once the module

ile
is powered on and the output voltage is 1.8V by default, rated for 50mA.

Table 22: Electronic characteristic

lF
Symbol Description Min. Typ. Max. Unit
VO Output voltage 1.71 1.8 1.89 V
IO Output current - - 50 mA

ia
e nt
f id
on
C
om
C
M
SI

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4 RF Specifications

ile
4.1 GSM/UMTS/LTE RF Specifications

Table 23: Conducted transmission power

lF
Frequency Power Min.
EGSM900 33dBm ±2dB 5dBm ± 5dB
DCS1800 30dBm ±2dB 0dBm ± 5dB

ia
EGSM900 (8-PSK) 27dBm ±3dB 5dBm ± 5dB
DCS1800 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB
WCDMA B1 24dBm +1/-3dB <-50dBm

nt
WCDMA B5 24dBm +1/-3dB <-50dBm
WCDMA B8 24dBm + 1/-3dB <-50dBm
LTE-FDD B1 23dBm +/-2.7dB <-40dBm
LTE-FDD B3
LTE-FDD B5
23dBm +/-2.7dB
23dBm +/-2.7dB
e <-40dBm
<-40dBm
LTE-FDD B7 23dBm +/-2.7dB
id <-40dBm
LTE-TDD B8 23dBm +/-2.7dB <-40dBm
LTE-FDD B20 23dBm +/-2.7dB <-40dBm
f
LTE-FDD B28 23dBm +/-2.7dB <-40dBm
on

LTE-TDD B38 23dBm +/-2.7dB <-40dBm

LTE-TDD B39 23dBm +/-2.7dB <-40dBm
LTE-TDD B40 23dBm +/-2.7dB <-40dBm
LTE-TDD B41 23dBm +/-2.7dB <-40dBm
C

Table 24: Operating frequencies

om

Frequency Receiving Transmission

EGSM900 925～960MHz 880～915 MHz
DCS1800 1805～1880 MHz 1710～1785 MHz
WCDMA B1 2110～2170 MHz 1920～1980 MHz
C

WCDMA B5 869～894 MHz 824～849 MHz

WCDMA B8 925～960 MHz 880～915 MHz
M

The LTE Operating frequencies are shown in the following table 22.
Note: Operating frequencies of LTE TDD B41 for the MODULE is 100MHz BW, 2555～2655 MHz
GPS 1574.4 ～1576.44 MHz -
SI

GLONASS 1598 ～1606 MHz -

BD 1559 ～1563 MHz

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Table 25: E-UTRA operating bands

E-UTRA Duplex
Uplink (UL) operating band Downlink(DL) operating band
operating band Mode
1 1920 ~1980 MHz 2110 ~2170 MHz FDD

ile
3 1710 ~1785 MHz 1805 ~1880 MHz FDD
5 824～849 MHz 869～894 MHz FDD
7 2500~2570MHz 2620~2690 MHz FDD

lF
8 880 ~915 MHz 925 ~960 MHz FDD
20 832~862MHz 791~ 821 MHz FDD
38 2570 ~2620 MHz 2570 ~2620 MHz TDD

ia
39 1880~1920MHz 1880~1920MHz TDD
40 2300 ~2400 MHz 2300 ~2400 MHz TDD

nt
41 2496 ~2690 MHz 2496 ~2690 MHz TDD

Table 26: Conducted receive sensitivity

e
id
Frequency Receive sensitivity(Typical) Receive sensitivity(MAX)
EGSM900 < -109dBm 3GPP
f
DCS1800 < -109dBm 3GPP
on

WCDMA 2100 < -110dBm 3GPP

WCDMA 900 < -110dBm 3GPP
WCDMA 800 < -110dBm 3GPP
C

LTE FDD/TDD See table 24. 3GPP

Table 27: Reference sensitivity (QPSK)

om

E-UTRA 3GPP standard Test value 3GPP standard

band 1.4MHz 3MHz 5MHz 10MHz 10MHz 10 MHz 15 MHz 20 MHz
1 - - -100 -97 -99.3 -102.3 -95.2 -94
C

3 -101.7 -98.7 -97 -94 -99.5 -103.2 -92.2 -91

5 -103.2 -100.2 -98 -95 -99.5 -102.2
M

7 -98 -95 -98 -101.3 -93.2 -92

8 -102.2 -99.2 -97 -94 -99.7 -102.5
SI

20 -97 -94 -98 -99.5 -91.2 -90

38 - - -100 -97 -98 -100.2 -95.2 -94
39 -100 -97 -99 -101.5 -95.2 -94
40 - - -100 -97 -98.5 -101.3 -95.2 -94
41 - - -98 -95 -98 -100.2 -93.2 -92

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Note: The test value of above row has shown two ways of data, the first line is main antenna receiver
sensitivity; another is two antennas’ sensitivity.

ile
4.2 GSM /UMTS/LTE Antenna Design Guide

Users should connect antennas to MODULE’s antenna pads through micro-strip line or other types

lF
of RF trace and the trace impedance must be controlled in 50Ω. SIMCom recommends that the
total insertion loss between the antenna pads and antennas should meet the following requirements:

Table 28: Trace loss

ia
Frequency Loss
700MHz-960MHz <0.5dB

nt
1710MHz-2170MHz <0.9dB
2300MHz-2650MHz <1.2dB

e
To facilitate the antenna tuning and certification test, a RF connector and an antenna matching
id
circuit should be added. The following figure is the recommended circuit.
f
on

MAIN ANT

RF connector
Matching circuit
ANT_MAIN
C

R1 R2
GND C1 C2 D1
om

MODULE
C

Figure 36: Antenna matching circuit (ANT_MAIN)

M

In above figure, the components R1, C1, C2 and R2 are used for antenna matching, the values of
components can only be achieved after the antenna tuning and usually provided by antenna vendor.
SI

By default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component
D1 is a TVS for ESD protection, and it is optional for users according to application environment.
The RF test connector is used for the conducted RF performance test, and should be placed as close
as to the MODULE’s ANT_MAIN pin. The traces impedance between MODULE and antenna
must be controlled in 50Ω.

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Diversity antenna

ile
Matching circuit
ANT_DIV
R3 R4
GND C3 C4 D2

lF
MODULE

ia
Figure 37: Antenna matching circuit (ANT_DIV)

nt
In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4
are 0Ωresistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is

e
optional for users according to application environment.
Two TVS are recommended in the table below.
id
Table 29: Recommended TVS
f
Package Part Number Vender
on

0201 LXES03AAA1-154 Murata

0402 LXES15AAA1-153 Murata

Note：SIMCom suggests the LTE auxiliary antenna to be kept on, since there are many high
C

bands in the designing of LTE-TDD, such as band38, band40 and band41. Because of the high
insert loss of the RF cable and layout lines, the receiver sensitivity of these bands above will have
risk to meet the authentication without the diversity antenna. For more details about auxiliary
om

antenna design notice, please refer to document [25].

4.3 GNSS Receiver

C

MODULE merges GNSS (GPS/GLONASS/BD) satellite and network information to provide a

high-availability solution that offers industry-leading accuracy and performance. This solution
M

performs well, even in very challenging environmental conditions where conventional GNSS
receivers fail, and provides a platform to enable wireless operators to address both location-based
services and emergency mandates.
SI

SIM7800 series supports Qualcomm GpsOneXTRA technology which allows to download XTRA
file from the internet server to enhance the TTFF，XTRA file contains predicted GPS and
GLONASS satellite coordinates and clock biases valid for up to7days. It is the best if XTRA file is
downloaded every 7 days. For customers with high precision requirements, the recommended
interval is 3 days. It also supports SBAS (including EGNOS/MSAS/QZSS/WAAS/GAGAN) that can
improve fix accuracy.
SIM7800 Series_Hardware_Design _V1.01 58 2019-03-19
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4.3.1 GNSS Technical specification

ile
Table 30: GPS Performance

Parameter Specification Conditions Type

Assigned to GPS 52 28 Channels(Glonass)

lF
Channels 16 Channels(BDs)
Receiver type GPS L1 frequency, C/A
Code
SBAS:EGNOS/MSAS/QZSS/WA

ia
AS/GAGAN
Cold Start @open sky Autonomous <35s
Time-To-First-Fix
Hot Start @open sky Autonomous <2s

nt
Tracking Static -160dBm
Sensitivity Re-acquisition Static -156dBm

Automatic Update rate

Cold-start

e Static -148dBm
1Hz
id
Accuracy CEP50@open Sky <1.5m
GNSS Current Total on VBAT 100mA
GSM/UMTS/LTE Sleep
f
consumption pins
on

 GPS L1 Frequency: 1575.42±1.023MHz

 GLONASS: 1597.5~1605.8 MHz
 BD: 1559.05~1563.14 MHz

C

GNSS data format: NMEA-0183

GPS Test requirement Note:

om

1. All satellites start at -130 dBm.

2. Wait 5minutes after successful positioning.

3. Down to -150dbm while testing tracking Sensitivity, waiting for 30 seconds, recording the
average signal to noise ratio of the satellite.
C

4.3.2 GNSS Application Guide

M

Users can adopt an active antenna to MODULE.

The reference design is as follows
SI

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GNSS
Active
10R
LDO Antenna

ile
47NH
Matching circuit
GNSS GNSS_ANT
Processor 22pF
R101 0R

lF
GND
C101 C102

SIM7800 MN NM TVS

ia
nt
Figure 38: Active antenna circuit

e
id
In above figures, the components C101, C102,R101 are used for antenna matching. Usually, the
values of the components can only be achieved after antenna tuning and usually provided by
antenna vendor..
f
GNSS can be tested by NMEA port. NMEA sentences can be obtained through UART or USB
on

automatically. NMEA sentences include GSV, GGA, RMC, GSA, and VTG. Before using GNSS,
user should configure MODULE in proper operating mode by AT command. Please refer to related
documents for details. MODULE can also get position location information through AT directly.
C

Note: GNSS is closed by default and can be started by AT+CGPS. The AT command has two
parameters, the first is on/off, and the second is GNSS mode. Default mode is standalone mode.
om
C
M
SI

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5 Electrical Specifications

ile
5.1 Absolute maximum ratings

Absolute maximum rating for digital and analog pins of MODULE are listed in the following table:

lF
Table 31: Absolute maximum ratings

ia
Parameter Min. Typ. Max. Unit
Voltage at VBAT -0.5 - 6.0 V
Voltage at USB_VBUS -0.5 - 6.0 V

nt
Voltage at digital pins
-0.3 - 2.1 V
(RESET,SPI,GPIO,I2C,UART,SDIO,I2S)
Voltage at digital pins (SD,USIM) -0.3 - 3.05 V
Voltage at PWRKEY

e -0.3 - 2.1
id
5.2 Operating conditions
f
on

Table 32: Recommended operating ratings

Parameter Min. Typ. Max. Unit

Voltage at VBAT 3.3 3.8 4.3 V
C

Voltage at USB_VBUS 3.0 5.0 5.25 V

Table 33: 1.8V Digital I/O characteristics*

om

Parameter Description Min. Typ. Max. Unit

VIH High-level input voltage 1.17 1.8 2.1 V

VIL Low-level input voltage -0.3 0 0.63 V

C

VOH High-level output voltage 1.35 - 1.8 V

VOL Low-level output voltage 0 - 0.45 V

M

High-level output current(no

IOH - 2 - mA
pull down resistor)
SI

Low-level output current(no pull

IOL - -2 - mA
up resistor)
Input high leakage current (no
IIH - - 1 uA
pull down resistor)

IIL Input low leakage current(no -1 - - uA

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 Smart Machine Smart Decision
pull up resistor)
*Note: These parameters are for digital interface pins, such as UART, SPI, SDIO, SD, I2C, I2S,
USB_ID, GRFC and GPIOs (NETLIGHT, FLIGHTMODE, STATUS, USIM_DET, SD_DET).

ile
The operating temperature of MODULE is listed in the following table.

Table 34: Operating temperature

lF
Parameter Min. Typ. Max. Unit
Normal operation temperature -30 25 80 ℃
Extended operation temperature* -40 25 85 ℃
Storage temperature -45 25 +90 ℃

ia
*Note: Module is able to make and receive voice calls, data calls, SMS and make GSM/
UMTX/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from the 3GPP

nt
specifications if the temperature is outside the normal operating temperature range and still
within the extreme operating temperature range.

5.3 Operating Mode

e
id
5.3.1 Operating Mode Definition
f
The table below summarizes the various operating modes of MODULE product.
on

Table 35: Operating mode Definition

Mode
C

Function
AT command “AT+CSCLK=1” can be used to set the module to a
GSM /UMTS/LTE sleep mode. In this case, the current consumption of module will be
Sleep reduced to a very low level and the module can still receive paging
om

message and SMS.

GSM/UMTS/LTE Software is active. Module is registered to the network, and the
Idle
Normal operation

MODULE is ready to communicate.

Connection between two subscribers is in progress. In this case, the
C

GSM/UMTS/LTE
power consumption depends on network settings such as DTX off/on,
Talk
FR/EFR/HR, hopping sequences, and antenna.
M

Module is ready for data transmission, but no data is currently sent or

GPRS/EDGE/
received. In this case, power consumption depends on network
UMTS/LTE Standby
settings.
SI

GPRS/EDGE/ There is data transmission in progress. In this case, power

UMTS/LTE consumption is related to network settings (e.g. power control level);
Data transmission uplink/downlink data rates, etc.
Minimum functionality AT command “AT+CFUN=0” can be used to set the MODULE to a
mode minimum functionality mode without removing the power supply. In

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 Smart Machine Smart Decision
this mode, the RF part of the MODULE will not work and the USIM
card will not be accessible, but the serial port and USB port are still
accessible. The power consumption in this mode is lower than normal
mode.

ile
AT command “AT+CFUN=4” or pulling down the FLIGHTMODE
pin can be used to set the MODULE to flight mode without removing
Flight mode the power supply. In this mode, the RF part of the MODULE will not
work, but the serial port and USB port are still accessible. The power

lF
consumption in this mode is lower than normal mode.
Module will go into power off mode by sending the AT command
“AT+CPOF” or pull down the PWRKEY pin, normally. In this mode
Power off

ia
the power management unit shuts down the power supply, and
software is not active. The serial port and USB are is not accessible.

nt
5.3.2 Sleep mode

e
In sleep mode, the current consumption of MODULE will be reduced to a very low level, and
MODULE can still receive paging message and SMS.
id
Several hardware and software conditions must be satisfied together in order to let MODULE enter
into sleep mode:
f
1. UART condition
on

2. USB condition
3. Software condition
Note: Before designing, pay attention to how to realize sleeping/waking function and refer to
Document [26] for more details.
C

5.3.3 Minimum functionality mode and Flight mode

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Minimum functionality mode ceases a majority function of MODULE, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality
levels.
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● AT+CFUN=0: Minimum functionality

● AT+CFUN=1: Full functionality (Default)
● AT+CFUN=4: Flight mode
M

If MODULE has been set to minimum functionality mode, the RF function and USIM card
function will be closed. In this case, the serial port and USB are still accessible, but RF function
SI

and USIM card will be unavailable.

If MODULE has been set to flight mode, the RF function will be closed. In this case, the serial port
and USB are still accessible, but RF function will be unavailable.
When MODULE is in minimum functionality or flight mode, it can return to full functionality by
the AT command “AT+CFUN=1”.

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5.4 Current Consumption

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The current consumption is listed in the table below.

Table 36: Current consumption on VBAT Pins (VBAT=3.8V)

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GNSS
GNSS supply current
@ -140dBm，Tracking Typical:42mA
(AT+CFUN=0,with USB connection)
GSM sleep/idle mode

ia
Sleep mode@ BS_PA_MFRMS=2 Typical: 1.81mA
GSM/GPRS supply current Sleep mode@ BS_PA_MFRMS=5 Typical: 1.33mA

nt
(GNSS off，without USB connection) Sleep mode@ BS_PA_MFRMS=9 Typical: 1.15mA
Idle mode@ BS_PA_MFRMS=2 Typical: 14.51mA
UMTS sleep/idle mode
WCDMA supply current
(GNSS off，without USB connection)
e
Sleep mode @DRX=9 Typical: 3.3mA
Idle mode @DRX=9 Typical: 13.87mA
id
TD-SCDMA supply current Sleep mode Typical: 1.44mA
(GNSS off，without USB connection) Idle mode Typical: 13.79mA
f
EVDO supply current Sleep mode Typical: 1.23mA
on

(GNSS off，without USB connection) Idle mode : 14.95mA

LTE sleep/idle mode
LTE FDD supply current Sleep mode Typical: 1.84mA
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(GNSS off，without USB connection) Idle mode Typical: 14.28mA

LTE TDD supply current Sleep mode Typical: 2.56mA
(GNSS off，without USB connection) Idle mode Typical: 14.09mA
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GSM Talk
EGSM900 @power level #5 Typical: 282mA
DCS1800 @power level #5 Typical: 187mA
UMTS Talk
WCDMA B1 @Power 24dBm Typical: 611mA
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WCDMA B5 @Power 24dBm Typical: 566mA

WCDMA B8 @Power 24dBm Typical: 498mA
M

TD-SCDMA 1900 @Power 24dBm Typical: 140mA

TD-SCDMA 2100 @Power 24dBm Typical: 142mA
GPRS
SI

EGSM900( 1 Rx,4 Tx ) @power level #5 Typical: 523mA

DCS1800( 1 Rx,4 Tx ) @power level #0 Typical: 412mA
EGSM900( 3Rx, 2 Tx ) @power level #5 Typical: 390mA
DCS1800( 3Rx, 2 Tx ) @power level #0 Typical: 272mA
EDGE
EGSM900( 1 Rx,4 Tx ) @power level #8 Typical: 387mA

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DCS1800( 1 Rx,4 Tx ) @power level #2 Typical: 391mA
EGSM900( 3Rx, 2 Tx ) @power level #8 Typical: 249mA
DCS1800( 3Rx, 2 Tx ) @power level #2 Typical: 236mA
HSDPA data
WCDMA B1 @Power 24dBm Typical: TBD

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WCDMA B5 @Power 24dBm Typical: TBD
WCDMA B8 @Power 24dBm Typical: TBD
LTE data
@5Mbps 23.1dBm Typical: 680mA

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LTE-FDD B1 @10Mbps 23.0dBm Typical: 699mA
@20Mbps 23.2dBm Typical: 710mA
@5Mbps 22.3dBm Typical: 620mA
LTE-FDD B3 @10Mbps 22.5dBm Typical: 637mA

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@20Mbps 22.7dBm Typical: 647mA
@5Mbps 23.3dBm Typical: 593mA
LTE-FDD B5 @10Mbps 23.4dBm Typical: 567mA

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@20Mbps 22.1dBm Typical: 630mA
@5Mbps 23.0dBm Typical: 699mA
LTE-FDD B7 @10Mbps 23.1dBm Typical: 704mA
@20Mbps 23.1dBm Typical: 750mA
LTE-FDD B8
e
@5Mbps
@10Mbps
23.1dBm
23.4dBm
Typical: 547mA
Typical: 582mA
id
@5Mbps 21.8dBm Typical: 556mA
LTE-FDD B20 @10Mbps 21.8dBm Typical: 582mA
@20Mbps 21.8dBm Typical: 630mA
f
@5Mbps 21.8dBm Typical: TBD
on

LTE-FDD B28 @10Mbps 21.8dBm Typical: TBD

@20Mbps 21.8dBm Typical: TBD
@5Mbps 23.2dBm Typical : 396mA
LTE-TDD B38 @10Mbps 23.3dBm Typical : 405mA
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@20Mbps 23.3dBm Typical : 429mA

@5Mbps 22.7dBm Typical : 297mA
LTE-TDD B39 @10Mbps 22.9dBm Typical : 308mA
@20Mbps 22.8dBm Typical : 337mA
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@5Mbps 22.9dBm Typical : 458mA

LTE-TDD B40 @10Mbps 23.0dBm Typical : 452mA
@20Mbps 22.9dBm Typical : 500mA
@5Mbps 23.1dBm Typical : 391mA
LTE-TDD B41 @10Mbps 23.1dBm Typical : 403mA
@20Mbps 23.0dBm Typical : 435mA
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5.5 ESD Notes

SI

MODULE is sensitive to ESD in the process of storage, transporting, and assembling. When
MODULE is mounted on the users’ mother board, the ESD components should be placed beside
the connectors which human body may touch, such as USIM card holder, SD card holder, audio
jacks, switches, USB interface, etc. The following table shows the MODULE ESD measurement
performance without any external ESD component.

Table 37: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)
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Part Contact discharge Air discharge
VBAT,GND +/-6K +/-12K
Antenna port +/-5K +/-10K
USB +/-4K +/-8K

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PWRKEY、RESET_N +/-4K +/-8K
UART +/-3K +/-6K
USIM Card +/-3K +/-6K

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Other PADs +/-3K +/-6K

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6 SMT Production Guide

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6.1 Top and Bottom View of MODULE

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Figure 39: Top and bottom view of MODULE

6.2 Typical SMT Reflow Profile

f
on

SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.
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Figure 40: The ramp-soak-spike reflow profile of MODULE

Note: For more details about secondary SMT, please refer to the document [21].

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6.3 Moisture Sensitivity Level (MSL)

MODULE is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC

J-STD-033. If the prescribed time limit is exceeded, users should bake MODULE for 192 hours in

ile
drying equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.

Table 38: Moisture Sensitivity Level and Floor Life

lF
Moisture Sensitivity Level Floor Life (out of bag) at factory ambient≤30°C/60% RH or as
(MSL) stated

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1 Unlimited at ≦30℃/85% RH
2 1 year
2a 4 weeks

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3 168 hours
4 72 hours
5 48 hours

e
5a 24 hours
id
6 Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
f
NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.
on

6.4 Stencil Foil Design Recommendation

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The recommended thickness of stencil foil is more than 0.15mm.

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7 Packaging

MODULE support tray packaging.

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Figure 41: packaging diagram

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Module tray drawing：

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Figure 42: Tray drawing

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Table 39: Tray size

Length（±3mm） Width（±3mm） Number

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241.5 161.0 15
Small carton drawing：

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Figure 43: Small carton drawing
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Table 40: Small Carton size
on

Length（±10mm） Width（±10mm） Height（±10mm） Number

270 180 120 8*16-3=125
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Big carton drawing：

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Figure 44: Big carton drawing

Table 41: Big Carton size

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Length（±10mm） Width（±10mm） Height（±10mm） Number
380 280 280 125*4=500

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Appendix

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A. Reference Design

Refer to < SIM7800CE/E Reference Design V1.X.pdf > for the details.

ia
USB Host/Slave
USB2.0 with OTG

MicroSD card/
4bit SD Interface
eMMC card

nt
ANT_MAIN
4bit SDIO Interface
ANT0
W59 Module
WIFI & BT Control signal
(WIFI+BT)
ANT1 4-wire BT UART2

SIM7800
e
Transformer

Ethernet Ethernet PHY

RJ-45
10M/100M/1000M 8-wire TRX IC AR8031/8033
(1000Mbps industrial) SGMII

Control signal
id
ECU
2-wire TRX
BroadR-Reach copper-line
10M/100M
IC BCM89820
(100Mbps automotive) (MDIO) Standard Version
ANT_DIV
UIM Card (3V/1.8V)
f
External I2C1
on

Audio Codec I2S

HSIC
7-Wire UART1

Host or device 4-wire UART3/ SPI/ I2C+GPIO ANT_GNSS

with UART/SPI/I2C
C

interface 4-wire UART4/ SPI/ I2C+GPIO

1KR STATUS
VBAT
LED 4.7K

47K
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NETLIGHT
1KR
VBAT
LED
>2.5s Power Down

4.7K
>500ms Power up

47K

FLIGHTMODE
>100ms

GPIOs
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PWRKEY
RESET

VBAT_RF
VBAT_BB
VDD_1V8
ADC2
ADC1
ADC0

GND
M

RESET impulse 4.7K 4.7K

Battery
PWRKEY impulse 47K
47K
SI

Figure 45: Standard MODULE reference schematic

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USB Host/Slave
USB2.0 with OTG

MicroSD card/
4bit SD Interface
eMMC card

ANT_MAIN
4bit SDIO Interface
ANT0
W59 Module
WIFI & BT Control signal
(WIFI+BT)

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ANT1

SIM7800
4-wire BT UART2
Transformer

Ethernet Ethernet PHY

RJ-45
10M/100M/1000M 8-wire TRX IC AR8031/8033
(1000Mbps industrial) SGMII

Control signal
Special Version
IC BCM89820

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2-wire TRX (MDIO)
ECU BroadR-Reach copper-line (100Mbps automotive)
10M/100M
(Codec integrated) ANT_DIV
UIM Card (3V/1.8V)

Device with I2C1

I2C interface I2C2
(Address 0x34 used internal)

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HSIC
7-Wire UART1

Test point 2-wire Debug UART3

ANT_GNSS

nt
Receiver

Microphone

e
1KR STATUS
VBAT
LED 4.7K

47K
id
1KR
NETLIGHT
PWRKEY >2.5s Power Down

VBAT
>500ms Power up

LED 4.7K
FLIGHTMODE
f
47K

GPIOs
>100ms
on

I2S/GPIOs
RESET

VBAT_RF
VBAT_BB
VDD_1V8
ADC2
ADC1
ADC0

GND
C

RESET impulse 4.7K 4.7K

Battery
PWRKEY impulse 47K
47K
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Figure 46: Special MODULE reference schematic

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B. Coding Schemes and Maximum Net Data Rates over Air Interface
M

Table 42: Coding Schemes and Maximum Net Data Rates over Air Interface

Multislot definition(GPRS/EDGE)
SI

Slot class DL slot number UL slot number Active slot number

1 1 1 2
2 2 1 3
3 2 2 3
4 3 1 4
5 2 2 4
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6 3 2 4
7 3 3 4
8 4 1 5
9 3 2 5
10 4 2 5

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11 4 3 5
12 4 4 5
GPRS coding scheme Max data rata（4 slots） Modulation type

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CS 1 = 9.05 kb/s / time slot 36.2 kb/s GMSK
CS 2 = 13.4 kb/s / time slot 53.6 kb/s GMSK
CS 3 = 15.6 kb/s / time slot 62.4 kb/s GMSK

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CS 4 = 21.4 kb/s / time slot 85.6 kb/s GMSK

EDGE coding scheme Max data rata（4 slots） Modulation type

MCS 1 = 8.8 kb/s/ time slot 35.2 kb/s GMSK

nt
MCS 2 = 11.2 kb/s/ time slot 44.8 kb/s GMSK
MCS 3 = 14.8 kb/s/ time slot 59.2 kb/s GMSK
MCS 4 = 17.6 kb/s/ time slot
MCS 5 = 22.4 kb/s/ time slot
70.4 kb/s
89.6 kb/s
e GMSK
8PSK
id
MCS 6 = 29.6 kb/s/ time slot 118.4 kb/s 8PSK
MCS 7 = 44.8 kb/s/ time slot 179.2 kb/s 8PSK
f
MCS 8 = 54.4 kb/s/ time slot 217.6 kb/s 8PSK
on

MCS 9 = 59.2 kb/s/ time slot 236.8 kb/s 8PSK

HSDPA device category Max data rate（peak） Modulation type

Category 1 1.2Mbps 16QAM,QPSK
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Category 2 1.2Mbps 16QAM,QPSK

Category 3 1.8Mbps 16QAM,QPSK
Category 4 1.8Mbps 16QAM,QPSK
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Category 5 3.6Mbps 16QAM,QPSK

Category 6 3.6Mbps 16QAM,QPSK
Category 7 7.2Mbps 16QAM,QPSK
Category 8 7.2Mbps 16QAM,QPSK
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Category 9 10.2Mbps 16QAM,QPSK

Category 10 14.4Mbps 16QAM,QPSK
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Category 11 0.9Mbps QPSK

Category 12 1.8Mbps QPSK
SI

Category 13 17.6Mbps 64QAM

Category 14 21.1Mbps 64QAM
Category 15 23.4Mbps 16QAM
Category 16 28Mbps 16QAM
Category 17 23.4Mbps 64QAM

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Category 18 28Mbps 64QAM
Category 19 35.5Mbps 64QAM
Category 20 42Mbps 64QAM
Category 21 23.4Mbps 16QAM

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Category 22 28Mbps 16QAM
Category 23 35.5Mbps 64QAM
Category 24 42.2Mbps 64QAM

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HSUPA device category Max data rate（peak） Modulation type
Category 1 0.96Mbps QPSK
Category 2 1.92Mbps QPSK

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Category 3 1.92Mbps QPSK
Category 4 3.84Mbps QPSK

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Category 5 3.84Mbps QPSK
Category 6 5.76Mbps QPSK

LTE-FDD device category

(Downlink)

e
Max data rate（peak） Modulation type

Category 1
id
10Mbps QPSK/16QAM/64QAM
Category 2 50Mbps QPSK/16QAM/64QAM
Category 3 100Mbps QPSK/16QAM/64QAM
f
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Category 4 150Mbps QPSK/16QAM/64QAM

LTE-FDD device category

Max data rate（peak） Modulation type
(Uplink)
Category 1 5Mbps QPSK/16QAM
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Category 2 25Mbps QPSK/16QAM

Category 3 50Mbps QPSK/16QAM
Category 4 50Mbps QPSK/16QAM
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C. Related Documents

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Table 43: Related Documents

NO. Title Description

SIM7800CE/E Series_AT
[1] AT Command Manual

lF
Command Manual_V1.xx
ITU-T Draft new
[2] Serial asynchronous automatic dialing and control
recommendationV.25ter
Digital cellular telecommunications (Phase 2+); AT command
[3] GSM 07.07

ia
set for GSM Mobile Equipment (ME)
[4] GSM 07.10 Support GSM 07.10 multiplexing protocol
Digital cellular telecommunications (Phase 2+); Use of Data

nt
Terminal Equipment – Data Circuit terminating Equipment
[5] GSM 07.05
(DTE – DCE) interface for Short Message Service (SMS)
and Cell Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+);
[6] GSM 11.14

e
Specification of the SIM Application Toolkit for the
Subscriber Identity Module – Mobile Equipment (SIM – ME)
id
interface
Digital cellular telecommunications system (Phase 2+);
[7] GSM 11.11 Specification of the Subscriber Identity Module – Mobile
f
Equipment (SIM – ME) interface
on

Digital cellular telecommunications system (Phase 2+);

[8] GSM 03.38
Alphabets and language-specific information
Digital cellular telecommunications system (Phase 2) ；
[9] GSM 11.10 Mobile Station (MS) conformance specification； Part 1:
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Conformance specification
Digital cellular telecommunications system (Release 5);
[10] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
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Electromagnetic Compatibility (EMC) for mobile terminals

[11] 3GPP TS 34.124
and ancillary equipment.
Electromagnetic Compatibility (EMC) for mobile terminals
[12] 3GPP TS 34.121
and ancillary equipment.
Technical Specification Group Radio Access Network;
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[13] 3GPP TS 34.123-1 Terminal conformance specification; Radio transmission and

reception (FDD)
User Equipment (UE) conformance specification; Part 3:
[14] 3GPP TS 34.123-3
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Abstract Test Suites.

Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
IMT-2000. Third Generation cellular networks; Part 2:
SI

[15] EN 301 908-02 V2.2.1

Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article
3.2 of the R&TTE Directive
Electromagnetic compatibility and Radio Spectrum Matters
(ERM); Electromagnetic Compatibility (EMC) standard for
[16] EN 301 489-24 V1.2.1
radio equipment and services; Part 24: Specific conditions for
IMT-2000 CDMA Direct Spread (UTRA) for Mobile and
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portable (UE) radio and ancillary equipment
[17] IEC/EN60950-1(2001) Safety of information technology equipment (2000)
Digital cellular telecommunications system (Release 5);
[18] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
[19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria

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Directive of the European Parliament and of the Council of
27 January 2003 on the restriction of the use of certain
[20] 2002/95/EC
hazardous substances in electrical and electronic equipment
(RoHS)

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[21] Module Module secondary SMT Guidelines
secondary-SMT-UGD-V1.xx
[22] SIM7X00 This document describes how to use UART interface of
Series_UART_Application SIMCom modules.

ia
Note_V1.xx
SIM7100_SIM7500_SIM7600
_SIM7800CE/E Series_USB

nt
[23] USB AUDIO Application Note
AUDIO_Application
Note_V1.xx

e
[24] SIM7X00 GPS Application Note
Series_GPS_Application
Note_V1.xx
id
[25] Antenna design guidelines for Antenna design guidelines for diversity receiver system
diversity receiver system
[26] SIM7100_SIM7500_SIM7600 Sleep Mode Application Note
f
_SIM7800CE/E_Sleep
on

Mode_Application
Note_V1.xx
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D. Terms and Abbreviations

Table 44: Terms and Abbreviations

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Abbreviation Description
ADC Analog-to-Digital Converter
ARP Antenna Reference Point

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BER Bit Error Rate
BTS Base Transceiver Station
CS Coding Scheme
CSD Circuit Switched Data

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CTS Clear to Send
DAC Digital-to-Analog Converter
DRX Discontinuous Reception

nt
DSP Digital Signal Processor
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready
DTX
EFR
Discontinuous Transmission
Enhanced Full Rate
e
id
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
f
ESD Electrostatic Discharge
on

ETS European Telecommunication Standard

EVDO Evolution Data Only
FCC Federal Communications Commission (U.S.)
FD SIM fix dialing phonebook
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FDMA Frequency Division Multiple Access

FR Full Rate
GMSK Gaussian Minimum Shift Keying
GNSS Global Navigation Satellite System
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GPRS General Packet Radio Service

GPS Global Positioning System
GSM Global Standard for Mobile Communications
HR Half Rate
HSPA High Speed Packet Access
C

HSIC High-speed Inter-chip

I2C Inter-Integrated Circuit
M

IMEI International Mobile Equipment Identity

LTE Long Term Evolution
MDIO Management Data Input/Output
SI

MMD MDIO manageable device

MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MT Mobile Terminated
NMEA National Marine Electronics Association
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
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PCB Printed Circuit Board
PCS Personal Communication System, also referred to as GSM 1900
RF Radio Frequency
RMS Root Mean Square (value)
RTC Real Time Clock

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SIM Subscriber Identification Module
SMS Short Message Service
SPI serial peripheral interface
SMPS Switched-mode power supply

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TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
TX Transmit Direction
UART Universal Asynchronous Receiver & Transmitter

ia
VSWR Voltage Standing Wave Ratio
SM SIM phonebook

nt
SGMII Serial gigabit media independent interface
NC Not connect
EDGE Enhanced data rates for GSM evolution

e
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
ZIF
id
Zero intermediate frequency
WCDMA Wideband Code Division Multiple Access
VCTCXO Voltage control temperature-compensated crystal oscillator
f
USIM Universal subscriber identity module
on

UMTS Universal mobile telecommunications system

UART Universal asynchronous receiver transmitter
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E. Safety Caution

Table 45: Safety Caution

ile
Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use
of mobiles. Switch the cellular terminal or mobile off, medical equipment may be

lF
sensitive and not operate normally due to RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to

ia
prevent interference with communication systems. Forgetting to think much of these
instructions may impact the flight safety, or offend local legal action, or both.

nt
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any

e
electrical equipment in potentially explosive atmospheres can constitute a safety
hazard.
id
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios,
f
computers or other electric equipment.
on

Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
C

networks and cannot be guaranteed to connect in all conditions, especially with a

mobile fee or an invalid SIM card. While you are in this condition and need emergent
help, please remember to use emergency calls. In order to make or receive calls, the
om

cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to
C

deactivate those features before you can make an emergency call.

Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.
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Contact us:
Shanghai SIMCom Wireless Solutions Limited.

Address: Building B, No.633 Jinzhong Road, Changning District, Shanghai P.R.China 200335
Tel: +86 21 3157 5100\3157 5200

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Email: [email protected]
Website: www.simcom.com

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