LSM6DS3 Datasheet
LSM6DS3 Datasheet
Description
The LSM6DS3 is a system-in-package featuring a 3D
digital accelerometer and a 3D digital gyroscope
LGA-14L
performing at 1.25 mA (up to 1.6 kHz ODR) in high-
(2.5 x 3 x 0.83 mm) typ.
performance mode and enabling always-on low-power
features for an optimal motion experience for the
consumer.
Features
The LSM6DS3 supports main OS requirements,
Power consumption: 0.9 mA in combo normal mode offering real, virtual and batch sensors with 8 kbyte for
and 1.25 mA in combo high-performance mode up to dynamic data batching.
1.6 kHz.
ST’s family of MEMS sensor modules leverages the
“Always-on” experience with low power robust and mature manufacturing processes already
consumption for both accelerometer and gyroscope used for the production of micromachined
Smart FIFO up to 8 kbyte based on features set accelerometers and gyroscopes.
Compliant with Android K and L The various sensing elements are manufactured using
Hard, soft ironing for external magnetic sensor specialized micromachining processes, while the IC
corrections interfaces are developed using CMOS technology that
±2/±4/±8/±16 g full scale allows the design of a dedicated circuit which is
trimmed to better match the characteristics of the
±125/±245/±500/±1000/±2000 dps full scale sensing element.
Analog supply voltage: 1.71 V to 3.6 V
The LSM6DS3 has a full-scale acceleration range of
Independent IOs supply (1.62 V) ±2/±4/±8/±16 g and an angular rate range of
Compact footprint, 2.5 mm x 3 mm x 0.83 mm ±125/±245/±500/±1000/±2000 dps.
SPI/I2C serial interface with main processor data High robustness to mechanical shock makes the
synchronization feature LSM6DS3 the preferred choice of system designers for
Embedded temperature sensor the creation and manufacturing of reliable products.
ECOPACK®, RoHS and “Green” compliant The LSM6DS3 is available in a plastic land grid array
(LGA) package.
Applications
Table 1. Device summary
Pedometer, step detector and step counter
Temperature
Significant motion and tilt functions Part number Package Packing
range [°C]
Indoor navigation
LSM6DS3 -40 to +85 Tray
Tap and double-tap detection LGA-14L
IoT and connected devices (2.5 x 3 x 0.83 mm) Tape &
LSM6DS3TR -40 to +85
Reel
Intelligent power saving for handheld devices
Vibration monitoring and compensation
Free-fall detection
6D orientation detection
Contents
1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4 Module specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.4 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.4.1 SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.4.2 I2C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.6 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.6.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.6.2 Zero-g and zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2 Gyroscope power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.3 Accelerometer power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.4 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.4.1 Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.4.2 FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.4.3 Continuous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.4.4 Continuous-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.4.5 Bypass-to-Continuous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.4.6 FIFO reading procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.4.7 Filter block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.1 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.1.1 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
6.2 SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
6.2.1 SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.2.2 SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.2.3 SPI read in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
7 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
7.1 LSM6DS3 electrical connections in Mode 1 . . . . . . . . . . . . . . . . . . . . . . . 40
7.2 LSM6DS3 electrical connections in Mode 2 . . . . . . . . . . . . . . . . . . . . . . . 41
8 Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
9 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
9.1 FUNC_CFG_ACCESS (01h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
9.2 SENSOR_SYNC_TIME_FRAME (04h) . . . . . . . . . . . . . . . . . . . . . . . . . . 46
9.3 FIFO_CTRL1 (06h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
9.4 FIFO_CTRL2 (07h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
9.5 FIFO_CTRL3 (08h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
9.6 FIFO_CTRL4 (09h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
9.7 FIFO_CTRL5 (0Ah) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
9.8 ORIENT_CFG_G (0Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
9.9 INT1_CTRL (0Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
9.10 INT2_CTRL (0Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
9.11 WHO_AM_I (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
9.12 CTRL1_XL (10h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
9.13 CTRL2_G (11h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
9.14 CTRL3_C (12h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
9.15 CTRL4_C (13h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
9.16 CTRL5_C (14h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
9.17 CTRL6_C (15h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
9.18 CTRL7_G (16h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
9.19 CTRL8_XL (17h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
12 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
13 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
13.1 LGA-14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
13.2 LGA-14 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
List of tables
List of figures
1 Overview
The LSM6DS3 has been designed to be fully compliant with Android, featuring the following
on-chip functions:
8 kbyte data buffering
– 100% efficiency with flexible configurations and partitioning
– possibility to store timestamp
Event-detection interrupts (fully configurable):
– free-fall
– wakeup
– 6D orientation
– tap and double-tap sensing
– activity / inactivity recognition
Specific IP blocks with negligible power consumption and high-performance:
– pedometer functions: step detector and step counters
– tilt (Android compliant, refer to Section 2.1: Tilt detection for additional info
– significant motion (Android compliant)
Sensor hub
– up to 6 total sensors: 2 internal (accelerometer and gyroscope) and 4 external
sensors
Data rate synchronization with external trigger for reduced sensor access and enhanced
fusion
3 Pin description
Z
Y
X (TOP VIEW)
DIRECTION OF THE
DETECTABLE
SDA
SCL
CS
ACCELERATIONS
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NC SDx
VIEW
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Z 8 4 INT1
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X DIRECTIONS OF THE
VDDIO
GND
GND
X DETECTABLE
ANGULAR RATES
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SPI 4-wire interface serial data SPI 4-wire interface serial data output
output (SDO) (SDO)
1 SDO/SA0
I2C least significant bit of the I2C least significant bit of the device
device address (SA0) address (SA0)
2 SDx Connect to VDDIO or GND I2C serial data master (MSDA)
3 SCx Connect to VDDIO or GND I2C serial clock master (MSCL)
4 INT1 Programmable interrupt 1
5 VDDIO(1) Power supply for I/O pins
6 GND 0 V supply
7 GND 0 V supply
(2)
8 VDD Power supply
Programmable interrupt 2 (INT2)/ Data
Programmable interrupt 2 enable (DEN)/
9 INT2
(INT2)/ Data enable (DEN) I2C master external synchronization
signal (MDRDY)
10 NC(3) Leave unconnected
(3)
11 NC Leave unconnected
I2C/SPI mode selection I2C/SPI mode selection
(1: SPI idle mode / I2C (1: SPI idle mode / I2C communication
12 CS communication enabled; 0: SPI enabled;
communication mode / I2C 0: SPI communication mode / I2C
disabled) disabled)
I2C serial clock (SCL) I2C serial clock (SCL)
13 SCL
SPI serial port clock (SPC) SPI serial port clock (SPC)
I2C serial data (SDA) I2C serial data (SDA)
SPI serial data input (SDI) SPI serial data input (SDI)
14 SDA
3-wire interface serial data output 3-wire interface serial data output
(SDO) (SDO)
1. Recommended 100 nF filter capacitor.
2. Recommended 100 nF capacitor.
3. Leave pin electrically unconnected and soldered to PCB.
4 Module specifications
±2
7. Noise RMS in Normal/LP mode is the same for all the ODR RMS related to BW = ODR /2 (for ODR /9, typ value can be
calculated by Typ *0.6)
8. The sign of the linear acceleration self-test output change is defined by the STx_XL bits in CTRL5_C (14h), Table 60 for all
axes.
9. The linear acceleration self-test output change is defined with the device in stationary condition as the absolute value of:
OUTPUT[LSb] (self-test enabled) - OUTPUT[LSb] (self-test disabled). 1LSb = 0.061 mg at ±2 g full scale.
10. The sign of the angular rate self-test output change is defined by the STx_G bits in CTRL5_C (14h), Table 59 for all axes.
11. The angular rate self-test output change is defined with the device in stationary condition as the absolute value of:
OUTPUT[LSb] (self-test enabled) - OUTPUT[LSb] (self-test disabled). 1LSb = 70 mdps at ±2000 dps full scale.
For details related to the LSM6DS3 operating modes, refer to 5.2: Gyroscope power modes
and 5.3: Accelerometer power modes.
Note: Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output
ports.
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4.6 Terminology
4.6.1 Sensitivity
Linear acceleration sensitivity can be determined, for example, by applying 1 g acceleration
to the device. Because the sensor can measure DC accelerations, this can be done easily
by pointing the selected axis towards the ground, noting the output value, rotating the
sensor 180 degrees (pointing towards the sky) and noting the output value again. By doing
so, ±1 g acceleration is applied to the sensor. Subtracting the larger output value from the
smaller one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This
value changes very little over temperature and over time. The sensitivity tolerance describes
the range of sensitivities of a large number of sensors.
An angular rate gyroscope is device that produces a positive-going digital output for
counterclockwise rotation around the axis considered. Sensitivity describes the gain of the
sensor and can be determined by applying a defined angular velocity to it. This value
changes very little over temperature and time.
5 Functionality
5.4 FIFO
The presence of a FIFO allows consistent power saving for the system since the host
processor does not need continuously poll data from the sensor, but it can wake up only
when needed and burst the significant data out from the FIFO.
LSM6DS3 embeds 8 kbytes data FIFO to store the following data:
gyroscope
accelerometer
external sensors
step counter and timestamp
temperature
Writing data in the FIFO can be configured to be triggered by the:
- accelerometer/gyroscope data-ready signal; in which case the ODR must be lower than or
equal to both the accelerometer and gyroscope ODRs;
- sensor hub data-ready signal;
- step detection signal.
In addition, each data can be stored at a decimated data rate compared to FIFO ODR and it
is configurable by the user, setting the registers FIFO_CTRL3 (08h) and FIFO_CTRL4
(09h). The available decimation factors are 2, 3, 4, 8, 16, 32.
Programmable FIFO threshold can be set in FIFO_CTRL1 (06h) and FIFO_CTRL2 (07h)
using the FTH [11:0] bits.
To monitor the FIFO status, dedicated registers (FIFO_STATUS1 (3Ah), FIFO_STATUS2
(3Bh), FIFO_STATUS3 (3Ch), FIFO_STATUS4 (3Dh)) can be read to detect FIFO overrun
events, FIFO full status, FIFO empty status, FIFO threshold status and the number of
unread samples stored in the FIFO. To generate dedicated interrupts on the INT1 and INT2
pads of these status events, the configuration can be set in INT1_CTRL (0Dh) and
INT2_CTRL (0Eh).
FIFO buffer can be configured according to five different modes:
– Bypass mode
– FIFO mode
– Continuous mode
– Continuous-to-FIFO mode
– Bypass-to-continuous mode
Each mode is selected by the FIFO_MODE_[2:0] in FIFO_CTRL5 (0Ah) register. To
guarantee the correct acquisition of data during the switching into and out of FIFO mode,
the first sample acquired must be discarded.
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6 Digital interfaces
The registers embedded inside the LSM6DS3 may be accessed through both the I2C and
SPI serial interfaces. The latter may be SW configured to operate either in 3-wire or 4-wire
interface mode.
The serial interfaces are mapped onto the same pins. To select/exploit the I2C interface, the
CS line must be tied high (i.e connected to Vdd_IO).
SPI enable
CS I2C/SPI mode selection (1: SPI idle mode / I2C communication enabled;
0: SPI communication mode / I2C disabled)
I2C Serial Clock (SCL)
SCL/SPC
SPI Serial Port Clock (SPC)
I2C Serial Data (SDA)
SDA/SDI/SDO SPI Serial Data Input (SDI)
3-wire Interface Serial Data Output (SDO)
SPI Serial Data Output (SDO)
SDO/SA0
I2C less significant bit of the device address
There are two signals associated with the I2C bus: the serial clock line (SCL) and the Serial
DAta line (SDA). The latter is a bidirectional line used for sending and receiving the data
to/from the interface. Both the lines must be connected to Vdd_IO through external pull-up
resistors. When the bus is free, both the lines are high.
The I2C interface is implemeted with fast mode (400 kHz) I2C standards as well as with the
standard mode.
In order to disable the I2C block, (I2C_disable) = 1 must be written in CTRL4_C (13h).
Table 14. Transfer when master is receiving (reading) one byte of data from slave
Master ST SAD + W SUB SR SAD + R NMAK SP
Slave SAK SAK SAK DATA
Table 15. Transfer when master is receiving (reading) multiple bytes of data from slave
Master ST SAD+W SUB SR SAD+R MAK MAK NMAK SP
DAT
Slave SAK SAK SAK DATA DATA
A
Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number
of bytes transferred per transfer is unlimited. Data is transferred with the Most Significant bit
(MSb) first. If a receiver can’t receive another complete byte of data until it has performed
some other function, it can hold the clock line, SCL LOW to force the transmitter into a wait
state. Data transfer only continues when the receiver is ready for another byte and releases
the data line. If a slave receiver doesn’t acknowledge the slave address (i.e. it is not able to
receive because it is performing some real-time function) the data line must be left HIGH by
the slave. The master can then abort the transfer. A LOW to HIGH transition on the SDA line
while the SCL line is HIGH is defined as a STOP condition. Each data transfer must be
terminated by the generation of a STOP (SP) condition.
In the presented communication format MAK is Master acknowledge and NMAK is No
Master Acknowledge.
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CS is the serial port enable and it is controlled by the SPI master. It goes low at the start of
the transmission and goes back high at the end. SPC is the serial port clock and it is
controlled by the SPI master. It is stopped high when CS is high (no transmission). SDI and
SDO are, respectively, the serial port data input and output. Those lines are driven at the
falling edge of SPC and should be captured at the rising edge of SPC.
Both the read register and write register commands are completed in 16 clock pulses or in
multiples of 8 in case of multiple read/write bytes. Bit duration is the time between two falling
edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling edge
of CS while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just before the
rising edge of CS.
bit 0: RW bit. When 0, the data DI(7:0) is written into the device. When 1, the data DO(7:0)
from the device is read. In latter case, the chip will drive SDO at the start of bit 8.
bit 1-7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written into the device (MSb first).
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
In multiple read/write commands further blocks of 8 clock periods will be added. When the
CTRL3_C (12h) (IF_INC) bit is ‘0’, the address used to read/write data remains the same for
every block. When the CTRL3_C (12h) (IF_INC) bit is ‘1’, the address used to read/write
data is increased at every block.
The function and the behavior of SDI and SDO remain unchanged.
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The SPI Read command is performed with 16 clock pulses. A multiple byte read command
is performed by adding blocks of 8 clock pulses to the previous one.
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The SPI Write command is performed with 16 clock pulses. A multiple byte write command
is performed by adding blocks of 8 clock pulses to the previous one.
bit 0: WRITE bit. The value is 0.
bit 1 -7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written inside the device (MSb
first).
bit 16-... : data DI(...-8). Further data in multiple byte writes.
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8 Register mapping
The table given below provides a list of the 8/16 bit registers embedded in the device and
the corresponding addresses.
I2C master
MASTER_CONFIG r/w 1A 00011010 00000000 configuration
register
WAKE_UP_SRC r 1B 00011011 output
Interrupts
TAP_SRC r 1C 00011100 output
registers
D6D_SRC r 1D 00011101 output
Status data
STATUS_REG r 1E 00011110 output
register
RESERVED - 1F 00011111 - Reserved
OUT_TEMP_L r 20 00100000 output Temperature
output data
OUT_TEMP_H r 21 00100001 output register
OUTX_L_G r 22 00100010 output
OUTX_H_G r 23 00100011 output
OUTY_L_G r 24 00100100 output Gyroscope
OUTY_H_G r 25 00100101 output output register
Registers marked as Reserved must not be changed. Writing to those registers may cause
permanent damage to the device.
The content of the registers that are loaded at boot should not be changed. They contain the
factory calibration values. Their content is automatically restored when the device is
powered up.
9 Register description
The device contains a set of registers which are used to control its behavior and to retrieve
linear acceleration, angular rate and temperature data. The register addresses, made up of
7 bits, are used to identify them and to write the data through the serial interface.
FTH_[7:0] Watermark flag rises when the number of bytes written to FIFO after the next write is
greater than or equal to the threshold level.
Minimum resolution for the FIFO is 1 LSB = 2 bytes (1 word) in FIFO
1. For a complete watermark threshold configuration, consider FTH_[11:8] in FIFO_CTRL2 (07h).
Pitch X X Y Y Z Z
Roll Y Z X Z X Y
Yaw Z Y Z X Y X
0 0 0 0 Power-down Power-down
0 0 0 1 12.5 Hz (low power) 12.5 Hz (high performance)
0 0 1 0 26 Hz (low power) 26 Hz (high performance)
0 0 1 1 52 Hz (low power) 52 Hz (high performance)
0 1 0 0 104 Hz (normal mode) 104 Hz (high performance)
0 1 0 1 208 Hz (normal mode) 208 Hz (high performance)
0 1 1 0 416 Hz (high performance) 416 Hz (high performance)
0 1 1 1 833 Hz (high performance) 833 Hz (high performance)
1 0 0 0 1.66 kHz (high performance) 1.66 kHz (high performance)
1 0 0 1 3.33 kHz (high performance) 3.33 kHz (high performance)
1 0 1 0 6.66 kHz (high performance) 6.66 kHz (high performance)
1. This bit must be set to '0' for the correct operation of the device.
000 No rounding
001 Accelerometer only
010 Gyroscope only
011 Gyroscope + accelerometer
100 Registers from SENSORHUB1_REG (2Eh) to SENSORHUB6_REG (33h) only
Accelerometer + registers from SENSORHUB1_REG (2Eh) to
101
SENSORHUB6_REG (33h)
Gyroscope + accelerometer + registers from SENSORHUB1_REG (2Eh) to
110 SENSORHUB6_REG (33h) and registers from SENSORHUB7_REG (34h) to
SENSORHUB12_REG(39h)
Gyroscope + accelerometer + registers from SENSORHUB1_REG (2Eh) to
111
SENSORHUB6_REG (33h)
0 0 Normal mode
0 1 Positive sign self-test
1 0 Not allowed
1 1 Negative sign self-test
0 0 Normal mode
0 1 Positive sign self-test
1 0 Negative sign self-test
1 1 Not allowed
0 0 0.0081 Hz
0 1 0.0324 Hz
1 0 2.07 Hz
1 1 16.32 Hz
Table 68. Accelerometer slope and high-pass filter selection and cutoff frequency
HPCF_XL[1:0] Applied filter HP filter cutoff frequency [Hz]
00 Slope ODR_XL/4
01 High-pass ODR_XL/100
10 High-pass ODR_XL/9
11 High-pass ODR_XL/400
00 ODR_XL/50
01 ODR_XL/100
10 ODR_XL/9
11 ODR_XL/400
9.47 SENSORHUB8_REG(35h)
Eighth byte associated to external sensors. The content of the register is consistent with the
SLAVEx_CONFIG number of read operation configurations (for external sensors from x = 0 to x = 3).
9.51 SENSORHUB12_REG(39h)
Twelfth byte associated to external sensors. The content of the register is consistent with the
SLAVEx_CONFIG number of read operation configurations (for external sensors from x = 0 to x = 3).
00 80 degrees
01 70 degrees
10 60 degrees
11 50 degrees
The table given below provides a list of the registers for the embedded functions available in
the device and the corresponding addresses. Embedded functions registers are accessible
when FUNC_CFG_EN is set to ‘1’ in FUNC_CFG_ACCESS (01h).
Note: All modifications of the content of the embedded functions registers have to be performed
with the device in power-down mode.
Registers marked as Reserved must not be changed. Writing to those registers may cause
permanent damage to the device.
The content of the registers that are loaded at boot should not be changed. They contain the
factory calibration values. Their content is automatically restored when the device is
powered up.
Note: All modifications of the content of the embedded functions registers have to be performed
with the device in power-down mode.
12 Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and "Green" standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave "Pin 1 Indicator" unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
13 Package information
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A (max) 330
B (min) 1.5
C 13 ±0.25
D (min) 20.2
N (min) 60
G 12.4 +2/-0
T (max) 18.4
14 Revision history
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.