IPC-AJ-820A

Assembly and Joining

Handbook

Developed by the Assembly and Joining Subcommittee (7-35) of the

Product Assurance Committee (7-30) of IPC

Supersedes: Users of this publication are encouraged to participate in the

IPC-AJ-820 - April 1997 development of future revisions.

Contact:

IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
February 2012 IPC-AJ-820A

Table of Contents
1 SCOPE ...................................................................... 1 3.3.1 Component Orientation ...................................... 21
1.1 Assembly and Joining Technology ...................... 1 3.3.2 Accessibility ....................................................... 22
1.2 Through-Hole Technology ................................... 1 3.3.3 Design Envelope ................................................ 22
1.3 Surface Mount Technology .................................. 1 3.3.4 Clearances .......................................................... 23
1.4 Related Documents .............................................. 2 3.3.5 Physical Support ................................................ 23
1.4.1 Joint Industry Standards ...................................... 2 3.4 Design for Automated Assembly ....................... 23
1.4.2 IPC - Association Connecting Electronics 3.4.1 Fiducial Marks ................................................... 23
Industries Documents ........................................... 4 3.4.2 Automated Through Hole Assembly ................. 23
1.4.3 United States Government Documents ............. 10 3.4.3 Automated Surface Mount Assembly ................ 23
1.4.4 American Society of Mechanical Engineers ..... 11 3.4.4 Automated Mixed-Technology Assembly ......... 24
1.4.5 ASTM International ........................................... 11 3.5 Through Hole Assembly .................................... 24
1.4.6 SAE International ............................................... 12 3.5.1 Lead Configuration ............................................ 24
1.4.7 Federal Aviation Regulations (FARs) ................ 12 3.5.2 Lead/Hole Relationships .................................... 28
1.4.8 Underwriters Laboratories ................................. 12 3.5.3 Through Hole Land Patterns ............................. 28
1.4.9 IEC Standards .................................................... 12 3.6 Surface Mount Assembly ................................... 29
1.4.10 Independent Distributors of Electronics 3.6.1 Basic Printed Board Features ............................ 29
Association (IDEA) ............................................ 12
3.6.2 Manufacturing Allowances ................................ 29
1.4.11 Electrostatic Discharge Association ................... 13
3.6.3 SMT Land Pattern Details ................................. 29
2 HANDLING ELECTRONIC ASSEMBLIES ............. 13 3.6.4 SMT Assembly Processing ................................ 30
2.1 Definitions .......................................................... 13
4 PRINTED CIRCUIT BOARDS ................................. 32
2.1.1 Electrostatic Discharge (ESD) ........................... 13
4.1 General Considerations ...................................... 32
2.1.2 Electrostatic Discharge Sensitive
Components (ESDS) .......................................... 13 4.2 Design Issues ...................................................... 34
2.1.3 Electrical Overstress (EOS) ............................... 13 4.2.1 Structures ............................................................ 34
2.2 Handling of ESDS Items (Components 4.2.2 Leaded vs. Leadless Components ...................... 34
and/or Assemblies) ............................................. 13 4.2.3 CTE Issues ......................................................... 34
2.2.1 Electrical Overstress (EOS) Damage 4.3 PCB Materials .................................................... 34
Prevention ........................................................... 14 4.3.1 Thermosetting Base Resins ................................ 34
2.2.2 Electrostatic Discharge (ESD) Damage 4.4 Printed Boards with Non-Metallic
Prevention ........................................................... 14 Constraining Cores ............................................. 36
2.3 Physical Handling .............................................. 15 4.5 Base Conductors ................................................ 36
2.3.1 Handling after Soldering .................................... 15 4.5.1 Metallic Foils ..................................................... 36
2.4 Contamination .................................................... 15 4.5.2 Electrodeposited Copper Foil ............................ 37
2.5 Processing Moisture Sensitive Components ..... 15 4.5.3 Rolled-Annealed Copper Foil ............................ 37
2.6 Classification of Non-IC Electronic 4.5.4 Additive Circuit Plating ..................................... 37
Components for Assembly Processes
(ECA/IPC/JEDEC J-STD-075) .......................... 16 4.6 Plating and Surface Finishes ............................. 37
4.6.1 Electroless Copper Plating ................................. 37
3 DESIGN CONSIDERATIONS .................................. 19
4.6.2 Semi-Conductive Coatings ................................ 37
3.1 Background and Theory ..................................... 19
4.6.3 Electrolytic Copper Plating ................................ 37
3.2 Basic Considerations .......................................... 19
3.2.1 End-Product Usage ............................................ 19 4.6.4 Gold Plating ....................................................... 38
3.2.2 Performance and Reliability .............................. 20 4.6.5 Immersion Silver ................................................ 41
3.2.3 Designing for Producibility ............................... 20 4.6.6 Immersion Tin .................................................... 42
3.3 Packaged-Component Assembly 4.6.7 Organic Solderability Preservative (OSP) ......... 42
Considerations .................................................... 21 4.6.8 Nickel Plating ..................................................... 43

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IPC-AJ-820A February 2012

4.6.9 Tin/Lead Plating ................................................. 44 6.6 Printed Wiring Board Weak Knee
4.6.10 Solder Coating .................................................... 44 Phenomena ......................................................... 56
6.7 Troubleshooting a Solderability Problem .......... 57
4.6.11 Other Metallic Coatings for Edge Printed
Board Contacts ................................................... 45 6.8 Solderability Tests .............................................. 57
4.7 Printed Board Handling and Storage 6.8.1 IPC J-STD-002 ................................................... 57
Guidelines ........................................................... 45 6.8.2 Force Measurement ............................................ 58
5 ELECTRONIC CIRCUIT COMPONENTS ............... 45 6.9 IPC J-STD-003 ................................................... 59
5.1 Lead/Termination Finishes ................................. 46 6.10 The Importance of Flux Material in
Solderability Testing .......................................... 60
5.2 Moisture Sensitivity ........................................... 46
5.3 Components ........................................................ 46 7 ASSEMBLY AND JOINING MATERIALS ............... 61

5.3.1 Active versus Passive Components ................... 46 7.1 Introduction ........................................................ 61

5.3.2 Discrete versus Integrated Components ............ 46 7.2 Presoldering Chemicals ...................................... 62
7.2.1 Metal Surface Activating Solutions ................... 62
5.4 Through Hole versus Surface Mount
Components ........................................................ 46 7.2.2 Solder Mask ....................................................... 63
5.4.1 Through Hole Lead Components ...................... 47 7.2.3 Protective Coatings ............................................ 63
5.4.2 Surface Mount - Leadless Components ............ 47 7.3 Solder Fluxes ...................................................... 64
5.4.3 Surface Mount - Leaded Components ............... 47 7.3.1 Choosing the Proper Flux .................................. 64
5.5 Electronic Assemblies ........................................ 47 7.3.2 Flux Types .......................................................... 64
5.6 Packaging of Component ................................... 47 7.3.3 Rosin/Resin Fluxes (RO or RE
Classification) ..................................................... 65
5.7 Printed Circuit Board Connectors ..................... 47
7.3.4 ‘‘No Clean’’ Fluxes ............................................ 66
5.7.1 Printed Circuit Board Connector Selection ....... 47
7.3.5 Organic Fluxes (OR Classification) ................... 66
5.8 Sockets ................................................................ 48
7.3.6 Inorganic Fluxes (IN Classification) ................. 67
5.9 Test Points and Test Jacks ................................. 49
7.3.7 Topping Oils ....................................................... 67
5.10 Design and Assembly Process
Implementation for BGAs (IPC-7095) .............. 50 7.4 Solder .................................................................. 67
5.10.1 Scope .................................................................. 50 7.4.1 Solder Alloy Selection ....................................... 67
5.10.2 Purpose ............................................................... 50 7.4.2 Economics .......................................................... 68
5.11 Design and Assembly Process 7.4.3 Processing and Application ................................ 69
Implementation for Bottom Termination 7.4.4 Solder Specifications .......................................... 69
Components (BTC) (IPC-7093) ........................ 50
7.5 Low Temperature Solder Alloys ........................ 70
5.12 Design and Assembly Process
7.5.1 Applications ........................................................ 70
Implementation for Flip Chips (IPC-7094) ....... 50
7.5.2 Forms and Techniques ....................................... 72
5.13 Counterfeit Electronic Components and/or
Counterfeit Mechanical Fasteners ..................... 50 7.5.3 Wave Soldering .................................................. 72
5.13.1 Counterfeit Mechanical Fasteners ..................... 50 7.5.4 Special Considerations ....................................... 73
5.13.2 Counterfeit Electronic Components .................. 51 7.6 Traditional Solder Alloys ................................... 73
7.6.1 High Temperature Soldering Flux ..................... 74
6 SOLDERABILITY .................................................... 52
7.6.2 High Temperature Stripping and Tinning .......... 74
6.1 Introduction ........................................................ 52
7.7 Lead-Free Solder Alloys .................................... 75
6.2 Inherent Solderability ......................................... 53
7.8 Solder Paste ........................................................ 88
6.3 Surface Finishes ................................................. 54
7.8.1 Solder Paste Alloys ............................................ 88
6.3.1 Organic Surface Finishes ................................... 54
7.8.2 Test Methods to Evaluate Solder
6.3.2 Soluble Finishes ................................................. 54 Paste Properties .................................................. 89
6.3.3 Fusible Finishes .................................................. 54 7.8.3 Solder Paste Application .................................... 89
6.3.4 Barrier Underplate .............................................. 54 7.9 Solder Preforms .................................................. 89
6.4 Degradation of Solderability .............................. 54 7.9.1 Solder Preform Alloys ....................................... 90
6.5 Accelerated Conditioning .................................. 56 7.9.2 Designing Solder Preforms ................................ 90

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7.9.3 Preform Heating ............................................. 91 8.6 Component Characteristics,

7.10 Adhesive Materials ........................................ 91 Through-Hole ............................................... 116
7.10.1 Epoxy Adhesives ............................................ 91 8.6.1 Axial-Leaded Discrete Components ............ 116
7.10.2 Silicone Adhesives ......................................... 92 8.6.2 Radial-Leaded Discrete Components .......... 116
7.10.3 Polyurethane ................................................... 92 8.6.3 Dual-Inline Packages .................................... 117
7.10.4 Acrylic Adhesives .......................................... 92 8.6.4 Single-Inline Packages ................................. 117
7.10.5 Cyanoacrylates ............................................... 93 8.6.5 Ribbon-Lead Components ............................ 117
7.10.6 Electrically Conductive Adhesives ................ 93 8.6.6 Pin Grid Arrays ............................................ 118
7.10.7 Surface Mount Adhesives .............................. 94 8.6.7 Through-Hole Connectors ............................ 119
7.10.8 Thermally Conductive Adhesives .................. 94 8.6.8 Through-Hole Sockets ................................. 120
7.10.9 Cure Verification ............................................ 94 8.7 Assembly Sequence, Through-Hole ............ 121
7.10.10 Workmanship Verification .............................. 94 8.7.1 Process Steps ................................................ 121
8.7.2 Component Placement ................................. 131
7.11 Tin Whiskers .................................................. 94
8.7.3 Vertical Mounting ........................................ 132
7.11.1 Executive Summary ....................................... 94
8.7.4 Mixed Technology ........................................ 135
7.11.2 General Guidelines for Migrating to
RoHS Compliant Finishes ............................. 95 8.7.5 Manual Techniques ...................................... 135
7.11.3 Electronic Component Lead and 8.7.6 Automated Techniques ................................. 135
Terminal Finishes ........................................... 99 8.8 Temporary Masking Guidelines ................... 138
7.11.4 Separable Connectors ................................... 101 8.9 Surface Mount .............................................. 138
7.11.5 Bus Bars ....................................................... 102 8.9.1 Assembly Hierarchy ..................................... 138
7.11.6 Heat Sinks .................................................... 103 8.9.2 Manual Assembly Techniques ..................... 145
7.11.7 Printed Circuit Boards (PCB) ...................... 103 8.9.3 Automated Assembly Techniques ................ 145
7.11.8 How Can I Tell If A Component 9 SOLDERING .......................................................... 147
Contains A Tin-Finish? ................................ 104
9.1 Introduction .................................................. 147
7.11.9 Testing to Detect the Presence of
Various Metals that may, or may 9.1.1 The Process of Wetting ................................ 147
not be Present in a Component Lead/ 9.1.2 Wetting and Solderability ............................ 147
Termination Finish ....................................... 104 9.1.3 Solder ............................................................ 148
7.11.10 Energy Dispersive Spectroscopy ................. 104 9.2 Solder Alloys ................................................ 148
8 COMPONENT MOUNTING ................................... 107 9.2.1 Structure of the Solder Bond ....................... 148
8.1 Assembly Classifications ............................. 107 9.2.2 Intermetallic Growth Rates .......................... 149
8.1.1 Producibility Levels ..................................... 107 9.2.3 Factors Affecting Physical Properties
8.1.2 Printed Circuit Board Assembly Types ....... 107 of Solder Alloys ........................................... 149
8.2 General Guidelines ....................................... 108 9.2.4 Strain Rate Effects ....................................... 150
8.2.1 Design Options and Considerations ............ 108 9.2.5 ‘‘Grain Size’’ Effects .................................... 152
8.2.2 Assembly Considerations ............................. 109 9.2.6 Lead-Free Soldering: Process
Considerations: ............................................. 154
8.3 Other Mounting Structure Materials
and Considerations ....................................... 112 9.3 Gold Removal .............................................. 156
8.3.1 Heat Sinks .................................................... 112 9.3.1 Reason for Gold Removal ........................... 156
8.3.2 Spacers .......................................................... 112 9.4 Solder Purity ................................................ 157
8.3.3 Component-Lead Spreaders ......................... 113 9.4.1 Reasons for Testing ...................................... 157
8.3.4 Thermally Conductive Insulators ................. 113 9.4.2 Testing Frequency ........................................ 157
8.4 Assembly Design Cycle ............................... 113 9.4.3 Copper .......................................................... 157
8.5 Placement Guidelines ................................... 114 9.4.4 Gold .............................................................. 157
8.5.1 Construction Formats and Process 9.4.5 Cadmium ...................................................... 157
Sequences ..................................................... 114 9.4.6 Zinc ............................................................... 158
8.5.2 Automated Assembly ................................... 115 9.4.7 Aluminum ..................................................... 158

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9.4.8 Antimony ...................................................... 158 9.18.2 Meniscus in Solder ...................................... 168

9.4.9 Iron ............................................................... 158 9.18.3 Interfacial Connection Without
9.4.10 Arsenic .......................................................... 158 Lead - Vias ................................................... 168
9.4.11 Bismuth ........................................................ 158 9.18.4 Hole Obstruction .......................................... 168
9.4.12 Silver ............................................................ 158 9.19 Machine Soldering ....................................... 169
9.4.13 Nickel ........................................................... 159 9.19.1 Wave Soldering ............................................ 169
9.4.14 Solder Pot Contamination ............................ 159 9.19.2 Machine Controls ......................................... 169
9.4.15 Effect of Contamination on Solder 9.19.3 Fluxing .......................................................... 169
Process .......................................................... 159 9.19.4 Foam Fluxing ............................................... 169
9.4.16 Resolving Contamination Problems ............ 159 9.19.5 Wave Fluxing ............................................... 169
9.5 Tin Depletion ................................................ 159 9.19.6 Brush Fluxing ............................................... 170
9.6 Soldering Processes ...................................... 159 9.19.7 Spray Fluxing ............................................... 170
9.7 Manual/Hand Soldering ............................... 159
9.19.8 Preheating ..................................................... 170
9.7.1 Flux Application ........................................... 159
9.19.9 The Solder Wave .......................................... 170
9.8 Solder Application ........................................ 160
9.19.10 Parabolic Wave ............................................. 170
9.9 Hand Soldering ............................................ 160
9.19.11 Bi-Directional Wide Wave ........................... 170
9.9.1 Heat Transfer Considerations ...................... 161
9.19.12 Asymmetrical (Supported) Wave ................. 171
9.10 Temperature Control - Thermal
Considerations for Components 9.19.13 Special Provisions ........................................ 171
and Boards .................................................... 162 9.19.14 Printed Board Conveyors ............................. 171
9.10.1 Heat Sinks .................................................... 162 9.19.15 Pallet Conveyors .......................................... 171
9.11 Tip Selection ................................................ 162 9.19.16 Finger Conveyors ......................................... 171
9.11.1 Tip Materials ................................................ 162 9.19.17 Other Conveyors .......................................... 171
9.11.2 Soldering Iron Tip Selection ........................ 162 9.19.18 Conveyor Control ......................................... 171
9.11.3 Shape/Physical Configuration ...................... 162 9.19.19 Inert Atmospheres ........................................ 171
9.11.4 Tip Maintenance ........................................... 163 9.19.20 Preparation Fluids ........................................ 172
9.11.5 Soldering Iron Station Maintenance ............ 163 9.19.21 System Considerations ................................. 173
9.11.6 Extending Tip Life ....................................... 163 9.19.22 Design Considerations ................................. 173
9.12 Hand Soldering-Soldering Tools
9.19.23 Process Control ............................................ 173
and Equipment ............................................. 164
9.19.24 Maintenance ................................................. 173
9.13 Terminal Soldering ....................................... 165
9.13.1 Flared Flange Hardware ............................... 165 9.19.25 Solder Dross Reclamation and Recovery .... 175
9.13.2 Shank Discontinuities .................................. 165 9.19.26 Training ........................................................ 175
9.13.3 Flared Flange Angles ................................... 165 9.19.27 Safety ............................................................ 175
9.13.4 Terminal Mounting ....................................... 165 9.20 Flow-Well/Minipot ....................................... 175
9.13.5 General Requirements .................................. 166 9.21 Static Solder Pots ......................................... 176
9.14 Soldering To Terminals ................................ 166 9.22 Selective Soldering ...................................... 176
9.14.1 Turret and Hook Terminals .......................... 166 9.22.1 Key Process Elements .................................. 176
9.14.2 Bifurcated, Pierced or Perforated 9.22.2 Process Expectations .................................... 176
Terminals ...................................................... 166 9.22.3 Process Optimization and Control ............... 176
9.14.3 Cup and Hollow Cylindrical 9.23 Reflow Soldering .......................................... 176
Terminal Soldering ....................................... 167
9.23.1 The Test Assembly ....................................... 177
9.15 Unsupported Holes ....................................... 167
9.23.2 Attachment of Thermocouples ..................... 177
9.16 Supported Holes (PTH) ............................... 167
9.23.3 Baseline Profile ............................................ 178
9.17 Vertical Fill of Hole ..................................... 167
9.23.4 PIN-In-PASTE .............................................. 183
9.18 PTH Mounted Components -
Solder Conditions ......................................... 168 9.23.5 Hold Down of Surface Mount Leads .......... 183
9.18.1 Solder in Lead Bend .................................... 168 9.24 Other Reflow Soldering Methods ................ 183

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9.24.1 Hot Bar Reflow Soldering-Resistance 10.3.1 Component Mounting with Adhesives ........ 205
‘‘Hot Bar’’/Pulse soldering .......................... 183 10.3.2 Outer Lead Bonding with Anisotropic
9.24.2 Laser Reflow Soldering ............................... 184 Adhesives ..................................................... 205
9.24.3 Vapor Phase Soldering ................................. 186 10.3.3 Thermally-Conductive Adhesive Bonding .. 205
9.24.4 IR Soldering ................................................. 188 10.3.4 Adhesive Application ................................... 206
9.24.5 The IR Reflow Process ................................ 188 10.3.5 Curing ........................................................... 207
9.24.6 MVC Temperature Determination ............... 193 10.3.6 Heat Sink Materials and Processing ............ 207
9.24.7 Air/Atmosphere Quality ............................... 194 10.3.7 Adhesive Testing and Evaluation ................ 210
9.24.8 Monitoring and Control ............................... 194 10.4 Mechanical Pressure Connections ............... 212
9.24.9 Profiling Devices .......................................... 194 10.4.1 Solderless Backplane Contact
9.24.10 Temperature Control .................................... 194 Terminations ................................................. 212
9.24.11 Inert Atmosphere Operation ........................ 194 10.4.2 Solderless (Wire) Wrapping ......................... 213
9.24.12 No-Clean Processing .................................... 194 10.4.3 Conductive-Elastomer Pressure
Connections .................................................. 217
9.24.13 Processing Bare Copper ............................... 195
9.24.14 Inert Atmosphere Control ............................ 195 11 CLEANLINESS REQUIREMENTS ...................... 219
9.24.15 Machine Selection ........................................ 195 11.1 Definitions .................................................... 220
9.24.16 Conveyor Type ............................................. 195 11.1.1 Solvency ....................................................... 220
9.24.17 Wavelength ................................................... 196 11.1.2 Solvent Stability ........................................... 220
9.24.18 Longitudinal Process Temperature 11.1.3 Film Drying Characteristics ......................... 220
Profiles .......................................................... 196 11.1.4 Soil Capacity ................................................ 220
9.24.19 Lateral Temperature Profiles ........................ 196 11.1.5 Surface Tension or Solvent Wetting ............ 220
9.24.20 Other Concerns ............................................ 197 11.2 Historical Perspective on Cleaning ............. 221
9.24.21 Can the Equipment Do the Job? ................. 197 11.3 Toxicity ......................................................... 221
9.24.22 Critical Parameters for IR Process 11.4 Ultrasonic Cleaning ...................................... 222
Control .......................................................... 197
11.5 Forms of Cleaning ....................................... 222
9.25 SMT .............................................................. 197
11.5.1 Aqueous Cleaning ........................................ 222
9.25.1 Surface Mount Assemblies Acceptance
Requirements ................................................ 197 11.5.2 Semi-Aqueous Cleaning .............................. 223
9.25.2 High Voltage or High Power Applications .. 197 11.5.3 Solvent Cleaning .......................................... 223
9.25.3 Quality Assurance (Visual Inspection) ........ 197 11.6 Cleaning Agent Considerations ................... 223
9.26 Process Verification Inspection .................... 198 11.6.1 Types of Solvents ......................................... 223
9.26.1 Magnification Aids and Lighting ................. 198 11.6.2 Cleaning Agent Compatibility ..................... 224
9.26.2 Sampling Inspection - Process Control ....... 198 11.6.3 Vented Components ..................................... 224
9.26.3 Statistical Process Control (SPC) - 11.7 Cleaning Agent Delivery Considerations .... 224
Refer to IPC-9191. ....................................... 198 11.7.1 In-Line Cleaning .......................................... 224
9.3 References .................................................... 198 11.7.2 Batch Cleaning ............................................. 224
10 OTHER ASSEMBLY AND JOINING 11.7.3 Interim or Spot Cleaning ............................. 224
METHODS ........................................................... 199 11.7.4 Vapor Degreasing ......................................... 224
10.1 Wire Bonding (Chip and Wire) ................... 199 11.7.5 Ultrasonic Cleaning ...................................... 224
10.1.1 Thermocompression (TC) Bonding ............. 199 11.7.6 Cleaning Process Development ................... 225
10.1.2 Ultrasonic Bonding ...................................... 200 11.7.7 Removal of Contaminants from
10.1.3 Thermosonic (TS) Bonding ......................... 202 Underneath Parts .......................................... 225
10.1.4 Choice of Wire Bonding Method ................ 202 11.8 Cleaning requirements ................................. 225
10.2 Tape Automated Bonding (TAB) ................. 203 11.8.1 Pre-Soldering Cleanliness Requirements ..... 225
10.2.1 Inner Lead Bonding (ILB) ........................... 204 11.8.2 Post-Soldering Cleaning .............................. 225
10.2.2 Outer Lead Bonding (OLB) ........................ 204 11.8.3 Particulate Matter ......................................... 225
10.3 Polymer Bonding ......................................... 205 11.9 Cleanliness Verification ................................ 226

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11.9.1 Visual Inspection .......................................... 226 13.4.13 Hybrid ........................................................... 241

11.10 Post-Soldering Cleanliness Designator ........ 226 13.4.14 Hydrophopic-Oleophobic Encapsulations ... 241
11.11 Tests for Cleanliness .................................... 227 13.4.15 Inhibition ...................................................... 241
11.11.1 Residual Rosin ............................................. 227 13.4.16 Mealing ......................................................... 241
11.11.2 Ionic Cleanliness (ROSE) ............................ 227 13.4.17 Monomer ...................................................... 241
11.11.3 SIR Testing ................................................... 230 13.4.18 Multi-Layering ............................................. 241
11.11.4 Surface Organic Contaminants .................... 230 13.4.19 Oligomer ....................................................... 241
11.11.5 Other Residue Tests ..................................... 230 13.4.20 Photoresist .................................................... 241
11.11.6 UV-Vis Spectroscopy ................................... 230 13.4.21 Polymer ........................................................ 241
11.11.7 A General Caution on Extraction- 13.4.22 Polymerization .............................................. 241
Based Tests ................................................... 231 13.4.23 Polysiloxane ................................................. 241
11.11.8 Other Contamination .................................... 231 13.4.24 Pot Life ......................................................... 241
11.11.9 Other Analytical Tests .................................. 231 13.4.25 Priming ......................................................... 242
11.11.10 Cleanliness Testing for No Clean 13.4.26 Shadowing .................................................... 242
Assemblies .................................................... 233
13.4.27 Shrinkage ...................................................... 242
11.12 Other Guidance on Cleaning ....................... 234
13.4.28 Spectroscopy ................................................ 242
12 CONFORMAL COATING .................................... 234 13.4.29 Stripping ....................................................... 242
12.1 Function of Conformal Coating .................. 234 13.4.30 Surface Tension ............................................ 242
12.2 Conformal Coating Specifications ............... 234 13.4.31 Transfer Efficiency ....................................... 242
12.3 Kinds of Conformal Coating ....................... 235 13.4.32 Wetting ......................................................... 242
12.4 Finding a Qualified Conformal Coating ...... 235 13.4.33 Young’s Modulus ......................................... 242
12.5 Advantage and Disadvantages ..................... 235 13.5 Environmental, Health and Safety
12.6 Storage and Shelf Life ................................. 236 Considerations .............................................. 242
12.7 Surface Preparation ...................................... 236 13.5.1 Emissions ...................................................... 242
12.8 Application Methods .................................... 237 13.5.2 Disposal of Hazardous Waste ...................... 242
12.9 Curing Methods ............................................ 237 13.5.3 Governmental Regulations ........................... 242
12.10 Process Control ............................................ 238 13.6 Types of Encapsulation ................................ 242
12.11 Coating Defects ............................................ 239 13.6.1 Acrylic .......................................................... 243
12.12 Coating Rework ........................................... 239 13.6.2 Epoxy ............................................................ 243
13.6.3 Silicone ......................................................... 243
13 POTTING AND ENCAPSULATION .................... 240
13.6.4 Polyurethane & Polysulfide ......................... 243
13.1 Introduction .................................................. 240
13.6.5 UV and Solvent Cure ................................... 243
13.2 Purpose ......................................................... 240
13.7 Design for Encapsulation Application ......... 244
13.3 Scope ............................................................ 240
13.7.1 Design Philosophy ....................................... 244
13.4 Terms and Definitions .................................. 240
13.7.2 PCBs ............................................................. 244
13.4.1 Adhesion Promotion .................................... 240
13.7.3 Component ................................................... 245
13.4.2 Adhesion Failure .......................................... 240
13.4.3 Anisotropic ................................................... 240 13.7.4 Electrical ....................................................... 246
13.4.4 ARUR ........................................................... 241 13.7.5 Encapsulation Coverage ............................... 247
13.4.5 Cross-Linking ............................................... 241 13.7.6 Masking ........................................................ 247
13.4.6 Cure .............................................................. 241 13.7.7 Drawings & Design Guidelines ................... 247
13.4.7 Delamination ................................................ 241 13.7.8 Reworkability/Repairability ......................... 248
13.4.8 Durometer ..................................................... 241 13.8 Raw Materials Characteristics ..................... 248
13.4.9 EMC ............................................................. 241 13.8.1 Viscosity ....................................................... 248
13.4.10 Filler ............................................................. 241 13.8.2 Viscosity vs. Rheology ................................ 248
13.4.11 Gel Time ....................................................... 241 13.8.3 Effect of Temperature on Viscosity ............. 248
13.4.12 Glass Transition Temperature Tg ................. 241 13.8.4 Surface Properties ........................................ 248

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13.9 Compatibility ................................................ 248 13.15.4 Environmental, Health and Safety

13.9.1 Compatibility with Process .......................... 248 Rework and Repair Considerations ............. 266
13.9.2 Inhibition ...................................................... 250 13.16 End Use Environment .................................. 267
13.10 Adhesion ....................................................... 251 13.16.1 Outdoor Environment .................................. 267
13.10.1 Solder Mask/Substrate ................................. 251 13.16.2 Automotive ................................................... 268
13.10.2 Components .................................................. 251 13.16.3 Avionics Environment .................................. 268
13.10.3 Surface Finishes ........................................... 252 13.16.4 Space Environment ...................................... 269
13.10.4 Cleanliness .................................................... 252 13.16.5 Medical Environment ................................... 269
13.10.5 Interlayer Adhesion ...................................... 252 13.16.6 Geothermal Environment ............................. 269
13.11 Methods of Assessing Compatibility 13.16.7 Nuclear Biological Chemical Warfare
and Performance .......................................... 252 Environment ................................................. 269
13.12 Processing ..................................................... 253 13.17 Long Term Reliability and Testing .............. 269
13.12.1 Cleanliness .................................................... 253 13.17.1 Failure Mechanism ....................................... 269
13.13 Processing Environment .............................. 254 13.17.2 Accelerated Testing ...................................... 271
13.13.1 Substrate Preparation ................................... 254 13.18 Bibliography ................................................. 271
13.13.2 Priming ......................................................... 254 14 REWORK AND REPAIR ..................................... 272
13.13.3 Plasma Treatment ......................................... 255 14.1 General Information and Common
13.13.4 Mechanical Etching ...................................... 255 Procedures .................................................... 272
13.13.5 Masking ........................................................ 255 14.1.1 Scope ............................................................ 272
14.1.2 Purpose ......................................................... 272
13.13.6 Manual vs. Automated Masking .................. 256
14.1.3 Background .................................................. 272
13.13.7 Recommended Coverage ............................. 257
14.1.4 Terms and Definitions .................................. 272
13.13.8 Application Methods .................................... 257
14.1.5 Applicability, Controls and Acceptability ... 274
13.13.9 Cure Mechanisms ......................................... 257
14.1.6 Basic Considerations .................................... 274
13.13.10 Cure Process Considerations ....................... 258
14.1.7 Workstations, Tools, Materials
13.13.11 Application Process Monitoring .................. 258 and Processes ............................................... 274
13.13.12 Inspection Guidelines ................................... 259 14.1.9 Lead Free ...................................................... 279
13.13.13 Environmental, Health and Safety 14.2 Handling Electronic Assemblies -
Processing Considerations ........................... 259 See Chapter 2 of this document. ................. 280
13.14 Encapsulation Properties .............................. 259 14.3 Cleaning - See Chapter 11 of
13.14.1 Appearance/Color ......................................... 260 this document. .............................................. 280
13.14.2 Dielectric Properties ..................................... 260 14.4 Coating Removal .......................................... 280
13.14.3 Thermal Properties ....................................... 260 14.4.1 Coating Removal, Identification of
Conformal Coating ........................................ 280
13.14.4 Flammability ................................................ 261
14.4.2 Coating Removal, Solvent Method............... 281
13.14.5 Flexibility ..................................................... 261
14.4.3 Coating Removal, Peeling Method............... 282
13.14.6 Abrasion Resistance ..................................... 262
14.4.4 Coating Removal, Thermal Method ............. 282
13.14.7 Hydrolytic Stability ...................................... 262
14.4.5 Coating Removal, Grinding/
13.14.8 Permeability .................................................. 262 Scraping Method ........................................... 283
13.14.9 Chemical Compatibility and Chemical 14.4.6 Coating Removal, Micro
Resistance ..................................................... 262 Blasting Method ............................................ 283
13.14.10 UV Stability ................................................. 263 14.5 Replacment of Conformal Coating .............. 283
13.14.11 Radiation Resistance .................................... 263 14.5.1 Coating Replacement, Solder Resist............. 283
13.14.12 Outgassing .................................................... 264 14.5.2 Coating Replacement, Conformal
13.15 Rework and Repair ...................................... 264 Coatings/Encapsulants ................................... 284
13.15.1 Removal Methods ........................................ 264 14.6 Conditioning – Baking and Preheating ........ 284
13.15.2 Cleaning after Stripping ............................... 266 14.7 Epoxy Mixing and Handling ........................ 284
13.15.3 Re-Encapsulation .......................................... 266 14.8 Legends/Markings ......................................... 285

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IPC-AJ-820A February 2012

14.8.1 Stamping Method ......................................... 285 Figure 7-2 Tin allotropic crystallographic structure;
(left) tetragonal β-tin, (right) cubic α-tin .......... 69
14.8.2 Hand Lettering............................................... 285
Figure 7-3 Tin Pest Transformation from Sweatman
14.8.3 Stencil Method .............................................. 285 et al Investigation ........................................... 70
14.9 Tip Care and Maintenance ............................ 285 Figure 7-4 Solder Wire Core Flux Comparison ............... 76
14.10 IPC-7711 Rework Procedures....................... 286 Figure 7-5 Solder Alloy Solidification Example: Blue
14.11 IPC-7721 Modification and Repair............... 288 line - Eutectic, Red line - Non-Eutectic .......... 76
Figure 7-6 Solder Alloy Fracture Toughness
Testing Results ............................................... 77
Figures Figure 7-7 Solder Alloy Drop Shock Testing Results ....... 77
Figure 2-1 J-STD-075 Process Flow Diagram ................. 17 Figure 7-8 NASA Tin-Whisker Photograph .................... 105
Figure 3-1 Component Orientation with Respect to Figure 7-9 Tin Whiskers - Observed Problems
Boundaries and Mounting Accessibility .......... 22 Caused by Whiskers .................................... 105
Figure 3-2 Uncoated Printed Board Clearance ............... 23 Figure 7-10 Additional Tin Whisker Problems ................. 106
Figure 3-3 Lead Terminations .......................................... 24 Figure 8-1 Type 1 Printed Board Assembly ................... 107
Figure 3-4 Clinched Through Hole Leads ........................ 26 Figure 8-2 Type 2 Printed Board Assemblies ................ 108
Figure 3-5 Dual-Inline Package (DIP) Lead Bends ......... 26 Figure 8-3 Staggered Hole Pattern Mounting ‘‘MO’’
Flatpack Outline Drawing (Only Inches
Figure 3-6 Lead Forming and Stress Relief Shown) .......................................................... 110
Lead Bends .................................................... 27
Figure 8-4 Component Modifications for Surface
Figure 3-7 Component Mounting Configurations ............. 27 Mounting Applications ................................... 110
Figure 3-8 Through Hole Flat-Pack Mounting with Figure 8-5 Modifying DIP for Surface Mounting ............. 110
Staggered Plated Through Holes ................... 29
Figure 8-6 Mixed Assemblies ......................................... 111
Figure 3-9 Modified Fan-Out Lands, mm [in] ................... 30
Figure 8-7 Clip-Mounted Component ............................. 112
Figure 3-10 Custom-Grid Fan-out Land Pattern ................ 30
Figure 8-8 Strap Securing .............................................. 112
Figure 3-11 Gull Wing Flat Pack Surface Mounting .......... 31
Figure 8-9 Typical Spacers ............................................ 113
Figure 3-12 Flat-Pack Lead Forming for (Planar)
Figure 8-10 Transistor Mounting with Spacer .................. 113
Surface Mounting ........................................... 31
Figure 8-11 Multiple Lead Spreader ................................. 113
Figure 3-13 Surface-Mount Flat Ribbon Lead Features .... 31
Figure 8-12 Thermally Conductive Insulator .................... 113
Figure 3-14 Coined Round Leads ...................................... 32
Figure 8-13 Single-Sided Surface Mount Assembly,
Figure 4-1 HASL Surface Topology Comparison ............. 45 Reflow Only .................................................. 114
Figure 5-1 One-Part Printed Circuit Board Connector ..... 48 Figure 8-14 Single-Sided Surface Mount Assembly,
Figure 5-2 Printed Circuit Board with Edge-Board Immersion Only ............................................. 114
Contacts .......................................................... 48 Figure 8-15 Mixed Technology Assembly, Double-
Figure 5-3 Typical One-Part Connector with Bellows Sided, Reflow Only ....................................... 114
Contacts .......................................................... 48 Figure 8-16 Mixed Technology Assembly, Double-
Figure 5-4 Typical One-Part Connector Tuning-Fork Sided: Reflow and Immersion ....................... 115
Contacts .......................................................... 48 Figure 8-17 Mixed Technology Assembly, Double-
Figure 5-5 Typical One-Part Connector Cantilever Sided Reflow and Manual ............................. 115
Contacts .......................................................... 48 Figure 8-18 Mixed Technology Assembly, Double-
Figure 5-6 Typical One-Part Connector Readout Sided, Immersion Only ................................. 115
Configuration .................................................. 49 Figure 8-19 Panel Assembly Tooling Holes ..................... 116
Figure 5-7 Typical Two-Part Blade-and-Fork Contacts .... 49 Figure 8-20 Panel Assembly Tooling Holes ..................... 116
Figure 5-8 Typical Zero-insertion-Force (ZIF) Pin- Figure 8-21 Taped Axial-Leaded Components ................. 116
Grid Array Socket ........................................... 49
Figure 8-22 Polarized Axial Lead Component
Figure 5-9 Typical Printed Board Test Points .................. 49 (Typical Polarity Markings) ............................ 116
Figure 6-1 Dissolution of Selected Elements in Figure 8-23 16-Lead Dip .................................................. 117
Sn/Pb Solder .................................................. 55
Figure 8-24 Flatpack Outline Drawing .............................. 118
Figure 6-2 Intermetallic Growth Rates ............................. 55
Figure 8-25 Typical Ribbon Leaded Discrete
Figure 6-3 Comparison of Oxidized and Non-oxidized Device Outline Drawing (Flat Leads) ............ 118
Sn/Pb Surface Finish ...................................... 56
Figure 8-26 Pin Grid Array ............................................... 119
Figure 6-4 Schematic of the Wetting Balance Test ......... 58
Figure 8-27 I/O Density Versus Lead Count
Figure 6-5 Idealized Wetting Balance Curve ................... 59 (All Dimensions in Inches) ............................ 119
Figure 7-1 Tin Lead Phase Diagram ................................ 68 Figure 8-28 Connector with Press Fit Contacts ............... 119

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February 2012 IPC-AJ-820A

Figure 8-29 Surface Mount Clip Carrier Socket .............. 120 Figure 8-71 DIP Clearances ............................................ 137
Figure 8-30 Section Through Socket Solder Contact ...... 120 Figure 8-73 DIP Slide Magazines .................................... 138
Figure 8-31 Component Mounting Sequence .................. 122 Figure 8-74 No Bridging ................................................... 139
Figure 8-32 Thermal Shunt .............................................. 123 Figure 8-75 Lead Forming for Surface Mounting ............ 139
Figure 8-33 Termination Examples .................................. 123 Figure 8-76 Criteria for Lead Attachment to Leadless
Figure 8-34 Clinch Patterns ............................................. 125 Type A (Leaded Type B) ............................... 140
Figure 8-35 Semiclinched Lead ....................................... 125 Figure 8-77 SO-16 Package Drawings Typical
Dimension ..................................................... 140
Figure 8-36 Lead Diameter Versus Bend Radius ............ 126
Figure 8-78 Typical SOT Packages ................................. 141
Figure 8-37 Bend Configuration ....................................... 127
Figure 8-79 Modifying DIP for Surface Mounting ............ 141
Figure 8-38 Simple-Offset Preformed Lead ..................... 127
Figure 8-39 Dimple Preformed Leads .............................. 127 Figure 8-80 Gull-Wing Lead for SIP-Type Component .... 141

Figure 8-40 Compound Lead Form Examples ................ 127 Figure 8-81 Surface Mount Receptacle ........................... 142

Figure 8-41 Stress Relief Leads ...................................... 128 Figure 8-82 Surface Mount Connector ............................ 142
Figure 8-42 TO Can Lead Forming .................................. 128 Figure 8-83 D-Subminiature Surface Mount Connector .. 142
Figure 8-43 Dimple Preformed Leads .............................. 128 Figure 8-84 Box-Contact Surface Mount Connector ....... 142
Figure 8-44 Typical Mounting Pattern for 12-Lead Figure 8-85 Leadless Grid Array Socket .......................... 142
Cans with Clinched Leads Mounting ............ 128 Figure 8-86 Surface Mount Chip Carrier Socket ............. 142
Figure 8-45 Mechanical Mounting - Lead Forming .......... 128 Figure 8-87 High Speed Circuit Socket ........................... 143
Figure 8-46 Single-Inline Component .............................. 129 Figure 8-88 Screw Down Cover ....................................... 143
Figure 8-47 Lead Configuration (After Assembly) ........... 129
Figure 8-89 Pressure Mounted Socket ............................ 143
Figure 8-48 Resilient Spacer to Heat Sink Frame ........... 129
Figure 8-90 Preferred Mounting Orientations .................. 146
Figure 8-49 Staggered Hole Pattern Mounting
Figure 9-1 Structure of a Solder Bond ........................... 148
(Flatpack Outline Drawing) ........................... 130
Figure 8-50 Component Mounting - Lead Forming ......... 130 Figure 9-2 Property Changes as a Function
of Temperature ............................................. 150
Figure 8-51 Through-Hole Board Mounting with
Unclinched Leads ......................................... 130 Figure 9-3 Stress Relaxation with Time and
Temperature .................................................. 151
Figure 8-52 Through-Hole Mounting with Clinched
Leads and Circumscribing Land ................... 130 Figure 9-4 Cylindrical Deformation Leading to
Joint Failure .................................................. 151
Figure 8-53 Through-Hole Mounting with Offset Land .... 130
Figure 9-5 Property Change with Strain Rate ............... 151
Figure 8-54 Components Mounted Over Conductors ...... 131
Figure 9-6 Cyclic Shear Strain Range (Figure
Figure 8-55 Hardware Clearance ..................................... 132
Courtesy of J.P. Clech) ................................. 151
Figure 8-56 Component Alignment .................................. 132
Figure 9-7 Solder Joint Grain Size Structure
Figure 8-57 Component Alignment .................................. 132 (As Soldered) ................................................ 152
Figure 8-58 Horizontal Mounting of Radial Figure 9-8 Solder Joint Grain Size Structure
Leaded Component ...................................... 133 (After accelerated Cycling) ........................... 152
Figure 8-59 Horizontal Mounting of Radial Leaded Figure 9-9 Solder Joint Grain Size Structure
Component with Heat Sink ........................... 133 (After Field Failure) ....................................... 152
Figure 8-60 Horizontal TO Mounting ................................ 133 Figure 9-10 Schematic Diagrams of The Microstructure
Figure 8-61 Vertical Mounted Axial Lead Components ... 133 Formation in Lead-Free Paste - Lead-Free
Figure 8-62 Vertical Mounted Radial-Lead Components . 134 Solder Balls Under Reflow ........................... 153

Figure 8-63 Vertical Mounted Components Coating Figure 9-11 A Lead-free BGA Microstructure; Left - As
Meniscus ....................................................... 134 Reflowed, Right - After Thermal Cycling ...... 153
Figure 8-64 Radial Components Mounting Figure 9-12 Solder Alloy Microstructure Differences:
(Unsupported Holes) .................................... 134 Left - Tin/lead Solder Alloy, Right: SAC305
Solder Alloy ................................................... 153
Figure 8-65 Offset Lead Can Mounting ........................... 134
Figure 9-13 Lead-free Solder Alloy/Component Surface
Figure 8-66 Offset Lead Can Mounting ........................... 134
Finish Incompatibility Example (Reference:
Figure 8-67 Metal Power-Package Transistor D. Hillman and R. Wilcoxon, ‘‘JCAA/JG-PP
Mounted on Resilient Standoffs ................... 134 Lead-free Solder Testing for High Reliability
Figure 8-68 Dual-Inline Package Gripping Tools ............. 136 Applications: -55 °C to +125 °C Thermal
Cycle Testing,’’ SMTAI Conference, 2006) ... 154
Figure 8-69 Transistor Assembly Tools ............................ 136
Figure 9-14 left: Non-uniform Solder Joint Microstructure,
Figure 8-70 Taping Specifications (only inches shown) .. 137 right: Incomplete Solder Joint Reflow
Figure 8-72 DIP Layout in Rows and Columns ............... 137 (Head-on-Pillow) ........................................... 155

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IPC-AJ-820A February 2012

Figure 9-15 Component Degradation Due to Lead-free Table 4-8 ENEPIG Surface Finish Advantages and
Soldering Process Incompatibility ................ 156 Disadvantages ................................................... 41
Figure 9-16 Lead-free Solder Alloy Attack of Wave Solder Table 4-9 Immersion Silver Surface Finish Advantages
Equipment (Photograph Reference: ‘‘Pb-free and Disadvantages ........................................... 42
Technology and the Necessary Changes in
Table 4-10 Immersion Tin Surface Finish Advantages
Soldering Process and Machine Technology,’’
and Disadvantages ........................................... 42
H. Schlessmann, APEX 2002 Conference
Proceedings) ................................................. 156 Table 4-11 OSP Surface Finish Advantages and
Limitations ......................................................... 43
Figure 9-17 Copper Erosion Due to Lead-free
Soldering Processes ..................................... 156 Table 6-1 Solderability of Some Common Surfaces ......... 53
Figure 9-18 Lead-free Soldering Iron Tip Damage Table 6-2 Flux Compositions ............................................. 60
(Courtesy of Hakko) ..................................... 163 Table 7-1 Types of Contaminants ..................................... 62
Figure 9-19 Thermal Profile of a Soldering Iron Tip ........ 164 Table 7-2 Flux Identification System ................................. 65
Figure 9-20 Properly Wrapped Wires .............................. 166 Table 7-3 Solder Alloys and Their Melting Points ............. 68
Figure 9-21 Soldering To Terminals ................................. 166 Table 7-4 Alloy Properties ................................................. 69
Figure 9-22 Acceptable Soldered Cup ............................. 167 Table 7-5 Indium-Based Solder Alloys .............................. 71
Figure 9-23 Wave Soldering Problems and Solutions Table 7-6 Bismuth-Based Solder Alloys ............................ 72
Reference Chart ........................................... 174
Table 7-7 Traditional Solder Alloys .................................... 73
Figure 9-24 Typical Tin-Lead Reflow Soldering
Thermal Profile ............................................. 189 Table 7-8 Lead-Free Solder Alloys .................................... 75
Figure 9-25 Typical Type RMA Flux Thermal Profile ....... 190 Table 7-9 Lead-Free Solder Alloys and Their Melting
Temperatures .................................................... 76
Figure 9-26 Typical Type OA Flux Thermal Profile .......... 191
Table 7-10 Hewlett Packard Proposed Test Protocol
Figure 9-27 Typical ‘‘No-Clean’’ Flux Thermal Profile ...... 191 for Pb-Free Solder Alloys .................................. 78
Figure 9-28 Typical Reactive Atmosphere Flux Table 7-11 Solder Powder Size Designations
Thermal Profile ............................................. 192 (J-STD-005) ....................................................... 88
Figure 9-29 Lateral Temperature Profiles ........................ 196 Table 7-12 Tin Whisker Mitigation ....................................... 95
Figure 10-1 Wire Bonding Variables ................................ 200 Table 7-13 Component Lead-Free Finishes (Tin
Figure 10-2 Mechanics of Thermocompression Wire Whisker Test Requirements) ........................... 100
Bonding. ........................................................ 200 Table 7-14 iNEMI Ratings for Whisker Risk on
Figure 10-3 Mechanics of Ultrasonic Wire Bonding ........ 201 Termination Finishes for Separable
Connectors ...................................................... 102
Figure 10-4 Solderless Wire Wrap ................................... 214
Table 7-15 Bus Bars - Tin Whisker Concerns .................. 103
Table 7-16 Heat Sink Finishes and Tin Whiskers ............. 103
Tables Table 7-17 Printed Circuit Boards ..................................... 104
Table 2-1 Typical Static Charge Sources .......................... 15 Table 8-1 Lead Clinch Length ......................................... 125
Table 2-2 Typical Static Voltage Generation ..................... 15 Table 9-1 Intermetallic Compounds and Diffusion
Table 2-3 General Rules for Handling Electronic Constants for Near-Eutectic SnPb Solders .... 149
Assemblies ........................................................ 15 Table 9-2 Common Physical Property Values for
Lead-Free Solder ............................................ 150
Table 2-4 Wave Solder PSL Classification ....................... 18
Table 9-3 Effect of Temperature on Lap Shear
Table 2-5 Reflow Solder PSL Classification ...................... 18
Strength PSI (Pa) ............................................ 150
Table 2-6 PSL 3rd Character ............................................ 19
Table 9-4 Maximum Limits of Solder Bath
Table 3-1 Integrated Circuit Packaging Technology Contaminant .................................................... 158
Comparison ....................................................... 22
Table 9-5 Soldering Process Comparison ...................... 160
Table 4-1 PCB Typical Material Properties ....................... 33
Table 9-6 Hand Soldering Tools ...................................... 161
Table 4-2 Cross Reference of Plastic Laminate
Table 9-7 Unsupported Holes with Component
Specifications .................................................... 35
Leads, Minimum Acceptable Conditions ......... 168
Table 4-3 Properties of Metallic Foils ................................ 36
Table 9-8 Supported Holes with Component Leads,
Table 4-4 Final Finish and Coating Requirements ........... 39 Minimum Acceptable Conditions Note ............ 168
Table 4-5 Gold Plating Uses ............................................. 40 Table 9-9 Problems and Solutions in Vapor Phase
Soldering ......................................................... 187
Table 4-6 ENIG Surface Finish Advantages and
Disadvantages ................................................... 40 Table 10−1 Wire Bonding Technologies ............................ 202
Table 4-7 ENIG/EG Surface Finish Advantages and Table 10-2 K Values for Common
Limitations ......................................................... 41 Materials (watts/meter-°C) .............................. 206

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February 2012 IPC-AJ-820A

Table 10-3 Methods of Mounting Power Devices to Heat Table 10-11 Solderless Wrap Wire/Terminal Size
Sinks ................................................................ 208 Relationships ................................................... 215
Table 10-4 Thermal Greases and Their Properties .......... 208 Table 10-12 Elastomeric Connector Troubleshooting
Table 10-5 Physical Properties of Compressible Pads ..... 209 Guide ............................................................... 219

Table 10-6 Performance Properties of Electrically Table 12-1 Comparison of Conformal Coating Materials .. 236
Insulating Epoxies and Acrylics ...................... 210 Table 13-1 Material Compatibility ...................................... 251
Table 10-7 Standard Joining Material ............................... 210 Table 13-2 Temperature Classifications of Automotive
Table 10-8 Alternate Joining Material Evaluation Industry ............................................................ 268
Test Method ..................................................... 210 Table 14-1 Conformal Coating Characteristics ................. 280
Table 10-9 Number of Solderless (Wire) Wrap Turns ...... 214 Table 14-2 Removal Method ............................................. 280
Table 10-10 Solderless (Wire) Wrap Strip Force ................ 215

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February 2012 IPC-AJ-820A

Assembly and Joining Handbook

IPC-AJ-820 OUTLINE
The purpose of this Assembly and Joining Handbook is to provide practical and useful information regarding various
approaches and techniques for the interconnection of electronic components. The table of contents is an indication of the
variety of data included in this document.
Chapter 1 Introduction
Chapter 2 Handling Electronic Assemblies
Chapter 3 Design Considerations
Chapter 4 Printed Boards
Chapter 5 Electronic Circuit Components
Chapter 6 Solderability
Chapter 7 Assembly and Joining Materials
Chapter 8 Component Mounting
Chapter 9 Solder Techniques and Connections
Chapter 10 Other Assembly and Joining Methods
Chapter 11 Cleaning and Cleanliness
Chapter 12 Conformal Coating (HDBK-830)
Chapter 13 Encapsulation and Potting
Chapter 14 Rework and Repair

1 SCOPE
This document provides guidelines and supporting information for manufacturing electronic assemblies. The intent is to
explain the ‘‘how-to’’ and ‘‘why’’ information, and fundamentals for these processes.
Additional detailed information can be found in documents referenced within each individual section. Users are encouraged
to use those referenced documents to better understand the applicable subject areas.
The words ‘‘shall,’’ ‘‘must,’’ etc., are used in various places within this handbook. However, nothing within this handbook
is considered mandatory unless otherwise specified in the design or contract documentation. In event of a conflict between
the content of this handbook and the requirements invoked by the design or contract documentation, the requirements of the
design or contract documentation shall take precedence.

1.1 Assembly and Joining Technology Selection of appropriate assembly and joining techniques for electronic circuits
should consider the requirements of the end product equipment and subassembly, including form, fit, function, cost effec-
tiveness, performance, and marketability. Other factors include packaging density, assembly profile height, development
time, development cost, circuit element factors, manufacturing costs, thermal considerations, reliability, and specific imple-
mentation details.
The assembly process steps differ according to the type of product being assembled, i.e., through-hole, surface mount, or
mixed technology. They also vary according to manufacturer expertise, experience, and preference.
The selection of a particular method for mounting and terminating a component will also depend on the type of component
(size, weight and shape), the equipment available for mounting and interconnecting, the connection method (e.g., soldering,
welding, or crimping), the reliability and maintainability (ease of replacement) required, and of course, cost.

1.2 Through-Hole Technology The most significant advantage of through-hole mounting is compatibility with conven-
tional mass soldering techniques, such as dip and wave soldering. One of the significant disadvantages is space. Through-
hole parts usually take up a much larger footprint on the PWA than a similar surface mount component. They also require
space on both sides of the board, as the leads protrude through to the opposite side.

1.3 Surface Mount Technology The most obvious benefits of surface mount technology (SMT) compared to older
through-hole (THT) technology are increased circuit density and improved electrical performance. Less obvious benefits
include lower process costs, higher product quality, reduced handling costs, and higher reliability.