PIC16C9XX

8-Bit CMOS Microcontroller with LCD Driver

Devices included in this data sheet: Available in Die Form
• PIC16C923
• PIC16C924
Microcontroller Core Features:
• High performance RISC CPU
• Only 35 single word instructions to learn
• 4K x 14 on-chip EPROM program memory
• 176 x 8 general purpose registers (SRAM)
• All single cycle instructions (500 ns) except for
program branches which are two-cycle
• Operating speed: DC - 8 MHz clock input
DC - 500 ns instruction cycle
• Interrupt capability
• Eight level deep hardware stack
• Direct, indirect and relative addressing modes
Peripheral Features:
• 25 I/O pins with individual direction control
• 25-27 input only pins
• Timer0: 8-bit timer/counter with 8-bit prescaler • Synchronous Serial Port (SSP) with SPI
• Timer1: 16-bit timer/counter, can be incremented and I2C
during sleep via external crystal/clock • 8-bit multi-channel Analog to Digital converter
• Timer2: 8-bit timer/counter with 8-bit period regis- (PIC16C924 only)
ter, prescaler and postscaler Special Microcontroller Features:
• One pin that can be configured a capture input, • Power-on Reset (POR)
PWM output, or compare output
• Power-up Timer (PWRT) and Oscillator Start-up
- Capture is 16-bit, max. resolution 31.25 ns Timer (OST)
- Compare is 16-bit, max. resolution 500 ns • Watchdog Timer (WDT) with its own on-chip RC
- PWM max resolution is 10-bits. oscillator for reliable operation
Maximum PWM frequency @ 8-bit resolution • Programmable code-protection
= 32 kHz, @ 10-bit resolution = 8 kHz
• Power saving SLEEP mode
• Programmable LCD timing module • Selectable oscillator options
- Multiple LCD timing sources available
• In-Circuit Serial Programming™ (via two pins)
- Can drive LCD panel while in Sleep mode
- Static, 1/2, 1/3, 1/4 multiplex CMOS Technology
- Static drive and 1/3 bias capability • Low-power, high-speed CMOS EPROM
- 16 bytes of dedicated LCD RAM technology
- Up to 32 segments, up to 4 commons • Fully static design
Common Segment Pixels • Wide operating voltage range: 2.5V to 6.0V
1 32 32 • Commercial and Industrial temperature ranges
2 31 62 • Low-power consumption:
3 30 90 - < 2 mA @ 5.5V, 4 MHz
4 29 116 - 22.5 µA typical @ 4V, 32 kHz
- < 1 µA typical standby current @ 3.0V

ICSP is a trademark of Microchip Technology Inc. I2C is a trademark of Philips Corporation. SPI is a trademark of Motorola Corporation.

 1997 Microchip Technology Inc. DS30444E - page 1

PIC16C9XX
Pin Diagrams

RD7/SEG31/COM1
RD6/SEG30/COM2
MCLR/VPP

COM0
PLCC

RA3
RA2

RA1
RA0
RB2
RB3

RB4
RB5
RB7
RB6
VDD
VSS

N/C
9
8
7
6
5
4
3
2
1
68
67
66
65
64
63
62
61
RA4/T0CKI 10 60 RD5/SEG29/COM3
RA5/SS 11 59 RG6/SEG26
RB1 12 58 RG5/SEG25
RB0/INT 13 57 RG4/SEG24
RC3/SCK/SCL 14 56 RG3/SEG23
RC4/SDI/SDA 15 55 RG2/SEG22
RC5/SDO 16 54 RG1/SEG21
C1 17 RG0/SEG20
C2 18 PIC16C923 53
52 RG7/SEG28
VLCD2 19 51 RF7/SEG19
VLCD3 20 50 RF6/SEG18
VDD 21 49 RF5/SEG17
VDD 22 48 RF4/SEG16
VSS 23 47 RF3/SEG15
OSC1/CLKIN 24 46 RF2/SEG14
OSC2/CLKOUT 25 45 RF1/SEG13
RC0/T1OSO/T1CKI 26 44 RF0/SEG12

27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
Shrink PDIP (750 mil)

MCLR/VPP 1 64 RB4

RC1/T1OSI
RC2/CCP1

VLCDADJ
RD0/SEG00
RD1/SEG01
RD2/SEG02
RD3/SEG03
RD4/SEG04
RE7/SEG27
RE0/SEG05
RE1/SEG06
RE2/SEG07
RE3/SEG08
RE4/SEG09
RE5/SEG10
RE6/SEG11
VLCD1
RB3 2 63 RB5
RB2 3 62 RB7
RA0 4 61 RB6
RA1 5 60 VDD
VSS 6 59 COM0
RA2 7 58 RD7/SEG31/COM1
RA3 8 57 RD6/SEG30/COM2
RA4/T0CKI 9 56 RD5/SEG29/COM3
RA5/SS 10 55 RG6/SEG26
RB1 11 54 RG5/SEG25
PIC16C923

RB0/INT 12 53 RG4/SEG24
RC3/SCK/SCL 13 52 RG3/SEG23
RC4/SDI/SDA 14 51 RG2/SEG22
RC5/SDO 15 50 RG1/SEG21
C1 16 49 RG0/SEG20
C2 17 48 RF7/SEG19
VLCD2 18 47 RF6/SEG18
VLCD3 19 46 RF5/SEG17
VDD 20 45 RF4/SEG16
VSS 21 44 RF3/SEG15
OSC1/CLKIN 22 43
RD7/SEG31/COM1
RF2/SEG14 RD6/SEG30/COM2
OSC2/CLKOUT 23 42 RF1/SEG13
RC0/T1OSO/T1CKI 24 41 RF0/SEG12
RC1/T1OSI 40
MCLR/VPP

25 RE6/SEG11
RC2/CCP1 26 39 RE5/SEG10
COM0

VLCD1 27 38 RE4/SEG09
RA3
RA2

RA1
RA0
RB2

RB4
RB5
RB7
RB6
RB3

VDD
VSS

VLCDADJ 28 37 RE3/SEG08 TQFP

RD0/SEG00 29 36 RE2/SEG07
RD1/SEG01 30 35 RE1/SEG06
RD2/SEG02 31 34 RE0/SEG05
RD3/SEG03 32 33 RD4/SEG04
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49

RA4/T0CKI 1 48 RD5/SEG29/COM3
RA5/SS 2 47 RG6/SEG26
RB1 3 46 RG5/SEG25
RB0/INT 4 45 RG4/SEG24
RC3/SCK/SCL 5 44 RG3/SEG23
RC4/SDI/SDA 6 43 RG2/SEG22
RC5/SDO 7 42 RG1/SEG21
C1 8 41 RG0/SEG20
C2 9 PIC16C923 40 RF7/SEG19
VLCD2 10 39 RF6/SEG18
VLCD3 11 38 RF5/SEG17
VDD 12 37 RF4/SEG16
VSS 13 36 RF3/SEG15
OSC1/CLKIN 14 35 RF2/SEG14
OSC2/CLKOUT 15 34 RF1/SEG13
RC0/T1OSO/T1CKI 16 33 RF0/SEG12
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
RC1/T1OSI
RC2/CCP1

VLCDADJ
RD0/SEG00
RD1/SEG01
RD2/SEG02
RD3/SEG03
RD4/SEG04
RE0/SEG05
RE1/SEG06
RE2/SEG07
RE3/SEG08
RE4/SEG09
RE5/SEG10
RE6/SEG11
VLCD1

LEGEND:

Input Pin
Output Pin
Input/Output Pin
Digital Input/LCD Output Pin
LCD Output Pin

DS30444E - page 2  1997 Microchip Technology Inc.

 PIC16C9XX
Pin Diagrams (Cont.’d)

RD7/SEG31/COM1
RD6/SEG30/COM2
RA3/AN3/VREF

MCLR/VPP
RA2/AN2

RA1/AN1
RA0/AN0
PLCC

COM0
RB2
RB3

RB4
RB5
RB7
RB6
VDD
VSS

N/C
9
8
7
6
5
4
3
2
1
68
67
66
65
64
63
62
61
RA4/T0CKI 10 60 RD5/SEG29/COM3
RA5/AN4/SS 11 59 RG6/SEG26
RB1 12 58 RG5/SEG25
RB0/INT 13 57 RG4/SEG24
RC3/SCK/SCL 14 56 RG3/SEG23
RC4/SDI/SDA 15 55 RG2/SEG22
RC5/SDO 16 54 RG1/SEG21
C1
C2
17
18 PIC16C924 53
52
RG0/SEG20
RG7/SEG28
VLCD2 19 51 RF7/SEG19
VLCD3 20 50 RF6/SEG18
AVDD 21 49 RF5/SEG17
VDD 22 48 RF4/SEG16
VSS 23 47 RF3/SEG15
OSC1/CLKIN 24 46 RF2/SEG14
Shrink PDIP (750 mil) OSC2/CLKOUT 25 45 RF1/SEG13
RC0/T1OSO/T1CKI 26 44 RF0/SEG12

27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
MCLR/VPP 1 64 RB4
RB3 2 63 RB5
RB2 3 62 RB7

RC1/T1OSI
RC2/CCP1

VLCDADJ
RD0/SEG00
RD1/SEG01
RD2/SEG02
RD3/SEG03
RD4/SEG04
RE7/SEG27
RE0/SEG05
RE1/SEG06
RE2/SEG07
RE3/SEG08
RE4/SEG09
RE5/SEG10
RE6/SEG11
VLCD1
RA0/AN0 4 61 RB6
RA1/AN1 5 60 VDD
VSS 6 59 COM0
RA2/AN2 7 58 RD7/SEG31/COM1
RA3/AN3/VREF 8 57 RD6/SEG30/COM2
RA4/T0CKI 9 56 RD5/SEG29/COM3
RA5/AN4/SS 10 55 RG6/SEG26
RB1 11 54 RG5/SEG25
PIC16C924

RB0/INT 12 53 RG4/SEG24
RC3/SCK/SCL 13 52 RG3/SEG23
RC4/SDI/SDA 14 51 RG2/SEG22
RC5/SDO 15 50 RG1/SEG21
C1 16 49 RG0/SEG20
C2 17 48 RF7/SEG19
VLCD2 18 47 RF6/SEG18
VLCD3 19 46 RF5/SEG17
VDD 20 45 RF4/SEG16
VSS 21 44 RF3/SEG15
OSC1/CLKIN 22 43 RF2/SEG14
OSC2/CLKOUT 23 42 RF1/SEG13

RD7/SEG31/COM1
RD6/SEG30/COM2
RC0/T1OSO/T1CKI 24 41 RF0/SEG12
RC1/T1OSI 25 40 RE6/SEG11
RA3/AN3/VREF

RC2/CCP1 26 39 RE5/SEG10
MCLR/VPP

VLCD1 27 38 RE4/SEG09
RA2/AN2

RA1/AN1
RA0/AN0

VLCDADJ 28 37 RE3/SEG08
COM0

RD0/SEG00 36
RB2

RB4
RB5
RB7
RB6
RB3

RE2/SEG07
VDD

29
VSS

RD1/SEG01 30 35 RE1/SEG06
RD2/SEG02 31 34 RE0/SEG05
RD3/SEG03 32 33 RD4/SEG04
TQFP
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49

RA4/T0CKI 1 48 RD5/SEG29/COM3
RA5/AN4/SS 2 47 RG6/SEG26
RB1 3 46 RG5/SEG25
RB0/INT 4 45 RG4/SEG24
RC3/SCK/SCL 5 44 RG3/SEG23
RC4/SDI/SDA 6 43 RG2/SEG22
RC5/SDO 7 42 RG1/SEG21
C1 8 41 RG0/SEG20
C2 9 PIC16C924 40 RF7/SEG19
VLCD2 10 39 RF6/SEG18
VLCD3 11 38 RF5/SEG17
VDD 12 37 RF4/SEG16
VSS 13 36 RF3/SEG15
OSC1/CLKIN 14 35 RF2/SEG14
OSC2/CLKOUT 15 34 RF1/SEG13
RC0/T1OSO/T1CKI 16 33 RF0/SEG12
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
RC1/T1OSI
RC2/CCP1

VLCDADJ
RD0/SEG00
RD1/SEG01
RD2/SEG02
RD3/SEG03
RD4/SEG04
RE0/SEG05
RE1/SEG06
RE2/SEG07
RE3/SEG08
RE4/SEG09
RE5/SEG10
RE6/SEG11
VLCD1

LEGEND:

Input Pin
Output Pin
Input/Output Pin
Digital Input/LCD Output Pin
LCD Output Pin

 1997 Microchip Technology Inc. DS30444E - page 3

PIC16C9XX
Table of Contents
1.0 General Description..................................................................................................................................................................... 5
2.0 PIC16C9XX Device Varieties ...................................................................................................................................................... 7
3.0 Architectural Overview ................................................................................................................................................................ 9
4.0 Memory Organization ................................................................................................................................................................ 17
5.0 Ports .......................................................................................................................................................................................... 31
6.0 Overview of Timer Modules....................................................................................................................................................... 43
7.0 Timer0 Module .......................................................................................................................................................................... 45
8.0 Timer1 Module .......................................................................................................................................................................... 51
9.0 Timer2 Module .......................................................................................................................................................................... 55
10.0 Capture/Compare/PWM (CCP) Module .................................................................................................................................... 57
11.0 Synchronous Serial Port (SSP) Module .................................................................................................................................... 63
12.0 Analog-to-Digital Converter (A/D) Module ................................................................................................................................. 79
13.0 LCD Module .............................................................................................................................................................................. 89
14.0 Special Features of the CPU ................................................................................................................................................... 103
15.0 Instruction Set Summary ......................................................................................................................................................... 119
16.0 Development Support.............................................................................................................................................................. 137
17.0 Electrical Characteristics ......................................................................................................................................................... 141
18.0 DC and AC Characteristics Graphs and Tables ...................................................................................................................... 161
19.0 Packaging Information............................................................................................................................................................. 171
Appendix A: ................................................................................................................................................................................... 175
Appendix B: Compatibility ............................................................................................................................................................. 175
Appendix C: What’s New................................................................................................................................................................ 176
Appendix D: What’s Changed ........................................................................................................................................................ 176
Index .................................................................................................................................................................................................. 177
List of Equations And Examples ........................................................................................................................................................ 181
List of Figures..................................................................................................................................................................................... 181
List of Tables...................................................................................................................................................................................... 182
Reader Response .............................................................................................................................................................................. 186
PIC16C9XX Product Identification System ........................................................................................................................................ 187

To Our Valued Customers

We constantly strive to improve the quality of all our products and documentation. We have spent an exceptional
amount of time to ensure that these documents are correct. However, we realize that we may have missed a few
things. If you find any information that is missing or appears in error, please use the reader response form in the
back of this data sheet to inform us. We appreciate your assistance in making this a better document.

DS30444E - page 4  1997 Microchip Technology Inc.

 PIC16C9XX
1.0 GENERAL DESCRIPTION mode. The user can wake up the chip from SLEEP
through several external and internal interrupts and
The PIC16C9XX is a family of low-cost, high-perfor- reset(s).
mance, CMOS, fully-static, 8-bit microcontrollers with
an integrated LCD Driver module, in the PIC16CXXX A highly reliable Watchdog Timer with its own on-chip
mid-range family. RC oscillator provides recovery in the event of a soft-
ware lock-up.
All PICmicro™ microcontrollers employ an advanced
RISC architecture. The PIC16CXXX microcontroller A UV erasable CERQUAD (compatible with PLCC)
family has enhanced core features, eight-level deep packaged version is ideal for code development while
stack, and multiple internal and external interrupt the cost-effective One-Time-Programmable (OTP) ver-
sources. The separate instruction and data buses of the sion is suitable for production in any volume.
Harvard architecture allow a 14-bit wide instruction The PIC16C9XX family fits perfectly in applications
word with the separate 8-bit wide data. The two stage ranging from handheld meters, thermostats, to home
instruction pipeline allows all instructions to execute in security products. The EPROM technology makes cus-
a single cycle, except for program branches (which tomization of application programs (LCD panels, cali-
require two cycles). A total of 35 instructions (reduced bration constants, sensor interfaces, etc.) extremely
instruction set) are available. Additionally, a large regis- fast and convenient. The small footprint packages make
ter set gives some of the architectural innovations used this microcontroller series perfect for all applications
to achieve a very high performance. with space limitations. Low cost, low power, high perfor-
PIC16CXXX microcontrollers typically achieve a 2:1 mance, ease of use and I/O flexibility make the
code compression and a 4:1 speed improvement over PIC16C9XX very versatile even in areas where no
other 8-bit microcontrollers in their class. microcontroller use has been considered before (e.g.
timer functions, capture and compare, PWM functions
The PIC16C923 devices have 176 bytes of RAM and and coprocessor applications).
25 I/O pins. In addition several peripheral features are
available including: three timer/counters, one Cap- 1.1 Family and Upward Compatibility
ture/Compare/PWM module, one serial port and one
LCD module. The Synchronous Serial Port can be con- Users familiar with the PIC16C5X microcontroller family
figured as either a 3-wire Serial Peripheral Interface will realize that this is an enhanced version of the
(SPI) or the two-wire Inter-Integrated Circuit (I 2C) bus. PIC16C5X architecture. Please refer to Appendix A for
The LCD module features programmable multiplex a detailed list of enhancements. Code written for the
mode (static, 1/2, 1/3 and 1/4) and drive bias (static and PIC16C5X can be easily ported to the PIC16CXXX
1/3). It is capable of driving up to 32 segments and up family of devices (Appendix B).
to 4 commons. It can also drive the LCD panel while in
1.2 Development Support
SLEEP mode.
PIC16C9XX devices are supported by the complete
The PIC16C924 devices have 176 bytes of RAM and
line of Microchip Development tools.
25 I/O pins. In addition several peripheral features are
available including: three timer/counters, one Cap- Please refer to Section 16.0 for more details about
ture/Compare/PWM module, one serial port and one Microchip’s development tools.
LCD module. The Synchronous Serial Port can be con-
figured as either a 3-wire Serial Peripheral Interface
(SPI) or the two-wire Inter-Integrated Circuit (I 2C) bus.
The LCD module features programmable multiplex
mode (static, 1/2, 1/3 and 1/4) and drive bias (static and
1/3). It is capable of driving up to 32 segments and up
to 4 commons. It can also drive the LCD panel while in
SLEEP mode. The PIC16C924 also has an 5-channel
high-speed 8-bit A/D. The 8-bit resolution is ideally
suited for applications requiring low-cost analog inter-
face, e.g. thermostat control, pressure sensing, and
meters.
The PIC16C9XX family has special features to reduce
external components, thus reducing cost, enhancing
system reliability and reducing power consumption.
There are four oscillator options, of which the single pin
RC oscillator provides a low-cost solution, the LP oscil-
lator minimizes power consumption, XT is a standard
crystal, and the HS is for High Speed crystals. The
SLEEP (power-down) feature provides a power saving

 1997 Microchip Technology Inc. DS30444E- page 5

PIC16C9XX
TABLE 1-1: PIC16C9XX FAMILY OF DEVICES
PIC16C923 PIC16C924
Clock Maximum Frequency of Operation (MHz) 8 8
EPROM Program Memory 4K 4K
Memory
Data Memory (bytes) 176 176
Timer Module(s) TMR0, TMR0,
TMR1, TMR1,
TMR2 TMR2
Capture/Compare/PWM Module(s) 1 1
Serial Port(s) SPI/I2C SPI/I2C
Peripherals (SPI/I2C, USART)

Parallel Slave Port — —

A/D Converter (8-bit) Channels — 5
LCD Module 4 Com, 4 Com,
32 Seg 32 Seg
Interrupt Sources 8 9
I/O Pins 25 25
Input Pins 27 27
Voltage Range (Volts) 2.5-6.0 2.5-6.0
Features In-Circuit Serial Programming Yes Yes
Brown-out Reset — —
Packages 64-pin SDIP, 64-pin SDIP,
TQFP; TQFP;
68-pin PLCC, 68-pin PLCC,
Die Die
All PICmicro Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capabil-
ity. All PIC16C9XX Family devices use serial programming with clock pin RB6 and data pin RB7.

DS30444E - page 6  1997 Microchip Technology Inc.

 PIC16C9XX
2.0 PIC16C9XX DEVICE VARIETIES 2.3 Quick-Turnaround-Production (QTP)
Devices
A variety of frequency ranges and packaging options
are available. Depending on application and production Microchip offers a QTP Programming Service for fac-
requirements, the proper device option can be selected tory production orders. This service is made available
using the information in the PIC16C9XX Product Iden- for users who choose not to program a medium to high
tification System section at the end of this data sheet. quantity of units and whose code patterns have stabi-
When placing orders, please use that page of the data lized. The devices are identical to the OTP devices but
sheet to specify the correct part number. with all EPROM locations and configuration options
For the PIC16C9XX family, there are two device “types” already programmed by the factory. Certain code and
as indicated in the device number: prototype verification procedures apply before produc-
tion shipments are available. Please contact your local
1. C, as in PIC16C924. These devices have
Microchip Technology sales office for more details.
EPROM type memory and operate over the
standard voltage range. 2.4 Serialized Quick-Turnaround
2. LC, as in PIC16LC924. These devices have Production (SQTPSM) Devices
EPROM type memory and operate over an
extended voltage range. Microchip offers a unique programming service where
a few user-defined locations in each device are pro-
2.1 UV Erasable Devices grammed with different serial numbers. The serial num-
bers may be random, pseudo-random or sequential.
The UV erasable version, offered in CERQUAD pack-
age, is optimal for prototype development and pilot pro- Serial programming allows each device to have a
grams. unique number which can serve as an entry-code,
password or ID number.
The UV erasable version can be erased and repro-
grammed to any of the configuration modes.
Microchip's PICSTART Plus and PRO MATE II pro-
grammers both support the PIC16C9XX. Third party
programmers also are available; refer to the Microchip
Third Party Guide for a list of sources.

2.2 One-Time-Programmable (OTP)

Devices
The availability of OTP devices is especially useful for
customers who need the flexibility for frequent code
updates and small volume applications.
The OTP devices, packaged in plastic packages, permit
the user to program them once. In addition to the pro-
gram memory, the configuration bits must also be pro-
grammed.

 1997 Microchip Technology Inc. DS30444E - page 7

PIC16C9XX
NOTES:

DS30444E - page 8  1997 Microchip Technology Inc.

 PIC16C9XX
3.0 ARCHITECTURAL OVERVIEW PIC16CXXX devices contain an 8-bit ALU and working
register. The ALU is a general purpose arithmetic unit.
The high performance of the PIC16CXXX family can be It performs arithmetic and Boolean functions between
attributed to a number of architectural features com- the data in the working register and any register file.
monly found in RISC microprocessors. To begin with,
the PIC16CXXX uses a Harvard architecture, in which, The ALU is 8-bits wide and capable of addition, sub-
program and data are accessed from separate memo- traction, shift and logical operations. Unless otherwise
ries using separate buses. This improves bandwidth mentioned, arithmetic operations are two's comple-
over traditional von Neumann architecture where pro- ment in nature. In two-operand instructions, typically
gram and data are fetched from the same memory one operand is the working register (W register). The
using the same bus. Separating program and data other operand is a file register or an immediate con-
buses further allows instructions to be sized differently stant. In single operand instructions, the operand is
than the 8-bit wide data word. Instruction opcodes are either the W register or a file register.
14-bits wide making it possible to have all single word The W register is an 8-bit working register used for ALU
instructions. A 14-bit wide program memory access bus operations. It is not an addressable register.
fetches a 14-bit instruction in a single cycle. A
Depending on the instruction executed, the ALU may
two-stage pipeline overlaps fetch and execution of
affect the values of the Carry (C), Digit Carry (DC), and
instructions (Example 3-1). Consequently, all instruc-
Zero (Z) bits in the STATUS register. The C and DC bits
tions execute in a single cycle (500 ns @ 8 MHz) except
operate as a borrow bit and a digit borrow out bit,
for program branches.
respectively, in subtraction. See the SUBLW and SUBWF
The PIC16C923 and PIC16C924 both address 4K x 14 instructions for examples.
of program memory and 176 x 8 of data memory.
The PIC16CXXX can directly or indirectly address its
register files or data memory. All special function regis-
ters, including the program counter, are mapped in the
data memory. The PIC16CXXX has an orthogonal
(symmetrical) instruction set that makes it possible to
carry out any operation on any register using any
addressing mode. This symmetrical nature and lack of
‘special optimal situations’ make programming with the
PIC16CXXX simple yet efficient, thus significantly
reducing the learning curve.

 1997 Microchip Technology Inc. DS30444E - page 9

PIC16C9XX
FIGURE 3-1: PIC16C923 BLOCK DIAGRAM

13 Data Bus 8 PORTA

EPROM Program Counter
RA0
Program RA1
Memory RA2
RAM RA3
8 Level Stack
4K x 14 File RA4/T0CKI
(13-bit) Registers
RA5/SS
176 x 8
Program 14
Bus RAM Addr 9 PORTB
Addr MUX
Instruction reg
RB0/INT
Direct Addr 7 Indirect
8 Addr
FSR reg RB1-RB7

STATUS reg
8 PORTC
RC0/T1OSO/T1CKI
RC1/T1OSI
3 RC2/CCP1
Power-up MUX
RC3/SCK/SCL
Timer
RC4/SDI/SDA
Instruction Oscillator RC5/SDO
Decode & Start-up Timer ALU
Control
Power-on
Reset 8 PORTD
Timing Watchdog
Generation Timer W reg RD0-RD4/SEGnn
OSC1/CLKIN
OSC2/CLKOUT
RD5-RD7/SEGnn/COMn

MCLR VDD, VSS

PORTE

RE0-RE7/SEGnn

PORTF

RF0-RF7/SEGnn

PORTG

RG0-RG7/SEGnn

Timer1, Timer2,
Timer0
CCP1

Synchronous COM0
Serial Port VLCD1
VLCD2
LCD VLCD3
C1
C2
VLCDADJ

DS30444E - page 10  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 3-2: PIC16C924 BLOCK DIAGRAM

13 Data Bus 8 PORTA

EPROM Program Counter
RA0/AN0
Program RA1/AN1
Memory RA2/AN2
RAM RA3/AN3/VREF
8 Level Stack
4K x 14 File RA4/T0CKI
(13-bit) Registers
RA5/AN4/SS
176 x 8
Program 14
Bus RAM Addr 9 PORTB
Addr MUX
Instruction reg
RB0/INT
Direct Addr 7 Indirect
8 Addr
FSR reg RB1-RB7

STATUS reg
8 PORTC
RC0/T1OSO/T1CKI
RC1/T1OSI
3 RC2/CCP1
Power-up MUX
RC3/SCK/SCL
Timer
RC4/SDI/SDA
Instruction Oscillator RC5/SDO
Decode & Start-up Timer ALU
Control
Power-on
Reset 8 PORTD
Timing Watchdog
Generation Timer W reg RD0-RD4/SEGnn
OSC1/CLKIN
OSC2/CLKOUT
RD5-RD7/SEGnn/COMn

MCLR VDD, VSS

PORTE

RE0-RE7/SEGnn

PORTF

RF0-RF7/SEGnn

PORTG

RG0-RG7/SEGnn

Timer1, Timer2,
Timer0 A/D
CCP1

Synchronous COM0
Serial Port VLCD1
VLCD2
LCD VLCD3
C1
C2
VLCDADJ

 1997 Microchip Technology Inc. DS30444E - page 11

PIC16C9XX
TABLE 3-1: PIC16C9XX PINOUT DESCRIPTION
DIP PLCC TQFP Pin Buffer
Pin Name Description
Pin# Pin# Pin# Type Type

OSC1/CLKIN 22 24 14 I ST/CMOS Oscillator crystal input or external clock source input. This
buffer is a Schmitt Trigger input when configured in RC
oscillator mode and a CMOS input otherwise.
OSC2/CLKOUT 23 25 15 O — Oscillator crystal output. Connects to crystal or resonator
in crystal oscillator mode. In RC mode, OSC2 pin outputs
CLKOUT which has 1/4 the frequency of OSC1, and
denotes the instruction cycle rate.
MCLR/VPP 1 2 57 I/P ST Master clear (reset) input or programming voltage input.
This pin is an active low reset to the device.
PORTA is a bi-directional I/O port. The AN and VREF multi-
plexed functions are used by the PIC16C924 only.
RA0/AN0 4 5 60 I/O TTL RA0 can also be Analog input0.
RA1/AN1 5 6 61 I/O TTL RA1 can also be Analog input1.
RA2/AN2 7 8 63 I/O TTL RA2 can also be Analog input2.
RA3/AN3/VREF 8 9 64 I/O TTL RA3 can also be Analog input3 or A/D Voltage Refer-
ence.
RA4/T0CKI 9 10 1 I/O ST RA4 can also be the clock input to the Timer0
timer/counter. Output is open drain type.
RA5/AN4/SS 10 11 2 I/O TTL RA5 can be the slave select for the synchronous serial
port or Analog input4.
PORTB is a bi-directional I/O port. PORTB can be software
programmed for internal weak pull-ups on all inputs.
RB0/INT 12 13 4 I/O TTL/ST RB0 can also be the external interrupt pin. This buffer
is a Schmitt Trigger input when configured as an exter-
nal interrupt.
RB1 11 12 3 I/O TTL
RB2 3 4 59 I/O TTL
RB3 2 3 58 I/O TTL
RB4 64 68 56 I/O TTL Interrupt on change pin.
RB5 63 67 55 I/O TTL Interrupt on change pin.
RB6 61 65 53 I/O TTL/ST Interrupt on change pin. Serial programming clock.
This buffer is a Schmitt Trigger input when used in
serial programming mode.
RB7 62 66 54 I/O TTL/ST Interrupt on change pin. Serial programming data.
This buffer is a Schmitt Trigger input when used in
serial programming mode.
PORTC is a bi-directional I/O port.
RC0/T1OSO/T1CKI 24 26 16 I/O ST RC0 can also be the Timer1 oscillator output or
Timer1 clock input.
RC1/T1OSI 25 27 17 I/O ST RC1 can also be the Timer1 oscillator input.
RC2/CCP1 26 28 18 I/O ST RC2 can also be the Capture1 input/Compare1 out-
put/PWM1 output.
RC3/SCK/SCL 13 14 5 I/O ST RC3 can also be the synchronous serial clock
input/output for both SPI and I2C modes.
RC4/SDI/SDA 14 15 6 I/O ST RC4 can also be the SPI Data In (SPI mode) or data
I/O (I2C mode).
RC5/SDO 15 16 7 I/O ST RC5 can also be the SPI Data Out (SPI mode).
C1 16 17 8 P LCD Voltage Generation.
C2 17 18 9 P LCD Voltage Generation.
Legend: I = input O = output P = power L = LCD Driver
— = Not used TTL = TTL input ST = Schmitt Trigger input

DS30444E - page 12  1997 Microchip Technology Inc.

 PIC16C9XX
TABLE 3-1: PIC16C9XX PINOUT DESCRIPTION (Cont.’d)
DIP PLCC TQFP Pin Buffer
Pin Name Description
Pin# Pin# Pin# Type Type

COM0 59 63 51 L Common Driver0

PORTD is a digital input/output port. These pins are also
used as LCD Segment and/or Common Drivers.
RD0/SEG00 29 31 21 I/O/L ST Segment Driver00/Digital Input/Output.

RD1/SEG01 30 32 22 I/O/L ST Segment Driver01/Digital Input/Output.

RD2/SEG02 31 33 23 I/O/L ST Segment Driver02/Digital Input/Output.

RD3/SEG03 32 34 24 I/O/L ST Segment Driver03/Digital Input/Output.

RD4/SEG04 33 35 25 I/O/L ST Segment Driver04/Digital Input/Output.

RD5/SEG29/COM3 56 60 48 I/L ST Segment Driver29/Common Driver3/Digital Input.

RD6/SEG30/COM2 57 61 49 I/L ST Segment Driver30/Common Driver2/Digital Input.

RD7/SEG31/COM1 58 62 50 I/L ST Segment Driver31/Common Driver1/Digital Input.

PORTE is a digital input or LCD Segment Driver port.

RE0/SEG05 34 37 26 I/L ST Segment Driver05.

RE1/SEG06 35 38 27 I/L ST Segment Driver06.

RE2/SEG07 36 39 28 I/L ST Segment Driver07.

RE3/SEG08 37 40 29 I/L ST Segment Driver08.

RE4/SEG09 38 41 30 I/L ST Segment Driver09.

RE5/SEG10 39 42 31 I/L ST Segment Driver10.

RE6/SEG11 40 43 32 I/L ST Segment Driver11.

RE7/SEG27 - 36 - I/L ST Segment Driver27 (Not available on 64-pin devices).

PORTF is a digital input or LCD Segment Driver port.

RF0/SEG12 41 44 33 I/L ST Segment Driver12.

RF1/SEG13 42 45 34 I/L ST Segment Driver13.

RF2/SEG14 43 46 35 I/L ST Segment Driver14.

RF3/SEG15 44 47 36 I/L ST Segment Driver15.

RF4/SEG16 45 48 37 I/L ST Segment Driver16.

RF5/SEG17 46 49 38 I/L ST Segment Driver17.

RF6/SEG18 47 50 39 I/L ST Segment Driver18.

RF7/SEG19 48 51 40 I/L ST Segment Driver19.

PORTG is a digital input or LCD Segment Driver port.

RG0/SEG20 49 53 41 I/L ST Segment Driver20.

RG1/SEG21 50 54 42 I/L ST Segment Driver21.

RG2/SEG22 51 55 43 I/L ST Segment Driver22.

RG3/SEG23 52 56 44 I/L ST Segment Driver23.

RG4/SEG24 53 57 45 I/L ST Segment Driver24.

RG5/SEG25 54 58 46 I/L ST Segment Driver25.

RG6/SEG26 55 59 47 I/L ST Segment Driver26.

RG7/SEG28 — 52 — I/L ST Segment Driver28 (Not available on 64-pin devices).

VLCDADJ 28 30 20 P LCD Voltage Generation.

AVDD — 21 — P Analog Power (PIC16C924 only).
VDD — 21 — P Power (PIC16C923 only).
VLCD1 27 29 19 P LCD Voltage.
VLCD2 18 19 10 P — LCD Voltage.
Legend: I = input O = output P = power L = LCD Driver
— = Not used TTL = TTL input ST = Schmitt Trigger input

 1997 Microchip Technology Inc. DS30444E - page 13

PIC16C9XX
TABLE 3-1: PIC16C9XX PINOUT DESCRIPTION (Cont.’d)
DIP PLCC TQFP Pin Buffer
Pin Name Description
Pin# Pin# Pin# Type Type

VLCD3 19 20 11 P — LCD Voltage.

VDD 20, 60 22, 64 12, 52 P — Digital power.
VSS 6, 21 7, 23 13, 62 P — Ground reference.
NC — 1 — — — These pins are not internally connected. These pins should
be left unconnected.
Legend: I = input O = output P = power L = LCD Driver
— = Not used TTL = TTL input ST = Schmitt Trigger input

DS30444E - page 14  1997 Microchip Technology Inc.

 PIC16C9XX
3.1 Clocking Scheme/Instruction Cycle 3.2 Instruction Flow/Pipelining
The clock input (from OSC1) is internally divided by An “Instruction Cycle” consists of four Q cycles (Q1,
four to generate four non-overlapping quadrature Q2, Q3 and Q4). The instruction fetch and execute are
clocks namely Q1, Q2, Q3 and Q4. Internally, the pro- pipelined such that fetch takes one instruction cycle
gram counter (PC) is incremented every Q1, the while decode and execute takes another instruction
instruction is fetched from the program memory and cycle. However, due to the pipelining, each instruction
latched into the instruction register in Q4. The instruc- effectively executes in one cycle. If an instruction
tion is decoded and executed during the following Q1 causes the program counter to change (e.g. GOTO)
through Q4. The clocks and instruction execution flow then two cycles are required to complete the instruction
is shown in Figure 3-3. (Example 3-1).
A fetch cycle begins with the program counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is latched
into the “Instruction Register" in cycle Q1. This instruc-
tion is then decoded and executed during the Q2, Q3,
and Q4 cycles. Data memory is read during Q2 (oper-
and read) and written during Q4 (destination write).

FIGURE 3-3: CLOCK/INSTRUCTION CYCLE

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
Q1
Q2 Internal
phase
Q3 clock
Q4
PC PC PC+1 PC+2

OSC2/CLKOUT
(RC mode)
Fetch INST (PC)
Execute INST (PC-1) Fetch INST (PC+1)
Execute INST (PC) Fetch INST (PC+2)
Execute INST (PC+1)

EXAMPLE 3-1: INSTRUCTION PIPELINE FLOW

Tcy0 Tcy1 Tcy2 Tcy3 Tcy4 Tcy5

1. MOVLW 55h Fetch 1 Execute 1
2. MOVWF PORTB Fetch 2 Execute 2
3. CALL SUB_1 Fetch 3 Execute 3
4. BSF PORTA, BIT3 (Forced NOP) Fetch 4 Flush
5. Instruction @ address SUB_1 Fetch SUB_1 Execute SUB_1

All instructions are single cycle, except for any program branches. These take two cycles since the fetch
instruction is “flushed” from the pipeline while the new instruction is being fetched and then executed.

 1997 Microchip Technology Inc. DS30444E - page 15

PIC16C9XX
NOTES:

DS30444E - page 16  1997 Microchip Technology Inc.

 PIC16C9XX
4.0 MEMORY ORGANIZATION 4.2 Data Memory Organization
The data memory is partitioned into four Banks which
4.1 Program Memory Organization contain the General Purpose Registers and the Special
The PIC16C9XX family has a 13-bit program counter Function Registers. Bits RP1 and RP0 are the bank
capable of addressing an 8K x 14 program memory select bits.
space. RP1:RP0 (STATUS<6:5>)
Only the first 4K x 14 (0000h-0FFFh) is physically 11 = Bank 3 (180h-1FFh)
implemented. Accessing a location above the physi- 10 = Bank 2 (100h-17Fh)
cally implemented addresses will cause a wraparound.
The reset vector is at 0000h and the interrupt vector is 01 = Bank 1 (80h-FFh)
at 0004h. 00 = Bank 0 (00h-7Fh)
The lower locations of each Bank are reserved for the
FIGURE 4-1: PROGRAM MEMORY MAP Special Function Registers. Above the Special Func-
AND STACK tion Registers are General Purpose Registers imple-
mented as static RAM. All four banks contain special
PC<12:0> function registers. Some “high use” special function
CALL, RETURN registers are mirrored in other banks for code reduction
RETFIE, RETLW 13 and quicker access.

4.2.1 GENERAL PURPOSE REGISTER FILE

Stack Level 1
The register file can be accessed either directly, or indi-
rectly through the File Select Register FSR
Stack Level 8 (Section 4.5).
The following General Purpose Registers are not phys-
ically implemented:
Reset Vector 0000h
• F0h-FFh of Bank 1
• 170h-17Fh of Bank 2
• 1F0h-1FFh of Bank 3
User Memory

Interrupt Vector 0004h These locations are used for common access across
0005h
Space

On-chip Program banks.

Memory (Page 0)
07FFh
On-chip Program 0800h
Memory (Page 1)

0FFFh
1000h

1FFFh

 1997 Microchip Technology Inc. DS30444E - page 17

PIC16C9XX
FIGURE 4-2: REGISTER FILE MAP
File File File File
Address Address Address Address

Indirect addr.(1) 00h Indirect addr.(1) 80h Indirect addr.(1) 100h Indirect addr.(1) 180h
TMR0 01h OPTION 81h TMR0 101h OPTION 181h
PCL 02h PCL 82h PCL 102h PCL 182h
STATUS 03h STATUS 83h STATUS 103h STATUS 183h
FSR 04h FSR 84h FSR 104h FSR 184h
PORTA 05h TRISA 85h 105h 185h
PORTB 06h TRISB 86h PORTB 106h TRISB 186h
PORTC 07h TRISC 87h PORTF 107h TRISF 187h
PORTD 08h TRISD 88h PORTG 108h TRISG 188h
PORTE 09h TRISE 89h 109h 189h
PCLATH 0Ah PCLATH 8Ah PCLATH 10Ah PCLATH 18Ah
INTCON 0Bh INTCON 8Bh INTCON 10Bh INTCON 18Bh
PIR1 0Ch PIE1 8Ch 10Ch 18Ch
0Dh 8Dh LCDSE 10Dh 18Dh
TMR1L 0Eh PCON 8Eh LCDPS 10Eh 18Eh
TMR1H 0Fh 8Fh LCDCON 10Fh 18Fh
T1CON 10h 90h LCDD00 110h 190h
TMR2 11h 91h LCDD01 111h 191h
T2CON 12h PR2 92h LCDD02 112h 192h
SSPBUF 13h SSPADD 93h LCDD03 113h 193h
SSPCON 14h SSPSTAT 94h LCDD04 114h 194h
CCPR1L 15h 95h LCDD05 115h 195h
CCPR1H 16h 96h LCDD06 116h 196h
CCP1CON 17h 97h LCDD07 117h 197h
18h 98h LCDD08 118h 198h
19h 99h LCDD09 119h 199h
1Ah 9Ah LCDD10 11Ah 19Ah
1Bh 9Bh LCDD11 11Bh 19Bh
1Ch 9Ch LCDD12 11Ch 19Ch
1Dh 9Dh LCDD13 11Dh 19Dh
ADRES(2) 1Eh 9Eh LCDD14 11Eh 19Eh
ADCON0(2) 1Fh ADCON1(2) 9Fh LCDD15 11Fh 19Fh
20h A0h 120h 1A0h

General
Purpose
Register
General
Purpose
Register EFh 16F 1EFh
Mapped in F0h Mapped in 170 Mapped in 1F0h
Bank 0 Bank 0 Bank 0
70h-7Fh 70h-7Fh 70h-7Fh
7Fh FFh 17F 1FFh
Bank 0 Bank 1 Bank 2 Bank 3

Unimplemented data memory locations, read as '0'.

Note 1: Not a physical register.
2: These registers are not implemented on the PIC16C923.

DS30444E - page 18  1997 Microchip Technology Inc.

 PIC16C9XX
4.2.2 SPECIAL FUNCTION REGISTERS The special function registers can be classified into two
sets (core and peripheral). Those registers associated
The Special Function Registers are registers used by with the “core” functions are described in this section,
the CPU and Peripheral Modules for controlling the and those related to the operation of the peripheral fea-
desired operation of the device. These registers are tures are described in the section of that peripheral fea-
implemented as static RAM. ture.

TABLE 4-1: SPECIAL FUNCTION REGISTER SUMMARY

Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset

Bank 0
00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
01h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
02h PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
03h STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 000q quuu
04h FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
05h PORTA — — PORTA Data Latch when written: PORTA pins when read (4) (4)
06h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu
07h PORTC — — PORTC Data Latch when written: PORTC pins when read --xx xxxx --uu uuuu
08h PORTD PORTD Data Latch when written: PORTD pins when read 0000 0000 0000 0000
09h PORTE PORTE pins when read 0000 0000 0000 0000
0Ah PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
0Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 LCDIF ADIF(2) — — SSPIF CCP1IF TMR2IF TMR1IF 00-- 0000 00-- 0000
0Dh — Unimplemented — —
0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
10h T1CON — — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu
11h TMR2 Timer2 module’s register 0000 0000 0000 0000
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
15h CCPR1L Capture/Compare/PWM Register (LSB) xxxx xxxx uuuu uuuu
16h CCPR1H Capture/Compare/PWM Register (MSB) xxxx xxxx uuuu uuuu
17h CCP1CON — — CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000
18h — Unimplemented — —
19h — Unimplemented — —
1Ah — Unimplemented — —
1Bh — Unimplemented — —
1Ch — Unimplemented — —
1Dh — Unimplemented — —
1Eh(1) ADRES A/D Result Register xxxx xxxx uuuu uuuu
1Fh(1) ADCON0 ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE (5)
ADON 0000 0000 0000 0000
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented read as '0',
shaded locations are unimplemented, read as ‘0’.
Note 1: Registers ADRES, ADCON0, and ADCON1 are not implemented in the PIC16C923, read as '0'.
2: These bits are reserved on the PIC16C923, always maintain these bits clear.
3: These pixels do not display, but can be used as general purpose RAM.
4: PIC16C923 reset values for PORTA: --xx xxxx for a POR, and --uu uuuu for all other resets,
PIC16C924 reset values for PORTA: --0x 0000 when read.
5: Bit1 of ADCON0 is reserved on the PIC16C924, always maintain this bit clear.

 1997 Microchip Technology Inc. DS30444E - page 19

PIC16C9XX
TABLE 4-1: SPECIAL FUNCTION REGISTER SUMMARY (Cont.’d)
Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset
Bank 1
80h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
81h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
82h PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
83h STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 000q quuu
84h FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
85h TRISA — — PORTA Data Direction Register --11 1111 --11 1111
86h TRISB PORTB Data Direction Register 1111 1111 1111 1111
87h TRISC — — PORTC Data Direction Register --11 1111 --11 1111
88h TRISD PORTD Data Direction Register 1111 1111 1111 1111
89h TRISE PORTE Data Direction Register 1111 1111 1111 1111
8Ah PCLATH — — — Write Buffer for the upper 5 bits of the PC ---0 0000 ---0 0000
8Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
8Ch PIE1 LCDIE ADIE(2) — — SSPIE CCP1IE TMR2IE TMR1IE 00-- 0000 00-- 0000
8Dh — Unimplemented — —
8Eh PCON — — — — — — POR — ---- --0- ---- --u-
8Fh — Unimplemented — —
90h — Unimplemented — —
91h — Unimplemented — —
92h PR2 Timer2 Period Register 1111 1111 1111 1111
93h SSPADD Synchronous Serial Port (I2C mode) Address Register 0000 0000 0000 0000
94h SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000
95h — Unimplemented — —
96h — Unimplemented — —
97h — Unimplemented — —
98h — Unimplemented — —
99h — Unimplemented — —
9Ah — Unimplemented — —
9Bh — Unimplemented — —
9Ch — Unimplemented — —
9Dh — Unimplemented — —
9Eh — Unimplemented — —
9Fh(1) ADCON1 — — — — — PCFG2 PCFG1 PCFG0 ---- -000 ---- -000
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented read as '0',
shaded locations are unimplemented, read as ‘0’.
Note 1: Registers ADRES, ADCON0, and ADCON1 are not implemented in the PIC16C923, read as '0'.
2: These bits are reserved on the PIC16C923, always maintain these bits clear.
3: These pixels do not display, but can be used as general purpose RAM.
4: PIC16C923 reset values for PORTA: --xx xxxx for a POR, and --uu uuuu for all other resets,
PIC16C924 reset values for PORTA: --0x 0000 when read.
5: Bit1 of ADCON0 is reserved on the PIC16C924, always maintain this bit clear.

DS30444E - page 20  1997 Microchip Technology Inc.

 PIC16C9XX
TABLE 4-1: SPECIAL FUNCTION REGISTER SUMMARY (Cont.’d)
Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset
Bank 2
100h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
101h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
102h PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
103h STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 000q quuu
104h FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
105h — Unimplemented — —
106h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu
107h PORTF PORTF pins when read 0000 0000 0000 0000
108h PORTG PORTG pins when read 0000 0000 0000 0000
109h — Unimplemented — —
10Ah PCLATH — — — Write Buffer for the upper 5 bits of the PC ---0 0000 ---0 0000
10Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
10Ch — Unimplemented — —
10Dh LCDSE SE29 SE27 SE20 SE16 SE12 SE9 SE5 SE0 1111 1111 1111 1111
10Eh LCDPS — — — — LP3 LP2 LP1 LP0 ---- 0000 ---- 0000
10Fh LCDCON LCDEN SLPEN — VGEN CS1 CS0 LMUX1 LMUX0 00-0 0000 00-0 0000
SEG07 SEG06 SEG05 SEG04 SEG03 SEG02 SEG01 SEG00
110h LCDD00 xxxx xxxx uuuu uuuu
COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0
SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG09 SEG08
111h LCDD01 xxxx xxxx uuuu uuuu
COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0
SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16
112h LCDD02 xxxx xxxx uuuu uuuu
COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0
SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24
113h LCDD03 xxxx xxxx uuuu uuuu
COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0
SEG07 SEG06 SEG05 SEG04 SEG03 SEG02 SEG01 SEG00
114h LCDD04 xxxx xxxx uuuu uuuu
COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1
SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG09 SEG08
115h LCDD05 xxxx xxxx uuuu uuuu
COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1
SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16
116h LCDD06 xxxx xxxx uuuu uuuu
COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1
SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24
117h LCDD07 xxxx xxxx uuuu uuuu
COM1(3) COM1 COM1 COM1 COM1 COM1 COM1 COM1
SEG07 SEG06 SEG05 SEG04 SEG03 SEG02 SEG01 SEG00
118h LCDD08 xxxx xxxx uuuu uuuu
COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2
SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG09 SEG08
119h LCDD09 xxxx xxxx uuuu uuuu
COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2
SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16
11Ah LCDD10 xxxx xxxx uuuu uuuu
COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2
SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24
11Bh LCDD11 xxxx xxxx uuuu uuuu
COM2(3) COM2(3) COM2 COM2 COM2 COM2 COM2 COM2
SEG07 SEG06 SEG05 SEG04 SEG03 SEG02 SEG01 SEG00
11Ch LCDD12 xxxx xxxx uuuu uuuu
COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3
SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG09 SEG08
11Dh LCDD13 xxxx xxxx uuuu uuuu
COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3
SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16
11Eh LCDD14 xxxx xxxx uuuu uuuu
COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3
SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24
11Fh LCDD15 xxxx xxxx uuuu uuuu
COM3(3) COM3(3) COM3(3) COM3 COM3 COM3 COM3 COM3
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented read as '0',
shaded locations are unimplemented, read as ‘0’.
Note 1: Registers ADRES, ADCON0, and ADCON1 are not implemented in the PIC16C923, read as '0'.
2: These bits are reserved on the PIC16C923, always maintain these bits clear.
3: These pixels do not display, but can be used as general purpose RAM.
4: PIC16C923 reset values for PORTA: --xx xxxx for a POR, and --uu uuuu for all other resets,
PIC16C924 reset values for PORTA: --0x 0000 when read.
5: Bit1 of ADCON0 is reserved on the PIC16C924, always maintain this bit clear.

 1997 Microchip Technology Inc. DS30444E - page 21

PIC16C9XX
TABLE 4-1: SPECIAL FUNCTION REGISTER SUMMARY (Cont.’d)
Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset
Bank 3
180h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
181h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
182h PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
183h STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 000q quuu
184h FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
185h — Unimplemented — —
186h TRISB PORTB Data Direction Register 1111 1111 1111 1111
187h TRISF PORTF Data Direction Register 1111 1111 1111 1111
188h TRISG PORTG Data Direction Register 1111 1111 1111 1111
189h — Unimplemented — —
18Ah PCLATH — — — Write Buffer for the upper 5 bits of the PC ---0 0000 ---0 0000
18Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
18Ch — Unimplemented — —
18Dh — Unimplemented — —
18Eh — Unimplemented — —
18Fh — Unimplemented — —
190h — Unimplemented — —
191h — Unimplemented — —
192h — Unimplemented — —
193h — Unimplemented — —
194h — Unimplemented — —
195h — Unimplemented — —
196h — Unimplemented — —
197h — Unimplemented — —
198h — Unimplemented — —
199h — Unimplemented — —
19Ah — Unimplemented — —
19Bh — Unimplemented — —
19Ch — Unimplemented — —
19Dh — Unimplemented — —
19Eh — Unimplemented — —
19Fh — Unimplemented — —
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented read as '0',
shaded locations are unimplemented, read as ‘0’.
Note 1: Registers ADRES, ADCON0, and ADCON1 are not implemented in the PIC16C923, read as '0'.
2: These bits are reserved on the PIC16C923, always maintain these bits clear.
3: These pixels do not display, but can be used as general purpose RAM.
4: PIC16C923 reset values for PORTA: --xx xxxx for a POR, and --uu uuuu for all other resets,
PIC16C924 reset values for PORTA: --0x 0000 when read.
5: Bit1 of ADCON0 is reserved on the PIC16C924, always maintain this bit clear.

DS30444E - page 22  1997 Microchip Technology Inc.

 PIC16C9XX
4.2.2.1 STATUS REGISTER It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
The STATUS register, shown in Figure 4-3, contains the STATUS register because these instructions do not
arithmetic status of the ALU, the RESET status and the affect the Z, C or DC bits from the STATUS register. For
bank select bits for data memory. other instructions, not affecting any status bits, see the
The STATUS register can be the destination for any “Instruction Set Summary.”
instruction, as with any other register. If the STATUS
Note 1: The C and DC bits operate as a borrow
register is the destination for an instruction that affects
and digit borrow bit, respectively, in sub-
the Z, DC or C bits, then the write to these three bits is
traction. See the SUBLW and SUBWF
disabled. These bits are set or cleared according to the
instructions for examples.
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For example, CLRF STATUS will clear the upper-three
bits and set the Z bit. This leaves the STATUS register
as 000u u1uu (where u = unchanged).

FIGURE 4-3: STATUS REGISTER (ADDRESS 03h, 83h, 103h, 183h)

R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x

IRP RP1 RP0 TO PD Z DC C R = Readable bit
W = Writable bit
bit7 bit0
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit 7: IRP: Register Bank Select bit (used for indirect addressing)
1 = Bank 2, 3 (100h - 1FFh)
0 = Bank 0, 1 (00h - FFh)
bit 6-5: RP1:RP0: Register Bank Select bits (used for direct addressing)
11 = Bank 3 (180h - 1FFh)
10 = Bank 2 (100h - 17Fh)
01 = Bank 1 (80h - FFh)
00 = Bank 0 (00h - 7Fh)
bit 4: TO: Time-out bit
1 = After power-up, CLRWDT instruction, or SLEEP instruction
0 = A WDT time-out occurred
bit 3: PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2: Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1: DC: Digit carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) (for borrow the polarity is reversed)
1 = A carry-out from the 4th low order bit of the result occurred
0 = No carry-out from the 4th low order bit of the result
bit 0: C: Carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) (for borrow the polarity is reversed)
1 = A carry-out from the most significant bit of the result occurred
0 = No carry-out from the most significant bit of the result occurred
Note: A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF,
RLF) instructions, this bit is loaded with either the high or low order bit of the source register.

 1997 Microchip Technology Inc. DS30444E - page 23

PIC16C9XX
4.2.2.2 OPTION REGISTER
Note: To achieve a 1:1 prescaler assignment for
The OPTION register is a readable and writable regis- the TMR0 register, assign the prescaler to
ter which contains various control bits to configure the the Watchdog Timer.
TMR0/WDT prescaler, the external RB0/INT pin inter-
rupt, TMR0, and the weak pull-ups on PORTB.

FIGURE 4-4: OPTION REGISTER (ADDRESS 81h, 181h)

R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 R = Readable bit
W = Writable bit
bit7 bit0
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit 7: RBPU: PORTB Pull-up Enable bit
1 = PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual port latch values
bit 6: INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of RB0/INT pin
0 = Interrupt on falling edge of RB0/INT pin
bit 5: T0CS: TMR0 Clock Source Select bit
1 = Transition on RA4/T0CKI pin
0 = Internal instruction cycle clock (CLKOUT)
bit 4: T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on RA4/T0CKI pin
0 = Increment on low-to-high transition on RA4/T0CKI pin
bit 3: PSA: Prescaler Assignment bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0: PS2:PS0: Prescaler Rate Select bits
Bit Value TMR0 Rate WDT Rate

000 1:2 1:1

001 1:4 1:2
010 1:8 1:4
011 1 : 16 1:8
100 1 : 32 1 : 16
101 1 : 64 1 : 32
110 1 : 128 1 : 64
111 1 : 256 1 : 128

DS30444E - page 24  1997 Microchip Technology Inc.

 PIC16C9XX
4.2.2.3 INTCON REGISTER
Note: Interrupt flag bits get set when an interrupt
The INTCON Register is a readable and writable regis- condition occurs regardless of the state of
ter which contains various enable and flag bits for the its corresponding enable bit or the global
TMR0 register overflow, RB Port change and external enable bit, GIE (INTCON<7>).
RB0/INT pin interrupts.

FIGURE 4-5: INTCON REGISTER (ADDRESS 0Bh, 8Bh, 10Bh, 18Bh)

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x

GIE PEIE T0IE INTE RBIE T0IF INTF RBIF R = Readable bit
W = Writable bit
bit7 bit0
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit 7: GIE: Global Interrupt Enable bit
1 = Enables all un-masked interrupts
0 = Disables all interrupts
bit 6: PEIE: Peripheral Interrupt Enable bit
1 = Enables all un-masked peripheral interrupts
0 = Disables all peripheral interrupts
bit 5: T0IE: TMR0 Overflow Interrupt Enable bit
1 = Enables the TMR0 interrupt
0 = Disables the TMR0 interrupt
bit 4: INTE: RB0/INT External Interrupt Enable bit
1 = Enables the RB0/INT external interrupt
0 = Disables the RB0/INT external interrupt
bit 3: RBIE: RB Port Change Interrupt Enable bit
1 = Enables the RB port change interrupt
0 = Disables the RB port change interrupt
bit 2: T0IF: TMR0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed (must be cleared in software)
0 = TMR0 register did not overflow
bit 1: INTF: RB0/INT External Interrupt Flag bit
1 = The RB0/INT external interrupt occurred (must be cleared in software)
0 = The RB0/INT external interrupt did not occur
bit 0: RBIF: RB Port Change Interrupt Flag bit
1 = At least one of the RB7:RB4 pins changed state (see Section 5.2 to clear interrupt)
0 = None of the RB7:RB4 pins have changed state
Interrupt flag bits get set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the
global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to
enabling an interrupt.

 1997 Microchip Technology Inc. DS30444E - page 25

PIC16C9XX
4.2.2.4 PIE1 REGISTER
Note: Bit PEIE (INTCON<6>) must be set to
This register contains the individual enable bits for the enable any peripheral interrupt.
peripheral interrupts.

FIGURE 4-6: PIE1 REGISTER (ADDRESS 8Ch)

R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

LCDIE ADIE(1) — — SSPIE CCP1IE TMR2IE TMR1IE R = Readable bit
W = Writable bit
bit7 bit0
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit 7: LCDIE: LCD Interrupt Enable bit
1 = Enables the LCD interrupt
0 = Disables the LCD interrupt
bit 6: ADIE: A/D Converter Interrupt Enable bit(1)
1 = Enables the A/D interrupt
0 = Disables the A/D interrupt
bit 5-4: Unimplemented: Read as '0'
bit 3: SSPIE: Synchronous Serial Port Interrupt Enable bit
1 = Enables the SSP interrupt
0 = Disables the SSP interrupt
bit 2: CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1: TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the TMR2 to PR2 match interrupt
0 = Disables the TMR2 to PR2 match interrupt
bit 0: TMR1IE: TMR1 Overflow Interrupt Enable bit
1 = Enables the TMR1 overflow interrupt
0 = Disables the TMR1 overflow interrupt
Note 1: Bit ADIE is reserved on the PIC16C923, always maintain this bit clear.

DS30444E - page 26  1997 Microchip Technology Inc.

 PIC16C9XX
4.2.2.5 PIR1 REGISTER
Note: Interrupt flag bits get set when an interrupt
This register contains the individual flag bits for the condition occurs regardless of the state of
peripheral interrupts. its corresponding enable bit or the global
enable bit, GIE (INTCON<7>). User soft-
ware should ensure the appropriate inter-
rupt flag bits are clear prior to enabling an
interrupt.

FIGURE 4-7: PIR1 REGISTER (ADDRESS 0Ch)

R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

LCDIF ADIF(1) — — SSPIF CCP1IF TMR2IF TMR1IF R = Readable bit
W = Writable bit
bit7 bit0
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit 7: LCDIF: LCD Interrupt Flag bit
1 = LCD interrupt occurred (must be cleared in software)
0 = LCD interrupt did not occur
bit 6: ADIF: A/D Converter Interrupt Flag bit(1)
1 = An A/D conversion completed (must be cleared in software)
0 = The A/D conversion is not complete
bit 5-4: Unimplemented: Read as '0'
bit 3: SSPIF: Synchronous Serial Port Interrupt Flag bit
1 = The transmission/reception is complete (must be cleared in software)
0 = Waiting to transmit/receive
bit 2: CCP1IF: CCP1 Interrupt Flag bit
Capture Mode
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare Mode
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM Mode
Unused in this mode
bit 1: TMR2IF: TMR2 to PR2 Match Interrupt Flag bit
1 = TMR2 to PR2 match occurred (must be cleared in software)
0 = No TMR2 to PR2 match occurred
bit 0: TMR1IF: TMR1 Overflow Interrupt Flag bit
1 = TMR1 register overflowed (must be cleared in software)
0 = TMR1 register did not overflow
Note 1: Bit ADIF is reserved on the PIC16C923, always maintain this bit clear.
Interrupt flag bits get set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the
global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to
enabling an interrupt.

 1997 Microchip Technology Inc. DS30444E - page 27

PIC16C9XX
4.2.2.6 PCON REGISTER For various reset conditions see Table 14-4 and
Table 14-5.
The Power Control (PCON) register contains a flag bit
to allow differentiation between a Power-on Reset
(POR) to an external MCLR Reset or WDT Reset.

FIGURE 4-8: PCON REGISTER (ADDRESS 8Eh)

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0

— — — — — — POR — R = Readable bit
W = Writable bit
bit7 bit0
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit 7-2: Unimplemented: Read as '0'
bit 1: POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0: Unimplemented: Read as '0'

DS30444E - page 28  1997 Microchip Technology Inc.

 PIC16C9XX
4.3 PCL and PCLATH
Note 1: There are no status bits to indicate stack
The program counter (PC) is 13-bits wide. The low byte
overflow or stack underflow conditions.
comes from the PCL register, which is a readable and
writable register. The upper bits (PC<12:8>) are not Note 2: There are no instructions/mnemonics
readable, but are indirectly writable through the called PUSH or POP. These are actions
PCLATH register. On any reset, the upper bits of the PC that occur from the execution of the
will be cleared. Figure 4-9 shows the two situations for CALL, RETURN, RETLW, and RETFIE
the loading of the PC. The upper example in the figure instructions, or the vectoring to an inter-
shows how the PC is loaded on a write to PCL rupt address.
(PCLATH<4:0> → PCH). The lower example in the fig-
ure shows how the PC is loaded during a CALL or GOTO 4.4 Program Memory Paging
instruction (PCLATH<4:3> → PCH). PIC16C9XX devices are capable of addressing a con-
tinuous 8K word block of program memory. The CALL
FIGURE 4-9: LOADING OF PC IN and GOTO instructions provide only 11 bits of address
DIFFERENT SITUATIONS to allow branching within any 2K program memory
page. When doing a CALL or GOTO instruction the
upper 2 bits of the address are provided by
PCH PCL
PCLATH<4:3>. When doing a CALL or GOTO instruc-
12 8 7 0 Instruction with tion, the user must ensure that the page select bits are
PC PCL as programmed so that the desired program memory
Destination
PCLATH<4:0> 8 page is addressed. If a return from a CALL instruction
5 ALU result (or interrupt) is executed, the entire 13-bit PC is pushed
onto the stack. Therefore, manipulation of the
PCLATH PCLATH<4:3> bits are not required for the return
instructions (which POPs the address from the stack).
PCH PCL
12 11 10 8 7 0 Note: The PIC16C9XX ignores paging bit
PC GOTO, CALL
PCLATH<4>, which is used to access pro-
gram memory pages 2 and 3. The use of
PCLATH<4:3> 11 PCLATH<4> as a general purpose
2 Opcode <10:0>
read/write bit is not recommended since
PCLATH
this may affect upward compatibility with
future products.

4.3.1 COMPUTED GOTO

A computed GOTO is accomplished by adding an offset

to the program counter (ADDWF PCL). When doing a
table read using a computed GOTO method, care
should be exercised if the table location crosses a PCL
memory boundary (each 256 byte block). Refer to the
application note “Implementing a Table Read” (AN556).

4.3.2 STACK

The PIC16CXXX family has an 8 level deep x 13-bit

wide hardware stack. The stack space is not part of
either program or data space and the stack pointer is
not readable or writable. The PC is PUSHed onto the
stack when a CALL instruction is executed or an inter-
rupt causes a branch. The stack is POPed in the event
of a RETURN, RETLW or a RETFIE instruction execu-
tion. PCLATH is not affected by a PUSH or POP oper-
ation.
The stack operates as a circular buffer. This means that
after the stack has been PUSHed eight times, the ninth
push overwrites the value that was stored from the first
push. The tenth push overwrites the second push (and
so on).

 1997 Microchip Technology Inc. DS30444E - page 29

PIC16C9XX
Example 4-1 shows the calling of a subroutine in 4.5 Indirect Addressing, INDF and FSR
page 1 of the program memory. This example assumes Registers
that PCLATH is saved and restored by the interrupt ser-
The INDF register is not a physical register. Addressing
vice routine (if interrupts are used).
the INDF register will cause indirect addressing.
EXAMPLE 4-1: CALL OF A SUBROUTINE IN Indirect addressing is possible by using the INDF reg-
PAGE 1 FROM PAGE 0 ister. Any instruction using the INDF register actually
ORG 0x500 accesses the register pointed to by the File Select Reg-
BSF PCLATH,3 ;Select page 1 (800h-FFFh) ister (FSR). Reading the INDF register itself indirectly
CALL SUB1_P1 ;Call subroutine in (FSR = '0') will produce 00h. Writing to the INDF regis-
: ;page 1 (800h-FFFh) ter indirectly results in a no-operation (although status
: bits may be affected). An effective 9-bit address is
: obtained by concatenating the 8-bit FSR register and
ORG 0x900 the IRP bit (STATUS<7>), as shown in Figure 4-10.
SUB1_P1: ;called subroutine
: ;page 1 (800h-FFFh) A simple program to clear RAM locations 20h-2Fh
: using indirect addressing is shown in Example 4-2.
RETURN ;return to Call subroutine
;in page 0 (000h-7FFh) EXAMPLE 4-2: INDIRECT ADDRESSING
movlw 0x20 ;initialize pointer
movwf FSR ;to RAM
NEXT clrf INDF ;clear INDF register
incf FSR,F ;inc pointer
btfss FSR,4 ;all done?
goto NEXT ;no clear next
CONTINUE
: ;yes continue

FIGURE 4-10: DIRECT/INDIRECT ADDRESSING

Direct Addressing Indirect Addressing

RP1:RP0 6 from opcode 0 IRP 7 FSR register 0

bank select location select bank select location select

00 01 10 11
00h 00h

Data
Memory

7Fh 7Fh
Bank 0 Bank 1 Bank 2 Bank 3

For memory map detail see Figure 4-2.

DS30444E - page 30  1997 Microchip Technology Inc.

 PIC16C9XX
5.0 PORTS FIGURE 5-1: BLOCK DIAGRAM OF PINS
RA3:RA0 AND RA5
Some pins for these ports are multiplexed with an alter-
nate function for the peripheral features on the device. Data
In general, when a peripheral is enabled, that pin may bus
D Q
not be used as a general purpose I/O pin.
VDD
WR
5.1 PORTA and TRISA Register Port
CK Q
P
The RA4/T0CKI pin is a Schmitt Trigger input and an
open drain output. All other RA port pins have TTL input Data Latch
levels and full CMOS output drivers. All RA pins have N I/O pin(1)
D Q
data direction bits (TRISA register) which can configure
these pins as output or input. WR
TRIS VSS
Setting a bit in the TRISA register puts the correspond- CK Q
Analog
ing output driver in a hi-impedance mode. Clearing a bit input
in the TRISA register puts the contents of the output TRIS Latch mode
latch on the selected pin.
Reading the PORTA register reads the status of the
RD TRIS TTL
pins whereas writing to it will write to the port latch. All input
write operations are read-modify-write operations. buffer
Therefore, a write to a port implies that the port pins are Q D
read, this value is modified, and then written to the port
data latch.
EN
Pin RA4 is multiplexed with the Timer0 module clock
input to become the RA4/T0CKI pin.
RD PORT
For the PIC16C924 only, other PORTA pins are multi-
plexed with analog inputs and the analog VREF input.
The operation of each pin is selected by clearing/set- To A/D Converter (PIC16C924 only)
ting the control bits in the ADCON1 register (A/D Con- Note 1: I/O pins have protection diodes to VDD and VSS.
trol Register1).
Note: On a Power-on Reset, these pins are con-
figured as analog inputs and read as '0'. FIGURE 5-2: BLOCK DIAGRAM OF
The TRISA register controls the direction of the RA RA4/T0CKI PIN
pins, even when they are being used as analog inputs. Data
The user must ensure the bits in the TRISA register are bus D Q
maintained set when using them as analog inputs.
WR
PORT
CK Q
EXAMPLE 5-1: INITIALIZING PORTA N I/O pin(1)
Data Latch
BCF STATUS, RP0 ; Select Bank0
BCF STATUS, RP1 D Q VSS
CLRF PORTA ; Initialize PORTA WR
BSF STATUS, RP0 ; TRIS CK Q Schmitt
MOVLW 0xCF ; Value used to Trigger
input
; initialize data TRIS Latch buffer
; direction
MOVWF TRISA ; Set RA<3:0> as inputs
; RA<5:4> as outputs RD TRIS
; RA<7:6> are always
; read as '0'. Q D

EN
EN
RD PORT

TMR0 clock input

Note 1: I/O pin has protection diodes to VSS only.

 1997 Microchip Technology Inc. DS30444E - page 31

PIC16C9XX
TABLE 5-1: PORTA FUNCTIONS

Name Bit# Buffer Function

(1)
RA0/AN0 bit0 TTL Input/output or analog input
(1)
RA1/AN1 bit1 TTL Input/output or analog input
RA2/AN2(1) bit2 TTL Input/output or analog input
RA3/AN3/V REF(1) bit3 TTL Input/output or analog input or VREF
RA4/T0CKI bit4 ST Input/output or external clock input for Timer0
Output is open drain type
RA5/AN4/SS (1) bit5 TTL Input/output or analog input or slave select input for synchronous serial port
Legend: TTL = TTL input, ST = Schmitt Trigger input
Note 1: The AN and VREF functions are for the A/D module and are only implemented on the PIC16C924.

TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA

Value on Value on
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on all other
Reset resets

05h PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 (2) (2)
85h TRISA — — PORTA Data Direction Control Register --11 1111 --11 1111
9Fh(1) ADCON1 — — — — — PCFG2 PCFG1 PCFG0 ---- -000 ---- -000
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by PORTA.
Note 1: The ADCON1 register is implemented on the PIC16C924 only.
2: PIC16C923 reset values for PORTA: --xx xxxx for a POR, and --uu uuuu for all other resets,
PIC16C924 reset values for PORTA: --0x 0000 when read.

DS30444E - page 32  1997 Microchip Technology Inc.

 PIC16C9XX
5.2 PORTB and TRISB Register PORTB. The “mismatch” outputs of RB7:RB4 are
OR’ed together to generate the RB Port Change Inter-
PORTB is an 8-bit wide bi-directional port. The corre-
rupt with flag bit RBIF (INTCON<0>).
sponding data direction register is TRISB. Setting a bit
in the TRISB register puts the corresponding output This interrupt can wake the device from SLEEP. The
driver in a hi-impedance input mode. Clearing a bit in user, in the interrupt service routine, can clear the inter-
the TRISB register puts the contents of the output latch rupt in the following manner:
on the selected pin(s). a) Any read or write of PORTB. This will end the
EXAMPLE 5-2: INITIALIZING PORTB mismatch condition.
b) Clear flag bit RBIF.
BCF STATUS, RP0 ; Select Bank0
BCF STATUS, RP1 A mismatch condition will continue to set flag bit RBIF.
CLRF PORTB ; Initialize PORTB Reading PORTB will end the mismatch condition, and
BSF STATUS, RP0 ; allow flag bit RBIF to be cleared.
MOVLW 0xCF ; Value used to
; initialize data This interrupt on mismatch feature, together with soft-
; direction ware configurable pull-ups on these four pins allow
MOVWF TRISB ; Set RB<3:0> as inputs easy interface to a keypad and make it possible for
; RB<5:4> as outputs wake-up on key-depression. Refer to the Embedded
; RB<7:6> as inputs Control Handbook, "Implementing Wake-Up on Key
Each of the PORTB pins has a weak internal pull-up. A Stroke" (AN552).
single control bit can turn on all the pull-ups. This is The interrupt on change feature is recommended for
performed by clearing bit RBPU (OPTION<7>). The wake-up on key depression operation and operations
weak pull-up is automatically turned off when the port where PORTB is only used for the interrupt on change
pin is configured as an output. The pull-ups are also dis- feature. Polling of PORTB is not recommended while
abled on a Power-on Reset. using the interrupt on change feature.
FIGURE 5-3: BLOCK DIAGRAM OF FIGURE 5-4: BLOCK DIAGRAM OF
RB3:RB0 PINS RB7:RB4 PINS
VDD
RBPU(2) weak VDD
P pull-up RBPU(2) weak
Data Latch P pull-up
Data bus
D Q Data Latch
Data bus
I/O D Q
WR Port
CK pin(1) I/O
WR Port
CK pin(1)
TRIS Latch
D Q TRIS Latch
TTL
Input D Q
WR TRIS
CK Buffer
WR TRIS TTL
CK Input
Buffer ST
Buffer
RD TRIS
Q D RD TRIS Latch
Q D
RD Port EN
RD Port EN Q1
Set RBIF
RB0/INT
Schmitt Trigger
Buffer RD Port Q D
From other
RB7:RB4 pins RD Port
Note 1: I/O pins have diode protection to VDD and VSS.
EN
2: To enable weak pull-ups, set the appropriate TRIS bit Q3
and clear the RBPU bit (OPTION<7>). RB7:RB6 in serial programming mode

Four of PORTB’s pins, RB7:RB4, have an interrupt on Note 1: I/O pins have diode protection to VDD and VSS.
change feature. Only pins configured as inputs can 2: To enable weak pull-ups, set the appropriate TRIS bit
and clear the RBPU bit (OPTION<7>).
cause this interrupt to occur (i.e. any RB7:RB4 pin con-
figured as an output is excluded from the interrupt on
change comparison). The input pins (of RB7:RB4) are
compared with the old value latched on the last read of

 1997 Microchip Technology Inc. DS30444E - page 33

PIC16C9XX
TABLE 5-3: PORTB FUNCTIONS

Name Bit# Buffer Function

RB0/INT bit0 TTL/ST Input/output pin or external interrupt input. Internal software
programmable weak pull-up. This buffer is a Schmitt Trigger input when
configured as the external interrupt.
RB1 bit1 TTL Input/output pin. Internal software programmable weak pull-up.
RB2 bit2 TTL Input/output pin. Internal software programmable weak pull-up.
RB3 bit3 TTL Input/output pin. Internal software programmable weak pull-up.
RB4 bit4 TTL Input/output pin (with interrupt on change). Internal software programmable
weak pull-up.
RB5 bit5 TTL Input/output pin (with interrupt on change). Internal software programmable
weak pull-up.
RB6 bit6 TTL/ST Input/output pin (with interrupt on change). Internal software programmable
weak pull-up. Serial programming clock. This buffer is a Schmitt Trigger
input when used in serial programming mode.
RB7 bit7 TTL/ST Input/output pin (with interrupt on change). Internal software programmable
weak pull-up. Serial programming data. This buffer is a Schmitt Trigger input
when used in serial programming mode.
Legend: TTL = TTL input, ST = Schmitt Trigger input

TABLE 5-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB

Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset

06h, 106h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu
86h, 186h TRISB PORTB Data Direction Control Register 1111 1111 1111 1111
81h, 181h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
Legend: x = unknown, u = unchanged. Shaded cells are not used by PORTB.

DS30444E - page 34  1997 Microchip Technology Inc.

 PIC16C9XX
5.3 PORTC and TRISC Register FIGURE 5-5: PORTC BLOCK DIAGRAM
PORTC is an 6-bit bi-directional port. Each pin is indi- (PERIPHERAL OUTPUT
vidually configurable as an input or output through the OVERRIDE)
TRISC register. PORTC is multiplexed with several VDD
peripheral functions (Table 5-5). PORTC pins have RBPU(2) weak
P pull-up
Schmitt Trigger input buffers.
Data Latch
Data bus
When enabling peripheral functions, care should be D Q
taken in defining TRIS bits for each PORTC pin. Some I/O
WR Port
peripherals override the TRIS bit to make a pin an out- CK pin(1)
put, while other peripherals override the TRIS bit to TRIS Latch
make a pin an input. Since the TRIS bit override is in D Q
TTL
effect while the peripheral is enabled, read-mod- Input
WR TRIS
ify-write instructions (BSF, BCF, XORWF) with TRISC CK Buffer
as destination should be avoided. The user should refer
to the corresponding peripheral section for the correct
TRIS bit settings. RD TRIS
Q D
EXAMPLE 5-3: INITIALIZING PORTC
RD Port EN
BCF STATUS,RP0 ; Select Bank0
BCF STATUS,RP1
CLRF PORTC ; Initialize PORTC RB0/INT
BSF STATUS,RP0 ;
Schmitt Trigger RD Port
MOVLW 0xCF ; Value used to Buffer
; initialize data
Note 1: I/O pins have diode protection to VDD and VSS.
; direction
2: To enable weak pull-ups, set the appropriate TRIS bit(s)
MOVWF TRISC ; Set RC<3:0> as inputs and clear the RBPU bit (OPTION<7>).
; RC<5:4> as outputs
; RC<7:6> always read 0

TABLE 5-5: PORTC FUNCTIONS

Name Bit# Buffer Type Function

RC0/T1OSO/T1CKI bit0 ST Input/output port pin or Timer1 oscillator output or Timer1 clock input
RC1/T1OSI bit1 ST Input/output port pin or Timer1 oscillator input
RC2/CCP1 bit2 ST Input/output port pin or Capture input/Compare output/PWM output
RC3/SCK/SCL bit3 ST Input/output port pin or the synchronous serial clock for both SPI and
I2C modes.
RC4/SDI/SDA bit4 ST Input/output port pin or the SPI Data In (SPI mode) or data I/O (I2C
mode).
RC5/SDO bit5 ST Input/output port pin or Synchronous Serial Port data out
Legend: ST = Schmitt Trigger input

TABLE 5-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC

Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset

07h PORTC — — RC5 RC4 RC3 RC2 RC1 RC0 --xx xxxx --uu uuuu
87h TRISC — — PORTC Data Direction Control Register --11 1111 --11 1111
Legend: x = unknown, u = unchanged, - = unimplemented, read as '0'. Shaded cells are not used by PORTC.

 1997 Microchip Technology Inc. DS30444E - page 35

PIC16C9XX
5.4 PORTD and TRISD Registers FIGURE 5-6: PORTD<4:0> BLOCK
PORTD is an 8-bit port with Schmitt Trigger input buff- DIAGRAM
ers. The first five pins are configurable as general pur- LCD
pose I/O pins or LCD segment drivers. Pins RD5, RD6 Segment Data
and RD7 can be digital inputs or LCD segment or com-
mon drivers. LCD Segment
Output Enable
TRISD controls the direction of pins RD0 through RD4
when PORTD is configured as a digital port.
Data Bus
D Q
Note: On a Power-on Reset these pins are con- WR
figured as LCD segment drivers. I/O pin
PORT
CK

Data Latch
Note: To configure the pins as a digital port, the
corresponding bits in the LCDSE register D Q
must be cleared. Any bit set in the LCDSE WR
TRIS
register overrides any bit settings in the CK
corresponding TRIS register. Schmitt
TRIS Latch Trigger
input
EXAMPLE 5-4: INITIALIZING PORTD buffer
RD TRIS
BCF STATUS,RP0 ;Select Bank2
BSF STATUS,RP1 ;
BCF LCDSE,SE29 ;Make RD<7:5> digital LCDSE<n>
BCF LCDSE,SE0 ;Make RD<4:0> digital
BSF STATUS,RP0 ;Select Bank1 Q D
BCF STATUS,RP1 ;
MOVLW 0x07 ;Make RD<4:0> outputs
EN
EN
MOVWF TRISD ;Make RD<7:5> inputs
RD
PORT

DS30444E - page 36  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 5-7: PORTD<7:5> BLOCK
DIAGRAM
LCD
Segment Data

LCD Segment
Output Enable

LCD
Common Data

LCD Common Digital Input/

Output Enable LCD Output pin

LCDSE<n>

Schmitt
Trigger
input
buffer
Data Bus
Q D

EN
EN

RD PORT

VDD

RD TRIS

TABLE 5-7: PORTD FUNCTIONS

Buffer
Name Bit# Function
Type
RD0/SEG00 bit0 ST Input/output port pin or Segment Driver00
RD1/SEG01 bit1 ST Input/output port pin or Segment Driver01
RD2/SEG02 bit2 ST Input/output port pin or Segment Driver02
RD3/SEG03 bit3 ST Input/output port pin or Segment Driver03
RD4/SEG04 bit4 ST Input/output port pin or Segment Driver04
RD5/SEG29/COM3 bit5 ST Digital input pin or Segment Driver29 or Common Driver3
RD6/SEG30/COM2 bit6 ST Digital input pin or Segment Driver30 or Common Driver2
RD7/SEG31/COM1 bit7 ST Digital input pin or Segment Driver31 or Common Driver1
Legend: ST = Schmitt Trigger input

TABLE 5-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD

Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset

08h PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 0000 0000 0000 0000
88h TRISD PORTD Data Direction Control Register 1111 1111 1111 1111
10Dh LCDSE SE29 SE27 SE20 SE16 SE12 SE9 SE5 SE0 1111 1111 1111 1111
Legend: Shaded cells are not used by PORTD.

 1997 Microchip Technology Inc. DS30444E - page 37

PIC16C9XX
5.5 PORTE and TRISE Register FIGURE 5-8: PORTE BLOCK DIAGRAM
PORTE is an digital input only port. Each pin is multi- LCD
plexed with an LCD segment driver. These pins have Segment Data
Schmitt Trigger input buffers.
LCD Segment
Output Enable
Note 1: On a Power-on Reset these pins are con-
figured as LCD segment drivers. LCD
Common Data
Note 2: To configure the pins as a digital port, the
corresponding bits in the LCDSE register LCD Common Digital Input/
must be cleared. Any bit set in the LCDSE Output Enable LCD Output pin
register overrides any bit settings in the
corresponding TRIS register. LCDSE<n>

EXAMPLE 5-5: INITIALIZING PORTE Schmitt

Trigger
BCF STATUS,RP0 ;Select Bank2 input
BSF STATUS,RP1 ; buffer
BCF LCDSE,SE27 ;Make all PORTE Data Bus
BCF LCDSE,SE5 ;and PORTG<7> Q D
BCF LCDSE,SE9 ;digital inputs
EN
EN

RD PORT

VDD

RD TRIS

TABLE 5-9: PORTE FUNCTIONS

Name Bit# Buffer Type Function

RE0/SEG05 bit0 ST Digital input or Segment Driver05
RE1/SEG06 bit1 ST Digital input or Segment Driver06
RE2/SEG07 bit2 ST Digital input or Segment Driver07
RE3/SEG08 bit3 ST Digital input or Segment Driver08
RE4/SEG09 bit4 ST Digital input or Segment Driver09
RE5/SEG10 bit5 ST Digital input or Segment Driver10
RE6/SEG11 bit6 ST Digital input or Segment Driver11
RE7/SEG27 bit7 ST Digital input or Segment Driver27 (not available on 64-pin devices)
Legend: ST = Schmitt Trigger input

TABLE 5-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE

Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset

09h PORTE RE7 RE6 RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000
89h TRISE PORTE Data Direction Control Register 1111 1111 1111 1111
10Dh LCDSE SE29 SE27 SE20 SE16 SE12 SE9 SE5 SE0 1111 1111 1111 1111
Legend: Shaded cells are not used by PORTE.

DS30444E - page 38  1997 Microchip Technology Inc.

 PIC16C9XX
5.6 PORTF and TRISF Register FIGURE 5-9: PORTF BLOCK DIAGRAM
PORTF is an digital input only port. Each pin is multi- LCD
plexed with an LCD segment driver. These pins have Segment Data
Schmitt Trigger input buffers.
LCD Segment
Note 1: On a Power-on Reset these pins are con- Output Enable
figured as LCD segment drivers.
Note 2: To configure the pins as a digital port, the LCD
corresponding bits in the LCDSE register Common Data
must be cleared. Any bit set in the LCDSE
register overrides any bit settings in the LCD Common Digital Input/
Output Enable LCD Output pin
corresponding TRIS register.

LCDSE<n>
EXAMPLE 5-6: INITIALIZING PORTF

BCF STATUS,RP0 ;Select Bank2 Schmitt

BSF STATUS,RP1 ; Trigger
input
BCF LCDSE,SE16 ;Make all PORTF buffer
BCF LCDSE,SE12 ;digital inputs
Data Bus
Q D

EN
EN

RD PORT

VDD

RD TRIS

TABLE 5-11: PORTF FUNCTIONS

Name Bit# Buffer Type Function

RF0/SEG12 bit0 ST Digital input or Segment Driver12
RF1/SEG13 bit1 ST Digital input or Segment Driver13
RF2/SEG14 bit2 ST Digital input or Segment Driver14
RF3/SEG15 bit3 ST Digital input or Segment Driver15
RF4/SEG16 bit4 ST Digital input or Segment Driver16
RF5/SEG17 bit5 ST Digital input or Segment Driver17
RF6/SEG18 bit6 ST Digital input or Segment Driver18
RF7/SEG19 bit7 ST Digital input or Segment Driver19
Legend: ST = Schmitt Trigger input

TABLE 5-12: SUMMARY OF REGISTERS ASSOCIATED WITH PORTF

Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset

107h PORTF RF7 RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000
187h TRISF PORTF Data Direction Control Register 1111 1111 1111 1111
10Dh LCDSE SE29 SE27 SE20 SE16 SE12 SE9 SE5 SE0 1111 1111 1111 1111
Legend: Shaded cells are not used by PORTF.

 1997 Microchip Technology Inc. DS30444E - page 39

PIC16C9XX
5.7 PORTG and TRISG Register FIGURE 5-10: PORTG BLOCK DIAGRAM
PORTG is an digital input only port. Each pin is multi- LCD
plexed with an LCD segment driver. These pins have Segment Data
Schmitt Trigger input buffers.
LCD Segment
Note 1: On a Power-on Reset these pins are con- Output Enable
figured as LCD segment drivers.
Note 2: To configure the pins as a digital port, the LCD
corresponding bits in the LCDSE register Common Data
must be cleared. Any bit set in the LCDSE
register overrides any bit settings in the LCD Common Digital Input/
Output Enable LCD Output pin
corresponding TRIS register.

LCDSE<n>

EXAMPLE 5-7: INITIALIZING PORTG Schmitt

Trigger
input
BCF STATUS,RP0 ;Select Bank2 buffer
BSF STATUS,RP1 ;
BCF LCDSE,SE27 ;Make all PORTG Data Bus
Q D
BCF LCDSE,SE20 ;and PORTE<7>
;digital inputs
EN
EN

RD PORT

VDD

RD TRIS

TABLE 5-13: PORTG FUNCTIONS

Name Bit# Buffer Type Function

RG0/SEG20 bit0 ST Digital input or Segment Driver20
RG1/SEG21 bit1 ST Digital input or Segment Driver21
RG2/SEG22 bit2 ST Digital input or Segment Driver22
RG3/SEG23 bit3 ST Digital input or Segment Driver23
RG4/SEG24 bit4 ST Digital input or Segment Driver24
RG5/SEG25 bit5 ST Digital input or Segment Driver25
RG6/SEG26 bit6 ST Digital input or Segment Driver26
RG7/SEG28 bit7 ST Digital input or Segment Driver28 (not available on 64-pin devices)
Legend: ST = Schmitt Trigger input

TABLE 5-14: SUMMARY OF REGISTERS ASSOCIATED WITH PORTG

Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset

108h PORTG RG7 RG6 RG5 RG4 RG3 RG2 RG1 RG0 0000 0000 0000 0000
188h TRISG PORTG Data Direction Control Register 1111 1111 1111 1111
10Dh LCDSE SE29 SE27 SE20 SE16 SE12 SE9 SE5 SE0 1111 1111 1111 1111
Legend: Shaded cells are not used by PORTG.

DS30444E - page 40  1997 Microchip Technology Inc.

 PIC16C9XX
5.8 I/O Programming Considerations EXAMPLE 5-8: READ-MODIFY-WRITE
INSTRUCTIONS ON AN I/O
5.8.1 BI-DIRECTIONAL I/O PORTS
PORT
Any instruction which writes, operates internally as a ;Initial PORT settings: PORTB<7:4> Inputs
; PORTB<3:0> Outputs
read followed by a write operation. The BCF and BSF
;PORTB<7:6> have external pull-ups and are
instructions, for example, read the register into the ;not connected to other circuitry
CPU, execute the bit operation and write the result back ;
to the register. Caution must be used when these ; PORT latch PORT pins
instructions are applied to a port with both inputs and ; ---------- ---------
outputs defined. For example, a BSF operation on bit5 BCF PORTB, 7 ; 01pp pppp 11pp pppp
of PORTB will cause all eight bits of PORTB to be read BCF PORTB, 6 ; 10pp pppp 11pp pppp
into the CPU. Then the BSF operation takes place on BCF STATUS, RP1 ;
bit5 and PORTB is written to the output latches. If BSF STATUS, RP0 ;
another bit of PORTB is used as a bi-directional I/O pin BCF TRISB, 7 ; 10pp pppp 11pp pppp
BCF TRISB, 6 ; 10pp pppp 10pp pppp
(e.g., bit0) and it is defined as an input at this time, the
;
input signal present on the pin itself would be read into ;Note that the user may have expected the
the CPU and rewritten to the data latch of this particular ;pin values to be 00pp ppp. The 2nd BCF
pin, overwriting the previous content. As long as the pin ;caused RB7 to be latched as the pin value
stays in the input mode, no problem occurs. However, if ;(high).
bit0 is switched into output mode later on, the contents
A pin actively outputting a Low or High should not be
of the data latch may now be unknown.
driven from external devices at the same time in order
Reading the port register, reads the values of the port to change the level on this pin (“wired-or”, “wired-and”).
pins. Writing to the port register writes the value to the The resulting high output currents may damage the
port latch. When using read-modify-write instructions chip.
(ex. BCF, BSF) on a port, the value of the port pins is
read, the desired operation is done to this value, and 5.8.2 SUCCESSIVE OPERATIONS ON I/O PORTS
this value is then written to the port latch.
The actual write to an I/O port happens at the end of an
Example 5-8 shows the effect of two sequential instruction cycle, whereas for reading, the data must be
read-modify-write instructions on an I/O port. valid at the beginning of the instruction cycle
(Figure 5-11). Therefore, care must be exercised if a
write followed by a read operation is carried out on the
same I/O port. The sequence of instructions should be
such to allow the pin voltage to stabilize (load depen-
dent) before the next instruction which causes that file
to be read into the CPU is executed. Otherwise, the
previous state of that pin may be read into the CPU
rather than the new state. When in doubt, it is better to
separate these instructions with a NOP or another
instruction not accessing this I/O port.
FIGURE 5-11: SUCCESSIVE I/O OPERATION

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Note:
PC PC PC + 1 PC + 2 PC + 3 This example shows a write to PORTB
Instruction followed by a read from PORTB.
fetched MOVWF PORTB MOVF PORTB,W
write to NOP NOP
PORTB Note that:
RB7:RB0 data setup time = (0.25TCY - TPD)
where TCY = instruction cycle
Port pin
sampled here TPD = propagation delay
TPD Therefore, at higher clock frequencies,
Instruction
executed NOP
a write followed by a read may be prob-
MOVWF PORTB MOVF PORTB,W
write to lematic.
PORTB

 1997 Microchip Technology Inc. DS30444E - page 41

PIC16C9XX
NOTES:

DS30444E - page 42  1997 Microchip Technology Inc.

 PIC16C9XX
6.0 OVERVIEW OF TIMER chronous Serial Port (SSP). The prescaler option
allows Timer2 to increment at the following rates: 1:1,
MODULES 1:4, 1:16.
Each module can generate an interrupt to indicate that
The postscaler allows the TMR2 register to match the
an event has occurred (e.g. timer overflow). Each of
period register (PR2) a programmable number of times
these modules is explained in full detail in the following
before generating an interrupt. The postscaler can be
sections. The timer modules are:
programmed from 1:1 to 1:16 (inclusive).
• Timer0 Module (Section 7.0)
• Timer1 Module (Section 8.0) 6.4 CCP Overview
• Timer2 Module (Section 9.0) The CCP module can operate in one of these three
modes: 16-bit capture, 16-bit compare, or up to 10-bit
6.1 Timer0 Overview Pulse Width Modulation (PWM).
The Timer0 module is a simple 8-bit timer/counter. The Capture mode captures the 16-bit value of TMR1 into
clock source can be either the internal system clock the CCPR1H:CCPR1L register pair. The capture event
(Fosc/4) or an external clock. When the clock source is can be programmed for either the falling edge, rising
an external clock, the Timer0 module can be selected edge, fourth rising edge, or the sixteenth rising edge of
to increment on either the rising or falling edge. the CCP1 pin.
The Timer0 module also has a programmable prescaler Compare mode compares the TMR1H:TMR1L register
option. This prescaler can be assigned to either the pair to the CCPR1H:CCPR1L register pair. When a
Timer0 module or the Watchdog Timer. Bit PSA match occurs an interrupt can be generated, and the
(OPTION<3>) assigns the prescaler, and bits PS2:PS0 output pin CCP1 can be forced to given state (High or
(OPTION<2:0>) determine the prescaler value. Timer0 Low), TMR1 can be reset and start A/D conversion.
can increment at the following rates: 1:1 when pres- This depends on the control bits CCP1M3:CCP1M0.
caler assigned to Watchdog timer, 1:2, 1:4, 1:8, 1:16,
PWM mode compares the TMR2 register to a 10-bit
1:32, 1:64, 1:128, and 1:256.
duty cycle register (CCPR1H:CCPR1L<5:4>) as well
Synchronization of the external clock occurs after the as to an 8-bit period register (PR2). When the TMR2
prescaler. When the prescaler is used, the external register = Duty Cycle register, the CCP1 pin will be
clock frequency may be higher then the device’s fre- forced low. When TMR2 = PR2, TMR2 is cleared to 00h,
quency. The maximum frequency is 50 MHz, given the an interrupt can be generated, and the CCP1 pin (if an
high and low time requirements of the clock. output) will be forced high.

6.2 Timer1 Overview

Timer1 is a 16-bit timer/counter. The clock source can
be either the internal system clock (Fosc/4), an external
clock, or an external crystal. Timer1 can operate as
either a timer or a counter. When operating as a counter
(external clock source), the counter can either operate
synchronized to the device or asynchronously to the
device. Asynchronous operation allows Timer1 to oper-
ate during sleep, which is useful for applications that
require a real-time clock as well as the power savings
of SLEEP mode.
Timer1 also has a prescaler option which allows Timer1
to increment at the following rates: 1:1, 1:2, 1:4, and
1:8. Timer1 can be used in conjunction with the Cap-
ture/Compare/PWM module. When used with a CCP
module, Timer1 is the time-base for 16-bit capture or
the 16-bit compare and must be synchronized to the
device. Timer1 oscillator is also one of the clock
sources for the LCD module.

6.3 Timer2 Overview

Timer2 is an 8-bit timer with a programmable prescaler
and postscaler, as well as an 8-bit period register
(PR2). Timer2 can be used with the CCP1 module (in
PWM mode) as well as the clock source for the Syn-

 1997 Microchip Technology Inc. DS30444E - page 43

PIC16C9XX
NOTES:

DS30444E - page 44  1997 Microchip Technology Inc.

 PIC16C9XX
7.0 TIMER0 MODULE bit T0SE selects the rising edge. Restrictions on the
external clock input are discussed in detail in
The Timer0 module has the following features: Section 7.2.
• 8-bit timer/counter The prescaler is mutually exclusively shared between
• Readable and writable the Timer0 module and the Watchdog Timer. The pres-
• 8-bit software programmable prescaler caler assignment is controlled in software by control bit
• Internal or external clock select PSA (OPTION<3>). Clearing bit PSA will assign the
• Interrupt on overflow from FFh to 00h prescaler to the Timer0 module. The prescaler is not
readable or writable. When the prescaler is assigned to
• Edge select for external clock
the Timer0 module, prescale values of 1:2, 1:4, ...,
Figure 7-1 is a simplified block diagram of the Timer0 1:256 are selectable. Section 7.3 details the operation
module. of the prescaler.
Timer mode is selected by clearing bit T0CS
7.1 Timer0 Interrupt
(OPTION<5>). In timer mode, the Timer0 module will
increment every instruction cycle (without prescaler). If The TMR0 interrupt is generated when the TMR0 reg-
the TMR0 register is written, the increment is inhibited ister overflows from FFh to 00h. This overflow sets bit
for the following two instruction cycles (Figure 7-2 and T0IF (INTCON<2>). The interrupt can be masked by
Figure 7-3). The user can work around this by writing clearing bit T0IE (INTCON<5>). Bit T0IF must be
an adjusted value to the TMR0 register. cleared in software by the Timer0 module interrupt ser-
vice routine before re-enabling this interrupt. The TMR0
Counter mode is selected by setting bit T0CS
interrupt cannot awaken the processor from SLEEP
(OPTION<5>). In counter mode Timer0 will increment
since the timer is shut off during SLEEP. Figure 7-4 dis-
either on every rising or falling edge of pin RA4/T0CKI.
plays the Timer0 interrupt timing.
The incrementing edge is determined by the Timer0
Source Edge Select bit T0SE (OPTION<4>). Clearing

FIGURE 7-1: TIMER0 BLOCK DIAGRAM

Data bus
FOSC/4 0
PSout 8
1
Sync with
1 Internal TMR0
clocks
RA4/T0CKI Programmable 0 PSout
pin Prescaler
T0SE (2 cycle delay)
3
Set interrupt
PS2, PS1, PS0 PSA flag bit T0IF
T0CS on overflow

Note 1: T0CS, T0SE, PSA, PS2:PS0 (OPTION<5:0>).

2: The prescaler is shared with Watchdog Timer (refer to Figure 7-6 for detailed block diagram).

FIGURE 7-2: TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE

PC Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
(Program
Counter) PC-1 PC PC+1 PC+2 PC+3 PC+4 PC+5 PC+6
Instruction MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
Fetch

TMR0 T0 T0+1 T0+2 NT0 NT0 NT0 NT0+1 NT0+2 T0

Instruction
Executed
Write TMR0 Read TMR0 Read TMR0 Read TMR0 Read TMR0 Read TMR0
executed reads NT0 reads NT0 reads NT0 reads NT0 + 1 reads NT0 + 2

 1997 Microchip Technology Inc. DS30444E - page 45

PIC16C9XX
FIGURE 7-3: TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2

PC Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
(Program
Counter) PC-1 PC PC+1 PC+2 PC+3 PC+4 PC+5 PC+6

Instruction MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
Fetch

TMR0 T0 T0+1 NT0 NT0+1 PC+6

Instruction
Execute Write TMR0 Read TMR0 Read TMR0 Read TMR0 Read TMR0 Read TMR0
executed reads NT0 reads NT0 reads NT0 reads NT0 reads NT0 + 1

FIGURE 7-4: TIMER0 INTERRUPT TIMING

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

OSC1

CLKOUT(3)

Timer0 FEh FFh 00h 01h 02h

1 1
T0IF bit
(INTCON<2>)

GIE bit
(INTCON<7>)

INSTRUCTION
FLOW

PC PC PC +1 PC +1 0004h 0005h

Instruction
fetched Inst (PC) Inst (PC+1) Inst (0004h) Inst (0005h)

Instruction Inst (PC-1) Inst (PC) Dummy cycle Dummy cycle Inst (0004h)
executed

Note 1: Interrupt flag bit T0IF is sampled here (every Q1).

2: Interrupt latency = 4TCY where TCY = instruction cycle time.
3: CLKOUT is available only in RC oscillator mode.

DS30444E - page 46  1997 Microchip Technology Inc.

 PIC16C9XX
7.2 Using Timer0 with an External Clock caler so that the prescaler output is symmetrical. For
the external clock to meet the sampling requirement,
When an external clock input is used for Timer0, it must
the ripple-counter must be taken into account. There-
meet certain requirements. The requirements ensure
fore, it is necessary for T0CKI to have a period of at
the external clock can be synchronized with the internal
least 4Tosc (and a small RC delay of 40 ns) divided by
phase clock (TOSC). Also, there is a delay in the actual
the prescaler value. The only requirement on T0CKI
incrementing of Timer0 after synchronization.
high and low time is that they do not violate the mini-
7.2.1 EXTERNAL CLOCK SYNCHRONIZATION mum pulse width requirement of 10 ns. Refer to param-
eters 40, 41 and 42 in the electrical specification of the
When no prescaler is used, the external clock input is desired device.
the same as the prescaler output. The synchronization
of T0CKI with the internal phase clocks is accom- 7.2.2 TMR0 INCREMENT DELAY
plished by sampling the prescaler output on the Q2 and Since the prescaler output is synchronized with the
Q4 cycles of the internal phase clocks (Figure 7-5). internal clocks, there is a small delay from the time the
Therefore, it is necessary for T0CKI to be high for at external clock edge occurs to the time the Timer0 mod-
least 2Tosc (and a small RC delay of 20 ns) and low for ule is actually incremented. Figure 7-5 shows the delay
at least 2Tosc (and a small RC delay of 20 ns). Refer to from the external clock edge to the timer incrementing.
the electrical specification of the desired device.
When a prescaler is used, the external clock input is
divided by the asynchronous ripple-counter type pres-

FIGURE 7-5: TIMER0 TIMING WITH EXTERNAL CLOCK

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Small pulse
External Clock Input or misses sampling
Prescaler output (2)
(1)
(3)
External Clock/Prescaler
Output after sampling
Increment Timer0 (Q4)

Timer0 T0 T0 + 1 T0 + 2

Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc).
Therefore, the error in measuring the interval between two edges on Timer0 input = ±4Tosc max.
2: External clock if no prescaler selected, Prescaler output otherwise.
3: The arrows indicate the points in time where sampling occurs.

 1997 Microchip Technology Inc. DS30444E - page 47

PIC16C9XX
7.3 Prescaler When assigned to the Timer0 module, all instructions
writing to the TMR0 register (e.g. CLRF 1, MOVWF 1,
An 8-bit counter is available as a prescaler for the
BSF 1,x....etc.) will clear the prescaler count. When
Timer0 module, or as a postscaler for the Watchdog
assigned to WDT, a CLRWDT instruction will clear the
Timer (Figure 7-6). For simplicity, this counter is being
prescaler count along with the Watchdog Timer. The
referred to as “prescaler” throughout this data sheet.
prescaler is not readable or writable.
Note that the prescaler may be used by either the
Timer0 module or the WDT but not both. Thus, a pres- Note: Writing to TMR0 when the prescaler is
caler assignment for the Timer0 module means that assigned to Timer0 will clear the prescaler
there is no prescaler for the Watchdog Timer, and count, but will not change the prescaler
vice-versa. assignment.
The PSA and PS2:PS0 bits (OPTION<3:0>) determine
the prescaler assignment and prescale ratio.

FIGURE 7-6: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER

CLKOUT (=Fosc/4) Data Bus

8
M 1
0
RA4/T0CKI U M
X SYNC
pin U 2 TMR0 reg
1 0
X Cycles

T0SE
T0CS
PSA Set flag bit T0IF
on Overflow

0
M 8-bit Prescaler
U
Watchdog 1 X 8
Timer

8 - to - 1MUX PS2:PS0
PSA

0 1
WDT Enable bit
MUX PSA

WDT
Time-out

Note: T0CS, T0SE, PSA, PS2:PS0 are (OPTION<5:0>).

DS30444E - page 48  1997 Microchip Technology Inc.

 PIC16C9XX
7.3.1 SWITCHING PRESCALER ASSIGNMENT Note: To avoid an unintended device RESET, the
The prescaler assignment is fully under software con- following instruction sequence (shown in
trol, i.e., it can be changed “on the fly” during program Example 7-1) must be executed when
execution. changing the prescaler assignment from
Timer0 to the WDT. This precaution must
be followed even if the WDT is disabled.

EXAMPLE 7-1: CHANGING PRESCALER (TIMER0→WDT)

1) BSF STATUS, RP0 ;Select Bank1
Lines 2 and 3 do NOT have to 2) MOVLW b'xx0x0xxx' ;Select clock source and prescale value of
be included if the final desired 3) MOVWF OPTION_REG ;other than 1:1
prescale value is other than 1:1. 4) BCF STATUS, RP0 ;Select Bank0
If 1:1 is final desired value, then
5) CLRF TMR0 ;Clear TMR0 and prescaler
a temporary prescale value is
set in lines 2 and 3 and the final 6) BSF STATUS, RP1 ;Select Bank1
prescale value will be set in lines 7) MOVLW b'xxxx1xxx' ;Select WDT, do not change prescale value
10 and 11. 8) MOVWF OPTION_REG ;
9) CLRWDT ;Clears WDT and prescaler
10) MOVLW b'xxxx1xxx' ;Select new prescale value and WDT
11) MOVWF OPTION_REG ;
12) BCF STATUS, RP0 ;Select Bank0

To change prescaler from the WDT to the Timer0 mod-

ule use the precaution shown in Example 7-2.

EXAMPLE 7-2: CHANGING PRESCALER (WDT→TIMER0)

CLRWDT ;Clear WDT and prescaler
BSF STATUS, RP0 ;Select Bank1
MOVLW b'xxxx0xxx' ;Select TMR0, new prescale value and
MOVWF OPTION_REG ;clock source
BCF STATUS, RP0 ;Select Bank0

TABLE 7-1: REGISTERS ASSOCIATED WITH TIMER0

Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset

01h, 101h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
0Bh, 8Bh, INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
10Bh, 18Bh
81h, 181h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
85h TRISA — — PORTA Data Direction Control Register --11 1111 --11 1111
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by Timer0.

 1997 Microchip Technology Inc. DS30444E - page 49

PIC16C9XX
NOTES:

DS30444E - page 50  1997 Microchip Technology Inc.

 PIC16C9XX
8.0 TIMER1 MODULE Timer1 can be turned on and off using the control bit
TMR1ON (T1CON<0>).
Timer1 is a 16-bit timer/counter consisting of two 8-bit
registers (TMR1H and TMR1L) which are readable and Timer1 also has an internal “reset input”. This reset can
writable. The TMR1 Register pair (TMR1H:TMR1L) be generated by the CCP module (Section 10.0).
increments from 0000h to FFFFh and rolls over to Figure 8-1 shows the Timer1 control register.
0000h. The TMR1 Interrupt, if enabled, is generated on When the Timer1 oscillator is enabled (T1OSCEN is
overflow which is latched in interrupt flag bit TMR1IF set), the RC1/T1OSI and RC0/T1OSO/T1CKI pins
(PIR1<0>). This interrupt can be enabled/disabled by become inputs.
setting/clearing TMR1 interrupt enable bit TMR1IE
(PIE1<0>).
Timer1 can operate in one of two modes:
• As a timer
• As a counter
The operating mode is determined by the clock select
bit, TMR1CS (T1CON<1>).
In timer mode, Timer1 increments every instruction
cycle. In counter mode, it increments on every rising
edge of the external clock input.

FIGURE 8-1: T1CON: TIMER1 CONTROL REGISTER (ADDRESS 10h)

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON R = Readable bit
W = Writable bit
bit7 bit0
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit 7-6: Unimplemented: Read as '0'
bit 5-4: T1CKPS1:T1CKPS0: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale value
10 = 1:4 Prescale value
01 = 1:2 Prescale value
00 = 1:1 Prescale value
bit 3: T1OSCEN: Timer1 Oscillator Enable Control bit
1 = Oscillator is enabled
0 = Oscillator is shut off
Note: The oscillator inverter and feedback resistor are turned off to eliminate power drain
bit 2: T1SYNC: Timer1 External Clock Input Synchronization Control bit

TMR1CS = 1
1 = Do not synchronize external clock input
0 = Synchronize external clock input

TMR1CS = 0
This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0.
bit 1: TMR1CS: Timer1 Clock Source Select bit
1 = External clock from pin T1CKI (on the rising edge)
0 = Internal clock (Fosc/4)
bit 0: TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1

 1997 Microchip Technology Inc. DS30444E - page 51

PIC16C9XX
8.1 Timer1 Operation in Timer Mode 8.2.1 EXTERNAL CLOCK INPUT TIMING FOR
SYNCHRONIZED COUNTER MODE
Timer mode is selected by clearing the TMR1CS
(T1CON<1>) bit. In this mode, the input clock to the When an external clock input is used for Timer1 in syn-
timer is Fosc/4. The synchronize control bit T1SYNC chronized counter mode, it must meet certain require-
(T1CON<2>) has no effect since the internal clock is ments. The external clock requirement is due to
always in sync. internal phase clock (Tosc) synchronization. Also, there
is a delay in the actual incrementing of TMR1 after syn-
8.2 Timer1 Operation in Synchronized
chronization.
Counter Mode
When the prescaler is 1:1, the external clock input is
Counter mode is selected by setting bit TMR1CS. In the same as the prescaler output. The synchronization
this mode the timer increments on every rising edge of of T1CKI with the internal phase clocks is accom-
clock input on pin RC1/T1OSI when bit T1OSCEN is plished by sampling the prescaler output on the Q2 and
set or pin RC0/T1OSO/T1CKI when bit T1OSCEN is Q4 cycles of the internal phase clocks. Therefore, it is
cleared. necessary for T1CKI to be high for at least 2Tosc (and
If T1SYNC is cleared, then the external clock input is a small RC delay of 20 ns) and low for at least 2Tosc
synchronized with internal phase clocks. The synchro- (and a small RC delay of 20 ns). Refer to the appropri-
nization is done after the prescaler stage. The pres- ate electrical specifications, parameters 45, 46, and 47.
caler is an asynchronous ripple-counter. When a prescaler other than 1:1 is used, the external
In this configuration, during SLEEP mode, Timer1 will clock input is divided by the asynchronous rip-
not increment even if the external clock is present, ple-counter type prescaler so that the prescaler output
since the synchronization circuit is shut off. The pres- is symmetrical. In order for the external clock to meet
caler however will continue to increment. the sampling requirement, the ripple-counter must be
taken into account. Therefore, it is necessary for T1CKI
to have a period of at least 4Tosc (and a small RC delay
of 40 ns) divided by the prescaler value. The only
requirement on T1CKI high and low time is that they do
not violate the minimum pulse width requirements of
10 ns). Refer to the appropriate electrical specifica-
tions, parameters 40, 42, 45, 46, and 47.

FIGURE 8-2: TIMER1 BLOCK DIAGRAM

Set flag bit
TMR1IF on
Overflow Synchronized
TMR1 0
clock input
TMR1H TMR1L
1
TMR1ON
on/off T1SYNC
T1OSC
RC0/T1OSO/T1CKI 1
Synchronize
Prescaler
T1OSCEN Fosc/4 1, 2, 4, 8 det
Enable Internal 0
RC1/T1OSI Oscillator(1) Clock 2 SLEEP input
T1CKPS1:T1CKPS0
TMR1CS
Note 1: When the T1OSCEN bit is cleared, the inverter and feedback resistor are turned off. This eliminates power drain.

DS30444E - page 52  1997 Microchip Technology Inc.

 PIC16C9XX
8.3 Timer1 Operation in Asynchronous EXAMPLE 8-1: READING A 16-BIT
Counter Mode FREE-RUNNING TIMER
If control bit T1SYNC (T1CON<2>) is set, the external
; All interrupts are disabled
clock input is not synchronized. The timer continues to MOVF TMR1H, W ;Read high byte
increment asynchronous to the internal phase clocks. MOVWF TMPH ;
The timer will continue to run during SLEEP and can MOVF TMR1L, W ;Read low byte
generate an interrupt on overflow which will wake-up MOVWF TMPL ;
the processor. However, special precautions in soft- MOVF TMR1H, W ;Read high byte
ware are needed to read-from or write-to the Timer1 SUBWF TMPH, W ;Sub 1st read
register pair (TMR1H:TMR1L) (Section 8.3.2). ; with 2nd read
BTFSC STATUS,Z ;Is result = 0
In asynchronous counter mode, Timer1 cannot be used GOTO CONTINUE ;Good 16-bit read
as a time-base for capture or compare operations. ;
; TMR1L may have rolled over between the read
8.3.1 EXTERNAL CLOCK INPUT TIMING WITH ; of the high and low bytes. Reading the high
UNSYNCHRONIZED CLOCK ; and low bytes now will read a good value.
;
If control bit T1SYNC is set, the timer will increment MOVF TMR1H, W ;Read high byte
completely asynchronously. The input clock must meet MOVWF TMPH ;
certain minimum high time and low time requirements, MOVF TMR1L, W ;Read low byte
as specified in timing parameters 45, 46, and 47. MOVWF TMPL ;
; Re-enable the Interrupt (if required)
8.3.2 READING AND WRITING TMR1 IN CONTINUE ;Continue with your code
ASYNCHRONOUS COUNTER MODE
8.4 Timer1 Oscillator
Reading TMR1H or TMR1L while the timer is running,
from an external asynchronous clock, will ensure a A crystal oscillator circuit is built in between pins T1OSI
valid read (taken care of in hardware). However, the (input) and T1OSO (amplifier output). It is enabled by
user should keep in mind that reading the 16-bit timer setting control bit T1OSCEN (T1CON<3>). The oscilla-
in two 8-bit values itself poses certain problems since tor is a low power oscillator rated up to 200 kHz. It will
the timer may overflow between the reads. continue to run during SLEEP. It is primarily intended
for a 32 kHz crystal. Table 8-1 shows the capacitor
For writes, it is recommended that the user simply stop
selection for the Timer1 oscillator.
the timer and write the desired values. A write conten-
tion may occur by writing to the timer registers while the The Timer1 oscillator is identical to the LP oscillator.
register is incrementing. This may produce an unpre- The user must provide a software time delay to ensure
dictable value in the timer register. proper oscillator start-up.
Reading the 16-bit value requires some care. TABLE 8-1: CAPACITOR SELECTION FOR
Example 8-1 is an example routine to read the 16-bit THE TIMER1 OSCILLATOR
timer value. This is useful if the timer cannot be
stopped. Osc Type Freq C1 C2
LP 32 kHz 33 pF 33 pF
100 kHz 15 pF 15 pF
200 kHz 15 pF 15 pF
These values are for design guidance only.
Crystals Tested:
32.768 kHz Epson C-001R32.768K-A ± 20 PPM
100 kHz Epson C-2 100.00 KC-P ± 20 PPM
200 kHz STD XTL 200.000 kHz ± 20 PPM
Note 1: Higher capacitance increases the stability
of oscillator but also increases the start-up
time.
2: Since each resonator/crystal has its own
characteristics, the user should consult the
resonator/crystal manufacturer for appropri-
ate values of external components.

 1997 Microchip Technology Inc. DS30444E - page 53

PIC16C9XX
8.5 Resetting Timer1 using the CCP 8.6 Resetting of Timer1 Register Pair
Trigger Output (TMR1H:TMR1L)
If the CCP1 module is configured in compare mode to TMR1H and TMR1L registers are not reset on a POR
generate a “special event trigger" (CCP1M3:CCP1M0 or any other reset except by the CCP1 special event
= 1011), this signal will reset Timer1. trigger.
Note: The special event trigger from the CCP1 T1CON register is reset to 00h on a Power-on Reset. In
module will not set interrupt flag bit any other reset, the register is unaffected.
TMR1IF (PIR1<0>).
8.7 Timer1 Prescaler
Timer1 must be configured for either timer or synchro-
nized counter mode to take advantage of this feature. If The prescaler counter is cleared on writes to the
Timer1 is running in asynchronous counter mode, this TMR1H or TMR1L registers.
reset operation may not work.
In the event that a write to Timer1 coincides with a spe-
cial event trigger from CCP1, the write will take prece-
dence.
In this mode of operation, the CCPR1H:CCPR1L regis-
ters pair effectively becomes the period register for
Timer1.

TABLE 8-2: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER

Value on Value on
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on all other
Reset resets

0Bh, 8Bh, INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
10Bh, 18Bh
0Ch PIR1 LCDIF ADIF(1) — — SSPIF CCP1IF TMR2IF TMR1IF 00-- 0000 00-- 0000

8Ch PIE1 LCDIE ADIE(1) — — SSPIE CCP1IE TMR2IE TMR1IE 00-- 0000 00-- 0000

0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu

0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu

10h T1CON — — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu

Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used by theTimer1 module.
Note 1: Bits ADIE and ADIF are reserved on the PIC16C923, always maintain these bits clear.

DS30444E - page 54  1997 Microchip Technology Inc.

 PIC16C9XX
9.0 TIMER2 MODULE 9.1 Timer2 Prescaler and Postscaler
Timer2 is an 8-bit timer with a prescaler and a The prescaler and postscaler counters are cleared
postscaler. It can be used as the PWM time-base for when any of the following occurs:
the PWM mode of the CCP module. The TMR2 register • a write to the TMR2 register
is readable and writable, and is cleared on any device • a write to the T2CON register
reset.
• any device reset (Power-on Reset, MCLR Reset,
The input clock (FOSC/4) has a prescale option of 1:1, or Watchdog Timer Reset)
1:4 or 1:16 (selected by control bits
TMR2 will not clear when T2CON is written.
T2CKPS1:T2CKPS0 (T2CON<1:0>)).
The Timer2 module has an 8-bit period register, PR2. 9.2 Output of TMR2
TMR2 increments from 00h until it matches PR2 and The output of TMR2 (before the postscaler) is fed to the
then resets to 00h on the next increment cycle. PR2 is Synchronous Serial Port module which optionally uses
a readable and writable register. The PR2 register is set it to generate shift clock.
during RESET.
The match output of TMR2 goes through a 4-bit FIGURE 9-1: TIMER2 BLOCK DIAGRAM
postscaler (which gives a 1:1 to 1:16 scaling inclusive)
to generate a TMR2 interrupt (latched in flag bit Sets flag
TMR2
output (1) bit TMR2IF
TMR2IF, (PIR1<1>)).
Timer2 can be shut off by clearing control bit TMR2ON
Prescaler Reset
(T2CON<2>) to minimize power consumption. Fosc/4 TMR2 reg
1:1, 1:4, 1:16
Figure 9-2 shows the Timer2 control register. Postscaler
2 Comparator
EQ 1:16 to 1:1

PR2 reg 4

Note 1: TMR2 register output can be software selected

by the SSP Module as the source clock.

FIGURE 9-2: T2CON: TIMER2 CONTROL REGISTER (ADDRESS 12h)

U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 R = Readable bit
W = Writable bit
bit7 bit0
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit 7: Unimplemented: Read as '0'
bit 6-3: TOUTPS3:TOUTPS0: Timer2 Output Postscale Select bits
0000 = 1:1 Postscale
0001 = 1:2 Postscale
•
•
•
1111 = 1:16 Postscale
bit 2: TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0: T2CKPS1:T2CKPS0: Timer2 Clock Prescale Select bits
00 = Prescaler is 1
01 = Prescaler is 4
1x = Prescaler is 16

 1997 Microchip Technology Inc. DS30444E - page 55

PIC16C9XX
TABLE 9-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER
Value on Value on
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on all other
Reset resets

0Bh, 8Bh, INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
10Bh, 18Bh
0Ch PIR1 LCDIF ADIF(1) — — SSPIF CCP1IF TMR2IF TMR1IF 00-- 0000 00-- 0000

8Ch PIE1 LCDIE ADIE(1) — — SSPIE CCP1IE TMR2IE TMR1IE 00-- 0000 00-- 0000

11h TMR2 Timer2 module’s register 0000 0000 0000 0000

12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
92h PR2 Timer2 Period Register 1111 1111 1111 1111

Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used by the Timer2 module.
Note 1: Bits ADIE and ADIF are reserved on the PIC16C923, always maintain these bits clear.

DS30444E - page 56  1997 Microchip Technology Inc.

 PIC16C9XX
10.0 CAPTURE/COMPARE/PWM For use of the CCP module, refer to the Embedded
Control Handbook, "Using the CCP Modules" (AN594).
(CCP) MODULE
The CCP (Capture/Compare/PWM) module contains a TABLE 10-1: CCP MODE - TIMER RESOURCE
16-bit register which can operate as a 16-bit capture
register, as a 16-bit compare register, or as a PWM CCP Mode Timer Resource
master/slave duty cycle register. Table 10-1 shows the
timer resources used by the CCP module. Capture Timer1
Compare Timer1
Capture/Compare/PWM Register1 (CCPR1) is com- PWM Timer2
prised of two 8-bit registers: CCPR1L (low byte) and
CCPR1H (high byte). The CCP1CON register controls
the operation of CCP1. All three are readable and writ-
able.
Figure 10-1 shows the CCP1CON register.

FIGURE 10-1: CCP1CON REGISTER (ADDRESS 17h)

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— — CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 R = Readable bit
bit7 bit0 W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n =Value at POR reset
bit 7-6: Unimplemented: Read as '0'
bit 5-4: CCP1X:CCP1Y: PWM Least Significant bits
Capture Mode
Unused
Compare Mode
Unused
PWM Mode
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L.
bit 3-0: CCP1M3:CCP1M0: CCP1 Mode Select bits
0000 = Capture/Compare/PWM off (resets CCP1 module)
0100 = Capture mode, every falling edge
0101 = Capture mode, every rising edge
0110 = Capture mode, every 4th rising edge
0111 = Capture mode, every 16th rising edge
1000 = Compare mode, set output on match (bit CCP1IF is set)
1001 = Compare mode, clear output on match (bit CCP1IF is set)
1010 = Compare mode, generate software interrupt on match (bit CCP1IF is set, CCP1 pin is unaffected)
1011 = Compare mode, trigger special event (CCP1IF bit is set; CCP1 resets TMR1)
11xx = PWM mode

 1997 Microchip Technology Inc. DS30444E - page 57

PIC16C9XX
10.1 Capture Mode Switching from one capture prescaler to another may
generate an interrupt. Also, the prescaler counter will
In Capture mode, CCPR1H:CCPR1L captures the
not be cleared, therefore the first capture may be from
16-bit value of the TMR1 register when an event occurs
a non-zero prescaler. Example 10-1 shows the recom-
on pin RC2/CCP1 (Figure 10-2). An event is defined as:
mended method for switching between capture prescal-
• Every falling edge ers. This example also clears the prescaler counter and
• Every rising edge will not generate the “false” interrupt.
• Every 4th rising edge
• Every 16th rising edge EXAMPLE 10-1: CHANGING BETWEEN
CAPTURE PRESCALERS
An event is selected by control bits CCP1M3:CCP1M0
(CCP1CON<3:0>). When a capture is made, the inter- CLRF CCP1CON ; Turn CCP module off
rupt request flag bit CCP1IF (PIR1<2>) is set. It must MOVLW NEW_CAPT_PS ; Load the W reg with
be cleared in software. If another capture occurs before ; the new prescaler
the value in register CCPR1 is read, the old captured ; mode value and CCP ON
value will be lost. MOVWF CCP1CON ; Load CCP1CON with
; this value
10.1.1 CCP PIN CONFIGURATION
10.2 Compare Mode
In capture mode, the RC2/CCP1 pin should be config- In Compare mode, the 16-bit CCPR1 register value is
ured as an input by setting the TRISC<2> bit. constantly compared against the TMR1 register pair
Note: If the RC2/CCP1 pin is configured as an value. When a match occurs, the RC2/CCP1 pin is:
output, a write to the port can cause a cap- • Driven High
ture condition. • Driven Low
• Remains Unchanged
FIGURE 10-2: CAPTURE MODE OPERATION
The action on the pin is based on the value of control
BLOCK DIAGRAM
bits CCP1M3:CCP1M0 (CCP1CON<3:0>). At the
same time, a compare interrupt is also generated.
Set CCP1IF
CCP PIR1<2>
Prescaler FIGURE 10-3: COMPARE MODE
÷ 1, 4, 16
OPERATION BLOCK DIAGRAM
RC2/CCP1 CCPR1H CCPR1L
pin

and Capture Special event trigger will reset Timer1, but not
edge detect Enable set interrupt flag bit TMR1IF (PIR1<0>).

TMR1H TMR1L
CCP1CON<3:0> Set CCP1IF
Trigger

PIR1<2>
Q’s
CCPR1H CCPR1L

10.1.2 TIMER1 MODE SELECTION Q S Output

Logic Comparator
RC2/CCP1 R match
Timer1 must be running in timer mode or synchronized
TRISC<2> TMR1H TMR1L
counter mode for the CCP module to use the capture Output Enable
feature. In asynchronous counter mode the capture CCP1CON<3:0>
operation may not work. Mode Select

10.1.3 SOFTWARE INTERRUPT

When the Capture mode is changed, a false capture

interrupt may be generated. The user should keep 10.2.1 CCP PIN CONFIGURATION
enable bit CCP1IE (PIE1<2>) clear to avoid false inter-
The user must configure the RC2/CCP1 pin as an out-
rupts and should clear flag bit CCP1IF following any
put by clearing the TRISC<2> bit.
such change in operating mode.
Note: Clearing the CCP1CON register will force
10.1.4 CCP PRESCALER the RC2/CCP1 compare output latch to the
There are four prescaler settings, specified by bits default low level. This is not the data latch.
CCP1M3:CCP1M0. Whenever the CCP module is
turned off, or the CCP module is not in Capture mode,
the prescaler counter is cleared. This means that any
reset will clear the prescaler counter.

DS30444E - page 58  1997 Microchip Technology Inc.

 PIC16C9XX
10.2.1 TIMER1 MODE SELECTION FIGURE 10-4: SIMPLIFIED PWM BLOCK
DIAGRAM
Timer1 must be running in Timer mode or Synchro-
nized Counter mode if the CCP module is using the CCP1CON<5:4>
Duty cycle registers
compare feature. In Asynchronous Counter mode, the
compare operation may not work. CCPR1L

10.2.2 SOFTWARE INTERRUPT MODE

When Generate Software Interrupt is chosen, the CCPR1H (Slave)

CCP1 pin is not affected. Only a CCP interrupt is gen-
erated (if enabled).
Comparator R Q
10.2.3 SPECIAL EVENT TRIGGER
RC1/CCP1
TMR2 (Note 1)
In this mode, an internal hardware trigger is generated S
which may be used to initiate an action.
The special event trigger output of CCP1 resets the Comparator TRISC<2>

TMR1 register pair and starts an A/D conversion. This Clear Timer,
CCP1 pin and
allows the CCPR1H:CCPR1L register pair to effectively PR2
latch D.C.
be a 16-bit programmable period register for Timer1.
Note: The "special event trigger" from the CCP1 Note 1: 8-bit timer is concatenated with 2-bit internal Q clock
module will not set interrupt flag bit or 2 bits of the prescaler to create 10-bit time-base.
TMR1IF (PIR1<0>).
A PWM output (Figure 10-5) has a time-base (period)
10.3 PWM Mode and a time that the output stays high (duty cycle). The
In Pulse Width Modulation (PWM) mode, the CCP1 pin frequency of the PWM is the inverse of the period
produces up to a 10-bit resolution PWM output. Since (1/period).
the CCP1 pin is multiplexed with the PORTC data latch,
the TRISC<2> bit must be cleared to make the CCP1 FIGURE 10-5: PWM OUTPUT
pin an output. Period
Note: Clearing the CCP1CON register will force
the CCP1 PWM output latch to the default
low level. This is not the PORTC I/O data
latch.
Duty Cycle TMR2 = PR2
Figure 10-4 shows a simplified block diagram of the
CCP module in PWM mode. TMR2 = Duty Cycle
For a step by step procedure on how to set up the CCP TMR2 = PR2
module for PWM operation, see Section 10.3.3.
10.3.1 PWM PERIOD

The PWM period is specified by writing to the PR2 reg-

ister. The PWM period can be calculated using the fol-
lowing formula:
PWM period = [ (PR2) + 1 ] • 4 • TOSC •
(TMR2 prescale value)
PWM frequency is defined as 1 / [PWM period].
When TMR2 is equal to PR2, the following three events
occur on the next increment cycle:
• TMR2 is cleared
• The CCP1 pin is set (exception: if PWM duty
cycle = 0%, the CCP1 pin will not be set)
• The PWM duty cycle is latched from CCPR1L into
CCPR1H

 1997 Microchip Technology Inc. DS30444E - page 59

PIC16C9XX
Note: The Timer2 postscaler (Section 9.0) is not EXAMPLE 10-2: PWM PERIOD AND DUTY
used in the determination of the PWM fre- CYCLE CALCULATION
quency. The postscaler could be used to Desired PWM frequency is 31.25 kHz,
have a servo update rate at a different fre- Fosc = 8 MHz
quency than the PWM output. TMR2 prescale = 1
10.3.2 PWM DUTY CYCLE 1/31.25 kHz = [ (PR2) + 1 ] • 4 • 1/8 MHz • 1
32 µs = [ (PR2) + 1 ] • 4 • 125 ns • 1
The PWM duty cycle is specified by writing to the
CCPR1L register and to the CCP1CON<5:4> bits. Up PR2 = 63
to 10-bit resolution is available: the CCPR1L contains Find the maximum resolution of the duty cycle that can
the eight MSbs and CCP1CON<5:4> contains the two be used with a 31.25 kHz frequency and 8 MHz oscilla-
LSbs. This 10-bit value is represented by tor:
CCPR1L:CCP1CON<5:4>. The following equation is
used to calculate the PWM duty cycle in time: 1/31.25 kHz = 2PWM RESOLUTION • 1/8 MHz • 1

PWM duty cycle = (CCPR1L:CCP1CON<5:4>) • 32 µs = 2PWM RESOLUTION • 125 ns • 1

Tosc • (TMR2 prescale value) 256 = 2PWM RESOLUTION
CCPR1L and CCP1CON<5:4> can be written to at any log(256) = (PWM Resolution) • log(2)
time, but the duty cycle value is not latched into 8.0 = PWM Resolution
CCPR1H until after a match between PR2 and TMR2
occurs (i.e., the period is complete). In PWM mode, At most, an 8-bit resolution duty cycle can be obtained
CCPR1H is a read-only register. from a 31.25 kHz frequency and a 8 MHz oscillator, i.e.,
0 ≤ CCPR1L:CCP1CON<5:4> ≤ 255. Any value greater
The CCPR1H register and a 2-bit internal latch are than 255 will result in a 100% duty cycle.
used to double buffer the PWM duty cycle. This double
buffering is essential for glitchless PWM operation. In order to achieve higher resolution, the PWM fre-
quency must be decreased. In order to achieve higher
When the CCPR1H and 2-bit latch match TMR2 con- PWM frequency, the resolution must be decreased.
catenated with an internal 2-bit Q clock or 2 bits of the
TMR2 prescaler, the CCP1 pin is cleared. Table 10-2 lists example PWM frequencies and resolu-
tions for Fosc = 8 MHz. TMR2 prescaler and PR2 val-
Maximum PWM resolution (bits) for a given PWM fre- ues are also shown.
quency:
10.3.3 SET-UP FOR PWM OPERATION
log( FOSC
FPWM ) The following steps should be taken when configuring
= bits
the CCP module for PWM operation:
log(2)
1. Set the PWM period by writing to the PR2 regis-
ter.
2. Set the PWM duty cycle by writing to the
Note: If the PWM duty cycle value is longer than CCPR1L register and CCP1CON<5:4> bits.
the PWM period the CCP1 pin will not be 3. Make the CCP1 pin an output by clearing the
cleared. TRISC<2> bit.
4. Set the TMR2 prescale value and enable Timer2
by writing to T2CON.
5. Configure the CCP module for PWM operation.

TABLE 10-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 8 MHz

PWM Frequency 488 Hz 1.95 kHz 7.81 kHz 31.25 kHz 62.5 kHz 250 kHz
Timer Prescaler (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x07
Maximum Resolution (bits) 10 10 10 8 7 5

DS30444E - page 60  1997 Microchip Technology Inc.

 PIC16C9XX
TABLE 10-3: REGISTERS ASSOCIATED WITH TIMER1, CAPTURE AND COMPARE
Value on Value on
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on all other
Reset Resets
0Bh, 8Bh, INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
10Bh, 18Bh
0Ch PIR1 LCDIF ADIF(1) — — SSPIF CCP1IF TMR2IF TMR1IF 00-- 0000 00-- 0000
(1) 00-- 0000 00-- 0000
8Ch PIE1 LCDIE ADIE — — SSPIE CCP1IE TMR2IE TMR1IE

87h TRISC — — PORTC Data Direction Control Register --11 1111 --11 1111

0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu

0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu

10h T1CON — — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu

15h CCPR1L Capture/Compare/PWM1 (LSB) xxxx xxxx uuuu uuuu

16h CCPR1H Capture/Compare/PWM1 (MSB) xxxx xxxx uuuu uuuu

17h CCP1CON — — CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0’. Shaded cells are not used in these modes.
Note 1: Bits ADIE and ADIF reserved on the PIC16C923, always maintain these bits clear.

TABLE 10-4: REGISTERS ASSOCIATED WITH PWM AND TIMER2

Value on Value on
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on all other
Reset Resets
0Bh, 8Bh, INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
10Bh, 18Bh
0Ch PIR1 LCDIF ADIF(1) — — SSPIF CCP1IF TMR2IF TMR1IF 00-- 0000 00-- 0000
8Ch PIE1 LCDIE ADIE(1) — — SSPIE CCP1IE TMR2IE TMR1IE 00-- 0000 00-- 0000
87h TRISC — — PORTC Data Direction Control Register --11 1111 --11 1111
11h TMR2 Timer2 module’s register 0000 0000 0000 0000
92h PR2 Timer2 module’s Period register 1111 1111 1111 1111
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
15h CCPR1L Capture/Compare/PWM1 (LSB) xxxx xxxx uuuu uuuu
16h CCPR1H Capture/Compare/PWM1 (MSB) xxxx xxxx uuuu uuuu
17h CCP1CON — — CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0’. Shaded cells are not used in this mode.
Note 1: Bits ADIE and ADIF reserved on the PIC16C923, always maintain these bits clear.

 1997 Microchip Technology Inc. DS30444E - page 61

PIC16C9XX
NOTES:

DS30444E - page 62  1997 Microchip Technology Inc.

 PIC16C9XX
11.0 SYNCHRONOUS SERIAL play drivers, A/D converters, etc. The SSP module can
operate in one of two modes:
PORT (SSP) MODULE
• Serial Peripheral Interface (SPI)
The Synchronous Serial Port (SSP) module is a serial
interface useful for communicating with other periph- • Inter-Integrated Circuit (I 2C)
eral or microcontroller devices. These peripheral Refer to Application Note AN578, "Use of the SSP
devices may be serial EEPROMs, shift registers, dis- Module in the I 2C Multi-Master Environment."
FIGURE 11-1: SSPSTAT: SYNC SERIAL PORT STATUS REGISTER (ADDRESS 94h)

R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0

SMP CKE D/A P S R/W UA BF R = Readable bit
bit7 bit0 W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n =Value at POR reset
bit 7: SMP: SPI data input sample phase
SPI Master Mode
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
SPI Slave Mode
SMP must be cleared when SPI is used in slave mode
bit 6: CKE: SPI Clock Edge Select (Figure 11-5, Figure 11-6, and Figure 11-7)
CKP = 0
1 = Data transmitted on rising edge of SCK
0 = Data transmitted on falling edge of SCK
CKP = 1
1 = Data transmitted on falling edge of SCK
0 = Data transmitted on rising edge of SCK
bit 5: D/A: Data/Address bit (I2C mode only)
1 = Indicates that the last byte received or transmitted was data
0 = Indicates that the last byte received or transmitted was address
bit 4: P: Stop bit (I2C mode only. This bit is cleared when the SSP module is disabled, or when the Start bit was
detected last)
1 = Indicates that a stop bit has been detected last (this bit is '0' on RESET)
0 = Stop bit was not detected last
bit 3: S: Start bit (I2C mode only. This bit is cleared when the SSP module is disabled, or when the Stop bit was
detected last)
1 = Indicates that a start bit has been detected last (this bit is '0' on RESET)
0 = Start bit was not detected last
bit 2: R/W: Read/Write bit information (I2C mode only)
This bit holds the R/W bit information following the last address match. This bit is only valid from the
address match to the next start bit, stop bit, or ACK bit.
1 = Read
0 = Write
bit 1: UA: Update Address (10-bit I2C mode only)
1 = Indicates that the user needs to update the address in the SSPADD register
0 = Address does not need to be updated
bit 0: BF: Buffer Full Status bit
Receive (SPI and I2C modes)
1 = Receive complete, SSPBUF is full
0 = Receive not complete, SSPBUF is empty
Transmit (I2C mode only)
1 = Transmit in progress, SSPBUF is full
0 = Transmit complete, SSPBUF is empty

 1997 Microchip Technology Inc. DS30444E - page 63

PIC16C9XX
FIGURE 11-2: SSPCON: SYNC SERIAL PORT CONTROL REGISTER (ADDRESS 14h)

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 R = Readable bit
bit7 bit0 W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n =Value at POR reset
bit 7: WCOL: Write Collision Detect bit
1 = The SSPBUF register is written while it is still transmitting the previous word
(must be cleared in software)
0 = No collision
bit 6: SSPOV: Receive Overflow Indicator bit
In SPI mode
1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow,
the data in SSPSR is lost. Overflow can only occur in slave mode. The user must read the SSPBUF, even
if only transmitting data, to avoid setting overflow. In master mode the overflow bit is not set since each
new reception (and transmission) is initiated by writing to the SSPBUF register.
0 = No overflow
In I2C mode
1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a "don’t care"
in transmit mode. SSPOV must be cleared in software in either mode.
0 = No overflow
bit 5: SSPEN: Synchronous Serial Port Enable bit
In SPI mode
1 = Enables serial port and configures SCK, SDO, and SDI as serial port pins
0 = Disables serial port and configures these pins as I/O port pins
In I2C mode
1 = Enables the serial port and configures the SDA and SCL pins as serial port pins
0 = Disables serial port and configures these pins as I/O port pins
In both modes, when enabled, these pins must be properly configured as input or output.
bit 4: CKP: Clock Polarity Select bit
In SPI mode
1 = Idle state for clock is a high level
0 = Idle state for clock is a low level
In I2C mode
SCK release control
1 = Enable clock
0 = Holds clock low (clock stretch) (Used to ensure data setup time)
bit 3-0: SSPM3:SSPM0: Synchronous Serial Port Mode Select bits
0000 = SPI master mode, clock = FOSC/4
0001 = SPI master mode, clock = FOSC/16
0010 = SPI master mode, clock = FOSC/64
0011 = SPI master mode, clock = TMR2 output/2
0100 = SPI slave mode, clock = SCK pin. SS pin control enabled.
0101 = SPI slave mode, clock = SCK pin. SS pin control disabled. SS can be used as I/O pin
0110 = I2C slave mode, 7-bit address
0111 = I2C slave mode, 10-bit address
1011 = I2C Firmware controlled master mode (slave idle)
1110 = I2C slave mode, 7-bit address with start and stop bit interrupts enabled
1111 = I2C slave mode, 10-bit address with start and stop bit interrupts enabled

DS30444E - page 64  1997 Microchip Technology Inc.

 PIC16C9XX
11.1 SPI Mode EXAMPLE 11-1: LOADING THE SSPBUF
The SPI mode allows 8-bits of data to be synchro- (SSPSR) REGISTER
nously transmitted and received simultaneously. To
BCF STATUS, RP1 ;Select Bank1
accomplish communication, typically three pins are
BSF STATUS, RP0 ;
used: LOOP BTFSS SSPSTAT, BF ;Has data been
• Serial Data Out (SDO) RC5/SDO ;received
• Serial Data In (SDI) RC4/SDI ;(transmit
;complete)?
• Serial Clock (SCK) RC3/SCK GOTO LOOP ;No
Additionally a fourth pin may be used when in a slave BCF STATUS, RP0 ;Select Bank0
mode of operation: MOVF SSPBUF, W ;W reg = contents
; of SSPBUF
• Slave Select (SS) RA5/AN4/SS (the AN4 function MOVWF RXDATA ;Save in user RAM
is implemented on the PIC16C924 only) MOVF TXDATA, W ;W reg = contents
When initializing the SPI, several options need to be ; of TXDATA
specified. This is done by programming the appropriate MOVWF SSPBUF ;New data to xmit
control bits in the SSPCON register (SSPCON<5:0>)
The block diagram of the SSP module, when in SPI
and SSPSTAT<7:6>. These control bits allow the fol-
mode (Figure 11-3), shows that the SSPSR is not
lowing to be specified:
directly readable or writable, and can only be accessed
• Master Mode (SCK is the clock output) from addressing the SSPBUF register. Additionally, the
• Slave Mode (SCK is the clock input) SSP status register (SSPSTAT) indicates the various
• Clock Polarity (Idle state of SCK) status conditions.
• Clock edge (output data on rising/falling edge of
SCK) FIGURE 11-3: SSP BLOCK DIAGRAM
• Clock Rate (Master mode only) (SPI MODE)
• Slave Select Mode (Slave mode only) Internal
data bus
The SSP consists of a transmit/receive Shift Register
Read Write
(SSPSR) and a buffer register (SSPBUF). The SSPSR
shifts the data in and out of the device, MSb first. The
SSPBUF reg
SSPBUF holds the data that was written to the SSPSR,
until the received data is ready. Once the 8-bits of data
have been received, that byte is moved to the SSPBUF
register. Then the buffer full detect bit BF
SSPSR reg
(SSPSTAT<0>) and interrupt flag bit SSPIF (PIR1<3>)
are set. This double buffering of the received data RC4/SDI/SDA bit0 shift
clock
(SSPBUF) allows the next byte to start reception before
reading the data that was just received. Any write to the RC5/SDO
SSPBUF register during transmission/reception of data
will be ignored, and the write collision detect bit WCOL
(SSPCON<7>) will be set. User software must clear the SS Control
WCOL bit so that it can be determined if the following Enable
write(s) to the SSPBUF register completed success- RA5/AN4/SS Edge
fully. When the application software is expecting to Select
receive valid data, the SSPBUF should be read before
the next byte of data to transfer is written to the 2
SSPBUF. Buffer full bit BF (SSPSTAT<0>) indicates Clock Select
when SSPBUF has been loaded with the received data
(transmission is complete). When the SSPBUF is read, SSPM3:SSPM0
TMR2 output
bit BF is cleared. This data may be irrelevant if the SPI 4 2
is only a transmitter. Generally the SSP Interrupt is
used to determine when the transmission/reception Edge
Select Prescaler TCY
has completed. The SSPBUF must be read and/or writ-
RC3/SCK/ 4, 16, 64
ten. If the interrupt method is not going to be used, then SCL
software polling can be done to ensure that a write col-
TRISC<3>
lision does not occur. Example 11-1 shows the loading
of the SSPBUF (SSPSR) for data transmission. The
shaded instruction is only required if the received data
is meaningful.

 1997 Microchip Technology Inc. DS30444E - page 65

PIC16C9XX
To enable the serial port, SSP Enable bit, SSPEN The master can initiate the data transfer at any time
(SSPCON<5>) must be set. To reset or reconfigure SPI because it controls the SCK. The master determines
mode, clear bit SSPEN, re-initialize the SSPCON reg- when the slave (Processor 2) is to broadcast data by
ister, and then set bit SSPEN. This configures the SDI, the firmware protocol.
SDO, SCK, and SS pins as serial port pins. For the pins In master mode the data is transmitted/received as
to behave as the serial port function, they must have soon as the SSPBUF register is written to. If the SPI is
their data direction bits (in the TRISC register) appro- only going to receive, the SCK output could be disabled
priately programmed. That is: (programmed as an input). The SSPSR register will
• SDI must have TRISC<4> set continue to shift in the signal present on the SDI pin at
• SDO must have TRISC<5> cleared the programmed clock rate. As each byte is received, it
• SCK (Master mode) must have TRISC<3> will be loaded into the SSPBUF register as if a normal
cleared received byte (interrupts and status bits appropriately
set). This could be useful in receiver applications as a
• SCK (Slave mode) must have TRISC<3> set
“line activity monitor” mode.
• SS must have TRISA<5> set
In slave mode, the data is transmitted and received as
Any serial port function that is not desired may be over- the external clock pulses appear on SCK. When the last
ridden by programming the corresponding data direc- bit is latched the interrupt flag bit SSPIF (PIR1<3>) is
tion (TRIS) register to the opposite value. An example set.
would be in master mode where you are only sending
data (to a display driver), then both SDI and SS could The clock polarity is selected by appropriately program-
be used as general purpose outputs by clearing their ming bit CKP (SSPCON<4>). This then would give
corresponding TRIS register bits. waveforms for SPI communication as shown in
Figure 11-5, Figure 11-6, and Figure 11-7 where the
Figure 11-4 shows a typical connection between two MSB is transmitted first. In master mode, the SPI clock
microcontrollers. The master controller (Processor 1) rate (bit rate) is user programmable to be one of the fol-
initiates the data transfer by sending the SCK signal. lowing:
Data is shifted out of both shift registers on their pro-
grammed clock edge, and latched on the opposite edge • FOSC/4 (or TCY)
of the clock. Both processors should be programmed to • FOSC/16 (or 4 • TCY)
same Clock Polarity (CKP), then both controllers would • FOSC/64 (or 16 • TCY)
send and receive data at the same time. Whether the • Timer2 output/2
data is meaningful (or dummy data) depends on the
This allows a maximum bit clock frequency (at 8 MHz)
application software. This leads to three scenarios for
of 2 MHz. When in slave mode the external clock must
data transmission:
meet the minimum high and low times.
• Master sends data — Slave sends dummy data
In sleep mode, the slave can transmit and receive data
• Master sends data — Slave sends data and wake the device from sleep.
• Master sends dummy data — Slave sends data

FIGURE 11-4: SPI MASTER/SLAVE CONNECTION

SPI Master SSPM3:SSPM0 = 00xxb SPI Slave SSPM3:SSPM0 = 010xb

SDO SDI

Serial Input Buffer Serial Input Buffer

(SSPBUF) (SSPBUF)

SDI SDO
Shift Register Shift Register
(SSPSR) (SSPSR)

MSb LSb MSb LSb

Serial Clock
SCK SCK

PROCESSOR 1 PROCESSOR 2

DS30444E - page 66  1997 Microchip Technology Inc.

 PIC16C9XX
The SS pin allows a synchronous slave mode. The Note: When the SPI is in Slave Mode with SS pin
SPI must be in slave mode (SSPCON<3:0> = 04h) control enabled, (SSPCON<3:0> = 0100)
and the TRISA<5> bit must be set for the synchro- the SPI module will reset if the SS pin is set
nous slave mode to be enabled. When the SS pin is to VDD.
low, transmission and reception are enabled and the
SDO pin is driven. When the SS pin goes high, the Note: If the SPI is used in Slave Mode with
SDO pin is no longer driven, even if in the middle of CKE = '1', then the SS pin control must be
a transmitted byte, and becomes a floating output. enabled.
External pull-up/ pull-down resistors may be desirable, To emulate two-wire communication, the SDO pin can
depending on the application. be connected to the SDI pin. When the SPI needs to
operate as a receiver the SDO pin can be configured as
an input. This disables transmissions from the SDO.
The SDI can always be left as an input (SDI function)
since it cannot create a bus conflict.

FIGURE 11-5: SPI MODE TIMING, MASTER MODE

SCK (CKP = 0,
CKE = 0)
SCK (CKP = 0,
CKE = 1)

SCK (CKP = 1,
CKE = 0)
SCK (CKP = 1,
CKE = 1)

SDO bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0

SDI (SMP = 0)

bit7 bit0
SDI (SMP = 1)

bit7 bit0
SSPIF

FIGURE 11-6: SPI MODE TIMING (SLAVE MODE WITH CKE = 0)

SS (optional)

SCK (CKP = 0)

SCK (CKP = 1)

SDO bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0

SDI (SMP = 0)

bit7 bit0

SSPIF

 1997 Microchip Technology Inc. DS30444E - page 67

PIC16C9XX
FIGURE 11-7: SPI MODE TIMING (SLAVE MODE WITH CKE = 1)

SS
(not optional)

SCK (CKP = 0)

SCK (CKP = 1)

SDO bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0

SDI (SMP = 0)
bit7 bit0

SSPIF

TABLE 11-1: REGISTERS ASSOCIATED WITH SPI OPERATION

Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset

0Bh, 8Bh, INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
10Bh, 18Bh
0Ch PIR1 LCDIF ADIF(1) — — SSPIF CCP1IF TMR2IF TMR1IF 00-- 0000 00-- 0000

8Ch PIE1 LCDIE ADIE(1) — — SSPIE CCP1IE TMR2IE TMR1IE 00-- 0000 00-- 0000

13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu

14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000

85h TRISA — — PORTA Data Direction Control Register --11 1111 --11 1111

87h TRISC — — PORTC Data Direction Control Register --11 1111 --11 1111

94h SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000
Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used by the SSP in SPI mode.
Note 1: Bits ADIE and ADIF are reserved on the PIC16C923, always maintain these bits clear.

DS30444E - page 68  1997 Microchip Technology Inc.

 PIC16C9XX
11.2 I 2C Overview The output stages of the clock (SCL) and data (SDA)
lines must have an open-drain or open-collector in
This section provides an overview of the Inter-Inte-
order to perform the wired-AND function of the bus.
grated Circuit (I 2C) bus, with Section 11.3 discussing
External pull-up resistors are used to ensure a high
the operation of the SSP module in I 2C mode.
level when no device is pulling the line down. The num-
The I 2C bus is a two-wire serial interface developed by ber of devices that may be attached to the I 2C bus is
the Philips Corporation. The original specification, or limited only by the maximum bus loading specification
standard mode, was for data transfers of up to 100 of 400 pF.
Kbps. An enhanced specification, or fast mode is not
supported. This device will communicate with fast 11.2.1 INITIATING AND TERMINATING DATA
mode devices if attached to the same bus. TRANSFER
The I 2C interface employs a comprehensive protocol to During times of no data transfer (idle time), both the
ensure reliable transmission and reception of data. clock line (SCL) and the data line (SDA) are pulled high
When transmitting data, one device is the “master” through the external pull-up resistors. The START and
which initiates transfer on the bus and generates the STOP conditions determine the start and stop of data
clock signals to permit that transfer, while the other transmission. The START condition is defined as a high
device(s) acts as the “slave.” All portions of the slave to low transition of the SDA when the SCL is high. The
protocol are implemented in the SSP module’s hard- STOP condition is defined as a low to high transition of
ware, except general call support, while portions of the the SDA when the SCL is high. Figure 11-8 shows the
master protocol need to be addressed in the START and STOP conditions. The master generates
PIC16CXXX software. Table 11-2 defines some of the these conditions for starting and terminating data trans-
I 2C bus terminology. For additional information on the fer. Due to the definition of the START and STOP con-
I 2C interface specification, refer to the Philips docu- ditions, when data is being transmitted, the SDA line
ment “The I 2C bus and how to use it.” #939839340011, can only change state when the SCL line is low.
which can be obtained from the Philips Corporation.
In the I 2C interface protocol each device has an FIGURE 11-8: START AND STOP
address. When a master wishes to initiate a data trans- CONDITIONS
fer, it first transmits the address of the device that it
wishes to “talk” to. All devices “listen” to see if this is
their address. Within this address, a bit specifies if the
master wishes to read-from/write-to the slave device. SDA
The master and slave are always in opposite modes
(transmitter/receiver) of operation during a data trans-
SCL S P
fer. That is they can be thought of as operating in either
of these two relations: Start Change Change Stop
Condition of Data of Data Condition
• Master-transmitter and Slave-receiver Allowed Allowed
• Slave-transmitter and Master-receiver
In both cases the master generates the clock signal.

TABLE 11-2: I2C BUS TERMINOLOGY

Term Description

Transmitter The device that sends the data to the bus.

Receiver The device that receives the data from the bus.

Master The device which initiates the transfer, generates the clock and terminates the transfer.

Slave The device addressed by a master.

Multi-master More than one master device in a system. These masters can attempt to control the bus at the
same time without corrupting the message.

Arbitration Procedure that ensures that only one of the master devices will control the bus. This ensure that
the transfer data does not get corrupted.

Synchronization Procedure where the clock signals of two or more devices are synchronized.

 1997 Microchip Technology Inc. DS30444E - page 69

PIC16C9XX
11.2.2 ADDRESSING I 2C DEVICES FIGURE 11-11: SLAVE-RECEIVER
ACKNOWLEDGE
There are two address formats. The simplest is the 7-bit
address format with a R/W bit (Figure 11-9). The more Data
complex is the 10-bit address with a R/W bit Output by
Transmitter
(Figure 11-10). For 10-bit address format, two bytes
Data not acknowledge
must be transmitted with the first five bits specifying this Output by
to be a 10-bit address. Receiver
acknowledge
SCL from
Master 2 8 9
FIGURE 11-9: 7-BIT ADDRESS FORMAT 1

S
MSb LSb Start Clock Pulse for
Condition Acknowledgment
S R/W ACK

slave address Sent by

If the master is receiving the data (master-receiver), it
Slave
generates an acknowledge signal for each received
S Start Condition byte of data, except for the last byte. To signal the end
R/W Read/Write pulse of data to the slave-transmitter, the master does not
ACK Acknowledge
generate an acknowledge (not acknowledge). The
slave then releases the SDA line so the master can
generate the STOP condition. The master can also
FIGURE 11-10: I2C 10-BIT ADDRESS generate the STOP condition during the acknowledge
FORMAT pulse for valid termination of data transfer.
If the slave needs to delay the transmission of the next
S 1 1 1 1 0 A9 A8 R/W ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK
byte, holding the SCL line low will force the master into
sent by slave a wait state. Data transfer continues when the slave
= 0 for write releases the SCL line. This allows the slave to move the
S - Start Condition
R/W - Read/Write Pulse
received data or fetch the data it needs to transfer
ACK - Acknowledge before allowing the clock to start. This wait state tech-
nique can also be implemented at the bit level,
Figure 11-12. The slave will inherently stretch the clock,
11.2.3 TRANSFER ACKNOWLEDGE when it is a transmitter, but will not when it is a receiver.
The slave will have to clear the SSPCON<4> bit to
All data must be transmitted per byte, with no limit to the
enable clock stretching when it is a receiver.
number of bytes transmitted per data transfer. After
each byte, the slave-receiver generates an acknowl-
edge bit (ACK) (Figure 11-11). When a slave-receiver
doesn’t acknowledge the slave address or received
data, the master must abort the transfer. The slave
must leave SDA high so that the master can generate
the STOP condition (Figure 11-8).

FIGURE 11-12: DATA TRANSFER WAIT STATE

SDA
MSB acknowledgment acknowledgment
signal from receiver byte complete signal from receiver
interrupt with receiver
clock line held low while
interrupts are serviced
SCL S 1 2 7 8 9 1 2 3•8 9 P
Start Stop
Condition Address R/W ACK Wait Data ACK
State Condition

DS30444E - page 70  1997 Microchip Technology Inc.

 PIC16C9XX
Figure 11-13 and Figure 11-14 show Master-transmit- is high), but occurs after a data transfer acknowledge
ter and Master-receiver data transfer sequences. pulse (not the bus-free state). This allows a master to
When a master does not wish to relinquish the bus (by send “commands” to the slave and then receive the
generating a STOP condition), a repeated START con- requested information or to address a different slave
dition (Sr) must be generated. This condition is identical device. This sequence is shown in Figure 11-15.
to the start condition (SDA goes high-to-low while SCL

FIGURE 11-13: MASTER-TRANSMITTER SEQUENCE

For 7-bit address: For 10-bit address:

S Slave Address R/W A Data A Data A/A P S Slave Address R/W A1 Slave Address A2
First 7 bits Second byte
'0' (write) data transferred
(n bytes - acknowledge) (write)
A master transmitter addresses a slave receiver with a
7-bit address. The transfer direction is not changed. Data A Data A/A P
A = acknowledge (SDA low)
From master to slave A = not acknowledge (SDA high)
S = Start Condition A master transmitter addresses a slave receiver
From slave to master P = Stop Condition with a 10-bit address.

FIGURE 11-14: MASTER-RECEIVER SEQUENCE

For 7-bit address: For 10-bit address:

S Slave Address R/W A Data A Data A P S Slave Address R/W A1 Slave Address A2
First 7 bits Second byte
'1' (read) data transferred
(n bytes - acknowledge) (write)
A master reads a slave immediately after the first byte.
Sr Slave Address R/W A3 Data A Data A P
A = acknowledge (SDA low) First 7 bits
From master to slave A = not acknowledge (SDA high) (read)
S = Start Condition A master transmitter addresses a slave receiver
From slave to master P = Stop Condition with a 10-bit address.

FIGURE 11-15: COMBINED FORMAT

(read or write)
(n bytes + acknowledge)

S Slave Address R/W A Data A/A Sr Slave Address R/W A Data A/A P

(read) Sr = repeated (write) Direction of transfer

Start Condition may change at this point

Transfer direction of data and acknowledgment bits depends on R/W bits.

Combined format:
Sr Slave Address R/W A Slave Address A Data A Data A/A Sr Slave Address R/W A Data A Data A P
First 7 bits Second byte First 7 bits
(write) (read)

Combined format - A master addresses a slave with a 10-bit address, then transmits
data to this slave and reads data from this slave.
A = acknowledge (SDA low)
From master to slave A = not acknowledge (SDA high)
S = Start Condition
From slave to master P = Stop Condition

 1997 Microchip Technology Inc. DS30444E - page 71

PIC16C9XX
11.2.4 MULTI-MASTER 11.2.4.2 Clock Synchronization

The I2C protocol allows a system to have more than Clock synchronization occurs after the devices have
one master. This is called multi-master. When two or started arbitration. This is performed using a
more masters try to transfer data at the same time, arbi- wired-AND connection to the SCL line. A high to low
tration and synchronization occur. transition on the SCL line causes the concerned
devices to start counting off their low period. Once a
11.2.4.1 ARBITRATION device clock has gone low, it will hold the SCL line low
until its SCL high state is reached. The low to high tran-
Arbitration takes place on the SDA line, while the SCL sition of this clock may not change the state of the SCL
line is high. The master which transmits a high when the line, if another device clock is still within its low period.
other master transmits a low loses arbitration The SCL line is held low by the device with the longest
(Figure 11-16), and turns off its data output stage. A low period. Devices with shorter low periods enter a
master which lost arbitration can generate clock pulses high wait-state, until the SCL line comes high. When the
until the end of the data byte where it lost arbitration. SCL line comes high, all devices start counting off their
When the master devices are addressing the same high periods. The first device to complete its high period
device, arbitration continues into the data. will pull the SCL line low. The SCL line high time is
determined by the device with the shortest high period,
FIGURE 11-16: MULTI-MASTER Figure 11-17.
ARBITRATION
(TWO MASTERS) FIGURE 11-17: CLOCK SYNCHRONIZATION

transmitter 1 loses arbitration

DATA 1 SDA wait start counting
state HIGH period
DATA 1

DATA 2 CLK
1

SDA counter
CLK reset
2
SCL

SCL

Masters that also incorporate the slave function, and

have lost arbitration must immediately switch over to
slave-receiver mode. This is because the winning mas-
ter-transmitter may be addressing it.
Arbitration is not allowed between:
• A repeated START condition
• A STOP condition and a data bit
• A repeated START condition and a STOP condi-
tion
Care needs to be taken to ensure that these conditions
do not occur.

DS30444E - page 72  1997 Microchip Technology Inc.

 PIC16C9XX
11.3 SSP I 2C Operation The SSPCON register allows control of the I 2C opera-
tion. Four mode selection bits (SSPCON<3:0>) allow
The SSP module in I 2C mode fully implements all slave
one of the following I 2C modes to be selected:
functions, except general call support, and provides
interrupts on start and stop bits in hardware to facilitate • I 2C Slave mode (7-bit address)
firmware implementations of the master functions. The • I 2C Slave mode (10-bit address)
SSP module implements the standard mode specifica- • I 2C Slave mode (7-bit address), with start and
tions as well as 7-bit and 10-bit addressing. Two pins stop bit interrupts enabled
are used for data transfer. These are the RC3/SCK/SCL
• I 2C Slave mode (10-bit address), with start and
pin, which is the clock (SCL), and the RC4/SDI/SDA
stop bit interrupts enabled
pin, which is the data (SDA). The user must configure
these pins as inputs or outputs through the • I 2C Firmware controlled Master Mode, slave is
TRISC<4:3> bits. The SSP module functions are idle
enabled by setting SSP Enable bit SSPEN (SSP- Selection of any I 2C mode, with the SSPEN bit set,
CON<5>). forces the SCL and SDA pins to be open drain, pro-
vided these pins are programmed to inputs by setting
FIGURE 11-18: SSP BLOCK DIAGRAM the appropriate TRISC bits.
(I2C MODE) The SSPSTAT register gives the status of the data
transfer. This information includes detection of a START
or STOP bit, specifies if the received byte was data or
Internal address if the next byte is the completion of 10-bit
data bus
address, and if this will be a read or write data transfer.
Read Write The SSPSTAT register is read only.
The SSPBUF is the register to which transfer data is
SSPBUF reg
RC3/SCK/SCL written to or read from. The SSPSR register shifts the
data in or out of the device. In receive operations, the
shift
clock SSPBUF and SSPSR create a doubled buffered
receiver. This allows reception of the next byte to begin
SSPSR reg
before reading the last byte of received data. When the
RC4/ MSb LSb complete byte is received, it is transferred to the
SDI/
SDA
SSPBUF register and flag bit SSPIF is set. If another
Match detect Addr Match complete byte is received before the SSPBUF register
is read, a receiver overflow has occurred and bit
SSPOV (SSPCON<6>) is set and the byte in the
SSPADD reg SSPSR is lost.
The SSPADD register holds the slave address. In 10-bit
Start and Set, Reset mode, the user needs to write the high byte of the
Stop bit detect S, P bits
(SSPSTAT reg) address (1111 0 A9 A8 0). Following the high byte
address match, the low byte of the address needs to be
The SSP module has five registers for I2C operation. loaded (A7:A0).
These are the:
• SSP Control Register (SSPCON)
• SSP Status Register (SSPSTAT)
• Serial Receive/Transmit Buffer (SSPBUF)
• SSP Shift Register (SSPSR) - Not directly acces-
sible
• SSP Address Register (SSPADD)

 1997 Microchip Technology Inc. DS30444E - page 73

PIC16C9XX
11.3.1 SLAVE MODE address is compared on the falling edge of the eighth
clock (SCL) pulse. If the addresses match, and the BF
In slave mode, the SCL and SDA pins must be config- and SSPOV bits are clear, the following events occur:
ured as inputs (TRISC<4:3> set). The SSP module will
override the input state with the output data when a) The SSPSR register value is loaded into the
required (slave-transmitter). SSPBUF register.
b) The buffer full bit, BF is set.
When an address is matched or the data transfer after
an address match is received, the hardware automati- c) An ACK pulse is generated.
cally will generate the acknowledge (ACK) pulse, and d) SSP interrupt flag bit, SSPIF (PIR1<3>) is set
then load the SSPBUF register with the received value (interrupt is generated if enabled) - on the falling
currently in the SSPSR register. edge of the ninth SCL pulse.
There are certain conditions that will cause the SSP In 10-bit address mode, two address bytes need to be
module not to give this ACK pulse. These are if either received by the slave (Figure 11-10). The five Most Sig-
(or both): nificant bits (MSbs) of the first address byte specify if
this is a 10-bit address. Bit R/W (SSPSTAT<2>) must
a) The buffer full bit BF (SSPSTAT<0>) was set
specify a write so the slave device will receive the sec-
before the transfer was received.
ond address byte. For a 10-bit address the first byte
b) The overflow bit SSPOV (SSPCON<6>) was set would equal ‘1111 0 A9 A8 0’, where A9 and A8 are
before the transfer was received. the two MSbs of the address. The sequence of events
In this case, the SSPSR register value is not loaded into for a 10-bit address is as follows, with steps 7- 9 for
the SSPBUF, but bit SSPIF (PIR1<3>) is set. Table 11-3 slave-transmitter:
shows what happens when a data transfer byte is 1. Receive first (high) byte of Address (bits SSPIF,
received, given the status of bits BF and SSPOV. The BF, and bit UA (SSPSTAT<1>) are set).
shaded cells show the condition where user software
2. Update the SSPADD register with second (low)
did not properly clear the overflow condition. Flag bit BF
byte of Address (clears bit UA and releases the
is cleared by reading the SSPBUF register while bit
SCL line).
SSPOV is cleared through software.
3. Read the SSPBUF register (clears bit BF) and
The SCL clock input must have a minimum high and clear flag bit SSPIF.
low time for proper operation. The high and low times of
4. Receive second (low) byte of Address (bits
the I2C specification as well as the requirement of the
SSPIF, BF, and UA are set).
SSP module is shown in timing parameter #100 and
parameter #101. 5. Update the SSPADD register with the first (high)
byte of Address, if match releases SCL line, this
11.3.1.1 ADDRESSING will clear bit UA.
6. Read the SSPBUF register (clears bit BF) and
Once the SSP module has been enabled, it waits for a clear flag bit SSPIF.
START condition to occur. Following the START condi-
7. Receive repeated START condition.
tion, the 8-bits are shifted into the SSPSR register. All
incoming bits are sampled with the rising edge of the 8. Receive first (high) byte of Address (bits SSPIF
clock (SCL) line. The value of register SSPSR<7:1> is and BF are set).
compared to the value of the SSPADD register. The 9. Read the SSPBUF register (clears bit BF) and
clear flag bit SSPIF.

TABLE 11-3: DATA TRANSFER RECEIVED BYTE ACTIONS

Status Bits as Data

Transfer is Received Set bit SSPIF
Generate ACK (SSP Interrupt occurs
BF SSPOV SSPSR → SSPBUF Pulse if enabled)
0 0 Yes Yes Yes
1 0 No No Yes
1 1 No No Yes
0 1 No No Yes

DS30444E - page 74  1997 Microchip Technology Inc.

 PIC16C9XX
11.3.1.2 RECEPTION An SSP interrupt is generated for each data transfer
byte. Flag bit SSPIF (PIR1<3>) must be cleared in soft-
When the R/W bit of the address byte is clear and an ware. The SSPSTAT register is used to determine the
address match occurs, the R/W bit of the SSPSTAT reg- status of the byte.
ister is cleared. The received address is loaded into the
SSPBUF register.
When the address byte overflow condition exists, then
no acknowledge (ACK) pulse is given. An overflow con-
dition is defined as either bit BF (SSPSTAT<0>) is set
or bit SSPOV (SSPCON<6>) is set.

FIGURE 11-19: I 2C WAVEFORMS FOR RECEPTION (7-BIT ADDRESS)

Receiving Address R/W=0 Receiving Data ACK Receiving Data ACK

A7 A6 A5 A4 A3 A2 A1 ACK
SDA D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

SCL S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P

SSPIF (PIR1<3>) Cleared in software Bus Master

terminates
transfer
BF (SSPSTAT<0>) SSPBUF register is read

SSPOV (SSPCON<6>)
Bit SSPOV is set because the SSPBUF register is still full.
ACK is not sent.

 1997 Microchip Technology Inc. DS30444E - page 75

PIC16C9XX
11.3.1.3 TRANSMISSION An SSP interrupt is generated for each data transfer
byte. Flag bit SSPIF must be cleared in software, and
When the R/W bit of the incoming address byte is set the SSPSTAT register is used to determine the status of
and an address match occurs, the R/W bit of the the byte. Flag bit SSPIF is set on the falling edge of the
SSPSTAT register is set. The received address is ninth clock pulse.
loaded into the SSPBUF register. The ACK pulse will be
sent on the ninth bit, and pin RC3/SCK/SCL is held low. As a slave-transmitter, the ACK pulse from the mas-
The transmit data must be loaded into the SSPBUF ter-receiver is latched on the rising edge of the ninth
register, which also loads the SSPSR register. Then pin SCL input pulse. If the SDA line was high (not ACK),
RC3/SCK/SCL should be enabled by setting bit CKP then the data transfer is complete. When the ACK is
(SSPCON<4>). The master must monitor the SCL pin latched by the slave, the slave logic is reset and the
prior to asserting another clock pulse. The slave slave then monitors for another occurrence of the
devices may be holding off the master by stretching the START bit. If the SDA line was low (ACK), the transmit
clock. The eight data bits are shifted out on the falling data must be loaded into the SSPBUF register, which
edge of the SCL input. This ensures that the SDA signal also loads the SSPSR register. Then pin
is valid during the SCL high time (Figure 11-20). RC3/SCK/SCL should be enabled by setting bit CKP.

FIGURE 11-20: I 2C WAVEFORMS FOR TRANSMISSION (7-BIT ADDRESS)

Receiving Address R/W = 1 Transmitting Data ACK

SDA A7 A6 A5 A4 A3 A2 A1 ACK D7 D6 D5 D4 D3 D2 D1 D0

SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
S P
Data in SCL held low
sampled while CPU
responds to SSPIF
SSPIF (PIR1<3>) cleared in software

BF (SSPSTAT<0>)
From SSP interrupt
SSPBUF is written in software service routine

CKP (SSPCON<4>)

Set bit after writing to SSPBUF

(the SSPBUF must be written-to
before the CKP bit can be set)

DS30444E - page 76  1997 Microchip Technology Inc.

 PIC16C9XX
11.3.2 MASTER MODE 11.3.3 MULTI-MASTER MODE

Master mode of operation is supported, in firmware, In multi-master mode, the interrupt generation on the
using interrupt generation on the detection of the detection of the START and STOP conditions allows the
START and STOP conditions. The STOP (P) and determination of when the bus is free. The STOP (P)
START (S) bits are cleared from a reset or when the and START (S) bits are cleared from a reset or when
SSP module is disabled. The STOP and START bits will the SSP module is disabled. The STOP and START bits
toggle based on the start and stop conditions. Control will toggle based on the start and stop conditions. Con-
of the I 2C bus may be taken when the P bit is set, or the trol of the I 2C bus may be taken when bit P (SSP-
bus is idle with both the S and P bits clear. STAT<4>) is set, or the bus is idle with both the S and
In master mode the SCL and SDA lines are manipu- P bits clear. When the bus is busy, enabling the SSP
lated by clearing the corresponding TRISC<4:3> bit(s). Interrupt will generate the interrupt when the STOP
The output level is always low, irrespective of the condition occurs.
value(s) in PORTC<4:3>. So when transmitting data, a In multi-master operation, the SDA line must be moni-
'1' data bit must have the TRISC<4> bit set (input) and tored to see if the signal level is the expected output
a '0' data bit must have the TRISC<4> bit cleared (out- level. This check only needs to be done when a high
put). The same scenario is true for the SCL line with the level is output. If a high level is expected and a low level
TRISC<3> bit. is present, the device needs to release the SDA and
The following events will cause SSP Interrupt Flag bit, SCL lines (set TRISC<4:3>). There are two stages
SSPIF, to be set (SSP Interrupt if enabled): where this arbitration can be lost, they are:

• START condition • Address Transfer

• STOP condition • Data Transfer
• Data transfer byte transmitted/received When the slave logic is enabled, the slave continues to
receive. If arbitration was lost during the address trans-
Master mode of operation can be done with either the
fer stage, communication to the device may be in
slave mode idle (SSPM3:SSPM0 = 1011) or with the
progress. If addressed an ACK pulse will be generated.
slave active. When both master and slave modes are
If arbitration was lost during the data transfer stage, the
enabled, the software needs to differentiate the
device will need to re-transfer the data at a later time.
source(s) of the interrupt.

TABLE 11-4: REGISTERS ASSOCIATED WITH I2C OPERATION

Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other resets
Reset

0Bh, 8Bh, INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
10Bh, 18Bh

0Ch PIR1 LCDIF ADIF(1) — — SSPIF CCP1IF TMR2IF TMR1IF 00-- 0000 00-- 0000

8Ch PIE1 LCDIE ADIE(1) — — SSPIE CCP1IE TMR2IE TMR1IE 00-- 0000 00-- 0000

13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu

2 0000 0000 0000 0000

93h SSPADD Synchronous Serial Port (I C mode) Address Register

14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000

94h SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000

87h TRISC — — PORTC Data Direction Control Register --11 1111 --11 1111

Legend: I2
x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used by SSP in C mode.
Note 1: Bits ADIE and ADIF are reserved on the PIC16C923, always maintain these bits clear.

 1997 Microchip Technology Inc. DS30444E - page 77

PIC16C9XX
FIGURE 11-21: OPERATION OF THE I 2C MODULE IN IDLE_MODE, RCV_MODE OR XMIT_MODE

IDLE_MODE (7-bit):
if (Addr_match) { Set interrupt;
if (R/W = 1) { Send ACK = 0;
set XMIT_MODE;
}
else if (R/W = 0) set RCV_MODE;
}
RCV_MODE:
if ((SSPBUF=Full) OR (SSPOV = 1))
{ Set SSPOV;
Do not acknowledge;
}
else { transfer SSPSR → SSPBUF;
send ACK = 0;
}
Receive 8-bits in SSPSR;
Set interrupt;
XMIT_MODE:
While ((SSPBUF = Empty) AND (CKP=0)) Hold SCL Low;
Send byte;
Set interrupt;
if ( ACK Received = 1) { End of transmission;
Go back to IDLE_MODE;
}
else if ( ACK Received = 0) Go back to XMIT_MODE;
IDLE_MODE (10-Bit):
If (High_byte_addr_match AND (R/W = 0))
{ PRIOR_ADDR_MATCH = FALSE;
Set interrupt;
if ((SSPBUF = Full) OR ((SSPOV = 1))
{ Set SSPOV;
Do not acknowledge;
}
else { Set UA = 1;
Send ACK = 0;
While (SSPADD not updated) Hold SCL low;
Clear UA = 0;
Receive Low_addr_byte;
Set interrupt;
Set UA = 1;
If (Low_byte_addr_match)
{ PRIOR_ADDR_MATCH = TRUE;
Send ACK = 0;
while (SSPADD not updated) Hold SCL low;
Clear UA = 0;
Set RCV_MODE;
}
}
}
else if (High_byte_addr_match AND (R/W = 1)
{ if (PRIOR_ADDR_MATCH)
{ send ACK = 0;
set XMIT_MODE;
}
else PRIOR_ADDR_MATCH = FALSE;
}

DS30444E - page 78  1997 Microchip Technology Inc.

 PIC16C9XX
12.0 ANALOG-TO-DIGITAL The A/D module has three registers. These registers
are:
CONVERTER (A/D) MODULE
• A/D Result Register (ADRES)
This section applies to the PIC16C924 only.
• A/D Control Register 0 (ADCON0)
The analog-to-digital (A/D) converter module has five
• A/D Control Register 1 (ADCON1)
inputs.
The ADCON0 register, shown in Figure 12-1, controls
The A/D allows conversion of an analog input signal to
the operation of the A/D module. The ADCON1 regis-
a corresponding 8-bit digital number (refer to Applica-
ter, shown in Figure 12-2, configures the functions of
tion Note AN546 for use of A/D Converter). The output
the port pins. The port pins can be configured as ana-
of the sample and hold is the input into the converter,
log inputs (RA3 can also be a voltage reference) or as
which generates the result via successive approxima-
digital I/O.
tion. The analog reference voltage is software select-
able to either the device’s AVDD pin or the voltage level
on the RA3/AN3/VREF pin. The A/D converter has a
unique feature of being able to operate while the device
is in SLEEP mode.
To operate in sleep, the A/D conversion clock must be
derived from the A/D’s internal RC oscillator.

FIGURE 12-1: ADCON0 REGISTER (ADDRESS 1Fh)

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE — ADON R = Readable bit
bit7 bit0 W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit 7-6: ADCS1:ADCS0: A/D Conversion Clock Select bits
00 = FOSC/2
01 = FOSC/8
10 = FOSC/32
11 = FRC (clock derived from an RC oscillation)
bit 5-3: CHS2:CHS0: Analog Channel Select bits
000 = channel 0, (RA0/AN0)
001 = channel 1, (RA1/AN1)
010 = channel 2, (RA2/AN2)
011 = channel 3, (RA3/AN3)
100 = channel 4, (RA5/AN4)
bit 2: GO/DONE: A/D Conversion Status bit
If ADON = 1
1 = A/D conversion in progress (setting this bit starts the A/D conversion)
0 = A/D conversion not in progress (This bit is automatically cleared by hardware when the A/D conversion
is complete)
bit 1: Reserved: Always maintain this bit clear
bit 0: ADON: A/D On bit
1 = A/D converter module is operating
0 = A/D converter module is shutoff and consumes no operating current

 1997 Microchip Technology Inc. DS30444E - page 79

PIC16C9XX
FIGURE 12-2: ADCON1 REGISTER (ADDRESS 9Fh)

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

— — — — — PCFG2 PCFG1 PCFG0 R = Readable bit
bit7 bit0 W = Writable bit
U = Unimplemented
bit, read as ‘0’
- n = Value at POR reset
bit 7-3: Unimplemented: Read as '0'
bit 2-0: PCFG2:PCFG0: A/D Port Configuration Control bits

PCFG2:PCFG0 RA0 RA1 RA2 RA5 RA3 VREF

000 A A A A A AVDD
001 A A A A VREF RA3
010 A A A A A AVDD
011 A A A A VREF RA3
100 A A D D A AVDD
111 D D D D D —
A = Analog input
D = Digital I/O

The ADRES register contains the result of the A/D con- 3. Wait the required acquisition time.
version. When the A/D conversion is complete, the 4. Start conversion:
result is loaded into the ADRES register, the GO/DONE • Set GO/DONE bit (ADCON0)
bit (ADCON0<2>) is cleared, and A/D interrupt flag bit
5. Wait for A/D conversion to complete, by either:
ADIF is set. The block diagram of the A/D module is
shown in Figure 12-3. • Polling for the GO/DONE bit to be cleared

After the A/D module has been configured as desired, OR

the selected channel must be acquired before the con- • Waiting for the A/D interrupt
version is started. The analog input channels must 6. Read A/D Result register (ADRES), clear bit
have their corresponding TRIS bits selected as an ADIF if required.
input. To determine acquisition time, see Section 12.1.
7. For next conversion, go to step 1 or step 2 as
After this acquisition time has elapsed the A/D conver-
required. The A/D conversion time per bit is
sion can be started. The following steps should be fol-
defined as TAD. A minimum wait of 2TAD is
lowed for doing an A/D conversion:
required before next acquisition starts.
1. Configure the A/D module:
• Configure analog pins / voltage reference /
and digital I/O (ADCON1)
• Select A/D input channel (ADCON0)
• Select A/D conversion clock (ADCON0)
• Turn on A/D module (ADCON0)
2. Configure A/D interrupt (if desired):
• Clear ADIF bit
• Set ADIE bit
• Set GIE bit

DS30444E - page 80  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 12-3: A/D BLOCK DIAGRAM
CHS2:CHS0

100
RA5/AN4
VAIN
(Input voltage) 011
RA3/AN3/VREF

010
A/D RA2/AN2
Converter
001
RA1/AN1

AVDD 000
RA0/AN0
000 or
VREF 010 or
100
(Reference
voltage) 001 or
011

PCFG2:PCFG0

 1997 Microchip Technology Inc. DS30444E - page 81

PIC16C9XX
12.1 A/D Acquisition Requirements Note 1: The reference voltage (VREF) has no
For the A/D converter to meet its specified accuracy, effect on the equation, since it cancels
the charge holding capacitor (CHOLD) must be allowed itself out.
to fully charge to the input channel voltage level. The Note 2: The charge holding capacitor (CHOLD) is
analog input model is shown in Figure 12-4. The source not discharged after each conversion.
impedance (RS) and the internal sampling switch (RSS)
Note 3: The maximum recommended impedance
impedance directly affect the time required to charge
for analog sources is 10 kΩ. This is
the capacitor CHOLD. The sampling switch (RSS) imped-
required to meet the pin leakage specifi-
ance varies over the device voltage (VDD),
cation.
(Figure 12-4). The source impedance affects the offset
voltage at the analog input (due to pin leakage current). Note 4: After a conversion has completed, a
The maximum recommended impedance for ana- 2.0 TAD delay must complete before
log sources is 10 kΩ. After the analog input channel is acquisition can begin again. During this
selected (changed) this acquisition must be done time the holding capacitor is not con-
before the conversion can be started. nected to the selected A/D input channel.
To calculate the minimum acquisition time,
Equation 12-1 may be used. This equation calculates EXAMPLE 12-1: CALCULATING THE
the acquisition time to within 1/2 LSb error (512 steps MINIMUM REQUIRED
for the A/D). The 1/2 LSb error is the maximum error SAMPLE TIME
allowed for the A/D to meet its specified accuracy. TACQ = Amplifier Settling Time +
Holding Capacitor Charging Time +
EQUATION 12-1: A/D MINIMUM CHARGING
TIME Temperature Coefficient

VHOLD = (VREF - (VREF/512)) • (1 - e(-Tc/CHOLD(RIC + RSS + RS))) TACQ = 5 µs + Tc + [(Temp - 25°C)(0.05 µs/°C)]
Given: VHOLD = (VREF/512), for 1/2 LSb resolution TC = -CHOLD (RIC + RSS + RS) ln(1/511)
The above equation reduces to: -51.2 pF (1 kΩ + 7 kΩ + 10 kΩ) ln(0.0020)
TC = -(51.2 pF)(1 kΩ - RSS + RS) ln(1/511) -51.2 pF (18 kΩ) ln(0.0020)
Example 12-1 shows the calculation of the minimum -0.921 µs (-6.2364)
required acquisition time (TACQ). This calculation is 5.747 µs
based on the following system assumptions.
TACQ = 5 µs + 5.747 µs + [(50°C - 25°C)(0.05 µs/°C)]
CHOLD = 51.2 pF
10.747 µs + 1.25 µs
Rs = 10 kΩ
11.997 µs
1/2 LSb error
VDD = 5V → Rss = 7 kΩ
Temp (system max.) = 50°C
VHOLD = 0 @ t = 0
FIGURE 12-4: ANALOG INPUT MODEL
VDD
Sampling
Switch
VT = 0.6V
Rs RAx RIC ≤ 1k SS RSS

CHOLD
VA CPIN I leakage = DAC capacitance
5 pF VT = 0.6V ± 500 nA = 51.2 pF

VSS

Legend CPIN = input capacitance

6V
VT = threshold voltage 5V
I leakage = leakage current at the pin due to VDD 4V
various junctions 3V
RIC = interconnect resistance 2V
SS = sampling switch
CHOLD = sample/hold capacitance (from DAC) 5 6 7 8 9 10 11
Sampling Switch
( kΩ )

DS30444E - page 82  1997 Microchip Technology Inc.

 PIC16C9XX
12.2 Selecting the A/D Conversion Clock 12.3 Configuring Analog Port Pins
The A/D conversion time per bit is defined as TAD. The The ADCON1 and TRISA registers control the opera-
A/D conversion requires 9.5 TAD per 8-bit conversion. tion of the A/D port pins. The port pins that are desired
The source of the A/D conversion clock is software as analog inputs must have their corresponding TRIS
selected. The four possible options for TAD are: bits set (input). If the TRIS bit is cleared (output), the
• 2TOSC digital output level (VOH or VOL) will be converted.
• 8TOSC The A/D operation is independent of the state of the
• 32TOSC CHS2:CHS0 bits and the TRIS bits.
• Internal RC oscillator Note 1: When reading the port register, all pins
For correct A/D conversions, the A/D conversion clock configured as analog inputs will read as
(TAD) must be selected to ensure a minimum TAD time cleared (a low level). Pins configured as
of 1.6 µs. digital inputs, will convert an analog input.
Analog levels on a digitally configured
Table 12-1 shows the resultant TAD times derived from input will not affect the conversion accu-
the device operating frequencies and the A/D clock racy.
source selected.
Note 2: Analog levels on any pin that is defined as
a digital input (including the AN4:AN0
pins), may cause the input buffer to con-
sume current that is out of the devices
specification.

TABLE 12-1: TAD vs. DEVICE OPERATING FREQUENCIES

A/D Clock Source (TAD) Device Frequency

Operation ADCS1:ADCS0 8 MHz 5 MHz 1.25 MHz 333.33 kHz
2TOSC 00 250 ns(2) 400 ns(2) 1.6 µs 6 µs
8TOSC 01 1 µs 1.6 µs 6.4 µs 24 µs(3)
32TOSC 10 4 µs 6.4 µs 25.6 µs(3) 96 µs(3)
RC 11 2-6 µs(1,4) 2-6µs(1,4) µs(1,4)
2-6 2 - 6 µs(1)
Legend: Shaded cells are outside of recommended range.
Note 1: The RC source has a typical TAD time of 4 µs.
2: These values violate the minimum required TAD time.
3: For faster conversion times, the selection of another clock source is recommended.
4: When derived frequency is greater than 1 MHz, the RC A/D conversion clock source is recommended for
sleep mode only
5: For extended voltage devices (LC), please refer to the electrical specifications section.

 1997 Microchip Technology Inc. DS30444E - page 83

PIC16C9XX
12.4 A/D Conversions Clearing the GO/DONE bit during a conversion will
abort the current conversion. The ADRES register will
Example 12-2 show how to perform an A/D conversion.
NOT be updated with the partially completed A/D con-
The RA pins are configured as analog inputs. The ana-
version sample. That is, the ADRES register will con-
log reference (VREF) is the device VDD. The A/D inter-
tinue to contain the value of the last completed
rupt is enabled, and the A/D conversion clock is FRC.
conversion (or the last value written to the ADRES reg-
The conversion is performed on the RA0 pin
ister). After the A/D conversion is aborted, a 2TAD wait
(channel0).
is required before the next acquisition is started. After
Note: The GO/DONE bit should NOT be set in this 2TAD wait, an acquisition is automatically started on
the same instruction that turns on the A/D. the selected channel.

EXAMPLE 12-2: DOING AN A/D CONVERSION

BCF STATUS, RP1 ; Select Bank1
BSF STATUS, RP0 ;
CLRF ADCON1 ; Configure A/D inputs
BSF PIE1, ADIE ; Enable A/D interrupts
BCF STATUS, RP0 ; Select Bank0
MOVLW 0xC1 ; RC Clock, A/D is on, Channel 0 is selected
MOVWF ADCON0 ;
BCF PIR1, ADIF ; Clear A/D interrupt flag bit
BSF INTCON, PEIE ; Enable peripheral interrupts
BSF INTCON, GIE ; Enable all interrupts
;
; Ensure that the required acquisition time for the selected input channel has elapsed.
; Then the conversion may be started.
;
BSF ADCON0, GO ; Start A/D Conversion
: ; The ADIF bit will be set and the GO/DONE bit
: ; is cleared upon completion of the A/D Conversion.

DS30444E - page 84  1997 Microchip Technology Inc.

 PIC16C9XX
12.4.1 FASTER CONVERSION - LOWER Since the TAD is based from the device oscillator, the
RESOLUTION TRADE-OFF user must use some method (a timer, software loop,
etc.) to determine when the A/D oscillator may be
Not all applications require a result with 8-bits of reso- changed. Example 12-3 shows a comparison of time
lution, but may instead require a faster conversion time. required for a conversion with 4-bits of resolution, ver-
The A/D module allows users to make the trade-off of sus the 8-bit resolution conversion. The example is for
conversion speed to resolution. Regardless of the res- devices operating at 8 MHz (The A/D clock is pro-
olution required, the acquisition time is the same. To grammed for 32TOSC), and assumes that immediately
speed up the conversion, the clock source of the A/D after 6TAD, the A/D clock is programmed for 2TOSC.
module may be switched so that the TAD time violates
the minimum specified time (see the applicable electri- The 2TOSC violates the minimum TAD time, therefore
cal specification). Once the TAD time violates the mini- the last 4-bits will not be converted to correct values.
mum specified time, all the following A/D result bits are
not valid (see A/D Conversion Timing in the Electrical
Specifications section.) The clock sources may only be
switched between the three oscillator versions (cannot
be switched from/to RC). The equation to determine
the time before the oscillator can be switched is as fol-
lows:
Conversion time = 2TAD + N • TAD + (8 - N)(2TOSC)
Where: N = number of bits of resolution required.

EXAMPLE 12-3: 4-BIT vs. 8-BIT CONVERSION TIMES

Resolution
Freq. (MHz)
4-bit 8-bit

TAD 8 1.6 µs 1.6 µs

TOSC 8 12.5 ns 125 ns
2TAD + N • TAD + (8 - N)(2TOSC) 8 10.6 µs 16 µs

 1997 Microchip Technology Inc. DS30444E - page 85

PIC16C9XX
12.5 A/D Operation During Sleep scale error is that full scale does not take offset error
into account. Gain error can be calibrated out in soft-
The A/D module can operate during SLEEP mode. This
ware.
requires that the A/D clock source be set to RC
(ADCS1:ADCS0 = 11). When the RC clock source is Linearity error refers to the uniformity of the code
selected, the A/D module waits one instruction cycle changes. Linearity errors cannot be calibrated out of
before starting the conversion. This allows the SLEEP the system. Integral non-linearity error measures the
instruction to be executed, which eliminates all digital actual code transition versus the ideal code transition
switching noise from the conversion. When the conver- adjusted by the gain error for each code.
sion is completed the GO/DONE bit will be cleared, and Differential non-linearity measures the maximum actual
the result loaded into the ADRES register. If the A/D code width versus the ideal code width. This measure
interrupt is enabled, the device will wake-up from is unadjusted.
SLEEP. If the A/D interrupt is not enabled, the A/D mod-
ule will then be turned off, although the ADON bit will The maximum pin leakage current is ± 1 µA.
remain set. In systems where the device frequency is low, use of
When the A/D clock source is another clock option (not the A/D RC clock is preferred. At moderate to high fre-
RC), a SLEEP instruction will cause the present conver- quencies, TAD should be derived from the device oscil-
sion to be aborted and the A/D module to be turned off, lator. TAD must not violate the minimum and should be
though the ADON bit will remain set. ≤ 8 µs for preferred operation. This is because TAD,
when derived from TOSC, is kept away from on-chip
Turning off the A/D places the A/D module in its lowest phase clock transitions. This reduces, to a large extent,
current consumption state. the effects of digital switching noise. This is not possible
Note: For the A/D module to operate in SLEEP, with the RC derived clock. The loss of accuracy due to
the A/D clock source must be set to RC digital switching noise can be significant if many I/O
(ADCS1:ADCS0 = 11). To perform an A/D pins are active.
conversion in SLEEP, ensure the SLEEP In systems where the device will enter SLEEP mode
instruction immediately follows the instruc- after the start of the A/D conversion, the RC clock
tion that sets the GO/DONE bit. source selection is required. In this mode, the digital
noise from the modules in SLEEP are stopped. This
12.6 A/D Accuracy/Error method gives high accuracy.
The absolute accuracy specified for the A/D converter
includes the sum of all contributions for quantization 12.7 Effects of a RESET
error, integral error, differential error, full scale error, off- A device reset forces all registers to their reset state.
set error, and monotonicity. It is defined as the maxi- This forces the A/D module to be turned off, and any
mum deviation from an actual transition versus an ideal conversion is aborted.
transition for any code. The absolute error of the A/D
The value that is in the ADRES register is not modified
converter is specified at < ±1 LSb for VDD = VREF (over
for a Power-on Reset. The ADRES register will contain
the device’s specified operating range). However, the
unknown data after a Power-on Reset.
accuracy of the A/D converter will degrade as VDD
diverges from VREF.
For a given range of analog inputs, the output digital
code will be the same. This is due to the quantization of
the analog input to a digital code. Quantization error is
typically ± 1/2 LSb and is inherent in the analog to dig-
ital conversion process. The only way to reduce quanti-
zation error is to increase the resolution of the A/D
converter.
Offset error measures the first actual transition of a
code versus the first ideal transition of a code. Offset
error shifts the entire transfer function. Offset error can
be calibrated out of a system or introduced into a sys-
tem through the interaction of the total leakage current
and source impedance at the analog input.
Gain error measures the maximum deviation of the last
actual transition and the last ideal transition adjusted for
offset error. This error appears as a change in slope of
the transfer function. The difference in gain error to full

DS30444E - page 86  1997 Microchip Technology Inc.

 PIC16C9XX
12.8 Use of the CCP Trigger 12.10 Transfer Function
An A/D conversion can be started by the “special event The ideal transfer function of the A/D converter is as fol-
trigger” of the CCP1 module. This requires that the lows: the first transition occurs when the analog input
CCP1M3:CCP1M0 bits (CCP1CON<3:0>) be pro- voltage (VAIN) is Analog VREF / 256 (Figure 12-5).
grammed as 1011 and that the A/D module is enabled
(ADON bit is set). When the trigger occurs, the FIGURE 12-5: A/D TRANSFER FUNCTION
GO/DONE bit will be set, starting the A/D conversion,
and the Timer1 counter will be reset to zero. Timer1 is
reset to automatically repeat the A/D acquisition period
with minimal software overhead (moving the ADRES to
the desired location). The appropriate analog input FFh

Digital code output

channel must be selected and the minimum acquisition FEh
done before the “special event trigger” sets the
GO/DONE bit (starts a conversion).
If the A/D module is not enabled (ADON is cleared),
then the “special event trigger” will be ignored by the 04h
A/D module, but will still reset the Timer1 counter. 03h

12.9 Connection Considerations 02h

01h
If the input voltage exceeds the rail values (VSS or VDD) 00h
by greater than 0.2V, then the accuracy of the conver-

(full scale)
255 LSb
256 LSb
0.5 LSb
1 LSb
2 LSb
3 LSb
4 LSb
sion is out of specification.
An external RC filter is sometimes added for anti-alias-
ing of the input signal. The R component should be
Analog input voltage
selected to ensure that the total source impedance is
kept under the 10 kΩ recommended specification. Any
external components connected (via hi-impedance) to
an analog input pin (capacitor, zener diode, etc.) should
have very little leakage current at the pin.

 1997 Microchip Technology Inc. DS30444E - page 87

PIC16C9XX
FIGURE 12-6: FLOWCHART OF A/D OPERATION
ADON = 0

Yes
ADON = 0?

No

Acquire
Selected Channel

Yes
GO = 0?

No

A/D Clock
Yes Start of A/D SLEEP Yes Finish Conversion
Conversion Delayed Instruction? GO = 0
= RC? 1 Instruction Cycle ADIF = 1

No No

Yes Abort Conversion Finish Conversion Wake-up Yes

Device in GO = 0 From Sleep? Wait 2 TAD
SLEEP? ADIF = 0 GO = 0
ADIF = 1

No No

Finish Conversion SLEEP Stay in Sleep

Power-down A/D Wait 2 TAD Power-down A/D
GO = 0
ADIF = 1

Wait 2 TAD

TABLE 12-2: SUMMARY OF A/D REGISTERS

Value on
Value on all
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on
other Resets
Reset

0Bh, 8Bh, INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
10Bh, 18Bh
0Ch PIR1 LCDIF ADIF — — SSPIF CCP1IF TMR2IF TMR1IF 00-- 0000 00-- 0000

8Ch PIE1 LCDIE ADIE — — SSPIE CCP1IE TMR2IE TMR1IE 00-- 0000 00-- 0000

1Eh ADRES A/D Result Register xxxx xxxx uuuu uuuu

1Fh ADCON0 ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE (1) 0000 0000 0000 0000
ADON
9Fh ADCON1 — — — — — PCFG2 PCFG1 PCFG0 ---- -000 ---- -000

05h PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 --0x 0000 --0u 0000

85h TRISA — — PORTA Data Direction Control Register --11 1111 --11 1111
Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used for A/D conversion.
Note 1: Bit1 of ADCON0 is reserved, always maintain this bit clear.

DS30444E - page 88  1997 Microchip Technology Inc.

 PIC16C9XX
13.0 LCD MODULE Once the module is initialized for the LCD panel, the
individual bits of the LCD data registers are cleared/set
The LCD module generates the timing control to drive to represent a clear/dark pixel respectively.
a static or multiplexed LCD panel, with support for up to
32 segments multiplexed with up to 4 commons. It also Once the module is configured, the LCDEN
provides control of the LCD pixel data. (LCDCON<7>) bit is used to enable or disable the LCD
module. The LCD panel can also operate during sleep
The interface to the module consists of 3 control regis- by clearing the SLPEN (LCDCON<6>) bit.
ters (LCDCON, LCDSE, and LCDPS) used to define
the timing requirements of the LCD panel and up to 16 Figure 13-4 through Figure 13-7 provides waveforms
LCD data registers (LCD00-LCD15) that represent the for Static, 1/2, 1/3, and 1/4 MUX drives.
array of the pixel data. In normal operation, the control
registers are configured to match the LCD panel being
used. Primarily, the initialization information consists of
selecting the number of commons required by the LCD
panel, and then specifying the LCD Frame clock rate to
be used by the panel.

FIGURE 13-1: LCDCON REGISTER (ADDRESS 10Fh)

R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

LCDEN SLPEN — VGEN CS1 CS0 LMUX1 LMUX0 R =Readable bit
bit7 bit0 W =Writable bit
U =Unimplemented bit,
Read as ‘0’
-n =Value at POR reset
bit 7: LCDEN: Module drive enable bit
1 = LCD drive enabled
0 = LCD drive disabled
bit 6: SLPEN: LCD display sleep enable
1 = LCD module will stop operating during SLEEP
0 = LCD module will continue to display during SLEEP
bit 5: Unimplemented: Read as '0'
bit 4: VGEN: Voltage Generator Enable
1 = Internal LCD Voltage Generator Enabled, (powered-up)
0 = Internal LCD Voltage Generator powered-down, voltage is expected to be provided externally
bit 3-2: CS1:CS0: Clock Source Select bits
00 = Fosc/256
01 = T1CKI (Timer1)
1x = Internal RC oscillator
bit 1-0: LMUX1:LMUX0: Common Selection bits
Specifies the number of commons and the bias method
LMUX1:LMUX0 MULTIPLEX BIAS Max # of Segments
00 Static (COM0) Static 32
01 1/2 (COM0, 1) 1/3 31
10 1/3 (COM0, 1, 2) 1/3 30
11 1/4 (COM0, 1, 2, 3) 1/3 29

 1997 Microchip Technology Inc. DS30444E - page 89

PIC16C9XX
FIGURE 13-2: LCD MODULE BLOCK DIAGRAM

128
LCD
to SEG<31:0>
Data Bus RAM
32 x 4 32 TO I/O PADS

MUX

Timing Control

LCDCON
COM3:COM0
LCDPS TO I/O PADS

LCDSE

Internal RC osc Clock

Source
T1CKI Select
and
Fosc/4
Divide

FIGURE 13-3: LCDPS REGISTER (ADDRESS 10Eh)

U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — — LP3 LP2 LP1 LP0 R =Readable bit
bit7 bit0 W =Writable bit
U =Unimplemented bit, Read as ‘0’
-n =Value at POR reset
bit 7-4: Unimplemented, read as '0'
bit 3-0: LP3:LP0: Frame Clock Prescale Selection bits

LMUX1:LMUX0 Multiplex Frame Frequency =

00 Static Clock source / (128 * (LP3:LP0 + 1))
01 1/2 Clock source / (128 * (LP3:LP0 + 1))
10 1/3 Clock source / (96 * (LP3:LP0 + 1))
11 1/4 Clock source / (128 * (LP3:LP0 + 1))

DS30444E - page 90  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 13-4: WAVEFORMS IN STATIC DRIVE

V1
COM0
V0
COM0
V1
SEG0
V0

V1
SEG1
V0

V1

COM0-SEG0 V0

-V1

COM0-SEG1 V0
1 Frame
SEG1
SEG2
SEG7

SEG5
SEG4

SEG0
SEG6

SEG3

 1997 Microchip Technology Inc. DS30444E - page 91

PIC16C9XX
FIGURE 13-5: WAVEFORMS IN 1/2 MUX, 1/3 BIAS DRIVE
V3

V2
COM0
V1
COM1
V0

V3
COM0
V2
COM1
V1

V0

V3

V2
SEG0
V1

V0

V3
SEG0
SEG1

SEG2

SEG3

V2
SEG1
V1

V0

V3

V2

V1

COM0-SEG0 V0

-V1

-V2

-V3

V3

V2

V1

COM0-SEG1 V0

-V1

-V2
1 Frame
-V3

DS30444E - page 92  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 13-6: WAVEFORMS IN 1/3 MUX, 1/3 BIAS

V3

V2
COM0
V1

V0

COM2 V3

V2
COM1
V1
COM1
V0
COM0
V3

V2
COM2
V1

V0

V3

V2
SEG0
V1

V0
SEG2

SEG1

SEG0

V3

V2
SEG1
V1

V0

V3

V2

V1

COM0-SEG0 V0

-V1

-V2

-V3

V3

V2

V1

COM0-SEG1 V0

-V1

-V2

-V3

1 Frame

 1997 Microchip Technology Inc. DS30444E - page 93

PIC16C9XX
FIGURE 13-7: WAVEFORMS IN 1/4 MUX, 1/3 BIAS

COM3
V3
V2
COM2 COM0 V1
V0

V3
COM1 COM1
V2
V1
COM0 V0

V3
V2
COM2 V1
V0

V3
V2
COM3 V1
V0

V3
V2
SEG0 V1
V0
SEG1

SEG0

V3
V2
SEG1 V1
V0

V3
V2
V1
COM0-SEG0 V0
-V1
-V2
-V3

V3
V2
V1
COM0-SEG1 V0
-V1
-V2
-V3
1 Frame

DS30444E - page 94  1997 Microchip Technology Inc.

 PIC16C9XX
13.1 LCD Timing The second source is the Timer1 external oscillator.
This oscillator provides a lower speed clock which may
The LCD module has 3 possible clock source inputs be used to continue running the LCD while the proces-
and supports static, 1/2, 1/3, and 1/4 multiplexing. sor is in sleep. It is assumed that the frequency pro-
vided on this oscillator will be 32 kHz. To use the
13.1.1 TIMING CLOCK SOURCE SELECTION
Timer1 oscillator as a LCD module clock source, it is
The clock sources for the LCD timing generation are: only necessary to set the T1OSCEN (T1CON<3>) bit.

• Internal RC oscillator The third source is the system clock divided by 256.
This divider ratio is chosen to provide about 32 kHz
• Timer1 oscillator
output when the external oscillator is 8 MHz. The
• System clock divided by 256 divider is not programmable. Instead the LCDPS regis-
The first timing source is an internal RC oscillator which ter is used to set the LCD frame clock rate.
runs at a nominal frequency of 14 kHz. This oscillator All of the clock sources are selected with bits CS1:CS0
provides a lower speed clock which may be used to (LCDCON<3:2>). Refer to Figure 13-1 for details of the
continue running the LCD while the processor is in register programming.
sleep. The RC oscillator will power-down when it is not
selected or when the LCD module is disabled.

FIGURE 13-8: LCD CLOCK GENERATION

COM0

COM1

COM2

COM3
FOSC ÷256

TMR1 32 kHz
crystal oscillator ÷4 Static
4-bit Programmable ÷32 ÷1,2,3,4
÷2 1/2 Prescaler Ring Counter

Internal RC oscillator 1/3

Nominal FRC = 14 kHz 1/4
LCDPS<3:0>
LMUX1:LMUX0

CS1:CS0 LMUX1:LMUX0

internal
data bus

 1997 Microchip Technology Inc. DS30444E - page 95

PIC16C9XX
13.1.2 MULTIPLEX TIMING GENERATION TABLE 13-2: APPROX. FRAME FREQ IN Hz
USING TIMER1 @ 32.768 kHz OR
The timing generation circuitry will generate 1 to 4 com-
Fosc @ 8 MHz
mon clocks based on the display mode selected. The
mode is specified by bits LMUX1:LMUX0 LP3:LP0 Static 1/2 1/3 1/4
(LCDCON<1:0>). Table 13-1 shows the formulas for
calculating the frame frequency. 2 85 85 114 85
3 64 64 85 64
TABLE 13-1: FRAME FREQUENCY
FORMULAS 4 51 51 68 51
5 43 43 57 43
Multiplex Frame Frequency =
6 37 37 49 37
Static Clock source / (128 * (LP3:LP0 + 1))
7 32 32 43 32
1/2 Clock source / (128 * (LP3:LP0 + 1))
1/3 Clock source / (96 * (LP3:LP0 + 1))
TABLE 13-3: APPROX. FRAME FREQ IN Hz
1/4 Clock source / (128 * (LP3:LP0 + 1)) USING INTERNAL RC OSC @
14 kHz

LP3:LP0 Static 1/2 1/3 1/4

0 109 109 146 109

1 55 55 73 55
2 36 36 49 36
3 27 27 36 27

DS30444E - page 96  1997 Microchip Technology Inc.

 PIC16C9XX
13.2 LCD Interrupts A new frame is defined to begin at the leading edge of
the COM0 common signal. The interrupt will be set
The LCD timing generation provides an interrupt that immediately after the LCD controller completes
defines the LCD frame timing. This interrupt can be accessing all pixel data required for a frame. This will
used to coordinate the writing of the pixel data with the occur at a certain fixed time before the frame boundary
start of a new frame. Writing pixel data at the frame as shown in Figure 13-9. The LCD controller will begin
boundary allows a visually crisp transition of the image. to access data for the next frame within TFWR after the
This interrupt can also be used to synchronize external interrupt.
events to the LCD. For example, the interface to an
external segment driver, such as a Microchip AY0438,
can be synchronized for segment data update to the
LCD frame.

FIGURE 13-9: EXAMPLE WAVEFORMS IN 1/4 MUX DRIVE

LCD Controller accesses

Interrupt next frame data
occurs
V3
COM0 V2
V1
V0

V3
COM1 V2
V1
V0

V3
COM2 V2
V1
V0

V3
COM3 V2
V1
V0
1 Frame

TFINT
Frame Frame
Boundary TFWR Boundary
TFWR = TFRAME/(LMUX1:LMUX0 + 1)
TFINT = (TFWR /2 - (2TCY + 40 ns)) → min.
(TFWR /2 - (1TCY + 40 ns)) → max.

 1997 Microchip Technology Inc. DS30444E - page 97

PIC16C9XX
13.3 Pixel Control Table 13-4 shows the correlation of each bit in the
LCDD registers to the respective common and seg-
13.3.1 LCDD (PIXEL DATA) REGISTERS ment signals.
The pixel registers contain bits which define the state of Any LCD pixel location not being used for display can
each pixel. Each bit defines one unique pixel. be used as general purpose RAM.

FIGURE 13-10:GENERIC LCDD REGISTER LAYOUT

R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x

SEGs SEGs SEGs SEGs SEGs SEGs SEGs SEGs R =Readable bit
COMc COMc COMc COMc COMc COMc COMc COMc W =Writable bit
bit7 bit0 U =Unimplemented bit,
Read as ‘0’
-n =Value at POR reset
bit 7-0: SEGsCOMc: Pixel Data Bit for segment s and common c
1 = Pixel on (dark)
0 = Pixel off (clear)

DS30444E - page 98  1997 Microchip Technology Inc.

 PIC16C9XX
13.4 Operation During Sleep The LCD interrupt can be used to determine the frame
boundary. See Section 13.2 for the formulas to calcu-
The LCD module can operate during sleep. The selec- late the delay.
tion is controlled by bit SLPEN (LCDCON<6>). Setting
If a SLEEP instruction is executed and SLPEN = '0', the
the SLPEN bit allows the LCD module to go to sleep.
module will continue to display the current contents of
Clearing the SLPEN bit allows the module to continue
the LCDD registers. To allow the module to continue
to operate during sleep.
operation while in sleep, the clock source must be
If a SLEEP instruction is executed and SLPEN = '1', the either the internal RC oscillator or Timer1 external
LCD module will cease all functions and go into a very oscillator. While in sleep, the LCD data cannot be
low current consumption mode. The module will stop changed. The LCD module current consumption will
operation immediately and drive the minimum LCD not decrease in this mode, however the overall con-
voltage on both segment and common lines. Figure sumption of the device will be lower due to shutdown of
13-11 shows this operation. To ensure that the LCD the core and other peripheral functions.
completes the frame, the SLEEP instruction should be
executed immediately after a LCD frame boundary. Note: The internal RC oscillator or external
Timer1 oscillator must be used to operate
the LCD module during sleep.

FIGURE 13-11:SLEEP ENTRY/EXIT WHEN SLPEN = 1 OR CS1:CS0 = 00

3/3V

Pin 2/3V
COM0
1/3V

0/3V

3/3V

Pin 2/3V
COM1
1/3V

0/3V

3/3V

Pin 2/3V
COM3
1/3V

0/3V

3/3V

Pin 2/3V
SEG0
1/3V

0/3V

interrupted
frame

SLEEP instruction execution Wake-up

 1997 Microchip Technology Inc. DS30444E - page 99

PIC16C9XX
13.4.1 SEGMENT ENABLES EXAMPLE 13-1: STATIC MUX WITH 32
SEGMENTS
The LCDSE register is used to select the pin function
for groups of pins. The selection allows each group of BCF STATUS,RP0 ;Select Bank 2
pins to operate as either LCD drivers or digital only BSF STATUS,RP1 ;
pins. To configure the pins as a digital port, the corre- BCF LCDCON,LMUX1 ;Select Static MUX
sponding bits in the LCDSE register must be cleared. BCF LCDCON,LMUX0 ;
MOVLW 0xFF ;Make PortD,E,F,G
If the pin is a digital I/O the corresponding TRIS bit con- MOVWF LCDSE ;LCD pins
trols the data direction. Any bit set in the LCDSE regis- . . . ;configure rest of LCD
ter overrides any bit settings in the corresponding TRIS
register. EXAMPLE 13-2: 1/3 MUX WITH 13
Note 1: On a Power-on Reset these pins are con- SEGMENTS
figured as LCD drivers. BCF STATUS,RP0 ;Select Bank 2
Note 2: The LMUX1:LMUX0 takes precedence BSF STATUS,RP1 ;
over the LCDSE bit settings for pins RD7, BSF LCDCON,LMUX1 ;Select 1/3 MUX
BCF LCDCON,LMUX0 ;
RD6 and RD5.
MOVLW 0x87 ;Make PORTD<7:0> &
MOVWF LCDSE ;PORTE<6:0> LCD pins
. . . ;configure rest of LCD

FIGURE 13-12:LCDSE REGISTER (ADDRESS 10Dh)

R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

SE29 SE27 SE20 SE16 SE12 SE9 SE5 SE0 R =Readable bit
bit7 bit0 W =Writable bit
U =Unimplemented bit,
Read as ‘0’
-n =Value at POR reset
bit 7: SE29: Pin function select RD7/COM1/SEG31 - RD5/COM3/SEG29
1 = pins have LCD drive function
0 = pins have digital Input function
The LMUX1:LMUX0 setting takes precedence over the LCDSE register.
bit 6: SE27: Pin function select RG7/SEG28 and RE7/SEG27
1 = pins have LCD drive function
0 = pins have digital Input function
bit 5: SE20: Pin function select RG6/SEG26 - RG0/SEG20
1 = pins have LCD drive function
0 = pins have digital Input function
bit 4: SE16: Pin function select RF7/SEG19 - RF4/SEG16
1 = pins have LCD drive function
0 = pins have digital Input function
bit 3: SE12: Pin function select RF3/SEG15 - RF0/SEG12
1 = pins have LCD drive function
0 = pins have digital Input function
bit 2: SE9: Pin function select RE6/SEG11 - RE4/SEG09
1 = pins have LCD drive function
0 = pins have digital Input function
bit 1: SE5: Pin function select RE3/SEG08 - RE0/SEG05
1 = pins have LCD drive function
0 = pins have digital Input function
bit 0: SE0: Pin function select RD4/SEG04 - RD0/SEG00
1 = pins have LCD drive function
0 = pins have digital I/O function

DS30444E - page 100  1997 Microchip Technology Inc.

 PIC16C9XX
13.5 Voltage Generation 2*VLCD1 and VLCD3 = 3 * VLCD1. When the charge pump
is not operating, Vlcd3 will be internally tied to VDD. See
There are two methods for LCD voltage generation, the Electrical Specifications section for charge pump
internal charge pump, or external resistor ladder. capacitor and potentiometer values.
13.5.1 CHARGE PUMP 13.5.2 EXTERNAL R-LADDER
The LCD charge pump is shown in Figure 13-13. The The LCD module can also use an external resistor lad-
1.0V - 2.3V regulator will establish a stable base volt- der (R-Ladder) to generate the LCD voltages.
age from the varying battery voltage. This regulator is Figure 13-13 shows external connections for static and
adjustable through the range by connecting a variable 1/3 bias. The VGEN (LCDCON<4>) bit must be cleared
external resistor from VLCDADJ to ground. The poten- to use an external R-Ladder.
tiometer provides contrast adjustment for the LCD. This
base voltage is connected to VLCD1 on the charge
pump. The charge pump boosts VLCD1 into VLCD2 =
FIGURE 13-13:CHARGE PUMP AND RESISTOR LADDER

VDD

10 µA
nominal

LCDEN
Charge Pump
SLPEN

VLCDADJ VLCD3 VLCD2 VLCD1 C1 C2

100k* 0.47 µF* 0.47 µF* 0.47 µF* Connections for

130k* internal charge
0.47 µF* pump, VGEN = 1

Connections for
external R-ladder,
1/3 Bias,
10k* 10k* 10k* 5k* VGEN = 0
VDD

Connections for
external R-ladder,
10k* Static Bias,
VDD 5k* VGEN = 0

* These values are provided for design guidance only and should be
optimized to the application by the designer.

 1997 Microchip Technology Inc. DS30444E - page 101

PIC16C9XX
13.6 Configuring the LCD Module - Timing source, bits CS1:CS0
- Voltage generation, bit VGEN
The following is the sequence of steps to follow to con-
- Sleep mode, bit SLPEN
figure the LCD module.
4. Write initial values to pixel data registers,
1. Select the frame clock prescale using bits LCDD00 through LCDD15.
LP3:LP0 (LCDPS<3:0>).
5. Clear LCD interrupt flag, LCDIF (PIR1<7>), and
2. Configure the appropriate pins to function as if desired, enable the interrupt by setting bit
segment drivers using the LCDSE register. LCDIE (PIE1<7>).
3. Configure the LCD module for the following 6. Enable the LCD module, by setting bit LCDEN
using the LCDCON register. (LCDCON<7>).
- Multiplex mode and Bias, bits
LMUX1:LMUX0
TABLE 13-4: SUMMARY OF REGISTERS ASSOCIATED WITH THE LCD MODULE

Value on Value on
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-on all other
Reset Resets
0Bh, 8Bh,
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
10Bh, 18Bh
(1)
0Ch PIR1 LCDIF ADIF — — SSPIF CCP1IF TMR2IF TMR1IF 00-- 0000 00-- 0000
8Ch PIE1 LCDIE ADIE(1) — — SSPIE CCP1IE TMR2IE TMR1IE 00-- 0000 00-- 0000
10h T1CON — — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu
10Dh LCDSE SE29 SE27 SE20 SE16 SE12 SE9 SE5 SE0 1111 1111 1111 1111
10Eh LCDPS — — — — LP3 LP2 LP1 LP0 ---- 0000 ---- 0000
10Fh LCDCON LCDEN SLPEN — VGEN CS1 CS0 LMUX1 LMUX0 00-0 0000 00-0 0000
SEG07 SEG06 SEG05 SEG04 SEG03 SEG02 SEG01 SEG00
110h LCDD00 xxxx xxxx uuuu uuuu
COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0
SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG09 SEG08
111h LCDD01 xxxx xxxx uuuu uuuu
COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0
SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16
112h LCDD02 xxxx xxxx uuuu uuuu
COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0
SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24
113h LCDD03 xxxx xxxx uuuu uuuu
COM0 COM0 COM0 COM0 COM0 COM0 COM0 COM0
SEG07 SEG06 SEG05 SEG04 SEG03 SEG02 SEG01 SEG00
114h LCDD04 xxxx xxxx uuuu uuuu
COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1
SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG09 SEG08
115h LCDD05 xxxx xxxx uuuu uuuu
COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1
SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16
116h LCDD06 xxxx xxxx uuuu uuuu
COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1
SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24
117h LCDD07 xxxx xxxx uuuu uuuu
COM1(2) COM1 COM1 COM1 COM1 COM1 COM1 COM1
SEG07 SEG06 SEG05 SEG04 SEG03 SEG02 SEG01 SEG00
118h LCDD08 xxxx xxxx uuuu uuuu
COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2
SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG09 SEG08
119h LCDD09 xxxx xxxx uuuu uuuu
COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2
SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16
11Ah LCDD10 xxxx xxxx uuuu uuuu
COM2 COM2 COM2 COM2 COM2 COM2 COM2 COM2
SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24
11Bh LCDD11 xxxx xxxx uuuu uuuu
COM2(2) COM2(2) COM2 COM2 COM2 COM2 COM2 COM2
SEG07 SEG06 SEG05 SEG04 SEG03 SEG02 SEG01 SEG00
11Ch LCDD12 xxxx xxxx uuuu uuuu
COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3
SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG09 SEG08
11Dh LCDD13 xxxx xxxx uuuu uuuu
COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3
SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16
11Eh LCDD14 xxxx xxxx uuuu uuuu
COM3 COM3 COM3 COM3 COM3 COM3 COM3 COM3
SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24
11Fh LCDD15 xxxx xxxx uuuu uuuu
COM3(2) COM3(2) COM3(2) COM3 COM3 COM3 COM3 COM3
Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used by the LCD Module.
Note 1: These bits are reserved on the PIC16C923, always maintain these bits clear.
2: These pixels do not display, but can be used as general purpose RAM.

DS30444E - page 102  1997 Microchip Technology Inc.

 PIC16C9XX
14.0 SPECIAL FEATURES OF THE the Oscillator Start-up Timer (OST), intended to keep
the chip in reset until the crystal oscillator is stable. The
CPU other is the Power-up Timer (PWRT), which provides a
What sets a microcontroller apart from other proces- fixed delay of 72 ms (nominal) on power-up only,
sors are special circuits to deal with the needs of designed to keep the part in reset while the power sup-
real-time applications. The PIC16CXXX family has a ply stabilizes. With these two timers on-chip, most
host of such features intended to maximize system reli- applications need no external reset circuitry.
ability, minimize cost through elimination of external
SLEEP mode is designed to offer a very low current
components, provide power saving operating modes
power-down mode. The user can wake-up from SLEEP
and offer code protection. These are:
through external reset, Watchdog Timer Wake-up or
• Oscillator selection through an interrupt. Several oscillator options are also
• Reset made available to allow the part to fit the application.
- Power-on Reset (POR) The RC oscillator option saves system cost while the
LP crystal option saves power. A set of configuration
- Power-up Timer (PWRT)
bits are used to select various options.
- Oscillator Start-up Timer (OST)
• Interrupts 14.1 Configuration Bits
• Watchdog Timer (WDT) The configuration bits can be programmed (read as '0')
• SLEEP or left unprogrammed (read as '1') to select various
• Code protection device configurations. These bits are mapped in pro-
• ID locations gram memory location 2007h.
• In-circuit serial programming The user will note that address 2007h is beyond the
user program memory space. In fact, it belongs to the
The PIC16CXXX has a Watchdog Timer which can be
special test/configuration memory space (2000h -
shut off only through configuration bits. It runs off its
3FFFh), which can be accessed only during program-
own RC oscillator for added reliability. There are two
ming.
timers that offer necessary delays on power-up. One is

FIGURE 14-1: CONFIGURATION WORD

CP1 CP0 CP1 CP0 CP1 CP0 — — CP1 CP0 PWRTE WDTE FOSC1 FOSC0 Register: CONFIG
Address 2007h
bit13 bit0
bit 13-8 CP1:CP0 Code protection bits (1)
5-4: 11 = Code protection off
10 = Upper half of program memory code protected
01 = Upper 3/4 of program memory code protected
00 = All memory is code protected
bit 6: Unimplemented: Read as '1'
bit 3: PWRTE: Power-up Timer Enable bit
1 = PWRT disabled
0 = PWRT enabled
bit 2: WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 1-0: FOSC1:FOSC0: Oscillator Selection bits
11 = RC oscillator
10 = HS oscillator
01 = XT oscillator
00 = LP oscillator

Note 1: All of the CP1:CP0 bits have to be given the same value to enable the code protection scheme listed.

 1997 Microchip Technology Inc. DS30444E - page 103

PIC16C9XX
14.2 Oscillator Configurations TABLE 14-1: CERAMIC RESONATORS
14.2.1 OSCILLATOR TYPES Ranges Tested:
The PIC16CXXX can be operated in four different oscil- Mode Freq OSC1 OSC2
lator modes. The user can program two configuration XT 455 kHz 68 - 100 pF 68 - 100 pF
bits (FOSC1 and FOSC0) to select one of these four 2.0 MHz 15 - 68 pF 15 - 68 pF
modes: 4.0 MHz 15 - 68 pF 15 - 68 pF
• LP Low Power Crystal HS 8.0 MHz 10 - 68 pF 10 - 68 pF
• XT Crystal/Resonator These values are for design guidance only. See
• HS High Speed Crystal/Resonator notes at bottom of page.
• RC Resistor/Capacitor Resonators Used:

14.2.2 CRYSTAL OSCILLATOR/CERAMIC 455 kHz Panasonic EFO-A455K04B ± 0.3%

RESONATORS 2.0 MHz Murata Erie CSA2.00MG ± 0.5%
4.0 MHz Murata Erie CSA4.00MG ± 0.5%
In XT, LP or HS modes a crystal or ceramic resonator
8.0 MHz Murata Erie CSA8.00MT ± 0.5%
is connected to the OSC1/CLKIN and OSC2/CLKOUT
All resonators used did not have built-in capacitors.
pins to establish oscillation (Figure 14-2). The
PIC16CXXX oscillator design requires the use of a par-
allel cut crystal. Use of a series cut crystal may give a TABLE 14-2: CAPACITOR SELECTION FOR
frequency out of the crystal manufacturers specifica- CRYSTAL OSCILLATOR
tions. When in XT, LP or HS modes, the device can
Crystal Cap. Range Cap. Range
have an external clock source to drive the OSC1/CLKIN Osc Type
Freq C1 C2
pin (Figure 14-3).
LP 32 kHz 33 pF 33 pF
FIGURE 14-2: CRYSTAL/CERAMIC 200 kHz 15 pF 15 pF
RESONATOR OPERATION XT 200 kHz 47-68 pF 47-68 pF
(HS, XT OR LP 1 MHz 15 pF 15 pF
OSC CONFIGURATION) 4 MHz 15 pF 15 pF
HS 4 MHz 15 pF 15 pF
OSC1
8 MHz 15-33 pF 15-33 pF
C1 To internal
logic These values are for design guidance only. See
XTAL notes at bottom of page.
SLEEP
RF
Crystals Used
OSC2
32 kHz Epson C-001R32.768K-A ± 20 PPM
RS
C2 Note1 PIC16CXXX 200 kHz STD XTL 200.000KHz ± 20 PPM
1 MHz ECS ECS-10-13-1 ± 50 PPM
See Table 14-1 and Table 14-2 for recommended 4 MHz ECS ECS-40-20-1 ± 50 PPM
values of C1 and C2. 8 MHz EPSON CA-301 8.000M-C ± 30 PPM
Note 1: A series resistor may be required for AT
strip cut crystals.
Note 1: Recommended values of C1 and C2 are
identical to the ranges tested (Table 14-1).
2: Higher capacitance increases the stability
FIGURE 14-3: EXTERNAL CLOCK INPUT of oscillator but also increases the start-up
OPERATION (HS, XT OR LP time.
OSC CONFIGURATION) 3: Since each resonator/crystal has its own
characteristics, the user should consult the
resonator/crystal manufacturer for appropri-
Clock from OSC1
ate values of external components.
ext. system PIC16CXXX 4: Rs may be required in HS mode as well as
Open OSC2 XT mode to avoid overdriving crystals with
low drive level specification.

DS30444E - page 104  1997 Microchip Technology Inc.

 PIC16C9XX
14.2.3 EXTERNAL CRYSTAL OSCILLATOR 14.2.4 RC OSCILLATOR
CIRCUIT
For timing insensitive applications the “RC” device
Either a prepackaged oscillator can be used or a simple option offers additional cost savings. The RC oscillator
oscillator circuit with TTL gates can be built. Prepack- frequency is a function of the supply voltage, the resis-
aged oscillators provide a wide operating range and tor (REXT) and capacitor (CEXT) values, and the operat-
better stability. A well-designed crystal oscillator will ing temperature. In addition to this, the oscillator
provide good performance with TTL gates. Two types of frequency will vary from unit to unit due to normal pro-
crystal oscillator circuits can be used; one with series cess parameter variation. Furthermore, the difference
resonance, or one with parallel resonance. in lead frame capacitance between package types will
Figure 14-4 shows implementation of a parallel reso- also affect the oscillation frequency, especially for low
nant oscillator circuit. The circuit is designed to use the CEXT values. The user also needs to take into account
fundamental frequency of the crystal. The 74AS04 variation due to tolerance of external R and C compo-
inverter performs the 180-degree phase shift that a par- nents used. Figure 14-6 shows how the R/C combina-
allel oscillator requires. The 4.7 kΩ resistor provides the tion is connected to the PIC16CXXX. For REXT values
negative feedback for stability. The 10 kΩ potentiometer below 2.2 kΩ, the oscillator operation may become
biases the 74AS04 in the linear region. This could be unstable, or stop completely. For very high REXT values
used for external oscillator designs. (e.g. 1 MΩ), the oscillator becomes sensitive to noise,
humidity and leakage. Thus, we recommend to keep
Rext between 3 kΩ and 100 kΩ.
FIGURE 14-4: EXTERNAL PARALLEL
RESONANT CRYSTAL Although the oscillator will operate with no external
OSCILLATOR CIRCUIT capacitor (CEXT = 0 pF), we recommend using values
above 20 pF for noise and stability reasons. With no or
+5V small external capacitance, the oscillation frequency
To Other
Devices can vary dramatically due to changes in external
10k capacitances, such as PCB trace capacitance or pack-
4.7k 74AS04 PIC16CXXX age lead frame capacitance.
74AS04 CLKIN See characterization data for desired device for RC fre-
quency variation from part to part due to normal pro-
cess variation. The variation is larger for larger R (since
10k leakage current variation will affect RC frequency more
XTAL for large R) and for smaller C (since variation of input
capacitance will affect RC frequency more).
10k
See characterization data for desired device for varia-
20 pF 20 pF tion of oscillator frequency due to VDD for given
REXT/CEXT values as well as frequency variation due to
operating temperature for given R, C, and VDD values.
Figure 14-5 shows a series resonant oscillator circuit.
The oscillator frequency, divided by 4, is available on
This circuit is also designed to use the fundamental fre-
the OSC2/CLKOUT pin, and can be used for test pur-
quency of the crystal. The inverter performs a
poses or to synchronize other logic (see Figure 3-3 for
180-degree phase shift in a series resonant oscillator
waveform).
circuit. The 330 kΩ resistors provide the negative feed-
back to bias the inverters in their linear region.
FIGURE 14-6: RC OSCILLATOR MODE
FIGURE 14-5: EXTERNAL SERIES
RESONANT CRYSTAL V DD
OSCILLATOR CIRCUIT
REXT
Internal
OSC1
To Other clock
330 kΩ 330 kΩ Devices
CEXT PIC16CXXX
74AS04 74AS04 74AS04
VSS
CLKIN OSC2/CLKOUT
0.1 µF Fosc/4
XTAL
PIC16CXXX

 1997 Microchip Technology Inc. DS30444E - page 105

PIC16C9XX
14.3 Reset the resumption of normal operation. The TO and PD
bits are set or cleared differently in different reset situ-
The PIC16CXX differentiates between various kinds of
ations as indicated in Table 14-4. These bits are used
reset:
in software to determine the nature of the reset. See
• Power-on Reset (POR) Table 14-6 for a full description of reset states of all reg-
• MCLR Reset during normal operation isters.
• MCLR Reset during SLEEP A simplified block diagram of the on-chip reset circuit is
• WDT Reset (normal operation) shown in Figure 14-7.
Some registers are not affected in any reset condition; The devices all have a MCLR noise filter in the MCLR
their status is unknown on POR and unchanged in any reset path. The filter will detect and ignore small pulses.
other reset. Most other registers are reset to a “reset It should be noted that a WDT Reset does not drive
state” on Power-on Reset (POR), on the MCLR and MCLR pin low.
WDT Reset, and on MCLR Reset during SLEEP. They
are not affected by a WDT Wake-up, which is viewed as

FIGURE 14-7: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT

External
Reset

MCLR
SLEEP
WDT WDT
Module Time-out

VDD rise
detect
Power-on Reset
VDD

OST/PWRT
OST
Chip_Reset
10-bit Ripple counter R Q

OSC1

(1) PWRT
On-chip
RC OSC 10-bit Ripple counter

Enable PWRT(2)

Enable OST(2)
Note 1: This is a separate oscillator from the RC oscillator of the CLKIN pin.
2: See Table 14-3 for time-out situations.

DS30444E - page 106  1997 Microchip Technology Inc.

 PIC16C9XX
14.4 Power-on Reset (POR), Power-up 14.4.3 OSCILLATOR START-UP TIMER (OST)
Timer (PWRT) and Oscillator Start-up
The Oscillator Start-up Timer (OST) provides 1024
Timer (OST)
oscillator cycle (from OSC1 input) delay after the
14.4.1 POWER-ON RESET (POR) PWRT delay is over. This ensures that the crystal oscil-
lator or resonator has started and stabilized.
A Power-on Reset pulse is generated on-chip when The OST time-out is invoked only for XT, LP and HS
VDD rise is detected (in the range of 1.5V - 2.1V). To modes and only on Power-on Reset or wake-up from
take advantage of the POR, just tie the MCLR pin SLEEP.
directly (or through a resistor) to VDD. This will elimi-
nate external RC components usually needed to create 14.4.4 TIME-OUT SEQUENCE
a Power-on Reset. A maximum rise time for VDD is
specified. See Electrical Specifications for details. On power-up the time-out sequence is as follows: First
PWRT time-out is invoked after the POR time delay has
When the device starts normal operation (exits the
expired. Then OST is activated. The total time-out will
reset condition), device operating parameters (voltage,
vary based on oscillator configuration and the status of
frequency, temperature, ...) must be met to ensure
the PWRT. For example, in RC mode with the PWRT
operation. If these conditions are not met, the device
disabled, there will be no time-out at all. Figure 14-8,
must be held in reset until the operating conditions are
Figure 14-9, and Figure 14-10 depict time-out
met.
sequences on power-up.
For additional information, refer to Application Note
Since the time-outs occur from the POR pulse, if MCLR
AN607, “Power-up Trouble Shooting.”
is kept low long enough, the time-outs will expire. Then
14.4.2 POWER-UP TIMER (PWRT) bringing MCLR high will begin execution immediately
(Figure 14-9). This is useful for testing purposes or to
The Power-up Timer provides a fixed 72 ms nominal synchronize more than one PIC16CXXX device operat-
time-out on power-up only, from the POR. The ing in parallel.
Power-up Timer operates on an internal RC oscillator. Table 14-5 shows the reset conditions for some special
The chip is kept in reset as long as the PWRT is active. function registers, while Table 14-6 shows the reset
The PWRT’s time delay allows VDD to rise to an accept- conditions for all the registers.
able level. A configuration bit is provided to enable/dis-
able the PWRT. 14.4.5 POWER CONTROL/STATUS REGISTER
The power-up time delay will vary from chip to chip due (PCON)
to VDD, temperature, and process variation. See DC Bit1 is Power-on Reset Status bit POR. It is cleared on
parameters for details. a Power-on Reset and unaffected otherwise. The user
must set this bit following a Power-on Reset.

TABLE 14-3: TIME-OUT IN VARIOUS SITUATIONS

Oscillator Configuration Power-up Wake-up from SLEEP

PWRTE = 1 PWRTE = 0
XT, HS, LP 1024TOSC 72 ms + 1024TOSC 1024 TOSC
RC — 72 ms —

 1997 Microchip Technology Inc. DS30444E - page 107

PIC16C9XX
TABLE 14-4: STATUS BITS AND THEIR SIGNIFICANCE

POR TO PD
0 1 1 Power-on Reset
0 0 x Illegal, TO is set on POR
0 x 0 Illegal, PD is set on POR
1 0 1 WDT Reset
1 0 0 WDT Wake-up
1 u u MCLR Reset during normal operation
1 1 0 MCLR Reset during SLEEP or interrupt wake-up from SLEEP
Legend: u = unchanged, x = unknown
TABLE 14-5: RESET CONDITION FOR SPECIAL REGISTERS

Program STATUS PCON

Condition
Counter Register Register

Power-on Reset 000h 0001 1xxx ---- --0-

MCLR Reset during normal operation 000h 000u uuuu ---- --u-
MCLR Reset during SLEEP 000h 0001 0uuu ---- --u-
WDT Reset 000h 0000 1uuu ---- --u-
WDT Wake-up PC + 1 uuu0 0uuu ---- --u-
Interrupt wake-up from SLEEP PC + 1(1) uuu1 0uuu ---- --u-
Legend: u = unchanged, x = unknown, - = unimplemented bit read as '0'.
Note 1: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded
with the interrupt vector (0004h).

TABLE 14-6: INITIALIZATION CONDITIONS FOR ALL REGISTERS

Register Applicable Devices Power-on Reset MCLR Resets Wake-up via
WDT Reset WDT or
Interrupt
W 923 924 xxxx xxxx uuuu uuuu uuuu uuuu
INDF 923 924 N/A N/A N/A
TMR0 923 924 xxxx xxxx uuuu uuuu uuuu uuuu
PCL 923 924 0000h 0000h PC + 1(2)
STATUS 923 924 0001 1xxx 000q quuu(3) uuuq quuu(3)
FSR 923 924 xxxx xxxx uuuu uuuu uuuu uuuu
PORTA 923 924 --xx xxxx --uu uuuu --uu uuuu
PORTA 923 924 --0x 0000(5) --0u 0000(5) --uu uuuu
PORTB 923 924 xxxx xxxx uuuu uuuu uuuu uuuu
PORTC 923 924 --xx xxxx --uu uuuu --uu uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as '0', q = value depends on condition
Note 1: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
2: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector
(0004h).
3: See Table 14-5 for reset value for specific condition.
4: Bits PIE1<6> and PIR1<6> are reserved on the PIC16C923, always maintain these bits clear.
5: PORTA values when read.

DS30444E - page 108  1997 Microchip Technology Inc.

 PIC16C9XX
TABLE 14-6: INITIALIZATION CONDITIONS FOR ALL REGISTERS (Cont.’d)
Register Applicable Devices Power-on Reset MCLR Resets Wake-up via
WDT Reset WDT or
Interrupt
PORTD 923 924 0000 0000 0000 0000 uuuu uuuu
PORTE 923 924 0000 0000 0000 0000 uuuu uuuu
PCLATH 923 924 ---0 0000 ---0 0000 ---u uuuu
INTCON 923 924 0000 000x 0000 000u uuuu uuuu(1)
PIR1(4) 923 924 00-- 0000 00-- 0000 uu-- uuuu(1)
TMR1L 923 924 xxxx xxxx uuuu uuuu uuuu uuuu
TMR1H 923 924 xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 923 924 --00 0000 --uu uuuu --uu uuuu
TMR2 923 924 0000 0000 0000 0000 uuuu uuuu
T2CON 923 924 -000 0000 -000 0000 -uuu uuuu
SSPBUF 923 924 xxxx xxxx uuuu uuuu uuuu uuuu
SSPCON 923 924 0000 0000 0000 0000 uuuu uuuu
CCPR1L 923 924 xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1H 923 924 xxxx xxxx uuuu uuuu uuuu uuuu
CCP1CON 923 924 --00 0000 --00 0000 --uu uuuu
ADRES 923 924 xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0 923 924 0000 00-0 0000 00-0 uuuu uu-u
OPTION 923 924 1111 1111 1111 1111 uuuu uuuu
TRISA 923 924 --11 1111 --11 1111 --uu uuuu
TRISB 923 924 1111 1111 1111 1111 uuuu uuuu
TRISC 923 924 --11 1111 --11 1111 --uu uuuu
TRISD 923 924 1111 1111 1111 1111 uuuu uuuu
TRISE 923 924 1111 1111 1111 1111 uuuu uuuu
(4)
PIE1 923 924 00-- 0000 00-- 0000 uu-- uuuu
PCON 923 924 ---- --0- ---- --u- ---- --u-
PR2 923 924 1111 1111 1111 1111 1111 1111
SSPADD 923 924 0000 0000 0000 0000 uuuu uuuu
SSPSTAT 923 924 0000 0000 0000 0000 uuuu uuuu
ADCON1 923 924 ---- -000 ---- -000 ---- -uuu
PORTF 923 924 0000 0000 0000 0000 uuuu uuuu
PORTG 923 924 0000 0000 0000 0000 uuuu uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as '0', q = value depends on condition
Note 1: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
2: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector
(0004h).
3: See Table 14-5 for reset value for specific condition.
4: Bits PIE1<6> and PIR1<6> are reserved on the PIC16C923, always maintain these bits clear.
5: PORTA values when read.

 1997 Microchip Technology Inc. DS30444E - page 109

PIC16C9XX
TABLE 14-6: INITIALIZATION CONDITIONS FOR ALL REGISTERS (Cont.’d)
Register Applicable Devices Power-on Reset MCLR Resets Wake-up via
WDT Reset WDT or
Interrupt
LCDSE 923 924 1111 1111 1111 1111 uuuu uuuu
LCDPS 923 924 ---- 0000 ---- 0000 ---- uuuu
LCDCON 923 924 00-0 0000 00-0 0000 uu-u uuuu
LCDD00 923 924 xxxx xxxx uuuu uuuu uuuu uuuu
to
LCDD15
TRISF 923 924 1111 1111 1111 1111 uuuu uuuu
TRISG 923 924 1111 1111 1111 1111 uuuu uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as '0', q = value depends on condition
Note 1: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
2: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector
(0004h).
3: See Table 14-5 for reset value for specific condition.
4: Bits PIE1<6> and PIR1<6> are reserved on the PIC16C923, always maintain these bits clear.
5: PORTA values when read.

DS30444E - page 110  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 14-8: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1

VDD

MCLR

INTERNAL POR

TPWRT

PWRT TIME-OUT TOST

OST TIME-OUT

INTERNAL RESET

FIGURE 14-9: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2

VDD

MCLR

INTERNAL POR

TPWRT

PWRT TIME-OUT TOST

OST TIME-OUT

INTERNAL RESET

FIGURE 14-10:TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)

VDD

MCLR

INTERNAL POR

TPWRT

PWRT TIME-OUT TOST

OST TIME-OUT

INTERNAL RESET

 1997 Microchip Technology Inc. DS30444E - page 111

PIC16C9XX
FIGURE 14-11:EXTERNAL POWER-ON FIGURE 14-12:EXTERNAL BROWN-OUT
RESET CIRCUIT (FOR SLOW PROTECTION CIRCUIT 1
VDD POWER-UP)
VDD VDD
33k
VDD

D
10k MCLR
R
R1 40k
MCLR PIC16CXXX
C PIC16CXXX

Note 1: This circuit will activate reset when VDD

Note 1: External Power-on Reset circuit is required goes below (Vz + 0.7V) where Vz = Zener
only if VDD power-up slope is too slow. The voltage.
diode D helps discharge the capacitor 2: Resistors should be adjusted for the char-
quickly when VDD powers down. acteristics of the transistors.
2: R < 40 kΩ is recommended to make sure
that voltage drop across R does not violate
the device’s electrical specification.
3: R1 = 100Ω to 1 kΩ will limit any current
flowing into MCLR from external capacitor FIGURE 14-13:EXTERNAL BROWN-OUT
C in the event of MCLR/VPP pin break- PROTECTION CIRCUIT 2
down due to Electrostatic Discharge
(ESD) or Electrical Overstress (EOS).
VDD VDD
R1

Q1
MCLR
R2 40k
PIC16CXXX

Note 1: This brown-out circuit is less expensive,

albeit less accurate. Transistor Q1 turns
off when VDD is below a certain level
such that:
R1
VDD • = 0.7V
R1 + R2
2: Resistors should be adjusted for the
characteristics of the transistors.

DS30444E - page 112  1997 Microchip Technology Inc.

 PIC16C9XX
14.5 Interrupts A global interrupt enable bit, GIE (INTCON<7>)
enables (if set) all un-masked interrupts or disables (if
The PIC16C9XX family has up to 9 sources of interrupt:
cleared) all interrupts. When bit GIE is enabled, and an
Applicable interrupt’s flag bit and mask bit are set, the interrupt will
Interrupt Sources Devices vector immediately. Individual interrupts can be dis-
abled through their corresponding enable bits in various
registers. Individual interrupt bits are set regardless of
External interrupt RB0/INT 923 924 the status of the GIE bit. The GIE bit is cleared on reset.
TMR0 overflow interrupt 923 924 The “return from interrupt” instruction, RETFIE, exits
PORTB change interrupts 923 924 the interrupt routine as well as sets the GIE bit, which
(pins RB7:RB4) re-enables interrupts.
A/D Interrupt 923 924 The RB0/INT pin interrupt, the RB port change interrupt
and the TMR0 overflow interrupt flags are contained in
TMR1 overflow interrupt 923 924
the INTCON register.
TMR2 matches period interrupt 923 924
The peripheral interrupt flags are contained in the spe-
CCP1 interrupt 923 924 cial function register PIR1. The corresponding interrupt
Synchronous serial port interrupt 923 924 enable bits are contained in special function register
PIE1, and the peripheral interrupt enable bit is con-
LCD Module interrupt 923 924
tained in special function register INTCON.
The interrupt control register (INTCON) records individ-
When an interrupt is responded to, the GIE bit is
ual interrupt requests in flag bits. It also has individual
cleared to disable any further interrupts, the return
and global interrupt enable bits.
address is pushed onto the stack and the PC is loaded
Note: Individual interrupt flag bits are set regard- with 0004h. Once in the interrupt service routine the
less of the status of their corresponding source(s) of the interrupt can be determined by polling
mask bit or the GIE bit. the interrupt flag bits. The interrupt flag bit(s) must be
cleared in software before re-enabling interrupts to
avoid recursive interrupts.
For external interrupt events, such as the RB0/INT pin
or RB Port change interrupt, the interrupt latency will be
three or four instruction cycles. The exact latency
depends when the interrupt event occurs
(Figure 14-15). The latency is the same for one or two
cycle instructions. Individual interrupt flag bits are set
regardless of the status of their corresponding mask bit
or the GIE bit.

 1997 Microchip Technology Inc. DS30444E - page 113

PIC16C9XX
FIGURE 14-14:INTERRUPT LOGIC

TMR1IF
Wake-up (If in SLEEP mode)
TMR1IE T0IF
T0IE
INTF
TMR2IF INTE
TMR2IE Interrupt to CPU
RBIF
RBIE
LCDIF PEIF
LCDIE
PEIE

GIE
CCP1IF
CCP1IE

SSPIF
SSPIE

ADIF
ADIE
The A/D module interrupt is implemented on the PIC16C924 only.

FIGURE 14-15:INT PIN INTERRUPT TIMING

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1

CLKOUT 3
4
INT pin
1
1
INTF flag 5 Interrupt Latency 2
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC PC PC+1 PC+1 0004h 0005h
Instruction
fetched Inst (PC) Inst (PC+1) — Inst (0004h) Inst (0005h)

Instruction Dummy Cycle Dummy Cycle Inst (0004h)

executed Inst (PC-1) Inst (PC)

Note 1: INTF flag is sampled here (every Q1).

2: Interrupt latency = 3-4 TCY where TCY = instruction cycle time.
Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT is available only in RC oscillator mode.
4: For minimum width of INT pulse, refer to AC specs.
5: INTF can be set anytime during the Q4-Q1 cycles.

DS30444E - page 114  1997 Microchip Technology Inc.

 PIC16C9XX
14.5.1 INT INTERRUPT 14.6 Context Saving During Interrupts
External interrupt on RB0/INT pin is edge triggered: During an interrupt, only the return PC value is saved
either rising if bit INTEDG (OPTION<6>) is set, or fall- on the stack. Typically, users may wish to save key reg-
ing, if the INTEDG bit is clear. When a valid edge isters during an interrupt i.e., W register and STATUS
appears on the RB0/INT pin, flag bit INTF register. This will have to be implemented in software.
(INTCON<1>) is set. This interrupt can be disabled by Example 14-1 stores and restores the STATUS, W, and
clearing enable bit INTE (INTCON<4>). Flag bit INTF PCLATH registers. The register, W_TEMP, must be
must be cleared in software in the interrupt service rou- defined in each bank and must be defined at the same
tine before re-enabling this interrupt. The INT interrupt offset from the bank base address (i.e., if W_TEMP is
can wake-up the processor from SLEEP, if bit INTE was defined at 0x20 in bank 0, it must also be defined at
set prior to going into SLEEP. The status of global inter- 0xA0 in bank 1).
rupt enable bit GIE decides whether or not the proces-
The example:
sor branches to the interrupt vector following wake-up.
See Section 14.8 for details on SLEEP mode. a) Stores the W register.
b) Stores the STATUS register in bank 0.
14.5.2 TMR0 INTERRUPT
c) Stores the PCLATH register.
An overflow (FFh → 00h) in the TMR0 register will set d) Executes the ISR code.
flag bit T0IF (INTCON<2>). The interrupt can be e) Restores the STATUS register (and bank select
enabled/disabled by setting/clearing enable bit T0IE bit).
(INTCON<5>). (Section 7.0) f) Restores the W and PCLATH registers.
14.5.3 PORTB INTCON CHANGE

An input change on PORTB<7:4> sets flag bit RBIF

(INTCON<0>). The interrupt can be enabled/disabled
by setting/clearing enable bit RBIE (INTCON<4>).
(Section 5.2)

EXAMPLE 14-1: SAVING STATUS, W, AND PCLATH REGISTERS IN RAM

MOVWF W_TEMP ;Copy W to TEMP register, could be bank one or zero
SWAPF STATUS,W ;Swap status to be saved into W
CLRF STATUS ;bank 0, regardless of current bank, Clears IRP,RP1,RP0
MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register
MOVF PCLATH, W ;Only required if using pages 1, 2 and/or 3
MOVWF PCLATH_TEMP ;Save PCLATH into W
CLRF PCLATH ;Page zero, regardless of current page
BCF STATUS, IRP ;Return to Bank 0
MOVF FSR, W ;Copy FSR to W
MOVWF FSR_TEMP ;Copy FSR from W to FSR_TEMP
:
:(ISR)
:
MOVF PCLATH_TEMP, W ;Restore PCLATH
MOVWF PCLATH ;Move W into PCLATH
SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W
;(sets bank to original state)
MOVWF STATUS ;Move W into STATUS register
SWAPF W_TEMP,F ;Swap W_TEMP
SWAPF W_TEMP,W ;Swap W_TEMP into W

 1997 Microchip Technology Inc. DS30444E - page 115

PIC16C9XX
14.7 Watchdog Timer (WDT) assigned to the WDT under software control by writing
to the OPTION register. Thus, time-out periods up to
The Watchdog Timer is as a free running on-chip RC
2.3 seconds can be realized.
oscillator which does not require any external compo-
nents. This RC oscillator is separate from the RC oscil- The CLRWDT and SLEEP instructions clear the WDT
lator of the OSC1/CLKIN pin. That means that the WDT and the postscaler, if assigned to the WDT, and prevent
will run, even if the clock on the OSC1/CLKIN and it from timing out and generating a device RESET con-
OSC2/CLKOUT pins of the device has been stopped, dition.
for example, by execution of a SLEEP instruction. Dur- The TO bit in the STATUS register will be cleared upon
ing normal operation, a WDT time-out generates a a Watchdog Timer time-out.
device RESET (Watchdog Timer Reset). If the device is
in SLEEP mode, a WDT time-out causes the device to 14.7.2 WDT PROGRAMMING CONSIDERATIONS
wake-up and continue with normal operation (Watch-
dog Timer Wake-up). The WDT can be permanently It should also be taken into account that under worst
disabled by clearing configuration bit WDTE case conditions (VDD = Min., Temperature = Max., and
(Section 14.1). max. WDT prescaler) it may take several seconds
before a WDT time-out occurs.
14.7.1 WDT PERIOD
Note: When a CLRWDT instruction is executed
The WDT has a nominal time-out period of 18 ms, (with and the prescaler is assigned to the WDT,
no prescaler). The time-out periods vary with tempera- the prescaler count will be cleared, but the
ture, VDD and process variations from part to part (see prescaler assignment is not changed.
DC specs). If longer time-out periods are desired, a
prescaler with a division ratio of up to 1:128 can be

FIGURE 14-16:WATCHDOG TIMER BLOCK DIAGRAM

From TMR0 Clock Source
(Figure 7-6)

0
M Postscaler
1 U
WDT Timer
X 8

8 - to - 1 MUX PS2:PS0
PSA
WDT
Enable Bit
To TMR0 (Figure 7-6)

0 1

MUX PSA

WDT
Note: PSA and PS2:PS0 are bits in the OPTION register. Time-out

FIGURE 14-17:SUMMARY OF WATCHDOG TIMER REGISTERS

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

2007h Config. bits (1) (1) CP1 CP0 PWRTE(1) WDTE FOSC1 FOSC0
81h, 181h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
Legend: Shaded cells are not used by the Watchdog Timer.
Note 1: See Figure 14-1 for operation of these bits.

DS30444E - page 116  1997 Microchip Technology Inc.

 PIC16C9XX
14.8 Power-down Mode (SLEEP) Other peripherals can not generate interrupts since
during SLEEP, no on-chip Q clocks are present.
Power-down mode is entered by executing a SLEEP
instruction. When the SLEEP instruction is being executed, the next
instruction (PC + 1) is pre-fetched. For the device to
If enabled, the Watchdog Timer will be cleared but
wake-up through an interrupt event, the corresponding
keeps running, the PD bit (STATUS<3>) is cleared, the
interrupt enable bit must be set (enabled). Wake-up is
TO (STATUS<4>) bit is set, and the oscillator driver is
regardless of the state of the GIE bit. If the GIE bit is
turned off. The I/O ports maintain the status they had,
clear (disabled), the device continues execution at the
before the SLEEP instruction was executed (driving
instruction after the SLEEP instruction. If the GIE bit is
high, low, or hi-impedance).
set (enabled), the device executes the instruction after
For lowest current consumption in this mode, place all the SLEEP instruction and then branches to the inter-
I/O pins at either VDD, or VSS, ensure no external cir- rupt address (0004h). In cases where the execution of
cuitry is drawing current from the I/O pin, power-down the instruction following SLEEP is not desirable, the
the A/D, disable external clocks. Pull all I/O pins, that user should have a NOP after the SLEEP instruction.
are hi-impedance inputs, high or low externally to avoid
switching currents caused by floating inputs. The T0CKI 14.8.2 WAKE-UP USING INTERRUPTS
input should also be at VDD or VSS for lowest current
consumption. The contribution from on-chip pull-ups on When global interrupts are disabled (GIE cleared) and
PORTB should be considered. any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
The MCLR pin must be at a logic high level (VIHMC).
• If the interrupt occurs before the execution of a
14.8.1 WAKE-UP FROM SLEEP SLEEP instruction, the SLEEP instruction will com-
plete as a NOP. Therefore, the WDT and WDT
The device can wake up from SLEEP through one of postscaler will not be cleared, the TO bit will not
the following events: be set and PD bits will not be cleared.
1. External reset input on MCLR pin. • If the interrupt occurs during or after the execu-
2. Watchdog Timer Wake-up (if WDT was tion of a SLEEP instruction, the device will immedi-
enabled). ately wake up from sleep. The SLEEP instruction
3. Interrupt from RB0/INT pin, RB port change, or will be completely executed before the wake-up.
some peripheral interrupts. Therefore, the WDT and WDT postscaler will be
cleared, the TO bit will be set and the PD bit will
External MCLR Reset will cause a device reset. All be cleared.
other events are considered a continuation of program
execution and cause a “wake-up”. The TO and PD bits Even if the flag bits were checked before executing a
in the STATUS register can be used to determine the SLEEP instruction, it may be possible for flag bits to
cause of device reset. The PD bit, which is set on become set before the SLEEP instruction completes. To
power-up is cleared when SLEEP is invoked. The TO bit determine whether a SLEEP instruction executed, test
is cleared if a WDT time-out occurred (and caused the PD bit. If the PD bit is set, the SLEEP instruction was
wake-up). executed as a NOP.

The following peripheral interrupts can wake the device To ensure that the WDT is cleared, a CLRWDT instruc-
from SLEEP: tion should be executed before a SLEEP instruction.

1. TMR1 interrupt. Timer1 must be operating as an

asynchronous counter.
2. SSP (Start/Stop) bit detect interrupt.
3. SSP transmit or receive in slave mode (SPI/I2C).
4. CCP capture mode interrupt.
5. A/D conversion (when A/D clock source is RC).
6. Special event trigger (Timer1 in asynchronous
mode using an external clock).
7. LCD module.

 1997 Microchip Technology Inc. DS30444E - page 117

PIC16C9XX
FIGURE 14-18:WAKE-UP FROM SLEEP THROUGH INTERRUPT

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1

CLKOUT(4) TOST(2)

INT pin

INTF flag
(INTCON<1>) Interrupt Latency
(Note 2)
GIE bit Processor in
(INTCON<7>)
SLEEP

INSTRUCTION FLOW
PC PC PC+1 PC+2 PC+2 PC + 2 0004h 0005h
Instruction
fetched Inst(PC) = SLEEP Inst(PC + 1) Inst(PC + 2) Inst(0004h) Inst(0005h)

Instruction Dummy cycle Dummy cycle

executed Inst(PC - 1) SLEEP Inst(PC + 1) Inst(0004h)

Note 1: XT, HS or LP oscillator mode assumed.

2: TOST = 1024TOSC (drawing not to scale) This delay will not be there for RC osc mode.
3: GIE = '1' assumed. In this case after wake- up, the processor jumps to the interrupt routine. If GIE = '0', execution will continue in-line.
4: CLKOUT is not available in these osc modes, but shown here for timing reference.

14.9 Program Verification/Code Protection After reset, to place the device into program/verify
mode, the program counter (PC) is at location 00h. A
If the code protection bit(s) have not been pro-
6-bit command is then supplied to the device. Depend-
grammed, the on-chip program memory can be read
ing on the command, 14-bits of program data are then
out for verification purposes.
supplied to or from the device, depending if the com-
Note: Microchip does not recommend code pro- mand was a load or a read. For complete details of
tecting windowed devices. serial programming, please refer to the PIC16C6X/7X
Programming Specifications (Literature #DS30228).
14.10 ID Locations
Four memory locations (2000h - 2003h) are designated FIGURE 14-19:TYPICAL IN-CIRCUIT SERIAL
as ID locations where the user can store checksum or PROGRAMMING
other code-identification numbers. These locations are CONNECTION
not accessible during normal execution but are read-
able and writable during program/verify. It is recom-
mended that only the 4 least significant bits of the ID To Normal
Connections
location are used. External
Connector PIC16CXXX
Signals
14.11 In-Circuit Serial Programming
+5V VDD
PIC16CXXX microcontrollers can be serially pro-
grammed while in the end application circuit. This is 0V VSS
simply done with two lines for clock and data, and three VPP MCLR/VPP
other lines for power, ground, and the programming
CLK RB6
voltage. This allows customers to manufacture boards
with unprogrammed devices, and then program the Data I/O RB7
microcontroller just before shipping the product. This
also allows the most recent firmware or a custom firm-
ware to be programmed. VDD
The device is placed into a program/verify mode by To Normal
holding the RB6 and RB7 pins low while raising the Connections
MCLR (VPP) pin from VIL to VIHH (see programming
specification). RB6 becomes the programming clock
and RB7 becomes the programming data. Both RB6
and RB7 are Schmitt Trigger inputs in this mode.

DS30444E - page 118  1997 Microchip Technology Inc.

 PIC16C9XX
15.0 INSTRUCTION SET SUMMARY TABLE 15-1: OPCODE FIELD DESCRIPTIONS
Each PIC16CXXX instruction is a 14-bit word divided Field Description
into an OPCODE which specifies the instruction type
f Register file address (0x00 to 0x7F)
and one or more operands which further specify the
operation of the instruction. The PIC16CXX instruction W Working register (accumulator)
set summary in Table 15-2 lists byte-oriented, bit-ori- b Bit address within an 8-bit file register
ented, and literal and control operations. Table 15-1 k Literal field, constant data or label
shows the opcode field descriptions.
x Don't care location (= 0 or 1)
For byte-oriented instructions, 'f' represents a file reg- The assembler will generate code with x = 0. It is the
ister designator and 'd' represents a destination desig- recommended form of use for compatibility with all
nator. The file register designator specifies which file Microchip software tools.
register is to be used by the instruction. d Destination select; d = 0: store result in W,
The destination designator specifies where the result of d = 1: store result in file register f.
the operation is to be placed. If 'd' is zero, the result is Default is d = 1
placed in the W register. If 'd' is one, the result is placed label Label name
in the file register specified in the instruction. TOS Top of Stack
For bit-oriented instructions, 'b' represents a bit field PC Program Counter
designator which selects the number of the bit affected PCLATH Program Counter High Latch
by the operation, while 'f' represents the number of the
GIE Global Interrupt Enable bit
file in which the bit is located.
WDT Watchdog Timer/Counter
For literal and control operations, 'k' represents an
eight or eleven bit constant or literal value. TO Time-out bit
PD Power-down bit
The instruction set is highly orthogonal and is grouped
into three basic categories: dest Destination either the W register or the specified
register file location
• Byte-oriented operations
• Bit-oriented operations [ ] Options

• Literal and control operations ( ) Contents

→ Assigned to
FIGURE 15-1: GENERAL FORMAT FOR <> Register bit field
INSTRUCTIONS
∈ In the set of
Byte-oriented file register operations
13 8 7 6 0 italics User defined term (font is courier)
OPCODE d f (FILE #)
All instructions are executed within one single instruc-
d = 0 for destination W tion cycle, unless a conditional test is true or the pro-
d = 1 for destination f gram counter is changed as a result of an instruction. In
f = 7-bit file register address
this case, the execution takes two instruction cycles
with the second cycle executed as a NOP. One instruc-
Bit-oriented file register operations tion cycle consists of four oscillator periods. Thus, for an
13 10 9 7 6 0 oscillator frequency of 4 MHz, the normal instruction
OPCODE b (BIT #) f (FILE #) execution time is 1 µs. If a conditional test is true or the
b = 3-bit bit address
program counter is changed as a result of an instruc-
f = 7-bit file register address tion, the instruction execution time is 2 µs.
Table 15-2 lists the instructions recognized by the
Literal and control operations MPASM assembler.
Figure 15-1 shows the general formats that the instruc-
General
tions can have.
13 8 7 0
OPCODE k (literal) Note: To maintain upward compatibility with
future PIC16CXXX products, do not use
k = 8-bit immediate value the OPTION and TRIS instructions.
All examples use the following format to represent a
CALL and GOTO instructions only
hexadecimal number:
13 11 10 0
0xhh
OPCODE k (literal)
where h signifies a hexadecimal digit.
k = 11-bit immediate value

 1997 Microchip Technology Inc. DS30444E - page 119

PIC16C9XX
TABLE 15-2: PIC16CXXX INSTRUCTION SET
Mnemonic, Description Cycles 14-Bit Opcode Status Notes
Operands MSb Affected
LSb

BYTE-ORIENTED FILE REGISTER OPERATIONS

ADDWF f, d Add W and f 1 00 0111 dfff ffff C,DC,Z 1,2

ANDWF f, d AND W with f 1 00 0101 dfff ffff Z 1,2
CLRF f Clear f 1 00 0001 lfff ffff Z 2
CLRW - Clear W 1 00 0001 0xxx xxxx Z
COMF f, d Complement f 1 00 1001 dfff ffff Z 1,2
DECF f, d Decrement f 1 00 0011 dfff ffff Z 1,2
DECFSZ f, d Decrement f, Skip if 0 1(2) 00 1011 dfff ffff 1,2,3
INCF f, d Increment f 1 00 1010 dfff ffff Z 1,2
INCFSZ f, d Increment f, Skip if 0 1(2) 00 1111 dfff ffff 1,2,3
IORWF f, d Inclusive OR W with f 1 00 0100 dfff ffff Z 1,2
MOVF f, d Move f 1 00 1000 dfff ffff Z 1,2
MOVWF f Move W to f 1 00 0000 lfff ffff
NOP - No Operation 1 00 0000 0xx0 0000
RLF f, d Rotate Left f through Carry 1 00 1101 dfff ffff C 1,2
RRF f, d Rotate Right f through Carry 1 00 1100 dfff ffff C 1,2
SUBWF f, d Subtract W from f 1 00 0010 dfff ffff C,DC,Z 1,2
SWAPF f, d Swap nibbles in f 1 00 1110 dfff ffff 1,2
XORWF f, d Exclusive OR W with f 1 00 0110 dfff ffff Z 1,2

BIT-ORIENTED FILE REGISTER OPERATIONS

BCF f, b Bit Clear f 1 01 00bb bfff ffff 1,2

BSF f, b Bit Set f 1 01 01bb bfff ffff 1,2
BTFSC f, b Bit Test f, Skip if Clear 1 (2) 01 10bb bfff ffff 3
BTFSS f, b Bit Test f, Skip if Set 1 (2) 01 11bb bfff ffff 3

LITERAL AND CONTROL OPERATIONS

ADDLW k Add literal and W 1 11 111x kkkk kkkk C,DC,Z

ANDLW k AND literal with W 1 11 1001 kkkk kkkk Z
CALL k Call subroutine 2 10 0kkk kkkk kkkk
CLRWDT - Clear Watchdog Timer 1 00 0000 0110 0100 TO,PD
GOTO k Go to address 2 10 1kkk kkkk kkkk
IORLW k Inclusive OR literal with W 1 11 1000 kkkk kkkk Z
MOVLW k Move literal to W 1 11 00xx kkkk kkkk
RETFIE - Return from interrupt 2 00 0000 0000 1001
RETLW k Return with literal in W 2 11 01xx kkkk kkkk
RETURN - Return from Subroutine 2 00 0000 0000 1000
SLEEP - Go into standby mode 1 00 0000 0110 0011 TO,PD
SUBLW k Subtract W from literal 1 11 110x kkkk kkkk C,DC,Z
XORLW k Exclusive OR literal with W 1 11 1010 kkkk kkkk Z
Note 1: When an I/O register is modified as a function of itself ( e.g., MOVF PORTB, 1), the value used will be that value present
on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven low by an external
device, the data will be written back with a '0'.
2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned
to the Timer0 Module.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.

DS30444E - page 120  1997 Microchip Technology Inc.

 PIC16C9XX
15.1 Instruction Descriptions

ADDLW Add Literal and W ADDWF Add W and f

Syntax: [label] ADDLW k Syntax: [label] ADDWF f,d

Operands: 0 ≤ k ≤ 255 Operands: 0 ≤ f ≤ 127

d ∈ [0,1]
Operation: (W) + k → (W)
Operation: (W) + (f) → (destination)
Status Affected: C, DC, Z
11 111x kkkk kkkk
Status Affected: C, DC, Z
Encoding:
Encoding: 00 0111 dfff ffff
Description: The contents of the W register are
added to the eight bit literal 'k' and the Description: Add the contents of the W register with
result is placed in the W register. register 'f'. If 'd' is 0 the result is stored
in the W register. If 'd' is 1 the result is
Words: 1 stored back in register 'f'.
Cycles: 1 Words: 1
Q Cycle Activity: Q1 Q2 Q3 Q4 Cycles: 1
Decode Read Process Write to
literal 'k' data W Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read Process Write to
register data destination
Example: ADDLW 0x15 'f'

Before Instruction
W = 0x10 Example ADDWF FSR, 0
After Instruction
W = 0x25 Before Instruction
W = 0x17
FSR = 0xC2
After Instruction
W = 0xD9
FSR = 0xC2

 1997 Microchip Technology Inc. DS30444E - page 121

PIC16C9XX

ANDWF AND W with f

ANDLW AND Literal with W
Syntax: [label] ANDWF f,d
Syntax: [label] ANDLW k
Operands: 0 ≤ f ≤ 127
Operands: 0 ≤ k ≤ 255
d ∈ [0,1]
Operation: (W) .AND. (k) → (W)
Operation: (W) .AND. (f) → (destination)
Status Affected: Z
Status Affected: Z
Encoding: 11 1001 kkkk kkkk
Encoding: 00 0101 dfff ffff
Description: The contents of W register are
Description: AND the W register with register 'f'. If 'd'
AND’ed with the eight bit literal 'k'. The
is 0 the result is stored in the W regis-
result is placed in the W register.
ter. If 'd' is 1 the result is stored back in
Words: 1 register 'f'.

Cycles: 1 Words: 1
Q Cycle Activity: Q1 Q2 Q3 Q4 Cycles: 1
Decode Read Process Write to Q Cycle Activity: Q1 Q2 Q3 Q4
literal "k" data W
Decode Read Process Write to
register data destination
ANDLW 0x5F 'f'
Example
Before Instruction
Example ANDWF FSR, 1
W = 0xA3
After Instruction Before Instruction
W = 0x03
W = 0x17
FSR = 0xC2
After Instruction
W = 0x17
FSR = 0x02

BCF Bit Clear f

Syntax: [label] BCF f,b
Operands: 0 ≤ f ≤ 127
0≤b≤7
Operation: 0 → (f<b>)
Status Affected: None
Encoding: 01 00bb bfff ffff

Description: Bit 'b' in register 'f' is cleared.

Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read Process Write
register data register 'f'
'f'

Example BCF FLAG_REG, 7

Before Instruction
FLAG_REG = 0xC7
After Instruction
FLAG_REG = 0x47

DS30444E - page 122  1997 Microchip Technology Inc.

 PIC16C9XX

BSF Bit Set f BTFSC Bit Test, Skip if Clear

Syntax: [label] BSF f,b Syntax: [label] BTFSC f,b

Operands: 0 ≤ f ≤ 127 Operands: 0 ≤ f ≤ 127

0≤b≤7 0≤b≤7

Operation: 1 → (f<b>) Operation: skip if (f<b>) = 0

Status Affected: None Status Affected: None

Encoding: 01 01bb bfff ffff Encoding: 01 10bb bfff ffff

Description: Bit 'b' in register 'f' is set. Description: If bit 'b' in register 'f' is '1' then the next
instruction is executed.
Words: 1 If bit 'b', in register 'f', is '0' then the next
instruction is discarded, and a NOP is
Cycles: 1 executed instead, making this a 2TCY
Q Cycle Activity: Q1 Q2 Q3 Q4 instruction.

Decode Read Process Write Words: 1

register data register 'f'
'f' Cycles: 1(2)
Q Cycle Activity: Q1 Q2 Q3 Q4
Example BSF FLAG_REG, 7
Decode Read Process No-
register 'f' data Operation
Before Instruction
FLAG_REG = 0x0A If Skip: (2nd Cycle)
After Instruction
FLAG_REG = 0x8A Q1 Q2 Q3 Q4
No- No- No- No-
Operation Operation Operation Operation

Example HERE BTFSC FLAG,1

FALSE GOTO PROCESS_CODE
TRUE •
•
•

Before Instruction
PC = address HERE
After Instruction
if FLAG<1> = 0,
PC = address TRUE
if FLAG<1>=1,
PC = address FALSE

 1997 Microchip Technology Inc. DS30444E - page 123

PIC16C9XX

BTFSS Bit Test f, Skip if Set CALL Call Subroutine

Syntax: [label] BTFSS f,b Syntax: [ label ] CALL k
Operands: 0 ≤ f ≤ 127 Operands: 0 ≤ k ≤ 2047
0≤b<7
Operation: (PC)+ 1→ TOS,
Operation: skip if (f<b>) = 1 k → PC<10:0>,
(PCLATH<4:3>) → PC<12:11>
Status Affected: None
01 11bb bfff ffff Status Affected: None
Encoding:
Encoding: 10 0kkk kkkk kkkk
Description: If bit 'b' in register 'f' is '0' then the next
instruction is executed.
If bit 'b' is '1', then the next instruction is Description: Call Subroutine. First, return address
(PC+1) is pushed onto the stack. The
discarded and a NOP is executed eleven bit immediate address is loaded
instead, making this a 2TCY instruction. into PC bits <10:0>. The upper bits of
the PC are loaded from PCLATH. CALL
Words: 1 is a two cycle instruction.
Cycles: 1(2) Words: 1
Q Cycle Activity: Q1 Q2 Q3 Q4 Cycles: 2
Decode Read Process No-
register 'f' data Operation
Q Cycle Activity: Q1 Q2 Q3 Q4
1st Cycle Decode Read Process Write to
If Skip: (2nd Cycle) literal 'k', data PC
Push PC
Q1 Q2 Q3 Q4 to Stack
No- No- No- No- 2nd Cycle No- No- No- No-
Operation Operation Operation Operation Operation Operation Operation Operation

Example HERE BTFSC FLAG,1 HERE CALL

Example THERE
FALSE GOTO PROCESS_CODE
TRUE • Before Instruction
• PC = Address HERE
• After Instruction
Before Instruction PC = Address THERE
TOS = Address HERE+1
PC = address HERE
After Instruction
if FLAG<1> = 0,
PC = address FALSE
if FLAG<1> = 1,
PC = address TRUE

DS30444E - page 124  1997 Microchip Technology Inc.

 PIC16C9XX

CLRF Clear f CLRW Clear W

Syntax: [label] CLRF f Syntax: [ label ] CLRW
Operands: 0 ≤ f ≤ 127 Operands: None
Operation: 00h → (f) Operation: 00h → (W)
1→Z 1→Z
Status Affected: Z Status Affected: Z
Encoding: 00 0001 1fff ffff
Encoding: 00 0001 0xxx xxxx
Description: The contents of register 'f' are cleared
Description: W register is cleared. Zero bit (Z) is
and the Z bit is set. set.
Words: 1 Words: 1
Cycles: 1 Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4 Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read Process Write
Decode No- Process Write to
register data register 'f'
Operation data W
'f'

Example CLRW
Example CLRF FLAG_REG

Before Instruction Before Instruction

W = 0x5A
FLAG_REG = 0x5A
After Instruction After Instruction
W = 0x00
FLAG_REG = 0x00
Z = 1
Z = 1

 1997 Microchip Technology Inc. DS30444E - page 125

PIC16C9XX

COMF Complement f
CLRWDT Clear Watchdog Timer
Syntax: [ label ] COMF f,d
Syntax: [ label ] CLRWDT
Operands: 0 ≤ f ≤ 127
Operands: None
d ∈ [0,1]
Operation: 00h → WDT
Operation: (f) → (destination)
0 → WDT prescaler,
1 → TO Status Affected: Z
1 → PD 00 1001 dfff ffff
Encoding:
Status Affected: TO, PD
Description: The contents of register 'f' are comple-
Encoding: 00 0000 0110 0100 mented. If 'd' is 0 the result is stored in
W. If 'd' is 1 the result is stored back in
register 'f'.
Description: CLRWDT instruction resets the Watch-
dog Timer. It also resets the prescaler
of the WDT. Status bits TO and PD are Words: 1
set.
Cycles: 1
Words: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Cycles: 1
Decode Read Process Write to
register data destination
Q Cycle Activity: Q1 Q2 Q3 Q4 'f'
Decode No- Process Clear
Operation data WDT
Counter Example COMF REG1,0

Before Instruction
Example CLRWDT REG1 = 0x13
After Instruction
Before Instruction REG1 = 0x13
WDT counter = ? W = 0xEC
After Instruction
WDT counter = 0x00
DECF Decrement f
WDT prescaler= 0
TO = 1 Syntax: [label] DECF f,d
PD = 1
Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (f) - 1 → (destination)
Status Affected: Z
Encoding: 00 0011 dfff ffff

Description: Decrement register 'f'. If 'd' is 0 the

result is stored in the W register. If 'd' is
1 the result is stored back in register 'f'.

Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read Process Write to
register data destination
'f'

Example DECF CNT, 1

Before Instruction
CNT = 0x01
Z = 0
After Instruction
CNT = 0x00
Z = 1

DS30444E - page 126  1997 Microchip Technology Inc.

 PIC16C9XX

DECFSZ Decrement f, Skip if 0 GOTO Unconditional Branch

Syntax: [ label ] DECFSZ f,d Syntax: [ label ] GOTO k
Operands: 0 ≤ f ≤ 127 Operands: 0 ≤ k ≤ 2047
d ∈ [0,1]
Operation: k → PC<10:0>
Operation: (f) - 1 → (destination); PCLATH<4:3> → PC<12:11>
skip if result = 0
Status Affected: None
Status Affected: None 10 1kkk kkkk kkkk
Encoding:
Encoding: 00 1011 dfff ffff
Description: GOTO is an unconditional branch. The
Description: The contents of register 'f' are decre- eleven bit immediate value is loaded
mented. If 'd' is 0 the result is placed in the into PC bits <10:0>. The upper bits of
W register. If 'd' is 1 the result is placed PC are loaded from PCLATH<4:3>.
back in register 'f'. GOTO is a two cycle instruction.
If the result is 1, the next instruction, is
executed. If the result is 0, then a NOP is Words: 1
executed instead making it a 2TCY instruc-
tion. Cycles: 2
Words: 1 Q Cycle Activity: Q1 Q2 Q3 Q4
Cycles: 1(2) 1st Cycle Decode Read Process Write to
literal 'k' data PC
Q Cycle Activity: Q1 Q2 Q3 Q4
2nd Cycle No- No- No- No-
Operation Operation Operation Operation
Decode Read Process Write to
register 'f' data destination

If Skip: (2nd Cycle) Example GOTO THERE

Q1 Q2 Q3 Q4 After Instruction
No- No- No- No-
PC = Address THERE
Operation Operation Operation Operation

Example HERE DECFSZ CNT, 1

GOTO LOOP
CONTINUE •
•
•

Before Instruction
PC = address HERE
After Instruction
CNT = CNT - 1
if CNT = 0,
PC = address CONTINUE
if CNT ≠ 0,
PC = address HERE+1

 1997 Microchip Technology Inc. DS30444E - page 127

PIC16C9XX

INCF Increment f INCFSZ Increment f, Skip if 0

Syntax: [ label ] INCF f,d Syntax: [ label ] INCFSZ f,d
Operands: 0 ≤ f ≤ 127 Operands: 0 ≤ f ≤ 127
d ∈ [0,1] d ∈ [0,1]
Operation: (f) + 1 → (destination) Operation: (f) + 1 → (destination),
skip if result = 0
Status Affected: Z
00 1010 dfff ffff Status Affected: None
Encoding:
Encoding: 00 1111 dfff ffff
Description: The contents of register 'f' are incre-
mented. If 'd' is 0 the result is placed in Description: The contents of register 'f' are incre-
the W register. If 'd' is 1 the result is mented. If 'd' is 0 the result is placed in
placed back in register 'f'. the W register. If 'd' is 1 the result is
placed back in register 'f'.
Words: 1 If the result is 1, the next instruction is
executed. If the result is 0, a NOP is
executed instead making it a 2TCY
Cycles: 1 instruction.
Q Cycle Activity: Q1 Q2 Q3 Q4 Words: 1
Decode Read Process Write to
register data destination Cycles: 1(2)
'f'
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read Process Write to
Example INCF CNT, 1 register 'f' data destination

Before Instruction If Skip: (2nd Cycle)

CNT = 0xFF
Z = 0 Q1 Q2 Q3 Q4
After Instruction No- No- No- No-
CNT = 0x00 Operation Operation Operation Operation
Z = 1

Example HERE INCFSZ CNT, 1

GOTO LOOP
CONTINUE •
•
•

Before Instruction
PC = address HERE
After Instruction
CNT = CNT + 1
if CNT= 0,
PC = address CONTINUE
if CNT≠ 0,
PC = address HERE +1

DS30444E - page 128  1997 Microchip Technology Inc.

 PIC16C9XX

IORLW Inclusive OR Literal with W IORWF Inclusive OR W with f

Syntax: [ label ] IORLW k Syntax: [ label ] IORWF f,d
Operands: 0 ≤ k ≤ 255 Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (W) .OR. k → (W)
Operation: (W) .OR. (f) → (destination)
Status Affected: Z
11 1000 kkkk kkkk Status Affected: Z
Encoding:
Encoding: 00 0100 dfff ffff
Description: The contents of the W register is
OR’ed with the eight bit literal 'k'. The Description: Inclusive OR the W register with regis-
result is placed in the W register. ter 'f'. If 'd' is 0 the result is placed in the
W register. If 'd' is 1 the result is placed
Words: 1 back in register 'f'.

Cycles: 1 Words: 1

Q Cycle Activity: Q1 Q2 Q3 Q4 Cycles: 1

Decode Read Process Write to Q Cycle Activity: Q1 Q2 Q3 Q4
literal 'k' data W
Decode Read Process Write to
register data destination
'f'
Example IORLW 0x35

Before Instruction IORWF

W = 0x9A
Example RESULT, 0
After Instruction Before Instruction
W = 0xBF RESULT = 0x13
Z = 1 W = 0x91
After Instruction
RESULT = 0x13
W = 0x93
Z = 1

 1997 Microchip Technology Inc. DS30444E - page 129

PIC16C9XX

MOVF Move f MOVWF Move W to f

Syntax: [ label ] MOVF f,d Syntax: [ label ] MOVWF f
Operands: 0 ≤ f ≤ 127 Operands: 0 ≤ f ≤ 127
d ∈ [0,1]
Operation: (W) → (f)
Operation: (f) → (destination)
Status Affected: None
Status Affected: Z 00 0000 1fff ffff
Encoding:
Encoding: 00 1000 dfff ffff
Description: Move data from W register to register
Description: The contents of register f is moved to a 'f'.
destination dependant upon the status
of d. If d = 0, destination is W register. If Words: 1
d = 1, the destination is file register f
Cycles: 1
itself. d = 1 is useful to test a file regis-
ter since status flag Z is affected. Q Cycle Activity: Q1 Q2 Q3 Q4
Words: 1 Decode Read Process Write
register data register 'f'
Cycles: 1 'f'

Q Cycle Activity: Q1 Q2 Q3 Q4
Example MOVWF OPTION_REG
Decode Read Process Write to
register data destination
'f' Before Instruction
OPTION = 0xFF
W = 0x4F
Example MOVF FSR, 0 After Instruction
OPTION = 0x4F
After Instruction W = 0x4F
W = value in FSR register
Z =1

MOVLW Move Literal to W

Syntax: [ label ] MOVLW k
Operands: 0 ≤ k ≤ 255
Operation: k → (W)
Status Affected: None
Encoding: 11 00xx kkkk kkkk

Description: The eight bit literal 'k' is loaded into W

register. The don’t cares will assemble
as 0’s.

Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read Process Write to
literal 'k' data W

Example MOVLW 0x5A

After Instruction
W = 0x5A

DS30444E - page 130  1997 Microchip Technology Inc.

 PIC16C9XX

NOP No Operation RETFIE Return from Interrupt

Syntax: [ label ] NOP Syntax: [ label ] RETFIE
Operands: None Operands: None
Operation: No operation Operation: TOS → PC,
1 → GIE
Status Affected: None
00 0000 0xx0 0000 Status Affected: None
Encoding:
Encoding: 00 0000 0000 1001
Description: No operation.
Description: Return from Interrupt. Stack is POPed
Words: 1 and Top of Stack (TOS) is loaded in the
Cycles: 1 PC. Interrupts are enabled by setting
Global Interrupt Enable bit, GIE
Q Cycle Activity: Q1 Q2 Q3 Q4 (INTCON<7>). This is a two cycle
instruction.
Decode No- No- No-
Operation Operation Operation Words: 1
Cycles: 2
Example NOP
Q Cycle Activity: Q1 Q2 Q3 Q4
1st Cycle Decode No- Set the Pop from
Operation GIE bit the Stack

2nd Cycle No- No- No- No-

Operation Operation Operation Operation

Example RETFIE

After Interrupt
PC = TOS
GIE = 1
OPTION Load Option Register
Syntax: [ label ] OPTION
Operands: None
Operation: (W) → OPTION
Status Affected: None
Encoding: 00 0000 0110 0010

Description: The contents of the W register are

loaded in the OPTION register. This
instruction is supported for code com-
patibility with PIC16C5X products.
Since OPTION is a readable/writable
register, the user can directly address
it.
Words: 1
Cycles: 1
Example
To maintain upward compatibility
with future PIC16CXX products, do
not use this instruction.

 1997 Microchip Technology Inc. DS30444E - page 131

PIC16C9XX

RETLW Return with Literal in W RETURN Return from Subroutine

Syntax: [ label ] RETLW k Syntax: [ label ] RETURN
Operands: 0 ≤ k ≤ 255 Operands: None
Operation: k → (W); Operation: TOS → PC
TOS → PC
Status Affected: None
Status Affected: None 00 0000 0000 1000
Encoding:
Encoding: 11 01xx kkkk kkkk
Description: Return from subroutine. The stack is
Description: The W register is loaded with the eight POPed and the top of the stack (TOS)
bit literal 'k'. The program counter is is loaded into the program counter. This
loaded from the top of the stack (the is a two cycle instruction.
return address). This is a two cycle
instruction.
Words: 1

Words: 1 Cycles: 2

Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4

Q Cycle Activity: Q1 Q2 Q3 Q4 1st Cycle Decode No- No- Pop from

Operation Operation the Stack

1st Cycle Decode Read No- Write to W, 2nd Cycle No- No- No- No-
literal 'k' Operation Pop from Operation Operation Operation Operation
the Stack

2nd Cycle No- No- No- No-

RETURN
Operation Operation Operation Operation Example
After Interrupt
Example CALL TABLE ;W contains table PC = TOS
;offset value
• ;W now has table value
•
•
TABLE ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
•
•
•
RETLW kn ; End of table

Before Instruction
W = 0x07
After Instruction
W = value of k8

DS30444E - page 132  1997 Microchip Technology Inc.

 PIC16C9XX

RLF Rotate Left f through Carry RRF Rotate Right f through Carry
Syntax: [ label ] RLF f,d Syntax: [ label ] RRF f,d
Operands: 0 ≤ f ≤ 127 Operands: 0 ≤ f ≤ 127
d ∈ [0,1] d ∈ [0,1]
Operation: See description below Operation: See description below
Status Affected: C Status Affected: C
Encoding: 00 1101 dfff ffff Encoding: 00 1100 dfff ffff

Description: The contents of register 'f' are rotated Description: The contents of register 'f' are rotated
one bit to the left through the Carry one bit to the right through the Carry
Flag. If 'd' is 0 the result is placed in the Flag. If 'd' is 0 the result is placed in the
W register. If 'd' is 1 the result is stored W register. If 'd' is 1 the result is placed
back in register 'f'. back in register 'f'.
C Register f C Register f

Words: 1 Words: 1
Cycles: 1 Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4 Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read Process Write to Decode Read Process Write to
register data destination register data destination
'f' 'f'

Example RLF REG1,0 RRF

Example REG1,0

Before Instruction Before Instruction

REG1 = 1110 0110 REG1 = 1110 0110
C = 0 C = 0
After Instruction After Instruction
REG1 = 1110 0110 REG1 = 1110 0110
W = 1100 1100 W = 0111 0011
C = 1 C = 0

 1997 Microchip Technology Inc. DS30444E - page 133

PIC16C9XX

SLEEP SUBLW Subtract W from Literal

Syntax: [ label ] SLEEP Syntax: [ label ] SUBLW k

Operands: None Operands: 0 ≤ k ≤ 255

Operation: 00h → WDT, Operation: k - (W) → (W)

0 → WDT prescaler, Status Affected: C, DC, Z
1 → TO,
0 → PD Encoding: 11 110x kkkk kkkk
Status Affected: TO, PD Description: The W register is subtracted (2’s comple-
ment method) from the eight bit literal 'k'.
Encoding: 00 0000 0110 0011 The result is placed in the W register.
Description: The power-down status bit, PD is Words: 1
cleared. Time-out status bit, TO is
set. Watchdog Timer and its pres- Cycles: 1
caler are cleared.
The processor is put into SLEEP
Q Cycle Activity: Q1 Q2 Q3 Q4
mode with the oscillator stopped. See Decode Read Process Write to W
Section 14.8 for more details. literal 'k' data

Words: 1
Example 1: SUBLW 0x02
Cycles: 1
Before Instruction
Q Cycle Activity: Q1 Q2 Q3 Q4
W = 1
Decode No- No- Go to
C = ?
Operation Operation Sleep
Z = ?

After Instruction
Example: SLEEP
W = 1
C = 1; result is positive
Z = 0

Example 2: Before Instruction

W = 2
C = ?
Z = ?

After Instruction
W = 0
C = 1; result is zero
Z = 1

Example 3: Before Instruction

W = 3
C = ?
Z = ?

After Instruction
W = 0xFF
C = 0; result is nega-
tive
Z = 0

DS30444E - page 134  1997 Microchip Technology Inc.

 PIC16C9XX

SUBWF Subtract W from f SWAPF Swap Nibbles in f

Syntax: [ label ] SUBWF f,d Syntax: [ label ] SWAPF f,d
Operands: 0 ≤ f ≤ 127 Operands: 0 ≤ f ≤ 127
d ∈ [0,1] d ∈ [0,1]
Operation: (f) - (W) → (destination) Operation: (f<3:0>) → (destination<7:4>),
(f<7:4>) → (destination<3:0>)
Status Affected: C, DC, Z
Status Affected: None
Encoding: 00 0010 dfff ffff
Encoding: 00 1110 dfff ffff
Description: Subtract (2’s complement method) W reg-
ister from register 'f'. If 'd' is 0 the result is Description: The upper and lower nibbles of register
stored in the W register. If 'd' is 1 the 'f' are exchanged. If 'd' is 0 the result is
result is stored back in register 'f'. placed in W register. If 'd' is 1 the result
is placed in register 'f'.
Words: 1
Words: 1
Cycles: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read Process Write to
Q Cycle Activity: Q1 Q2 Q3 Q4
register 'f' data destination
Decode Read Process Write to
register 'f' data destination

Example 1: SUBWF REG1,1

Example SWAPF REG, 0
Before Instruction
REG1 = 3 Before Instruction
W = 2 REG1 = 0xA5
C = ?
Z = ? After Instruction
After Instruction REG1 = 0xA5
W = 0x5A
REG1 = 1
W = 2
C = 1; result is positive
Z = 0

Example 2: Before Instruction TRIS Load TRIS Register

REG1 = 2
Syntax: [label] TRIS f
W = 2
C = ? Operands: 5≤f≤7
Z = ?
Operation: (W) → TRIS register f;
After Instruction
Status Affected: None
REG1 = 0
Encoding: 00 0000 0110 0fff
W = 2
C = 1; result is zero Description: The instruction is supported for code
Z = 1 compatibility with the PIC16C5X prod-
Example 3: Before Instruction ucts. Since TRIS registers are read-
able and writable, the user can directly
REG1 = 1 address them.
W = 2
C = ? Words: 1
Z = ? Cycles: 1
After Instruction Example
REG1 = 0xFF To maintain upward compatibility
W = 2 with future PIC16CXX products, do
C = 0; result is negative not use this instruction.
Z = 0

 1997 Microchip Technology Inc. DS30444E - page 135

PIC16C9XX

XORLW Exclusive OR Literal with W XORWF Exclusive OR W with f

Syntax: [label] XORLW k Syntax: [label] XORWF f,d

Operands: 0 ≤ k ≤ 255 Operands: 0 ≤ f ≤ 127

d ∈ [0,1]
Operation: (W) .XOR. k → (W)
Operation: (W) .XOR. (f) → (destination)
Status Affected: Z
Status Affected: Z
Encoding: 11 1010 kkkk kkkk
Encoding: 00 0110 dfff ffff
Description: The contents of the W register are
XOR’ed with the eight bit literal 'k'. Description: Exclusive OR the contents of the W
The result is placed in the W regis- register with register 'f'. If 'd' is 0 the
ter. result is stored in the W register. If 'd' is
1 the result is stored back in register 'f'.
Words: 1
Words: 1
Cycles: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read Process Write to
literal 'k' data W Decode Read Process Write to
register data destination
'f'
Example: XORLW 0xAF
Before Instruction Example XORWF REG 1
W = 0xB5 Before Instruction
After Instruction REG = 0xAF
W = 0xB5
W = 0x1A
After Instruction
REG = 0x1A
W = 0xB5

DS30444E - page 136  1997 Microchip Technology Inc.

 PIC16C9XX
16.0 DEVELOPMENT SUPPORT 16.3 ICEPIC: Low-Cost PIC16CXXX
In-Circuit Emulator
16.1 Development Tools
ICEPIC is a low-cost in-circuit emulator solution for the
The PICmicrο microcontrollers are supported with a Microchip PIC16C5X and PIC16CXXX families of 8-bit
full range of hardware and software development tools: OTP microcontrollers.
• PICMASTER/PICMASTER CE Real-Time ICEPIC is designed to operate on PC-compatible
In-Circuit Emulator machines ranging from 286-AT through Pentium
• ICEPIC Low-Cost PIC16C5X and PIC16CXXX based machines under Windows 3.x environment.
In-Circuit Emulator ICEPIC features real time, non-intrusive emulation.
• PRO MATE II Universal Programmer
16.4 PRO MATE II: Universal Programmer
• PICSTART Plus Entry-Level Prototype
Programmer The PRO MATE II Universal Programmer is a full-fea-
• PICDEM-1 Low-Cost Demonstration Board tured programmer capable of operating in stand-alone
• PICDEM-2 Low-Cost Demonstration Board mode as well as PC-hosted mode.
• PICDEM-3 Low-Cost Demonstration Board The PRO MATE II has programmable VDD and VPP
• MPASM Assembler supplies which allows it to verify programmed memory
at VDD min and VDD max for maximum reliability. It has
• MPLAB SIM Software Simulator
an LCD display for displaying error messages, keys to
• MPLAB-C (C Compiler) enter commands and a modular detachable socket
• Fuzzy Logic Development System assembly to support various package types. In stand-
(fuzzyTECH−MP) alone mode the PRO MATE II can read, verify or pro-
gram PIC12CXXX, PIC14C000, PIC16C5X,
16.2 PICMASTER: High Performance PIC16CXXX and PIC17CXX devices. It can also set
Universal In-Circuit Emulator with configuration and code-protect bits in this mode.
MPLAB IDE
16.5 PICSTART Plus Entry Level
The PICMASTER Universal In-Circuit Emulator is Development System
intended to provide the product development engineer
with a complete microcontroller design tool set for all The PICSTART programmer is an easy-to-use, low-
microcontrollers in the PIC12CXXX, PIC14C000, cost prototype programmer. It connects to the PC via
PIC16C5X, PIC16CXXX and PIC17CXX families. one of the COM (RS-232) ports. MPLAB Integrated
PICMASTER is supplied with the MPLAB Integrated Development Environment software makes using the
Development Environment (IDE), which allows editing, programmer simple and efficient. PICSTART Plus is not
“make” and download, and source debugging from a recommended for production programming.
single environment.
PICSTART Plus supports all PIC12CXXX, PIC14C000,
Interchangeable target probes allow the system to be PIC16C5X, PIC16CXXX and PIC17CXX devices with
easily reconfigured for emulation of different proces- up to 40 pins. Larger pin count devices such as the
sors. The universal architecture of the PICMASTER PIC16C923 and PIC16C924 may be supported with an
allows expansion to support all new Microchip micro- adapter socket.
controllers.
The PICMASTER Emulator System has been designed
as a real-time emulation system with advanced fea-
tures that are generally found on more expensive devel-
opment tools. The PC compatible 386 (and higher)
machine platform and Microsoft Windows 3.x environ-
ment were chosen to best make these features avail-
able to you, the end user.
A CE compliant version of PICMASTER is available for
European Union (EU) countries.

 1997 Microchip Technology Inc. DS30444E - page 137

PIC16C9XX
16.6 PICDEM-1 Low-Cost PICmicro an RS-232 interface, push-button switches, a potenti-
Demonstration Board ometer for simulated analog input, a thermistor and
separate headers for connection to an external LCD
The PICDEM-1 is a simple board which demonstrates module and a keypad. Also provided on the PICDEM-3
the capabilities of several of Microchip’s microcontrol- board is an LCD panel, with 4 commons and 12 seg-
lers. The microcontrollers supported are: PIC16C5X ments, that is capable of displaying time, temperature
(PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, and day of the week. The PICDEM-3 provides an addi-
PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and tional RS-232 interface and Windows 3.1 software for
PIC17C44. All necessary hardware and software is showing the demultiplexed LCD signals on a PC. A sim-
included to run basic demo programs. The users can ple serial interface allows the user to construct a hard-
program the sample microcontrollers provided with ware demultiplexer for the LCD signals.
the PICDEM-1 board, on a PRO MATE II or
PICSTART-Plus programmer, and easily test firm- 16.9 MPLAB™ Integrated Development
ware. The user can also connect the PICDEM-1 Environment Software
board to the PICMASTER emulator and download
the firmware to the emulator for testing. Additional pro- The MPLAB IDE Software brings an ease of software
totype area is available for the user to build some addi- development previously unseen in the 8-bit microcon-
tional hardware and connect it to the microcontroller troller market. MPLAB is a windows based application
socket(s). Some of the features include an RS-232 which contains:
interface, a potentiometer for simulated analog input, • A full featured editor
push-button switches and eight LEDs connected to • Three operating modes
PORTB. - editor
- emulator
16.7 PICDEM-2 Low-Cost PIC16CXX - simulator
Demonstration Board • A project manager
• Customizable tool bar and key mapping
The PICDEM-2 is a simple demonstration board that
• A status bar with project information
supports the PIC16C62, PIC16C64, PIC16C65,
• Extensive on-line help
PIC16C73 and PIC16C74 microcontrollers. All the
necessary hardware and software is included to MPLAB allows you to:
run the basic demonstration programs. The user • Edit your source files (either assembly or ‘C’)
can program the sample microcontrollers provided • One touch assemble (or compile) and download
with the PICDEM-2 board, on a PRO MATE II pro- to PICmicro tools (automatically updates all
grammer or PICSTART-Plus, and easily test firmware. project information)
The PICMASTER emulator may also be used with the • Debug using:
PICDEM-2 board to test firmware. Additional prototype - source files
area has been provided to the user for adding addi- - absolute listing file
tional hardware and connecting it to the microcontroller • Transfer data dynamically via DDE (soon to be
socket(s). Some of the features include a RS-232 inter- replaced by OLE)
face, push-button switches, a potentiometer for simu- • Run up to four emulators on the same PC
lated analog input, a Serial EEPROM to demonstrate
The ability to use MPLAB with Microchip’s simulator
usage of the I2C bus and separate headers for connec-
allows a consistent platform and the ability to easily
tion to an LCD module and a keypad.
switch from the low cost simulator to the full featured
16.8 PICDEM-3 Low-Cost PIC16CXXX emulator with minimal retraining due to development
Demonstration Board tools.

The PICDEM-3 is a simple demonstration board that 16.10 Assembler (MPASM)

supports the PIC16C923 and PIC16C924 in the PLCC
The MPASM Universal Macro Assembler is a PC-
package. It will also support future 44-pin PLCC
hosted symbolic assembler. It supports all microcon-
microcontrollers with a LCD Module. All the neces-
troller series including the PIC12C5XX, PIC14000,
sary hardware and software is included to run the
PIC16C5X, PIC16CXXX, and PIC17CXX families.
basic demonstration programs. The user can pro-
gram the sample microcontrollers provided with MPASM offers full featured Macro capabilities, condi-
the PICDEM-3 board, on a PRO MATE II program- tional assembly, and several source and listing formats.
mer or PICSTART Plus with an adapter socket, and It generates various object code formats to support
easily test firmware. The PICMASTER emulator may Microchip's development tools as well as third party
also be used with the PICDEM-3 board to test firmware. programmers.
Additional prototype area has been provided to the MPASM allows full symbolic debugging from
user for adding hardware and connecting it to the PICMASTER, Microchip’s Universal Emulator System.
microcontroller socket(s). Some of the features include

DS30444E - page 138  1997 Microchip Technology Inc.

 PIC16C9XX
MPASM has the following features to assist in develop- 16.14 MP-DriveWay – Application Code
ing software for specific use applications. Generator
• Provides translation of Assembler source code to
MP-DriveWay is an easy-to-use Windows-based Appli-
object code for all Microchip microcontrollers.
cation Code Generator. With MP-DriveWay you can
• Macro assembly capability. visually configure all the peripherals in a PICmicro
• Produces all the files (Object, Listing, Symbol, device and, with a click of the mouse, generate all the
and special) required for symbolic debug with initialization and many functional code modules in C
Microchip’s emulator systems. language. The output is fully compatible with Micro-
• Supports Hex (default), Decimal and Octal source chip’s MPLAB-C C compiler. The code produced is
and listing formats. highly modular and allows easy integration of your own
MPASM provides a rich directive language to support code. MP-DriveWay is intelligent enough to maintain
programming of the PICmicro. Directives are helpful in your code through subsequent code generation.
making the development of your assemble source code
16.15 SEEVAL Evaluation and
shorter and more maintainable.
Programming System
16.11 Software Simulator (MPLAB-SIM)
The SEEVAL SEEPROM Designer’s Kit supports all
The MPLAB-SIM Software Simulator allows code Microchip 2-wire and 3-wire Serial EEPROMs. The kit
development in a PC host environment. It allows the includes everything necessary to read, write, erase or
user to simulate the PICmicro series microcontrollers program special features of any Microchip SEEPROM
on an instruction level. On any given instruction, the product including Smart Serials and secure serials.
user may examine or modify any of the data areas or The Total Endurance Disk is included to aid in trade-
provide external stimulus to any of the pins. The input/ off analysis and reliability calculations. The total kit can
output radix can be set by the user and the execution significantly reduce time-to-market and result in an opti-
can be performed in; single step, execute until break, or mized system.
in a trace mode.
16.16 KEELOQ Evaluation and
MPLAB-SIM fully supports symbolic debugging using Programming Tools
MPLAB-C and MPASM. The Software Simulator offers
the low cost flexibility to develop and debug code out- KEELOQ evaluation and programming tools support
side of the laboratory environment making it an excel- Microchips HCS Secure Data Products. The HCS eval-
lent multi-project software development tool. uation kit includes an LCD display to show changing
codes, a decoder to decode transmissions, and a pro-
16.12 C Compiler (MPLAB-C) gramming interface to program test transmitters.
The MPLAB-C Code Development System is a
complete ‘C’ compiler and integrated development
environment for Microchip’s PICmicro family of micro-
controllers. The compiler provides powerful integration
capabilities and ease of use not found with other
compilers.
For easier source level debugging, the compiler pro-
vides symbol information that is compatible with the
MPLAB IDE memory display.

16.13 Fuzzy Logic Development System

(fuzzyTECH-MP)
fuzzyTECH-MP fuzzy logic development tool is avail-
able in two versions - a low cost introductory version,
MP Explorer, for designers to gain a comprehensive
working knowledge of fuzzy logic system design; and a
full-featured version, fuzzyTECH-MP, edition for imple-
menting more complex systems.
Both versions include Microchip’s fuzzyLAB demon-
stration board for hands-on experience with fuzzy logic
systems implementation.

 1997 Microchip Technology Inc. DS30444E - page 139

 24CXX HCS200
PIC12C5XX PIC14000 PIC16C5X PIC16CXXX PIC16C6X PIC16C7XX PIC16C8X PIC16C9XX PIC17C4X PIC17C75X 25CXX HCS300
93CXX HCS301
PICMASTER/
PICMASTER-CE Available
TABLE 16-1:

In-Circuit Emulator ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ 3Q97

DS30444E - page 140

ICEPIC Low-Cost
In-Circuit Emulator
✔ ✔ ✔ ✔ ✔ ✔

Emulator Products
MPLAB
PIC16C9XX

Integrated
Development
Environment ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔
MPLAB C
Compiler ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔
fuzzyTECH-MP
Explorer/Edition
Fuzzy Logic
Dev. Tool ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔

Software Tools
MP-DriveWay
Applications
Code Generator ✔ ✔ ✔ ✔ ✔ ✔
Total Endurance
Software Model ✔
PICSTART
DEVELOPMENT TOOLS FROM MICROCHIP

Lite Ultra Low-Cost

Dev. Kit ✔ ✔ ✔ ✔

PICSTART
Plus Low-Cost
Universal Dev. Kit ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔

PRO MATE II
Universal

Programmers
Programmer ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔
KEELOQ
Programmer ✔

SEEVAL
Designers Kit ✔
PICDEM-1 ✔ ✔ ✔ ✔
PICDEM-2 ✔ ✔
PICDEM-3 ✔

Demo Boards

KEELOQ
✔

 1997 Microchip Technology Inc.

Evaluation Kit
 PIC16C9XX
17.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Ambient temperature under bias............................................................................................................ .-55˚C to +125˚C
Storage temperature .............................................................................................................................. -65˚C to +150˚C
Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4).......................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V
Voltage on MCLR with respect to VSS............................................................................................................. 0V to +14V
Voltage on RA4 with respect to Vss ................................................................................................................ 0V to +14V
Total power dissipation (Note 1)................................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD).....................................................................................................................± 20 mA
Output clamp current, IOK (VO < 0 or VO > VDD).............................................................................................................± 20 mA
Maximum output current sunk by any I/O pin .........................................................................................................10 mA
Maximum output current sourced by any I/O pin ...................................................................................................10 mA
Maximum current sunk by all Ports combined ......................................................................................................200 mA
Maximum current sourced by all Ports combined ................................................................................................200 mA
Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOl x IOL)

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.

TABLE 17-1: CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS AND
FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
PIC16C923-04 PIC16C923-08 PIC16LC923-04
OSC CL Devices
PIC16C924-04 PIC16C924-08 PIC16LC924-04
VDD: 4.0V to 6.0V VDD: 4.5V to 5.5V VDD: 2.5V to 6.0V VDD: 2.5V to 6.0V
IDD: 5 mA max. at 5.5V IDD: 2.7 mA typ. at 5.5V IDD: 3.8 mA max. at 3.0V IDD: 5 mA max. at 5.5V
RC
IPD: 21 µA max. at 4V IPD: 1.5 µA typ. at 4V IPD: 5 µA max. at 3V IPD: 21 µA max. at 4V
Freq: 4 MHz max. Freq: 4 MHz max. Freq: 4 MHz max. Freq: 4 MHz max.
VDD: 4.0V to 6.0V VDD: 4.5V to 5.5V VDD: 2.5V to 6.0V VDD: 2.5V to 6.0V
IDD: 5 mA max. at 5.5V IDD: 2.7 mA typ. at 5.5V IDD: 3.8 mA max. at 3.0V IDD: 5 mA max. at 5.5V
XT
IPD: 21 µA max. at 4V IPD: 1.5 µA typ. at 4V IPD: 5 µA max. at 3V IPD: 21 µA max. at 4V
Freq: 4 MHz max. Freq: 4 MHz max. Freq: 4 MHz max. Freq: 4 MHz max.
VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V
IDD: 3.5 mA typ. at 5.5V IDD: 7 mA max. at 5.5V IDD: 7 mA max. at 5.5V
HS Do not use in HS mode
IPD: 1.5 µA typ. at 4.5V IPD: 1.5 µA typ. at 4.5V IPD: 1.5 µA typ. at 4.5V
Freq: 4 MHz max. Freq: 8 MHz max. Freq: 8 MHz max.
VDD: 4.0V to 6.0V VDD: 2.5V to 6.0V
VDD: 2.5V to 6.0V
IDD: 22.5 µA typ. IDD: 30 µA max.
IDD: 30 µA max. at 32 kHz, 3.0V
LP at 32 kHz, 4.0V Do not use in LP mode at 32 kHz, 3.0V
IPD: 5 µA max. at 3.0V
IPD: 1.5 µA typ. at 4.0V IPD: 5 µA max. at 3.0V
Freq: 200 kHz max.
Freq: 200 kHz max. Freq: 200 kHz max.
The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications.
It is recommended that the user select the device type that ensures the specifications required.

 1997 Microchip Technology Inc. DS30444E - page 141

PIC16C9XX
17.1 DC Characteristics: PIC16C923/924-04 (Commercial, Industrial)
PIC16C923/924-08 (Commercial, Industrial)

Standard Operating Conditions (unless otherwise stated)

DC CHARACTERISTICS Operating temperature -40˚C ≤ TA ≤ +85˚C for industrial and
0˚C ≤ TA ≤ +70˚C for commercial
Param Characteristic Sym Min Typ† Max Units Conditions
No.
D001 Supply Voltage VDD 4.0 - 6.0 V XT, RC and LP osc configuration
D001A 4.5 - 5.5 V HS osc configuration
D002* RAM Data Retention VDR - 1.5 - V
Voltage (Note 1)
D003 VDD start voltage to VPOR - VSS - V See Power-on Reset section for details
ensure internal
Power-on Reset signal
D004* VDD rise rate to ensure SVDD 0.05 - - V/ms (Note 6) See Power-on Reset section for
internal Power-on details
Reset signal
D010 Supply Current (Note 2) IDD - 2.7 5 mA XT and RC osc configuration
FOSC = 4 MHz, VDD = 5.5V (Note 4)
D011 - 22.5 48 µA LP osc configuration,
FOSC = 32 kHz, VDD = 4.0V
D012 - 3.5 7 mA HS osc configuration
FOSC = 8 MHz, VDD = 5.5V
D020 Power-down Current IPD - 1.5 21 µA VDD = 4.0V
(Note 3)
Module Differential Cur-
rent (Note 5)
D021 Watchdog Timer ∆IWDT - 6.0 20 µA VDD = 4.0V
D022* LCD Voltage Generation ∆ILCDRC - 40 55 µA VDD = 4.0V (Note 7)
w/internal RC osc
enabled
D024* LCD Voltage Generation ∆ILCDT1 - 33 60 µA VDD = 4.0V (Note 7)
w/Timer1 @ 32.768 kHz
D025* Timer1 oscillator ∆IT1OSC - 10.6 17 µA VDD = 4.0V
D026* A/D Converter ∆IAD - 1.0 - µA A/D on, not converting
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
6: PWRT must be enabled for slow ramps.
7: ∆ΙLCDT1 and ∆ΙLCDRC includes the current consumed by the LCD Module and the voltage generation cir-
cuitry. This does not include current dissipated by the LCD panel.

DS30444E - page 142  1997 Microchip Technology Inc.

 PIC16C9XX
17.2 DC Characteristics: PIC16LC923/924-04 (Commercial, Industrial)

Standard Operating Conditions (unless otherwise stated)

DC CHARACTERISTICS Operating temperature -40˚C ≤ TA ≤ +85˚C for industrial and
0˚C ≤ TA ≤ +70˚C for commercial
Param Characteristic Sym Min Typ† Max Units Conditions
No.
D001 Supply Voltage VDD 2.5 - 6.0 V LP, XT, RC osc configuration
D002* RAM Data Retention VDR - 1.5 - V
Voltage (Note 1)
D003 VDD start voltage to VPOR - VSS - V See Power-on Reset section for details
ensure internal
Power-on Reset signal
D004* VDD rise rate to ensure SVDD 0.05 - - V/ms (Note 6) See Power-on Reset section for
internal Power-on details
Reset signal
D010 Supply Current (Note 2) IDD - 2.0 3.8 mA XT and RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
D011 - 13.5 30 µA LP osc configuration,
FOSC = 32 kHz, VDD = 4.0V
D020 Power-down Current IPD - 0.9 5 µA VDD = 3.0V
(Note 3)
Module Differential Cur-
rent (Note 5)
D021 Watchdog Timer ∆IWDT - 6.0 20 µA VDD = 3.0V
D022* LCD Voltage Generation ∆ILCDRC - 36 50 µA VDD = 3.0V (Note 7)
w/internal RC osc
enabled
D024* LCD Voltage Generation ∆ILCDT1 - 15 29 µA VDD = 3.0V (Note 7)
w/Timer1 @ 32.768 kHz
D025* Timer1 oscillator ∆IT1OSC - 3.1 6.5 µA VDD = 3.0V
D026* A/D Converter ∆IAD - 1.0 - µA A/D on, not converting
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
6: PWRT must be enabled for slow ramps.
7: ∆ΙLCDT1 and ∆ΙLCDRC includes the current consumed by the LCD Module and the voltage generation cir-
cuitry. This does not include current dissipated by the LCD panel.

 1997 Microchip Technology Inc. DS30444E - page 143

PIC16C9XX
17.3 DC Characteristics: PIC16C923/924-04 (Commercial, Industrial)
PIC16C923/924-08 (Commercial, Industrial)
PIC16LC923/924-04 (Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40˚C ≤ TA ≤ +85˚C for industrial and
DC CHARACTERISTICS
0˚C ≤ TA ≤ +70˚C for commercial
Operating voltage VDD range as described in DC spec
Param Characteristic Sym Min Typ Max Units Conditions
No. †
Input Low Voltage
I/O ports VIL
D030 with TTL buffer VSS - 0.15VDD V For entire VDD range
VSS - 0.8V V 4.5V ≤ VDD ≤ 5.5V
D031 with Schmitt Trigger buffer VSS - 0.2VDD V
D032 MCLR, OSC1 (in RC mode) VSS - 0.2VDD V
D033 OSC1 (in XT, HS and LP) VSS - 0.3VDD V Note1
Input High Voltage
I/O ports VIH -
D040 with TTL buffer 2.0 - VDD V 4.5V ≤ VDD ≤ 5.5V
D040A 0.25VDD - VDD V For entire VDD range
+ 0.8V
D041 with Schmitt Trigger buffer 0.8VDD - VDD V
D042 MCLR 0.8VDD - VDD V
D042A OSC1 (XT, HS and LP) 0.7VDD - VDD V Note1
D043 OSC1 (in RC mode) 0.9VDD - VDD V
D070 PORTB weak pull-up current IPURB 50 250 400 µA VDD = 5V, VPIN = VSS
Input Leakage Current
(Notes 2, 3)
D060 I/O ports IIL - - ±1.0 µA Vss ≤ VPIN ≤ VDD, Pin at hi-Z
D061 MCLR, RA4/T0CKI - - ±5 µA Vss ≤ VPIN ≤ VDD
D063 OSC1 - - ±5 µA Vss ≤ VPIN ≤ VDD, XT, HS and LP osc
configuration
Output Low Voltage
D080 I/O ports VOL - - 0.6 V IOL = 4.0 mA, VDD = 4.5V
D083 OSC2/CLKOUT (RC osc mode) - - 0.6 V IOL = 1.6 mA, VDD = 4.5V
Output High Voltage
D090 I/O ports (Note 3) VOH VDD - 0.7 - - V IOH = -3.0 mA, VDD = 4.5V
D092 OSC2/CLKOUT (RC osc mode) VDD - 0.7 - - V IOH = -1.3 mA, VDD = 4.5V
Capacitive Loading Specs on
Output Pins
D100* OSC2 pin COSC2 - - 15 pF In XT, HS and LP modes when exter-
nal clock is used to drive OSC1.
D101* All I/O pins and OSC2 (in RC) CIO - - 50 pF
D102* SCL, SDA in I2C mode CB - - 400 pF
D150* Open -Drain High Voltage VDD - - 14 V RA4 pin
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C9XX be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified lev-
els represent normal operating conditions. Higher leakage current may be measured at different input volt-
ages.
3: Negative current is defined as current sourced by the pin.

DS30444E - page 144  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 17-1: LCD VOLTAGE WAVEFORM

D223 D224

VLCD3

VLCD2

VLCD1

VSS

TABLE 17-2: LCD MODULE ELECTRICAL SPECIFICATIONS

Parameter Sym Characteristic Min Typ† Max Units Conditions
No.
D200 VLCD3 LCD Voltage on pin VDD - 0.3 — Vss + 7.0 V
VLCD3
D201 VLCD2 LCD Voltage on pin — — VLCD3 V
VLCD2
D202 VLCD1 LCD Voltage on pin — — VDD V
VLCD1
D220* VOH Output High Max VLCDN - — Max VLCDN V COM outputs IOH = 25 µA
Voltage 0.1 SEG outputs IOH = 3 µA
D221* VOL Output Low Voltage Min VLCDN — Min VLCDN + V COM outputs IOL = 25 µA
0.1 SEG outputs IOL = 3 µA
D222* FLCDRC LCDRC Oscillator Fre- 5 15 50 kHz VDD = 5V, -40˚C to +85˚C
quency
D223* TrLCD Output Rise Time — — 200 µs COM outputs Cload = 5,000 pF
SEG outputs Cload = 500 pF
VDD = 5.0V, T = 25°C
D224* TfLCD Output Fall Time (1) — — 200 µs COM outputs Cload = 5,000 pF
SEG outputs Cload = 500 pF
VDD = 5.0V, T = 25°C
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
(1) 0 ohm source impedance at VLCD.

TABLE 17-3: VLCD CHARGE PUMP ELECTRICAL SPECIFICATIONS

Parameter
Symbol Characteristic Min Typ Max Units Conditions
No.

D250* IVADJ VLCDADJ regulated current output — 10 — µA

D252* ∆ IVADJ/∆ VDD VLCDADJ current VDD Rejection — — 0.1/1 µA/V
D265* VVADJ VLCDADJ voltage limits PIC16C92X 1.0 — 2.3 V
PIC16LC92X 1.0 VDD - V VDD < 3V
0.7V
* These parameters are characterized but not tested.
Note 1: For design guidance only.

 1997 Microchip Technology Inc. DS30444E - page 145

PIC16C9XX
17.4 Timing Parameter Symbology
The timing parameter symbols have been created following one of the following formats:

1. TppS2ppS 3. TCC:ST (I2C specifications only)

2. TppS 4. Ts (I2C specifications only)
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
H High R Rise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
2C only
I
AA output access High High
BUF Bus free Low Low
TCC:ST (I2C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO STOP condition
STA START condition

DS30444E - page 146  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 17-2: LOAD CONDITIONS
Load condition 1 Load condition 2

VDD/2

RL

CL CL
Pin Pin

VSS VSS
RL = 464Ω
CL = 50 pF for all pins except OSC2 unless otherwise noted.
15 pF for OSC2 output

 1997 Microchip Technology Inc. DS30444E - page 147

PIC16C9XX
17.5 Timing Diagrams and Specifications

FIGURE 17-3: EXTERNAL CLOCK TIMING

Q4 Q1 Q2 Q3 Q4 Q1

OSC1
1 3 3 4 4
2
CLKOUT

TABLE 17-4: EXTERNAL CLOCK TIMING REQUIREMENTS

Parameter Sym Characteristic Min Typ† Max Units Conditions
No.

Fosc External CLKIN Frequency DC — 4 MHz XT and RC osc mode

(Note 1) DC — 8 MHz HS osc mode
DC — 200 kHz LP osc mode
Oscillator Frequency DC — 4 MHz RC osc mode
(Note 1) 0.1 — 4 MHz XT osc mode
4 — 8 MHz HS osc mode
5 — 200 kHz LP osc mode
1 Tosc External CLKIN Period 250 — — ns XT and RC osc mode
(Note 1) 125 — — ns HS osc mode
5 — — µs LP osc mode
Oscillator Period 250 — — ns RC osc mode
(Note 1) 250 — 10,000 ns XT osc mode
125 — 250 ns HS osc mode
5 — — µs LP osc mode
2 TCY Instruction Cycle Time (Note 1) 500 — DC ns TCY = 4/FOSC
3 TosL, External Clock in (OSC1) High or 50 — — ns XT oscillator
TosH Low Time 2.5 — — µs LP oscillator
10 — — ns HS oscillator
4 TosR, External Clock in (OSC1) Rise or — — 25 ns XT oscillator
TosF Fall Time — — 50 ns LP oscillator
— — 15 ns HS oscillator
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin.
When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices.

DS30444E - page 148  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 17-4: CLKOUT AND I/O TIMING

Q4 Q1 Q2 Q3

OSC1

10 11

CLKOUT

13 12
19 18
14 16

I/O Pin
(input)
17 15

I/O Pin old value new value

(output)

20, 21

Refer to Figure 17-2 for load conditions.

TABLE 17-5: CLKOUT AND I/O TIMING REQUIREMENTS

Parameter Sym Characteristic Min Typ† Max Units Conditions
No.
10* TosH2ckL OSC1↑ to CLKOUT↓ — 75 200 ns Note 1
11* TosH2ckH OSC1↑ to CLKOUT↑ — 75 200 ns Note 1
12* TckR CLKOUT rise time — 35 100 ns Note 1
13* TckF CLKOUT fall time — 35 100 ns Note 1
14* TckL2ioV CLKOUT ↓ to Port out valid — — 0.5TCY + 20 ns Note 1
15* TioV2ckH Port in valid before CLKOUT ↑ Tosc + 200 — — ns Note 1
16* TckH2ioI Port in hold after CLKOUT ↑ 0 — — ns Note 1
17* TosH2ioV OSC1↑ (Q1 cycle) to — 50 150 ns
Port out valid
18* TosH2ioI OSC1↑ (Q2 cycle) to PIC16C923/924 100 — — ns
Port input invalid (I/O in PIC16LC923/924 200 — — ns
hold time)
19* TioV2osH Port input valid to OSC1↑ (I/O in setup time) 0 — — ns
20* TioR Port output rise time PIC16C923/924 — 10 40 ns
PIC16LC923/924 — — 80 ns
21* TioF Port output fall time PIC16C923/924 — 10 40 ns
PIC16LC923/924 — — 80 ns
22††* Tinp INT pin high or low time TCY — — ns
23††* Trbp RB7:RB4 change INT high or low time TCY — — ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance
only and are not tested.
†† These parameters are asynchronous events not related to any internal clock edges.
Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.

 1997 Microchip Technology Inc. DS30444E - page 149

PIC16C9XX
FIGURE 17-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER
TIMING

VDD

MCLR

30
Internal
POR

33
PWRT
Time-out 32

OSC
Time-out

Internal
RESET

Watchdog
Timer
RESET
31
34
34

I/O Pins

Refer to Figure 17-2 for load conditions.

TABLE 17-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER
REQUIREMENTS
Parameter Sym Characteristic Min Typ† Max Units Conditions
No.
30 TmcL MCLR Pulse Width (low) 2 — — µs
31* Twdt Watchdog Timer Time-out Period 7 18 33 ms VDD = 5V, -40˚C to +85˚C
(No Prescaler)
32 Tost Oscillation Start-up Timer Period — 1024TOSC — — TOSC = OSC1 period
33* Tpwrt Power-up Timer Period 28 72 132 ms VDD = 5V, -40˚C to +85˚C
34 TIOZ I/O Hi-impedance from MCLR Low — — 2.1 µs
or Watchdog Timer Reset
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.

DS30444E - page 150  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 17-6: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS

RA4/T0CKI

40 41
42

RC0/T1OSO/T1CKI

45 46

47 48
TMR0 or
TMR1
Refer to Figure 17-2 for load conditions.

TABLE 17-7: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS

Param Sym Characteristic Min Typ† Max Units Conditions
No.
40* Tt0H T0CKI High Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
With Prescaler 10 — — ns parameter 42
41* Tt0L T0CKI Low Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
With Prescaler 10 — — ns parameter 42
42* Tt0P T0CKI Period No Prescaler TCY + 40 — — ns
With Prescaler Greater of: — — ns N = prescale value
20 or TCY + 40 (2, 4, ..., 256)
N
45* Tt1H T1CKI High Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
Synchronous, PIC16C923/924 15 — — ns parameter 47
Prescaler = PIC16LC923/924 25 — — ns
2,4,8
Asynchronous PIC16C923/924 30 — — ns
PIC16LC923/924 50 — — ns
46* Tt1L T1CKI Low Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
Synchronous, PIC16C923/924 15 — — ns parameter 47
Prescaler = PIC16LC923/924 25 — — ns
2,4,8
Asynchronous PIC16C923/924 30 — — ns
PIC16LC923/924 50 — — ns
47* Tt1P T1CKI input period Synchronous PIC16C923/924 Greater of: — — ns N = prescale value
30 OR TCY + 40 (1, 2, 4, 8)
N
PIC16LC923/924 Greater of: N = prescale value
50 OR TCY + 40 (1, 2, 4, 8)
N
Asynchronous PIC16C923/924 60 — — ns
PIC16LC923/924 100 — — ns
Ft1 Timer1 oscillator input frequency range DC — 200 kHz
(oscillator enabled by setting bit T1OSCEN)
48 TCKEZtmr1 Delay from external clock edge to timer increment 2Tosc — 7Tosc —
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.

 1997 Microchip Technology Inc. DS30444E - page 151

PIC16C9XX
FIGURE 17-7: CAPTURE/COMPARE/PWM TIMINGS

RC2/CCP1
(Capture Mode)

50 51

52

RC2/CCP1
(Compare or PWM Mode)

53 54

Refer to Figure 17-2 for load conditions.

TABLE 17-8: CAPTURE/COMPARE/PWM REQUIREMENTS

Parameter Sym Characteristic Min Typ† Max Units Conditions
No.
50* TccL Input Low Time No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16C923/924 10 — — ns
PIC16LC923/924 20 — — ns
51* TccH Input High Time No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16C923/924 10 — — ns
PIC16LC923/924 20 — — ns
52* TccP Input Period 3TCY + 40 — — ns N = prescale value
N (1,4 or 16)
53* TccR Output Rise Time PIC16C923/924 — 10 25 ns
PIC16LC923/924 — 25 45 ns
54* TccF Output Fall Time PIC16C923/924 — 10 25 ns
PIC16LC923/924 — 25 45 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.

DS30444E - page 152  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 17-8: SPI MASTER MODE TIMING (CKE = 0)

SS

70
SCK
(CKP = 0)

71 72
78 79

SCK
(CKP = 1)

79 78
80

SDO MSb BIT6 - - - - - -1 LSb

75, 76

SDI MSb IN BIT6 - - - -1 LSb IN

74
73
Refer to Figure 17-2 for load conditions.

FIGURE 17-9: SPI MASTER MODE TIMING (CKE = 1)

SS

81
SCK
(CKP = 0)

71 72
79
73
SCK
(CKP = 1)
80
78

SDO MSb BIT6 - - - - - -1 LSb

75, 76

SDI MSb IN BIT6 - - - -1 LSb IN

74

Refer to Figure 17-2 for load conditions.

 1997 Microchip Technology Inc. DS30444E - page 153

PIC16C9XX
FIGURE 17-10:SPI SLAVE MODE TIMING (CKE = 0)

SS

70
SCK
(CKP = 0) 83

71 72
78 79

SCK
(CKP = 1)

79 78
80

SDO MSb BIT6 - - - - - -1 LSb

75, 76 77

SDI MSb IN BIT6 - - - -1 LSb IN

74
73
Refer to Figure 17-2 for load conditions.

FIGURE 17-11:SPI SLAVE MODE TIMING (CKE = 1)

82
SS

70
SCK 83
(CKP = 0)

71 72

SCK
(CKP = 1)
80

SDO MSb BIT6 - - - - - -1 LSb

75, 76 77

SDI
MSb IN BIT6 - - - -1 LSb IN

74

Refer to Figure 17-2 for load conditions.

DS30444E - page 154  1997 Microchip Technology Inc.

 PIC16C9XX
TABLE 17-9: SPI MODE REQUIREMENTS
Param Sym Characteristic Min Typ† Max Units Conditions
No.
70* TssL2scH, SS↓ to SCK↓ or SCK↑ input TCY — — ns
TssL2scL
71* TscH SCK input high time (slave Continuous 1.25TCY + — — ns
mode) 30
71A* Single Byte 40 — — ns
72* TscL SCK input low time (slave Continuous 1.25TCY + — — ns
mode) 30
72A* Single Byte 40
73* TdiV2scH, Setup time of SDI data input to SCK edge 50 — — ns
TdiV2scL
74* TscH2diL, Hold time of SDI data input to SCK edge 50 — — ns
TscL2diL
75* TdoR SDO data output rise time — 10 25 ns
76* TdoF SDO data output fall time — 10 25 ns
77* TssH2doZ SS↑ to SDO output hi-impedance 10 — 50 ns
78* TscR SCK output rise time (master mode) — 10 25 ns
79* TscF SCK output fall time (master mode) — 10 25 ns
80* TscH2doV, SDO data output valid after SCK edge — — 50 ns
TscL2doV
81* TdoV2scH, SDO data output setup to SCK edge TCY — — ns
TdoV2scL
82* TssL2doV SDO data output valid after SS↓ edge — — 50 ns
83* TscH2ssH, SS ↑ after SCK edge 1.5TCY + 40 — — ns
TscL2ssH
84* Tb2b Delay between consecutive bytes 1.5TCY + 40 — — ns
* Characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not
tested.

 1997 Microchip Technology Inc. DS30444E - page 155

PIC16C9XX
FIGURE 17-12:I2C BUS START/STOP BITS TIMING

SCL
91 93
90 92

SDA

START STOP
Condition Refer to Figure 17-2 for load conditions. Condition

TABLE 17-10:I2C BUS START/STOP BITS REQUIREMENTS

Parameter Sym Characteristic Min Typ Max Units Conditions
No.
90* TSU:STA START condition 100 kHz mode 4700 — — Only relevant for repeated START
ns
Setup time condition
91* THD:STA START condition 100 kHz mode 4000 — — After this period the first clock
ns
Hold time pulse is generated
92* TSU:STO STOP condition 100 kHz mode 4700 — —
ns
Setup time
93* THD:STO STOP condition 100 kHz mode 4000 — —
ns
Hold time
* Characterized but not tested.

DS30444E - page 156  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 17-13:I2C BUS DATA TIMING
103 100 102
101
SCL
90
106
107
91 92
SDA
In
110
109 109

SDA
Out
Refer to Figure 17-2 for load conditions.

TABLE 17-11:I2C BUS DATA REQUIREMENTS

Parameter Sym Characteristic Min Max Units Conditions
No.
100* THIGH Clock high time 100 kHz mode 4.0 — µs Device must operate at a mini-
mum of 1.5 MHz
SSP Module 1.5TCY —
101* TLOW Clock low time 100 kHz mode 4.7 — µs Device must operate at a mini-
mum of 1.5 MHz
SSP Module 1.5TCY —
102* TR SDA and SCL rise 100 kHz mode — 1000 ns
time
103* TF SDA and SCL fall time 100 kHz mode — 300 ns
90* TSU:STA START condition 100 kHz mode 4.7 — µs Only relevant for repeated
setup time START condition
91* THD:STA START condition hold 100 kHz mode 4.0 — µs After this period the first clock
time pulse is generated
106* THD:DAT Data input hold time 100 kHz mode 0 — ns
107* TSU:DAT Data input setup time 100 kHz mode 250 — ns
92* TSU:STO STOP condition setup 100 kHz mode 4.7 — µs
time
109* TAA Output valid from 100 kHz mode — 3500 ns Note 1
clock
110* TBUF Bus free time 100 kHz mode 4.7 — µs Time the bus must be free
before a new transmission can
start
D102* Cb Bus capacitive loading — 400 pF
* Characterized but not tested.
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of
the falling edge of SCL to avoid unintended generation of START or STOP conditions.

 1997 Microchip Technology Inc. DS30444E - page 157

PIC16C9XX
TABLE 17-12:A/D CONVERTER CHARACTERISTICS:
PIC16C924-04 (COMMERCIAL, INDUSTRIAL)
PIC16LC924-04 (COMMERCIAL, INDUSTRIAL)
Param Sym Characteristic Min Typ† Max Units Conditions
No.
A01 NR Resolution — — 8-bits bit VREF = VDD = 5.12V,
VSS ≤ VAIN ≤ VREF
A02 EABS Total Absolute error — — <±1 LSb VREF = VDD = 5.12V,
VSS ≤ VAIN ≤ VREF
A03 EIL Integral linearity error — — <±1 LSb VREF = VDD = 5.12V,
VSS ≤ VAIN ≤ VREF
A04 EDL Differential linearity error — — <±1 LSb VREF = VDD = 5.12V,
VSS ≤ VAIN ≤ VREF
A05 EFS Full scale error — — <±1 LSb VREF = VDD = 5.12V,
VSS ≤ VAIN ≤ VREF
A06 EOFF Offset error — — <±1 LSb VREF = VDD = 5.12V,
VSS ≤ VAIN ≤ VREF
A10 — Monotonicity — guaranteed — — VSS ≤ VAIN ≤ VREF
A20 VREF Reference voltage 3.0V — VDD + 0.3 V
A25 VAIN Analog input voltage VSS - 0.3 — VREF + 0.3 V
A30 ZAIN Recommended impedance of — — 10.0 kΩ
analog voltage source
A40 IAD A/D conversion current PIC16C924 — 180 — µA Average current consump-
(VDD) PIC16LC924 — 90 — µA tion when A/D is on.
(Note 1)
A50 IREF VREF input current (Note 2) 10 — 1000 µA During VAIN acquisition.
Based on differential of
VHOLD to VAIN to charge
CHOLD, see Section 12.1.

— — 10 µA During A/D Conversion

cycle
*
These parameters are characterized but not tested.
†
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: When A/D is off, it will not consume any current other than minor leakage current.
The power-down current spec includes any such leakage from the A/D module.
2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input.

DS30444E - page 158  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 17-14:A/D CONVERSION TIMING

BSF ADCON0, GO 1 TCY

134 (TOSC/2) (1)
131
Q4
130

A/D CLK 132

A/D DATA 7 6 5 4 3 2 1 0

ADRES OLD_DATA NEW_DATA

ADIF

GO DONE

SAMPLING STOPPED
SAMPLE

Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.

TABLE 17-13:A/D CONVERSION REQUIREMENTS

Param Sym Characteristic Min Typ† Max Units Conditions
No.
130 TAD A/D clock period PIC16C924 1.6 — — µs TOSC based, VREF ≥ 3.0V
PIC16LC924 2.0 — — µs TOSC based, VREF full range
PIC16C924 2.0 4.0 6.0 µs A/D RC Mode
PIC16LC924 3.0 6.0 9.0 µs A/D RC Mode
131 TCNV Conversion time (not including S/H time) — 9.5 — TAD
(Note 1)
132 TACQ Acquisition time Note 2 20 — µs

5* — — µs The minimum time is the amplifier

settling time. This may be used if
the "new" input voltage has not
changed by more than 1 LSb (i.e.,
20.0 mV @ 5.12V) from the last
sampled voltage (as stated on
CHOLD).
134 TGO Q4 to A/D clock start — TOSC/2 § — — If the A/D clock source is selected
as RC, a time of TCY is added
before the A/D clock starts. This
allows the SLEEP instruction to be
executed.
135 TSWC Switching from convert → sample time 1.5 § — — TAD
*
These parameters are characterized but not tested.
†
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
§ This specification ensured by design.
Note 1: ADRES register may be read on the following TCY cycle.
2: See Section 12.1 for min conditions.

 1997 Microchip Technology Inc. DS30444E - page 159

PIC16C9XX
NOTES:

DS30444E - page 160  1997 Microchip Technology Inc.

 PIC16C9XX
18.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES
The graphs and tables provided in this section are for design guidance and are not tested or guaranteed.
In some graphs or tables the data presented are outside specified operating range (i.e., outside specified VDD
range). This is for information only and devices are guaranteed to operate properly only within the specified
range.
Note: The data presented in this section is a statistical summary of data collected on units from different lots over
a period of time and process characterization samples. 'Typical' represents the mean of the distribution at,
25°C, while 'max' or 'min' represents (mean +3σ) and (mean -3σ) respectively where σ is standard devia-
tion.

FIGURE 18-1: TYPICAL IPD vs. VDD (WDT FIGURE 18-3: TYPICAL IPD vs. VDD (WDT
DISABLED, RC MODE @ ENABLED, RC MODE @
25°C) 25°C)
280 25.0

260 20.0

IPD(µA)
240
15.0
220
IPD(nA)

10.0
200

180 5.0

160 0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
140 VDD (VOLTS)

120
FIGURE 18-4: MAXIMUM IPD vs. VDD (WDT
100 ENABLED, RC MODE -40°C TO
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 +85°C)
VDD (VOLTS)
40.0

35.0
FIGURE 18-2: MAXIMUM IPD vs. VDD (WDT
30.0
DISABLED, RC MODE -40°C
TO +85°C) 25.0
3.5
IPD(µA)

20.0
3.0
15.0
2.5
10.0
2.0
5.0
IPD(µA)

1.5
0.0
1.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (VOLTS)
0.5

0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (VOLTS)

 1997 Microchip Technology Inc. DS30444E - page 161

 PIC16C9XX
FIGURE 18-5: TYPICAL IPD vs. VDD (LCD FIGURE 18-7: TYPICAL IPD vs. VDD (LCD
ON(1), INTERNAL RC(2), RC ON(1), TIMER1 (32 kHz(2)), RC
MODE @ 25°C) MODE @ 25°C)
60 90

55 80

50 70
IPD(µA)

45 60

IPD(µA)
40 50

35 40

30 30
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (VOLTS) 20
C Spec @ 4.0V = 41
LC Spec @ 3.0V = 37 10

0
FIGURE 18-6: MAXIMUM IPD vs. VDD (LCD ON 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
(32 kHz(1)), INTERNAL RC (32 VDD (VOLTS)
kHz(2)), RC MODE -40°C TO
+85°C)
70 FIGURE 18-8: MAXIMUM IPD vs. VDD (LCD
ON(1), TIMER1(32 kHz(2)), RC
65
MODE -40°C TO +85°C)
Data based on process characterization samples. See first page of this section for details.

60 180
IPD(µA)

55 160
50
140

45 120
IPD(µA)

40 100

35 80

30 60
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
C Spec @ 4.0V = 45 VDD (VOLTS) 40
LC Spec @ 3.0V = 40
20

0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (VOLTS)

Note 1: The LCD module is turned on, internal charge pump enabled, 1/4 MUX, 32 Hz frame frequency and no load
on LCD segments/commons. IPD will increase depending on the LCD panel connected to the PIC16C9XX.
Note 2: Indicates the clock source to the LCD module.

DS30444E - page 162  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 18-9: TYPICAL RC OSCILLATOR FIGURE 18-12:TYPICAL IPD vs. TIMER1
FREQUENCY vs. VDD ENABLED (32 kHz, RC0/RC1 =
Cext = 22 pF, T = 25°C 33 pF/33 pF, RC MODE)
6.0
5.5
5.0 30
4.5 R = 5k
4.0 25
Fosc(MHz)

3.5
20
3.0
R = 10k

IPD(µA)
2.5 15
2.0
1.5 10
1.0
R = 100k 5
0.5
0.0 0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (VOLTS) VDD (VOLTS)

Shaded area is beyond recommended range.

FIGURE 18-13:MAXIMUM IPD vs. TIMER1

FIGURE 18-10:TYPICAL RC OSCILLATOR
ENABLED
FREQUENCY vs. VDD
(32 kHz, RC0/RC1 = 33 pF/33
2.4
Cext = 100 pF, T = 25°C pF, 85°C TO -40°C, RC MODE)
2.2
R = 3.3k
2.0
1.8 45

Data based on process characterization samples. See first page of this section for details.
1.6 40
Fosc(MHz)

R = 5k
1.4 35
1.2 30
1.0 25
IPD(µA)

R = 10k
0.8 20
0.6
15
0.4
R = 100k 10
0.2
5
0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0
VDD (VOLTS) 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)

FIGURE 18-11:TYPICAL RC OSCILLATOR

FREQUENCY vs. VDD

Cext = 300 pF, T = 25°C

1000
900
800 R = 3.3k
700
Fosc(kHz)

600
R = 5k
500
400
R = 10k
300
200
100 R = 100k
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (VOLTS)

 1997 Microchip Technology Inc. DS30444E - page 163

 PIC16C9XX
FIGURE 18-14:TYPICAL IDD vs. FREQUENCY (RC MODE @ 20 pF, 25°C)

2500
6.0V

5.5V

2000
5.0V

4.5V
IDD(µA)

4.0V
1500
3.5V

3.0V
1000
2.5V

500

0
0.0 1.00 2.00 3.00 4.00 5.00
Frequency (MHz) Shaded area is
Typical 2.7 mA @ 4 MHz, 5.5V beyond recommended range
Data based on process characterization samples. See first page of this section for details.

FIGURE 18-15:MAXIMUM IDD vs. FREQUENCY (RC MODE @ 20 pF, -40°C TO +85°C)

3500

6.0V
3000

5.5V
5.0V
2500
IDD(µA)

4.5V

4.0V
2000
3.5V

3.0V
1500 2.5V

1000

500

0
0.0 1.00 2.00 3.00 4.00 5.00
Frequency (MHz) Shaded area is
Maximum 5.0 mA @ 4 MHz, 5.5V beyond recommended range

DS30444E - page 164  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 18-16:TYPICAL IDD vs. FREQUENCY (RC MODE @ 100 pF, 25°C)

1400
6.0V

5.5V
1200
5.0V

4.5V
1000
4.0V

3.5V
IDD(µA)

800
3.0V

2.5V
600

400

200

0
0 200 400 600 800 1000 1200 1400 1600
Shaded area is Frequency (kHz)
beyond recommended range

Data based on process characterization samples. See first page of this section for details.
FIGURE 18-17:MAXIMUM IDD vs. FREQUENCY (RC MODE @ 100 pF, -40°C TO +85°C)

1600
6.0V

5.5V
1400
5.0V
4.5V
1200
4.0V

3.5V
1000
3.0V
IDD(µA)

2.5V
800

600

400

200

0
0 200 400 600 800 1000 1200 1400 1600
Shaded area is Frequency (kHz)
beyond recommended range

 1997 Microchip Technology Inc. DS30444E - page 165

 PIC16C9XX
FIGURE 18-18:TYPICAL IDD vs. FREQUENCY (RC MODE @ 300 pF, 25°C)

1200
6.0V

5.5V
1000
5.0V
4.5V

800 4.0V

3.5V
IDD(µA)

600 3.0V

2.5V

400

200

0
0 100 200 300 400 500 600 700
Frequency (kHz)
Data based on process characterization samples. See first page of this section for details.

FIGURE 18-19:MAXIMUM IDD vs. FREQUENCY (RC MODE @ 300 pF, -40°C TO +85°C)
1400

6.0V

1200 5.5V
5.0V

1000 4.5V

4.0V

3.5V
800
IDD(µA)

3.0V
2.5V
600

400

200

0
0 100 200 300 400 500 600 700
Frequency (kHz)

DS30444E - page 166  1997 Microchip Technology Inc.

 PIC16C9XX
TABLE 18-1: RC OSCILLATOR
FREQUENCIES FIGURE 18-20:TRANSCONDUCTANCE(gm)
OF HS OSCILLATOR vs. VDD
Average
Cext Rext 4.0
Fosc @ 5V, 25°C Max -40°C
3.5
22 pF 5k 4.12 MHz ± 1.4%
3.0
10k 2.35 MHz ± 1.4%
100k 268 kHz ± 1.1% 2.5
Typ 25°C

gm(mA/V)
100 pF 3.3k 1.80 MHz ± 1.0% 2.0

5k 1.27 MHz ± 1.0% 1.5 Min 85°C

10k 688 kHz ± 1.2% 1.0
100k 77.2 kHz ± 1.0%
0.5
300 pF 3.3k 707 kHz ± 1.4%
0.0
5k 501 kHz ± 1.2% 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
VDD (VOLTS)
10k 269 kHz ± 1.6% Shaded area is
beyond recommended range
100k 28.3 kHz ± 1.1%
The percentage variation indicated here is part to FIGURE 18-21:TRANSCONDUCTANCE(gm)
part variation due to normal process distribution. The OF LP OSCILLATOR vs. VDD
variation indicated is ±3 standard deviation from
110
average value for VDD = 5V. 100 Max -40°C
90
80
70
gm(µA/V)

60 Typ 25°C
50

Data based on process characterization samples. See first page of this section for details.
40
30
20 Min 85°C
10
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
Shaded areas are VDD (VOLTS)
beyond recommended range

FIGURE 18-22:TRANSCONDUCTANCE(gm)
OF XT OSCILLATOR vs. VDD

1000
900 Max -40°C
800
700
gm(µA/V)

600 Typ 25°C

500
400
300 Min 85°C
200
100
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
Shaded areas are VDD (VOLTS)
beyond recommended range

 1997 Microchip Technology Inc. DS30444E - page 167

 PIC16C9XX
FIGURE 18-23:TYPICAL XTAL STARTUP TIME FIGURE 18-26:TYPICAL IDD vs. VDD
vs. VDD (LP MODE, 25°C) (LP MODE @ 25°C)
3.5
140

3.0
120

2.5
100
Startup Time(Seconds)

2.0 200 kHz, 15 pF/15 pF

80
32 kHz, 33 pF/33 pF
1.5
60

IDD(µA)
1.0
40

0.5 200 kHz, 15 pF/15 pF

20
32 kHz, 33 pF/33 pF
0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (VOLTS)
VDD (VOLTS)

FIGURE 18-24:TYPICAL XTAL STARTUP TIME LC Spec -> Typical = 22.5 µA, 32 kHz, 4.0V
vs. VDD (HS MODE, 25°C)
7
FIGURE 18-27:MAXIMUM IDD vs. VDD
6 (LP MODE -40°C TO +85°C)
Startup Time(ms)
Data based on process characterization samples. See first page of this section for details.

5
140
4
8 MHz, 33 pF/33 pF 120
3
8 MHz, 15 pF/15 pF
100
2
200 kHz, 15 pF/15 pF
1 80
4.0 4.5 5.0 5.5 6.0
VDD (VOLTS)
60
FIGURE 18-25:TYPICAL XTAL STARTUP TIME
IDD(µA)

vs. VDD (XT MODE, 25°C) 40

70
20
60
32 kHz, 33 pF/33 pF

50 0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Startup Time(ms)

40 VDD (VOLTS)
200 kHz, 68 pF/68 pF

30 LC Spec -> Maximum = 48 µA, 32 kHz, 4.0V

200 kHz, 47 pF/47 pF
20
1 MHz, 15 pF/15 pF

10 4 MHz, 15 pF/15 pF

0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (VOLTS)

DS30444E - page 168  1997 Microchip Technology Inc.

 PIC16C9XX
FIGURE 18-28:TYPICAL IDD vs. VDD FIGURE 18-30:TYPICAL IDD vs. VDD
(XT MODE @ 25°C) (HS MODE @ 25°C)

7
1600

1400 6

1200
5
4 MHz, 15 pF/15 pF
1000
4

IDD(µA)
800 8 MHz, 15 pF/15 pF
1 MHz, 15 pF/15 pF
600 3
IDD(µA)

400 2

200
1
200 kHz, 33 pF/33 pF
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0
4.0 4.5 5.0 5.5 6.0
VDD (VOLTS)
VDD (VOLTS)
Typical = 2.7 µA, 4 MHz, 5.5V
Typical = 3.5 mA, 8 MHz, 5.5V

FIGURE 18-29:MAXIMUM IDD vs. VDD

(XT MODE -40°C TO +85°C) FIGURE 18-31:MAXIMUM IDD vs. VDD
(HS MODE -40°C TO +85°C)

Data based on process characterization samples. See first page of this section for details.
2500 8

2000 7

1500 6
IDD(µA)

4 MHz, 15 pF/15 pF 1 MHz, 15 pF/15 pF

1000 5

500 4
IDD (MA)

200 kHz, 33 pF/33 pF

0 3
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
8 MHz, 15 pF/15 pF
VDD (VOLTS)
2
Maximum = 5 mA, 4 MHz, 5.5V
1

0
4.0 4.5 5.0 5.5 6.0
VDD (VOLTS)

Maximum = 7 mA, 8 MHz, 5.5V

 1997 Microchip Technology Inc. DS30444E - page 169

PIC16C9XX
NOTES:

DS30444E - page 170  1997 Microchip Technology Inc.

 PIC16C9XX
19.0 PACKAGING INFORMATION
19.1 64-Lead Plastic Surface Mount (TQFP 10x10x1 mm Body 1.0/0.10 mm Lead Form))
D1
D
D/2

e/2

A
E1 A E
DETAIL A
e
E/2

See Detail A
8 Places
11/13° 0° min.
A

A2
See Detail B Datum Plane

0.25
b 0.08
with Lead Finish A1 R min. 0-7°
Gauge Plane
0.09/0.20 0.09/0.16 0.20 min.
L

b1 1.00 ref.
Base Metal
DETAIL B

Package Group: Plastic TQFP

Millimeters Inches
Symbol Min Nominal Max Min Nominal Max
α 0° - 7° 0° - 7°
A - - 1.20 - - 0.047
A1 0.05 0.10 0.15 0.002 0.004 0.006
A2 0.95 1.00 1.05 0.037 0.039 0.041
b 0.17 0.22 0.27 0.007 0.009 0.011
b1 0.17 0.20 0.23 0.007 0.008 0.009
D - 12.00 - - 0.472 -
D1 - 10.00 - - 0.394 -
E - 12.00 - - 0.472 -
E1 - 10.00 - - 0.394 -
e - 0.50 - - 0.020 -
L 0.45 0.60 0.75 0.018 0.024 0.030
N 64 64 64 64 64 64

 1997 Microchip Technology Inc. DS30444E - page 171

PIC16C9XX
19.2 64-Lead Plastic Dual In-line (750 mil)

α
E1 E C
eA
Pin No. 1 eB
Indicator Area

D
S S1
Base
Plane

Seating
Plane L
B1 e1 A1 A2 A
B
D1

Package Group: Plastic Dual In-Line (PLA)

Millimeters Inches
Symbol Min Max Notes Min Max Notes
α 0° 15° 0° 15°
A – 5.08 – 0.200
A1 0.51 – 0.020 –
A2 3.38 4.27 0.133 0.168
B 0.38 0.56 0.015 0.022
B1 .076 1.27 Typical 0.030 0.050 Typical
C 0.20 0.30 Typical 0.008 0.012 Typical
D 57.40 57.91 2.260 2.280
D1 55.12 55.12 Reference 2.170 2.170 Reference
E 19.05 19.69 0.750 0.775
E1 16.76 17.27 0.660 0.680
e1 1.73 1.83 Typical 0.068 0.072 Typical
eA 19.05 19.05 Reference 0.750 0.750 Reference
eB 19.05 21.08 0.750 0.830
L 3.05 3.43 0.120 0.135
N 64 64 64 64
S 1.19 – 0.047 –
S1 0.686 – 0.027 –

DS30444E - page 172  1997 Microchip Technology Inc.

 PIC16C9XX
19.3 68-Lead Plastic Leaded Chip Carrier (Square)

D 0.812/0.661 N Pics
0.177 1.27 .032/.026
.007 S B D-E S .050
2 Sides -H- 0.177
-A- .007 S B A S
D1 A
A1 2 Sides
-D- 3 9
D3/E3
0.101 Seating
D2 D
.004 Plane
0.38 -C-
3 .015 F-G S 4
3 -G-
8 E2
-F-
E1 E
0.38
.015 F-G S 4
-B-

3 -E- 0.177
.007 S A F-G S
10
0.812/0.661
0.254 0.254 3
.032/.026
.010 Max 11 .010 Max 11
1.524
0.508 0.508
2 -H- .060 Min
.020 .020 -H- 2
6
6
-C-
5
1.651 1.651 0.64 Min 0.533/0.331
.065 .065 .025 .021/.013
R 1.14/0.64 R 1.14/0.64
.045/.025 .045/.025 0.177
, D-E S
.007 M A F-G S

Package Group: Plastic Leaded Chip Carrier (PLCC)

Millimeters Inches
Symbol Min Max Notes Min Max Notes
A 4.191 4.699 0.165 0.185
A1 2.286 2.794 0.090 0.110
D 25.019 25.273 0.985 0.995
D1 24.130 24.334 0.950 0.958
D2 22.860 23.622 0.900 0.930
D3 20.320 - Reference 0.800 - Reference
E 25.019 25.273 0.985 0.995
E1 24.130 24.334 0.950 0.958
E2 22.860 23.622 0.900 0.930
E3 20.320 - Reference 0.800 - Reference
N 68 - 68 -
CP - 0.102 - 0.004
LT 0.203 0.254 0.008 0.010

 1997 Microchip Technology Inc. DS30444E - page 173

PIC16C9XX
19.4 Package Marking Information
68-Lead CERQUAD Windowed Example

MMMMMMMMMMMMMMMMM PIC16C924-04/CL
AABBCDE 9650CAE

64-Lead TQFP Example

MMMMMMMMMM PIC16C923
MMMMMMM -08I/PT

AABBCDE 9712CAE

68-Lead PLCC Example

MMMMMMMMMM PIC16C924
MMMMMMM -08/L

AABBCDE 9648CAE

64-Lead SDIP (Shrink DIP) Example

MMMMMMMMMMMMMMMMM PIC16C924-04I/SP
AABBCDE 9736CAE

Legend: MM...M Microchip part number information

XX...X Customer specific information*
AA Year code (last 2 digits of calender year)
BB Week code (week of January 1 is week '01’)
C Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
S = Tempe, Arizona, U.S.A.
D1 Mask revision number for microcontroller
E Assembly code of the plant or country of origin in which
part was assembled.
Note: In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.

DS30444E - page 174  1997 Microchip Technology Inc.

 PIC16C9XX
APPENDIX A: APPENDIX B: COMPATIBILITY
The following are the list of modifications over the To convert code written for PIC16C5X to PIC16CXX,
PIC16C5X microcontroller family: the user should take the following steps:
1. Instruction word length is increased to 14-bits. 1. Remove any program memory page select oper-
This allows larger page sizes both in program ations (PA2, PA1, PA0 bits) for CALL, GOTO.
memory (4K now as opposed to 512 before) and 2. Revisit any computed jump operations (write to
register file (192 bytes now versus 32 bytes PC or add to PC, etc.) to make sure page bits are
before). set properly under the new scheme.
2. A PC high latch register (PCLATH) is added to 3. Eliminate any data memory page switching.
handle program memory paging. Bits PA2, PA1, Redefine data variables to reallocate them.
PA0 are removed from STATUS register. 4. Verify all writes to STATUS, OPTION, and FSR
3. Data memory paging is redefined slightly. STA- registers since these have changed.
TUS register is modified. 5. Change reset vector to 0000h.
4. Four new instructions have been added:
RETURN, RETFIE, ADDLW, and SUBLW.
Two instructions TRIS and OPTION are being
phased out although they are kept for compati-
bility with PIC16C5X.
5. OPTION and TRIS registers are made address-
able.
6. Interrupt capability is added. Interrupt vector is
at 0004h.
7. Stack size is increased to 8 deep.
8. Reset vector is changed to 0000h.
9. Reset of all registers is revisited. Five different
reset (and wake-up) types are recognized. Reg-
isters are reset differently.
10. Wake up from SLEEP through interrupt is
added.
11. Two separate timers, Oscillator Start-up Timer
(OST) and Power-up Timer (PWRT) are
included for more reliable power-up. These tim-
ers are invoked selectively to avoid unnecessary
delays on power-up and wake-up.
12. PORTB has weak pull-ups and interrupt on
change feature.
13. T0CKI pin is also a port pin (RA4) now.
14. FSR is made a full eight bit register.
15. “In-circuit programming” is made possible. The
user can program PIC16CXX devices using only
five pins: VDD, VSS, MCLR/VPP, RB6 (clock) and
RB7 (data in/out).
16. PCON status register is added with a Power-on
Reset status bit (POR).
17. Code protection scheme is enhanced such that
portions of the program memory can be pro-
tected, while the remainder is unprotected.

 1997 Microchip Technology Inc. DS30444E - page 175

PIC16C9XX
APPENDIX C: WHAT’S NEW 18 - TosH2ioL 200 ns Min (LC devices)
Figure 13-13 (Resistor Ladder and Charge Pump) in 30 - TmcL 2 µs Min
LCD Section. 34 - Tioz 2.1 µs Max
Parameter D150 - Open Drain High Voltage. Timer0 and Timer1 External Clock Timings - Various.
DC and AC Characterization Graphs and Tables. 53 - TccR,
54 - TccF
APPENDIX D: WHAT’S CHANGED
73 - TdiV2scH 50 ns Min
Various descriptions for clarity.
74 - TscH2diL 50 ns Min
Example code for Changing prescaler assignment
between Timer0 and the WDT. Combined A/D specification tables for Standard and
Extended Voltage devices.
The A/D section has many changes that provide
greater clarification of A/D operation.
The Instruction Set has Q-cycle activity listings for
every instruction.
The following Electrical Characteristic Parameter val-
ues have changed to:
D011 (Standard Voltage Devices, C)
Typical 22.5 µA
Max 48 µA
D022 (Standard Voltage Devices)
Typical 40 µA
Max 55 µA
D024 (Standard Voltage Devices)
Typical 33 µA
Max 60 µA
D001 (Extended Voltage Devices, LC)
Min 2.5 V
D011 (Extended Voltage Devices, LC)
Typical 13.5 µA
Max 30 µA
D022 (Extended Voltage Devices, LC)
Typical 36 µA
Max 50 µA
D024 (Extended Voltage Devices, LC)
Typical 15 µA
Max 29 µA
D030 (with TTL)
Max 0.5VDD V (ENTIRE RANGE)
Max 0.8V V (4.5V ≤ VDD ≤ 5.5V)
D201, D202
Deleted D210 and D211, D251, D253, D260, D271
D222
Min 5 kHz
Typical 15 kHz
Max 50 kHz
D223, D224 - units to ns.
Added D265 (VLCDADJ voltage limits.
Changed parameters:
12 - TckR 35 ns Typical
13 - TckF 35 ns Typical
15 - TioV2ckH Tosc + 200 ns Min

DS30444E - page 176  1997 Microchip Technology Inc.

 PIC16C9XX
INDEX PORTF ........................................................................39
PORTG........................................................................40
A PWM............................................................................59
RA3:RA0 and RA5 Port Pins .......................................31
A/D
RA4/T0CKI Pin ............................................................31
Accuracy/Error ............................................................ 86
RB3:RB0 Port Pins ......................................................33
ADCON0 ............................................................... 79, 80
RB7:RB4 Port Pins ......................................................33
ADCON1 ............................................................... 79, 80
RC Oscillator ............................................................ 105
ADIF............................................................................ 80
SSP (I2C Mode)...........................................................73
Analog-to-Digital Converter......................................... 79
SSP (SPI Mode) ..........................................................65
Configuring Analog Port.............................................. 83
Timer0 .........................................................................45
Connection Considerations......................................... 87
Timer0/WDT Prescaler ................................................48
Conversion time .......................................................... 85
Timer1 .........................................................................52
Conversions ................................................................ 84
Timer2 .........................................................................55
Converter Characteristics ......................................... 158
Watchdog Timer ....................................................... 116
Faster Conversion - Lower Resolution Tradeoff ......... 85
Brown-out Protection Circuit ............................................. 112
GO/DONE ................................................................... 80
Internal Sampling Switch (Rss) Impedance ................ 82 C
Operation During Sleep .............................................. 86 C bit .....................................................................................23
Sampling Requirements.............................................. 82 Capture/Compare/PWM (CCP)
Sampling Time ............................................................ 82 Capture Mode..............................................................58
Source Impedance...................................................... 82 CCP1 ...........................................................................57
Transfer Function........................................................ 87 CCP1CON ................................................................ 109
A/D Conversion Clock......................................................... 83 CCPR1H................................................................... 109
Registers CCPR1L ................................................................... 109
Section ........................................................................ 19 Compare Mode............................................................58
Absolute Maximum Ratings .............................................. 141 Compare Mode Block Diagram ...................................58
ACK............................................................. 70, 74, 75, 76, 77 Prescaler .....................................................................58
ADCON0 Register............................................................... 19 PWM Block Diagram ...................................................59
ADCON1 Register............................................................... 20 PWM Mode..................................................................59
ADIE bit............................................................................... 26 PWM, Example Frequencies/Resolutions ...................60
ADIF bit ............................................................................... 27 Section.........................................................................57
ADRES............................................................ 19, 79, 80, 109 Carry bit .................................................................................9
ALU ....................................................................................... 9 CCP1CON Register.............................................................19
Application Notes CCP1IE bit ...........................................................................26
AN546 ......................................................................... 79 CCP1IF bit ...........................................................................27
AN552 ......................................................................... 33 CCPR1H Register ...............................................................19
AN556 ......................................................................... 29 CCPR1L Register ................................................................19
AN578 ......................................................................... 63 Clocking Scheme.................................................................15
AN594 ......................................................................... 57 Code Examples
AN607 ....................................................................... 107 Call of a Subroutine in Page 1 from Page 0 ................30
Architecture Changing Between Capture Prescalers ......................58
Harvard ......................................................................... 9 Changing Prescaler (Timer0 to WDT) .........................49
Overview ....................................................................... 9 Changing Prescaler (WDT to Timer0) .........................49
von Neumann................................................................ 9 Doing an A/D Conversion ............................................84
Assembler I/O Programming .........................................................41
MPASM Assembler................................................... 138 I2C Module Operation..................................................78
B Indirect Addressing......................................................30
Initializing PORTA .......................................................31
BF ....................................................................................... 74
Initializing PORTB .......................................................33
Block Diagrams
Initializing PORTC .......................................................35
A/D .............................................................................. 81
Initializing PORTD .......................................................36
Capture Mode ............................................................. 58
Initializing PORTE .......................................................38
Compare Mode ........................................................... 58
Initializing PORTF........................................................39
External Brown-out1 ................................................. 112
Initializing PORTG .......................................................40
External Brown-out2 ................................................. 112
Loading the SSPBUF register .....................................65
External Parallel Cystal Oscillator............................. 105
Reading a 16-bit Free-running Timer ..........................53
External Power-on Reset .......................................... 112
Code Protection ........................................................ 103, 118
External Series Crystal Oscillator ............................. 105
Computed GOTO ................................................................29
Interrupt Logic ........................................................... 114
Configuration Bits ............................................................. 103
LCD Module ................................................................ 90
On-Chip Reset Circuit ............................................... 106 D
PIC16C923 ................................................................. 10 DC bit...................................................................................23
PIC16C924 ................................................................. 11 DC Characteristics.................................................... 142, 143
PORTC ....................................................................... 35 Development Support ....................................................... 137
PORTD ................................................................. 36, 37 Development Tools........................................................... 137
PORTE........................................................................ 38 Digit Carry bit .........................................................................9

 1997 Microchip Technology Inc. DS30444E - page 177

PIC16C9XX
Direct Addressing................................................................ 30 NOP .......................................................................... 131
E OPTION .................................................................... 131
RETFIE ..................................................................... 131
Electrical Characteristics................................................... 141
RETLW ..................................................................... 132
External Power-on Reset Circuit ....................................... 112
RETURN................................................................... 132
F RLF ........................................................................... 133
Family of Devices RRF .......................................................................... 133
PIC16C9XX................................................................... 6 SLEEP ...................................................................... 134
FSR ................................................................................... 108 SUBLW ..................................................................... 134
FSR Register............................................... 19, 20, 21, 22, 30 SUBWF..................................................................... 135
Fuzzy Logic Dev. System (fuzzyTECH-MP)................... 139 SWAPF ..................................................................... 135
G TRIS ......................................................................... 135
XORLW .................................................................... 136
GIE .................................................................................... 113
XORWF .................................................................... 136
I Section...................................................................... 119
I/O Ports INT Interrupt...................................................................... 115
Section ........................................................................ 31 INTCON ............................................................ 109, 113, 115
I/O Programming Considerations........................................ 41 INTCON Register................................ 19, 20, 21, 22, 25, 102
I2C INTEDG ............................................................................ 115
Addressing I2C Devices .............................................. 70 INTEDG bit ......................................................................... 24
Arbitration.................................................................... 72 Inter-Integrated Circuit (I2C) ............................................... 63
BF ......................................................................... 74, 75 Internal Sampling Switch (Rss) Impedance........................ 82
CKP............................................................................. 76 Interrupt Flag .................................................................... 113
Clock Synchronization ................................................ 72 Interrupts................................................................... 103, 113
Combined Format ....................................................... 71 RB7:RB4 Port Change ............................................... 33
I2C Overview............................................................... 69 IRP bit ................................................................................. 23
Initiating and Terminating Data Transfer..................... 69 K
Master-Receiver Sequence ........................................ 71
KeeLoq Evaluation and Programming Tools ................. 139
Master-Transmitter Sequence .................................... 71
Multi-master ................................................................ 72 L
START ........................................................................ 69 Loading of PC ..................................................................... 29
STOP .................................................................... 69, 70 M
Transfer Acknowledge ................................................ 70
MCLR........................................................................ 106, 108
ICEPIC Low-Cost PIC16CXXX In-Circuit Emulator .......... 137
Memory
IDLE_MODE ....................................................................... 78
Data Memory .............................................................. 17
In-Circuit Serial Programming ................................... 103, 118
Maps, PIC16C9XX ..................................................... 17
INDF.................................................................................. 108
Program Memory ........................................................ 17
INDF Register ............................................. 19, 20, 21, 22, 30
MP-DriveWay™ - Application Code Generator ................ 139
Indirect Addressing ............................................................. 30
MPLAB C .......................................................................... 139
Instruction Cycle.................................................................. 15
MPLAB Integrated Development Environment Software.. 138
Instruction Flow/Pipelining .................................................. 15
Instruction Format ............................................................. 119 O
Instruction Set One-Time-Programmable Devices ....................................... 7
ADDLW ..................................................................... 121 OPCODE .......................................................................... 119
ADDWF ..................................................................... 121 OPTION .................................................................... 109, 115
ANDLW ..................................................................... 122 OPTION Register.................................................... 20, 22, 24
ANDWF ..................................................................... 122 Orthogonal ............................................................................ 9
BCF........................................................................... 122 OSC selection................................................................... 103
BSF ........................................................................... 123 Oscillator
BTFSC ...................................................................... 123 HS..................................................................... 104, 107
BTFSS ...................................................................... 124 LP ..................................................................... 104, 107
CALL ......................................................................... 124 Oscillator Configurations................................................... 104
CLRF......................................................................... 125 Output of TMR2 .................................................................. 55
CLRW ....................................................................... 125 P
CLRWDT................................................................... 126
Paging, Program Memory................................................... 29
COMF ....................................................................... 126
PC..................................................................................... 108
DECF ........................................................................ 126
PCL Register .............................................. 19, 20, 21, 22, 29
DECFSZ.................................................................... 127
PCLATH............................................................................ 109
GOTO ....................................................................... 127
PCLATH Register ....................................... 19, 20, 21, 22, 29
INCF.......................................................................... 128
PCON ............................................................................... 109
INCFSZ ..................................................................... 128
PCON Register ................................................................... 28
IORLW ...................................................................... 129
PD............................................................................. 106, 108
IORWF ...................................................................... 129
PD bit .................................................................................. 23
MOVF........................................................................ 130
PICDEM-1 Low-Cost PICmicro Demo Board ................... 138
MOVLW .................................................................... 130
PICDEM-2 Low-Cost PIC16CXX Demo Board................. 138
MOVWF .................................................................... 130
PICDEM-3 Low-Cost PIC16CXXX Demo Board .............. 138

DS30444E - page 178  1997 Microchip Technology Inc.

 PIC16C9XX
PICMASTER In-Circuit Emulator ................................... 137 Oscillator Start-up Timer (OST)........................ 103, 107
PICSTART Plus Entry Level Development System ....... 137 Power Control Register (PCON)............................... 107
PIE1 .................................................................................. 113 Power-on Reset (POR)............................. 103, 107, 108
PIE1 Register........................................................ 20, 26, 102 Power-up Timer (PWRT) .................................. 103, 107
Pin Functions Power-Up-Timer (PWRT) ......................................... 107
MCLRVPP.................................................................... 12 Time-out Sequence .................................................. 107
OSC1/CLKIN............................................................... 12 Time-out Sequence on Power-up............................. 111
OSC2/CLKOUT........................................................... 12 TO..................................................................... 106, 108
RA0/AN0 ..................................................................... 12 POR bit ................................................................................28
RA1/AN1 ..................................................................... 12 Port RB Interrupt............................................................... 115
RA2/AN2 ..................................................................... 12 PORTA Register ........................................................... 19, 31
RA3/AN3/VREF ............................................................ 12 PORTB ....................................................................... 77, 108
RA4/T0CKI.................................................................. 12 PORTB Register ..................................................... 19, 21, 33
RA5/AN4/SS ............................................................... 12 PORTC ............................................................................. 108
RB0/INT ...................................................................... 12 PORTC Register........................................................... 19, 35
RB1 ............................................................................. 12 PORTD ............................................................................. 109
RB2 ............................................................................. 12 PORTD Register..................................................................36
RB3 ............................................................................. 12 PORTE ............................................................................. 109
RB4 ............................................................................. 12 PORTE Register ..................................................................38
RB5 ............................................................................. 12 PORTF Register ..................................................................39
RB6 ............................................................................. 12 PORTG Register .................................................................40
RB7 ............................................................................. 12 Ports
RC0/T1OSO/T1CKI .................................................... 12 PORTA ........................................................................31
RC1/T1OSI ................................................................. 12 PORTB ........................................................................33
RC2/CCP1 .................................................................. 12 PORTC ........................................................................35
RC3/SCK/SCL ............................................................ 12 PORTD ........................................................................36
RC4/SDI/SDA ............................................................. 12 PORTE ........................................................................38
RC5/SDO .................................................................... 12 PORTF ........................................................................39
RD0/SEG00 ................................................................ 13 PORTG........................................................................40
RD1/SEG01 ................................................................ 13 Power-down Mode (SLEEP)............................................. 117
RD2/SEG02 ................................................................ 13 PR2................................................................................... 109
RD3/SEG03 ................................................................ 13 PR2 Register .......................................................................20
RD4/SEG04 ................................................................ 13 Prescaler, Switching Between Timer0 and WDT.................49
RD5/SEG29/COM3..................................................... 13 PRO MATE II Universal Programmer ............................ 137
RD6/SEG30/COM2..................................................... 13 Program Branches.................................................................9
RD7/SEG31/COM1..................................................... 13 Program Memory Maps, PIC16C9XX..................................17
RE0/SEG05 ................................................................ 13 PS0 bit .................................................................................24
RE1/SEG06 ................................................................ 13 PS1 bit .................................................................................24
RE2/SEG07 ................................................................ 13 PS2 bit .................................................................................24
RE3/SEG08 ................................................................ 13 PSA bit.................................................................................24
RE4/SEG09 ................................................................ 13 PUSH...................................................................................29
RE5/SEG10 ................................................................ 13 Q
RE6/SEG11 ................................................................ 13
Quick-Turnaround-Production ...............................................7
RE7/SEG27 ................................................................ 13
RF0/SEG12................................................................. 13 R
RF1/SEG13................................................................. 13 R/W bit .............................................................. 70, 74, 75, 76
RF2/SEG14................................................................. 13 RBIF bit....................................................................... 33, 115
RF3/SEG15................................................................. 13 RBPU bit ..............................................................................24
RF4/SEG16................................................................. 13 RC Oscillator .................................................... 104, 105, 107
RF5/SEG17................................................................. 13 RCV_MODE ........................................................................78
RF6/SEG18................................................................. 13 Read-Modify-Write...............................................................41
RF7/SEG19................................................................. 13 Register File ........................................................................17
RG0/SEG20 ................................................................ 13 Reset ........................................................................ 103, 106
RG1/SEG21 ................................................................ 13 RP0 bit .......................................................................... 17, 23
RG2/SEG22 ................................................................ 13 RP1 bit .................................................................................23
RG3/SEG23 ................................................................ 13 S
RG4/SEG24 ................................................................ 13
SCL......................................................................... 74, 76, 77
RG5/SEG25 ................................................................ 13
SDA .............................................................................. 76, 77
RG6/SEG26 ................................................................ 13
SEEVAL Evaluation and Programming System ............ 139
RG7/SEG28 ................................................................ 13
Serialized Quick-Turnaround-Production ..............................7
VDD ............................................................................. 14
Slave Mode
VSS .............................................................................. 14
SCL..............................................................................74
PIR1 .................................................................................. 113
SDA .............................................................................74
PIR1 Register.............................................................. 19, 102
SLEEP ...................................................................... 103, 106
POP .................................................................................... 29
Software Simulator (MPLAB-SIM) .................................... 139
POR .......................................................................... 107, 108
Special Features of the CPU ............................................ 103

 1997 Microchip Technology Inc. DS30444E - page 179

PIC16C9XX
Special Function Registers, Section ................................... 19 Interrupt Timing .................................................. 46
SPI Overview............................................................. 43
Master Mode ............................................................... 66 Prescaler ............................................................ 48
Serial Clock ................................................................. 65 Prescaler Block Diagram .................................... 48
Serial Data In .............................................................. 65 Section................................................................ 45
Serial Data Out ........................................................... 65 Synchronization .................................................. 47
Serial Peripheral Interface (SPI) ................................. 63 Timing................................................................. 45
Slave Select ................................................................ 65 Timer1
SPI clock ..................................................................... 66 Capacitor Selection ............................................ 53
SPI Mode .................................................................... 65 Overview............................................................. 43
SSP Switching Prescaler Assignment ........................ 49
SSPADD ....................................................... 73, 74, 109 Timer2
SSPBUF............................................ 66, 73, 74, 76, 109 Overview............................................................. 43
SSPCON ........................................... 64, 73, 75, 76, 109 Timing Diagrams
SSPIF bit................................................... 74, 75, 76, 77 A/D Conversion ........................................................ 159
SSPOV bit................................................................... 74 Timer0 ........................................................................ 45
SSPSR............................................................ 66, 74, 76 Timer0 Interrupt Timing .............................................. 46
SSPSTAT.......................................... 63, 73, 75, 76, 109 Timer0 with External Clock ......................................... 47
SSP I2C Timing Diagrams and Specifications ................................ 148
Addressing .................................................................. 74 TMR0 Register.............................................................. 19, 21
Multi-master Mode ...................................................... 77 TMR1H Register ................................................................. 19
Reception.................................................................... 75 TMR1IE bit.......................................................................... 26
SSP I2C Operation...................................................... 73 TMR1IF bit .......................................................................... 27
START ........................................................................ 76 TMR1L Register.................................................................. 19
START (S) .................................................................. 77 TMR2 Register.................................................................... 19
STOP (P) .................................................................... 77 TMR2IE bit.......................................................................... 26
Transmission............................................................... 76 TMR2IF bit .......................................................................... 27
SSPADD Register ............................................................... 20 TO bit .................................................................................. 23
SSPBUF Register ............................................................... 19 TRISA Register....................................................... 20, 22, 31
SSPCON Register............................................................... 19 TRISB ............................................................................... 109
SSPIE bit............................................................................. 26 TRISB Register....................................................... 20, 22, 33
SSPIF bit ............................................................................. 27 TRISC ......................................................................... 77, 109
SSPOV................................................................................ 74 TRISC Register....................................................... 20, 35, 68
SSPSTAT Register ............................................................. 20 TRISD ............................................................................... 109
Stack ................................................................................... 29 TRISD Register................................................................... 36
Overflows .................................................................... 29 TRISE ............................................................................... 109
Underflow.................................................................... 29 TRISE Register....................................................... 38, 39, 40
STATUS ............................................................................ 108 Two’s Complement ............................................................... 9
STATUS Register.............................................. 19, 20, 21, 22 U
T UV Erasable Devices............................................................ 7
T0CS bit .............................................................................. 24 W
T1CON Register.......................................................... 19, 102
W ...................................................................................... 108
T2CON Register.................................................................. 19
W Register
TAD ...................................................................................... 83
ALU............................................................................... 9
Timer Modules, Overview ................................................... 43
Wake-up from SLEEP....................................................... 117
Timer0
Watchdog Timer (WDT)............................ 103, 106, 108, 116
RTCC ........................................................................ 108
WDT.................................................................................. 108
T0IF........................................................................... 115
Period ....................................................................... 116
TMR0 Interrupt .......................................................... 115
Programming Considerations ................................... 116
Timer1
Timeout..................................................................... 108
Resetting of Timer1 Registers .................................... 54
Resetting Timer1 using a CCP Trigger Output ........... 54 X
T1CON................................................................ 51, 109 XMIT_MODE ...................................................................... 78
TMR1H...................................................................... 109 XT ............................................................................. 104, 107
TMR1L ...................................................................... 109 Z
Timer2
Z bit..................................................................................... 23
T2CON................................................................ 55, 109
Zero bit.................................................................................. 9
TIMER2 (TMR2) Module ............................................. 55
TMR2 ........................................................................ 109
Timers
Timer0
Block Diagram..................................................... 45
External Clock..................................................... 47
External Clock Timing ......................................... 47
Increment Delay.................................................. 47
Interrupt............................................................... 45

DS30444E - page 180  1997 Microchip Technology Inc.

 PIC16C9XX
List of Equations And Examples Figure 8-1: T1CON: Timer1 Control Register (Address
10h) .............................................................51
Example 3-1: Instruction Pipeline Flow............................. 15 Figure 8-2: Timer1 Block Diagram.................................52
Example 4-1: Call of a Subroutine in Page 1 from Page 0 30 Figure 9-1: Timer2 Block Diagram.................................55
Example 4-2: Indirect Addressing ..................................... 30 Figure 9-2: T2CON: Timer2 Control Register (Address
Example 5-1: Initializing PORTA....................................... 31 12h) .............................................................55
Example 5-2: Initializing PORTB....................................... 33 Figure 10-1: CCP1CON Register (Address 17h).............57
Example 5-3: Initializing PORTC ...................................... 35 Figure 10-2: Capture Mode Operation Block Diagram ....58
Example 5-4: Initializing PORTD ...................................... 36 Figure 10-3: Compare Mode Operation Block Diagram ..58
Example 5-5: Initializing PORTE....................................... 38 Figure 10-4: Simplified PWM Block Diagram...................59
Example 5-6: Initializing PORTF....................................... 39 Figure 10-5: PWM Output................................................59
Example 5-7: Initializing PORTG ...................................... 40 Figure 11-1: SSPSTAT: Sync Serial Port Status Register
Example 5-8: Read-Modify-Write Instructions on an (Address 94h)..............................................63
I/O Port ....................................................... 41 Figure 11-2: SSPCON: Sync Serial Port Control Register
Example 7-1: Changing Prescaler (Timer0→WDT).......... 49 (Address 14h)..............................................64
Example 7-2: Changing Prescaler (WDT→Timer0).......... 49 Figure 11-3: SSP Block Diagram (SPI Mode)..................65
Example 8-1: Reading a 16-bit Free-Running Timer ........ 53 Figure 11-4: SPI Master/Slave Connection .....................66
Example 10-1: Changing Between Capture Prescalers...... 58 Figure 11-5: SPI Mode Timing, Master Mode..................67
Example 10-2: PWM Period and Duty Cycle Calculation ... 60 Figure 11-6: SPI Mode Timing
Example 11-1: Loading the SSPBUF (SSPSR) Register.... 65 (Slave Mode With CKE = 0) ........................67
Equation 12-1: A/D Minimum Charging Time...................... 82 Figure 11-7: SPI Mode Timing
Example 12-1: Calculating the Minimum Required (Slave Mode With CKE = 1) ........................68
Sample Time............................................... 82 Figure 11-8: Start and Stop Conditions ...........................69
Example 12-2: Doing an A/D Conversion ........................... 84 Figure 11-9: 7-bit Address Format...................................70
Example 12-3: 4-bit vs. 8-bit Conversion Times ................. 85 Figure 11-10: I2C 10-bit Address Format...........................70
Example 13-1: Static MUX with 32 Segments .................. 100 Figure 11-11: Slave-receiver Acknowledge .......................70
Example 13-2: 1/3 MUX with 13 Segments ...................... 100 Figure 11-12: Data Transfer Wait State.............................70
Example 14-1: Saving STATUS, W, and PCLATH Figure 11-13: Master-transmitter Sequence ......................71
Registers in RAM...................................... 115 Figure 11-14: Master-receiver Sequence ..........................71
Figure 11-15: Combined Format........................................71
List of Figures Figure 11-16: Multi-master Arbitration
(Two Masters) .............................................72
Figure 3-1: PIC16C923 Block Diagram......................... 10 Figure 11-17: Clock Synchronization.................................72
Figure 3-2: PIC16C924 Block Diagram......................... 11 Figure 11-18: SSP Block Diagram
Figure 3-3: Clock/Instruction Cycle ............................... 15 (I2C Mode)...................................................73
Figure 4-1: Program Memory Map and Stack ............... 17 Figure 11-19: I2C Waveforms for Reception
Figure 4-2: Register File Map........................................ 18 (7-bit Address).............................................75
Figure 4-3: Status Register (Address 03h, 83h, 103h, Figure 11-20: I2C Waveforms for Transmission
183h)........................................................... 23 (7-bit Address).............................................76
Figure 4-4: OPTION Register (Address 81h, 181h) ...... 24 Figure 11-21: Operation of the I2C Module in IDLE_MODE,
Figure 4-5: INTCON Register (Address 0Bh, 8Bh, RCV_MODE or XMIT_MODE .....................78
10Bh, 18Bh)................................................ 25 Figure 12-1: ADCON0 Register (Address 1Fh) ...............79
Figure 4-6: PIE1 Register (Address 8Ch) ..................... 26 Figure 12-2: ADCON1 Register (Address 9Fh) ...............80
Figure 4-7: PIR1 Register (Address 0Ch) ..................... 27 Figure 12-3: A/D Block Diagram ......................................81
Figure 4-8: PCON Register (Address 8Eh) ................... 28 Figure 12-4: Analog Input Model .....................................82
Figure 4-9: Loading of PC In Different Situations.......... 29 Figure 12-5: A/D Transfer Function .................................87
Figure 4-10: Direct/Indirect Addressing........................... 30 Figure 12-6: Flowchart of A/D Operation .........................88
Figure 5-1: Block Diagram of pins RA3:RA0 and RA5.. 31 Figure 13-1: LCDCON Register (Address 10Fh) .............89
Figure 5-2: Block Diagram of RA4/T0CKI Pin ............... 31 Figure 13-2: LCD Module Block Diagram ........................90
Figure 5-3: Block Diagram of RB3:RB0 Pins ................ 33 Figure 13-3: LCDPS Register (Address 10Eh) ................90
Figure 5-4: Block Diagram of RB7:RB4 Pins ................ 33 Figure 13-4: Waveforms in Static Drive ...........................91
Figure 5-5: PORTC Block Diagram (Peripheral Output Figure 13-5: Waveforms in 1/2 MUX, 1/3 Bias Drive .......92
Override)..................................................... 35 Figure 13-6: Waveforms in 1/3 MUX, 1/3 Bias ................93
Figure 5-6: PORTD<4:0> Block Diagram...................... 36 Figure 13-7: Waveforms in 1/4 MUX, 1/3 Bias ................94
Figure 5-7: PORTD<7:5> Block Diagram...................... 37 Figure 13-8: LCD Clock Generation ................................95
Figure 5-8: PORTE Block Diagram ............................... 38 Figure 13-9: Example Waveforms in 1/4 MUX Drive .......97
Figure 5-9: PORTF Block Diagram ............................... 39 Figure 13-10: Generic LCDD Register Layout...................98
Figure 5-10: PORTG Block Diagram............................... 40 Figure 13-11: Sleep Entry/exit When SLPEN = 1 or
Figure 5-11: Successive I/O Operation ........................... 41 CS1:CS0 = 00 .............................................99
Figure 7-1: Timer0 Block Diagram ................................ 45 Figure 13-12: LCDSE Register (Address 10Dh)............. 100
Figure 7-2: Timer0 Timing: Internal Clock/No Prescale 45 Figure 13-13: Charge Pump and Resistor Ladder.......... 101
Figure 7-3: Timer0 Timing: Internal Clock/Prescale 1:2 46 Figure 14-1: Configuration Word .................................. 103
Figure 7-4: Timer0 Interrupt Timing .............................. 46 Figure 14-2: Crystal/Ceramic Resonator Operation
Figure 7-5: Timer0 Timing with External Clock ............. 47 (HS, XT or LP OSC Configuration)........... 104
Figure 7-6: Block Diagram of the Timer0/WDT Figure 14-3: External Clock Input Operation
Prescaler..................................................... 48 (HS, XT or LP OSC Configuration)........... 104

 1997 Microchip Technology Inc. DS30444E - page 181

PIC16C9XX
Figure 14-4: External Parallel Resonant Crystal Figure 18-14: Typical IDD vs. Frequency
Oscillator Circuit........................................ 105 (RC Mode @ 20 pF, 25°C) ....................... 164
Figure 14-5: External Series Resonant Crystal Figure 18-15: Maximum IDD vs. Frequency
Oscillator Circuit........................................ 105 (RC Mode @ 20 pF, -40°C to +85°C)....... 164
Figure 14-6: RC Oscillator Mode................................... 105 Figure 18-16: Typical IDD vs. Frequency
Figure 14-7: Simplified Block Diagram of On-chip (RC Mode @ 100 pF, 25°C) ..................... 165
Reset Circuit ............................................. 106 Figure 18-17: Maximum IDD vs. Frequency
Figure 14-8: Time-out Sequence on Power-up (RC Mode @ 100 pF, -40°C to +85°C)..... 165
(MCLR not Tied to VDD): Case 1 .............. 111 Figure 18-18: Typical IDD vs. Frequency
Figure 14-9: Time-out Sequence on Power-up (RC Mode @ 300 pF, 25°C) ..................... 166
(MCLR Not Tied To VDD): Case 2............. 111 Figure 18-19: Maximum IDD vs. Frequency
Figure 14-10: Time-out Sequence on Power-up (RC Mode @ 300 pF, -40°C to +85°C)..... 166
(MCLR Tied to VDD).................................. 111 Figure 18-20: Transconductance(gm) of HS Oscillator
Figure 14-11: External Power-on Reset Circuit vs. VDD ..................................................... 167
(for Slow VDD Power-up)........................... 112 Figure 18-21: Transconductance(gm) of LP Oscillator
Figure 14-12: External Brown-out Protection Circuit 1 .... 112 vs. VDD ..................................................... 167
Figure 14-13: External Brown-out Protection Circuit 2 .... 112 Figure 18-22: Transconductance(gm) of XT Oscillator
Figure 14-14: Interrupt Logic........................................... 114 vs. VDD ..................................................... 167
Figure 14-15: INT Pin Interrupt Timing............................ 114 Figure 18-23: Typical XTAL Startup Time vs. VDD
Figure 14-16: Watchdog Timer Block Diagram ............... 116 (LP Mode, 25°C)....................................... 168
Figure 14-17: Summary of Watchdog Timer Registers ... 116 Figure 18-24: Typical XTAL Startup Time vs. VDD
Figure 14-18: Wake-up from Sleep Through Interrupt .... 118 (HS Mode, 25°C) ...................................... 168
Figure 14-19: Typical In-Circuit Serial Programming Figure 18-25: Typical XTAL Startup Time vs. VDD
Connection................................................ 118 (XT Mode, 25°C) ..................................... 168
Figure 15-1: General Format for Instructions ................ 119 Figure 18-26: Typical IDD vs. VDD
Figure 17-1: LCD Voltage Waveform ............................ 145 (LP Mode @ 25°C) ................................... 168
Figure 17-2: Load Conditions........................................ 147 Figure 18-27: Maximum IDD vs. VDD
Figure 17-3: External Clock Timing ............................... 148 (LP Mode -40°C to +85°C) ....................... 168
Figure 17-4: CLKOUT and I/O Timing........................... 149 Figure 18-28: Typical IDD vs. VDD
Figure 17-5: Reset, Watchdog Timer, Oscillator Start-up (XT Mode @ 25°C)................................... 169
Timer and Power-up Timer Timing ........... 150 Figure 18-29: Maximum IDD vs. VDD
Figure 17-6: Timer0 and Timer1 External Clock (XT Mode -40°C to +85°C) ....................... 169
Timings ..................................................... 151 Figure 18-30: Typical IDD vs. VDD
Figure 17-7: Capture/Compare/PWM Timings .............. 152 (HS Mode @ 25°C) .................................. 169
Figure 17-8: SPI Master Mode Timing (CKE = 0) ......... 153 Figure 18-31: Maximum IDD vs. VDD
Figure 17-9: SPI Master Mode Timing (CKE = 1) ......... 153 (HS Mode -40°C to +85°C)....................... 169
Figure 17-10: SPI Slave Mode Timing (CKE = 0) ........... 154
Figure 17-11: SPI Slave Mode Timing (CKE = 1) ........... 154 List of Tables
Figure 17-12: I2C Bus Start/Stop Bits Timing.................. 156
Figure 17-13: I2C Bus Data Timing ................................. 157 Table 1-1: PIC16C9XX Family of Devices..................... 6
Figure 17-14: A/D Conversion Timing ............................. 159 Table 3-1: PIC16C9XX Pinout Description .................. 12
Figure 18-1: Typical IPD vs. VDD (WDT Disabled, Table 4-1: Special Function Register Summary .......... 19
RC Mode @ 25°C).................................... 161 Table 5-1: PORTA Functions ...................................... 32
Figure 18-2: Maximum IPD vs. VDD (WDT Disabled, Table 5-2: Summary of Registers Associated with
RC Mode -40°C to +85°C) ........................ 161 PORTA ....................................................... 32
Figure 18-3: Typical IPD vs. VDD (WDT Enabled, Table 5-3: PORTB Functions ...................................... 34
RC Mode @ 25°C).................................... 161 Table 5-4: Summary of Registers Associated with
Figure 18-4: Maximum IPD vs. VDD (WDT Enabled, PORTB ....................................................... 34
RC Mode -40°C to +85°C) ........................ 161 Table 5-5: PORTC Functions ...................................... 35
Figure 18-5: Typical IPD vs. VDD (LCD on(1), Internal Table 5-6: Summary of Registers Associated with
RC(2), RC Mode @ 25°C) ........................ 162 PORTC ....................................................... 35
Figure 18-6: Maximum IPD vs. VDD (LCD on (32 kHz(1)), Table 5-7: PORTD Functions ...................................... 37
Internal RC (32 kHz(2)), RC Mode -40°C to Table 5-8: Summary of Registers Associated with
+85°C)....................................................... 162 PORTD ....................................................... 37
Figure 18-7: Typical IPD vs. VDD (LCD On(1), Timer1 Table 5-9: PORTE Functions ...................................... 38
(32 kHz(2)), RC Mode @ 25°C)................ 162 Table 5-10: Summary of Registers Associated with
Figure 18-8: Maximum IPD vs. VDD (LCD On(1), Timer1 PORTE ....................................................... 38
(32 kHz(2)), RC Mode -40°C to +85°C) .... 162 Table 5-11: PORTF Functions....................................... 39
Figure 18-9: Typical RC Oscillator Frequency vs. VDD . 163 Table 5-12: Summary of Registers Associated with
Figure 18-10: Typical RC Oscillator Frequency vs. VDD . 163 PORTF ....................................................... 39
Figure 18-11: Typical RC Oscillator Frequency vs. VDD . 163 Table 5-13: PORTG Functions ...................................... 40
Figure 18-12: Typical IPD vs. Timer1 Enabled (32 kHz, Table 5-14: Summary of Registers Associated with
RC0/RC1 = 33 pF/33 pF, RC Mode)......... 163 PORTG....................................................... 40
Figure 18-13: Maximum IPD vs. Timer1 Enabled Table 7-1: Registers Associated with Timer0 .............. 49
(32 kHz, RC0/RC1 = 33 pF/33 pF, 85°C to Table 8-1: Capacitor Selection for the Timer1
-40°C, RC Mode) ...................................... 163 Oscillator .................................................... 53

DS30444E - page 182  1997 Microchip Technology Inc.

 PIC16C9XX
Table 8-2: Registers Associated with Timer1 as a
Timer/counter.............................................. 54
Table 9-1: Registers Associated with Timer2 as a
Timer/Counter............................................. 56
Table 10-1: CCP Mode - Timer Resource ..................... 57
Table 10-2: Example PWM Frequencies and
Resolutions at 8 MHz.................................. 60
Table 10-3: Registers Associated with Timer1,
Capture and Compare ................................ 61
Table 10-4: Registers Associated with PWM and
Timer2......................................................... 61
Table 11-1: Registers Associated with SPI Operation ... 68
Table 11-2: I2C Bus Terminology................................... 69
Table 11-3: Data Transfer Received Byte Actions......... 74
Table 11-4: Registers Associated with I2C Operation.... 77
Table 12-1: TAD vs. Device Operating Frequencies ...... 83
Table 12-2: Summary of A/D Registers ......................... 88
Table 13-1: Frame Frequency Formulas ....................... 96
Table 13-2: Approx. Frame Freq in Hz using Timer1 @
32.768 kHz or Fosc @ 8 MHz..................... 96
Table 13-3: Approx. Frame Freq in Hz using internal
RC osc @ 14 kHz ....................................... 96
Table 13-4: Summary of Registers Associated with
the LCD Module........................................ 102
Table 14-1: Ceramic Resonators ................................. 104
Table 14-2: Capacitor Selection for Crystal Oscillator . 104
Table 14-3: Time-out in Various Situations.................. 107
Table 14-4: Status Bits and Their Significance ............ 108
Table 14-5: Reset Condition for Special Registers ...... 108
Table 14-6: Initialization Conditions for all Registers ... 108
Table 15-1: Opcode Field Descriptions........................ 119
Table 15-2: PIC16CXXX Instruction Set ...................... 120
Table 16-1: development tools from microchip ............ 140
Table 17-1: Cross Reference of Device Specs for
Oscillator Configurations and Frequencies
of Operation (Commercial Devices).......... 141
Table 17-2: LCD Module Electrical Specifications ....... 145
Table 17-3: VLCD Charge Pump Electrical
Specifications............................................ 145
Table 17-4: External Clock Timing Requirements ....... 148
Table 17-5: CLKOUT and I/O Timing Requirements ... 149
Table 17-6: Reset, Watchdog Timer, Oscillator
Start-up Timer and Power-up Timer
Requirements ........................................... 150
Table 17-7: Timer0 and Timer1 External Clock
Requirements ........................................... 151
Table 17-8: Capture/Compare/PWM Requirements .... 152
Table 17-9: SPI Mode Requirements........................... 155
Table 17-10: I2C Bus Start/Stop Bits Requirements ...... 156
Table 17-11: I2C Bus Data Requirements ..................... 157
Table 17-12: A/D Converter Characteristics:
PIC16C924-04 (Commercial, Industrial)
PIC16LC924-04 (Commercial, Industrial). 158
Table 17-13: A/D Conversion Requirements ................. 159
Table 18-1: RC Oscillator Frequencies........................ 167

 1997 Microchip Technology Inc. DS30444E - page 183

PIC16C9XX

DS30444E - page 184  1997 Microchip Technology Inc.

 PIC16C9XX
ON-LINE SUPPORT The procedure to connect will vary slightly from country
to country. Please check with your local CompuServe
Microchip provides two methods of on-line support. agent for details if you have a problem. CompuServe
These are the Microchip BBS and the Microchip World service allow multiple users various baud rates
Wide Web (WWW) site. depending on the local point of access.
Use Microchip's Bulletin Board Service (BBS) to get The following connect procedure applies in most loca-
current information and help about Microchip products. tions.
Microchip provides the BBS communication channel for
you to use in extending your technical staff with micro- 1. Set your modem to 8-bit, No parity, and One stop
controller and memory experts. (8N1). This is not the normal CompuServe setting
which is 7E1.
To provide you with the most responsive service possi-
2. Dial your local CompuServe access number.
ble, the Microchip systems team monitors the BBS,
posts the latest component data and software tool 3. Depress the <Enter> key and a garbage string will
updates, provides technical help and embedded sys- appear because CompuServe is expecting a 7E1
tems insights, and discusses how Microchip products setting.
provide project solutions. 4. Type +, depress the <Enter> key and “Host Name:”
will appear.
The web site, like the BBS, is used by Microchip as a
means to make files and information easily available to 5. Type MCHIPBBS, depress the <Enter> key and you
customers. To view the site, the user must have access will be connected to the Microchip BBS.
to the Internet and a web browser, such as Netscape or In the United States, to find CompuServe's phone num-
Microsoft Explorer. Files are also available for FTP ber closest to you, set your modem to 7E1 and dial
download from our FTP site. (800) 848-4480 for 300-2400 baud or (800) 331-7166
Connecting to the Microchip Internet Web Site for 9600-14400 baud connection. After the system
responds with “Host Name:”, type NETWORK, depress
The Microchip web site is available by using your favor- the <Enter> key and follow CompuServe's directions.
ite Internet browser to attach to:
www.microchip.com For voice information (or calling from overseas), you
may call (614) 723-1550 for your local CompuServe
The file transfer site is available by using an FTP ser- number.
vice to connect to:
ftp.mchip.com/biz/mchip Microchip regularly uses the Microchip BBS to distrib-
ute technical information, application notes, source
The web site and file transfer site provide a variety of
code, errata sheets, bug reports, and interim patches
services. Users may download files for the latest Devel-
for Microchip systems software products. For each SIG,
opment Tools, Datasheets, Application Notes, User's
a moderator monitors, scans, and approves or disap-
Guides, Articles and Sample Programs. A variety of
proves files submitted to the SIG. No executable files
Microchip specific business information is also avail-
are accepted from the user community in general to
able, including listings of Microchip sales offices, dis-
limit the spread of computer viruses.
tributors and factory representatives. Other data
available for consideration is: Systems Information and Upgrade Hot Line
• Latest Microchip Press Releases The Systems Information and Upgrade Line provides
• Technical Support Section with Frequently Asked system users a listing of the latest versions of all of
Questions Microchip's development systems software products.
• Design Tips Plus, this line provides information on how customers
can receive any currently available upgrade kits.The
• Device Errata
Hot Line Numbers are:
• Job Postings
• Microchip Consultant Program Member Listing 1-800-755-2345 for U.S. and most of Canada, and
• Links to other useful web sites related to 1-602-786-7302 for the rest of the world.
Microchip Products
Connecting to the Microchip BBS Trademarks: The Microchip name, logo, PIC, PICSTART,
Connect worldwide to the Microchip BBS using either PICMASTER and PRO MATE are registered trademarks of
the Internet or the CompuServe communications net- Microchip Technology Incorporated in the U.S.A. and other
work. countries. PICmicro, ICSP, MPLAB and fuzzyLAB are
trademarks and SQTP is a service mark of Microchip in
Internet: the U.S.A.
You can telnet or ftp to the Microchip BBS at the fuzzyTECH is a registered trademark of Inform Software
address: mchipbbs.microchip.com Corporation. IBM, IBM PC-AT are registered trademarks of
International Business Machines Corp. Pentium is a trade-
CompuServe Communications Network: mark of Intel Corporation. Windows is a trademark and
When using the BBS via the Compuserve Network, in MS-DOS, Microsoft Windows are registered trademarks
most cases, a local call is your only expense. The of Microsoft Corporation. CompuServe is a registered
trademark of CompuServe Incorporated.
Microchip BBS connection does not use CompuServe
membership services, therefore you do not need Com- All other trademarks mentioned herein are the property of
puServe membership to join Microchip's BBS. There is their respective companies.
no charge for connecting to the Microchip BBS.

 1997 Microchip Technology Inc. DS30444E - page 185

PIC16C9XX
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (602) 786-7578.
Please list the following information, and use this outline to provide us with your comments about this Data Sheet.

To: Technical Publications Manager Total Pages Sent

RE: Reader Response

From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________ FAX: (______) _________ - _________
Application (optional):
Would you like a reply? Y N

Device: PIC16C9XX Literature Number: DS30444E

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this data sheet easy to follow? If not, why?

4. What additions to the data sheet do you think would enhance the structure and subject?

5. What deletions from the data sheet could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

8. How would you improve our software, systems, and silicon products?

DS30444E - page 186  1997 Microchip Technology Inc.

 PIC16C9XX
PIC16C9XX PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery refer to the factory or the listed sales office.
PART NO. -XX X /XX XXX Examples
Pattern: QTP, SQTP, ROM Code or Special Requirements a) PIC16C924 - 04/P 301
Package: SP = 64-pin Shrink PDIP Commercial Temp.,
PT = TQFP PDIP Package, 4 MHz,
CL = 68-pin Windowed CERQUAD normal VDD limits, QTP
L = PLCC pattern #301
b) PIC16LC923 - 04/PT
Temperature - = 0°C to +70°C (T for Tape/Reel) Commercial Temp.,
Range: I = -40°C to +85°C (S for Tape/Reel)
TQFP package, 4 MHz,
extended VDD limits
Frequency 04 = 200 kHz (PIC16C9XX-04)
04 = 4 MHz c) PIC16C923 - 08I/CL
Range:
08 = 8 MHz Industrial Temp.,
Windowed CERQUAD
Device PIC16C9XX :VDD range 4.0V to 6.0V package, 8 MHz, normal
PIC16C9XXT :VDD range 4.0V to 6.0V (Tape/Reel) VDD limits
PIC16LC9XX :VDD range 2.5V to 6.0V
PIC16LC9XT :VDD range 2.5V to 6.0V (Tape/Reel)

* CL Devices are UV erasable and can be programmed to any device configuration. CL Devices meet the electrical requirement of
each oscillator type (including LC devices).

Sales and Support

Products supported by a preliminary Data Sheet may possibly have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office (see below)
2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277
3. The Microchip’s Bulletin Board, via your local CompuServe number (CompuServe membership NOT required).
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
For latest version information and upgrade kits for Microchip Development Tools, please call 1-800-755-2345 or 1-602-786-7302.

 1997 Microchip Technology Inc. DS30444E - page 187

Note the following details of the code protection feature on PICmicro® MCUs.

• The PICmicro family meets the specifications contained in the Microchip Data Sheet.
• Microchip believes that its family of PICmicro microcontrollers is one of the most secure products of its kind on the market today,
when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowl-
edge, require using the PICmicro microcontroller in a manner outside the operating specifications contained in the data sheet.
The person doing so may be engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable”.
• Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of
our product.
If you have any further questions about this matter, please contact the local sales office nearest to you.

Information contained in this publication regarding device Trademarks

applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to The Microchip name and logo, the Microchip logo, FilterLab,
ensure that your application meets with your specifications. KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
No representation or warranty is given and no liability is PICSTART, PRO MATE, SEEVAL and The Embedded Control
assumed by Microchip Technology Incorporated with respect Solutions Company are registered trademarks of Microchip Tech-
to the accuracy or use of such information, or infringement of nology Incorporated in the U.S.A. and other countries.
patents or other intellectual property rights arising from such
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
use or otherwise. Use of Microchip’s products as critical com-
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
ponents in life support systems is not authorized except with
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
express written approval by Microchip. No licenses are con-
MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
veyed, implicitly or otherwise, under any intellectual property
and Total Endurance are trademarks of Microchip Technology
rights.
Incorporated in the U.S.A.

Serialized Quick Turn Programming (SQTP) is a service mark

of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

© 2002, Microchip Technology Incorporated, Printed in the

U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999. The
Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs and microperipheral
products. In addition, Microchip’s quality
system for the design and manufacture of
development systems is ISO 9001 certified.

 2002 Microchip Technology Inc.

M
WORLDWIDE SALES AND SERVICE
AMERICAS ASIA/PACIFIC Japan
Microchip Technology Japan K.K.
Corporate Office Australia
Benex S-1 6F
2355 West Chandler Blvd. Microchip Technology Australia Pty Ltd
3-18-20, Shinyokohama
Chandler, AZ 85224-6199 Suite 22, 41 Rawson Street
Kohoku-Ku, Yokohama-shi
Tel: 480-792-7200 Fax: 480-792-7277 Epping 2121, NSW
Kanagawa, 222-0033, Japan
Technical Support: 480-792-7627 Australia
Web Address: http://www.microchip.com Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Rocky Mountain China - Beijing Korea
2355 West Chandler Blvd. Microchip Technology Consulting (Shanghai) Microchip Technology Korea
Chandler, AZ 85224-6199 Co., Ltd., Beijing Liaison Office 168-1, Youngbo Bldg. 3 Floor
Tel: 480-792-7966 Fax: 480-792-7456 Unit 915 Samsung-Dong, Kangnam-Ku
Bei Hai Wan Tai Bldg. Seoul, Korea 135-882
Atlanta No. 6 Chaoyangmen Beidajie Tel: 82-2-554-7200 Fax: 82-2-558-5934
500 Sugar Mill Road, Suite 200B Beijing, 100027, No. China Singapore
Atlanta, GA 30350 Tel: 86-10-85282100 Fax: 86-10-85282104 Microchip Technology Singapore Pte Ltd.
Tel: 770-640-0034 Fax: 770-640-0307 200 Middle Road
China - Chengdu
Boston #07-02 Prime Centre
Microchip Technology Consulting (Shanghai)
2 Lan Drive, Suite 120 Singapore, 188980
Co., Ltd., Chengdu Liaison Office
Westford, MA 01886 Tel: 65-6334-8870 Fax: 65-6334-8850
Rm. 2401, 24th Floor,
Tel: 978-692-3848 Fax: 978-692-3821 Taiwan
Ming Xing Financial Tower
Chicago No. 88 TIDU Street Microchip Technology Taiwan
333 Pierce Road, Suite 180 Chengdu 610016, China 11F-3, No. 207
Itasca, IL 60143 Tel: 86-28-6766200 Fax: 86-28-6766599 Tung Hua North Road
Tel: 630-285-0071 Fax: 630-285-0075 Taipei, 105, Taiwan
China - Fuzhou
Dallas Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Microchip Technology Consulting (Shanghai)
4570 Westgrove Drive, Suite 160 Co., Ltd., Fuzhou Liaison Office
Addison, TX 75001 Unit 28F, World Trade Plaza
Tel: 972-818-7423 Fax: 972-818-2924 EUROPE
No. 71 Wusi Road
Detroit Fuzhou 350001, China Denmark
Tri-Atria Office Building Tel: 86-591-7503506 Fax: 86-591-7503521 Microchip Technology Nordic ApS
32255 Northwestern Highway, Suite 190 China - Shanghai Regus Business Centre
Farmington Hills, MI 48334 Microchip Technology Consulting (Shanghai) Lautrup hoj 1-3
Tel: 248-538-2250 Fax: 248-538-2260 Co., Ltd. Ballerup DK-2750 Denmark
Kokomo Room 701, Bldg. B Tel: 45 4420 9895 Fax: 45 4420 9910
2767 S. Albright Road Far East International Plaza France
Kokomo, Indiana 46902 No. 317 Xian Xia Road Microchip Technology SARL
Tel: 765-864-8360 Fax: 765-864-8387 Shanghai, 200051 Parc d’Activite du Moulin de Massy
Los Angeles Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 43 Rue du Saule Trapu
18201 Von Karman, Suite 1090 China - Shenzhen Batiment A - ler Etage
Irvine, CA 92612 91300 Massy, France
Microchip Technology Consulting (Shanghai)
Tel: 949-263-1888 Fax: 949-263-1338 Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Co., Ltd., Shenzhen Liaison Office
New York Rm. 1315, 13/F, Shenzhen Kerry Centre, Germany
150 Motor Parkway, Suite 202 Renminnan Lu Microchip Technology GmbH
Hauppauge, NY 11788 Shenzhen 518001, China Gustav-Heinemann Ring 125
Tel: 631-273-5305 Fax: 631-273-5335 Tel: 86-755-2350361 Fax: 86-755-2366086 D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
San Jose Hong Kong
Microchip Technology Inc. Microchip Technology Hongkong Ltd. Italy
2107 North First Street, Suite 590 Unit 901-6, Tower 2, Metroplaza Microchip Technology SRL
San Jose, CA 95131 223 Hing Fong Road Centro Direzionale Colleoni
Tel: 408-436-7950 Fax: 408-436-7955 Kwai Fong, N.T., Hong Kong Palazzo Taurus 1 V. Le Colleoni 1
Tel: 852-2401-1200 Fax: 852-2401-3431 20041 Agrate Brianza
Toronto
Milan, Italy
6285 Northam Drive, Suite 108 India Tel: 39-039-65791-1 Fax: 39-039-6899883
Mississauga, Ontario L4V 1X5, Canada Microchip Technology Inc.
Tel: 905-673-0699 Fax: 905-673-6509 India Liaison Office United Kingdom
Divyasree Chambers Arizona Microchip Technology Ltd.
1 Floor, Wing A (A3/A4) 505 Eskdale Road
No. 11, O’Shaugnessey Road Winnersh Triangle
Bangalore, 560 025, India Wokingham
Tel: 91-80-2290061 Fax: 91-80-2290062 Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820

03/01/02

 2002 Microchip Technology Inc.