GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Features
RoHS Compliant  Compliant to RoHS EU Directive 2011/65/EU (Z versions)
 Compliant to RoHS EU Directive 2011/65/EU under
exemption 7b (Lead solder exemption). Exemption 7b
will expire after June 1, 2016 at which time this produc
twill no longer be RoHS compliant (non-Z versions)
 Delivers up to 6A Output current
5V (4A), 3.3V (5A), 2.5V – 1.0V (6A each)
 High efficiency – 89% at 5.0V full load
 Low Output voltage- supports migration to future IC
supply voltages down to 1.0V
Applications  Low output ripple and noise
 Wireless Networks  Small Size and low profile
 Distributed power architectures 47.2mm x 29.5mm x 8.5mm
 Optical and Access Network Equipment (1.86 x 1.16 x 0.335 in)
 Enterprise Networks  Surface mount or Through hole (TH)
 Latest generation IC’s (DSP, FPGA, ASIC) and  Remote On/Off
Microprocessor powered applications
 Output overcurrent/Over voltage protection
 Over temperature protection
Options  Single Tightly regulated output
 Remote On/Off logic (positive or negative)
 Output voltage adjustment trim 10%
 Surface Mount (-S Suffix)
 Wide operating temperature range (-40°C to 85°C)
 Additional Vout+ pin (-3 Suffix)
 Meets the voltage insulation requirements for ETSI 300-
132-2 and complies with and is Licensed for Basic
Insulation rating per EN 60950
 CE mark meets 73/23/EEC and 93/68/EEC directives§
 UL* 60950-1Recognized, CSA† C22.2 No. 60950-1-03
Certified, and VDE‡ 0805:2001-12 (EN60950-1) Licensed
 ISO** 9001 and ISO 14001 certified manufacturing
facilities

Description
The HW/HC series power modules are isolated dc-dc converters that operate over a wide input voltage range of 18 to 36
Vdc (HC) or 36 to 75 Vdc (HW) and provide one precisely regulated output. The output is fully isolated from the input,
allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency, e.g. typical
efficiency of 87% 3.3V/5A, 86% at 2.5V/6A. Built-in filtering for both input and output minimizes the need for external
filtering. These open frame modules are available either in surface-mount (-S) or in through-hole form.

* UL is a registered trademark of Underwriters Laboratories, Inc.

†
CSA is a registered trademark of Canadian Standards Association.
‡
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards

October 2, 2015 ©2012 General Electric Company. All rights reserved.

GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage HC VIN -0.3 50 Vdc
Continuous HW VIN -0.3 80 Vdc
Transient (100ms) HW VIN, trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
I/O Isolation Voltage (100% factory tested) All   2250 Vdc

Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage HC VIN 18 24 36 Vdc
HW VIN 36 54 75 Vdc
Maximum Input Current HC IIN,max 1.75 Adc
(VIN=0V to 75V, IO=IO, max) HW IIN,max 0.85 Adc

Inrush Transient All It

2 1 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 12μH source impedance; VIN=0V to 75V, All 5 mAp-p
IO= IOmax ; see Figure 9)
Input Ripple Rejection (120Hz) All 50 dB

EMC, EN55022 See EMC Considerations section

CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part
of complex power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve
maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with
a maximum rating of 3A (see Safety Considerations section). Based on the information provided in this data sheet on inrush
energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse
manufacturer’s data sheet for further information.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 2
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

5V, 3.3V
Output Voltage Set-point 2.5V, 2.0V, VO, set -1.0  +1.0 % VO, nom
1.8V, 1.5V

(VIN=VIN,nom, IO=IO, max, Tref=25°C) 1.2V, 1.0V VO, set -1.25  +1.25 % VO, nom
Output Voltage All VO -3.0  +3.0 % VO, nom
(Over all operating input voltage, resistive load,
and temperature conditions until end of life)
Adjustment Range All VO -10.0 +10.0 % VO, nom
Selected by external resistor
Output Regulation
Line (VIN=VIN, min to VIN, max) All   10 mV
Load (IO=IO, min to IO, max) All   15 mV
Temperature (Tref=TA, min to TA, max) All   1.00 %
Output Ripple and Noise on nominal output
(VIN=VIN, nom and IO=IO, min to IO, max)

RMS (5Hz to 20MHz bandwidth) All  8 15 mVrms

Peak-to-Peak (5Hz to 20MHz bandwidth) All  25 50 mVpk-pk

External Capacitance All CO, max   470 μF

Output Current 5V Io 0 4.0 Adc

3.3V Io 0 5.0 Adc

2.5V, 2.0,
1.8V, 1.5V, Io 0 6.0 Adc
1.2V, 1.0V

Output Current Limit Inception 5V IO, lim  6.5  Adc

( Hiccup Mode ) 3.3V IO, lim  7  Adc

2.5V, 2.0V,
1.8V, 1.5V, IO, lim  8.5  Adc
1.2V, 1.0V
Output Short-Circuit Current 5V IO, s/c  2.4  A rms
(VO≤250mV) ( Hiccup Mode ) 3.3V IO, s/c  2.4  A rms
2.5V, 2.0V,
1.8V, 1.5V, IO, s/c  2.8  A rms
1.2V, 1.0V

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 3
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit
HW 5V η  89.0  %
Efficiency HW 3.3V η  87.0  %
VIN=VIN, nom, TA=25°C HW 2.5V η  86.0  %
IO=IO, max , VO= VO,set HW 2.0V η  82.0  %
HW 1.8V η  82.0  %
HW 1.5V η  80.0  %
HW 1.2V η  77.0  %
HW 1.0V η  75.0  %
HC 5V η  88.0  %
HC 3.3V η  86.0  %
Switching Frequency All HW fsw  300  kHz
All HC fsw  380  kHz
Dynamic Load Response
(Io/t=1A/s; Vin=Vin,nom; TA=25°C) 5V, 3.3V Vpk  100  mV
2.5V, 2.0V,
Load Change from Io= 50% to 75% of Io,max: 1.8V, 1.5V, Vpk  80  mV
1.2V, 1.0V
Peak Deviation
Settling Time (Vo<10% peak deviation) All ts  100  s
Dynamic Line Response
(Vin / t0.5V/s; Vin=Vin,nom; TA=25°C)
Peak Deviation All Vpk  0.6 2 %Vo, set
Settling Time (Vo<10% peak deviation) All ts  150 1000 s

Isolation Specifications
Parameter Symbol Min Typ Max Unit
Isolation Capacitance Ciso  200  pF
Isolation Resistance Riso 10   MΩ

General Specifications
Parameter Min Typ Max Unit
Calculated MTBF (for HW005A0F1-S in accordance with Lucent RIN 6:
>4,000,000 Hours
IO=80% of IO, max, TA=25°C, airflow=1m/s)
Weight  13  g (oz.)

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 4
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
See Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low Specification
Remote On/Off Current – Logic Low All Ion/off  0.15 1.0 mA
On/Off Voltage:
Logic Low All Von/off 0.0  1.2 V
Logic High – (Typ = Open Collector) All Von/off  5.8 15 V
Logic High maximum allowable leakage current All Ion/off   10 μA
Turn-On Delay and Rise Times
(IO=IO, max)
Tdelay  100  ms
Tdelay = Time until VO = 10% of VO,set from either 5V, 3.3V
application of Vin with Remote On/Off set to On or
Trise  40  ms
operation of Remote On/Off from Off to On with Vin
already applied for at least one second.
2.5V, 2.0V, Tdelay  12  ms
1.8V, 1.5V,
Trise = time for VO to rise from 10% of VO,set to 90% of
1.2V, 1.0V
VO,set.
Trise  3  ms

5V VO, limit   7.0 V

Output Overvoltage Protection # 3.3V   4.6 V
2.5V   3.5 V
Values are the same for HW and HC codes 2.0V   3.2 V
1.8V   2.8 V
1.5V   2.5 V
1.2V   2.0 V
1.0V   1.8 V
Overtemperature Protection All Tref  125  °C
(See Feature Descriptions)
Input Undervoltage Lockout
Turn-on Threshold All HW  33 36 V
Turn-off Threshold All HW 27 30  V
Turn-on Threshold All HC  17 18 V
Turn-off Threshold All HC 13.5 15  V
# More accurate Overvoltage protection can be accomplished externally by means of the remote On/Off pin.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 5
 GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Characteristic Curves
The following figures provide typical characteristics for the HW004A0A (5.0V, 4A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.

90 5
88
86 4

OUTPUT CURRENT, Io (A)

84
EFFICIENCY,  (%)

82 3

80 V I = 36V
V I = 54V 2 3.0 m/s (600 ft./min.)
78
V I = 75V 2.0 m/s (400 ft./min.)
76
1.0 m/s (200 ft./min.)
74 1 NATURAL CONVECTION
72
70 0
0 1 2 3 4 0 10 20 30 40 50 60 70 80 90 100 110

OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC

Figure 1. Converter Efficiency versus Output Current Figure 4. Derating Output Current versus Local Ambient
Temperature and Airflow

INPUT VOLTAGE OUTPUT VOLTAGE

VO (V) (2V/div)
OUTPUT VOLTAGE,
VO (V) (20mV/div)

VIN (V) (50V/div)

TIME, t (1s/div) TIME, t (20ms/div)

Figure 2. Typical Output Ripple and Noise. Figure 5. Typical Start-Up with application of Vin.
On/Off VOLTAGE OUTPUT VOLTAGE
OUTPUT CURRENT, OUTPUT VOLTAGE
VO (V) (50mV/div)

VO (V) (2V/div)
VON/OFF(V) (5V/div)
IO (A) (1A/div)

TIME, t (50s/div) TIME, t (20ms/div)

Figure 3. Transient Response to Dynamic Load Change Figure 6. Typical Start-Up Using Remote On/Off, negative
from 50% to 75% to 50% of full load. logic version shown.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 6
 GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Characteristic Curves (continued)

The following figures provide typical characteristics for the HW005A0F (3.3V, 5A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.

90 6
88
5
86

OUTPUT CURRENT, Io (A)

84 4
EFFICIENCY,  (%)

82
80 V I = 36V 3
3.0 m/s (600 ft./min.)
V I = 54V
78 2.0 m/s (400 ft./min.)
V I = 75V 2
76 1.0 m/s (200 ft./min.)
NATURAL CONVECTION
74 1
72
70 0
0 1 2 3 4 5 0 10 20 30 40 50 60 70 80 90 100 110

OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC

Figure 7. Converter Efficiency versus Output Current Figure 10. Derating Output Current versus Local Ambient
Temperature and Airflow

INPUT VOLTAGE, OUTPUT VOLTAGE

VO (V) (1V/div)
OUTPUT VOLTAGE,
VO (V) (20mV/div)

VIN (V) (50V/div)

TIME, t (1s/div) TIME, t (20ms/div)

Figure 8. Typical Output Ripple and Noise. Figure 11. Typical Start-Up with application of Vin.
On/Off VOLTAGE OUTPUT VOLTAGE
OUTPUT CURRENT, OUTPUT VOLTAGE
VO (V) (50mV/div)

VO (V) (1V/div)
VON/OFF(V) (5V/div)
IO (A) (2A/div)

TIME, t (50s/div) TIME, t (20ms/div)

Figure 9. Transient Response to Dynamic Load Change Figure 12. Typical Start-Up Using Remote On/Off, negative
from 50% to 75% to 50% of full load. logic version shown.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 7
 GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Characteristic Curves (continued)

The following figures provide typical characteristics for the HW006A0G (2.5V, 6A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
88 7
86
6
84

OUTPUT CURRENT, Io (A)

82 5
EFFICIENCY,  (%)

80
4
78
76 V I = 36V 3
74 V I = 54V
2.0 m/s (400 ft./min.)
V I = 75V 2
72 1.0 m/s (200 ft ./min.)
70 1 NATURAL CONVECTION

68
0 1 2 3 4 5 6
0
0 10 20 30 40 50 60 70 80 90 100 110

OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC

Figure 13. Converter Efficiency versus Output Current. Figure 16. Derating Output Current versus Local Ambient
Temperature and Airflow.

OUTPUT VOLTAGE
VO (V) (1V/div)
OUTPUT VOLTAGE,
VO (V) (20mV/div)

INPUT VOLTAGE,
VIN (V) (50V/div)

TIME, t (1s/div) TIME, t (5ms/div)

Figure 14. Typical Output Ripple and Noise. Figure 17. Typical Start-Up with application of Vin.
On/Off VOLTAGE, OUTPUT VOLTAGE
OUTPUT CURRENT, OUTPUT VOLTAGE
VO (V) (50mV/div)

VO (V) (1V/div)
VON/OFF(V) (5V/div)
IO (A) (2A/div)

TIME, t (50s/div) TIME, t (5ms/div)

Figure 15. Transient Response to Dynamic Load Change Figure 18. Typical Start-Up Using Remote On/Off, negative
from 50% to 75% to 50% of full load. logic version shown.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 8
 GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Characteristic Curves (continued)

The following figures provide typical characteristics for the HW006A0D (2.0V, 6A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
88 7
86
6
84

OUTPUT CURRENT, Io (A)

82 5
EFFICIENCY,  (%)

80
4
78
76 V I = 36V 3
74 V I = 54V
2.0 m/ s (400 ft ./min.)
V I = 75V 2
72 1.0 m/ s (200 f t./min.)
70 1 NATURAL CONVECTION

68
0 1 2 3 4 5 6
0
0 10 20 30 40 50 60 70 80 90 100 110

OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC

Figure 13. Converter Efficiency versus Output Current. Figure 16. Derating Output Current versus Local Ambient
Temperature and Airflow

OUTPUT VOLTAGE
VO (V) (1V/div)
OUTPUT VOLTAGE,
VO (V) (20mV/div)

INPUT VOLTAGE,
VIN (V) (50V/div)

TIME, t (1s/div) TIME, t (5ms/div)

Figure 14. Typical Output Ripple and Noise. Figure 17. Typical Start-Up with application of Vin.
On/Off VOLTAGE, OUTPUT VOLTAGE
OUTPUT CURRENT, OUTPUT VOLTAGE
VO (V) (50mV/div)

VO (V) (1V/div)
VON/OFF(V) (5V/div)
IO (A) (2A/div)

TIME, t (50s/div) TIME, t (5ms/div)

Figure 15. Transient Response to Dynamic Load Change Figure 18. Typical Start-Up Using Remote On/Off, negative
from 50% to 75% to 50% of full load. logic version shown.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 9
 GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Characteristic Curves (continued)

The following figures provide typical characteristics for the HW006A0Y (1.8V, 6A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
86 7
84
6
82

OUTPUT CURRENT, Io (A)

5
80
EFFICIENCY,  (%)

78 4
76
3
74
2.0 m/ s (400 f t./ min.)
72 2
V I = 36V 1.0 m/ s (200 f t./ min.)
70 V I = 54V NATURAL CONVECTION
1
68 V I = 75V

66 0
0 1 2 3 4 5 6 0 10 20 30 40 50 60 70 80 90 100 110

OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC

Figure 25. Converter Efficiency versus Output Current Figure 28. Derating Output Current versus Local Ambient
Temperature and Airflow

VO (V) (500mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)

VIN (V) (25V/div)

TIME, t (1s/div) TIME, t (5ms/div)

Figure 26. Typical Output Ripple and Noise. Figure 29. Typical Start-Up with application of Vin.
On/Off VOLTAGE, OUTPUT VOLTAGE
VON/OFF(V) (5V/div) VO (V) (500mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
VO (V) (50mV/div)
IO (A) (2A/div)

TIME, t (50s/div) TIME, t (5ms/div)

Figure 27. Transient Response to Dynamic Load Change Figure 30. Typical Start-Up Using Remote On/Off, negative
from 50% to 75% to 50% of full load. logic version shown.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 10
 GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Characteristic Curves (continued)

The following figures provide typical characteristics for the HW006A0M (1.5V, 6A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
86 7
84
6
82

OUTPUT CURRENT, Io (A)

80 5
EFFICIENCY,  (%)

78
4
76
74 3

72 2.0 m/ s (400 f t./ min.)

V I = 36V 2
70 V I = 54V 1.0 m/ s (200 f t./ min.)
V I = 75V 1 NATURAL CONVECTION
68
66 0
0 1 2 3 4 5 6 0 10 20 30 40 50 60 70 80 90 100 110

OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC

Figure 31. Converter Efficiency versus Output Current. Figure 34. Derating Output Current versus Local Ambient
Temperature and Airflow

VO (V) (500mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)

VIN (V) (25V/div)

TIME, t (1s/div) TIME, t (5ms/div)

Figure 32. Typical Output Ripple and Noise. Figure 35. Typical Start-Up with application of Vin.
VON/OFF(V) (5V/div) VO (V) (500mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
VO (V) (50mV/div)

On/Off VOLTAGE, OUTPUT VOLTAGE

IO (A) (2A/div)

TIME, t (50s/div) TIME, t (5ms/div)

Figure 33. Transient Response to Dynamic Load Change Figure 36. Typical Start-Up Using Remote On/Off, negative
from 50% to 75% to 50% of full load. logic version shown.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 11
 GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Characteristic Curves (continued)

The following figures provide typical characteristics for the HW006A0P (1.2V, 6A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.

80 7
78
6
76

OUTPUT CURRENT, Io (A)

74 5
EFFICIENCY,  (%)

72
4
70
68 V I = 36V 3
V I = 54V 3.0 m/s (600 ft./min.)
66
V I = 75V 2 2.0 m/ s (400 ft./min.)
64 1.0 m/ s (200 f t./ min.)
62 1 NATURAL CONVECTION
60
0 1 2 3 4 5 6 0
0 10 20 30 40 50 60 70 80 90 100 110

OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC

Figure 37. Converter Efficiency versus Output Current. Figure 40. Derating Output Current versus Local Ambient
Temperature and Airflow

VO (V) (500mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)

VIN (V) (50V/div)

TIME, t (1s/div) TIME, t (5ms/div)

Figure 38. Typical Output Ripple and Noise. Figure 41. Typical Start-Up with application of Vin.
VON/OFF(V) (5V/div) VO (V) (500mV/div)
On/Off VOLTAGE, OUTPUT VOLTAGE
OUTPUT CURRENT, OUTPUT VOLTAGE
VO (V) (50mV/div)
IO (A) (2A/div)

TIME, t (50s/div) TIME, t (5ms/div)

Figure 39. Transient Response to Dynamic Load Change Figure 42. Typical Start-Up Using Remote On/Off, negative
from 50% to 75% to 50% of full load. logic version shown.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 12
 GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Characteristic Curves (continued)

The following figures provide typical characteristics for the HW006A0S1R0 (1.0V, 6A) at 25ºC. The figures are identical for
either positive or negative Remote On/Off logic.

80 7
78
6
76

OUTPUT CURRENT, Io (A)

74 5
EFFICIENCY,  (%)

72
4
70
68 3
VI = 36V 3.0 m/s (600 ft./min.)
66
VI = 54V 2 2.0 m/ s (400 ft./min.)
64 1.0 m/ s (200 f t./ min.)
VI = 75V
62 1 NATURAL CONVECTION
60
0 1 2 3 4 5 6 0
0 10 20 30 40 50 60 70 80 90 100 110

OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC

Figure 43. Converter Efficiency versus Output Current. Figure 46. Derating Output Current versus Local Ambient
Temperature and Airflow.

VO (V) (500mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)

VIN (V) (50V/div)

TIME, t (1s/div) TIME, t (5ms/div)

Figure 44. Typical Output Ripple and Noise. Figure 47. Typical Start-Up with application of Vin.
On/Off VOLTAGE, OUTPUT VOLTAGE
VON/OFF(V) (5V/div) VO (V) (500mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
VO (V) (50mV/div)
IO (A) (2A/div)

TIME, t (50s/div) TIME, t (5ms/div)

Figure 45. Transient Response to Dynamic Load Change Figure 48. Typical Start-Up Using Remote On/Off, negative
from 50% to 75% to 50% of full load. logic version shown.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 13
 GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Characteristic Curves (continued)

The following figures provide typical characteristics for the HC004A0A (5.0V, 4A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.

OUTPUT CURRENT, Io (A)

EFFICIENCY,  (%)

2 3.0 m/s (600 ft./min.)

2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
1 Natural Convect ion

0
0 10 20 30 40 50 60 70 80 90 100 110

OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC

Figure 49. Converter Efficiency versus Output Current. Figure 52. Derating Output Current versus Local Ambient
Temperature and Airflow.
INPUT VOLTAGE, OUTPUT VOLTAGE
VO (V) (2V/div)
OUTPUT VOLTAGE,
VO (V) (20mV/div)

VIN (V) (25V/div)

TIME, t (1s/div) TIME, t (20ms/div)

Figure 50. Typical Output Ripple and Noise. Figure 53. Typical Start-Up with application of Vin.
On/Off VOLTAGE, OUTPUT VOLTAGE
OUTPUT CURRENT, OUTPUT VOLTAGE
VO (V) (50mV/div)

VO (V) (2V/div)
VON/OFF(V) (5V/div)
IO (A) (1A/div)

TIME, t (50s/div) TIME, t (20ms/div)

Figure 51. Transient Response to Dynamic Load Change Figure 54. Typical Start-Up Using Remote On/Off, negative
from 50% to 75% to 50% of full load. logic version shown.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 14
 GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Characteristic Curves (continued)

The following figures provide typical characteristics for the HC005A0F (3.3V, 5A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.

OUTPUT CURRENT, Io (A)

4
EFFICIENCY,  (%)

3.0 m/ s (600 f t./ min.)

2
2.0 m/ s (400 f t./ min.)
1.0 m/ s (200 f t./ min.)
1 Natural Convection

0
0 10 20 30 40 50 60 70 80 90 100 110

OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC

Figure 55. Converter Efficiency versus Output Current. Figure 58. Derating Output Current versus Local Ambient
Temperature and Airflow.
INPUT VOLTAGE, OUTPUT VOLTAGE
VO (V) (1V/div)
OUTPUT VOLTAGE,
VO (V) (20mV/div)

VIN (V) (25V/div)

TIME, t (1s/div) TIME, t (20ms/div)

Figure 56. Typical Output Ripple and Noise. Figure 59. Typical Start-Up with application of Vin.
On/Off VOLTAGE, OUTPUT VOLTAGE
OUTPUT CURRENT, OUTPUT VOLTAGE
VO (V) (50mV/div)

VO (V) (1V/div)
VON/OFF(V) (5V/div)
IO (A) (2A/div)

TIME, t (50s/div) TIME, t (20ms/div)

Figure 57. Transient Response to Dynamic Load Change Figure 60. Typical Start-Up Using Remote On/Off, negative
from 50% to 75% to 50% of full load. logic version shown.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 15
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Test Configurations Design Considerations

TO OSCILLOSCOPE CURRENT PROBE
Input Source Impedance
LTEST The power module should be connected to a low
Vin+
12μH ac-impedance source. A highly inductive source impedance
can affect the stability of the power module. For the test
configuration in Figure 61, a 33μF electrolytic capacitor
BATTERY

CS 220μF
E.S.R.<0.1
33μF
(ESR<0.7 at 100kHz), mounted close to the power module
@ 20°C 100kHz helps ensure the stability of the unit. Consult the factory for
further application guidelines.
Vin-
Safety Considerations
NOTE: Measure input reflected ripple current with a simulated For safety-agency approval of the system in which the
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown power module is used, the power module must be installed
above.
in compliance with the spacing and separation
Figure 61. Input Reflected Ripple Current Test Setup. requirements of the end-use safety agency standard, i.e.,
COPPER STRIP
UL 60950-1-3, CSA C22.2 No. 60950-00, and VDE
0805:2001-12 (IEC60950-1).
VO (+) RESISTIVE
LOAD
If the input source is non-SELV (ELV or a hazardous voltage
greater than 60 Vdc and less than or equal to 75Vdc), for
1uF . 10uF SCOPE
the module’s output to be considered as meeting the
V O (–) requirements for safety extra-low voltage (SELV), all of the
following must be true:
GROUND PLANE  The input source is to be provided with reinforced insulation
NOTE: All voltage measurements to be taken at the module
from any other hazardous voltages, including the ac mains.
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals  One VIN pin and one VOUT pin are to be grounded, or both the
to avoid measurement errors due to socket contact input and output pins are to be kept floating.
resistance.

Figure 62. Output Ripple and Noise Test Setup.  The input pins of the module are not operator accessible.
 Another SELV reliability test is conducted on the whole system
(combination of supply source and subject module), as
Rdistribution Rcontact Rcontact Rdistribution required by the safety agencies, to verify that under a single
Vin+ Vout+ fault, hazardous voltages do not appear at the module’s
output.

RLOAD
Note: Do not ground either of the input pins of the module
VIN VO
without grounding one of the output pins. This may
allow a non-SELV voltage to appear between the
Rdistribution Rcontact Rcontact Rdistribution output pins and ground.
Vin- Vout-
The power module has extra-low voltage (ELV) outputs
when all inputs are ELV.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then For input voltages exceeding –60 Vdc but less than or equal
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
to –75 Vdc, these converters have been evaluated to the
resistance. applicable requirements of BASIC INSULATION between
secondary DC MAINS DISTRIBUTION input (classified as
Figure 63. Output Voltage and Efficiency Test Setup. TNV-2 in Europe) and unearthed SELV outputs.
VO. IO
"All flammable materials used in the manufacturing of
Efficiency  = x 100 % these modules are rated 94V-0 and UL60950 A.2 for
VIN. IIN
reduced thicknesses.
The input to these units is to be provided with a maximum
3A fast-acting fuse in the unearthed lead."
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic turns
the module on during a logic high voltage on the ON/OFF

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 16
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

pin, and off during a logic low. Negative logic remote Over Voltage Protection
On/Off, device code suffix “1”, turns the module off during a
logic high and on during a logic low. The output overvoltage protection consists of circuitry that
internally clamps the output voltage. If a more accurate
To maintain compatibility with LW series power modules output overvoltage protection scheme is required then this
the Remote On/Off pin is optional for the TH (through hole) should be implemented externally via use of the remote
version. Standard TH modules have no On/Off pin fitted. TH on/off pin.
modules ordered with device code suffix “1” are negative
logic with the On/Off pin fitted. Over Temperature Protection
To provide protection in a fault condition, the unit is
VIN(+)
equipped with a thermal shutdown circuit. The unit will
shutdown if the overtemperature threshold of 125 oC is
exceeded at the thermal reference point Tref . Once the unit
VO goes into thermal shutdown it will then wait to cool before
Ion/off
ON/OFF attempting to restart.
Output Voltage Programming
Von/off
COM Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by connecting
an external resistor between the TRIM pin and either the
VIN(-) VO(+) pin or the VO(-) pin (COM pin) .

VIN(+) VO(+)

Figure 64. Remote On/Off Implementation. Rtrim-up

To turn the power module on and off, the user must supply ON/OFF
a switch (open collector or equivalent) to control the voltage LOAD
VOTRIM
(Von/off) between the ON/OFF terminal and the VIN(-) terminal.
Logic low is 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a
Rtrim-down
logic low is 1mA, the switch should be maintain a logic low
level whilst sinking this current.
VIN(-) COM
During a logic high, the typical Von/off generated by the
module is 5.8V, and the maximum allowable leakage
current at Von/off = 5.8V is 10μA.
Figure 65. Circuit Configuration to Trim Output Voltage.
If not using the remote on/off feature:
Connecting an external resistor (Rtrim-down) between the TRIM
For positive logic, leave the ON/OFF pin open.
pin and the COM pin decreases the output voltage set point.
For negative logic, short the ON/OFF pin to VIN(-). To maintain set point accuracy, the trim resistor tolerance
Overcurrent Protection should be ±0.1%.
To provide protection in a fault (output overload) condition,
the unit is equipped with internal current-limiting circuitry
and can endure current limiting continuously. At the point
of current-limit inception, the unit enters hiccup mode. The
unit operates normally once the output current is brought
back into its specified range. The average output current
during hiccup is 10% IO, max.

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module will only
begin to operate once the input voltage is raised above the
undervoltage lockout turn-on threshold, VUV/ON.
Once operating, the module will continue to operate until
the input voltage is taken below the undervoltage turn-off
threshold, VUV/OFF.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 17
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Feature Descriptions (continued) ∆% = 2

The relationship between the output voltage and the trim 511
resistor value for a ∆% reduction in output voltage is: Rtrim-down = - 6.11 k


Nominal 5V, 3.3V, 2.5V, 2.0V, 1.8V, & 1.5V modules: Rtrim-down = 249.39 k
To trim up the output of a nominal 3.3V module
511
(HW005A0F) to 3.63V
Rtrim-down = - 6.11 k
% ∆% = 10

Nominal 1.2V module:

5.11x3.3(100+10) 511
346 Rtrim-up = - - 6.11 k
Rtrim-down = - 4.46 k 1.225x10 
%
Rtrim-up =94.2 k
Nominal 1.0V module:

390
Rtrim-down = - 4.90 k
%

Connecting an external resistor (Rtrim-up) between the TRIM

pin and the VO(+) pin increases the output voltage set point.
To maintain set point accuracy, the trim resistor tolerance
should be ±0.5%.
The relationship between the output voltage and the trim
resistor value for a ∆% increase in output voltage is:

Nominal 5V, 3.3V, 2.5V, 2.0V, 1.8V, & 1.5V modules:

5.11VO(100+%) 511
Rtrim-up = - - 6.11 k
1.225% %

Nominal 1.2V module:

5.11VO(100+%) 346
Rtrim-up = - - 4.46 k
1.225% %

Nominal 1.0V module:

5.11VO(100+%) 390
Rtrim-up = - - 4.90 k
1.225% %

(VO refers to the nominal output voltage, i.e. 5.0V for VO on

an HW004A0A. ∆% is the required % change in output
voltage, i.e. to trim a 5.0V module to 5.10V the ∆% value is
2).

Examples:
To trim down the output of a nominal 5.0V module
(HW004A0A) to 4.90V

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 18
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Thermal Considerations C5 56nF

L2
The power modules operate in a variety of thermal 10uH
environments; however, sufficient cooling should be Vin+ Vout+

provided to help ensure reliable operation.

C4
Considerations include ambient temperature, airflow, C1 C2 C3
33uF
100V
HW005

module power dissipation, and the need for increased 0.68uF 0.68uF 0.68uF

reliability. A reduction in the operating temperature of the Vin- Vout-

module will result in an increase in reliability. The thermal L1 - CMC

Pulse P0354
data presented here is based on physical measurements
taken in a wind tunnel. C6 56nF

The thermal reference point, Tref used in the specifications

is shown in Figure 66. For reliable operation this Figure 67. Suggested Configuration for EN55022 Class
temperature should not exceed 115 oC. B.

90

80

70

60
EN 55022 Class B Conducted Average dBuV
50

40

30
Level (dBµV)

20

10

100K 500K 1M 5M 10M 30M

Frequency(Hz)

Figure 66. Tref Temperature Measurement Location.

Figure 68. EMC signature using above filter, HW005A0F.
For further information on designing for EMC compliance,
Please refer to the Application Note “Thermal please refer to the FLTR100V10 data sheet (FDS01-043EPS).
Characterization Process For Open-Frame Board-Mounted
Power Modules” for a detailed discussion of thermal
aspects including maximum device temperatures. Layout Considerations
The HW/HC005 power module series are low profile in order
Heat Transfer via Convection to be used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
Increased airflow over the module enhances the heat module and the mounting board is limited. Avoid placing
transfer via convection. Derating figures showing the copper areas on the outer layer directly underneath the
maximum output current that can be delivered by each power module. Also avoid placing via interconnects
module versus local ambient temperature (TA) for natural underneath the power module.
convection and up to 3m/s (600 ft./min) are shown in the
respective Characteristics Curves section. For additional layout guide-lines, refer to FLTR100V10 data
sheet.

EMC Considerations
The figure 67 shows a suggested configuration to meet the
conducted emission limits of EN55022 Class B.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 19
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Mechanical Outline for HW/HC Surface-Mount Module

Dimensions are in millimeters and (inches).
Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated]
x.xx mm  0.25 mm (x.xxx in  0.010 in.)
47.2
(1.860)
Top View

29.5
(1.162)

2.54
(0.100)
min stand-off 8.50
Side View height (0.335)
MAX

0.5
(.020)
max
compliance

Bottom View 40.00

10.00 (1.576)
(0.394)
Pin Function PIN 3
1 Vout + 1 2 3 OPTIONAL 9
2 Vout - 26.16
Standard = No Pin (1.031)
3
Optional = Vout +
9 Trim 18 17 11
11 On/Off
17 Vin - 1.65 5.00
(0.065) (0.197)
18 Vin +
3.63 35.00
(0.143) (1.379)

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 20
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Mechanical Outline for HW/HC Through Hole Module

Dimensions are in millimeters and (inches).
Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated]
x.xx mm  0.25 mm (x.xxx in  0.010 in.)
47.2
(1.860)
Top View

29.5
(1.162)

Side View

* Optional pin lengths shown in Table 2 Device Options

Bottom View 40.00

(1.576)

Pin Function
1 2 9
1 Vout +
2 Vout - 26.16
9 Trim
(1.031)
11 On/Off
17 Vin -
18 17 11
18 Vin +
1.65 5.00
(0.065) (0.197)
3.63 35.00
(0.143) (1.379)

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 21
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Recommended Pad Layout for Surface Mount and Through Hole Module
Dimensions are in millimeters and (inches).
Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated]
x.xx mm  0.25 mm (x.xxx in  0.010 in.)

Pin Function
1 Vout +
2 Vout -
Standard = No Pin
3
Optional = Vout +
9 Trim
11 On/Off
17 Vin -
18 Vin +

Surface Mount Pad Layout – Component side view

Pin Function
1 Vout +
2 Vout -
9 Trim
11 On/Off
17 Vin -
18 Vin +

Through-Hole Pad Layout – Component side view

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 22
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Packaging Details
The surface mount versions of the HW005 family are also available in tape & reel (suffix –SR) as an option. Detailed of tape
dimensions are shown below. Modules are shipped in quantities of 115 per reel.

Tape Dimensions
Dimensions are in millimeters and (inches).

9.02
4.00 40.00 (0.355)
PICK POINT (0.157) (1.575)

34.20 FEED 72.00

(1.346) DIRECTION (2.834)
68.40
(2.692)
66.50
(2.692)

TOP COVER TAPE EMBOSSED CARRIER

NOTE: CONFORMS TO EAI-481 REV. A STANDARD

Reel Dimensions
Outside diameter: 330.2 mm (13.00”)
Inside diameter: 177.8 mm (7.00”)
Tape Width: 72.00 mm (2.834”)

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 23
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Through-Hole Lead-Free Soldering

Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210C. For Pb
solder, the recommended pot temperature is 260C,
while the Pb-free solder pot is 270C max. Not all RoHS-
compliant through-hole products can be processed with Figure 69. Surface Mount Packaging Tray
paste-through-hole Pb or Pb-free reflow process. If Tray Specification
additional information is needed, please consult with
your GE representative for more details. Material Antistatic coated PVC
Max surface resistivity 1012/sq
Surface Mount Information Color Clear
Capacity 15 power modules
Packaging Details Min order quantity 60 pcs (1 box of 4 full trays)
The surface mount versions of the HW005 family (suffix –
S) are supplied as standard in the plastic tray shown in Each tray contains a total of 15 power modules. The
Figure 69. The tray has external dimensions of trays are self-stacking and each shipping box will
135.1mm (W) x 321.8mm (L) x 12.4mm (H) or 5.319in (W) x contain 4 full trays plus one empty hold down tray giving
12.669in (L) x 0.489in (H). a total number of 60 power modules.
Surface mount versions of the HW005 family are also Pick and Place
available as an option packaged in Tape and Reel. For
further information on this please contact your local GE The HW005-S series of DC-to-DC power converters use
Technical Sales Representative. an open-frame construction and are designed for
surface mount assembly within a fully automated
manufacturing process.
The HW005-S series modules are fitted with a Kapton
label designed to provide a large flat surface for pick and
placing. The label is located covering the Centre of
Gravity of the power module. The label meets all the
requirements for surface-mount processing, as well as
meeting UL safety agency standards. The label will
withstand reflow temperatures up to 300C. The label
also carries product information such as product code,
date and location of manufacture.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 24
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Surface Mount Information (continued) The surface mountable modules in the HW005 family
use our newest SMT technology called “Column Pin” (CP)
connectors. Fig 71 shows the new CP connector before
and after reflow soldering onto the end-board assembly.
24.2
COG
HW005 Board
12.7

Insulator

14.7
Solder Ball
8.0

End assembly PCB

19.0 9.5
Figure 71. Column Pin Connector Before and After
Reflow Soldering.
Note: All dimensions in mm.
Figure 70. Pick and Place Location. The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder. The CP connector design is able
Z Plane Height to compensate for large amounts of co-planarity and
The ‘Z’ plane height of the pick and place location is still ensure a reliable SMT solder joint.
7.50mm nominal with an RSS tolerance of +/-0.25 mm.
Typically, the eutectic solder melts at 183oC, wets the
Nozzle Recommendations land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on the
The module weight has been kept to a minimum by connection to ensure a reliable solder joint. There are
using open frame construction. Even so, they have a several types of SMT reflow technologies currently used
relatively large mass when compared with conventional in the industry. These surface mount power modules
SMT components. Variables such as nozzle size, tip style, can be reliably soldered using natural forced convection,
vacuum pressure and placement speed should be IR (radiant infrared), or a combination of convection/IR.
considered to optimize this process. For reliable soldering the solder reflow profile should be
The minimum recommended nozzle diameter for reliable established by accurately measuring the modules CP
operation is 6mm. The maximum nozzle outer diameter, connector temperatures.
which will safely fit within the allowable component 300
spacing, is 9 mm.
P eak Temp 235oC
Oblong or oval nozzles up to 11 x 9 mm may also be 250
used within the space available. Co o ling
Heat zo ne zo ne
200
REFLOW TEMP (C)

max 4oCs -1 1-4oCs -1

For further information please contact your local GE
Technical Sales Representative. 150

So ak zo ne
Reflow Soldering Information 100 30-240s Tlim above
205oC
The HW005 family of power modules is available for
50 P reheat zo ne
either Through-Hole (TH) or Surface Mount (SMT) max 4oCs -1
soldering. These power modules are large mass, low
0
thermal resistance devices and typically heat up slower
than other SMT components. It is recommended that REFLOW TIME (S)
the customer review data sheets in order to customize Figure 72. Recommended Reflow Profile
the solder reflow profile for each application board
assembly.
The following instructions must be observed when SMT
soldering these units. Failure to observe these
instructions may result in the failure of or cause damage
to the modules, and can adversely affect long-term
reliability.

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 25
 GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Surface Mount Information (continued) packages will be a minimum of 12 months from the bag
seal date, when stored at the following conditions: < 40°
240 C, < 90% relative humidity.
235 Post Solder Cleaning and Drying Considerations
230 Post solder cleaning is usually the final circuit-board
MAX TEMP SOLDER (C)

225
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
220 the reliability of a power module and the testability of
215 the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
210
refer to GE Board Mounted Power Modules: Soldering and
205 Cleaning Application Note (AP01-056EPS).
300
200 Per J-STD-020 Rev. C
0 10 20 30 40 50 60 Peak Temp 260°C
250
TIME LIMIT (S)

Figure 73. Time Limit Curve Above 205oC Reflow . Cooling

Reflow Temp (°C)

200
Zone
* Min. Time Above 235°C
15 Seconds
150
Lead Free Soldering Heating Zone
1°C/Second
*Time Above 217°C
60 Seconds
100
The –Z version SMT modules of the HW/HC series are
lead-free (Pb-free) and RoHS compliant and are 50
compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the failure 0
of or cause damage to the modules and can adversely Reflow Time (Seconds)
affect long-term reliability.
Figure 74. Recommended linear reflow profile using
Pb-free Reflow Profile Sn/Ag/Cu solder.

Power Systems will comply with J-STD-020 Rev. C Solder Ball and Cleanliness Requirements
(Moisture/Reflow Sensitivity Classification for
The open frame (no case or potting) power module will
Nonhermetic Solid State Surface Mount Devices) for both
meet the solder ball requirements per J-STD-001B. These
Pb-free solder profiles and MSL classification procedures.
This standard provides a recommended forced-air- requirements state that solder balls must neither be
loose nor violate the power module minimum electrical
convection reflow profile based on the volume and
spacing.
thickness of the package (table 4-2). The suggested Pb-
free solder paste is Sn/Ag/Cu (SAC). The recommended The cleanliness designator of the open frame power
linear reflow profile using Sn/Ag/Cu solder is shown in module is C00 (per J specification).
Figure. 74.

MSL Rating
The HW/HC series SMT modules have a MSL rating of 2A.

Storage and Handling

The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture barrier bags (MBB)
with desiccant are required for MSL ratings of 2 or
greater. These sealed packages should not be broken
until time of use. Once the original package is broken,
the floor life of the product at conditions of  30°C and
60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 26
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Input Output Output Remote Connector
Product codes Comcodes
Voltage Voltage Current On/Off Logic Type
HW004A0A-S 48 Vdc 5.0V 4A Positive SMT 108968272
HW004A0A-SZ 48 Vdc 5.0V 4A Positive SMT 109100245
HW004A0A1 48 Vdc 5.0V 4A Negative Through-Hole 108965476
HW004A0A1-S 48 Vdc 5.0V 4A Negative SMT 108960634
HW004A0A1Z 48 Vdc 5.0V 4A Negative Through-Hole CC109102002
HW004A0A1-SB 48 Vdc 5.0V 4A Negative SMT 108980525
HW004A0A1-SZ 48 Vdc 5.0V 4A Negative SMT 109100237
HW005A0F-S 48 Vdc 3.3V 5A Positive SMT 108968678
HW005A0F-SZ 48 Vdc 3.3V 5A Positive SMT 109100261
HW005A0F-SR39* 48 Vdc 3.3V 5A Positive SMT (tape & reel) 108986951
HW005A0F1 48 Vdc 3.3V 5A Negative Through-Hole 108967779
HW005A0F1Z 48 Vdc 3.3V 5A Negative Through-Hole CC109107125
HW005A0F1-S 48 Vdc 3.3V 5A Negative SMT 108960667
HW005A0F1-SZ 48 Vdc 3.3V 5A Negative SMT 108995197
HW005A0F1-SRZ 48 Vdc 3.3V 5A Negative SMT (tape&reel) 109100253
HW005A0F1-S65* 48 Vdc 3.3V 5A Negative SMT 108987512
HW005A0F1-S65Z* 48 Vdc 3.3V 5A Negative SMT 108995206
HW006A0G1-SZ 48 Vdc 2.5V 6A Negative SMT 109100311
HW006A0D1-S 48 Vdc 2.0V 6A Negative SMT 108969676
HW006A0D1-SZ 48 Vdc 2.0V 6A Negative SMT 109100303
HW006A0Y1-S 48 Vdc 1.8V 6A Negative SMT 108960782
HW006A0Y1-SZ 48 Vdc 1.8V 6A Negative SMT 109100344
HW006A0P1-SZ 48 Vdc 1.2V 6A Negative SMT 109100336
HC004A0A1-S 24 Vdc 5.0V 4A Negative SMT 108960642
HC004A0A1-SZ 24 Vdc 5.0V 4A Negative SMT 108996113
HC005A0F1-S 24 Vdc 3.3V 5A Negative SMT 108960659
HC005A0F1-SZ 24 Vdc 3.3V 5A Negative SMT 108996121

October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 27
GE Data Sheet

HW/HC004/005/006 Series DC-DC Power Module

18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current

Table 2. Device Options

Option Suffix
Negative remote on/off logic 1
With additional Vout+ pin3 3
Short Pins: 3.68 mm ± 0.25 mm (0.145 in ±0.010 in) 6
Short Pins: 2.79 mm ± 0.25 mm (0.110 in ±0.010 in) 8
Customer specific -39
Customer specific -65
Tape & Reel -R
Surface mount connections -S
RoHS Compliant -Z

* Please contact GE for availability of these options, samples, minimum order quantity and lead times

Contact Us
For more information, call us at

USA/Canada:
+1 877 546 3243, or +1 972 244 9288

Asia-Pacific:
+86.021.54279977*808

Europe, Middle-East and Africa:

+49.89.878067-280

www.gecriticalpower.com
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no
liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such
product(s) or information.

October 2, 2015 ©2012 General Electric Company. All International rights reserved. Version 1.2