BR35QV365L01X

SPECIFICATION FOR Near UV LED

3535 UVA LED PKG

DESCRIPTION

The BR35QV365L01X is a UV LED package

based on brilliant aluminum reflector with a
peak wavelength of 365 nm.

In the case of aluminum, the reflectivity of

the UV wavelength band is the best metal.

Moreover, reliability is also excellent because

the LED PKG body radiates heat as a whole.

In the case of a transparent quartz glass that

protects the UV LED, the application of quartz
glass maximizes the light output of the UV
LED.

FEATURES APPLICATIONS

• Brilliant Aluminum SMT package • Sterilization

with quartz glass • Disinfection

• Dimension (L x W x H) in mm • Chemical and Biological analysis
- 3.5 x 3.5 x 1.4 • Phototherapy
• Forward current: up to 1,000 mA • Fluorescent Spectroscopy
• Radiant power (typ.) • Counterfeit Detectors
- 950 mW at 700 mA

• Viewing Angle (2θ1/2)

- Typical 115°

• Built in ESD Protection device

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Table of contents

1. PKG Specifications ......................................................................................................... 3

2. Bin Structures ................................................................................................................. 4

3. Typical Characteristics Graphs ................................................................................... 5

4. Outline Dimensions ....................................................................................................... 6

5. Reflow Soldering Profile ............................................................................................... 7

6. Tape and Reel ................................................................................................................. 8

7. Precautions on use .................................................................................................. 9-11

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1. PKG Specifications
1) Absolute maximum ratings [Ta=25℃]

Parameters Symbol Value Unit

Forward current If 1000 mA

Power dissipation Pd 3.9 W

Junction Temperature Tj 100 ℃

Operating temperature Topr - 30 ~ +60 ℃

Storage temperature Tstg - 40 ~ +100 ℃

Junction Temperature Tj 125 ℃

Soldering temperature Tsol 260*) ℃

ESD Classification Class2**)

Notes
*) Recommend JEDEC-J-STD-020D for reflow soldering.
**) The ESD test follows JESD22-A114.

2) Electrical and Optical Characteristics [Ta=25℃]

Parameter Symbol If Min Typ Max Unit

Peak wavelength λp 700mA 360 365 370 nm

Radiant Flux Φe 700mA 700 950 1100 mW

Forward voltage Vf 700mA 3.5 3.8 4.1 V

Full Width at Half
Δλ 700mA 12 nm
Maximum
Viewing angle 2θ1/2 700mA 115 °
Thermal resistance RθJ-s 700mA 4.1 ºC/W

Notes
• Peak Wavelength(λp) Measurement tolerance is ± 3nm.
• Radiant Flux(Φe) Measurement tolerance is ± 10%.
• Forward Voltage(Vf) Measurement tolerance is ± 3%.
• Viewing angle(deg) Measurement tolerance is ± 5deg.

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2. Bin Structures

[If=700mA, Ta=25℃]

Item Bin Min Max Unit

Peak Wavelength W 360 370 nm

R1 700 800

R2 800 900
Radiant Flux mW
R3 900 1000

R4 1000 1100

V1 3.5 3.7

Forward Voltage V2 3.7 3.9 V

V3 3.9 4.1

Notes
• Peak Wavelength(λp) Measurement tolerance is ± 3nm.
• Radiant Flux(Φe) Measurement tolerance is ± 10%.
• Forward Voltage(Vf) Measurement tolerance is ± 3%.

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3. Typical Characteristics Graphs

1) Forward Current vs. Forward Voltage 2) Relative Radiant Flux vs. Forward Current

[Ta=25℃] [Ta=25℃]
1,000 1.5

Relative Radiant Flux (a.u.)

Forward Current (mA)

800
1.0
600

400
0.5
200

0 0.0
0 2 4 6 0 200 400 600 800 1000
Forward Voltaget (V) Forward Current (mA)

3) Peak Wavelength vs. Forward Current 4) Ambient Temp. vs. Relative Radiant Flux

[Ta=25℃] [Ta=25℃]

380 1.2
Relative Radiant Flux (a.u.)

1.0
Wavelength (nm)

375
0.8

370 0.6

0.4
365
0.2

360 0.0
0 200 400 600 800 1000 25 35 45 55 65 75 85
Forward Current (mA) Ambient Temperature(℃)

5) Spectrum 6) Typical Spatial Distribution

[Ta=25℃] [Ta=25℃]
1.2 1.2

1.0 1.0
Relative Intensity (a.u.)

Photometric (%)

0.8 0.8

0.6 0.6

0.4 0.4

0.2 0.2

0.0 0.0
300 325 350 375 400 425 450 -90 -60 -30 0 30 60 90
Wavelength (nm) Viewing angle (deg.)

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4. Outline Dimensions
1) PKG Dimensions

• PKG Dimensions - 3.5 x 3.5 x 1.4 (L x W x H)

• Undefined tolerance is ± 0.2mm

[Unit : mm]

2) Internal Circuit 3) Recommended Solder Pad

① ②

Anode Cathode

① ②

Protection Device

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5. Reflow Soldering Profile

[ Classification Reflow Profiles ]

Profile Feature Pb-free Assembly Sn-Pb Eutectic Assembly

Average ramp-up rate

3℃/second max 3℃/second max
(Tsmax to Tp)
Preheat
- Temperature Min (Tsmin) 150 ℃ 100 ℃
- Temperature Max (Tsmax) 200 ℃ 150 ℃
- Time (Tsmin to Tsmax) (ts) 60-180 seconds 60-120 seconds
Time maintain above:
- Temperature (TL) 217 ℃ 183 ℃
- Time (tL) 60-150 seconds 60-150 seconds
Peak Temperature (Tp) 260 ℃ 235 ℃

Time within 5℃ of actual Peak

20-40 seconds 10-30 seconds
Temperature (tp)2
Ramp-down Rate 6 ℃/second max 6 ℃/second max

Time 25℃ to Peak Temperature 8 minutes max. 6 minutes max.

Notes
• All temperature refer to topside of the package, measured on the package body surface.
• The LED package is designed to be reflow soldered to a PCB. If dip soldered or hand soldered,
PEC will not guarantee its reliability.
• Reflow soldering must not be done more than two times.
• When the LED PKG is cooled at the maximum temperature, a rapid temperature fall is not
recommended.

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6. Taping and Reel packing

1) Tape

[Unit : mm]

Anode Mark

2) Reel

• PKG Quantity : 500 PCS/Reel [Unit : mm]

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7. Precautions on use

1) Storage condition
- This LED PKG is vacuum-packed in an aluminum bag containing a dehumidifying agent.
However, if the storage environment is not good, the LED PKG can absorb moisture.
- When soldering with LED PKG absorb moisture, vaporization of moisture may occur
and internal air may expand. This may cause the quartz to peel off or deteriorate its
optical properties.
- It is recommended to keep in the environment shown in the table below.

Conditions Temperature Humidity Time

Before Opening Within 1 Year from

5℃ ~ 30℃ ＜ 50%RH
Aluminum Bag the Delivery Date
Storage
After Opening
5℃ ~ 30℃ ＜ 60%RH ≤ 672 hours
Aluminum Bag
Baking 65 ± 5℃ ＜ 10%RH 10 ~ 24 hours

2) Circuit design

- When designing the circuit by applying the BR series, be sure to not exceed the
absolute maximum ratings of each LED.
- For the BR series, it is designed to operate with forward voltage. If a reverse voltage
is applied, the LED chip and the Zener diode can be damaged.
- For the current drive method, it is recommended to operate in the constant current
mode.

3) Handling precautions
- When handling the LED PKG using a tweezer, handle it in a direction parallel to the
electrode separation line as shown in Fig. A below.
- When handling as shown in Fig. B, short-circuit failure may occur due to damage
between electrode separation lines.
- When handling as shown in Fig. C, may cause quartz to break or scratch.

OK NG NG

(A) (B) (C)

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- Do not do rapid cooling immediately after soldering. It can cause the failure of the
LED PKG.
- Handling the LED PKG by hand may contaminate the LED surface, which may cause
the light output to drop.
- Dropping the LED PKG may cause LED damage.

4) ESD (Electrostatic Discharge)

- Use all objects and materials in the workplace for anti-static measures.
- Grounding

① All instruments, JIG, and equipment in the workplace should be grounded and

measured once a month by a ground resistance meter.

② Workers should wear antistatic clothing and ground through a wrist strap or heel

ground. Earth ring should be connected so as not to be shaken when grounding, and
check for disconnection every day.
- The working surface of the work table is provided with a conductive mat and grounded.
Periodically measure and check the conductivity state.
- The work table preferably has a surface resistance of 105 to 109 [Ω/SQ], and the
metal work table is not good. (Breakage due to rapid discharge)
- Install conductive tiles or mats and regularly measure and manage grounding
resistance and static electricity.
- Partially high static electricity is generated such as rotating body, TV, monitor, JIG. If
it is non-conductive, use ionizer or anti-static spray regularly and prevent static
electricity.
- In addition to general cases, use humidity control or partial humidifier to suppress the
generation of static electricity.

5) Thermal Management
- Thermal management is closely related to the lifetime of LEDs.
- The temperature of the LED during operation must not exceed the junction
temperature (Tj).
- For temperature management of the LED, the thermal resistance of the PCB and the
spacing between the LEDs must be considered.
- For PCBs, a Cu based metal PCB is recommended, and if necessary, a heat sink should
be attached to manage the LED temperature.

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6) Eye Safety
- This UV LED PKG emits high power UV light.
- Exposure to light with strong UV light can cause damage to the human eye and skin.
- Do not look directly or indirectly at UV light.
- If exposure to UV light is unavoidable, the body should be protected by suitable
protection devices such as goggles and clothing.
- Attach the following warning labels on products/systems that use UV LEDs.

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