Data Sheet

RO3003G2™ Circuit Materials

High Frequency Laminates

RO3003G2™ high-frequency ceramic-filled PTFE laminates are

an extension of Rogers’ industry leading RO3003™ solutions. FEATURES AND BENEFITS:
RO3003G2 laminates are based on industry feedback to address
the next generation needs for mm-wave automotive radar
applications. Best in class performance for
insertion loss
• Utilizing new Very Low Profile
The combination of optimized resin and filler content along (VLP) ED copper
with the introduction of Very Low Profile ED copper translates Minimize dielectric constant variation
to a Dk of 3.00 @ 10 GHz (clamped stripline method) & 3.07 @ in finished PCB
77 GHz (microstrip differential phase length method). These • Homogeneous construction
incorporating VLP ED copper and
laminates also show very low insertion loss of 1.3dB/inch for 5 reduced dielectric porosity
mil laminates as measured by the microstrip differential phase
Enable trend toward more small
length method. diameter vias
• Enhanced filler system using
small rounded particles
RO3003G2 laminates can be fabricated into printed circuit
boards using standard PTFE circuit board processing techniques, Global manufacturing foot print
with minor modifications as described in the application note • Multiple high volume
manufacturing plants
“Fabrication Guidelines for RO3000® Series High Frequency
Circuit Materials.”
TYPICAL APPLICATIONS:

• Adaptive cruise control

• Forward collision warning
• Active brake assist
• Lane change assist
• Traffic jam pilot
• Parking pilot
• Blind spot detection

100 S. Roosevelt Avenue, Chandler, AZ 85226

Tel: 480-961-1382 Fax: 480-961-4533 www.rogerscorp.com

Page 1 of 4
 Data Sheet

Chart 1:

Chart 2:

100 S. Roosevelt Avenue, Chandler, AZ 85226

Tel: 480-961-1382 Fax: 480-961-4533 www.rogerscorp.com

Page 2 of 4
 Data Sheet

TYPICAL VALUE(1)
PROPERTY
Unit Condition Test Method
RO3003G2 Direction
IPC-TM-650
Dielectric Constant, er Process 3.00 ± 0.04 Z - 10 GHz 23°C 2.5.5.5
Clamped Stripline
Differential Phase
(2,)
Dielectric Constant, er Design 3.07 Z - 77 GHZ
Length Method
IPC-TM-650
Dissipation Factor, tan d 0.0011 Z - 10 GHz 23°C
2.5.5.5
10 GHz IPC-TM-650
Thermal Coefficient of er -35 Z ppm/°C
-50 to 150°C 2.5.5.5
-0.16 X
Dimensional Stability mm/m Method C IPC TM-650 2.2.4
-0.14 Y
Volume Resistivity 1.4 x 109 - MΩ•cm COND A IPC 2.5.17.1
Surface Resistivity 2.6 x 10⁸ - MΩ COND A IPC 2.5.17.1
378 X
Tensile Modulus ksi 23°C ASTM D638
396 Y
IPC-TM-650
Moisture Absorption 0.06 - % D48/50
2.6.2.1
0.73 0°C
Specific Heat Z J/g/K ASTM E1269-11
0.83 50°C
Thermal Conductivity 0.43 Z W/m/K 50°C ASTM D5470
16 X
Coefficient of Thermal Expansion 17 Y ppm/°C 23°C/50% RH IPC-TM-650 2.4.41
18 Z
Td 500 - °C TGA - ASTM D3850
gm/
Density 2.15 - 23°C ASTM D792
cm3
1/2 oz. EDC
Copper Peel Strength 12.0 - lb/in IPC-TM-2.4.8
After Solder Float
Flammability V-0 - - - UL 94
Lead Free Process Compatible YES - - - -

NOTES:
(1) Typical values are a representation of an average value for the population of the property. For specification values contact Rogers Corporation.
(2) The design Dk is an average number from several different tested lots of material and on the most common thicknesses. If more detailed information is
required, please contact Rogers Corporation or refer to Rogers’ technical papers in the Rogers Technology Support Hub at www.rogerscorp.com/techub

Foil Sa Sz Sq Surface Area Index

(microns) (microns) (microns)
1/4 oz 0.35 3.85 0.44 2.37
1/2 oz 0.34 3.73 0.43 2.82
1 oz 0.36 4.05 0.45 2.24

100 S. Roosevelt Avenue, Chandler, AZ 85226

Tel: 480-961-1382 Fax: 480-961-4533 www.rogerscorp.com

Page 3 of 4
 Data Sheet

Standard Thicknesses Standard Panel Sizes Standard Claddings

0.005” (0.13mm) +/- 0.0005” 24” X 18” (610 X 457mm) VLP Electrodeposited Copper Foil
0.010” (0.25mm) +/- 0.0007” 24” X 21” (610 X 533mm) ½ oz (18µm) TH/TH

*Additional panel sizes available *Additional cladding weights are available

*Contact Customer Service or Sales Engineering to inquire about additional available product configurations

The information in this data sheet is intended to assist you in designing with Rogers’ circuit materials. It is not intended to and does not create any
warranties express or implied, including any warranty of merchantability or fitness for a particular purpose or that the results shown on this data sheet
will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers’ circuit materials for each application.

These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations. Diversion contrary to
U.S. law prohibited.

The Rogers’ logo, Helping power, protect, connect our world, RO3000, RO3003 and RO3003G2 are trademarks of Rogers Corporation or one of its subsidiaries.

©2022 Rogers Corporation, Printed in U.S.A., All rights reserved.

Revised 1625 102522 Publication #92-547

100 S. Roosevelt Avenue, Chandler, AZ 85226

Tel: 480-961-1382 Fax: 480-961-4533 www.rogerscorp.com

Page 4 of 4