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JetsonNano DataSheet DS09366001v1.1

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JetsonNano DataSheet DS09366001v1.1

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DATA SHEET

NVIDIA Jetson Nano System-on-Module

Maxwell GPU + ARM Cortex-A57 + 4GB LPDDR4 + 16GB eMMC

Maxwell GPU ◊ Display Controller

128-core GPU | End-to-end lossless compression | Tile Caching | Two independent display controllers support DSI, HDMI, DP, eDP:
OpenGL® 4.6 | OpenGL ES 3.2 | Vulkan™ 1.1 | CUDA® | OpenGL MIPI-DSI (1.5Gbps/lane): Single x2 lane | Maximum Resolution:
ES Shader Performance (up to): 512 GFLOPS (FP16) 1920x960 at 60Hz (up to 24bpp)
Maximum Operating Frequency: 921MHz HDMI 2.0a/b (up to 6Gbps) | DP 1.2a (HBR2 5.4 Gbps) | eDP
1.4 (HBR2 5.4Gbps) | Maximum Resolution (DP/eDP/HDMI):
CPU 3840 x 2160 at 60Hz (up to 24bpp)
ARM® Cortex® -A57 MPCore (Quad-Core) Processor with NEON
Technology | L1 Cache: 48KB L1 instruction cache (I-cache) per Clocks
core; 32KB L1 data cache (D-cache) per core | L2 Unified Cache: System clock: 38.4MHz | Sleep clock: 32.768kHz | Dynamic clock
2MB | Maximum Operating Frequency: 1.43GHz scaling and clock source selection

Audio
Multi-Stream HD Video and JPEG
Industry standard High Definition Audio (HDA) controller provides a Video Decode
multichannel audio path to the HDMI interface.
H.265 (Main, Main 10): 2160p 60fps | 1080p 240fps
Memory H.264 (BP/MP/HP/Stereo SEI half-res): 2160p 60fps | 1080p
240fps
Dual Channel | System MMU | Memory Type: 4ch x 16-bit LPDDR4
| Maximum Memory Bus Frequency: 1600MHz | Peak Bandwidth: H.264 (MVC Stereo per view): 2160p 30fps | 1080p 120fps
25.6 GB/s | Memory Capacity: 4GB VP9 (Profile 0, 8-bit): 2160p 60fps | 1080p 240fps
VP8: 2160p 60fps | 1080p 240fps
Storage VC-1 (Simple, Main, Advanced): 1080p 120fps | 1080i 240fps
eMMC 5.1 Flash Storage | Bus Width: 8-bit | Maximum Bus MPEG-2 (Main): 2160p 60fps | 1080p 240fps | 1080i 240fps
Frequency: 200MHz (HS400) | Storage Capacity: 16GB Video Encode
H.265:2160p 30fps | 1080p 120fps
Boot Sources H.264 (BP/MP/HP): 2160p 30fps | 1080p 120fps
eMMC and USB (recovery mode) H.264 (MVC Stereo per view): 1440p 30fps | 1080p 60fps
VP8: 2160p 30fps | 1080p 120fps
Networking JPEG (Decode and Encode): 600 MP/s
10/100/1000 BASE-T Ethernet | Media Access Controller (MAC)
Peripheral Interfaces
Imaging xHCI host controller with integrated PHY: 1 x USB 3.0, 3 x USB 2.0
Dedicated RAW to YUV processing engines process up to | USB 3.0 device controller with integrated PHY | EHCI controller
1400Mpix/s (up to 24MP sensor) | MIPI CSI 2.0 up to 1.5Gbps (per with embedded hub for USB 2.0 | 4-lane PCIe: one x1/2/4 controller
lane) | Support for x4 and x2 configurations (up to four active | single SD/MMC controller (supporting SDIO 4.0, SD HOST 4.0) |
streams). 3 x UART | 2 x SPI | 4 x I2C | 2 x I2S: support I2S, RJM, LJM, PCM,
TDM (multi-slot mode) | GPIOs
Operating Requirements
Temperature Range (Tj): -25 – 97C* | Module Power: 5 – 10W | Mechanical
Power Input: 5.0V Module Size: 69.6 mm x 45 mm | PCB: 8L HDI | Connector: 260 pin
SO-DIMM

Note: Refer to the software release feature list for current software support; all features may not be available for a particular OS.
◊
Product is based on a published Khronos Specification and is expected to pass the Khronos Conformance Process. Current conformance status
can be found at www.khronos.org/conformance.

* See the Jetson Nano Thermal Design Guide for details. Listed temperature range is based on module Tj characterization.

Revision History
Version Date Description
v0.1 JAN 2019 Initial Release
v0.7 MAY 2019 Description
• Memory: corrected peak bandwidth
• Peripheral Interfaces: corrected number of available I2C interfaces
Functional Overview
• Removed block diagram; see the Jetson Nano Product Design Guide for these details
Power and System Management
• Removed On-Module Internal Power Rails table
• Updated Power Domains table
• Updated Programmable Interface Wake Event table
• Updated Power Up/Down sequence diagrams
Pin Descriptions
• Updated throughout to reflect updated pinmux
• GPIO Pins: updated table to reflect dedicated GPIO pins only (see pinmux for ALL GPIO
capable pins)
Interface Descriptions
• Updated throughout to reflect updated pinmux
• Embedded DisplayPort (eDP) Interface: clarified DP use/limitations on DP0
• MIPI Camera Serial Interface (CSI) - Updated CSI description to remove erroneous
reference to virtual channels
Physical/Electrical Characteristics
• Absolute Maximum Ratings - Added reference to Jetson Nano Thermal Design Guide for
Operating Temperature; extended IDDMAX to 5A
• Pinout: Updated to reflect updated pinmux
• Package Drawing and Dimensions – Updated drawing
v0.8 OCT 2019 Description
• Operating Requirements: corrected Module Power to reflect power for module only
(previous stated range included module + IO); updated Temperature Range for clarity,
included maximum operating temperature and updated note to reflect module
temperature is based on Tj .
v1.0 FEB 2020 Pin Descriptions
• GPIO Pins: corrected pin number listing for GPIO01
Interface Descriptions
• High-Definition Multimedia Interface (HDMI) and DisplayPort (DP) Interfaces reference to
YUV output support
• Gigabit Ethernet – Corrected Realtek Gigabit Ethernet Controller part number
Physical/Electrical Characteristics
• Operating and Absolute Maximum Ratings – Added Mounting Force to Absolute
Maximum Ratings table.
• Package Drawing and Dimensions – Updated drawing
• Environmental & Mechanical Screening – Added section
v1.1 MAY 2022 Power and System Management
• Moved PMIC_BBAT information to new sub-section
• Updated PMIC_BBAT Pin Description
Pin Descriptions
• GPIO Pins: updated GPIO8 (pin 208) description; Fan tachometer only
Interface Descriptions
• SD/SDIO – Updated pin descriptions to include 3.3V support; deprecated GPIO8 SD Card
Detect support
• SPI – updated master timing diagram and parameters
• UART – UART1_CTS (pin 209) updated PoR
Physical/Electrical Characteristics
• Package Drawing and Dimensions – added module dimensions table

Table of Contents
1.0 Functional Overview 5
Maxwell GPU ............................................................................................................................................... 5
CPU Complex .............................................................................................................................................. 6
1.2.1 Snoop Control Unit and L2 Cache ................................................................................................. 6
1.2.2 Performance Monitoring ................................................................................................................. 7
High-Definition Audio-Video Subsystem ..................................................................................................... 7
1.3.1 Multi-Standard Video Decoder ....................................................................................................... 7
1.3.2 Multi-Standard Video Encoder ....................................................................................................... 7
1.3.3 JPEG Processing Block ................................................................................................................. 8
1.3.4 Video Image Compositor (VIC) ...................................................................................................... 8
Image Signal Processor (ISP) ..................................................................................................................... 9
Display Controller Complex ......................................................................................................................... 9
Memory ...................................................................................................................................................... 10
2.0 Power and System Management 11
Power Rails................................................................................................................................................ 12
PMIC_BBAT .............................................................................................................................................. 12
Power Domains/Islands ............................................................................................................................. 12
Power Management Controller (PMC) ...................................................................................................... 13
2.4.1 Resets .......................................................................................................................................... 13
2.4.2 System Power States and Transitions ......................................................................................... 13
2.4.2.1 ON State ............................................................................................................................. 14
2.4.2.2 OFF State ........................................................................................................................... 14
2.4.2.3 SLEEP State ....................................................................................................................... 14
Thermal and Power Monitoring ................................................................................................................. 15
Power Sequencing .................................................................................................................................... 15
2.6.1 Power Up ..................................................................................................................................... 15
2.6.2 Power Down ................................................................................................................................. 15
3.0 Pin Descriptions 17
MPIO Power-on Reset Behavior ............................................................................................................... 17
MPIO Deep Sleep Behavior ...................................................................................................................... 18
GPIO Pins .................................................................................................................................................. 19
4.0 Interface Descriptions 20
USB ........................................................................................................................................................... 20
PCI Express (PCIe) ................................................................................................................................... 21
Display Interfaces ...................................................................................................................................... 22
4.3.1 MIPI Display Serial Interface (DSI) .............................................................................................. 22
4.3.2 High-Definition Multimedia Interface (HDMI) and DisplayPort (DP) Interfaces ........................... 23
4.3.3 Embedded DisplayPort (eDP) Interface ....................................................................................... 24
MIPI Camera Serial Interface (CSI) / VI (Video Input)............................................................................... 25
SD / SDIO .................................................................................................................................................. 27
Inter-IC Sound (I2S) ................................................................................................................................... 28
Miscellaneous Interfaces ........................................................................................................................... 29
4.7.1 Inter-Chip Communication (I2C) .................................................................................................. 29
4.7.2 Serial Peripheral Interface (SPI) .................................................................................................. 29
4.7.3 UART ........................................................................................................................................... 31
4.7.4 Gigabit Ethernet ........................................................................................................................... 32
4.7.5 Fan ............................................................................................................................................... 33
4.7.6 Debug ........................................................................................................................................... 33

5.0 Physical / Electrical Characteristics 34

Operating and Absolute Maximum Ratings ............................................................................................... 34
Digital Logic ............................................................................................................................................... 35
Environmental & Mechanical Screening .................................................................................................... 35
Pinout ......................................................................................................................................................... 37
Package Drawing and Dimensions ........................................................................................................... 38

1.0 Functional Overview

Designed for use in power-limited environments, the Jetson Nano squeezes industry-leading compute capabilities, 64-bit
operating capability, and integrated advanced multi-function audio, video and image processing pipelines into a 260-pin SO-
DIMM. The Maxwell GPU architecture implemented several architectural enhancements designed to extract maximum
performance per watt consumed. Core components of the Jetson Nano series module include:

 NVIDIA® Tegra® X1 series SoC

- NVIDIA Maxwell GPU
- ARM® quad-core Cortex®-A57 CPU Complex
 4GB LPDDR4 memory
 16GB eMMC 5.1 storage
 Gigabit Ethernet (10/100/1000 Mbps)
 PMIC, regulators, power and voltage monitors
 260-pin keyed connector (exposes both high-speed and low-speed industry standard I/O)
 On-chip temperature sensors

Maxwell GPU
The Graphics Processing Cluster (GPC) is a dedicated hardware block for rasterization, shading, texturing, and compute;
most of the GPU’s core graphics functions are performed inside the GPC. Within the GPC there are multiple Streaming
Multiprocessor (SM) units and a Raster Engine. Each SM includes a Polymorph Engine and Texture Units; raster operations
remain aligned with L2 cache slices and memory controllers

The Maxwell GPU architecture introduced an all-new design for the SM, redesigned all unit and crossbar structures, optimized
data flows, and significantly improved power management. The SM scheduler architecture and algorithms were rewritten to
be more intelligent and avoid unnecessary stalls, while further reducing the energy per instruction required for scheduling. The
organization of the SM also changed; each Maxwell SM (called SMM) is now partitioned into four separate processing blocks,
each with its own instruction buffer, scheduler and 32 CUDA cores.

The SMM CUDA cores perform pixel/vertex/geometry shading and physics/compute calculations. Texture units perform
texture filtering and load/store units fetch and save data to memory. Special Function Units (SFUs) handle transcendental and
graphics interpolation instructions. Finally, the Polymorph Engine handles vertex fetch, tessellation, viewport transform,
attribute setup, and stream output. The SMM geometry and pixel processing performance make it highly suitable for rendering
advanced user interfaces and complex gaming applications; the power efficiency of the Maxwell GPU enables this
performance on devices with power-limited environments.

Features:

 End-to-end lossless compression

 Tile Caching
 Support for OpenGL 4.6, OpenGL ES 3.2, Vulkan 1.1, DirectX 12, CUDA 10 (FP16)
 Adaptive Scalable Texture Compression (ATSC) LDR profile supported
 Iterated blend, ROP OpenGL-ES blend modes
 2D BLIT from 3D class avoids channel switch
 2D color compression
 Constant color render SM bypass
 2x, 4x, 8x MSAA with color and Z compression
 Non-power-of-2 and 3D textures, FP16 texture filtering

 FP16 shader support

 Geometry and Vertex attribute Instancing
 Parallel pixel processing
 Early-z reject: Fast rejection of occluded pixels acts as multiplier on pixel shader and texture performance while saving
power and bandwidth
 Video protection region
 Power saving: Multiple levels of clock gating for linear scaling of power

GPU frequency and voltage are actively managed by Tegra Power and Thermal Management Software and influenced by
workload. Frequency may be throttled at higher temperatures (above a specified threshold) resulting in a behavior that
reduces the GPU operating frequency. Observed chip-to-chip variance is due to NVIDIA ability to maximize performance
(DVFS) on a per-chip basis, within the available power budget.

CPU Complex
The CPU complex is a high-performance Multi-Core SMP cluster of four ARM Cortex-A57 CPUs with 2MB of L2 cache (shared
by all cores). Features include:

 Superscalar, variable-length, out-of-order pipeline

 Dynamic branch prediction with Branch Target Buffer (BTB) and Global History Buffer RAMs, a return stack, and an
indirect predictor
 48-entry fully-associative L1 instruction TLB with native support for 4KB, 64KB, and 1MB page sizes.
 32-entry fully-associative L1 data TLB with native support for 4KB, 64KB, and 1MB pages sizes.
 4-way set-associative unified 1024-entry Level 2 (L2) TLB in each processor
 48Kbyte I-cache and 32Kbyte D-cache for each core.
 Full implementation of ARMv8 architecture instruction set
 Embedded Trace Microcell (ETM) based on the ETMv4 architecture
 Performance Monitor Unit (PMU) based on the PMUv3 architecture
 Cross Trigger Interface (CTI) for multiprocessor debugging
 Cryptographic Engine for crypto function support
 Interface to an external Generic Interrupt Controller (vGIC-400)
 Power management with multiple power domains

CPU frequency and voltage are actively managed by Tegra Power and Thermal Management Software and influenced by
workload. Frequency may be throttled at higher temperatures (above a specified threshold) resulting in a behavior that
reduces the CPU operating frequency. Observed chip-to-chip variance is due to NVIDIA ability to maximize performance
(DVFS) on a per-chip basis, within the available power budget.

1.2.1 Snoop Control Unit and L2 Cache

The CPU cluster includes an integrated snoop control unit (SCU) that maintains coherency between the CPUs within the
cluster and a tightly coupled L2 cache that is shared between the CPUs within the cluster. The L2 cache also provides a 128-
bit AXI master interface to access DRAM. L2 cache features include:

 2MB L2
 Fixed line length of 64 bytes
 16-way set-associative cache structure

 Duplicate copies of the L1 data cache directories for coherency support

 Hardware pre-fetch support
 ECC support

1.2.2 Performance Monitoring

The performance monitoring unit (part of MPCore non-CPU logic) provides six counters, each of which can count any of the
events in the processor. The unit gathers various statistics on the operation of the processor and memory system during
runtime, based on ARM PMUv3 architecture.

High-Definition Audio-Video Subsystem

The audio-video subsystem off-loads audio and video processing activities from the CPU subsystem resulting in faster, fully
concurrent, highly efficient operation.

1.3.1 Multi-Standard Video Decoder

The video decoder accelerates video decode, supporting low resolution content, Standard Definition (SD), High Definition (HD)
and UltraHD (2160p, or 4k video) profiles. The video decoder is designed to be extremely power efficient without sacrificing
performance.

The video decoder communicates with the memory controller through the video DMA which supports a variety of memory
format output options. For low power operations, the video decoder can operate at the lowest possible frequency while
maintaining real-time decoding using dynamic frequency scaling techniques.

Video standards supported:

 H.265: Main10, Main

 WEBM VP9 and VP8
 H.264: Baseline (no FMO/ASO support), Main, High, Stereo SEI (half-res)
 VC-1: Simple, Main, Advanced
 MPEG-4: Simple (with B frames, interlaced; no DP and RVLC)
 H.263: Profile 0
 DiVX: 4/5/6
 XviD Home Theater
 MPEG-2: MP

1.3.2 Multi-Standard Video Encoder

The multi-standard video encoder enables full hardware acceleration of various encoding standards. It performs high-quality
video encoding operations for applications such as video recording and video conferencing. The encode processor is designed
to be extremely power-efficient without sacrificing performance.

Video standards supported:

 H.265 Main Profile: I-frames and P-frames (No B-frames)

 H.264 Baseline/Main/High Profiles: IDR/I/P/B-frame support, MVC
 VP8
 MPEG4 (ME only)
 MPEG2 (ME only)
 VC1 (ME only): No B frame, no interlaced

1.3.3 JPEG Processing Block

The JPEG processing block is responsible for JPEG (de)compression calculations (based on JPEG still image standard),
image scaling, decoding (YUV420, YUV422H/V, YUV444, YUV400) and color space conversion (RGB to YUV; decode only).

Input (encode) formats:

 Pixel width: 8bpc

 Subsample format: YUV420
 Resolution up to 16K x 16K
 Pixel pack format
- Semi-planar/planar for 420

Output (decode) formats:

 Pixel width 8bpc

 Resolution up to 16K x 16K
 Pixel pack format
- Semi-planar/planar for YUV420
- YUY2/planar for 422H/422V
- Planar for YUV444
- Interleave for RGBA

1.3.4 Video Image Compositor (VIC)

The Video Image Compositor implements various 2D image and video operations in a power-efficient manner. It handles
various system UI scaling, blending and rotation operations, video post-processing functions needed during video playback,
and advanced de-noising functions used for camera capture.

Features:

 Color Decompression
 High-quality Deinterlacing
 Inverse Teleciné
 Temporal Noise Reduction
- High-quality video playback
- Reduces camera sensor noise
 Scaling
 Color Conversion
 Memory Format Conversion
 Blend/Composite
 2D Bit BLIT operation
 Rotation

Image Signal Processor (ISP)

The ISP module takes data from the VI/CSI module or memory in raw Bayer format and processes it to YUV output. The
imaging subsystem supports raw (Bayer) image sensors up to 24 million pixels. Advanced image processing is used to convert
input to YUV data and remove artifacts introduced by high megapixel CMOS sensors and optics with up to 30-degree CRA.

Features:

 Flexible post-processing architecture for supporting custom computer vision and computational imaging operations
 Bayer domain hardware noise reduction
 Per-channel black-level compensation
 High-order lens-shading compensation
 3 x 3 color transform
 Bad pixel correction
 Programmable coefficients for de-mosaic with color artifact reduction
Color Artifact Reduction: a two-level (horizontal and vertical) low-pass filtering scheme that is used to reduce/remove
any color artifacts that may result from Bayer signal processing and the effects of sampling an image.
 Enhanced down scaling quality
 Edge Enhancement
 Color and gamma correction
 Programmable transfer function curve
 Color-space conversion (RGB to YUV)
 Image statistics gathering (per-channel)
- Two 256-bin image histograms
- Up to 4,096 local region averages
- AC flicker detection (50Hz and 60Hz)
- Focus metric block

Display Controller Complex

The Display Controller Complex integrates two independent display controllers. Each display controller is capable of
interfacing to an external display device and can drive the same or different display contents at different resolutions and
refresh rates. Each controller supports a cursor and three windows (Window A, B, and C); controller A supports two additional
simple windows (Window D, T). The display controller reads rendered graphics or video frame buffers in memory, blends them
and sends them to the display.

Features:

 Two heads. Each can be mapped to one of:

- 1x DSI, 1x eDP/DP (Limited Functionality: No Audio)
- 1x HDMI/DP (Full Functionality)
 90, 180, 270-degree image transformation uses both horizontal and vertical flips (controller A only)
 Byte-swapping options on 16-bit and 32-bit boundary for all color depths
 NVIDIA Pixel Rendering Intensity and Saturation Management™ (PRISM)
 256 x 256 cursor size
 Color Management Unit for color decompression and to enhance color accuracy (compensate for the color error
specific to the display panel being used)

 Scaling and tiling in hardware for lower power operation

 Full color alpha-blending
 Captive panels
- Secure window (Win T) for TrustZone
- Supports cursor and up to four windows (Win A, B, C, and D)
- 1x 2-lane MIPI DSI
- Supports MIPI D-PHY rates up to 1.5Gbps
- 4-lane eDP with AUX channel
- Independent resolution and pixel clock
- Supports display rotation and scaling in hardware
 External displays
- Supports cursor and three windows (Window A, B, and C)
- 1x HDMI (2.0) or DisplayPort (HBR2) interface
- Supports display scaling in hardware

Memory
The Jetson Nano integrates 4GB of LPDDR4 over a four-channel x 16-bit interface. Memory frequency options are 204MHz
and 1600MHz; maximum frequency of 1600MHz has a theoretical peak memory bandwidth of 25.6GB/s.

The Memory Controller (MC) maximizes memory utilization while providing minimum latency access for critical CPU requests.
An arbiter is used to prioritize requests, optimizing memory access efficiency and utilization and minimizing system power
consumption. The MC provides access to main memory for all internal devices. It provides an abstract view of memory to its
clients via standardized interfaces, allowing the clients to ignore details of the memory hierarchy. It optimizes access to shared
memory resources, balancing latency and efficiency to provide best system performance, based on programmable
parameters.

Features:
 TrustZone (TZ) Secure and OS-protection regions
 System Memory Management Unit
 Dual CKE signals for dynamic power down per device
 Dynamic Entry/Exit from Self -Refresh and Power Down states

The MC can sustain high utilization over a very diverse mix of requests. For example, the MC is prioritized for bandwidth (BW)
over latency for all multimedia blocks (the multimedia blocks have been architected to prefetch and pipeline their operations to
increase latency tolerance); this enables the MC to optimize performance by coalescing, reordering, and grouping requests to
minimize memory power. DRAM also has modes for saving power when it is either not being used, or during periods of
specific types of use.

2.0 Power and System Management

The Jetson Nano module operates from a single power source (VDD_IN) with all internal module voltages and I/O voltages
generated from this input. This enables the on-board power management controller to implement a tiered structure of power
and clock gating in a complex environment that optimizes power consumption based on workload:

 Power Management Controller (PMC) and Real Time Clock (RTC): These blocks reside in an Always On (not
power gated) partition. The PMC provides an interface to an external power manager IC or PMU. It primarily controls
voltage transitions for the SoC as it transitions to/from different low power modes; it also acts as a slave receiving
dedicated power/clock request signals as well as wake events from various sources (e.g., SPI, I2C, RTC, USB
attach) which can wake the system from a deep-sleep state. The RTC maintains the ability to wake the system based
on either a timer event or an external trigger (e.g., key press).
 Power Gating: The SoC aggressively employs power-gating (controlled by PMC) to power-off modules which are
idle. CPU cores are on a separate power rail to allow complete removal of power and eliminate leakage. Each CPU
can be power gated independently. Software provides context save/restore to/from DRAM.
 Clock Gating: Used to reduce dynamic power in a variety of power states.
 Dynamic Voltage and Frequency Scaling (DVFS): Raises voltages and clock frequencies when demand requires,
lowers them when less is sufficient, and removes them when none is needed. DVFS is used to change the voltage
and frequencies in the following power domains: CPU, CORE, and GPU.

Table 1 Power and System Control Pin Descriptions

Pin Name Direction Type PoR Description

251 VDD_IN Input 5.0V Power: Main DC input, supplies PMIC and other
252 regulators
253
254
255
256
257
258
259
260

235 PMIC_BBAT Bidirectional 1.65V-5.5V Power: PMIC Battery Back-up. Optionally used to
provide back-up power for the Real-Time Clock
(RTC).

240 SLEEP/WAKE* Input CMOS – 5.0V PU Sleep / Wake. Configured as GPIO for optional use
to place system in sleep mode or wake system from
sleep.

214 FORCE_RECOVERY* Input CMOS – 1.8V PU Force Recovery: strap pin

237 POWER_EN Input CMOS – 5.0V Module on/off: high = on, low = off.

233 SHUTDOWN_REQ* Output CMOS – 5.0V z Shutdown Request: used by the module to request a
shutdown from the carrier board (POWER_EN low).
100kΩ pull-up to VDD_IN (5V) on the module.

239 SYS_RESET* Bidirectional Open Drain, 1.8V 1 Module Reset. Reset to the module when driven low
by the carrier board. When module power sequence
is complete used as carrier board supply enable.
Used to ensure proper power on/off sequencing
between module and carrier board supplies. 4.7kΩ
pull-up to 1.8V on the module.

178 MOD_SLEEP* Output CMOS – 1.8V Indicates the module sleep status. Low is in sleep
mode, high is normal operation. This pin is
controlled by system software and should not be
modified.

Power Rails
VDD_IN must be supplied by the carrier board that the Jetson Nano is designed to connect to. It must meet the required
electrical specifications detailed in Section 5. All Jetson Nano interfaces are referenced to on-module voltage rails; no I/O
voltage is required to be supplied to the module. See the Jetson Nano Product Design Guide for details of connecting to each
of the interfaces.

PMIC_BBAT
An optional back up battery can be attached to the PMIC_BBAT module input. It is used to maintain the RTC voltage when
VDD_IN is not present. This pin is connected directly to the onboard PMIC. When a backup cell is connected to the PMIC, the
RTC will retain its contents and can be configured to charge the backup cell. RTC accuracy is 2 seconds/day under typical
room temperature conditions (only).

The following backup cells may be attached to the PMIC_BBAT pin:

 Super Capacitor (gold cap, double layer electrolytic)
 Standard capacitors (tantalum)
 Rechargeable Lithium Manganese cells

A backup cell MUST provide a voltage in the range 2.5V to 3.5V. The backup cell is charged with a constant current, constant
voltage charger that can be configured between 2.5V and 3.5V (constant voltage) output and 50µA to 800µA (constant
current).

Table 2: PMIC_BBAT Pin Descriptions

Pin Name Description Direction Pin Type

235 PMIC_BBAT PMIC Battery Back-up. Optionally used to provide back-up power for the Bidir 1.65V-5.5V
Real-Time Clock (RTC). Connects to Lithium Cell or super capacitor on
Carrier Board. PMIC is supply when charging cap or coin cell. Super cap or
coin cell is source when system is disconnected from power. Constant
current of 2.0µA for 2.5V; 2.3µA for 3.3V typical; 4.2µA maximum.

Power Domains/Islands
Power domains and power islands are used to optimize power consumption for various low-power use cases and limiting
leakage current. The RTC domain is always on, CORE/CPU/GPU domains can be turned on and off. The CPU, CORE and
GPU power domains also contain power-gated islands which are used to power individual modules (as needed) within each
domain. Clock-gating is additionally applied during powered-on but idle periods to further reduce unnecessary power
consumption. Clock-gating can be applied to both power-gated and non-power-gated islands (NPG).

Table 3 Power Domains

Power Domain Power Island in Domain Modules in Power Island
RTC N/A PMC (Power Management Controller)
(VDD_RTC)
RTC (Real Time Clock)
CORE NPG (Non-Power-Gated) AHB, APB Bus, AVP, Memory Controller (MC/EMC), USB 2.0, SDMMC
(VDD_SOC)
VE, VE2 ISPs (image signal processing) A and B, VI (video input), CSI (Camera Serial
Interface)
NVENC Video Encode
NVDEC Video Decode
NVJPG JPG accelerator and additional Video Decode
PCX PCIe

Power Domain Power Island in Domain Modules in Power Island

SOR HDMI, DSI, DP
IRAM IRAM
DISP-A, DISP-B Display Controllers A and B
XUSBA, XUSBB, XUSBC USB 3.0
VIC VIC (Video Image Compositor)
ADSP APE (Audio Processing Engine)
DFD Debug logic
GPU GPU 3D, FE, PD, PE, RAST, SM, ROP
(VDD_GPU)
CPU CPU 0 CPU 0
(VDD_CPU)
CPU 1 CPU 1
CPU 2 CPU 2
CPU 3 CPU 3
Non-CPU L2 Cache for Main CPU complex
TOP Top level logic

Power Management Controller (PMC)

The PMC power management features enable both high-speed operation and very low-power standby states. The PMC
primarily controls voltage transitions for the SoC as it transitions to/from different low-power modes; it also acts as a slave
receiving dedicated power/clock request signals as well as wake events from various sources (e.g., SPI, I2C, RTC, USB
attach) which can wake the system from deep sleep state. The PMC enables aggressive power-gating capabilities on idle
modules and integrates specific logic to maintain defined states and control power domains during sleep and deep sleep
modes.

2.4.1 Resets
The PMC receives the primary reset event (from SYS_RESET*) and generates various resets for: PMC, RTC, and CAR. From
the PMC provided reset, the Clock and Reset (CAR) controller generates resets for most of the blocks in the module. In
addition to reset events, the PMC receives other events (e.g., thermal, WatchDog Timer (WDT), software, wake) which also
result in variants of system reset.

The RTC block includes an embedded real-time clock and can wake the system based on either a timer event or an external
trigger (e.g., key press).

2.4.2 System Power States and Transitions

The Jetson module operates in three main power modes: OFF, ON, and SLEEP. The module transitions between these states
are based on various events from hardware or software. Figure 1 shows the transitions between these states.

Figure 1 Power State Diagram

ON SLEEP
EVENT EVENT

OFF ON SLEEP

OFF WAKE
EVENT EVENT

2.4.2.1 ON State
The ON power state is entered from either OFF or SLEEP states. In this state the Jetson module is fully functional and
operates normally. An ON event has to occur for a transition between OFF and ON states. The only ON EVENT currently used
is a low to high transition on the POWER_EN pin. This must occur with VDD_IN connected to a power rail, and POWER_EN is
asserted (at a logic1). The POWER_EN control is the carrier board indication to the Jetson module that the VDD_VIN power is
good. The Carrier board should assert this high only when VDD_IN has reached its required voltage level and is stable. This
prevents the Jetson module from powering up until the VDD_IN power is stable.

NOTE: The Jetson Nano module does include an Auto-Power-On option; a system input that enables the
module to power on if asserted. For more information on available signals and broader system
usage, see the Jetson Nano Product Design Guide.

2.4.2.2 OFF State

The OFF state is the default state when the system is not powered. It can only be entered from the ON state, through an OFF
event. OFF Events are listed in the table below.

Table 4 OFF State Events

Event Details Preconditions

HW Shutdown Set POWER_EN pin to zero for at least 100µS, the internal PMIC will In ON State
start shutdown sequence

SW Shutdown Software initiated shutdown ON state, Software operational

Thermal Shutdown If the internal temperature of the Jetson module reaches an unsafe Any power state
temperature, the hardware is designed to initiate a shutdown

2.4.2.3 SLEEP State

The Sleep state can only be entered from the ON state. This state allows the Jetson module to quickly resume to an
operational state without performing a full boot sequence. In this state the Jetson module operates in low power with enough
circuitry powered to allow the device to resume and re-enter the ON state. During this state the output signals from Jetson
module are maintained at their logic level prior to entering the state (i.e., they do not change to a 0V level).

The SLEEP state can only be entered directly by software. For example, operating within an OS, with no operations active for
a certain time can trigger the OS to initiate a transition to the SLEEP state.

To Exit the SLEEP state a WAKE event must occur. WAKE events can occur from within the Jetson module or from external
devices through various pins on the Jetson Nano connector. A full list of Wake enabled pins is available in the pinmux.

Table 5 SLEEP State Events

Event Details

RTC WAKE up Timers within the Jetson module can be programmed, on SLEEP entry. When these expire they
create a WAKE event to exit the SLEEP state.

Thermal Condition If the Jetson module internal temperature exceeds programmed hot and cold limits the system is
forced to wake up, so it can report and take appropriate action (shut down for example)

USB VBUS detection If VBUS is applied to the system (USB cable attached) then the device can be configured to Wake
and enumerate

Thermal and Power Monitoring

The Jetson Nano is designed to operate under various workloads and environmental conditions. It has been designed so that
an active or passive heat sinking solution can be attached. The module contains various methods through hardware and
software to limit the internal temperature to within operating limits. See the Jetson Nano Thermal Design Guide for more
details.

Power Sequencing
The Jetson Nano module is required to be powered on and off in a known sequence. Sequencing is determined through a set
of control signals; the SYS_RESET* signal (when deasserted) is used to indicate when the carrier board can power on. The
following sections provide an overview of the power sequencing steps between the carrier board and Jetson Nano module.
Refer to the Jetson Nano Product Design Guide for system level details on the application of power, power sequencing, and
monitoring. The Jetson Nano module and the product carrier board must be power sequenced properly to avoid potential
damage to components on either the module or the carrier board system.

2.6.1 Power Up
During power up, the carrier board must wait until the signal SYS_RESET* is deasserted from the Jetson module before
enabling its power; the Jetson module will deassert the SYS_RESET* signal to enable the complete system to boot.

NOTE: I/O pins cannot be high (>0.5V) before SYS_RESET* goes high. When SYS_RESET* is low, the
maximum voltage applied to any I/O pin is 0.5V. For more information, refer to the Jetson Nano
Product Design Guide.

Figure 2 Power-up Sequence (No Power Button – Auto-Power-On Enabled)

VDD_IN

POWER_EN

Module Power

SYS_RESET*

Carrier Board Supplies

2.6.2 Power Down

In a shutdown event the Jetson module asserts SHUTDOWN_REQ*. The SHUTDOWN_REQ* must be serviced by the carrier
board to toggle POWER_EN from high to low, even in cases of sudden power loss. The Jetson module starts the power off
sequence when POWER_EN is deasserted; SYS_RESET* is asserted by the Jetson module, allowing the carrier board to put
any components into a known state and power down.

Figure 3 Power Down Sequence (Initiated by SHUTDOWN_REQ* Assertion)

VDD_IN

SHUTDOWN_REQ*

POWER_EN T < 10uS

3.0 Pin Descriptions

The primary interface to Jetson Nano is via a 260-pin SO-DIMM connector. Connector exposes power, ground, high-speed
and low-speed industry standard I/O connections. See the NVIDIA Jetson Nano Product Design Guide for details on
integrating the module and mating connector into product designs.

The I/O pins on the SO-DIMM are comprised of both Single Function I/O (SFIO) and Multi-Purpose digital I/O (MPIO) pins.
Each MPIO can be configured to act as a GPIO or it can be assigned for use by a particular I/O controller. Though each MPIO
has up to five functions (GPIO function and up to four SFIO functions), a given MPIO can only act as a single function at a
given point in time. The functions for each pin on the Jetson module are fixed to a single SFIO function or as a GPIO. The
different MPIO pins share a similar structure, but there are several varieties of such pins. The varieties are designed to
minimize the number of on-board components (such as level shifters or pull-up resistors) required in Jetson Nano designs.

MPIO pin types:

 ST (standard) pins are the most common pins on the chip. They are used for typical General Purpose I/O.
 DD (dual-driver) pins are similar to the ST pins. A DD pin can tolerate its I/O pin being pulled up to 3.3V (regardless
of supply voltage) if the pin’s output-driver is set to open-drain mode. There are special power-sequencing
considerations when using this functionality.
NOTE: The output of DD pins cannot be pulled High during deep-power-down (DPD).

 CZ (controlled output impedance) pins are optimized for use in applications requiring tightly controlled output
impedance. They are similar to ST pins except for changes in the drive strength circuitry and in the weak pull-ups/-
downs. CZ pins are included on the VDDIO_SDMMC3 (Module SDMMC pins) power rail; also includes a CZ_COMP
pin. Circuitry within the Jetson module continually matches the output impedance of the CZ pins to the on-board pull-
up/-down resistors attached to the CZ_COMP pins.
 LV_CZ (low voltage-controlled impedance) pins are similar to CZ pins but are optimized for use with a 1.2V supply
voltage (and signaling level). They support a 1.8V supply voltage (and signaling level) as a secondary mode. The
Jetson nano uses LV_CZ pins for SPI interfaces operating at 1.8V.
 DP_AUX pin is used as an Auxiliary control channel for the DisplayPort which needs differential signaling. Because
the same I/O block is used for DisplayPort and HDMI to ensure the control path to the display interface is minimized,
the DP_AUX pins can operate in open-drain mode so that HDMI’s control path (i.e., DDC interface which needs I2C)
can also be used in the same pin.

Each MPIO pin consists of:

 An output driver with tristate capability, drive strength controls and push-pull mode, open-drain mode, or both
 An input receiver with either Schmitt mode, CMOS mode, or both
 A weak pull-up and a weak pull-down

MPIO pins are partitioned into multiple “pin control groups” with controls being configured for the group. During normal
operation, these per-pin controls are driven by the pinmux controller registers. During deep sleep, the PMC bypasses and then
resets the pinmux controller registers. Software reprograms these registers as necessary after returning from deep sleep.

Refer to the Tegra X1 (SoC) Technical Reference Manual for more information on modifying pin controls.

MPIO Power-on Reset Behavior

Each MPIO pin has a deterministic power-on reset (PoR) state. The particular reset state for each pin is chosen to minimize
the need of on-board components like pull-up resistors in a Jetson Nano-based system. For example, the on-chip weak pull-
ups are enabled during PoR for pins which are usually used to drive active-low chip selects.

MPIO Deep Sleep Behavior

Deep Sleep is an ultra-low-power standby state in which the Jetson Nano maintains much of its I/O state while most of the
chip is powered off. The following lists offer a simplified description of the deep sleep entry and exit concentrating on those
aspects which relate to the MPIO pins. During deep sleep most of the pins are put in a state called Deep Power Down (DPD).
The sequence for entering to DPD is same across pins. Specific variations are there in some pins in terms of type of features
that are available in DPD.

NOTE: The output of DD pins cannot be pulled High during deep-power-down (DPD).
OD pins do NOT retain their output during DPD. OD pins should NOT be configured as GPIOs in a platform
where they are expected to hold a value during DPD.

ALL MPIO pins do NOT have identical behavior during deep sleep. They differ with regard to:
 Input buffer behavior during deep sleep
- Forcibly disabled OR
- Enabled for use as a “GPIO wake event” OR
- Enabled for some other purpose (e.g., a “clock request” pin)
 Output buffer behavior during deep sleep
- Maintain a static programmable (0, 1, or tristate) constant value OR
- Capable of changing state (i.e., dynamic while the chip is still in deep sleep)
 Weak pull-up/pull-down behavior during deep sleep
- Forcibly disabled OR
- Can be configured
 Pins that do not enter deep sleep
- Some of the pins whose outputs are dynamic during deep sleep are of special type and they do not enter deep
sleep (e.g., pins that are associated with PMC logic do not enter deep sleep, pins that are associated with JTAG
do not enter into deep sleep any time.

Figure 4 DPD Wait Times

GPIO Pins
The Jetson Nano has multiple dedicated GPIOs. Each GPIO can be individually configurable as an Output, Input, or Interrupt
source with level/edge controls. The pins listed in the following table are dedicated GPIOs; some with alternate SFIO
functionality. Many other pins not included in this list are capable of being configured as GPIOs instead of the SFIO
functionality the pin name suggests (e.g., UART, SPI, I2S, etc.). All pins that can support GPIO functionality have this exposed
in the Pinmux.

Table 6 Dedicated GPIO Pin Descriptions

Pin Name Direction Type PoR Alternate Function

87 GPIO00 Bidirectional Open-Drain [DD] 0 USB VBUS Enable (USB_VBUS_EN0)

118 GPIO01 Bidirectional CMOS – 1.8V [ST] pd Camera MCLK #2 (CLK)

124 GPIO02 Bidirectional CMOS – 1.8V [ST] pd

126 GPIO03 Bidirectional CMOS – 1.8V [ST] pd

127 GPIO04 Bidirectional CMOS – 1.8V [ST] pd

128 GPIO05 Bidirectional CMOS – 1.8V [ST] pd

130 GPIO06 Bidirectional CMOS – 1.8V [ST] pd

206 GPIO07 Bidirectional CMOS – 1.8V [ST] pd Pulse Width Modulation Signal (PWM)

208 GPIO08 Bidirectional CMOS – 1.8V [ST] pd Fan Tachometer

211 GPIO09 Bidirectional CMOS – 1.8V [ST] pd Audio Clock (AUD_MCLK)

212 GPIO10 Bidirectional CMOS – 1.8V [ST] pd

216 GPIO11 Bidirectional CMOS – 1.8V [ST] pd Camera MCLK #3

218 GPIO12 Bidirectional CMOS – 1.8V [ST] pd

228 GPIO13 Bidirectional CMOS – 1.8V [ST] pd Pulse Width Modulation Signal

230 GPIO14 Bidirectional CMOS – 1.8V [ST] pd Pulse Width Modulation Signal

114 CAM0_PWDN Bidirectional CMOS – 1.8V [ST] pd

120 CAM1_PWDN Bidirectional CMOS – 1.8V [ST] pd

4.0 Interface Descriptions

The following sections outline the interfaces available on the Jetson Nano module and details the module pins used to interact
with and control each interface. See the Tegra X1 Series SoC Technical Reference Manual for complete functional
descriptions, programming guidelines and register listings for each of these blocks.

USB
Standard Notes

Universal Serial Bus Specification Revision 3.0 Refer to specification for related interface timing details.

Universal Serial Bus Specification Revision 2.0 USB Battery Charging Specification, version 1.0; including Data Contact Detect protocol
Modes: Host and Device
Speeds: Low, Full, and High
Refer to specification for related interface timing details.
Enhanced Host Controller Interface Specification Refer to specification for related interface timing details.
for Universal Serial Bus revision 1.0

An xHCI/Device controller (named XUSB) supports the xHCI programming model for scheduling transactions and interface
managements as a host that natively supports USB 3.0, USB 2.0, and USB 1.1 transactions with its USB 3.0 and USB 2.0
interfaces. The XUSB controller supports USB 2.0 L1 and L2 (suspend) link power management and USB 3.0 U1, U2, and U3
(suspend) link power managements. The XUSB controller supports remote wakeup, wake on connect, wake on disconnect,
and wake on overcurrent in all power states, including sleep mode.

USB 2.0 Ports

Each USB 2.0 port operates in USB 2.0 High Speed mode when connecting directly to a USB 2.0 peripheral and operates in
USB 1.1 Full- and Low-Speed modes when connecting directly to a USB 1.1 peripheral. All USB 2.0 ports operating in High
Speed mode share one High-Speed Bus Instance, which means 480 Mb/s theoretical bandwidth is distributed across these
ports. All USB 2.0 ports operating in Full- or Low-Speed modes share one Full/Low-Speed Bus Instance, which means 12
Mb/s theoretical bandwidth is distributed across these ports.

USB 3.0 Port

The USB 3.0 port only operates in USB 3.0 Super Speed mode (5 Gb/s theoretical bandwidth).

Table 7 USB 2.0 Pin Descriptions

Pin Name Direction Type Description

87 GPIO0 Input USB VBUS, 5V USB 0 VBUS Detect (USB_VBUS_EN0). Do not feed 5V
directly into this pin; see the Jetson Nano Product Design
Guide for complete details.

109 USB0_D_N Bidirectional USB PHY USB 2.0 Port 0 Data

111 USB0_D_P

115 USB1_D_N Bidirectional USB PHY USB 2.0 Port 1 Data

117 USB1_D_P

121 USB2_D_N Bidirectional USB PHY USB 2.0 Port 2 Data

123 USB2_D_P

Table 8 USB 3.0 Pin Descriptions

Pin Name Direction Type Description

163 USBSS_RX_P Input USB SS PHY USB 3.0 SS Receive

161 USBSS_RX_N

Pin Name Direction Type Description

168 USBSS_TX_P Output USB SS PHY USB 3.0 SS Transmit

166 USBSS_TX_N

PCI Express (PCIe)

Standard Notes
PCI Express Base Specification Revision 2.0 Jetson Nano meets the timing requirements for the Gen2 (5.0 GT/s) data rates. Refer to
specification for complete interface timing details.
Although NVIDIA validates that the Jetson Nano design complies with the PCIe
specification, PCIe software support may be limited.

The Jetson module integrates a single PCIe Gen2 controller supporting:

 Connections to a single (x1/2/4) endpoint
 Upstream and downstream AXI interfaces that serve as the control path from the Jetson Nano to the external PCIe
device.
 Gen1 (2.5 GT/s/lane) and Gen2 (5.0 GT/s/lane) speeds.

NOTE: Upstream Type 1 Vendor Defined Messages (VDM) should be sent by the Endpoint Port (EP) if the
Root Port (RP) also belongs to same vendor/partner; otherwise the VDM is silently discarded.

See the Jetson Nano Product Design Guide for supported USB 3.0/PCIe configuration and connection examples.

Table 9 PCIe Pin Descriptions

Pin Name Direction Type PoR Description

179 PCIE_WAKE* Input Open Drain 3.3V z PCI Express Wake

This signal is used as the PCI Express defined WAKE#
signal. When asserted by a PCI Express device, it is a
request that system power be restored. No interrupt or other
consequences result from the assertion of this signal. On
module 100kΩ pull-up to 3.3V

160 PCIE0_CLK_N Output PCIe PHY 0 PCIe Reference Clock

162 PCIE0_CLK_P 0

180 PCIE0_CLKREQ* Bidirectional Open Drain 3.3V z PCIe Reference Clock Request
This signal is used by a PCIe device to indicate it needs the
PCIE0_CLK_N and PCIE0_CLK_P to actively drive reference
clock. On module 47kΩ pull-up to 3.3V

181 PCIE0_RST* Output Open Drain 3.3V 0 PCIe Reset

This signal provides a reset signal to all PCIe links. It must be
asserted 100 ms after the power to the PCIe slots has
stabilized. On module 47kΩ pull-up to 3.3V

157 PCIE0_RX3_P Input PCIe PHY PCIe Receive (Lane 3)

155 PCIE0_RX3_N

151 PCIE0_RX2_P Input PCIe PHY PCIe Receive (Lane 2)

149 PCIE0_RX2_N

139 PCIE0_RX1_P Input PCIe PHY PCIe Receive (Lane 1)

137 PCIE0_RX1_N

133 PCIE0_RX0_P Input PCIe PHY PCIe Receive (Lane 0)

131 PCIE0_RX0_N

156 PCIE0_TX3_P Output PCIe PHY PCIe Transmit (Lane 3)

154 PCIE0_TX3_N

Pin Name Direction Type PoR Description

150 PCIE0_TX2_P Output PCIe PHY PCIe Transmit (Lane 2)

148 PCIE0_TX2_N

142 PCIE0_TX1_P Output PCIe PHY PCIe Transmit (Lane 1)

140 PCIE0_TX1_N

136 PCIE0_TX0_P Output PCIe PHY PCIe Transmit (Lane 0)

134 PCIE0_TX0_N

Display Interfaces
The Jetson Nano Display Controller Complex integrates a MIPI-DSI interface and Serial Output Resource (SOR) to collect
pixels from the output of the display pipeline, format/encode them to desired format, and then streams to various output
devices. The SOR consists of several individual resources which can be used to interface with different display devices such
as HDMI, DP, or eDP.

4.3.1 MIPI Display Serial Interface (DSI)

The Display Serial Interface (DSI) is a serial bit-stream replacement for the parallel MIPI DPI and DBI display interface
standards. DSI reduces package pin-count and I/O power consumption. DSI support enables both display controllers to
connect to an external display(s) with a MIPI DSI receiver. The DSI transfers pixel data from the internal display controller to
an external third-party LCD module.

Features:
 PHY Layer
- Start / End of Transmission. Other out-of-band signaling
- Per DSI interface: one Clock Lane; two Data Lanes
- Supports link configuration – 1x 2
- Maximum link rate 1.5Gbps as per MIPI D-PHY 1.1v version
- Maximum 10MHz LP receive rate
 Lane Management Layer with Distributor
 Protocol Layer with Packet Constructor
 Supports MIPI DSI 1.0.1v version mandatory features
 Command Mode (One-shot) with Host and/or display controller as master
 Clocks
- Bit Clock: Serial data stream bit-rate clock
- Byte Clock: Lane Management Layer Byte-rate clock
- Application Clock: Protocol Layer Byte-rate clock.
 Error Detection / Correction
- ECC generation for packet Headers
- Checksum generation for Long Packets
 Error recovery
 High-Speed Transmit timer
 Low-Power Receive timer
 Turnaround Acknowledge Timeout

Table 10 DSI Pin Descriptions

Pin Name Direction Type Description

76 DSI_CLK_N Output MIPI D-PHY Differential output clock for DSI interface
78 DSI_CLK_P

82 DSI_D1_N Output MIPI D-PHY Differential data lanes for DSI interface.
84 DSI_D1_P

70 DSI_D0_N Bidirectional MIPI D-PHY Differential data lanes for DSI interface. DSI lane can read data
72 DSI_D0_P back from the panel side in low power (LP) mode.

4.3.2 High-Definition Multimedia Interface (HDMI) and DisplayPort (DP) Interfaces

Standard Notes

High-Definition Multimedia Interface (HDMI) > 340MHz pixel clock

Specification, version 2.0 Scrambling support
Clock/4 support (1/40 bit-rate clock)

The HDMI and DP interfaces share the same set of interface pins. A new transport mode was introduced in HDMI 2.0 to
enable link clock frequencies greater than 340MHz and up to 600MHz. For transfer rates above 340MHz, there are two main
requirements:

 All link data, including active pixel data, guard bands, data islands and control islands must be scrambled.
 The TMDS clock lane must toggle at CLK/4 instead of CLK. Below 340MHz, the clock lane toggles as normal
(independent of the state of scrambling).

Features:

 HDMI
- HDMI 2.0 mode (3.4Gbps < data rate <= 6Gbps)
- HDMI 1.4 mode (data rate<=3.4Gbps)
- Multi-channel audio from HDA controller, up to eight channels 192kHz 24-bit.
- Vendor Specific Info-frame (VSI) packet transmission
- 24-bit RGB pixel formats
- Transition Minimized Differential Signaling (TMDS) functional up to 340MHz pixel clock rate
 DisplayPort
- Display Port mode: interface is functional up to 540MHz pixel clock rate (i.e., 1.62GHz for RBR, 2.7GHz for HBR,
and 5.4GHz for HBR2).
- 8b/10b encoding support
- External Dual Mode standard support
- Audio streaming support

Table 11 HDMI Pin Descriptions

Pin Name Direction Type Description

83 DP1_TXD3_P Differential Output AC-Coupled on Carrier Board DP Data lane 3 or HDMI Differential Clock. AC
81 DP1_TXD3_N [DP] coupling required on carrier board. For HDMI, pull-
downs (with disable) also required on carrier board.

77 DP1_TXD2_P Differential Output AC-Coupled on Carrier Board HDMI Differential Data lanes 2:0. AC coupling required
75 DP1_TXD2_N [DP] on carrier board. For HDMI, pull-downs (with disable)
also required on carrier board.
71 DP1_TXD1_P
69 DP1_TXD1_N HDMI:
65 DP1_TXD0_P DP1_TXD2_[P,N] = HDMI Lane 0
DP1_TXD1_[P,N] = HDMI Lane 1

Pin Name Direction Type Description

63 DP1_TXD0_N DP1_TXD0_[P,N] = HDMI Lane 2

96 DP1_HPD Input CMOS – 1.8V [ST] HDMI Hot Plug detection. Level shifter required as this
pin is not 5V tolerant.

94 HDMI_CEC Bidirectional Open Drain, 1.8V [DD] Consumer Electronics Control (CEC) one-wire serial
bus.
NVIDIA provides low level CEC APIs (read/write).
These are not supported in earlier Android releases.
For additional CEC support, 3rd party libraries need to
be made available.

100 DP1_AUX_P Bidirectional Open-Drain, 1.8V (3.3V tolerant DDC Serial Clock for HDMI. Level shifter required; pin
- DDC) [DP_AUX] is not 5V tolerant.

98 DP1_AUX_N Bidirectional Open-Drain, 1.8V (3.3V tolerant DDC Serial Data. Level shifter required; pin is not 5V
- DDC) tolerant.

Table 12 DisplayPort on DP1 Pin Descriptions

Pin Name Direction Type Description

83 DP1_TXD3_P Differential Output AC-Coupled on Carrier Board DisplayPort 1 Differential Data lanes 2:0. AC coupling
81 DP1_TXD3_N [DP] required on carrier board.
77 DP1_TXD2_P DP1_TXD2_[P,N] = DP Lane 2
75 DP1_TXD2_N DP1_TXD1_[P,N] = DP Lane 1
71 DP1_TXD1_P DP1_TXD0_[P,N] = DP Lane 0
69 DP1_TXD1_N
65 DP1_TXD0_P
63 DP1_TXD0_N

96 DP1_HPD Input CMOS – 1.8V [ST] DisplayPort 1 Hot Plug detection. Level shifter required
and must be non-inverting.

100 DP1_AUX_P Bidirectional Open-Drain, 1.8V [DP_AUX] DisplayPort 1 auxiliary channels. AC coupling required
98 DP1_AUX_N on carrier board.

4.3.3 Embedded DisplayPort (eDP) Interface

Standard Notes
Embedded DisplayPort 1.4 Supported eDP 1.4 features:
 Additional link rates
 Enhanced framing
 Power sequencing
 Reduced aux timing
 Reduced main voltage swing

eDP is a mixed-signal interface consisting of four differential serial output lanes and one PLL. This PLL is used to generate a
high frequency bit-clock from an input pixel clock enabling the ability to handle 10-bit parallel data per lane at the pixel rate for
the desired mode. Embedded DisplayPort (eDP) modes (1.6GHz for RBR, 2.16GHz, 2.43GHz, 2.7GHz for HBR, 3.42GHz,
4.32GHz and 5.4GHz for HBR2).

NOTE: eDP has been tested according to DP1.2b PHY CTS even though eDPv1.4 supports lower swing
voltages and additional intermediate bit rates. This means the following nominal voltage levels
(400mV, 600mV, 800mV, 1200mV) and data rates (RBR, HBR, HBR2) are tested. This interface can
be tuned to drive lower voltage swings below 400mV and can be programmed to other intermediate
bit rates as per the requirements of the panel and the system designer.

DisplayPort on DP0 is limited to display functionality only; no HDCP or audio support.

Table 13 eDP (or DisplayPort on DP0) Pin Descriptions

Pin Name Direction Type Description

59 DP0_TXD3_P Differential Output AC-Coupled on Carrier DP0 Differential Data. AC coupling & pull-
57 DP0_TXD3_N Board downs (with disable) required on carrier board.
53 DP0_TXD2_P [DP] DP0_TXD3_[P,N] = DisplayPort 0 Data Lane 3
51 DP0_TXD2_N DP0_TXD2_[P,N] = DisplayPort 0 Data Lane 2
47 DP0_TXD1_P DP0_TXD1_[P,N] = DisplayPort 0 Data Lane 1
45 DP0_TXD1_N DP0_TXD0_[P,N] = DisplayPort 0 Data Lane 0
41 DP0_TXD0_P
39 DP0_TXD0_N

88 DP0_HPD Input CMOS – 1.8V [ST] DP0 Hot Plug detection. Level shifter required
as this pin is not 5V tolerant

92 DP0_AUX_P Bidirectional AC-Coupled on Carrier DP0 auxiliary channels. AC coupling required

90 DP0_AUX_N Board [DP_AUX] on Carrier board.

MIPI Camera Serial Interface (CSI) / VI (Video Input)

Standard

MIPI CSI 2.0 Receiver specification

MIPI D-PHY® v1.2 Physical Layer specification

The Camera Serial Interface (CSI) is based on MIPI CSI 2.0 standard specification and implements the CSI receiver which
receives data from an external camera module with CSI transmitter. The Video Input (VI) block receives data from the CSI
receiver and prepares it for presentation to system memory or the dedicated image signal processor (ISP) execution
resources.

Features:

 Supports both x4-lane and x2-lane sensor camera configurations:

- x4 only configuration (up to three active streams)
- x4 + x2 configurations (up to four active streams)
 Supported input data formats:
- RGB: RGB888, RGB666, RGB565, RGB555, RGB444
- YUV: YUV422-8b, YUV420-8b (legacy), YUV420-8b, YUV444-8b
- RAW: RAW6, RAW7, RAW8, RAW10, RAW12, RAW14
- DPCM: user defined
- User defined: JPEG8
- Embedded: Embedded control information
 Supports single-shot mode
 Physical Interface (MIPI D-PHY) Modes of Operation
- High Speed Mode – High-speed differential signaling up to 1.5Gbps; burst transmission for low power
- Low Power Control – Single-ended 1.2V CMOS level; low-speed signaling for handshaking.
- Low Power Escape – Low-speed signaling for data, used for escape command entry only.

If the two streams come from a single source, then the streams are separated using a filter indexed on different data types. In
case of separation using data types, the normal data type is separated from the embedded data type.

Table 14 CSI Pin Descriptions

Pin Name Direction Type Description

10 CSI0_CLK_N Input MIPI D-PHY CSI 0 Clock–

12 CSI0_CLK_P Input MIPI D-PHY CSI 0 Clock+

4 CSI0_D0_N Input MIPI D-PHY CSI 0 Data 0–

6 CSI0_D0_P Input MIPI D-PHY CSI 0 Data 0+

16 CSI0_D1_N Input MIPI D-PHY CSI 0 Data 1–

18 CSI0_D1_P Input MIPI D-PHY CSI 0 Data 1+

3 CSI1_D0_N Input MIPI D-PHY CSI 1 Data 0–

5 CSI1_D0_P Input MIPI D-PHY CSI 1 Data 0+

15 CSI1_D1_N Input MIPI D-PHY CSI 1 Data 1–

17 CSI1_D1_P Input MIPI D-PHY CSI 1 Data 1+

28 CSI2_CLK_N Input MIPI D-PHY CSI 2 Clock–

30 CSI2_CLK_P Input MIPI D-PHY CSI 2 Clock+

22 CSI2_D0_N Input MIPI D-PHY CSI 2 Data 0–

24 CSI2_D0_P Input MIPI D-PHY CSI 2 Data 0+

34 CSI2_D1_N Input MIPI D-PHY CSI 2 Data 1–

36 CSI2_D1_P Input MIPI D-PHY CSI 2 Data 1+

27 CSI3_CLK_N Input MIPI D-PHY CSI 3 Clock–

29 CSI3_CLK_P Input MIPI D-PHY CSI 3 Clock+

21 CSI3_D0_N Input MIPI D-PHY CSI 3 Data 0–

23 CSI3_D0_P Input MIPI D-PHY CSI 3 Data 0+

33 CSI3_D1_N Input MIPI D-PHY CSI 3 Data 1–

35 CSI3_D1_P Input MIPI D-PHY CSI 3 Data 1+

52 CSI4_CLK_N Input MIPI D-PHY CSI 4 Clock–

54 CSI4_CLK_P Input MIPI D-PHY CSI 4 Clock+

46 CSI4_D0_N Input MIPI D-PHY CSI 4 Data 0–

48 CSI4_D0_P Input MIPI D-PHY CSI 4 Data 0+

58 CSI4_D1_N Input MIPI D-PHY CSI 4 Data 1–

60 CSI4_D1_P Input MIPI D-PHY CSI 4 Data 1+

40 CSI4_D2_N Input MIPI D-PHY CSI 4 Data 2–

42 CSI4_D2_P Input MIPI D-PHY CSI 4 Data 2+

64 CSI4_D3_N Input MIPI D-PHY CSI 4 Data 3–

66 CSI4_D3_P Input MIPI D-PHY CSI 4 Data 3+

Table 15 Camera Clock and Control Pin Descriptions

Pin Name I/O Pin Type PoR Description

213 CAM_I2C_SCL Bidirectional Open Drain – 3.3V [DD] z Camera I2C Clock

215 CAM_I2C_SDA Bidirectional Open Drain – 3.3V [DD] z Camera I2C Data

Pin Name I/O Pin Type PoR Description

116 CAM0_MCLK Output CMOS – 1.8V [ST] PD Camera 1 Reference Clock

114 CAM0_PWDN Output CMOS – 1.8V [ST] PD Camera 1 Powerdown or GPIO

122 CAM1_MCLK Output CMOS – 1.8V [ST] PD Camera 2 Reference Clock

120 CAM1_PWDN Output CMOS – 1.8V [ST] PD Camera 2 Powerdown or GPIO

SD / SDIO
Standard Notes

SD Specifications Part A2 SD Host Controller Standard

Specification Version 4.00

SD Specifications Part 1 Physical Layer Specification Version 4.00

SD Specifications Part E1 SDIO Specification Version 4.00 Support for SD 4.0 Specification without UHS-II

Embedded Multimedia Card (eMMC), Electrical Standard 5.1

The SecureDigital (SD)/Embedded MultiMediaCard (eMMC) controller is used to support the on-module eMMC and a single
SDIO interface made available for use with SDIO peripherals; it supports Default and High-Speed modes.

The SDMMC controller has a direct memory interface and is capable of initiating data transfers between memory and external
device. The SDMMC controller supports both the SD and eMMC bus protocol and has an APB slave interface to access
configuration registers. Interface is intended for supporting various compatible peripherals with an SD/MMC interface.

Table 16 SD/SDIO Controller I/O Capabilities

Controller Bus Width Supported I/O bus Max Bandwidth Notes

Voltages (V) clock (MHz) (MBps)

SD/SDIO Card 4 1.8 / 3.3 208 104 Available at connector for SDIO or SD Card use

eMMC 8 1.8 200 400 On-module eMMC

Table 17 SD/SDIO Pin Descriptions

Pin Name I/O Pin Type PoR Description

229 SDMMC_CLK Output CMOS – 1.8V / 3.3V [CZ] PD SDIO/MMC Clock

227 SDMMC_CMD Bidirectional CMOS – 1.8V / 3.3V [CZ] PU SDIO/MMC Command

225 SDMMC_DAT3 Bidirectional CMOS – 1.8V / 3.3V [CZ] PU SDIO/MMC Data bus
223 SDMMC_DAT2
221 SDMMC_DAT1
219 SDMMC_DAT0
Note: Pin voltage is determined by LDO on module setting.

Inter-IC Sound (I2S)

Standard
Inter-IC Sound (I2S) specification

The I2S controller transports streaming audio data between system memory and an audio codec. The I2S controller supports
I2S format, Left-justified Mode format, Right-justified Mode format, and DSP mode format, as defined in the Philips inter-IC-
sound (I2S) bus specification.

The I2S and PCM (master and slave modes) interfaces support clock rates up to 24.5760MHz.

The I2S controller supports point-to-point serial interfaces for the I2S digital audio streams. I2S-compatible products, such as
compact disc players, digital audio tape devices, digital sound processors, and those with digital TV sound may be directly
connected to the I2S controller. The controller also supports the PCM and telephony mode of data-transfer. Pulse-Code-
Modulation (PCM) is a standard method used to digitize audio (particularly voice) patterns for transmission over digital
communication channels. The Telephony mode is used to transmit and receive data to and from an external mono CODEC in
a slot-based scheme of time-division multiplexing (TDM). The I2S controller supports bidirectional audio streams and can
operate in half-duplex or full-duplex mode.

Features:

 Basic I2S modes to be supported (I2S, RJM, LJM and DSP) in both Master and Slave modes.
 PCM mode with short (one-bit-clock wide) and long-fsync (two bit-clocks wide) in both master and slave modes.
 NW-mode with independent slot-selection for both Tx and Rx
 TDM mode with flexibility in number of slots and slot(s) selection.
 Capability to drive-out a High-z outside the prescribed slot for transmission
 Flow control for the external input/output stream.

Table 18 Audio Pin Descriptions

Pin Name Direction Type PoR Description

211 GPIO09 Output CMOS – 1.8V [ST] PD Audio Codec Master Clock (AUD_MCLK)

195 I2S0_DIN Input CMOS – 1.8V [CZ] PD I2S Audio Port 0 Data In

193 I2S0_DOUT Output CMOS – 1.8V [CZ] PD I2S Audio Port 0 Data Out

197 I2S0_FS Bidirectional CMOS – 1.8V [CZ] PD I2S Audio Port 0 Frame Select (Left/Right Clock)

199 I2S0_SCLK Bidirectional CMOS – 1.8V [CZ] PD I2S Audio Port 0 Clock

222 I2S1_DIN Input CMOS – 1.8V [ST] PD I2S Audio Port 1 Data In

220 I2S1_DOUT Output CMOS – 1.8V [ST] PD I2S Audio Port 1 Data Out

224 I2S1_FS Bidirectional CMOS – 1.8V [ST] PD I2S Audio Port 1 Frame Select (Left/Right Clock)

226 I2S1_SCLK Bidirectional CMOS – 1.8V [ST] PD I2S Audio Port 1 Clock

Miscellaneous Interfaces

4.7.1 Inter-Chip Communication (I2C)

Standard

NXP inter-IC-bus (I2C) specification

This general purpose I2C controller allows system expansion for I2C -based devices as defined in the NXP inter-IC-bus (I2C)
specification. The I2C bus supports serial device communications to multiple devices; the I2C controller handles clock source
negotiation, speed negotiation for standard and fast devices, 7-bit slave address support according to the I2C protocol and
supports master and slave mode of operation.

The I2C controller supports the following operating modes: Master – Standard-mode (up to 100Kbit/s), Fast-mode (up to 400
Kbit/s), Fast-mode plus (Fm+, up to 1Mbit/s); Slave – Standard-mode (up to 100Kbit/s), Fast-mode (up to 400 Kbit/s), Fast-
mode plus (Fm+, up to 1Mbit/s).

Table 19 I2C Pin Descriptions

Pin Name I/O Pin Type PoR Description

185 I2C0_SCL Bidirectional Open Drain – 3.3V [DD] z Only 3.3V devices supported without level
187 I2C0_SDA z shifter. I2C 0 Clock/Data pins. On module 2.2kΩ
pull-up to 3.3V.

189 I2C1_SCL Bidirectional Open Drain – 3.3V [DD] z Only 3.3V devices supported without level
191 I2C1_SDA z shifter. I2C 1 Clock/Data pins. On module 2.2kΩ
pull-up to 3.3V.

232 I2C2_SCL Bidirectional Open Drain – 1.8V [DD] z Only 1.8V devices supported without level
234 I2C2_SDA z shifter. I2C 2 Clock/Data pins. On module 2.2kΩ
pull-up to 1.8V.

213 CAM_I2C_SCL Bidirectional Open Drain – 3.3V [DD] z Only 3.3V devices supported without level
215 CAM_I2C_SDA z shifter. Camera I2C Clock/Data pins. On module
4.7kΩ pull-up to 3.3V.

4.7.2 Serial Peripheral Interface (SPI)

The SPI controllers operate up to 65Mbps in master mode and 45Mbps in slave mode. It allows a duplex, synchronous, serial
communication between the controller and external peripheral devices. It consists of four signals, SS_N (Chip select), SCK
(clock), MOSI (Master data out and Slave data in) and MISO (Slave data out and master data in). The data is transferred on
MOSI or MISO based on the data transfer direction on every SCK edge. The receiver always receives the data on the other
edge of SCK.

Features:
 Independent Rx FIFO and Tx FIFO.
 Software controlled bit-length supports packet sizes of 1 to 32 bits.
 Packed mode support for bit-length of 7 (8-bit packet size) and 15 (16-bit packet size).
 SS_N can be selected to be controlled by software, or it can be generated automatically by the hardware on packet
boundaries.
 Receive compare mode (controller listens for a specified pattern on the incoming data before receiving the data in the
FIFO).
 Simultaneous receive and transmit supported
 Supports Master mode. Slave mode has not been validated

Table 20 SPI Pin Descriptions

Pin Name Direction Type PoR Description

95 SPI0_CS0* Bidirectional CMOS – 1.8V [LV-CZ] PU SPI 0 Chip Select 0

97 SPI0_CS1* Bidirectional CMOS – 1.8V [LV-CZ] PU SPI 0 Chip Select 1

93 SPI0_MISO Bidirectional CMOS – 1.8V [LV-CZ] PD SPI 0 Master In / Slave Out

89 SPI0_MOSI Bidirectional CMOS – 1.8V [LV-CZ] PD SPI 0 Master Out / Slave In

91 SPI0_SCK Bidirectional CMOS – 1.8V [LV-CZ] PD SPI 0 Clock

110 SPI1_CS0* Bidirectional CMOS – 1.8V [CZ] PU SPI 1 Chip Select 0

112 SPI1_CS1* Bidirectional CMOS – 1.8V [CZ] PU SPI 1 Chip Select 1

108 SPI1_MISO Bidirectional CMOS – 1.8V [CZ] PD SPI 1 Master In / Slave Out

104 SPI1_MOSI Bidirectional CMOS – 1.8V [CZ] PD SPI 1 Master Out / Slave In

106 SPI1_SCK Bidirectional CMOS – 1.8V [CZ] PD SPI 1 Clock

Figure 5 SPI Master Timing Diagram

tCS
SPIx_CSx

tCSS tCH tCL tCSH tCSS tCSH

SPIx_SCK 0 n

tDD
SPIx_MOSI

tSU tHD
SPIx_MISO MSB IN LSB IN

Table 21 SPI Master Timing Parameters

Symbol Parameter Minimum Maximum Unit

Fsck SPIx_SCK clock frequency 65 MHz

Psck SPIx_SCK period 1/Fsck ns

tCH SPIx_SCK high time 50%Psck -10% 50%Psck +10% ns

tCL SPIx_SCK low time 50%Psck -10% 50%Psck +10% ns

tCRT SPIx_SCK rise time (slew rate) 0.1 V/ns

tCFT SPIx_SCK fall time (slew rate) 0.1 V/ns

tSU SPIx_MISO setup to SPIx_SCK rising edge 2 ns

tHD SPIx_MISO hold from SPIx_SCK rising edge 3 ns

tDD SPIx_MOSI delay from SPIx_SCK falling edge 0 4 ns

tCSS SPIx_CSx setup time 2 ns

tCSH SPIx_CSx hold time 3 ns

tCS SPIx_CSx high time 10 ns

Note: Polarity of SCLK is programmable. Data can be driven or input relative to either the rising edge (shown above) or falling edge.

Figure 6 SPI Slave Timing Diagram

tCSH
SPIx_CSx

tCSU tSCP tCH tCL tCCS

SPIx_SCK 0 1 n

tDSU
SPIx_MOSI

tDH tDD
SPIx_MISO

Table 22 SPI Slave Timing Parameters

Symbol Parameter Minimum Maximum Unit

tSCP SPIx_SCK period 2*(tSDD+ tMSU1) ns

tSCH SPIx_SCK high time tSDD + tMSU1 ns

tSCL SPIx_SCK low time tSDD + tMSU1 ns

tSCSU SPIx_CSx setup time 1 tSCP

tSCSH SPIx_CSx high time 1 tSCP

tSCCS SPIx_SCK rising edge to SPIx_CSx rising edge 1 1 tSCP

tSDSU SPIx_MOSI setup to SPIx_SCK rising edge 1 1 ns

tSDH SPIx_MOSI hold from SPIx_SCK rising edge 2 11 ns

1. tMSU is the setup time required by the external master

Note: Polarity of SCLK is programmable. Data can be driven or input relative to either the rising edge (shown above) or falling edge.

4.7.3 UART
UART controller provides serial data synchronization and data conversion (parallel-to-serial and serial-to-parallel) for both
receiver and transmitter sections. Synchronization for serial data stream is accomplished by adding start and stop bits to the
transmit data to form a data character. Data integrity is accomplished by attaching a parity bit to the data character. The parity
bit can be checked by the receiver for any transmission bit errors.

NOTE: The UART receiver input has low baud rate tolerance in 1-stop bit mode. External devices must use
2 stop bits.
In 1-stop bit mode, the Tegra UART receiver can lose sync between Tegra receiver and the external
transmitter resulting in data errors/corruption. In 2-stop bit mode, the extra stop bit allows the Tegra
UART receiver logic to align properly with the UART transmitter.

Features:
 Synchronization for the serial data stream with start and stop bits to transmit data and form a data character
 Supports both 16450- and 16550-compatible modes. Default mode is 16450
 Device clock up to 200MHz, baud rate of 12.5Mbits/second
 Data integrity by attaching parity bit to the data character
 Support for word lengths from five to eight bits, an optional parity bit and one or two stop bits
 Support for modem control inputs
 DMA capability for both Tx and Rx
 8-bit x 36 deep Tx FIFO

 11-bit x 36 deep Rx FIFO. Three bits of 11 bits per entry log the Rx errors in FIFO mode (break, framing, and parity
errors as bits 10, 9, 8 of FIFO entry)
 Auto sense baud detection
 Timeout interrupts to indicate if the incoming stream stopped
 Priority interrupts mechanism
 Flow control support on RTS and CTS
 Internal loopback
 SIR encoding/decoding (3/16 or 4/16 baud pulse widths to transmit bit zero)

Table 23 UART Pin Descriptions

Pin Name Direction Type PoR Description

99 UART0_TXD Output CMOS – 1.8V [ST] PD UART 0 Transmit

101 UART0_RXD Input CMOS – 1.8V [ST] PU UART 0 Receive

103 UART0_RTS* Output CMOS – 1.8V [ST] PD UART 0 Request to Send

105 UART0_CTS* Input CMOS – 1.8V [ST] PD UART 0 Clear to Send

203 UART1_TXD Output CMOS – 1.8V [ST] PD UART 1 Transmit

205 UART1_RXD Input CMOS – 1.8V [ST] PD UART 1 Receive

207 UART1_RTS* Output CMOS – 1.8V [ST] PD UART 1 Request to Send

209 UART1_CTS* Input CMOS – 1.8V [ST] PD UART 1 Clear to Send

236 UART2_TXD Output CMOS – 1.8V [ST] PD UART 2 Transmit

238 UART2_RXD Input CMOS – 1.8V [ST] PD UART 2 Receive

4.7.4 Gigabit Ethernet

The Jetson Nano integrates a Realtek RTL81119ICG Gigabit Ethernet controller. The on-module Ethernet controller supports:

 10/100/1000 Mbps Gigabit Ethernet

 IEEE 802.3u Media Access Controller (MAC)

Table 24 Gigabit Ethernet Pin Descriptions

Pin Name Direction Type Description

194 GBE_LED_ACT Output Activity LED (yellow) enable

188 GBE_LED_LINK Output Link LED (green) enable. Link LED only illuminates if link established is
1000. 100/10 will not cause the Link LED to light up.

184 GBE_MDI0_N Bidirectional MDI GbE Transformer Data 0

186 GBE_MDI0_P

190 GBE_MDI1_N Bidirectional MDI GbE Transformer Data 1

192 GBE_MDI1_P

196 GBE_MDI2_N Bidirectional MDI GbE Transformer Data 2

198 GBE_MDI2_P

202 GBE_MDI3_N Bidirectional MDI GbE Transformer Data 3

204 GBE_MDI3_P

4.7.5 Fan
The Jetson Nano includes PWM and Tachometer functionality to enable fan control as part of a thermal solution. The Pulse
Width Modulator (PWM) controller is a frequency divider with a varying pulse width. The PWM runs off a device clock
programmed in the Clock and Reset controller and can be any frequency up to the device clock maximum speed of 48MHz.
The PWFM gets divided by 256 before being subdivided based on a programmable value.

Table 25 Fan Pin Descriptions

Pin Name Direction Type PoR Description

230 GPIO14 Output CMOS – 1.8V [ST] PD Fan PWM

208 GPIO08 Input CMOS – 1.8V [ST] PD Fan Tachometer

4.7.6 Debug
A debug interface is supported via JTAG on-module test points or serial interface over UART1. The JTAG interface can be
used for SCAN testing or communicating with integrated CPU. See the NVIDIA Jetson Nano Product Design Guide for more
information.

Table 26 Debug Pin Descriptions

Pin Name I/O Pin Type PoR Description

- JTAG_RTCK Output CMOS – 1.8V [JT_RST] 0 Return Test Clock

- JTAG_TCK Input CMOS – 1.8V [JT_RST] z Test Clock

- JTAG_TDI Input CMOS – 1.8V [JT_RST] PU Test Data In

- JTAG_TDO Output CMOS – 1.8V [ST] z Test Data Out

- JTAG_TMS Input CMOS – 1.8V [JT_RST] PU Test Mode Select

- JTAG_GP0 Input CMOS – 1.8V [JT_RST] PD Test Reset

236 UART2_TXD Output CMOS – 1.8V [ST] PD Debug UART Transmit

238 UART2_RXD Input CMOS – 1.8V [ST] PD Debug UART Receive

5.0 Physical / Electrical Characteristics

Operating and Absolute Maximum Ratings

The parameters listed in following table are specific to a temperature range and operating voltage. Operating the Jetson Nano
module beyond these parameters is not recommended. Exceeding these conditions for extended periods may adversely affect
device reliability.

WARNING: Exceeding the listed conditions may damage and/or affect long-term reliability of the part.
The Jetson Nano module should never be subjected to conditions extending beyond the
ratings listed below.

Table 27 Recommended Operating Conditions

Symbol Parameter Minimum Typical Maximum Unit

VDDDC VDD_IN 4.75 5.0 5.25 V

PMIC_BBAT 1.65 5.5 V

Absolute maximum ratings describe stress conditions. These parameters do not set minimum and maximum operating
conditions that will be tolerated over extended periods of time. If the device is exposed to these parameters for extended
periods of time, no guarantee is made and device reliability may be affected. It is not recommended to operate the Jetson
Nano module under these conditions.

Table 28 Absolute Maximum Ratings

Symbol Parameter Minimum Maximum Unit Notes

VDDMAX VDD_IN -0.5 5.5 V

PMIC_BBAT -0.3 6.0 V

IDDMAX VDD_IN Imax 5 A

VM_PIN Voltage applied to any powered -0.5 VDD + 0.5 V VDD + 0.5V when CARRIER_PWR_ON high &
I/O pin associated I/O rail powered.
I/O pins cannot be high (>0.5V) before
CARRIER_PWR_ON goes high.
When CARRIER_PWR_ON is low, the maximum
voltage applied to any I/O pin is 0.5V
DD pins configured as open -0.5 3.63 V The pin’s output-driver must be set to open-drain
drain mode
TOP Operating Temperature -25 97 °C See the Jetson Nano Thermal Design Guide for
details.
TSTG Storage Temperature (ambient) -40 80 °C

MMAX Mounting Force 4.0 kgf kilogram-force (kgf). Maximum force applied to
PCB. See the Jetson Nano Thermal Design
Guide for additional details on mounting a thermal
solution.

Digital Logic
Voltages less than the minimum stated value can be interpreted as an undefined state or logic level low which may result in
unreliable operation. Voltages exceeding the maximum value can damage and/or adversely affect device reliability.

Table 29. CMOS Pin Type DC Characteristics

Symbol Description Minimum Maximum Units

VIL Input Low Voltage -0.5 0.25 x VDD V

VIH Input High Voltage 0.75 x VDD 0.5 + VDD V

VOL Output Low Voltage (IOL = 1mA) --- 0.15 x VDD V

VOH Output High Voltage (IOH = -1mA) 0.85 x VDD --- V

Table 30 Open Drain Pin Type DC Characteristics

Symbol Description Minimum Maximum Units

VIL Input Low Voltage -0.5 0.25 x VDD V

VIH Input High Voltage 0.75 x VDD 3.63 V

VOL Output Low Voltage (IOL = 1mA) --- 0.15 x VDD V

I2C[1,0] Output Low Voltage (IOL = 2mA) (see note) --- 0.3 x VDD V

VOH Output High Voltage (IOH = -1mA) 0.85 x VDD --- V

Note: I2C[1,0]_[SCL, SDA] pins pull-up to 3.3V through on module 2.2kΩ resistor. I2C2_[SCL, SDA] pins pull-up to 1.8V through on module 2.2kΩ resistor.

Environmental & Mechanical Screening

Module performance was assessed against a series of industry standard tests designed to evaluate robustness and estimate
the failure rate of an electronic assembly in the environment in which it will be used. Mean Time Between Failures (MTBF)
calculations are produced in the design phase to predict a product’s future reliability in the field.

Table 31 Jetson Nano Reliability Report

Test Reference Standards / Test Conditions

Temperature Humidity Biased JESD22-A101
85°C / 85% RH, 168 hours, Power ON
Temperature Cycling JESD22-A104, IPC9701
-40°C to 105°C, 250 cycles, non-operational
Humidity Steady State NVIDIA Standard
45°C 90% RH 336hrs, operational
Mechanical Shock – 140G JESD22-B110
140G, half sine, 1 shock/orientation, 6 orientations total, non-operational
Mechanical Shock – 50G IEC600068-2-27
50G, half sine,1 shock/orientation, 6 orientations total, operational
Connector Insertion Cycling EIA-364
30 cycles
Sine Vibration – 3G IEC60068-2-6
3G, 10-500 Hz, 1 sweep/axis, 3 axes total, non-operational
Random Vibration – 2G IEC60068-2-64
10-500 Hz, 2 Grms,1 hour/axis, non-operational

Test Reference Standards / Test Conditions

Random Vibration – 1G IEC60068-2-64
10-500 Hz, 1 Grms,1 hour/axis, operational
Hard Boot NVIDIA Standard
Power ON/OFF, ON for 150 sec OFF for 30 sec 1000 cycles at 25°C, 1000 cycles at -40°C
Operational Low Temp NVIDIA Standard
-5°C, 24 hours, operational
Operational High Temp NVIDIA Standard
40°C, 90%RH, 168 hours, operational
MTBF / Failure Rate: 3,371K Hours Telcordia SR-332, ISSUE 3 Parts Count (Method I)
Controlled Environment (GB), T = 35°C, CL = 90%
MTBF / Failure Rate: 1,836K Hours Telcordia SR-332, ISSUE 3 Parts Count (Method I)
Uncontrolled Environment (GF), T = 35°C, CL = 90%
MTBF / Failure Rate: 957K Hours Telcordia SR-332, ISSUE 3 Parts Count (Method I)
Uncontrolled Environment (GM), T = 35°C, CL = 90%

Pinout
Signal Name Pin # Pin # Signal Name Signal Name Pin # Pin # Signal Name
Top Bottom Top Bottom
Odd Even Odd Even
GND 1 2 GND PCIE0_RX0_P 133 134 PCIE0_TX0_N
CSI1_D0_N 3 4 CSI0_D0_N GND 135 136 PCIE0_TX0_P
CSI1_D0_P 5 6 CSI0_D0_P PCIE0_RX1_N 137 138 GND
GND 7 8 GND PCIE0_RX1_P 139 140 PCIE0_TX1_N
RSVD 9 10 CSI0_CLK_N GND 141 142 PCIE0_TX1_P
RSVD 11 12 CSI0_CLK_P RSVD 143 144 GND
GND 13 14 GND KEY KEY KEY KEY
CSI1_D1_N 15 16 CSI0_D1_N RSVD 145 146 GND
CSI1_D1_P 17 18 CSI0_D1_P GND 147 148 PCIE0_TX2_N
GND 19 20 GND PCIE0_RX2_N 149 150 PCIE0_TX2_P
CSI3_D0_N 21 22 CSI2_D0_N PCIE0_RX2_P 151 152 GND
CSI3_D0_P 23 24 CSI2_D0_P GND 153 154 PCIE0_TX3_N
GND 25 26 GND PCIE0_RX3_N 155 156 PCIE0_TX3_P
CSI3_CLK_N 27 28 CSI2_CLK_N PCIE0_RX3_P 157 158 GND
CSI3_CLK_P 29 30 CSI2_CLK_P GND 159 160 PCIE0_CLK_N
GND 31 32 GND USBSS_RX_N 161 162 PCIE0_CLK_P
CSI3_D1_N 33 34 CSI2_D1_N USBSS_RX_P 163 164 GND
CSI3_D1_P 35 36 CSI2_D1_P GND 165 166 USBSS_TX_N
GND 37 38 GND RSVD 167 168 USBSS_TX_P
DP0_TXD0_N 39 40 CSI4_D2_N RSVD 169 170 GND
DP0_TXD0_P 41 42 CSI4_D2_P GND 171 172 RSVD
GND 43 44 GND RSVD 173 174 RSVD
DP0_TXD1_N 45 46 CSI4_D0_N RSVD 175 176 GND
DP0_TXD1_P 47 48 CSI4_D0_P GND 177 178 MOD_SLEEP*
GND 49 50 GND PCIE_WAKE* 179 180 PCIE0_CLKREQ*
DP0_TXD2_N 51 52 CSI4_CLK_N PCIE0_RST* 181 182 RSVD
DP0_TXD2_P 53 54 CSI4_CLK_P RSVD 183 184 GBE_MDI0_N
GND 55 56 GND I2C0_SCL 185 186 GBE_MDI0_P
DP0_TXD3_N 57 58 CSI4_D1_N I2C0_SDA 187 188 GBE_LED_LINK
DP0_TXD3_P 59 60 CSI4_D1_P I2C1_SCL 189 190 GBE_MDI1_N
GND 61 62 GND I2C1_SDA 191 192 GBE_MDI1_P
DP1_TXD0_N 63 64 CSI4_D3_N I2S0_DOUT 193 194 GBE_LED_ACT
DP1_TXD0_P 65 66 CSI4_D3_P I2S0_DIN 195 196 GBE_MDI2_N
GND 67 68 GND I2S0_FS 197 198 GBE_MDI2_P
DP1_TXD1_N 69 70 DSI_D0_N I2S0_SCLK 199 200 GND
DP1_TXD1_P 71 72 DSI_D0_P GND 201 202 GBE_MDI3_N
GND 73 74 GND UART1_TXD 203 204 GBE_MDI3_P
DP1_TXD2_N 75 76 DSI_CLK_N UART1_RXD 205 206 GPIO07
DP1_TXD2_P 77 78 DSI_CLK_P UART1_RTS* 207 208 GPIO08
GND 79 80 GND UART1_CTS* 209 210 CLK_32K_OUT
DP1_TXD3_N 81 82 DSI_D1_N GPIO09 211 212 GPIO10
DP1_TXD3_P 83 84 DSI_D1_P CAM_I2C_SCL 213 214 FORCE_RECOVERY*
GND 85 86 GND CAM_I2C_SDA 215 216 GPIO11
GPIO0 87 88 DP0_HPD GND 217 218 GPIO12
SPI0_MOSI 89 90 DP0_AUX_N SDMMC_DAT0 219 220 I2S1_DOUT
SPI0_SCK 91 92 DP0_AUX_P SDMMC_DAT1 221 222 I2S1_DIN
SPI0_MISO 93 94 HDMI_CEC SDMMC_DAT2 223 224 I2S1_FS
SPI0_CS0* 95 96 DP1_HPD SDMMC_DAT3 225 226 I2S1_SCLK
SPI0_CS1* 97 98 DP1_AUX_N SDMMC_CMD 227 228 GPIO13
UART0_TXD 99 100 DP1_AUX_P SDMMC_CLK 229 230 GPIO14
UART0_RXD 101 102 GND GND 231 232 I2C2_SCL
UART0_RTS* 103 104 SPI1_MOSI SHUTDOWN_REQ* 233 234 I2C2_SDA
UART0_CTS* 105 106 SPI1_SCK PMIC_BBAT 235 236 UART2_TXD
GND 107 108 SPI1_MISO POWER_EN 237 238 UART2_RXD
USB0_D_N 109 110 SPI1_CS0* SYS_RESET* 239 240 SLEEP/WAKE*
USB0_D_P 111 112 SPI1_CS1* GND 241 242 GND
GND 113 114 CAM0_PWDN GND 243 244 GND
USB1_D_N 115 116 CAM0_MCLK GND 245 246 GND
USB1_D_P 117 118 GPIO01 GND 247 248 GND
GND 119 120 CAM1_PWDN GND 249 250 GND
USB2_D_N 121 122 CAM1_MCLK VDD_IN 251 252 VDD_IN
USB2_D_P 123 124 GPIO02 VDD_IN 253 254 VDD_IN
GND 125 126 GPIO03 VDD_IN 255 256 VDD_IN
GPIO04 127 128 GPIO05 VDD_IN 257 258 VDD_IN
GND 129 130 GPIO06 VDD_IN 259 260 VDD_IN
PCIE0_RX0_N 131 132 GND

Package Drawing and Dimensions

Table 32 Module Dimensions

Description Minimum Typical Maximum Unit

Connector to opposite side 45 mm

Side (perpendicular to connector) to opposite side 69.6 mm

SoC height 1.36 1.51 1.66 mm

Figure 7 Module Top and Side View with Cover Outline

Figure 8 Module Bottom with Cover Outline

Figure 9 Module Top Showing DRAM Placement and Side View

Figure 10 Module Bottom Showing EMMC Placement

The information provided in this specification is believed to be accurate and reliable as of the date provided. However, NVIDIA Corporation
(“NVIDIA”) does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information.
NVIDIA shall have no liability for the consequences or use of such information or for any infringement of patents or other rights of third
parties that may result from its use. This publication supersedes and replaces all other specifications for the product that may have been
previously supplied.

NVIDIA reserves the right to make corrections, modifications, enhancements, improvements, and other changes to this specification, at any
time and/or to discontinue any product or service without notice. Customer should obtain the latest relevant specification before placing
orders and should verify that such information is current and complete.

NVIDIA products are sold subject to the NVIDIA standard terms and conditions of sale supplied at the time of order acknowledgement,
unless otherwise agreed in an individual sales agreement signed by authorized representatives of NVIDIA and customer. NVIDIA hereby
expressly objects to applying any customer general terms and conditions with regard to the purchase of the NVIDIA product referenced in
this specification.

NVIDIA products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction of the NVIDIA product can reasonably be expected to result in personal injury,
death or property or environmental damage. NVIDIA accepts no liability for inclusion and/or use of NVIDIA products in such equipment or
applications and therefore such inclusion and/or use is at customer’s own risk.

NVIDIA makes no representation or warranty that products based on these specifications will be suitable for any specified use without
further testing or modification. Testing of all parameters of each product is not necessarily performed by NVIDIA. It is customer’s sole
responsibility to ensure the product is suitable and fit for the application planned by customer and to do the necessary testing for the
application in order to avoid a default of the application or the product. Weaknesses in customer’s product designs may affect the quality
and reliability of the NVIDIA product and may result in additional or different conditions and/or requirements beyond those contained in this
specification. NVIDIA does not accept any liability related to any default, damage, costs or problem which may be based on or attributable
to: (i) the use of the NVIDIA product in any manner that is contrary to this specification, or (ii) customer product designs.

No license, either express or implied, is granted under any NVIDIA patent right, copyright, or other NVIDIA intellectual property right under
this specification. Information published by NVIDIA regarding third-party products or services does not constitute a license from NVIDIA to
use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property rights of the third party, or a license from NVIDIA under the patents or other intellectual property
rights of NVIDIA. Reproduction of information in this specification is permissible only if reproduction is approved by NVIDIA in writing, is
reproduced without alteration, and is accompanied by all associated conditions, limitations, and notices.

ALL NVIDIA DESIGN SPECIFICATIONS, REFERENCE BOARDS, FILES, DRAWINGS, DIAGNOSTICS, LISTS, AND OTHER
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Notwithstanding any damages that customer might incur for any reason whatsoever, NVIDIA’s aggregate and cumulative liability towards
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HDMI

HDMI, the HDMI logo, and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC.

ARM

ARM, AMBA and ARM Powered are registered trademarks of ARM Limited. Cortex, MPCore and Mali are trademarks of ARM Limited. All
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AB
OpenCL

OpenCL is a trademark of Apple Inc. used under license to the Khronos Group Inc.

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