AN12342

Card Coil Design Guide for MIFARE DESFire Light

Rev. 1.1 — 29 June 2022 Application note
522611 COMPANY PUBLIC

Document information
Information Content
Keywords Contactless, MIFARE DESFire Light, ISO/IEC 14443, Resonance, Coil, Inlay,
Antenna
Abstract This document provides guidance for engineers designing magnetic loop
antenna coils for MIFARE DESFire Light ICs
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

Revision history
Rev Date Description
1.1 20220629 Updated legal information and corrected attachments.
1.0 20190131 Initial version

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 2 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

1 Introduction
MIFARE DESFire Light, a passive device (without battery) is powered by a magnetic field
generated by the PCD. To get the magnetic flux cut by the PICC, it requires also a loop
antenna.
This document describes some notes to the design of loop antennas for MIFARE
DESFire Light. The detailed loop antenna design is explained in [1]. Although such
antennas are relatively straightforward in principle and look very similar when comparing
various contactless smartcards, experience proves that their parameters do have a
noticeable impact on performance.
In this document, some antenna layout examples are attached for your reference but
please adapt and verify them before you go for production. In this document the term
„MIFARE DESFire Light card“ refers to a MIFARE DESFire Light IC-based contactless
card.

1.1 How to use this document

In this document only the antenna design hints and notes specific to MIFARE DESFire
Light are explained. All the basics and design details are explained in [1]. Please use
[1]as the base document and apply wherever requires the notes mentioned here.

1.2 Terms and Abbreviations

Table 1. Abbreviations
Acronym Description
CCDG Card Coil Design Guide
PCD Proximity Coupling Device
PICC Proximity IC Card

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 3 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

2 Card Coil Design Notes for MIFARE DESFire Light

There are different classes of antennas widely used in contactless applications for the
MIFARE DESFire Light PICC. For different antenna classes the design of PICC coils are
different. Even different application requirements also lead to different antenna design.
Basically, three parameters are important for the card coil design: coil area, coil quality
factor and resonance frequency of the transponder under loaded conditions.

2.1 Different classes of antenna according to ISO/IEC 14443-1

In Figure 1 different antenna sizes according to ISO/IEC 14443-1 [4] are shown.

Figure 1. Different Coil antenna sizes according to ISO/IEC 14443-1

2.2 Average card coil area

Make the card coil area as big as possible. Rounded corners are better than sharp
corners.

2.3 Coil Q-Factor

To achieve best performance and to cover manufacturing tolerances, for MIFARE
DESFire Light, the recommended Coil Q values are given in Table 2.

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 4 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

2.3.1 Measurement of Coil Q-Factor

There are different ways to measure the Q-Factor of the coil antenna, which may end up
with different results. Follow the way described in the Card Coil Design Guide [1] or ask
your NXP technical support.

2.4 Definition for “unloaded” and “loaded” conditions.

“loaded conditions”, or just “loaded”, means that the MIFARE DESFire Light IC gets
enough power to be able to fully operate. With the NXP setup used (defined in [2]), those
conditions are achieved, when the power at the network analyzer output is set to the
value of +10 dBm.
“unloaded conditions”, or just “unloaded”, means that the MIFARE DESFire Light IC
doesn’t get enough power in order to even start to operate. With the NXP setup used
(defined in [2]), those conditions are achieved, when the power at the network analyzer
output is set to the value of -30 dBm.
Both conditions were created with a NXP dedicated measurement setup, which is
described in [2]. All measurement results presented further down in this document have
been obtained with this setup and under “loaded” and “unloaded” conditions as defined
earlier in this paragraph.

2.5 Loaded resonance frequency of the transponder

The loaded resonance frequency of the transponder is the resulting resonance
frequency, if the MIFARE DESFire Light contactless IC is operated under loaded
conditions.
In general, the appropriate resonance frequency of the transponder depends on the input
capacitance of the MIFARE DESFire Light IC. To achieve best performance and to cover
manufacturing tolerances, for MIFARE DESFire Light, the recommend loaded resonance
frequency is given in Table 2.

2.5.1 Measurement of loaded resonance frequency of the transponder

There are different ways to measure the resonance frequency of the transponder, which
may end up with different results. Follow the way described in the Card Coil Design
Guide [1] or ask your NXP technical support.

2.6 NXP recommendation for PICC coil design

Table 2 summarizes the recommendations for PICC coil design.

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 5 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

Table 2. PICC coil design recommendation

Recommended
Recommended
Antenna loaded transponder
chip of MIFARE Recommended Coil Q Comments
class resonance
DESFire Light
frequency (fR)
Transponder optimum loaded
resonance frequency for single card
operation is close to 14.5MHz.
13.56 MHz < fR < 16
Class 1 17 pF > 30 Transponder optimum loaded
MHz
resonance frequency for stacked
2 cards operation is close to
15.5MHz.
For 106 kbps and single card
13.56 MHz < application. The optimum loaded
Class 2 50 pF > 40
fR < 14.50 MHz resonance frequency is slightly
above 13.56 MHz.
For 106 kbps and single card
13.56 MHz < application. The optimum loaded
Class 3 50 pF > 40
fR < 14.50 MHz resonance frequency is slightly
above 13.56 MHz.
For 106 kbps and single card
13.56 MHz < application. The optimum loaded
Class 4 50 pF > 40
fR < 14.50 MHz resonance frequency is slightly
above 13.56 MHz.
For 106 kbps and single card
13.56 MHz < application. The optimum loaded
Class 5 50 pF > 40
fR < 14.50 MHz resonance frequency is slightly
above 13.56 MHz.
For 106 kbps and single card
13.56 MHz < application. The optimum loaded
Class 6 50 pF > 40
fR < 14.10 MHz resonance frequency is slightly
above 13.56 MHz.

Those recommended quality factor values for the coil are important to get the best
power transfer and to increase the so-called power range of the transponder. Those
recommended values will also remain valid for higher bit rates than 106 kbps (up to 848
kbps).
For Class 1 antennas (17 pF input capacitance IC version) a minimum coil Q-Factor of
30 is recommended. The resulting transponder Q-factor under “unloaded” conditions is
similar to this value. Once the IC starts to operate, the transponder (loaded) Q-Factor is
decreasing and this is leading to a loaded Q-Factor in the range of Q = 8-9. This value
is a good compromise in the middle of the Range Q = 6-15, which results in a good
performance for all data transfer rates (from 106 kbps to 848 kbps).
All those considerations are valid as well for class 2 to class 6 antennas (50 pF input
capacitance IC version), only difference is that a minimum coil Q-Factor of 40 is
recommended.
Note: Increasing the communication bit rate may reduce the communication distance
especially for the small antennas (smaller than Class 1). This could be caused by
unsufficient coupling between reader and card antenna, as bigger designed antennas
typically show a slight performance margin, but smaller once rather not.

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 6 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

2.7 Practical design hints and recommendations for 17 pF chip version

2.7.1 Class 1 wire wound antennas

Hints for antenna design:
Within the boarders of the application and the card manufacturing processes used, try to
maximize the antenna size. The outermost turn of the antenna coil should be placed as
close as possible to the edge of the card represented by an 81 x 49 mm rectangle. Class
1 antenna examples (with two different parameters) are shown in Figure 2.
Note: international standards and industry specifications may restrict the choice of the
maximum allowed antenna coil size.

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 7 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

Figure 2. Class 1 antenna examples (with two different parameters)

For Class 1 (ID-11 size) antenna, the 17 pF input capacitance IC version is

recommended. For all other classes (from ID-2 to ID-6) the usage of the 50 pF input
capacitance IC version of the MIFARE DESFire Light chip is recommended.
Figure 3 shows further examples of typical parameters for different ID1-sized antenna
designs. Besides geometrical coil parameters (orange colored area), also measured
(blue colored area) and calculated (green colored area) electrical parameters are listed in
comparison.

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 8 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

Figure 3. Typical parameters of different realizations of class 1 card antennas

2.7.2 Class 1 etched antennas

One of possible antenna design realizations is shown in Figure 4.

Figure 4. Class 1 Etched Antenna example - HFSS Simulation Model

The geometrical parameters of the antenna are given in Table 3

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 9 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

Table 3. Geometrical Parameters of a Class 1 etched antenna design

Parameter Value
Antenna Dimension, mm x mm 75 x 45
Material: Aluminum
Trackwidth, mm 0,6
Gap between tracks, mm 0,3
Track thickness (coil), mm 0,03
Track thickness (bridge), mm 0,01
Number of Turns 7
Carrier Material: Polyester
Carrier Thickness, mm 0,038
Carrier Dielectric constant, Er: 3,2

and simulative electrical parameters are presented in Table 4.

Table 4. Electrical Parameters of a Class 1 etched antenna design

Parameter Value
SRF, MHz 33,6412
R (@1MHz), Ohm 2,3814
L (@1MHz), uH 5,8623
R (@13,56MHz), Ohm 6,8700
L (@13,56MHz), uH 6,9165
C, pF 3,81
Cic, pF 17
Fres_PICC, MHz 14,5200

The drawing of this antenna (in DXF Format) is available and attached to this document.
To verify the simulation results an etched copper prototype has been (Fig 5) built and
evaluated.

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 10 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

Figure 5. Class 1 Etched Antenna example - Prototype

Fig 6 shows a “loaded” resonance frequency and quality factors, whereas Fig 7 shows a
“unloaded” resonance frequency and quality factors of the prototype.

Figure 6. Loaded resonance frequency (14,56 MHz) and Quality factor (6,5) - Prototype

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 11 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

Figure 7. Unloaded resonance frequency (15,39 MHz) and Quality factor (85,3) - Prototype

The label sensitivity (Hmin) at 13,56 MHz is measured to be 0,175 A/m (Fig 8) for Level 3
activation.

Figure 8. The label sensitivity (Hmin) at 13,56 MHz - Prototype

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 12 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

2.8 Practical design hints and recommendations for 50 pF chip version

For Class 2 and up to Class 6 antenna sizes, it is recommended to use 50 pF input
capacitance IC version.

2.8.1 Class 6 etched antenna

One of possible antenna design realizations is shown in Fig 9.

Figure 9. Class 6 Etched Antenna example - HFSS Simulation Model

Geometrical parameters of this antenna design is shown in Table 5.

Table 5. Geometrical Parameters of a Class 6 Etched Antenna design

Parameter Value
Antenna Diameter, mm 24
Material: Aluminum
Trackwidth, mm 0,25
Gap between tracks, mm 0,25
Track thickness (coil), mm 0,03
Track thickness (bridge), mm 0,01
Number of Turns 10
Carrier Material: Polyester

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 13 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

Table 5. Geometrical Parameters of a Class 6 Etched Antenna design...continued

Parameter Value
Carrier Thickness, mm 0,038
Carrier Dielectric constant, Er: 3,2

and simulative electrical parameters are presented in Table 6.

Table 6. Electrical Parameters of a Class 6 Etched Antenna design

Parameter Value
SRF, MHz 77,4140
R (@1MHz), Ohm 2,2765
L (@1MHz), uH 2,5668
R (@13,56MHz), Ohm 3,8604
L (@13,56MHz), uH 2,6054
C, pF 1,64
Cic, pF 50
Fres_PICC, MHz 13,9300

The drawing of this antenna (in DXF Format) is available and attached to this application
note.

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 14 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

2.9 Required transponder bandwidth for (PICC --> PCD) data transfer
The demand for data transfer sets certain requirements on the transponder bandwidth
B, which limits the transponder quality factor QT. The needed bandwidth is related to the
modulation scheme, coding and data rates, used.
The highest data rate, which is defined in the standard, requires the largest transponder
bandwidth.
Figure 10 demonstrates how this bandwidth can be calculated for 424 bit/s data rate.

Figure 10. Transponder Bandwidth considerations

Other possible data rates and their relationship to their associated required bandwidth is
given in Table 7.

Table 7. Theoretical PICC needed bandwidth for a data transfer with different data
rates
Data rates [kbps] B [MHz]
106 1,8
212 1,9
424 2,1
848 2,5
106 1,8

Note: if a transponder bandwidth is smaller, as recommended, this does not

automatically mean that the communication will not be possible. What will happen is
that the sideband levels of the card answer will be damped more than 3 dB. It is not
recommended, but still sufficient for successful communication.
Note for higher antenna classes (Class 2 to Class 6): The inductance of the coil size
reduces the coil size. It is recommended to use 50pF input capacitance IC versions for
antenna sizes smaller than Class 1. This results in the increase of the transponder factor,
QT. It is recommended to control resulting QT or bandwidth B of the new designed small
transponder, to enable successful communication for all desired data rates.

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 15 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

3 References
1. AN11093 Card Coil Design Guide, Document Number: 0117**1
2. PICC and VICC Resonance Frequency Measurement
3. M. Gebhart, Air Interface, Antennas and Signals in Contactless Near-Field
Communication 2nd lecture in Selected Topics of Advanced Analog Chip Design,
439.224
4. Contactless Card Standard ISO/IEC 14443-1:2018
5. AN12342, version 1.1, document number 522611, is released with the following
attachments:
• PICC_VICC_Resonance_Frequency_Measurement.pdf
• RD_75x45_MFDFLight_17pF.dxf
• RD_v2_D24_MFDFlight_50pF.dxf

1 ** ... BU S&C document version number

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 16 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

4 Legal information
4.1 Definitions Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
Draft — A draft status on a document indicates that the content is still agreed in a valid written individual agreement. In case an individual
under internal review and subject to formal approval, which may result agreement is concluded only the terms and conditions of the respective
in modifications or additions. NXP Semiconductors does not give any agreement shall apply. NXP Semiconductors hereby expressly objects to
representations or warranties as to the accuracy or completeness of applying the customer’s general terms and conditions with regard to the
information included in a draft version of a document and shall have no purchase of NXP Semiconductors products by customer.
liability for the consequences of use of such information.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
4.2 Disclaimers authorization from competent authorities.

Limited warranty and liability — Information in this document is believed Suitability for use in non-automotive qualified products — Unless
to be accurate and reliable. However, NXP Semiconductors does not give this data sheet expressly states that this specific NXP Semiconductors
any representations or warranties, expressed or implied, as to the accuracy product is automotive qualified, the product is not suitable for automotive
or completeness of such information and shall have no liability for the use. It is neither qualified nor tested in accordance with automotive testing
consequences of use of such information. NXP Semiconductors takes no or application requirements. NXP Semiconductors accepts no liability for
responsibility for the content in this document if provided by an information inclusion and/or use of non-automotive qualified products in automotive
source outside of NXP Semiconductors. equipment or applications.
In no event shall NXP Semiconductors be liable for any indirect, incidental, In the event that customer uses the product for design-in and use in
punitive, special or consequential damages (including - without limitation - automotive applications to automotive specifications and standards,
lost profits, lost savings, business interruption, costs related to the removal customer (a) shall use the product without NXP Semiconductors’ warranty
or replacement of any products or rework charges) whether or not such of the product for such automotive applications, use and specifications, and
damages are based on tort (including negligence), warranty, breach of (b) whenever customer uses the product for automotive applications beyond
contract or any other legal theory. NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
Notwithstanding any damages that customer might incur for any reason
liability, damages or failed product claims resulting from customer design and
whatsoever, NXP Semiconductors’ aggregate and cumulative liability
use of the product for automotive applications beyond NXP Semiconductors’
towards customer for the products described herein shall be limited in
standard warranty and NXP Semiconductors’ product specifications.
accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
Right to make changes — NXP Semiconductors reserves the right to
and their suppliers expressly disclaim all warranties, whether express,
make changes to information published in this document, including without
implied or statutory, including but not limited to the implied warranties of non-
limitation specifications and product descriptions, at any time and without
infringement, merchantability and fitness for a particular purpose. The entire
notice. This document supersedes and replaces all information supplied prior
risk as to the quality, or arising out of the use or performance, of this product
to the publication hereof.
remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers
Suitability for use — NXP Semiconductors products are not designed,
be liable to customer for any special, indirect, consequential, punitive
authorized or warranted to be suitable for use in life support, life-critical or
or incidental damages (including without limitation damages for loss of
safety-critical systems or equipment, nor in applications where failure or
business, business interruption, loss of use, loss of data or information, and
malfunction of an NXP Semiconductors product can reasonably be expected
the like) arising out the use of or inability to use the product, whether or not
to result in personal injury, death or severe property or environmental
based on tort (including negligence), strict liability, breach of contract, breach
damage. NXP Semiconductors and its suppliers accept no liability for
of warranty or any other theory, even if advised of the possibility of such
inclusion and/or use of NXP Semiconductors products in such equipment or
damages.
applications and therefore such inclusion and/or use is at the customer’s own
risk. Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
Applications — Applications that are described herein for any of these all direct or general damages), the entire liability of NXP Semiconductors,
products are for illustrative purposes only. NXP Semiconductors makes no its affiliates and their suppliers and customer’s exclusive remedy for all of
representation or warranty that such applications will be suitable for the the foregoing shall be limited to actual damages incurred by customer based
specified use without further testing or modification. on reasonable reliance up to the greater of the amount actually paid by
customer for the product or five dollars (US$5.00). The foregoing limitations,
Customers are responsible for the design and operation of their
exclusions and disclaimers shall apply to the maximum extent permitted by
applications and products using NXP Semiconductors products, and NXP
applicable law, even if any remedy fails of its essential purpose.
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
Safety of high-voltage evaluation products — The non-insulated high
whether the NXP Semiconductors product is suitable and fit for the
voltages that are present when operating this product, constitute a risk of
customer’s applications and products planned, as well as for the planned
electric shock, personal injury, death and/or ignition of fire. This product is
application and use of customer’s third party customer(s). Customers should
intended for evaluation purposes only. It shall be operated in a designated
provide appropriate design and operating safeguards to minimize the risks
test area by personnel that is qualified according to local requirements
associated with their applications and products.
and labor laws to work with non-insulated mains voltages and high-voltage
NXP Semiconductors does not accept any liability related to any default, circuits.
damage, costs or problem which is based on any weakness or default
The product does not comply with IEC 60950 based national or regional
in the customer’s applications or products, or the application or use by
safety standards. NXP Semiconductors does not accept any liability for
customer’s third party customer(s). Customer is responsible for doing all
damages incurred due to inappropriate use of this product or related to non-
necessary testing for the customer’s applications and products using NXP
insulated high voltages. Any use of this product is at customer’s own risk
Semiconductors products in order to avoid a default of the applications
and liability. The customer shall fully indemnify and hold harmless NXP
and the products or of the application or use by customer’s third party
Semiconductors from any liability, damages and claims resulting from the
customer(s). NXP does not accept any liability in this respect.
use of the product.

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 17 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy 4.3 Trademarks
between the translated and English versions.
Notice: All referenced brands, product names, service names, and
Security — Customer understands that all NXP products may be subject to trademarks are the property of their respective owners.
unidentified vulnerabilities or may support established security standards or
specifications with known limitations. Customer is responsible for the design NXP — wordmark and logo are trademarks of NXP B.V.
and operation of its applications and products throughout their lifecycles DESFire — is a trademark of NXP B.V.
to reduce the effect of these vulnerabilities on customer’s applications
MIFARE — is a trademark of NXP B.V.
and products. Customer’s responsibility also extends to other open and/or
proprietary technologies supported by NXP products for use in customer’s
applications. NXP accepts no liability for any vulnerability. Customer should
regularly check security updates from NXP and follow up appropriately.
Customer shall select products with security features that best meet rules,
regulations, and standards of the intended application and make the
ultimate design decisions regarding its products and is solely responsible
for compliance with all legal, regulatory, and security related requirements
concerning its products, regardless of any information or support that may be
provided by NXP.
NXP has a Product Security Incident Response Team (PSIRT) (reachable
at [email protected]) that manages the investigation, reporting, and solution
release to security vulnerabilities of NXP products.

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 18 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

Tables
Tab. 1. Abbreviations .....................................................3 Tab. 5. Geometrical Parameters of a Class 6
Tab. 2. PICC coil design recommendation .................... 6 Etched Antenna design ................................... 13
Tab. 3. Geometrical Parameters of a Class 1 Tab. 6. Electrical Parameters of a Class 6 Etched
etched antenna design ....................................10 Antenna design ............................................... 14
Tab. 4. Electrical Parameters of a Class 1 etched Tab. 7. Theoretical PICC needed bandwidth for a
antenna design ................................................10 data transfer with different data rates ..............15

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 19 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

Figures
Fig. 1. Different Coil antenna sizes according to Fig. 6. Loaded resonance frequency (14,56 MHz)
ISO/IEC 14443-1 ............................................... 4 and Quality factor (6,5) - Prototype ................. 11
Fig. 2. Class 1 antenna examples (with two Fig. 7. Unloaded resonance frequency (15,39
different parameters) ......................................... 8 MHz) and Quality factor (85,3) - Prototype ...... 12
Fig. 3. Typical parameters of different realizations Fig. 8. The label sensitivity (Hmin) at 13,56 MHz -
of class 1 card antennas ...................................9 Prototype ......................................................... 12
Fig. 4. Class 1 Etched Antenna example - HFSS Fig. 9. Class 6 Etched Antenna example - HFSS
Simulation Model ...............................................9 Simulation Model .............................................13
Fig. 5. Class 1 Etched Antenna example - Fig. 10. Transponder Bandwidth considerations .......... 15
Prototype ......................................................... 11

AN12342 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2022. All rights reserved.

Application note Rev. 1.1 — 29 June 2022

COMPANY PUBLIC 522611 20 / 21
NXP Semiconductors
AN12342
Card Coil Design Guide for MIFARE DESFire Light

Contents
1 Introduction ......................................................... 3
1.1 How to use this document .................................3
1.2 Terms and Abbreviations ................................... 3
2 Card Coil Design Notes for MIFARE
DESFire Light ...................................................... 4
2.1 Different classes of antenna according to
ISO/IEC 14443-1 ............................................... 4
2.2 Average card coil area ...................................... 4
2.3 Coil Q-Factor ..................................................... 4
2.3.1 Measurement of Coil Q-Factor .......................... 5
2.4 Definition for “unloaded” and “loaded”
conditions. ..........................................................5
2.5 Loaded resonance frequency of the
transponder ........................................................5
2.5.1 Measurement of loaded resonance
frequency of the transponder .............................5
2.6 NXP recommendation for PICC coil design ....... 5
2.7 Practical design hints and
recommendations for 17 pF chip version ...........7
2.7.1 Class 1 wire wound antennas ........................... 7
2.7.2 Class 1 etched antennas ...................................9
2.8 Practical design hints and
recommendations for 50 pF chip version .........13
2.8.1 Class 6 etched antenna ...................................13
2.9 Required transponder bandwidth for (PICC
--> PCD) data transfer .....................................15
3 References ......................................................... 16
4 Legal information .............................................. 17

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.

© NXP B.V. 2022. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 29 June 2022
Document identifier: AN12342
Document number: 522611