IXYS Power MOSFET Datasheet Parameters Definition

Abdus Sattar, IXYS Corporation

IXAN0065

IXYS provides datasheets with parameters that are essential and useful for
selecting the appropriate device as well as for predetecting its performance in an
application. The graphs included in the datasheet represent typical performance
characteristic and can be used to extrapolate from one set of operating conditions to
another. Power MOSFET generally contains a body diode, which provides “free
wheeling” operation in the inductive load switching. Figure 1 shows the equivalent
circuit for an N-Channel and a P-Channel Power MOSFET.

Figure 1: (a) an N-Channel (b) a P-Channel Enhancement-Mode Power MOSFET1

Essential Ratings and Characteristics

1. Maximum Ratings
The ratings are limiting values for a device and valid for the whole range of operating
conditions3.

1.1 Temperature
1.1.1 Junction Temperature TJ and TJM
The junction temperature ( TJ ) range is -55 ~ 150 oC in most cases and it is the
device’s permissible temperature range within which the device may be operated
continuously. The maximum junction temperature ( TJM ) is 150oC unless
otherwise specified (in some cases 175oC). Junction temperature varies electrical
parameters of Power MOSFET, for example, at very low temperature (< -55oC),
the device can loss its functionality and at very high temperature, the device’s
threshold voltage becomes very low and leakage current becomes very high. It
also can cause thermal run away within the device at very high value.
1.1.2 Storage Temperature TStg
It is the range of temperature for storage or transportation of the dev ice and it
must be between -55 ~ 150oC.
1.1.3 Lead Temperature TL
It is the maximum lead temperature during soldering and it must not exceed
300 oC for 10 seconds at 1/8” from the case.
1.2 Power Dissipation PD

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

The power dissipation is the maximum calculated power that the device can
dissipate and is function of both on the maximum junction temperature and the
thermal resistance at a case temperature T C 25oC.
PD = [TJ M – T C]/RthJC (1)

1.3 Current
1.3.1 Continuous On-state Drain Current I D25
This is the maximum current rating for the device at a case temperature (TC )
25oC. It is calculated based on maximum power dissipation, maximum on-
resistance and temperature dependence of on-resistance. It can be limited by the
current handling capacity of leads.
1.3.2 Maximum Lead Current IDRMS
This is the maximum current rating of the device’s lead at a case temperature
25oC.
1.3.3 Maximum Peak On-state Drain Current IDM
It is the peak current the device can flow above ID25 specification under the
maximum junction temperature. It varies with current pulse widths, duty cycle
and heat dissipation conditions.
1.3.4 Diode Forward Current IS
It’s the maximum DC current the diode can flow in the forward direction at
specified case temperature.
1.3.5 Maximum Diode Forward Current I SM
It’s the peak current the diode can flow above IS specification under the maximum
junction temperature.

1.4 Voltage
1.4.1 Maximum Drain-Source Voltage VDSS
This is defined as the maximum drain-source voltage without causing avalanche
breakdown with gate-source short-circuited (V GS = 0) and the device is at 25oC.
The avalanche breakdown voltage is temperature dependent and could be less
than the BVDSS, rating.
1.4.2 Maximum Gate-Source Voltage ±VGS
This is the maximum voltage that can be introduced between gate and source. It
depends on the thickness and characteristics of the gate oxide layer. The actual
gate oxide withstand voltage is typically much higher than this but varies due to
manufacturing processes, so staying within this rating ensures application
reliability.
1.4.3 Maximum Rate of Rise of Off-state Voltage (dv/dt)
This is defined as the maximum permissible rate of rise of off-state voltage across
the device.

1.5 Avalanche Energy (for avalanche devices)3

1.5.1 Avalanche Drain Current, Repetitive IAR

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

For power MOSFETs, the propensity for current crowding in the die area during
avalanche mandates a limit in avalanche current. It represents the avalanche
energy specification for the device and the true capability of a device.

1.5.2 Maximum repetitive Avalanche Energy, Single Pulse EAR

The maximum permissible reverse-voltage breakdown energy in continuous
operation while observing the maximum permissible chip temperature. The heat
dissipation limits the avalanche energy.
1.5.3 Maximum non-repetitive Avalanche Energy, EAS
The maximum permissible reverse-voltage breakdown energy in continuous
operation while observing the maximum permissible chip temperature. The heat
dissipation limits the avalanche energy.

1.6 Mechanical Data

1.6.1 Mechanical Drawings
This provides the mechanical size of the device with package information.
1.6.2 Weight
This provides the weight information of the device with package.
1.6.3 Mounting Torque M d
This provides the maximum permissible torque that can be applied on the device
for mounting3.

2. Characteristics
According to IEC 60747-8:2004, the characteristics of Power MOSFETs are given at
25 o C and at one specified higher operating temperature3.

2.1 Current
2.1.1 Gate-Source Leakage Current IGSS
It is the maximum gate-source leakage current with the drain and the source
shorted and with the introduction of rated gate-source voltage.
2.1.2 Zero Gate Voltage Drain Current IDSS
It is the maximum drain-source leakage current with the gate and the source
shorted and with the introduction of rated drain-source voltage.

2.2 Voltage
2.2.1 Break Down Voltage BVDSS
The breakdown voltage BVDSS is the minimum blocking voltage between the
drain and the source at given drain current and when the gate is shorted to the
source. The break down voltage has a positive temperature coefficient.

2.2.2 Gate Threshold Voltage VGS (th)

It is the gate-source voltage at which the drain current starts to flow and the
device is considered at ON-State. It has negative temperature coefficient.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

2.2.3 Gate-Source on-state voltage VGSM

This is a gate-source maximum voltage in the on-state.

2.3 On-state Resistance RDS (on)

The specific on-resistance for a power MOSFET is defined by
RDS (on) = RSOURCE + RCH + RA + RD + RJ + Rsub + Rwcml, (2)

Where,
RSOURCE = Source diffusion resistance
RCH = Channel resistance
RA = Accumulation resistance
RJ = JFET component resistance
RD = Drift region resistance
Rsub = Substrate resistance
Rwcml = Bond wire resistance

2.4 Transconductance gfs

It is defined as the change in drain current divided by the change in gate voltage
for a constant drain voltage. A large transconductance is desirable to obtain a high
current handling capability with low gate drive voltage and for achieving high
frequency response.

2.5 Capacitances and Gate Charges3

2.5.1 Input Capacitance Ciss
The input capacitance is measured between the gate and source terminals with the
drain shorted to the source terminal. The Ciss is made up of the gate-to-drain
capacitance CDG in parallel with the gate-to-source capacitance CGS.
Ciss = CGS+CDG (3)

2.5.2 Reverse Transfer Capacitance Crss

The reverse transfer capacitance is measured between the drain and gate terminals
with the source connected to ground. The reverse transfer capacitance is the same
as the gate-to-drain capacitance CDG.
Crss = CDG (4)

2.5.3 Output Capacitance Coss

The output capacitance is measured between the drain and source with the gate
shorted to the source terminal. The Coss is equal to the drain-to-source capacitance
CDS, in parallel with the gate to drain capacitance CDG.
Coss = CDS+CDG (5)

2.5.4 Gate Charges

It’s the total gate charge that’s required to raise the gate-source voltage to 15V in
most cases to fully turn-on the device. It’s measured at a specified drain current,

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

drain-source voltage and gate-source voltage. The gate charge reflects the charge
stored on the inter-terminal capacitances described earlier and is used in designing
the gate drive circuit.

2.6 Switching times (td (on), tr, td (off) , tf)3

2.6.1 Turn-on Delay Time t d (on)
The turn-on delay time is defined as the time interval when the gate-source
voltage (VGS) has reached 10 % of its end value (VGG ), to the time when the drain-
source voltage (VDS) has dropped to 90 % of its initial value (V DD).
2.6.2 Rise Time tr
Following the turn-on delay time, the rise-time follows; it is the interval between
the drain-source voltages from 90% to 10% of its initial value. The drain current
starts to rise and the major part of turn-on losses is generated during this period.
2.6.3 Turn-off Delay Time td (off)
The turn-off delay time is defined as the time interval between the moment when
the gate-emitter voltage (VGE ) has declined to 90 % of its initial value (VGG) and
the drain-source voltage has risen to 10 % of the supply voltage VDD.
2.6.4 Fall Time tf
Following the turn-off delay time, the fall-time follows; it is the interval between
the drain-source voltage rises from 10% to 90% of its end value. During this
period, the drain current starts to fall and the major part of turn-off losses is
generated during this time.

2.7 Turn-on energy (per pulse) E on where appropriate3

2.8 Turn-off energy (per pulse) E off where appropriate3

2.9 Thermal Characteristic2

Power MOSFETs operate at elevated junction temperature and it is important to
observe their thermal limitations in order to achieve acceptable performance and
reliability.
2.9.1 Thermal Resistance Junction to Case RthJC
It’s the thermal resistance from the junction of the die to the outside of the device
case. Itdescribes the passage of heat between the semiconductor chip and case.
IXYS specifies maximum static RthJC.
2.9.2 Thermal Resistance Case to Heatsink RthCK
The thermal resistance case to sink characterizes the static heat dissipation of a
MOSFET and depends on module size, heatsink, case surfaces, thickness
parameters of thermal layers between module and heatsink.

3.0 Intrinsic Diode Characteristics2

3.1 Intrinsic Diode Forward Voltage VSD
The forward voltage is the maximum forward drop of the intrinsic diode at a
specified value of source current.
3.2 Reverse Recovery Time trr

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Reverse recovery time is the time interval starting as current flow reverses
through the diode until it goes zero. IXYS shows typical trr at given test
conditions.
3.3 Reverse Recovery Charge Qrr
Reverse recovery charge is the integral of the reverse recovery current that occurs
during current commutation.
3.4 Peak Reverse Current IRM
Peak Reverse recovery charge is the integral of the reverse recovery current that
occurs during current commutation.

Essential Curves Definitions

Figure 2: Output Characteristics of a Power MOSFET [IXTH/IXTQ130N10T]5

1. Output Characteristics:
Figure 2 shows a typical output characteristic of an N-Channel Power MOSFET in which
the different modes of operation are delineated. In the Cut-off region, the gate-source
voltage (VGS) is less than the gate-threshold voltage (VGS(th)) and the device is an open-
circuit or off. In the Ohmic region, the device acts as a resistor with almost a constant on-
resistance RDS (on) and is equal to V DS /IDS. In the linear-mode of operation, the device
operates in the ‘Current-Saturated’ region where the drain current (Ids) is a function of the
gate-source voltage (V gs) and defined by:

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

I DS K (VGS V GS ( th ) ) 2 g fs (VGS V GS ( th ) ) (6)

Where K is a parameter depending on the temperature and device geometry and gfs is the
current gain or transconductance. When the drain voltage (VDS) is increased, the positive
drain potential opposes the gate voltage bias and reduces the surface potential in the
channel. The channel inversion layer charge decreases with increasing VDS and
ultimately, it becomes zero when the drain voltage equals to (VGS V GS (th ) ) . This point is
called the “channel pinch-off point” where the drain current becomes saturated4.

Figure 3: Normalized R DS(on) vs. Junction Temperature [IXTH/IXTQ130N10T] 5

2. On-Resistance RDS(on) vs. Junction Temperature:

Temperature has a strong effect on RDS(on) , on-resistance, which is an important
parameter in power MOSFET and a measure of the current handling capability of the
device. An important merit is an increase in the on-resistance with increasing temperature
as shown in Figure 3, which portrays a positive temperature coefficient. The positive
temperature coefficient of RDS (on) is a nice feature when paralleling Power MOSFETs
because it ensures thermal stability.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Figure 4: Drain Current vs. Case Temperature [IXTH/IXTQ130N10T]5

3. Drain Current vs. Case Temperature:

The drain current ID is a rating of the maximum continuous DC current with the die at its
maximum rated junction temperature (TJM) and the case at 25 oC. It is related with the
junction-to-case thermal resistance R thJC and case temperature TC as follows:

T TC
PD  JM I D2 RDS ( on) atT JM (7)
R thJC
Solving for ID as
TJM TC
ID  (8)
RthJC RDS ( on ) atTJM
Figure 4 is just the solution of equation (8) over a range of case temperature. Note that in
some cases, the package leads limit the continuous current (the switched current can be
higher). 75A is for TO-3P, TO-220 and TO-263 and 120A is for 7-leaded TO-263.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Figure 5: Transfer Characteristics (Input Admittance) [IXTH/IXTQ130N10T]5

4. Transfer Characteristics (Input Admittance):

Figure 5 shows a typical transfer characteristic, which is a plot of drain current as a
function of gate voltage at three different temperature ranges -40, 25 and 150 oC. The
intercepts of these lines at ID =0 provides the threshold voltages for respective
temperature. It can be concluded that the transfer characteristic depends on both
temperature and drain current and the threshold voltage decreases with increasing
temperature. It can be further concluded that at below 120A, which is the cross-over
point, the gate-source voltage has negative temperature coefficient means less gate-
source voltage at higher temperature for a given drain current. At above 120A, the
temperature coefficient for gate-source voltage is positive.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Figure 6: Current Gain (transconductance) vs. drain current [IXTH/IXTQ130N10T]5

5. Current Gain or Transconductance:

It’s defined as the change in drain current divided by the change in gate voltage for a
constant drain voltage:
dI
g fs  D VDS cons tan t (9)
dVGS
A large transconductance is desirable to obtain a high current handling capability with
low gate drive voltage and for achieving high frequency response. A typical variation of
transconductance as a function of drain current is shown in Figure 6. The reduction in the
mobility with increasing temperature adversely affects the transconductance.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Figure 7: Gate Charge [IXTH/IXTQ130N10T]5

6. Gate Charge:
It’s the total gate charge required to raise the gate-source voltage to 15V, which is
necessary in most cases to fully turn-on the device. All values are measured at a specified
drain current, drain-source voltage and gate current. A typical gate charge waveform for a
power MOSFET is shown in Figure 7. The gate charge reflects the charge stored on the
inter-terminal capacitances described earlier and is used in designing the gate drive
circuit.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Figure 8: Capacitance [IXTH/IXTQ130N10T]5

7. Capacitance:
Figure 8 shows parasitic capacitances characteristics as a function of drain-source
voltage. Its components include input capacitance (Ciss), which consists of CGS in
parallel with CDG, output capacitance (Coss), which consists of CDG in parallel with C DS
and reverse transfer capacitance (Crss), which is the drain-source capacitance.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Figure 9: Transient Thermal Impedance [IXTH/IXTQ130N10T]5

8. Transient Thermal Impedance:

Power MOSFET has junction temperature (TJ) limitation. It should be operated below the
maximum junction temperature (TJM) specified in the datasheet to ensure reliability. The
heat generated within the silicon chip is typically dissipated by means of a heat sink into
the ambient surroundings. The junction temperature rise above the ambient surrounding
(TA) is directly proportional to this heat flow and the junction-to-ambient thermal
resistance (RthJA). The steady-state junction temperature can be defined by:
TJ PD R( th ) JA TA TJM (10)
Where, PD = Maximum power dissipated in the junction. The total thermal resistance
between junction and ambient is,

R(th)JA = R(th)JC + R(th)CS + R (th)SA (11)

The steady-state thermal resistance is not enough for finding peak junction temperatures
for pulsed applications. When a power pulse applied to the device, the peak junction
temperature varies depending on peak power and pulse width. The thermal resistance for
junction-to-case at a given time is called transient thermal resistance and it is defined by:

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Z( th ) JC (t ) r( t ) R( th ) JC (12)

Where r(t) is a time dependent factor that defines the thermal capacity of the device. For
short pulse, the r(t) value is small but for long pulse, it approaches 1 that means the
transient thermal resistance approaches to steady-state thermal resistance. A typical
transient thermal resistance curve is shown in Figure 9. It approaches the steady-state
value at long pulse values. It can be used to estimate the peak temperature rise for square
wave power pulses, which is typical in power supply design circuits

Figure 10: Resistive Turn-on Rise Times vs. Junction Temperature

[IXTH/IXTQ130N10T]5

9. Resistive Turn-on Rise Times vs. Junction Temperature

Figure 10 shows the resistive turn-on rise time decreases with increasing junction
temperature. It also shows that rise time increases with increasing current.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Figure 11: Resistive Turn-on Rise Times vs. Drain Current

[IXTH/IXTQ130N10T]5

10. Resistive Turn-on Rise Times vs. Drain Current

Figure 11 shows the resistive turn-on rise time increases with increasing junction
temperature. It also shows that rise time increases with increasing temperature.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Figure 12: Resistive Turn-on Switching Times vs. Gate Resistance

[IXTH/IXTQ130N10T]5

11. Resistive Turn-on Switching Times vs. Gate Resistance:

Figure 12 shows the resistive turn-on switching time increases with increasing gate
resistance. It also shows that rise time increases with increasing drain current.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Figure 13: Resistive Turn-off Switching Times vs. Junction Temperature

[IXTH/IXTQ130N10T]5

12. Resistive Turn-off Switching Times vs. Gate Resistance:

Figure 13 shows the resistive turn-on switching time increases with increasing gate
resistance. It also shows that rise time increases with increasing drain current.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Figure 14: Resistive Turn-off Switching Times vs. Drain Current

[IXTH/IXTQ130N10T]5

13. Resistive Turn-off Switching Times vs. Drain Current:

Figure 14 shows the resistive turn-off switching time stays almost constant with
increasing drain current. It also shows the fall time increases with increasing temperature.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Figure 15: Resistive Turn-off Switching Times vs. Gate Resistance

[IXTH/IXTQ130N10T] 5
14. Resistive Turn-off Switching Times vs. Gate Resistance:
Figure 15 shows the resistive turn-off switching time increases with increasing gate
resistance. It also shows that the fall times decreases with increasing drain current.

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

Figure 16: Forward-Biased Safe Operating Area (FBSOA) graph for an N-

Channel Power MOSFET [IXFH/IXFT140N10P] 5

15. Forward-Biased Safe Operating Area (FBSOA):

The FBSOA is a datasheet figure of merit that defines the maximum allowed operating
points. Figure 16 shows a typical FBSOA characteristic for an N-Channel Power
MOSFET. It is bounded by the maximum drain-to-source voltage VDSS, maximum
conduction current IDM and constant power dissipation lines for various pulse durations.
In this figure, the set of the curves shows a DC line and four single pulse operating lines,
10ms, 1ms, 100 s and 25 s. The top of each line is truncated to limit the maximum
drain current and is bounded by a positive slope line defined by the RDS(on) of the device.
The right hand side of each line is terminated at the rated drain-to-source voltage limit
(Vdss). Each line has a negative slope and is determined by the maximum allowed power
dissipation of the device Pd:

Pd = [TJM – TC] / ZthJC = VDS ID (13)

Where ZthJC is the junction-to-case transient thermal impedance and TJ (max) is the
maximum allowed junction temperature of the MOSFET. These theoretical constant

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 IXYS Power MOSFET Datasheet Parameters Definition
Abdus Sattar, IXYS Corporation
IXAN0065

power curves are derived from calculation with assumption of essentially uniform
junction temperature across the Power MOSFET die. This assumption is not always
valid, especially for a large die MOSFETs. Firstly, the edge of a MOSFET die soldered to
the mounting tab of a power package has generally lower temperature compared to the
center of the die, the result of lateral heat flow. Secondly, material imperfections (die
attach voids, thermal grease cavities, etc.) may cause local decrease of thermal
conductivity, i.e. increase of local temperature. Thirdly, fluctuations in dopant
concentrations and gate oxide thickness and fixed charge will cause fluctuations of local
threshold voltage and the current gain (gfs) of MOSFET cells, which will also affect local
temperature of the die. Die temperature variations are mostly harmless in case of
switched mode operation; however, these can trigger catastrophic failure in linear mode
operation with pulse duration longer than time required for a heat transfer from the
junction to the heat sink. Modern Power MOSFETs optimized for a switch-mode
applications were found to have limited capability to operate in the right-side bottom
corner of the FBSOA graph.

Bibliography
[1] John G. Kassakian, Martin F. Schlecht, George C. Verghese, “Principles of Power
Electronics” Addison-Wesley Publishing Company, ISBN: 0-201-09689-7
[2] “Power Semiconductors Application Notes, 2002” IXYS Corporation, 3540 Bassett
Street, Santa Clara CA 95054.
[3] BS IEC 60747-8-4: Discrete Semiconductor Devices: Metal-oxide-semiconductor
field effect transistors (MOSFETs) for power switching applications.
[4] B. Jayant Baliga, “Power Semiconductor Devices” PWS Publishing Company,
ISBN: 0-534-94098-6, 1996.
[5] “Product Datasheet, IXTH/IXTQ130N10T”, IXYS Corporation, 3540 Bassett Street,
Santa Clara, CA 95054.

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