SIM7500A_SIM7500E_SIM7500JE_

SIM7500JC_SIM7500S_SIM7500SA
_Hardware Design_V1.05
 Smart Machine Smart Decision

SIM7500A_SIM7500E_SIM7500JE_SIM7500JC_SIM7500S_
Document Title
SIM7500SA_ Hardware Design
Version V1.05

Date 2017-06-26

Status Released
SIM7500A_SIM7500E_SIM7500JE_SIM7500JC_SIM7500S_
Document Control ID
SIM7500SA_Hardware Design_V1.05

General Notes
SIMCom offers this information as a service to its customers to support the application and
engineering efforts that use the products designed by SIMCom. The information provided is based
on the requirements specifically from the customers. SIMCom has not undertaken any independent
search for additional relevant information, including any information that may be in the customer’s
possession. Furthermore, the system validation of the product designed by SIMCom within a larger
electronic system remains the responsibility of the customer or the customer’s system integrator.
All specifications supplied herein are subject to change without notice.

Copyright
This document contains the proprietary technical information which is the property of SIMCom
Limited, copying of this document, giving it to others, the using or communication of the contents
thereof are forbidden without the official authority by SIMCom. Offenders are liable to the
payment of the damages. All rights are reserved in the event of grant of a patent or the registration
of a utility model or design. All specifications supplied herein are subject to change without notice

Copyright © SIMCom Wireless Solutions Co., Ltd. 2017

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Contents

Contents .............................................................................................................................................3

Table Index ........................................................................................................................................5

Figure Index ......................................................................................................................................6

Revision History ................................................................................................................................7

1 Introduction ................................................................................................................................8
1.1 Product Outline .....................................................................................................................8
1.2 Hardware Interface Overview ...............................................................................................9
1.3 Hardware Block Diagram......................................................................................................9
1.4 Functional Overview .............................................................................................................9

2 Package Information................................................................................................................ 11
2.1 Pin Assignment Overview ................................................................................................... 11
2.2 Pin Description ....................................................................................................................13
2.3 Mechanical Information ......................................................................................................15
2.4 Footprint Recommendation .................................................................................................16

3 Interface Application ...............................................................................................................17

3.1 Power Supply ......................................................................................................................17
3.1.1 Power supply Design Guide .........................................................................................17
3.1.2 Recommended Power Supply Circuit ..........................................................................18
3.1.3 Voltage Monitor............................................................................................................19
3.2 Power on/Power off/Reset Function....................................................................................19
3.2.1 Power on.......................................................................................................................19
3.2.2 Power off ......................................................................................................................20
3.2.3 Reset Function ..............................................................................................................21
3.3 UART Interface ...................................................................................................................22
3.3.1 UART Design Guide ....................................................................................................22
3.3.2 RI and DTR Behavior...................................................................................................23
3.4 USB Interface ......................................................................................................................24
3.4.1 USB Application Guide ................................................................................................24
3.5 SIM Interface ......................................................................................................................25
3.5.1 SIM Application Guide ................................................................................................26
3.5.2 SIM Card Design Guide ...............................................................................................27
3.5.3 Recommended SIM Card Holder .................................................................................27
3.6 PCM Interface .....................................................................................................................28
3.6.1 PCM Timing .................................................................................................................29
3.6.2 PCM Application Guide ...............................................................................................30
3.7 I2C Interface........................................................................................................................30
3.7.1 I2C Design Guide .........................................................................................................30
3.8 Network Status ....................................................................................................................31
3.9 Operating Status Indication .................................................................................................32
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3.10 Flight Mode Control ........................................................................................................32
3.11 Pin Multiplex Function ....................................................................................................33
3.12 Other interface .................................................................................................................33
3.12.1 Sink Current Source ..................................................................................................33
3.12.2 ADC ..........................................................................................................................34

4 RF Specifications......................................................................................................................35
4.1 WCDMA/LTE RF Specifications........................................................................................35
4.2 GSM/WCDMA/LTE Antenna Design Guide ......................................................................37
4.3 GNSS ..................................................................................................................................38
4.3.1 GNSS Technical specification ......................................................................................38
4.3.2 GNSS Application Guide .............................................................................................39

5 Electrical Specifications...........................................................................................................41
5.1 Absolute Maximum Ratings................................................................................................41
5.2 Operating Conditions ..........................................................................................................41
5.3 Operating Mode ..................................................................................................................42
5.3.1 Operating Mode Definition ..........................................................................................42
5.3.2 Sleep Mode ...................................................................................................................43
5.3.3 Minimum Functionality Mode and Flight Mode ..........................................................43
5.4 Current Consumption ..........................................................................................................43
5.5 ESD Notes ...........................................................................................................................45

6 SMT Production Guide ...........................................................................................................46

6.1 Top and Bottom View of Module ........................................................................................46
6.2 Label Information................................................................................................................47
6.3 Typical SMT Reflow Profile ...............................................................................................47
6.4 Moisture Sensitivity Level (MSL) ......................................................................................48
6.5 Stencil Foil Design Recommendation .................................................................................49

7 Packaging ..................................................................................................................................50

Appendix..........................................................................................................................................52
A. Reference Design......................................................................................................................52
B. Coding Schemes and Maximum Net Data Rates over Air Interface.........................................53
C. Related Documents ...................................................................................................................55
D. Terms and Abbreviations..........................................................................................................57
E. Safety Caution ...........................................................................................................................59

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Table Index
Table 1: SIM7500 series frequency bands............................................................................................................ 8
Table 2: General features ..................................................................................................................................... 9
Table 3: Pin Definitions ..................................................................................................................................... 12
Table 4: IO parameters definition....................................................................................................................... 13
Table 5: Pin description...................................................................................................................................... 13
Table 6: VBAT Pins electronic characteristic ..................................................................................................... 17
Table 7: Recommended zener diode list............................................................................................................. 18
Table 8: Power on timing and electronic characteristic ...................................................................................... 20
Table 9: Power off timing and Electronic Characteristic.................................................................................... 21
Table 10: RESET pin electronic characteristic ................................................................................................... 22
Table 11: SIM Electronic characteristic in 1.8V mode (SIM_VDD=1.8V)........................................................ 25
Table 12: SIM Electronic characteristic 3.0V mode (SIM_VDD=2.95V).......................................................... 26
Table 13: Amphenol SIM Socket Pin Description.............................................................................................. 28
Table 14: PCM Format ....................................................................................................................................... 28
Table 15: PCM Timing Parameters .................................................................................................................... 29
Table 16: NETLIGHT pin status ........................................................................................................................ 31
Table 17: Pin definition of the STATUS............................................................................................................. 32
Table 18: FLIGHTMODE Pin Status ................................................................................................................. 32
Table 19: Pin multiplex function list .................................................................................................................. 33
Table 20: Sink current electronic characteristic ................................................................................................. 33
Table 21: ADC Electronic Characteristics.......................................................................................................... 34
Table 22: Conducted transmission power .......................................................................................................... 35
Table 23: Operating frequencies ........................................................................................................................ 35
Table 24: Conducted receive sensitivity ............................................................................................................. 36
Table 25: Reference sensitivity (QPSK) ............................................................................................................ 36
Table 26: Trace Loss .......................................................................................................................................... 37
Table 27: Recommended TVS ........................................................................................................................... 38
Table 28: LNA requirements .............................................................................................................................. 40
Table 29: Absolute maximum ratings................................................................................................................. 41
Table 30: Recommended operating ratings ........................................................................................................ 41
Table 31: 1.8V Digital I/O characteristics* ........................................................................................................ 41
Table 32: Operating temperature ........................................................................................................................ 42
Table 33: Operating mode Definitions ............................................................................................................... 42
Table 34: Current consumption on VBAT Pins (VBAT=3.8V) .......................................................................... 44
Table 35: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) ............................. 45
Table 36: The Description of Label Information ................................................................................................ 47
Table 37: Moisture Sensitivity Level and Floor Life ......................................................................................... 48
Table 38: Tray size ............................................................................................................................................. 50
Table 39: Small Carton size ............................................................................................................................... 51
Table 40: Big carton size .................................................................................................................................... 51
Table 41: Coding schemes and maximum net data rates over air interface ........................................................ 53
Table 42: Related documents ............................................................................................................................. 55
Table 43: Terms and Abbreviations .................................................................................................................... 57
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Table 44: Safety caution ..................................................................................................................................... 59

Figure Index
Figure 1: SIM7500 series Block Diagram ............................................................................................................ 9
Figure 2: Pin assignment overview .................................................................................................................... 11
Figure 3: Dimensions (Unit: mm) ...................................................................................................................... 15
Figure 4: Footprint recommendation (Unit: mm) ............................................................................................... 16
Figure 5: Power supply application circuit......................................................................................................... 17
Figure 6: Linear regulator reference circuit ....................................................................................................... 18
Figure 7: Switching mode power supply reference circuit ................................................................................. 18
Figure 8: Reference Power on/off Circuit .......................................................................................................... 19
Figure 9: Power on timing sequence .................................................................................................................. 20
Figure 10: Power off timing sequence ............................................................................................................... 21
Figure 11: Reference reset circuit ...................................................................................................................... 22
Figure 12: UART full modem ............................................................................................................................ 22
Figure 13: UART null Modem ........................................................................................................................... 23
Figure 14: Reference circuit of level shift .......................................................................................................... 23
Figure 15: RI behaviour（SMS and URC report） ........................................................................................... 24
Figure 16: RI behaviour（voice call） .............................................................................................................. 24
Figure 17: USB reference circuit ....................................................................................................................... 25
Figure 18: Reference circuit of the 8-pin SIM card holder ................................................................................ 26
Figure 19: SIM interface reference circuit ......................................................................................................... 27
Figure 20: Amphenol SIM card socket .............................................................................................................. 28
Figure 21: PCM_SYNC timing.......................................................................................................................... 29
Figure 22: EXT codec to module timing ............................................................................................................ 29
Figure 23: Module to EXT codec timing ........................................................................................................... 29
Figure 24: Audio codec reference circuit ........................................................................................................... 30
Figure 25: I2C reference circuit ......................................................................................................................... 31
Figure 26: NETLIGHT reference circuit............................................................................................................ 31
Figure 27: Flight Mode Switch Reference Circuit ............................................................................................. 32
Figure 28: ISINK reference circuit..................................................................................................................... 34
Figure 29: Antenna matching circuit (MAIN_ANT) .......................................................................................... 37
Figure 30: Antenna matching circuit (DIV_ANT) ............................................................................................. 38
Figure 31: Active antenna circuit ....................................................................................................................... 39
Figure 32: Passive antenna circuit (Default) ...................................................................................................... 39
Figure 33: Top and bottom view of Module....................................................................................................... 46
Figure 34: Label Information ............................................................................................................................. 47
Figure 35: The ramp-soak-spike Reflow Profile of Module............................................................................... 48
Figure 36: Packaging introduce ......................................................................................................................... 50
Figure 37: Module tray drawing introduce......................................................................................................... 50
Figure 38: Small carton drawing introduce ........................................................................................................ 51
Figure 39: Big carton drawing introduce ........................................................................................................... 51
Figure 40: Reference design .............................................................................................................................. 52

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Revision History
Data Version Description of change Author

Yuan Shijie
2016-07-06 1.00 Original
Teng lili

Modify Document name

Add SIM7500JC/SIM7500S/SIM7500SA/SIM7500E project
Modify GPIO_49 to FlightMode Shengwu.sun
2016-11-01 1.01 Shijie.yuan
Modify VBUS Minimum Voltage from 3.6V to 3.0V LiLi.teng
Modify figure 18, figure 23 and figure 39.
Modify Table 8, table 9 figure 18 and figure 23.
Modify figure 8，figure 11. Shengwu.sun
2017-01-03 1.02 Shijie.yuan
Add SIM Card reference circuit with hot plug in
Shengwu.sun
2017-03-23 1.03 Modify Table 1.
Shijie.yuan
Fan.gao
2017-05-25 1.04 Modify Table 1,Table 22,Table 24,Table 33
Shijie.yuan
2017-06-26 1.05 Modify Table 2 Shijie.yuan

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1 Introduction
This document describes the electronic specifications, RF specifications, interfaces, mechanical
characteristics and testing results of the SIMCom SIM7500 series. With the help of this document
and other software application notes/user guides, users can understand and use modules to design
and develop applications quickly.

1.1 Product Outline

The SIM7500 series support many air-interface standards, refer to the following table.

Table 1: SIM7500 series frequency bands

Standard Frequency SIM7500A SIM7500E SIM7500JE SIM7500JC SIM7500S SIM7500SA

900MHz 
GSM
1800M Hz 
BAND1  
BAND2 
WCDMA
BAND5  
BAND8 
LTE-FDD B1    
LTE-FDD B2 
LTE-FDD B3   
LTE-FDD B4 
LTE-FDD B5 
LTE-FDD B7  
LTE-FDD B8   
LTE
LTE-FDD B12  
LTE-FDD B18 
LTE-FDD B19 
LTE-FDD B20 
LTE-FDD B25 
LTE-FDD B26  
LTE-FDD B28 
Category CAT1 CAT1 CAT1 CAT1 CAT1 CAT1
Remark -H for CAT4 -H for CAT4 -H for CAT4

GNSS     
With a small physical dimension of 24*27*2.75 mm and with the functions integrated, the Module
can meet almost any space requirement in users’ applications, such as smart phones, PDA’s,
industrial handhelds, machine-to-machine, vehicle applications, etc.
*Note: CAT1 or CAT4 correspond to different PN numbers.
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1.2 Hardware Interface Overview

The interfaces that are described in detail in the next chapters include:
● Power Supply
● USB Interface
● UART Interface
● SIM Interface
● GPIO
● ADC
● Power Output
● Current Sink Source
● PCM Interface
● I2C Interface

1.3 Hardware Block Diagram

The block diagram of the Module is shown in the figure below.

GNSS Antenna

Main Antenna AUX Antenna DDR

NAND
GNSS RF Flash

GSM/WCDMA WCDMA
/LTE /LTE SMT Interface
RF FEM RF FEM
Qualcomm
Chip
RX SIM
RX UART
TX Baseband I2C

{
RF USB PCM
GSM/ Transceiver GPIOs Interrupt
WCDMA/LTE PA ADC Status LED
LDO
Sink Current Source
SYSTEM POWER

Power On
Power Reset
XO Management
19.2MHz
VBAT VBAT

Figure 1: SIM7500 series Block Diagram

1.4 Functional Overview

Table 2: General features

Feature Implementation
Power supply Single supply voltage 3.4～4.2V
Power saving Current in sleep mode : <5mA
Radio frequency bands Please refer to the table 1
GSM/GPRS:
Class 4 (2W): EGSM900
Transmitting power Class 1 (1W): DCS1800
EDGE:
Class E2 (0.5W): EGSM900
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Class E1 (0.4W): DCS1800
WCDMA: Class 3 (0.25W)
LTE: Class 3 (0.25W)
GPRS multi-slot class 12
EDGE multi-slot class 12UMTS R99 speed: 384 kbps DL/UL
HSPA+: 5.76 Mbps(UL), 42 Mbps(DL)
Data Transmission
LTE Category 1: 10 Mbps (DL)
Throughout
LTE Category 1: 5 Mbps (UL)
LTE Category 4: 150 Mbps (DL) for –H version, see table 1
LTE Category 4: 50 Mbps (UL) for –H version, see table 1
GSM/WCDMA /LTE main antenna
Antenna WCDMA /LTE auxiliary antenna
GNSS antenna
GNSS engine (GPS,GLONASS and BD)
GNSS
Protocol: NMEA
MT, MO, CB, Text and PDU mode
SMS SMS storage: SIM card or ME(default)
Transmission of SMS alternatively over CS or PS.
SIM interface Support identity card: 1.8V/ 3V
Support SAT class 3, GSM 11.14 Release 98
SIM application toolkit
Support USAT
Phonebook management Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN
Support PCM interface
Audio feature Only support PCM master mode and short frame sync, 16-bit linear data
formats
A full modem serial port by default
Baud rate: 300bps to 4Mbps(default:115200bps)
Auto-bauding baud rate: 9600,19200,38400,57600,115200bps
UART interface
Can be used as the AT commands or data stream channel.
Support RTS/CTS hardware handshake
Multiplex ability according to GSM 07.10 Multiplexer Protocol.
USB USB 2.0 specification-compliant as a peripheral
Firmware upgrade over USB interface
Firmware upgrade USB
USB 2.0 specification-compliant as a peripheral
Weight:4.0 g
Physical characteristics
Size:24*27*2.75mm
Normal operation temperature: -30°C to +80°C
Temperature range Extended operation temperature: -40°C to +85°C*
Storage temperature -45°C to +90°C
*Note: Module is able to make and receive voice calls, data calls, SMS and make
WCDMA/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from
the 3GPP specifications if the temperature is outside the normal operating temperature range
and still within the extreme operating temperature range.

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2 Package Information

2.1 Pin Assignment Overview

All functions of the SIM7500 series will be provided through 56 pads that will be connected to the
customers’ platform. The following Figure is a high-level view of the pin assignment of the
SIM7500 series. GNSS_ANT

DBG_TXD

FlightMode

MAIN_ANT
NETLIGHT

STATUS

GPIO_37
GND

GND

GND

GND

GND

GND
56

55

54

53

52

51

50

49

48

47

46

45

44
GND 1 43
GND
DIV_ANT 2 42 RI
3 41
GND CTS

4 40
SCL DTR
SIM7500x
5 DBG_TXD 39 RXD
SDA
38
GND 6 TXD

LTE_ACTIVE
37 DCD
USB_DM 7

USB_DP 8
36 RTS

VBUS 9
Top View 35 GND
34
SIM_DATA 10 VBAT
33 VBAT
SIM_CLK 11

SIM_DET 12
32 GND

SIM_RST 13 31 GND

SIM_VDD 14 30 PWRKEY

GND 15 29 GND
21

22

23

24

25

28
16

17

18

19

20

26

27
GPIO_1
L11_1V8
PCM_OUT
PCM_SYNC

PCM_IN
GND

GND
ISINK
RESET

ADC
PCM_CLK
I2S_MCLK

GND

Figure 2: Pin assignment overview

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Table 3: Pin Definitions

Pin No. Pin Name Pin No. Pin Name

1 GND 2 DIV_ANT
3 GND 4 SCL
5 SDA 6 GND
7 USB_DM 8 USB_DP
9 VBUS 10 SIM_DATA
11 SIM_CLK 12 SIM_DET
13 SIM_RST 14 SIM_VDD
15 GND 16 GND
17 I2S_MCLK 18 PCM_CLK
19 PCM_SYNC 20 PCM_IN
21 PCM_OUT 22 GND
23 L11_1V8 24 RESET
25 ADC 26 GPIO_1
27 ISINK 28 GND
29 GND 30 PWRKEY
31 GND 32 GND
33 VBAT 34 VBAT
35 GND 36 RTS
37 DCD 38 TXD
39 RXD 40 DTR
41 CTS 42 RI
43 GND 44 GND
45 MAIN_ANT 46 GND
47 GND 48* GPIO_37
49 FlightMode 50 STATUS
51 DBG_TXD 52 NETLIGHT
53 GND 54 GND
55 GNSS_ANT 56 GND

*Note: SIM7500A could not support GNSS Function.

Before the normal power up, pin48 cannot be pulled up.

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2.2 Pin Description

Table 4: IO parameters definition

Pin type Description

PI Power input
PO Power output
AI Analog input
AIO Analog input/output
I/O Bidirectional input /output
DI Digital input
DO Digital output
DOH Digital output with high level
DOL Digital output with low level
PU Pull up
PD Pull down

Table 5: Pin description

Default
Pin name Pin No. Description Comment
status
Power Supply
VBAT Power supply, voltage range: 3.4～
33,34 PI
4.2V.
1.8V output with Max. 50ma If unused, keep it
open.
L11_1V8 23 PO current output for external circuit,
such as level shift circuit.
1, 3, 6,
15,16,22
,28,29,3
GND 1,32,35, Ground
43,44,46
,47,53,5
4,56
System Control
System power on/off control input,
PWRKEY 30 DI,PU Default 0.8V
active low.
RESET has been
System reset control input, active pulled up to 1.8V
RESET 24 DI, PU
low. via a resistor
internally.
SIM interface

SIM Card data I/O, which has been All lines of SIM
SIM_DATA 10 I/O,PU pulled up via a 100KR resistor to interface should
SIM_VDD internally. be protected

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SIM_RST 13 DO SIM Reset against ESD.
SIM_CLK 11 DO SIM clock

Power output for SIM card, its

output Voltage depends on SIM
SIM_VDD 14 PO
card type automatically. Its output
current is up to 50ma.

USB
Valid USB detection input with
VBUS 9 DI,PD
3.0～5.25V detection voltage

Negative line of the differential,

USB_DM 7 I/O
bi-directional USB signal.
USB_DP Positive line of the differential,
8 I/O
bi-directional USB signal.
UART interface
RTS 36 DOL Request to send
CTS 41 DI,PU Clear to Send
RXD 39 DI,PU Receive Data
If unused, keep
RI 42 DOH Ring Indicator
them open.
DCD 37 DOH Carrier detects
TXD 38 DOH Transmit Data
DTR 40 DI,PU DTE get ready
I2C interface
SCL 4 DO I2C clock output If unused, keep
SDA 5 I/O I2C data input/output them open.
PCM interface
PCM_OUT 21 DO PCM data output.
PCM_IN 20 DI PCM data input. If unused, please
PCM_SYNC 19 DO PCM data frame sync signal. keep them open.
PCM_CLK 18 DO PCM data bit clock.
I2S_MCLK 17 DO Audio Master clock
GPIO
LED control output as network
NETLIGHT 52 DO
status indication.
Operating status output.
High level: Power on and firmware If unused, please
STATUS 50 DO
ready keep them open.
Low level: Power off
FlightMode Can’t
GPIO_1 26 IO GPIO
be used when
Flight Mode control input.
FlightMode 49 DI,PU High level(or open): Normal Mode Module is in sleep
Low level: Flight Mode mode.
Default: GPIO
SIM_DET 12 IO Optional: SIM card detecting input.
H: SIM is removed
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L: SIM is inserted
GPIO_37 48 IO GPIO
RF interface
MAIN _ANT 45 AIO MAIN antenna soldering pad
DIV_ANT 2 AI Auxiliary antenna soldering pad
GNSS_ANT 55 AI GNSS antenna soldering pad
Other interface
ISINK 27 AI Ground-referenced current sink.
If unused, please
DGB_TXD 51 DO Use for debug keep them open.
ADC 25 AI Analog-digital converter input

2.3 Mechanical Information

The following figure shows the package outline drawing of Module.

Figure 3: Dimensions (Unit: mm)

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2.4 Footprint Recommendation

Figure 4: Footprint recommendation (Unit: mm)

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3 Interface Application

3.1 Power Supply

On VBAT pads, a ripple current up to 2A typically, may cause voltage drop. Therefore, the power
supply for these pads must be able to provide sufficient current up to more than 2A in order to
avoid the voltage drop of more than 300mV.

Table 6: VBAT Pins electronic characteristic

Symbol Description Min. Typ. Max. Unit

VBAT Module power voltage 3.4 3.8 4.2 V
IVBAT(peak) Module power peak current in normal mode. 1.0 - 2 A
IVBAT(average) Module power average current in normal mode
Please refer to the table 34
IVBAT(sleep) Power supply current in sleep mode
IVBAT(power-off) Module power current in power off mode. - - 20 uA

3.1.1 Power supply Design Guide

Make sure that the voltage on the VBAT pins will never drop below 3.4V.
Note: If the power supply for BAT pins can support up to 2A, using a total of more than 220uF
capacitors is recommended, or else users must use a total of 1000uF capacitors, in order to avoid
the voltage drop of more than 300mV.
Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band
can be used for EMC.
These capacitors should be put as close as possible to VBAT pads. Also, user should keep VBAT
trace on the circuit board wider than 2 mm to minimize PCB trace impedance. The following figure
shows the recommended circuit.
FB101
VBAT 34
VBAT

33
VBAT
33pF 220uF 5.1V
MODULE C101 C102 500mW

GND 32

31
GND

Figure 5: Power supply application circuit

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In addition, in order to guard over voltage protection, it is suggested to use a zener diode with 5.1V
reverse zener voltage and more than 500mW power dissipation.

Table 7: Recommended zener diode list

No. Manufacturer Part Number power dissipation Package

1 On semi MMSZ5231BT1G 500mW SOD123
2 Prisemi PZ3D4V2H 500mW SOD323
3 Vishay MMSZ4689-V 500mW SOD123
4 Crownpo CDZ55C5V1SM 500mW 0805

3.1.2 Recommended Power Supply Circuit

It is recommended that a switching mode power supply or linear regulator power supply is used. It
is important to make sure that all the components used in the power supply circuit can resist a peak
current up to 2A.
The following figure shows the linear regulator reference circuit with 5V input and 3.8V output.
DC INPUT U101 MIC29302 VBAT
2 4
Vin Vout
FUSE
C101 + C102 1
FB 5
GND

R101
100uF 1uF
On/Off
100K + C103 C104 R103
470R
PWR_CTRL 3
330uF 100nF
R102
47K

Figure 6: Linear regulator reference circuit

If there is a big voltage difference between input and output for VBAT power supply, or the
efficiency is extremely important, then a switching mode power supply will be preferable. The
following figure shows the switching mode power supply reference circuit.
DC INPUT U101 LM2596- ADJ L101 FB101 VBAT
1
Vin Vout 2
FUSE 100uH 270 ohm@100Mhz
C101 + C102 5
+
GND

On/Off FB 4 D102 C103 C104 R101

100uF 2.2K
1uF 330uF
PWR_CTRL 3 100nF
MBR360
R102
1K

Figure 7: Switching mode power supply reference circuit

Note: The Switching Mode power supply solution for VBAT must be chosen carefully against
Electro Magnetic Interference and ripple current from depraving RF performance.

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3.1.3 Voltage Monitor

To monitor the VBAT voltage, the AT command “AT+CBC” can be used.

For monitoring the VBAT voltage outside or within a special range, the AT command
“AT+CVALARM” can be used to enable the under-voltage warning function.
If users need to power off Module, when the VBAT voltage is out of a range, the AT command
“AT+CPMVT” can be used to enable under-voltage power-off function.
Note: Under-voltage warning function and under-voltage power-off function are disabled by
default. For more information about these AT commands, please refer to Document [1].

3.2 Power on/Power off/Reset Function

3.2.1 Power on

Module can be powered on by pulling the PWRKEY pin down to ground.

The PWRKEY pin has been pulled up with a diode to 1.8V internally, so it does not need to be
pulled up externally. It is strongly recommended to put a100nF capacitor, an ESD protection diode,
close to the PWRKEY pin as it would strongly enhance the ESD performance of PWRKEY pin.
Please refer to the following figure for the recommended reference circuit.

The high voltage of PWRKEY is 0.8V

1.8V

Turn on / off PWRKEY 0Ω Power

impulse On / off logic
4.7K
100nF

47K MODULE

Figure 8: Reference Power on/off Circuit

Note: Module could be automatically power on by connecting PWRKEY pin to ground via 0R
resistor directly.

The power-on scenarios are illustrated in the following figure.

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VBAT Ton

PWRKEY
(Input)

Ton(status)
STATUS
(Output)
Ton(uart)

UART Port Undefined Active

USB Port Ton(usb)

Undefined Active

Figure 9: Power on timing sequence

Table 8: Power on timing and electronic characteristic

Symbol Parameter Min. Typ. Max. Unit

The time of active low level impulse of PWRKEY
Ton 100 500 - ms
pin to power on module
The time from power-on issue to STATUS pin 12 13 -
Ton(status) s
output high level(indicating power up ready )
Ton(uart) The time from power-on issue to UART port ready 11 12 s
Ton(usb) The time from power-on issue to USB port ready 11 12 s
VIH Input high level voltage on PWRKEY pin 0.6 0.8 1.8 V
VIL Input low level voltage on PWRKEY pin -0.3 0 0.5 V

3.2.2 Power off

The following methods can be used to power off Module.

● Method 1: Power off Module by pulling the PWRKEY pin down to ground.
● Method 2: Power off Module by AT command “AT+CPOF”.
● Method 3: Over-voltage or under-voltage automatic power off. The voltage range can be set by
AT command “AT+CPMVT”.
● Method 4: Over-temperature or under-temperature automatic power off.

Note: If the temperature is outside the range of -30~+80°C, some warning will be reported via
AT port. If the temperature is outside the range of -40~+85°C, Module will be powered off
automatically.

For details about “AT+CPOF” and “AT+CPMVT”, please refer to Document [1].
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These procedures will make modules disconnect from the network and allow the software to enter a
safe state and save data before modules are powered off completely.
The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.

Toff-on

PWRKEY Toff Ton

( Input )

STATUS
( Output )
Toff(status)

Toff(uart)

UART Port Active Undefined

Toff(usb)

USB Port Active Undefined

Figure 10: Power off timing sequence

Table 9: Power off timing and Electronic Characteristic

Time value
Symbol Parameter Unit
Min. Typ. Max.
The active low level time pulse on PWRKEY pin to
Toff 2.5 -- -- s
power off module
The time from power-off issue to STATUS pin output
Toff(status) 25 26 - s
low level(indicating power off )*
Toff(uart) The time from power-off issue to UART port off 14 15 - s
Toff(usb) The time from power-off issue to USB port off 27 28 - s
The buffer time from power-off issue to power-on
Toff-on 0 - - s
issue

3.2.3 Reset Function

Module can be reset by pulling the RESET pin down to ground.

Note: This function is only used as an emergency reset when AT command “AT+CPOF” and the
PWRKEY pin all have lost efficacy.

The RESET pin has been pulled up to 1.8V internally, so it does not need to be pulled up externally.
It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the
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RESET pin. Please refer to the following figure for the recommended reference circuit.

1.8V

Treset 40K
Reset Impulse RESET Reset
Logic
4.7K
100nF

47K MODULE

Figure 11: Reference reset circuit

Table 10: RESET pin electronic characteristic

Symbol Description Min. Typ. Max. Unit
The active low level time impulse on
Treset 100 ms
RESET pin to reset module
VIH Input high level voltage 1.17 1.8 2.1 V
VIL Input low level voltage -0.3 0 0.8 V

3.3 UART Interface

Module provides a 7-wire UART (universal asynchronous serial transmission) interface as DCE
(Data Communication Equipment). AT commands and data transmission can be performed through
UART interface.

3.3.1 UART Design Guide

The following figures show the reference design.

MODULE ( DCE) HOST ( DTE)

TXD TXD
RXD RXD
RTS RTS
UART
CTS CTS UART
DTR DTR
DCD DCD
RI RING

Figure 12: UART full modem

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MODULE ( DCE) HOST ( DTE)

TXD TXD
RXD RXD
RTS RTS
UART CTS CTS UART
DTR DTR
DCD DCD
Wake up host
RI RING
Interrupt

Figure 13: UART null Modem

The Module UART is 1.8V voltage interface. If user’s UART application circuit is a 3.3V voltage
interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR
provided by Texas Instruments is recommended. The following figure shows the voltage matching
reference design.

VDD_1V8 or
External 1V8 3.3V

MODULE 100nF 100nF

VCCA VCCB
OE GND
TXD A1 B1 TXD_3.3V
RXD A2 B2 RXD_3.3V
RTS A3 B3 RTS_3.3V
CTS A4 B4 CTS_3.3V
DTR A5 B5 DTR_3.3V
DCD A6 B6 DCD_3.3V
RI A7 B7 RI_3.3V
47K 47K
A8 B8
UART port

Figure 14: Reference circuit of level shift

To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect
Module to the RS-232-C interface, for example SP3238ECA, etc.
Note: Module supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400,
57600, 115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. The default band rate
is 115200bps.

3.3.2 RI and DTR Behavior

The RI pin can be used to interrupt output signal to inform the host controller such as application
CPU.

Normally RI will stay at high level until certain conditions such as receiving SMS, or a URC report
come in. It will then change to low level. It will stay low until the host controller clears the
interrupted event with “AT+CRIRS” AT command.

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RI Receiving SMS and any Clear by AT+CRIRS

Idle URC report coming.
HIGH AT+CFGRI=1

LOW

RI
Idle Receiving SMS . Clear by AT+CRIRS
HIGH AT+CFGRI=0

LOW

Figure 15: RI behaviour（SMS and URC report）

Normally RI will be kept high until a voice call, then it will output periodic rectangular wave with
5900ms low level and 100ms high level. It will output this kind of periodic rectangular wave until
the call is answered or hung up.
RI 5900ms 100ms
HIGH

LOW
Idle Ring Establish Hang up Idle
the call the call

Figure 16: RI behaviour（voice call）

Note: For more details of AT commands about UART, please refer to document [1] and [22].

DTR pin can be used to wake Module from sleep. When Module enters sleep mode, pulling down
DTR can wake Module.

3.4 USB Interface

The Module contains a USB interface compliant with the USB2.0 specification as a peripheral, but
the USB charging function is not supported.

3.4.1 USB Application Guide

Module can be used as a USB device. Module supports the USB suspend and resume mechanism
which can reduce power consumption. If there is no data transmission on the USB bus, Module will
enter suspend mode automatically and will be resumed by some events such as voice call, receiving
SMS, etc.

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MODULE HOST
USB_VBU Bead
VBUS
S L
USB_DM D-
USB USB
USB_DP D+
GND GND
D1 D2 D3

Figure 17: USB reference circuit

Because of the high bit rate on USB bus, more attention should be paid to the influence of the
junction capacitance of the ESD component on USB data lines. Typically, the capacitance should
be less than 1pF. It is recommended to use an ESD protection component such as ESD9L5.0ST5G
provided by On Semiconductor (www.onsemi.com ).
D3 is suggested to select the diode with anti-ESD and voltage surge function, or customer could
add a ZENER diode for surge clamping. The recommend diodes list please refer to table 7.
L is recommended (MURATA) DLW21SN371SQ2L.
Note ： 1.The USB_DM and USB_DP nets must be traced by 90Ohm+/-10% differential
impedance.
2. Must reserve USB interfaces or test points to for software debug.

3.5 SIM Interface

Module supports both 1.8V and 3.0V SIM Cards.

Table 11: SIM Electronic characteristic in 1.8V mode (SIM_VDD=1.8V)

Symbol Parameter Min. Typ. Max. Unit

SIM_V
LDO power output voltage 1.75 1.8 1.95 V
DD

VIH High-level input voltage 0.65*SIM_VDD - SIM_VDD +0.3 V

VIL Low-level input voltage -0.3 0 0.35*SIM_VDD V

VOH High-level output voltage SIM_VDD -0.45 - SIM_VDD V

VOL Low-level output voltage 0 0 0.45 V

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Table 12: SIM Electronic characteristic 3.0V mode (SIM_VDD=2.95V)

Symbol Parameter Min. Typ. Max. Unit

SIM_V
LDO power output voltage 2.75 2.95 3.05 V
DD

VIH High-level input voltage 0.65*SIM_VDD - SIM_VDD +0.3 V

VIL Low-level input voltage -0.3 0 0.25*SIM_VDD V

VOH High-level output voltage SIM_VDD -0.45 - SIM_VDD V

VOL Low-level output voltage 0 0 0.45 V

3.5.1 SIM Application Guide

It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST

(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the SIM
peripheral circuit should be close to the SIM card socket. The following figure shows the 8-pin
SIM card holder reference circuit.

L11_1V8 4.7K
MOLEX- 91228
SIM_VDD
VCC GND
SIM_RST 22R RST VPP
Module SIM_CLK 22R CLK I/O
SIM_DET
PRESENCE GND
SIM_DATA 22R
SIM Card
NM_22PF
NM_22PF
NM_22PF

ESDA6V1W5
100nF

Figure 18: Reference circuit of the 8-pin SIM card holder

The SIM_DET pin is used for detection of the SIM card hot plug in. User can select the 8-pin
SIM card holder to implement SIM card detection function.

If the SIM card detection function is not used, user can keep the SIM_DET pin open. The
reference circuit of 6-pin SIM card holder is illustrated in the following figure.

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100nF
SIM CARD
SIM_VDD
SIM_RST VCC GND
22Ω
RST VPP
MODULE SIM_CLK 22Ω CLK I/O

C707 10M006 512

SIM_DATA 22Ω

ESDA6V1W5

22pF_NM

22pF_NM

22pF_NM

Figure 19: SIM interface reference circuit

Note: SIM_DATA has been pulled up with a 100KΩ resistor to SIM_VDD in module. A 100nF
capacitor on SIM_VDD is used to reduce interference. For more details of AT commands about
SIM, please refer to document [1].

3.5.2 SIM Card Design Guide

SIM card signal could be interferenced by some high frequency signal, it is strongly recommended
to follow these guidelines while designing:
 SIM card holder should be far away from main antenna
 SIM traces should keep away from RF lines, VBAT and high-speed signal lines
 The traces should be as short as possible
 Keep SIM card holder’s GND connect to main ground directly
 Shielding the SIM card signal by ground well
 Recommended to place a 100nF capacitor on SIM_VDD line and keep close to the SIM
card holder
 Add some TVS which parasitic capacitance should not exceed 50pF
 Add 22Ω resistor to (SIM_RST/SIM_CLK/SIM_DATA) signal could enhance ESD
protection
 Mount 22pF capacitor to (SIM_RST/SIM_CLK/SIM_DATA) signal if having RF signal
interference

3.5.3 Recommended SIM Card Holder

It is recommended to use the 6-pin SIM socket such as C707 10M006 512 produced by Amphenol.
User can visit http://www.amphenol.com for more information about the holder.

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Figure 20: Amphenol SIM card socket

Table 13: Amphenol SIM Socket Pin Description

Pin Signal Description

C1 SIM_VDD SIM Card Power supply.
C2 SIM_RST SIM Card Reset.
C3 SIM_CLK SIM Card Clock.
C5 GND Connect to GND.
C6 VPP
C7 SIM_DATA SIM Card data I/O.

3.6 PCM Interface

Module provides a PCM interface for external codec, which can be used in master mode with short
sync and 16 bits linear format.

Table 14: PCM Format

Characteristics Specification
Line Interface Format Linear(Fixed)
Data length 16bits(Fixed)
PCM Clock/Sync Source Master Mode(Fixed)
PCM Clock Rate 2048 KHz (Fixed)
PCM Sync Format Short sync(Fixed)
Data Ordering MSB

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Note: For more details about PCM AT commands, please refer to document [1].

3.6.1 PCM Timing

Module supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec.

Figure 21: PCM_SYNC timing

Figure 22: EXT codec to module timing

Figure 23: Module to EXT codec timing

Table 15: PCM Timing Parameters

Parameter Description Min. Typ. Max. Unit

T(sync) PCM_SYNC cycle time – 125 – μs
T(synch) PCM_SYNC high level time – 488 – ns
T(syncl) PCM_SYNC low level time – 124.5 – μs
T(clk) PCM_CLK cycle time – 488 – ns
T(clkh) PCM_CLK high level time – 244 – ns
T(clkl) PCM_CLK low level time – 244 – ns
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PCM_SYNC setup time high before falling edge of
T(susync) – 122 – ns
PCM_CLK
PCM_SYNC hold time after falling edge of
T(hsync) – 366 – ns
PCM_CLK
PCM_IN setup time before falling edge of
T(sudin) 60 – – ns
PCM_CLK
T(hdin) PCM_IN hold time after falling edge of PCM_CLK 60 – – ns
T(pdout) Delay from PCM_CLK rising to PCM_OUT valid – – 60 ns
Delay from PCM_CLK falling to PCM_OUT
T(zdout) – – 60 ns
HIGH-Z

3.6.2 PCM Application Guide

The following figure shows the external codec reference design.

3.3V 3.8V VDD_1V8

VDDA
VDDSPK
VDDD
PCM_IN 1.3K
ADCOUT
PCM_OUT MICBIAS
DACIN
PCM_SYNC FS 1uF
MIC+
PCM_CLK BCLK MIC- 1uF
MODULE MIC
MCLK
1.3K
47uF
SCL MOUT
SCLK 47uF
SDA
SDIO
NAU8810 SPK
100pF C101

Figure 24: Audio codec reference circuit

Note: 1. Module can transmit PCM data by the USB port besides the PCM interface. For more
details please refer to documents [1] and [23].
2. If use SIM7500E Module,C101 should use 220pF.
3.C101 must be mounted.

3.7 I2C Interface

Module provides a I2C interface compatible with I2C specification, version 2.1, with clock rate up
to 400 kbps. Its operation voltage is 1.8V.

3.7.1 I2C Design Guide

The following figure shows the I2C bus reference design.

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SCL SCL
SDA SDA

GND GND
Module Device

Figure 25: I2C reference circuit

Note：
SDA and SCL have pull-up resistors in module. So, 2 external pull up resistors are not needed in
application circuit.
“AT+CRIIC and AT+CWIIC” AT commands could be used to read/write register values of the
I2C peripheral devices. For more details about AT commands please refer to document [1].

3.8 Network Status

The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the
following figure.

VBAT

R
Module
4.7K
NETLIGHT

47K

Figure 26: NETLIGHT reference circuit

Note: The value of the resistor named “R” depends on the LED characteristic.

Table 16: NETLIGHT pin status

NETLIGHT pin status Module status

Always On Searching Network; Call Connect(include VOLTE,SRLTE)
200ms ON, 200ms OFF Data Transmit; 4G registered;
800ms ON, 800ms OFF 2G/3G registered network
OFF Power off ;Sleep
Note: NETLIGHT output low level as “OFF”, and high level as “ON”.
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3.9 Operating Status Indication

The pin50 is for operating status indication of the module. The pin output is high when module is
powered on, and output is low when module is powered off.

Table 17: Pin definition of the STATUS

Pin name Pin number Description

STATUS 50 Operating status indication
Note: For timing about STATUS, please reference to the chapter “3.2 power on/down scenarios”

3.10 Flight Mode Control

The FLIGHTMODE pin can be used to control SIM7500x to enter or exit the Flight mode. In
Flight mode, the RF circuit is closed to prevent interference with other equipments and minimize
current consumption. Bidirectional ESD protection component is suggested to add on
FLIGHTMODE pin, its reference circuit is shown in the following figure.

1.8V

4.7K

FlightMode Switch

4.7K
Module

Figure 27: Flight Mode Switch Reference Circuit

Table 18: FLIGHTMODE Pin Status

FLIGHTMODE Pin Status Module operation

Input Low Level Flight Mode: RF is closed
AT+CFUN=0: RF is closed
Input High Level
AT+CFUN=1:RF is working
Note :FlightMode Can’t be used when Module is in sleep mode.

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3.11 Pin Multiplex Function

Some pins of Module could be used for alternate function besides default function.

Table 19: Pin multiplex function list

Pin Number Pin Name Default Function Alternate Function

4 SCL SCL GPIO11
5 SDA SDA GPIO10
12 SIM_DET GPIO34 SIM_DET
GPIO23,SPI_CLK
18 PCM_CLK PCM_CLK
I2C_SCL
19 PCM_SYNC PCM_SYNC GPIO20,SPI_MOSI
20 PCM_IN PCM_IN, GPIO21,SPI_MISO
GPIO22,SPI_CS_N
21 PCM_OUT PCM_OUT
I2C_SDA
Note： For more details of AT commands about GPIO multiplex function, please refer to
document [1].

3.12 Other interface

3.12.1 Sink Current Source

The ISINK pin is VBAT tolerant and intended to drive some passive devices such as LCD
backlight, white LED, etc. Its output current can be up to 40 mA and be set by the AT command
“AT+ CLEDITST”.

Table 20: Sink current electronic characteristic

Symbol Description Min. Typ. Max. Unit

VISINK Voltage tolerant 0.5 - VBAT V
IISINK Current tolerant 0 - 40 mA

ISINK is a ground-referenced current sink. The following figure shows its reference circuit.

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VBAT

+
ISINK pin is VBAT Passive
tolerant-suitable for driving device
white LEDs
-

ISINK

MODULE

Current Controls

Figure 28: ISINK reference circuit

Note: The sinking current can be adjusted to meet the design requirement through the AT
command “AT+ CLEDITST =<0>, <value>”.The “value” ranges from 0 to 8, on behalf of the
current from 0mA to 40mA by 5mA step.

3.12.2 ADC

Module has 1 dedicated ADC pins named ADC. They are available for digitizing analog signals
such as battery voltage and so on. These electronic specifications are shown in the following table.

Table 21: ADC Electronic Characteristics

Characteristics Min. Typ. Max. Unit

Resolution – 15 – Bits
Input Range 0.1 1.7 V
Input serial resistance 1 – – MΩ
Note: “AT+CADC” can be used to read the voltage of the ADC pins, for more details, please
refer to document [1].

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4 RF Specifications

4.1 WCDMA/LTE RF Specifications

Table 22: Conducted transmission power

Frequency Power Min.

E-GSM900 33dBm ±2dB 5dBm ± 5dB
DCS1800 30dBm ±2dB 0dBm ± 5dB
E-GSM900 (8-PSK) 27dBm ±3dB 5dBm ± 5dB
DCS1800 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB
WCDMA B1 24dBm +1/-3dB <-50dBm
WCDMA B2 24dBm +1/-3dB <-50dBm
WCDMA B5 24dBm +1/-3dB <-50dBm
WCDMA B8 24dBm +1/-3dB <-50dBm
LTE-FDD B1 23dBm +/-2.7dB <-40dBm
LTE-FDD B2 23dBm +/-2.7dB <-40dBm
LTE-FDD B3 23dBm +/-2.7dB <-40dBm
LTE-FDD B4 23dBm +/-2.7dB <-40dBm
LTE-FDD B5 23dBm +/-2.7dB <-40dBm
LTE-FDD B7 23dBm +/-2.7dB <-40dBm
LTE-FDD B8 23dBm +/-2.7dB <-40dBm
LTE-FDD B12 23dBm +/-2.7dB <-40dBm
LTE-FDD B18 23dBm +/-2.7dB <-40dBm
LTE-FDD B19 23dBm +/-2.7dB <-40dBm
LTE-FDD B20 23dBm +/-2.7dB <-40dBm
LTE-FDD B25 23dBm +/-2.7dB <-40dBm
LTE-FDD B26 23dBm +/-2.7dB <-40dBm
LTE-FDD B28 23dBm +/-2.7dB <-40dBm

Table 23: Operating frequencies

Frequency Receiving Transmission

E-GSM900 925～960 MHz 880～915 MHz
DCS1800 1805～1880 MHz 1710～1785 MHz
WCDMA B1 2110 ~2170 MHz 1920 ~1980 MHz
WCDMA B2 1930~1990 MHz 1850~1910 MHz
WCDMA B5 869~894 MHz 824~849 MHz
WCDMA B8 925~960 MHz 880 ~915 MHz
LTE-FDD B1 2110 ~2170 MHz 1920 ~1980 MHz
LTE-FDD B2 1930 ~1990 MHz 1850 ~1910 MHz
LTE-FDD B3 1805 ~1880 MHz 1710 ~1785 MHz
LTE-FDD B4 2110 ~2155 MHz 1710 ~1755 MHz
LTE-FDD B5 869~894 MHz 824~849 MHz
LTE-FDD B7 2620~2690 MHz 2500 ~2570 MHz
LTE-FDD B8 925~960 MHz 880 ~915 MHz

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LTE-FDD B12 729 ~746 MHz 699 ~716 MHz
LTE-FDD B18 860 ~875 MHz 815~830 MHz
LTE-FDD B19 875 ~890 MHz 830~845 MHz
LTE-FDD B20 832 ~862 MHz 791~821 MHz
LTE-FDD B25 1930 ~1995 MHz 1850~1850 MHz
LTE-FDD B26 859 ~894 MHz 814~849 MHz
LTE-FDD B28 758 ~803 MHz 703~748 MHz
GPS 1574.4 ～1576.44 MHz -
GLONASS 1598 ～1606 MHz -
BD 1559 ～1563 MHz

Table 24: Conducted receive sensitivity

Frequency Receive sensitivity(Typical) Receive sensitivity(MAX)

E-GSM900 < -109dBm 3GPP
DCS1800 < -109dBm 3GPP
WCDMA B1 < -110dBm 3GPP
WCDMA B2 < -110dBm 3GPP
WCDMA B8 < -110dBm 3GPP
WCDMA B5 < -110dBm 3GPP
LTE FDD/TDD See table 25. 3GPP

Table 25: Reference sensitivity (QPSK)

E-UTRA 3GPP standard Test value 3GPP standard

Duplex
band 1.4 MHz 3MHz 5MHz 10MHz 10 MHz 15 MHz 20 MHz
1 - - -100 -97 -101.3 -95.2 -94 FDD
2 -102.7 -99.7 -98 -95 -101 -93.2 -92 FDD
3 -101.7 -98.7 -97 -94 -100 -92.2 -91 FDD
4 -104.7 -101.7 -100 -97 -102 -95.2 -94 FDD
5 -103.2 -100.2 -98 -95 -101 - - FDD
7 - - -98 -95 -98 -93.2 -92 FDD
8 -102.2 -99.2 -97 -94 -99.8 - - FDD
12 -101.7 -98.7 -97 -94 -101.5 - - FDD
18 - - -100 -97 -101 -95.2 - FDD
19 - - -100 -97 -101 -95.2 - FDD
20 - - -97 -94 -102 -91.2 -90 FDD
25 -101.2 -98.2 -96.5 -93.5 -100 -91.7 -90.5 FDD
26 -102.7 -99.7 -97.5 -94.5 -101 -92.7 - FDD
28 -100.2 -98.5 -95.5 TBD -93.7 -91 FDD

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4.2 GSM/WCDMA/LTE Antenna Design Guide

Users should connect antennas to Module’s antenna pads through the micro-strip line or other types
of RF trace. The trace impedance must be controlled in 50Ω. SIMCom recommends that the total
insertion loss between Module and antenna should meet the following requirements:

Table 26: Trace Loss

Frequency Loss
700MHz-960MHz <0.5dB
1710MHz-2170MHz <0.9dB
2300MHz-2650MHz <1.2dB

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching
circuit should be added. The following figure is the recommended circuit.

MAIN ANT

RF connector
Matching circuit
MAIN_ANT 45
R1 R2
GND 44 C1 C2 D1

MODULE

Figure 29: Antenna matching circuit (MAIN_ANT)

In above figure, the components R1,C1,C2 and R2 are used for antenna matching, the value of
components can only be achieved after the antenna tuning and usually provided by antenna vendor.
By default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component D1
is a TVS for ESD protection, and it is optional for users according to application environment.
The RF test connector is used for the conducted RF performance test, and should be placed as close
as to the module’s MAIN_ANT pin. The traces impedance between Module and antenna must be
controlled in 50Ω.

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Diversity antenna

Matching circuit
DIV_ANT 2
R3 R4
GND 1 C3 C4 D2

MODULE

Figure 30: Antenna matching circuit (DIV_ANT)

In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4
are 0Ωresistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is
optional for users according to application environment.
Two TVS are recommended in the table below.

Table 27: Recommended TVS

Package Part Number Vender

0201 LXES03AAA1-154 Murata
0402 LXES15AAA1-153 Murata

Note：SIMCom suggests the LTE auxiliary antenna to be kept on, since there are many high
bands in the designing of FDD-LTE. Because of the high insert loss of the RF cable and layout
lines, the receiver sensitivity of these bands above will have risk to meet the authentication
without the diversity antenna. For more details about auxiliary antenna design notice, please
refer to document [25]

4.3 GNSS

SIM7500 series merges GNSS satellite and network information to provide a high-availability
solution that offers industry-leading accuracy and performance. This solution performs well, even
in very challenging environmental conditions where conventional GNSS receivers fail, and
provides a platform to enable wireless operators to address both location-based services and
emergency mandates.

4.3.1 GNSS Technical specification

 Tracking sensitivity: -159 dBm（GPS）/-158 dBm（GLONASS）

 Cold-start sensitivity: -148 dBm
 Accuracy (Open Sky): 2.5m (CEP50)
 TTFF (Open Sky) : Hot start <1s, Cold start<35s
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 Receiver Type: 16-channel, C/A Code
 GPS L1 Frequency: 1575.42±1.023MHz
 GLONASS: 1597.5~1605.8 MHz
 Update rate: Default 1 Hz
 GNSS data format: NMEA-0183
 GNSS Current consumption : 100mA ((WCDMA/LTE Sleep ,in total on VBAT pins)
 GNSS antenna: Passive/Active antenna

Note: If the antenna is active type, the power should be given by main board, because there is no
power supply on GPS antenna pad. If the antenna is passive, it is suggested that the external
LNA should be used.

4.3.2 GNSS Application Guide

Users can adopt an active antenna or a passive antenna as GNSS signal transceiver. In this
document, all GNSS specification mentioned is from passive antenna. The following is the
reference circuit.

VDD

10 ohm

47nH
GNSS Active ANT

GND 56 Matching circuit

C1 C2 33pF
GNSS_ANT 55

GND 54 L1 L2
D3

MODULE

Figure 31: Active antenna circuit

GNSS Passive ANT

GND 56 Matching circuit
C1
GNSS_ANT 55 LNA
GND 54 L1 L2
D4

MODULE

Figure 32: Passive antenna circuit (Default)

In above figures, the components C1 and L1, L2 are used for antenna matching, the values of the
components can only be obtained after the antenna tuning and usually provided by antenna vendor.
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C2 in Figure 29 is used for DC blocking. L3 is the matching component of the external LNA, and
the value of L3 is determined by the LNA characteristic and PCB layout. Both VDD of active
antenna and V_LNA need external power supplies which should be considered according to active
antenna and LNA characteristic. LDO/DCDC is recommended to get lower current consuming by
shutting down active antennas and LNA when GNSS is not working.
LNA should apply the following requirements as table 28. LNA is also suggested to put near the
passive antenna.

Table 28: LNA requirements

Parameter Min Max Unit

Vdd 1.5 3.3 V
Idd 3 mA
LNA_EN 1.3 V
Gain 14 17 dB
VSWR 2

GNSS can be used by NMEA port. User can select NMEA as output through UART or USB.
NMEA sentences are automatic and no command is provided. NMEA sentences include GSV, GGA,
RMC, GSA, and VTG. Before using GNSS, user should configure SIM7500 series in proper
operating mode by AT command. Please refer to related document for details. SIM7500 series can
also get position location information through AT directly.

Note: GNSS is closed by default, it could be started by AT+CGPS. The AT command has two
parameters, the first is on/off, and the second is GNSS mode. Default mode is standalone mode.
AGPS mode needs more support from the mobile telecommunication network. Please refer to
document [24] for more details.

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5 Electrical Specifications

5.1 Absolute Maximum Ratings

Absolute maximum rating for digital and analog pins of Module are listed in the following table:

Table 29: Absolute maximum ratings

Parameter Min. Max. Unit

Voltage at VBAT -0.5 6.0 V
Voltage at VBUS -0.5 6.3 V
Voltage at digital pins (RESET,SPI,GPIO,I2C,UART,PCM) -0.3 2.1 V
Voltage at digital pins :SIM -0.3 3.05 V
Voltage at PWRKEY -0.3 1.8

5.2 Operating Conditions

Table 30: Recommended operating ratings

Parameter Min. Typ. Max. Unit

Voltage at VBAT 3.4 3.8 4.2 V
Voltage at VBUS 3.0 5 5.25 V

Table 31: 1.8V Digital I/O characteristics*

Parameter Description Min. Typ. Max. Unit

VIH High-level input voltage 1.17 1.8 2.1 V

VIL Low-level input voltage -0.3 0 0.63 V

VOH High-level output voltage 1.35 - 1.8 V

VOL Low-level output voltage 0 - 0.45 V

High-level output current(no

IOH - 2 mA
pull down resistor)
Low-level output current(no pull
IOL - -2 - mA
up resistor)
Input high leakage current (no
IIH - - 1 uA
pull down resistor)

Input low leakage current(no

IIL -1 - - uA
pull up resistor)
*Note: These parameters are for digital interface pins, such as SPI, GPIOs (NETLIGHT), I2C,
UART, PCM.

The operating temperature of Module is listed in the following table.

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Table 32: Operating temperature

Parameter Min. Typ. Max. Unit

Normal operation temperature -30 25 80 ℃
Extended operation temperature* -40 25 85 ℃
Storage temperature -45 25 +90 ℃
*Note: Module is able to make and receive voice calls, data calls, SMS and make
WCDMA/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from
the 3GPP specifications if the temperature is outside the normal operating temperature range
and still within the extreme operating temperature range.

5.3 Operating Mode

5.3.1 Operating Mode Definition

The table below summarizes the various operating modes of Module series products.

Table 33: Operating mode Definitions

Mode Function
In this case, the current consumption of module will be reduced to the
GSM/WCDMA / LTE
minimal level and the module can still receive paging message and
Sleep
SMS.
GSM/WCDMA / LTE Software is active. Module is registered to the network, and the
Idle module is ready to communicate.
Normal operation

Connection between two subscribers is in progress. In this case, the

GSM/WCDMA / LTE
power consumption depends on network settings such as DTX off/on,
Talk
FR/EFR/HR, hopping sequences, antenna.
Module is ready for data transmission, but no data is currently sent or
GSM/WCDMA/LTE
received. In this case, power consumption depends on network
Standby
settings.
There is data transmission in progress. In this case, power
GPRS/EDGE/WCDM
consumption is related to network settings (e.g. power control level);
A / LTE transmission
uplink/downlink data rates, etc.
AT command “AT+CFUN=0” can be used to set the module to a
minimum functionality mode without removing the power supply. In
Minimum functionality this mode, the RF part of the module will not work and the SIM card
mode will not be accessible, but the serial port and USB port are still
accessible. The power consumption in this mode is lower than normal
mode.
AT command “AT+CFUN=4” or pulling down the FLIGHTMODE
Flight mode pin can be used to set the module to flight mode without removing the
power supply. In this mode, the RF part of the module will not work

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but the serial port and USB port are still accessible. The power
consumption in this mode is lower than normal mode.
Module will go into power off mode by sending the AT command
“AT+CPOF” or by pulling down the PWRKEY pin normally. In this
Power off
mode the power management unit shuts down the power supply and
software is not active. The serial port and USB are is not accessible.

5.3.2 Sleep Mode

In sleep mode, the current consumption of module will be reduced to the minimal level, and
module can still receive paging message and SMS.
Several hardware and software conditions must be satisfied together in order to let Module enter
into sleep mode:
1. UART condition
2. USB condition
3. Software condition
Note: Before designing, pay attention to how to realize sleeping/waking function and refer to
Document [26] for more details.

5.3.3 Minimum Functionality Mode and Flight Mode

Minimum functionality mode ceases a majority function of module, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality
levels.
● AT+CFUN=0: Minimum functionality
● AT+CFUN=1: Full functionality (Default)
● AT+CFUN=4: Flight mode

If Module has been set to minimum functionality mode, the RF function and SIM card function
will be closed. In this case, the serial port and USB are still accessible, but RF function and SIM
card will be unavailable.
If Module has been set to flight mode, the RF function will be closed. In this case, the serial port
and USB are still accessible, but RF function will be unavailable.
When Module is in minimum functionality or flight mode, it can return to full functionality by the
AT command “AT+CFUN=1”.

5.4 Current Consumption

The current consumption is listed in the table below.

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Table 34: Current consumption on VBAT Pins (VBAT=3.8V)

GNSS
GNSS supply current
@ -140dBm，Tracking Typical:72mA
(AT+CFUN=0,with USB connection)
GSM Sleep mode/Idle Mode
GSM/GPRS supply current Sleep mode@ BS_PA_MFRMS=2 Typical: 2.8mA
(GNSS off，without USB connection) Idle mode@ BS_PA_MFRMS=2 Typical: 18mA
UMTS Sleep/Idle Mode
WCDMA supply current Sleep mode @DRX=9 Typical: 1.11mA
(without USB connection) Idle mode @DRX=9 Typical: 17.5mA
LTE Sleep/Idle mode
LTE supply current Sleep mode Typical: 1.56mA
(without USB connection) Idle mode Typical: 13.7mA
GSM Talk
GSM 900 @power level #5 Typical: 220mA
DCS1800 @power level #5 Typical: 162mA
UMTS Talk
WCDMA B1 @Power 23dBm Typical: 535mA
WCDMA B2 @Power 22dBm Typical: 524mA
WCDMA B5 @Power 23.48dBm Typical: 480mA
WCDMA B8 @Power 23.5dBm Typical: 530mA
GPRS
GSM 900 ( 1 Rx,4 Tx ) @power level #5 Typical: 230mA
DCS1800 ( 1 Rx,4 Tx ) @power level #0 Typical: 195mA
GSM 900 ( 3Rx, 2 Tx ) @power level #5 Typical: 370mA
DCS1800 ( 3Rx, 2 Tx ) @power level #0 Typical: 275mA
EDGE
GSM 900 ( 1 Rx,4 Tx ) @power level #8 Typical: 400mA
DCS1800 ( 1 Rx,4 Tx ) @power level #2 Typical: 300mA
GSM 900 ( 3Rx, 2 Tx ) @power level #8 Typical: 320mA
DCS1800 ( 3Rx, 2 Tx ) @power level #2 Typical: 230mA
HSDPA Data
WCDMA B1 @Power 23 Typical: TBD
WCDMA B2 @Power 24dBm Typical: TBD
WCDMA B5 @Power 23.64dBm Typical: 426mA
WCDMA B8 @Power 23 Typical: TBD
LTE Data
@5 MHz 22.2dBm Typical: 482mA
LTE-FDD B1 @10 MHz 22.7dBm Typical: 489mA
@20 MHz 22.38dBm Typical: 534mA
@5 MHz 22.2dBm Typical: 589mA
LTE-FDD B2 @10 MHz 22.7dBm Typical: 577mA
@20 MHz 22.38dBm Typical: 626mA
@5 MHz 22.2dBm Typical: 479mA
LTE-FDD B3 @10 MHz 22.7dBm Typical: 491mA
@20 MHz 22.38dBm Typical: 538mA

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@5 MHz 23.05dBm Typical: 519mA
LTE-FDD B4 @10 MHz 23.04dBm Typical: 556mA
@20 MHz 22.83dBm Typical: 600mA
@3 MHz 24dBm Typical: 488.5mA
LTE-FDD B5 @5 MHz 23.83dBm Typical: 482.5mA
@10 MHz 23.91dBm Typical: 496.5mA
@5 MHz 22.64dBm Typical: 593mA
LTE-FDD B7 @10 MHz 22.66dBm Typical: 611mA
@20 MHz 24.5dBm Typical: 650mA
@5 MHz 22.2dBm Typical: 476mA
LTE-FDD B8
@10 MHz 22.7dBm Typical: 481mA
@5 MHz 22.69dBm Typical: 516mA
LTE-FDD B12
@10 MHz 22.9dBm Typical: 512mA
@5 MHz 23.3dBm Typical: 477mA
LTE-FDD B18
@10 MHz 23.5dBm Typical: 482mA
@5 MHz 23.6dBm Typical: 412mA
LTE-FDD B19
@10 MHz 23.4dBm Typical: 450mA
@5 MHz 24dBm Typical: 591mA
LTE-FDD B20 @10 MHz 24dBm Typical: 526mA
@20 MHz 23.9dBm Typical: 670mA
LTE-FDD B25
@5 MHz 23.6dBm Typical: 433mA
LTE-FDD B26
@10 MHz 23.4dBm Typical: 480mA
@5 MHz 23.88dBm Typical: 700mA
LTE-FDD B28 @10 MHz 23.75dBm Typical: 608mA
@20 MHz 24.5dBm Typical: 700mA

5.5 ESD Notes

Module is sensitive to ESD in the process of storage, transporting and assembling. Especially,
Module is mounted on the users’ mother board, The ESD components should be placed beside the
connectors which human body might touch, such as SIM card holder, audio jacks, switches and
keys, etc. The following table shows the Module ESD measurement performance without any
external ESD component.

Table 35: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)

Part Contact discharge Air discharge

GND +/-6K +/-12K
VBAT +/-5K +/-10K
Antenna port +/-5K +/-10K
USB +/-4K +/-8K
UART +/-4K +/-8K
PCM +/-4K +/-8K
Other PADs +/-3K +/-6K

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6 SMT Production Guide

6.1 Top and Bottom View of Module

Figure 33: Top and bottom view of Module

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6.2 Label Information

Figure 34: Label Information

Table 36: The Description of Label Information

No. Description
A LOGO
B No.1 Pin
C Project Name
D Product Code
E Serial Number
F International Mobile Equipment Identity
G QR code

6.3 Typical SMT Reflow Profile

SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.

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Figure 35: The ramp-soak-spike Reflow Profile of Module

Note: For more details about secondary SMT, please refer to the document [21].

6.4 Moisture Sensitivity Level (MSL)

Module is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033.
If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying
equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.

Table 37: Moisture Sensitivity Level and Floor Life

Moisture Sensitivity Level Floor Life (out of bag) at factory ambient≤30°C/60% RH or as

(MSL) stated
1 Unlimited at ≦30℃/85% R H
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.

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6.5 Stencil Foil Design Recommendation

The recommended thickness of stencil foil is 0.13mm.

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7 Packaging
Module module support tray packaging.

Figure 36: Packaging introduce

Module tray drawing：

Figure 37: Module tray drawing introduce

Table 38: Tray size

Length（±3mm） Width（±3mm） Module number

242.0 161.0 15

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Small carton drawing：

Figure 38: Small carton drawing introduce

Table 39: Small Carton size

Length（±10mm） Width（±10mm） Height（±10mm） Module number

270 180 120 15*20=300

Big carton drawing：

Figure 39: Big carton drawing introduce

Table 40: Big carton size

Length（±10mm） Width（±10mm） Height（±10mm） Module number

380 280 280 300*4=1200

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Appendix

A. Reference Design

GNSS Antenna

R102 0R
45
MAIN_ANT
NC NC
C106 C107 44 55
GND GNSS_ANT
46 GND L101
C108
L102
53 NC
33pF NC
47 GND Div Antenna
GND
GND 54
Power supply
34 56
VBAT GND
VBAT 33 VBAT R101 0R
DIV_ANT 2
C101 C102 C103 35 GND
220uF 100uF 1uF

32 GND C104 C105

31 GND 1 NC
GND NC

GND 3
30 POWERKEY
Turn on/off pulse
R103 4.7K

R104 47K
SIM7500x R105
LED VBAT

300R Power supply

R106 10K
Reset pulse NETLIGHT 52
C114 100NF Network
Status
24
RESET R107 10K

38
UART_TXD TXD
39 C104
UART_RXD RXD 4.7uF
41
UART_CTS CTS
36
UART_RTS RTS 9
42 USB_VBUS USB_VBUS
UART_RI RI 7
37 USB_DN USB_DN
UART_DCD DCD 8
40 USB_DP USB_DP
UART_DTR DTR

If USB interface is used， Connect

USB_VBUS to 3.0V-5.25V

SCL 4
I2C_SCL
SDA 5 I2C_SDA

27
ISINK
12
SIM_DET
ADC 25
C115 22PF C116 22PF C117 22PF
R120 22R 10 GPIO_1 26
SIM_DATA
GPIO_37 48
SIM_DATA SIM_CLK R121 22R 11 SIM_CLK
SIM_RST R122 22R
13 49
SIM_VDD
SIM_RST FlightMode
14
SIM_VDD STATUS 50
DBG_TXD 51
C109 TVS
100nF ESDA6V1W5

6 GND
15 GND
16 20 Audio CODEC Chip
GND PCM_IN
22 19 or
GND PCM_SYNC
28 GND 21 DSP
29 PCM_OUT
GND 18
43 GND PCM_CLK
I2S_MCLK 17

C115 100pF

L11_1V8 23

Figure 40: Reference design

Note: 1.The UART port suggests to be used by isolated circuit.

2. If use SIM7500E Module, C115 should use 220pF.
3. C115 must be mounted.
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B. Coding Schemes and Maximum Net Data Rates over Air Interface

Table 41: Coding schemes and maximum net data rates over air interface

Multislot definition(GPRS/EDGE)
Slot class DL slot number UL slot number Active slot number
1 1 1 2
2 2 1 3
3 2 2 3
4 3 1 4
5 2 2 4
6 3 2 4
7 3 3 4
8 4 1 5
9 3 2 5
10 4 2 5
11 4 3 5
12 4 4 5
GPRS coding scheme Max data rata（4 slots） Modulation type
CS 1 = 9.05 kb/s / time slot 36.2 kb/s GMSK
CS 2 = 13.4 kb/s / time slot 53.6 kb/s GMSK
CS 3 = 15.6 kb/s / time slot 62.4 kb/s GMSK
CS 4 = 21.4 kb/s / time slot 85.6 kb/s GMSK
EDGE coding scheme Max data rata（4 slots） Modulation type
MCS 1 = 8.8 kb/s/ time slot 35.2 kb/s GMSK
MCS 2 = 11.2 kb/s/ time slot 44.8 kb/s GMSK
MCS 3 = 14.8 kb/s/ time slot 59.2 kb/s GMSK
MCS 4 = 17.6 kb/s/ time slot 70.4 kb/s GMSK
MCS 5 = 22.4 kb/s/ time slot 89.6 kb/s 8PSK
MCS 6 = 29.6 kb/s/ time slot 118.4 kb/s 8PSK
MCS 7 = 44.8 kb/s/ time slot 179.2 kb/s 8PSK
MCS 8 = 54.4 kb/s/ time slot 217.6 kb/s 8PSK
MCS 9 = 59.2 kb/s/ time slot 236.8 kb/s 8PSK
HSDPA device category Max data rate（peak） Modulation type
Category 1 1.2Mbps 16QAM,QPSK
Category 2 1.2Mbps 16QAM,QPSK
Category 3 1.8Mbps 16QAM,QPSK
Category 4 1.8Mbps 16QAM,QPSK
Category 5 3.6Mbps 16QAM,QPSK
Category 6 3.6Mbps 16QAM,QPSK
Category 7 7.2Mbps 16QAM,QPSK

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Category 8 7.2Mbps 16QAM,QPSK
Category 9 10.2Mbps 16QAM,QPSK
Category 10 14.4Mbps 16QAM,QPSK
Category 11 0.9Mbps QPSK
Category 12 1.8Mbps QPSK
Category 13 17.6Mbps 64QAM
Category 14 21.1Mbps 64QAM
Category 15 23.4Mbps 16QAM
Category 16 28Mbps 16QAM
Category 17 23.4Mbps 64QAM
Category 18 28Mbps 64QAM
Category 19 35.5Mbps 64QAM
Category 20 42Mbps 64QAM
Category 21 23.4Mbps 16QAM
Category 22 28Mbps 16QAM
Category 23 35.5Mbps 64QAM
Category 24 42.2Mbps 64QAM
HSUPA device category Max data rate（peak） Modulation type
Category 1 0.96Mbps QPSK
Category 2 1.92Mbps QPSK
Category 3 1.92Mbps QPSK
Category 4 3.84Mbps QPSK
Category 5 3.84Mbps QPSK
Category 6 5.76Mbps QPSK
LTE-FDD device category
Max data rate（peak） Modulation type
(Downlink)
Category 1 10Mbps QPSK/16QAM/64QAM
Category 2 50Mbps QPSK/16QAM/64QAM
Category 3 100Mbps QPSK/16QAM/64QAM
Category 4 150Mbps QPSK/16QAM/64QAM
LTE-FDD device category
Max data rate（peak） Modulation type
(Uplink)
Category 1 5Mbps QPSK/16QAM
Category 2 25Mbps QPSK/16QAM
Category 3 50Mbps QPSK/16QAM
Category 4 50Mbps QPSK/16QAM

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C. Related Documents

Table 42: Related documents

SN Title Description
SIM7500_SIM7600 Series_AT
[1] SIM7500_SIM7600 Series_AT Command Manual_V1.xx
Command Manual_V1.xx
ITU-T Draft new
[2] Serial asynchronous automatic dialing and control
recommendationV.25ter
Digital cellular telecommunications (Phase 2+); AT command
[3] GSM 07.07
set for GSM Mobile Equipment (ME)
[4] GSM 07.10 Support GSM 07.10 multiplexing protocol
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment
[5] GSM 07.05
(DTE – DCE) interface for Short Message Service (SMS)
and Cell Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+);
Specification of the SIM Application Toolkit for the
[6] GSM 11.14
Subscriber Identity Module – Mobile Equipment (SIM – ME)
interface
Digital cellular telecommunications system (Phase 2+);
[7] GSM 11.11 Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+);
[8] GSM 03.38
Alphabets and language-specific information
Digital cellular telecommunications system (Phase 2) ；
[9] GSM 11.10 Mobile Station (MS) conformance specification； Part 1:
Conformance specification
Digital cellular telecommunications system (Release 5);
[10] 3GPP TS 51.010-1
Mobile Station (MS) conformance specification
Electromagnetic Compatibility (EMC) for mobile terminals
[11] 3GPP TS 34.124
and ancillary equipment.
Electromagnetic Compatibility (EMC) for mobile terminals
[12] 3GPP TS 34.121
and ancillary equipment.
Technical Specification Group Radio Access Network;
[13] 3GPP TS 34.123-1 Terminal conformance specification; Radio transmission and
reception (FDD)
User Equipment (UE) conformance specification; Part 3:
[14] 3GPP TS 34.123-3
Abstract Test Suites.
Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
IMT-2000. Third Generation cellular networks; Part 2:
[15] EN 301 908-02 V2.2.1
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article
3.2 of the R&TTE Directive
Electromagnetic compatibility and Radio Spectrum Matters
(ERM); Electromagnetic Compatibility (EMC) standard for
[16] EN 301 489-24 V1.2.1 radio equipment and services; Part 24: Specific conditions for
IMT-2000 CDMA Direct Spread (UTRA) for Mobile and
portable (UE) radio and ancillary equipment
[17] IEC/EN60950-1(2001) Safety of information technology equipment (2000)
[18] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5);

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Mobile Station (MS) conformance specification
[19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria
Directive of the European Parliament and of the Council of
27 January 2003 on the restriction of the use of certain
[20] 2002/95/EC
hazardous substances in electrical and electronic equipment
(RoHS)
[21] Module Module secondary SMT Guidelines
secondary-SMT-UGD-V1.xx
[22] SIM7X00 SIM7X00 Series_UART_Application Note
Series_UART_Application
Note_V1.xx
SIM7X00 Series_USB
SIM7X00 Series_USB AUDIO_Application Note
[23] AUDIO_Application
Note_V1.xx
[24] Antenna design guidelines for Antenna design guidelines for diversity receiver system
diversity receiver system
[25] SIM7X00 Series_Sleep Mode_ SIM7X00 Series_Sleep Mode_ Application Note
Application Note_V1.xx

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D. Terms and Abbreviations

Table 43: Terms and Abbreviations

Abbreviation Description
ADC Analog-to-Digital Converter
ARP Antenna Reference Point
BER Bit Error Rate
BTS Base Transceiver Station
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DRX Discontinuous Reception
DSP Digital Signal Processor
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
EVDO Evolution Data Only
FCC Federal Communications Commission (U.S.)
FD SIM fix dialing phonebook
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
GNSS Global Navigation Satellite System
HR Half Rate
HSPA High Speed Packet Access
I2C Inter-Integrated Circuit
IMEI International Mobile Equipment Identity
LTE Long Term Evolution
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MT Mobile Terminated
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCS Personal Communication System, also referred to as GSM 1900
RF Radio Frequency
RMS Root Mean Square (value)
RTC Real Time Clock
SIM Subscriber Identification Module
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SMS Short Message Service
SPI serial peripheral interface
SMPS Switched-mode power supply
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
TX Transmit Direction
UART Universal Asynchronous Receiver & Transmitter
VSWR Voltage Standing Wave Ratio
SM SIM phonebook
NC Not connect
EDGE Enhanced data rates for GSM evolution
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
ZIF Zero intermediate frequency
WCDMA Wideband Code Division Multiple Access
VCTCXO Voltage control temperature-compensated crystal oscillator
SIM Universal subscriber identity module
UMTS Universal mobile telecommunications system
UART Universal asynchronous receiver transmitter

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E. Safety Caution

Table 44: Safety caution

Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use
of mobiles. Switch the cellular terminal or mobile off, medical equipment may be
sensitive and not operate normally due to RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to
prevent interference with communication systems. Forgeting to think much of these
instructions may impact the flight safety or offend local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any
electrical equipment in potentially explosive atmospheres can constitute a safety
hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios,
computers or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, especially with a
mobile fee or an invalid SIM card. While you are in this condition and need emergent
help, please remember to use emergency calls. In order to make or receive calls, the
cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to
deactivate those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.

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Contact us:
Shanghai SIMCom Wireless Solutions Ltd.
Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R. China
200335
Tel：+86 21 3235 3300
Fax：+86 21 3235 3020
URL：www.simcomm2m.com

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