XXX © IEC 60068-2-83 Ed.

1 :200X –1– XXX © CEI:200X

2CD draft 2008-05-25

CONTENTS

1 General........................................................................................................................5
1.1 Scope .................................................................................................................5
1.2 Objective .............................................................................................................5
2 Normative references....................................................................................................5
3 Terms and definitions ...................................................................................................6
4 Test .............................................................................................................................6
4.1 General description..............................................................................................6
4.2 Test methods.......................................................................................................6
5 Solder paste.................................................................................................................7
6 Preconditioning ............................................................................................................7
7 Temperature profile method ..........................................................................................7
7.1 Equipment ...........................................................................................................7
7.2 Test jig plate........................................................................................................8
7.3 Preparation .........................................................................................................8
7.3.1 Solder Paste ............................................................................................8
7.3.2 Test jig plate ............................................................................................8
7.3.3 Specimen Holder ......................................................................................9
7.4 Test condition ......................................................................................................9
7.4.1 Test temperature ......................................................................................9
7.4.2 Feed of solder paste and immersion condition............................................9
7.4.3 Conditions for ascend and descend of the test equipment.........................10
7.5 Test procedure ..................................................................................................10
7.6 Presentation of the result ...................................................................................11
7.7 Required items of the test ..................................................................................12
8 Quick heating Method .................................................................................................12
8.1 Equipment .........................................................................................................12
8.2 Test jig plate......................................................................................................13
8.3 Preparation .......................................................................................................14
8.3.1 Solder paste...........................................................................................14
8.3.2 Test jig plate ..........................................................................................14
8.3.3 Specimen Holder ....................................................................................14
8.4 Test Condition ...................................................................................................15
8.4.1 Test Temperature ...................................................................................15
8.4.2 Feed of Solder Paste and Immersion Condition ........................................15
8.4.3 Conditions for ascend and descend of the test equipment.........................16
8.5 Presentation of the result ...................................................................................17
8.6 Required test items ............................................................................................17
9 Items to be specified in the relevant specification .........................................................18
Annex A (Normative) Specifications of the flux ...................................................................19
Annex B (Normative) Test equipment for the temperature profile method .............................20
Annex C (Normative) Reading of the output data and correction of the result in the
temperature profile test ...............................................................................................21
Annex D (Normative) Equipment for the quick heating method ............................................24
XXX © IEC 60068-2-83 Ed.1 :200X –2– XXX © CEI:200X
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Annex E (Normative) Reading of the output data and correction of the result in the
quick heating test .......................................................................................................25
XXX © IEC 60068-2-83 Ed.1 :200X –3– XXX © CEI:200X
2CD draft 2008-05-25
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

ENVIRONMENTAL TESTING –

Part 2-83: Tests – Test Tf : Solderability testing

of electronic components for surface mounting devices (SMD)
by the wetting balance method using lead-free solder paste

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
10) The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed that
compliance with this document may involve the use of a patent.
IEC takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences under reasonable
and non-discriminatory terms and conditions with applicants throughout the world. In this respect, the statement
of the holder of this patent right is registered with IEC. Information may be obtained from:

JP Patent 2630712 Testing method of characteristics of solder paste and the equipment for the test.
name of holder of patent right : Malcom Co., Ltd
address: 4-15-10 Honmachi, Shibuya-ku, Tokyo, 151-0071,Japan

JP Patent 3027441 High temperature solders.

name of holder of patent right : Senju Metal Industry Co., Ltd.
address: Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan
name of holder of patent right : Matsushita Electric Industrial Co., Ltd.
address: 1006, Kadoma, Kadoma City, Osaka 571-8501, Japan
XXX © IEC 60068-2-83 Ed.1 :200X –4– XXX © CEI:200X
2CD draft 2008-05-25

JP Patent 3153884 Soldering equipment for solder paste.

name of holder of patent right : Sony Corporation
address: 6-7-35 Kitashinagawa, Shinagawa-ku, Tokyo 141-0001, Japan
name of holder of patent right : Tarutin Kester Co., Ltd.
address: 2-20-11 Yokokawa, Sumida-ku, Tokyo, 130-0003, Japan

JP Patent 3552061 Equipment for solderability test.

name of holder of patent right : Sony Corporation
address: 6-7-35 Kitashinagawa, Shinagawa-ku, Tokyo 141-0001, Japan
name of holder of patent right : Tarutin Kester Co., Ltd.
address: 2-20-11 Yokokawa, Sumida-ku, Tokyo, 130-0003, Japan

JP Pat. Appl. No. Heisei-5-256383 3498100

Testing method of solderability and the equipment used for the test, and the micro-furnace used for the
test.
Patent applicant: Sony Corporation
Address: 6-7-35 Kitashinagawa, Shinagawa-ku, Tokyo 141-0001, Japan
Patent applicant: Tarutin Kester Co., Ltd.
Address: 2-20-11 Yokokawa, Sumida-ku, Tokyo, 130-0003, Japan

International Standard IEC 60068-2-83 has been prepared by IEC technical committee 91:

The text of this standard is based on the following documents:

FDIS Report on voting

XX/XX/FDIS XX/XX/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date 1) indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be

• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

———————
1) The National Committees are requested to note that for this publication the maintenance result date is ....
XXX © IEC 60068-2-83 Ed.1 :200X –5– XXX © CEI:200X
2CD draft 2008-05-25
ENVIRONMENTAL TESTING –
Part 2-83: Tests – Test Tf: Solderability test
of electronic components for surface mounting devices (SMD)
by the wetting balance method using solder paste

1 General

1.1 Scope

This part of IEC 60068 outlines test Tf, solderability test for surface mounting devices (SMD)
by wetting balance method using solder paste.

This standard provides two (2) methods for quantitatively evaluation of the wettability of the
metallic terminations or metallized terminations of SMD, the temperature profile method and Comment [ 1]: UK1
the quick heating method.

Note that the test results are depening on the size, shape and thermal mass of the specimens.

Note1 – This Standard is applicable to the components shown in Table 3 and Table 5, but may be applicable to the
other components which are not evaluated.

Note2 - Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC Comment [ 2]: UK2
60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting
balance evaluation using solder bath and solder globule method.

1.2 Objective

Test methods are intended for evaluation purpose. The result may be used for
acceptance/rejection upon agreement between the trading partners.

2 Normative references

The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.

IEC 60068-1, Environmental testing – Electricity and Electronics – General rules

IEC 60068-2-20(91/764/FDIS), Environmental testing - Part 2-20: Tests - Test T: Test
methods for solderability and resistance to soldering heat of leaded devices
IEC 60068-2-54:2006, Environmental testing - Part 2-54: Tests - Test Ta: Solderability
testing of electronic components by the wetting balance method
IEC 60068-2-58:2004, Environmental testing - Part 2-58: Tests - Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60194, Printed Board Design, Manufacture and Assembly - Terms and Definition
IEC 61190-1-1:2002, Attachment materials for electronic assemblies: Part 1-1:
Requirements for soldering fluxes for high quality interconnections in electronic
assembly
IEC 61190-1-2:2007, Attachment materials for electronic assembly - Part 1-2:
Requirements for soldering paste for high-quality interconnects in electronics assembly
IEC 61190-1-3:2007, Attachment materials for electronic assembly - Part 1-
3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications
XXX © IEC 60068-2-83 Ed.1 :200X –6– XXX © CEI:200X
2CD draft 2008-05-25
IEC 61189-5:2006, Test methods for electrical materials, interconnection structures and
assemblies - Part 5: Test methods for printed board assemblies

3 Terms and definitions

For the purpose of this standard, in addition to the definitions given in IEC 60068-1,
IEC 60068-2-20, IEC 60068-2-58, IEC 60194, and IEC 61190-1-3 the following principal
definitions apply.

3.1
wettability
ease with which a metal or metal alloy can be wetted by molten solder.

3.2
solder paste
finely divided particles of solder, with additives to promote wetting and to control viscosity,
tackiness, slumping, drying rate, etc, that are suspended in a cream flux.

3.3
wetting balance method
method to measure wetting performance and solderability by measuring vertical force
(difference with surface tension and buoyancy) to the specimen and recording as a function of
time, when the specimen is immersed into molten solder.

3.4
starting point of heating
time of the start of temperature rise by heating the solder paste applied to a testing jig

3.5
zero line
line extended to the time axis of the force experienced by the specimen as indicated by the
test equipment (force sensor) when the specimen is taken out from the molten solder after Comment [ 3]: DE2:
end of measurement.

4 Test
Comment [ 4]: UK4
4.1 General description

The specimen is held on a holder suitable to the specimen and is suspended from sensitive
balance. The specimen is immersed into solder paste applied onto the test jig plate, then
solder past is heated to melt. The resultant of the vertical forces of buoyancy and surface
tension (here after, referred as “acting force”) acting upon the immersed specimen by force
sensor and converted into a signal which is continuously recorded or monitored as a function
of time on recorder. The evaluation of the wetting force is made by comparison of the forces
experienced by specimens of the same shape and sizes.
Comment [ 5]: UK5
4.2 Test methods

There are two methods as described below. The choice of the method shall be specified in
the relevant specification.

a) Temperature profile method: Solder paste is melted using a similar temperature profile
used in production and the wettability of the electrodes of a component is evaluated.
b) Quick heating method: The wettability of electrodes of a component is evaluated while the
solder paste is melted in a rapid temperature rise.
XXX © IEC 60068-2-83 Ed.1 :200X –7– XXX © CEI:200X
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5 Solder paste

The solder paste used in this test is given in Table 1. The detailed specification of the flux is
given in Table A.1.

Table 1 - Solder paste description

Alloy Flux Powder size Nominal metal content Viscosity d

Type
designation a classification b type c (wt%) (Pa-s)

SAC Sn96,5Ag3Cu0,5 ROM1 3 88 180 ± 50

Sn-Pb Sn63Pb37 ROM1 3 90 200 ± 50

Shape of the solder powder shall be spherical.
a See IEC 61190-1-3, Annex B.
b See IEC 61190-1-1, Table 1.
c See IEC 61190-1-2, Table 3.
d The viscosity of the paste flux shall be evaluated in accordance with IEC 61189-5 test method 5X02.

6 Preconditioning

Unless otherwise specified in the detailed specification of the component, the test shall be
made on the specimens as received and care shall be taken not to contaminate the
specimens by fingers and other items. The specimen may be immersed in organic solvent at
room temperature to remove possible contamination such as grease attached to the surface if
the preconditioning is specified in the specification. No other method shall be used to clean
the specimen. The specimen thus cleaned may be dried in air.

When accelerated ageing is prescribed by the relevant specification, one of the methods of
4.1.4 (Ageing 1) of IEC 60068-2-20 shall be used. The aging condition shall be specified in
the relevant specification.

7 Temperature profile method

7.1 Equipment

The equipment for the temperature profile method consists of systems of measurement,
heating, and mechanical lift. An example of the measurement system is shown in Figure 1.
Requirements to the system are given in Annex B.

a) The measuring system shall consist of a force sensor that can measure a force generated
in the vertical direction to the specimen, mechanical-electrical signal converter, and
recording equipment.
b) The heating system shall realize the temperature profile specified in 7.4.1.
c) The lift system shall consist of a lift mechanism which can ascend and descend with the
conditions specified in 7.4.3.
XXX © IEC 60068-2-83 Ed.1 :200X –8– XXX © CEI:200X
2CD draft 2008-05-25

Sensor
Transducer Recorder

Specimen
Heating Housing
unit Solder paste
Test jig plate

Lift Controller

Figure 1- Example of the system for temperature profile method test equipment

7.2 Test jig plate

The test jig plate shall be as specified in Table 2.

Table 2 - Specification of the test jig plate of temperature profile method

Item Specification of the test jig plate

Material oxygen-free phosphate copper
Shape square or rectangular plate
Size 15 mm to 35 mm for each side
Thickness 0,3 mm ± 0,03 mm

Warp ± 0,05 mm (the longer side for rectangular shape)

7.3 Preparation

7.3.1 Solder Paste

Use solder paste that has been stored in a sealed container and stored in an environment of
dark place and below 10 °C. The procedure of the use of solder paste shall be in the following
way.

a) Confirm the limiting date of use of the solder paste.

b) Take the solder paste from the dark and cool storage place and leave it in the testing
environment until the temperature of the solder paste reaches to nearly room temperature.
c) Open the cap of the container of the solder paste and confirm that the solder and solvent
are not separated or observable change in quality.
d) Stir the solder paste thoroughly until the colour tone of the solder paste becomes uniform
on the surface and inside of the paste.
e) Take a required amount of solder paste from the container and then return the container
to the dark and cool storage place.

7.3.2 Test jig plate

The test jig plate used in the test shall be the plate stored in a sealed container after cleaning
the plate using acid, or plate cleaned using acid immediately before the test. The plates
taken out by opening a sealed container shall be used for tests on the day of opening of the
sealed container but shall not be carried over to the next day. A new jig plate shall be used
for each test.
XXX © IEC 60068-2-83 Ed.1 :200X –9– XXX © CEI:200X
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7.3.3 Specimen Holder

The specimen holder is usually contaminated by creeping of flux used in a test. A specimen
holder shall be cleaned using neutral organic solvent. It is desirable to use ultrasonic
agitation in cleaning.

7.4 Test condition

7.4.1 Test temperature

The test temperature is the temperature of the jig used in the test. The test jig plate shall be
processed using the temperature profile given in Figure 2.

250
T2
3,0 K/s ± 0,3 K/s
Temperature °C

200
Pre-heating at T 1
150
t1
Arbitrary
100

3,0 K/s ± 0,3 K/s

50 °C or less when start measurement

Time

Symbol SAC type * Sn-Pb type *

T1 160 °C ± 5 °C 150 °C ± 5 °C
t1 80 s ± 5 s 80 s ± 5 s
T 2 ** 245 °C ± 3 °C 220 °C ± 3 °C

* Refer to Table 1

** T 2 is the preset temperature of the heating unit. Jig

temperature may not reach the preset temperature.

Figure 2 – The temperature profile of the temperature profile method.

7.4.2 Feed of solder paste and immersion condition

The recommended amount of solder paste and the condition of immersion of a specimen into
the solder paste used in the soldering test are given in Table 3. The component not specified
in Table 3, test conditions shall be specified in the relevant specification or agreed upon
between the trading partners.
XXX © IEC 60068-2-83 Ed.1 :200X – 10 – XXX © CEI:200X
2CD draft 2008-05-25

Table 3 – Recommended test conditions of the temperature profile method for rectangular Comment [ 6]: DE3
SMD

Amount of solder Angle and

Types and sizes of paste applied b, c direction of
Comment [ 7]: UK9
Immersion depth c specimen
specimens a immersing into
diameter thickness
solder paste
1005 (0402) Horizontal
Capacitors
1608 (0603) Rectangular SMD
3 mm 0,20 mm
1005 (0402)
Resistors
1608 (0402)
0,05 mm
2012 (0805)
Capacitors
3216 (1206)
5 mm 0,30 mm Solder paste
2012 (0805)
Resistors
3216 (1206)
a Designation of the size is, for example, 1005 means a specimen with a length of 1,0 mm and width
of 0,5 mm. In parentheses, dimensions are expressed in Imperial.
b The amount of applied solder paste is specified according to the size of a specimen.
c The amount of solder paste and immersion depth are the target values.

7.4.3 Conditions for ascend and descend of the test equipment

The specimen is once withdrawn from the solder paste during temperature ramp-up to
separate the cohesion force of the solder paste and wetting force of the specimen to solder.
The timing of separation shall be 0,5 s prior to the time that the acting force becomes zero
expected from the gradient after acting force reached to a peak. After 0,5 s, the specimen
separated from the solder paste, and then the specimen shall be immersed again to the Comment [ 8]: DE4
solder paste returned to the previous position.

a) The speed of withdrawal and re-immersion of the specimen to and from the solder paste
shall be 5 mm/s ± 0,5 mm/s.
b) The duration for the second immersion of the specimen to the withdrawal of the specimen
from the solder shall be 10 s ± 0,5 s. Comment [ 9]: UK14

7.5 Test procedure

a) Apply a specified amount of solder paste in 7.4.2 to a test jig plate whose surface is
cleaned. Use a metal mask and a squeegee to apply solder paste to a jig plate as shown Comment [ 10]: UK15
in Figure 3.

Direction of squeeze
Squeegee
Metal mask

Test jig plate

Figure 3 - Example of applying solder paste to a test jig plate

b) Fix the specimen on the holder designed to realize the immersion angle specified in 7.4.2.
Place the holder on the test jig plate at the centre of the plate.
c) Immerse the specimen into the solder paste. The condition of immersion of the specimen
is specified in 7.4.2. Comment [ 11]: UK16

d) Adjust the output of the force sensor to zero before the specimen is immersed into the
solder paste Comment [ 12]: UK17

e) Heat the jig plate to melt the solder paste in accordance with the temperature profile
specified in Figure 2.
 XXX © IEC 60068-2-83 Ed.1 :200X – 11 – XXX © CEI:200X
2CD draft 2008-05-25
f) The specimen shall be withdrawn from the solder paste to separate the cohesion force of
the solder paste and wetting force of the specimen to the solder. Immerse the specimen Comment [ 13]: UK18
again into the solder paste immediately before the temperature of solder reaches to the
liquidus temperature (approximately 217 °C for SAC type solder paste and approximately
183 °C for Sn-Pb type solder paste).
g) Withdraw the specimen from the molten solder paste when measurement is finished. The
recorder shall record the signal of the force from the transducer from t 1 to t 4 as specified
in Figure 4. Measurement finishes when the force reaches to a stable state.
Comment [ 14]: UK19
7.6 Presentation of the result

The recorder records the force acted to the specimen in the vertical direction. The force
acted to the upper direction (pushing force or buoyancy) is recorded as a negative value, and
the force acted to downward to the specimen (wetting force) is recorded as a positive value.

A typical shape of the output signal obtained as the sample temperature is raised according to
the specified temperature profile is shown in Figure 4. The meaning and correction of the
data different from the shape shown in Figure 4 are given in Annex C.

The data for the period between t o and t 1 are not used in the evaluation of wetting force of the
specimen.

NOTE - The upward force as shown in Figure 4 with a dotted line between A’ and B is the coagulation force
when the solder paste melts.

t0 t1 t 2’ t3 t4
Wetting time T 2
t2
Wetting time T 1
Positive

D E
C’
C
86 %Fmax
Acting force

2/3Fmax

Fmax

Start of heating
Fend

F Zero line
A A’ B

Time (s)
10 s ± 0,5 s
Negative

Figure 4-Typical output shape of signal in the temperature profile method

Where:
t 0 : Time to start to heat the test jig (A in Figure 4).
t 1 : Time to start wetting of solder to the specimen (B in Figure 4).
t 2 : The time the wetting force reaches to 2/3 of the maximum wetting force (C in Figure 4).
t 2 ': The time the wetting force reaches to 86 % of the maximum wetting force (C’ in
Figure 4).
t 3 : The time to withdraw the specimen after measurement is complete (E in Figure 4).
XXX © IEC 60068-2-83 Ed.1 :200X – 12 – XXX © CEI:200X
2CD draft 2008-05-25
t 4 : The time the force reaches to a stable state after the specimen is withdrawn from the jig
plate (F in Figure 4).
T 1 : T1 is calculated from T 1 = t 2 − t 1 , that is the time the wetting force reaches to 2/3 of the
maximum wetting force minus the time to start wetting of the specimen.
T 2 : T 2 is the wetting time. T 2 = t 2 ’ − t 1 , that is the time the wetting force reaches to 86 % of
the maximum wetting force minus the time to start wetting of the specimen.
F max : The maximum wetting force. The maximum force obtained in the measurement, the
value from the zero line (D in Figure 4).
F end : The wetting force obtained at the end of the test, the value from the zero line (E in
Figure 4).

7.7 Required items of the test

The requirement for the wetting force in the temperature profile method is to specify at least
one of the following items.

a) Wetting time: T 1 and/or T 2

b) Maximum wetting force: F max
c) Wetting stability: S b ; The ratio of the final wetting force (F end ) and the maximum wetting
force (F max ).

NOTE - Wetting stability is calculate from S b =F end /F max .

8 Quick heating Method

8.1 Equipment

The equipment used for the quick heating method consists of measurement, heating and lift
system as shown in Figure 5. The detailed requirements to the equipment are specified in
Annex D.

a) The measuring system consists of the force sensor that can measure the force vertically
acted on a specimen, signal transducer and a recorder.
b) The heating system shall be capable of realizing the control of the temperature profile as
specified in 8.4.1.
c) The lift system shall be capable of carrying out immersion and withdraw of the specimen
as specified in 8.4.3. Comment [ 15]: UK21
XXX © IEC 60068-2-83 Ed.1 :200X – 13 – XXX © CEI:200X
2CD draft 2008-05-25

Sensor Transducer Recorder

Housing
Holding jig of a
test jig plate Specimen
Solder paste

Test jig plat

Heating
bath

Lift Lift Controller

Figure 5 - Example of the system for quick heating method test equipment

8.2 Test jig plate

The test jig plate shall be as specified in Table 4.

Table 4 - Specification of the test jig plate of quick heating method

Item Specification of the test jig

Material Oxygen-free phosphate copper
Shape Drawed rectangular plate Comment [ 16]: UK23
2
Dimensions Less than 30 mm one side, or less than total area of 900 mm
Thickness 0,3 mm ± 0,03mm
9 mm to 10 mm at the bottom,
Drawing diameter
13 mm to 14 mm at the top
Drawing depth 0,4 mm ± 0,04 mm
Inner diameter of 10 mm ± 0,02 mm, and over 20 mm for the Comment [ 17]: UK22
Solder resist
outer diameter
Resist coat thickness 0,035 mm ± 0,01 mm
Warp ±0,05 mm (for the longer side for a rectangular shape)
XXX © IEC 60068-2-83 Ed.1 :200X – 14 – XXX © CEI:200X
2CD draft 2008-05-25
An example of the test jig plate used in the quick heating method is shown in Figure 6.

Outer dimension
23,5

0,3 ± 0,03
Thickness
Outer diameter of drawing
13,5
Inner diameter of drawing
9,5

A-A’
cross section

Drawing depth
0,4 ± 0,04

Outer dimension
23,5 ± 0,1
A
A A’

Drawing for solder resist

Solder resist

Inner diameter of resist

10 ± 0,02

Outer diameter of resist

20

Figure 6 - Example of test jig plate for the quick heating method

8.3 Preparation

8.3.1 Solder paste

Refer to 7.3.1.

8.3.2 Test jig plate

Refer to 7.3.2.

8.3.3 Specimen Holder

Use a clean specimen holder on the surface and exchange for each measurement.
XXX © IEC 60068-2-83 Ed.1 :200X – 15 – XXX © CEI:200X
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8.4 Test Condition

8.4.1 Test Temperature

The test temperature is the temperature of the jig used in the test. The test jig plate shall be Comment [ 18]: UK24
processed using the temperature profile given in Figure 7.

3 s or less

1,5 s or less
Temperature °C

250 T4
T3
200
Arbitra
150

100

50°C or less
when start
Time
5 s to15 s

Symbol SAC type * Sn-Pb type *

T3 217 °C 183 °C
T4 245 °C ± 3 °C 235 °C ± 3 °C
* Refer to Table 1

Figure 7 - The temperature profile of the quick heating method

8.4.2 Feed of Solder Paste and Immersion Condition

The recommended condition of immersing a specimen into the solder paste is given in Table 5.
The component not specified in Table 5, test conditions shall be specified in the relevant
specification or agreed upon between the trading partners.
XXX © IEC 60068-2-83 Ed.1 :200X – 16 – XXX © CEI:200X
2CD draft 2008-05-25

Table 5 - Recommended test conditions of the quick heating method

for rectangular SMD

Angle and direction of

Sizes of specimen a Immersion depth b, c specimen immersing into
solder paste
1005 (0402) 0,15 mm Horizontal
1608 (0603) 0,20 mm
Resistors Rectangular SMD
2012 (0805)
3216 (1206)
1005 (0402) 0,15 mm
1608 (0603) Solder paste
Capacitors
2012 (0805) 0,20 mm
3216 (1206)
a Designation of the size is, for example, 1005 means a specimen with a length of 1,0 mm and
width of 0,5 mm. In parentheses, dimensions are expressed in Imperial.
b The immersion depths specified in this table are recommended due to the buoyancy force is
different depending upon the electrode configuration.
c The immersion depth is the target values.

Comment [ 19]: UK27

8.4.3 Conditions for ascend and descend of the test equipment

The immersion speed of the specimen into the solder paste shall be 0,5 mm/s to 1 mm/s, and
that of the heating bath shall be 1 mm/s to 5 mm/s.

8.5 Procedure
a) Apply solder paste to the drawn section of a test jig plate using a squeegee as shown in Comment [ 20]: DE6
Figure 8. Excess solder paste is scraped off using the squeegee. &UK28

Squeegee

Direction of squeeze
Solder paste

Test jig plate

Figure 8 - Example of applying solder paste to a test jig plate.

b) Mount a specimen on a holder as to the immersion angle specified in 8.4.2 is realized.

The holder shall be installed on the centre of upper surface of a test jig plate with solder
paste applied.
c) The specimen shall be immersed into the solder paste to the depth of twice or more the
specified depth, and then the specified depth. The immersion attitude and the immersion
depth are given in 8.4.2. Comment [ 21]: UK29

Note - The purpose of this procedure is to apply flux on the portion of the specimen which corresponds to the
immersion depth, before heating.

d) Adjust the output of the force sensor and the recorder to zero before the specimen is
immersed into the solder paste.
e) Heat the jig plate to melt the solder paste in accordance with the temperature profile
specified in Figure 7.
f) The specimen shall be withdrawn from the solder to separate the coagulation force of the
solder and wetting force of the specimen to the solder.
XXX © IEC 60068-2-83 Ed.1 :200X – 17 – XXX © CEI:200X
2CD draft 2008-05-25
g) Withdraw the specimen from the molten solder paste when measurement is finished.
Recording of the result is completed when the force reaches to a stable state.

8.6 Presentation of the result

The recorder records the force acted to the specimen in the vertical direction. The force
acted to the upper direction (pushing force or buoyancy) is recorded as a negative value, and
the force acted to downward to the specimen (wetting force) is recorded as a positive value.

A typical shape of the output signal obtained the sample temperature is raised as the
specified temperature profile is shown in Figure 9. The meaning and correction of the data Comment [ 22]: UK30
different from the shape shown in Figure 9 are given in Annex E. &UK31

t0 t1 t2 t3 t4
Time to progress of
T1 wetting

T0
Positive

Time to start wetting D

E
Reference point to
start time C
measurement

F m ax
Acting force

2/3 F max

F end
A B F Zero line

Time
Negative

Figure 9 - Typical output shape of signal in the quick heating method

Where: t0: Reference point to start time measurement (A in Figure 9).

Note- Point A is the fist positive force peak during the test.

t1: Time to cross the output form and the zero line (B in Figure 9).

t2: The time the wetting force reaches to 2/3 of the maximum wetting force
(C in Figure 9).

t3: The time to withdraw the specimen after measurement is complete (E in

Figure 9).

t4: The time the force reached to a stable state after the specimen is
withdrawn from the jig plate (F in Figure 9).

T0 : The time to start wetting. The time from point A to point B. T 0 = t 1 - t 0 .

T1 : Time to wetting. The time from point B to point C. T 1 = t 2 - t 1

F max : The maximum wetting force. The maximum force obtained in the
measurement, the value from the zero line (D in Figure 9).

Fend : The final wetting force. The wetting force obtained at the end of the
test, the value from the zero line (E in Figure 9).

8.7 Required test items

The requirement for the wetting force in the quick heating test is to specify at least one of the
following items.
XXX © IEC 60068-2-83 Ed.1 :200X – 18 – XXX © CEI:200X
2CD draft 2008-05-25
a) The time to start wetting: T 0
b) Wetting time: T 1
c) Maximum wetting force: F max
d) Wetting stability: S b ; The ratio of the final wetting force (F end ) and the maximum wetting
force (F max ).

NOTE - Wetting stability is calculate from S b =F end /F max .

9 Items to be specified in the relevant specification

The relevant specification of a component shall specify the following items.

a) Test method
(Temperature profile method, or the quick heating method) * 4.2 Comment [ 23]: UK32

b) Preconditioning 6
c) Amount of solder paste used and the immersion condition for the
temperature profile method 7.4.2 Comment [ 24]: UK33

d) Required test items in the temperature profile method * 7.7

e) Immersion condition in the quick heating method 8.4.2
f) Required test items in the quick heating method * 8.7
* These items shall be included in the detailed specification.
XXX © IEC 60068-2-83 Ed.1 :200X – 19 – XXX © CEI:200X
2CD draft 2008-05-25
Annex A
(Normative)
Specifications of the flux

A.1 Scope

This Annex specified the composition and materials of the flux used for the solder paste as
described in clause 5.

A.2 Specification of the flux

The flux used for solder paste in this test shall have the component satisfying the composition,
items and their specified values as given in Table A.1.

Table A.1-Specification of flux for solder paste

Content (wt%)
Component Composition Characteristic Specification Comment [ 25]: UK34
SAC * Sn-Pb *

Polymerized Softening point 93 °C to 115 °C

30,0 52,5
rosin Acid value 145 mgKOH/g to 165 mgKOH/g
Rosin
Softening point 113 °C to 139 °C
Modified rosin 30,0 ⎯
Acid value 160 mgKOH/g or more

Diethylene Specific gravity 0.953 to 0.958

glycol
34,7 ⎯ Water content 0,2 wt% or less
Monobutyl
ether Boiling point 220 °C to 236 °C
Solvent
Specific gravity 0.922 to0.925
2-METHYL-2,4-
⎯ 42,2 Water content 0,1 wt% or less
PENTANEDIOL
Boiling point 197.1 to 198.3 °C
1,3-Diphenyl Halide content 11,6wt% to 12,6wt%
Activator guanidine 0,8 0,8
Hydrobromide Acid value 170 mgKOH/g to 230 mgKOH/g

Purity 99,6 wt% or more

Water content 0,3 wt% or less
Organic acid Adipic acid 0,5 0,5
Ash content 0,02 wt% or less
Melting point 151 °C or above
Acid value 2 mgKOH/g or less

Thixotropic Hydrogenated Melting point 85 °C to 87 °C

4,0 4,0
agent castor oil
Saponification
175 mgKOH/g to 185 mgKOH/g
value

* Solder flux type, refer to Table 1

XXX © IEC 60068-2-83 Ed.1 :200X – 20 – XXX © CEI:200X
2CD draft 2008-05-25
Annex B
(Normative)
Test equipment for the temperature profile method

B.1 Scope

This Annex specified the details of the test equipment for the temperature profile method.

B.2 Test equipment

The details of the test equipment are specified as follow.

B.2.1 Measuring system

The measuring system shall satisfy the following requirements

a) The range of measurement of the wetting force shall be −50 mN to +50 mN.
b) The deviation sensitivity of the force sensor shall be better than 0,5 mN/µm.
c) The resolution of the force sensor shall be better than 0,01 mN.
d) The continuous recording of the output signal shall cover t 1 to t 4 of the data shown in 7.6,
Figure 3 of the main text.
e) The recorder shall be able to record the output data on recording sheet, or shall be able to
display the data by means of, e.g., a personal computer.
f) The time resolution of the record shall be better than 0,1 s.
g) The response time of the recording tip of the recorder used shall be better than 0,3 s to
return from the maximum output to the zero center of recording and the overshoot shall be
less than 1 % of the reading on the record. Comment [ 26]: DE7

h) The electrical and mechanical noises of the system shall not exceed 10 % of the signal.

B.2.2 Heating system

The heating system shall comply with the following requirements.

a) The heating section of the system shall realize the temperature profile as specified in
7.4.1, Figure 2.
b) The temperature difference between the solder paste and the electrodes of testing
specimen shall be less than 5 °C for the temperature of solder paste of 212 °C ~ 222 °C.
The temperature difference may be within 10 °C when the temperature of the solder paste
is outside of this temperature range. The temperature difference caused by the latent heat
of solder paste is not specified in this document.

B.2.3 Lift system

The lift system shall comply with the following requirements.

a) The speed of immersion and withdraw shall be 0,5 mm/s to 5 mm/s.

b) The position resolution shall be controllable better than 0,01 mm.
c) The system shall be capable of immersing a specimen in solder paste until the time to
withdraw the specimen from the solder paste as specified in 7.5 g).
XXX © IEC 60068-2-83 Ed.1 :200X – 21 – XXX © CEI:200X
2CD draft 2008-05-25
Annex C
(Normative)
Reading of the output data and correction of the result
in the temperature profile test

C.1 Scope

This annex specifies the reading of the output data and correction of the result other than as
shown in 7.6, Figure 4.

C.2 Reading of the output form in the temperature profile test

Typical examples other than as shown in 7.6, Figure 4 are given in Figure C.1. The bold line
shows the force acted to a specimen as a function of time, and the horizontal fine line shows
the zero line. The wetting time and the value of F max are used as they are for the cases a), b)
and e) to f) as shown in Figure C.1.

The correction for the case of c) in Figure C.1 shall be made in accordance with C.3.

The result cannot be obtained in the case of d) in Figure C.1.

XXX © IEC 60068-2-83 Ed.1 :200X – 22 – XXX © CEI:200X
2CD draft 2008-05-25

<1.1 F max

a) Wetting starts immediately b) An extruding acting force is experienced

immediately after start of wetting (less than
1,1 F max )

≥ 1,1 F max

c) An extruding acting force is experienced d) No wetting

immediately after start of wetting (1,1 F max or
lager)

e) Retarded wetting f) No complete wetting during the test

Figure C.1 - Typical output forms for profile temperature test

C.3 Correction to the typical data attained by the temperature profile method

Data for the wettability are obtained from the experimental data when a chart as shown in
Figure C.1, c) is attained from the obtained chart using the illustration given in
Figure C.2. In the case an extruding force larger than 1,1 times the maximum wetting force,
F max , is applied to a specimen after a coagulation force is generated due to the melting of
solder paste (B to C in the Figure 4), the wetting time T 1 , wetting time T 2 , the maximum
wetting force F max and the final wetting force F end are obtained as shown in the figure.
 XXX © IEC 60068-2-83 Ed.1 :200X – 23 – XXX © CEI:200X
2CD draft 2008-05-25

Wetting time T 2
Wetting time T 1
1,1 F max or lager
Positive

C' D E

86 %Fmax
2/3Fmax

Fmax
C

Fend
Zero line
Force

A A' B F

Time (s)
Negative

Figure C.2 - The case an extruding force (1,1Fmax or lager)

is generated immediately after beginning of wetting.
XXX © IEC 60068-2-83 Ed.1 :200X – 24 – XXX © CEI:200X
2CD draft 2008-05-25
Annex D
(Normative)
Equipment for the quick heating method

D.1 Scope

This Annex specified the details of the test equipment for the quick heating method

D.2 Test equipment

The details of the test equipment are specified as follow.

D.2.1 Measuring system

The measuring system shall satisfy the following requirements

a) The range of measurement of the wetting force shall be −40 mN to +40 mN. Comment [ 27]: UK36

b) The deviation sensitivity of the force sensor shall be better than 0,5 mN/µm.
c) The resolution of the force sensor shall be better than 0,02 mN. Comment [ 28]: UK37

d) The continuous recording of the output signal shall cover t 0 to t 4 of the data shown in 8.6,
Figure 9 of the main text.
e) The recorder shall be able to record the output data on recording sheet, or shall be able to
display the data by means of, e.g., a personal computer.
f) The time resolution of the record shall be better than 0,1 s.
g) The response time of the recording tip of the recorder used shall be better than 0,3 s to
return from the maximum output to the zero center of recording and the overshoot shall be
less than 1 % of the reading on the record.
h) The electrical and mechanical noises of the system shall not exceed 10 % of the signal.

D.2.2 Heating system

The heating system shall comply with the following requirements.

a) The heating section of the system shall realize the temperature profile as specified in
8.4.1, Figure 7.
b) The size of the heating bath shall be of a diameter larger than 40 mm and of a depth
deeper than 15 mm.

D.2.3 Lift system

The lift system shall comply with the following requirements.

a) The immersion depth of the specimen into the solder paste on the test jig plate can be
adjusted by 0,05 mm increment with the maximum depth equal to the drawing depth of the
test jig plate.
b) The position resolution shall be controllable better than 0,02 mm.
c) The speed of immersion shall be 0,5 mm/s to 5 mm/s.
d) The duration of the test jig plate being contacted with the heating bath shall be adjustable
from 5 s to 15 s.
XXX © IEC 60068-2-83 Ed.1 :200X – 25 – XXX © CEI:200X
2CD draft 2008-05-25
Annex E
(Normative)
Reading of the output data and correction of the result
in the quick heating test

E.1 Scope

This annex specifies the reading of the output data and correction of the result other than as
shown in 8.6, Figure 9.

E.2 Reading of the output form in the quick heating test

Typical examples other than as shown in 8.6, Figure 9 are given in Figure E.1. The bold line
shows the force acted to a specimen as a function of time, and the horizontal fine line shows
the zero line.

a) The time the force line crosses the zero line, t 1 :

t 1 cannot be obtained in a case the force line does not cross the zero line, and the start of
wetting, T 0 , and the wetting time, T 1 , cannot be attained neither. A virtual t 1 should be
obtained in the chart from the crossing point of an extended supplemental line and the
zero line.
t 1 for the cases a) to c) and g) is the t 1 as given in the figure. The correction for the
cases of d) to g) in Figure E.1 shall be made in accordance with E.3.
t 1 for the case h) in Figure E.1 cannot be obtained
b) Maximum wetting force, F max :
F max for the cases a) to d) is the F max as given in the figure. The correction for the cases
of e) to g) in Figure E.1 shall be made in accordance with E.3.
F max for the case h) in Figure E.1 cannot be obtained. Comment [ 29]: DE8
 t0 t1 t0 t1

F max F max

XXX © IEC
a) Wetting begins from a negative
60068-2-83 Ed.1 force
:200Xto a – 26 – XXX ©first
b) A maximum wetting force appears CEI:200X
and
specimen
2CD draft 2008-05-25 then gradually decreases as time proceeds

t0 t1 t0 t1 ’

a
a F max F max

c) A large step of wetting d) A small step of wetting

The first step “a” is larger than 1/2F max The first step “a” is 1/2F max or smaller

t0 t1 ’ t0

F max
F max

t1’
e) An apparent maximum wetting force f) Decrease of force from an apparent
maximum force wetting

t0 t1 t0

F max

g) Force decreases to the zero line from h) Negative force only

an apparent maximum wetting force

Figure E.1 - Typical wetting force changes in quick heating method

E.3 Correction to the typical data attained by the quick heating method

Corrections to the experimentally obtained data are made in the following cases.

a) Correction to the initial wetting time applicable to cases where the wetting force changes
in a step-wise (Figure E.1, c) and d)): When the wetting force is in a step-wise state, the
correction is made according to either Figure E.2 or Figure E.3 to determine the initial
wetting time, t 1 , depending on the value of wetting force is larger or smaller than 1/2 of
the maximum wetting force.
1) The wetting force at the first step, Fa, is 1/2F max or less

Draw a tangential line to the wetting curve and obtain the crossing of this tangential
line and the zero line to obtain the initial time of wetting, t 1 .

Tangential line to the wetting

t0 t t1’
Fa

F m ax
Zero line

Figure E.2 - Example of correction of the initial time

of wetting (Fa is 1/2F max or less).

2) The wetting force at the first step, Fa, is larger than 1/2F max
XXX © IEC 60068-2-83 Ed.1 :200X – 27 – XXX © CEI:200X
2CD draft 2008-05-25
The start of wetting of the first step is taken as the initial time of wetting, t 1 .

t0 t1

F m ax
Fa
Zero line

Figure E.3 - Example of correction of the initial time

of wetting (Fa is larger than 1/2F max ).

b) Correction to the initial wetting time applicable to cases where a sharp positive peak
appears in the wetting Figure E.1, e) to g)):
1) Correction to the initial time of wetting (applicable to Figure E.1, e) to f))
Draw a tangential line to the wetting curve and obtain the crossing of this tangential line
and the zero line to obtain the initial time of wetting, t 1 .
2) Correction to the maximum wetting force (applicable to Figure E.1, e) to g))
The maximum wetting force is the force when wetting reached to stable state.
The time to reach 2/3 of the maximum wetting force (t 2 ) is obtained from the corrected
maximum wetting force.