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07 Chapter1

This document introduces the topic of mm-wave antennas and integrated circuits. It discusses the motivation and objectives of the thesis, which are to investigate gain enhancement approaches for mm-wave on-chip antennas using conventional CMOS technology. The thesis is organized into five chapters that cover an introduction, literature review, a design using an artificial magnetic conductor surface, a functional chip package using a Fresnel lens, and conclusions. The overall goal is to overcome the challenges of low gain and radiation efficiency for on-chip antennas at mm-wave frequencies.

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15 views

07 Chapter1

This document introduces the topic of mm-wave antennas and integrated circuits. It discusses the motivation and objectives of the thesis, which are to investigate gain enhancement approaches for mm-wave on-chip antennas using conventional CMOS technology. The thesis is organized into five chapters that cover an introduction, literature review, a design using an artificial magnetic conductor surface, a functional chip package using a Fresnel lens, and conclusions. The overall goal is to overcome the challenges of low gain and radiation efficiency for on-chip antennas at mm-wave frequencies.

Uploaded by

Prarthna
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
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C HAPTER 1

INTRODUCTION

1.1 INTRODUCTION 02
1.2 MOTIVATION AND OBJECTIVE 03
1.3 THESIS ORGANIZATION 04
Chapter 1: Introduction

1.1 INTRODUCTION
The wavelength range of 10 mm to 1 mm corresponds to the mm-wave
frequency band, which spans 30 GHz to 300 GHz. Due to its large bandwidth, small
component sizes, high resolution, and low interference, the mm-wave frequency band
has drawn research attention with the development of short-range wireless
communication systems [1]. The Federal Communication Commission has designated
the E band frequencies of 72.5-76/81-86 GHz for high capacity point-to-point
communication systems. One of the most significant benefits is that a high data rate
may be attained in these frequency bands due to the size of the available, license-free
frequency spectrum [2].Because of transistor downscaling, high integration levels,
enhanced standard fabrication procedures, and low fabrication costs, the rapid growth of
ICs over the past two decades has sparked research interest. Therefore, the development
of ICs encourages the creation of wireless systems that benefit from a variety of
capabilities, high degrees of integration, and multiple frequency bands. The four
functional elements that make up a wireless system are :the digital baseband, mixed-
signal, RF front-end, and antenna. especially in electric motor design [3]. While the
mixed-signal system provides the signal conditioning, the digital baseband module is
needed to process the signal data in baseband by digital means. The RF front-end
module is used to modulate the data signal to the high frequency carriers, and the
modulated signal is transmitted by the antenna. The SoC, which can be produced using
common CMOS technology, was introduced. The fundamental idea behind a SoC is to
combine all of the functional components of wireless systems, such as the digital
baseband, mixed-signal, and RF front-end modules, onto a single chip. A single chip RF
SoC possesses several advantages compared to the discrete RF system: less external
noise, lower cost, and simpler assembly.

Additionally, wireless systems have a tendency to go to higher


frequencies, particularly the mm-wave frequency band. There are various wireless
system applications in the mm-wave spectrum, such as high data rate point-to-point
communication systems at the 60 GHz and 72.5 GHz bands, vehicle radars at 76-81
GHz, and imaging systems at 94 GHz. However, the integration of a high-performing
on-chip antenna is the bottleneck of a real mm-wave RF SoC. The lossy Si substrate
causes the traditional on-chip antenna to have poor gain and low radiation

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Chapter 1: Introduction

efficiency.The Si substrate used in the conventional CMOS process is suitable for IC


design, but because it has a low resistivity, the majority of the RF power is absorbed by
the substrate rather than being radiated by the antenna, which results in a dramatic
degradation of on-chip antenna radiation performance. In addition, high-order surface
waves are excited by the Si substrate's high relative permittivity and electrically
substantial thickness.

Different on-chip and off-chip strategies for gain enhancement, such as


an on-chip AMC surface, on-chip cavity structure, and off-chip lens structure, have
been proposed in order to boost the performance of mm-wave on-chip antennas. A real
system-level solution, however, should use both on-chip and off-chip methods.
Packaging can have a significant impact on off-chip processes.Instead than just offering
mechanical protection for the chip, the chip package can be cleverly designed and
optimized to be a functional packaging for the on-chip antenna's gain increase. The
conventional CMOS technology makes cheap cost possible, however the entire system
is not only CMOS. Because packaging plays a significant role in the system.Chip
packaging may benefit from additive manufacturing's low-cost fabrication options.
Additionally, the advantages of additive manufacturing include having digital
procedures and working with mass production. Thus, the total system's cheap costs are
the result of the integration of the CMOS technology and additive manufacturing.

1.2 MOTIVATION AND OBJECTIVE


The major goal of this thesis is to investigate various gain enhancement
approaches in order to overcome the difficulties of low gain of mm-wave on-chip
antenna design with the conventional CMOS technology. The following is a list of the
thesis' objectives:

● Using embedded AMC surfaces to establish an on-chip monolithically


integrated approach for gain enhancement, it will be possible to show on-chip
antennas in the mm-wave band (72.5 GHz) with standard CMOS technology.
● To deal with challenging simulation and measurement problems for mm-wave
on-chip antennas.

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Chapter 1: Introduction

● To create a functional package with a Fresnel lens and a superstrate layer that
can protect the chip from mechanical damage while enhancing the gain of an on-
chip antenna.

1.3 THESIS ORGANIZATION


The technical research work carried out in this thesis has been structured
in four chapters. The brief descriptions of each chapter of the thesis are summarized
below.

Chapter 1: Introduction
Chapter 1 gives an introduction of mm wave and its importance in the
development of short-range wireless communication systems. It also states that the
rapid growth of ICs over the past two decades has sparked research interest.It highlights
how AoC being the one of the most favorable solutions for the utilization of mm waves
still suffers from poor gain and radiation efficiency.

Chapter 2: Literature Review


Chapter 2 presents an overview of antenna-on-chip (AoC) and discusses
the challenges related to the low gain and radiation efficiency of the on-chip antenna.
An overview of gain enhancement methods is also provided. Additionally, the
difficulties and approaches for measuring mm-wave antennas are given.

Chapter 3: Antenna-on-Chip with an artificial Magnetic


Conductor Surface
Chapter 3 covers the fundamental idea of AMC surface operation along
with comparisons of three different electromagnetic (EM) wave-reflecting surfaces. The
AMC surface simulation model and associated simulation results are then displayed. It
displays the on-chip antenna and drive circuit's simulated and measured results.

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Chapter 1: Introduction

Chapter 4: Functional Chip Package for Gain Enhancement


Chapter 4 discusses the working principles and design procedure of
superstrates and the Fresnel lens in detail.Additionally, it displays the complete system-
level design along with the functional set and simulation findings.

Chapter 5: Conclusion and Future work


Chapter 5 concludes all the work in this thesis and plans the future work.

Page | 5

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