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ESSXXRC2023 Invitation Letter CONFERENCE

This invitation letter invites the recipient to participate in the ESSCIRC-ESSDERC 2023 Conference to be held in Lisbon, Portugal from September 11-14, 2023. The conference aims to provide scientists and engineers a platform to discuss trends and solutions in solid-state devices and circuits. While extending the invitation, the letter clarifies that it does not constitute any financial obligation for the organizers and that all travel and accommodation expenses will be the responsibility of the participant.

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Jak Adfraam
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215 views1 page

ESSXXRC2023 Invitation Letter CONFERENCE

This invitation letter invites the recipient to participate in the ESSCIRC-ESSDERC 2023 Conference to be held in Lisbon, Portugal from September 11-14, 2023. The conference aims to provide scientists and engineers a platform to discuss trends and solutions in solid-state devices and circuits. While extending the invitation, the letter clarifies that it does not constitute any financial obligation for the organizers and that all travel and accommodation expenses will be the responsibility of the participant.

Uploaded by

Jak Adfraam
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
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First Name:      

Family Name:      

Institution:      

Full Address:      

e-Mail:      

PAPER ID:      

Passport No:      


Date of Issue:      
Date of Expiry:      
ORGANIZING COMMITTEE
João Goes
Univ. NOVA de Lisboa, UNINOVA, PT
INVITATION LETTER
General Chair

José M. de la Rosa Dear      ,


IMSE-CNM, Univ. de Sevilla, ES
General co- Chair
on behalf of the Organizing Committee, I cordially invite you to participate in
the forthcoming ESSCIRC-ESSDERC 2023 Conference, to be held in LISBON
(Portugal) from 11 to 14 September, 2023.
ORGANIZING SECRETARIAT
Sistema Congressi The main goal of the ESSCIRC ESSDERC Conference is to offer both
+39 049 651699
scientists and engineers in academies and industries an opportunity to express
[email protected]
and discuss their views on current trends, challenges and solutions to various
problems in the fields of solid-state devices and circuits.

Indeed, your participation would certainly enrich the Conference and contribute
to its success.

I take this opportunity to state that this letter does not constitute any financial
obligation on behalf of the Organizers and any travel, subsistence, health
insurance and Conference fee, including any other expenses, will be entirely on
your charge.
Looking forward to seeing you in LISBON, we send kindest regards
João Goes
General Chair
on behalf of the ESSCIRC/ESSDERC 2023 Organizing Committee

www.esscirc-essderc2023.org

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