DESIGN AND FABRICATION OF PORTABLE

THERMOELECTRIC REFRIGERATOR

A Major project report submitted in partial fulfillment of the requirements for

the degree of Master of Technology in Machine Design

by

R.RAMANA KUMAR
22N31D1507

Under the guidance of

Mr. VIVEKANANDA SOMA
ASST. PROFESSOR

MALLA REDDY COLLEGE OF ENGINEERING & TECHNOLOGY

DEPARTMENT OF MECHANICAL ENGINEERING
UGC Autonomous Institution, Govt. of India
(Affiliated to JNTUH, Approved by AICTE, NBA &NAAC with ‘A’ Grade)
Secunderabad – 500100, Telangana State, India
 MALLA REDDY COLLEGE OF ENGINEERING & TECHNOLOGY
Autonomous Institution - UGC Govt. of India
(Affiliated to JNTU, Hyderabad, Approved by AICTE - Accredited by NBA & NAAC – ‘A’ Grade)
Secunderabad – 500100, Telangana State, India

DEPARTMENT OF MECHANICAL
ENGINEERING

CERTIFICATE

This is to certify that the Major Project work entitled “Design and

Fabrication of Portable Thermoelectric Refrigerator” is carried out

by R.Ramana Kumar (H.T.NO 22N31D1507), in partial fulfillment

for the award of degree of Master of Technology in Machine

Design, Jawaharlal Nehru Technological University, Hyderabad

during the academic year 2022-2024.

ASST. PROF VIVEKANANDA SOMA PROF. DR.P.SRIKAR

Internal Guide HOD

External Examiner
 ii

DECLARATION

I hereby declare that the project titled “Secure U Emergency System” submitted to

Malla Reddy College of Engineering and Technology (UGC-Autonomous), affiliated

to Jawaharlal Nehru Technological University Hyderabad (JNTUH) for the award of

the degree of Master of Technology in Thermal Engineering is a result of original

research carried-out in this thesis. I understand that my report may be made

electronically available to the public. It is further declared that the project report or

any part thereof has not been previously submitted to any University or Institute for

the award of degree or diploma.

Name of the Student : R. Ramana kumar

Hall Ticket Number : 22N31D1507

Degree : Master of Technology in Machine Design

Department : Mechanical Engineering

Title of the project : DESIGN AND FABRICATION OF PORTABLE THERMOELECTRIC

REFRIGIRATOR

(R.RAMANA KUMAR)
Date:

ACKNOWLEDGEMENT
Acknowledgements are to be written by the students as per the
sequence mentioned below

1) Dr S Srinivasa Rao, Principal

2) Dr P Srikar Head of the Department

3) Asst. prof Vivekananda Soma Internal Guide

4) Parents and other people who helped to complete the project

iv
 ABSTRACT

The Objective of this project is to Design and Fabricate a portable thermoelectric

refrigerator whose casing and components are designed using CATIA Software and

Fabricate the product. This refrigerator consists of a thermoelectric module as

cooling generator along with an insulated cabin, thermostat and charging unit.

Thermoelectric elements perform the same cooling function as Freon-based vapor

compression or absorption refrigerators. The design of the refrigeration is based on

the principle of thermoelectric module (i.e., Peltier effect) to create a hot side and a

cold side. The cold side of the thermoelectric module is used for refrigeration

purposes. On the other hand, the heat from the hot side of the module is rejected to

the surroundings with the help of heat sinks and fans. So, the aim is to Design and

Fabricate the Portable Thermoelectric Refrigerator with high efficiency.

KEYWORDS: Peltier Effect, Heat sink, Thermoelectric module, Refrigeration,

etc.
 v

CONTENTS
TOPICS PAGE NO
● Certificate ii
● Declaration iii
● Acknowledgement iv
● Abstract v

CHAPTER 1: INTRODUCTION 1

1.1Introduction of the project 1

1.2Project overview 4

1.3Thesis 4

CHAPTER 2: LITERATURE SURVEY 5

2.1Literature survey 5

2.2Survey conclusion 7

CHAPTER 3: METHODOLOGY 8

3.1Introduction with block diagram 8

3.1.1History 9

3.2Components of Thermoelectric Refrigerator 10

3.2.1Peltier Module 10
 3.2.2Heat Sink 10

3.2.3Temperature Indicator 11

3.2.4Power Supply 12

3.2.5Thermocol Casing 13

3.2.6DC Fan 13

3.2.7Dimensions 14

3.3Introduction to Catia 16

3.3.1Starting to Catia 16

3.3.2Procedure for Drawing Portable Thermoelectric

Refrigerator 17

3.3.3Options Used to Create Design 18

3.3.4Designed Parts Using Catia 20

3.3.5Final Design 22

3.3.6Principle and Characteristics of Thermoelectric

Refrigeration 23

3.3.7Uses of TE Refrigerators 24

3.3.8Applications of Cooling 24

3.4Methods of Heat Transport 25

3.5Thermoelectric Cooling (TEC) 26

3.5.1Thermoelectric Refrigeration Cooling process 26

3.5.2Working of Peltier Module 26

3.6Fabrication and Assemble 27

 3.6.1Before and After Assembly 27

3.6.2Assembly Drawing 28

3.7Nomenclature 29

3.7.1Experimental Setup 29

3.7.2Design & Measurement of Temperature 30

3.8Coefficient of Performance 32

3.8.1COP with respective time (Theoretical) 33

3.8.2COP with respective time (Practical) 33

3.8.3Graph: COP vs Time 34

CHAPTER 4: RESULT 35

4.1Experimental Results 35

4.1.1Experiment on plastic water bottle &Coca Cola (Tin) 35

4.1.2Experiment on Glass Sheet 36

CHAPTER 5: CONCLUSION 37

CHAPTER 6: REFERENCES 38
 LIST OF FIGURES

Figure No Figure title Page No

1.1 Line Diagram of Thermoelectric Refrigerator 3

3.1.1 Block diagram of processes in TER 9

3.2.1 Peltier Module 10

3.2.2 Heat sink 11

3.2.3 Temperature Indicator 12

3.2.4 Power supply 12

3.2.5 Thermocol 13

3.2.6 DC Fan 13

3.3.1 Selecting the module 17

3.3.2 Selection of plane 18

3.3.4 Designed parts using CATIA 20

3.3.5 Final Design 22

3.3.5 Peltier effect 23

3.5.1 TER cooling process 26

3.6.1 Parts before and after Assembly 27

3.6.2 Assembly of Peltier module, heatsink and DC fan 28

3.8.3 Coefficient of Performance 34

4.1.1 Cooling test result on plastic water bottle 36

4.1.2 Cooling test on Coca Cola (Tin) 36

 LIST OF TABLES

Table No Table Title Page No

3.2.5 Dimensions of Thermocol Box 14

3.2.1 Dimensions of Peltier 14

3.2.4 Dimensions of SMPS (AC to DC Converter) 15

3.2.6 Dimensions of DC Fan 15

3.3 Details of CATIA 16

3.7 Observations of Peltier 30

3.7.1 Theoretical Observations 33

3.7.2 Practical Observations 33

0
 CHAPTER 1

INTRODUCTION

In this chapter a complete brief introduction to the project “Portable

ThermoelectricRefrigerator” is given which also includes the how the
Thermoelectric refrigerator works.

1.1 Introduction:

Refrigeration is a process of removal of heat from a space where

it is unwanted and transferring the same to the surrounding environment
where it makes little or no difference. Although a thermoelectric (TE)
phenomenon was discovered more than 150 years ago, thermoelectric devices
(TE coolers) have only been applied commercially during recent decades. For
some time, commercial TECs have been developing in parallel with two
mainstream directions of technical progress – electronics and photonics,
particularly optoelectronics and laser techniques. Lately, a dramatic increase
inthe application of TE solutions in optoelectronic devices has been observed,
such as diode lasers, super luminescent diodes (SLD), various photo-
detectors, diode pumped solid state lasers (DPSS), charge-coupled devices
(CCDs), focal plane arrays (FPA) and others. The effect of heating or cooling
at the junctions of two different conductors exposed to the current was named
in honor of the French watchmaker Jean Peltier (1785–1845) who discovered
it in 1834. It was found that if a current passes through the contacts of two
dissimilar conductors in a circuit, a temperature differential appears between
them. This briefly described phenomenon is the basis of thermoelectricity and
is applied actively in the so-called thermoelectric cooling modules.
Thermoelectric devices (thermoelectric modules) can convert electrical
energy into atemperature gradient thisphenomenon was discovered by Peltier
in 1834.
1
The application of this cooling or heating effect remained minimal until the
development of semiconductor materials. With the advent of semiconductor
materials brings the capability for a wide variety of practical thermoelectric
refrigeration applications. Thermoelectric Refrigeration is achieved when a
direct current is passed through one or more pairs of n and p-type
semiconductor materials. In the cooling mode, direct current passes from the n
to p-type semiconductor material. The temperature of the interconnecting
conductor decreases and heat is absorbed from the environment. This heat
absorption from the environment (cooling) occurs when electrons pass from a
low energy level in the p-type material through the interconnecting conductor
to a higher energy level in the n-type material. The absorbed heat is
transferred through the semiconductor materials by electron transport to the
other end of the junction TH and liberated as the electrons return to a lower
energy level in the p-type material. This phenomenon is called the Peltier
effect. We studied the working system of Heating,Ventilation and Air
Conditioner (HVAC) system and observed the temperature and pressure in
this system. Our aim is to introduce a new HVAC system using a
thermoelectric couple which shall overcome all the disadvantages of existing
HVAC systems. If this system comes in present HVAC system, then
revolution will occur in the automotive sector. With population and pollution
increasing at an alarming rate TEC (thermoelectric couple) system have come
to rescue as these are environment friendly, compact and affordable.
Conventional compressor run cooling devices have many drawbacks
pertaining to energy efficiency and the use of CFC refrigerants. Both these
factors indirectly point to the impending scenario of global warming. As most
of the electricity generation relies on the coal power plants, which add
greenhouse gasses to the atmosphere is the major cause of global warming.
Although researches are going on, better alternatives for the CFC refrigerants
are still on the hunt. So instead of using conventional air conditioning
systems, other products which can efficiently cool a person are to be devised.
2
By using other efficient cooling mechanisms, we can save the electricity bills
and also control the greenhouse gasses that are currently released into the
atmosphere. Although Thermoelectric (TE) property was discovered about
two centuries ago thermoelectric devices have only been commercialized
during recent years. The applications of TE vary from small refrigerators and
electronics package cooling to Avionic instrumentation illumination control
and thermal imaging cameras. Lately a dramatic increase in the applications
of TE coolers in the industry has been observed. It includes water chillers,
cold plates, etc. Portable insulin coolers, portable beverage containers and etc.
Chlorofluorocarbon(CFC):Chlorofluorocarbon is any of various halocarbon
compounds consisting of carbon, hydrogen, chlorine, and fluorine. CFC were once
used widely as aerosol propellants and refrigerants. Chlorofluorocarbons are
believed to cause depletion of the atmospheric ozone layer

Fig: 1.1 Linediagram ofThermoelectric Refrigerator

3
1.2 Project Overview:

Peltier Effect:

The Peltier Effect is the phenomenon that a potential difference applied

across a thermocouple causes a temperature difference between the
junctions of the different materials in the thermocouple. The hot junction
can be placed outside of an insulated area and the cold junction can be
placed inside the region. The Peltier Effect can be used to cool a region.

1.3 Thesis:
The thesis explains the implementation of “Design and
Fabrication of Portable Thermoelectric Refrigerator”. The
organization of the thesis is explained here with:

Chapter 1: Presents introduction to the overall thesis and the overview of

the project. In the project overview a brief introduction of
thermoelectric refrigerator, its applications are discussed.
Chapter 2: Presents the complete literature survey and the conclusion of
the literature survey.
Chapter 3: Presents the complete methodology followed and design and
requirements of parts to be assembled and manufactured.
Chapter 4: Presents the result

Chapter 5: Presents the conclusion.

4
 CHAPTER2

LITERATURE SURVEY

2.1 Literature survey:

[1]Manoj Kumar Rawat did an experimental study of comparing novel

potential green refrigeration and air-conditioning technology. They are
enumerating the cause and effect of air conditioning and came to the
result that thermoelectric cooling provides a promising option for R&AC
technology. They concluded that thermoelectric cooling is generally5-
15% as efficient compared to 40-60% conventional compressor cooling.

[2] Kirti Singh carried out the work on the development of portable
cooler cum heater that utilizes solar energy with the use of thermoelectric
module and photovoltaic module for generation of energy which could be
further used for cooling and heating effect. They concluded that a
thermoelectric cooler serves the purpose of pumping heat and its misuse
can heat up the CPU instead of cooling it down. Thermoelectric cooler
needs to have a high heat capacity.

[3]Dr. S. Sreenath Reddy the researchers carried out their work on design
and fabrication of thermoelectric refrigerator using germanium and its
alloys. They concluded that a thermoelectric refrigerator with interior
Cooling volume of 0.0258 m3 is far better in comparison to conventional
refrigerator.

[4]Vivek Vaidya carried out the work on the experimentation of a

thermoelectric refrigerator using Solar energy for cold storage
application. They concluded that the refrigerator can be used only for
light load to lower its temperature to a particular temperature. Further the

5
system is unable to handle fluctuations in load.

[5]MeghaliGaikwad carried out the work on the development of

thermoelectric R&AC system. They compared the cost and efficiency of
vapor compression, thermoelectric absorption refrigerators. They
concluded that the vapor compression system was the most energy
efficient as well it has the lowest operating and purchasing cost.

[6]Riffat&Qiu compared the effectiveness of thermoelectric

airconditioner to that of the vapor compression air conditioner and the
absorption air conditioner

2.2 Survey Conclusion:

By doing the literature survey on the “Thermoelectric
Refrigerator” we understood that TER is very effective to operate, has
lesspower consumptionas compared to the conventional compressor
cooling methods it also takes very less time to do cool. By removing the
hot air to the surrounding through the DC fan. Thermoelectric refrigerator
one can obtain highlyefficientcooling and does not have risk of releasing
harmful gas to atmosphere. Moreover, while performing the TERhas an
effective coefficient of performance as compared to traditional
refrigerator. They operate on a Peltier effect that produces maximum
cooling with minimum power consumption and thus enhancing its
efficiency. Moreover, it also requires less maintenance and has a low
running cost and has a pollutants free behavior.

6
 CHAPTER 3

METHODOLOGY

The Methodology is a process for implementation and developing

the project. With the goal of successfulness of the project is depending on
how the plans is conduct to achieve the result. Methodology is to define
each step to achieve the sequence of the flow work from the beginning
until the outcome is obtained.
All the results obtain were evaluated and improved till the best
result came out and to be taken. This implementation would be and
getting the worst result where try and error is happening here. Where any
ideal decision may reconsider and repeating to satisfy the best result.
By following the methodology to fabricated a safe and fully
functional “portable thermoelectric refrigerator” is designed and
fabricated.

3.1 Introduction with block diagram:

Thermoelectric cooling uses the Pettier effect to create a heat flux
between the junctions of two different types of materials. A Peltier cooler,
heater or thermoelectric heat pump is a solid - state active heat pump
which transfers heat from one side of the device to the other, with
consumption of electrical energy, depending on the direction of the
current.by applying low voltage DC power source to a TE module, Heat
will be moved through the module from one side to other where is
connected with long heat sink through DC fan the heat from the long heat
sink is exhaust to atmosphere. where small heat sink is inserted to the
casing where a small heat sink is attached with a DC fan to circulate the
cooling effect from the small heat to the casing. All the connection of
components is given to the AC to DC converter as per block diagram
shown below the connection is given to the refrigerator. Where Peltier,
DC Fan, Thermostat,etc. all this connected to the AC to DC Converter.

7
 Fig 3.1Block diagram of processes in TEC

Cold sides of the four Peltier devices transfers the chilling effect to
the evaporator. Hot side of the Peltier are exposed to the atmosphere
so that a fan will takes out the heat from hot side at faster rate.
The Peltier thermoelectric device will be arranged in a box with
proper insulation system and heat sink so that efficient cooling takes
place at all the time.

3.1.1 History:

● Thermoelectric was discovered and developed in 1820-1920 in

Western Europe, with much of work centered in Berlin. The
first important discovery related to thermoelectricity occurred
in 1823. German scientist ThomasSee beck found that a circuit
made from two dissimilar metals and junctions of thesame
keptat two different temperatures, produces thermoelectric
force which is responsible for flow of the current through the
module.

8
3.2 Components of Thermoelectric Refrigerator

3.2.1 Peltier Module:

Peltier modules are solid state heat pumps that operate on

the Peltier Effect. Heat pump is a thermodynamic system which transfers
heat from low temperature body and gives out the same to high
temperature body.
The Peltier Effect, mini refrigerator operates according to
the Peltier effect. The effect creates a temperature difference by
transferring heat between two electrical junctions. A voltage is applied
across joined conductors to create an electric current.

Fig 3.2.1 Peltier Module

3.2.2 Heat Sink:

A heat sink which is a passive heat exchanger that transfers
the heat by any device into a coolant fluid in motion. Then transferred
heat leaves the device with the fluid in motion therefore allowing the
regulation of the device temperature at physically feasible levels. A heat
sink transfers thermal energy from a higher temperature device to a lower
temperature fluid medium. The fluid medium is frequently air, but can
also be water, refrigerants or oil. If the fluid medium is water, the heat
sink is frequently called a cold plate.

9
 Fig 3.2.2 Heat sink

3.2.3 Temperature Indicator:

The Temperature Indicator is device that is used to know
about the temperature inside the chamber of refrigerator. It has a probe
which is inserted inside the chamber of refrigerator and the probe senses
the temperature inside gives the temperature data to the output display.

Key feature:

● NTC Thermistors with plastic housing for precise temperature

measurement.
● High insulation to moisture and water.
● Tolerance for resistance and B-value good as 1%.
● High product stability and reliability.
● Fast response within 10 seconds.
● Consistent performance in operating range of -40 to 85°C.

10
 Fig 3.2.3 Temperature Indicator

3.2.4 Power Supply:

A Power Supply is an Electrical device that supplies

electrical energy to electrical load. The primary function of a power
supply is to convert one form of electrical energy into another. Here we
are using 12V power supply because it reduces the 220V AC input into
12V AC Output. Because we are using all components which are working
with 12V of current.

Fig 3.2.4. Power Supply

11
3.2.5 ThermocolCasing:

Fig 3.2.5 ThermocolCasing

Thermal casing is made of Thermocol and is used for

keeping cool inside and to store the storage beverages and food stuffing's
in the mini refrigerator. Thermocol is aninsulator.So, it will help to cool
inside the mini refrigerator.

3.2.6 DC Fan:

Fig 3.2.6 DC Fan

12
DC Cooling fans are used to maintain a desired temperature within electrical
devices in order to ensure efficiency and longevity of that device. DC Cooling
fans can be used in a large number of applications that require cooling along
with low noise and low voltage consumption

3.2.7 Dimensions:

Parts Dimensions(mm)

Overall box length 550

Overall box width 450

Longer heat sink 120x70x40

Short heat sink 40x40x26

Ground clearance 20.2

Table 3.2.5 Dimension of Thermocol Box

Pelter type TEC1-12706

Current 6A
Volage 12v
Cooling time 1 hours

Table 3.2.1 Dimension of Peltier

13
 Power 120w
DC current 15 Amps
DC voltage 12v
Ac voltage 110-240v

Table 3.2.4 Dimension of SMPS(AC to DC converter)

Fan type Plastic Pc cooling Fan

Fan length 90mm
Fan width 90mm

Table 3.2.6 Dimension of DC Fan

3.3 Introduction to CATIA:

14
 CATIA (Computer Aided Three-dimensional Interactive Application)
is a multi-platform CAD/CAM/CAE commercial software suite developed by
the French company Assault Systems. Written in the C++ programming
language, CATIA is the cornerstone of the Assault Systems product lifecycle
management software suite.

CATIA competes in the CAD/CAM/CAE market with Siemens NX,

Pro/E, Autodesk Inventor, and Solid Edge as well as many others.

Developer(s) Dassault System

Stable release V6R2011x/November 23,2010

Operating system Unix/Windows

Type CAD software

License Proprietary

website WWW.3ds.com

Table 3.3: Details of CATIA.

3.3.1 Starting to CATIA:

To start CATIA there may be icon on the desktop or you may have to look in
start menu at the bottom of leaf of the screen windows taskbar. The program
takes a while to load, so be patient the start-up is complete when your screen
looks like the following figure, which is a default CATIA screen.

15
 Fig:3.3.1 Selecting the module

Now click to the start button at the top of the toolbar it shows different
modules as shown in below figure for modeling select “mechanical design” in
that again select it shows options as shown below select ‘part design’.

3.3.2 Procedure For DrawingPortableThermoelectricRefrigerator

After selecting the part design module screen as shown below figure in the
screen there will be three planes XY, YZ and ZX planes. The XY planes
represent the top or bottom view, the YZ plane represents the front or back
view and the ZX plane represents the right side or left side view. In that three
plans select ZX-plane and select the sketcher your screen looks like.

16
 Fig:3.3.2 Selection of plane

3.3.3 Options Used to Create Design

Pad - Pad is a method of defining three-dimensional geometry by

projecting a two-dimensional section at a specified distance
normal to the sketching plane.

Pocket - Pocket is a method of extruding a profile or a surface and

removing the material resulting from the extrusion

Shaft - The Shaft tool creates a feature by revolving a sketched

section around a centerline.

Filet - A filet is a curved face of a constant or variable radius that

is tangent to, and that joins, two surfaces. Together, these three
surfaces form either an inside corner or an outside corner.

17
Chamfer - Chamfering consists in removing or adding a flat
section from a selected edge to create a beveled surface between
the two original faces common to that edge.

Draft - Drafts are defined on molded parts to make them easier to

remove from molds.

Thickness – Adds or removes to the face.

Translation - Moving a body.

Mirror -Mirroring a body or a list of features consists in

duplicating these elements using symmetry by selecting a face or
plane as reference.

Pattern - To duplicate the whole geometry of one or more features

and to position this geometry on a part.

18
3.3.4 Designed Parts Using Catia

Fig 3.3.4 (a) Design of Peltier, Heat Sinks, DC Fan

19
Fig:3.3.4 (b)Design of Insulated box and assembly of all parts.

20
3.3.5Final Design

Fig: 3.3.5 Final Design in Multi view.

21
3.3.6 Principle and characteristics of Thermoelectric Refrigeration:

Thermoelectric coolers operate by the Peltier effect. The device has two
sides. and when a DC electric current flows through the device, it brings
heat from one side to the other, so that one side gets cooler while the
other gets hotter. The " hot " side is attached to a heat sink so that it
remains at ambient temperature, while the cool side goes below room
temperature. In some applications, multiple coolers can be cascaded
together for lower temperature. Thermoelectric refrigeration works on the
principle of see beck effect in which the voltage is applied between two
different combinations of metal and due to effect of see beck the cooling
and heating phenomena happens which can be used accordingly for
different purposes.

Fig:3.3.5 Peltier Effect.

Following are the characteristics:

 Does not produce harmful gasses like CFCs.

 Noiseless operation

 No moving parts, no friction.

22
 Portable.

23
3.3.7 Uses TE Refrigerators

● Electronic

● Medical

● Aerospace

● Telecommunications

3.3.8 Applications of Cooling:

● Electronic enclosures.

● Laser diodes Laboratory instruments

● Temperature baths

● Refrigerators

● Telecommunications equipment

● Temperature control in missiles and space systems

● Heat transport ranges vary from a few mill watts to several thousand watts,
however , since the efficiency of TE devices are low , smaller heat transfer
applications are more practical.

24
3.4Method of Heat Transport:
There are several methods which can be employed to facilitate the transfer of heat
from the surface of the thermoelectric to the surrounding.

 Electrons can travel freely in the copper conductors but not so freely
in the semiconductor.

 As the electrons leave the copper and enter the hot side of the p -
type, they must fill a " hole " in order to move through the p - type.
When the electrons fill a hole, they drop down to a lower energy
level and release heat in the process.

 Then, as the electrons move from the p - type into the copper
conductor on the cold side, the electrons are bumped back to a higher
energy level and absorb heat in the process.

 Next, the electrons move freely through the copper until they reach
the cold side of the n - type semiconductor. When the electrons move
into the n type, they must bump up an energy level in order to move
through the semiconductor. Heat is absorbed when this occurs.

 Finally, when the electrons leave the hot - side of the n type, they can
move freely in the copper. They drop down to a lower energy level
and release heat in the process.

 To increase heat transport, several p type or n type thermoelectric

(TE) components can be hooked up in parallel.

 However, the device requires low voltage and therefore, a large

current which is too great to be commercially practical.

25
3.5 Thermoelectric cooling (TEC):

Thermoelectric cooling (TEC) is also known as solid-state cooling,

because there is no liquid refrigerant running through the machine
Instead, solidmetalis used to transfer thermal energy.

3.5.1 Thermoelectric Refrigerator cooling process:

The Thermoelectric cooling systems rely on electricity flowing through

two different types of conductors – such as different types of metal like
copper or zinc. When DC voltage is applied and direct current runs from
one conductor to the other, there’s a change in temperature where the two
conductors join. When this small thermoelectric effect is multiplied by
creating junctions between two ceramic plates, a cooling effect strong.

Fig:3.5.1 TER cooling process

3.5.2 Working in Peltier module:

One plate is the “cool side” while the other is the “hot side.” The cold
side goes inside an ice-free cooler or wine refrigerator, while the hot side
is connected to metal fins that act as a heat sink to help dissipate excess
heat on the outside of the appliance.
26
3.6 Fabrication and Assemble

The Thermoelectric refrigerator is assembled with the help of Peltier

module with screws and nuts. The Peltier module is fixed in between two
heat sinks and thermal paste is applied to develop contact surface with the
heat sink and Peltier module.The Dc fan is fixed on long heat sink with
help of screws and nuts to remove heat from inside the insulated chamber
and release outside.And small Dc fan is placed on small heat sink with
the help of screws to cool the insulated chamber and responsible for fast
condensate of small heat sink.

3.6.1 Before and After Assembly

Fig 3.6.1 Parts before and after Assembly

27
3.6.2 Assembly drawing:

Fig 3.6.2Assembly of Peltier module, heatsinks and Dc fan

28
3.7 Nomenclature

COP - Coefficient of performance

I - Current
K - Thermal conductivity
Q - Heating and cooling rate
Qh - Heat rejection
Ql - Heat absorption
R - Electric Resistance
T - Temperature
Tc - cold side temperature
Th - hot side temperature
ΔΤ - Temperature Difference
TEC - Thermoelectric cooler
P - Power consumption
S - see beck coefficient

3.7.1 Experimental Setup

This presents the detailed information of instruments,

working procedure, operating parameters of thermoelectric cooler.

TEC Specification

In this study we use TEC1-12706 a thermoelectric

Module, which specification are as follow.

29
Table: Model number for TER

Module:TEC1-127-06L

Qmax 60 Watts Dimensions

Imax 6 Amps Width 40mm
Vmax 15.4V Length 40mm
Tmax 90 C Thickness 3.5mm
Number of 127
thermocouple

Table 3.7.1 Observations ofPeltier

3.7.2 Design &Measurement of Temperature

Every specific application where a thermoelectric cooler Module or refrigerator is
required is characterized by a set of operation parameters, which dictate the necessity
and Accurate selection of the optional thermoelectric cooler type of single-stage
Thermoelectric cooler module.

A.Thermoelectric Cooler Module

The thermoelectric cooler module material chosen is
Bismuth telluride. The properties of a 127 couple, 6A
Bismuth Telluride module TEC1-127-06L are:
See beck coefficient (S) = 0.01229 V/k
Module thermal conductance (K) = 0.1815 W/k
Module resistance ® = 4Ω

B. Thermal Resistance Network

Thermal resistance network is conducted here for analysis.
Since TEC generates Joule heat, it makes heat rejection,
Which is called QH, from TEC hot side larger than the heat
Absorption, which is called QL, into TEC cold side.
According to literatures, the general forms of heat
30
Absorption and heat rejection are presented as bellow. Heat
Transferred into the cold side when neglected the
Temperature drop through the TEC is given by,

QL = [SITc – ½ I²R-k (Th-Tc)] (-) sign for heat rejection.

While the heat transferred out of the hot side into the heat
Sink is given by,

QH= [SITc + ½ I²R-k (Th-Tc)]

See beck coefficient (S) and electrical resistance ® in ohms are dependent
both on the materials used within the TEC, but also on the geometry of the
device, given by the number and dimensions of the individual N and P-type
Semiconductor elements.

C. Temperature difference
After measuring the temperature by radiation pyrometer,
final temperature at the surface of module and the heat sink
are as follow.
Temperature at hot side Th = 68˚ C
Temperature at cold side Tc = 17˚ C
So, Temperature difference can be considered as
T= (Th − Tc) = (68-17) = 51˚C

D. COP of Single stage thermoelectric cooler

A non-dimensionless parameter called the Coefficient of Performance is therefore
used to measure the performance of a cooling machine. The coefficient of performance
(COP) of a thermoelectric module which is the thermal efficiency must be considered
for a TE system. COP is the ratio of the thermal output power and the electrical input

31
power of the TEC. COP can be calculated by dividing the amount of heat absorbed at
the cold side to the input powerCOP = QL/Energy supplied (W)Heat absorption is
calculated as bellow.
QL = -[SITc – ½ I²R-k (Th-Tc)]
=58.21185
From the first law of thermodynamics, the Energy supplied is:
Energy supplied, W = QH - QL
From the first law of thermodynamics, the Energy supplied is:
Energy supplied, W = QH - QL
=SI (Th − Tc) + I²R
=103.13395

3.8. Coefficient of Performance

The Coefficient of Performance (COP) is obtained by the following empirical

equation.
COP = QL/Energy supplied
=[SITc – ½ I²R-k (Th-Tc)] /SI (Th − Tc) + I²R
=58.21185/103.13395
COP =0.564432

Here it is remarkable that the value of COP is still lower than the expectation.
Although the COP of a TE module is lower than that of conventional VCR system,
efforts have been made to develop thermoelectric domestic coolers to exploit the
advantages associated with this solid-state energy conversion technology. Further
improvement in the COP may be possible through using multi stage thermoelectric
module, improving module contact resistance, thermal interfaces and heat exchanger.
Among these possibilities use of multistage thermoelectric module is the simplest and
presently available method. Due to the performance limits of thermoelectric materials,
a single-stagethermoelectric cooler can only be operated over a small temperature

32
range. If the temperature ratio between the heat sink and the cooled space is large, a
single-stage thermoelectric cooler will lose its effectiveness. Thus, the application of
two- or multi-stage combined thermoelectric refrigerator is an important method of
improving the performance of thermoelectric refrigerator

3.8.1 COP with respect Time: (Theoretical)

COP 0.5259 0.5238 0.5323 0.5308 0.5321

Time 30 60 120 180 240

(min)

Table: 3.8.1 Theoretical Observations

3.8.2 COP with respect Time: (practical)

COP 0.5240 0.5221 0.5318 0.5308 0.5283

Time 30 60 120 180 240

(min)

Table:3.8.2 Practical Observations

3.8.3 Graph: COP vs Time

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Fig: 3.8.3 Coefficient of Performance

34
 CHAPTER 4

RESULTS

In this chapter we learn about the experiments carried out on the

Thermoelectric refrigerator to test its cooling rate on various components of

various time period after complete fabrication of the TER. Average

Coefficient of performance (COP)= 0.564432

The project “Portable thermoelectric refrigerator” was designed to cool the

water bottles, food items, aluminum heat sink which is placed with Peltier

module. And when the user on the cooling process can be carried out the

condensate particle is forced to cool the items in a refrigerator.

4.1 Experimental results:

After the complete fabrication of the “Portable thermoelectric

refrigerator” to know the working performance, we tested the Peltier
module on various time period at particular temperature under proper
safety.

4.1.1 Experiment on plastic water bottle and Coca Cola(Tin):

The experiment is carried out on Peltier module which under goes

two different operations i.e., cooling and heating of 17°C and 68°C on
Coefficient of performance is 0.564432.

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 Fig: 4.1.1 Cooling test result on Plastic Water Bottle

4.1.2 Experiment on glass sheet:

The experiment is carried out on coca cola (tin) which under goes
cooling 14°C of coefficient of performance (COP) is 0.56428 and heat
transfer 76°C it took 90 min to cool the Tin.

Fig 4.1.2 Cooling test on Coca Cola (Tin)

36
 CHAPTER 5

CONCLUSION

A portable mini refrigerator prototype was designed and built which can

be used for personal cooling. It was constructed by using Thermocol with

perfect dimensions. It is successful and the temperature readings were

recorded. Cooling stabilizes within one hour once the switch is turned

ON. It had been shown from testing results that the portable mini fridge is

capable of cooling the can. All the components in the project had been

tested individually and the results were found to be positive

37
 CHAPTER 6

REFERENCES

The sites which were used while doing this project:

1. www.wikepedia.com
2. www.researchgate.net
3. www.intechopen.com
4. www.britannica.com
5. www.academia.edu
6. www.sciencedirect.com
7. www.iopscience.iop.org

References:
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[2]. Arvind Yadav, Durgesh Srivastav, Gaurav Kumar, Amit Kumar

Yadav, AkshayGoswami.” Experimental Investigation and Analysis of
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[3].J. Vian, D. Austrian, “Development of a heat exchanger for the cold

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(2008) ISSN: 1514-1521.

[4].Kirti Singh, NishitaSakhare, SangitaJambhulkar, “Compressor-Less

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Advanced Engineering,Vol. ISSN: 2250-2459, Issue: 3 [Feb-2013].

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[6].MeghaGaikwad, DhanashriShevade, AbhijitKadam ,
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Books referred:

1. Design and analysis of thermoelectric refrigerator / Yashpalsinhdhabi /

NirveshMehta.
2. Thermoelectric refrigerator - H.J. Goldsmid.
3. Thermoelectric basic principles and new material development /
G.S Nalos/J. Sharp.

*****

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