SIMATIC IPC677D

Preface

Overview 1

Safety instructions 2
SIMATIC
Mounting and connecting the
device 3
Industrial PC
SIMATIC IPC677D 4
Commissioning the device

Operating the device and

device functions 5
Operating Instructions
Expanding the device and
assigning device parameters 6
Maintaining and servicing
your device 7

Technical information 8

Technical support A
Meaning of the symbols on
your device B

List of abbreviations C

01/2020
A5E32995420-AE
Legal information
Warning notice system
This manual contains notices you have to observe in order to ensure your personal safety, as well as to prevent
damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert
symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are
graded according to the degree of danger.

DANGER
indicates that death or severe personal injury will result if proper precautions are not taken.

WARNING
indicates that death or severe personal injury may result if proper precautions are not taken.

CAUTION
indicates that minor personal injury can result if proper precautions are not taken.

NOTICE
indicates that property damage can result if proper precautions are not taken.
If more than one degree of danger is present, the warning notice representing the highest degree of danger will
be used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to
property damage.
Qualified Personnel
The product/system described in this documentation may be operated only by personnel qualified for the specific
task in accordance with the relevant documentation, in particular its warning notices and safety instructions.
Qualified personnel are those who, based on their training and experience, are capable of identifying risks and
avoiding potential hazards when working with these products/systems.
Proper use of Siemens products
Note the following:

WARNING
Siemens products may only be used for the applications described in the catalog and in the relevant technical
documentation. If products and components from other manufacturers are used, these must be recommended
or approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and
maintenance are required to ensure that the products operate safely and without any problems. The permissible
ambient conditions must be complied with. The information in the relevant documentation must be observed.

Trademarks
All names identified by ® are registered trademarks of Siemens AG. The remaining trademarks in this publication
may be trademarks whose use by third parties for their own purposes could violate the rights of the owner.
Disclaimer of Liability
We have reviewed the contents of this publication to ensure consistency with the hardware and software
described. Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the
information in this publication is reviewed regularly and any necessary corrections are included in subsequent
editions.

Siemens AG A5E32995420-AE Copyright © Siemens AG 2020.

Division Digital Factory Ⓟ 02/2020 Subject to change All rights reserved
Postfach 48 48
90026 NÜRNBERG
GERMANY
Preface

Purpose of the operating instructions

These operating instructions contain all the information you need for commissioning and
operating the SIMATIC IPC677D.
It is intended both for programming and testing personnel who commission the device and
connect it with other units (automation systems, programming devices), as well as for service
and maintenance personnel who install add-ons or carry out fault/error analyses.

Basic knowledge required

A solid background in personal computers and Microsoft operating systems is required to
understand this manual. General knowledge in the field automation control engineering is
recommended.

Scope of the operating instructions

These operating instructions apply to devices with the following order numbers 6AV7260.....

Scope of the documentation

The documentation for the IPC includes the following:
● SIMATIC IPC677D Quick Install Guide with product information about the device, for
example important notes
● SIMATIC IPC677D operating instructions
The documentation is supplied with the IPC in German and English in electronic form as a
PDF file on the Documentation and Drivers CD/DVD.

Conventions
In these operating instructions, the term "device" is also used to refer to the
"SIMATIC IPC677D".
The SIMATIC IPC677D consists of an operator panel with touch screen and a
SIMATIC IPC627D computer unit. In these operating instructions, you also find descriptions
and illustrations of the SIMATIC IPC627D which apply to the SIMATIC IPC677D.
"CP" is used as an abbreviation for "CP 1616 onboard" (for PROFINET) or "CP 5622" (for
PROFIBUS).
In these operating instructions, "Windows Embedded Standard" is also used as a standard
term for "Windows Embedded Standard 7". "Windows 7" is used as an abbreviation for
"Windows 7 Ultimate".

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Preface

A touch device generally refers to a device with a capacitive touch screen or a resistive
touch screen. Touch screen is the general term for a capacitive multi-touch screen and
resistive single touch screen.

Note
A note is important information about the product, handling the product or a reference to
specific sections of the documentation that require special consideration.

History
The following editions of these operating instructions have already been published:

Edition Comments
12/2013 First edition
06/2014 Description of devices with capacitive multi-touch screen
09/2014 Revision: HDD in a removable drive bay and RAID
Update with IPC Wizard 2.1 and corrections
06/2019 Revision: Power supply, Windows 10

See also
Technical specifications (Page 131)
Certificates and approvals (Page 117)

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Table of contents

Preface ...................................................................................................................................................... 3
1 Overview.................................................................................................................................................. 10
1.1 Product description .................................................................................................................10
1.1.1 Applications.............................................................................................................................12
1.1.2 Features ..................................................................................................................................12
1.2 Design of the device ...............................................................................................................16
1.2.1 Operator controls and interfaces ............................................................................................16
1.2.2 Status displays ........................................................................................................................18
1.2.3 PROFINET status displays .....................................................................................................19
1.3 Accessories.............................................................................................................................20
2 Safety instructions ................................................................................................................................... 21
2.1 General safety instructions .....................................................................................................21
2.2 Notes on usage .......................................................................................................................25
3 Mounting and connecting the device........................................................................................................ 27
3.1 Preparing for mounting ...........................................................................................................27
3.1.1 Checking the delivery package ...............................................................................................27
3.1.2 Device identification data ........................................................................................................29
3.1.3 Permitted mounting positions .................................................................................................31
3.1.4 Preparing the mounting cutout................................................................................................33
3.2 Mounting the device ................................................................................................................35
3.2.1 Installation guidelines .............................................................................................................35
3.2.2 Mounting clips or mounting brackets, position for IP65 ..........................................................37
3.2.3 Mounting the device with mounting clips ................................................................................38
3.2.4 Mounting the device with mounting brackets ..........................................................................40
3.2.5 Position of the mounting clips for IP66-complaint installation ................................................42
3.3 Connecting the device ............................................................................................................43
3.3.1 Wiring information ...................................................................................................................43
3.3.2 Connecting the Equipotential Bonding Circuit ........................................................................44
3.3.3 Connecting 100-240 VAC power supply .................................................................................45
3.3.4 Connecting the 24 VDC power supply ....................................................................................48
3.3.5 Connecting peripheral equipment ...........................................................................................50
3.3.6 Connecting the device to networks .........................................................................................51
3.3.7 PROFINET ..............................................................................................................................52
3.3.8 Connecting Ethernet/USB strain relief ....................................................................................53
3.3.9 Connecting the PROFINET strain relief ..................................................................................54

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Table of contents

4 Commissioning the device ....................................................................................................................... 55

4.1 Notes on commissioning and operation ................................................................................. 55
4.2 Switching on the device ......................................................................................................... 56
4.3 Automatic switching on of the device ..................................................................................... 57
4.4 Windows Action Center .......................................................................................................... 57
4.5 Notes on different device configurations ................................................................................ 58
4.5.1 RAID1 system (optional) ........................................................................................................ 58
4.5.2 Notes on the DVD burner....................................................................................................... 60
4.6 Switching off the device ......................................................................................................... 61
5 Operating the device and device functions .............................................................................................. 62
5.1 Operator input options ........................................................................................................... 62
5.2 Operating a device with resistive single touch screen ........................................................... 63
5.3 Operating a device with capacitive multi-touch screen .......................................................... 64
5.4 IPC Wizard functions ............................................................................................................. 66
5.5 Extended device functions ..................................................................................................... 67
5.5.1 Monitoring functions ............................................................................................................... 67
5.5.1.1 Overview of the monitoring functions ..................................................................................... 67
5.5.1.2 Temperature monitoring/display ............................................................................................ 68
5.5.1.3 Watchdog (WD)...................................................................................................................... 68
5.5.1.4 Battery monitoring .................................................................................................................. 69
5.5.2 Enhanced Write Filter (EWF) ................................................................................................. 70
5.5.3 File Based Write Filter (FBWF) .............................................................................................. 73
5.5.4 Buffer memory SRAM (optional) ............................................................................................ 75
5.5.5 Active Management Technology (AMT) ................................................................................ 75
5.5.6 Trusted Platform Modul (TPM)............................................................................................... 77
6 Expanding the device and assigning device parameters ......................................................................... 78
6.1 Opening the Device ............................................................................................................... 78
6.2 Expanding memory ................................................................................................................ 79
6.3 Expansion cards .................................................................................................................... 81
6.3.1 Notes on the expansion cards ............................................................................................... 81
6.3.2 Removing and installing expansion cards ............................................................................. 81
6.4 Drives ..................................................................................................................................... 83
6.4.1 Installation options for internal drives .................................................................................... 83
6.4.2 Removing and installing the drive bay module ...................................................................... 84
6.4.3 Removing and installing hard disks ....................................................................................... 85
6.4.4 Removing and installing an SSD drive .................................................................................. 87
6.4.5 Installation options for external drives ................................................................................... 88
6.4.6 Removing and installing a DVD drive .................................................................................... 89

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7 Maintaining and servicing your device ..................................................................................................... 91

7.1 Maintenance ...........................................................................................................................91
7.2 Managing RAID systems ........................................................................................................91
7.2.1 Example for a RAID1 system during the boot phase of the system .......................................91
7.2.2 RAID software .........................................................................................................................92
7.2.3 Checking the status of the RAID system ................................................................................93
7.2.4 Displaying a defective hard disk of a RAID system in the RAID software ..............................94
7.2.5 Special feature: Replacing hard disk in the RAID system when switched off ........................94
7.2.6 Integrating a new hard disk drive in the RAID system ............................................................95
7.3 Service and spare parts ..........................................................................................................97
7.4 Cleaning the Device Front ......................................................................................................99
7.5 Separating the control unit from the computer unit...............................................................100
7.6 Connecting the control unit with the computer unit...............................................................102
7.7 Removing and installing hardware........................................................................................104
7.7.1 Replacing a defective hard disk drive in the RAID system ...................................................104
7.7.2 Removing and installing the hard disk in the removable drive bay ......................................105
7.7.3 Replacing the Backup Battery ..............................................................................................106
7.7.4 Removing and installing the power supply ...........................................................................108
7.7.5 Removing and installing the bus board.................................................................................109
7.7.6 Removing and installing the power supply fan .....................................................................110
7.7.7 Removing and installing the device fan ................................................................................112
7.7.8 Replacing the processor .......................................................................................................114
7.8 Recycling and disposal .........................................................................................................116
7.9 Installing operating system, software and drivers.................................................................116
7.9.1 Installing the operating system .............................................................................................116
7.9.2 Installing software and drivers ..............................................................................................116
8 Technical information............................................................................................................................. 117
8.1 Certificates and approvals ....................................................................................................117
8.1.1 KC Mark (Korea) ...................................................................................................................119
8.2 Directives and declarations ...................................................................................................120
8.2.1 CE marking ...........................................................................................................................120
8.2.2 ESD guideline .......................................................................................................................121
8.3 Dimension drawings..............................................................................................................124
8.3.1 Dimension drawing of 15" device with capacitive multi-touch screen ..................................124
8.3.2 Dimension drawing of 19" device with capacitive multi-touch screen ..................................125
8.3.3 Dimension drawing of 22" device with capacitive multi-touch screen ..................................126
8.3.4 Dimension drawing of 15" device with resistive single touch screen....................................127
8.3.5 Dimension drawing of 19" device with resistive single touch screen....................................128
8.3.6 Dimension drawing of 22" device with resistive single touch screen....................................129
8.3.7 Dimensional drawing for the installation of expansion cards ................................................130

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8.4 Technical specifications ....................................................................................................... 131

8.4.1 General technical specifications .......................................................................................... 131
8.4.2 Ambient conditions ............................................................................................................... 135
8.4.3 Current and power requirements ......................................................................................... 136
8.4.4 AC voltage supply ................................................................................................................ 137
8.4.5 DC power supply .................................................................................................................. 139
8.5 Hardware descriptions ......................................................................................................... 140
8.5.1 Motherboard ......................................................................................................................... 140
8.5.1.1 Structure and functions of the motherboard ........................................................................ 140
8.5.1.2 Position of the interfaces on the motherboard ..................................................................... 141
8.5.1.3 Internal interfaces ................................................................................................................ 142
8.5.1.4 Front ports ............................................................................................................................ 144
8.5.2 Bus board ............................................................................................................................. 145
8.5.2.1 Layout and principle of operation ......................................................................................... 145
8.5.2.2 PCI slot pin assignment ....................................................................................................... 147
8.5.2.3 Pin assignment 12 V power supply connection for expansion cards................................... 148
8.5.2.4 PCI Express slot x16 pin assignment .................................................................................. 149
8.5.3 External ports ....................................................................................................................... 151
8.5.3.1 COM1/COM2 ....................................................................................................................... 151
8.5.3.2 DisplayPort ........................................................................................................................... 152
8.5.3.3 DVI-I ..................................................................................................................................... 153
8.5.3.4 Ethernet................................................................................................................................ 154
8.5.3.5 USB 3.0 ................................................................................................................................ 154
8.5.3.6 PROFIBUS ........................................................................................................................... 155
8.5.3.7 PROFINET ........................................................................................................................... 155
8.5.4 System resources ................................................................................................................ 156
8.5.4.1 Currently allocated system resources .................................................................................. 156
8.5.4.2 System resources used by the BIOS/DOS .......................................................................... 156
8.5.5 Assignment of expansion interfaces to the software in the TIA Portal (CP assignment) .... 163
8.5.6 CP 1616 onboard communications processor ..................................................................... 164
8.5.6.1 Properties ............................................................................................................................. 164
8.5.6.2 Typical Communication Partners ......................................................................................... 165
8.5.6.3 Firmware Loader .................................................................................................................. 167
8.5.6.4 Further actions in STEP 7/NCM PC..................................................................................... 169
8.6 BIOS description .................................................................................................................. 170
8.6.1 Overview .............................................................................................................................. 170
8.6.2 Opening the BIOS selection menu....................................................................................... 171
8.6.3 Configuration ........................................................................................................................ 173
8.6.4 Exit menu ............................................................................................................................. 175
8.6.5 General BIOS Setup settings ............................................................................................... 176
8.6.6 BIOS update......................................................................................................................... 181
8.6.7 Alarm, error and system messages ..................................................................................... 182

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8.7 Active Management Technology (AMT) ...............................................................................183

8.7.1 Introduction ...........................................................................................................................183
8.7.2 Overview of AMT ..................................................................................................................184
8.7.3 Enabling Intel® AMT / basic configuration............................................................................184
8.7.4 Resetting the Intel® AMT to the default settings and disabling AMT ...................................186
8.7.5 Determining the network address .........................................................................................186
8.7.6 Forcing user consent ............................................................................................................187
8.8 Functional scope in Windows ...............................................................................................188
8.8.1 Windows Embedded Standard 7 Professional .....................................................................188
A Technical support .................................................................................................................................. 190
A.1 Service and support ..............................................................................................................190
A.2 Troubleshooting ....................................................................................................................191
B Meaning of the symbols on your device ................................................................................................. 194
B.1 Meaning of the symbols on your device ...............................................................................194
B.2 Safety ....................................................................................................................................194
B.3 Operator controls ..................................................................................................................194
B.4 Certificates, approvals and markings....................................................................................195
B.5 Interfaces ..............................................................................................................................196
B.6 Directives and declarations ...................................................................................................197
C List of abbreviations ............................................................................................................................... 198
C.1 Abbreviations ........................................................................................................................198
Glossary ................................................................................................................................................ 204
Index ...................................................................................................................................................... 212

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Overview 1
1.1 Product description
Devices with capacitive multi-touch screen

Devices with resistive single touch screen

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 Overview
1.1 Product description

Features
The SIMATIC IPC677D provides high-level industrial functionality.
● Compact design
● Maintenance-free operation
● Rugged
The color display is equipped with TFT technology in widescreen format and LED
backlighting.
Device with a resistive single touch screen comes with a front-side USB port for connection
of external peripheral devices.

Device variants
The delivery note contains information on the precise scope of functions and product
package for your device.
The SIMATIC IPC677D is available in the following device variants, which differ in regard to
the display size, operating method and optional expansions.

Devices with capacitive multi-touch screen

● Display:
– 15'' display, resolution 1366 × 768 pixels
– 19'' display, resolution 1366 × 768 pixels
– 22'' display, resolution 1920 × 1080 pixels

Devices with resistive single touch screen

● Display:
– 15" display, resolution 1280 × 800 pixels
– 19'' display, resolution 1366 × 768 pixels
– 22'' display, resolution 1920 × 1080 pixels

Operating systems
The following operating systems are approved for the devices:
● Windows 7 Ultimate (32/64-bit)
● Windows Embedded Standard 7 P (32/64-bit)

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Overview
1.1 Product description

1.1.1 Applications
The device are available for industrial PC systems for high-performance and space-saving
applications in particular in the field of machine, plant and control cabinet engineering:
● Measuring and controlling process and machine data, for example, automated washing
systems, assembling machines and packaging machines
● Operating and visualization tasks, for example, information terminals and large-scale
displays in automobile manufacturing
● Data logging and processing, for example, system data logging and distributed process
control

1.1.2 Features

Basic data
Installation In control cabinet
Processor • Intel Xeon E3-1268L v3 2.3 (3.3) GHz, 4 cores, GT2, 8 MB cache,
HT, AMT
• Intel Core i3-4330TE 2.4 GHz, 2 cores, GT2, 3 MB cache
• Intel Celeron G1820TE 2.2 GHz, 2 cores, GT1, 2 MB cache
Main memory Maximum memory configuration 16 GB with the following memory
modules:
without ECC:
• 2 GB DDR3 SDRAM
• 4 GB DDR3 SDRAM
• 8 GB DDR3 SDRAM
with ECC:
• 4 GB DDR3 ECC
• 8 GB DDR3 ECC
Equipment options with ex- • 2 × PCI
pansion cards
• 1 × PCI, 1 × PCIe x16 Gen3
• 1 × PCIe x4 Gen2, 1 × PCIe x16 Gen3
Maximum bandwidth of PCI 133 Mbps
slots
Maximum bandwidth of PCI Gen 2: 5 GT/s (500 Mbps) bandwidth per lane
slots Gen 3: 8 GT/s (985 Mbps) bandwidth per lane

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 Overview
1.1 Product description

Basic data
Graphics • Intel® HD Graphics Controller P4600/4700 GT1/GT2
2D and 3D engine integrated in chipset
Dynamic Video Memory Technology
(requires up to 512 MB in main memory)
• DVI/VGA resolution up to 1920 × 1200 pixels
• Graphics memory is claimed in main memory (dynamic UMA)
• Triple Head Mode
DisplayPort resolutions depend on the graphics controller in the CPU,
which is represented by the processor:
• Celeron G1820TE: GT1 (HD Graphics),
maximum resolutions up to 2560 × 1600
• Core I3-4330TE: GT2 (HD Graphics 4600),
maximum resolutions up to 3840 × 2160
• XEON E3-1268L v3: GT2 (HD Graphics 4600)
maximum resolutions up to 3840 × 2160
Power supply • 120 V / 230 VAC, 190 W; wide range
• 24 VDC, 210 W
AC and DC power supply with short-term power failure backup in
accordance with NAMUR: maximum of 20 ms at 0.85 rated voltage.
The 24 VDC power supply is protected against reverse polarity con-
nection.
Drives and storage media
Hard disk • 1 × 3.5" ≥ 500 GB, SATA
• 2 × 2.5" ≥ 250 GB, SATA only with
RAID1 system for automatic data mirroring on two hard disks
SSD (Solid State Disk) 2.5" ≥ 240 GB Standard
USB stick External, can be connected via USB port
DVD drive DVD burner (slimline), optional
• DVD+/-R/RW, CD, CD-RW, DVD-RAM
• Double layer functionality

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Overview
1.1 Product description

Basic data
Interfaces
Ethernet 2 × 10/100/1000 Mbps, (2 x RJ45)
Wake on LAN, Remote Boot and teaming are supported:
PROFIBUS/MPI 12 Mbps, electrically isolated, compatible with CP 5622, optional
PROFINET 3 × 10/100 bps, CP 1616 on-board, RJ45, optional
USB • Front: 1 × USB 3.0 high current

(only for devices with resistive single touch screen)

• External: 4 × USB 3.0 high current
(a maximum of 2 can be operated as high current at the same
time)
• External, optional: 1 × USB 2.0 high current, 1 × low current
• Internal: 1 × USB 3.0 high current for internal USB stick/dongle
COM Serial V.24 port
COM2/LPT optional
Monitor • 1 x DVI-I (VGA monitors can be connected with a DVI/VGA adapt-
er acquired separately)
• 1 x DisplayPort

Software
Operating systems • Without
• Windows 7 Ultimate 32-bit 1, 2
• Windows 7 Ultimate 64-bit 1, 2
• Windows Embedded Standard 7 Professional 32-bit 3
• Windows 10 Enterprise 2016 LTSB 64-bit1, 4, 5
• Windows 10 Enterprise IoT 2015 LTSB 64-bit1, 4, 5

1 MUI: Multi-language user interface; English, German, French, Italian, Spanish

2 Pre-installed / Recovery and Restore DVD enclosed
3 Pre-installed on SSD ≥80 GB / Restore DVD enclosed.
4 Pre-installed or included on USB flash drive
5 Activation is not absolutely necessary for full functionality of Windows. Activation occurs automati-
cally as soon as the IPC has been connected to the Internet and was able to connect to the Mi-
crosoft activation servers.

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 Overview
1.1 Product description

Optional software
SIMATIC IPC DiagMonitor V5.0.2 or Software tool for local as well as remote monitoring of
higher SIMATIC PCs:
• Watchdog
• Temperature
• Fan speed
• Hard disk monitoring (SMART)
Communication:
• Ethernet interface (SNMP protocol)
• OPC for integrating in SIMATIC software
• Client server architecture
• Structure of log files
SIMATIC IPC Image & Partition Crea- Software tool for local data backup and hard disk parti-
tor V3.5.1 or higher tioning

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Overview
1.2 Design of the device

1.2 Design of the device

1.2.1 Operator controls and interfaces

Device with PROFIBUS interface

① PROFIBUS DP/MPI PROFIBUS DP/MPI interface (RS 485, isolated), 9-pin sub D socket
fieldbus
② On/off switch You switch on the device with the on/off switch. This requires that the
BIOS setup entry "After Power Failure" is set to "Power On".
The on/off switch does not isolate the device from the power supply.
Position "ON", when the "-)" symbol is pressed inward on the device.
Position "OFF" is the factory state.
③ 100-240 VAC Power supply connection
④ 2 × Ethernet • X1P1, left: RJ45 Ethernet port 1 (exclusive PCI interrupt) with
10/100/1000 Mbps, iAMT capable
• X2P1, right: RJ45 Ethernet port 2 (shared PCI interrupt) with
10/100/1000 Mbps
⑤ 4 × USB USB 3.0 high current, backward compatible with USB 2.0/1.1
⑥ COM1 Serial interface
⑦ DisplayPort DisplayPort connection for digital monitor
⑧ DVI-I DVI connector for CRT or LCD monitor with DVI port
⑨ PCI/PCIe expansion behind the cover
cards,
COM2/LPT and USB
on expansion card
(optional)

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1.2 Design of the device

⑩ On/off button The on/off button has three functions:

• Switch on the PC: Briefly press once
• Shut down operating system and switch off PC: Briefly press once
• Switch off PC without shutting down the operating system (hardware
reset): Press for more than 4 seconds.
Note: The BIOS setup entry "After Power Failure" has been set to
"Power On". This means the device is switched on with the on/off
switch. You then do not need to press the on/off button.
⑪ 4 status LEDs Status display of the operating state

Device with PROFINET interface

The following PROFINET interface is located at the position of the PROFIBUS interface ①
in the figure above:

① CP 1616 onboard interface, three RJ45 sockets for devices with PROFINET, IRT capable

Device with COM2/LPT and USB expansion (optional)

The following expansion cards are located at the position of the cover ⑨ in the figure above:

① LPT X32
② COM X31
③ USB X64, X65

Devices with resistive single-touch screen

Note
If you open the sealed cover for the front USB port, the degree of protection IP65 for the
front of the device is no longer guaranteed.

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Overview
1.2 Design of the device

1.2.2 Status displays

The status display consists of four two-colored LEDs.

Position LED State Description

① PC ON/WD Off -
Green BIOS ready to boot
Flashing BIOS in POST, power switch on
green/yellow (1 Hz)
Yellow Idle state
Flashing red (1 Hz) Watchdog status display: active
② RUN/STOP / L1 Off -
Green Can be controlled by user program
Yellow Can be controlled by controller program (e.g.
WinAC)
③ ERROR / L2 Off -
Red -
Flashing red Can be controlled by user program or controller
program (e.g. WinAC)
④ MAINT / L3 Off -
Yellow -
Red Can be controlled by controller program (e.g.
WinAC)

For additional information on controlling the LEDs or the SRAM with a Windows operating
system, please refer to the chapter "Buffer memory SRAM (optional) (Page 75)". Example
programs for controlling the LEDs under Windows operating systems is available on the
Internet at the following address: Technical support
(https://support.industry.siemens.com/cs/ww/en/)

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 Overview
1.2 Design of the device

1.2.3 PROFINET status displays

PROFINET status display

Display Meaning LED Description

① SF Status display for CP OFF • CP not available
PROFINET, op- 1616 onboard
• CP disabled
tional
• No error, communication es-
tablished
• Download in progress
Slow flashing • Link status error
• IO controller: IO device cannot
be addressed
• IO controller: Duplicate IP
address
Fast flashing Exception error: Diagnostics via
Web or SNMP no longer possible
AN • Diagnostic information availa-
ble
• No communication estab-
lished.

Virtual status displays

The two "virtual" CP 1616 LEDs can only be seen in the SIMATIC software and can be scanned via
SNMP.
PROFINET Virtual LEDs RUN CP is active
STOP CP is in the stop state
Flashes There are no "slow flashing" or
"fast flashing" states.

See also
Industry Automation and Drive Technologies - Homepage
(http://www.siemens.com/automation/service&support)

SIMATIC IPC677D
Operating Instructions, 01/2020, A5E32995420-AE 19
Overview
1.3 Accessories

1.3 Accessories
Accessories are available for your device. These are not included in the product package.
You can find Information on available accessories on the Internet at:
● Industry Mall (https://mall.industry.siemens.com)
● Expansion components and accessories (http://www.automation.siemens.com/mcms/pc-
based-automation/en/industrial-pc/expansion_components_accessories)

Other accessories
● Touch stylus for devices with resistive single touch screen

● Mounting bracket
If there are strict requirements for the front seal, fasten the device in a cabinet with
mounting brackets.

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Safety instructions 2
2.1 General safety instructions

WARNING
Life-threatening voltages are present with an open control cabinet
When you install the device in a control cabinet, some areas or components in the open
control cabinet may be carrying life-threatening voltages.
If you touch these areas or components, you may be killed by electric shock.
Switch off the power supply to the cabinet before opening it.

System expansions

NOTICE
Damage through system expansions
Device and system expansions may be faulty and can affect the entire machine or plant.
The installation of expansions can damage the device, machine or plant. Device and
system expansions may violate safety rules and regulations regarding radio interference
suppression. If you install or exchange system expansions and damage your device, the
warranty becomes void.

Note the following for system expansions:

● Only install system expansion devices designed for this device. Contact your technical
support team or where you purchased your PC to find out which system expansion
devices may safely be installed.
● Observe the information on electromagnetic compatibility (Page 120).

NOTICE
"Open Type" UL508
Note that the device is classified as "Open Type" for use in the area of Industrial Control
Equipment (UL508). Installation of the device in an enclosure complying with UL508 for
specific permitted mounting positions (see corresponding section) is a prerequisite for
approval or operation in accordance with UL508.

SIMATIC IPC677D
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Safety instructions
2.1 General safety instructions

WARNING
Risk of fire through expansion cards
Expansion cards generate additional heat. The device may overheat and cause a fire.
Please note the following:
• Observe the safety and installation instructions for the expansion cards.
• If in doubt, install the device in an enclosure that is compliant with sections 4.6 and 4.7.3
of the IEC/EN/DIN-EN 60950-1 standard.

Battery and rechargeable battery

WARNING
Risk of explosion and release of harmful substances
Improper handling of lithium batteries can result in an explosion of the batteries.
Explosion of the batteries and the released pollutants can cause severe physical injury.
Worn batteries jeopardize the function of the device.
Note the following when handling lithium batteries:
• Replace used batteries in good time; see the section "Replacing the backup battery" in
the operating instructions.
• Replace the lithium battery only with an identical battery or types recommended by the
manufacturer (order no.: A5E00331143).
• Do not throw lithium batteries into fire, do not solder on the cell body, do not recharge,
do not open, do not short-circuit, do not reverse polarity, do not heat above 100°C and
protect from direct sunlight, moisture and condensation.

High frequency radiation

NOTICE
Unintentional operating situations
High frequency radiation, e g. from a cellular phone, interferes with device functions and
can result in malfunctioning of the device.
Persons are injured and the plant is damaged.
Avoid high-frequency radiation:
• Remove radiation sources from the environment of the device.
• Switch off radiating devices.
• Reduce the radio output of radiating devices.
• Observe the information on electromagnetic compatibility (Page 120).

SIMATIC IPC677D
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 Safety instructions
2.1 General safety instructions

ESD Guideline
Electrostatic sensitive devices can be labeled with an appropriate symbol.

NOTICE
Electrostatic sensitive devices (ESD)
When you touch electrostatic sensitive components, you can destroy them through voltages
that are far below the human perception threshold.
If you work with components that can be destroyed by electrostatic discharge, observe the
ESD Guideline (Page 121).

Industrial Security
Siemens provides products and solutions with industrial security functions that support the
secure operation of plants, systems, machines and networks.
In order to protect plants, systems, machines and networks against cyber threats, it is
necessary to implement – and continuously maintain – a holistic, state-of-the-art industrial
security concept. Siemens’ products and solutions constitute one element of such a concept.
Customers are responsible for preventing unauthorized access to their plants, systems,
machines and networks. Such systems, machines and components should only be
connected to an enterprise network or the internet if and to the extent such a connection is
necessary and only when appropriate security measures (e.g. firewalls and/or network
segmentation) are in place.
For additional information on industrial security measures that may be implemented, please
visit.
Siemens’ products and solutions undergo continuous development to make them more
secure. Siemens strongly recommends that product updates are applied as soon as they are
available and that the latest product versions are used. Use of product versions that are no
longer supported, and failure to apply latest updates may increase customer’s exposure to
cyber threats.
To stay informed about product updates, subscribe to the Siemens Industrial Security RSS
Feed under.

Disclaimer for third-party software updates

This product includes third-party software. Siemens AG only provides a warranty for
updates/patches of the third-party software, if these have been distributed as part of a
Siemens software update service contract or officially released by Siemens AG. Otherwise,
updates/patches are undertaken at your own risk. You can find more information about our
Software Update Service offer on the Internet at Software Update Service
(http://www.automation.siemens.com/mcms/automation-software/en/software-update-
service).

SIMATIC IPC677D
Operating Instructions, 01/2020, A5E32995420-AE 23
Safety instructions
2.1 General safety instructions

Notes on protecting administrator accounts

A user with administrator privileges has extensive access and manipulation options in the
system.
Therefore, ensure there are adequate safeguards for protecting the administrator accounts
to prevent unauthorized changes. To do this, use secure passwords and a standard user
account for normal operation. Other measures, such as the use of security policies, should
be applied as needed.

See also
Industrial security (http://www.siemens.com/industrialsecurity)
Technical support (https://support.industry.siemens.com/cs/ww/en/)

SIMATIC IPC677D
24 Operating Instructions, 01/2020, A5E32995420-AE
 Safety instructions
2.2 Notes on usage

2.2 Notes on usage

NOTICE
Possible functional restrictions in case of non-validated plant operation
The device is tested and certified on the basis of the technical standards. In rare cases,
functional restrictions can occur during plant operation.
Validate the correct functioning of the plant to avoid functional restrictions.

Environment

NOTICE
Ambient conditions and chemical resistance
Unsuitable environmental conditions have a negative impact on device operation. Chemical
substances such as cleaners or fuels may alter the color, shape and structure of the device
surface, for example, the front panel.
The device may be damaged. possibly resulting in malfunctions.
For this reason, please observe the following precautions:
• Always operate the device in closed rooms. All warranties shall be void in the case of
noncompliance.
• Operate the device only in accordance with the ambient conditions specified in the
technical specifications.
• Protect the device against dust, moisture and heat.
• Do not expose the device to direct sunlight or to other strong sources of light.
• Without additional safety measures, such as a supply of clean air, the device may not be
used in locations with harsh operating conditions caused by acidic vapors or gases.
• Always use suitable cleaning agents. Read the information about Chemical resistance of
the HMI devices and industrial PCs
(https://support.industry.siemens.com/cs/ww/en/view/39718396) on the Internet.

Note
Use in an industrial environment without additional protective measures
The device has been designed for use in a normal industrial environment in accordance with
IEC 60721-3-3 (pollutant class 3C2 for chemical influences, 3S2 for dust without
contamination by sand).

SIMATIC IPC677D
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Safety instructions
2.2 Notes on usage

TFT displays

NOTICE
Burn-in effect and backlighting
A permanent picture with bright screen objects leads to a burn-in effect. The longer the
same screen contents are displayed, the longer it will take for the burn-in effect to
disappear. Screen savers reduce the risk of burn-in. The brightness of the backlighting
deteriorates over the course of the screen's life cycle.
Use the "BbcScreenSaver" to extend the life of the screen and the backlighting.

Defective pixels in the display

At present, the manufacturing process of modern displays does not guarantee that all pixels
of the display will be perfect. A small number of defective pixels in the display is therefore
unavoidable. This does not present a functional problem as long as the defective pixels are
not bunched in one location.
Additional information is available in the section "General technical specifications
(Page 131)".

SIMATIC IPC677D
26 Operating Instructions, 01/2020, A5E32995420-AE
Mounting and connecting the device 3
3.1 Preparing for mounting

3.1.1 Checking the delivery package

Procedure
1. When accepting a delivery, please check the packaging for visible transport damage.
2. If any transport damage is present at the time of delivery, lodge a complaint at the
shipping company in charge. Have the shipper confirm the transport damage
immediately.
3. Unpack the device at its installation location.
4. Keep the original packaging in case you have to transport the unit again.

Note
Damage to the device during transport and storage
If a device is transported or stored without packaging, shocks, vibrations, pressure and
moisture may impact the unprotected unit. Damaged packaging indicates that ambient
conditions have already had a massive impact on the device and it may be damaged.
This may cause the device, machine or plant to malfunction.
• Keep the original packaging.
• Pack the device in the original packaging for transportation and storage.

5. Check the contents of the packaging and any accessories you may have ordered for
completeness and damage.

SIMATIC IPC677D
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Mounting and connecting the device
3.1 Preparing for mounting

6. Please inform the delivery service immediately if the package contents are incomplete or
damaged or do not correspond with your order. Fax the enclosed form "SIMATIC IPC/PG
Quality Control Report".

DANGER
Electric shock and fire hazard due to damaged device
A damaged device can be under hazardous voltage and trigger a fire in the machine or
plant.
A damaged device has unpredictable properties and states.
Death or serious injury could occur.
• Avoid installing and commissioning a damaged device.
• Label the damaged device and keep it locked away.
• Send off the device for immediate repair.

NOTICE
Damage from condensation
If the device is subjected to low temperatures or extreme fluctuations in temperature
during transportation, as is the case in cold weather, for example, moisture can build up
on or inside the device (condensation).
Moisture causes a short circuit in electrical circuits and damages the device.
In order to prevent damage to the device, proceed as follows:
• Store the device in a dry place.
• Bring the device to room temperature before starting it up.
• Do not expose the device to direct heat radiation from a heating device.
• If condensation develops, wait approximately 12 hours or until the device is
completely dry before switching it on.

7. Please keep the enclosed documentation in a safe place. It belongs to the device. You
need the documentation when you commission the device for the first time.
8. Write down the identification data of the device.

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 Mounting and connecting the device
3.1 Preparing for mounting

3.1.2 Device identification data

Unpacking the device

The device can be clearly identified with the help of this identification data in case of repairs
or theft.
Enter the identification data in the table below:

Identification date Source Value

Serial number Rating plate S VP ...
Order number of the device Rating plate 6AV7260.....
Microsoft Windows Product Key Back of the de- Only devices with preinstalled
Certificate of Authenticity (COA) vice Windows operating systems
have the COA label
Ethernet address 1 BIOS setup,
Ethernet address 2 "Main" menu
CP 1616 onboard MAC Address Layer 2 (only
for PROFINET devices)
CP 1616 onboard MAC address PROFINET
(only for PROFINET devices)

Rating plate

SIMATIC IPC677D
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Mounting and connecting the device
3.1 Preparing for mounting

COA label
Microsoft Windows "Product Key" from the "Certificate of Authenticity" (COA):
The COA label is present only when Windows Embedded Standard 7 or Windows 7 is
installed.
● COA label of a device with the Windows Embedded Standard 7 operating system

● COA label of a device with the Windows 7 operating system

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3.1 Preparing for mounting

3.1.3 Permitted mounting positions

The following mounting positions are permitted for the device.
For information on the maximum permissible ambient temperatures during operation, refer to
section "Ambient conditions (Page 135)".

Mounting positions according to UL508/EN60950-1

CAUTION
Points to note with expansion cards
Expansion cards may impose restrictions on the installation location (fire-proof enclosure)
and permitted mounting positions (see Technical specifications). If the device has been
fitted with expansion cards, please observe the safety and installation instructions for the
expansion cards in the corresponding documentation.
If in doubt, install the device in an enclosure that is compliant with sections 4.6 and 4.7.3 of
IEC/EN/DIN EN 60950-1.

NOTICE
Operation in closed rooms
The device is approved for operation in closed rooms only. Pay attention to the ambient
and environmental conditions.

Mounting in horizontal format

Note
Mounting precautions
• The total power for USB and PCI/PCIe expansions cannot exceed 30 W.
• Operation of a DVD drive in the inclined position is not permitted.

SIMATIC IPC677D
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Mounting and connecting the device
3.1 Preparing for mounting

Additional mounting positions according to UL508/CSA 22.2 No. 142

Mounting in vertical format

NOTICE
CD/DVD operation not permitted with mounting in vertical format
CD/DVD drives must not be operated in this position. The CD drawer opens downward; this
can lead to damage to the drawer mechanics.

Note
Mounting precautions
• The total power for USB and PCI/PCIe expansions cannot exceed 30 W.

Note
This mounting position is also permitted for Information Technology Equipment if the device
is mounted in an enclosure that complies with the requirements of sections 4.6 and 4.7.3 of
IEC/EN/DIN EN 60950-1.

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 Mounting and connecting the device
3.1 Preparing for mounting

3.1.4 Preparing the mounting cutout

Note
Stability of the mounting cutout
The material in the area of the mounting cutout must provide sufficient strength to guarantee
the enduring and safe mounting of the HMI device.
The force of the clamps or operation of the device may not lead to deformation of the
material in order to achieve the degrees of protection described below.

Note
Read the information in the section "Installation guidelines (Page 35)".

Requirements for complying with degree of protection

The degree of protection of the HMI device can only be guaranteed if the following
requirements are met:
● Material thickness at the mounting cutout for IP65 degree of protection, or for
enclosure type 4X/type 12 (indoor use only): 2 mm to 6 mm
● Permitted deviation from plane at the mounting cutout: ≤ 0.5 mm
This condition must be fulfilled for the mounted HMI device.
● Permissible surface roughness in the area of the seal: ≤ 120 µm (Rz 120)

Dimensions of the mounting cutout

SIMATIC IPC677D
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Mounting and connecting the device
3.1 Preparing for mounting

Mounting cutout 15" 2 15" 3 19" 22"

Width w 1 399 mm 396 mm 465 mm 542 mm
Height h 1 280 mm 291 mm 319 mm 362 mm
1 Width and height must be interchanged for mounting in vertical format.
2 Device with capacitive multi-touch screen
3 Device with resistive single-touch screen

Installation depth
Information on the overall depth is available in the section "Dimension drawings (Page 124)".

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 Mounting and connecting the device
3.2 Mounting the device

3.2 Mounting the device

3.2.1 Installation guidelines

WARNING
Requirements for a fire protection enclosure according to EN 60950-1 only for standard
mounting position
In the standard installation position and in the inclined position in horizontal format with
vertical inclination of max. ±20°, the device meets the requirements for fire protection
enclosures according to EN 60950-1 and can therefore be installed without an additional
fire protection covering. For information on the mounting positions, refer to section
"Permitted mounting positions (Page 31)".

NOTICE
Risk of fire
If you install the device in an unapproved mounting position or if you do not observe the
ambient conditions, the device can overheat.
Overheating can cause a fire. Proper functioning of the device is no longer guaranteed.
Before you install the device, note the following general installation information.

● Install the device only in one of the permitted mounting positions.

● Note the climatic and mechanical ambient conditions (Page 135).
● The device was designed for use in a normal industrial environment. The SIMATIC PC
cannot be operated in difficult operating environments which are subject to caustic vapors
or gases without taking additional protective measures (such as the provision of clean
air).
● For installation in control cabinets, note the SIMATIC setup guidelines as well as the
relevant DIN/VDE requirements or the country-specific regulations.
● The ventilation slots of the device may not be covered or obstructed.
● Equip the control cabinet with struts for stabilizing the mounting cut-out. Install struts
where necessary.
● The device with AC power supply meets the requirements for fire protection enclosures
according to EN 60950-1 and can therefore be installed without an additional fire
protection covering.

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Mounting and connecting the device
3.2 Mounting the device

● The device with DC power supply does not fulfill the requirements according to
EN 60950-1 in the power supply unit area. The device must therefore be installed in such
a way that it is part of an operating area with restricted access (for example, a lockable
control cabinet, control panel or server room).

NOTICE
Voided approvals
If these conditions are not met when the system is mounted, the approvals according to
UL 508 and EN 60950-1 are rendered void.

● Provide adequate volume in the control cabinet for air circulation and heat transport.
Keep at least 10 cm distance between the device and control cabinet.

IP65 degree of protection

The installer of the plant is responsible for proper installation of the device.

WARNING
Risk of electric shock
The degree of protection cannot be guaranteed if the device is not correctly installed.
Moisture or water can penetrate and cause electric shock or plant damage.
The IP65 degree of protection is ensured for the front of the device only if you observe the
following:
• Fixing with mounting brackets or mounting clips
• Make sure that the size of the mounting cut-out is correct; see section Preparing the
mounting cutout (Page 33).

See also
Technical specifications (Page 131)
Dimension drawings (Page 124)

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 Mounting and connecting the device
3.2 Mounting the device

3.2.2 Mounting clips or mounting brackets, position for IP65

Types of mounting clips and mounting brackets

You can mount the device as follows:
● With 12 mounting clips, steel (included in the product package)

● With 6 mounting brackets (available as accessories)

Positions of the mounting clips or mounting brackets for IP65

To achieve the IP65 degree of protection for the device, the mounting clips or brackets must
be affixed at the positions shown below.

NOTICE
22" devices
The mounting clip marked in red must be shifted to the left on 22" devices to account for a
cutout.
The degree of protection IP65 is not affected by the offset.
The position can be retained when using the mounting brackets.

SIMATIC IPC677D
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Mounting and connecting the device
3.2 Mounting the device

3.2.3 Mounting the device with mounting clips

Positions of the mounting clips

To achieve the degree of protection for the device, the positions for the mounting clips
shown below must be adhered to.
The positions of the mounting clips are marked by stamps on the cutouts. Fit the mounting
clips in all the stamped cutouts.

Requirements
● All packaging components and protective films have been removed from the device.
● To install the device, you need the mounting clips from the accessory kit.
● The mounting seal on the front of the device is not managed.

Procedure

Note
If the mounting seal is damaged or protrudes from the device, the guaranteed degree of
protection is not ensured.
It is prohibited from mounting the device if the mounting seal is damaged. Order a
replacement seal.

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 Mounting and connecting the device
3.2 Mounting the device

1. Insert the device into the mounting cut-

out from the front and secure the device
to prevent it falling out.
2. Insert a mounting clip into the cutout
provided on the device. Make sure it is
in the correct position, see the section
"Mounting clips or mounting brackets,
position for IP65 (Page 37)".
3. Tighten the threaded pin to secure the
mounting clip. The maximum torque
when tightening the threaded pins of the
mounting clips is 0.5 Nm.
4. Repeat steps 2 and 3 for all mounting
clips.
5. Check the fit of the mounting seal.

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Mounting and connecting the device
3.2 Mounting the device

3.2.4 Mounting the device with mounting brackets

If there are strict requirements for the front seal, it may be necessary to fasten the device
with mounting brackets in a cabinet.
You can secure the device with 6 mounting brackets.
The mounting brackets are not supplied with the device and can be ordered separately; see
section Accessories (Page 20).

Requirements
● All packaging components and protective films have been removed from the device.
● You have mounting brackets to hand
● 2.5 mm hexagonal spanner

Procedure

Note
If the mounting seal is damaged or protrudes over the device, the degree of protection is not
guaranteed.

1. Working from the front, insert the device

into the mounting cut-out.

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 Mounting and connecting the device
3.2 Mounting the device

2. Insert the mounting clamp into the re-

cesses on the device. Make sure it is in
the correct position, see the section
"Mounting clips or mounting brackets,
position for IP65 (Page 37)".

3. Secure the mounting bracket by tighten-

ing the threaded pins. The maximum
permissible torque is 0.5 Nm.

4. Repeat steps 2 and 3 until all mounting

brackets are attached.
5. Check the fit of the mounting seal.

See also
Preparing the mounting cutout (Page 33)

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Mounting and connecting the device
3.2 Mounting the device

3.2.5 Position of the mounting clips for IP66-complaint installation

Positions of the mounting clips

To achieve IP66 degree of protection instead of IP65 for a device with capacitive multi-touch
screen, fasten 4 additional mounting clips (available as accessories) at the positions marked
by the red boxes. The 15" display meets IP66 even without additional mounting clips.

Device Position
Touch screen device
with 19" display

Touch screen device

with 22" display

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 Mounting and connecting the device
3.3 Connecting the device

3.3 Connecting the device

3.3.1 Wiring information

WARNING
Risk of fire and electric shock
The on/off switch does not isolate the device from the power supply. Risk of electric shock if
the device is opened incorrectly or defective. There is also a risk of fire if the device or
connecting lines are damaged.
You should therefore protect the device as follows:
• Always pull out the power plug when you are not using the device or if the device is
defective. The power plug must be freely accessible.
• Properly connect the device to a protective conductor.
• Use a central isolating switch in the case of cabinet installation.

WARNING
Risk of lightning strikes
A lightning flash may enter the mains cables and data transmission cables and jump to a
person.
Death, serious injury and burns can be caused by lightning.
Take the following precautions:
• If there is no additional lightning protection equipment: Disconnect the device from the
power supply in good time when a thunderstorm is approaching.
• Do not touch mains cables and data transmission cables during a thunderstorm.
• Keep a sufficient distance from electric cables, distributors, systems, etc.

NOTICE
Fault caused by I/O devices
The connection of I/O devices can cause faults in the device.
The result may be personal injury and damage to the machine or plant.
Note the following when connecting I/O devices:
• Read the documentation of the I/O devices. Follow all instructions in the documentation.
• Only connect I/O devices which are approved for industrial applications in accordance
with EN 61000-6-2 and IEC 61000-6-2.
• I/O devices that are not hotplug-capable may only be connected after the device has
been disconnected from the power supply.

NOTICE
Damage through regenerative feedback
Regenerative feedback of voltage to ground by a connected or installed component can
damage the device.
Connected or built-in I/Os, for example, a USB drive, are not permitted to supply any
voltage to the device. Regenerative feedback is generally not permitted.

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Mounting and connecting the device
3.3 Connecting the device

3.3.2 Connecting the Equipotential Bonding Circuit

A low-resistance ground connection ensures that interference signals generated by external
power supply cables, signal cables or cables to the I/O modules are safely discharged to
ground.
The equipotential bonding connection of the device is located on the side of the device and
is identified by the following symbol:

Requirement
For the equipotential bonding connection, you need:
● One TORX T20 screwdriver
● One equipotential bonding cable with minimum cross-section of 2.5 mm2

Procedure

1. Connect the marked equipotential-

bonding connection (thread M4) of the
device with the equipotential-bonding
cable.
Ensure that the equipotential-bonding
cable has a large-area contact with the
housing.
2. Connect the equipotential-bonding cable
with the central grounding point of the
cabinet.
Ensure that the equipotential-bonding
cable has a large-area contact with the
central grounding point.

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3.3 Connecting the device

3.3.3 Connecting 100-240 VAC power supply

Note before connecting the device

Note
The varying voltage power supply module is designed for operation on 120/230/240 V AC
networks. The setting of the voltage range takes place automatically.

WARNING
Thunderstorms
Do not connect or disconnect power and data cables during thunderstorms.

WARNING
Operation only in TN networks
The device is designed for operation in grounded power supply networks (TN networks
according to VDE 0100 Part 100, or IEC 60364-1).
Operation on ungrounded or impedance-grounded power networks (IT networks) is
prohibited.

WARNING
Rated voltage
The permitted nominal voltage of the device must conform with local mains voltage.

NOTICE
Notes on the power supply network
The mains connector must be disconnected to fully isolate the device from mains. Ensure
easy access to this area.
A master mains disconnect switch must be installed if the device is mounted in a switch
cabinet.
Make sure that the safety power outlet of the building installation is freely accessible and
located as close as possible to the device.

Note
The power supply contains an active PFC (Power Factor Correction) circuit to conform to the
EMC guidelines.
Uninterruptible AC power systems (UPS) must supply a sinusoidal output voltage in the
normal and buffered mode when used with SIMATIC PCs with an active PFC.
UPS characteristics are described and classified in the standards EN 50091-3 and
IEC 62040-3. Devices with sinusoidal output voltage in the normal and buffered mode are
identified with the classification "VFI-SS-...." or "VI-SS-....".

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3.3 Connecting the device

Localized information
For countries other than the USA and Canada:
230 V supply voltage
This device is equipped with a safety-tested power supply cord which may only be
connected to a grounded safety power outlet. If you choose not to use this cable, you must
use a flexible cable of the following type: Cable cross-section at least 0.82 mm2 and 15 A /
250 V ground contact connector. The cable set must be compliant with the safety regulations
of the country where the device is to be installed and carry the identification labels required
by law.
For the USA and Canada:
For the United States and Canada, a CSA or UL-listed power supply cord must be used.
The connector must be compliant with NEMA 5-15.
120 V supply voltage
A flexible cable with UL approval and with CSA label which has the following features is to
be used: Type SJT with three leads, min. 18 AWG conductor cross-section, max. 4.5 m in
length and parallel ground contact connector 15 A, min. 125 V.
240 V supply voltage
A flexible cable with UL approval and with CSA label which has the following features is to
be used: Type SJT with three conductors, min. 18 AWG conductor cross-section, max.
length 4.5 m, and tandem grounded connector 15 A, min. 250 V.

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 Mounting and connecting the device
3.3 Connecting the device

Procedure

1. Make sure that the ON/OFF switch is in position '-'

(Off) to avoid unintentional startup of the device
when you plug in the power cord.

2. Connect the appliance connector to the device.

3. Connect the power cable with the safety power
outlet.
4. If necessary, install the enclosed cable grip.

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3.3 Connecting the device

3.3.4 Connecting the 24 VDC power supply

Note before connecting the device

WARNING
Safety extra-low voltage (SELV)
The device should only be connected to a 24 V DC power supply which meets the
requirements of safe extra low voltage (SELV) according to IEC/EN/DIN EN 60950-1. A
protective conductor must also be used. The conductors must withstand the short-circuit
current of the 24 V DC power source, so that a short-circuit will not damage the cable. Only
connect cables with a minimum cross-section of 1.3 mm2 (AWG16) and a maximum cross-
section of 3.3 mm2 (AWG12).

Note
The 24 V DC power source must be adapted to the input data of the device (see
specifications).

Procedure

1. Make sure that the ON/OFF switch is in the posi-

tion "0" (OFF) to prevent unintentional startup of
the device when it is connected to the 24 V power
supply.
2. Switch off the external 24 V DC power supply.
3. Connect the 24 VDC plug connector to the device.
Observe the correct polarity of the contacts:
① DC 24 V
② ground
③ protective conductor

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3.3 Connecting the device

4. If necessary, install the enclosed cable grip.

5. Secure the 24 VDC cable to the cable grip using a
cable tie.

Note
Reverse-polarity protection
The DC power supply (24V) has a mechanism to protect against reverse polarity. In the
event that the 24 VDC lines are reversed (24 VDC nominal (-20% / +20%) and connected to
ground, the device will not be damaged. The device will simply fail to turn on. After the power
supply has been connected correctly, the device will again be ready to operate.

See also
General technical specifications (Page 131)

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Mounting and connecting the device
3.3 Connecting the device

3.3.5 Connecting peripheral equipment

Note
Ensure suitability for industrial applications
Connect only I/O devices approved for industrial applications according to EN IEC 61000-6-
2.

Note
Peripheral devices capable of hot-plugging (USB)
Hot-plug I/O modules (USB) may be connected while the PC is in operation.

NOTICE
Peripheral devices incapable of hot-plugging
Peripheral devices that are incapable of hot-plugging may only be connected after the
device has been disconnected from the power supply. Strictly adhere to the specifications
for peripheral equipment.

Note
Wait at least ten seconds between removing and reinserting USB devices.
When using standard USB devices, bear in mind that their EMC immunity level is frequently
designed only for office environments. These USB devices are adequate for commissioning
and servicing purposes. Only industrial grade USB devices are permitted for use in industrial
environments. The USB devices are developed and marketed by the respective provider.
The product supplier in each case provides support for the USB devices. Moreover, the
terms of liability of the individual vendors or suppliers apply here.

Note
The connected or built-in I/Os, such as USB drives, should not introduce a reverse voltage
into the device.
Reverse voltages exceeding 0.5 V to ground that are generated by connected or installed
components can prevent proper operation of the device or lead to its destruction.

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 Mounting and connecting the device
3.3 Connecting the device

3.3.6 Connecting the device to networks

The following options are available for the integration in existing or planned system
environments or networks:

Ethernet
The integrated Ethernet port (10/100/1000 Mbps) can also be used for communication and
data exchange with automation devices such as SIMATIC S7.
This functionality requires the "SOFTNET S7" software package.

PROFIBUS/MPI
The optional electrically isolated PROFIBUS interface (12 Mbps) can be used to interconnect
distributed field devices or for coupling to SIMATIC S7.
The "SOFTNET for PROFIBUS" software package is required for coupling to S7 automation
systems.

PROFINET
PROFINET can be operated via
● CP1616 IRT (Isochronous Real Time)
● Standard Ethernet interfaces (RT)
CP 1616 on-board allows you to connect IPCs to Industrial Ethernet. Only one CP 1616 can
be installed in a PG/PC. You will find detailed information in sections "PROFINET (Page 52)"
and "CP 1616 onboard communications processor (Page 164)".

Device driver CP 16xx.sys

The device driver allow integration of the Windows network protocol in the optional "CP 1616
onboard" Ethernet PROFINET controller on SIMATIC PCs. The PROFINET interface will act
like a regular 100 Mbit Ethernet interface with a MAC address when you use this driver. The
three RJ45 sockets are connected with each other via switch.

PROFINET IO application
You can create, operate and configure PROFINET IO applications using the "Development
Kit DK-16xx PN IO. It must be installed in addition to the CP 16xx.sys device driver. This kit
and the documentation are available free of charge at the following Internet address:
Development Kit DK-16xx PN IO
(http://www.automation.siemens.com/net/html_00/produkte/040_cp_1616_devlopkit.htm)

SIMATIC NET
Use this software package to configure network components and connections. You will find
information on this on the SIMATIC NET DVD. This software package and the
documentation are not part of the product package.

Additional information
Additional information is available in the catalog and the online ordering system Industry Mall
(https://mall.industry.siemens.com).

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Mounting and connecting the device
3.3 Connecting the device

3.3.7 PROFINET

CP 1616 onboard
The basic characteristics of the PCS 1616 onboard are:
● Optimized for PROFINET IO
● With Ethernet realtime ASIC ERTEC 400
● Three RJ45 sockets for connection terminal devices or addition network components
● Integrated 3-port real-time switch
● Automatic hardware detection

NOTICE
A maximum of one CP 1616/1604 is permitted
A maximum of one CP 1616/1604 module can be installed in one PG/PC. If you want to
use an additional CP 1616/1604 card, the CP 1616 onboard option must be disabled
using the "Profinet" entry in the BIOS setup.

Additional documentation on PROFINET

Get an overview of the information available for PROFINET
(http://support.automation.siemens.com/WW/view/en/18880715/133300).

Document name What is contained in this document?

This documentation is not included in the product package:
Getting Started The documents use concrete examples to provide
PROFINET IO Getting Started: Manual step-by-step instructions on how to commission a fully
Collection functional application.
Manual This gives you the basic knowledge about the
PROFINET System Description PROFINET IO topics:
Network components, data exchange and communica-
tion, PROFINET IO, component-based automation,
application example of PROFINET IO and component-
based automation.
Manual Read this document if you want to convert an installed
From PROFIBUS DP to PROFINET IO PROFIBUS system to a PROFINET system.
Readme file for CP 1616/CP 1604 and DK- This provides the latest information about the
16xx PN IO SIMATIC NET products CP 1616/CP 1604, CP 1616
onboard, the developer kit.
Configuration Manual This provides you will all the information necessary for
Commissioning PC Stations commissioning and configuring a PC as a PROFINET
IO controller or IO device.

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3.3 Connecting the device

Document name What is contained in this document?

Manual This manual introduces you to industrial communica-
SIMATIC NET Industrial Communication tion and explains the available communication proto-
with PG/PC: Volume 1 - Basics cols. It also describes the OPC interface as an
SIMATIC NET Industrial Communication alternative to the IO-based user programming inter-
with PG/PC: Volume 2 - Interfaces face.
S7 CPs for Industrial Ethernet This provides the following support:
Configuring and Commissioning - For commissioning S7 stations
- For establishing effective communication
Manual Configure and build your Industrial Ethernet networks
SIMATIC NET - Twisted Pair and Fiber- based on this document.
Optic Networks
This documentation is part of the supplied Documentation and Drivers CD:
Operating instructions This provides you with all information required for
CP 1616/CP 1604/CP 1616 onboard operation.
Installation guide Read this guide if you want to install the NDIS device
Device Driver CP16xx.sys driver, CP16xx.sys.

Further information
You can find the information on specific products in the Internet at the address: Product-
related Information SIMATIC NET (http://www.siemens.com/simatic-net)

3.3.8 Connecting Ethernet/USB strain relief

The Ethernet/USB strain relief supplied in the product package is used to prevent accidental
removal of the Ethernet cable and Industrial Ethernet FastConnect connector from the
device. You need two cable ties to use the strain relief. In addition to the Ethernet cables,
you can also use this strain relief to protect the four USB cables from inadvertent removal.
To secure the Ethernet strain relief, you will need a TORX T10 screwdriver.

Procedure

1. Secure the Ethernet/USB strain

relief with two oval-head screws
M3 ① to the device housing.
2. Connect the network and USB
cables with the device and secure
the connectors to the strain relief
with cable ties ②.

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Mounting and connecting the device
3.3 Connecting the device

3.3.9 Connecting the PROFINET strain relief

The PROFINET strain relief supplied in the product package is used to prevent accidental
removal of the Ethernet cable and Industrial Ethernet FastConnect connector from the
device. You need two cable ties to use the strain relief.
To fix the PROFINET strain relief, you will need a TORX T10 screwdriver.

Procedure

1. Secure the PROFINET strain relief with

two oval-head screws M3 ① to the de-
vice housing.
2. Connect the PROFINET cables with the
device and secure the PROFINET con-
nector with straight cable outlet to the
strain relief with cable ties ②.

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Commissioning the device 4
4.1 Notes on commissioning and operation

Note
Windows Embedded Standard 7
Read the EWF and FBWF information
Two configurable write filters (Enhanced Write Filter and File Based Write Filter) are
provided with Windows Embedded Standard. Read the EWF/FBWF information if you
activate and use them, otherwise you can experience data loss.

Notes on operation

Note
During the startup procedure...
• Make sure that there are no conductive liquids on the touch screen during startup.
• Do not touch the touch screen during startup.
The device automatically calibrates the touch screen during startup.

Requirement
● The device is connected to the power supply.
● The protective conductor is connected.
● The connection cables are plugged in correctly.
● The following hardware is available for initial commissioning:
– One USB keyboard
– One USB mouse

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Commissioning the device
4.2 Switching on the device

4.2 Switching on the device

Following the initial startup, the operating system preinstalled on the drive is automatically
configured on the device.

NOTICE
Faulty installation
If you change the default values in the BIOS Setup or if you turn off the device during
installation, you disrupt the installation and the operating system is not installed correctly.
The operating safety of the device and the plant is at risk.
Do not switch off the device during the entire installation process. Do not change the default
values in the BIOS Setup.

Note
The power-up time depends on the device configuration and the BIOS settings. Changes to
the device configuration and/or the BIOS settings can influence the power-up time.

Procedure
1. Set the On/Off switch to "ON" position.
The "PC ON/WD" LED lights up. The module carries out a self-test. During the self-test,
the following message appears:
Press Esc for Boot Options

2. Wait for the message to disappear.

3. Follow the instructions on the screen.
The following steps are only to be performed for initial startup of the device with factory
settings:
4. Make the region and language settings.
If you want your system language to be international, select English. Information about
changing the region and language settings is available in the section "Servicing and
maintaining the device", under "Installing software".

Note
Once the operating system has been set up, the device might restart.

5. Type in the product key as required.

You can find the product key among the identification data of the device on the
"Certificate of Authenticity" COA label, in the "Product Key" line.
6. If the device is delivered with pre-installed software, the setup of the SIMATIC IPC Wizard
is started automatically after operating system installation (see the following section).
The installation of the operating system is complete.

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 Commissioning the device
4.3 Automatic switching on of the device

4.3 Automatic switching on of the device

In the BIOS setup, you can specify the behavior of the device when it is disconnected from
the mains voltage. The following property is set as default:
● BIOS setup, "Advanced" menu, "Chipset Configuration" submenu, setup parameter "After
G3 On" to "S0".
● After a power loss during operation, the device will automatically restart when the power
returns.
The mains voltage must have failed for at least 20 s for the power failure to be detected and
for this defined action to be executed.

NOTICE
Unintentional reactions at power loss restart
Automatic startup, for example, after a power failure, can result in unintentional reactions of
the machine or plant. This endangers the operation.
Take the BIOS setup entry "After G3 On" into consideration in the plant planning.

4.4 Windows Action Center

The Action Center checks the status of the device with regard to the important safety
aspects listed below. If a problem is found, the Action Center provides recommendations on
how you can better protect the device.

Functions
● Firewall: The Windows Firewall adds protection to the device by blocking network or
Internet access to the device by unauthorized users. The firewall is enabled in the
delivery state.
● Antivirus software: Antivirus programs add protection to the device by searching for and
eliminating viruses and other security threats. No antivirus software is installed in the
delivery state.
● Automatic updates: Using the Automatic Update feature allows Windows to regularly
search for the latest critical updates for the device and to install them automatically.
This option is disabled in the delivery state for Windows Server 2008 R2 and Windows
Server 2012 R2. You can enable or disable this option for Windows 7 and Windows 10
during commissioning of Windows.
● User Account Control: User Account Control issues a warning when programs attempt to
modify important Windows settings. You can then either acknowledge this warning or
prevent the program from changing the Windows settings.
This option is disabled in the delivery state for Windows Server 2008 R2 and Windows
Server 2012 R2. This option is enabled in the delivery state for Windows 7 and
Windows 10.

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Commissioning the device
4.5 Notes on different device configurations

4.5 Notes on different device configurations

4.5.1 RAID1 system (optional)

This is a RAID1 system configuration (mirroring with two hard disks). This configuration
enhances system availability as the system is able to continue operation if a hard drive fails,
or if there is a cable problem at a channel.
The two hard disks are configured as follows in the factory state of the device:

RAID1 system
Partition C: System, NTFS,
50 GB
Partition D: Data, NTFS, re-
maining capacity

Note
You can find information regarding Intel RAID controllers in the RAID documentation on the
included "Documentation and Drivers" DVD in the Drivers\RAID\Intel directory.

RAID system management functions

The pre-installed RAID system software offers enhanced functionality for RAID system
operation and management. For more information, please refer to the chapter "Servicing and
maintaining the device".

Note
The entries of the RAID status are made in the Windows Event Viewer by default.
If an error occurs, a hard disk can be synchronized at the operating system level. It may take
up to several hours to synchronize a new disk in the background, depending on the size of
the hard disk and on the system load.
The redundant system state RAID 1 is reached again only after synchronization is
completed.

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4.5 Notes on different device configurations

Comments about faults

Note
Input delay
System load may briefly increase due to synchronization when a hard disk has failed,
depending on processor load and current hard disk activity.
In extreme cases, input from the keyboard and touch screen may be delayed for a brief
period.

Before you replace the defective hard disk, create a backup copy of the system.

See also
Managing RAID systems (Page 91)

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Commissioning the device
4.5 Notes on different device configurations

4.5.2 Notes on the DVD burner

Notes on the data backup on DVD

To achieve a reliable data backup on the DVD-R media with the burner (HLDS GTC0N,
HLDS GUD0N), use the "SIMATIC IPC Image & Partition Creator" software Version V3.5.1
or higher.
Only HLDS drives for the use with DVD-R blanks are affected. There are no restrictions for
DVD+R or DVD+RW blanks.

NOTICE
Data errors during burning:
• Burner operation is only permitted in an environment free of shock and vibration.
• It cannot be ruled out that vibrations in the environment and varying quality of raw discs
could result in data errors when burning data media, even when no error message
occurs.
• Data comparison is the only guarantee that data has been written correctly. Perform
data comparison each time you burn a disc.

Requirement
● "SIMATIC IPC Image & Partition Creator" Version V3.5.1 or higher
● DVD+R or DVD+RW blank

Procedure
1. With the "SIMATIC IPC Image & Partition Creator" software create a backup of your data
on a DVD.
2. Check your backups for integrity.
You can find information on this in the operating manual: "SIMATIC IPC Image & Partition
Creator (https://support.industry.siemens.com/cs/de/en/view/21766418)".

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4.6 Switching off the device

4.6 Switching off the device

Procedure

WARNING
Risk of electric shock
The on/off switch does not isolate the device from the mains. When the on/off switch is in
the position 0 "Off", the device is still supplied with line voltage to generate the internal
auxiliary voltage.
Always pull out the plug to isolate the device from the mains.

NOTICE
Risk of data loss
Microsoft operating systems and hardware components, such as hard drives, save your
data in internal caches. Files may be open or data may be being written when the power
supply is interrupted in the following ways:
• When you activate the on/off switch while the device is running (uncontrolled switch off)
• In the case of a hardware reset
• In the case of an unpredictable supply voltage failure
This results in data loss, which damages the device of plant. Follow these steps to prevent
data loss:
• Shut down the operating system with "Start > Shut down" before you switch off the
device.
• Protect the device and plant with a suitable uninterruptible power supply (UPS).

1. Open the function "Start > Shut down" in the Start menu.
The green LED "PC ON/WD" changes to yellow.

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Operating the device and device functions 5
5.1 Operator input options
Depending on your device and the connected I/O devices, the following operator input
options are available:
● Integrated keyboard on touch device (not for all IPC)
● Touch screen for touch device

CAUTION
Unintentional actions with touch screen operation
If you touch the touch screen while system-internal processes are running, unintended
reactions of the device may be triggered.
Do not touch the screen in the following situations:
• During the boot process
• When plugging or unplugging USB components
• While Scandisk is running
• During a BIOS update

NOTICE
Damage to the touch screen
Hitting the touch screen with hard objects may damage it and can result in a total failure
of the touch screen.
Only touch the touch screen with your fingers or a suitable touch stylus.

● Screen keyboard for touch device

● External keyboard, connected via USB
● External mouse, connected via USB

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5.2 Operating a device with resistive single touch screen

5.2 Operating a device with resistive single touch screen

When you touch an object on the single touch screen, the corresponding function is
performed.

WARNING
Personal injury or property damage due to incorrect operation
Incorrect operation of devices with a touch screen can occur. This can result in personal
injury or property damage.
Take the following precautions:
• Configure the plant so that safety-related functions are not operated with the touch
screen.
• Always touch only a single point on the touch screen.
• Calibrate the touch screen, at the latest when the touch screen becomes inaccurate or
does not respond despite repeated touches.
• Switch off the device for cleaning and maintenance.
• Make sure that the touch screen is kept free of dirt.

NOTICE
Damage to the touch screen
Touching the touch screen with pointed or sharp objects can damage it and lead to a
significant reduction in service life or even total failure of the touch screen.
Do not touch the touch screen with pointed or hard objects. Only touch the touch screen
with your fingers, a touch stylus or an approved touch glove.

Note
Appearance of blisters under extreme ambient conditions
Under extreme environmental conditions such as high atmospheric humidity and
temperature, bubbles can form on the touch surface in rare cases. This only affects the
appearance and does not represent any functional restriction.

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Operating the device and device functions
5.3 Operating a device with capacitive multi-touch screen

5.3 Operating a device with capacitive multi-touch screen

You operate the multi-touch screen with one or multiple fingers. You can also operate it
using gestures with up to five fingers at a time.

WARNING
Personal injury or property damage due to no earth connection
An inadequate earth connection or the lack of one may cause malfunction of the capacitive
touch screen. Functions may not work properly. This can result in personal injury or
property damage.
• Always connect the device to an earth conductor.
• The earth conductor from the device must be connected directly to earth with low
impedance (short connection, minimum cross-section 2.5 mm2).

You can find additional information on connecting the earth conductor in the section
"Connecting the Equipotential Bonding Circuit (Page 44)".

WARNING
Personal injury or property damage due to maloperation
Incorrect operation of devices with a touch screen can occur. This can result in personal
injury or property damage.
Take the following precautions:
• Configure the plant so that safety-related functions are not operated with the touch
screen.
• Switch off the device for cleaning and maintenance.

WARNING
Danger of malfunction due to improper execution of gestures on the touch screen
If gestures are executed incorrectly on the touch screen with multi-touch function, these
gestures may not be recognized or could be recognized incorrectly. The entries made are
then not implemented by the device or are implemented incorrectly or in an unintended
manner.
Incorrect execution of multi-touch functions can lead to errors in the operation of the plant
and thus to physical injury.
Note the following when operating the touch screen with multi-touch function:
• The touch screen reacts to contact on its surface, not to pressure.
• When using a touch pen: Operate the touch screen only with a touch pen for capacitive
touch.
• Avoid unintended multiple touches, for example, with your knuckles.
Before you start to operate the device, make sure you are familiar with the multi-touch
functions of the Windows operating system, as well as with the application to be used and
its functions. Ensure that the gestures which the user executes on the multi-touch display
are recognized by the application. It is possible that certain gestures need to be trained
beforehand.

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 Operating the device and device functions
5.3 Operating a device with capacitive multi-touch screen

Notes on operation

Note
Do not touch the touch screen during startup
The device automatically calibrates the capacitive multi-touch screen during startup. The
touch screen is locked during calibration.
Do not touch the touch screen during startup. Make sure that you do not rest on the touch
screen with the palm of your hand during startup.
Make sure that there are no conductive liquids on the touch screen during startup.

Note when operating the multi-touch screen:

● Surface contact with a diameter of about 5 to 20 mm is required for an operator action to
be detected.
● An operation with gloves with a material thickness of <2 mm is detected in most cases.
However, check the usefulness of the gloves you are using.
● To avoid incorrect operation, certain inputs are ignored and blocked from further entry:
– Simultaneous operation with more than 5 fingers.
– Surface contact with a diameter of > 3 cm, for example, resting the palm of the hand
on the touch screen
– As soon as the touch screen is no longer touched, input is possible again.

Functions of the multi-touch screen

General functions
● Detection of up to 5 finger touches at a time.
● Detection of gestures that are supported by the operating system or the software installed
on the device.

Note
Multi-touch operation can provide advanced features or pose limitations depending on the
operating system and the software installed on the device. Read the corresponding
documentation.

● You do not need to calibrate the touch screen. Some operating systems do offer touch
calibration. However, this calibration does not result in an improvement of the accuracy.
Security functions in an industrial environment
The touch screen is locked for security reasons when following happens:
● There is a conductive liquid on the touch screen with ground contact via the enclosure or
the operator, for example.
● Electromagnetic interference is present that exceeds the specification according to
EN 61000-4-2.
Once the interference is over, the touch screen is no longer locked.

See also
Chemical resistance of the HMI devices and industrial PCs
(https://support.industry.siemens.com/cs/ww/en/view/39718396)

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Operating the device and device functions
5.4 IPC Wizard functions

5.4 IPC Wizard functions

Software components
● General for all devices: Panel PC Tools
– SetBrightness
– IPCScreenSaver
● Special for devices with resistive single-touch screen: UPDD (Universal Pointing Device
Driver) with the following features
– Advanced touch features
– Calibrating
● Calibration is not necessary for devices with capacitive multi-touch screen. Depending on
your operating system, you may be able calibrate the touch screen through the operating
system, although it will not improve the accuracy.
All other functions are described in the manual "SIMATIC IPC Wizard 2.1 and Panel
Configuration Center":
● On the "Documentation and Drivers" CD/DVD included in the delivery
● In the IPC Wizard installation directory on the PC

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5.5 Extended device functions

5.5 Extended device functions

5.5.1 Monitoring functions

5.5.1.1 Overview of the monitoring functions

The basic version of the device also provides monitoring functions. The following display,
monitoring and control functions are available when the appropriate software is used:
● Temperature monitoring (over / under temperature)
● Battery monitoring: The charge level of the battery is monitored.
● Monitoring of hard disks, memory cards and SSD drives with S.M.A.R.T. functionality
● Watchdog (hardware or software reset of the computer)
● Operating hours meter (information on the cumulative run time)
● Hard disk status and status of the RAID system

SIMATIC IPC DiagBase software

Use the functions of the SIMATIC IPC DiagBase software included in the scope of delivery
for local monitoring. Use the "DiagBase Management Explorer" application to obtain a clear
overview for monitoring purposes. Use the DiagBase Alarm Manager to receive notifications
about individual alarms.

Note
For more information on SIMATIC IPC DiagBase software functionality, please refer to the
relevant online help.

SIMATIC IPC DiagMonitor software

SIMATIC IPC DiagMonitor is available on CD (not included in the scope of delivery). The CD
contains both the monitoring software and the software for the stations to be monitored. The
interface specifications and a library for creating your own applications are also provided.

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5.5.1.2 Temperature monitoring/display

Four temperature sensors monitor the temperature of the device at several positions:
● Processor temperature
● Temperature close to the RAM ICs/chips
● Temperature of the basic module below the power supply
● Temperature in proximity of the air inlet
A temperature error is triggered under these circumstances:
● The configured low threshold for the temperature has been violated.
● The configured high threshold for the temperature has been violated.
A temperature error causes the following reaction:

Reaction Option
The DiagBase or DiagMonitor software alerts the user. None

The temperature error is retained in memory until temperatures have fallen below the
thresholds and it is reset by one of the following measures:
● Acknowledgment of the error message by the monitoring software
● Restart of the device

5.5.1.3 Watchdog (WD)

Configuration
You configure the watchdog with the DiagBase or DiagMonitor software.

Function
The watchdog is able to monitor system runtime and informs the user about the different
reactions that are triggered if the system does not respond to the watchdog within the
specified monitoring time.
A watchdog alarm is retained after a restart and is reset and logged by the DiagBase or
DiagMonitor software. The watchdog configuration is retained in the process.

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Watchdog reactions
The following reactions can occur if the watchdog is not addressed within the set time:

Option Reaction
Reset on Executes a hardware reset when the watchdog expires
Reset off1 Executes no action when the watchdog expires
Restart 1 Restarts the operating system when the watchdog expires
Shutdown 1 Shuts down the operating system when the watchdog expires
1 Option is device-specific.

NOTICE
"Reset on" option
The "Reset on" option immediately triggers a hardware reset that may result in loss of data
under Windows and damage to the installation.

Watchdog monitoring times

The monitoring time can be configured with the DiagBase or DiagMonitor software.

Note
When you change the monitoring time, the change becomes effective immediately.

5.5.1.4 Battery monitoring

The installed buffer battery has a service life of at least 5 years. The status can be checked
with two-tier battery monitoring. The information can be read from an I/O register and
evaluated.
When the first warning level is reached, the remaining service life of the battery for buffering
CMOS data and buffer memory is at least 1 month.

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5.5.2 Enhanced Write Filter (EWF)

Purpose and function

The Enhanced Write Filter (EWF) is a function that is only available for Windows Embedded
operating systems. EWF is a write filter that can be configured by the user.
You can use the Enhanced Write Filter to boot Windows Embedded Standard from read-only
media, for example, memory cards or Solid State Drives (SSD), or provide individual
partitions with write protection.
EWF can be used to minimize write access to storage media. This is important because the
write cycles are limited due to technical reasons. We therefore recommend using EWF if you
work with these storage media.
If you use HORM or compressed NTFS, EWF is indispensable.

CAUTION
Data loss with several write filters
Both EWF and FBWF are preinstalled in the SIMATIC IPC images. If several writer filters
are active on one partition at the same time, you may experience data loss. This may
damage the machine or plant.
Make sure that you only activate one write filter for each partition.

Note
Windows Embedded Standard
The Enhanced Write Filter is deactivated in the Windows Embedded Standard default state.
• Back up your data after installation of the operating system and programs.
• Activate the EWF.

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Setting EWF
The following programs can be used to install, enable or disable the EWF:
● EWFMGR.EXE
● SIMATIC IPC EWF Manager.
The SIMATIC IPC EWF Manager is pre-installed and included on the supplied
"Documentation and Drivers" DVD.
Start the SIMATIC IPC EWF Manager as follows:
● "Start > All Programs >Siemens Automation > SIMATIC > EWF Manager > EWF
Manager"
Configure the SIMATIC IPC EWF Manager as follows:
● "Start > All Programs > Siemens Automation > SIMATIC > EWF Manager > EWF
Settings"
or
● Click the "SIMATIC IPC EWF Manager" icon in the system tray.
The following functions are available:

Function Command
Write-protect drive C: Power on ewfmgr c: -enable
Write-protect drive C: disable: the modified data are ewfmgr c: -commitanddisable
applied
Modified data on drive C: apply ewfmgr c: -commit
Display information about the EWF drive ewfmgr c:

Display help ewfmgr /h

Note
The EWF commands affecting the write protection do not become active until after the next
booting process.

Note
The EWF command ewfmgr c: -commitanddisable may not be used with the option -live: Not
ewfmgr c: -commitanddisable -live.

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Special notes for use

If EWF is enabled, when the PC shuts down all changes made on drive C: after the boot
process are lost.
These changes are only retained on the PC in the following cases:
● EWF is disabled when you make changes.
● EWF is enabled and you save the changes before shutting down the device using the
following command on C: drive :

ewfmgr c: -commit

Note
When the system is set to automatically adjust the clock for daylight saving time adjustment,
systems without central time management and with activated EWF set the clock forward or
backward by one hour in the daylight saving time or standard time period each time the
system boots.
The reason for this behavior is that Windows Embedded Standard 7 makes a registry entry
that the changeover to daylight saving time has occurred. Since this file is also protected
against modification by the EWF, the marker is lost during the boot sequence and the
adjustment is made again.
We therefore recommend that you deactivate the automatic adjustment and change the
clock manually.
Follow these steps:
1. Deactivate automatic adjustment in the Control Panel: In the "Time Zone" tab opened
with the menu command "Start > Control Panel > Date and Time", remove the check
mark from the "Automatically adjust clock for daylight saving changes" check box.
2. Save the change you have made with ewfmgr c: -commit and then reboot the system.

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5.5.3 File Based Write Filter (FBWF)

Purpose and function

With the Feature Pack 2007 for Windows XP Embedded and Windows Embedded
Standard 7, Microsoft introduced a second write filter, File Based Write Filter (FBWF).
In contrast to EWF, which protects partitions based on sectors, FBWF works on the file level.
When FBWF is enabled, all files and folders of a partition are protected unless they are
included in an exception list.
FBWF is disabled by factory default in the operating system images for SIMATIC IPC and
must be enabled and configured by the user.
When you enable FBWF, the folders C:\FBWF and D:\FBWF are authorized for writing by
default.

Comparison between EWF and FBWF

● You should prefer FBWF, because it is more flexible in its configuration and allows
immediate writing without rebooting.
● If you use HORM or compressed NTFS, EWF is indispensable.

CAUTION
Data loss with several write filters
Both EWF and FBWF are preinstalled in the SIMATIC IPC images. If several writer
filters are active on one partition at the same time, you may experience data loss. This
may damage the machine or plant.
Make sure that you only activate one write filter for each partition.

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Configuring FBWF
FBWF can be configured in command console using the program FBWFMGR.EXE.

Note
• Observe the following syntax: Enter a space after the drive designation colon.
• Changes for direct write access only take effect after rebooting.
• Only existing files and folders can be entered in the exception list.

Function Command
Display the current FBWF status fbwfmgr /displayconfig

Enable FBWF after the next startup fbwfmgr /enable

Write to protected files fbwfmgr /commit c: \Test.txt

Adding/removing elements in the exception list:

fbwfmgr /addexclusion C: \Test.txt
• Add file
fbwfmgr /addexclusion C: \Test fold-
• Add folder er
fbwfmgr /removeexclusion
• Remove file C: \Test.txt
fbwfmgr /removeexclusion C: \Test
• Remove folder folder
Call up the help function fbwfmgr /?

Detailed instructions on FBWF are available on the Internet (http://msdn.microsoft.com/en-

us/library/aa940926(WinEmbedded.5).aspx).

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5.5.4 Buffer memory SRAM (optional)

In order for applications to store data following a power failure, motherboards with fieldbus
(PROFIBUS or PROFINET) feature battery-buffered SRAM. If the supply voltage fails for
more than 20 ms for the AC power supply or more than 5 ms for the DC power supply, then
you will be informed about this situation by the NAU signal.
At least 10 ms is available to copy the data to the buffered RAM. During this time, 128 Kb
can be saved with a full load and even more with a smaller configuration, in other words, a
lesser load. A maximum 2 MB memory window is displayed via a PCI address register. The
base address is initialized by the BIOS.
A corresponding function is implemented there for using the SRAM under WinAC RTX.

Note
If replacement of the battery takes longer than 30 seconds, the data saved in the CMOS
RAM and in the buffered SRAM is lost.

Note
The buffer memory SRAM is available only with devices with PROFIBUS or PROFINET
interfaces.

5.5.5 Active Management Technology (AMT)

AMT (Active Management Technology) is technology for the remote maintenance of
computers (simply called AMT-PC in the remainder of the document) and it includes the
following functions:
● Keyboard Video Mouse( KVM) Redirection: Using KVM that is integrated in the AMT
hardware you access the AMT PC remotely. With KVM, you can also control AMT PCs
that have no operating system or a defective operating system. A KVM remote session is
always possible with the KVM server integrated in the firmware. This means you can
restart the PC and change the BIOS setup remotely.
● Remote power management: AMT PCs can be turned on and off and restarted from
another PC.
● SOL (Serial over LAN): Redirection of the data of a serial interface to the network. The
main use of the function is text-based remote control of an AMT PC using a console.
● IDE redirection: An ISO file on the help desk PC can be mounted on the AMT PC and
used as a DVD drive.
An ISO file contains a memory image of the content of a CD or DVD structured in the ISO
9660 format.
● Remote reboot: An AMT PC can be booted from a bootable ISO file made available by
another PC.

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SIMATIC IPC Remote Manager

The "SIMATIC IPC Remote Manager" software is available for utilization of the AMT
functions with SIMATIC IPCs. The software can be ordered from the Siemens online
ordering system. For detailed information about "SIMATIC IPC Remote Manager", refer to
the corresponding product documentation: SIMATIC IPC Remote Manager
(http://support.automation.siemens.com/WW/view/en/48707158)
Typical areas of application and functions of the SIMATIC IPC Remote Manager:
● Remote maintenance of SIMATIC IPC with AMT, for example for service purposes in the
case of a defective operating system or for adapting BIOS settings.
● Diagnostics without on-site use
● Convenient service: Access to AMT clients, such as headless systems, without additional
hardware
● Resource management

Requirement
● A device with Xeon processor
● A functioning and configured management engine
● A functioning and configured Ethernet connection
● A help desk PC with a functioning and configured Ethernet connection for the full AMT
functionality

Configuration of the AMT PC

You configure AMT by means of the BIOS setup and MEBx (Management Engine BIOS
Extension). MEBx is a BIOS extension for configuration of AMT (see BIOS description in
chapter "Technical specifications").

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5.5.6 Trusted Platform Modul (TPM)

Depending on the ordered configuration, the motherboard contains a Trusted Platform
Module (TPM). A TPM is a chip that adds important security functions to your device, such
as enhanced protection of the PC against unauthorized manipulation by third parties. The
current operating systems, for example, Windows 7 and Windows 8, support these security
functions.

NOTICE
Import restrictions
TPM technology is subject to legal restrictions in some regions and may not be used there.
You could commit a crime by importing or exporting the device in certain countries.
Note the respective import provisions for the TPM module.

Activating the Trusted Platform Module

The TPM can be activated under "Security" in the BIOS setup. Please follow the instructions
in the BIOS setup.

Using the Trusted Platform Module

The TPM can be used in Windows 7 with the "BitLocker" drive encrypter. Please follow the
instructions for this in the operating system.

Note
Risk of data loss
If you lose the password for the drive encryption, you will not be able to restore the data. You
will then lose accesss to the encrypted drive.
The warranty does not cover a reset of the hardware in the event of a loss of a password.
Please store the password carefully and make sure it is protected against unauthorized
access.

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parameters 6
6.1 Opening the Device

CAUTION
The device contains electronic components which may be destroyed by electrostatic
charge.
You therefore need to take precautionary measures before you open the device. Refer to
the ESD guidelines on handling electrostatically sensitive components (Page 121).

Requirement
● The device is disconnect from the mains.
● All connecting cables are unplugged
● Screwdriver of type Torx T10

Limitation of liability
All technical data and approvals apply only to expansion units which are released by
SIEMENS.
Siemens disclaims any liability for impairment of functions caused by the use of third-party
devices or components.
Observe the installation instructions for the components. UL approval of the device only
applies when the UL-approved components are used according to their "Conditions of
Acceptability".

Procedure

1. Remove the four screws in the

cover.
2. Lift up the cover.

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6.2 Expanding memory

6.2 Expanding memory

Memory expansion options

The motherboard has 2 slots for memory modules. DIMM DDR3 1600 memory modules,
type PC3-12800, unbuffered, with or without ECC can be used. This allows you to expand
IPC memory capacity to up to 16 GB, of which you can use approx. 3.2 GB for the operating
system and applications with 32-bit operating systems. You can install one or two modules.

Combination Slot x19 (outside) Slot x20 (inside) Maximum expansion

1 2 GB/4 GB/8 GB 8 GB
2 2 GB/4 GB/8 GB 2 GB/4 GB/8 GB 16 GB

Note
Dual-channel operation and available memory
• The modules can be inserted into any slot. Memory is operated in dual-channel mode if
two modules are installed.
• Memory modules with ECC and without ECC may not be used in mixed operation.
• If expansion modules with their own memory, for example graphics cards, with 256 MB or
more are used, the memory available for the 32-bit operating system or applications may
also be less than 3.2 GB.
In order to avoid operating faults you may have to remove a module so that the real
memory expansion on the motherboard and the reserved memory of the expansion
module do not overlap.

Preparation
Disconnect the device from mains and unplug all cables.

NOTICE
Electrostatic discharge
The electronic components on the PCBs are highly sensitive to electrostatic discharge.
Always take appropriate precautionary measures when handling these components. Refer
to the ESD directives on handling electrostatic sensitive components.

Note
We strongly recommend using only memory modules approved by Siemens. Siemens
disclaims any liability for impairment of functions caused by the use of third-party memory
modules.

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6.2 Expanding memory

Installing a memory module

1. Open the device (Page 78).

2. Note where the (polarized) cutout
① is located on the pin side of the
RAM module before inserting it.

3. Open the two locking mechanisms

on the left ② and right ③ of the
slot.
4. Insert the module downwards, ap-
plying slight pressure and press it
until the locking snaps into place.

5. Close the device.

Removing a memory module

1 Open the device (Page 78).

2 Release the locking mechanisms
on the left and right of the slot.

3 Pull the memory module out of the slot.

4 Close the device.

Display of the current memory configuration

A new memory module is automatically detected. When switching on the device and starting
the BIOS Setup using <F2>, the current memory size is displayed under "Total Memory".

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6.3 Expansion cards

6.3 Expansion cards

6.3.1 Notes on the expansion cards

The device is designed for use with PCI expansion cards conforming to PCI specification
V 2.2:
● 5 V 32 Bit PCI
● Universal 5 V & 3.3 V 32 Bit PCI
The following PCIe specifications apply to the use of PCIe cards:
● x16: V3.0
● x4: V2.0
Equipment options:
● 2 × PCI
● 1 × PCI, 1 × PCIe x16
● 1 × PCIe x4 Slot 1, 1 × PCIe x16 Slot 2

6.3.2 Removing and installing expansion cards

Requirement
● The device is opened.

Procedure

1. Loosen the fastening screw ④

and remove the card retainer ⑤.
2. Remove the slot cover ① from
the intended slot.
3. Insert the expansion card ② into
the intended slot.
4. Mount the card bracket and insert
the slider ③.
5. Screw in the slot cover ① of the
expansion card.

6. Insert the slider.

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6.3 Expansion cards

Inserting the slider

1. Push the slider through the guide

slot until it is firmly seated on the
expansion card. The expansion
card must now be inserted into
the slot.

NOTICE
Damage to the expansion card.
The expansion card can break if excessive force is used.
• Do not apply any pressure.
• Do not apply excessive force on the slider when you push it onto the expansion card.

2. Cut off the protruding part of

the slider element.
Use a knife to apply a cut on
the slider at the upper edge
of the bracket and then break
this section off. Cut off the
excess length with a diagonal
cutter.

Notes on the allocation of resources

The slots for the expansion cards come with exclusive interrupts. The assignment of the PCI
IRQ line to the PCI slot is explained in the chapter "Bus board (Page 145)".

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6.4 Drives

6.4 Drives
6.4.1 Installation options for internal drives
One 3.5" hard disk

Item Description
① Slot for one 3.5" drive
② Drive bay for one 3.5" drive

Two 2.5" hard disks

Item Description
① 2.5" hard disk: Two slots for
2.5" hard disks
② Drive bay for 2.5" hard disks

One SSD drive

Item Description
① SSD drive: Two slots for SSD
drives
② Drive bay for SSD drive

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6.4 Drives

6.4.2 Removing and installing the drive bay module

Requirement
● The device is opened.

Procedure
1. Remove the four screws ①.

2. Lift out the drive bay module for hard disks and set it down carefully with the base facing
downwards.

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6.4.3 Removing and installing hard disks

Procedure

Removing 2.5" drive

1. Remove the drive bay module.

2. Loosen the 4 screws ① on the
holding plates.
Do not remove the screws.

3. Remove the hard disk drive including the mounting plate from the bay.
4. Disconnect the power supply and the data cable from the drive.

Removing 3.5" drive

Note
Special screws with inch threads (screw designation 6-32x3/16''-St-G3E) are used with this
drive.

1. Remove the drive bay module.

2. Disconnect the power supply and the data cable from the drive.
3. Remove the screws ① (Torx
T15) of the drive.

4. Remove the hard disk drive from the bay.

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6.4 Drives

Removing hard disk in removable drive bay

See chapter "Maintaining and repairing the device", "Removing and installing hardware",
section "Removing and installing the hard disk in the removable drive bay (Page 105)".

Installation
Proceed in reverse order in each case.

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6.4 Drives

6.4.4 Removing and installing an SSD drive

Requirement
● The device is opened.

Procedure

Removal

1. Remove the drive bay module.

2. Disconnect the power supply and
the data cable from the drive.
3. Loosen the screws ① of the drive.

4. Remove the drive from the bay.

Installation
Proceed in reverse order.

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6.4 Drives

6.4.5 Installation options for external drives

Some devices are equipped with external drives according to their configuration; these are
mounted on the outside of the device, for example, a DVD drive.

A DVD drive
The figure shows a mounted DVD drive.

Two 2.5" hard disks in removable drive bay

Item Description
① 2.5" hard disk
② Tray for one 2.5" hard disk

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6.4.6 Removing and installing a DVD drive

Requirement
● The device is opened.

Procedure

Removing external drive

1. Remove the internal HDD/SSD drive bay module.

2. Loosen the following connectors of
the optical drive from the mother-
board:
• Power supply connector ①.
• SATA connector ②

3. Loosen the designated rivets on the

left and right on the cover with a
screwdriver and put the cover down
with the optical drive facing down-
wards.

4. Loosen the designated screws on

the inside of the cover.

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6.4 Drives

5. Remove the cover of the external

drive and the drive bay from the
device.
6. Pull the connector of the SATA
cable from the drive.

7. Loosen the four screws that con-

nect the optical drive with the drive
bay and pull out the optical drive to
the front from the drive bay.

Installing external drive

Proceed in reverse order.

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Maintaining and servicing your device 7
7.1 Maintenance
To maintain high system availability, we recommend the preventative replacement of those
PC components that are subject to wear. The table below indicates the intervals for this
replacement.

Component Replacement interval:

Hard disk drive 3 years
Fan 3 years
CMOS backup battery 5 years
SSD Depends on the type of use 1
1 The interval for replacement depends greatly on the type of use. A specific interval cannot be
given.

All drives are monitored with the software tools DiagBase or DiagMonitor on the basis of
their SMART status. As soon the SMART status of the HDD or SSD switches to "Not OK", a
message is sent in DiagBase or DiagMonitor, or when you start up the PC. You should then
back up your data and replace the drive.

7.2 Managing RAID systems

7.2.1 Example for a RAID1 system during the boot phase of the system

You can configure RAID hardware with <CTRL-I> in the boot phase. The associated
description is available on the "Documentation and Drivers" DVD.

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7.2 Managing RAID systems

7.2.2 RAID software

The RAID software "Intel Rapid Storage Technology" offers advanced functions to use and
manage the RAID system.
1. Select the RAID software via "Start > Programs > Intel Rapid Storage Technology".

2. Select "Manage" > "Advanced" to display details of the RAID system.

3. Select "Help" > "System Report" > "Save" to create a report with the details of the RAID
system.

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7.2 Managing RAID systems

7.2.3 Checking the status of the RAID system

By default, the status of the RAID system is displayed in the Windows Event Viewer and in a
log file of the program. If an error occurs, a hard disk can be synchronized at the operating
system level.

Note
It may take a very long time (hours or even days in the case of a high drive load) to
synchronize a new hard disk in the background, depending on its size and on the system
load.
The redundant system state is reached again only after synchronization is completed.

NOTICE
Operator errors on the machine or plant
Data is synchronized if a hard disk fails. Depending on the work load of the processor and
hard disks, the system may react with some delay. Execution of keyboard, mouse or touch
screen commands may be briefly delayed in extreme situations. This could result in
operator errors on the machine or plant.
Do not operate safety-critical functions when a hard disk has failed.

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7.2 Managing RAID systems

7.2.4 Displaying a defective hard disk of a RAID system in the RAID software

Note
Always replace the defective hard disk with a new hard disk of the same type and capacity.

If an error is detected the defective hard disk must be replaced with a new hard disk to return
to a secure RAID status after an error.
The RAID software indicates the following:
● A defective hard disk
● Details of the functioning hard disk:
The functioning hard disk is indicated by BIOS with its port number or by the RAID
software with its device port number.
The following figure shows the corresponding window in the RAID software with a RAID1
system.

You can find information on how to detect and replace a defective hard disk in the RAID
system in the section "Removing and installing hardware (Page 104)".

7.2.5 Special feature: Replacing hard disk in the RAID system when switched off
The RAID system does not automatically boot up when restarted if a defective hard disk was
replaced while the RAID system is switched off. Therefore, place the RAID system in the first
place of the bootable sources in the BIOS setup menu "Boot". Otherwise, the system will
boot from the hard disk you have just installed and the message "Operating system not
found" will be displayed.

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7.2 Managing RAID systems

7.2.6 Integrating a new hard disk drive in the RAID system

The RAID system is configured in the delivery state so that a new hard disk must be
integrated manually in case of an error. To integrate the hard disk automatically, activate
"Automatic rebuild" in the "Preferences" menu of the RAID software.

Automatic integration of a hard disk

NOTICE
Data loss
The hard disk to be integrated is not checked for partition information or existing data
during automatic integration.
All partitions and data on the hard disk are deleted without warning. Insert only a brand-new
hard disk.

Requirement:
● "Automatic rebuild" is selected in the "Preferences" menu of the RAID software.
● The hard disk must be completely new or set up as spare drive for this purpose. Notes on
creating spare drives are available in the controller documentation.
Sequence
The following figure is an example for the automatic rebuilding process.

A defective hard disk is still displayed during the rebuilding process. This display disappears
when the rebuilding process is completed.

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7.2 Managing RAID systems

Procedure - integrating hard disk manually

When the "Automatic rebuild" option is deselected in the "Preferences" menu of the RAID
software (default setting), you must integrate the hard disk manually:
1. Select "Start" > "Programs" > "Intel Rapid Storage Technology".
2. Click "Run Hardware Scan now".
The new hard disk is found and displayed.
Or:
1. Reboot the device.
The RAID software automatically integrates the hard disk.
2. Click the "Rebuild to another Disk" link.
The RAID system is synchronized.
The following figure shows the window when integrating a hard disk in a RAID1 system.

If you shut down and restart the system without installing a functioning new hard disk,
"unused" is displayed for the corresponding SATA port. You can install the functioning hard
disk while the system is running. The new hard disk is then assigned to a SATA port and is
integrated into the RAID system.
A defective hard disk is still displayed during the rebuilding process. This display disappears
when the rebuilding process is completed.

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7.3 Service and spare parts

7.3 Service and spare parts

Making repairs

WARNING
Opening the device
Unauthorized opening and improper repairs on the device may result in substantial damage
to equipment or endanger the user. If you install or replace a system expansion and
damage your device, the warranty will become void.
The device may only be repaired by qualified personnel.

Safety when working in and on electrical systems

Work in or on electrical systems may only be carried out by authorized persons. The
following safety regulations apply in Germany for the prevention of electric shock and
electrocution:
1. Switch off the system
2. Secure the system to prevent it switching back on
3. Check the system to ensure it is de-energized
4. Ground and short the system
5. Cover or shield adjacent live parts
These safety rules are based on the DIN VDE 0105 standard.

Note
These safety steps must always be taken in the above order before any work on electrical
systems. Once work on an electrical system is finished, cancel the safety steps starting with
the last and finishing with the first.

In accordance with the applicable safety regulations, clearly indicate on an electrical system
that work on it is underway.
Observe the safety regulations applicable in the country of operation.

CAUTION
Electrostatic-sensitive components
The device contains electronic components which are destroyed by electrostatic charges.
This can result in malfunctions and damage to the machine or plant.
Make sure you take precautionary measures even when you open the device, for example,
when opening device doors, device covers or the housing cover. For more information,
refer to the chapter "ESD Guideline (Page 121)"

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7.3 Service and spare parts

WARNING
Risk of explosion and release of harmful substances
Improper handling of lithium batteries can result in an explosion of the batteries. Explosion
of the batteries and the released pollutants can cause severe physical injury.
Observe all safety and handling instructions for lithium batteries. Do not expose lithium
batteries to flames and do not solder the battery cell. Do not recharge, open, or short
lithium batteries. Do not reverse lithium battery polarity or heat the batteries to over 100°C.
Keep lithium batteries out of direct sunlight and protect them from moisture and
condensation.

Note the following when handling lithium batteries:

● An empty battery jeopardizes the function of the device. Charge the battery in good time.
● Replace lithium batteries only with batteries of the same type or a type recommended by
the manufacturer.
The order number for the lithium battery is A5E00331143.

NOTICE
Batteries and rechargeables pollute the environment
Do not dispose of used batteries or rechargeables in household waste. Users are obliged
by law to return used batteries and rechargeable batteries. You as the user are legally
responsible disposing used batteries or rechargeables in a correct manner.
Observe the following rules for the disposal of batteries and rechargeables:
• Dispose of used batteries and rechargeable batteries separately as hazardous waste in
accordance with local regulations.
• You can take used batteries and rechargeable batteries to public collection points and
wherever batteries and rechargeable batteries of the type in question are sold.
• Mark used battery containers as "Used batteries".

Limitation of liability
All technical specifications and approvals for the device apply only if you use expansion
components that have a valid CE approval (CE marking). The installation instructions for
expansion components in the associated documentation must be observed.
UL approval of the device only applies when the UL-approved components are used
according to their "Conditions of Acceptability".
We are not liable for functional limitations caused by the use of third-party devices or
components.

See also
Spare parts and repairs (http://support.automation.siemens.com/WW/view/en/16611927)

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7.4 Cleaning the Device Front

7.4 Cleaning the Device Front

The device is designed for low-maintenance operation. You should still clean the device front
regularly, however.

CAUTION
Unwanted reactions when cleaning the device
You risk unintentional actuation of control elements if you clean the device while it is
switched on.
You may possibly trigger unwanted actions of the device or controller that are liable to
cause personal injury or damage to the machinery.
Always switch off the device before you clean it.

Cleaning Agents

NOTICE
Damage to the HMI device caused by impermissible cleaning agents
Impermissible and unsuitable cleaning agents may cause damage to the HMI device.
Use dish soap or foaming screen cleaner only as cleaning agents. Do not use the following
cleaning agents:
• Aggressive solvents or scouring powder
• Steam jets
• Compressed air

Cleaning the Device Front

1. Switch off the device.
2. Dampen the cleaning cloth.
3. Spray the cleaning agent on the cloth and not directly on the device.
4. Clean the device with the cleaning cloth.

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7.5 Separating the control unit from the computer unit

7.5 Separating the control unit from the computer unit

Introduction
You separate the control unit from the computer unit in the removed state to carry out repairs
or to replace the control unit, for example.

Requirement
● The device is disconnected from the mains.
● The device is fully removed.
● The device is lying on a soft cloth with the front side down.

Procedure

1. Loosen the 4 screws ① some-

what, but do not remove them.

2. Loosen the captive knurled

screw ② and remove the metal
door from the slots ③.

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7.5 Separating the control unit from the computer unit

3. Pry out the connector ④ using

a screwdriver.
4. Push the computer unit back
slightly until the screw ⑤ lies
exactly in its recess.
5. Pull the connector ④ fully out.
6. Lift up the computer unit and
gently place it on a soft surface.

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7.6 Connecting the control unit with the computer unit

7.6 Connecting the control unit with the computer unit

Requirement
● Computer unit and control unit are disconnected from the mains.
● Control unit and computer unit are fully removed.
● The control unit is lying on a soft cloth with the front side down.

Procedure

1. Set down the computer unit with

its guide rail lightly on the
screws ①.
Make sure that the computer
unit is not scratched and there
is sufficient distance to the con-
trol unit for the connector② and
its cable.

2. Mount the connector ② on its

corresponding guide rail (see
figure) and push the connector
all the way in until it is securely
at the back of its socket.
3. Push the left connector ③ to
the back of its socket as depict-
ed using the index finger ④ as
support.

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7.6 Connecting the control unit with the computer unit

4. Check once again that all the

connectors ⑤ are fully plugged
in and are the same height at
the front.
5. Insert the metal door in the riv-
ets ⑥ and close the metal door
with the knurled screw ⑦.
6. Slide the computer unit all the
way forward to the stop screw
⑧ and screw in the 4 screws.

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7.7 Removing and installing hardware

7.7 Removing and installing hardware

7.7.1 Replacing a defective hard disk drive in the RAID system

A hard disk can only be replaced during operation in the removable drive bay in connection
with a configured RAID1 system. This functionality is referred to as "Hot Swap".

Note
If you have configured a non-RAID system with several hard disks, or in the case of an
internally installed hard disk, you need to turn off the device before you replace a hard disk.

Observe the EGB guidelines. Always replace the drive with a new drive of the same type and
capacity.

Mounting locations for hard disks in the RAID1 system

Hard disks for a RAID1 system can be installed permanently in the device or in a removable
drive bay.

Note
The replacement of a RAID hard disk with removable drive bay can be performed without
shutting down the device. An internal hard disk may only be replaced when the device is
switched off.
The new hard disk can be integrated into the RAID system at operating system level with the
RAID software. Synchronization may take several hours, depending on system load.

Status displays of the hard disks in a RAID1 system

The following table includes information on the alarms of the status displays. If the hard disk
is defective and the SIMATIC DiagBase monitoring software is installed, the LEDs of the
status display light up individually or simultaneously.

Internal hard disk or hard disk in removable drive bay

Status display RAID BIOS RAID software SATA connection of Drive

the motherboard
HDD0 alarm Port 0 Device port 0 SATA 0 0
HDD1 alarm Port 1 Device port 1 SATA 1 1

Replacing a defective hard disk in the RAID system

1. Determine which hard disk was reported by the RAID software as defective.
2. Remove the defective hard disk or replace the hard disk in the removable drive bay.
3. Replace the defective hard disk with a hard disk of the same type and capacity.
4. Integrate a new hard disk drive into the RAID system (Page 95).

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7.7 Removing and installing hardware

7.7.2 Removing and installing the hard disk in the removable drive bay

Procedure

Removal

1. Open the lock identified in the figure with the appropriate key from the top.
2. Push in both sliders ① on the han-
dle and remove the hard disk tray
using its handle.
3. Place the hard disk bay top down
on a soft surface.
4. Loosen the screws ② of the drive.

5. Remove the drive from the removable drive bay.

Installation
Proceed in reverse order.

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7.7 Removing and installing hardware

7.7.3 Replacing the Backup Battery

Note
Batteries are wearing parts and should be replaced every 5 years to ensure proper
functioning of the PC.

To be noted before you replace the battery

WARNING
Risk of explosion and release of harmful substances!
For this reason, do not burn lithium batteries, do not solder on the cell body, do not open,
do not short circuit, do not reverse polarity, do not heat above 100°C, dispose of correctly,
and protect against direct sunlight, dampness and dew.

NOTICE
Risk of damage!
The lithium battery may only be replaced with an identical battery or with a type
recommended by the manufacturer (Order No.: A5E00331143).
Disposal
Batteries must be disposed of in accordance with local regulations.

Requirement

Note
For the BIOS setting "Profile: Standard" the configuration data of the device is deleted when
the battery replacement takes more than 30 seconds. You need to enter the configuration
data again in the BIOS setup.
For the BIOS setting "Profile: User" the configuration data of the device is retained; only the
date and time has to be reconfigured.
The content of the SRAM is lost if the battery replacement takes more than 30 seconds.

● You have written down the current settings of the BIOS setup.
A list in which you can note down this information is found in the BIOS description.
● The device is disconnected from the mains and all connecting cables have been
removed.

Note
You can also replace the battery while the device is running; do not touch anything with the
device in this case. We recommend switching off the device beforehand.

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7.7 Removing and installing hardware

Procedure

1. Open the battery compartment with

a screwdriver at the indicated loca-
tion.

2. Remove the battery holder.

3. Detach the cable.

4. Remove the old battery.

5. Fasten the new battery and reinsert the battery holder.
6. Close the battery compartment.

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7.7 Removing and installing hardware

7.7.4 Removing and installing the power supply

Requirement
● The device is opened.

Procedure

Removal

1. Remove the screw at the indi-

cated location below the on/off
switch on the back of the device.

2. Remove the identified screws

(Torx T10) on the side.

3. Remove the drive bay module.

(Page 84)
4. Remove the labeled power sup-
ply connector of the power sup-
ply.
5. Lift up the power supply unit
slightly and remove it to the rear
top

Installation
Proceed in reverse order.

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7.7 Removing and installing hardware

7.7.5 Removing and installing the bus board

Requirement
● The device is opened.

Procedure

Removal
1. Remove all modules from the slots.
2. Remove the drive bay module for hard disks.
3. Remove the power supply.
4. Remove the screws ① on the bus board.

5. Pull the bus board from the motherboard.

Installation
Proceed in reverse order.

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7.7 Removing and installing hardware

7.7.6 Removing and installing the power supply fan

Requirement
● The device is opened.
● The power supply has been removed.

Procedure

Removal
1. Pull out the plug of the power supply fan ①.

2. Loosen the four screws ② on the enclosure.

3. Take the power supply fan out of the enclosure.

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7.7 Removing and installing hardware

Installation

Note
Install only a fan of the same type. Note the correct mounting position of the fan.

The figure shows the correct mounting position.

● Direction of flow: Make sure that the blades ① of the power supply fan are on the outside
of the housing.
● Run the power supply cable ② along the housing edge and fasten any excess cable as
loop as shown in the illustration.

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7.7 Removing and installing hardware

7.7.7 Removing and installing the device fan

Requirement
● The device is opened.

Procedure

Removal

1. Remove the two screws ① and

remove the air guide pulling it
up vertically.

2. Loosen the four plastic rivets ②

on the enclosure.

3. Pull out the fan plug ③.

4. Take the fan ④ out of the en-
closure.

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7.7 Removing and installing hardware

Installation

Note
Install only a fan of the same type. Note the correct fan mounting position: Make sure that
the blades of the fan are on the outside of the housing.

Proceed in reverse order.

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7.7 Removing and installing hardware

7.7.8 Replacing the processor

Requirement
● The device is opened.
● The memory modules have been removed.
● The air guide has been removed (see chapter "Removing and installing the device fan
(Page 112)")
● A suitable processor
Only an approved processor is permitted to be installed on the motherboard of the
device. If the processor type is changed, the BIOS must be updated so that the suitable
microcode is loaded. Information about original spare parts for SIMATIC IPCs is available
on the Internet at:
– Contacts (http://www.siemens.com/automation/partner)
– SIMATIC IPC after-sales information system (http://www.siemens.com/asis)

Procedure
1. Loosen the screws ①.

The fourth screw is hidden by the air guide in the figure.

2. Remove the heat sink.
3. Release the lever ② of the processor bay and tilt it all the way back. The bay releases
the processor.

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7.7 Removing and installing hardware

4. Remove the processor by grabbing the rails on the side ④. Do not touch the processor
and its connections in the process (see Technical Specifications, chapter "ESD
guidelines").
5. Install the new processor on the socket, as shown in the figure.
During positioning, make sure to take the highlighted arrow on the processor into
consideration.
6. Tilt the lever to the front again. Make sure that the bay covers the screw ③.
7. Press the lever all the way down and lock it again.

NOTICE
Damage to the processor
The locking mechanism may be stuck. The locking mechanism is damaged while being
pressed down. The processor is not correctly locked in place by the bay. The result may
be malfunctions.
• Do not use excessive force.
• Tilt the lever back again and try again.

The next steps are available in the "Technical manual of the motherboard" on the
"Documentation and Drivers" DVD shipped with the product.

Processor type and clock frequency

When a processor is replaced, perform a BIOS update. The microcode matching the
processor is loaded in the process.

Note
Damage to the processor due to high clock frequency
If the installed processor is operated with a higher clock frequency than permitted, it can be
destroyed or cause loss of data.
Operate the processor only at a clock frequency that is equal to or less than the permitted
clock frequency.

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7.8 Recycling and disposal

7.8 Recycling and disposal

Due to the low levels of pollutants in the HMI devices described in these operating
instructions, they can be recycled.
Contact a certified disposal service company for electronic scrap for environmentally sound
recycling and disposal of your old devices, and dispose of the device according to the
relevant regulations in your country.

7.9 Installing operating system, software and drivers

7.9.1 Installing the operating system

Information on commissioning, restoring or reinstalling the operating system you ordered
with the device can be found in the detailed operating system description on the delivered
data carrier or online under:
● Microsoft® Windows® 7
(https://support.industry.siemens.com/cs/ww/en/view/109749497)
● Microsoft® Windows® 10
(https://support.industry.siemens.com/cs/ww/en/view/109749498)
● Microsoft® Windows Embedded Standard® 7
(https://support.industry.siemens.com/cs/ww/en/view/109749499)

7.9.2 Installing software and drivers

The supplied USB stick (read only), contains the "Documentation and Drivers" suite, which
you use to install all supplied software and drivers.

Procedure
1. Insert the provided USB stick into the device.
2. Start the "Documentation and Drivers" suite from the USB flash drive by executing the
"START_DocuAndDrivers.CMD" file.
3. Install the desired software and drivers.

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8.1 Certificates and approvals
ISO 9001 certificate
The Siemens quality management system for our entire product creation process
(development, production and sales) meets the requirements of ISO 9001:2008.
This has been certified by DQS (the German society for the certification of quality
management systems).
Certificate no.: 001323 QM08

Software license agreements

If the device is supplied with preinstalled software, you must observe the corresponding
license agreements.

UL approval
● UL 508 (Industrial Control Equipment)
● CSA C22.2 No. 142 (Process Control Equipment)
● ANSI/ISA 12.12.01 (Hazardous Location)
● CSA-213 (Hazardous Location) Approved for use in
● Cl. I Div. 2, GP. A, B, C, D T4
● Cl. I, Zone 2, GP. IIC T4

ATEX/IECEx approval

Additionally to the installation instructions in the user manual of IPC477D the following
specifications must be observed for installation in hazardous locations.

The device has to be used in pollution degree 2 environment only.

Use copper supply wires of at least 0.75 mm2.

EN60079-0 (ATEX)
EN60079-15 (ATEX)
EN60079-31 (ATEX)
IEC60079-0 (IECEx)
IEC60079-15 (IECEx)

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8.1 Certificates and approvals

IEC60079-31 (IECEx)

II 3 G Ex nA IIC Tx Gc
II 3 D Ex tc T 70 °C Dc

Approval Mark ATEX 15ATEX0119X and/or IECEx DEK 15.0080X

Note
Installation
You have to install the device so that the complete device conforms to IP65.
The front panel of the mounted device confirms to IP65.

CAUTION
DC-Version
If a main circuit breaker for DC-supply should be installed in hazardous locations as
described above it has to be intended for use in that area. Otherwise it must be installed in
an area which is known to be non-hazardous.

WARNING
Risk of explosion when connecting or disconnecting the device
EXPLOSION HAZARD
WARNING - EXPLOSION HAZARD - Do not connect or disconnect while circuit is live
unless area is known to be non-hazardous.

This equipment is suitable for use in Class I, Division 2, Groups A, B, C and D or non-
hazardous locations only.

WARNING
Warning - Explosion Hazard - Batteries Must Only Be Changed In An Area Known To Be
Non-Hazardous.
The lithium battery shall only be replaced by a trained technician.

WARNING
Replacing components
EXPLOSION HAZARD
WARNING - SUBSTITUTION OF COMPONENTS MAY IMPAIR SUITABILITY FOR
CLASS I, DIVISION 2 OR ZONE 2.

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8.1 Certificates and approvals

Reference designation Description Type of Protection

Hard Disk Drive on Motherboard HDD Brushless Motor

Federal Commu- This equipment has been tested and found to comply with the limits for a Class
nications Commis- A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed
sion to provide reasonable protection against harmful interference when the equip-
Radio Frequency ment is operated in a commercial environment. This equipment generates, uses,
Interference and can radiate radio frequency energy and, if not installed and used in accord-
Statement ance with the instruction manual, may cause harmful interference to radio com-
munications. Operation of this equipment in a residential area is likely to cause
harmful interference in which case the user will be required to correct the inter-
ference at his own expense.
Shielded Cables Shielded cables must be used with this equipment to maintain compliance with
FCC regulations.
Modifications Changes or modifications not expressly approved by the manufacturer could
void the user's authority to operate the equipment.
Conditions of This device complies with Part 15 of the FCC Rules. Operation is subject to the
Operations following two conditions: (1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.

CANADA
Canadian Notice This Class A digital apparatus complies with Canadian ICES-003.
Avis Canadien Cet appareil numérique de la classe A est conforme à la norme NMB-
003 du Canada.

RCM AUSTRALIA/NEW ZEALAND

This product meets the requirements of EN 61000-6-4 Generic standards – Emission
standard for industrial environments.
This product meets the requirements of the standard EN 61000-6-4 Generic standards –
Emission standard for industrial environments.

8.1.1 KC Mark (Korea)

This product meets the requirements of Korean certification.
This product satisfies the requirement of the Korean Certification (KC Mark).
이 기기는 업무용(A급) 전자파 적합기기로서 판매자 또는 사용자는 이 점을 주의하시기
바라며 가정 외의 지역에서 사용하는 것을 목적으로 합니다.

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8.2 Directives and declarations

8.2 Directives and declarations

8.2.1 CE marking
The device meets the guidelines listed in the following sections.

EU Declaration of Conformity
The associated declaration of conformity is available on the Internet at the following address:
Panel PC certificates
(http://support.automation.siemens.com/WW/view/en/10805572/134200).

Electromagnetic compatibility
This product meets the requirements of EC Directive 2004/108/EC "Electromagnetic
Compatibility".
The device is designed for the following areas of application corresponding to the CE
marking:

Scope of application Requirements for

Interference emission Immunity to interference
Industrial area EN 61000-6-4 +A1 EN 61000-6-2

The devices with AC power supply comply with the standards EN 61000-3-2 +A1 +A2
(harmonic currents) and EN 61000-3-3 (voltage fluctuations and flicker).

Low-voltage directive
The device with AC power supply complies with the requirements of the EU Directive
2014/35/EU "Low Voltage Directive". Compliance with this standard has been verified
according to EN 60950-1 +A11 +A1 +A12 +A2.

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8.2 Directives and declarations

8.2.2 ESD guideline

What does ESD mean?

An electronic module is equipped with highly integrated components. Due to their design,
electronic components are highly sensitive to overvoltage and thus to the discharge of static
electricity. Such electronic components or modules are labeled as electrostatic sensitive
devices.
The following abbreviations are commonly used for electrostatic sensitive devices:
● ESD – Electrostatic sensitive device
● ESD – Electrostatic Sensitive Device as a common international designation
Electrostatic sensitive devices can be labeled with an appropriate symbol.

NOTICE
Damage to ESD from touch
Electrostatic sensitive devices, ESD, can be destroyed by voltages which are far below the
human perception limit. If you touch a component or electrical connections of a module
without discharging any electrostatic energy, these voltages may arise.
The damage to a module by an overvoltage can often not be immediately detected and only
becomes evident after an extended period of operation. The consequences are incalculable
and range from unforeseeable malfunctions to a total failure of the machine or system.
Avoid touching components directly. Make sure that persons, the workstation and the
packaging are properly grounded.

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8.2 Directives and declarations

Charge
Every person without a conductive connection to the electrical potential of his/her
surroundings can be electrostatically charged.
The material with which this person comes into contact is of particular significance. The
figure shows the maximum electrostatic voltages with which a person is charged, depending
on humidity and material. These values conform to the specifications of IEC 61000-4-2.

① Synthetic materials
② Wool
③ Antistatic materials such as wood or concrete

NOTICE
Grounding measures
There is no equipotential bonding without grounding. An electrostatic charge is not
discharged and may damage the ESD.
Protect yourself against discharge of static electricity. When working with electrostatic
sensitive devices, make sure that the person and the workplace are properly grounded.

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8.2 Directives and declarations

Protective measures against discharge of static electricity

● Disconnect the power supply before you install or remove modules which are sensitive to
ESD.
● Pay attention to good grounding:
– When handling electrostatical sensitive devices, make sure that persons, the
workstation and devices, tools and packaging used are properly grounded. This way
you avoid static discharge.
● Avoid direct contact:
– As a general rule, do not touch electrostatic sensitive devices, except in the case of
unavoidable maintenance work.
– Hold the modules at their edge so that you do not touch the connector pins or
conductor paths. This way, the discharge energy does not reach and damage the
sensitive components.
– Discharge your body electrostatically before you take a measurement at a module. Do
so by touching grounded metallic parts. Always use grounded measuring instruments.

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8.3 Dimension drawings

8.3 Dimension drawings

8.3.1 Dimension drawing of 15" device with capacitive multi-touch screen

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8.3 Dimension drawings

8.3.2 Dimension drawing of 19" device with capacitive multi-touch screen

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8.3 Dimension drawings

8.3.3 Dimension drawing of 22" device with capacitive multi-touch screen

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8.3 Dimension drawings

8.3.4 Dimension drawing of 15" device with resistive single touch screen

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8.3 Dimension drawings

8.3.5 Dimension drawing of 19" device with resistive single touch screen

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8.3 Dimension drawings

8.3.6 Dimension drawing of 22" device with resistive single touch screen

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8.3 Dimension drawings

8.3.7 Dimensional drawing for the installation of expansion cards

Short PCI or PCIe expansion card

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8.4 Technical specifications

8.4 Technical specifications

8.4.1 General technical specifications

Order numbers See order documents

Weight 15" 19" 22"
12 kg 14 kg 16 kg
Supply voltage AC Nominal 100-240 V AC (-15% / +10%) (autorange)

Supply voltage DC 1 Nominal 24 V DC (-20% / + 20%), SELV 1

Input current AC Continuous current up to 2.5 A (up to 50 A for 1 ms at startup)
Input current DC Continuous current up to 8 A (up to 14 A for 20 ms at startup)
Line voltage frequency 50-60 Hz (47 to 63 Hz)
Short-term voltage interruption in max. 20 ms (at 93 to 264 V)
accordance with Namur (max. 10 events per hour; recovery time at least 1 s)
Power consumption • AC: 190 W
• DC: 210 W
Degree of protection On the front: IP 65
At the rear: IP 20 according to IEC 60529
Protection class Protection class I to IEC 61140
Safety specifications EN 60950-1; UL508; CSA C22.2 No 142
Noise emission < 55 dB(A) according to EN ISO 7779
Quality assurance In accordance with ISO 9001

1 The device should only be connected to a 24 V DC power supply which meets the re-
quirements of safe extra low voltage (SELV) according to IEC/EN/DIN EN 60950-1. A
protective conductor must also be used (see section "Connecting the 24 VDC power sup-
ply (Page 48)").

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8.4 Technical specifications

Electromagnetic compatibility

Interference emission EN 61000-6-3, EN 61000-6-4, CISPR22 class A; FCC class A

Immunity with regard to conduct- ± 2 kV according to IEC 61000-4-4; burst
ed interference on the supply lines ± 1 kV according to IEC 61000-4-5; symmetrical surge
± 2 kV according to IEC 61000-4-5; asymmetrical surge
Noise immunity on signal lines ± 1 kV to IEC 61000-4-4; Burst; Length < 3 m
± 2 kV in accordance with IEC 61000-4-4; Burst; length > 3 m
± 2 kV in accordance with IEC 61000-4-5; Surge; length > 30 m
Immunity to electrostatic dis- ± 6 kV contact discharge in accordance with IEC 61000-4-2
charge ± 8 kV air discharge in accordance with IEC 61000-4-2
Immunity to RF interference 10 V/m 80 MHz - 2.7 GHz, 80% AM according to IEC 61000-4-3
3 V/m 2.7–6 GHz, 80% AM according to IEC 61000-4-3
10 V 10 KHz–80 MHz, 80% AM according to IEC 61000-4-6
Immunity to magnetic fields 100 A/m, 50/60 Hz according to IEC 61000-4-8

Motherboard

Chipset Intel DH82C226 PCH

Processor • Intel Xeon E3-1268L v3 2.3 (3.3) GHz, 4 cores, 8 threads, GT2,
8 MB second level cache, HT, AMT
• Intel Core i3-4330TE 2.4 GHz, 2 cores, 4 threads, GT2, 3 MB
second level cache
• Intel Celeron G1820TE 2.2 GHz, 2 cores, 2 threads, GT1, 2 MB
second level cache
Main memory Expansion options
• 2 GB, 4 GB, 8 GB, 16 GB without ECC
• 4 GB, 8 GB, 16 GB with ECC
Buffer memory 2 MB SRAM
Expansion card slots 1 × PCI 185 mm long and 1 × PCI 185 mm long
1 × PCI 185 mm long and 1 × PCIe x16 185 mm long
1 × PCIe x16 185 mm long and 1 × PCIe x4 185 mm long

Drive and memory media

Hard disk drive 1 × 3.5" SATA HD

2 × 2.5" SATA HD
Solid State Disk 1 × 2.5" SATA SSD, ≥ 240 GB standard
DVD burner ∗2 Serial ATA, See order documentation for features

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8.4 Technical specifications

Display

15" 1 15" 2 19" 22"

Display type LCD TFT with LCD TFT LCD TFT LCD TFT with
extended view- extended view-
ing angle ing angle
Degree of protection on the IP 65 IP 65 IP 65 IP 66
front
Active display area 331 x 207 mm 364 mm x 216 410 mm x 230 475 mm x 267
mm mm mm
Resolution 1280 x 800 1366 x 768 1366 x 768 1920 x 1080
Pixels Pixels Pixels Pixels
Displayable colors Up to 16.7 million
Brightness control Yes, value range 0 to 99 3
0 = backlighting off
Backlighting LED LED LED LED
Half Brightness Life Time 80000 h 70000 h 50000 h 30000 h
(MTBF43)
Pixel error class in accord- II
ance with ISO 9241-307
Contact force resistive touch With test stylus, 2 mm diameter: 5 N
screen
Power consumption 25 W 25 W 25 W 32 W
1 resistive touch screen only
2 capacitive touch screen only
3 Via SetBrightness dialog: 9 to 99 (≙ 10% to 100%),
via SetBrightness command line call: 0 to 99
4 MTBF: Operating hours after which the maximum brightness is reduced by half compared to the
original value. MTBF is increased by using the integrated dimming function, for example, time-
controlled via screen saver or centrally via PROFIenergy.

Graphics

Graphic controller • Xeon: Intel® HD Graphics Controller P4600 GT2

• Core i3: Intel® HD Graphics Controller P4600 GT2
• Celeron: Intel® HD Graphics Controller (GT1)
Graphics memory 32 - 512 MB Shared Memory
Resolution / frequency / col- • Display Port (Spec. V1.2) : max. 3840 x 2160 / 60 Hz / 32-bit
ors
• DVI-D : max. 1920 x 1200 / 60 Hz / 32 Bi
• VGA: max. 1920 x 1200 / 60 Hz / 32-bit

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8.4 Technical specifications

Interfaces

DVI-I Connection of DVI display devices

DisplayPort Connection of DisplayPort display devices
Keyboard USB support
Mouse USB support
USB 4 × USB 3.0, max. 2 can be simultaneously operated as high current
Front USB 3.0 for device with resistive single touch
PROFIBUS / MPI interface, 9-pin Cannon socket, 2-row
isolated
• Transmission speed:

9.6 kbps to 12 Mbps

• Operating modes:

DP master: DP-V0, DP-V1 with SOFTNET DP

DP slave: DP-V0, DP-V1 with SOFTNET-DP slave

PROFINET 3 RJ45 connection, CP1616 compatible,
onboard interface based on ERTEC 400,
10/100 Mbps, electrically isolated
Ethernet 3 2 × Ethernet port (RJ45) Intel WGI217LM and Intel WGI210IT,
10/100/1000 Mbps, electrically isolated,
Wake on LAN, remote boot,
teaming and Jumbo frames up to 9014 bytes are supported 4 5
COM1 RS232, 115 kbps max., 9-pin SUB-D, male
Free slots for expansion 2 PCI/PCIe cards
cards
3 For unique labeling, the Ethernet ports are numbered on the enclosure. The numbering by the
operating system can differ.
4 No teaming with AMT.
5 When using AMT, the interface x1 p1 must be used for connection to remote maintenance.

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8.4 Technical specifications

8.4.2 Ambient conditions

Climatic ambient conditions

Ambient temperature, tested according to IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-14
In operation, horizontal format, vertical instal- + 5 °C to + 45 °C
lation 1 2
In operation, horizontal format, inclined instal- + 5 °C to + 40 °C
lation 2
In operation, vertical format, vertical installa- + 5 °C to + 45 °C
tion 2
Storage/transportation – 20° C to +60° C
Gradient max. 10° C/h in operation, 20° C/h storage, no con-
densation
1 DVD burner operation is only permitted with ambient temperatures of +5°C to +40 °C
2 The total power for USB and PCI/PCIe expansions cannot exceed 30 W, no DVD operation

Relative humidity, tested in accordance with IEC 60068-2-78, IEC 60068-2-30

During operation 5 °C to 31 °C: 5% to 80% (no condensation):
linear decrease down to 5% to 25% at 45 °C (no condensation)
Storage/transportation 5% to 95 % at 25° C (no condensation)

Atmospheric pressure
During operation 1080 to 795 hPa (corresponds to an altitude of -1000 to 2000 m)
Storage/transportation 1080 to 660 hPa (corresponds to an altitude of -1000 to 3500 m)

Mechanical ambient conditions

Vibration, tested according to DIN IEC 60068-2-6

During operation 10 to 58 Hz: 0.075 mm, 58 to 500 Hz: 9.8 m/s2
Storage/transportation 5 to 9 Hz: 3.5 mm, 9 to 500 Hz: 9.8 m/s2

Shock resistance, tested in accordance with IEC 60068-2-27, IEC 60068-2-29

During operation 1 50 m/s2, 30 ms
Storage/transport 1 250 m/s2, 6 ms
1 Restriction for DVD burners: Read, write and burner operation only permitted in an interference-
free environment.

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8.4 Technical specifications

8.4.3 Current and power requirements

Maximum current values

Component Voltage
+5 V +3.3 V +12 V -12 V
Base device 1, 2 7.5 A
Hard disk drive 1 × 3.5" 2 0.6 A 0.5 A
Hard disk drives 2 × 2.5" 2 1.2 A
SSD drive (SATA) 1 x 2.5" 2 0.8 A
DVD burner drive 2 0.8 A
USB ports 3 4 2A
PCI/PCIe slots total
4 4A 6A 2A 0.1 A
Maximum per PCI slot 4A 6A 0.5 A 0.1 A
Maximum per PCIe slot - 3A 2A -
Internal front interfaces for Panel PC 2.41 A
Individual currents (max. permissible) 5 14 A 14 A 12.5 A 0.3 A
1 Base device includes motherboard, processor, memory, both fans, CF
2 Depends on the selected device configuration
3 2 × USB3.0 high current and 2 × USB2.0 low current.
4 The power for individual PCI/PCIe slots cannot exceed 25 W.
The total power for USB and PCI/PCIe slots cannot exceed 30 W.
5 The max. permitted accumulated power of +5 V and +3.3 V is 60 W.

Typical power values

Component Current consump- Current consump- Power consumption

tion tion 0.85 efficiency
230 VAC 24 VDC
Base device 0.3 A 3.0 A 70 W
Hard disk drive 1 × 3.5" 0.04 A 0.38 A 9W
Hard disk drives 2 × 2.5" 0.03 A 0.25 A 6W
SSD drive (SATA) 1 x 2.5" 0.02 A 0.17 A 7W
DVD burner drive 0.02 A 0.17 A 4W
USB ports max. 0.06 A max. 0.54 A max. 13 W
PCI/PCIe slots 0.16 A max. 1.54 A max. Max. 37 W
Operator panel max 0.14 A max. 1.33 A max. 32 W

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8.4 Technical specifications

8.4.4 AC voltage supply

Technical data

Note
The power supply contains an active PFC (Power Factor Correction) circuit to conform to the
EMC guidelines.
Uninterruptible AC power systems (UPS) must supply a sinusoidal output voltage in the
normal and buffered mode when used with SIMATIC PCs with an active PFC.
UPS characteristics are described and classified in the standards EN 50091-3 and IEC
62040-3. Devices with sinusoidal output voltage in the normal and buffered mode are
identified with the classification "VFI-SS-...." or "VI-SS-....".

Power supply characteristics AC power supply

Input data
Voltage Nominal 100 - 240 V AC (-15% / +10%), wide
range
Continuous current Max. 1.7 A for 20 ms
Starting current (load-independent) Max. 132 A for a half-value time of 0.8 ms
I²t Max. 9.5 A²s
Active power 176 W
Apparent power 190 VA
Output data
Voltages +12 V / 12.5 A
Secondary power output Max. 150 W

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8.4 Technical specifications

Power Good signal of the AC power supply

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8.4 Technical specifications

8.4.5 DC power supply

Technical data

Power supply characteristics DC power supply

Input data
Voltage Nominal 24 V DC (-20% / +20%), SELV, isolated
Continuous current Max. 8 A
Starting current (load- Max. 13 A for a period of 50 ms
independent)
I²t Max. 3.5 A²s
Active power 176 W
Output data
Voltages +12 V / 12.5 A
Secondary power output Max. 150 W

Power Good signal of the DC power supply

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8.5 Hardware descriptions

8.5 Hardware descriptions

8.5.1 Motherboard

8.5.1.1 Structure and functions of the motherboard

The essential components of the motherboard are the processor and the chip set, two slots
for memory modules, internal and external interfaces and the Flash BIOS.

① Processor heat sink

② Slot for the bus board

③ Two memory module slots

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8.5 Hardware descriptions

8.5.1.2 Position of the interfaces on the motherboard

Interfaces
The motherboard of the device features the following interfaces:
● Interfaces for the connection of external devices
● Interfaces for internal components (drives, bus boards etc.)

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8.5 Hardware descriptions

8.5.1.3 Internal interfaces

Pin assignment of the internal interfaces

Interface Posi- Connector Description

tion
Memory Inter- X19, X20 2 DIMM sockets, 64-bit
nal
Bus expansion Inter- X508, X610 Socket for bus expansion, assigned PCI bus sig-
nal nals
Power supply Inter- X800 20-pin connector plug for power supply
nal
BIOS Recovery Inter- X593 Jumper:
nal
• Jumper on pins 2-3: default
• Replug to pins 3-4 for BIOS Recovery *
• Replug to pins 1-2 for ME Update *
* USB memory stick required

Serial ATA Inter- X522, X523, X524, Serial ATA, max. 3 drives operable
nal X525
Connection for Inter- X516, X517, X518, Voltage supply for serial ATA
PS serial ATA nal X519, X520, X521
Connection for Inter- X515 Voltage supply for CPU fan, 4-pin male connector
PS fan nal
Connection for Inter- X512 Voltage supply for equipment fan, 4-pin male
equipment fan nal connector
Backup battery Inter- X40, X41 Voltage supply for backup battery, 2-pin male
nal connector
USB port Inter- X535 USB channel 6 and 7, 10-pole male connector
nal On expansion card (optional) guided (see section
"Operator controls and interfaces")
USB port Inter- X562 USB channel 9, upright USB socket
nal
Spare HDD Inter- X803 LED display
nal

Pin assignment of the device fan supply, X512

Pin no. Short description Meaning Input/Output

1 GND Ground -
2 +12 V Switched voltage supply Output
3 CPU FAN_CLK Clock signal Input
4 PWM PWM signal Output

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8.5 Hardware descriptions

Pin assignment of the supply for the power supply fan, X515

Pin no. Short description Meaning Input/Output

1 GND Ground -
2 +12 V Switched voltage supply Output
3 PG1 FAN_CLK Clock signal Input
4 PWM PWM signal Output

Pin assignment of serial ATA voltage supply, X516 - X521

Pin no. Short description Meaning Input/Output

1 +12 V Voltage +12 V Output
2 GND Ground -
3 GND Ground -
4 +5 V Voltage +5 V Output
5 +3.3 V Voltage +3.3 V Output

Connector for backup battery, X40, X41

A battery for buffering the CMOS RAM is connected to this connector. This is a 3 V Lithium
battery with a capacity of 750 mAh.

Pin no. Short description Meaning Input/Output

1 + Plus pole Input
2 - Minus pole -

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8.5 Hardware descriptions

8.5.1.4 Front ports

Overview

Interface Position Connect- Description

or
Display Internal X570 Connection of LC displays
I/O front Internal X571 Interface for I/O front
USB 2.0 Internal X561 Internal USB 2.0 interface (USB channel 6)
USB 3.0 Internal X560 Internal USB 3.0 interface (USB channel 3)

See also
Industry Automation and Drive Technologies - Homepage
(http://www.siemens.com/automation/service&support)

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8.5 Hardware descriptions

8.5.2 Bus board

8.5.2.1 Layout and principle of operation

The bus board is designed as a link between the motherboard and the expansion cards. It is
secured with five screws.
The following bus board models are available:
Variant 1 has two PCI slots. It can host expansion modules conforming to PCI specification
(Rev. 2.2) for 5 V and 3.3 V modules. All PCI slots are master compatible. The expansion
modules are supplied with power via the bus board to motherboard connection.

① Slot 1 PCI (TIA Portal: X100)

② Slot 2 PCI (TIA Portal: X101)

③ 12 V power supply connection

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8.5 Hardware descriptions

Variant 2 has one PCI and one PCIe slot.

① Slot 1 PCI (TIA Portal: X100)

② Slot 2 PCI Express x16 (TIA Portal: X101)

③ 12 V power supply connection

Variant 3 has two PCIe slots.

① Slot 1 PCI Express x4, mechanical x16 (TIA Portal: X100)

② Slot 2 PCI Express x16 (TIA Portal: X101)

③ 12 V power supply connection

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8.5 Hardware descriptions

8.5.2.2 PCI slot pin assignment

5V System Environment
Side B Side A
1 -12V TRST#
2 TCK +12V
3 Ground TMS
4 TDO TDI
5 +5V +5V
6 +5V INTA#
7 INTB# INTC#
8 INTD# +5V
9 PRSNT1# Reserved
10 Reserved +5 V (I/O)
11 PRSNT2# Reserved
12 Ground Ground
13 Ground Ground
14 Reserved Reserved
15 Ground RST#
16 CLK +5 V (I/O)
17 Ground GNT#
18 REQ# Ground
19 +5 V (I/O) Reserved
20 AD[31] AD[30]
21 AD[29] +3.3V
22 Ground AD[28]
23 AD[27] AD[26]
24 AD[25] Ground
25 +3.3V AD[24]
26 C/BE[3]# IDSEL
27 AD[23] +3.3V
28 Ground AD[22]
29 AD[21] AD[20]
30 AD[19] Ground
31 +3.3V AD[18]
32 AD[17] AD[16]
33 C/BE[2]# +3.3V
34 Ground FRAME#
35 IRDY# Ground
36 +3.3V TRDY#
37 DEVSEL# Ground
38 Ground STOP#
39 LOCK# +3.3V

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8.5 Hardware descriptions

5V System Environment
Side B Side A
40 PERR# SDONE
41 +3.3V SBO#
42 SERR# Ground
43 +3.3V PAR
44 C/BE[1]# AD[15]
45 AD[14] +3.3V
46 Ground AD[13]
47 AD[12] AD[11]
48 AD[10] Ground
49 Ground AD[09]
50 CONNECTOR KEY
51 CONNECTOR KEY
52 AD[08] C/BE[0]#
53 AD[07] +3.3V
54 +3.3V AD[06]
55 AD[05] AD[04]
56 AD[03] Ground
57 Ground AD[02]
58 AD[01] AD[00]
59 +5 V (I/O) +5 V (I/O)
60 ACK64# REQ64#
61 +5V +5V
62 +5V +5V

8.5.2.3 Pin assignment 12 V power supply connection for expansion cards

Pin Short description Meaning Input/Output

1 +12 V 1 12 V voltage Output
2 GND Ground -
3 GND Ground -
4 +5 V 1 5 V voltage Output
1 max. permitted current: 1 A; with this power demand the total power demand for the PCI

slots are not allowed to be exceeded.

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8.5 Hardware descriptions

8.5.2.4 PCI Express slot x16 pin assignment

Signal Pin no. Pin no. Signal

P12V B1 A1 P12V
P12V B2 A2 P12V
P12V B3 A3 P12V
GND B4 A4 GND
SMB_CLK2 B5 A5 n.c.
SMB_DATA2 B6 A6 n.c.
GND B7 A7 n.c.
P3V3 B8 A8 n.c.
n.c. B9 A9 P3V3
AUX_3V B10 A10 P3V3
WAKE2 B11 A11 PCIE_RESET_L
n.c. B12 A12 GND
GND B13 A13 PCIE0_ECLK
PCIEX16_TX_P(15) B14 A14 PCIE0_ECLK_N
PCIEX16_TX_N(15) B15 A15 GND
GND B16 A16 PCIEX16_RX_P(15)
SDVO_CTRLCLK B17 A17 PCIEX16_RX_N(15)
GND B18 A18 GND
PCIEX16_TX_P(14) B19 A19 n.c.
PCIEX16_TX_N(14) B20 A20 GND
GND B21 O21 PCIEX16_RX_P(14)
GND B22 A22 PCIEX16_RX_N(14)
PCIEX16_TX_P(13) B23 A23 GND
PCIEX16_TX_N(13) B24 A24 GND
GND B25 A25 PCIEX16_RX_P(13)
GND B26 A26 PCIEX16_RX_N(13)
PCIEX16_TX_P(12) B27 A27 GND
PCIEX16_TX_N(12) B28 A28 GND
GND B29 A29 PCIEX16_RX_P(12)
n.c. B30 A30 PCIEX16_RX_N(12)
SDVO_CTRLDATA B31 A31 GND
GND B32 A32 n.c.
PCIEX16_TX_P(11) B33 A33 n.c.
PCIEX16_TX_N(11) B34 A34 GND
GND B35 A35 PCIEX16_RX_P(11)
GND B36 A36 PCIEX16_RX_N(11)
PCIEX16_TX_P(10) B37 A37 GND
PCIEX16_TX_N(10) B38 A38 GND
GND B39 A39 PCIEX16_RX_P(10)
GND B40 A40 PCIEX16_RX_N(10)
PCIEX16_TX_P(9) B41 A41 GND
PCIEX16_TX_N(9) B42 A42 GND
GND B43 A43 PCIEX16_RX_P(9)

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8.5 Hardware descriptions

Signal Pin no. Pin no. Signal

GND B44 A44 PCIEX16_RX_N(9)
PCIEX16_TX_P(8) B45 A45 GND
PCIEX16_TX_N(8) B46 A46 GND
GND B47 A47 PCIEX16_RX_P(8)
MCH_CFG_20 B48 A48 PCIEX16_RX_N(8)
GND B49 A49 GND
PCIEX16_TX_P(7) B50 A50 n.c.
PCIEX16_TX_N(7) B51 A51 GND
GND B52 A52 PCIEX16_RX_P(7)
GND B53 A53 PCIEX16_RX_N(7)
PCIEX16_TX_P(6) B54 A54 GND
PCIEX16_TX_N(6) B55 A55 GND
GND B56 A56 PCIEX16_RX_P(6)
GND B57 A57 PCIEX16_RX_N(6)
PCIEX16_TX_P(5) B58 A58 GND
PCIEX16_TX_N(5) B59 A59 GND
GND B60 A60 PCIEX16_RX_P(5)
GND B61 A61 PCIEX16_RX_N(5)
PCIEX16_TX_P(4) B62 A62 GND
PCIEX16_TX_N(4) B63 A63 GND
GND B64 A64 PCIEX16_RX_P(4)
GND B65 A65 PCIEX16_RX_N(4)
PCIEX16_TX_P(3) B66 A66 GND
PCIEX16_TX_N(3) B67 A67 GND
GND B68 A68 PCIEX16_RX_P(3)
GND B69 A69 PCIEX16_RX_N(3)
PCIEX16_TX_P(2) B70 A70 GND
PCIEX16_TX_N(2) B71 A71 GND
GND B72 A72 PCIEX16_RX_P(2)
GND B73 A73 PCIEX16_RX_N(2)
PCIEX16_TX_P(1) B74 A74 GND
PCIEX16_TX_N(1) B75 A75 GND
GND B76 A76 PCIEX16_RX_P(1)
GND B77 A77 PCIEX16_RX_N(1)
PCIEX16_TX_P(0) B78 A78 GND
PCIEX16_TX_N(0) B79 A79 GND
GND B80 A80 PCIEX16_RX_P(0)
n.c. B81 A81 PCIEX16_RX_N(0)
n.c. B82 A82 GND

Note
This slot can also be used for PCIe x8, x4 and x1 modules.

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8.5.3 External ports

8.5.3.1 COM1/COM2

Serial port COM1, 9-pin (plug) or COM2

Pin no. Short description Meaning Input / output

1 DCD Data carrier detect Input
2 RxD Received data Input
3 TxD Transmit data Output
4 DTR Data terminal ready Output
5 GND Ground -
6 DSR Ready for operation Input
7 RTS Request to send Output
8 CTS Clear to send Input
9 RI Incoming call Input

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8.5.3.2 DisplayPort

DisplayPort port

Pin no. Short description Meaning Input / output

1 ML_Lane0+ DP data 0+ Output
2 GND Ground -
3 ML_Lane0- DP data 0- Output
4 ML_Lane1+ DP data 1+ Output
5 GND Ground -
6 ML_Lane1- DP data 1- Output
7 ML_Lane2+ DP data 2+ Output
8 GND Ground -
9 ML_Lane2- DP data 2- Output
10 ML_Lane3+ DP data 3+ Output
11 GND Ground -
12 ML_Lane3- DP data 3- Output
13 CONFIG1 CAD Cable Adapter Detect Input
14 CONFIG2 Ground (PullDown) -
15 AUX_CH+ Auxiliary channel+ Bidirectional
16 GND Ground -
17 AUX_CH- Auxiliary channel- Bidirectional
18 HPD Hot Plug Detect Input
19 GND Ground -
20 DP_PWR +3.3V (fused) Output

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8.5.3.3 DVI-I

DVI-I port (standard socket)

Pin no. Short description Meaning Input / output

1 TMDS Data2- DVI data channel Output
2 TMDS Data2+ DVI data channel Output
3 TMDS Data2/4 shield Cable shield
4 NC
5 NC
6 DDC clock (SCL) Display Data Channel – Clock Input / output
7 DDC data (SDA) Display Data Channel – Data Input / output
8 Analog vertical sync Analog Vertical Sync Signal Output
(VSYNC)
9 TMDS Data1- DVI data channel Output
10 TMDS Data1+ DVI data channel Output
11 TMDS Data1/3 shield Cable shield
12 NC
13 NC
14 +5V power (VCC) +5V power for DCC Output
15 Ground (return for +5V, Analog ground
Hsync and Vsync) (GND)
16 Hot Plug Detect
17 TMDS data 0- DVI data channel Output
18 TMDS data 0+ DVI data channel Output
19 TMDS Data0/5 shield Cable shield
20 NC
21 NC
22 TMDS clock shield Cable shield
23 TMDS clock+ DVI clock channel Output
24 TMDS clock- DVI clock channel Output
C1 Analog red (R) Analog Red Signal Output
C2 Analog green (G) Analog Green Signal Output
C3 Analog blue (B) Analog Blue Signal Output
C4 Analog horizontal sync Analog Horizontal Sync Signal Output
(HSYNC)
C5 Analog ground (analog R, Analog ground
G, & return) (GND)

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8.5.3.4 Ethernet

Ethernet RJ45 interface

Pin no. Short description Meaning Input / output

1 BI_DA+ Bi-directional data A+ Input/output
2 BI_DA- Bi-directional data A- Input/output
3 BI_DB+ Bi-directional data B+ Input/output
4 BI_DC+ Bi-directional data C+ Input/output
5 BI_DC- Bi-directional data C- Input/output
6 BI_DB- Bi-directional data B- Input/output
7 BI_DD+ Bi-directional data D+ Input/output
8 BI_DD- Bi-directional data D- Input/output
S Shield –
LED 1 Off: 10 Mbps –
Green light: 100 Mbps
Orange light: 1000 Mbps
LED 2 Lit: Active connection, e.g., to a hub –
Flashing: Activity

8.5.3.5 USB 3.0

USB 3.0 port

Pin no. Short description Meaning Input / output

1 VBUS + 5 V (fused) Output
2 D- Data line Input / output
3 D+ Data line Input / output
4 GND Ground –
5 RX- Data line Input
6 RX+ Data line Input
7 GND Ground –
8 TX- Data line Output
9 TX+ Data line Output

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8.5.3.6 PROFIBUS

PROFIBUS interface, 9-pin (socket)

Pin no. Short description Meaning

1-2 NC Not connected
3 LTG_B Data line (I/O)
4 RTS_AS Turn on PLC transmitter (O)
5 GND Ground isolated
6 P5V_dp_fused +5 V / max. 90 mA (fused) electrically isolated
7 NC Not connected
8 LTG_A Data line (I/O)
9 RTS_PG PG Request to send (O)

8.5.3.7 PROFINET

PROFINET LAN X3 Port P1, P2, P3

PROFINET interface

Pin no. Short description Meaning Input / output

1 RD+ Receive data 2 Input
2 RD- Receive data 2 Input
3 TD+ Send data 2 Output
4, 5 1 SYMR Internal 75 Ohm terminating resistor _
6 TD- Receive data 2 Output
7, 8 1 SYMT- Internal 75 Ohm terminating resistor _
S Shield
LED 1 Lights up green: link
LED 2 Lights up yellow: Activity
1 Optional product variant
2 Auto Negotiation and auto crossover are supported

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8.5.4 System resources

8.5.4.1 Currently allocated system resources

All system resources (hardware addresses, memory allocation, interrupt assignment, DMA
channels) are assigned dynamically by the BIOS or the Windows operating system,
depending on the hardware equipment, drivers, installed expansion cards and connected
external devices. Assignment is automatic and depends on the demanded resources of the
connected devices and the inserted modules. Due to this configuration dependency, clear
statements can only be made by determining them in relation to the system in the final
configuration.

Procedure
Resources may be viewed as follows under Windows:
1. Press the "Windows key" and "R" simultaneously.
The "Run" dialog box opens.
2. Enter "msinfo32" in the "Open" field.
3. Click "OK" to confirm.

8.5.4.2 System resources used by the BIOS/DOS

The following table describes the system resources for the factory state of the device.

I/O address allocation

The following tables describe the system resources in the factory state of the device.

Static area

I/O address Size Description of the basic function Alternative function

(hex) [byte]
From To
0000 001F 32 DMA controller
0020 0021 2 Programmable interrupt controller
0022 0023 2 <Not used>
0024 0025 2 Programmable interrupt controller
0026 0027 2 <Not used>
0028 0029 2 Programmable interrupt controller
002A 002B 2 <Not used>
002C 002D 2 Programmable interrupt controller
002E 002F 2 Motherboard resources
0030 0031 2 Programmable interrupt controller
0032 0033 2 <Not used>

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I/O address Size Description of the basic function Alternative function

(hex) [byte]
From To
0034 0035 2 Programmable interrupt controller
0036 0037 2 <Not used>
0038 0039 2 Programmable interrupt controller
003A 003B 2 <Not used>
003C 003D 2 Programmable interrupt controller
003E 003F 2 <Not used>
0040 0043 4 System timer
0044 004D 10 <Not used>
004E 004F 2 Motherboard resources
0050 0053 4 System timer
0054 005F 12 <Not used>
0060 0060 1 Keyboard controller
0061 0061 1 Motherboard resources
0062 0062 1 <Not used>
0063 0063 1 Motherboard resources
0064 0064 1 Keyboard controller
0065 0065 1 Motherboard resources
0066 0066 1 <Not used>
0067 0067 1 Motherboard resources
0068 006F 8 <Not used>
0070 0070 1 Motherboard resources Cascaded
0070 0077 8 System CMOS/real-time clock
0078 007F 8 <Not used>
0080 0080 1 Motherboard resources
0081 0091 17 DMA controller
0092 0092 1 Motherboard resources
0093 009F 13 DMA controller
00A0 00A1 2 Programmable interrupt controller
00A2 00A3 2 <Not used>
00A4 00A5 2 Programmable interrupt controller
00A6 00A7 2 <Not used>
00A8 00A9 2 Programmable interrupt controller
00AA 00AB 2 <Not used>
00AC 00AD 2 Programmable interrupt controller
00AE 00AF 2 <Not used>
00B0 00B1 2 Programmable interrupt controller
00B2 00B3 2 Motherboard resources
00B4 00B5 2 Programmable interrupt controller
00B6 00B7 2 <Not used>
00B8 00B9 2 Programmable interrupt controller

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I/O address Size Description of the basic function Alternative function

(hex) [byte]
From To
00BA 00BB 2 <Not used>
00BC 00BD 2 Programmable interrupt controller
00BE 00BF 2 <Not used>
00C0 00DF 32 DMA controller
00E0 00EF 16 <Not used>
00F0 00F0 1 Numeric data processor
00F1 0277 391 <Not used>
0278 027F 8 <Reserved> Reserved for LPT1
0280 02E7 104 <Not used>
02E8 02EF 8 <Reserved> Reserved for COM1 or COM2
02F0 02F7 8 <Not used>
02F8 02FF 8 COM2 Can be deactivated in setup, then
free
Reserved for COM1 or COM2
0300 0377 120 <Not used>
0378 037F 8 LPT1 Can be deactivated in setup, then
free
Reserved for LPT1
0380 03AF 48 <Not used>
03B0 03BB 12 Graphics
03BC 03BF 4 <Reserved>
03C0 03DF 32 Graphics
03E0 03E7 8 <Not used>
03E8 03EF 8 <Reserved> Reserved for COM1 or COM2
03F0 03F7 8 <Not used>
03F8 03FF 8 COM1 Can be deactivated in setup, then
free
Reserved for COM1 or COM2

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Dynamic range – resources are managed by means of Plug and Play functionality

I/O address Size Description of the basic function Alternative function

(hex) [byte]
From To
0400 0453 84 Motherboard resources
04D0 04D1 2 Programmable interrupt controller
0680 069F 32 Motherboard resources
0800 087F 128 Motherboard resources
164E 164F 2 Motherboard resources
1800 18FE 255 Motherboard resources
1854 1857 4 Motherboard resources Cascaded
2004 2007 4 Motherboard resources
FFFF FFFF 1 Motherboard resources

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Interrupt Assignments
The functions are assigned different interrupts, depending on the operating system. A
distinction is made between the PIC and APIC modes.
Interrupt assignment in PIC mode

Y Interrupt in APIC mode

Z BIOS Default Interrupt in PIC mode, e.g., DOS
1 Host PCI-IRQ A to H is assigned to IRQ 16 to 23 permanently in APIC mode. Host PCI-IRQ A to H
will be automatically assigned IRQ 0 to 15 by BIOS in PIC mode. A specific assignment can not
be enforced.

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Interrupt assignment of the slot connectors on the bus board

1 Host PCI-IRQ A to H will be assigned IRQ 16 to 23 permanently in ACPI mode. Host PCI-IRQ A to H will be automati-
cally assigned IRQ 0 to 15 in PIC mode. A specific assignment can not be enforced.
Y Interrupt in APIC mode
Z BIOS Default Interrupt in PIC mode (e.g. DOS)

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Exclusive PCI hardware interrupt

Applications demanding a high-performance interrupt require a high-speed hardware
interrupt reaction. The PCI hardware interrupt should be used only by one resource in order
to ensure high-speed reaction of the hardware.

Exclusive interrupt in APIC mode

IRQ assignments for Windows systems, (APIC mode)

Ethernet 1 16 1, 2
Ethernet 2 17 1
Profibus/MPI 19 1
PCI slot 1 20 1
PCI slot 2 21 1
PCI Express slot 16 1, 3
1) Requirement: The modules in the PCI slots each require only one interrupt
2) Requirement: VGA and PCIexpress do not require an interrupt
3) Requirement: VGA does not require an interrupt and Ethernet1 is disabled

Exclusive interrupt in PIC mode

The interrupts are automatically assigned to the slots at system startup due to the default
settings in system BIOS.
Several slots may share the same interrupt, depending on the system configuration. This
functionality is known as interrupt sharing. Exclusive interrupts are not available in PIC
mode. Disable specific system resources in order to obtain exclusive interrupts. BIOS
assigns the PIC interrupts at random during restart of the system.

Memory address assignments

PCI VGA modules can be operated with expansion ROM up to 48 K.

Address Size Description of the basic function Alternative function

From To
0000 0000 0007 FFFF 512 K Conventional system memory
0008 0000 0009 F7FF 126 K Conventional system memory
extended
0009 F800 0009 FFFF 2K XBDA, extended Bios Data
Area
000A 0000 000A FFFF 64 K VGA graphics refresh memory Shared SMM for power
management
000B 0000 000B 7FFF 32 K Software graphics / text refresh Not used
memory
000B 8000 000B FFFF 32 K VGA graphics/text refresh
memory
000C 0000 000C BFFF 48 K VGA BIOS expansion
000C 0000 000C FFFF 64 K VGA BIOS Always allocated or
reserved

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Address Size Description of the basic function Alternative function

From To
000E 0000 000F FFFF 2 × 64K DMI data, System BIOS, Op-
tions ROMs: PXE, RAID
0010 0000 CFFF FFFF 3.2 GB System memory 4 GB memory Depends on memory
configuration configuration
EFFF F000 EFFF FFFF 4K Motherboard resources
F000 0000 F3FF FFFF 64 M Motherboard resources
FED0 0000 FED0 03FF 1K High Precision Event Timer
FED1 0000 FED1 7FFF 32 K Motherboard resources
FED1 8000 FED1 8FFF 4K Motherboard resources
FED1 9000 FED1 9FFF 4K Motherboard resources
FED1 C000 FED1 FFFF 16 K Motherboard resources
FED2 0000 FED3 FFFF 128 K Motherboard resources
FED4 0000 FED4 4FFF 20 K Trusted Platform Module 1.2
FED9 0000 FED9 3FFF 16 K Motherboard resources
FEE0 0000 FEEF FFFF 1M Motherboard resources
FF00 0000 FFFF FFFF 16 M Motherboard resources Intel® 82802 firmware
hub

8.5.5 Assignment of expansion interfaces to the software in the TIA Portal (CP
assignment)
The table below shows the correlation between enclosure labeling of the IPC expansion slots
and the labeling that is used during assignment of interfaces to the software in TIA Portal.

Enclosure labeling IPC677D TIA Portal

1 X100
2 X101

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8.5.6 CP 1616 onboard communications processor

8.5.6.1 Properties
CP 1616 on-board allows you to connect IPCs to Industrial Ethernet.
The basic characteristics of the PCS 1616 onboard are:
● Optimized for PROFINET IO
● Enhanced Real Time Ethernet Controller 400 = ERTEC 400
● The connectors are designed for 10BaseT and 100BaseTX.
● Data transfer rates of 10 and 100 Mbps in full/half duplex mode are supported.
● The handshake is performed automatically (auto negotiation).
● Autocrossing
● Automatic hardware detection
● Integrated 3-port real-time switch

3-port real-time switch

The switch function of the 3-port real-time switch is maintained in the following cases:
● Restart (Windows Restart)
● Reset (using the shortcut <Ctrl-Alt-Del)
The switch function can be activated permanently in the BIOS setup, "Power" menu with the
"PROFINET always On" parameter. When switched off (Disabled), the switch function is
interrupted in the following cases:
● Shutting down with Windows command
● Activating the on/off switch
● Shutting down with power switch (on/off switch).

Three RJ45 connectors

Terminal devices or other network components can be connected to the three RJ45 sockets
that lead to the integrated real-time switch. The CP 1616 is connected to the LAN (Local
Area Network) via one of the three RJ45 sockets of the device.

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8.5.6.2 Typical Communication Partners

CP 1616 onboard as an IO controller

The following diagram shows a typical application: CP 1616 onboard as PROFINET IO
controller on the IO controller layer.
The IO base controller user program runs on the PC. This program accesses the functions of
the IO base user program interface.
Data traffic is routed via the communication processor to several SIMATIC S7 PROFINET IO
devices, ET 200S over Industrial Ethernet.

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CP 1616 onboard as IO device

The following diagram shows a typical application: Two PCs each with a CP as a PROFINET
IO device on the IO device layer.
A PC with a CP as PROFINET IO controller, a SIMATIC S7-400 with a CP 443-1 as
PROFINET IO controller and two SIMATIC S7 ET 200S PROFINET IO devices are also
connected in the network.
The IO base device user program runs on the IO device PC. This program accesses the
functions of the IO base user program interface. Data traffic is routed via the CP 1616
onboard communication processor to a PC as PROFINET IO controller, or to an S7-400
automation system with CP 443-1 over Industrial Ethernet.

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8.5.6.3 Firmware Loader

Firmware loader

When to load firmware

The CP 1616 onboard is supplied with the latest version of the firmware. If new functions
become available due to product development, you can make them available by performing
a firmware download.

Description
This section will familiarize you with the application area and use of the firmware loader. You
can find additional, detailed information about the individual loader variants in the integrated
help of the program.

Firmware
This refers to the system program in the SIMATIC NET modules.

Application area for the firmware loader

The firmware loader enables you to reload new firmware releases to SIMATIC NET modules.
It is used for:
● PROFIBUS modules
● Industrial Ethernet modules
● Modules for gateways, for example, IE/PB link

Installation
The firmware loader is available on your PG/PC under Windows following the installation of
STEP 7/NCM PC.

Loader files
The firmware loader supports the following file types:
● <file>.FWL
A file form that contains further information, which is displayed by the firmware loader.
The firmware loader can use this information to check if the firmware is compatible to the
device.
Read the information provided along with the loader file, for example, in the readme file. This
information is also displayed in the firmware loader when the FWL file is loaded.

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Loading firmware
Start downloading procedure
1. In the Windows Start menu, select the menu command SIMATIC > STEP 7 > NCM S7 >
Firmware Loader.

2. Click "Next" and follow the instructions in the dialog fields that follow. A help function is
integrated in the software as support.

Note
Ensure that the loader file you are using for the update is suitable for the version of
firmware on your module. If you have any doubts, contact your local Siemens consultant.

Note
Be aware that aborting the loading process may result in an inconsistent state in your
module.

You can find additional, detailed information about the individual loader variants in the
integrated help.
Note
When loading the firmware or commissioning the module, be aware that the CP 1616
onboard takes five MAC addresses (always in direct sequence). The first two addresses are
displayed in the BIOS, in the "Peripheral Configuration" submenu of the "Advanced" menu.

Example
The lower MAC address at "Profinet" is provided for Layer 2 communication, while the
second one is used for Ethernet/PROFINET communication.

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8.5.6.4 Further actions in STEP 7/NCM PC

Configuring
Your PC is now ready, although you still have to configure the SIMATIC NET communication
software. The rest of the procedure is described in the "Commissioning PC Stations" manual
(on the Windows PC that also contains STEP 7/NCM PC: Start > Simatic > Documentation >
English > Commissioning PC Stations).

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8.6 BIOS description

8.6.1 Overview

BIOS Setup program

The BIOS Setup program, or BIOS Setup for short, is located, together with the setup
parameters, in a FLASH block on the motherboard.
You change the setup parameters of the device in the BIOS Setup. Examples: System time,
hard disks or boot order.

Changing the device configuration

Your device configuration is preset for operating with the included software. You should only
change the default setup parameters if you have made technical changes to your device, or
if a fault occurs when the device is switched on.

NOTICE
Malfunctions can occur with running software CPU
If a BIOS update of the PC is performed while SIMATIC software controller, a SIMATIC
WinAC for example, is running, the software CPU can malfunction, resulting in
communication interruptions or failures, for example. Other actions that put a heavy load on
the PC hardware, for example, running hardware tests such as benchmarks, can result in
malfunctions of the software CPU.
Do not run a BIOS update or other actions that would put a heavy load on the hardware
during operation of a software CPU.
Switch the software CPU to "STOP" before you run a BIOS update or perform other critical
actions.

Note
Documentation
BIOS Setup is described for all devices and device configurations. Some BIOS submenus or
Setup parameters may not be included, depending on your order. The interface of your BIOS
Setup can deviate from the figures in this document.
You can find a detailed description of the BIOS on the Support website under Entry ID
92189185 (http://support.automation.siemens.com/WW/view/en/92189185).

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8.6.2 Opening the BIOS selection menu

Procedure
1. Reset the device (warm or cold restart).
Depending on the device version, the default settings can differ from the figures shown.
The following message appears briefly on the display at the end of the self-test:
Press ESC for boot options

2. Press <ESC> to open the BIOS selection menu:

The following keys are available in the BIOS selection menu:

Buttons Function
Continue Exit selection menu, continue start sequence
Boot Manager Specify the boot media from which to boot:
• Hard disk drive
• CD-ROM drive
• USB drive
Device Management Start device manager for UEFI boot media
Boot From File Boot Maintenance Manager:
• Boot Options: Set boot order
• Driver Options: Configure drivers
• Console Options: Configure connected input device
• Boot from File: Start from an ".EFI" file
• Reset System: Restore factory settings
Secure Boot Option 1 Configuration settings to start the device in Secure Boot mode. The only
software modules loaded are those that are known to be safe for the
BIOS or the operating system.

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Buttons Function
SCU Start BIOS Setup via Setup Configuration Utility
BIOS Update Update BIOS from USB memory stick
MEBx Start Intel Management Engine BIOS Extension from Active Manage-
ment Technology Support (AMT)
1 Available as of Windows 8 or later

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8.6.3 Configuration
The individual setup parameters are distributed between different menus and submenus.
The menus always have the same layout.

Menu layout
The following figure is an example for the main menu. Device-specific information is shown
as blurred.

① Header ④ Help area

② Menu bar ⑤ Key assignment
③ Settings, submenus and device-specific
information
A menu is divided into four areas:
● In the menu bar ② on top, you select from the different menus "Main", "Advanced", etc.
● The center left area ③ includes information on your device and you can edit settings that
are partly available in submenus.
● The center right area ④ displays short help texts for the currently selected setup
parameters.
● The key assignment ⑤ at the bottom shows the function keys and control keys available
in BIOS Setup.
You can toggle between the menus with the "←" left and "→" right cursor keys.

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The following table shows the standard menus. Not all menus are included in each supplied
device configuration.

Menu Meaning
Main Display system information, for example, BIOS version, processor and memory
Advanced Configure hardware using different submenus
Security Security functions, e.g., setting a password
Power Specify CPU settings and switch-on functions.
Boot Determine boot options, e.g., boot order
Exit Save and exit (see Exit menu)

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8.6.4 Exit menu

You always exit BIOS Setup in this menu.

Exit Saving Changes All changes are saved and the system is restarted with the new Setup
parameters.
Save Change Without All changes are saved
Exit
Exit Discarding Changes All changes are discarded and the system is restarted with the old Setup
parameters.
Load Optimal Defaults All setup parameters are reset to the safe default values.
Notice: The existing Setup parameters are overwritten by this.
Load Custom Defaults The profile must be loaded with the custom Setup parameters.
Requirement: The parameters are saved prior to this with "Save Custom
Defaults".
Save Custom Defaults The currently configured Setup parameters are saved as a custom profile
(see also "Load Custom Defaults").
Discard Changes All changes are discarded.

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8.6.5 General BIOS Setup settings

If you have changed any default settings in Setup, you can enter them in the following table.
You can then refer to these entries for any future hardware modifications.

Note
Print out the table below and keep the pages in a safe place once you made your entries.
The default setup settings vary depending on the ordered device configuration.

BIOS Setup settings

Main

System parameters Default settings Local settings

System Time 00:00:00
System Date MM/DD/YYYY

Advanced > Boot Configuration

System parameters Default settings Local settings

Numlock On
POST errors All without keyboard

Advanced > Peripheral Configuration

System parameters Default settings Local settings

Internal COM 1 1 Auto
Base I/O address 1 2 3F8
Interrupt 12 IRQ4
Internal COM 2 1 Auto
Base I/O address 12 2F8
Interrupt 1 2 IRQ3
Internal LPT 1 Auto
Base I/O address 13 378
Interrupt 1 3 IRQ7
Mode 13 Bi-directional
DMA Channel 13 DMA 1
Onboard PROFINET 1 Enabled
PCI – MPI / DP 1 Enabled
Audio 4 Auto

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System parameters Default settings Local settings

Onboard Ethernet 1 (LAN 1, X1 P1) Enabled
Onboard Ethernet 2 (LAN 2, X2 P1) Enabled
1 Visible depending on the ordered device configuration
2 Only visible if the corresponding parameter "Internal COM #" is enabled.
3 Only visible if "Internal LPT" is enabled.
4 Only available if an Azalia HD audio controller is installed.

Advanced > SATA Configuration

System parameters Default settings Local settings

SATA Controller Enabled
HDC Configure As AHCI

Advanced > Fan Control Configuration

System parameters Default settings Local settings

Fan Control Mode Standard

Advanced > Video Configuration

System parameters Default settings Local settings

Primary Display Auto
IGD - Aperture Size 128 MB
IGD - DVMT Size MAX
IGD boot type VBIOS default
IGD boot type 2 Disabled
PEG0 - Gen X Auto
PEG1 - Gen X Auto
PEG2 - Gen X Auto

Advanced > USB Configuration

System parameters Default settings Local settings

USB Precondition Enabled
XHCI Auto
Per-Port Control Disabled
The following parameters are only visible if "Per-Port Control" is enabled (Enabled).
USB Port 0 (X61) Enabled
USB Port 1 (X60) Enabled
USB Port 2 (USB3 P2, internal) Enabled
USB Port 3 (USB3 P3, front) Enabled
USB Port 4 (X63) Enabled
USB Port 5 (X62) Enabled

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8.6 BIOS description

System parameters Default settings Local settings

USB Port 6 (USB2 P6, front) 1 Enabled
USB Port 6 (USB2 P6, touch) 2 Enabled
USB Port 8 (USB2 P8, internal) Enabled
USB Port 9 (USB2 P9, internal) Enabled
USB Port 10 (USB2 P10, internal) 1 Enabled
USB Port 11 (USB2 P11, internal) 1 Enabled
1 Only with rack devices
2 Only with box devices

Advanced > Chipset Configuration

System parameters Default settings Local settings

VT-d Auto
After G3 On Last State
DeepSx Power Policies 1 Disabled
Max TOLUD Dynamic
HPET Support Enabled
1 Only with rack devices

Advanced > Active Management Technology Support

System parameters Default settings Local settings

Intel AMT Support Enabled
Hide Un-Configure ME Confirmation Disabled
Un-Configure ME Disabled
Intel AMT Password Write Enabled
AMT CIRA Request Trig Disabled
USB Configure Enabled
AMT CIRA Timeout 0

Advanced > PCI Express Configuration

System parameters Default settings Local settings

PCI Express Root Port 5 Enabled
PCIe Speed 2 Auto
PCI Express Root Port 61 Enabled
PCIe Speed 1 2 Auto
PCI Express Root Port 7 1 Enabled
PCIe Speed 1 2 Auto

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8.6 BIOS description

System parameters Default settings Local settings

PCI Express Root Port 8 1 Enabled
PCIe Speed 1 2 Auto
1 Visible depending on the ordered device configuration
2 Only visible if the associated parameter "PCI Express Root Port #" is enabled.

Security

System parameters Default settings Local settings

TPM Status 1 Depending on configura-
tion
TPM Operation 1 No Operation
TPM Force Clear 1 Disabled
Set Supervisor Password
Set User Password
Power-on Password Disabled
User Access Level Full
1 Visible depending on the ordered device configuration

Power

System parameters Default settings Local settings

Wake on PME or LAN 2 (X2 P1) Disabled
Auto Wake on S5 Disabled
Wake on S5 Time 1 00:00:00
Day of Month 1 1
Wake on LAN 1 (X1 P1) Enabled
PROFINET always On 2 Disabled
PROFINET Wake Capability 2 3 Disabled
USB Ports 0/1 (X61/X60) powered Enabled
USB Ports 0/1 (X61/X60) Wake Capa- Disabled
bility 4
USB Ports 4/5 (X63/X62) powered Enabled
USB Ports 4/5 (X63/X62) Wake Capa- Disabled
bility 4
USB Ports 3/6/8/9 powered Enabled
USB Port 3/6/8/9 Wake Capability 4 Disabled
1 Only visible if the "Auto Wake on S5" is set accordingly.
2 Visible depending on the ordered device configuration
3 Only visible if the parameter "PROFINET always On" is enabled.
4 Only visible if the associated parameter "USB Ports # powered" is enabled.

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Technical information
8.6 BIOS description

Power > Advanced CPU Control

System parameters Default settings Local settings

P-States (ACTUAL) Enabled
Active Processor Cores All Cores
HT Support Auto
Execute Disable Bit Enabled
Intel (VMX) Virtualization Technology Enabled
C-States Enabled
Turbo Mode Enabled

Boot

System parameters Default settings Local settings

Boot Type Dual Boot Type
Quick Boot Enabled
Quiet Boot Enabled
Network Stack Disabled
PXE Boot capability Disabled
Add Boot Options Auto
USB Boot Enabled
EFI Device First Enabled
Boot Delay Time 3

Boot > Legacy

System parameters Default settings Local settings

Normal Boot menu Standard
Boot Type Order In the order of the following
boot media:
Floppy drive Depending on configuration
Hard Disk Drive Depending on configuration
CD/DVD ROM Drive Depending on configuration
USB Depending on configuration
Others Depending on configuration

Exit

System parameters Default settings Local settings

Profile:

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8.6 BIOS description

8.6.6 BIOS update

Check regularly if updates are available for download to your device.
Additional information can be found on the Internet at the following address:After Sales
Information system (http://www.siemens.com/asis).

Noting down and restoring BIOS Setup settings

NOTICE
Irretrievable loss of data
All BIOS Setup settings are deleted after the BIOS update. This can put the system in an
undefined state. This may damage the device and the plant.
1. Print out the table in the next section "General BIOS Setup settings".
2. Enter your specific BIOS Setup setting in this table before you run a BIOS update.
3. Start BIOS Setup after the BIOS update.
4. Load the BIOS Setup default settings with <F9> "Setup Defaults". Or use the BIOS
Setup command "Load Optimal Defaults" in the "Exit" menu.
5. Make your own Setup settings based on the table you have printed out.
6. Save the BIOS Setup settings with <F10> "Save and Exit".

Performing a BIOS update

NOTICE
Damage to the device
If you switch off the device during the update, the BIOS will be incomplete and corrupt. This
may result in malfunctions.
Leave the device switched on during the update.

If you have purchased a new BIOS update for your device, follow these steps to install the
update:
1. Copy the update to a USB memory stick.
2. Reset the device (warm or cold restart).
The following message appears briefly on the display at the end of the self-test:
Press ESC for boot options

3. Press <ESC> to open the BIOS selection menu.

4. Click the "BIOS Update" button.
5. Follow the instructions on the screen.

Reboots
There may be several reboots after a BIOS update. These reboots are initiated by the
Management Engine (ME). The reboots are required by the ME to adapt itself to the changes
of the BIOS update.

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8.6 BIOS description

8.6.7 Alarm, error and system messages

During startup (the boot process), the BIOS first performs a Power On Self Test (POST) and
checks whether certain functional units of the PC are operating error-free. The boot
sequence is immediately interrupted if critical errors occur.
BIOS initializes and tests further functional units if the POST does not return any errors. In
this startup phase, the graphics controller is initialized and any error messages are output to
the screen.
The error messages output by system BIOS are listed below. For information on error
messages output by the operating system or application programs, refer to the
corresponding manuals.

On-screen error messages

On-screen error message Meaning / tip

Operating system not found Possible causes:
• No operating system installed
• Incorrect active boot partition
• Wrong boot drive settings in SETUP
Keyboard controller error Controller error.
Contact your technical support team.
SMART failure detected on HDD Hard disk reports pending failure through S.M.A.R.T.
CMOS battery failed CMOS battery is not connected.
CMOS battery weak CMOS battery is weak
Real-time clock has lost power The CMOS clock was operated without battery or with a battery
that was too weak, during battery change, for example. Check
the CMOS clock.
Keyboard error No keyboard inserted.
PLD configuration failed Programming of the PLC on the motherboard has failed.

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8.7 Active Management Technology (AMT)

8.7 Active Management Technology (AMT)

8.7.1 Introduction
Intel® Active Management Technology (Intel® AMT) is an Intel technology for the remote
maintenance of SIMATIC Industrial PCs (IPCs) with AMT technology using a management
PC. It is not necessary to install an operating system on the SIMATIC IPC with Intel® AM.
Intel® AMT provides numerous functions, e.g.:
● Keyboard Video Mouse (KVM) Redirection
KVM connections are always possible using the KVM server that is integrated in the
firmware. KVM enables access to IPCs with a corrupted or no operating system as the
KVM server is integrated in the AMT hardware. KVM enables you to reboot a remote
computer and make changes to its BIOS settings.
● Remote power management
SIMATIC IPC with Intel ® AMT can be switched on and off or restarted using another PC.
● IDE redirection
An image on the management PC can be integrated and used on the SIMATIC IPC with
Intel® AMT both as a CD/DVD drive and as a floppy drive. If the image is bootable, you
can also boot the SIMATIC IPC with Intel® AMT from it.
The following figure shows remote maintenance of SIMATIC IPCs with Intel® AMT, e.g.
for troubleshooting a corrupt operating system or incorrect BIOS settings:

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Technical information
8.7 Active Management Technology (AMT)

8.7.2 Overview of AMT

This section describes the required measures and settings on the local IPC so that the IPC
can be controlled and maintained remotely from a management station known below as the
help desk PC.
The local IPC is known below as the "AMT PC".
The sections contain the following information:
● AMT settings in the MEBx and in the BIOS setup
● Basic configuration of AMT
● Further useful notes

8.7.3 Enabling Intel® AMT / basic configuration

For security reasons, Intel® AMT is not enabled on new devices. The Management Engine
(ME) is always active.

Procedure

For devices IPCxxxD, IPCxxxG, IPCxxxE, Field PG M4, Field PG M5, ITP:
1. If necessary, first reset Intel® AMT to the default status.
2. To open the BIOS selection menu, press the <ESC> key while the device is booting.
3. Open the BIOS Setup using the "Setup Configuration Utility (SCU)".
4. Select the "Active Management Technology Support" command in the Advanced menu.
Only for the devices IPC547D, IPC547E and IPC547G: Select "AMT Configuration".
5. Activate the option "Intel AMT Support".
6. Only for the devices IPC547D, IPC547E and IPC547G: Select the "Normal" setting for
"MEBx Mode".
7. Exit the BIOS Setup with <F10> key (Save and Exit).
Only for the devices IPC547D, IPC547E and IPC547G: Exit the BIOS Setup with <F4>
key.

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8.7 Active Management Technology (AMT)

Settings in the MEBx

1. To open the BIOS selection menu, press the <ESC> key while the device is booting.
2. Use the arrow keys to select "MEBx" and confirm with the <Enter> key.
3. Select "MEBx Login".
4. Enter the default password "admin".
Change the password. The new password must comprise:
– At least eight characters
– An upper case letter
– A lower case letter
– A number
– A special character (! @ # $ % ^ & *)
– The underscore "_" and space characters are valid in the string but do not increase the
complexity of the password.

Note
If the password is no longer available, you must reset the Intel® AMT to the default
settings.
Backup the password to protect it against loss.

5. Switch to the "Intel (R) AMT Configuration" submenu and enable "Manageability Feature
Selection".
6. Switch to the "Intel(R) ME General Settings" submenu and enable access via the network
with "Activate Network Access".
7. Confirm the dialogs that appear with "Y".
Drivers are automatically installed once with the Windows system start in the subsequent
restart.

See also
Resetting the Intel® AMT to the default settings and disabling AMT (Page 186)

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Technical information
8.7 Active Management Technology (AMT)

8.7.4 Resetting the Intel® AMT to the default settings and disabling AMT
If Intel® AMT has already been configured, it is advisable to reset Intel® AMT to the default
settings. One effect of resetting to the default settings is that Intel® AMT is disabled.
You can skip this point if you have a new IPC in the factory state.

Procedure
Proceed as follows to reset the Intel® AMT to the default values:
1. Press "F2" in the boot sequence to open the BIOS.
2. Select the "Active Management Technology Support" command in the Advanced menu;
for an IPC547D/IPC547E/IPC547G select "AMT Configuration".
3. Set "Un-Configure ME" or "Un-Configure AMT/ME" to Enabled.
4. Exit the BIOS with "F10" (Save and Exit).
You can exit the IPC547D/547E/IPC547G with "F4".
The following prompt will appear after an automatic restart:

5. Confirm this prompt with "Y" to discard all settings in the Management Engine (ME).
6. For IPC427E/IPC477E/Field PG M4/Field PG M5, you now need to set the "Un-Configure
ME" menu command in the BIOS back to Disabled.

8.7.5 Determining the network address

To connect the AMT PC with the AMT server, the network address that uniquely localizes
the AMT server on the AMT PC must be entered.
If DHCP is set for the automatic assignment of the network address in "Network Setup" in
the MEBx of the AMT PC, the network address is not fixed.

Procedure
If the AMT server uses the same network address as the operating system of the AMT PC
(most common situation):
1. You can obtain the address of the AMT server in the command line in Windows using
"ipconfig" and in UNIX using "ifconfig".
If the AMT server and operating system do not use the same network address, ask your
network administrator for the address you have been assigned.

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8.7 Active Management Technology (AMT)

8.7.6 Forcing user consent

When a connection to the AMT PC is established, the KVM viewer may prompt the user to
enter a six-figure code. This code is displayed on the screen of the AMT PC. The user of the
AMT PC must inform the user of the KVM viewer of this code.
This code query needs to be set up on the KVM viewer.

Procedure
1. Select "Intel(R) AMT Configuration > User Consent" in the MEBx.
2. Select the value "KVM" for "User Consent".
To allow a user with administrator privileges to avoid this code query, follow these steps:
1. Select "Intel(R) AMT Configuration > User Consent" in the MEBx.
2. Select "Opt-in Configurable from Remote IT".

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Technical information
8.8 Functional scope in Windows

8.8 Functional scope in Windows

8.8.1 Windows Embedded Standard 7 Professional

The overview shows the most important device functions under
Windows Embedded Standard 7:

Function Availability
.Net Framework Available, V3.5
Accessories Available
Aero background Available
Backup and Restore Available
Bluetooth Available
Dialog box filter Available
DirectX and Windows Device Experience Available, V11
Domain services Available
Driver database Not available
Driver frameworks Available
Encrypted File System (EFS) Available
Enhanced Write Filter Available
Fax and Scan Available
File Based Write Filter (FBWF) Available
Fonts 48
Help and Support Engine Available
Hibernate Once Resume Many (HORM-EEF) Available
Image Mastering API V2 Available
IME Base Components Available
Internet Explorer Available, IE 8
Internet Information Server (IIS) Available, V7.0
Language (Standard) English 1
Mobility Center Available
Network and Sharing Center Available
Network Diagnostics Available
Pagefile Available
Printing Utilities and Management Available
Registry Filter Available
Remote Assistance Available
Remote Client Available
Remote Desktop Available
SIMATIC IPC DiagBase Available, V1.4
Speech Not available
System Management Administrative Tools Available

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8.8 Functional scope in Windows

Function Availability
Telnet Server Available
User Account Control Available
Windows Explorer Shell Available
Windows Firewall Available
Windows Installer Available
Windows Media Player Available, V12
Windows PowerShell 2.0 Available
Windows Search and Natural Language 6 Available
Windows Security Center Available
Windows Update Available
Wireless Networking Available
1 Note the licensing agreements for Windows Embedded Standard 7 Professional.

Additional information on language selection is available in section "Setting up the language

selection by means of the Multilanguage User Interface (MUI)".

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Technical support A
A.1 Service and support
You can find additional information and support for the products described on the Internet at
the following addresses:
● Technical support (https://support.industry.siemens.com/cs/ww/en/)
● Support request form (http://www.siemens.com/automation/support-request)
● After-sales information system for SIMATIC PC / PG (http://www.siemens.com/asis)
● SIMATIC Documentation Collection (http://www.siemens.com/simatic-tech-doku-portal)
● Your local representative (http://www.automation.siemens.com/mcms/aspa-
db/en/Pages/default.aspx)
● Training center (http://sitrain.automation.siemens.com/sitrainworld/?AppLang=en)
● Industry Mall (https://mall.industry.siemens.com)
When contacting your local representative or Technical Support, please have the following
information at hand:
● Order number of the device (MLFB)
● BIOS version (industry PC) or image version (HMI device)
● Installed additional hardware
● Installed additional software

Tools & downloads

Please check regularly if updates and hotfixes are available for download to your device. The
downloads are available on the Internet under "After Sales Information System SIMATIC
PC/PG" (see above).

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A.2 Troubleshooting

A.2 Troubleshooting
This chapter provides you with tips on how to localize and troubleshoot frequently occurring
problems.

Problem Possible cause Remedy

The device is not operational There is no power supply to the • Check the power supply, the network cable and
device. the power plug.
• Check if the On/Off switch is in the correct posi-
tion.
Device is being operated outside • Check the ambient conditions.
the specified ambient. conditions
• After transport in cold weather, wait approximate-
ly 12 hours before switching on the device.
The PC crashes during startup • I/O addresses are assigned Check your computer configuration:
twice. • If the computer configuration corresponds with
• Hardware interrupts and/or the factory state, please contact your technical
DMA channels are assigned support team.
twice • If the computer configuration has been changed,
• Signal frequencies or signal restore the original factory settings. Remove all
levels are not adhered to third-party expansion cards, then restart the PC.
• Different connector pin assign- If the error no longer occurs, the third-party ex-
ments pansion card was the cause of the fault. Replace
this expansion card with a Siemens card or con-
tact the card supplier.
If the PC still crashes, contact your technical support
team.
Windows no longer boots Settings in the BIOS Setup are • Check the settings in the BIOS Setup "SATA
incorrect Configuration" submenu
• Check the setting in the BIOS Setup Boot menu.
The external monitor remains The monitor is switched off. Switch on the monitor.
dark. The monitor is in "power save" Press any key on the keyboard.
mode.
The brightness button has been set Increase the screen brightness. For detailed infor-
to dark. mation, refer to the monitor operating instructions.
The power cord or the monitor • Check whether the power cord has been properly
cable is not connected. connected to the monitor and to the system unit
or to the grounded shockproof outlet.
• Check whether the monitor cable has been
properly connected to the system unit and to the
monitor.
If the monitor screen still remains dark after you
have performed these checks, please contact your
technical support team.
The mouse pointer does not The mouse driver is not loaded. Check if the mouse driver is correctly installed.

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Technical support
A.2 Troubleshooting

Problem Possible cause Remedy

appear on the screen. The mouse is not connected. Check whether the mouse lead is connected to the
system unit. If you are using an adapter or extension
for the mouse lead, check the connectors.
Should the mouse cursor still not be visible on-
screen after completing these checks and measures,
contact technical support.
Wrong time and/or date on the 1. Open the BIOS selection menu (see Technical
PC. specifications, section "BIOS description").
2. Select BIOS setup, "Main" menu.
3. Set the time and date.
Although the BIOS setting is The backup battery is dead. Replace the backup battery.
OK, the time and data are still
wrong.
USB device not responding. The USB ports are disabled in your Use a different USB port or enable the port.
BIOS.
Operating system does not support Enable USB Legacy Support for the mouse and
the USB port. keyboard.
For other devices you need the USB drivers for the
respective operating system.
DVD: The front loader does The device is switched off or the Emergency removal of the data medium:
not open. open/close button is disabled by a 1. Switch off the device
software application.
2. Insert a pointed object, a pin for example, or an
opened paper clip into the emergency extraction
opening of the drive. Apply slight pressure to the
contact until the front loader opens.
3. Pull the loader further out.
The RAID software reports the RAID is not activated In this case, the messages have no negative influ-
following errors: ence on the device function and can be ignored.
Acknowledge the messages.
• The RAID plug-in failed to
load, because the drive is RAID is activated Re-install the software from the supplied Documen-
not installed. tation and Drivers DVD.

• The Serial ATA plug-in

failed to load, because the
driver is not installed cor-
rectly.
• The Intel® Matrix Storage
Console was unable to
load a page for the follow-
ing reason:
– A plug-in did not pro-
vide a page for the se-
lected device
– A plug-in failed to load
After changing the hard disk, RAID array does not have highest Set the RAID array to be first in the boot order
the system does not boot from boot priority
the RAID array

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A.2 Troubleshooting

Problem Possible cause Remedy

After changing the hard disk, The system was booted without a Reboot the system with a functioning hard disk
"unused" is indicated for the functioning hard disk (the remova-
relevant SATA port ble cartridge was possibly not
turned on)
Computer does not boot or The boot device is not first in the Change the boot priority of the boot device in the
"Boot device not found" is boot priority in the BIOS setup or is Boot menu of the BIOS setup or permit boot device
displayed excluded as a boot device in the boot priority

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Meaning of the symbols on your device B
B.1 Meaning of the symbols on your device
The following tables show all the symbols which may be found on your SIMATIC industrial
PC, SIMATIC industrial monitor or SIMATIC Field PG in addition to the symbols which are
explained in the operating instructions.
The symbols on your device may vary in some details from the symbols shown in the
following tables.

B.2 Safety

Symbol Meaning Symbol Meaning

Warning, observe the supplied docu- Lock is closed
mentation.

Attention, radio equipment Lock is open

Disconnect the power plug before Opening for Kensington lock

opening

Attention ESD (Electrostatic sensitive Warning of hot surface

device)

B.3 Operator controls

Symbol Meaning Symbol Meaning

On/off switch, without electrical isola- Eject CD/DVD
tion

On/off switch, without electrical isola-

tion

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 Meaning of the symbols on your device
B.4 Certificates, approvals and markings

B.4 Certificates, approvals and markings

The following table shows symbols relating to certificates, approvals and markings which
may be on the device. You can find more information in the operating instructions for your
device:

Symbol Meaning Symbol Meaning

Approved for Australia and New Zea- Marking for the Eurasian Customs
land Union

Approved for China Test mark of Factory Mutual Re-

search

CE markings for European countries Marking of Federal Communications

Commission for the USA

EFUP (Environment Friendly Use Approved for Korea

Period) marking for China

Test mark of the Underwriters La- Disposal information, observe the

boratories local regulations.

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Meaning of the symbols on your device
B.5 Interfaces

B.5 Interfaces

Symbol Meaning Symbol Meaning

Connection to the power supply PS/2 mouse interface

Protective conductor terminal PS/2 keyboard-interface

Connection for functional earthing Multimedia Card Reader

(equipotential bonding line)

DisplayPort interface Smart Card Reader

DVI-D interface Line In

LAN interface, not approved for con- Line Out

necting WAN or telephone

Serial interface Microphone input

USB port Universal Audio Jack

USB 2.0 HiSpeed interface Headphone output

USB 3.0 super-speed port

USB 3.1 SuperSpeedPlus interface

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 Meaning of the symbols on your device
B.6 Directives and declarations

B.6 Directives and declarations

Supplement to the chapter of the operating instructions.
Electromagnetic compatibility
This product meets the requirements of EU Directive 2014/30/EU "Electromagnetic
Compatibility".
Low-voltage directive
The device with AC power supply complies with the requirements of the EU Directive
2014/35/EU "Low Voltage Directive".
Compliance with this standard has been verified according to EN 60950-1:2006 + A11:2009
+ A1:2010 + A12:2011 + AC:2011 + A2:2013.

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List of abbreviations C
C.1 Abbreviations

Abbreviation Term Meaning

AC Alternating current Alternating current
ACPI Advanced Configuration and Power Interface
PLC Programmable controller
AGP Accelerated Graphics Port High speed bus system
AHCI Advanced Host Controller Interface Standardized controller interface for SATA devic-
es. This is supported in Microsoft Windows XP as
of SP1 and IAA driver.
APIC Advanced Programmable Interrupt Controller Extended programmable interrupt controller
APM Advanced Power Management Tool for monitoring and reducing power con-
sumption of the PC
AS Automation system
ASIS After Sales Information System
AT Advanced Technology
ATA Advanced Technology Attachment
ATX AT-Bus-Extended
AWG American Wire Gauge US standard for the cable diameter
BIOS Basic Input Output System Basic Input Output System
CAN Controller Area Network
CD-ROM Compact Disc – Read Only Memory Removable storage medium for large data vol-
umes
CD-RW Compact Disc – Rewritable Rewritable CD
CE Communauté Européenne (CE symbol) The product is in conformance with all applicable
EC directives
CF + AST The acronym CFast is the combination of CF
CFast (CompactFlash) and AST (ATA Serial Transport).
CGA Color Graphics Adapter Standard monitor interface
CLK Clock pulse Clock signal for controllers
CMOS Complementary Metal Oxide Semiconductors Complementary metal oxide semiconductors
COA Certificate of authentication Microsoft Windows Product Key
CoL Certificate of License License authorization
COM Communications Port Term for the serial interface
CP Communication Processor Communication computer
CPU Central Processing Unit CPU
CRT Cathode Ray Tube

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 List of abbreviations
C.1 Abbreviations

Abbreviation Term Meaning

CSA Canadian Standards Association Canadian organization for tests and certifications
according to own or binational standards (with UL
/ USA) standards
CTS Clear To Send Clear to send
DRAM Dynamic Random Access Memory
DC Direct Current DC current
DCD Data Carrier Detect Data carrier signal detection
DMA Direct Memory Access Direct memory access
DOS Disk Operating System Operating system without GUI
DPP DisplayPort New powerful digital monitor port
DQS Deutsche Gesellschaft zur Zertifizierung von
Qualitätsmanagement mBH
DDRAM Double Data Random Access Memory Memory chip with high-speed interface
DSR Data Set Ready Ready for operation
DTR Data Terminal Ready Data terminal is ready
DVD Digital Versatile Disk Digital versatile disk
DVI Digital Visual Interface Digital display interface
DVI-I Digital Visual Interface Digital display interface with digital and VGA
signals
ECC Error checking and correction Error correction code
ECP Extended capability port Extended parallel port
EFI Extensible Firmware Interface
EGA Enhanced Graphics Adapter PC to monitor interface
ESD Electrostatic-sensitive components
DM Electronic Manual
EIDE Enhanced Integrated Drive Electronics An enhancement of the IDE standard
EISA Extended Industry Standard Architecture Extended ISA standard
EMM Expanded Memory Manager Manages memory expansions
EM64T Extended Memory 64 technology
EN European standard
EPROM / EEPROM Erasable Programmable Read-Only Memory / Plug-in submodules with EPROM/EEPROM chips
Electrically Erasable Programmable Read-
Only Memory
EPP Enhanced Parallel Port Bi-directional Centronics interface
ESC Escape character Control character
EWF Enhanced Write Filter
FAQ Frequently Asked Questions FAQs
FAT 32 File Allocation Table 32-bit 32-bit file allocation table
FBWF File Based Write Filter
FD Floppy disk Disk drive, 3.5"
FSB Front Side Bus
GND Ground Chassis ground
HD Hard disk Hard disk

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List of abbreviations
C.1 Abbreviations

Abbreviation Term Meaning

HDA High Definition Audio
HDD Hard Disk Drive Hard disk drive
HU Height unit
HMI Human Machine Interface User interface
HORM Hibernate Once - Resume Many
HT Hyper-Threading
HTML Hyper Text Markup Language Script language for creating Internet pages.
HTTP Hypertext Transfer Protocol Protocol for data transfer on the Internet
Hardware Hardware
IAMT Intel Active Management Technology Technology that permits the diagnostics, man-
agement and remote control of PCs
I/O Input/Output Data input/output on computers
IAA Intel Application Accelerator
IDE Integrated Device Electronics
IEC International Electronical Commission
IGD Integrated Graphics Device
IP Ingress Protection Degree of protection
IR Infrared Infrared
IRDA Infrared Data Association Standard for data transfer via IR module
IRQ Interrupt Request Interrupt request
ISA Industry Standard Architecture Bus for expansion modules
ITE Information Technology Equipment
L2C Level 2 cache
LAN Local Area Network Computer network that is limited to a local area.
LCD Liquid Crystal Display Liquid crystal display
LED Light Emitting Diode Light emitting diode
LPT Line Printer Printer port
LVDS Low Voltage Differential Signaling
LW Drive
MAC Media access control Media access control
MC Memory Card Memory card in credit card format
MLFB Machine-readable product designation
MMC Micro Memory Card Memory card of the format 32 mm x 24.5 mm
MPI Multipoint-capable interface for programming
devices
MRAM Magnetoresistive Random Access Memory Non-volatile data memory. Data memory is re-
tained without external power supply.
MS-DOS Microsoft Disc Operating System
MTBF Mean Time Between Failures
MUI Multilanguage User Interface Multilanguage operating system with Windows
with language toggling; 5 languages: German,
English, French, Spanish and Italian
NA Not Applicable

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 List of abbreviations
C.1 Abbreviations

Abbreviation Term Meaning

NAMUR Normenarbeitsgemeinschaft for Mess- und
Regelungstechnik in der chemischen Industrie
(standardization body for instrumentation and
control technology in the chemicals industry)
NC Not Connected Not connected
NCQ Native Command Queuing Automatic re-sorting of the file and disk access,
for increased performance
NEMA National Electrical Manufacturers Association Syndicate of manufacturers of electrical compo-
nents in the USA
NMI Non Maskable Interrupt Interrupt the processor can not reject
NTFS New Techniques File System Secure file system for Windows versions (2000,
XP, 7)
ODD Optical Disk Drive
OPC OLE for Process Control Standardized interface for industrial processes
OSK On Screen Keyboard Screen keyboard emulated by operating system
PATA Parallel ATA
PC Personal computer
PCI Peripheral Component Interconnect High-speed expansion bus
PCIe Peripheral Component Interconnect express High-speed serial, differential full-duplex PtP
interface with high data rate.
PCMCIA Personal Computer Memory Card Interna-
tional Association
PI Protective Earth Protective conductor
PEG PCI Express Graphics
PG Programming device
PIC Programmable Interrupt Controller Programmable interrupt controller
PIC-E Peripheral Component Interconnect Express
POST Power On Self Test
PXE Preboot Execution Environment Software for running new PCs without hard disk
data via the network
RAID Redundant Array of Independent Disks Redundant hard disk array
RAL Restricted Access Location Installation of device in operating facilities with
restricted access - for example, a locked switch-
gear cabinet
RAM Random Access Memory
RI Ring Input Incoming call
ROM Read-Only Memory
RS 485 Reconciliation Sublayer 485 Bi-directional bus system designed for up to 32
nodes
RTC Real Time Clock Real-time clock
RTS Reliable Transfer Service Request to send
RxD Receive Data Data transfer signal
SATA Serial Advanced Technology Attachment
SCSI Small Computer System Interface
SDRAM Synchronous DRAM

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List of abbreviations
C.1 Abbreviations

Abbreviation Term Meaning

SELV Safety Extra Low Voltage Safety extra low voltage
SLC Second Level Cache
SMART Self Monitoring Analysis and Reporting Tech- Hard disk error diagnostics program
nology
SMS Short Message Service Short message via telecommunication network
SNMP Simple Network Management Protocol Network protocol
SO-DIMM Small Outline Dual Inline Memory Module
SOM SafeCard on Motherboard (SOM)
SPP Standard Parallel Port Synonym for parallel port
SRAM Static Random Access Memory Static RAM
SSD Solid State Drive
SVGA Super Video Graphics Array Enhanced VGA standard with at least 256 colors
SVP Serial number of the device
SW Software
TCO Total Cost of Ownership
TFT Thin-Film-Transistor Type of LCD flat-screen
TPM Trusted Platform Module Chip with security functions
TTY Tele Type Asynchronous data transfer
TxD Transmit Data Data transfer signal
TXT Trusted Execution Technology Hardware implementation
TWD Watchdog Time Watchdog monitoring time
UEFI Unified Extensible Firmware Interface
UL Underwriters Laboratories Inc. US organization for tests and certifications ac-
cording to own or binational standards (with CSA
/ Canada) standards.
UMA Unified Memory Architecture Video memory
URL Uniform Resource Locator Designation of the full address of an Internet
page
USB Universal Serial Bus
UXGA Ultra Extended Graphics Array Graphic standard, maximum resolution
1.600 x 1.200 pixels.
V.24 ITU-T standardized recommendation for data
transfer via serial ports
VCC Positive supply voltage of integrated circuits
VDE Verein deutscher Elektrotechniker (Union of
German Electrical Engineers)
VGA Video Graphics Array Video adapter which meets industrial standard
VRM Voltage Regulator Module
VT Virtualization Technology Intel technology with which a virtually closed
environment can be made available.
VT-D Virtualization Technology for Directed I/O Enables the direct assignment of a device (e.g.
network adapter) to a virtual device.
W2k Windows 2000
WAN Wide Area Network

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 List of abbreviations
C.1 Abbreviations

Abbreviation Term Meaning

WAV Wave Length Encoding Loss-free file format for audio data
WD Watchdog Program monitoring with error detection and
alarming.
WLAN Wireless LAN LWireless local area network
WoL Wake on Local Area Network
WWW World Wide Web
XD Execute Disable Capability Hardware implementation
XGA Extended Graphics Array Graphic standard, maximum resolution
1.024 x 768 pixels.

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Glossary

AHCI mode
AHCI is a standardized method to address the SATA controller. AHCI describes a structure
in the RAM, which contains a general area for control and status, as well as a command list.

APIC mode
Advanced peripheral interrupt controller. 24 interrupt lines are available.

Automation system
A programmable controller (PLC) of the SIMATIC S7 system consist of a central controller,
one or several CPUs, and various I/O modules.

Backup
Duplicate of a program, data medium or database, used either for archiving purposes or for
the protection of vital and non-replaceable data against loss when the working copy is
corrupted. Certain applications automatically generate backup copies of data files, and
manage both the current and the previous versions on the hard disk.

Baud
Physical unit for the step speed in signal transmission. Defines the number of transferred
signal states per second. With only two states, one baud is equivalent to a transmission rate
of 1 bps.

Boot disk
A boot disk is a disk with a "Boot" sector. This can be used to load the operating system from
the disk.

Cache
High-speed access buffer for interim storage (buffering) of requested data.

CE marking
Communauté Européene The CE mark confirms compliance of the product with
corresponding EC Directives, for example, with the EMC Directive.

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 Glossary

Chipset
Located on the motherboard, connects the processor with the PCI or PCIe bus and the
external interfaces.

Cold restart
A start sequence, starting when the computer is switched on. The system usually performs
some basic hardware checks within the cold start sequence, and then loads the operating
system from the hard disk to work memory -> boot

COM interface
The COM interface is a serial V.24 interface. The interface is suitable for asynchronous data
transfer.

CompactFlash card
CompactFlash is a digital storage medium in card format and without moving parts. The CF
card contains the non-volatile memory and the controller. The interface of the CF card
corresponds with the IDE interface. CF cards can be operated without additional electronics
on PCMCIA or IDE hard disk controllers using a plug and socket adapter. There are two
design forms: CF-I (42.6 x 36.4 x 3.3 mm) and CF-II (42.8 x 36.4 x 5 mm).

Configuration files
These are files containing data which define the configuration after restart. Examples of such
files are CONFIG.SYS, AUTOEXEC.BAT and the registry files .

Configuration software
The configuration software updates the device configuration when new modules are installed
. This is done either by copying the configuration files supplied with the module or by manual
configuration using the configuration utility.

Controller
Integrated hardware and software controllers that control the functions of certain internal or
peripheral devices (for example, the keyboard controller).

Device configuration
The configuration of a PC or programming device contains information on hardware and
device options, such as memory configuration, drive types, monitor, network address, etc.
The data are stored in a configuration file and enable the operating system to load the
correct device drivers and configure the correct device parameters. . If changes are made to
the hardware configuration, the user can change entries in the configuration file using the
SETUP program. .

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Glossary

Drivers
Program parts of the operating system. They adapt user program data to the specific formats
required by I/O devices such as hard disk, printers, and monitors.

EMC directive
Directive concerning Electromagnetic Compatibility. Compliance is confirmed by the CE
symbol and the EC certificate of conformity.

Energy management
The energy management functions of a modern PC allow individual control over the current
consumption of vital computer components (e.g. of the monitor, hard disk and CPU), by
restricting their activity based on the current system or component load. Energy
management is of particular importance for mobile PCs.

Energy options
The energy options can be used to reduce energy consumption of the computer, while
keeping it ready for immediate use. This can be configured in Windows by selecting Settings
> Control Panel > Energy options.

Enhanced Write Filter

Configurable write filter that allows you to, for example, boot Windows Embedded Standard
from write-protected media (e.g., CD-ROM), set write protection for individual partitions, and
adapt the file system performance to user requirements (when using memory cards, for
example).

ESD Guideline
Guideline for using electrostatic sensitive components.

Ethernet
Local network (bus structure) for text and data communication with a transfer rate of
10/100/1000 Mbps.

Execute Disable Capability

Hardware implementation that prevents mutual memory accesses by programs and
applications. It is only effective when all relevant system components, such as processors,
operating systems and applications are supported.

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 Glossary

Extensible Firmware Interface

Refers to the central interface between the firmware, the individual components of a
computer and the operating system. EFI is located logically beneath the operating system
and represents the successor to PC BIOS, focusing on 64-bit systems.

File Based Write Filter

Configurable write filter to protect individual files from write access.

Formatting
Basic partitioning of memory space on a magnetic data medium into tracks and segments.
Formatting deletes all data on a data medium. All data media must be formatted prior to their
first use.

HORM
Hibernate once, resume many is a method for fast booting from a single Hibernate file that
only needs to be created once. HORM ensures restoration of a uniform, saved system state
when booting. This minimizes write access, for example to a CompactFlash medium, when
you start up and shut down Windows Embedded Standard 7.

Hub
A term in network technology. In a network, a device joining communication lines at a central
location, providing a common connection to all devices on the network.

Hyper Threading
HT technology (multi-threading) enables the parallel computing of processes. HT is only
effective when all relevant system components, such as processors, operating systems and
applications are supported.

IGD
Integrated Graphics Device. Graphics interface integrated in the chipset.

Image
This refers to the image, for example, of hard disk partitions saved to a file in order to restore
them when necessary.

Intel Active Management Technology

This technology permits the diagnostics, management and remote control of PCs. It is only
effective when all relevant system components, such as processors, operating systems and
applications are supported.

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Glossary

Intel VT
The Intel Virtualization Technology (IVT) is the implementation of a secure closed
environment for applications. Special (visualization) software an a VT-capable processor is
required for its use.

Interface
● Physical interconnection (cable) of hardware elements such as PLCs, PCs, programming
devices, printers or monitors.
● Interface for interactive software applications.

LAN
Local Area Network: LAN is a local network that consists of a group of computers and other
devices that are distributed across a relatively restricted range and are linked with
communication cables. The devices connected to a LAN are called nodes. The purpose of
networks is the mutual use of files, printers or other resources.

Legacy Boot Device

Conventional drives can be used as USB devices.

License key
The license key represents the electronic license stamp of a license. Siemens provides the
license keys for protected software.

License key disk

The license key disk contains the authorizations or license keys required to enable protected
SIMATIC software.

Low-voltage directive
EC Product Safety Directive relating to the safety of products which are operated on low
voltage (50 V AC to 1000 V AC, 70 V DC to 1500 V DC) and not specified in other directives.
Compliance is confirmed by the CE symbol and the EC certificate of conformity.

Module
Modules are plug-in units for PLCs, programming devices or PCs. They are available as
local modules, expansion modules, interfaces or mass storage (Mass storage module).

Motherboard
The motherboard is the core of the computer. Here, data are processed and stored, and
interfaces and device I/Os are controlled and managed.

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 Glossary

Operating system
Generic term which describes all functions for controlling and monitoring user program
execution, distribution of system resources to the user programs and the operating mode in
cooperation with the hardware (for example, Windows 7 Ultimate).

Pixel
The pixel represents the smallest element that can be reproduced on-screen or on a printer.

Plug&Play
Generally, a reference to the ability of a computer to automatically configure the system for
communication with peripheral devices (for example monitors, modems or printers). The
user can plug in a peripheral and "play" it at once without manually configuring the system. A
Plug&Play PC requires both a BIOS that supports Plug&Play and a Plug&Play expansion
card.

POST
Self-test performed by the BIOS after the computer is switched on. Performs a RAM test and
a graphics controller test, for example. The system outputs audible signals (beep codes) if
the BIOS detects any errors; the relevant message indicating cause of error is output on the
screen.

Programmable controller
The programmable controllers of the SIMATIC S5 system consist of a central controller, one
or several CPUs and various other modules (for example, I/O modules).

PXE server
A Preboot Execution Environment server is part of a network environment and can provide
software to connected computers even before they boot. This can involve operating system
installations or servicing tools, for example.

RAL
Restricted Access Location: Installation of the device in a production facility with restricted
access, for example, a locked control cabinet.

Recovery CD
Contains the tools for configuring hard disks and the Windows operating system.

Reset
Hardware reset: Reset/restart of the PC using a button/switch.

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Glossary

Restart
Warm restart of a computer without switching the power off (Ctrl + Alt + Del)

Restore DVD
The Restore DVD is used to restore the system partition or the entire hard disk to factory
state if the system has crashed. The bootable DVD contains all the necessary image files.
You can also create a boot disk allowing restoration via the network.

ROM
Read-Only Memory ROM is a read-only memory in which every memory location can be
addressed individually. The programs or data are permanently stored and are not lost in the
event of a power failure.

S.M.A.R.T
The Self-Monitoring, Analysis and Reporting Technology (SMART or S.M.A.R.T.) is an
industry standard integrated in storage media. It makes for permanent monitoring of
important parameters and early detection of imminent problems.

SATA
Serial ATA Interface for hard disk drives and optical drives with serial data transmission rates
of up to 300 Mbps.

SETUP (BIOS Setup)

A program in which information about the device configuration (that is the configuration of
the hardware on the PC/PG) is defined. The device configuration of the PC/PG is preset with
defaults. Changes must therefore be entered in the SETUP if a memory expansion, new
modules or a new drive are added to the hardware configuration.

SSD (Solid State Drive)

A Solid State Drive is a drive that can be installed like any other drive; it does not contain a
rotating disk or other moving parts because only semiconductor memory chips of similar
capacity will be used. This design makes SSDs more rugged, provides shorter access times,
low energy consumption and rapid data transfer.

STEP 7
Programming software for the creation of user programs for SIMATIC S7 controllers.

Troubleshooting
Error cause, cause analysis, remedy

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 Glossary

Trusted Execution Technology

Hardware implementation that allows secured execution of programs and applications. It is
only effective when all relevant system components, such as processors, operating systems
and applications are supported.

Wake on LAN
Wake on Local area network. This function allows the PC to be started via the LAN interface.

Warm restart
The restart of a computer after a program was aborted. The operating system is loaded and
restarted again. The CTRL+ ALT+ DEL hotkey can be used to initiate a warm restart.

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Index

Connecting
24 V DC power supply, 48
2 Peripherals, 43
Power supply, 50
24 V DC power supply
Power supply 120/230 V AC, 45
Connecting, 48
Connection elements, (Interfaces)
Connector pin assignment
PCI slot, 147
A
CP 1616 onboard, 52
Abbreviations, 198, 203
AC power supply, 137
Allocation of resources, 82 D
Antivirus software, 57
Data exchange, 51
Assignment
Degree of protection, 33, 131
I/O addresses, 156
Design
Australia, 119
Bus board, 145
Automatic Update, 57
Motherboard, 140
Device
Mounting, 38
B
Open, 78
Backup battery, 143 Power off, 61
Battery monitoring, 69 Power on, 56
Battery replacement, 106 Device configuration, 176
BIOS Setup, 170 Device driver CP16xx.sys, 53
Exit menu, 175 Device fan, (See Fan), (See Fan), (See Fan)
Menu layout, 173 Device fan supply, 142
Boot sequence, 182 DiagBase software, 67
Buffer memory, 132 DiagMonitor, 15
Bus board Temperature monitoring, 68
Design, 145 DiagMonitor software, 67
Removing, 109 Diagnostics, 67, 67
Bus module, (Bus board) DiagBase software, 67
DiagMonitor software, 67
Error Messages, 182
C Troubleshooting, 191
Dimension drawing, 124
CE marking, 120
Dimensional drawings
Certificates, 120
Expansion card, 130
Certifications and approvals, 117
Dimensions, 124
Certifications and approvals, 36
Dimensions of the device, 124
Clamp, (Mounting bracket)
Directive
Cleaning Agents, 99
ESD Directive, 121
Climatic conditions, 135
Display, 11, 26
Clock frequency, 115
DisplayPort
COA label, 30
Interface, 152
COM1 port, 151
Disposal, 116
Components sensitive to electrostatic charge, 121
DPP, (DisplayPort)
Condensation, 28

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Drive bay module Hard disks

Removing, 84 Partitions, 58
Drives, 132
DVD burner, 132
DVD burner drive I
Removing, 89
I/O addresses
DVI-I port, 153
Assignment, 156
Image & Partition Creator, 15
Initial commissioning, 56
E
Installation
Earth connection, 64 Memory modules, 79
Electromagnetic compatibility, 132 Installation guidelines, 35
Enhanced Write Filter, 70 Installation information, 35
Equipotential bonding, 44 Installing
ESD, 121 Expansion card, 81
ESD Directive, 121 Memory modules, 80
Ethernet, 134 Installing drives, 83
Ethernet address, 29 Installing expansion cards
Ethernet interface, 154 627D, 81
Ethernet RJ45 port, 14 Interfaces, 16, 134, 134, 141
Ethernet strain relief, 53 COM1, 151
EU Declaration of Conformity, 120 COM2, 151
EWF (Enhanced Write Filter), 70 DisplayPort, 152
Exit menu, 175 DVI-I, 153
Expansion Ethernet RJ 45, 51
Memory, 79 PROFIBUS, 51, 155
Expansion module, (Expansion card) PROFIBUS/MPI, 14, 51, 51, 51
Expansion slots, 132 PROFINET, 51, 155
RJ45 Ethernet, 14
USB, 14
F VGA, 14
Interference emission, 132
Fan, 100, 102, 112
Internal interfaces, 142
Removal, 100, 102, 112
Interrupt reaction time, 162
FBWF (File Based Write Filter), 73
FCC Rules (USA), 119
File Based Write Filter, 73
K
Fire protection covering, 35
Fire protection enclosure, 35 KC Mark, 119
Firewall, 57 Korea
KC Mark, 119
Korean Certification, 119
G
Graphic controller, 133
L
Limitation of liability, 98
H Lithium battery, 106
Localized information, 46
Hard disk
Removing, 85
Hard disk drive, 132

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Index

M Operating systems, 14
Operation
Main circuit board, (Motherboard)
Capacitive multi-touch screen, 64
Main memory, 132
Single touch screen, 63
Mainboard, (Motherboard)
Touch screen, 62
Marking
EU Declaration of Conformity, 120
Mechanical ambient conditions, 135
P
Memory configuration, 80
Memory expansion, 79 Package contents, 27
Memory media Checking, 27
Drives, 132 Packaging, 27
Memory modules, 132 Checking, 27
Installing, 79, 80 Removing, 27
Removing, 80 Partitions
Messages Hard disks, 58
On the screen, 182 PCI Express
Modules Pin assignment, 149
Installing, 79 PCI hardware interrupt, 162
Module bracket, 81 PCI slot
Monitoring Connector pin assignment, 147
Status displays, 19, 19 PE conductor, 64
Motherboard, 132, (Motherboard) Pin assignment
Design, 140 PCI Express slot, 149
Internal interfaces, 142 Pixel, 26
Location of the interfaces, 141 Defective pixel, 26
Mounting Plug-in card, (Expansion card)
Device, 38 Ports, (Interfaces)
with latch fasteners, 40 RJ45 Ethernet, 154
Mounting clamp, (Mounting clip) USB 3.0, 154
Mounting clip Power consumption, 131
Mounting, 38 Power factor correction, 137
Mounting cutout Power Good signal, 138
Dimensions, 33 Power requirements, 136
Preparing, 33 Power supply, 45, (Removing), (Power supply)
Mounting positions, 31 AC voltage supply, 137
DC voltage supply, 139
WinAC module, 148
N Power supply fan
Removal, 110
New Zealand, 119
Power supply unit, (Power supply)
Note, 35
Processor, 132
General Information, 25
Removal, 114
Installation guidelines, 35
Processor type, 115
PROFIBUS, 51
Interface, 155
O
PROFIBUS/MPI, 51, 51, 51, 134
Online ordering system, 51 PROFIBUS/MPI interface, 14
On-screen error messages, 182 PROFINET, 29, 51, 52, 134, 165
Open Interface, 155
Device, 78 Protective measure
Operating system Static electricity, 123
Initial commissioning, 56

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R Strain relief
Ethernet cable, 53
Radiation, 22
PROFINET cable, 54
High frequency radiation, 22
Supply voltage, 46, 131
RAID Level 1, 58
Switching on the device
RAID system
Configure automatic startup, 57
Checking status, 93
System resources, 156
Displaying the defective HDD in the RAID
I/O address allocation, 156
software, 94
Integrating a new hard disk, 96
Management functions, 58, 92
T
Management functions, 58, 92
RAID1 system Temperature monitoring, 68
Mounting locations for hard disks, 104 TFT technology, 11
Replacing a defective hard disk, 104 Third-party expansion cards, 191
Status displays of the hard disks, 104 Touch screen
Recycling, 116 Operation, 62
Removing Troubleshooting/FAQs, 191
Bus board, 109
Drive bay module, 84
DVD burner drive, 89 U
Fan, 100, 102, 112
Update, 57
Hard disk, 85
USA
Memory modules, 80
FCC Rules, 119
Power supply, 108
USB 3.0
Power supply fan, 110
Port, 154
Processor, 114
USB port, 14
Repairs, 97
User Account Control, 57
Replacing
Battery, 106
Resolution, 11
V
RJ45 Ethernet, 51
Ventilation slits, 35
VGA port, 14
S
Safety information
W
Storage, 28
Transportation, 28 Warranty, 21
Scope, 3 Watchdog, 68
Scope of application, 12 Monitoring function, 68
Serial number, 29 Monitoring times, 69
Setup, (BIOS Setup) Weight, 131
SIMATIC S7, 51 WinAC module
Single touch screen Power supply connection, 148
Operation, 63 Windows Action Center, 57
Slot cover, 81
SOFTNET S7, 51
Startup, 182
Static electricity
Protective measures, 123
Status displays, 19, 19

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