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100N10 Etc

This document provides information and specifications for an N-Channel PowerTrench MOSFET. It details key features such as low on-resistance, fast switching speed, and high current handling capability. Tables provide maximum ratings, thermal characteristics, electrical characteristics, and typical performance curves.

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Jm Tech
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0% found this document useful (0 votes)
186 views5 pages

100N10 Etc

This document provides information and specifications for an N-Channel PowerTrench MOSFET. It details key features such as low on-resistance, fast switching speed, and high current handling capability. Tables provide maximum ratings, thermal characteristics, electrical characteristics, and typical performance curves.

Uploaded by

Jm Tech
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 5

100N10

100N10
N-Channel PowerTrench® MOSFET
100V, 75A, 10mΩ

Features
Applications
• RDS(on) = 8.2mΩ ( Typ.)@ VGS = 10V, ID = 75A
DC to DC converters / Synchronous Rectification
• Fast switching speed

• Low gate charge Description


• High performance trench technology for extremely low RDS(on) This N-Channel MOSFET is producedusing Fairchild Semicon-
ductor’s advanced PowerTrench process that has been espe-
• High power and current handing capability
cially tailored to minimize the on-state resistance and yet
• RoHS compliant maintain superior switching performance.

TO-220
G D S
S

MOSFET Maximum Ratings TC = 25oC unless otherwise noted*


Symbol Parameter Ratings Units
VDSS Drain to Source Voltage 100 V
VGSS Gate to Source Voltage ±20 V
ID Drain Current -Continuous (TC = 75oC) 75 A
IDM Drain Current - Pulsed (Note 1) 300 A
EAS Single Pulsed Avalanche Energy (Note 2) 365 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 4.8 V/ns
(TC = 25oC) 208 W
PD Power Dissipation
- Derate above 25oC 1.4 W/oC
TJ, TSTG Operating and Storage Temperature Range -55 to +175 oC

Maximum Lead Temperature for Soldering Purpose, o


TL 300 C
1/8” from Case for 5 Seconds
*Drain current limited by maximum junction temperature

Thermal Characteristics
Symbol Parameter Ratings Units
RθJC Thermal Resistance, Junction to Case 0.72
RθCS Thermal Resistance, Case to Sink Typ. 0.5 oC/W

RθJA Thermal Resistance, Junction to Ambient 62.5


*When mounted on the minimum pad size recommended (PCB Mount)

1/5
100N10

Package Marking and Ordering Information TC = 25oC unless otherwise noted


Device Marking Device Package Reel Size Tape Width Quantity
FDP100N10 FDP100N10 TO-220 - - 50

Electrical Characteristics
Symbol Parameter Test Conditions Min. Typ. Max. Units

Off Characteristics
BVDSS Drain to Source Breakdown Voltage ID = 250µA, VGS = 0V, TJ = 25oC 100 - - V
∆BVDSS Breakdown Voltage Temperature
ID = 250µA, Referenced to 25oC - 0.1 - V/oC
/ ∆TJ Coefficient
VDS = 100V, VGS = 0V - - 1
IDSS Zero Gate Voltage Drain Current µA
VDS = 100V, VGS = 0V, TJ = 150oC - - 500
IGSS Gate to Body Leakage Current VGS = ±20V, VDS = 0V - - ±100 nA

On Characteristics
VGS(th) Gate Threshold Voltage VGS = VDS, ID = 250µA 2.5 - 4.5 V
RDS(on) Static Drain to Source On Resistance VGS = 10V, ID = 75A - 8.2 10 mΩ
gFS Forward Transconductance VDS = 10V, ID = 37.5A (Note 4) - 110 - S

Dynamic Characteristics
Ciss Input Capacitance - 5500 7300 pF
VDS = 25V, VGS = 0V
Coss Output Capacitance - 530 710 pF
f = 1MHz
Crss Reverse Transfer Capacitance - 220 325 pF
Qg(tot) Total Gate Charge at 10V - 76 100 nC
Qgs Gate to Source Gate Charge VDS = 50V, ID = 75A - 30 - nC
VGS = 10V
Qgd Gate to Drain “Miller” Charge (Note 4, 5) - 20 - nC

Switching Characteristics
td(on) Turn-On Delay Time - 70 150 ns
tr Turn-On Rise Time VDD = 50V, ID = 75A - 265 540 ns
td(off) Turn-Off Delay Time VGS = 10V, RGEN = 25Ω - 125 260 ns
tf Turn-Off Fall Time (Note 4, 5) - 115 240 ns

Drain-Source Diode Characteristics


IS Maximum Continuous Drain to Source Diode Forward Current - - 75 A
ISM Maximum Pulsed Drain to Source Diode Forward Current - - 300 A
VSD Drain to Source Diode Forward Voltage VGS = 0V, ISD = 75A - - 1.25 V
trr Reverse Recovery Time VGS = 0V, ISD = 75A - 71 - ns
Qrr Reverse Recovery Charge dIF/dt = 100A/µs (Note 4) - 164 - nC

Notes:
1: Repetitive Rating: Pulse width limited by maximum junction temperature
2: L = 0.13mH, IAS = 75A, VDD = 25V, RG = 25Ω, Starting TJ = 25oC
3: ISD ≤ 75A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25oC
4: Pulse Test: Pulse width ≤ 300µs, Duty Cycle ≤ 2%
5: Essentially Independent of Operating Temperature Typical Characteristics

2/5
100N10

Typical Performance Characteristics

Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics


1000
500 VGS = 15.0 V
10.0 V
8.0 V
7.0 V
ID,Drain Current[A]

6.5 V

ID,Drain Current[A]
100 6.0 V 100
5.5 V o
150 C
o
-55 C

o
10 25 C

10 *Notes: *Notes:
1. 250µs Pulse Test 1. VDS = 20V
o
2. TC = 25 C 2. 250µs Pulse Test
5 1
0.1 1 5 2 4 6 8 10 12
VDS,Drain-Source Voltage[V] VGS,Gate-Source Voltage[V]

Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage


Drain Current and Gate Voltage Variation vs. Source Current
and Temperature
0.020 1000
Drain-Source On-Resistance

IS, Reverse Drain Current [A]

0.015
100
RDS(ON) [Ω],

o
150 C
VGS = 10V
0.010

o
25 C
VGS = 20V 10
0.005
*Notes:
1. VGS = 0V
o
*Note: TJ = 25 C 2. 250µs Pulse Test
0.000 1
0 50 100 150 200 250 300 350 0.2 0.4 0.6 0.8 1.0 1.2 1.4
ID, Drain Current [A] VSD, Body Diode Forward Voltage [V]

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics


8000 10
Ciss = Cgs + Cgd (Cds = shorted) VDS = 80V
Coss = Cds + Cgd VDS = 50V
VGS, Gate-Source Voltage [V]

Crss = Cgd
VDS = 25V
8
6000 Ciss
Capacitances [pF]

*Note: 6
1. VGS = 0V
4000 2. f = 1MHz
Coss
4

2000
Crss 2

*Note: ID = 75A
0 0
0.1 1 10 30 0 15 30 45 60 75 90
VDS, Drain-Source Voltage [V] Qg, Total Gate Charge [nC]

3/5
100N10

Typical Performance Characteristics (Continued)

Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation


vs. Temperature vs. Temperature
1.2 3.0
Drain-Source Breakdown Voltage

2.5

Drain-Source On-Resistance
1.1
BVDSS, [Normalized]

RDS(on), [Normalized]
2.0

1.0 1.5

1.0
0.9
*Notes: 0.5 *Notes:
1. VGS = 0V 1. VGS = 10V
2. ID = 250µA 2. ID = 75A
0.8 0.0
-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200
o o
TJ, Junction Temperature [ C] TJ, Junction Temperature [ C]

Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current
vs. Case Temperature
500
20µs

100µs 75
100
ID, Drain Current [A]

1ms
ID, Drain Current [A]

10ms

10 Operation in This Area DC 50


is Limited by R DS(on)

1 *Notes: 25
o
1. TC = 25 C
o
2. TJ = 175 C
3. Single Pulse
0.1
1 10 100 200 0
VDS, Drain-Source Voltage [V] 25 50 75 100 125 o 150 175
TC, Case Temperature [ C]

Figure 11. Transient Thermal Response Curve

0.5
Thermal Response [ZθJC]

0.2
0.1
0.1

0.05 PDM
0.02 t1
0.01 t2
0.01
Single pulse
*Notes:
o
1. ZθJC(t) = 0.72 C/W Max.
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * ZθJC(t)
1E-3
-5 -4 -3 -2 -1 0
10 10 10 10 10 10
Rectangular Pulse Duration [sec]

4/5
100N10

Mechanical Dimensions

TO-220
9.90 ±0.20 4.50 ±0.20
1.30 ±0.10

(8.70)

2.80 ±0.10
(1.70)

+0.10
ø3.60 ±0.10 1.30 –0.05

18.95MAX.
(3.70)

15.90 ±0.20
9.20 ±0.20

(1.46)

(3.00)
(45°
)
(1.00)
13.08 ±0.20

10.08 ±0.30

1.27 ±0.10 1.52 ±0.10

0.80 ±0.10 +0.10


0.50 –0.05 2.40 ±0.20
2.54TYP 2.54TYP
[2.54 ±0.20] [2.54 ±0.20]

10.00 ±0.20

5/5

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