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Koh Young America - SPI Solutions

The document describes several 3D SPI systems from Koh Young for inspecting solder paste and other materials on PCBs. It summarizes the key features of four models - aSPIre 3, Meister-S, KY8030-3, and KY8030-2. The aSPIre 3 and Meister-S models offer the highest accuracy down to 5 microns, while the KY8030 models provide higher throughput at lower precision. All models provide 3D inspections of attributes like volume, height, and shape. The aSPIre 3 and Meister-S include additional capabilities like foreign material inspection and auto-verification.

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achref jebali
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677 views3 pages

Koh Young America - SPI Solutions

The document describes several 3D SPI systems from Koh Young for inspecting solder paste and other materials on PCBs. It summarizes the key features of four models - aSPIre 3, Meister-S, KY8030-3, and KY8030-2. The aSPIre 3 and Meister-S models offer the highest accuracy down to 5 microns, while the KY8030 models provide higher throughput at lower precision. All models provide 3D inspections of attributes like volume, height, and shape. The aSPIre 3 and Meister-S include additional capabilities like foreign material inspection and auto-verification.

Uploaded by

achref jebali
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Koh Young 3D SPI (Solder Paste Inspection) Systems

World Best Accuracy and Inspection Capability


The first and the last quad projection SPI fulfilling any inspection needs either speed or accuracy.
Configurable to inspection 008004. CeTaQ verification certified fulfilling automotive standard.

Revolutionary Optimization Tool with Artificial Intelligence


KSMART Printing Process Optimizer helps monitoring printing quality and correcting errors as
well as finding the optimal parameters of screen printer with deep learning engine.

Beyond Solder Paste Inspection


Various inspection criteria not only solder paste but also whole PCB foreign material inspection,
conductive glue, sinter paste with full color image display.

Connectivity with Zenith 3D AOI for Consolidated Review


CeTaQ verification compliant inspection reliability to fulfill automotive and micro electronics
standard Automatic measurement performance verification with integrated verification target

Fully Integrated with Smart Factory Solutions


Koh Young Zenith AOI is not only tightly coupled with KSMART solutions but also connecting
and exchange data with other industry leading equipment, industry 4.0 interface standards.

KY8030-2 KY8030-3 aSPIre 3 Meister-S

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3D SPI Product Portfolio
aSPIre 3, Flagship 3D SPI System Meister-S, Unrivalled in Accuracy
Quad 3D Projection Quad 3D Projection Probe with Laser Z-axis Sensor
12 Mega Pixel High Speed Camera with Telecentric Lens The most accurate SPI system on the planet
CeTaQ verification fulfillment for automotive standard 12 Mega Pixel High Speed Camera with Telecentric Lens
Auto-verification for sustainable accuracy Best ROI guaranteed for semiconductor manufacturing
12M15 ㎛ , 10㎛ 12M5 ㎛
KY8030-3, High Throughput SPI System
Dual 3D Projection
4 Mega Pixel High Speed Camera

Accuracy
All popular features included
Highly configurable
㎛ ㎛ ㎛
4M20 , 15 , 10

KY8030-2, Cost-Effective SPI System 8030-3


Dual 3D Projection
4 Mega Pixel Camera
8030-2
Equip all must-have features
Highly configurable
㎛ ㎛
4M20 , 15
Speed

4
3D SPI Product Comparison
KY8030-2 KY8030-3 aSPIre 3 Meister-S
Measurement Capabilities Volume, Area, Height, Offset, Bridging, Shape Deformity, Co-planarity
Inspection Tasks Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity, Paste Offset, Smear, Co-planarity
3D Projection 2-way 2-way 4-way 4-way
Camera Resolution 4M 4M 12M 12M
Pixel Resolution ( ㎛) 10 15 20 10 15 20 10 15 20 5 ㎛
FOV Size (mm) 20 x 20 30 x 30 40 x 40 20 x 20 30 x 30 40 x 40 41 x 30.7 61.44x 46 20 x 15
Inspection time/FOV (sec) 0.38 0.4 0.42 0.3 0.32 0.37 0.43 0.45 N/A
Inspection Speed (㎠/sec) 10.5 22.5 38.1 13.7 28.7 43.5 29.3 62.9
Inspection
Specification Z-Resolution 0.37 0.2
Height Accuracy 1 ㎛ <1㎛
Standard Max. Paste Height 400㎛ 400 ㎛ (2000㎛ optional) 150㎛
Min. Deposit Size 100 ㎛ 70㎛
Z-axis Laser Sensor N/A Standard

Inspection Accuracy Golden Sample, @3σ


- Height: 0.2um
- Area/Volume: <0.3%
01005 Inspection Capacity Gage R&R (±50% tolerance) : 10% @6σ
008004 Print Bump, @3σ
- Height: 0.3um
- Area/Volume: <4%

IR-RGB Lighting for Color Processing Optional Standard

Inspection Foreign Material Inspection N/A Standard


Add-on Z-tracking - 3D Warp Compensation Optional Standard
Pad-referencing - 2D Warp Compensation N/A Optional Standard N/A

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