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Stps 5 L 25

This document provides information on a Schottky rectifier product that is fully in production. It includes key specifications, features, absolute ratings, thermal resistance characteristics, and graphs showing forward power dissipation, average forward current over temperature, avalanche power derating over pulse duration, and relative thermal impedance variation over pulse duration.

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0% found this document useful (0 votes)
88 views8 pages

Stps 5 L 25

This document provides information on a Schottky rectifier product that is fully in production. It includes key specifications, features, absolute ratings, thermal resistance characteristics, and graphs showing forward power dissipation, average forward current over temperature, avalanche power derating over pulse duration, and relative thermal impedance variation over pulse duration.

Uploaded by

Gabriel Latiu
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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STPS5L25

Low drop power Schottky rectifier

Datasheet  production data

Description
Single Schottky rectifier suited for switch mode
$ . power supply and high frequency DC to DC
converters.

. Packaged in DPAK, this device is intended for use


. as a rectifier at the secondary of 3.3 V SMPS
units.
. $
. $
Table 1. Device summary
1&
1& Symbol Value
'3$. IF(AV) 5A
VRRM 25 V
Tj (max) 150 °C
VF(typ) 0.31 V
Features
 Very low forward voltage drop for less power
dissipation and reduced heatsink
 Optimized conduction/reverse losses trade-off
which means the highest efficiency in the
applications
 High power surface mount miniature package
 Avalanche specification
 ECOPACK®2 compliant component for DPAK
on demand

May 2017 DocID3626 Rev 8 1/8


This is information on a product in full production. www.st.com 8
Characteristics STPS5L25

1 Characteristics

Table 2. Absolute ratings (limiting values, at 25 °C unless otherwise stated)


Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 25 V


IF(RMS) Forward rms current 7 A
IF(AV) Average forward current, δ 0.5 square wave Tc = 140 °C, 5 A
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A
PARM Repetitive peak avalanche power tp = 10 s, Tj = 125 °C 215 W
Tstg Storage temperature range -65 to +150 °C
Tj Maximum operating junction temperature(1) 150 °C
dPtot < 1
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj Rth(j-a)

Table 3. Thermal resistance


Symbol Parameter Max. value Unit

Rth(j-c) Junction to case 2.5 °C/W

Table 4. Static electrical characteristics


Symbol Parameter Test conditions Min. Typ. Max. Unit

Tj = 25 °C - - 350 A
IR(1) Reverse leakage current VR = VRRM
Tj = 125 °C - 55 115 mA
Tj = 25 °C - - 0.47
IF = 5 A
Tj = 125 °C - 0.31 0.35
VF(1) Forward voltage drop V
Tj = 25 °C - - 0.59
IF = 10 A
Tj = 125 °C - 0.41 0.50
1. Pulse test: tp = 380 µs,  < 2%

To evaluate the conduction losses use the following equation:


P = 0.2 x IF(AV) + 0.03 x IF2(RMS)

2/8 DocID3626 Rev 8


STPS5L25 Characteristics

Figure 1. Average forward power dissipation Figure 2. Average forward current versus
versus average forward current ambient temperature (δ = 0.5)

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Figure 3. Normalized avalanche power derating Figure 4. Relative variation of thermal


versus pulse duration at Tj = 125 °C impedance junction to case versus pulse
duration

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Figure 5. Reverse leakage current versus Figure 6. Junction capacitance versus reverse
reverse voltage applied (typical values) voltage applied (typical values)

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DocID3626 Rev 8 3/8


Characteristics STPS5L25

Figure 7. Forward voltage drop versus forward Figure 8. Thermal resistance junction to
current (maximum values) ambient versus copper surface under tab

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4/8 DocID3626 Rev 8


STPS5L25 Package Information

2 Package Information

 Epoxy meets UL94,V0


 Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

2.1 DPAK package information


Figure 9. DPAK package outline

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Note: This package drawing may slightly differ from the physical package. However, all the
specified dimensions are guaranteed.

DocID3626 Rev 8 5/8


Package Information STPS5L25

Table 5. DPAK package mechanical data


Dimensions

Ref. Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 2.18 2.40 0.085 0.094


A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
b 0.64 0.90 0.025 0.035
b4 4.95 5.46 0.194 0.214
c 0.46 0.61 0.018 0.024
c2 0.46 0.60 0.018 0.023
D 5.97 6.22 0.235 0.244
D1 4.95 5.60 0.194 0.220
E 6.35 6.73 0.250 0.264
E1 4.32 5.50 0.170 0.216
e 2.28 0.090
e1 4.40 4.70 0.173 0.185
H 9.35 10.40 0.368 0.409
L 1.00 1.78 0.039 0.070
L2 1.27 0.050
L4 0.60 1.02 0.023 0.040
V2 -8° +8° -8° 8°

Figure 10. DPAK footprint dimensions (in mm)

  

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6/8 DocID3626 Rev 8


STPS5L25 Ordering information

3 Ordering information

Table 6. Ordering information


Order code Marking Package Weight Base qty Delivery mode

STPS5L25B-TR STPS5 L25B DPAK 0.32 g 2500 Tape and reel

4 Revision history

Table 7. Document revision history


Date Revision Changes

Jul-2003 5A Previous release.


Reformatted to current standard. Corrected order code
15-Apr-2008 6
in Table 5.
Updated package information and reformatted to current
08-Jan-2015 7
standard.
Updated DPAK package information and reformatted to
15-May-2017 8
current standard.

DocID3626 Rev 8 7/8


STPS5L25

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2017 STMicroelectronics – All rights reserved

8/8 DocID3626 Rev 8

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