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Ec465 Mems

This document outlines the course details of EC465 MEMS. The course is a 3 credit hour course introduced in 2016. The objectives are to understand MEMS devices and systems, microfabrication techniques, and MEMS applications. The syllabus covers topics like MEMS principles, microsensors, microactuators, materials, fabrication methods, packaging, and specific MEMS areas. Upon completing the course, students will be able to understand MEMS working principles, scaling laws, materials, fabrication techniques, and design challenges. The course is divided into 6 modules taught over 15 weeks with internal and end semester exams.

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Anupriya T M
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78 views2 pages

Ec465 Mems

This document outlines the course details of EC465 MEMS. The course is a 3 credit hour course introduced in 2016. The objectives are to understand MEMS devices and systems, microfabrication techniques, and MEMS applications. The syllabus covers topics like MEMS principles, microsensors, microactuators, materials, fabrication methods, packaging, and specific MEMS areas. Upon completing the course, students will be able to understand MEMS working principles, scaling laws, materials, fabrication techniques, and design challenges. The course is divided into 6 modules taught over 15 weeks with internal and end semester exams.

Uploaded by

Anupriya T M
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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COURSE YEAR OF

CODE COURSE NAME L-T-P-C INTRODUCTION


EC465 MEMS 3-0-0 -3 2016
Prerequisite : NIL
Course objectives:
 To understand the operation of major classes of MEMS devices/systems
 To give the fundamentals of standard micro fabrication techniques and processes
 To understand the unique demands, environments and applications of MEMS devices
Syllabus:
MEMS and Microsystems applications, Review of Mechanical concepts, Actuation and Sensing
techniques, Scaling laws in miniaturization, Materials for MEMS, Micro System fabrication
techniques, Micro manufacturing, Micro system Packaging, Bonding techniques for MEMS,
Overview of MEMS areas.
Expected outcome:
The student will be able to:
i. Understand the working principles of micro sensors and actuators
ii. Understand the application of scaling laws in the design of micro systems
iii. Understand the typical materials used for fabrication of micro systems
iv. Understand the principles of standard micro fabrication techniques
v. Appreciate the challenges in the design and fabrication of Micro systems

Text Books:

KTU STUDENTS
1. Chang Liu, Foundations of MEMS, Pearson 2012
2. Tai-Ran Hsu, MEMS and Microsystems Design and Manufacture, TMH, 2002
References:
1. Chang C Y and Sze S. M., VLSI Technology, McGraw-Hill, New York, 2000
2. Julian W Gardner, Microsensors: Principles and Applications, John Wiley & Sons, 1994
3. Mark Madou, Fundamentals of Micro fabrication, CRC Press, New York, 1997
4. Stephen D. Senturia, Microsystem design, Springer (India), 2006.
5. Thomas B. Jones, Electromechanics and MEMS, Cambridge University Press, 2001

Course Plan
Module Course content (42hrs) End
Sem.
Hours
Exam
Marks
MEMS and Microsystems: Applications – Multidisciplinary nature
of MEMS – principles and examples of Micro sensors and micro
actuators – micro accelerometer –comb drives - Micro grippers – 4
micro motors, micro valves, micro pumps, Shape Memory Alloys.
I
Review of Mechanical concepts: Stress, Strain, Modulus of 15%
Elasticity, yield strength, ultimate strength – General stress strain
relations – compliance matrix. Overview of commonly used 3
mechanical structures in MEMS - Beams, Cantilevers, Plates,
Diaphragms – Typical applications

For more study materials>www.ktustudents.in


Flexural beams: Types of Beams, longitudinal strain under pure
bending – Deflection of beams – Spring constant of cantilever – 3
Intrinsic stresses
II 15%
Actuation and Sensing techniques : Thermal sensors and actuators,
Electrostatic sensors and actuators , Piezoelectric sensors and 4
actuators, magnetic actuators
FIRST INTERNAL EXAM
Scaling laws in miniaturization - scaling in geometry, scaling in
rigid body dynamics, Trimmer force scaling vector, scaling in
III 5
electrostatic and electromagnetic forces, scaling in electricity and
fluidic dynamics, scaling in heat conducting and heat convection. 15%
Materials for MEMS – Silicon – Silicon compounds – Silicon
Nitride, Silicon Dioxide, Silicon carbide, Poly Silicon, GaAs , 4
Silicon Piezo resistors,
IV Polymers in MEMS – SU-8, PMMA, PDMS, Langmuir –
Blodgett Films, Micro System fabrication – Photolithography –
5 15%
Ion implantation- Diffusion – Oxidation – Chemicalvapour
deposition – Etching
SECOND INTERNAL EXAM
Overview of Micro manufacturing – Bulk micro manufacturing,
Surface micro machining , LIGA process –Microstereo 6
V lithography 20%
Micro system Packaging: general considerations in packaging
design – Levels of Micro system packaging 3

KTU VI
STUDENTS
Bonding techniques for MEMS : Surface bonding , Anodic
bonding , Silicon - on - Insulator , wire bonding , Sealing –
Assembly of micro systems
Overview of MEMS areas : RF MEMS, BioMEMS, MOEMS,
NEMS
3

2
20%

END SEMESTER EXAM

Question Paper Pattern

The question paper shall consist of three parts. Part A covers modules I and II, Part B covers
modules III and IV, and Part C covers modules V and VI. Each part has three questions
uniformly covering the two modules and each question can have maximum four subdivisions.
In each part, any two questions are to be answered. Mark patterns are as per the syllabus with
70% for theory and 30% for logical/numerical problems, derivation and proof.

For more study materials>www.ktustudents.in

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