TUTORIAL – ELECTRONIC PRODUCT DESIGN – 2019E078

Q1.
a) Explain the different stages of an electronic product development indicating the importance
of each stage.

• Product Concept Develonment

• Requirements Collection from Stakeholders
• Preparation or system specifications
• Hardware and Software Design
• Prototype Development and Testing and verification
• Mass Manufacturing
• Maintenance and Support
• Disposal

b) Explain the bathtub curve for reliability indicating all regions.

• Early Failure - Initial defects and failures

• Operating Stress - Period of normal operation
• Wear Out Failure - End of life wear and tear

c) What is need of grounding? Explain the different types of grounding.

Q2)

a) Discuss the ergonomic & aesthetic design considerations with suitable example.

Ergonomic Design:

• Keyboard Design: When designing a computer keyboard, ergonomic considerations involve

the layout and spacing of keys to minimize user fatigue and reduce the risk of repetitive
strain injuries (RSI). For example, ergonomic keyboards like the Microsoft Natural Ergonomic
Keyboard are designed to reduce wrist strain by splitting the keys into two sections and
angling them

Aesthetic Design:

• Smartphone Design: Aesthetic considerations play a significant role in smartphone design.

The choice of materials, colors, and the arrangement of elements on the device can greatly
impact its visual appeal. The sleek and minimalist design of Apple’s iPhones is a prime
example of aesthetics in consumer electronics

b) What are the different noise coupling mechanisms?

c) Discuss the main objectives of packing for an electronic product.

Q3)

a) What are the different PCB design considerations for microprocessor / microcontroller based
circuits ?

b) Explain different termination schemes for avoiding reflection in high speed PCB designs.
Q4)

a) Explain the PCB design considerations with respect to

01) Analog a digital grounds

02) Grounds bounce.

 a) Calculate the resistance of 1 cm long copper track with width of 1 mm for a standard 35
micron copper clad laminates at 25°c. Estimate the change in resistance if the temperature
of track increases to 50°c. Comment on result. (Assume 𝜌=1.72×10-6Ω.cm)

[ A = \text{width} * \text{length} = 0.1 cm * 1 cm = 0.1 cm^2 ]

Now we can calculate the resistance at 25°C:

[ R_{25} = \frac{(1.72×10^{-6} , Ω.cm) * 1 , cm}{0.1 , cm^2} = 0.0172 , Ω ]

[ ΔR = R_{25} * α * ΔT ]
[ ΔR = 0.0172 , Ω * 0.0039 °C⁻¹ * 25°C = 0.016725 , Ω ]

The change in resistance when the temperature increases to 50°C is approximately 0.0167 Ω.

Q5)

a) Define signal integrity. Explain the importance of signal integrity. Also state the parameters
on which signal integrity depends

Signal Integrity is the quality of an electrical signal as it travels through a medium. It's vital for
accurate data transmission and system performance, reducing interference, and ensuring product
longevity. Signal integrity depends on transmission line characteristics, rise/fall times, noise,
termination, signal amplitude, clock jitter, power integrity, temperature, and component
characteristics. Maintaining it involves good design practices and careful consideration of these
factors.

b) Explain the use & limitations of AC & DC analysis with the help of suitable example.

DC Analysis (Direct Current):

Use: DC analysis is used to analyze circuits with constant or steady-state voltage and current. It’s
essential for understanding the behavior of circuits with constant sources and components.

Example: Consider a simple DC circuit with a battery, resistor, and LED. DC analysis helps determine
the LED’s forward voltage drop and the current flowing through it in a steady-state condition.

AC Analysis (Alternating Current):

Use: AC analysis is employed to study circuits that operate with varying voltages and currents, such
as in AC power systems and audio applications. It helps analyze circuit behavior at different
frequencies.

Example: In an audio amplifier, AC analysis is used to examine the gain and frequency response. This
analysis helps design amplifiers that accurately reproduce audio signals.
Limitations of AC and DC Analysis:

1. DC Analysis:

Limitation: DC analysis assumes constant values for voltage and current, which is not suitable for
circuits with rapidly changing signals, like those in high-frequency electronics.

Example: In a radio transmitter, DC analysis is insufficient to understand the circuit’s behavior at the
frequency of radio waves.

2. AC Analysis:

Limitation: AC analysis assumes that all components are linear, which may not hold true for highly
nonlinear devices like diodes or transistors operating near saturation.

Example: When analyzing a high-power RF amplifier, AC analysis may not accurately predict its
behavior near saturation, where nonlinear effects become significant.

Q6)

a) State performance parameters of PCB.

Performance parameters of a PCB include signal integrity, power distribution, EMC compliance,
thermal management, manufacturability, size, reliability, materials, impedance control, cost, EMI
shielding, testing provisions, and environmental compliance. These factors impact the functionality
and quality of electronic devices.

b) What is multilayer PCB and why it’s preferred for ICs on dense embedded circuits?

Multilayer PCBs are preferred for ICs on dense embedded circuits because they provide more space
for components, better signal integrity, reduced noise, and controlled impedance, allowing for
compact, high-performance designs.

Q7)

a) Write a short note on DIP soldering.

DIP Soldering (Dual In-line Package soldering) is a common method for attaching integrated circuits
(ICs) to a printed circuit board (PCB). It involves the following steps:

1. Component Placement: The IC is aligned with the PCB's DIP socket or pads, ensuring the
correct orientation.
2. Tinning: The component's leads and the PCB's pads are coated with solder.
3. Soldering: Heat is applied to the component leads and pads simultaneously, melting the
solder and creating a strong electrical and mechanical connection.
4. Cooling: The solder solidifies, securing the IC in place .
 b) Write a short note on SMD assemblies.

SMD Assemblies (Surface Mount Device assemblies) are a common method for mounting electronic
components directly onto a printed circuit board (PCB) without the need for holes or leads. Key
points about SMD assemblies include:

1. Component Mounting: SMD components have flat leads or terminations that are directly
soldered onto pads on the PCB's surface.

2. Size and Space Efficiency: SMD components are smaller and offer higher component density,
making them suitable for compact and lightweight electronic devices.

3. Automated Assembly: SMD components are typically assembled using automated pick-and-place
machines, which is efficient and cost-effective for large-scale production.

4. Improved High-Frequency Performance: SMD technology is well-suited for high-frequency

applications, such as RF circuits, due to reduced parasitic elements and shorter signal paths.

5. Reduced Lead Length: SMD components have shorter leads, reducing inductance and improving
electrical performance.

6. No Through-Hole Drilling: SMD assemblies eliminate the need for drilling holes in the PCB,
simplifying