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An Introduction to Rogers PCB and Rogers

Materials

The Best Rogers PCB

Manufacturer in China

Rogers PCB is a type of high-frequency board that raw material is produced by Rogers company. It is
different from the conventional PCB board—epoxy resin (FR4). It has no glass fiber in the middle and
uses a ceramic base as the high-frequency material. Rogers has superior dielectric constant and
temperature stability. Its dielectric constant thermal expansion coefficient is very consistent
with copper foil, which can be used to improve the deficiencies of PTFE substrates. It is very suitable
for high-speed electronic design, commercial microwave, and radio frequency applications. Its low
water absorption is ideal for high-humidity applications, providing customers in the high-frequency
board industry with the highest quality materials and related resources, which fundamentally enhance
product quality.

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ROGERS 4003C and ROGERS 4350B have excellent low dielectric loss characteristics. As a
result, they provide a more cost-effective and processable high-frequency material selection than PTFE.
They are widely used in antennas of the cellular base station and power amplifiers, microwave
point-to-point connection (P2P), automotive radars and sensors, radio frequency identification (RFID),
direct broadcast satellite high-frequency head (LNB), and other fields. In addition, the thermal
expansion coefficient of the X and Y-axis is similar to that of copper. The expansion coefficient of the

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Z-axis is much lower than FR4 (46ppm/ oC) and has a higher Tg value (>280oC), thus ensuring good
thermal stability. The dimensional stability and high reliability of the entire product in PCB processing
and assembly will bring more benefits to the design of multilayer circuits.

When the circuit’s operating frequency is above 500MHz, the range of materials that design
engineers can choose is significantly reduced. Rogers RO4350B material allows RF engineers to
conveniently design circuits, such as network matching and impedance control of transmission
lines. Due to its low dielectric loss characteristics, in high-frequency applications, RO4350B
material has more advantages than ordinary circuit raw materials. Its dielectric constant with
temperature fluctuation is almost the lowest among similar materials. In a wide frequency range,
its dielectric constant is also relatively stable at 3.48; the recommended design value is 3.66.
LoPra copper foil can reduce insertion loss, which makes the material suitable for broadband
applications.

RayMing always has all the thickness and specifications of

RO4003C, RO3003C, RO4350B, RO5880, RO5870, and RO4450F prepregs, which can meet
your immediate response needs. We have rich experience in RFID data process engineering and a
complete high-frequency material processing control system to ensure product design functions.

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In PCB prototyping, Rogers is a unique circuit board with a specific technical threshold, difficult to
operate, and high cost. General PCB factories rarely fulfill orders due to the troublesome production
methods and the small number of customer orders. RayMing is engaged in the PCB prototype
manufacturer of Rogers high-frequency PCB boards, which can meet the various high-frequency
PCB needs of customers. Currently, it can achieve 4~10 layers of ceramic pure pressure and 4~12
layers of mixed pressure.

RayMing is very proud of supporting the military. We were contracted to assemble a PCB for use in a
military communications application and provided Rogers 4350, Rogers 4003, and RT5880 material
assembly services. There are no MOQ 1 panelization is ok. We will perform final testing using
automated optical inspections and x-ray inspection prior to product delivery. There will be
strict impedance control following specification with a testing report.

With services (special 5G application) from consumer to military PCB industries, we continuously
strive to build Rogers PCB products that exceed your expectations, develop long-term customer
relationships, and become your best possible manufacturing partner.

Hybrid Rogers+Fr4 PCB

RayMing stocks most of rogers material model in our warehouse, and we produce pure Rogers PCB
or mix-press PCB boards: FR4+Rogers PCB and Aluminum+Rogers PCB. If you have a special design
and material request, please send your design and requirement to [email protected] with your PCB
stack-up. If you need design suggestions and consultation, you are welcome to contact us.

Rogers PCB materials are generally in stock with different thickness :

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♦ Rogers 4350B
♦ Rogers 4003C
♦ Rogers 3003
♦ Rogers 5880/RT5880
♦ RT5870
………..

More Rogers Materials:

3001 Bonding Film (Thermoplastic Chloro-fluorocopolymer)

RO3000® series High-Frequency Laminates (PTFE/Ceramic)
RO3035® series High-Frequency Laminates (PTFE/Ceramic)
RO3200® series High-Frequency Laminates (PTFE/Ceramic)
RO4000® High-Frequency Laminate with TICER Foil
RO4000® laminates datasheet and fabrication guidelines: RO4003C, RO4350B
RO4400® prepreg datasheet and fabrication guidelines: RO4450B, RO4450F
RO4500® Antenna Grade Laminates for High Volume Applications
RT/duroid® 5870/5880 Glass Microfiber Reinforced PTFE Composites
RT/duroid® 6002 laminate datasheet
RT/duroid® 6006/6010 laminate datasheet
RT/duroid® 6202 laminate datasheet
RT/duroid® 6202PR laminate datasheet
TMM Thermoset laminate datasheet: TMM3, TMM4, TMM6, TMM10, TMM10i
ULTRALAM 2000 laminate datasheet
ULTRALAM 3000 LCP laminate datasheet: ULTRALAM 3850
ULTRALAM 3000 LCP Prepreg: ULTRALAM 3908

LONGLITE™ AND R/flex® Flexible Circuit Materials – Thin Dielectrics

LONGLITE™ Flex 200 Adhesiveless Materials
LONGLITE™ Flex 300 Adhesiveless Series
R/flex® 1000 Circuit Materials for Long-life Dynamic Flexing
R/flex® 1100 Circuit Materials – High-Temperature Laminates
R/flex® 1500 Assembly Adhesive
R/flex® 2001 Laminates and Coverfilms
R/flex® 2005 Laminates and Coverfilms
8080 Liquid Photoimageable Covercoat datasheet
8080 Liquid Photoimageable Covercoat: LP11
8080 Liquid Photoimageable Covercoat: LP2
R/flex CRYSTAL 7500 Laminates and Coverlayers
R/flex CRYSTAL 7700 Laminates and Coverlayers
R/flex JADE A coverfilm datasheet
R/flex JADE A laminates datasheet
R/flex JADE J coverfilm datasheet
R/flex JADE J laminate datasheet

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In order to support R&D for universities and institutions, bare Rogers substrate is for sale at a
competitive price, even with small quantity orders. Please contact RayMing for more information.

Rogers vs. FR4

Here is a comparison between FR4 and Rogers PCB material. Almost 80% of electronic
circuit boards are manufactured with FR4 material. What is the difference between FR4 material
and Rogers PCB material?

Here is a comparison chart:

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All RF boards need to control signal loss. From the diagram, Rogers PCB material performs better
than FR4. As 5G is on the horizon, Rogers PCB market will increase, and prices will decrease. If
your design involves any types of signal transmission, we strongly recommend materials from
Rogers.

What is Rogers Material?

Rogers is a leading global materials technology company that develops advanced circuit board
laminate materials used in high frequency, high performance printed circuit boards (PCBs). Some
of the key things to know about Rogers materials:

 Develops a wide range of circuit board substrate materials engineered for different
applications and performance requirements. Popular materials include RO4000, RO3000,
RT/duroid, and many others.

 Specializes in high frequency materials for use in radio frequency (RF) and microwave
PCBs and components. Allows precision electrical performance.

 Offers both rigid and flexible circuit laminates compatible with common PCB
manufacturing processes.

 Utilizes specialized proprietary formulations to create materials with specific dielectric,

thermal, and mechanical characteristics.

 Rogers’ material technology enables higher circuit densities, improved signal speed and
integrity, and enhanced reliability in PCBs.

 Complies with major industry standards such as UL, IPC, and RoHS. Certified for
aerospace, defense, telecom, automotive and other critical applications.

 Used by PCB manufacturers worldwide to construct high-end circuit boards for advanced
electronic devices.

Overview of Rogers' Circuit Board Materials

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Rogers offers one of the industry’s widest selection of circuit board substrate materials to meet the
needs of various applications:

RO4000 Series High Frequency Laminates

The RO4000 series consists of ceramic-filled thermoset laminates designed for exacting circuit
boards operating at up to mmWave frequencies. It delivers excellent dimensional stability, low
thermal expansion, and outstanding high frequency performance. Some options include:

 RO4003TM – Most common version for wireless, aerospace, defense, and

instrumentation applications.

 RO4350BTM – Higher thermal conductivity for power circuits and heat spreading.

 RO4450TM – Improved thermal cycle reliability performance.

 RO4835TM – Lightweight material alternative with similar electrical features.

RO3000 Series High Frequency Laminates

The RO3000 series offers more affordable circuit materials compared to the RO4000 series,
making them popular for cost-sensitive commercial applications. Options include:

 RO3010TM – General purpose microwave material with good high frequency

performance.

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 RO3006TM – Higher permittivity and thermal conductivity for power modules.

 RO3003TM – High frequency laminate with improved insertion loss over RO3010.

RT/duroid High Frequency Laminates

RT/duroid materials are specially engineered to provide tightly controlled electrical parameters for
optimal circuit functionality. They are halogen-free. Variants include:

 RT/duroid® 5870 – Low loss material for high power density in mmWave applications.

 RT/duroid® 6035HTC – High thermal conductivity and low loss for power amplifiers and
antennas.

 RT/duroid® 6002 – Cost-optimized microwave laminate with improved thermal

performance over RO4350B.

RO1200 Low Flow Prepregs

RO1200 low flow prepregs consist of liquid crystal polymer films designed primarily
for multilayer PCB constructions requiring excellent dimensional stability. Common versions are
RO1200TM and RO1220TM.

TMM Thermoset Microwave Materials

The TMM series offers a selection of thermoset micro-dispersed ceramic-filled materials covering
a wide range of dielectric constants for broadband applications. Options include TMM3, TMM4,
TMM6, TMM10i, and more.

lexible LCP and PTFE Films

Rogers’ flexible circuit materials provide excellent high frequency performance in a thin,
lightweight form factor. These include ULTRALAM® liquid crystal polymer (LCP) films and
RT/duroid® PTFE composites.

Other Specialty Materials

Additional Rogers’ materials technologies include ceramic-filled thermal endmatch materials,

damping materials, beam window materials, polyimide films, and more for specific applications.

Rogers also offers quick-turn prototyping materials under its ProtoBONDTM brand.

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Benefits of Rogers Materials for PCBs

Using Rogers materials for circuit board fabrication provides these key advantages:

High Frequency Performance – Provides stable dielectric constant and low loss characteristics
for optimal electrical functionality in RF, microwave, and millimeter wave applications. Allows
higher operating frequencies.

Thermal Management – Specialized formulations available with high thermal conductivity, low
coefficient of thermal expansion, and excellent thermal stability for managing heat in circuit
boards. Critical for power devices.

Miniaturization – Consistent and reliable electrical properties allow construction of higher

complexity boards, components, circuits, and electrical features within a given area for greater
miniaturization.

Signal Integrity – Excellent dimensional stability along with fine microstructures result in smooth
copper surfaces that greatly improve signal speed, quality, and signal integrity through PCB
traces.

Reliability – Long-term material stability, adhesion, and durability support reliability

requirements of defense, aerospace, automotive, and other long-life applications.

Design Flexibility – Wide range of material thicknesses, sizes, certifications, dielectric constants,
loss tangents, and other parameters provides extensive design flexibility.

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Ease of Processing – Compatible with standard circuit board fabrication techniques like imaging,
drilling, plating, and assembly allowing use with existing PCB processes and equipment.

Regulatory Compliance – Materials comply with major environmental and regulatory standards
for use in stringently controlled industries and applications.

Rogers PCB and Laminate Manufacturing Process

To produce finished circuit boards using Rogers materials, PCB fabricators use specialized
processes tailored to the properties of Rogers laminates:

Sourcing Rogers Materials

 Rogers works with a global network of qualified distributors to supply their various
circuit board materials to PCB manufacturing partners.

 Manufacturers can source Rogers’ materials in sheet, panel, or roll formats depending on
needs.

 Rogers provides technical advice to manufacturers on optimal material selection.

Incoming Inspection

 Rogers material quality and lot traceability is verified upon receipt.

 Dimensional tolerances, hole locations, thickness, and other parameters are measured.

Panel Preparation

 Rogers laminate sheets are cut to sized panels for imaging and plating steps.

 Tooling holes are precision drilled for layer-to-layer alignment during lamination.

Imaging

 Laminate surfaces are prepared and coated with photoresist.

 An imagable film is then exposed to define the circuit pattern traces and features.

Etching

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 The exposed surfaces are etched away to selectively remove exposed copper, isolating
circuit traces.

Automated Optical Inspection (AOI)

 Optical inspection validates trace positioning, widths, spacing, butting, etc. match design
data.

Plating and Coating

 Surfaces are plated with copper and coated where required for solder mask, silkscreen,
and other finishes.

Lamination

 Individual boards are laminated together under heat and pressure to form multilayer
boards with traces and vias between layers.

Drilling

 Holes are precisely drilled for component pins and inter-layer connections using small
microvias.

Routing

 Boards are routed from panel to individual PCB dimensions based on specific designs.

Testing

 Electrical testing validates continuity, resistance, and board performance matches

specifications.

 Quality assurance testing screen for defects.

Final Finishes

 Optional conformal coating or potting can protect boards from environmental factors.

 Specialized markings or cosmetic finishes may be applied.

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Packaging and Shipment

 Finished Rogers PCBs are cleaned, baked, and carefully packaged to ship to product
manufacturers for assembly and integration into electronic systems.

By following optimized fabrication processes tailored to Roger’s material properties, PCB

fabricators can produce high quality, high performance printed circuit boards from Rogers
laminates.

Major Applications of Rogers Materials

The high frequency capabilities and reliable performance of Rogers materials makes them well
suited for:

 Wireless Communications – Used in 5G NR mmWave antennas, massive MIMO arrays,

remote radio heads, base stations, backhaul links, and other wireless infrastructure.

 Satcom & Radar – Used in satellite communications, phased array radar systems, GPS
equipment, and other high frequency aerospace and defense electronics.

 Automotive Radar – Used in collision avoidance radar PCBs for advanced driver
assistance systems in modern vehicles.

 High-Speed Data – Used in networking equipment, data centers, test equipment, and
oscilloscopes for high-bandwidth applications.

 Smart Weaponry – Used in “smart” munitions, guided missiles, drones, and

other military electronics requiring reliable high frequency circuit boards.

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 Aerospace & Avionics – Used in in-flight entertainment systems, communications,

onboard electronics, and other commercial and military aircraft systems.

 5G Phased Arrays – Used in high performance 5G beamforming antenna arrays for

improved speed and coverage.

 Medical Imaging – Used in MRI, X-Ray, and other imaging equipment operating at UHF,
microwave, and mmWave frequencies.

 Test & Measurement – Used in oscilloscopes, signal generators, and other lab equipment
for high-frequency measurements.

 Radar Housings – Used in structural radomes, modules, and housings for protecting
sensitive radar electronics.

 Industrial/Scientific – Used in high power industrial RF generators and processing

equipment used for scientific research.

The specialized high frequency properties of Rogers materials makes them a top choice for these
cutting-edge applications.

Rogers PCB Manufacturers and Fabricators

Many PCB fabricators worldwide utilize Rogers materials to construct high-performance printed
circuit boards:

Large Fabricators

 TTM Technologies

 Sanmina Corporation

 Flex Ltd.

 AT&S

 Multek

Mid-Size Fabricators

 APCT

 Lenthor Engineering

 Eastern Electronics

 Sierra Circuits

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 Bittele Electronics

 Epec

Small Fabricators

 Ohmega Technologies

 Photocircuits

 Quick Turn Circuits

 Sunstone Circuits

 Advanced Assembly

 Screaming Circuits

Rogers maintains relationships with these qualified PCB manufacturing partners and helps
connect product designers and engineers to reputable fabricators that can build Rogers-based
circuit boards for their needs.

Rogers also works closely with these fabricators to educate them on best practices for processing
Rogers materials using qualified procedures. Rogers provides extensive technical documentation
and guidelines to manufacturers that cover every step of the PCB fabrication process with their
materials.

Designing Rogers PCBs

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To utilize Rogers materials effectively in circuit board designs, engineers should follow these
guidelines:

Choose the Right Material – Select the specific Rogers laminate that provides the right
combination of dielectric constant, loss tangent, thermal conductivity, and other needs for optimal
performance.

Leverage Rogers’ Models – Take advantage of Rogers’ material models for simulations to
accurately model performance.

Follow Layout Guidelines – Designs must adhere to fabrication capabilities and constraints for
parameters like:

 Trace width/spacing

 Minimum hole size

 Impedance tolerances

 Line-to-line spacing

 Layer stackup

Design for Thermal Management – Ensure designs adequately dissipate heat from components
to prevent temperature related performance issues or reliability concerns.

Account for Coefficients – Designs must factor in the coefficient of thermal expansion and other
material specific coefficients.

Leverage Rogers’ Technical Support – Take advantage of Rogers’ extensive design support,
resources, and expertise in high frequency design techniques.

Following these guidelines helps engineers fully unlock the capabilities of Rogers circuit board
materials for their specific application needs.

Conclusion

For over 60 years, Rogers Corp has pioneered cutting-edge materials science to create high
performance circuit board laminates that enable today’s most advanced PCB designs and
electronic devices.

With its portfolio of materials engineered specifically to deliver stable, reliable electrical
performance at microwave, millimeter wave, and Terahertz frequencies, Rogers provides the
technology foundation for 5G communications, vehicle radars, aerospace electronics, defense
systems, and other emerging applications.

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By selecting the optimal Rogers’ material, leveraging qualified PCB fabricators, and designing
effectively for their specialized properties, engineers can utilize these materials to push the
boundaries of speed, signal integrity, miniaturization, and reliability in their electronic
products and systems.

Rogers PCBs - Frequently Asked Questions

Q: What are some key differences between Rogers RO4000 and RO3000 series

materials?

A: The RO4000 series offers higher performance but at a premium cost over the RO3000 series.
Key differences:

 RO4000 has a lower dielectric constant for better high frequency response.
 RO4000 has lower loss for optimal signal integrity.
 RO4000 features better impedance control and consistency.
 RO3000 series is more cost optimized for commercial applications.
 RO4000 offers higher thermal conductivity options.
 RO4000 features a smaller z-axis CTE for enhanced reliability.

Q: When should flexible Rogers materials be used instead of rigid materials?

A: Reasons to use flexible Roger’s materials include:

 Enabling flexible or conformal circuits

 When extreme thinness and lightweight is required
 For dynamic flexing environments
 For portable and wearable devices
 For space/weight constrained aerospace applications
 For flexible interconnects and antennas
 For multilayer constructions by interleaving flex/rigid

Q: What are some key design considerations when using Rogers materials?

Some key considerations include:

 Selecting the optimal material to meet electrical, thermal, and mechanical needs.
 Accounting for dielectric constant, loss tangent, and other properties in simulations.
 Following fabrication constraints like trace spacing, hole sizes, impedance tolerances, etc.
 Planning for coefficient of thermal expansion.
 Managing thermal design for heat dissipation.

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 Taking advantage of Rogers’ design resources and expertise.

Q: What are the main benefits of using PTFE-based Rogers materials?

Benefits of Rogers PTFE materials like RT/duroid 6000 include:

 Extremely low dielectric constant of 2.94 for better high frequency response.
 Very low loss for maximum signal integrity and minimal signal loss.
 Low Z-axis thermal expansion for reliability.
 High thermal conductivity for heat dissipation.
 Excellent dimensional stability.
 Good flexibility and drape characteristics.

Q: What types of testing and qualification is performed on Rogers materials?

Rogers subjects its materials to a variety of qualification testing:

 RF Testing – Measures dielectric constant, loss tangent, thermal coefficient of expansion

and other RF parameters.
 Mechanical Testing – Evaluates tensile strength, compressive strength, shear strength, and
more.
 Chemical Testing – Validates chemistry and assesses compatibility.
 Thermal Testing – Looks at thermal conductivity, continuous use temperature, and
thermal shock resistance.
 Quality Testing – Dimensions, acceptability, hole quality, and visual characteristics.
 Reliability Testing – Assesses performance over time through accelerated testing.
 Qualification Testing – Evaluates suitability for stringent applications via prescribed
standards.

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