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Guidelines for RF PCB Design and Microwave Materials Options

Introduction
Radio frequency (RF) printed circuit boards operate at frequencies from

30 kHz to 100 GHz and are essential components in wireless

communications, radars, broadcast systems and other high

frequency circuits. RF PCBs require specialized design expertise to

achieve the required signal integrity, transmission characteristics and

reliability.

This article provides a comprehensive set of guidelines for RF PCB

design covering layout considerations, stackup, material selection,

simulations, fabrication and assembly processes. Key microwave

substrate materials available for RF boards are also evaluated including

popular options like Rogers, Taconic, Isola and Arlon laminates.

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RF PCB Design Guidelines

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Following proven design strategies is critical when laying out

printed circuit boards for radio frequency and microwave

operating environments. Here are key guidelines to follow:

Board Stackup Design

 Choose dielectric materials based on operating frequency,

loss tangent, thermal conductivity and CTE requirements

 Minimize number of laminate materials if possible

 Use symmetric stackup with controlled impedance layers

 Include thin dielectric cores and prepregs where needed

 Incorporate buried and blind vias for layer transitions

 Model and simulate stackup in 3D EM tool and run signal

integrity analysis

Trace Routing

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 Keep trace lengths as short and direct as possible

 Avoid 90° turns on traces, use 45° mitred bends

 Route adjacent traces orthogonally to avoid coupling

 Provide clearance between traces based on voltage levels

 Use curved and tapered bends to improve impedance

matching

 Verify trace width and spacing for controlled impedance

Components Placement

 Position components for shortest high speed links

 Orient directional components properly

 Keep RF input and output ports accessible

 Group frequently interacting devices together

 Separate analog and digital sections

 Allow space for routing and tuners around devices

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Grounding Design

 Use continuous copper fills for ground plane

 Provide multiple vias connecting ground layers

 Surround RF traces for return current with ground

 Use distinct grounding for analog and digital circuits

 Connect all board grounds at single point

 Include periphery ground stitching vias

Layer Strategy

 Assign plane layers appropriately – RF, ground, power

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 Place sensitive traces between ground layers

 Ensure uninterrupted reference planes

 Use power planes to isolate circuits

 Adjust layer count based on complexity

 Optimize for EMI control, thermal and mechanical needs

Passive Integration

 Include passives like capacitors and resistors

 Select footprints for available components

 Place passives close to ICs they support

 Use buried resistors and capacitors if possible

 Consider transmission line structures

Transitions and Terminations

 Taper microstrip trace width when changing layers

 Use via fences for common ground connections

 Match trace width to pad width for smoother transition

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 Include backdrilling for unused via portions

 Add resistors for proper trace termination

Shielding and Partitions

 Divide board sections with ground planes

 Use electromagnetic bandgap structures

 Place sensitive traces between ground layers

 Add metal shielding enclosures if needed

 Include edge plating for shielding and connections

Simulations

 Perform 3D EM and SPICE simulations

 Model entire board including devices

 Run worst case tolerance analysis

 Verify impedance, losses, frequency response

 Tune design prior to fabrication

Materials

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 Select materials based on dielectric constant, loss tangent needs

 Use materials with tight dielectric constant tolerance

 Confirm Dk and Df stability over freqeuncy

 Evaluate moisture absorption, Tg glass transition temperature

 Obtain certified laminates from reputable suppliers

Microwave Substrate Materials for RF PCBs

RF PCB substrates should provide stable dielectric constant and low

loss tangent over the operating frequency range. Some commonly

used microwave laminate materials are:

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Rogers Corporation

Rogers is a leading producer of printed circuit materials for high

frequency applications in aerospace, defense, automotive radar and

wireless communications. Popular microwave laminates from Rogers

include:

 RO3003TM – Glass microfiber filled PTFEsubstrate with low Dk

and Df

 RO4350BTM – Woven glass reinforced, ceramic-filled laminate

with high dielectric constant

 RT/duroid® 6002 – Ceramic filled PTFE material with tight Dk and

Df tolerances

 RO4835TM – Glass microfiber filled, ceramically loaded laminate

 TMM® 10i – Woven glass reinforced, ceramic-filled PTFE material

Taconic

Taconic manufactures a broad range of RF laminates including:

 TLY-5TM – Low loss thermoset laminate for analog circuits

 TLC-30TM – Low Dk glass microfiber PTFE composite

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 RF-35TM – Ceramic filled PTFE material for broadband

applications

 RF-60TM – Thin film ceramic filled fluoropolymer laminate

 TacPreg® – Low loss thermoset prepregs available in various

Dk

Isola

Isola offers high performance copper clad laminates including RF

materials:

 IS680 – Low Dk glass weave reinforced laminate

 FR408HR – High performance FR-4 with tight dielectric

tolerance

 P96 – High thermal reliability FR4 material

 Getek® – Glass microfiber reinforced fluoropolymer

substrates

 ISOLA Astra MT77 – Composite material for broadband

applications

Arlon

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Arlon specializes in high performance laminates for microwave

and thermal management applications:

 CLTE-XT – Low Dk glass reinforced hydrocarbon ceramic

laminate

 CLTE-AT – Glass reinforced PTFE composite material

 55NT – Non-PTFE, thermoset microwave substrate

 25N – Economical woven glass reinforced laminate

Park Electrochemical

Park Electrochemical provides NelsonicTM RF/microwave

laminates including:

 N9000-13EP – Tight tolerance woven glass reinforced

substrate

 N9000-13SI – Filled ceramic PTFE composite material

 N9120-4 – High frequency laminate with PPS thermoplastic

reinforcement

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Fabrication and Assembly Considerations

Fabricating RF PCBs requires specialized expertise and processes for

controlled impedance, tolerances, surface finishes and reliability.

Key RF board fabrication and assembly guidelines:

 Maintain excellent impedance tolerance of ±5% or better

 Use industry standard IPC laminate test vehicles for validation

 Implement controlled environment conditions –

temperature, humidity

 Confirm surface roughness, copper thickness, dielectric values

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 Utilize impedance controlled bondply innerlayer materials

 Employ sequential lamination process

 Implement rigorous quality inspection procedures

 Verify plating quality – surface, hole wall, via filling

 Use automated optical inspection (AOI)

 Perform electrical testing like time domain reflectometry

 Include fixture and jig design for repeatable assembly

 Execute thermal profiling for soldering processes

 Conduct shock and vibration testing on assemblies

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Conclusion

Designing and producing RF PCBs for wireless and microwave

applications requires the right design rules, material selection,

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modeling tools and manufacturing processes. This article

summarized best practices guidelines covering stackup, layout,

grounding, layering, shielding, simulation, materials selection and

fabrication processes essential for high frequency

PCB development. Popular microwave laminate materials from

leading suppliers were also compared. Following these proven

strategies will help RF design engineers achieve excellent signal

integrity and reliable performance in their wireless, radar and

communication systems.

Frequently Asked Questions

Here are some common questions about RF PCB design

guidelines and materials selection:

Q: What are the most important RF PCB design guidelines to

follow?

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The most crucial considerations are controlled impedance traces,

minimizing trace lengths, proper grounding techniques, layer

stackup strategy, simulation/analysis and selecting the

right microwave materials.

Q: How are materials chosen for RF PCBs?

Materials are selected based on the dielectric constant, loss

tangent, frequency stability, thermal performance and cost

requirements of the application. Important parameters are Dk

tolerance, Df, Tg, moisture absorption.

Q: What fabrication process is used for RF PCB manufacturing?

A sequential lamination process with automated impedance

control and testing ensures the best impedance tolerance and

reliability. Maintaining process controls is critical.

Q: What tests are performed to validate RF PCBs?

Testing includes impedance, high-pot testing, time domain

reflectometry, VSWR measurements, thermal stress testing

and microsection analysis to confirm trace integrity.

Q: What interface design issues need consideration on RF PCBs?

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Careful design of interfaces between board layers, components,

connectors and external systems ensures smooth RF

signal transmission. Simulations help identify potential issues.

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